A copper alloy dual-wavelength laser synergistic pulsed magnetic field additive manufacturing device and method

Abstract

The application provides a copper alloy double-wavelength laser synergistic pulse magnetic field additive manufacturing device and method, and belongs to the field of additive manufacturing.The device comprises a substrate for additive manufacturing of a printed part; a base is arranged directly above the substrate and moves horizontally relative to the substrate; a blanking mechanism is arranged on the base and delivers a powder material to the substrate; a first laser is arranged on the base and emits blue laser towards the substrate; and a second laser is arranged on the base and emits red laser towards the substrate; the blue laser irradiates raw materials and forms a molten pool on the substrate from the powder material; and the red laser irradiates the molten pool to input a heat source and expand the molten pool.The application designs the starting time of irradiation of the red and blue lasers, adjusts the power and spot area of the red and blue lasers, finely controls the molten pool formed by additive manufacturing of copper or copper alloy, and solves the problems of low forming efficiency and poor compactness of copper or copper alloy in the additive manufacturing process.

Description

Technical Field

[0001] This invention relates to the field of additive manufacturing technology, and in particular to a copper alloy dual-wavelength laser-assisted pulsed magnetic field additive manufacturing apparatus and method. Background Technology

[0002] Copper alloys are widely used in the electronics, aerospace, and automotive industries due to their excellent electrical and thermal conductivity and corrosion resistance. Laser melting deposition technology, with its layer-by-layer deposition forming characteristics, is particularly suitable for manufacturing copper alloy functional components with lightweight topological configurations. Through high-precision molten pool control and integrated forming capabilities for complex structures, this technology has become a core manufacturing method for high thermal conductivity copper alloy components such as microchannel heat dissipation modules for electronic devices and regenerative cooling heat exchangers for aerospace applications.

[0003] However, copper alloys have extremely low absorption rates (less than 5%) for commonly used infrared lasers, resulting in low energy utilization and low forming efficiency, making them unsuitable for additive manufacturing of copper alloys. While using a single blue / green laser can improve the absorption rate of copper alloys (laser absorption rate is 40%-50%), the equipment cost is extremely high, severely limiting practical applications. Furthermore, due to the high thermal conductivity of copper alloys (>350W / m·K), the molten pool cools rapidly, easily causing thermal stress concentration, which can lead to part deformation or cracking. The existing invention patent with patent number CN202111571983.0 proposes an additive manufacturing method for copper or copper alloys to solve the problems of low laser absorption rate and low forming efficiency in the additive manufacturing process of copper alloys in the prior art. In the above technical solution, blue light-near infrared laser composite method is used for additive manufacturing, which increases the absorption rate of the copper alloy molten pool to the laser. However, the energy matching and spatiotemporal coordination between the two are not fully optimized, and the high thermal conductivity of copper or copper alloys leads to insufficient stability of the molten pool. Problems such as pores and uneven spreading still exist inside the sample. Summary of the Invention

[0004] In view of this, the present invention proposes a copper alloy dual-wavelength laser-assisted pulsed magnetic field additive manufacturing device and method to solve the problem that the current copper alloy additive manufacturing using red and blue laser composite methods has not been optimized.

[0005] The technical solution of the present invention is implemented as follows: The present invention provides a copper alloy dual-wavelength laser-coordinated pulsed magnetic field additive manufacturing apparatus, including a substrate on which additive manufacturing printed parts are mounted; a base disposed directly above the substrate and moving horizontally relative to the substrate; a feeding mechanism disposed on the base and feeding powder onto the substrate; a first laser disposed on the base and emitting blue laser towards the substrate; and a second laser disposed on the base and emitting red laser towards the substrate; wherein, the blue laser irradiates the raw material and causes the powder to form a molten pool on the substrate, and the red laser irradiates the molten pool, inputs a heat source, and expands the molten pool.

[0006] Based on the above technical solutions, preferably, it also includes a pulsed magnetic field generating mechanism, which is disposed below the substrate and moves horizontally relative to the substrate; wherein, the pulsed magnetic field generating mechanism moves synchronously with the base and applies a pulsed magnetic field toward the molten pool.

