Moving device and polishing equipment

Abstract

The invention relates to the technical field of polishing, and particularly discloses a moving device and polishing equipment. The moving device comprises a swing assembly, a first driving mechanism and a second driving mechanism; the swing assembly comprises a support and a swing arm, and one end of the swing arm is rotationally arranged on the support in a sleeving mode. The first driving mechanism comprises a supporting frame, a first driving assembly, a transmission assembly and a speed reduction assembly, the supporting frame is arranged on the swing arm, the first driving assembly is arranged on the supporting frame, and the speed reduction assembly is arranged on the support; the second driving mechanism comprises a second driving assembly and a driving shaft assembly, the second driving assembly is arranged at the other end, away from the support, of the swing arm, the output end of the second driving assembly is connected to the driving shaft assembly, and the driving shaft assembly is connected to the polishing head. The moving device is simple in structure, the number of heating parts is small, the problems that the swing precision of the swing arm is reduced due to temperature rise, and the polishing precision of the polishing head is reduced are solved, and meanwhile the influence of temperature rise on the control precision of a pneumatic control element on the swing arm is avoided.

Description

Technical Field

[0001] The present invention relates to the field of polishing technology, and in particular to a mobile device and polishing equipment. Background Art

[0002] A chemical mechanical polisher is a device that combines chemical etching with mechanical friction. It is mainly used for fine removal and flattening of the surface of semiconductor wafers. Its working principle is to soften the material to be removed on the surface of the semiconductor wafer through the chemical action of the polishing fluid, and then remove the softened material through the physical action of the polishing head and the polishing pad.

[0003] Currently, chemical mechanical polishing machines use a polishing head to absorb the wafer and press the wafer onto the polishing pad on the polishing plate. However, in the existing technology, the mechanical design of the main arm on which the polishing head is installed is complex, which easily causes temperature rise during use and affects the movement accuracy of the main arm, thereby reducing the polishing accuracy. Summary of the Invention

[0004] The purpose of the present invention is to provide a moving device and polishing equipment to solve the problem in the prior art that the mechanical design of the main arm on which the polishing head is installed is complex, which is very easy to heat up during use and affects the moving accuracy of the main arm, thereby reducing the polishing accuracy.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] In one aspect, the present invention provides a moving device for moving a polishing head, the moving device comprising:

[0007] A swing assembly, the swing assembly comprising a support and a swing arm, one end of the swing arm being rotatably sleeved on the support;

[0008] a first drive mechanism, the first drive mechanism comprising a support frame, a first drive assembly, a transmission assembly, and a reduction assembly, the support frame being mounted on the swing arm, the first drive assembly being mounted on the support frame, and the reduction assembly being mounted on the support; an output end of the first drive assembly being connected to an input end of the reduction assembly via the transmission assembly, and an output end of the reduction assembly being connected to the swing arm; the first drive assembly being used to drive the swing arm to swing around the support;

[0009] The second driving mechanism includes a second driving assembly and a driving shaft assembly. The second driving assembly is arranged at the other end of the swing arm away from the support. The output end of the second driving assembly is connected to the driving shaft assembly, and the driving shaft assembly is connected to the polishing head. The second driving assembly is used to drive the polishing head to rotate.

[0010] As an alternative to the above-mentioned mobile device, the speed reduction assembly includes a transmission shaft, a speed reducer, an annular mounting seat, and a connection assembly. The speed reducer is provided on the support. The transmission assembly is connected to the input end of the speed reducer through the transmission shaft. The annular mounting seat is sleeved outside the speed reducer and connected to the output end of the speed reducer. The connection assembly connects the annular mounting seat and the swing arm.

[0011] As an alternative to the above-mentioned mobile device, the connection assembly includes a connecting piece and at least two hoop pieces. At least two of the hoop pieces surround the annular mounting seat. The connecting piece is used to connect at least two of the hoop pieces to clamp the annular mounting seat. The hoop piece is connected to the swing arm.

