Optical element, photodetector, and electronic apparatus

Abstract

An optical element is provided. The optical element includes: a structure including a first component and a second component disposed around the first component, the second component having a refractive index different from a refractive index of the first component; and a filler material disposed around the structure and having a refractive index different from a refractive index of the second component.

Description

Cross - reference to related applications

[0001] This application claims the benefit of Japanese Priority Patent Application JP2022 - 210860, filed on December 27, 2022, the entire content of which is incorporated herein by reference. Technical field

[0002] This disclosure relates to optical elements, photodetectors, and electronic devices. Background art

[0003] A color - separation lens array has been proposed, which has a plurality of nanoposts and focuses incident light according to wavelengths (Patent Document 1). Citation list Patent document

[0004] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2021 - 69119 Summary of the invention Technical problem

[0005] It is desirable for an optical element to effectively focus incident light.

[0006] It is desirable to provide an optical element capable of effectively focusing light. Problem - solving means

[0007] The optical element according to an embodiment of the present disclosure includes: a structure having a columnar shape and including a first member and a second member provided around the first member, the refractive index of the second member being different from that of the first member; and a material provided around the structure and having a refractive index different from that of the second member. In various embodiments, the structure may have other shapes than the columnar shape, including but not limited to a rectangular shape (e.g., Figure 14 and 17 ) or a cross - shape (e.g., Figure 15 ). The photodetector according to an embodiment of the present disclosure includes: a first light - guiding member including a first structure having a columnar shape and a material provided around the first structure; and a first photoelectric conversion element that performs photoelectric conversion on the light incident via the first light - guiding member. The first structure includes a first member and a second member provided around the first member, the refractive index of the second member being different from that of the first member. The material is provided around the first structure and has a refractive index different from that of the second member. In various embodiments, the first structure may be provided above the first photoelectric conversion element and scatter the incident light. The electronic device according to an embodiment of the present disclosure includes: an optical system; and a photodetector that receives light transmitted through the optical system. The photodetector includes: a first light guiding member including a first structure having a columnar shape and a material provided around the first structure; and a first photoelectric conversion element that performs photoelectric conversion on the light incident via the first light guiding member. The first structure includes a first member and a second member provided around the first member, and the refractive index of the second member is different from that of the first member. The material is provided around the first structure and its refractive index is different from that of the second member. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a block diagram showing a schematic configuration example of an imaging device as an example of a photodetector according to an embodiment of the present disclosure. Figure 2 is a diagram showing a configuration example of a pixel of an imaging device according to an embodiment of the present disclosure. Figure 3 is a diagram showing a planar configuration example of an imaging device according to an embodiment of the present disclosure. Figure 4 is a diagram showing a cross-sectional configuration example of an imaging device according to an embodiment of the present disclosure. Figure 5A is a diagram showing a planar configuration example of an imaging device according to an embodiment of the present disclosure. Figure 5B is a diagram showing a planar configuration example of an imaging device according to an embodiment of the present disclosure. Figure 5C is a diagram showing a planar configuration example of an imaging device according to an embodiment of the present disclosure. Figure 6 is a diagram showing a configuration example of the structure of an imaging device according to a comparative example of the present disclosure. Figure 7 is a diagram showing an example of the amount of phase delay in a light guiding portion of an imaging device according to a comparative example of the present disclosure. Figure 8 is a diagram showing a configuration example of the structure of an imaging device according to an embodiment of the present disclosure. Figure 9 is a diagram showing an example of the amount of phase delay in a light guiding portion of an imaging device according to an embodiment of the present disclosure. Figure 10A is a diagram showing an example of a manufacturing method of an imaging device according to an embodiment of the present disclosure. Figure 10B is a diagram showing an example of a manufacturing method of an imaging device according to an embodiment of the present disclosure. Figure 10C is a diagram showing an example of a manufacturing method of an imaging device according to an embodiment of the present disclosure. Figure 10DIt is a diagram showing an example of a method for manufacturing an imaging device according to an embodiment of the present disclosure. Figure 10E It is a diagram showing an example of a method for manufacturing an imaging device according to an embodiment of the present disclosure. Figure 10F It is a diagram showing an example of a method for manufacturing an imaging device according to an embodiment of the present disclosure. Figure 10G It is a diagram showing an example of a method for manufacturing an imaging device according to an embodiment of the present disclosure. Figure 11 It is a diagram showing an example of a planar structure of an imaging device according to Modification 1 of the present disclosure. Figure 12A It is a diagram showing an example of a cross-sectional structure of an imaging device according to Modification 1 of the present disclosure. Figure 12B It is a diagram showing an example of a cross-sectional structure of an imaging device according to Modification 1 of the present disclosure. Figure 13 It is a diagram showing another example of a planar structure of an imaging device according to Modification 1 of the present disclosure. Figure 14 It is an explanatory diagram of a configuration example of a light guide unit of an imaging device according to Modification 2 of the present disclosure. Figure 15 It is an explanatory diagram of a configuration example of a light guide unit of an imaging device according to Modification 2 of the present disclosure. Figure 16 It is an explanatory diagram of a configuration example of a light guide unit of an imaging device according to Modification 3 of the present disclosure. Figure 17 It is an explanatory diagram of another configuration example of a light guide unit of an imaging device according to Modification 3 of the present disclosure. Figure 18 It is a diagram showing an example of a cross-sectional structure of an imaging device according to Modification 4 of the present disclosure. Figure 19 It is a block diagram showing an example of a configuration of an electronic device including an imaging device. Figure 20 It is a block diagram showing a schematic configuration example of a vehicle control system. Figure 21 It is a diagram for assisting in explaining an example of the installation positions of an external information detection unit and an imaging unit. Figure 22 It is a diagram showing a schematic configuration example of an endoscopic surgery system. Figure 23 It is a block diagram showing an example of a functional configuration of a camera head and a camera control unit (CCU). Detailed Description of the Invention

[0009] Embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. Note that the description will be given in the following order. 1. Embodiment 2. Modification Example 3. Application Example 4. Practical Application Example <1. Embodiment>

[0010] Figure 1 is a block diagram showing a schematic configuration example of an imaging device, which is an example of a light detector according to an embodiment of the present disclosure. A light detector is a device capable of detecting incident light. The imaging device 1 is a light detector, which includes a plurality of pixels P, each pixel P includes a photoelectric conversion section (photoelectric conversion element), and is configured to perform photoelectric conversion on incident light and generate a signal. The imaging device 1 (light detector) can receive light transmitted through an optical system including an optical lens and generate a signal.

[0011] The photoelectric conversion section of each pixel P of the imaging device 1 is, for example, a photodiode, and is configured to be able to perform photoelectric conversion on light. The imaging device 1 includes an area (pixel section 100) as an imaging area, in which a plurality of pixels P are arranged in a two-dimensional matrix form. The pixel section 100 may also be referred to as a pixel array in which a plurality of pixels P are arranged.

[0012] The imaging device 1 obtains incident light (image light) from a subject through an optical system (not shown) including an optical lens. The imaging device 1 captures an image of the subject formed by the optical lens. The imaging device 1 can perform photoelectric conversion on the received light to generate a pixel signal. The imaging device 1 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor. The imaging device 1 can be used, for example, in electronic devices such as a digital still camera, a video camera, or a mobile phone. Schematic Configuration of Imaging Device

[0013] As in the example shown in Figure 1 the imaging device 1 includes, for example, a pixel driving section 111, a signal processing section 112, a control section 113, and a processing section 114, etc. in a peripheral area of the pixel section 100 (pixel array). In addition, the imaging device 1 is also provided with a plurality of control lines L1 and a plurality of signal lines L2.

[0014] The control line L1 is a signal line capable of transmitting a signal for controlling the pixel P, and is connected to the pixel driving section 111 and the pixel P of the pixel section 100. In the pixel section 100, in the example shown in Figure 1 the plurality of control lines L1 are respectively wired for each pixel row, and each pixel row is composed of a plurality of pixels P arranged in the horizontal direction (row direction). The control line L1 is configured to transmit a control signal for reading a signal from the pixel P.

[0015] As an example, the plurality of control lines L1 for each pixel row in the imaging device 1 include wiring for transmitting signals for controlling transfer transistors, wiring for transmitting signals for controlling selection transistors, and wiring for transmitting signals for controlling reset transistors, and the like. The control line L1 may also be referred to as a drive line (pixel drive line) for transmitting signals for driving the pixel P.

[0016] The signal line L2 is a signal line capable of transmitting signals from the pixel P, and is connected to the pixel P of the pixel unit 100 and the signal processing unit 112. For example, in the pixel unit 100, the signal line L2 is wired for each pixel column, and each pixel column is composed of a plurality of pixels P arranged in the vertical direction (column direction). The signal line L2 is a vertical signal line and is configured to transmit signals output from the pixel P.

[0017] The pixel drive unit 111 is configured to be able to drive each pixel P of the pixel unit 100. The pixel drive unit 111 is a drive circuit and is composed of, for example, a plurality of circuits including a buffer, a shift register, and an address decoder. The pixel drive unit 111 generates signals for driving the pixel P and outputs the signals to each pixel P of the pixel unit 100 through the control line L1. The pixel drive unit 111 is controlled by the control unit 113 and controls the pixel P of the pixel unit 100.

[0018] The pixel drive unit 111 generates, for example, signals for controlling the pixel P (for example, signals for controlling transfer transistors of the pixel P and signals for controlling reset transistors), and supplies the signals to each pixel P through the control line L1. The pixel drive unit 111 can perform control to read pixel signals from each pixel P. The pixel drive unit 111 may also be referred to as a pixel control unit, which is configured to be able to control each pixel P. Note that the pixel drive unit 111 and the control unit 113 may also be collectively referred to as a pixel control unit.

[0019] The signal processing unit 112 is configured to be able to perform signal processing on the input pixel signals. The signal processing unit 112 is a signal processing circuit and includes, for example, a load circuit unit, an AD (analog-to-digital) converter unit, and a horizontal selection switch. Note that the signal processing unit 112 may include an amplification circuit unit configured to amplify signals read from the pixel P through the signal line L2.

