Device and system for testing optical performance of miniature optical device

Abstract

The invention provides a device and a system for testing the optical performance of a miniature optical device, and the device comprises a hollow structural body which is divided into an upper half part and a lower half part which are detachable, the hollow inner wall surface of the hollow structural body is a spherical surface, and the hollow structural body is made of a light reflection material; a mounting hole is formed in the bottom of the lower half part, a metal bearing table is inserted into the mounting hole, the metal bearing table is used for placing a to-be-tested micro optical device, is connected with a first wire and is used for supplying power to a first electrode of the micro optical device, and a metal frame is mounted on the side wall of the lower half part and is connected with a second wire; and the bottom side can abut against a second electrode of the micro optical device and is used for supplying power to the second electrode, and the upper half part is provided with a measuring hole. The device can realize intracavity power supply and measurement, is suitable for placing a miniature optical device in a hollow structure body, and solves the problem of optical performance test of the miniature optical device. When the structure is applied to an optical performance testing system of the diamond NV color center, the problem of optical performance detection of the micron-scale or nano-scale diamond NV color center can be solved.

Description

Technical Field

[0001] The present invention relates to the field of optical detection, and particularly to a device and a system for testing the optical performance of micro-optical devices. Background Art

[0002] With the improvement of chip manufacturing technology, currently, light source chips, such as laser diode chips, LEDs, etc., are extremely small in size, generally in the order of a few hundred micrometers or even a few micrometers. To measure the performance of these bare chips, such as optical power or spectrum, etc., using the measurement methods for existing large-sized components, for example, using existing large-sized integrating sphere devices, there are many problems. When the existing integrating sphere detection device detects the light emitted by a light source, the light source is placed outside the integrating sphere or at the opening on the wall of the integrating sphere, and the light from the light source is introduced into the integrating sphere. This method is not applicable to the unencapsulated bare chip light source with relatively divergent light. First, the size of the light source chip is small and cannot be fixed at the opening on the wall of the integrating sphere. Second, it is difficult to collect and introduce the divergent light into the integrating sphere. Third, even if the light source is placed inside the integrating sphere, due to the extremely small size of the light source, the existing integrating sphere cannot meet its power supply requirements.

[0003] For such micro-optical devices, how to achieve the optical performance test has become a problem to be solved. Summary of the Invention

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the present invention is to provide a device and a system for testing the optical performance of micro-optical devices, so as to solve the problem that the optical performance test of micro-optical devices cannot be achieved in the prior art.

[0005] To achieve the above purpose and other related purposes, the first aspect of the present invention provides a device for testing the optical performance of micro-optical devices, including: A hollow structure body, including a detachable upper half and a lower half, the inner wall surface of the hollow is spherical and made of a light-reflecting material; a measurement hole is opened on the upper half for installing an instrument for optical performance testing, and an installation hole is opened at the bottom of the lower half; A metal carrier platform for placing the micro-optical device to be tested, the upper end of which can be inserted into the cavity of the hollow structure body through the installation hole, and a first insulating member surrounding the circumferential side surface of the metal carrier platform is provided on the hole wall of the installation hole; A first wire, connected to the metal carrier platform, for supplying power to the first electrode of the micro-optical device through the metal carrier platform; A metal frame, the two ends of which are installed on the side walls of the lower half, a second insulating member is provided between the installation parts of the two ends, and the bottom side thereof can abut against the second electrode of the micro-optical device; A second wire, penetrating from the outside of the hollow structure body into it and connected to the metal frame, for supplying power to the second electrode through the metal frame.

[0006] Further, it further includes a displacement adjusting mechanism, which is located outside the hollow structure and is connected to the lower end of the metal carrier platform, and is used to adjust the position where the upper end of the metal carrier platform is inserted into the hollow structure.

[0007] Further, it further includes a support rod, one end of which is detachably connected to the outer wall of the lower half, and the other end is used for fixing.

[0008] Further, the metal frame includes a cross beam and a protrusion provided on the bottom side of the cross beam. The two ends of the cross beam are installed on the side walls of the lower half, and the protrusion can abut against the second electrode of the micro optical device for supplying power to the second electrode.

