Test probe, probe card, and test probe manufacturing method

Abstract

The invention relates to the technical field of chip detection, in particular to a test probe, a probe card and a test probe manufacturing method. The test probe comprises a probe body, a plating layer is arranged outside the probe body, and the plating layer comprises at least two elements. Wherein in the thickness direction of the plating layer, the contents of at least two elements in the plating layer are continuously and linearly changed, so that the conduction coefficient and the deformation resistance coefficient of the plating layer are continuously and linearly changed in the thickness direction of the plating layer. According to the invention, all the elements influencing the conductivity coefficient and the deformation resistance coefficient exist in the same plating layer, that is, the elements are connected to form a whole, so that compared with two stacked alloy plating layers in the prior art, the plating layer is firmer, and the conductivity coefficient and the deformation resistance coefficient are greatly improved. The repeated bending deformation of the test probe does not cause the separation of the plating layer, thereby avoiding the reduction of the overall performance of the test probe.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and particularly to test probes, probe cards, and methods for manufacturing test probes. Background Art

[0002] Probes are important components for chip signal testing. Alloy plating layers for enhancing anti-deformation ability and alloy plating layers for enhancing conduction performance are usually provided on the outside of the probes, and these two alloy plating layers are sequentially arranged in a stacked manner.

[0003] When the probe conducts signal testing, to avoid poor contact of the probe, the substrate presses the probe against the surface of the object to be tested, and the pressure of the substrate causes the probe to bend and deform. Since the above two alloy plating layers on the outside of the probe are arranged in a stacked manner, the repeated bending deformation of the probe will cause separation between the two alloy plating layers, thereby reducing the overall performance of the probe. Summary of the Invention

[0004] The purpose of the present invention is to overcome the following technical problems: the two alloy plating layers on the outside of the probe are arranged in a stacked manner, and the repeated bending deformation of the probe will cause separation between the two alloy plating layers, thereby reducing the overall performance of the probe.

[0005] To achieve the above purpose, on the one hand, the present invention provides a test probe, which includes a probe body, and a plating layer is provided on the outside of the probe body. The plating layer contains at least two elements; wherein, in the thickness direction of the plating layer, the contents of at least two elements in the plating layer change continuously linearly, so that the conduction coefficient and anti-deformation coefficient of the plating layer change continuously linearly in the thickness direction of the plating layer.

[0006] In some embodiments, the plating layer contains two elements; wherein, in the thickness direction of the plating layer, the contents of the two elements in the plating layer change continuously linearly, so that the conduction coefficient and anti-deformation coefficient of the plating layer change continuously linearly in the thickness direction of the plating layer.

[0007] In some embodiments, the plating layer contains three elements; wherein, in the thickness direction of the plating layer, the contents of at least two elements in the plating layer change continuously linearly, so that the conduction coefficient and anti-deformation coefficient of the plating layer change continuously linearly in the thickness direction of the plating layer.

[0008] In some embodiments, the influence of each element contained in the plating layer on the conduction coefficient and / or anti-deformation coefficient is different.

[0009] In some embodiments, in the linear direction from the inner surface to the outer surface of the plating layer, the content of at least one element in the plating layer continuously linearly increases, and the content of at least one element in the plating layer continuously linearly decreases, so that one of the conductivity coefficient and the anti-deformation coefficient of the plating layer continuously linearly increases along this direction, and the other of the conductivity coefficient and the anti-deformation coefficient of the plating layer continuously linearly decreases along this direction.

[0010] In some embodiments, the plating layer fits on the outer surface of the probe body.

[0011] On the other hand, the present invention also provides a probe card, which includes a substrate and a plurality of the test probes of the above embodiments, and the plurality of test probes are spaced apart and installed at the bottom of the substrate.

[0012] On yet another aspect, the present invention also provides a method for manufacturing a test probe, which includes: performing an electroplating step on the probe body, and dynamically adjusting the electroplating conditions during the electroplating step to form a plating layer on the outside of the probe body; and in the thickness direction of the plating layer, the content of at least two elements in the plating layer continuously linearly changes, so that the conductivity coefficient and the anti-deformation coefficient of the plating layer continuously linearly change in the thickness direction of the plating layer.