[0020] Signals output from each pixel P are selected and scanned by the pixel drive unit 111 and input to the signal processing unit 112 via the signal line L2. The signal processing unit 112 can perform signal processing such as CDS (correlated double sampling) and AD conversion on the signals of the pixel P. Signals of each pixel P transmitted through each signal line L2 undergo signal processing in the signal processing unit 112 and are then output to the processing unit 114.

[0021] The processing unit 114 is configured to be able to perform signal processing on the input signal. The processing unit 114 is a signal processing circuit and is constituted by, for example, a circuit that performs various signal processes on the pixel signal. The processing unit 114 may include a processor and a memory. The processing unit 114 performs signal processing on the pixel signal input from the signal processing unit 112 and outputs the processed pixel signal. The processing unit 114 can perform various signal processes such as, for example, noise reduction processing or gray scale correction processing.

[0022] The control unit 113 is configured to be able to control each part of the imaging device 1. The control unit 113 can receive a clock or data for commanding an operation mode provided from the outside and output data such as internal information of the imaging device 1. The control unit 113 is a control circuit and includes, for example, a timing generator configured to be able to generate various timing signals. The control unit 113 controls the driving of the pixel driving unit 111, the signal processing unit 112, etc. according to various timing signals (pulse signals, clock signals, etc.) generated by the timing generator. Note that the control unit 113 and the processing unit 114 may be integrally configured.

[0023] The pixel driving unit 111, the signal processing unit 112, the control unit 113, the processing unit 114, etc. may be provided on one semiconductor substrate or may be respectively provided on a plurality of semiconductor substrates. The imaging device 1 may have a structure (stacked structure) constituted by stacking a plurality of substrates. Structure of Pixel

[0024] Figure 2 is a diagram showing an example of the structure of a pixel of an imaging device according to an embodiment. The pixel P includes a photoelectric conversion unit 12 (photoelectric conversion element) and a readout circuit 20. The readout circuit 20 is configured to be able to output a signal based on the charge obtained by photoelectric conversion. As an example, the readout circuit 20 includes a transfer transistor 13, an FD (floating diffusion section) 14, an amplification transistor 15, a selection transistor 16, and a reset transistor 17.

[0025] The transfer transistor 13, the amplification transistor 15, the selection transistor 16, and the reset transistor 17 are all MOS transistors (MOSFETs), and the MOS transistors include a gate terminal, a source terminal, and a drain terminal. In Figure 2 the example shown, the transfer transistor 13, the amplification transistor 15, the selection transistor 16, and the reset transistor 17 are all constituted by NMOS transistors. Note that the transistors of the pixel P may also be constituted by PMOS transistors.

[0026] The photoelectric conversion unit 12 is configured to receive light and generate a signal. The photoelectric conversion unit 12 is a light receiving unit (light receiving element) and is configured to be able to generate charge by photoelectric conversion. In Figure 2In the example shown, the photoelectric conversion unit 12 is a photodiode (PD), and converts incident light into charge. The photoelectric conversion unit 12 performs photoelectric conversion to generate charge corresponding to the received light amount.

[0027] The transfer transistor 13 is configured to be able to transfer the charge photoelectrically converted by the photoelectric conversion unit 12 to the FD 14. As Figure 2 shown, the transfer transistor 13 is controlled by the signal TRG to electrically connect or disconnect the photoelectric conversion unit 12 and the FD 14 from each other. The transfer transistor 13 can transfer the charge photoelectrically converted and accumulated by the photoelectric conversion unit 12 to the FD 14.

[0028] The FD 14 is an accumulation unit and is configured to be able to accumulate the transferred charge. The FD 14 can accumulate the charge photoelectrically converted by the photoelectric conversion unit 12. The FD 14 can also be referred to as a holding unit, which is able to hold the transferred charge. The FD 14 accumulates the transferred charge and converts it into a voltage corresponding to the capacity of the FD 14.

[0029] The amplifying transistor 15 is configured to generate and output a signal based on the charge accumulated in the FD 14. As Figure 2 shown, the gate of the amplifying transistor 15 is electrically connected to the FD 14 to allow the voltage converted by the FD 14 to be input to the gate. The drain of the amplifying transistor 15 is connected to the power supply line to receive the power supply voltage VDD, and the source of the amplifying transistor 15 is connected to the signal line L2 through the selection transistor 16. The amplifying transistor 15 can generate a signal based on the charge accumulated in the FD 14 (i.e., a signal based on the FD 14 voltage) and output the generated signal to the signal line L2.

[0030] The selection transistor 16 is configured to be able to control the output of the pixel signal. The selection transistor 16 is controlled by the signal SEL and is configured to be able to output the signal from the amplifying transistor 15 to the signal line L2. The selection transistor 16 can control the output timing of the pixel signal. Note that the selection transistor 16 can be provided between the power supply line for supplying the power supply voltage VDD and the amplifying transistor 15. In addition, the selection transistor 16 can be omitted as needed.

[0031] The reset transistor 17 is configured to be able to reset the voltage of the FD 14. In Figure 2 the example shown, the reset transistor 17 is electrically connected to the power supply line to receive the power supply voltage VDD and is configured to reset the charge of the pixel P. The reset transistor 17 can be controlled by the signal RST to reset the charge accumulated in the FD 14 and reset the voltage of the FD 14. Note that the reset transistor 17 can release the charge accumulated in the photoelectric conversion unit 12 through the transfer transistor 13.

[0032] The pixel driving unit 111 (seeFigure 1 )Control signals are supplied to the gates of the transfer transistor 13, the selection transistor 16, the reset transistor 17, etc. of each pixel P through the above-mentioned control line L1, so that these transistors are in an on state (conductive state) or an off state (non-conductive state). The plurality of control lines L1 of the imaging device 1 include a wiring for transmitting a signal TRG for controlling the transfer transistor 13, a wiring for transmitting a signal SEL for controlling the selection transistor 16, a wiring for transmitting a signal RST for controlling the reset transistor 17, etc.

[0033] The on or off state of the transfer transistor 13, the selection transistor 16, the reset transistor 17, etc. is controlled by the pixel driving unit 111. The pixel driving unit 111 controls the readout circuit 20 of each pixel P, so that each pixel P outputs a pixel signal to the signal line L2. The pixel driving unit 111 can perform control to read the pixel signal of each pixel P into the signal line L2. Configuration of the imaging device

[0034] Figure 3 is a diagram showing an example of the planar configuration of the imaging device according to the present embodiment. Figure 3 An example of the arrangement of the pixels P of the pixel unit 100 in the imaging device 1 is shown. The pixel P of the imaging device 1 includes a color filter 25. In addition, the pixel P further includes a light guide unit 40 (light guide member), and the light guide unit 40 is constituted by a structure 30 described later. Note that, as Figure 3 shown, the incident direction of the light from the subject is defined as the Z-axis direction; the left-right direction orthogonal to the Z-axis direction on the paper surface is defined as the X-axis direction; and the up-down direction orthogonal to the Z-axis direction and the X-axis direction on the paper surface is defined as the Y-axis direction. In the following drawings, in some cases, the arrow direction in Figure 3 can be used as the standard for indicating the direction.

[0035] The color filter 25 is configured to selectively transmit light in a specific wavelength region among the incident light. The color filter 25 is, for example, an RGB color filter or a filter that transmits infrared light. The plurality of pixels P provided in the pixel unit 100 of the imaging device 1 include a plurality of pixels Pr provided with a color filter 25 that transmits red (R) light, a plurality of pixels Pg provided with a color filter 25 that transmits green (G) light, and a plurality of pixels Pb provided with a color filter 25 that transmits blue (B) light.

[0036] In the pixel unit 100, as in Figure 3In the illustrated example, these multiple pixels Pr, multiple pixels Pg, and multiple pixels Pb are arranged repeatedly. The pixels Pr, pixels Pg, and pixels Pb are arranged, for example, in a Bayer arrangement. The pixels Pr, pixels Pg, and pixels Pb generate pixel signals for the R component, pixel signals for the G component, and pixel signals for the B component, respectively. The imaging device 1 is capable of acquiring RGB pixel signals.

[0037] Note that the filter 25 provided for the pixel P of the pixel unit 100 is not limited to a color filter of the primary color system (RGB), and may be a color filter of the complementary color system (e.g., Cy (cyan), Mg (magenta), or Ye (yellow)). A filter corresponding to W (white), i.e., a filter that transmits light beams in all wavelength ranges of incident light, may be arranged.

[0038] In addition, the filter 25 may be omitted as needed in the imaging device 1. For example, in the pixel P that receives white light (W) for photoelectric conversion, the filter 25 may not be provided. Further, for example, depending on the characteristics of the light guiding unit 40, the filter 25 may not be provided for some or all of the pixels P of the imaging device 1.

[0039] Figure 4 It is a diagram showing an example of a cross-sectional structure of the imaging device according to the present embodiment. Figures 5A to 5C They are diagrams showing examples of a planar structure of the imaging device according to the present embodiment. As Figure 4 shown, in the structure of the imaging device 1, for example, the light guiding unit 40, the insulating layer 50, the filter 25, the semiconductor layer 10, and the multilayer wiring layer 90 are stacked in the Z-axis direction.

[0040] As Figure 4 shown, the semiconductor layer 10 has a first surface 11S1 and a second surface 11S2 that face each other. The second surface 11S2 is a surface on the opposite side of the first surface 11S1. The semiconductor layer 10 is constituted by a semiconductor substrate, for example, a Si (silicon) substrate. The first surface 11S1 of the semiconductor layer 10 is a light receiving surface (light incident surface). The second surface 11S2 of the semiconductor layer 10 is an element formation surface on which elements such as transistors are formed. The second surface 11S2 of the semiconductor layer 10 may be provided with a gate electrode, a gate oxide film, etc.

[0041] In Figure 4 the illustrated example, the filter 25, the light guiding unit 40, etc. are provided on the first surface 11S1 side of the semiconductor layer 10. The multilayer wiring layer 90 is provided on the second surface 11S2 side of the semiconductor layer 10. The light guiding unit 40, the filter 25, etc. are provided on the incident side of light from the optical system, and the multilayer wiring layer 90 is provided on the side opposite to the light incident side. The imaging device 1 is a so-called back-illuminated imaging device.