[0007] On the other hand, the present invention also provides a copper alloy dual-wavelength laser-coordinated pulsed magnetic field additive manufacturing method, which adopts the above-mentioned copper alloy dual-wavelength laser-coordinated pulsed magnetic field additive manufacturing device, including the following steps: Step 1, establish a three-dimensional model of the printed part and slice and layer the three-dimensional model, and design the laser scanning path and printing parameters for additive manufacturing; Step 2, set the printing parameters and feed powder to the substrate, first turn on the first laser to emit blue laser to irradiate the powder, so that it forms a molten pool on the substrate, and then turn on the second laser to emit red laser to irradiate the molten pool, input heat source to the molten pool and expand the molten pool; Step 3, after completing the additive manufacturing of the printed part according to the designed laser scanning path, first turn off the second laser and then turn off the first laser.

[0008] Based on the above technical solutions, preferably, in step two, the second laser is turned on 1s~2s after the first laser is turned on; in step three, the first laser is turned off 1s~2s after the second laser is turned off.

[0009] Based on the above technical solutions, preferably, the power of the first laser is 400W~1000W, and the power of the second laser is 3000W~6000W.

[0010] Even more preferably, the spot area of ​​the blue laser is smaller than that of the red laser.

[0011] More preferably, the spot size of the blue laser is not larger than the coverage area of ​​the molten pool on the substrate, and the spot size of the blue laser covers the molten pool.

[0012] Based on the above technical solutions, preferably, in step two, after a molten pool is formed on the substrate, a pulsed magnetic field generating mechanism is activated to apply a pulsed magnetic field toward the molten pool.

[0013] More preferably, the pulsed magnetic field generating mechanism simultaneously applies a transverse magnetic field and a radial rotating magnetic field to the molten pool.

[0014] More preferably, the transverse magnetic field is applied in a direction parallel to the laser scanning path, and the radial rotating magnetic field is applied in a direction perpendicular to the substrate surface.

[0015] The copper alloy dual-wavelength laser-assisted pulsed magnetic field additive manufacturing apparatus and method of the present invention have the following advantages over the prior art:

[0016] (1) By designing the start time of red and blue laser irradiation and adjusting the power and spot area of ​​the red and blue laser, the present invention can finely control the molten pool formed by copper or copper alloy additive manufacturing, thereby solving the problems of low forming efficiency and poor density of copper or copper alloy in the additive manufacturing process.

[0017] (2) The present invention applies a pulsed magnetic field to the molten pool, changes the trajectory of free electrons in the material through the Lorentz force, affects its oscillation response, and constrains the collective oscillation of electrons through the Lorentz force, increases the electron scattering probability, reduces the reflectivity, and forces more energy to be absorbed in the form of Joule heating. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the additive manufacturing apparatus of the present invention;

[0020] Figure 2 This is a microscopic image of a printed sample from Embodiment 1 of the present invention;

[0021] Figure 3 This is a microscopic image of a printed sample from Embodiment 2 of the present invention;

[0022] Figure 4 This is a microscopic image of a printed sample from Embodiment 3 of the present invention.

[0023] In the figure: 1. Substrate; 11. Molten pool; 2. Base; 3. Blanking mechanism; 4. First laser; 41. Blue laser; 5. Second laser; 51. Red laser; 6. Pulse magnetic field generating mechanism. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0025] like Figure 1 As shown, the present invention provides a copper alloy dual-wavelength laser-coordinated pulsed magnetic field additive manufacturing apparatus, comprising a substrate 1, a base 2, a blanking mechanism 3, a first laser 4, and a second laser 5.

[0026] The substrate 1 is used for additive manufacturing of printed parts. The substrate 1 can be housed within a closed enclosure.

[0027] The base 2 is positioned directly above the base plate 1 and can move horizontally relative to the base plate 1. The base 2 can be mounted on a multi-axis guide rail mechanism to enable movement, or it can be positioned at the end of a robotic arm.

[0028] The feeding mechanism 3 is mounted on the base 2 and feeds powder to the substrate 1. The powder is copper or copper alloy metal powder with a particle size range of 10-50 μm. The feeding mechanism 3 can be a powder feeding conduit. In actual implementation, the feeding mechanism 3 is located in the center of the base 2 and is vertically downward aligned with the substrate 1 to feed the powder. The first laser 4 and the second laser 5 are arranged around the feeding mechanism 3, and the first laser 4 and the second laser 5 are obliquely aligned with the molten pool on the substrate 1.