[0009] Further, a through hole leading from the top side to the bottom side is opened on the cross beam and passes through the protrusion. The through hole can be used to insert a first probe so that the first probe abuts against the second electrode of the micro optical device, and the first probe is fixed by dispensing glue at the midpoint of the through hole. The first probe is also connected to a third wire for supplying power to the second electrode.

[0010] Further, a probe jack is opened on the outer wall of the upper half for inserting a second probe so that the second probe abuts against the second electrode or the first electrode of the micro optical device. The second probe is also connected to a fourth wire for supplying power to the second electrode or the first electrode. A third insulating member surrounding the circumferential side surface of the second probe is provided on the hole wall of the probe jack.

[0011] Further, it further includes a light shielding member, which can cover the gap between the mounting hole and the side surface of the metal carrier platform when the upper end of the metal carrier platform is inserted into the cavity of the hollow structure.

[0012] Further, the diameter of the hollow cavity of the hollow structure is 1 - 10 cm.

[0013] To achieve the above and other related purposes, the second aspect of the present invention provides a system for testing the optical performance of diamond NV centers, including: the device for testing the optical performance of micro optical devices according to any one of the first aspects, and the metal carrier platform is also used for placing the diamond containing NV centers to be tested; and it further includes one of the following structures: Structure 1: It further includes a laser chip die placed on the metal carrier platform, and the laser chip die is powered by the way of supplying power to the micro optical device; Structure 2: It further includes an optical fiber, one end of the optical fiber extends into the interior of the hollow structure, the end face faces the diamond containing NV centers to be tested, and the other end is located outside the hollow structure, and the end face is used for accessing laser light.

[0014] Further, it further includes a filter plate, which is detachably installed in the measurement hole.

[0015] As described above, a device and a system for testing the optical performance of a micro-optical device according to the present invention have the following beneficial effects: A metal carrier platform for placing a micro-optical device to be tested, which can be inserted into the interior of a hollow structure, is connected to a first wire and used to supply power to the first electrode of the micro-optical device. A metal frame connected to a second wire is also provided, and the bottom side thereof can abut against the second electrode of the micro-optical device. Cavity power supply is realized through the metal carrier platform and the metal frame, and a measurement hole is also provided on the hollow structure. Thus, cavity power supply and measurement are realized, which is suitable for placing micro-optical devices, such as laser chip bare dies, LED chip bare dies, etc. in an integrating sphere to solve the problem of testing their optical performance; Applying this structure to the optical performance testing system of a diamond NV center, by placing a laser chip bare die and a diamond containing an NV center in the hollow structure, the problem of detecting the optical performance of a micron-scale or nano-scale diamond NV center is solved, and the problem of introducing a light source for the photoluminescence of the diamond, as well as the power supply problem of the laser chip bare die, which is also a micro-optical device, is solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It shows a first schematic structural diagram of the device for testing the optical performance of a micro-optical device according to the present invention; Figure 2 It shows a second schematic structural diagram of the device for testing the optical performance of a micro-optical device according to the present invention; Figure 3 It shows Figure 2 An enlarged schematic diagram at position A in Figure 4 It shows Figure 2 An enlarged schematic diagram at position B in Figure 5 It shows a third schematic structural diagram of the device for testing the optical performance of a micro-optical device according to the present invention; Figure 6 It shows a top view of the structure of the measurement hole according to the present invention;<l Figure 7 It shows a first schematic structural diagram of the system for testing the optical performance of a diamond NV center according to the present invention; Figure 8 It shows a schematic structural diagram of a laser chip and a diamond embedded in a fixing frame according to the present invention; Figure 9 It shows a schematic structural diagram of the fixing frame according to the present invention; Figure 10 It shows a second schematic structural diagram of the system for testing the optical performance of a diamond NV center according to the present invention.