[0042] In the semiconductor layer 10, a plurality of photoelectric conversion portions 12 (photoelectric conversion elements) are provided along the first surface 11S1 and the second surface 11S2 of the semiconductor layer 10. For example, the plurality of photoelectric conversion portions 12 are embedded and formed in the semiconductor layer 10. Note that the semiconductor layer 10 may be an SOI (silicon on insulator) substrate, a SiGe (silicon germanium) substrate, a SiC (silicon carbide) substrate, etc., and may be composed of a III-V group compound semiconductor material or the like.

[0043] The multilayer wiring layer 90 includes, for example, a conductor film and an insulating film, and includes a plurality of wirings and via interconnect portions (VIA), etc. The multilayer wiring layer 90 includes, for example, two or more layers of wirings. In the structure of the multilayer wiring layer 90, the plurality of wirings are stacked with an insulating film therebetween. The insulating film of the multilayer wiring layer 90 may also be referred to as an interlayer insulating film (interlayer insulating layer).

[0044] The wirings of the multilayer wiring layer 90 are formed using a metal material such as aluminum (Al), copper (Cu), or tungsten (W). The wirings of the multilayer wiring layer 90 may be composed of polysilicon (Poly-Si) or other conductive materials. The interlayer insulating film is formed using, for example, silicon oxide (SiO), silicon nitride (SiN), or silicon oxynitride (SiON), etc.

[0045] The semiconductor layer 10 and the multilayer wiring layer 90 are provided with, for example, the above-mentioned readout circuit 20 (see Figure 2 ). Note that the above-mentioned pixel driving portion 111, signal processing portion 112, control portion 113, processing portion 114, etc. may be provided on a substrate different from the semiconductor layer 10, or may be provided in the semiconductor layer 10 and the multilayer wiring layer 90.

[0046] The insulating layer 50 is provided between the layer provided with the light guide portion 40 and the layer provided with the filter 25. The insulating layer 50 is a spacer layer, and is provided to stack the filter 25 between the light guide portion 40 and the semiconductor layer 10 and is located on the first surface 11S1 of the semiconductor layer 10. The insulating layer 50 is formed using, for example, an insulating film such as an oxide film, a nitride film, or an oxynitride film.

[0047] The insulating layer 50 may be composed of silicon oxide (SiO), silicon nitride (SiN), and silicon oxynitride (SiON), etc., or may also be formed using other insulating materials. The insulating layer 50 may also be referred to as a planarization layer (planarization film). In addition, the insulating layer 50 may also be referred to as a transparent layer that transmits light.

[0048] In addition, the imaging device 1 is provided with a separation portion 60, a light guide wall 65, and an antireflection film 45a. The separation portion 60 is provided between the plurality of photoelectric conversion portions 12 adjacent to each other to isolate the photoelectric conversion portions 12 from each other. The separation portion 60 has grooves (recesses) provided at the boundaries between adjacent pixels P (or photoelectric conversion portions 12). For example, the separation portion 60 is provided in the semiconductor layer 10 to surround the photoelectric conversion portion 12.

[0049] For example, as in Figure 4 the example shown, the separation portion 60 may be provided to penetrate the semiconductor layer 10. As an example, an insulating film, such as a silicon oxide film, is provided in the groove of the separation portion 60. Note that polysilicon, a metal material, or the like may be embedded in the groove of the separation portion 60. The separation portion 60 may also be formed of other dielectric materials having a low refractive index. For example, an air gap (cavity) may be provided in the groove of the separation portion 60. By providing the separation portion 60, light leakage to surrounding pixels P can be suppressed.

[0050] The light guide wall 65 is provided between the plurality of filters 25 adjacent to each other. The light guide wall 65 is, for example, a wall-like structure and is provided to surround the filter 25. The light guide wall 65 is located on the side surface of the filter 25, and its refractive index is lower than that of the surrounding medium. The refractive index of the light guide wall 65 is lower than that of the filter 25. The light guide wall 65 is provided at the boundary between adjacent pixels P and may also be referred to as a separation wall (or separation portion) that isolates the filters 25 from each other.

[0051] The light guide wall 65 is constituted of, for example, silicon oxide or an air gap (cavity). Note that the light guide wall 65 may be formed of other dielectric materials having a low refractive index. The light guide wall 65 may be constituted of an organic material. The light guide wall 65 changes the propagation direction of incident light by the refractive index difference between the light guide wall 65 and the surrounding medium. By providing the light guide wall 65, light leakage to surrounding pixels P can be suppressed, thereby reducing color mixing.

[0052] Note that the imaging device 1 may include a fixed charge film. For example, the fixed charge film is provided between the semiconductor layer 10 and the filter 25. As an example, the fixed charge film is constituted of a metal compound (metal oxide, metal nitride, etc.). The fixed charge film is, for example, a film having a negative fixed charge and suppresses the generation of dark current at the interface of the semiconductor layer 10.

[0053] The antireflection film 45a is constituted of an insulating material such as silicon nitride (SiN) or silicon oxide (SiO), for example. In Figure 4 the example shown, the antireflection film 45a is provided on the insulating layer 50 to reduce (suppress) reflection. Note that the insulating layer 50 or the light guide portion 40 may include the antireflection film 45a.

[0054] The light guide unit 40 (light guide member) includes the structure 30 and is configured to guide incident light to the photoelectric conversion unit 12 side. Light from the subject to be measured is incident on the light guide unit 40. The structure 30 is a fine (microscopic) structure whose size is equal to or smaller than a predetermined wavelength of the incident light. For example, the size (e.g., width) of the structure 30 is equal to or smaller than the wavelength of visible light. The size of the structure 30 may be equal to or smaller than the wavelength of infrared light.

[0055] The light guide unit 40 includes the structure 30 and a filling material 35 provided around the structure 30. The structure 30 is formed of a plurality of materials and has a columnar (rod-shaped) shape. In Figure 4 the example shown, the structure 30 includes a first member 31 and a second member 32 provided around the first member 31. The second member 32 is provided so as to surround the first member 31. The second member 32 is formed, for example, to cover the side surface (side portion) of the first member 31. The structure 30 may be provided above the photoelectric conversion element 12 and scatter the incident light.

[0056] The filling material 35 is provided so as to fill between the structures 30 adjacent to each other. The filling material 35 is embedded between the plurality of structures 30. Note that the filling material 35 may be formed to cover the structure 30 including the first member 31 and the second member 32. The first member 31 and the second member 32 are provided inside the filling material 35 and may be regarded as being arranged in a manner to replace a part of the filling material 35.

[0057] In addition, as Figure 4 shown, the light guide unit 40 includes an antireflection film 45b. The antireflection film 45b is formed of an insulating material such as silicon oxide (SiO) or silicon nitride (SiN), for example. Note that the antireflection film 45b may be formed of silicon oxynitride (SiON) or may be formed of other materials. The antireflection film 45b is provided on the structure 30 to reduce (suppress) reflection. The antireflection film 45b is provided so as to cover, for example, the structure 30 and the filling material 35.

[0058] The light guide unit 40 is an optical element using metamaterial (metasurface) technology and may also be referred to as a light guide element capable of guiding light. As will be described later, the light guide unit 40 according to the present embodiment is also a light scattering unit (light scattering element) and is configured to disperse incident light. For example, the light guide unit 40 may be provided for each pixel P or for a plurality of pixels P.

[0059] As Figure 4 shown, the structure 30 is, for example, a columnar structure. As Figure 4As shown schematically, the plurality of structures 30 are arranged side by side in the left-right direction (X-axis direction) on the paper surface with a part of the filling material 35 interposed therebetween. In each pixel P, the arrangement pitch of the plurality of structures 30 may be equal to or less than a predetermined wavelength of incident light, for example, equal to or less than the wavelength of visible light (or infrared light).

[0060] The refractive index of the structure 30 is different from that of the adjacent medium. In Figure 4 the example shown, the refractive index of the first component 31 of the structure 30 is different from that of the second component 32 disposed around the first component 31. The refractive index of the second component 32 of the structure 30 is different from that of the filling material 35.

[0061] For example, the refractive index of the first component 31 of the structure 30 may be higher than that of the second component 32. In addition, the refractive index of the first component 31 may be higher than that of the filling material 35. The refractive index of the constituent material of the first component 31 may be higher than those of the second component 32 and the filling material 35.

[0062] The refractive index of the second component 32 of the structure 30 is different from, for example, the refractive index of the filling material 35 and the refractive index of the first component 31 disposed around the second component 32. As an example, the second component 32 is made of a material having a refractive index higher than that of the filling material 35, and its refractive index is higher than that of the filling material 35. Additionally, for example, the second component 32 is made of a material having a refractive index lower than that of the filling material 35, and its refractive index is lower than that of the filling material 35.

[0063] The difference between the refractive index of the first component 31 and the refractive index of the second component 32 is, for example, 1.0 or more. In addition, for example, the difference between the refractive index of the first component 31 and the refractive index of the second component 32 may be 1.2 or more, or may be 1.5 or more. Note that the difference between the refractive index of the first component 31 and the refractive index of the second component 32 may be 0.3 or more.

[0064] The difference between the refractive index of the second component 32 and the refractive index of the filling material 35 is, for example, 1.0 or more. In addition, for example, the difference between the refractive index of the second component 32 and the refractive index of the filling material 35 may be 1.2 or more, or may be 1.5 or more. Note that the difference between the refractive index of the second component 32 and the refractive index of the filling material 35 may be 0.3 or more.

[0065] As an example, the structure 30 is made of titanium oxide. The structure 30 can be made of simple substances, oxides, nitrides, oxynitrides or composites of titanium, hafnium, zirconium, tantalum, aluminum, niobium, indium, etc. In addition, the structure 30 can also be made of silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, silicon oxycarbide or other silicon compounds. The structure 30 can be made of amorphous silicon (a-Si), polycrystalline silicon or germanium (Ge), etc.

[0066] In addition, the structure 30 can be made of organic substances such as siloxane. For example, the structure 30 can be made of a siloxane-based resin, a styrene-based resin or an acrylic-based resin, etc. The structure 30 can be made of a fluorine-containing material in any of these resins. The structure 30 can be formed of a material formed by filling beads (fillers) having a refractive index higher than that of the resin in any of these resins.