[0012] As an alternative to the above-mentioned mobile device, the speed reduction assembly further includes a bearing seat and a first bearing assembly. The bearing seat covers the annular mounting seat. The first bearing assembly is provided in the bearing seat, and the transmission shaft passes through the first bearing assembly.

[0013] As an alternative to the above-mentioned mobile device, the support includes a base, an inner pressure plate, an outer ring pressure plate, and a second bearing assembly. The inner pressure plate is connected to the base and is used to press a part of the second bearing assembly between the base and the inner pressure plate. The outer ring pressure plate is sleeved outside the base and connected to the swing arm, and is used to press another part of the second bearing assembly between the outer ring pressure plate and the swing arm. The speed reduction assembly is provided on the inner pressure plate.

[0014] As an alternative to the above-mentioned mobile device, the transmission assembly includes a first synchronous pulley, a second synchronous pulley, and a synchronous belt body. The first synchronous pulley is connected to the output end of the first driving assembly. The second synchronous pulley is connected to the input end of the speed reduction assembly. The synchronous belt body is sleeved on the first synchronous pulley and the second synchronous pulley.

[0015] As an alternative to the above-mentioned mobile device, the mobile device further includes a sensor. The sensor is provided on the swing arm and is used to measure the rotation angle of the swing arm.

[0016] As an alternative to the above-mentioned mobile device, the mobile device further includes a mounting bracket and a bellows. The mounting bracket is provided on the swing arm. One end of the bellows is connected to the mounting bracket, and the cable can be connected to the first driving assembly and the second driving assembly via the bellows.

[0017] As an alternative to the above-mentioned mobile device, the first driving assembly is a servo motor, and the second driving assembly is a direct drive motor.

[0018] On the other hand, the present invention provides a polishing device, comprising a moving device as described above, the polishing device also comprising a polishing head, a polishing frame, a loading platform assembly, a polishing disc assembly, a dresser assembly and a grinding liquid spraying assembly, the moving device, the loading platform assembly, the polishing disc assembly, the dresser assembly and the grinding liquid spraying assembly are all arranged on the polishing frame, and the polishing head is arranged at the output end of the moving device.

[0019] The beneficial effects of the present invention are:

[0020] The mobile device includes a swing assembly, a first drive mechanism, and a second drive mechanism. The swing assembly includes a support and a swing arm, one end of the swing arm is rotatably mounted on the support, so that the swing arm can swing around the support. The first drive mechanism includes a support frame, a first drive assembly, a transmission assembly, and a reduction assembly. The support frame is mounted on the swing arm, the first drive assembly is mounted on the support frame, and the reduction assembly is mounted on the support. Thus, the first drive assembly is separated from the swing arm by the support frame and is separated from the reduction assembly. At the same time, the output end of the first drive assembly is connected to the input end of the reduction assembly through the transmission assembly, and the output end of the reduction assembly is connected to the swing arm. Under the transmission of the transmission assembly and the reduction assembly, the first drive assembly is used to drive the swing arm to swing around the support. During this process, the temperature increase of the first drive assembly will not be transmitted to the swing arm and the reduction assembly, and therefore will not affect the swing accuracy of the swing arm. At the same time, the second drive mechanism includes a second drive assembly and a drive shaft assembly. The second drive assembly is arranged at the other end of the swing arm away from the support. The output end of the second drive assembly is connected to the drive shaft assembly, and the drive shaft assembly is connected to the polishing head. The second drive assembly is used to drive the polishing head to rotate. During this process, the second drive assembly can directly control the rotation accuracy of the polishing head to improve the polishing uniformity of the wafer. The moving device has a simple structure and fewer heating parts. The swing arm can drive the polishing head to move in an arc, which makes it convenient for the polishing head to match the surface contour of the wafer and achieve a more uniform polishing pressure distribution, avoiding the uneven pressure or missed polishing caused by linear movement. The first drive assembly and the deceleration assembly are separated by the transmission assembly, which avoids the temperature rise of the first drive assembly affecting the performance and service life of the deceleration assembly, thereby avoiding the problem of reduced swing accuracy of the swing arm and reduced polishing accuracy of the polishing head. At the same time, it also avoids the temperature rise affecting the control accuracy of the air control element on the swing arm. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic structural diagram of a mobile device provided by an embodiment of the present invention;

[0022] Figure 2 A disassembly diagram of a mobile device provided by an embodiment of the present invention;

[0023] Figure 3 A cross-sectional view of a mobile device provided by an embodiment of the present invention;

[0024] Figure 4 This is a schematic structural diagram of the polishing equipment provided by the embodiment of the present invention.

