Optical waveguide array manufacturing method and glue pouring system

Abstract

The invention provides an optical waveguide array manufacturing method, which comprises the steps that a plurality of waveguide master slices are provided, and each waveguide master slice comprises a transparent substrate and a reflecting film arranged on at least one surface of the transparent substrate; a separating layer is arranged on the reflecting film of each waveguide master slice; sequentially laminating the plurality of waveguide master slices to form a laminated body, wherein two adjacent waveguide master slices are separated by the separation layer to form a glue pouring seam; communicating vessel structures are built at the two opposite ends of the stacked body respectively, and the two communicating vessels communicate with each other through the glue pouring seams; adhesive glue is added into each communicating vessel until each glue pouring seam is completely filled with the adhesive glue; curing the adhesive glue; and cutting the bonded laminated body along a direction perpendicular to the transparent substrate to obtain a plurality of optical waveguide arrays. The invention further provides a glue filling system.

Description

Technical Field

[0001] The present application relates to a method for manufacturing an optical waveguide array and a glue filling system used in this method. Background Art

[0002] In current optical waveguide arrays, multiple plate-shaped optical waveguide precursors are usually bonded to form a laminate, and then the optical waveguide array is obtained by cutting. Vacuum glue filling technology is usually used to bond between multiple optical waveguide precursors. However, vacuum glue filling requires placing the laminated optical waveguide precursors in a vacuum chamber or sealing them, which increases the complexity of the process and has a high operation difficulty. Moreover, the cost of vacuum injection equipment is high, reducing the economic applicability of the production process. In addition, the glass glue used in the sealing operation is prone to oil seepage under heating conditions, thus affecting the optical performance of the optical waveguide and the curing effect of the adhesive, resulting in many internal defects (such as bubbles, impurities, cracks, etc.) in the negative refractive flat lens, and further leading to low imaging quality and affecting the user experience. Summary of the Invention

[0003] On the one hand, the present application provides a method for manufacturing an optical waveguide array, including:

[0004] providing a plurality of waveguide mother sheets, each of the waveguide mother sheets including a transparent substrate and a reflective film provided on at least one surface of the transparent substrate;

[0005] providing a separation layer on the reflective film of each of the waveguide mother sheets;

[0006] stacking the plurality of waveguide mother sheets in sequence to form a laminate, and adjacent two of the waveguide mother sheets are separated by the separation layer to form a glue filling seam;

[0007] building a communicating structure at opposite ends of the laminate respectively, and the two communicating structures are communicated with each other through each of the glue filling seams;

[0008] adding an adhesive to each of the communicating structures respectively until the adhesive completely fills each of the glue filling seams;

[0009] curing the adhesive;

[0010] cutting the bonded laminate along a direction perpendicular to the transparent substrate to obtain a plurality of optical waveguide arrays.

[0011] The method for manufacturing an optical waveguide array provided by this application stacks multiple waveguide mother wafers into a laminate. A glue injection seam is formed between two adjacent waveguide mother wafers, and a connector structure is built at both ends of the laminate, so that the two connectors are connected through each glue injection seam, which is conducive to injecting glue into the laminate using the principle of the connector, enabling the adhesive to flow into each glue injection seam, thereby realizing the adhesion of multiple waveguide mother wafers. The process of this method for manufacturing an optical waveguide array is simple. Compared with vacuum glue injection, it is conducive to cost reduction. And since vacuum sealing is not required, the adhesion process will not be interfered by the sealant, which is conducive to improving the adhesion effect of the adhesive and ensuring the imaging quality of the optical waveguide array.

[0012] In one embodiment, the thickness difference between multiple transparent substrates is less than 3 μm, and the flatness deviation is less than 2 μm.

[0013] In one embodiment, the step of providing multiple waveguide mother wafers includes: depositing the reflective film on one surface of each transparent substrate; or depositing the reflective film on both surfaces of each transparent substrate.

[0014] In one embodiment, the step of setting a separation layer on the reflective film of each waveguide mother wafer specifically includes: arranging a plurality of columnar spacers on the surface of the reflective film, the height of each spacer is 1 μm - 100 μm, the width of each spacer is 50 μm - 200 μm, and the distance between two adjacent spacers is 100 μm - 5000 μm.

