Optical communication chip test equipment and method

Abstract

The invention relates to the technical field of optical communication chip testing, and discloses an optical communication chip testing device and method, and the device comprises a carrying module, a carrier module and a testing module, and each module comprises a corresponding module and a corresponding mechanism. After a to-be-tested chip is transferred from the feeding module to the test platform deck through the carrying module to complete multiple tests, the chip is transferred from the test platform deck to the storage module through the carrying module to be classified and stored; coherent test items of chips are integrated on one device, automatic operation of loading, testing and unloading classified storage of the chips is achieved through cooperation of the modules and the modules, the situation that manual operation factors affect the qualified rate of chip testing can be avoided, the overall production efficiency is greatly improved, and the production cost is reduced. The production cost is reduced, the classified storage efficiency is improved, and the data can be sorted and classified without waiting for testing of a plurality of devices.

Description

Technical Field

[0001] The present invention relates to the technical field of optical communication chip testing, and particularly relates to an optical communication chip testing device and method. Background Art

[0002] Optical communication chips are the core components of optical communication systems, responsible for key functions such as the emission, reception, modulation, demodulation, and signal processing of optical signals; optical communication chip testing is a key link connecting design, manufacturing, and application. Its core goal is to ensure that the chip performance meets the standards, has strong reliability, good compatibility, and controllable mass production, and ultimately guarantees the stability, efficiency, and security of the entire optical communication system.

[0003] Currently, the testing of coherent chips in the optical communication industry includes optical performance, electrical performance testing, signal linear impairment equalization ability testing, temperature cycle testing, optical port alignment accuracy testing, chip quality grade testing, etc. There are many types and items of testing, and often multiple semi-automatic devices are required to cooperate in the testing. Not only does it require a large amount of manual intervention, but such a testing method has a complex process and a long testing time. Moreover, only manual feeding or waffle box trays can be used for feeding, and wafer trays cannot be used for one-time feeding. Therefore, a large number of workers are required, resulting in low efficiency. In addition, in the existing method, data sorting can only be carried out after the testing of multiple devices is completed, resulting in low efficiency of classified storage. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide an optical communication chip testing device and method, which concentrate the items to be tested for coherent chips on one device for testing, and the loading, unloading, and testing processes are completely automated, avoiding the influence of manual operation factors on the qualification rate of chip testing. At the same time, the overall production and classified storage efficiency are greatly improved, and the production cost is reduced.

[0005] To achieve the above purpose, the technical solution adopted by the present invention is as follows: <0 of The testing module includes a coupling stage module, a probe module, a coupling and testing module, and a transfer module for driving the horizontal movement of the coupling stage module. The coupling stage module is located above the transfer module, and the probe module and the coupling and testing module are adjacent and distributed on both sides of the transfer module; The coupling stage module includes a test stage for installing the chip. A temperature control module is provided at the bottom of the test stage. The temperature control module is connected to the output end of the transfer module, and a first adjustment mechanism for adjusting the chip position and posture is provided between the output end of the transfer module and the temperature control module; ​The probe module includes a probe card located above the test stage, and a plurality of groups of probes for testing different performances of the chip are arranged at the bottom of the probe card; A feeding module and a storage module are arranged on the carrier module. After the chip to be tested is transferred from the feeding module to the test stage through the handling module to complete multiple tests, the chip is then transferred from the test stage to the storage module through the handling module for classified storage.

[0006] Optionally, the test module further includes a base. The coupling test module and the transfer module are both installed on the base. A test bracket is also arranged on the base. A Z-axis driving mechanism is installed on the test bracket. The output end of the Z-axis driving mechanism is connected with a second adjusting mechanism for adjusting the position and posture of the probe card, and the probe card is installed at the output end of the second adjusting mechanism.

[0007] Optionally, the handling module includes a gantry. The gantry is located at the rear side of the base. A handling driving mechanism is installed on the gantry. The output end of the handling driving mechanism is installed with a material taking mechanism for grasping the chip, and there are two sets of the material taking mechanisms.

[0008] Optionally, a downward vision camera is installed at the output end of the handling driving mechanism, and a bottom camera is arranged on one side of the coupling table module close to the carrier module.

[0009] Optionally, the coupling test module includes a six-axis driving module. The output end of the six-axis driving module is installed with a coupling force control sensor. A fixture for clamping the FA is installed on the coupling force control sensor, and the fixture is located on one side of the six-axis driving module close to the coupling table module.