[0025] In the figure:

[0026] 1. Swing assembly; 11. Support; 111. Base; 112. Inner pressure plate; 113. Outer ring pressure plate; 114. Second bearing assembly; 12. Swing arm;

[0027] 2. First driving mechanism; 21. Support frame; 22. First driving component; 23. Transmission component; 231. First synchronous pulley; 232. Second synchronous pulley; 233. Synchronous belt body; 24. Reduction component; 241. Reducer; 242. Ring mounting seat; 243. Connection component; 2431. Connecting piece; 2432. Hoop piece; 244. Bearing seat; 245. First bearing assembly;

[0028] 3. Second driving mechanism; 31. Second driving component; 32. Driving shaft assembly;

[0029] 4. Sensor; 5. Mounting frame; 6. Bellows;

[0030] 100. Polishing head; 200. Polishing frame; 300. Loading platform assembly; 400. Polishing disc assembly; 500. Truing device assembly; 600. Grinding fluid spraying assembly. Specific embodiments

[0031] Next, the technical solutions of the present invention will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0033] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected" and "coupled" should be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0035] Embodiment 1

[0036] As Figures 1 to 4 shown, this embodiment provides a mobile device for moving the polishing head 100.

[0037] The mobile device includes a swing assembly 1, a first drive mechanism 2, and a second drive mechanism 3. The swing assembly 1 includes a support 11 and a swing arm 12. One end of the swing arm 12 is rotatably sleeved on the support 11, so that the swing arm 12 can swing about the support 11 as an axis. Among them, the first drive mechanism 2 includes a support frame 21, a first drive assembly 22, a transmission assembly 23, and a reduction assembly 24. The support frame 21 is arranged on the swing arm 12, the first drive assembly 22 is arranged on the support frame 21, and the reduction assembly 24 is arranged on the support 11. Thus, the first drive assembly 22 is spaced from the swing arm 12 through the support frame 21 and is separated from the reduction assembly 24. At the same time, the output end of the first drive assembly 22 is drivingly connected to the input end of the reduction assembly 24 through the transmission assembly 23, and the output end of the reduction assembly 24 is connected to the swing arm 12. Driven by the transmission assembly 23 and the reduction assembly 24, the first drive assembly 22 is used to drive the swing arm 12 to swing about the support 11. During this process, the temperature rise of the first drive assembly 22 will not be transmitted to the swing arm 12 and the reduction assembly 24, so it will not affect the swing accuracy of the swing arm 12.

[0038] At the same time, the second drive mechanism 3 includes a second drive assembly 31 and a drive shaft assembly 32. The second drive assembly 31 is arranged at the other end of the swing arm 12 away from the support 11. The output end of the second drive assembly 31 is connected to the drive shaft assembly 32, and the drive shaft assembly 32 is connected to the polishing head 100. The second drive assembly 31 is used to drive the polishing head 100 to rotate. During this process, the rotation accuracy of the polishing head 100 can be directly controlled through the second drive assembly 31 to improve the polishing uniformity of the wafer. Optionally, the first drive assembly 22 is a servo motor, and the second drive assembly 31 is a direct drive motor. The servo motor can improve the swing accuracy of the swing arm 12 through its high-precision positioning and control capabilities, and further improve the polishing accuracy of the polishing head 100. The direct drive motor directly drives the polishing head 100 to rotate through the drive shaft assembly 32, and its transmission accuracy is relatively high, which can accurately control the rotation speed of the polishing head 100, thereby improving the polishing uniformity of the wafer. Further optionally, the mobile device further includes a sensor 4. The sensor 4 is arranged on the swing arm 12 and is used to measure the rotation angle of the swing arm 12. Thus, the sensor 4 and the first drive mechanism 2 cooperate with each other to further improve the swing accuracy of the swing arm 12.