[0017] Description of component labels: 1 - hollow structure; 11 - upper half; 12 - lower half; 121 - second insulating member; 122 - wire passing hole; 123 - first groove; 124 - second connection hole; 13 - mounting hole; 131 - first insulating member; 132 - light-shielding member; 133 - first fastener; 14 - measuring hole; 15 - inner wall layer; 16 - outer wall layer; 17 - connecting ring; 171 - second fastening hole; 172 - second fastener; 18 - probe jack; 181 - third insulating member; 19 - second groove; 2 - metal carrier; 3 - micro-optical device; 4 - first wire; 5 - metal frame; 51 - cross beam; 511 - bent end; 512 - first connection hole; 52 - protrusion; 53 - through hole; 6 - second wire; 7 - displacement adjustment mechanism; 8 - support rod; 91 - first probe; 92 - second probe; 10 - third wire; 20 - fourth wire; 30 - laser chip die; 40 - diamond; 50 - filter; 60 - fixing frame; 601 - first fixing hole; 602 - second fixing hole; 70 - optical fiber. Detailed implementation manners

[0018] The following uses specific examples to illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0019] It should be noted that the diagrams provided in the following embodiments only illustrate the basic concept of the present invention in a schematic manner. Therefore, only the components related to the present invention are shown in the diagrams, rather than being drawn according to the number, shape, and size of the components in actual implementation. The types, quantities, and proportions of the components in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0020] Embodiment 1: As Figure 1 shown, this embodiment provides a device for testing the optical performance of a micro-optical device, including: A hollow structure 1, including a detachable upper half 11 and a lower half 12, the inner wall surface of the hollow is spherical and made of a light-reflecting material; a measuring hole 14 is opened on the upper half 11 for installing an instrument for testing optical performance, and a mounting hole 13 is opened at the bottom of the lower half; A metal carrier 2, used for placing the micro-optical device 3 to be tested, the upper end can be inserted into the cavity of the hollow structure 1 through the mounting hole 13, and a first insulating member 131 surrounding the circumferential side surface of the metal carrier 2 is provided on the hole wall of the mounting hole 13; The first wire 4 is connected to the metal carrier 2 and is used to supply power to the first electrode of the micro-optical device 3 through the metal carrier 2; The metal frame 5 is mounted on the side walls of the lower half 12 at both ends. A second insulating member 121 is provided between the mounting portions of the two, and its bottom side can abut against the second electrode of the micro-optical device 3; The second wire 6 penetrates from the outside of the hollow structure 1 into it and is connected to the metal frame 5, and is used to supply power to the second electrode through the metal frame 5.

[0021] This embodiment can simultaneously achieve in-cavity power supply and measurement, and is suitable for placing micro-optical devices, such as laser chip dies, LED chip dies, etc. in the cavity to solve the problem of their optical performance testing.

[0022] Among them, the first electrode and the second electrode can be either the anode or the cathode of the micro-optical device and form an anode-cathode pair. For a chip with the anode and cathode located on the top surface and the bottom surface of the chip respectively, such as a laser chip die, power supply is achieved through the contact between the metal frame and the metal carrier and the two electrodes of the chip. The structure is simple and the operation is convenient, playing a dual role of in-cavity placement and power supply.

[0023] Among them, both the upper half 11 and the lower half 12 of the hollow structure 1 are hemispherical, and are divided into an inner wall layer 15 and an outer wall layer 16 from the inside to the outside. The inner wall layer 15 is formed by covering the outer wall layer 16 with a light-reflecting material with a reflectivity of over 95%. The forming method can adopt processes such as electroplating, evaporation plating, sputtering, spin coating, etc. The light-reflecting material can be polytetrafluoroethylene, barium sulfate, magnesium oxide, etc. The upper half 11 and the lower half 12 can be detachably connected by respectively setting protrusions and grooves on the connected end faces, or as shown in Figure 2 respectively setting mating internal threads and external threads at the connected ends to achieve detachable connection. For the micro-optical device located inside the hollow structure, even if the emitted light is scattered, after spherical reflection, the optical performance, such as optical power, wavelength, pulse frequency, etc., can be measured at the measurement port. The instruments that can be installed at the measurement port can be a spectrometer, a power meter, etc. or an optical fiber connector can be installed.