[0015] In one embodiment, the step of setting a separation layer on the reflective film of each waveguide mother wafer specifically includes: setting a plurality of spacers on the surface of the reflective film by one of photolithographic exposure, screen printing, inkjet printing, nanoimprinting, ultraviolet curing transfer printing, laser etching, or electrostatic spraying curing.

[0016] In one embodiment, the step of sequentially stacking the multiple waveguide mother wafers to form a laminate, and separating two adjacent waveguide mother wafers by the separation layer to form a glue injection seam includes: setting the level tolerance between each waveguide mother wafer in the laminate to be less than or equal to 2 μm.

[0017] In one embodiment, the viscosity of the adhesive is less than 1000 Pa·s, and the curing temperature is 70°C - 200°C.

[0018] In one embodiment, communicating vessel structures are respectively built at opposite ends of the laminate. The step that the two communicating vessels communicate with each other through each glue injection seam specifically includes: providing a communicating groove, the communicating groove including a bottom groove and two glue injection grooves, the two glue injection grooves respectively communicating with one end of the bottom groove; providing a bottom baffle and two side baffles, covering the bottom baffle on the bottom groove, and movably arranging the two side baffles on the opening sides of the glue injection grooves, such that the two glue injection grooves communicate through the bottom groove; placing the laminate on the bottom baffle, and aligning both ends of each glue injection seam with the two side baffles respectively.

[0019] In one embodiment, the step of respectively adding adhesive into each communicating vessel until the adhesive completely fills each glue injection seam specifically includes: injecting the adhesive into the two glue injection grooves until the communicating groove is filled with the adhesive; removing the two side baffles, such that the adhesive in the glue injection grooves flows into each glue injection seam; continuously injecting the adhesive until the adhesive completely fills each glue injection seam.

[0020] In one embodiment, the step that communicating vessel structures are respectively built at opposite ends of the laminate and the two communicating vessels communicate with each other through each glue injection seam specifically includes: providing a carrying device, the carrying device including a bottom plate and side plates arranged at both ends of the bottom plate; placing the laminate on the bottom plate, glue injection gaps being respectively formed between the laminate and the two side plates, and both ends of each glue injection seam being respectively aligned with the two side plates; respectively arranging sealing films on the waveguide female chips at both ends of the laminate to seal the laminate and the carrying device.

[0021] In one embodiment, the step of respectively adding adhesive into each communicating vessel until the adhesive completely fills each glue injection seam specifically includes: injecting the adhesive into the two glue injection gaps respectively.

[0022] In one embodiment, the width of the glue injection gap is 1 cm - 5 cm.

[0023] The second aspect of the present application provides a glue injection system, including:

[0024] A communicating groove, the communicating groove including a bottom groove and two glue injection grooves, the two glue injection grooves respectively communicating with one end of the bottom groove;

[0025] A bottom baffle, arranged on the bottom groove;

[0026] Two side baffles, respectively movably arranged on the opening sides of the glue injection grooves; and

[0027] The laminate is disposed on the bottom baffle. The laminate includes a plurality of waveguide mother sheets stacked on top of each other. A potting seam is formed between two adjacent waveguide mother sheets, and both ends of the potting seam respectively correspond to one of the side baffles.

[0028] The third aspect of the present application provides a potting system, including:

[0029] A carrying device, including a bottom plate and side plates disposed at both ends of the bottom plate;

[0030] A laminate, disposed on the bottom plate. The laminate includes a plurality of waveguide mother sheets stacked on top of each other. A potting seam is formed between two adjacent waveguide mother sheets, and both ends of the potting seam respectively correspond to one of the side plates; and

[0031] A plurality of sealing films, which are respectively disposed between two waveguide mother sheets at both ends of the laminate and the carrying device. Description of the Drawings

[0032] Figure 1 It is a flowchart of a method for manufacturing an optical waveguide array in an embodiment of the present application.

[0033] Figure 2 It is Figure 1 The structural flowchart of steps S1 to S3 in

[0034] Figure 3 It is Figure 2 A partially enlarged schematic diagram of the intermediate layer.

[0035] Figure 4 It is an exploded structural schematic diagram of a communication groove in an embodiment of the present application.

[0036] Figure 5 It is a structural schematic diagram of a potting system in an embodiment of the present application.

