Capacitor and method for manufacturing capacitor

Abstract

The present invention provides a capacitor capable of suppressing variations in the amount of a sealing resin and improving the dimensional accuracy of the height of the upper surface of the capacitor. A capacitor (1) is provided with: a capacitor element (10); a case (50) having an opening (51f) and housing the capacitor element (10); a cover (60) that has through-holes (61aa-61af) and is disposed in the opening (51f) in a state in which the capacitor element (10) is housed in the housing (50); and a sealing resin (70) that is injected into the housing (50) and seals the capacitor element (10).

Description

Technical Field

[0001] The present invention relates to a capacitor in which a capacitor element accommodated in a case is sealed with a sealing resin, and a method for manufacturing the same. Background Art

[0002] For example, a conventional capacitor disclosed in Japanese Unexamined Patent Application Publication No. 2022-100801 (hereinafter referred to as "Patent Document 1") has a capacitor element having a first end face electrode and a second end face electrode. With the first bus bar connected to the first end face electrode and the second bus bar connected to the second end face electrode, the capacitor element is accommodated in a box-shaped case having an opening on one face. Then, the capacitor element is sealed with a sealing resin by injecting the sealing resin into the empty space of the case.

[0003] The case of the capacitor described in Patent Document 1 has a bottom portion, a peripheral wall portion, and an identification portion. The bottom portion is provided below the accommodation space for accommodating the capacitor element. The peripheral wall portion surrounds the four sides of the accommodation space. The identification portion is an identification on the resin surface of the sealing resin. The identification portion has an upper limit identification portion and a lower limit identification portion. The upper limit identification portion extends upward from the bottom portion and is formed at a position lower than the upper end of the peripheral wall portion. The lower limit identification portion is formed at a position lower than the upper end of the upper limit identification portion. The upper limit identification portion and the lower limit identification portion are integrally formed. Summary of the Invention

[0004] Problems to be Solved by the Invention

[0005] Due to the size limitation of the capacitor, it is sometimes difficult to provide an identification portion on the case. In addition, even when the identification portion can be provided on the case, there are the following problems. That is, in a vehicle-mounted capacitor, the required current increases and cooling needs to be implemented. Sometimes, heat dissipation components are arranged on the upper surface (resin surface of the sealing resin) of the capacitor having a case opening portion. In this case, high precision is required for the height of the resin surface. Therefore, even when the identification portion is provided on the case, due to the deviation in the amount of the injected sealing resin, the dimensional accuracy of the height of the resin surface of the sealing resin sometimes does not meet the requirements. In addition, in order to suppress the deviation in the resin amount, it is conceivable to inject the sealing resin in multiple times while changing the resin injection amount per unit time. However, in this case, the process time becomes long.

[0006] In addition, bubbles generated during the period from the start of injecting the sealing resin to the curing of the sealing resin sometimes accumulate in the upper part of the case. In this case, due to the bubbles accumulated in the upper part of the case, the upper surface of the sealing resin is lowered, and sometimes the sealing resin is thinner than expected.

[0007] An object of the present invention is to provide a capacitor capable of suppressing the deviation in the amount of the sealing resin and improving the dimensional accuracy of the height of the upper surface of the capacitor.

[0008] Means for Solving the Problems

[0009] A first aspect of the present invention is a capacitor having:

[0010] A capacitor element;

[0011] A housing having an opening and accommodating the capacitor element;

[0012] A lid having a through-hole and disposed in the opening in a state where the capacitor element is accommodated in the housing; and

[0013] A sealing resin injected into the housing to seal the capacitor element.

[0014] A second aspect of the present invention is a method for manufacturing a capacitor, including:

[0015] Disposing a lid having a through-hole in an opening of a housing accommodating a capacitor element; and

[0016] In a state where the lid is disposed in the opening, injecting a sealing resin into the housing through the through-hole to seal the capacitor element.

[0017] A third aspect of the present invention is a method for manufacturing a capacitor, including:

[0018] Injecting a sealing resin into a housing accommodating a capacitor element to seal the capacitor element; and

[0019] Disposing a lid having a through-hole in an opening of the housing accommodating the capacitor element sealed with the sealing resin.

[0020] Effects of the Invention

[0021] According to the present invention, it is possible to suppress variations in the amount of resin of the sealing resin and to improve the dimensional accuracy of the height of the upper surface of the capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a perspective view of the capacitor according to the first embodiment.

[0023] Figure 2 is an exploded perspective view of the capacitor according to the first embodiment except for the sealing resin.

[0024] Figure 3 is a perspective view of the capacitor element according to the first embodiment.

[0025] Figure 4 is a perspective view of the first bus bar according to the first embodiment.

[0026] Figure 5 It is a perspective view of the second bus bar of the first embodiment.

[0027] Figure 6 It is a perspective view of the insulating component of the first embodiment.

[0028] Figure 7(a) is a perspective view of the housing of the first embodiment as viewed obliquely from above, and Figure 7(b) is a perspective view of the housing of the first embodiment as viewed obliquely from a different direction from that of Figure 7(a).

[0029] Figure 8(a) is a perspective view of the cover of the first embodiment as viewed obliquely from above, and Figure 8(b) is a perspective view of the cover of the first embodiment as viewed obliquely from below.

[0030] Figure 9 is an explanatory diagram of the manufacturing process of the capacitor of the first embodiment.

[0031] Figure 10 is an explanatory diagram of the manufacturing process of the capacitor subsequent to Figure 9.

[0032] Figure 11 is an explanatory diagram of the manufacturing process of the capacitor subsequent to Figure 10.

[0033] Figure 12 is an explanatory diagram of the manufacturing process of the capacitor subsequent to Figure 11.

[0034] Figure 13 It is a perspective view of the capacitor of the second embodiment.

[0035] Figure 14(a) is a perspective view of the cover of the second embodiment as viewed obliquely from above, and Figure 14(b) is a perspective view of the cover of the second embodiment as viewed obliquely from below.

[0036] Figure 15(a) is a perspective view of the cover of the capacitor of the third embodiment as viewed obliquely from above, and Figure 15(b) is a perspective view of the cover of the third embodiment as viewed obliquely from below.