[0010] Optionally, the temperature control module includes a temperature control housing. The temperature control housing is connected with a water cooling system, and a TEC module is arranged inside the temperature control housing; the test stage is installed on the top of the temperature control housing, and the temperature control housing is installed at the output end of the first adjusting mechanism.

[0011] Optionally, a first damping system is arranged at the bottom of the test module, and a second damping system is arranged at the bottoms of the handling module and the carrier module, and the first damping system and the second damping system are independent of each other.

[0012] Optionally, the carrier module includes a bottom plate capable of horizontal movement. The feeding module and the storage module are both arranged on the bottom plate, and the feeding module adopts the wafer disk feeding method.

[0013] In a second aspect, a method for testing an optical communication chip is provided. The optical communication chip testing device described in the first aspect is adopted, and the method includes the following steps: S1. The vehicle module drives the feeding module to move the wafer disk to the picking area, and the handling drive mechanism drives the downward vision camera to move above the wafer disk; S2. Two sets of picking mechanisms suck the chips to be tested under the guidance of the downward vision camera, and then adjust the position and angle of the chips to be tested through the guidance of the bottom camera; S3. The transfer module and the handling drive mechanism cooperate to complete chip delivery at the specified position, and place the chips to be tested on the test stage; S4. The transfer module moves the test stage to the test position, and the test camera identifies the pads of the chips to be tested, and then the probe module pierces the probes into the corresponding pads to supply power and establish test communication for the chips to be tested; S5. After the test is completed, the transfer module and the handling drive mechanism cooperate to complete chip delivery again; among them, the picking mechanism without materials sucks the tested chips, and then the picking mechanism with materials places the next chip to be tested on the test stage; S6. While the chips to be tested in step S5 are moved to the test position, the tested chips are classified and stored in the corresponding storage area of the storage module according to the test results.

[0014] Optionally, during the chip test in step S4, first the alignment accuracy of the optical ports is tested, and then the remaining test items are sequentially carried out according to the process test sequence.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: (1) The present invention conducts the coherent test items of the chips on one device, and through the cooperation between each module and module, realizes the automatic operations of chip loading, testing and unloading and classification storage. It can not only avoid the influence of manual operation factors on the qualification rate of chip testing, but also greatly improve the overall production efficiency, reduce the production cost, and at the same time improve the efficiency of classification storage, without waiting for multiple devices to complete testing before sorting and classifying data; (2) In the present invention, by setting multiple groups of probes for testing different performances of the chips on the probe card of the probe module, it can ensure that multiple test items of the chips are sequentially carried out without the equipment stopping and without manual intervention, improving the automation rate and production time efficiency of chip testing; (3) In the present invention, since this device can realize automatic loading and unloading and testing, an efficient wafer disk loading method is adopted for loading, which is convenient for loading and has a long material change cycle, saving labor and improving production efficiency; (4) The present invention not only considers that different regions need independent shock absorption systems to avoid mutual interference, but also considers that different regions need different shock absorption methods. The first shock absorption system and the second shock absorption system cooperate with each other to improve the operation stability of the device and the qualification rate of chip testing; (5) In the test method of the present invention, since the optical port alignment accuracy test is completed based on the loss of the test optical signal and an external FA needs to be used to connect the optical power meter for testing, during the entire test process, this item is tested first, and then the remaining items are tested in sequence according to the process sequence, improving the logic of the overall test, making the integrated test more reasonable and orderly, and improving the test efficiency. (6) In the test method of the present invention, after the chip delivery is completed, when the chip to be tested is moved to the test position, the tested chips are simultaneously placed in the storage module. That is, when the chip is being tested, the feeding mechanism picks up a new chip to be tested and moves it to the designated position for delivery. Through the coordinated cooperation among each module, module, and mechanism, the waiting time for chip delivery is reduced, and at the same time, the intermittent time of the test module is reduced, improving the work efficiency. Description of the Drawings