[0013] In some embodiments, dynamically adjusting the electroplating conditions at least includes at least one of the following adjustment items: (Ⅰ) dynamically adjusting the current density of electroplating over time; (Ⅱ) dynamically adjusting the concentration of the chelating agent in the electroplating solution over time; (Ⅲ) dynamically adjusting the temperature of the electroplating solution over time; (Ⅳ) dynamically adjusting the pH value of the electroplating solution over time.

[0014] The above technical solutions of the present invention have the following technical effects:

[0015] A plating layer is provided on the outside of the probe body, and the plating layer contains at least two elements. In this plating layer, the content of at least two elements continuously linearly changes in its thickness direction, so that the conductivity coefficient and the anti-deformation coefficient of the plating layer continuously linearly change in its thickness direction, thereby enabling the plating layer to simultaneously optimize the conduction performance and the anti-deformation performance of the probe body. Moreover, all the elements that affect the conductivity coefficient and the anti-deformation coefficient exist in the same plating layer, that is, these elements are connected to form a whole. Compared with the two stacked alloy plating layers in the prior art, the plating layer of the present invention is more firm, and the repeated bending deformation of the test probe will not cause the plating layer itself to separate, thus avoiding the reduction of the overall performance of the test probe. Description of the Drawings

[0016] Figure 1 is a schematic diagram of a test probe in an embodiment of the present invention;

[0017] Figure 2Schematic diagram of the content change of the first element and the second element in an embodiment of the present invention;

[0018] Figure 3 Schematic diagram of the content change of the first element and the second element in another embodiment of the present invention;

[0019] Figure 4 Schematic diagram of the content change of the first element and the second element in yet another embodiment of the present invention.

[0020] Description of reference numerals

[0021] 1. Probe body; 2. Coating layer; 21. Inner surface of the coating layer; 22. Outer surface of the coating layer; 23. First element; 24. Second element. Detailed implementation manners

[0022] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present invention, rather than to limit the present invention. For those skilled in the art, the present invention can be implemented without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present invention by showing examples of the present invention.

[0023] As Figures 1 to 4 shown, the present invention provides a test probe on the one hand. The test probe includes a probe body 1, and a coating layer 2 is provided outside the probe body 1. The coating layer 2 contains at least two elements. Among them, in the thickness direction of the coating layer 2, the contents of at least two elements in the coating layer 2 change continuously and linearly, so that the conduction coefficient and anti-deformation coefficient of the coating layer 2 change continuously and linearly in the thickness direction of the coating layer 2.

[0024] Specifically, a coating layer 2 is provided outside the probe body 1, and the coating layer 2 contains at least two elements. In the coating layer 2, the contents of at least two elements change continuously and linearly in its thickness direction, so that the conduction coefficient and anti-deformation coefficient of the coating layer 2 change continuously and linearly in its thickness direction, thereby enabling the coating layer 2 to optimize the conduction performance and anti-deformation performance of the probe body 1 at the same time. Moreover, all the elements that affect the conduction coefficient and anti-deformation coefficient are present in the same coating layer 2, that is, these elements are connected to form a whole. Compared with the two stacked alloy coating layers in the prior art, the coating layer 2 of the present invention is more firm, and the repeated bending deformation of the test probe will not cause the coating layer 2 itself to separate, thereby avoiding the reduction of the overall performance of the test probe.

[0025] As Figures 2 to 4As shown, in some embodiments of the present invention, the plating layer 2 contains two elements; wherein, in the thickness direction of the plating layer 2, the contents of the two elements in the plating layer 2 vary continuously and linearly, so that the conduction coefficient and the anti-deformation coefficient of the plating layer 2 vary continuously and linearly in the thickness direction of the plating layer 2.

