A semiconductor device welding positioning device

Abstract

The present invention belongs to the field of semiconductor production technology and provides a semiconductor device welding positioning device, comprising a base, a rotating frame rotatably mounted on the base and a rotating power member for driving the rotating frame to rotate is provided on the base, the rotating frame is L-shaped and an L-shaped placement plate is fixedly mounted on the rotating frame, the placement plate is provided with a movable plate for fixing a circuit board; a lifting plate is provided on the placement plate and a first telescopic member for driving the lifting plate to move up and down is fixedly mounted on the placement plate, and a plurality of groups of positioning tubes distributed in an array are slidably mounted on the lifting plate. Compared with the prior art, the beneficial effects of the present invention are as follows: the position of the device is positioned by moving the positioning tube downward, and since the positioning tube is light in weight, the pressure applied to the device is small, and the force applied by the positioning tube to the device is in the vertical direction, which avoids pushing the device to shift laterally and ensures the accuracy of the position of the device on the circuit board.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor production, and in particular relates to a semiconductor device welding positioning device. Background Art

[0002] The circuit board soldering of semiconductor devices is generally divided into surface mount soldering and pin soldering. When soldering the pins, the components are generally inserted into the wiring holes to initially fix the components, and then the circuit board is turned over. Soldering is performed at the pin connection position using a soldering iron and solder from the side of the circuit board away from the components.

[0003] When there are a large number of components and their sizes vary greatly, they generally need to be soldered one by one. The fixing strength of the components after being inserted into the wiring holes is weak. Directly flipping the circuit board will cause some of the components to fall off from the wiring holes, affecting the welding efficiency. In response to the above technical problems, the Chinese patent with patent announcement number CN119187764B inflates the airbag after the circuit board is installed during use, and presses and fixes the devices on the circuit board through the expansion of the airbag. However, the airbag is made of soft material, so it needs to be filled with internal gas to produce a fixing effect. After the airbag is filled, the pressure on the device is relatively large, which will push the device to move in the wire hole on the circuit board, thereby changing the length of the device contact angle extending out of the circuit board, causing the device to contact the circuit board, affecting subsequent use. Summary of the Invention

[0004] The object of the present invention is to provide a semiconductor device welding positioning device, aiming to solve the technical problem in the prior art that the position of the device cannot be stably positioned.

[0005] The present invention is achieved by providing a semiconductor device welding positioning device, comprising a base, a rotating frame rotatably mounted on the base, and a rotating power member for driving the rotating frame to rotate provided on the base, the rotating frame being L-shaped and having an L-shaped placement plate fixedly mounted on the rotating frame, the placement plate being provided with a movable plate for fixing a circuit board;

[0006] The placement plate is provided with a lifting plate and a first telescopic member is fixedly installed on the placement plate to drive the lifting plate to move up and down. A plurality of positioning tubes distributed in an array are slidably installed on the lifting plate. A first iron sheet is fixedly installed on one end of the positioning tube away from the placement plate. The lifting plate is provided with a fixing plate for fixing the positioning tube.

[0007] Further technical solution: multiple groups of parallel and spaced guide plates are fixedly installed on the placement plate, the movable plate is slidably installed on the guide plate, the cross-section of the movable plate is T-shaped, the upper surface of the horizontal section of the movable plate is flush with the upper surface of the placement plate, and an adjusting screw is rotatably installed on the placement plate to drive the movable plate to move.

[0008] Further technical solution: a slide groove is provided on the movable plate, a limit plate is slidably installed in the slide groove, the limit plate passes through the movable plate and a fixing screw is provided on the limit plate.

[0009] Further technical solution: Two sets of guide frames are fixedly installed on the lifting plate, the guide frames are located on both sides of the positioning tube distribution area, a movable frame is slidably installed on the guide frame, the fixed plate is fixedly installed in the movable frame, and a second telescopic part that drives the movable frame to move is fixedly installed on the lifting plate.