[0029] The first laser 4 is disposed on the base 2 and emits blue laser 41 toward the substrate 1. The first laser 4 is a blue laser (450nm-470nm). The blue laser 41 has a Gaussian heat source distribution. The blue laser 41 irradiates the raw material and causes the powder to form a molten pool 11 on the substrate 1.

[0030] The second laser 5 is disposed on the base 2 and emits red laser 51 towards the substrate 1. The second laser 5 is a near-infrared (750-1100nm) laser. The red laser 51 is a uniformly distributed heat source. The red laser 51 irradiates the molten pool 11, inputs the heat source, and expands the molten pool 11.

[0031] The principle behind this scheme is that the varying absorption rates of copper alloys for different wavelengths of light are primarily due to the differences in their electronic structure's response to photons of different wavelengths. Blue light photons have higher energy (approximately 2.75 eV), exceeding the energy required for electrons in copper alloys to transition from the valence band to the conduction band (the interband transition threshold of copper is approximately 2.1 eV). When irradiated with blue light, the photon energy is sufficient to excite electrons to cross the band gap, triggering interband transitions, resulting in some energy being absorbed by the material. Infrared light photons have lower energy (e.g., approximately 1.16 eV at 1064 nm), far below the interband transition threshold of copper, and cannot trigger electron transitions. However, infrared lasers can continuously provide a high heat source input, ensuring a high heat source for the molten pool; therefore, a high-power near-infrared laser is selected. Copper's absorption rate for blue light is significantly higher than that for infrared light in its solid state because its photon energy is close to the interband transition threshold of copper, triggering electron resonant absorption. After the molten pool is formed, the absorption rate of red light by liquid copper increases with increasing temperature. Therefore, this embodiment uses red and blue laser composite to form and expand the molten pool, which can significantly improve the absorption rate of light energy by copper alloy powder, thereby obtaining a stable molten pool and avoiding the presence of pores and uneven spreading inside the printed parts.

[0032] exist Figure 1 In one preferred embodiment, copper, in its solid state, has a significantly higher absorption rate for blue light than for infrared light because its photon energy is close to the interband transition threshold of copper, triggering electronic resonance absorption. After the molten pool is formed, the absorption rate of liquid copper for red light increases with increasing temperature. However, when the temperature exceeds a critical value (such as near the boiling point), the absorption rate of the molten pool surface may decrease due to plasma shielding or changes in surface morphology. Therefore, an external field can be used to maintain the optimal temperature range in the molten pool. For the above reasons, this embodiment also includes a pulsed magnetic field generating mechanism 6.

[0033] The pulsed magnetic field generating mechanism 6 is positioned below the substrate 1 and moves horizontally relative to the substrate 1. The pulsed magnetic field generating mechanism 6 moves synchronously with the base 2, applying a pulsed magnetic field towards the molten pool 11. The pulsed magnetic field generating mechanism 6 can be an electromagnetic coil or an electromagnet. The pulsed magnetic field alters the trajectory of free electrons in the material through the Lorentz force, affecting its oscillation response. For infrared lasers, the high reflectivity of metals mainly stems from the plasma oscillation of free electrons. The pulsed magnetic field, through the Lorentz force, constrains the collective oscillation of electrons, increasing the electron scattering probability, reducing reflectivity, and forcing more energy to be absorbed through Joule heating.

[0034] like Figure 1 As shown, the present invention provides a copper alloy dual-wavelength laser-assisted pulsed magnetic field additive manufacturing method, employing a copper alloy dual-wavelength laser-assisted pulsed magnetic field additive manufacturing apparatus as described in the above embodiment, comprising the following steps:

[0035] Step one involves creating a 3D model of the printed part and slicing the model into layers to design the laser scanning path and printing parameters for additive manufacturing. Specifically, a 3D solid model of the printed part is constructed using digital modeling technologies such as CAD software or Solidworks software. The model data is then imported into the layering processing system via STL file format conversion. Based on the requirements of the printed component, the forming parameters of the component are determined, thereby obtaining a 2D data model generated after slicing the 3D solid model. The area and thickness of each layer are optimized using layering software to select the values ​​of blue laser power and infrared laser power within a specified range.