[0016] Figure 1 is a schematic structural diagram of the optical communication chip test equipment in an embodiment of the present invention; Figure 2 is a schematic structural diagram of the carrier module and the feeding module in an embodiment of the present invention; Figure 3 is a schematic structural diagram of the ejection mechanism in an embodiment of the present invention; Figure 4 is a schematic structural diagram of the test module in an embodiment of the present invention; Figure 5 is a schematic structural diagram of the coupling table module in an embodiment of the present invention; Figure 6 is a schematic structural diagram of the probe module in an embodiment of the present invention; Figure 7 is a schematic structural diagram of the coupling test module in an embodiment of the present invention; Figure 8 is a schematic structural diagram of the handling module in an embodiment of the present invention; Figure 9 is Figure 8 a partial enlarged structural diagram at A in Figure 10 is a schematic flow diagram of the optical communication chip test method in an embodiment of the present invention; Among them, 1. Carrier module; 101. Support plate; 102. Bottom plate; 2. Test module; 201. Base; 202. Transfer module; 203. Coupling table module; 231. First adjustment mechanism; 232. Temperature control module; 233. Test stage; 204. Probe module; 241. Z-axis drive mechanism; 242. Second adjustment mechanism; 243. Probe card; 205. Coupling test module; 251. Six-axis drive module; 252. Coupling force control sensor; 253. Fixture; 206. Bracket; 3. Handling module; 301. Gantry; 302. X-axis linear module; 303. Z-axis linear module; 304. Mounting plate; 305. Material picking mechanism; 351. First sliding table cylinder; 352. L-shaped plate; 353. Adjusting motor; 354. Suction nozzle; 4. Feeding module; 401. Crystal disk; 402. Positioning and clamping mechanism; 403. Ejecting mechanism; 431. Mounting seat; 432. Second sliding table cylinder; 433. Frame; 434. Cam; 435. Guide wheel; 436. Sleeve; 437. Suction cup; 438. Ejector pin; 439. Driving motor; 5. Storage module; 6. Top vision camera; 7. Bottom camera; 8. Test camera; 9. First shock absorption system. Specific embodiments

[0017] Now, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. These drawings are all simplified schematic diagrams, only illustrating the basic structure of the present invention in a schematic manner, so they only show the components related to the present invention.

[0018] Embodiment 1

[0019] As Figure 1 shown, an optical communication chip testing device includes a carrier module 1, a testing module 2, and a handling module 3. The carrier module 1 and the testing module 2 are located below the handling module 3, and a feeding module 4 and a storage module 5 are provided on the carrier module 1. When the chip to be tested is transferred from the feeding module 4 to the testing module 2 through the handling module 3 to complete multiple tests, the chip is then transferred from the testing module 2 to the storage module 5 through the handling module 3 for classified storage.

[0020] The present invention concentrates the test items of coherent chips on one device for testing, adopts the feeding method of the crystal disk 401, and the loading and unloading and testing processes of this device are completely automated without manual intervention, avoiding the influence brought by manual operation, improving the test qualification rate, greatly improving the overall production efficiency, reducing costs, and this device can be widely promoted and is convenient for batch production and use in enterprises.

[0021] As Figure 1 、 Figure 2 and Figure 3 shown, the carrier module 1 includes two opposite support plates 101, the support plates 101 are parallel to the Y-axis direction, and a bottom plate 102 capable of horizontally moving in the X and Y-axis directions is provided on the top of the support plates 101. The feeding module 4 and the storage module 5 are both provided on the bottom plate 102.

[0022] A middle connecting plate is also arranged between the top of the support plate 101 and the bottom of the bottom plate 102. The middle connecting plate is slidably mounted on the top of the support plate 101 along the Y-axis direction, and the bottom plate 102 is slidably mounted on the top of the middle connecting plate along the X-axis direction, so that the middle connecting plate can only move relative to the support plate 101 along the Y-axis direction, and the bottom plate 102 can only move relative to the middle connecting plate along the X-axis direction.

[0023] A Y-axis driving mechanism is installed inside the support plate 101 to drive the middle connecting plate along the Y-axis direction; an X-axis driving mechanism is installed at the rear end of the support plate 101 to drive the bottom plate 102 to move relative to the middle connecting plate along the X-axis direction; both the X-axis driving mechanism and the Y-axis driving mechanism adopt existing technologies, such as a lead screw driving module, etc. The cooperation of the two can make the bottom plate 102 move horizontally along the X and Y axes, so as to facilitate the adjustment of the positions of the feeding module 4 and the storage module 5 in the plane.

[0024] As described above, the feeding module 4 includes a crystal disk 401 located at the center position of the bottom plate 102, and a positioning and clamping mechanism 402 is arranged on its circumferential side to realize the fixed clamping of the crystal disk 401 on the bottom plate 102; a jacking mechanism 403 is also arranged below the bottom plate 102 to jack up the chips on the crystal disk 401 for the handling module 3 to grab.

[0025] The jacking mechanism 403 includes a mounting seat 431 arranged between the two support plates 101. A second sliding table cylinder 432 parallel to the Z-axis direction is installed on one side of the mounting seat 431. The output end of the second sliding table cylinder 432 is connected to a frame 433. A cam 434 is rotatably installed inside the frame 433. The rotation axis of the cam 434 is parallel to the X-axis direction and is driven to rotate by a driving motor 439 arranged on the outer side of the frame 433.