[0010] Further technical solution: the fixing plates are provided in multiple groups, and the fixing plates are spaced apart from the rows of positioning tubes.

[0011] Further technical solution: A base plate is fixedly installed on the rotating frame, and the base plate is made of magnetic material. Multiple groups of fixed tubes distributed in an array are slidably installed on the base plate. The positions of the fixed tubes correspond one-to-one to the positions of the positioning tubes. Electromagnets are fixedly installed in the fixed tubes. The electromagnets are distributed along the length direction of the fixed tubes. The end of the electromagnet close to the lifting plate is flush with the end of the fixed tube.

[0012] Further technical solution: An airbag is fixedly installed on one end of the fixed tube away from the lifting plate. The airbag is filled with gas and the buoyancy generated by the gas filled in the airbag is set to have a set difference with the gravity of the fixed tube and the structure above it. The buoyancy generated by the gas filled in the airbag is small.

[0013] Further technical solution: Multiple groups of L-shaped brackets are fixedly installed on one end of the fixed tube close to the lifting plate, and an L-shaped limit frame is provided on the bracket. The limit frame is used in conjunction with the connecting groove opened on the first iron sheet. When the electromagnet is energized, it drives the limit frame to move into the connecting groove.

[0014] Further technical solution: an elastic line is fixedly connected to the limit frame, an end of the elastic line away from the limit frame is fixedly connected to the end of the bracket, a support rod pointing to the fixed tube is fixedly installed on the limit frame, and a second iron sheet is fixedly installed on the end of the support rod.

[0015] Further technical solution: A mounting frame is fixedly mounted on the base plate, and a plurality of cameras for detecting the position of the fixed tubes are fixedly mounted on the mounting frame.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. After the circuit board is installed, the position of the device is positioned by moving the positioning tube downward. Since the positioning tube is light in weight, the pressure exerted on the device is small, which avoids generating a large force on the device to push the device to move. The force exerted by the positioning tube on the device is in the vertical direction, which avoids pushing the device to shift laterally, ensuring the accuracy of the device position on the circuit board and improving the quality of subsequent welding. After the positioning tube is fixed by the fixing plate, the positioning tube will no longer exert additional force on the device on the circuit board during subsequent use, further improving the stability and accuracy of the device position. During welding, the circuit board and the device are supported by the positioning tube. Since the positioning tube is fixed, the circuit board and the device can maintain a stable static state, further improving the stability of the position of the circuit board and the device and improving the welding quality.

[0018] 2. When the positioning tube completes the positioning of the device, the electromagnet in the corresponding fixed tube is energized at the same time, and the first iron sheet is connected to the fixed tube under the action of magnetic force. Since the fixed tube is fixed to the substrate by magnetic force, the positioning tube is in a fixed state, and the positioning function of the positioning tube has been completed in the positioning process. The friction force generated by the subsequent downward movement of the lifting plate on the positioning tube is offset by the fixing of the fixed tube and the substrate, ensuring the stability of the positioning tube position, further reducing the pressure of the positioning tube on the device, ensuring the accuracy of the device position on the circuit board, and further improving the welding quality. Subsequently, the positioning tube can be fixed again by the fixing plate to achieve double fixation of the positioning tube, further improving the stability and accuracy of the device position on the circuit board.

[0019] 3. When the electromagnet in the corresponding fixed tube is energized, it will adsorb the first iron sheet and the second iron sheet. The electromagnet adsorbs the first iron sheet to achieve a preliminary connection between the fixed tube and the first iron sheet. Then, under the action of magnetic force, the second iron sheet moves toward the fixed tube. The second iron sheet drives the limit frame to move through the support rod and stretches the elastic line, so that the limit frame enters the connecting groove. The limit frame realizes a stable mechanical connection between the fixed tube and the first iron sheet, thereby achieving a stable connection between the fixed tube and the positioning tube, thereby improving the stability of the connection between the fixed tube and the positioning tube, and thereby improving the stability of the positioning tube in positioning the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0021] Figure 2 It is a structural schematic diagram of the rotating frame in the present invention.