[0036] Step 2: Set the printing parameters and feed the powder to the substrate 1 through the powder feeding mechanism 3. The printing parameters include the infrared laser printing parameters, blue laser printing parameters, pulse magnetic field device parameters, powder feeding parameters, etc. for each stacked layer. First, turn on the first laser 4 to emit blue laser 41 to irradiate the powder, so that it forms a molten pool 11 on the substrate 1. Then, turn on the second laser 5 to emit red laser 51 to irradiate the molten pool 11, input heat source into the molten pool 11 and expand the molten pool 11.

[0037] Step three involves optimizing the scanning strategy based on the model and controlling the laser heat source to deliver and deposit powder along the pre-designed laser scanning path; this process completes the layer-by-layer deposition of the printed component until a three-dimensional solid component is formed. After completing the additive manufacturing of the printed part, the second laser 5 is turned off first, followed by the first laser 4. Additionally, during the printing process, inert gas needs to be injected into the molten pool through a gas guide pipe.

[0038] exist Figure 1 In a preferred embodiment, in step two, the second laser 5 is turned on 1 to 2 seconds after the first laser 4 is turned on; in step three, the first laser 4 is turned off 1 to 2 seconds after the second laser 5 is turned off.

[0039] exist Figure 1 In a preferred embodiment, the power of the first laser 4 is 400W~1000W, and the power of the second laser 5 is 3000W~6000W. Before printing, the area and thickness of each stack layer need to be optimized and analyzed using layering software to select the values ​​of the blue laser power of the first laser 4 and the infrared laser power of the second laser 5 within the specified range.

[0040] exist Figure 1 In a preferred embodiment, to ensure that the near-infrared red laser 51 can sufficiently expand the molten pool 11, the spot area of ​​the blue laser 41 is smaller than the spot area of ​​the red laser 51.

[0041] exist Figure 1 In a preferred embodiment, both the blue laser 41 and the red laser 51 have circular spots. The spot of the blue laser 41 is no larger than the coverage area of ​​the molten pool 11 on the substrate 1, and the spot of the blue laser 41 covers the molten pool 11. The selectable spot diameter of the blue laser 41 is 100~150μm; the selectable spot diameter of the near-infrared red laser 51 is 300~400μm.

[0042] exist Figure 1 In a preferred embodiment, since copper has a significantly higher absorption rate for blue light than infrared light in its solid state, and because its photon energy is close to the interband transition threshold of copper, it induces electronic resonance absorption. After the molten pool is formed, the absorption rate of liquid copper for red light increases with increasing temperature. However, when the temperature exceeds a critical value (e.g., close to the boiling point), the absorption rate of the molten pool surface may decrease due to plasma shielding or changes in surface morphology. Therefore, an external field is needed to maintain the optimal temperature range in the molten pool. In step two of this embodiment, after the molten pool 11 is formed on the substrate 1, the pulsed magnetic field generating mechanism 6 is activated to apply a pulsed magnetic field toward the molten pool 11, and this continues until the printed part solidifies. The pulsed magnetic field induces eddy currents in the molten pool, according to Joule's law (Q=I). 2The magnetic field (RT) generates additional heat to compensate for energy losses in the molten pool due to heat conduction, convection, and radiation, maintaining the high temperature of the molten pool. The pulsed magnetic field interacts with the conductive liquid metal within the molten pool, inducing eddies and generating periodically varying Lorentz forces (F=J×B, where J is the current density and B is the magnetic induction intensity). This suppresses natural convection within the molten pool (such as Marangoni convection), reducing heat loss to the surrounding cold substrate. The magnetic field weakens thermal boundary layer disturbances at the molten pool edge, reducing heat conduction losses and extending the residence time in the high-temperature zone. Furthermore, the magnetic field induces non-uniform nucleation within the molten pool, refining the solidification structure, reducing grain boundary thermal resistance, improving the efficiency of heat conduction from the molten pool to the surrounding environment, and preventing sudden temperature drops due to localized rapid solidification.