[0026] Specifically, the two elements that affect the conduction coefficient and the anti-deformation coefficient both exist in the same plating layer 2, that is, these two elements are connected to form a firm whole, enabling the plating layer 2 to optimize the conduction performance and the anti-deformation performance of the probe body 1 simultaneously, for example, being able to optimize the heat conduction performance, magnetic conduction performance, electrical conduction performance, hardness performance, strength performance, etc. simultaneously.

[0027] For example, in some embodiments, as Figures 2 to 4 shown, the plating layer 2 contains two elements. The first element 23 is cobalt, and the second element 24 is nickel. In the thickness direction of the plating layer 2, the content of cobalt varies continuously and linearly, so that the anti-deformation coefficient of the plating layer 2 varies continuously and linearly in the thickness direction of the plating layer 2; the content of nickel varies continuously and linearly, so that the conduction coefficient of the plating layer 2 varies continuously and linearly in the thickness direction of the plating layer 2. Of course, the plating layer 2 can also be composed of two other elements, such as copper and chromium, which is not limited in the present invention.

[0028] In some embodiments of the present invention, the plating layer 2 contains three elements. Among them, in the thickness direction of the plating layer 2, the contents of at least two elements in the plating layer 2 vary continuously and linearly, so that the conduction coefficient and the anti-deformation coefficient of the plating layer 2 vary continuously and linearly in the thickness direction of the plating layer 2.

[0029] Specifically, among these three elements, two or three elements can affect the conduction coefficient and the anti-deformation coefficient. Similarly, all the elements that affect the conduction coefficient and the anti-deformation coefficient exist in the same plating layer 2, that is, these two elements are connected to form a firm whole, enabling the plating layer 2 to optimize the conduction performance and the anti-deformation performance of the probe body 1 simultaneously, for example, being able to optimize the heat conduction performance, magnetic conduction performance, electrical conduction performance, hardness performance, strength performance, etc. simultaneously.

[0030] For example, in some embodiments, as Figure 2As shown, the coating layer 2 contains three elements. The first element 23 is cobalt, the second element 24 is nickel, and the third element is iron. In the thickness direction of the coating layer 2, the content of cobalt element changes continuously and linearly, so that the anti-deformation coefficient of the coating layer 2 changes continuously and linearly in the thickness direction of the coating layer 2; at the same time, the content of nickel element changes continuously and linearly, so that the conductivity coefficient of the coating layer 2 changes continuously and linearly in the thickness direction of the coating layer 2; and the content of iron element can change continuously and linearly or remain unchanged. Of course, the coating layer 2 can also contain three other elements, such as palladium, silver, and copper, which are not limited in the present invention.

[0031] In some embodiments of the present invention, the influence of each element contained in the coating layer on the conductivity coefficient and / or the anti-deformation coefficient is different.

[0032] Specifically, each element in the coating layer can affect the conductivity coefficient and / or the anti-deformation coefficient. For example, a certain element can affect the conductivity coefficient or the anti-deformation coefficient, or a certain element can affect both the conductivity coefficient and the anti-deformation coefficient at the same time. And as the content of the element changes, the influence of the element on the conductivity coefficient and / or the anti-deformation coefficient also changes. Finally, under the comprehensive influence of various elements, the conductivity coefficient and the anti-deformation coefficient of the coating layer 2 change continuously and linearly in the thickness direction of the coating layer 2, so that the coating layer 2 can optimize the conductivity performance and the anti-deformation performance of the probe body 1 at the same time, for example, can optimize the heat conduction performance, the magnetic conduction performance, the electrical conduction performance, the hardness performance, and the strength performance, etc.

[0033] For example, in some embodiments, the coating layer 2 contains cobalt and nickel. Cobalt mainly affects the anti-deformation coefficient, and thus affects the hardness performance and the strength performance, etc. Nickel mainly affects the conductivity coefficient, and thus affects the heat conduction performance, the magnetic conduction performance, and the electrical conduction performance, etc.