[0022] Figure 3 It is a structural schematic diagram of the lifting plate in the present invention.

[0023] Figure 4 for Figure 2 A magnified schematic diagram of the A1 region in the middle.

[0024] Figure 5 for Figure 3 A magnified schematic diagram of the A2 region in the middle.

[0025] Figure 6 Schematic diagram of the structure of the substrate in the present invention.

[0026] Figure 7 It is a structural schematic diagram of the fixed tube in the present invention.

[0027] Figure 8 for Figure 6 Schematic diagram of the enlarged A3 region.

[0028] Figure 9 for Figure 7 Schematic diagram of the enlarged A4 area.

[0029] In the accompanying drawings: 1. Base; 2. Rotating frame; 3. Rotating power part; 4. Placement plate; 5. Guide plate; 6. Moving plate; 7. Adjusting screw; 8. Slide groove; 9. Limiting plate; 10. First telescopic part; 11. Lifting plate; 12. Positioning tube; 13. First iron sheet; 14. Connecting groove; 15. Moving frame; 16. Second telescopic part; 17. Fixed plate; 18. Guide frame; 19. Base plate; 20. Fixed tube; 21. Airbag; 22. Electromagnet; 23. Bracket; 24. Limiting frame; 25. Elastic line; 26. Support rod; 27. Second iron sheet; 28. Mounting frame; 29. ​​Camera. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0031] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0032] like Figures 1-9 As shown, a semiconductor device welding positioning device provided by the present invention includes a base 1, a rotating frame 2 is rotatably installed on the base 1, and a rotating power part 3 for driving the rotating frame 2 to rotate is provided on the base 1, the rotating frame 2 is L-shaped and an L-shaped placement plate 4 is fixedly installed on the rotating frame 2, a movable plate 6 for fixing the circuit board is provided on the placement plate 4, a plurality of groups of parallel and spaced guide plates 5 are fixedly installed on the placement plate 4, the movable plate 6 is slidably installed on the guide plate 5, the movable plate 6 has a T-shaped cross-section, the upper surface of the horizontal section of the movable plate 6 is flush with the upper surface of the placement plate 4, an adjusting screw 7 for driving the movable plate 6 to move is rotatably installed on the placement plate 4, a slide groove 8 is opened on the movable plate 6, a limit plate 9 is slidably installed in the slide groove 8, the limit plate 9 passes through the movable plate 6 and a fixing screw is provided on the limit plate 9;

[0033] A lifting plate 11 is provided on the placing plate 4, and a first telescopic member 10 is fixedly installed on the placing plate 4 to drive the lifting plate 11 to move up and down. A plurality of positioning tubes 12 distributed in an array are slidably installed on the lifting plate 11, and a first iron sheet 13 is fixedly installed on the end of the positioning tube 12 away from the placing plate 4. The lifting plate 11 is provided with a fixed plate 17 for fixing the positioning tube 12. Two groups of guide frames 18 are fixedly installed on the lifting plate 11. The guide frames 18 are located on both sides of the distribution area of ​​the positioning tube 12. A moving frame 15 is slidably installed on the guide frame 18. The fixed plate 17 is fixedly installed in the moving frame 15. A second telescopic member 16 that drives the moving frame 15 to move is fixedly installed on the lifting plate 11. There are multiple groups of fixed plates 17, and the fixed plates 17 are spaced apart from the rows of positioning tubes 12.