[0043] exist Figure 1 In a preferred embodiment, the pulse magnetic field generating mechanism 6 simultaneously applies a transverse magnetic field and a radial rotating magnetic field to the molten pool 11, and the two magnetic fields act simultaneously to control the molten pool 11.

[0044] exist Figure 1 In one preferred embodiment, the transverse magnetic field is applied in a direction parallel to the laser scanning path and mainly acts on long straight paths; the radial rotating magnetic field is applied in a direction perpendicular to the surface of substrate 1 and mainly acts on the shaping of complex contours.

[0045] To investigate the impact of various factors involving the combined use of red and blue lasers in copper alloy additive manufacturing on copper alloy products, this invention prepared the following copper alloy printed sample for comparative analysis:

[0046] Sample 1

[0047] It is manufactured using a copper alloy dual-wavelength laser-coordinated pulsed magnetic field additive manufacturing apparatus and method of the present invention, including a substrate 1, a base 2, a blanking mechanism 3, a first laser 4, a second laser 5, and a pulsed magnetic field generating mechanism 6. Its fabrication steps include...

[0048] Step 1: First, use 3D modeling software to create a 3D model of the target component. Then, use dedicated slicing software to slice the 3D model into layers, discretize the 3D solid model into a series of 2D data, and import them into the printing management software to generate an additive manufacturing laser scanning path.

[0049] Step 2: Set the additive manufacturing robot printing parameters, metal powder feeding parameters, and pulsed magnetic field technical parameters to control the printing process. Specifically, copper alloy metal powder is used as the raw material, with a particle size range of 30μm; the power of the blue laser 41 is 800W, the power of the near-infrared laser 51 is 4000W, the laser scanning speed is 15mm / s, the powder feeding speed is 45g / min, and the pulsed magnetic field strength is 1T, the pulse frequency is 90kHz, and the pulse width is 250μs.

[0050] Step 3: When additive manufacturing begins, the first laser 4 is activated to emit a blue laser 41 for 1 second to melt the metal powder and form a molten pool 11. Then, the second laser 5 is activated to emit a near-infrared red laser 51 to compensate for the insufficient power of the blue laser 41, so that the molten pool 11 has sufficient heat input and expands the molten pool. At the same time, the pulse magnetic field generating mechanism 6 is activated to apply a transverse magnetic field and a radial rotating magnetic field to the molten pool 11. After additive manufacturing is completed, the second laser 5 is turned off first, and after waiting for 1 second, the first laser 4 and the pulse magnetic field generating mechanism 6 are turned off.

[0051] The printed sample 1 was obtained using the above-described additive manufacturing apparatus and method for copper alloys. Its microstructure was observed using a micro-electron microscope. Figure 2 Microscopic images;

[0052] Sample 2

[0053] Sample 2 was prepared using an additive manufacturing apparatus and method similar to that used for Sample 1, the difference being that the power of the blue laser 41 was 400W. The microstructure of Sample 2 was observed using a micro-electron microscope, yielding... Figure 3 Microscopic image.

[0054] Sample 3

[0055] The sample was prepared using an additive manufacturing apparatus and method similar to that used for sample 1, except that the power of the blue laser 41 was 1000W.

[0056] Sample 4

[0057] The sample was prepared using an additive manufacturing apparatus and method similar to that used for sample 1, except that the power of the blue laser 41 was 2500W.

[0058] Sample 5

[0059] The sample was prepared using an additive manufacturing apparatus and method similar to that used for sample 1, except that blue laser 41 and red laser 51 were simultaneously activated to irradiate the molten pool 11.

[0060] Sample 6

[0061] The sample was prepared using an additive manufacturing apparatus and method similar to that used for sample 1, except that the molten pool 11 was not irradiated with a blue laser 41.

[0062] Sample 7

[0063] The sample was prepared using an additive manufacturing apparatus and method similar to that used for sample 1, the difference being that the particle size of the raw copper alloy powder was 50 μm.

[0064] Sample 8

[0065] The sample was prepared using an additive manufacturing apparatus and method similar to that used for Sample 1, the difference being that the particle size of the raw copper alloy powder was 50 μm. The power of the blue laser 41 was 1000 W.