[0034] As Figure 2 shown, in some embodiments of the present invention, in the linear direction from the inner surface to the outer surface of the coating layer 2, the content of the first element 23 in the coating layer 2 increases continuously and linearly, and the content of the second element 24 in the coating layer 2 decreases continuously and linearly, so that one of the conductivity coefficient and the anti-deformation coefficient of the coating layer 2 increases continuously and linearly along this direction, and the other of the conductivity coefficient and the anti-deformation coefficient of the coating layer 2 decreases continuously and linearly along this direction.

[0035] Specifically, the plating layer 2 may contain two, three or more than three elements. All the elements that affect the conductivity coefficient and the anti-deformation coefficient are present in the same plating layer 2, that is, these elements are connected to form a firm whole, enabling the plating layer 2 to optimize the conduction performance and anti-deformation performance of the probe body 1 simultaneously. For example, it can optimize the thermal conductivity, magnetic conductivity, electrical conductivity, hardness performance, strength performance, etc. at the same time. Moreover, the content of at least one element increases linearly continuously, and the content of at least one element decreases linearly continuously. Therefore, the change trend of the content of the main constituent elements in the plating layer 2 is relatively stable, and the plating layer 2 as a whole is a single-layer structure, which helps to make the plating layer 2 more stable and firm.

[0036] For example, in some embodiments, as Figure 2 shown, the plating layer 2 contains three elements. The first element 23 is cobalt, the second element 24 is nickel, and the third element is iron. Define the inner surface of the plating layer 2 as the inner surface of the plating layer 21, and define the outer surface of the plating layer 2 as the outer surface of the plating layer 22. In the linear direction from the inner surface of the plating layer 21 to the outer surface of the plating layer 22, the content of cobalt element increases linearly, so that the anti-deformation coefficient of the plating layer 2 increases linearly continuously; the content of nickel element decreases linearly, so that the conductivity coefficient of the plating layer 2 decreases linearly continuously; the iron element can remain stable, increase linearly continuously or decrease linearly continuously.

[0037] In other embodiments, as Figure 3 shown, in the linear direction from the inner surface of the plating layer 21 to the outer surface of the plating layer 22, the content of at least one element first decreases and then increases, and its change trend is generally a continuous curve with an upward opening; the content of at least one element first increases and then decreases, and its change trend is generally a continuous curve with a downward opening. For example, as Figure 3 shown, the change trend of the content of the first element 23 is a continuous curve with an upward opening, and the change trend of the content of the second element 24 is a continuous curve with a downward opening. Of course, in these embodiments, the plating layer 2 may also contain two, three or more than three elements.

[0038] Of course, the change trend of the content of the elements in the plating layer 2 may also be other forms, which are not limited in the present invention. For example, as Figure 4 shown, it may also be a continuous curve approximately similar to the image of an exponential function.

[0039] In some embodiments of the present invention, the materials selected for the plating layer 2 include at least one of gold (Au), silver (Ag), copper (Cu), nickel (Ni), chromium (Cr), platinum (Pt), palladium (Pd), iron (Fe), tantalum (Ta), zirconium (Zr), aluminum (Al), rhodium (Rh), molybdenum (Mo), titanium (Ti), ruthenium (Ru), cobalt (Co), zinc (Zn), tungsten carbide (WC), diamond-like carbon (DLC), and titanium nitride (TiN). Of course, other materials can also be selected, and the present invention is not limited thereto.

[0040] In some embodiments, the various materials in the plating layer 2 can exist in the form of simple substances, and the material of the plating layer 2 is a mixture material composed of at least two simple substances. For example, a mixture material formed by mixing nickel metal material and cobalt metal material.

[0041] In some other embodiments, the various elements in the plating layer 2 can exist in the form of a solid solution alloy or an intermetallic compound alloy, that is, the material of the plating layer 2 is an alloy material composed of at least two elements. For example, nickel-cobalt alloy material (Ni-Co), nickel-boron alloy (Ni-B), platinum-nickel alloy material (Pt-Ni), copper-silver alloy material (Cu-Ag), palladium-silver-copper alloy material (Pd-Ag-Cu), or phosphorus-palladium alloy material (Pd-P), etc.