[0037] Figure 16(a) is a schematic diagram illustrating a modification example of the housing and the cover, Figure 16(b) is a schematic diagram illustrating another modification example of the housing and the cover, and Figure 16(c) is a schematic diagram illustrating still another modification example of the housing and the cover.

[0038] Figure 17(a) is a schematic diagram illustrating a modification example of the top plate portion of the cover, and Figure 17(b) is a schematic diagram illustrating another modification example of the top plate portion of the cover.

[0039] Symbol Description

[0040] 1, 1A Capacitor

[0041] 10 Capacitor Element

[0042] 20 First Bus Bar

[0043] 30 Second bus bar

[0044] 40 Insulating component

[0045] 50 Housing

[0046] 53 First fitting part

[0047] 53a First lower fitting part

[0048] 53b First upper fitting part

[0049] 54 Second fitting part

[0050] 54a Second lower fitting part

[0051] 54b Second upper fitting part

[0052] 60 Cover

[0053] 61a Top plate part

[0054] 61aa - 61af Through - hole part

[0055] 62 First fitting portion

[0056] 63 Second fitting portion

[0057] 64 Marking part

[0058] 64b First lower limit marking part

[0059] 64c Second lower limit marking part

[0060] 70 Sealing resin Detailed implementation mode

[0061] "First Embodiment"

[0062] Hereinafter, the capacitor 1 of the first embodiment will be described in detail with reference to the drawings.

[0063] Refer to Figure 1 FIGs. 7 to 8 to describe the structure of the capacitor 1 of the first embodiment. In addition, Figure 1 the x - axis, y - axis, and z - axis of each of the FIGS. 7 to 8 and FIGS. 9 to 12 are in the same direction. The opening surface of the housing 50 in the completed state of the capacitor 1 is the xy plane. The short - side side surface of the housing 50 is the yz plane. The long - side side surface of the housing 50 is the zx plane. In this way, the capacitor 1 and each component (capacitor element 10, first bus bar 20, second bus bar 30, insulating component 40, housing 50, cover 60, sealing resin 70) are shown.

[0064] In addition, in the second embodiment, the Figure 13The same applies to the x-axis, y-axis, and z-axis of each of FIGS. 14 and 15 referred to in the third embodiment.

[0065] As Figure 1 and Figure 2 shown, the capacitor 1 includes a metallized film capacitor element (capacitor element), a first bus bar 20, a second bus bar 30, insulating components 40 such as insulating paper and insulating plates, a housing 50, a lid 60, and a sealing resin 70.

[0066] As Figure 3 shown, the capacitor element 10 has an element main body portion 11, a first end face electrode 12, and a second end face electrode 13. The first end face electrode 12 is formed by spraying a metal such as zinc on the first end face of the element main body portion 11. The second end face electrode 13 is formed by spraying a metal such as zinc on the second end face of the element main body portion 11.

[0067] The element main body portion 11 is formed by overlapping two metallized films on which aluminum is vapor-deposited on a dielectric film, winding or laminating the overlapping metallized films, and pressing them into a flat shape.

[0068] In addition, the element main body portion 11 of the present embodiment is not limited thereto, and may be formed of a metallized film on which other metals such as zinc and magnesium are vapor-deposited, may be formed of a metallized film on which multiple of these metals are vapor-deposited, or may be formed of a metallized film on which an alloy of these metals is vapor-deposited.

[0069] By welding in a state where the first bus bar 20 is in contact with the first end face electrode 12, the first end face electrode 12 is electrically connected to the first bus bar 20. By welding in a state where the second bus bar 30 is in contact with the second end face electrode 13, the second end face electrode 13 is electrically connected to the second bus bar 30. The first bus bar 20 and the second bus bar 30 are each formed of a conductive material such as copper. In the present embodiment, the first end face electrode 12 and the first bus bar 20 are set as the P-pole side, and the second end face electrode 13 and the second bus bar 30 are set as the N-pole side. In addition, the first end face electrode 12 and the first bus bar 20 may be set as the N-pole side, and the second end face electrode 13 and the second bus bar 30 may be set as the P-pole side.

[0070] In addition, the capacitor 1 of the present embodiment has one capacitor element 10, but is not limited thereto, and may also have two or more capacitor elements 10.

[0071] The first bus bar 20 is formed of a conductive material such as copper and has Figure 4 the shape shown.

[0072] The first bus bar 20 has a flat end-face electrode contact portion 21. The end-face electrode contact portion 21 contacts the first end-face electrode 12 in the state where the capacitor 1 is assembled. The end-face electrode contact portion 21 has a substantially rectangular outer shape when viewed from above in the xy plane. The end-face electrode contact portion 21 has two through-holes 21a. Each through-hole 21a is rectangular in shape when viewed from above in the xy plane. Each through-hole 21a has a protrusion 21b for welding to the first end-face electrode 12.

[0073] The first bus bar 20 has a flat first lead-out portion 22. The first lead-out portion 22 extends from one side portion of the end-face electrode contact portion 21 (the side portion on the positive y-axis side of the end-face electrode contact portion 21) in a direction perpendicular to the plane of the end-face electrode contact portion 21 (the positive z-axis direction).

[0074] The first bus bar 20 has two second lead-out portions 23. Each second lead-out portion 23 extends from the end portion of the first lead-out portion 22 on the side opposite to the end-face electrode contact portion 21 in the positive z-axis direction.

[0075] The first bus bar 20 has two external connection terminal portions 24. Each external connection terminal portion 24 extends from the end portion of the second lead-out portion 23 on the side opposite to the first lead-out portion 22 in a direction parallel to the end-face electrode contact portion 21 (along the negative y-axis direction) toward the side facing the end-face electrode contact portion 21. Each external connection terminal portion 24 has a through-hole 24a. The through-hole 24a is substantially circular in shape when viewed from above in the xy plane. The first bus bar 20 and the external wiring are connected through the through-hole 24a.

[0076] The first bus bar 20 is manufactured, for example, by using a mold to make a single flat plate having portions corresponding to the end-face electrode contact portion 21, the first lead-out portion 22, the two second lead-out portions 23, and the two external connection terminal portions 24, and then by bending processing.