[0037] Figure 6 It is a structural schematic diagram of a potting system in another embodiment of the present application.

[0038] Figure 7 It is Figure 1 The structural flowchart of step S7 in

[0039] Description of the Main Component Symbols

[0040] Steps S1, S2, S3, S4, S5, S6, S7

[0041] Laminate 100

[0042] Waveguide mother sheet 10

[0043] Transparent substrate 11

[0044] Reflection film 13

[0045] Separator layer 50

[0046] Spacer 51

[0047] Glue injection seam 60

[0048] Glue injection systems 200, 300

[0049] Communication groove 210

[0050] Bottom groove 211

[0051] Glue injection groove 213

[0052] Bottom baffle 215

[0053] Side baffle 217

[0054] Carrying device 310

[0055] Bottom plate 311

[0056] Side plate 313

[0057] Glue injection gap 314

[0058] Sealing film 315

[0059] Adhesive 80

[0060] Syringe 90

[0061] Optical waveguide array 400

[0062] Height a

[0063] Width b

[0064] Spacings c, d

[0065] The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings. Specific embodiments

[0066] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0067] Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application.

[0068] To further elaborate on the technical means and effects adopted by this application to achieve the intended purpose, the following provides a detailed description of this application in conjunction with the accompanying drawings and preferred embodiments.

[0069] Please refer to Figure 1 , the method for manufacturing an optical waveguide array provided by an embodiment of this application includes:

[0070] Step S1: Provide a plurality of waveguide mother wafers, each of the waveguide mother wafers including a transparent substrate and a reflective film disposed on at least one surface of the transparent substrate;

[0071] Step S2: Dispose a separation layer on the reflective film of each of the waveguide mother wafers;

[0072] Step S3: Stack the plurality of waveguide mother wafers in sequence to form a stacked body, and adjacent two of the waveguide mother wafers are separated by the separation layer to form a glue injection seam;

[0073] Step S4: Build a communicating structure at opposite ends of the stacked body respectively, and the two communicating structures communicate with each other through each of the glue injection seams;

[0074] Step S5: Add adhesive to each of the communicating structures respectively until the adhesive completely fills each of the glue injection seams;

[0075] Step S6: Cure the adhesive;

[0076] Step S7: Cut the glued stacked body in a direction perpendicular to the transparent substrate to obtain a plurality of optical waveguide arrays.

[0077] Specifically, please refer to Figure 2 , in Step S1, the transparent substrate 11 is a transparent plate, such as transparent materials like glass, resin, plastic (such as polycarbonate or acrylic, etc.). The thickness of the transparent substrate 11 can be 0.1 mm - 5 mm.

[0078] The thickness difference between multiple transparent substrates 11 is less than 33 μm, and the flatness deviation is less than 2 μm. Specifically, the optical waveguide array includes a plurality of optical waveguides arranged in parallel and a reflective layer disposed between adjacent two optical waveguides. The reflective layer is plated on the surface of the optical waveguide and is used to reflect light in the same direction. The optical waveguides are cut from the waveguide mother wafer 10. Therefore, by setting the thickness difference and flatness deviation between multiple transparent substrates 11, the thickness difference and flatness deviation between multiple waveguide mother wafers 10 can be controlled, which is beneficial to ensuring the consistent dimensions between multiple optical waveguides, and further ensuring that multiple reflective surfaces are parallel and arranged at equal intervals, which is beneficial to ensuring the imaging effect of the optical waveguide.

[0079] In this embodiment, step S1 specifically includes: depositing a reflective film 13 on both sides of each transparent substrate 11. In other embodiments, step S1 may also be to deposit a reflective film 13 on only one side of each transparent substrate 11, and the present application does not limit this.

[0080] The thickness of the reflective film 13 is 1 μm - 300 μm. The reflective film 13 may specifically be a metal reflective film such as aluminum, silver, copper, gold, chromium, platinum, etc., or a metal-dielectric reflective film which is one or a combination of two of all-dielectric reflective films such as silicon monoxide, magnesium fluoride, silicon dioxide, aluminum oxide, etc. The reflective film 13 can be deposited on the transparent substrate 11 by one or more of the processes such as vacuum evaporation, magnetron sputtering, ion plating, chemical vapor deposition, sol-gel method, photolithography, etc., and the present application does not limit this.