[0042] As Figure 1 shown, in some embodiments of the present invention, the plating layer 2 is attached to the outer surface of the probe body 1 so that the plating layer 2 is firmly connected to the probe body 1. For example, the plating layer 2 can be formed on the outer surface of the probe body 1 by an electroplating process.

[0043] In some embodiments, the entire outer surface of the probe body 1 is wrapped by the plating layer 2. In some other embodiments, only the outer surface of the middle and lower parts of the probe body 1 is entirely wrapped by the plating layer 2.

[0044] In some embodiments, when a cross-section is taken in a direction perpendicular to the length direction of the probe body 1, the cross-section of the probe body 1 is circular, and the cross-section of the plating layer 2 is annular; alternatively, the cross-section of the probe body 1 is rectangular, and the cross-section of the plating layer 2 is square-annular. Of course, the cross-sections of the probe body 1 and the plating layer 2 can also be other shapes, and the present invention is not limited thereto.

[0045] On the other hand, the present invention also provides a probe card, which includes a substrate and a plurality of test probes as described in the above embodiments. The plurality of test probes are spaced apart and installed at the bottom of the substrate.

[0046] Specifically, since the probe card of the present invention adopts the test probes of the above embodiments, it can also achieve the above technical effects.

[0047] In some embodiments, the plating layer 2 of the present invention can also be plated on the interface of other plating layers or coatings. Similarly, there will be no peeling between various elements in the plating layer 2 of the present invention. In some embodiments, the other plating layers or coatings can be other conductors or insulating layers.

[0048] On the other hand, the present invention also provides a method for manufacturing a test probe, which includes: performing an electroplating step on the probe body 1, and dynamically adjusting the electroplating conditions during the electroplating step to form a plating layer 2 on the outside of the probe body 1; and in the thickness direction of the plating layer 2, the contents of at least two elements in the plating layer 2 change continuously and linearly, so that the conduction coefficient and anti-deformation coefficient of the plating layer 2 change continuously and linearly in the thickness direction of the plating layer 2.

[0049] Specifically, by dynamically adjusting the electroplating conditions during the electroplating step, a plating layer 2 containing at least two elements is formed on the outside of the probe body 1. In this plating layer 2, the contents of at least two elements change continuously and linearly in its thickness direction, so that the conduction coefficient and anti-deformation coefficient of the plating layer 2 change continuously and linearly in its thickness direction, thereby enabling the plating layer 2 to optimize the conduction performance and anti-deformation performance of the probe body 1 at the same time, such as optimizing the heat conduction performance, magnetic conduction performance, electrical conduction performance, hardness performance, and strength performance, etc. at the same time. Moreover, all the elements that affect the conduction coefficient and anti-deformation coefficient exist in the same plating layer 2, that is, these elements are connected to form a whole. Compared with the two stacked alloy plating layers 2 in the prior art, the plating layer 2 of the present invention is more firm, and the repeated bending deformation of the test probe will not cause the separation of the plating layer 2 itself, thus avoiding the reduction of the overall performance of the test probe.

[0050] In some embodiments of the present invention, dynamically adjusting the electroplating conditions at least includes at least one of the following adjustment items: (Ⅰ) dynamically adjusting the current density (ASD) of electroplating over time; (Ⅱ) dynamically adjusting the concentration of the complexing agent in the electroplating solution over time; (Ⅲ) dynamically adjusting the temperature of the electroplating solution over time; (Ⅳ) dynamically adjusting the pH value of the electroplating solution over time.

[0051] Specifically, by adjusting at least one of the above items, the plating amounts of at least two elements plated on the probe body 1 can change continuously and linearly. Therefore, after the plating layer 2 is formed, the contents of at least two elements change continuously and linearly in its thickness direction.