[0034] In actual application of this embodiment, the circuit board with the components to be soldered is placed on the placement plate 4 and one corner of the circuit board is brought into contact with the rotating frame 2 so that the components on the circuit board are located above the circuit board. The movable plate 6 is driven to move by adjusting the screw 7 so that the horizontal section of the movable plate 6 moves to the bottom of the circuit board until the vertical section of the movable plate 6 contacts the side of the circuit board. Then, the limiting plate 9 is moved to contact the other side of the circuit board and fixed by the fixing screws. At this time, the installation of the circuit board is completed. The circuit board is supported by the movable plate 6 and the placement plate 4, and the fixing and positioning of the circuit board are completed by the rotating frame 2, the movable plate 6 and the limiting plate 9.

[0035] In the initial state, the lifting plate 11 is at the highest point, and the first iron sheet 13 contacts the lifting plate 11. Then the first telescopic member 10 drives the lifting plate 11 to move downward, and the downward movement of the lifting plate 11 drives the positioning tubes 12 to move synchronously. Since the multiple groups of positioning tubes 12 are densely distributed, the upper surface of the device on the circuit board will contact one or more groups of positioning tubes 12 after the positioning tubes 12 descend. When the lower ends of the positioning tubes 12 contact the devices on the circuit board, the group of positioning tubes 12 no longer moves downward. At this time, the lifting plate 11 continues to move downward until the other positioning tubes 12 contact the circuit board and the first iron sheet 13 is separated from the lifting plate 11. At this time, the second telescopic member 16 drives The movement of the moving frame 15 causes the fixing plate 17 to come into contact with the corresponding row of positioning tubes 12, thereby achieving the fixation of the positioning tubes 12. Since the positioning tubes 12 are light in weight, the pressure exerted on the device is small, avoiding the generation of a large force on the device to push the device to move. Moreover, the force exerted by the positioning tubes 12 on the device is in the vertical direction, avoiding the device from being pushed to shift laterally, ensuring the accuracy of the device position on the circuit board and improving the quality of subsequent welding. Moreover, after the positioning tubes 12 are fixed by the fixing plates 17, the positioning tubes 12 will no longer exert additional force on the device on the circuit board during subsequent use, further improving the stability and accuracy of the device position.

[0036] After the positioning tube 12 is fixed, the rotating frame 2 is driven to rotate 180 degrees by the rotating power part 3 to flip the circuit board. At this time, the device can be welded to the circuit board through the welding equipment. During welding, the circuit board and the device are supported by the positioning tube 12. Since the positioning tube 12 is fixed, the circuit board and the device can maintain a stable static state, further improving the stability of the position of the circuit board and the device, and improving the welding quality. After the welding is completed, the rotating frame 2 is reset, and then the fixing plate 17 to the positioning tube 12 is released. Then the first telescopic part 10 drives the lifting plate 11 to reset upward, remove the circuit board after welding, replace it with a new circuit board, and then continue the welding operation.

[0037] In an example of this embodiment, the rotating power part 3 is a motor, and of course it can also be other components that can output rotational power, such as a hydraulic motor. The motor drives the rotating frame 2 to rotate to realize the flipping of the circuit board. The first telescopic part 10 and the second telescopic part 16 are respectively the first electric telescopic rod and the second electric telescopic rod. Of course, they can also be other components that can actively change the length, such as a hydraulic cylinder. The lifting plate 11 is driven up and down by the first electric telescopic rod, and the fixed plate 17 is driven to move by the second electric telescopic rod.

[0038] like Figures 1-9 As shown, a semiconductor device welding positioning device provided by the present invention, a base plate 19 is fixedly installed on the rotating frame 2, the base plate 19 is made of magnetic material, and a plurality of groups of fixed tubes 20 distributed in an array are slidably installed on the base plate 19, and the positions of the fixed tubes 20 correspond one-to-one to the positions of the positioning tubes 12. An electromagnet 22 is fixedly installed in the fixed tube 20, and the electromagnet 22 is distributed along the length direction of the fixed tube 20. The end of the electromagnet 22 close to the lifting plate 11 is flush with the end of the fixed tube 20.