[0081] In other embodiments, after depositing the reflective film 13 on the transparent substrate 11, an inorganic material protective film layer or a polymer material antireflection film layer may also be deposited on the surface of the reflective film 13, so as to play a role in protection or enhancing transmission.

[0082] Please refer to Figure 2 and Figure 3 , step S2 includes arranging a plurality of columnar spacers 51 at intervals on the surface of the reflective film 13. The height a of each spacer 51 is 1 μm - 100 μm, the width b of each spacer 51 is 50 μm - 200 μm, and the distance c between two adjacent spacers 51 is 100 μm - 5000 μm. Specifically, the spacer layer 50 is composed of a plurality of spacers 51 arranged at intervals. The spacer 51 is a columnar structure with a flat top, and is used to abut against the two waveguide mother chips 10 when the two waveguide mother chips 10 are stacked, so that the two waveguide mother chips 10 will not be completely attached when stacked. A glue injection seam 60 is formed between the plurality of spacers 51. After the two waveguide mother chips 10 are separated by the plurality of spacers 51, the adhesive can flow into the space between the two waveguide mother chips 10 through the glue injection seam 60, so as to bond the two waveguide mother chips 10 together. When the viscosity of the adhesive is relatively large, the height a of the spacer 51 can be set larger, so as to facilitate the adhesive to flow into the glue injection seam 60. When the viscosity of the adhesive is relatively small, the height a of the spacer 51 can be set smaller, so that the waveguide mother chips 10 are stacked compactly.

[0083] The spacer 51 can be arranged on the reflective film 13 by one of the methods such as photolithographic exposure, screen printing, inkjet printing, nanoimprinting, ultraviolet curing transfer printing, laser etching or electrostatic spraying curing. According to different setting processes, the spacer 51 can also be made of different materials, and the present application does not limit this.

[0084] When the spacers 51 are set by means of photolithographic exposure, screen printing, inkjet printing, nanoimprinting, ultraviolet curing transfer printing, or laser etching, the spacers 51 can be set at equal intervals. If the spacing c between the spacers 51 is too large, the waveguide master wafer 10 is likely to be deformed, and then the optical waveguide is deformed, affecting the imaging effect. If the spacing between the spacers 51 is too small, the overall volume of the glue filling seam 60 will become smaller, and then the amount of adhesive filled between the two waveguide master wafers 10 will become smaller, reducing the bonding strength.

[0085] When the spacers 51 are set by means of an electrostatic spraying and curing process, spherical particles with a size of 1 μm - 20 μm can be selected and set on the reflective film 13 by electrostatic spraying, and then fixed on the surface of the reflective film 13 by heating and curing. During the electrostatic spraying process, the spacing between the spacers 51 can be controlled by controlling the density of the sprayed spacers 51, so as to achieve the effect of approximately equal-spacing setting of the spacers 51.

[0086] The spacers 51 can be set to black or other dark colors to avoid affecting the imaging of the optical waveguide array. Specifically, the optical waveguide array is used to reflect light. When the spacers 51 are set to white or other colors, when light passes through the optical waveguide array, the color of the spacers 51 themselves will be mixed into the light, thus changing the color of the light and affecting the final imaging effect.

[0087] Please continue to refer to Figure 2 In step S3, the flatness tolerance between each waveguide master wafer 10 in the stacked body 100 is set to be less than or equal to 2 μm. Specifically, since the optical waveguide array requires parallel arrangement of multiple optical waveguides, it is necessary to ensure the flatness tolerance between multiple waveguide master wafers 10 when stacking multiple waveguide master wafers 10.

[0088] During the process of setting the stacked body 100, when the reflective film 13 and the separation layer 50 are provided on only one side of each transparent substrate 11, multiple waveguide master wafers 10 need to be arranged in the same direction, so that the side of each waveguide master wafer 10 provided with the reflective film 13 is attached to the side of another waveguide master wafer 10 not provided with the reflective film 13. When the reflective film 13 is provided on both sides of each transparent substrate 11, the arrangement direction of the multiple waveguide master wafers 10 is not limited.