[0052] In some embodiments, the electroplating material can be selected from at least one of gold (Au), silver (Ag), copper (Cu), nickel (Ni), chromium (Cr), platinum (Pt), palladium (Pd), iron (Fe), tantalum (Ta), zirconium (Zr), aluminum (Al), rhodium (Rh), molybdenum (Mo), titanium (Ti), ruthenium (Ru), cobalt (Co), zinc (Zn), tungsten carbide (WC), diamond-like carbon (DLC), and titanium nitride (TiN). Of course, other materials can also be selected as the electroplating material, and the present invention does not make any limitations.

[0053] In this article, specific examples are used to elaborate on the principles and implementation manners of the present invention. The description of the above examples is only used to help understand the method and its core idea of the present invention. The above are only the preferred implementation manners of the present invention. It should be noted that due to the limited nature of written expression and the objectively infinite specific structures, for those of ordinary skill in the art in this technical field, without departing from the principle of the present invention, several improvements, refinements, or changes can be made, or the above technical features can be combined in an appropriate manner; these improvements, refinements, changes, or combinations, or directly applying the concept and technical solution of the present invention to other occasions without improvement, shall all be regarded as the protection scope of the present invention.

Claims

1. A test probe, characterized in that, It includes a probe body (1), and a plating layer (2) is provided on the outer part of the probe body (1), and the plating layer (2) contains at least two elements; Wherein, in the thickness direction of the plating layer (2), the contents of at least two elements in the plating layer (2) change continuously and linearly, so that the conductivity coefficient and the anti-deformation coefficient of the plating layer (2) change continuously and linearly in the thickness direction of the plating layer (2).

2. The test probe according to claim 1, wherein The plating layer (2) contains two elements; wherein, in the thickness direction of the plating layer (2), the contents of the two elements in the plating layer (2) change continuously and linearly, so that the conductivity coefficient and the anti-deformation coefficient of the plating layer (2) change continuously and linearly in the thickness direction of the plating layer (2).

3. The test probe according to claim 1, characterized in that The plating layer (2) contains three elements; wherein, in the thickness direction of the plating layer (2), the contents of at least two elements in the plating layer (2) change continuously and linearly, so that the conductivity coefficient and the anti-deformation coefficient of the plating layer (2) change continuously and linearly in the thickness direction of the plating layer (2).

4. The test probe according to claim 1, wherein, The influence of each element contained in the plating layer (2) on the conductivity coefficient and / or the anti-deformation coefficient is different.

5. The test probe according to claim 1, wherein, In the linear direction from the inner surface to the outer surface of the plating layer (2), the content of the first element in the plating layer (2) increases continuously and linearly, and the content of the second element in the plating layer (2) decreases continuously and linearly, so that one of the conductivity coefficient and the anti-deformation coefficient of the plating layer (2) increases continuously and linearly along this direction, and the other of the conductivity coefficient and the anti-deformation coefficient of the plating layer (2) decreases continuously and linearly along this direction.

6. The test probe according to claim 1, wherein The plating layer (2) is attached to the outer surface of the probe body (1).

7. A probe card, characterized in that, It includes a substrate and a plurality of test probes as described in any one of claims 1-6, and the plurality of test probes are spaced and installed at the bottom of the substrate.

8. A method for manufacturing a test probe, characterized in that, It includes: Performing an electroplating step on the probe body (1), and dynamically adjusting the electroplating conditions in the electroplating step to form a plating layer (2) on the outer part of the probe body (1); and in the thickness direction of the plating layer (2), the contents of at least two elements in the plating layer (2) change continuously and linearly, so that the conductivity coefficient and the anti-deformation coefficient of the plating layer (2) change continuously and linearly in the thickness direction of the plating layer (2).

9. The test probe according to claim 8, wherein The dynamic adjustment of the electroplating conditions at least includes at least one of the following adjustment items: (Ⅰ) Dynamically adjusting the current density of electroplating with time; (Ⅱ) Dynamically adjusting the concentration of the complexing agent in the electroplating solution with time; (Ⅲ) Dynamically adjusting the temperature of the electroplating solution with time; (Ⅳ) Dynamically adjusting the pH value of the electroplating solution with time.

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