[0039] Specifically, an airbag 21 is fixedly installed at one end of the fixed tube 20 away from the lifting plate 11. The airbag 21 is filled with gas, and the buoyancy generated by the gas filled in the airbag 21 and the gravity of the fixed tube 20 and the structure thereon are set to have a set difference. The buoyancy generated by the gas filled in the airbag 21 is relatively small.

[0040] Specifically, a plurality of L-shaped brackets 23 are fixedly installed on one end of the fixed tube 20 close to the lifting plate 11, and an L-shaped limit frame 24 is provided on the bracket 23. The limit frame 24 is used in conjunction with the connecting groove 14 opened on the first iron sheet 13. When the electromagnet 22 is energized, it drives the limit frame 24 to move into the connecting groove 14.

[0041] Specifically, an elastic line 25 is fixedly connected to the limit frame 24, and one end of the elastic line 25 away from the limit frame 24 is fixedly connected to the end of the bracket 23. A support rod 26 pointing to the fixed tube 20 is fixedly installed on the limit frame 24, and a second iron sheet 27 is fixedly installed on the end of the support rod 26.

[0042] Specifically, a mounting frame 28 is fixedly mounted on the base plate 19 , and a plurality of cameras 29 for detecting the position of the fixed tube 20 are fixedly mounted on the mounting frame 28 .

[0043] In actual application of this embodiment, in the initial state, the electromagnet 22 is de-energized, the lower end of the fixing tube 20 contacts the first iron sheet 13, and the camera 29 captures the movement of the fixing tube 20 to detect whether the fixing tube 20 moves downward. When the lifting plate 11 moves downward, the fixing tube 20 moves downward synchronously with the corresponding positioning tube 12. The buoyancy generated by the gas in the airbag 21 offsets the weight of the fixing tube 20 and the structure above it, so that the pressure exerted by the fixing tube 20 on the first iron sheet 13 reaches a set value, ensuring that the pressure exerted on the device by the positioning tube 12 after contacting the device is sufficiently small to prevent the device from displacement.

[0044] When the positioning tube 12 contacts the device, the positioning tube 12 no longer moves downward, and the fixed tube 20 maintains a fixed height. After the camera 29 shoots and detects that the height of the upper end of the fixed tube 20 remains unchanged, the electromagnet 22 is energized. After the electromagnet 22 is energized, the fixed tube 20 is fixed on the substrate 19 under the action of magnetic force. At this time, the position of the fixed tube 20 is fixed, and the electromagnet 22 will also adsorb the first iron sheet 13 and the second iron sheet 27. The electromagnet 22 adsorbs the first iron sheet 13 to achieve a preliminary connection between the fixed tube 20 and the first iron sheet 13. After that, under the action of magnetic force, the second iron sheet 27 moves in the direction close to the fixed tube 20. The second iron sheet 27 drives the limit frame 24 to move through the support rod 26 and stretches the elastic line 25, so that the limit frame 24 enters the connecting groove 14. A stable mechanical connection is achieved between the fixing tube 20 and the first iron sheet 13, thereby achieving a stable connection between the fixing tube 20 and the positioning tube 12. Since the fixing tube 20 is fixed to the base plate 19 by magnetic force, the positioning tube 12 is in a fixed state, and the positioning function of the positioning tube 12 has been completed in advance during the positioning process. The friction force generated by the subsequent downward movement of the lifting plate 11 on the positioning tube 12 is offset by the fixing of the fixing tube 20 and the base plate 19, ensuring the stability of the position of the positioning tube 12, further reducing the pressure of the positioning tube 12 on the device, ensuring the accuracy of the device position on the circuit board, and further improving the welding quality. Subsequently, the positioning tube 12 can be fixed again by the fixing plate 17 to achieve double fixation of the positioning tube 12, further improving the stability and accuracy of the device position on the circuit board.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