[0024] In this embodiment, as shown in Figure 2 、 Figure 3As shown in the figure, the metal frame 5 includes a cross beam 51 and a protrusion 52 provided on the bottom side of the cross beam 51. The protrusion 52 can be abutted against the second electrode of the micro-optical device 3 to supply power to the second electrode. By providing the protrusion 52, the electrode of the micro-optical device can be more accurately opposed, so as to avoid the bottom side of the metal frame 5 not being abutted due to uneven or sunken electrode surfaces. The material of the metal frame 5 is selected from conductive materials such as copper, aluminum, and iron to obtain good electrical conductivity. The end face of the protrusion 52 is a plane, and its shape can be selected according to needs, such as rectangular or circular, and the maximum dimension in a single dimension (such as diameter or length) is 0.1-0.5 mm. As Figure 4 As shown in the figure, a wire threading hole 122 is opened on the side wall of the lower half. The second wire 6 enters the cavity through this wire threading hole, and glue, such as optical glue, is applied to the inside of the cavity of the lower half 12 from the wire threading hole 122. On the one hand, high-reflection sealing can be achieved to reduce light loss, and on the other hand, it can be used to fix the wire and reduce the unstable influence on power supply caused by wire movement.

[0025] As Figure 2 shown in the figure, it further includes a displacement adjustment mechanism 7, which is located outside the hollow structure 1 and is connected to the metal carrier 2 for adjusting the position of the metal carrier 2 inserted into the hollow structure 1. The displacement adjustment mechanism 7 adopts a three-dimensional precision adjustment device with a precision up to the micron level to achieve adjustment in three spatial directions. The adjustment method is to insert the metal carrier 2 into the mounting hole 13 of the lower half 12, then keep the lower half 12 fixed, and by controlling the displacement adjustment mechanism 7, the position of the metal carrier 2 in the hollow structure 1 is adjusted so that the electrode of the micro-optical device 3 placed on the metal carrier 2 abuts against the protrusion 52. After adjustment, the upper half 11 is installed on the lower half 12. The operation is relatively convenient, the adjustment fineness is relatively high, and there is no need to open an observation hole for observation on the hollow structure 1, further improving the light reflection effect in the cavity. To avoid blocking the light reflection in the hollow structure 1, the metal carrier 2 is selected to have a slender structure, and the size of its top end face should be suitable for placing the chip. The maximum dimension in a single dimension of the top surface (such as diameter or length) is 1-8 mm, and it can be as Figure 1 , Figure 2 shown in the figure, a cylindrical structure is selected.

[0026] A first insulating member 131 is provided on the hole wall of the mounting hole 13. When the upper end of the metal carrier 2 is inserted into the cavity of the hollow structure 1, the first insulating member 131 surrounds the circumferential side surface of the metal carrier to form electrical insulation to avoid affecting the power supply requirements for the micro-optical device 3 to be measured. Exemplarily, as Figure 1 shown in the figure, the first insulating member 131 is an insulating material layer covering the hole wall along the circumference of the mounting hole 13. The insulating material can be plastic, rubber, etc. To enhance the light reflection, a white material can be selected.

[0027] To reduce the light loss caused by the remaining gap after the installation hole 13 is inserted into the metal carrier 2, a light-shielding member 132 is further included. When the upper end of the metal carrier 2 is inserted into the cavity of the hollow structure 1, the light-shielding member 132 can cover the gap between the installation hole 13 and the side surface of the metal carrier 2. An exemplary setting is as Figure 1 The shown light-shielding member 132 is an annular structure, sleeved on the circumferential side surface of the metal carrier 2, and can abut against the circumferential surface of the lower port of the installation hole 13 to cover the gap between the hole wall and the side surface of the metal carrier. Further, the abutting surface of the annular structure at the part facing the gap can be set as a concave surface, in the shape of a lotus leaf surface. By using the light reflection of the concave surface, the light loss is reduced. The light-shielding member 132 is made of a high-reflection material. To fix the light-shielding member 132, an example is as Figure 1 , Figure 2 shown. A first fastener 133 with an external thread on the outer side surface is also provided. A first fastening hole is opened on the side surface of the light-shielding member 132, and an internal thread matching the external thread is provided on the hole wall of the first fastening hole. By screwing in the first fastener 133, the end surface of the entering end can abut against the side surface of the metal carrier 2, thereby realizing the fixation of the light-shielding member 132. The minimum single-dimensional size of the covering surface of the light-shielding member is greater than the difference between the maximum single-dimensional size of the cross-section of the installation hole and the maximum single-dimensional size of the cross-section of the metal carrier, preferably greater than 1.5 times.