[0077] The second bus bar 30 is formed of a conductive material such as copper and has Figure 5 the shape shown.

[0078] The second bus bar 30 has a flat end-face electrode contact portion 31. The end-face electrode contact portion 31 contacts the second end-face electrode 13 in the state where the capacitor 1 is assembled. The end-face electrode contact portion 31 has a substantially rectangular outer shape when viewed from above in the xy plane. The end-face electrode contact portion 31 has a through-hole 31a. Each through-hole 31a is rectangular in shape when viewed from above in the xy plane. The through-hole 31a has a protrusion 31b for welding to the second end-face electrode 13.

[0079] The second bus bar 30 has a flat first lead-out portion 32. The first lead-out portion 32 extends from one side portion of the end-face electrode contact portion 31 (the side portion on the positive y-axis side of the end-face electrode contact portion 31) in a direction perpendicular to the plane of the end-face electrode contact portion 31 (the positive z-axis direction).

[0080] In the state where the capacitor 1 is assembled, a first lead-out portion 22 of the first bus bar 20 and a first lead-out portion 32 of the second bus bar 30 overlap partially in a top view from the zx direction. The first lead-out portion 22 is closer to the capacitor element 10 side than the first lead-out portion 32. An insulating member 40 is disposed between the first lead-out portion 22 and the first lead-out portion 32. Thereby, the insulating state between the first bus bar 20 and the second bus bar 30 is ensured. In addition, if the insulating state between the first bus bar 20 and the second bus bar 30 can be ensured, the insulating member 40 may not be disposed between the first lead-out portion 22 and the first lead-out portion 32.

[0081] The second bus bar 30 has two second lead-out portions 33. Each second lead-out portion 33 extends in the positive z-axis direction from an end portion of the first lead-out portion 32 on the side opposite to the end face electrode contact portion 31.

[0082] The second bus bar 30 has two external connection terminal portions 34. Each external connection terminal portion 34 extends in a direction facing the end face electrode contact portion 31 (in the negative y-axis direction) parallel to the end face electrode contact portion 31 from an end portion of the second lead-out portion 33 on the side opposite to the first lead-out portion 32. Each external connection terminal portion 34 has a through portion 34a. The through portion 34a has a substantially circular shape in a top view from the xy direction. The second bus bar 30 and the external wiring are connected through the through portion 34a.

[0083] The second bus bar 30 is fabricated, for example, by using a mold to make a single flat plate having portions corresponding to the end face electrode contact portion 31, the first lead-out portion 32, the two second lead-out portions 33, and the two external connection terminal portions 34, and then performing bending processing.

[0084] The insulating member 40 is formed of an insulating material. As Figure 6 shown, the insulating member 40 has a substantially rectangular outer shape in a top view from the zx direction. The insulating member 40 is disposed between the first lead-out portion 22 of the first bus bar 20 and the first lead-out portion 32 of the second bus bar 30 to insulate the first bus bar 20 and the second bus bar 30.

[0085] The housing 50 is formed of various materials such as organic materials such as resins or plastics like polyphenylene sulfide (PPS) or polybutylene terephthalate (PBT), and inorganic materials such as ceramics. The housing 50 has the shape shown in FIGS. 7(a) and 7(b).

[0086] The housing 50 has a flat bottom 51a. The bottom 51a has a substantially rectangular outer diameter when viewed from above in the xy plane. In addition, the housing 50 has a first side portion 51b, a second side portion 51c, a third side portion 51d, and a fourth side portion 51e. The first to fourth side portions 51b to 51e are each in the shape of a flat plate extending in a direction (the positive z-axis direction) perpendicular to the inner surface (inner bottom surface) of the bottom 51a from the four side edges of the bottom 51a. The housing 50 is in the shape of a rectangular parallelepiped box having an opening 51f with an opening facing the inner bottom surface of the bottom 51a.

[0087] The housing 50 has two first mounting portions 52a and two second mounting portions 52b. The two first mounting portions 52a are arranged on the outer surface of the second side portion 51c. The two second mounting portions 52b are arranged on the outer surface of the fourth side portion 51e. Each first mounting portion 52a and each second mounting portion 52b have a through portion. The capacitor 1 is mounted on an external device through the first mounting portion 52a and the second mounting portion 52b.

[0088] The housing 50 has two first fitting portions 53 on the inner surface of the second side portion 51c. Each first fitting portion 53 has a first lower fitting portion 53a and a first upper fitting portion 53b on the inner surface of the second side portion 51c. The first lower fitting portion 53a and the first upper fitting portion 53b are arranged at intervals. When viewed from above in the yz plane, the upper surface and the lower surface of the first lower fitting portion 53a are parallel to the inner bottom surface of the bottom 51a. The first fitting portion 62 (see FIG. 8) of the lid 60 is fitted between the upper surface of the first lower fitting portion 53a and the lower surface of the first upper fitting portion 53b.

[0089] The housing 50 has two second fitting portions 54 on the inner surface of the fourth side portion 51e. Each second fitting portion 54 has a second lower fitting portion 54a and a second upper fitting portion 54b on the inner surface of the fourth side portion 51e. The second lower fitting portion 54a and the second upper fitting portion 54b are arranged at intervals. When viewed from above in the yz plane, the upper surface and the lower surface of the second lower fitting portion 54a are parallel to the inner bottom surface of the bottom 51a. The second fitting portion 63 (see FIG. 8) of the lid 60 is fitted between the upper surface of the second lower fitting portion 54a and the lower surface of the second upper fitting portion 54b.

[0090] When the inner bottom surface of the bottom 51a is used as the reference plane for height, the height of the upper surfaces of the two first lower fitting portions 53a is equal to the height of the upper surfaces of the two second lower fitting portions 54a. In addition, the height of the lower surfaces of the two first upper fitting portions 53b is equal to the height of the lower surfaces of the two second upper fitting portions 54b.

[0091] The housing 50 integrally forms, for example, a bottom portion 51a, first to fourth side portions 51b - 51e, two first mounting portions 52a, two second mounting portions 52b, two first engaged portions 53, and two second engaged portions 54.