[0046] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A semiconductor device welding positioning device, comprising a base (1), characterized in that: The base (1) is rotatably mounted with a rotating frame (2), and a rotating power member (3) for driving the rotating frame (2) to rotate is provided on the base (1); the rotating frame (2) is L-shaped, and an L-shaped placement plate (4) is fixedly mounted on the rotating frame (2); and a movable plate (6) for fixing a circuit board is provided on the placement plate (4); The placement plate (4) is provided with a lifting plate (11), and a first telescopic member (10) is fixedly installed on the placement plate (4) for driving the lifting plate (11) to move up and down. A plurality of positioning tubes (12) distributed in an array are slidably installed on the lifting plate (11), and a first iron sheet (13) is fixedly installed on one end of the positioning tube (12) away from the placement plate (4). The lifting plate (11) is provided with a fixing plate (17) for fixing the positioning tube (12). A base plate (19) is fixedly mounted on the rotating frame (2), and the base plate (19) is made of a magnetic material. A plurality of fixed tubes (20) distributed in an array are slidably mounted on the base plate (19), and the positions of the fixed tubes (20) correspond one to one with the positions of the positioning tubes (12). An electromagnet (22) is fixedly mounted in the fixed tube (20), and the electromagnet (22) is distributed along the length direction of the fixed tube (20). One end of the electromagnet (22) close to the lifting plate (11) is flush with the end of the fixed tube (20); An air bag (21) is fixedly mounted on one end of the fixed tube (20) away from the lifting plate (11), the air bag (21) is filled with gas, and a predetermined difference is set between the buoyancy generated by the gas filled in the air bag (21) and the gravity of the fixed tube (20) and the structure thereon; A plurality of L-shaped brackets (23) are fixedly mounted on one end of the fixed tube (20) close to the lifting plate (11), and an L-shaped limiting bracket (24) is provided on the bracket (23). The limiting bracket (24) cooperates with the connecting groove (14) provided on the first iron sheet (13). When the electromagnet (22) is energized, the limiting bracket (24) is driven to move into the connecting groove (14); An elastic line (25) is fixedly connected to the limiting frame (24), and one end of the elastic line (25) away from the limiting frame (24) is fixedly connected to the end of the bracket (23). A support rod (26) pointing to the fixed pipe (20) is fixedly installed on the limiting frame (24), and a second iron sheet (27) is fixedly installed at the end of the support rod (26).

2. A semiconductor device welding positioning device according to claim 1, characterized in that: A plurality of guide plates (5) arranged in parallel and spaced apart are fixedly mounted on the placement plate (4), and a movable plate (6) is slidably mounted on the guide plate (5). The movable plate (6) has a T-shaped cross section, and the upper surface of the horizontal section of the movable plate (6) is flush with the upper surface of the placement plate (4). An adjusting screw (7) for driving the movable plate (6) to move is rotatably mounted on the placement plate (4).

3. A semiconductor device welding positioning device according to claim 2, characterized in that: The movable plate (6) is provided with a sliding groove (8), and a limiting plate (9) is slidably installed in the sliding groove (8). The limiting plate (9) passes through the movable plate (6) and is provided with a fixing screw.

4. A semiconductor device welding positioning device according to claim 1, characterized in that: Two sets of guide frames (18) are fixedly mounted on the lifting plate (11), and the guide frames (18) are located on both sides of the distribution area of ​​the positioning tube (12). A moving frame (15) is slidably mounted on the guide frame (18), and the fixed plate (17) is fixedly mounted in the moving frame (15). A second telescopic member (16) for driving the moving frame (15) to move is fixedly mounted on the lifting plate (11).

5. A semiconductor device welding positioning device according to claim 4, characterized in that: The fixing plates (17) are provided in multiple groups, and the fixing plates (17) are spaced apart from the rows of positioning tubes (12).

6. The semiconductor device welding positioning device according to claim 1, characterized in that: A mounting frame (28) is fixedly mounted on the base plate (19), and a plurality of cameras (29) for detecting the position of the fixed tube (20) are fixedly mounted on the mounting frame (28).

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