[0066] Sample 9

[0067] Sample 7 was prepared using an additive manufacturing apparatus and method similar to that used for Sample 1, but with the difference that the additive manufacturing apparatus for the copper alloy did not include the pulsed magnetic field generator 6, and no pulsed magnetic field was applied to the molten pool 11 during the additive manufacturing process. The microstructure of Sample 7 was observed using a micro-electron microscope. Figure 4 Microscopic image.

[0068] Through microscopic analysis of Examples 1, 2, and 9 Figures 2 to 4 A comparison reveals that: Figure 2 No obvious defects such as cracks or pores were found in it; Figure 3 Due to the reduced power of the blue laser 41, the effect of interband transitions caused by electrons crossing the band gap in the copper alloy was not fully excited, resulting in relatively obvious or large defects such as unfused pores in the micro-components. Figure 4 Because the molten pool 11 was not controlled by a pulsed magnetic field, a relatively large number of unfused pore defects were formed in the microstructure.

[0069] Density tests were performed on samples 1 to 9, and the statistical data in Table 1 below were compared and analyzed.

[0070] Table 1

[0071]

[0072] A comparison of the densities of samples 1 to 4 reveals that as the power of the blue laser 41 increases, it can excite electrons in the copper alloy to cross the band gap and induce interband transitions, thereby significantly improving the density of the copper alloy product. However, when the power of the blue laser 41 is too high (2500W), the temperature of the molten pool 11 rapidly exceeds the critical value (such as approaching the boiling point) during the formation process. This may cause the red and blue light absorption rates of the molten pool 11 to decrease due to plasma shielding or changes in surface morphology, thus reducing the density of sample 4.

[0073] A comparison of the density of samples 1 and 5 reveals that when copper alloy materials are sintered simultaneously with red and blue lasers, the instantaneous heat source applied to the copper alloy material is excessive, while the effect of electrons crossing the band gap and inducing interband transitions within the copper alloy structure is not fully excited. Therefore, the density of sample 5 is still not ideal. A comparison of the density of samples 1 and 6 reveals that without first exciting the effect of electrons crossing the band gap and inducing interband transitions within the copper alloy using blue laser 41, it is difficult to effectively improve the absorption rate of red laser 51 in the copper alloy molten pool 11, resulting in a decrease in the density of sample 6.

[0074] A comparison of the density of samples 1, 7 and 8 reveals that increasing the particle size of the powder affects the absorption rate of the copper alloy material to red and blue lasers, thereby reducing the density of sample 7. Therefore, appropriately increasing the particle size of the powder (Example 8) or reducing the power of the blue laser 41 can help improve the density of the sample.

[0075] Comparing the density of samples 1 and 9 reveals that, since copper has a significantly higher absorption rate of blue light than infrared light in its solid state, and its photon energy is close to the interband transition threshold of copper, it induces electronic resonance absorption. After the molten pool is formed, the absorption rate of liquid copper for red light increases with increasing temperature. However, when the temperature exceeds the critical value (such as approaching the boiling point), the absorption rate of the molten pool surface may decrease due to plasma shielding or changes in surface morphology. Therefore, a pulsed magnetic field is needed as an external field to assist the molten pool in maintaining the optimal temperature range, thereby effectively improving the density of the sample.

[0076] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A copper alloy dual-wavelength laser synergistic pulsed magnetic field additive manufacturing device, characterized by, The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device.

2. A copper alloy dual-wavelength laser synergistic pulsed magnetic field additive manufacturing method, characterized in that: The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device.

3. The method of claim 2, wherein the copper alloy is a dual-wavelength laser synergistic pulsed magnetic field additive manufacturing method. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device.

4. The method of claim 3, wherein the copper alloy is a dual-wavelength laser synergistic pulsed magnetic field additive manufacturing method. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device.

5. The method for additive manufacturing of copper alloys using dual-wavelength laser-assisted pulsed magnetic field according to claim 4, characterized in that: The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device.

6. The method of claim 3, wherein the copper alloy is a dual-wavelength laser synergistic pulsed magnetic field additive manufacturing method. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device.

7. The method for additive manufacturing of copper alloys using dual-wavelength laser-assisted pulsed magnetic field according to claim 6, characterized in that: The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. 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The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field additive manufacturing device. The application relates to a copper alloy double-wavelength laser coordinated pulse magnetic field

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