[0039] The moving device has a simple structure and fewer heated areas. The swing arm 12 can drive the polishing head 100 to move in an arc, which makes it convenient for the polishing head 100 to adapt to the surface contour of the wafer and achieve a more uniform polishing pressure distribution, avoiding the uneven pressure or missed polishing problems caused by linear motion. The first drive component 22 and the deceleration component 24 are separated by the transmission component 23, which avoids the temperature rise of the first drive component 22 affecting the performance and service life of the deceleration component 24, thereby avoiding the problem of reduced swing accuracy of the swing arm 12, resulting in reduced polishing accuracy of the polishing head 100, and at the same time avoids the temperature rise affecting the control accuracy of the air control components on the swing arm 12.

[0040] like Figure 2 and Figure 3 As shown, the reduction assembly 24 includes a transmission shaft, a reducer 241, an annular mounting seat 242 and a connecting assembly 243. The reducer 241 is arranged on the support 11, so that the reducer 241 is fixed on the support 11 as a whole, and it will not shake during operation, so the transmission accuracy is high. The transmission assembly 23 is connected to the input end of the reducer 241 through the transmission shaft, and the annular mounting seat 242 is sleeved outside the reducer 241 and connected to the output end of the reducer 241, and the connecting assembly 243 connects the annular mounting seat 242 and the swing arm 12, so that the first driving assembly 22 can drive the transmission shaft to rotate through the transmission assembly 23, and the transmission shaft drives the annular mounting seat 242 to rotate via the reducer 241, and finally the annular mounting seat 242 drives the swing arm 12 to swing through the connecting assembly 243

[0041] Specifically, the connecting assembly 243 includes a connecting piece 2431 and at least two clamping pieces 2432, and the at least two clamping pieces 2432 surround the annular mounting seat 242. The connecting piece 2431 is used to connect the at least two clamping pieces 2432 to clamp the annular mounting seat 242, so that the clamping piece 2432 is fixed to the annular mounting seat 242, and the clamping piece 2432 is connected to the swing arm 12, so that when the annular mounting seat 242 rotates, it can drive the at least two clamping pieces 2432, and then the at least two clamping pieces 2432 can drive the swing arm 12 to swing. By surrounding the annular mounting seat 242 with at least two clamping pieces 2432, the coaxiality between the swing arm 12 and the annular mounting seat 242 during the swinging process can be ensured, and the installation of the deceleration assembly 24 as a whole on the support 11 and the swing arm 12 is facilitated.

[0042] Furthermore, the deceleration assembly 24 also includes a bearing seat 244 and a first bearing assembly 245. The bearing seat 244 is covered on the annular mounting seat 242, the first bearing assembly 245 is arranged in the bearing seat 244, and the transmission shaft is passed through the first bearing assembly 245. Through the arrangement of the bearing seat 244 and the first bearing assembly 245, the stability of the transmission shaft during rotation can be improved, and the transmission shaft can be prevented from shaking and affecting the swing accuracy of the swing arm 12.

[0043] Further, the support 11 includes a base 111, an inner pressure plate 112, an outer ring pressure plate 113, and a second bearing assembly 114. The inner pressure plate 112 is connected to the base 111 and is used to press a part of the second bearing assembly 114 between the base 111 and the inner pressure plate 112. The outer ring pressure plate 113 is sleeved outside the base 111 and is connected to the swing arm 12, and is used to press another part of the second bearing assembly 114 between the outer ring pressure plate 113 and the swing arm 12. The speed reduction assembly 24 is arranged on the inner pressure plate 112. Thus, the base 111, the inner pressure plate 112, the swing arm 12, and the outer ring pressure plate 113 can enclose the second bearing assembly 114. And because the speed reduction assembly 24, the inner pressure plate 112, and the base 111 are fixed as a whole, and the output end of the speed reduction assembly 24, the swing arm 12, and the outer ring pressure plate 113 are fixed as a whole, the stability of the swing arm 12 during the swinging process can be improved through the second bearing assembly 114, and the swinging difficulty of the swing arm 12 can be reduced.