[0089] In this embodiment, please refer to Figure 4 and Figure 5 , step S4 specifically includes:

[0090] Step S411: Provide a communication groove 210, the communication groove 210 includes a bottom groove 211 and two glue filling grooves 213, and the two glue filling grooves 213 are respectively communicated with one end of the bottom groove 211;

[0091] Step S412: Provide a bottom baffle 215 and two side baffles 217. Cover the bottom baffle 215 on the bottom groove 217, and movably arrange the two side baffles 217 on the opening side of the glue injection groove 213, so that the two glue injection grooves 213 are communicated through the bottom groove 211;

[0092] Step S413: Place the laminate 100 on the bottom baffle 215, and align both ends of each glue injection seam 60 with the two side baffles 217 respectively.

[0093] Specifically, the communication groove 210 is a U-shaped groove structure, including a bottom groove 211 at the bottom and two glue injection grooves 213 at both ends. The opening of the bottom groove 211 faces the direction of the two glue injection grooves 213, and the openings of the two glue injection grooves 213 are arranged opposite to each other. The bottom baffle 215 is used to cover the opening of the bottom groove 211, and the side baffle 217 is used to movably cover the opening of the glue injection groove 213. When the bottom baffle 215 and the side baffle 217 are both arranged on the communication groove 210, the communication groove 210 forms a communicating vessel structure. That is, when injecting liquid into one glue injection groove 213, since the two glue injection grooves 213 are communicated through the bottom groove 211, the liquid will flow into the other glue injection groove 213 under the action of atmospheric pressure, and the liquid levels in the two glue injection grooves 213 are the same.

[0094] Step S413 specifically is: Place the laminate 100 on the bottom baffle 215, so that three of the four surfaces formed by overlapping multiple waveguide female chips 10 respectively correspond to the bottom baffle 215 and the two side baffles 217. Thus, one side baffle 217 can be communicated with the other side baffle 217 through each glue injection seam 60.

[0095] Step S413 further includes: Seal the two waveguide female chips 10 at both ends of the laminate 100 with the communication groove 210 respectively, so that the laminate 100 and the communication groove 210 together form a groove structure with an open top.

[0096] In this embodiment, step S5 specifically is:

[0097] Step S511: Inject the adhesive into the glue injection groove until the communication groove is filled with the adhesive;

[0098] Step S512: Remove the two side baffles, so that the adhesive in the glue injection groove flows into each glue injection seam;

[0099] Step S513: Continue to inject the adhesive until each glue injection seam is completely filled with the adhesive.

[0100] Specifically, in step S511, injecting the adhesive 80 into the glue injection tank 213 can be to inject the adhesive 80 into only one glue injection tank 213, or to inject the adhesive 80 into two glue injection tanks 213 simultaneously. This embodiment does not limit this.

[0101] Injecting the adhesive 80 can be carried out by injecting with a syringe 90, or by directly pouring. When injecting the adhesive 80, it is necessary to maintain continuity and uniformity to avoid air entrainment.

[0102] In step S512, after removing the side baffle 217, a communicating vessel structure is formed between the glue injection tank 213 and the glue injection seam 60. Therefore, under the action of atmospheric pressure, the adhesive 80 in the glue injection tank 213 begins to flow into the glue injection seam 60, thereby starting to fill the glue injection seam 60. Specifically, the adhesive 80 first flows from both sides of the glue injection seam 60 towards the middle position, and then starts to flow upward under the action of atmospheric pressure until the liquid level of the adhesive 80 in the glue injection seam 60 is flush with the liquid level in the glue injection tank 213.

[0103] In step S513, continuously injecting the adhesive 80 can be to inject the adhesive 80 into only one glue injection tank 213, or to inject the adhesive 80 into two glue injection tanks 213 simultaneously. Since the adhesive 80 is also connected through the bottom tank 211, when injecting the adhesive 80 into only one glue injection tank 213, the adhesive 80 can flow into the other glue injection tank 213 through the bottom tank 211 under the action of atmospheric pressure, so as to ensure that the glue injection seam 60 can still be injected with the adhesive 80 by two glue injection tanks 213 simultaneously, and further ensure that the liquid level of the adhesive in the glue injection seam 60 remains flush, improving the stability of glue injection.