[0028] To facilitate the fixation of the hollow structure 1, as Figure 2 shown, a support rod 8 is also provided. A connecting ring 17 is connected to the outer wall of the lower half 12. The connecting ring 17 can be sleeved into one end of the support rod 8 and fixed on the outer wall of the support rod 8. As Figure 2 shown, the upper end of the support rod 8 can be set such that the radial dimension gradually increases from top to bottom. In this way, when the connecting ring 17 is sleeved from top to bottom, it will be fixed at a position where the radial dimension is larger than the ring diameter. The other end of the support rod 8 is used to be fixed on a plane such as a test platform. The detachable connection between the hollow structure 1 and the support rod 8 is realized through the connecting ring 17, and it is also convenient to pour out the micro-optical device placed in the cavity by tilting the lower half, which can solve the problem that it is difficult to clamp and take out the micro-optical device.

[0029] The connection relationship between the support rod 8 and the lower half 12 can also be set in a form where the lower half 12 can adjust its height along the axial direction of the support rod 8. An example is as Figure 7 shown. A second fastening hole 171 is opened on the circumferential side surface of the connecting ring 17, and a thread is provided on the hole wall. A second fastener 172 with an external thread is also provided, such as a screw. After the connecting ring 17 is sleeved on the support rod and adjusted to the specified height, by screwing the second fastener 172 into the second fastening hole 171, the end surface of the entering end of the second fastener 172 abuts against the side surface of the support rod 8 ( Figure 10As shown, the connecting ring 17 is thus fixed at a specified position on the support rod 8.

[0030] In this embodiment, as Figure 3 shown, a through hole 53 leading from the top side to the bottom side is further provided in the cross beam 51, and the through hole 53 passes through the protrusion 52. As Figure 5 shown, this through hole 53 can be used to insert the first probe 91, so that the first probe 91 abuts against the second electrode of the micro-optical device, and the first probe 91 is fixed by dispensing glue at the midpoint of the through hole 53. The first probe 91 is also connected to the third wire 10 for supplying power to the second electrode. The third wire 10 passes through the same wire passing hole 122 as the second wire 6 and extends out of the hollow structure to be connected to an external power supply device. Here, in addition to supplying power through the protrusion 52, another power supply method is provided as a backup. This method is more flexible because the first probe 91 is introduced through the through hole 53, and the length of the first probe 91 extending out of the through hole 53 can be adjusted as needed to contact the electrode located on the top surface of the chip, which can solve the situation where the electrode surface cannot be touched by the protrusion 52, such as the electrode surface having an inclined angle, resulting in poor contact between the protrusion 52 and the electrode surface. After dispensing glue in the through hole 53, it plays a role in collimating and fixing the first probe 91. A white optical glue is selected to increase light reflection and does not affect the conductivity of the probe. The buffering effect of the glue on the first probe 91 also makes the contacted electrode not easily be broken down. By removing the upper half 11 and inserting the first probe 91 into the through hole 53, the position of the first probe relative to the electrode surface can be adjusted under a large viewing angle, which can more accurately achieve precise adjustment. The diameter of the first probe is dozens of micrometers, the length is 5 - 10 mm, and the length of the bottom end extending out of the through hole 53 is 1 - 2 mm.

[0031] As Figure 2 shown, both ends of the cross beam 51 are connected to positions near the middle of the hollow structure, so that the micro-optical device is close to the middle position, improving the uniformity of light detection. Figure 4 Exemplarily, both ends of the cross beam 51 are bent from the transverse direction to the longitudinal direction to form bent ends 511, which are clamped in the first grooves 123 on the end faces of the side walls of the lower half. A first connection hole 512 and a second connection hole 124 are respectively provided on the side surface of each bent end 511 and the side wall of the lower half adjacent thereto. By using a connecting member (such as a bolt, a screw, etc.) to fixedly connect the two connection holes (512, 124) of the bent end and the side wall of the lower half adjacent thereto, both ends of the cross beam 51 can be connected to the side wall of the lower half. The second insulating member 121 is located between the connection parts of the two to achieve electrical insulation between them. Figure 3 Exemplarily, the second insulating member 121 is an insulating layer covering the inner wall surface of the first groove 123.