[0067] As described above, the first component 31 and the second component 32 of the structure 30 can be made of inorganic materials or can be made of organic materials. For example, the first component 31 can be made of a metal compound (metal oxide, metal nitride, etc.) such as titanium oxide. The first component 31 and the second component 32 can be made of different materials or can be made of the same type of materials.

[0068] As an example, the filling material 35 is formed of an inorganic material such as an oxide, a nitride or an oxynitride. The filling material 35 is made of, for example, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide or silicon oxycarbide, etc. Note that the filling material 35 can be made of an organic material. The filling material 35 can be made of a siloxane-based resin, a styrene-based resin or an acrylic-based resin, etc. The filling material 35 can be made of a fluorine-containing material in any of these resins. The filling material 35 can be formed of a material formed by filling beads having a refractive index higher than that of the resin in any of these resins.

[0069] The materials of the first component 31, the second component 32 and the filling material 35 can be selected according to the refractive index difference with respect to the surrounding medium and the wavelength range of the incident light to be measured. Note that the first component 31, the second component 32 and the filling material 35 can be partially made of air (air gap). That is, the light guiding portion 40 can have a space (cavity).

[0070] The light guiding unit 40 uses the refractive index difference between the structure 30 and the surrounding medium to cause phase delay of the incident light, thereby affecting the wave front. The light guiding unit 40 provides different amounts of phase delay according to the wavelength of the light, thereby adjusting the propagation direction of the light and thus separating the incident light into light beams in each wavelength region.

[0071] The dimensions (sizes), shapes, refractive indices, and spacings (arrangement intervals) of each structure 30 are determined so that the light beams in each wavelength region included in the incident light propagate in a desired direction. In Figure 4 the example shown, the dimensions (width, height, etc.), shapes, refractive indices, and intervals of each of the first member 31 and the second member 32 of the structure 30 and the refractive index of the filling material 35 can be adjusted.

[0072] The light guiding unit 40 (light scattering unit) is a light scattering element that uses metamaterial (metasurface) technology to achieve light scattering, and can also be referred to as a beam splitter (dichroic filter). The imaging device 1 according to the present embodiment can also be regarded as having a dichroic filter structure.

[0073] The direction in which the light guiding unit 40 propagates the light beams of each wavelength can be adjusted by the materials (optical constants) such as the first member 31, the second member 32, and the filling material 35 and the shape, height, and arrangement position of the structure 30. The light guiding unit 40 is a light scattering unit configured to scatter the incident light. Note that each light guiding unit 40 of the imaging device 1 can also be referred to as a region (light scattering region) that scatters the incident light through the structure 30.

[0074] The light guiding unit 40 provides different phase delays for the light beams in a plurality of wavelength regions (for example, the light beams in the first wavelength region to the third wavelength region). Thus, in the imaging device 1, the light incident on the light guiding unit 40 can be divided into the light in the first wavelength region (for example, the light in the blue wavelength region), the light in the second wavelength region (for example, the light in the green wavelength region), and the light in the third wavelength region (for example, the light in the red wavelength region). For example, the imaging device 1 can adjust the propagation direction of each of the blue light, the green light, and the red light.

[0075] The light guiding unit 40 of the pixel Pb is configured to propagate the blue light (B) among the incident light to the filter 25 and the photoelectric conversion unit 12 of the pixel Pb, and propagate the red light (R) to the filter 25 and the photoelectric conversion unit 12 of the pixel Pr. The light guiding unit 40 of the pixel Pb splits the incident light and guides the light in the red wavelength region among the incident light toward the pixel Pr.

[0076] In addition, the light guide portion 40 of pixel Pb is configured to propagate the green light (G) among the incident light to the color filter 25 and the photoelectric conversion portion 12 of pixel Pg. The light guide portion 40 of pixel Pb splits the incident light and guides the light in the green wavelength region among the incident light toward pixel Pg.

[0077] The light guide portion 40 of pixel Pr is configured to propagate the red light (R) among the incident light to the color filter 25 and the photoelectric conversion portion 12 of pixel Pr, and to propagate the blue light (B) to the color filter 25 and the photoelectric conversion portion 12 of pixel Pb. The light guide portion 40 of pixel Pr splits the incident light and guides the light in the blue wavelength region among the incident light toward pixel Pb.

[0078] In addition, the light guide portion 40 of pixel Pr is configured to propagate the green light (G) among the incident light to the color filter 25 and the photoelectric conversion portion 12 of pixel Pg. The light guide portion 40 of pixel Pr splits the incident light and guides the light in the green wavelength region among the incident light toward pixel Pg.

[0079] The light guide portion 40 of pixel Pg is configured to propagate the green light (G) among the incident light to the color filter 25 and the photoelectric conversion portion 12 of pixel Pg, and to propagate the blue light (B) to the color filter 25 and the photoelectric conversion portion 12 of pixel Pb. The light guide portion 40 of pixel Pg splits the incident light and guides the light in the blue wavelength region among the incident light toward pixel Pb.

[0080] In addition, the light guide portion 40 of pixel Pg is configured to propagate the red light (R) among the incident light to the color filter 25 and the photoelectric conversion portion 12 of pixel Pr. The light guide portion 40 of pixel Pg splits the incident light and guides the light in the red wavelength region among the incident light toward pixel Pr.

[0081] Therefore, as Figure 5A schematically indicated by the arrows in, multiple pixels around pixel Pb guide the light of the blue wavelength among the incident light toward pixel Pb. The blue light incident on pixel Pb and the blue light incident on each pixel around pixel Pb can be gathered onto the color filter 25 and the photoelectric conversion portion 12 of pixel Pb. The photoelectric conversion portion 12 of pixel Pb can effectively receive the light in the blue wavelength region and perform photoelectric conversion to generate charges corresponding to the amount of received light.

[0082] As Figure 5BAs schematically shown by the arrows in [the figure], multiple pixels around pixel Pg guide the light of the green wavelength among the incident light toward pixel Pg. The green light incident on pixel Pg and the green light incident on each pixel around pixel Pg can be concentrated on the color filter 25 and the photoelectric conversion section 12 of pixel Pg. The photoelectric conversion section 12 of pixel Pg can effectively receive the light in the green wavelength region and perform photoelectric conversion to generate charges corresponding to the received light quantity.

[0083] In addition, as Figure 5C schematically shown by the arrows in [the figure], multiple pixels around pixel Pr guide the light of the red wavelength among the incident light toward pixel Pr. The red light incident on pixel Pr and the red light incident on each pixel around pixel Pr can be concentrated on the color filter 25 and the photoelectric conversion section 12 of pixel Pr. The photoelectric conversion section 12 of pixel Pr can effectively receive the light in the red wavelength region and perform photoelectric conversion to generate charges corresponding to the received light quantity.

[0084] In this way, the imaging device 1 can effectively introduce more light into pixel P, thereby improving the quantum efficiency (QE). Note that the structure 30 of the corresponding light guiding sections 40 of the above-mentioned pixel Pb, pixel Pg, and pixel Pr can be formed, for example, to have respective different dimensions (such as width) and shapes, etc.

[0085] As described above, the light from the subject is incident on the photoelectric conversion section 12 of each pixel P through the light guiding section 40, the color filter 25, etc. The photoelectric conversion section 12 can receive the light incident through the structure 30 of the light guiding section 40 and perform photoelectric conversion to generate charges corresponding to the received light quantity. Therefore, the imaging device 1 uses the pixel signals obtained through the photoelectric conversion of the photoelectric conversion section 12 to generate, for example, a visible image or an infrared image, etc. In the imaging device 1, the light guiding section 40 can appropriately concentrate light, thereby improving the sensitivity to the incident light.

[0086] In the present embodiment, as described above, the structure 30 of the light guiding section 40 is constituted by the first component 31 and the second component 32. Therefore, the phase delay amount of the light in each wavelength region can be finely adjusted by setting the average refractive index of the light guiding section 40, thereby realizing the desired phase delay amount distribution. Thereby, the difference between the ideal phase distribution and the actual phase distribution for realizing the color separator is reduced, and thus the light can be appropriately concentrated. The sensitivity to the incident light can be improved. Hereinafter, the imaging device 1 according to the present embodiment will be further described in contrast with a comparative example.

[0087] Figure 6 FIG. [the figure number] is a structural example diagram showing the structure of an imaging device according to a comparative example. Figure 7FIG. 0 is a diagram showing an example of the amount of phase delay in a light guide unit of an imaging device according to a comparative example. The comparative example relates to a case where the structure 30 does not include the second member 32. The structure 30 according to the comparative example is composed of a single first member 31. The refractive index of the first member 31 is n1, and the refractive index of the filling material 35 is n0.

[0088] In Figure 7 the vertical axis represents the amount of phase delay of green light (unit: degrees), and the horizontal axis represents the amount of phase delay of blue light. Figure 7 The amount of phase delay is shown when the width W1 of the first member 31 is changed on the premise that n1>n0. Note that the width W1 is the width (length) in the direction orthogonal to the incident direction of light from the subject (i.e., the stacking direction (Z-axis direction) of the light guide unit 40 and the semiconductor layer 10).

[0089] In the comparative example, as in the example shown in Figure 7 when only the width W1 of the first member 31 is changed, the number of possible combinations of phase values that can be adopted by the light beams of the three RGB wavelengths is limited. In this case, it can be imagined that the difference between the ideal phase distribution for realizing the color separator and the actual phase distribution may increase. As a result, it is difficult to focus light ideally, which may lead to deterioration of the sensitivity improvement effect.

[0090] Figure 8 FIG. 16 is a diagram showing a structural example of an imaging device according to the present embodiment. Figure 9 FIG. 18 is a diagram showing an example of the amount of phase delay in a light guide unit of an imaging device according to the present embodiment. As in the example shown in Figure 8 the structure 30 according to the present embodiment is composed of the above-mentioned first member 31 and second member 32. The refractive index of the first member 31 is n1, and the refractive index of the second member 32 is n2. In addition, the refractive index of the filling material 35 is n0.

[0091] Figure 9 The amount of phase delay is shown when the width W1 of the first member 31 and the width W2 of the second member 32 are changed on the premise that n1>n0>n2. Note that the widths W1 and W2 are the widths (lengths) in the direction orthogonal to the incident direction of light from the subject (i.e., the stacking direction (Z-axis direction) of the light guide unit 40 and the semiconductor layer 10), respectively.