[0026] A sleeve 436 is fixedly installed on the top of the frame 433. A suction cup 437 is arranged on the top of the sleeve 436, and the sleeve 436 can pass through the middle connecting plate and the bottom plate 102 to the lower part of the crystal disk 401; a spool is movably embedded inside the sleeve 436 along the axis. A plurality of ejector pins 438 are fixedly installed at the upper end of the spool, and the ejector pins 438 can pass through the suction cup 437 to contact the chips.

[0027] A guide wheel 435 in contact and cooperation with the cam 434 is rotatably installed at the lower end of the spool. When the driving motor 439 drives the cam 434 to rotate around its own axis, under the action of the guide wheel 435, the spool can be driven to reciprocate up and down along the axis relative to the sleeve 436, and then drive the ejector pins 438 to move up and down reciprocally, and the ejector pins 438 can pass through the suction cup 437 to contact the chips after moving up.

[0028] Specifically, after the crystal disk 401 is clamped, it is horizontally moved along the X and Y axes under the drive of the X-axis drive mechanism and the Y-axis drive mechanism, so that the chip on the crystal disk 401 corresponds to the sleeve 436 of the ejecting mechanism 403, thereby ejecting the chip from the crystal disk 401 for the handling module 3 to grab.

[0029] First, the second sliding table cylinder 432 adjusts the suction cup 437 to an appropriate height to contact the bottom of the chip to complete adsorption, and then continues to move upward to eject the chip from the crystal disk 401. During this process, due to the adsorption of the suction cup 437, accidental dropping of the chip during the ejection process can be avoided; then the suction cup 437 stops working, and the driving motor 439 drives the cam 434 to rotate, and then drives the spool to reciprocate up and down through the guide wheel 435, so that the ejector pin 438 ejects the chip until it is separated from the suction cup 437. Finally, the handling module 3 grabs the chip; the second sliding table cylinder 432 drives the suction cup 437 to reset below the crystal disk 401, and the crystal disk 401 adjusts its horizontal position so that the next chip is aligned with the sleeve 436, and the above steps are continued to achieve ejection.

[0030] Among them, multiple ejector pins 438 are circumferentially arrayed around the axis of the sleeve 436, and the positioning and clamping mechanism 402 adopts the prior art to realize the fixed clamping of the crystal disk 401 through the pre-tightening cooperation of springs and clamping blocks.

[0031] In addition, the storage module 5 uses multiple waffle box trays. The crystal disk 401 is located at the center of the bottom plate 102. Multiple waffle box trays are grouped in pairs and symmetrically distributed on the left and right sides of the crystal disk 401. Each waffle box tray has multiple storage positions, and the chip quality grades stored in the same waffle box tray are the same.

[0032] As Figure 4 shown, the test module 2 includes a base 201. A transfer module 202, a coupling test module 205 and an inverted L-shaped bracket 206 are arranged on the base 201. A test camera 8 is installed at the top of the bracket 206. The test camera 8 is parallel to the Z-axis direction, and a probe module 204 is installed inside the bracket 206; the output end of the transfer module 202 is provided with a coupling table module 203 and can drive the coupling table module 203 to horizontally move along the Y-axis direction.

[0033] The transfer module 202 is close to the carrier module 1. The coupling test module 205 is located at one end of the transfer module 202 away from the handling module 3, and the bracket 206 is located on the side of the transfer module 202 away from the carrier module 1, that is, the coupling table module 203 is located above the transfer module 202, and the probe module 204 and the coupling test module 205 are adjacent and distributed on both sides of the transfer module 202.

[0034] Among them, the transfer module 202 uses an existing linear module to output motion parallel to the X-axis direction, and is used to drive the coupling stage module 203 to reciprocate between the chip delivery position and the test position. The test position is located below the probe module 204, and the chip delivery position is located on one side close to the handling module 3.

[0035] As Figure 4 and Figure 5 shown, the coupling stage module 203 includes a first adjustment mechanism 231, a temperature control module 232, and a test stage 233. The three are connected in series in sequence. The first adjustment mechanism 231 is installed at the output end of the transfer module 202, the temperature control module 232 is installed at the output end of the first adjustment mechanism 231, and the test stage 233 is installed on the top of the temperature control module 232.