[0044] Further, the transmission assembly 23 includes a first synchronous pulley 231, a second synchronous pulley 232, and a synchronous belt body 233. The first synchronous pulley 231 is connected to the output end of the first driving assembly 22, the second synchronous pulley 232 is connected to the input end of the speed reduction assembly 24, and the synchronous belt body 233 is sleeved on the first synchronous pulley 231 and the second synchronous pulley 232. Thus, the first driving assembly 22 can drive the speed reduction assembly 24 to operate in sequence through the first synchronous pulley 231, the synchronous belt body 233, and the second synchronous pulley 232. And by controlling the tooth number ratio between the first synchronous pulley 231 and the second synchronous pulley 232, the transmission ratio between the two can be controlled, so as to improve the transmission efficiency. Optionally, the synchronous belt body 233 is an arc tooth synchronous belt.

[0045] As Figures 1 to 3 shown, the mobile device further includes a mounting bracket 5 and a corrugated pipe 6. The mounting bracket 5 is arranged on the swing arm 12. One end of the corrugated pipe 6 is connected to the mounting bracket 5, and the cable can be connected to the first driving assembly 22 and the second driving assembly 31 via the corrugated pipe 6 to supply power to the first driving assembly 22 and the second driving assembly 31 respectively, so as to realize the operation of the first driving assembly 22 and the second driving assembly 31. At the same time, the cable can be protected through the corrugated pipe 6, and the cable clutter is avoided from affecting the swinging of the swing arm 12.

[0046] Embodiment Two

[0047] This embodiment also provides a polishing device, as Figure 1 and Figure 4As shown in the figure, including the mobile device in the first embodiment, the polishing equipment further includes a polishing head 100, a polishing frame 200, a loading platform assembly 300, a polishing pad assembly 400, a dresser assembly 500, and a polishing liquid spraying assembly 600. The mobile device, the loading platform assembly 300, the polishing pad assembly 400, the dresser assembly 500, and the polishing liquid spraying assembly 600 are all arranged on the polishing frame 200. The polishing head 100 is arranged at the output end of the mobile device. In this polishing equipment, the loading platform assembly 300 can receive the wafer incoming material, and then the polishing head 100 can be swung by the mobile device to adsorb the wafer on the loading platform assembly 300, and move the wafer to the polishing pad of the polishing pad assembly 400. Then, through the rotation of the polishing head 100 and the rotation of the polishing pad, the planarization treatment of the wafer surface is realized.

[0048] Among them, the polishing liquid spraying assembly 600 can spray polishing liquid on the polishing pad, and the dresser assembly 500 can dress the polishing pad. Optionally, the polishing equipment further includes a cleaning assembly, which is arranged on the polishing frame 200 and is used to clean the dresser assembly 500.

[0049] Obviously, the above-mentioned embodiments of the present invention are only examples for clearly explaining the present invention, and are not intended to limit the implementation manners of the present invention. For those of ordinary skill in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation manners here. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A mobile device for moving a polishing head (100), characterized in that, The mobile device comprises: A swing assembly (1), the swing assembly (1) comprising a support (11) and a swing arm (12), one end of the swing arm (12) being rotatably sleeved on the support (11); A first driving mechanism (2), the first driving mechanism (2) comprising a support frame (21), a first driving assembly (22), a transmission assembly (23) and a reduction assembly (24), the support frame (21) being arranged on the swing arm (12), the first driving assembly (22) being arranged on the support frame (21), and the reduction assembly (24) being arranged on the support (11); the output end of the first driving assembly (22) being connected to the input end of the reduction assembly (24) via the transmission assembly (23), and the output end of the reduction assembly (24) being connected to the swing arm (12); the first driving assembly (22) being used for driving the swing arm (12) to swing around the support (11); A second driving mechanism (3), the second driving mechanism (3) comprises a second driving assembly (31) and a driving shaft assembly (32), the second driving assembly (31) being arranged at the other end of the swing arm (12) away from the support (11), the output end of the second driving assembly (31) being connected to the driving shaft assembly (32), and the driving shaft assembly (32) being connected to the polishing head (100); the second driving assembly (31) is used for driving the polishing head (100) to rotate.