[0092] In the present embodiment, as in the example shown in Figure 9 the number of possible combinations of phase values that can be utilized by the light beams of the three RGB wavelengths can be increased. Therefore, the difference between the ideal phase distribution for realizing the color separator and the actual phase distribution can be reduced. As a result, the imaging device 1 can appropriately focus the incident light and thus improve the sensitivity to the incident light.

[0093] The first component 31, the second component 32, and the filling material 35 can be set to satisfy n1>n0>n2. In addition, the first component 31, the second component 32, and the filling material 35 can be set to satisfy n1>n2>n0. Light can be effectively focused on the photoelectric conversion unit 12, thereby improving the quantum efficiency (QE). Deterioration of spectral characteristics can be prevented.

[0094] Figures 10A to 10G These are diagrams showing examples of manufacturing methods for the imaging device according to the present embodiment. First, as Figure 10A shown, an insulating layer 50 serving as a spacer layer is formed in the form of a film above a semiconductor layer 10 in which a photoelectric conversion unit 12, a filter 25, etc. are formed inside or on the top. Then, as Figure 10B shown, an antireflection film 45a and a filling material 35 are formed on the insulating layer 50.

[0095] Next, as Figure 10C shown, the filling material 35 is selectively removed by photolithography and etching, and a plurality of holes (pores) are formed in the filling material 35. Then, as Figure 10D shown, the second component 32 is embedded and formed in each hole of the filling material 35.

[0096] Next, as Figure 10E shown, the second component 32 is selectively removed by photolithography and etching, and holes are formed in the second component 32. Then, as Figure 10F shown, the first component 31 is embedded and formed in the holes of the second component 32. In addition, as Figure 10G shown, an antireflection film 45b is formed. After that, a filter 25, etc. are formed. Through the above manufacturing method, the imaging device 1 shown in Figure 4 or other diagrams can be manufactured. Note that the above manufacturing method is only an example, and other manufacturing methods can be used. Functions and Effects

[0097] The optical element according to the present embodiment includes: a structure (structure 30) having a columnar shape and including a first component (first component 31) and a second component (second component 32) provided around the first component, the refractive index of the second component being different from that of the first component; and a filling material (filling component 35) provided around the structure and having a refractive index different from that of the second component.

[0098] The optical element (light guiding unit 40) according to the present embodiment includes a columnar structure 30 having a first component 31 and a second component 32 and a filling material 35. Therefore, incident light can be appropriately focused. An optical element capable of effectively focusing light can be realized.

[0099] The photodetector according to the present embodiment includes: a first light guiding member (light guiding portion 40), which includes a first structure (structure 30) having a columnar shape and a filling material (filling member 35) provided around the first structure; and a first photoelectric conversion element (photoelectric conversion portion 12), which performs photoelectric conversion on the light incident through the first light guiding member. The first structure includes a first member (first member 31) and a second member (second member 32) provided around the first member, and the refractive index of the second member is different from that of the first member. The filling material is provided around the first structure, and its refractive index is different from that of the second member.

[0100] The photodetector (imaging device 1) according to the present embodiment is provided with a light guiding portion 40, which includes a filling material 35 and a columnar structure 30 including a first member 31 and a second member 32. Thus, incident light can be effectively focused on the photoelectric conversion portion 12. A photodetector capable of effectively condensing light can be realized.

[0101] Next, a modification of the present disclosure will be described. Hereinafter, components similar to those in the above embodiment are denoted by the same reference numerals, and their descriptions are appropriately omitted. <2. Modification> (2-1. Modification 1)

[0102] In the above embodiment, an example in which the structure 30 of each of the pixels Pr, Pg, and Pb is formed of a plurality of materials has been described. However, the structure 30 formed of a plurality of materials may be provided only in one or two of the pixels Pr, Pg, and Pb.

[0103] For example, regarding the change in the width (diameter) of the structure 30, compared with the light in the red wavelength region, the light in the blue wavelength region and the green wavelength region tend to have a greater phase change. Therefore, the pixels Pg and Pb may be provided with a light guiding portion 40, which includes a structure 30 having a plurality of members (for example, a first member 31 and a second member 32).

[0104] As described above, by arranging the structure 30 including a plurality of members at positions corresponding to the pixels Pg and Pb (for example, provided above the photoelectric conversion portions of the pixels Pg and Pb), a more precise phase distribution can be designed. In other words, it is desirable to arrange the structure 30 including a plurality of members on a pixel that performs photoelectric conversion on light in a wavelength range having a shorter wavelength than the light in the red wavelength range.

[0105] Figure 11 It is a diagram showing an example of the planar configuration of the imaging device according to Modification 1 of the present disclosure. Figure 12A and 12BThese are diagrams showing exemplary cross-sectional structures of the imaging device according to Modification 1. As in the examples shown in Figure 11 and 12A the pixel Pg and the pixel Pb may each include a structure 30 composed of a first component 31 and a second component 32. Further, as in the examples shown in Figure 11 and 12B the pixel Pr may include a structure 30 composed of the first component 31. The number of possible combinations of phase values that can be utilized by the light beams in each wavelength band can be increased, enabling high-precision phase design.

[0106] Figure 13 This is a diagram showing another exemplary planar structure of the imaging device according to Modification 1 of the present disclosure. As in the example shown in Figure 13 the pixel Pb may include a structure 30 composed of a first component 31 and a second component 32. Further, the pixel Pg and the pixel Pr may each include a structure 30 composed of the first component 31. Note that, as in the example shown in Figures 11 to 13 the widths (diameters) of the first component 31 and the second component 32 of the structure 30 in each of the pixel Pb, the pixel Pg, and the pixel Pr may be formed to allow their respective sizes (widths) to be different.

[0107] In the case where pixels Pc including a Cy filter 25, pixels Pm including an Mg filter 25, and pixels Py including a Ye filter 25 are arranged, a structure 30 composed of multiple materials may be provided in only one or two of the pixels P. (2-2. Modification 2)

[0108] Figure 14 and Figure 15 These are explanatory diagrams showing exemplary structures of the light guide unit of the imaging device according to Modification 2. In the foregoing embodiments and modifications, exemplary structures of the light guide unit 40 including the structure 30 have been described. The shape of the structure 30 of the light guide unit 40 is not limited to the above examples. The shape of the structure 30 can be appropriately deformed, and as in the example shown in Figure 14 it may be quadrilateral in a plan view, for example.

[0109] Further, for example, as in the example shown in Figure 15 the shape of the structure 30 may be cross-shaped in a plan view. Note that the shape of the structure 30 may be polygonal, elliptical, or other shapes. (2-3. Modification 3)

[0110] Figure 16 This is an explanatory diagram showing an exemplary structure of the light guide unit of the imaging device according to Modification 3. In the structure of the structure 30 of the light guide unit 40, three or more materials can be combined. For example, as in Figure 16In the example shown, the structure 30 may include a third member 33 disposed around the second member 32.

[0111] The refractive index of the third member 33 of the structure 30 is different from the refractive index of the surrounding medium. For example, the refractive index of the third member 33 is different from the refractive index of the second member 32 and the refractive index of the filling material 35 disposed around the third member 33. For example, the refractive index of the third member 33 may be higher than the refractive index of the second member 32. In addition, the refractive index of the third member 33 may be higher than the refractive index of the filling material 35.

[0112] Alternatively, for example, the refractive index of the third member 33 may be lower than the refractive index of the second member 32. In addition, the refractive index of the third member 33 may be lower than the refractive index of the filling material 35. Note that, for example, the refractive index of the first member 31 may be higher than the refractive index of the third member 33. In this modified example, effects similar to those of the foregoing embodiment can also be obtained.

[0113] Note that the shape of the structure 30 can be appropriately changed. As shown in Figure 16 the example, the structure 30 may be circular in a plan view. As shown in Figure 17 the example, the structure 30 may be quadrilateral in a plan view. (2-4. Modified Example 4)

[0114] Figure 18 is a diagram showing an example of a cross-sectional structure of an imaging device according to Modified Example 4. As shown in Figure 18 the example, the imaging device 1 may include a lens unit 21. The lens unit 21 guides the light incident from above to the side where the filter 25 and the photoelectric conversion unit 12 are located. The lens unit 21 is an optical component and is also referred to as an on-chip lens. The lens unit 21 is provided, for example, above the light guide unit 40 for each pixel P or for every plurality of pixels P.

[0115] Light from a subject is incident on the lens unit 21 via an optical system such as an imaging lens. The photoelectric conversion unit 12 can perform photoelectric conversion on the light incident via the lens unit 21, the light guide unit 40, and the filter 25. Note that the lens unit 21 may be provided between the light guide unit 40 and the filter 25. The lens unit 21 may also be referred to as an internal lens. (2-5. Modified Example 5)

[0116] The light guide unit 40 as an optical element can be configured as a lens for focusing light according to the design of the structure 30. In addition, the light guide unit 40 can also be configured as an optical element for controlling the polarization state of light. In these cases, the light guide unit 40 is referred to as a metalens or a polarizing metalens, etc.

[0117] In addition, for example, the light guide unit 40 can be configured as a filter for selectively transmitting light in a specific wavelength region among incident light. The light guide unit 40 can be configured as an optical element (referred to as a deflector) for changing the propagation direction of light in a specific wavelength region. The optical element (light guide unit 40) and the light detector according to the present disclosure can be applied to various devices. <3. Application Examples>

[0118] The above imaging device 1 etc. can be applied to any type of electronic device having an imaging function, such as camera systems like still cameras or video cameras and mobile phones having an imaging function. Figure 19 The schematic configuration of the electronic device 1000 is shown.

[0119] The electronic device 1000 includes, for example, a lens group 1001, an imaging device 1, a DSP (Digital Signal Processor) circuit 1002, a frame memory 1003, a display unit 1004, a recording unit 1005, an operation unit 1006, and a power supply unit 1007. They are interconnected via a bus 1008.

[0120] The lens group 1001 receives incident light (image light) from the subject and forms an image on the imaging surface of the imaging device 1. The imaging device 1 converts the amount of incident light forming an image on the imaging surface through the lens group 1001 into an electrical signal pixel by pixel and provides the electrical signal as a pixel signal to the DSP circuit 1002.