[0032] As Figure 5 、 Figure 7As shown, a probe jack 18 is also provided on the outer wall of the upper half 11 for inserting a second probe 92, so that the second probe 92 abuts against the second electrode or the first electrode of the micro-optical device 3. The second probe 92 is also connected to a fourth wire 20 for supplying power to the second electrode or the first electrode. A third insulating member 181 surrounding the circumferential side surface of the second probe 92 is provided on the pore wall of the probe jack 18. Figure 7 Exemplarily, the third insulating member 181 is an insulating material layer covering the pore wall along the circumferential direction of the pore. This way provides an alternative way to supply power to the second electrode on one hand, enhancing the selectivity of the power supply method. On the other hand, it provides a power supply method for the anode and cathode of the micro-optical device on the same plane. The aforementioned power supply method through the protrusion 52 and the first probe 91 inserted into the through hole 53 can be selectively used for the power supply of the second electrode, and this method through the probe jack can be used for the power supply of the first electrode on the same plane as the second electrode, improving the application scope of this embodiment.

[0033] As Figure 5 shown, the measurement hole 14 is arranged in such a way that the aperture gradually becomes larger from the inner wall side to the outer wall side of the hollow structure body to accommodate optical fibers or fiber connectors of different diameters, so as to further adapt to the diversity of measurement methods and improve the application scope of measurement. The inner diameter range of each section in the measurement hole is 2 - 4 mm. The optical fiber installed in the measurement hole 14 can also be a split optical fiber. The combined end is inserted into the measurement hole 14, and multiple split ends are connected to a test instrument, enabling simultaneous testing of multiple parameters, such as spectrum, optical power, etc.

[0034] As Figure 5 、 Figure 6 shown, the outward opening end of the measurement hole 14 leads to a second groove 19, and a notch 191 leading to the outside is provided at the edge of the second groove 19. As Figure 5 Exemplarily given, the second groove 19 is formed by the upward extension of the outer wall layer 16. Figure 5 Exemplarily given, the cross-section of the second groove 19 is circular, which can be applicable to measuring instruments with a circular outer contour of the connector, such as the measuring connector of an optical power meter. The connector is directly placed in the circular groove, and the photosensitive part on the circular surface of the connector faces the measurement port directly. Light is transmitted through the measurement hole to the photosensitive part to achieve measurement. The notch 191 is used for placing the connecting wire. This way can achieve the perception measurement of light without using an optical fiber or other connectors, with convenient operation, and the measurement hole 14 and the second groove 19 can be selectively used, having a wider application range. Of course, the structural shape of the second groove 19 can also be other styles, which can be adaptively designed according to the shape of the target measuring instrument.

[0035] Since the measurement object in this embodiment is a micro-optical device, the size of the hollow structure is relatively small compared to the general case. The maximum single-dimensional size of its outer contour (such as diameter or length) is 2 - 11 cm, and the diameter of the hollow cavity is 1 - 10 cm. When the area of the measurement hole is constant, the smaller the radius of the inner wall surface of the hollow structure, the greater the light energy received by the measurement hole, which can reduce the measurement error.

[0036] Embodiment 2: This embodiment provides a system for testing the optical properties of diamond NV centers, as Figure 7 shown, including: the device for testing the optical properties of micro-optical devices in Embodiment 1. The metal carrier 2 is also used to place the diamond 40 containing NV centers to be measured. It also includes a laser chip die 30 placed on the metal carrier 2, and the laser chip die 30 is powered in the same way as the micro-optical device.

[0037] The inner wall layer 15 in this embodiment is a single-layer structure directly made of a reflective material, and is adhesively connected to the inner surface of the outer wall layer 16. The reflective material is polytetrafluoroethylene with a thickness of 1 - 8 mm.