[0092] The cover 60 is formed of various materials such as resins or plastics like polyphenylene sulfide (PPS) or polybutylene terephthalate (PBT), inorganic materials such as ceramics, and metals such as aluminum. The cover 60 has the shape shown in FIGS. 8(a) and 8(b).

[0093] The cover 60 has a flat top plate portion 61a. The top plate portion 61a has a substantially rectangular outer shape in xy top view. In addition, the cover 60 has a first side portion 61b, a second side portion 61c divided into two, a third side portion 61d, and a fourth side portion 61e divided into two. The first to fourth side portions 61b - 61e are each flat plate - shaped and extend in a direction (z - axis negative direction) perpendicular to the inner surface (the surface on the negative z - axis side) of the top plate portion 61a from the four side portions of the top plate portion 61a. The top surface (the outer surface of the cover) of the top plate portion 61a is a substantially flat surface.

[0094] The top plate portion 61a has two large - diameter through - holes 61aa, 61ab, four through - holes 61ac, 61ad, 61ae, twelve small - diameter through - holes 61af, and a cutout portion 61ag. Each of the large - diameter through - holes 61aa, 61ab is circular in xy top view. Each of the through - holes 61ac, 61ad, 61ae is semicircular in xy top view. Each of the small - diameter through - holes 61af is circular in xy top view. The cutout portion 61ag is rectangular in xy top view.

[0095] The through - holes 61aa - 61ae are mainly used for injecting the sealing resin 70. The through - hole 61af is mainly used for discharging the air bubbles generated when injecting the sealing resin 70 to the outside of the resin. The diameters of the through - holes 61aa, 61ab and the diameters of the through - holes 61ac - 61ae are larger than the diameter of the through - hole 61af. In the state where the capacitor 1 is assembled, the cutout portion 61ag enables the first lead - out portion 22 of the first bus bar 20, the first lead - out portion 32 of the second bus bar 30, and the insulating member 40 to be led out from the inside of the capacitor 1 to the outside of the capacitor 1 (refer to Figure 1 ). The number of through - holes for injecting the sealing resin 70 may also be other than six. The number of through - holes for discharging the air bubbles may also be other than twelve.

[0096] The cover 60 has two first fitting portions 62. Each first fitting portion 62 extends parallel to the top plate portion 61a (in the positive x-axis direction) from the end of the second side portion 61c divided into two on the side opposite to the top plate portion 61a. The thickness of the first fitting portion 62 (the thickness in the z-axis direction) is approximately equal to the clearance (the distance in the z-axis direction) between the upper surface of the first lower fitting portion 53a of the housing 50 and the lower surface of the first upper fitting portion 53b. Each first fitting portion 62 is fitted between the upper surface of the first lower fitting portion 53a and the lower surface of the first upper fitting portion 53b.

[0097] The cover 60 has two second fitting portions 63. The second fitting portion 63 extends parallel to the top plate portion 61a (in the negative x-axis direction) from the end of the fourth side portion 61e divided into two on the side opposite to the top plate portion 61a. The thickness of the second fitting portion 63 (the thickness in the z-axis direction) is approximately equal to the clearance (the distance in the z-axis direction) between the upper surface of the second lower fitting portion 54a of the housing 50 and the lower surface of the second upper fitting portion 54b. Each second fitting portion 63 is fitted between the upper surface of the second lower fitting portion 54a and the lower surface of the second upper fitting portion 54b.

[0098] The cover 60 has three extension portions 64. Each extension portion 64 extends downward (in the negative z-axis direction) from the lower surface of the top plate portion 61a. Each extension portion 64 has the same shape.

[0099] The first extension portion 64 (on the left side in Fig. 8(b)) has a base portion 64a, a first lower limit marking portion 64b, and a second lower limit marking portion 64c. The base portion 64a extends in a direction perpendicular to the lower surface of the top plate portion 61a (in the negative z-axis direction) from the lower surface of the top plate portion 61a between the through-hole 61ac and the through-hole 61aa. The first lower limit marking portion 64b extends from the lower part of the side surface of the base portion 64a to a part of the through-hole 61ac in the xy plan view. The second lower limit marking portion 64c extends from the lower part of the side surface of the base portion 64a to a part of the through-hole 61aa in the xy plan view.

[0100] The second extension portion 64 (in the center in Fig. 8(b)) has a base portion 64a, a first lower limit marking portion 64b, and a second lower limit marking portion 64c. The base portion 64a extends in a direction perpendicular to the lower surface of the top plate portion 61a (in the negative z-axis direction) from the lower surface of the top plate portion 61a between the through-hole 61aa and the through-hole 61ab. The first lower limit marking portion 64b extends from the lower part of the side surface of the base portion 64a to a part of the through-hole 61aa in the xy plan view. The second lower limit marking portion 64c extends from the lower part of the side surface of the base portion 64a to a part of the through-hole 61ab in the xy plan view.

[0101] The third extension part 64 (on the right side of FIG. 8(b)) has a base part 64a, a first lower limit identification part 64b, and a second lower limit identification part 64c. The base part 64a extends from the lower surface of the top plate part 61a between the through holes 61ab and 61ad in a direction (negative z-axis direction) perpendicular to the lower surface of the top plate part 61a. The first lower limit identification part 64b extends from the lower part of the side surface of the base part 64a to a part of the through hole 61ab in the xy plan view. The second lower limit identification part 64c extends from the lower part of the side surface of the base part 64a to a part of the through hole 61ad in the xy plan view.

[0102] The upper surface (the surface on the positive z-axis side) of each first lower limit identification part 64b and the upper surface (the surface on the positive z-axis side) of each second lower limit identification part 64c are located below (negative z-axis direction) the lower surface of the top plate part 61a.

[0103] The upper surfaces of the first lower limit identification part 64b and the second lower limit identification part 64c of each extension part 64 serve as the identification of the lower limit of the injection amount of the sealing resin 70. In the first extension part 64, the first lower limit identification part 64b can be seen from the through hole 61ac. In addition, the second lower limit identification part 64c can be seen from the through hole 61aa.