[0036] The first adjustment mechanism 231 is used to adjust the position and pose of the chip in space, ensuring that the pads (bonding pads, used to connect the internal circuit of the chip to the external pins) of the chip are aligned one by one with the probes of the probe module 204, and at the same time ensuring the smooth coupling of the chip with the external FA (abbreviation of Fiber Array, meaning fiber optic array); the first adjustment mechanism 231 uses existing technologies and can achieve rotation around the X, Y, and Z axes.

[0037] The temperature control module 232 is used for temperature cycle testing. It includes a temperature control housing connected to the output end of the first adjustment mechanism 231. The test stage 233 is installed on the top of the temperature control housing. The temperature control housing is connected to the water cooling system, and a TEC module is provided inside the temperature control housing, and a pipeline is installed outside to connect to an external low-temperature water circulation machine. The TEC module (abbreviation of Thermoelectric Cooler, meaning thermoelectric cooler or semiconductor refrigeration sheet) and the water cooling system cooperate with each other, and its temperature control range can reach -20°C - 100°C.

[0038] The test stage 233 is used to install the chip to be tested and is fixedly installed on the top of the housing of the temperature control module 232. After the chip to be tested is transferred from the feeding module 4 to the test stage 233 by the handling module 3 to complete multiple tests, the chip is then transferred from the test stage 233 to the storage module 5 by the handling module 3 for classified storage.

[0039] As Figure 4 and Figure 6As shown, the probe module 204 is used to supply power to the chip and conduct multiple test items. The probe module 204 includes a Z-axis drive mechanism 241, a second adjustment mechanism 242, and a probe card 243. The Z-axis drive mechanism 241 uses existing technologies, such as air cylinders, electric cylinders, etc. The Z-axis drive mechanism 241 is installed inside the bracket 206. The second adjustment mechanism 242 is installed at the output end of the Z-axis drive mechanism 241. The probe card 243 is installed at the output end of the second adjustment mechanism 242, and multiple groups of probes are fixedly installed at the bottom of the probe card 243 for testing different performances of the chip.

[0040] As described above, the probe card 243 is located above the test stage 233. The second adjustment mechanism 242 can adopt an existing manual five-axis adjustment structure, including rotation around the XYZ axes and translation along the XY axes. Its function is to cooperate with the first adjustment mechanism 231 so that multiple groups of probes integrated on the probe card 243 can be respectively docked with the corresponding pads on the chip.

[0041] As Figure 4 and Figure 7 shown, the coupling test module 205 includes a six-axis drive module 251. A coupling force control sensor 252 is installed at the output end of the six-axis drive module 251, and a fixture 253 for clamping the FA is fixedly installed on the coupling force control sensor 252.

[0042] The six-axis drive module 251 uses existing technologies and can adjust the six degrees of freedom of the fixture 253 in space. The six-axis drive module 251 is installed on the base 201, and the fixture 253 is located on the side of the six-axis drive module 251 close to the coupling stage module 203.

[0043] In all tests, since the optical port alignment accuracy test measures the optical signal loss and an external FA needs to be connected to an optical power meter for testing, a group of coupling test modules 205 are designed in this device to preferentially conduct the coupling test for this item. After this test is completed, the remaining test items are tested in sequence according to the process test order. During this period, since the instrument has been connected in advance, no manual intervention is required.

[0044] Specifically, the fixture 253 is used to clamp the fiber array. Under the feedback of the coupling force control sensor 252, the six-axis drive module 251 and the coupling stage module 203 cooperate with each other to complete the coupling of the chip and the FA, facilitating the subsequent test items. The coupling process is an existing technology, so it will not be elaborated here.

[0045] As Figure 1 、 Figure 8 and Figure 9As shown in the figure, the handling module 3 includes a gantry 301. The gantry 301 is located at the rear side of the base 201, and a handling driving mechanism is installed on the gantry 301. A material taking mechanism 305 for grasping the chip is installed at the output end of the handling driving mechanism.

[0046] The handling driving mechanism includes an X-axis linear module 302, a Z-axis linear module 303 and a mounting plate 304. The X-axis linear module 302 is installed on the side of the gantry 301 close to the testing module 2. The Z-axis linear module 303 is installed at the output end of the X-axis linear module 302. The mounting plate 304 is installed at the output end of the Z-axis linear module 303. The material taking mechanism 305 is installed on the mounting plate 304. Under the action of the handling driving mechanism, the material taking mechanism 305 can move along the X-axis and Z-axis directions, thereby realizing the transfer function of the chip.