[0038] In the system of this embodiment, when the diamond 40 containing NV centers to be measured is placed on the metal carrier 2, the laser emitted from the laser chip exit will irradiate on the diamond, and the NV centers will generate fluorescence under the action of the laser. Thus, the optical properties of the diamond NV centers, such as the power and wavelength of the fluorescence generated by photoluminescence, can be tested. Since the diamond is in a micron-scale or nano-scale structure, taking the diamond containing NV centers as a micro-optical device can also solve the problem of testing its optical properties. And placing the laser chip die directly in the hollow structure to emit laser light directly to the diamond also solves the problem of introducing the light source for the photoluminescence of the diamond, as well as the power supply problem of the laser chip, which is also a micro-optical device.

[0039] The measurement hole 14 of this embodiment can measure the mixed light of laser and fluorescence, or as Figure 7 shown, it also includes a filter 50, which is detachably installed in the measurement hole 14. Different filters can be replaced according to the need for filtering wavelengths to selectively measure fluorescence or laser. Figure 7 Exemplarily, the filter 50 is installed at one end of the measurement hole 14 close to the inner wall of the hollow structure. A groove is opened at this port. The filter 50 can be snapped into the groove from the direction of the inner wall of the hollow structure, and threads are provided on the side wall of this port. Using a fastening frame with threads on the outer periphery, the filter 50 can be fastened and disassembled by screwing in and out the threads. When not installed, the filter 50 can also be directly placed at one end of the measurement hole 14 on the outer surface of the hollow structure and attached to the detection surface of the detection instrument.

[0040] To prevent the laser chip die 30 and the diamond 40 from moving on the metal carrier 2, as shown in Figures 8 - 9 , a fixing frame 60 can be provided, including a first fixing hole 601 for embedding the laser chip die 30 therein and a second fixing hole 602 for embedding the diamond 40 therein, and the two holes are connected. The laser is transmitted to the diamond through the communication channel. Or the diamond 40 is bonded to the metal carrier 2 with optical glue, and only the position of the laser chip die 30 is adjusted so that the light emitted therefrom irradiates the diamond and meets the power supply requirements.

[0041] Embodiment 3: As shown in Figure 10 , the difference between this embodiment and Embodiment 2 is that it does not include the laser chip die 30, but includes an optical fiber 70. One end of the optical fiber 70 extends into the interior of the hollow structure 1, and the end face faces the diamond 40 containing NV centers to be measured, and the other end is located outside the hollow structure 1, and the end face is used to access the laser.

[0042] As shown in Figure 10 , the diamond 40 can be connected to the end face of the optical fiber facing the diamond 40, for example, by bonding with optical glue, and the optical fiber can pass through the probe jack 18 or a hole additionally opened on the side wall of the hollow structure, so that its two ends are respectively located inside and outside the hollow structure 1, and the fluorescence performance is tested through the measurement hole 14; Figure 10 Exemplarily, the probe jack 18 is selected. When the second probe 92 is not inserted into the probe jack 18, the optical fiber is passed through the probe jack 18. After the laser is transmitted to the diamond 40 by the optical fiber 70, the diamond generates fluorescence, which is reflected by the inner wall surface of the hollow structure 1 and then measured by the measurement hole 14. The optical fiber used can be a bare optical fiber or an optical fiber with a protective layer on the outside. The protective layer is preferably made of a white material with light reflection to enhance the reflection of fluorescence in the cavity and improve the test accuracy.

[0043] When the hole through which the optical fiber passes is located on the upper half 11, during installation, the upper half 11 is removed, the diamond connected to one end face of the optical fiber is placed on the metal carrier, the other end of the optical fiber passes through the hole on the wall surface of the upper half, and then the upper half 11 and the lower half 12 are installed together. At this time, the installation method is a snap-fit method, for example, by snap-fitting of protrusions and grooves.

[0044] This embodiment uses an optical fiber to access the laser to realize the optical test of the photoluminescence of the diamond NV centers, and can also be selectively used with the method in Embodiment 2, realizing the diversity and flexibility of the test methods.