[0104] In the second extension part 64, the first lower limit identification part 64b can be seen from the through hole 61aa. In addition, the second lower limit identification part 64c can be seen from the through hole 61ab.

[0105] In the third extension part 64, the first lower limit identification part 64b can be seen from the through hole 61ab. In addition, the second lower limit identification part 64c can be seen from the through hole 61ad.

[0106] Since the upper surfaces of the first lower limit identification part 64b and the second lower limit identification part 64c of each extension part 64 serve as the identification of the lower limit of the injection amount of the sealing resin 70, after the injection and curing of the sealing resin 70, the extension part 64 is buried in the sealing resin. Therefore, even when the lower surface of the top plate part 61a of the cover 60 is separated from the resin surface of the sealing resin 70, since at least the front end of the extension part 64 is buried in the sealing resin 70, heat can be dissipated from the sealing resin 70 via the extension part 64.

[0107] In the present embodiment, the first to fourth side parts 61b to 61e, the first fitting part 62, and the second fitting part 63 also contact the sealing resin 70. Thereby, heat can be dissipated from the sealing resin 70.

[0108] In the present embodiment, the top surface of the top plate part 61a is used as the identification of the upper limit of the injection amount of the sealing resin 70.

[0109] In addition, the cover 60 has a shape and size that block substantially the entire opening part 51f of the housing 50.

[0110] The cover 60 is integrally formed with, for example, a top plate portion 61a, first to fourth side portions 61b to 61e, two first fitting portions 62, two second fitting portions 63, and three extending portions 64.

[0111] The sealing resin 70 seals the capacitor element 10, a part of the first bus bar 20, a part of the second bus bar 30, and a part of the insulating member 40. The sealing resin 70 is, for example, an epoxy resin. In addition, the sealing resin 70 is not limited to the epoxy resin, and various insulating materials used as the sealing resin for electronic components can be used. Further, the sealing resin 70 is formed by injecting it in a liquid state into the housing 50 and then curing it.

[0112] Next, the manufacturing process of the capacitor 1 will be described with reference to FIGS. 9 to 12. In addition, the manufacturing process of the capacitor 1 described below is an example, and as long as it is an assembly sequence that can finally assemble the capacitor 1 into Figure 1 the state shown.

[0113] As shown in FIG. 9(a), the insulating member 40 is adhered to the surface on the negative y-axis side of the first lead-out portion 32 of the second bus bar 30. Thereby, the state shown in FIG. 9(b) is obtained.

[0114] As shown in FIG. 10(a), the second bus bar 30 in the state where the insulating member 40 is adhered is arranged such that the upper surface (the surface on the positive z-axis side) of the end face electrode contact portion 31 contacts the second end face electrode 13 of the capacitor element 10. In addition, the first bus bar 20 is arranged such that the lower surface (the surface on the negative z-axis side) of the end face electrode contact portion 21 contacts the first end face electrode 12 of the capacitor element 10. In this state, the second bus bar 30 is welded to the second end face electrode 13 by the protruding portion 31b of the second bus bar 30. Thereby, the second bus bar 30 and the second end face electrode 13 are electrically connected. In addition, the first bus bar 20 is welded to the first end face electrode 12 by the protruding portion 21b of the first bus bar 20. Thereby, the first bus bar 20 and the first end face electrode 12 are electrically connected. Thereby, the state shown in FIG. 10(b) is obtained. Hereinafter, the unit in which the capacitor element 10, the first bus bar 20, the second bus bar 30, and the insulating member 40 are assembled into the state shown in FIG. 10(b) is appropriately referred to as the wiring unit 5.

[0115] As shown in FIG. 11(a), the wiring unit 5 is housed in the housing 50 from the opening portion 51f of the housing 50. Then, the cover 60 is attached to the housing 50. Thereby, the state shown in FIG. 11(b) is obtained.

[0116] In the installation of the cover 60 to the housing 50, for example, first, the cover 60 is tilted so that the fourth side portion 61e side is closer to the housing 50 than the second side portion 61c side, and the second fitting portion 63 of the cover 60 (see FIG. 8) is inserted between the upper surface of the second lower fitting portion 54a and the lower surface of the second upper fitting portion 54b of the housing 50. Then, the vicinity of the second side portion 61c of the top plate portion 61a of the cover 60 is pressed toward the bottom portion 51a of the housing 50, and the first fitting portion 62 of the cover 60 is inserted between the upper surface of the first lower fitting portion 53a and the lower surface of the first upper fitting portion 53b of the housing 50.

[0117] In a state where the cover 60 is mounted on the housing 50 that houses the wiring unit 5, as shown in FIG. 12(a), a sealing resin 70 such as liquid epoxy resin is injected from the through-holes 61aa to 61ae formed in the cover 60. Then, by curing it at a specified curing temperature, the capacitor 1 shown in FIG. 12(b) is completed. In the present embodiment, the top surface of the top plate portion 61a of the cover 60 is used as an indication of the upper limit of the injection amount of the sealing resin 70, and the upper surfaces of the first and second lower limit indication portions 64b and 64c (see FIG. 8) are used as indications of the lower limit of the injection amount of the sealing resin 70, and the sealing resin 70 is injected.

[0118] According to the first embodiment, the top surface of the top plate portion 61a of the cover 60 is used as an indication of the upper limit of the injection amount of the sealing resin 70, and the upper surfaces of the first and second lower limit indication portions 64b and 64c of the cover 60 are used as indications of the lower limit of the injection amount of the sealing resin 70, thereby adjusting the injection amount of the sealing resin 70. Thus, the thickness of the sealing resin 70 covering the upper portion of the capacitor element 10 can be adjusted, and the deviation of the resin amount can be suppressed. In addition, the top surface of the top plate portion 61a of the cover 60 becomes the upper surface of the capacitor 1. Compared with the dimensional accuracy of the height of the resin surface of the sealing resin 70, the dimensional accuracy of the height of the top surface of the top plate portion 61a is higher, so the dimensional accuracy of the height of the upper surface of the capacitor 1 is improved. Thus, for example, even when a heat dissipation component is arranged on the upper surface of the capacitor 1, the required dimensional accuracy can be satisfied.