[0047] As described above, the material taking mechanism 305 includes a first sliding table cylinder 351 arranged on the mounting plate 304 and parallel to the Z-axis direction. The output end of the first sliding table cylinder 351 is connected with an L-shaped plate 352. An adjusting motor 353 is installed on the horizontal part of the L-shaped plate 352. The output end of the adjusting motor 353 extends below the L-shaped plate 352, and a suction nozzle 354 for sucking the chip is installed at the output end of the adjusting motor 353.

[0048] A downward vision camera 6 is also installed on the mounting plate 304. A bottom camera 7 is arranged on the side of the coupling table module 203 close to the carrier module 1. When picking and placing the chip, under the guidance of the downward vision camera 6, the X-axis linear module 302 and the Z-axis linear module 303 drive the material taking mechanism 305 to a suitable position, and then the first sliding table cylinder 351 pushes the suction nozzle 354 to move downward to realize sucking or placing the chip. During the feeding process, after the chip is sucked, under the guidance of the bottom camera 7, the position and angle of the chip can be adjusted by the adjusting motor 353, which is convenient for the chip to be installed on the test stage 233 faster and more accurately.

[0049] Furthermore, in order to improve the efficiency of chip transfer, two sets of material taking mechanisms 305 are provided, and the two sets of material taking mechanisms 305 can operate independently. One set of material taking mechanism 305 is used for grasping the tested chips, and the other set of material taking mechanism 305 is used for placing the chips to be tested, which improves the chip delivery efficiency and reduces the delivery waiting time.

[0050] In addition, a support base is also arranged below the support plate 101. The support plate 101 is fixedly installed on the support base, and one end of the gantry 301 is also installed on the support base, and the other end is located at the rear side of the base 201. A first shock absorption system 9 is arranged at the bottom of the testing module 2. A second shock absorption system is arranged at the bottoms of the handling module 3 and the carrier module 1, and the first shock absorption system 9 and the second shock absorption system are independent of each other.

[0051] Specifically, the first shock absorption system 9 adopts a high-precision air-bearing table shock pad, which is installed under the base 201 to ensure the stability of the test platform; the second shock absorption system adopts a polymer material shock pad, which is installed under the support base and the gantry 301 to improve the stability and accuracy of material feeding.

[0052] The two sets of high-precision shock absorption systems work independently. Appropriate shock absorption systems are selected in different areas, taking into account the need for independent shock absorption systems in different areas to avoid mutual interference and different shock absorption methods in different areas. The two shock absorption systems cooperate with each other, greatly improving the operation stability of the equipment and the qualification rate of chip testing.

[0053] Working principle: Chip grasping and feeding: The ejecting mechanism 403 ejects the chips on the wafer disk 401. Under the guidance of the top vision, the handling driving mechanism drives the picking mechanism 305 to pick up the ejected chips. Then, under the guidance of the bottom vision, the position and angle of the chips are adjusted by the adjustment motor 353. Chip delivery: The transfer module 202 and the handling driving mechanism act synchronously, so that the chips and the test stage 233 reach the designated delivery position. Then, the picking mechanism 305 places the chips on the test stage 233, or the picking mechanism 305 without materials picks up the tested chips on the test stage 233 and then places the chips to be tested on the test stage 233. Subsequently, they move to the unloading position and the test position respectively. During the process of moving the chips to be tested to the test position, the tested chips are also classified and stored in the corresponding waffle box trays of the storage module 5 according to the test results. Chip testing; when the test stage 233 moves to the test position (i.e., under the probe card 243), the test camera 8 identifies the pads of the chips under the action of the top vision. Then, the Z-axis driving mechanism 241 of the probe module 204 drives the probe card 243 to move down, and the integrated probes are inserted into the corresponding pads to realize power supply and test communication for the chips.

[0054] In all tests, since the optical port alignment accuracy test measures the optical signal loss and an external FA connected to an optical power meter is required for testing, a set of coupling test modules 205 are designed in this equipment to give priority to coupling and testing this item; after this test is completed, the remaining test items are tested in sequence according to the process test order. During this period, since the instrument has been connected in advance, no manual intervention is required.

[0055] Embodiment 2

[0056] Such as Figure 10As shown in the figure, on the basis of the first embodiment, the present invention further provides an optical communication chip testing method, which includes the following steps: First, the handling module 3 grabs the chip to be tested from the feeding module 4, and then uses the handling module 3 to deliver the chip to be tested to the testing module 2. Then, the testing module 2 sequentially tests each testing item of the chip. After the testing is completed, the handling module 3 transports the chip to the storage module 5 and classifies and stores it according to the tested quality level. Repeat the above steps until all the chips on the entire wafer 401 are tested.