[0104] In another embodiment, please refer to Figure 6 , step S4 specifically includes:

[0105] Step S421: Provide a carrying device, the carrying device includes a bottom plate and side plates provided at both ends of the bottom plate;

[0106] Step S422: Place the laminate on the bottom plate, and glue injection gaps are respectively formed between the laminate and the two side plates, and opposite ends of each glue injection seam are respectively aligned with the two side plates;

[0107] Step S423: Respectively arrange sealing films on the waveguide female chips at both ends of the laminate to seal the laminate and the carrying device.

[0108] Specifically, the carrier device 310 includes a bottom plate 311 and side plates 313 perpendicular to the bottom plate 311 and respectively disposed at both ends of the bottom plate 311. The bottom plate 311 and the side plates 313 form a U-shaped structure. The laminate 100 is disposed on the bottom plate 311, and a glue injection gap 314 is formed between the laminate 100 and the two side plates 313. Three of the four surfaces formed by overlapping multiple waveguide mother sheets 10 respectively correspond to the bottom plate 311 and the two side plates 313. Thus, one glue injection gap 314 can communicate with another glue injection gap 314 through each glue filling seam 60.

[0109] In step S423, the sealing film 315 is specifically used to connect and seal the laminate 100 with the bottom plate 311 and the two side plates 313, so that the two glue injection gaps 314 form a communicating vessel structure.

[0110] The width of the glue injection gap 314 can be set to 1 cm - 5 cm, and it can be specifically determined according to the glue injection method in actual application. The smaller the width of the glue injection gap 314, the higher the accuracy requirement for glue injection, and the less the amount of the final adhesive 80 used.

[0111] The sealing film 315 is a high-temperature resistant film to avoid damage when the adhesive 80 releases heat. The sealing film 315 can also be a transparent material to facilitate observing the liquid level height in the glue injection gap 314.

[0112] In this embodiment, step S5 specifically includes: injecting the adhesive 80 into the two glue injection gaps 314 respectively until the glue filling seam 60 is completely filled with the adhesive 80. Specifically, by injecting the adhesive 80 into the two glue injection gaps 314, under the action of atmospheric pressure, the adhesive 80 will flow towards the middle glue filling seam 60, so as to fill into the glue filling seam 60. Finally, when the two glue injection gaps 314 are filled with the adhesive 80, all the glue filling seams 60 are also completely filled with the adhesive 80.

[0113] Step S6 specifically includes: putting the communicating vessel structure into an oven for curing together, so as to obtain a completely bonded laminate 100. Specifically, after all the glue filling seams 60 of the laminate 100 are filled with the adhesive 80, the entire glue injection system can be directly heated to cure the adhesive 80, so as to avoid the adhesive 80 in the glue filling seam 60 flowing out when the laminate 100 is taken out, which affects the bonding effect.

[0114] Step S6 further includes: after curing for more than 24 hours, performing annealing treatment on the laminate 100 twice or more times to eliminate the curing stress.

[0115] Please refer to Figure 7, step S7 specifically includes: cutting the laminate 100, and performing processes such as grinding and polishing to obtain a plurality of optical waveguide arrays 400. Specifically, first, the laminate 100 is cut out from the connector structure, and then the laminate 100 is cut along a direction perpendicular to the transparent substrate 11 to obtain a plurality of optical waveguide arrays 400. Then, the optical waveguide arrays 400 are processed through processes such as grinding and polishing to eliminate the surface wear generated by the previous processes.

[0116] The adhesive 80 can be a two-component thermosetting adhesive. The two components are stored separately when not in use and are mixed together when in use, thus becoming the adhesive 80 with viscosity. The viscosity of the adhesive 80 is less than or equal to 1000 Pa·s, the working time of the mixed adhesive 80 is greater than 1 hour, and the curing temperature of the adhesive 80 is 70°C to 200°C. In other embodiments, the adhesive 80 can also be set as a single-component adhesive according to needs, and the present application does not limit this.

[0117] The optical waveguide array manufacturing method provided by the embodiments of the present application places the laminate 100 formed by laminating a plurality of waveguide mother sheets 10 into a connector, and makes the glue injection seam 60 between two adjacent waveguide mother sheets 10 communicate with the connector structure, so that the adhesive can be injected into the connector structure to realize injecting the adhesive into the glue injection seam 60, thereby bonding the plurality of waveguide mother sheets 10. The manufacturing method has simple process, can ensure the imaging quality, and is beneficial to reducing the production cost.