[0121] The DSP circuit 1002 is a signal processing circuit that processes the signal provided from the imaging device 1. The DSP circuit 1002 outputs image data obtained by processing the signal from the imaging device 1. The frame memory 1003 temporarily stores the image data processed by the DSP circuit 1002 frame by frame.

[0122] The display unit 1004 includes, for example, a panel-type display device such as a liquid crystal panel or an organic EL (electroluminescence) panel, and records the image data of the moving image or still image captured by the imaging device 1 in a recording medium such as a semiconductor memory or a hard disk.

[0123] The operation unit 1006 outputs operation signals for various functions of the electronic device 1000 according to the user's operation. The power supply unit 1007 appropriately supplies various power supplies to the DSP circuit 1002, the frame memory 1003, the display unit 1004, the recording unit 1005, and the operation unit 1006 for the operation of these power supply targets. <4. Practical Application Examples> (Practical Application Examples on a Moving Body)

[0124] The technology according to the present disclosure (this technology) can be applied to various products. For example, the technology according to the present disclosure can be implemented in the form of a device installed on any type of moving body, such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, a personal mobility device, an airplane, a drone, a ship, and a robot.

[0125] Figure 20 is a block diagram showing a schematic configuration example of a vehicle control system as an example of a moving body control system to which the technology according to an embodiment of the present disclosure can be applied.

[0126] The vehicle control system 12000 includes a plurality of electronic control units connected to each other via a communication network 12001. Among Figure 20 the examples shown, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside vehicle information detection unit 12030, an inside vehicle information detection unit 12040, and an integrated control unit 12050. In addition, a microcomputer 12051, a sound / image output unit 12052, and an in-vehicle network interface (I / F) 12053 are shown as functional configurations of the integrated control unit 12050.

[0127] The drive system control unit 12010 controls the operation of devices related to the drive system of the vehicle according to various programs. For example, the drive system control unit 12010 serves as a control device for devices such as a driving force generation device (e.g., an internal combustion engine, a drive motor, etc.) for generating vehicle driving force, a driving force transmission mechanism for transmitting the driving force to the wheels, a steering mechanism for adjusting the steering angle of the vehicle, and a braking device for generating vehicle braking force.

[0128] The body system control unit 12020 controls the operation of various devices provided on the vehicle body according to various programs. For example, the body system control unit 12020 serves as a control device for devices such as a keyless entry system, a smart key system, an electric window device, or various lights such as a headlight, a reverse light, a brake light, a turn signal, or a fog light. In this case, radio waves or signals from various switches sent from a portable device serving as a key substitute can be input to the body system control unit 12020. The body system control unit 12020 receives these input radio waves or signals and controls the vehicle door lock device, the electric window device, or the vehicle lights, etc.

[0129] The vehicle external information detection unit 12030 detects external information about a vehicle including the vehicle control system 12000. For example, the vehicle external information detection unit 12030 is connected to the imaging unit 12031. The vehicle external information detection unit 12030 causes the imaging unit 12031 to image the exterior of the vehicle and receives the captured image. Based on the received image, the vehicle external information detection unit 12030 can perform processing for detecting objects such as people, vehicles, obstacles, signs, or characters on the road surface, or processing for detecting their distances.

[0130] The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the received light amount. The imaging unit 12031 may also output an electrical signal as an image, or may output an electrical signal as measured distance information. Additionally, the light received by the imaging unit 12031 may be visible light, or may be invisible light such as infrared light, etc.

[0131] The vehicle interior information detection unit 12040 detects internal information about the vehicle. For example, the vehicle interior information detection unit 12040 is connected to the driver state detection unit 12041 for detecting the driver's state. The driver state detection unit 12041 includes, for example, a camera for imaging the driver. Based on the detection information input from the driver state detection unit 12041, the vehicle interior information detection unit 12040 can calculate the driver's fatigue level or the driver's attention concentration level, or can determine whether the driver is dozing off.

[0132] The microcomputer 12051 can calculate control target values for the driving force generation device, the steering mechanism, or the braking device based on the information about the interior and exterior of the vehicle obtained by the vehicle external information detection unit 12030 or the vehicle interior information detection unit 12040, and output a control command to the drive system control unit 12010. For example, the microcomputer 12051 can perform coordinated control aimed at realizing the functions of an advanced driver assistance system (ADAS), which include collision avoidance or shock absorption of the vehicle, following driving based on the vehicle distance, speed holding driving, vehicle collision warning, or vehicle lane departure warning, etc.

[0133] Additionally, based on the environmental information about the vehicle obtained by the vehicle external information detection unit 12030 or the vehicle interior information detection unit 12040, the microcomputer 12051 can perform coordinated control for autonomous driving by controlling the driving force generation device, the steering mechanism, or the braking device, etc., so that the vehicle automatically travels without relying on the driver's operation, etc.

[0134] In addition, the microcomputer 12051 can output a control command to the vehicle body system control unit 12030 based on the external information of the vehicle acquired by the vehicle external information detection unit 12030. For example, the microcomputer 12051 can perform coordinated control for preventing glare by controlling the vehicle headlamp to change from high beam to low beam according to the position of the preceding vehicle or oncoming vehicle detected by the vehicle external information detection unit 12030, for example.

[0135] The sound / image output unit 12052 transmits an output signal of at least one of sound and image to an output device capable of notifying information visually or audibly to vehicle occupants or the outside of the vehicle. In Figure 22 the example of, the audio speaker 12061, the display unit 12062, and the instrument panel 12063 are shown as output devices. The display unit 12062 can include at least one of an in-vehicle display and a head-up display, for example.

[0136] Figure 21 is a diagram showing an example of the installation position of the imaging unit 12031.

[0137] In Figure 21 the imaging unit 12031 includes imaging units 12101, 12102, 12103, 12104, and 12105.

[0138] The imaging units 12101, 12102, 12103, 12104, and 12105 are provided at positions such as the front nose, rearview mirror, rear bumper, rear door, and upper part of the vehicle interior windshield of the vehicle 12100, for example. The imaging unit 12101 provided at the front nose and the imaging unit 12105 provided at the upper part of the vehicle interior windshield mainly acquire images in front of the vehicle 12100. The imaging units 12102 and 12103 provided at the rearview mirror mainly acquire images on both sides of the vehicle 12100. The imaging unit 12104 provided at the rear bumper or rear door mainly acquires images behind the vehicle 12100. The imaging unit 12105 provided at the upper part of the vehicle interior windshield is mainly used to detect a preceding vehicle, a pedestrian, an obstacle, a traffic signal, a traffic sign, or a lane, etc.

[0139] Note that Figure 21 shows an example of the imaging range of the imaging units 12101 to 12104. The imaging range 12111 represents the imaging range of the imaging unit 12101 provided at the front nose. The imaging ranges 12112 and 12113 represent the imaging ranges of the imaging units 12102 and 12103 provided at the rearview mirror, respectively. The imaging range 12114 represents the imaging range of the imaging unit 12104 provided at the rear bumper or rear door. For example, an aerial view image of the vehicle 12100 is obtained by superimposing the image data imaged by the imaging units 12101 to 12104.

[0140] At least one of the imaging units 12101 to 12104 may have a function for obtaining distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera composed of a plurality of imaging elements, or may be an imaging element having pixels for phase difference detection.

[0141] For example, the microcomputer 12051 may determine the distance of each three-dimensional object within the imaging ranges 12111 to 12114 and the temporal change of the distance (relative speed with respect to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104, and extract the nearest three-dimensional object as the preceding vehicle, which particularly exists on the traveling path of the vehicle 12100 and travels in substantially the same direction as the vehicle 12100 at a predetermined speed (e.g., equal to or greater than 0 km / h). In addition, the microcomputer 12051 can preset the following distance to be maintained in front of the preceding vehicle and perform automatic braking control (including following stop control), automatic acceleration control (including following start control), etc. Therefore, coordinated control for autonomous driving can be executed so that the vehicle can automatically travel without relying on the driver's operation or the like.

[0142] For example, the microcomputer 12051 may classify the three-dimensional object data of the three-dimensional objects into two-wheeled vehicles, standard-sized vehicles, large vehicles, pedestrians, utility poles, and other three-dimensional objects based on the distance information obtained from the imaging units 12101 to 12104, extract the classified three-dimensional object data, and use the extracted three-dimensional object data for automatic obstacle avoidance. For example, the microcomputer 12051 identifies the obstacles around the vehicle 12100 as obstacles that can be visually recognized by the driver of the vehicle 12100 and obstacles that are difficult to be visually recognized by the driver of the vehicle 12100. Then, the microcomputer 12051 determines the collision risk indicating the risk of collision with each obstacle. When the collision risk is equal to or higher than the set value and thus there is a possibility of collision, the microcomputer 12051 outputs a warning to the driver through the audio speaker 12061 or the display unit 12062, and performs forced deceleration or avoidance steering through the driving system control unit 12010. The microcomputer 12051 can thereby assist driving to avoid collisions.

[0143] At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 may identify a pedestrian by determining whether a pedestrian exists in the captured images of the imaging units 12101 to 12104. Such pedestrian identification is performed, for example, through the following processes: a process of extracting feature points in the captured images of the imaging units 12101 to 12104 that are infrared cameras; and a process of determining whether it is a pedestrian by performing pattern matching processing on a series of feature points representing the object contour. When the microcomputer 12051 determines that a pedestrian exists in the captured images of the imaging units 12101 to 12104 and thus identifies the pedestrian, the sound / image output unit 12052 controls the display unit 12062 to superimpose and display a square contour line for emphasis on the identified pedestrian. In addition, the sound / image output unit 12052 may control the display unit 12062 to display an icon or the like for indicating the pedestrian at a desired position.

[0144] The mobile body control system to which the technology according to an embodiment of the present disclosure can be applied has been described above. The technology according to an embodiment of the present disclosure can be applied to, for example, the imaging unit 12031 having the above-described configuration. Specifically, for example, the imaging device 1 or the like can be applied to the imaging unit 12031. By applying the technology according to an embodiment of the present disclosure to the imaging unit 12031, a high-definition captured image can be obtained, and thus the captured image can be used for high-precision control in the mobile body control system. (Practical application example on an endoscopic surgery system)

[0145] The technology (this technology) according to an embodiment of the present disclosure can be applied to various products. For example, the technology according to an embodiment of the present disclosure can be applied to an endoscopic surgery system.