[0057] Before the equipment works, the operator places the wafer 401 on the bottom plate 102 and completes the fixed clamping through the positioning and clamping mechanism 402. After checking the equipment, press the start button.

[0058] Loading step: The carrier module 1 drives the feeding module 4 to move the wafer 401 to the picking area. The corresponding chip on the wafer 401 is ejected by the ejecting mechanism 403. At the same time, the handling driving mechanism drives the downward vision camera 6 to move above the wafer 401. Two picking mechanisms 305 suck the chips to be tested under the guidance of the downward vision camera 6. After sucking, the ejecting mechanism 403 resets and cooperates with the carrier module 1 to perform the next chip ejection. At the same time, under the guidance of the bottom camera 7, the position and angle of the chip to be tested are adjusted by the adjusting motor 353.

[0059] In the loading step, if it is the first loading and delivery, there is no material on the test stage 233, then both picking mechanisms 305 of the handling module 3 can suck the chips, and wait for the next delivery after delivering one chip without returning to the unloading. If it is not the first loading and there is material on the test stage 233, only one of the two picking mechanisms 305 is used for picking, and the other is used for picking at the test stage 233.

[0060] Delivery step: During the process of the transfer module 202 driving the coupling stage module 203 to move to the delivery position, the handling driving mechanism also synchronously drives the picking mechanism 305 to move to the designated delivery position and places the chip to be tested on the test stage 233.

[0061] Testing step: The transfer module 202 moves the test stage 233 under the probe card 243. The pad of the chip to be tested is identified by the test camera 8. Then, the first adjustment mechanism 231 adjusts the position of the chip to be tested. After the chip pad is aligned with the probe, the probe is inserted into the corresponding pad through the Z-axis driving mechanism 241 to supply power and test communication to the chip to be tested.

[0062] During the testing process, first, the optical port alignment accuracy of the external FA test chip is combined through the coupling test module 205, and then the remaining test items are sequentially carried out according to the process test sequence, including electrical performance tests (such as resistance, capacitance, voltage, current), functional performance tests (such as power consumption, frequency response), and stability tests (high and low temperature cycling, high load), and the temperature cycling test among them is completed in cooperation with the temperature control module 232.

[0063] Among them, all probes are synchronously inserted into the corresponding pads under the drive of the Z-axis drive mechanism 241 and are respectively used for power supply and test communication for use according to different test items. And after the FA is aligned with the chip optical port, light can enter the chip, and then the optoelectronic performance of the chip can be tested. Therefore, the optical port alignment accuracy of the chip is tested first.

[0064] The probe card 243 integrates a large number of pin feet, enabling the chip to sequentially test multiple test items without the device stopping and without manual intervention, improving the automation rate and production time efficiency of chip testing.

[0065] This device can test multiple test items at one time, and can automatically distinguish the quality grades of chips through a complete set of tests on the device, and then store them by category; customers do not need to wait for several devices to complete the test and then sort out the data as before, improving the classification storage efficiency.

[0066] Chip unloading steps: The transfer module 202 and the handling drive mechanism cooperate with each other to make the chip taking mechanism 305 and the test stage 233 be in the delivery position again; first, the tested chip is taken away by the chip taking mechanism 305 without material, and then the chip taking mechanism 305 with material is made to place the next chip to be tested on the test stage 233.

[0067] After the chip delivery is completed under the cooperation of the transfer module 202 and the handling drive mechanism, while the transfer module 202 moves the chip to be tested to the test position, the handling drive mechanism puts the tested chip into the corresponding storage area (waffle box tray) of the storage module 5 according to the test results, realizing classified storage after grading.

[0068] In the above steps, after the chip delivery is completed, while the chip to be tested is moved to the test position, the tested chip is synchronously placed into the storage module 5, that is, when the chip is being tested, the chip taking mechanism 305 can suck the new chip to be tested and move it to the designated position to wait for delivery, reducing the waiting time for chip delivery and the intermittent time of the test module 2, and improving work efficiency.

[0069] In summary, based on the previous analysis and understanding of the product and in combination with the existing testing processes, the present invention proposes an optical communication chip testing device and method. The device mainly includes a feeding module 4, a storage module 5 for chip quality zoning, a chip identification camera module, a handling module 3, a testing module 2, a zoning shock absorption system module, etc. The full-automatic testing of the chip and the zoned storage after the testing are realized through the cooperation among the functional modules.

[0070] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0071] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood through specific circumstances.