[0118] The embodiments of the present application also provide a glue injection system 200. Please refer to Figure 4 and Figure 5 , the glue injection system 200 includes a connecting groove 210, a bottom baffle 215, two side baffles 217 and a laminate 100. The connecting groove 210 is a U-shaped groove structure, including a bottom groove 211 at the bottom and two glue injection grooves 213 at both ends. The opening of the bottom groove 211 faces the direction of the two glue injection grooves 213, and the openings of the two glue injection grooves 213 are arranged opposite to each other, so that the two glue injection grooves 213 are connected through the bottom groove 211. The bottom baffle 215 is used to cover the opening of the bottom groove 211, and the side baffle 217 is used to movably cover the opening of the glue injection groove 213. The laminate 100 is arranged on the bottom baffle 215. The laminate 100 includes a plurality of waveguide mother sheets 10 stacked together, and a glue injection seam 60 is formed between two adjacent waveguide mother sheets 10. Both ends of the glue injection seam 60 respectively correspond to a side baffle 217.

[0119] The glue filling system 200 provided by the embodiment of the present application can form a communicating vessel structure between two glue filling grooves 213 by arranging a communicating groove 210 in combination with a bottom baffle 215 and two side baffles 217. By arranging a laminate 100 on the bottom baffle 215 and making the two side baffles 217 movable, after the side baffles 217 are removed from the openings of the glue filling grooves 213, the glue filling seam 60 can be communicated with the two glue filling grooves 213, so that the bonding glue 80 can flow into the glue filling seam 60 through the glue filling grooves 213, and then the bonding of multiple waveguide mother pieces 10 can be realized.

[0120] The embodiment of the present application also provides a glue filling system 300. Please refer to Figure 6 , the glue filling system 300 includes a carrying device 310, a laminate 100, and a plurality of sealing films 315. The carrying device 310 includes a bottom plate 311 and side plates 313 perpendicular to the bottom plate 311 and respectively arranged at both ends of the bottom plate 311. The bottom plate 311 and the side plates 313 form a U-shaped structure. The laminate 100 is arranged on the bottom plate 311, and a glue injection gap 314 is formed between the laminate 100 and the two side plates 313. Three of the four surfaces formed by overlapping a plurality of waveguide mother pieces 10 respectively correspond to the bottom plate 311 and the two side plates 313. Thus, one glue injection gap 314 can be communicated with another glue injection gap 314 through each glue filling seam 60. The sealing film 315 is specifically used to connect and seal the laminate 100 with the bottom plate 311 and the two side plates 313, so that the two glue injection gaps 314 form a communicating vessel structure.

[0121] The glue filling system 300 provided by the embodiment of the present application can form a communicating vessel structure by arranging the bottom plate 311, the side plates 313, the laminate 100, and the sealing film 315. When injecting the bonding glue 80 into the two glue injection gaps 314, under the action of atmospheric pressure, the bonding glue 80 can flow into the glue filling seam 60, so as to realize the bonding of multiple waveguide mother pieces 10.

[0122] Those of ordinary skill in the art of this technology should recognize that the above embodiments are only used to illustrate the present application, rather than to limit the present application. As long as within the scope of the substantial spirit of the present application, appropriate changes and variations made to the above embodiments fall within the scope of protection required by the present application.

Claims

1. A method for manufacturing an optical waveguide array, characterized in that Including: Providing a plurality of waveguide mother sheets, each of the waveguide mother sheets including a transparent substrate and a reflective film provided on at least one surface of the transparent substrate; Providing a separation layer on the reflective film of each of the waveguide mother sheets; Stacking the plurality of waveguide mother sheets in sequence to form a stacked body, with adjacent two waveguide mother sheets separated by the separation layer to form a glue injection seam; Constructing a connector structure at opposite ends of the stacked body respectively, with the two connectors communicating with each other through each glue injection seam; Adding an adhesive to each of the connectors respectively until the adhesive completely fills each glue injection seam; Curing the adhesive; Cutting the bonded stacked body along a direction perpendicular to the transparent substrate to obtain a plurality of optical waveguide arrays.