[0146] Figure 22 It is a diagram showing a schematic configuration example of an endoscopic surgery system to which the technology (this technology) according to an embodiment of the present disclosure can be applied.

[0147] In Figure 22 it is shown that a surgical operator (doctor) 11131 is performing a surgery on a patient 11132 on a hospital bed 11133 using an endoscopic surgery system 11000. As shown in the figure, the endoscopic surgery system 11000 includes an endoscope 11100, other surgical tools 11110 such as a pneumoperitoneum tube 11111 and an energy device 11112, a support arm device 11120 for supporting the endoscope 11100 thereon, and a cart 11200 on which various endoscopic surgery devices are mounted.

[0148] The endoscope 11100 includes an endoscope tube 11101 and a camera 11102 connected to the proximal end of the endoscope tube 11101. An area of the endoscope tube 11101 having a predetermined length starting from its distal end is inserted into the body cavity of the patient 11132. In the illustrated example, the endoscope 11100 is shown as a rigid endoscope including a rigid endoscope tube 11101. However, the endoscope 11100 can also be a flexible endoscope including a flexible endoscope tube 11101.

[0149] The endoscope tube 11101 has an opening at its distal end, and an objective lens is fitted in the opening. A light source device 11203 is connected to the endoscope 11100 such that light generated by the light source device 11203 is introduced into the distal end of the endoscope tube 11101 through an optical fiber extending inside the endoscope tube 11101 and is irradiated toward an observation target in the body cavity of the patient 11132 through the objective lens. It should be noted that the endoscope 11100 can be a forward-view endoscope, or can be an oblique-view endoscope or a side-view endoscope.

[0150] An optical system and an imaging element are provided inside the camera 11102 such that reflected light (observation light) from the observation target is converged on the imaging element through the optical system. The observation light is subjected to photoelectric conversion by the imaging element to generate an electrical signal corresponding to the observation light, that is, an image signal corresponding to the observation image. The image signal is transmitted to the CCU 11201 as raw data.

[0151] The CCU 11201 includes a central processing unit (CPU), a graphics processing unit (GPU), etc., and overall controls the operations of the endoscope 11100 and the display device 11202. In addition, the CCU 11201 receives the image signal from the camera 11102 and performs various image processing operations such as development processing (demosaicing processing) on the image signal to display an image based on the image signal.

[0152] Under the control of the CCU 11201, the display device 11202 displays an image thereon based on the image signal on which the CCU 11201 has performed image processing.

[0153] The light source device 11203 includes a light source such as a light emitting diode (LED), for example, and provides illumination light to the endoscope 11100 when imaging the surgical area.

[0154] The input device 11204 is an input interface of the endoscopic surgery system 11000. A user can input various types of information or instructions into the endoscopic surgery system 11000 through the input device 11204. For example, the user can input instructions for changing the image capture conditions (type of illumination light, magnification factor, focal length, etc.) of the endoscope 11100.

[0155] The treatment tool control device 11205 controls the driving of the energy device 11112 for cauterizing tissue, cutting tissue, sealing blood vessels, etc. The pneumoperitoneum device 11206 feeds gas into the body cavity of the patient 11132 through the pneumoperitoneum tube 11111 to expand the body cavity, thereby ensuring the viewing field of the endoscope 11100 and ensuring the working space for the surgery. The recorder 11207 is a device capable of recording various information related to the surgery. The printer 11208 is a device - that can print various information related to the surgery in various forms such as text, images, and charts.

[0156] It should be noted that, for example, the light source device 11203 that provides illumination light to the endoscope 11100 when imaging the surgical area may include a white light source, which, for example, includes an LED, a laser light source, or a combination thereof. In the case where the white light source includes a combination of red, green, and blue (RGB) laser light sources, since the output intensity and output timing of each color (each wavelength) can be controlled with high precision, the white balance of the captured image can be adjusted by the light source device 11203. Additionally, in this case, if the laser beams from the RGB laser light sources are irradiated to the observation target in a time-division manner and the driving of the imaging element of the camera 11102 is controlled in synchronization with the emission timing, images corresponding to RGB respectively can be captured in a time-division manner. According to this method, a color image can be obtained even without setting a color filter for the imaging element.

[0157] Furthermore, the light source device 11203 can be controlled such that the intensity of the output light is changed every predetermined period of time. By controlling the driving of the imaging element of the camera 11102 in synchronization with the changing timing of the light intensity to obtain images in a time-division manner and synthesize the images, a high-dynamic-range image without underexposed occlusion shadows and overexposed highlights can be generated.

[0158] In addition, the light source device 11203 can be configured to provide light having a predetermined wavelength region prepared for specific light observation. In specific light observation, for example, by utilizing the wavelength dependence of light absorption in body tissue to irradiate light having a narrower band than the irradiation light (i.e., white light) during normal observation, imaging (narrow band imaging) is performed for a predetermined tissue such as blood vessels in the surface portion of the mucosal layer having high contrast. Alternatively, in specific light observation, fluorescence observation can be performed to obtain an image based on fluorescence generated by irradiation with excitation light. In fluorescence observation, observation of fluorescence from body tissue (autofluorescence observation) can be performed by irradiating the body tissue, or a fluorescence image can be obtained by locally injecting a reagent such as indocyanine green (ICG) into the body tissue and irradiating the body tissue with excitation light corresponding to the fluorescence wavelength of the reagent. The light source device 11203 can be configured to provide narrow band light and / or excitation light suitable for the specific light observation described above.

[0159] Figure 23 is a diagram showing Figure 22 an example of the functional configuration of the shown camera 11102 and CCU 11201.

[0160] The camera 11102 includes a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera control unit 11405. The CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera 11102 and the CCU 11201 are connected via a transmission cable 11400 to communicate with each other.

[0161] The lens unit 11401 is an optical system provided at a position connected to the lens barrel 11101. Observation light obtained from the distal end of the lens barrel 11101 is guided to the camera 11102 and introduced into the lens unit 11401. The lens unit 11401 includes a combination of a plurality of lenses, which include a zoom lens and a focusing lens.

[0162] The number of imaging elements included in the imaging unit 11402 can be one (single-board type) or multiple (multi-board type). In the case where the imaging unit 11402 is configured as a multi-board type, for example, image signals corresponding to R, G, and B are generated by the imaging elements, and a color image can be obtained by synthesizing these image signals. The imaging unit 11402 can also be configured to have a pair of imaging elements for acquiring a right-eye image signal and a left-eye image signal for three-dimensional (3D) display. If 3D display is performed, the surgical operator 11131 can more accurately perceive the depth of the body tissue at the surgical site. It should be noted that in the case where the imaging unit 11402 is configured as a multi-board type, a plurality of systems of lens units 11401 can be provided in a manner corresponding to the respective imaging elements.

[0163] In addition, the imaging unit 11402 does not have to be provided in the camera 11102. For example, the imaging unit 11402 can be provided immediately after the objective lens inside the lens barrel 11101.

[0164] The drive unit 11403 includes an actuator, and under the control of the camera control unit 11405, the drive unit 11403 moves the zoom lens and the focusing lens of the lens unit 11401 along the optical axis by a predetermined distance. Therefore, the magnification and focus of the image captured by the imaging unit 11402 can be appropriately adjusted.

[0165] The communication unit 11404 includes a communication device for transmitting / receiving various information to / from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 as raw data to the CCU 11201 through the transmission cable 11400.

[0166] In addition, the communication unit 11404 receives a control signal for controlling the drive of the camera 11102 from the CCU 11201 and provides the control signal to the camera control unit 11405. For example, the control signal includes information related to imaging conditions, and the image capture conditions are, for example, information for specifying the frame rate of the captured image, information for specifying the exposure value at the time of image capture, and / or information for specifying the magnification and focus of the captured image.

[0167] It should be noted that image capture conditions such as the frame rate, exposure value, magnification, and focus can be appropriately specified by the user or automatically set by the control unit 11413 of the CCU 11201 based on the obtained image signal. In the latter case, an automatic exposure (AE) function, an automatic focus (AF) function, and an automatic white balance (AWB) function are combined in the endoscope 11100.

[0168] The camera control unit 11405 controls the driving of the camera 11102 based on the control signal received from the CCU 11201 through the communication unit 11404.

[0169] The communication unit 11411 includes communication means for transmitting / receiving various types of information to / from the camera 11102. The communication unit 11411 receives the image signal transmitted from the camera 11102 through the transmission cable 11400.

[0170] In addition, the communication unit 11411 transmits the control signal for controlling the driving of the camera 11102 to the camera 11102. The image signal and the control signal can be transmitted through electrical communication, optical communication, etc.

[0171] The image processing unit 11412 performs various image processing operations on the image signal transmitted from the camera 11102 in the form of raw data.

[0172] The control unit 11413 performs various types of control related to the image capture of the surgical area, etc. performed by the endoscope 11100 and the display of the captured images obtained through the image capture of the surgical area, etc. For example, the control unit 11413 generates a control signal for controlling the driving of the camera 11102.

[0173] In addition, the control unit 11413 controls the display device 11202 to display the captured image for depicting the surgical area, etc. based on the image signal on which the image processing unit 11412 has performed image processing. At this time, the control unit 11413 can identify various objects in the captured image by using various image recognition techniques. For example, the control unit 11413 can identify surgical tools such as forceps, specific living body parts, bleeding, fog when using the energy device 11112, etc. by detecting the shape, color, etc. of the edges of the objects included in the captured image. When the control unit 11413 controls the display device 11202 to display the captured image, the control unit 11413 can display various surgical assistance information in a manner superimposed on the image of the surgical area by using the recognition result. By displaying the surgical assistance information in a superimposed manner and presenting it to the surgical operator 11131, the burden on the surgical operator 11131 can be reduced, or the surgeon 11131 can perform the surgery more reliably.

[0174] The transmission cable 11400 that connects the camera 11102 and the CCU 11201 is an electrical signal cable for electrical signal communication, an optical fiber for optical communication, or a composite cable for both electrical communication and optical communication.

[0175] Here, in the illustrated example, although communication is performed by wired communication using the transmission cable 11400, communication between the camera 11102 and the CCU 11201 can be performed by wireless communication.