[0119] In addition, according to the present embodiment, the air bubbles generated during the period from the injection of the sealing resin 70 to the curing of the sealing resin 70 are discharged from the through-holes 61aa to 61ae. Therefore, the accumulation of air bubbles between the resin surface of the sealing resin 70 and the cover 60 is suppressed. Thus, it is possible to suppress the sealing resin 70 from being thinner than expected.

[0120] In addition, by providing the extending portion 64 with identification portions (the first lower limit identification portion 64b and the second lower limit identification portion 64c), the identification of the resin surface height (upper limit and / or lower limit) can be arbitrarily set. In the present embodiment, the lower limit of the resin surface height is set. Moreover, by providing the identification portions on the extending portion 64, compared with the case where the identification portions are provided on the housing, the identification portions can be more easily provided even when the size of the capacitor is limited.

[0121] In addition, by making the top surface of the top plate portion 61a of the lid 60 a substantially flat surface, the top plate portion 61a of the heat dissipation component can be easily and correctly arranged on the top surface.

[0122] In addition, the lid 60 has a size that substantially blocks the entire opening portion 51f of the housing 50. Therefore, the contact area between the top plate portion 61a of the lid 60 and the heat dissipation component arranged on the top surface of the top plate portion 61a can be increased, and thus the heat dissipation performance of the capacitor 1 can be improved.

[0123] In addition, by increasing the diameters of the through portions 61aa to 61ae for injecting the sealing resin 70, the sealing resin 70 can be easily injected. In addition, by reducing the diameter of the through portion 61af for discharging the bubbles generated when injecting the sealing resin 70 to the outside of the resin, the contact area between the top plate portion 61a and the heat dissipation component can be increased. Thereby, the heat dissipation performance of the capacitor 1 is improved.

[0124] In addition, in the present embodiment, the manufacturing process of the capacitor 1 in which the lid 60 is installed on the housing 50 and then the sealing resin 70 is injected into the housing 50 has been described, but the lid 60 may also be installed on the housing 50 after the sealing resin 70 is injected into the housing 50. In this case, for example, the housing 50 has an identification portion on the side surface. Even when the lid 60 is installed on the housing 50 after the sealing resin 70 is injected into the housing 50, the bubbles generated during the period from the injection of the sealing resin 70 to the curing of the sealing resin 70 are discharged from the through portions 61aa to 61ae. Therefore, the accumulation of bubbles between the resin surface of the sealing resin 70 and the lid 60 is suppressed. Thereby, it is possible to suppress the sealing resin 70 from being thinner than expected.

[0125] Here, the lid 60 may also be installed on the housing 50 after the sealing resin 70 is injected into the housing 50 and before the sealing resin 70 is completely cured. In this case, it is also possible to suppress the sealing resin 70 from being thinner than expected.

[0126] 《Second Embodiment》

[0127] Next, refer to Figure 13FIG. 14 will describe the capacitor 1A of the second embodiment in detail. The capacitor 1A is different in that it has a lid 60A different from the lid 60 of the capacitor 1 of the first embodiment. In the second embodiment, the lid 60A will be mainly described. Other constituent components (the first bus bar 20, the second bus bar 30, the insulating member 40, the housing 50) have the same structure in the capacitor 1A and the capacitor 1, and the same reference numerals are given and the description is omitted in the second embodiment.

[0128] The lid 60A has a top plate portion 61aA, first to fourth side portions 61b to 61e, two first fitting portions 62, two second fitting portions 63, and three extending portions 64. The top surface of the top plate portion 61aA is a substantially flat surface. The top plate portion 61aA has two through holes 61aa, 61ab having a circular shape in a top view in the xy plane, four through holes 61ac to 61ae having a semicircular shape, and nine through holes 61af having a circular shape.

[0129] The through holes 61aa to 61ae are mainly used for injecting the sealing resin 70. The through holes 61af are mainly used for discharging the air bubbles generated when injecting the sealing resin 70 to the outside of the resin. The diameters of the through holes 61aa, 61ab and the diameters of the through holes 61ac to 61ae are larger than the diameter of the through hole 61af.

[0130] Compared with the top plate portion 61a of the first embodiment having 12 through holes 61af, the top plate portion 61aA of the present embodiment has nine through holes 61af. In addition, compared with the top plate portion 61a of the first embodiment having a notch portion 61ag, the top plate portion 61aA of the present embodiment does not have a notch portion. The number of through holes for injecting the sealing resin 70 may also be a number other than six. The number of through holes for discharging air bubbles may also be a number other than nine.

[0131] The lid 60 of the first embodiment has a shape and size that substantially block the entire opening portion 51f of the housing 50. In contrast, the lid 60A of the present embodiment has a shape and size that do not block substantially the entire opening portion 51f of the housing 50, but only block a part thereof. Specifically, the portion indicated by the dotted arrow 80 in the opening portion 51f is not blocked by the lid 60A.

[0132] According to the second embodiment, the same effects as those of the first embodiment are achieved. In addition, according to the second embodiment, the deviation of the resin amount of the sealing resin is suppressed by the lid 60A, and the lead-out of the first bus bar 20 and the second bus bar 30 can be configured more freely by using the portion not blocked by the lid 60A.

[0133] 《Third Embodiment》

[0134] Hereinafter, the capacitor of the third embodiment will be described in detail with reference to FIG. 15. The capacitor of the third embodiment is different from the capacitor 1 of the first embodiment in that it has a lid 60B different from the lid 60. In the third embodiment, the lid 60B will be mainly described. Other constituent components (the first bus bar 20, the second bus bar 30, the insulating component 40, the housing 50) have the same structure in the capacitor of the third embodiment and the capacitor 1 of the first embodiment, and in the third embodiment, the description and illustration of other constituent components are omitted.

[0135] The lid 60B of the present embodiment has a structure in which the extension portion 64 is removed from the lid 60 of the first embodiment. The lid 60B has a top plate portion 61a, first to fourth side portions 61b to 61e, two first fitting portions 62, and two second fitting portions 63. The top plate portion 61a has two through holes 61aa, 61ab having a circular shape in the xy top view, four through holes 61ac to 61ae having a semicircular shape, twelve through holes 61af having a circular shape, and a rectangular cutout portion 61ag.