[0072] Based on the inspiration of the ideal embodiments of the present invention as described above, through the above description, relevant personnel can completely make various changes and modifications without departing from the technical idea of this invention. The technical scope of this invention is not limited to the content in the specification, and the technical scope must be determined according to the scope of the claims.

Claims

1. An optical communication chip testing device, characterized in that: It includes a handling module for transporting chips, and a carrier module and a testing module are oppositely arranged below the handling module; The testing module includes a coupling table module, a probe module, a coupling test module, and a transfer module for driving the horizontal movement of the coupling table module. The coupling table module is located above the transfer module, and the probe module and the coupling test module are adjacently distributed on both sides of the transfer module; The coupling table module includes a test stage for mounting the chip. A temperature control module is provided at the bottom of the test stage. The temperature control module is connected to the output end of the transfer module, and a first adjustment mechanism for adjusting the pose of the chip is provided between the output end of the transfer module and the temperature control module; The probe module includes a probe card located above the test stage, and multiple groups of probes for testing different performances of the chip are provided at the bottom of the probe card; A feeding module and a storage module are provided on the carrier module. After the chip to be tested is transported from the feeding module to the test stage through the handling module to complete multiple tests, the chip is then transported from the test stage to the storage module for classified storage through the handling module.

2. The optical communication chip testing device according to claim 1, characterized in that: The testing module further includes a base. The coupling test module and the transfer module are both mounted on the base, and a test bracket is further provided on the base. A Z-axis driving mechanism is mounted on the test bracket. The output end of the Z-axis driving mechanism is connected to a second adjustment mechanism for adjusting the pose of the probe card, and the probe card is mounted on the output end of the second adjustment mechanism.

3. The optical communication chip testing device according to claim 2, characterized in that: The handling module includes a gantry. The gantry is located at the rear side of the base, and a handling driving mechanism is mounted on the gantry. The output end of the handling driving mechanism is mounted with a picking mechanism for grasping the chip, and there are two sets of picking mechanisms.

4. The optical communication chip testing device according to claim 3, characterized in that: The output end of the handling driving mechanism is mounted with a downward vision camera, and a bottom camera is provided on one side of the coupling table module close to the carrier module.

5. The optical communication chip testing device according to claim 1, characterized in that: The coupling test module includes a six-axis driving module. The output end of the six-axis driving module is mounted with a coupling force control sensor, and a fixture for clamping the FA is mounted on the coupling force control sensor, and the fixture is located on the side of the six-axis driving module close to the coupling table module.

6. The optical communication chip testing device according to claim 1, wherein: The temperature control module includes a temperature control housing. The temperature control housing is connected to the water cooling system, and a TEC module is provided inside the temperature control housing; the test stage is mounted on the top of the temperature control housing, and the temperature control housing is mounted on the output end of the first adjustment mechanism.

7. The optical communication chip testing device according to claim 1, characterized in that: A first shock absorption system is provided at the bottom of the testing module, and a second shock absorption system is provided at the bottoms of the handling module and the carrier module, and the first shock absorption system and the second shock absorption system are independent of each other.

8. The optical communication chip testing device according to claim 7, wherein: The carrier module includes a bottom plate capable of horizontal movement. The feeding module and the storage module are both provided on the bottom plate, and the feeding module adopts the wafer disk feeding method.

9. A method for testing an optical communication chip, which uses the optical communication chip testing device described in any one of claims 1-8, characterized in that, It includes the following steps: S1. The carrier module drives the feeding module to move the wafer disk to the picking area, and the handling driving mechanism drives the downward vision camera to move above the wafer disk; S2. Two sets of chip picking mechanisms pick up the chips to be tested under the guidance of the downward vision camera, and then adjust the position and angle of the chips to be tested through the guidance of the bottom camera; S3. The transfer module and the handling driving mechanism cooperate to complete chip delivery at the designated position, and place the chips to be tested on the test stage; S4. The transfer module moves the test stage to the test position, and identifies the pads of the chips to be tested through the test camera, and then inserts the probes into the corresponding pads through the probe module to supply power and establish test communication for the chips to be tested; S5. After the test is completed, the transfer module and the handling driving mechanism cooperate to complete chip delivery again; Among them, the chip picking mechanism without chips picks up the tested chips, and then the chip picking mechanism with chips places the next chip to be tested on the test stage; S6. While the chip to be tested in step S5 is moved to the test position, the tested chips are classified and stored in the corresponding storage area of the storage module according to the test results.

10. The optical communication chip testing method according to claim 9, wherein: During the chip testing process in step S4, the alignment accuracy of the optical ports is first tested, and then the remaining test items are sequentially carried out according to the process test sequence.

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