2. The mobile device according to claim 1, wherein The reduction assembly (24) comprises a transmission shaft, a reducer (241), an annular mounting seat (242) and a connecting assembly (243); the reducer (241) is arranged on the support (11); the transmission assembly (23) is connected to the input end of the reducer (241) through the transmission shaft; the annular mounting seat (242) is sleeved outside the reducer (241) and connected to the output end of the reducer (241); the connecting assembly (243) connects the annular mounting seat (242) and the swing arm (12).

3. The mobile device according to claim 2, wherein, The connecting assembly (243) comprises a connecting piece (2431) and at least two hoop pieces (2432), wherein the at least two hoop pieces (2432) surround the annular mounting seat (242), and the connecting piece (2431) is used to connect the at least two hoop pieces (2432) to clamp the annular mounting seat (242); the hoop piece (2432) is connected to the swing arm (12).

4. The mobile device according to claim 2, wherein The deceleration assembly (24) further includes a bearing seat (244) and a first bearing assembly (245), wherein the bearing seat (244) is covered on the annular mounting seat (242), the first bearing assembly (245) is disposed in the bearing seat (244), and the transmission shaft passes through the first bearing assembly (245).

5. The mobile device according to claim 1, characterized in that, The support (11) includes a base (111), an inner pressing plate (112), an outer ring pressing plate (113), and a second bearing assembly (114). The inner pressing plate (112) is connected to the base (111) and is used to press a part of the second bearing assembly (114) between the base (111) and the inner pressing plate (112). The outer ring pressing plate (113) is sleeved outside the base (111) and is connected to the swing arm (12), and is used to press another part of the second bearing assembly (114) between the outer ring pressing plate (113) and the swing arm (12). The deceleration assembly (24) is arranged on the inner pressing plate (112).

6. The mobile device according to claim 1, wherein The transmission assembly (23) includes a first synchronous pulley (231), a second synchronous pulley (232), and a synchronous belt body (233). The first synchronous pulley (231) is connected to the output end of the first driving assembly (22), the second synchronous pulley (232) is connected to the input end of the deceleration assembly (24), and the synchronous belt body (233) is sleeved on the first synchronous pulley (231) and the second synchronous pulley (232).

7. The mobile device according to claim 1, characterized in that, The mobile device further includes a sensor (4). The sensor (4) is arranged on the swing arm (12) and is used to measure the rotation angle of the swing arm (12).

8. The mobile device according to claim 1, wherein The mobile device further includes a mounting bracket (5) and a corrugated pipe (6). The mounting bracket (5) is arranged on the swing arm (12). One end of the corrugated pipe (6) is connected to the mounting bracket (5), and a cable can be connected to the first driving assembly (22) and the second driving assembly (31) through the corrugated pipe (6).

9. The mobile device according to any one of claims 1 to 8, characterized in that, The first driving assembly (22) is a servo motor, and the second driving assembly (31) is a direct drive motor.

10. A polishing device, characterized in that, Including the mobile device according to any one of claims 1 to 9, the polishing device further includes a polishing head (100), a polishing frame (200), a loading platform assembly (300), a polishing disc assembly (400), a dresser assembly (500), and a grinding fluid spraying assembly (600). The mobile device, the loading platform assembly (300), the polishing disc assembly (400), the dresser assembly (500), and the grinding fluid spraying assembly (600) are all arranged on the polishing frame (200), and the polishing head (100) is arranged at the output end of the mobile device.

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