[0136] The through holes 61aa to 61ae are mainly used for injecting the sealing resin 70. The through holes 61af are mainly used for discharging the air bubbles generated when injecting the sealing resin 70 to the outside of the resin. The diameters of the through holes 61aa, 61ab and the diameters of the through holes 61ac to 61ae are larger than the diameter of the through hole 61af. The cutout portion 61ag can lead out the first lead-out portion 22 of the first bus bar 20, the first lead-out portion 32 of the second bus bar 30, and the insulating component 40 from the inside of the capacitor to the outside of the capacitor in the state where the capacitor 1 is assembled. The number of through holes for injecting the sealing resin 70 may also be a number other than six. The number of through holes for discharging the air bubbles may also be a number other than twelve.

[0137] The top surface of the top plate portion 61a of the lid 60B of the present embodiment is used as an indication of the upper limit of the injection amount of the sealing resin 70, and the lower surface of the top plate portion 61a is used as an indication of the lower limit of the injection amount of the sealing resin 70. In addition, in order to use the lid 60B as an indication of the upper limit and the lower limit of the injection amount of the sealing resin 70, for example, the thickness of the lid 60B is adjusted.

[0138] The lid 60B of the third embodiment uses the top surface of the top plate portion 61a as an indication of the upper limit of the injection amount of the sealing resin 70, and uses the lower surface of the top plate portion 61a as an indication of the lower limit of the injection amount of the sealing resin 70, thereby adjusting the injection amount of the sealing resin 70. Thereby, the thickness of the sealing resin 70 covering the upper part of the capacitor element 10 can be adjusted, and the deviation of the resin amount can be suppressed. In addition, the same effects as those of the first embodiment can be achieved.

[0139] In addition, when using the lower surface of the top plate portion 61a as an indication of the lower limit of the injection amount of the sealing resin 70, from the viewpoint of heat dissipation, it is preferable that the resin surface of the sealing resin 70 contacts the lower surface of the top plate portion 61a. However, the contact between the lower surface of the top plate portion 61a and the sealing resin 70 is not essential. For example, the case where the resin surface of the sealing resin 70 that can be visually recognized from the through-hole portion of the lid 60B reaches near the lower surface of the top plate portion 61a is also included in the case where the lid 60B (through-hole portion) functions as an indication portion.

[0140] In addition, various design changes can be implemented for the above structure.

[0141] In the first to third embodiments, the lids 60, 60A, and 60B are housed inside the first to fourth side portions 51b to 51e of the housing 50, but it is not limited thereto. For example, the housing may be housed inside the first to fourth side portions of the lid. In this case, for example, the outer surface of the second side portion of the housing has a first fitting portion, and the outer surface of the fourth side portion of the housing has a second fitting portion. Moreover, the lid has a first fitting portion that extends parallel to the top plate portion from the lower end portion of the second side portion, and a second fitting portion that extends parallel to the top plate portion from the lower end portion of the fourth side portion.

[0142] In the first to third embodiments, the lids 60, 60A, and 60B are housed inside the first to fourth side portions 51b to 51e of the housing 50, but it is not limited thereto. For example, it may also be Figures 16(a) to 16(c) the structure shown. Figures 16(a) to 16(c) It is a schematic plan view of the capacitor, and the illustration of the first bus bar 20, the second bus bar 30, the insulating member 40, etc. is omitted for simplicity of the illustration.

[0143] The top plate portion 61aC of the lid 60C of the modification shown in FIG. 16(a) has through-hole portions 61aaC to 61aeC for resin injection, a through-hole portion 61afC for discharging air bubbles, and a cutout portion 61agC for leading out the first bus bar 20, the second bus bar 30, and the insulating member 40 to the outside of the capacitor 1. In addition, the lid 60C has an outer shape that substantially closes the opening portion 51fC of the housing 50C. The first to fourth side portions 51bC to 51eC of the housing 50C are housed inside the first to fourth side portions 61bC to 61eC of the lid 60C. In this case, for example, the outer surface of the second side portion 51cC of the housing 50C has a first fitting portion, and the second side portion 61cC of the lid 60C has a first fitting portion that extends parallel to the top plate portion 61aC from the lower end portion. The first fitting portion is fitted to the first fitting portion. In addition, the outer surface of the fourth side portion 51eC of the housing 50C has a second fitting portion, and the fourth side portion 61eC of the lid 60C has a second fitting portion that extends parallel to the top plate portion 61aC from the lower end portion. The second fitting portion is fitted to the second fitting portion.

[0144] The top plate portion 61aD of the lid 60D in the modified example shown in Fig. 16(b) has resin injection through-holes 61aaD to 61adD and air bubble discharge through-holes 61afD. In a plan view, the lid 60D has a rectangular shape. The lid 60D only blocks a part of the opening 51fD of the housing 50D, not substantially the whole. That is, the portion indicated by the dotted arrow 80D in the opening 51fD is not blocked by the lid 60D. The second and fourth side portions 51cD and 51eD of the housing 50D are received inside the second and fourth side portions 61cD and 61eD of the lid 60D. In this case, the outer surface of the second side portion 51cD of the housing 50D has a first fitting portion, and the second side portion 61cD of the lid 60D has a first fitting portion extending parallel to the top plate portion 61aD from the lower end portion. The first fitting portion is fitted with the first fitting portion. In addition, the outer surface of the fourth side portion 51eD of the housing 50D has a second fitting portion, and the fourth side portion 61eD of the lid 60D has a second fitting portion extending parallel to the top plate portion 61aD from the lower end portion. The second fitting portion is fitted with the second fitting portion.