[0045] The above embodiments are only illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. An apparatus for testing the optical performance of a micro-optical device, characterized in that, The device includes: A hollow structure (1), comprising a detachable upper half (11) and a lower half (12), the inner wall surface of the hollow being spherical and made of a light-reflective material; a measurement hole (14) is provided on the upper half (11) for installing an instrument for optical performance testing, and an installation hole (13) is provided at the bottom of the lower half; A metal carrier platform (2) for placing a micro-optical device (3) to be tested, the upper end of which can be inserted into the cavity of the hollow structure (1) through the installation hole (13), and a first insulating member (131) surrounding the circumferential side surface of the metal carrier platform (2) is provided on the hole wall of the installation hole (13); A first wire (4) connected to the metal carrier platform (2) for supplying power to the first electrode of the micro-optical device (3) through the metal carrier platform (2); A metal frame (5), the two ends of which are installed on the side walls of the lower half (12), a second insulating member (121) is provided between the installation parts of the two, and the bottom side thereof can abut against the second electrode of the micro-optical device (3); A second wire (6) passes from the outside of the hollow structure (1) into it and is connected to the metal frame (5) for supplying power to the second electrode through the metal frame (5).

2. The device for testing the optical performance of a micro-optical device according to claim 1, wherein: It further includes a displacement adjustment mechanism (7) located outside the hollow structure (1) and connected to the lower end of the metal carrier platform (2) for adjusting the position of the upper end of the metal carrier platform (2) inserted into the hollow structure (1).

3. The device for testing the optical performance of a micro-optical device according to claim 1 or 2, characterized in that: It further includes a support rod (8), one end of which is detachably connected to the outer wall of the lower half (12), and the other end is for fixing.

4. The device for testing the optical performance of a micro-optical device according to claim 1, characterized in that: The metal frame (5) includes a cross beam (51) and a protrusion (52) provided on the bottom side of the cross beam (51), the two ends of the cross beam (51) are installed on the side walls of the lower half (12), and the protrusion (52) can abut against the second electrode of the micro-optical device (3) for supplying power to the second electrode.

5. The device for testing the optical performance of a micro-optical device according to claim 4, characterized in that: A through hole (53) leading from the top side to the bottom side is provided on the cross beam (51) and passes through the protrusion (52), the through hole (53) can be used for inserting a first probe (91) so that the first probe (91) abuts against the second electrode of the micro-optical device (3), and the first probe (91) is fixed by dispensing glue into the through hole (53), and the first probe (91) is also connected to a third wire (10) for supplying power to the second electrode.

6. The device for testing the optical performance of a micro-optical device according to claim 1, characterized in that: A probe jack (18) is provided on the outer wall of the upper half (11) for inserting a second probe (92) so that the second probe (92) abuts against the second electrode or the first electrode of the micro-optical device (3), and the second probe (92) is also connected to a fourth wire (20) for supplying power to the second electrode or the first electrode, and a third insulating member (181) surrounding the circumferential side surface of the second probe (18) is provided on the hole wall of the probe jack (18).

7. The device for testing the optical performance of a micro-optical device according to claim 1, characterized in that: It further includes a light-shielding member (132), when the upper end of the metal carrier platform (2) is inserted into the cavity of the hollow structure (1), the light-shielding member (132) can cover the gap between the installation hole (13) and the side surface of the metal carrier platform (2).

8. The device for testing the optical performance of a micro-optical device according to claim 1, characterized in that: The diameter of the hollow cavity of the hollow structure (1) is 1 - 10 cm.

9. A system for testing the optical properties of diamond NV color centers, characterized in that, The system includes: a device for testing the optical performance of a micro-optical device as described in any one of claims 1-8, and the metal carrier stage (2) is further used for placing a diamond (40) containing NV centers to be tested; and further includes one of the following structures: Structure 1: Further includes a laser chip die (30) placed on the metal carrier stage (2), and powers the laser chip die (30) by supplying power to the micro-optical device; Structure 2: Further includes an optical fiber (70), one end of the optical fiber (70) extends into the interior of the hollow structure (1), the end face faces the diamond (40) containing NV centers to be tested, and the other end is located outside the hollow structure (1), and the end face is used for accessing the laser.

10. The system for testing the optical properties of diamond NV centers according to claim 9, characterized in that: Further includes a filter (50), which is detachably installed in the measurement hole (14).

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