[0176] An example of an endoscopic surgical system to which the technology according to an embodiment of the present disclosure can be applied has been described above. The technology according to an embodiment of the present disclosure can be applied, for example, to the imaging unit 11402 provided in the camera 11102 of the endoscope 11100 having the above-described configuration. By applying the technology according to an embodiment of the present disclosure to the imaging unit 11402, the imaging unit 11402 can be made highly sensitive, and thus a high-definition endoscope 11100 can be provided.

[0177] Although the present disclosure has been described above in conjunction with embodiments, variations, application examples, and actual application examples, the present technology is not limited to the above-described embodiments and the like, and various modifications can be made. For example, although the above variations are described as variations of the above embodiments, the configurations of the respective variations can be appropriately combined. For example, the present disclosure is not limited to a back-illuminated image sensor, and is also applicable to a front-illuminated image sensor.

[0178] The optical element according to an embodiment of the present disclosure includes: a structure having a columnar shape and including a first member and a second member provided around the first member, the refractive index of the second member being different from that of the first member; and a filling material provided around the structure and having a refractive index different from that of the second member. Therefore, the number of possible combinations of phase values that can be utilized by light beams in each wavelength region can be increased, and thus incident light can be appropriately guided. An optical element capable of effectively concentrating light can be realized.

[0179] The light detector according to an embodiment of the present disclosure includes: a first light guiding member including a first structure having a columnar shape and a filling material provided around the first structure; and a first photoelectric conversion element that performs photoelectric conversion on light incident via the first light guiding member. The first structure includes a first member and a second member provided around the first member, the refractive index of the second member being different from that of the first member. The filling material is provided around the first structure and has a refractive index different from that of the second member. Therefore, the number of possible combinations of phase values that can be utilized by light beams in each wavelength region can be increased, and thus incident light can be appropriately guided. The present disclosure can realize a light detector capable of effectively concentrating light.

[0180] Note that the effects described herein are merely exemplary and not limited thereto, and may also include other effects. In addition, the present disclosure may also have the following configurations. (1) An optical element, comprising: A structure having a columnar shape and including a first component and a second component disposed around the first component, the refractive index of the second component being different from that of the first component; and A filling material disposed around the structure and having a refractive index different from that of the second component. (2) The optical element according to (1), wherein the refractive index of the first component is higher than that of the second component, and the refractive index of the second component is higher than that of the filling material. (3) The optical element according to (1) or (2), wherein the refractive index of the first component is higher than that of the filling material, and the refractive index of the filling material is higher than that of the second component. (4) The optical element according to any one of (1) to (3), wherein the width of the structure is equal to or less than the wavelength of visible light or the width of the structure is equal to or less than the wavelength of infrared light. (5) The optical element according to any one of (1) to (4), further including a plurality of the structures, wherein the filling material is disposed to fill between the plurality of adjacent structures. (6) The optical element according to any one of (1) to (5), wherein the structure includes a first structure and a second structure having different widths from each other. (7) The optical element according to any one of (1) to (6), wherein the structure includes a third component disposed around the second component, the refractive index of the third component being different from that of the second component. (8) The optical element according to any one of (1) to (7), wherein the structure has a columnar shape. (9) The optical element according to any one of (1) to (7), wherein the structure has a rectangular shape. (10) The optical element according to any one of (1) to (7), wherein the structure has a cross shape. (11) A photodetector, comprising: A first light guiding component including a first structure and a filling material disposed around the first structure; and A first photoelectric conversion element that performs photoelectric conversion on light incident through the first light guiding component, wherein the first structure includes a first component and a second component disposed around the first component, the refractive index of the second component being different from that of the first component, and The filling material is disposed around the first structure, and the refractive index of the filling material is different from that of the second component. (12) The photodetector according to (11), wherein, the refractive index of the first component is higher than that of the second component, and the refractive index of the second component is higher than that of the filling material. (13) The photodetector according to (11) or (12), wherein, the refractive index of the first component is higher than that of the filling material, and the refractive index of the filling material is higher than that of the second component. (14) The photodetector according to any one of (11) to (13), wherein the width of the structure is equal to or less than the wavelength of visible light, or the width of the structure is equal to or less than the wavelength of infrared light. (15) The photodetector according to any one of (11) to (14), wherein the first structure is disposed above the first photoelectric conversion element and scatters incident light. (16) The photodetector according to any one of (11) to (15), further comprising: a second light guiding component, which includes a second structure and the filling material disposed around the second structure; a second photoelectric conversion element, which performs photoelectric conversion on the light incident via the second light guiding component; a third light guiding component, which includes a third structure and the filling material disposed around the third structure; and a third photoelectric conversion element, which performs photoelectric conversion on the light incident via the third light guiding component. (17) The photodetector according to any one of (11) to (16), further comprising a first filter, which is disposed between the first light guiding component and the first photoelectric conversion element, and the first filter transmits blue light. (18) The photodetector according to (17), further comprising a second filter, which is disposed between the second light guiding component and the second photoelectric conversion element, and the second filter transmits green light, wherein, the second structure includes the first component and the second component disposed around the first component. (19) The photodetector according to (18), further comprising a third filter, which is disposed between the third light guiding component and the third photoelectric conversion element, and the third filter transmits red light, wherein, The third structure includes the first component and the second component disposed around the first component. (20) The photodetector according to any one of (11) to (19), wherein the first structure includes a third component disposed around the second component, and wherein the refractive index of the third component is different from the refractive index of the second component. (21) An electronic device, comprising: an optical system; and a photodetector that receives light transmitted through the optical system, wherein the photodetector includes: a first light guiding component including a first structure and a filling material disposed around the first structure; and a first photoelectric conversion element that performs photoelectric conversion on the light incident through the first light guiding component, wherein, the first structure includes a first component and a second component disposed around the first component, the refractive index of the second component is different from the refractive index of the first component, and the filling material is disposed around the first structure, and the refractive index of the filling material is different from the refractive index of the second component.

[0181] Those skilled in the art should understand that various deformations, combinations, sub - combinations, and modifications can be made according to design requirements and other factors, as long as they are within the scope of the appended claims or their equivalents. List of reference numerals

[0182] 1 Imaging device 10 Semiconductor layer 12 Photoelectric conversion section 25 Filter 30 Structure 31 First component 32 Second component 33 Third component 35 Filling material or filling component 40 Light guiding section 50 Insulating layer

Claims

1. An optical element, comprising: a structure including a first member and a second member disposed around the first member, wherein the refractive index of the second member is different from that of the first member; and a filling material disposed around the structure, and the refractive index of the filling material is different from that of the second member.

2. The optical element according to claim 1, Among them, wherein the refractive index of the first member is higher than that of the second member, and wherein the refractive index of the second member is higher than that of the filling material.

3. The optical element according to claim 1, Among them, wherein the refractive index of the first member is higher than that of the filling material, and wherein the refractive index of the filling material is higher than that of the second member.

4. The optical element according to claim 1, wherein, The width of the structure is equal to or less than the wavelength of visible light, or the width of the structure is equal to or less than the wavelength of infrared light.

5. The optical element according to claim 1, further comprising: a plurality of the structures, wherein the filling material is disposed to fill between the plurality of adjacent structures.

6. The optical element according to claim 1, wherein, The structure includes a first structure and a second structure having different widths from each other.

7. The optical element according to claim 1, wherein The structure includes a third member disposed around the second member, wherein the refractive index of the third member is different from that of the second member.

8. The optical element according to claim 1, wherein, The structure has a columnar shape.

9. The optical element according to claim 1, wherein, The structure has a rectangular shape.

10. The optical element according to claim 1, wherein, The structure has a cross shape.

11. A photodetector, comprising: a first light guiding member including a first structure and a filling material disposed around the first structure; and a first photoelectric conversion element that performs photoelectric conversion on light incident through the first light guiding member, wherein the first structure includes a first member and a second member disposed around the first member, the refractive index of the second member is different from that of the first member, and wherein the filling material is disposed around the first structure, and the refractive index of the filling material is different from that of the second member.

12. The photodetector according to claim 11, Among them, wherein the refractive index of the first member is higher than that of the second member, and wherein the refractive index of the second member is higher than that of the filling material.

13. The photodetector according to claim 11, Among them, wherein the refractive index of the first member is higher than that of the filling material, and wherein the refractive index of the filling material is higher than that of the second member.

14. The optical detector according to claim 11, wherein, The width of the structure is equal to or less than the wavelength of visible light, or the width of the structure is equal to or less than the wavelength of infrared light.

15. The optical detector according to claim 11, wherein, The first structure is disposed above the first photoelectric conversion element and scatters incident light.

16. The photodetector according to claim 11, further comprising: a second light guiding member including a second structure and the filling material disposed around the second structure; a second photoelectric conversion element that performs photoelectric conversion on light incident through the second light guiding member; a third light guiding member including a third structure and the filling material disposed around the third structure; and a third photoelectric conversion element that performs photoelectric conversion on light incident through the third light guiding member.

17. The photodetector according to claim 16, further comprising: A first optical filter disposed between the first light guiding member and the first photoelectric conversion element, wherein the first optical filter transmits blue light.

18. The photodetector according to claim 17, further comprising: A second optical filter disposed between the second light guiding member and the second photoelectric conversion element, wherein the second optical filter transmits green light, and wherein the second structure includes the first component and the second component disposed around the first component.

19. The photodetector according to claim 18, further comprising: A third optical filter disposed between the third light guiding member and the third photoelectric conversion element, wherein the third optical filter transmits red light, and wherein the third structure includes the first component and the second component disposed around the first component.

20. The optical detector according to claim 11, wherein, The first structure includes a third component disposed around the second component, and wherein the refractive index of the third component is different from the refractive index of the second component.

21. An electronic device, comprising: An optical system; And A photodetector that receives light transmitted through the optical system, The photodetector comprising: A first light guiding member including a first structure and a filling material disposed around the first structure; and A first photoelectric conversion element that performs photoelectric conversion on light incident via the first light guiding member, wherein the first structure includes a first component and a second component disposed around the first component, the refractive index of the second component being different from the refractive index of the first component, and wherein the filling material is disposed around the first structure, and the refractive index of the filling material is different from the refractive index of the second component.

Images