[0145] The top plate portion 61aE of the lid 60E in the modified example shown in Fig. 16(c) has resin injection through-holes 61aae to 61adE and air bubble discharge through-holes 61afE. In a plan view, the lid 60E has a cross shape. The lid 60E only blocks a part of the opening 51fE of the housing 50E, not substantially the whole. That is, the portion indicated by the dotted arrow 80E in the opening 51fE is not blocked by the lid 60E. The first to fourth side portions 51bE to 51eE of the housing 50E are received inside the first to fourth side portions 61bE to 61eE of the lid 60E. In this case, the outer surface of the second side portion 51cE of the housing 50E has a first fitting portion, and the second side portion 61cE of the lid 60E has a first fitting portion extending parallel to the top plate portion 61aE from the lower end portion. The first fitting portion is fitted with the first fitting portion. In addition, the outer surface of the fourth side portion 51eE of the housing 50E has a second fitting portion, and the fourth side portion 61eE of the lid 60E has a second fitting portion extending parallel to the top plate portion 61aE from the lower end portion. The second fitting portion is fitted with the second fitting portion. In addition, the outer surface of the first side portion 51bE of the housing 50E has a third fitting portion, and the first side portion 61bE of the lid 60E has a third fitting portion extending parallel to the top plate portion 61aE from the lower end portion. The third fitting portion is fitted with the third fitting portion. In addition, the outer surface of the third side portion 51dE of the housing 50E has a fourth fitting portion, and the third side portion 61dE of the lid 60E has a fourth fitting portion extending parallel to the top plate portion 61aE from the lower end portion. The fourth fitting portion is fitted with the fourth fitting portion.

[0146] The top plate portions 61a of the covers 60, 60A, and 60B of the first to third embodiments have a flat plate shape, but are not limited thereto. For example, they may also be Figure 17(a) , 17(b) the shapes shown. Figure 17(a) , 17(b) are schematic cross-sectional views of a capacitor. To simplify the illustration, the illustration of the first bus bar 20, the second bus bar 30, the insulating member 40, etc. is omitted.

[0147] The top plate portion 61aF of the cover 60F of the modified example shown in FIG. 17(a) has resin injection through-holes 61aaF to 61adF, etc. In addition, the top plate portion 61aF of the cover 60F has extension portions 64F at three locations on the lower surface. The extension portions 64F have a base portion 64aF, a first lower limit marking portion 64bF, and a second lower limit marking portion 64cF. The upper surfaces of the three first lower limit marking portions 64bF are equal in height to the upper surfaces of the three second lower limit marking portions 64cF. The upper surfaces of the three first lower limit marking portions 64bF and the upper surfaces of the three second lower limit marking portions 64cF serve as marks for the lower limit of the injection amount of the sealing resin 70. The upper surface near the deepest part of the top plate portion 61aF of the cover 60F serves as a mark for the upper limit of the injection amount of the sealing resin 70. As shown in FIG. 17(a), the top plate portion 61aF of the cover 60F has a curved shape that bulges outward from the capacitor. The front ends of the extension portions 64F are buried in the sealing resin 70.

[0148] The top plate portion 61aG of the cover 60G of the modified example shown in FIG. 17(b) has resin injection through-holes 61aaG to 61adG, etc. In addition, the top plate portion 61aG of the cover 60G has extension portions 64G at three locations on the lower surface. The extension portions 64G have a base portion 64aG, a first lower limit marking portion 64bG, and a second lower limit marking portion 64cG. The upper surfaces of the three first lower limit marking portions 64bG are equal in height to the upper surfaces of the three second lower limit marking portions 64cG. The upper surfaces of the three first lower limit marking portions 64bG and the upper surfaces of the three second lower limit marking portions 64cG serve as marks for the lower limit of the injection amount of the sealing resin 70. The upper surface near the deepest part of the top plate portion 61aG of the cover 60G serves as a mark for the upper limit of the injection amount of the sealing resin 70. As shown in FIG. 17(b), the top plate portion 61aG of the cover 60G has a curved shape that depresses inward from the capacitor. The front ends of the extension portions 64G are buried in the sealing resin 70.

[0149] In addition, in Figures 16(a) to 16(c) the modified examples of the covers 60C to 60E shown, the top plate portions 61aC to 61aE may also have a curved shape that bulges outward from the capacitor or may have a curved shape that depresses inward from the capacitor.

[0150] In addition, the content described in the above embodiments or variations may be appropriately combined.

[0151] The present invention can be widely applied to capacitors in which capacitor elements accommodated in a case are sealed with a sealing resin.

Claims

1. A capacitor, characterized in that, comprising: a capacitor element; a housing having an opening and accommodating the capacitor element; a lid having a through-hole and disposed at the opening in a state where the capacitor element is accommodated in the housing; and a sealing resin injected into the housing to seal the capacitor element.

2. The capacitor according to claim 1, wherein the outer surface of the lid is a substantially flat surface.

3. The capacitor according to claim 1 or 2, wherein the lid has an outer shape that substantially closes the opening.

4. The capacitor according to any one of claims 1 to 3, wherein the lid has an extension extending downward from the inner surface, and at least the front end of the extension is buried in the sealing resin.

5. The capacitor according to claim 4, wherein the extension has an identification portion that is an identification of the resin surface of the sealing resin.

6. The capacitor according to claim 5, wherein the identification portion is visually recognizable through the through-hole.

7. The capacitor according to any one of claims 1 to 6, wherein in a state where the lid is disposed at the opening, the sealing resin is injected into the housing through the through-hole.

8. A method for manufacturing a capacitor, characterized in that, comprising: disposing a lid having a through-hole at the opening of a housing that accommodates a capacitor element; and in a state where the lid is disposed at the opening, injecting a sealing resin into the housing through the through-hole to seal the capacitor element.

9. The method for manufacturing a capacitor according to claim 8, wherein the outer surface of the lid is a substantially flat surface.

10. The method for manufacturing a capacitor according to claim 8 or 9, wherein the lid has an outer shape that substantially closes the opening.

11. The method for manufacturing a capacitor according to any one of claims 8 to 10, wherein the lid has an extension extending downward from the inner surface, and at least the front end of the extension is buried in the sealing resin.

12. The method for manufacturing a capacitor according to claim 11, wherein the extension has an identification portion that is an identification of the resin surface of the sealing resin.

13. The method for manufacturing a capacitor according to claim 12, wherein the identification portion is visually recognizable through the through-hole.

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