2. The method for manufacturing an optical waveguide array according to claim 1, characterized in that, The thickness difference between the plurality of transparent substrates is less than 3 μm, and the flatness deviation is less than 2 μm.

3. The method for manufacturing an optical waveguide array according to claim 1, wherein The step of providing a plurality of waveguide mother sheets includes: plating the reflective film on one surface of each of the transparent substrates; or plating the reflective film on both surfaces of each of the transparent substrates.

4. The manufacturing method of the optical waveguide array according to claim 1, wherein The step of providing a separation layer on the reflective film of each of the waveguide mother sheets specifically includes: providing a plurality of columnar spacers on the surface of the reflective film, with the height of each spacer being 1 μm - 100 μm, the width of each spacer being 50 μm - 200 μm, and the distance between adjacent two spacers being 10 μm - 5000 μm.

5. The manufacturing method of the optical waveguide array according to claim 1, characterized in that, The step of providing a separation layer on the reflective film of each of the waveguide mother sheets specifically includes: providing a plurality of spacers on the surface of the reflective film by one of photolithography exposure, screen printing, inkjet printing, nanoimprinting, ultraviolet curing transfer printing, laser etching or electrostatic spraying curing.

6. The method for manufacturing an optical waveguide array according to claim 1, wherein The step of stacking the plurality of waveguide mother sheets in sequence to form a stacked body, with adjacent two waveguide mother sheets separated by the separation layer to form a glue injection seam includes: setting the level tolerance between each of the waveguide mother sheets in the stacked body to be less than or equal to 2 μm.

7. The method for manufacturing an optical waveguide array according to claim 1, wherein The viscosity of the adhesive is less than 1000 Pa·s, and the curing temperature is 70°C - 200°C.

8. The method for manufacturing an optical waveguide array according to claim 1, wherein, The step of constructing a connector structure at opposite ends of the stacked body respectively, with the two connectors communicating with each other through each glue injection seam specifically includes: Providing a connection groove, the connection groove including a bottom groove and two glue injection grooves, with the two glue injection grooves respectively communicating with one end of the bottom groove; Providing a bottom baffle and two side baffles, covering the bottom baffle on the bottom groove, and movably setting the two side baffles on the opening side of the glue injection grooves, such that the two glue injection grooves communicate through the bottom groove; Placing the stacked body on the bottom baffle, with both ends of each glue injection seam respectively aligned with the two side baffles.

9. The method for manufacturing an optical waveguide array according to claim 8, wherein, The step of adding an adhesive to each of the connectors respectively until the adhesive completely fills each glue injection seam specifically includes: Injecting the adhesive into the glue injection grooves until the connection groove is filled with the adhesive; Removing the two side baffles, such that the adhesive in the glue injection grooves flows into each glue injection seam; Continuing to inject the adhesive until the adhesive completely fills each glue injection seam.

10. The method for manufacturing an optical waveguide array according to claim 1, wherein, Construct communicating vessel structures at opposite ends of the laminate respectively. The specific steps for the two communicating vessels to communicate with each other through each glue injection seam include: Provide a carrying device, which includes a bottom plate and side plates arranged at both ends of the bottom plate; Place the laminate on the bottom plate. Glue injection gaps are respectively formed between the laminate and the two side plates. Opposite ends of each glue injection seam are respectively aligned with the two side plates; Sealing films are respectively arranged on the waveguide mother chips at both ends of the laminate to seal the laminate and the carrying device.

11. The method for manufacturing an optical waveguide array according to claim 10, characterized in that, The specific steps for adding adhesive to each communicating vessel until the adhesive completely fills each glue injection seam include: injecting the adhesive into the two glue injection gaps respectively.

12. The method for manufacturing an optical waveguide array according to claim 10, wherein, The width of the glue injection gap is 1 cm - 5 cm.

13. A potting system, characterized in that, Include: A communicating groove, which includes a bottom groove and two glue injection grooves. The two glue injection grooves are respectively communicated with one end of the bottom groove; A bottom baffle plate arranged on the bottom groove; Two side baffle plates respectively movably arranged on the opening sides of the glue injection grooves; And A laminate arranged on the bottom baffle plate. The laminate includes a plurality of waveguide mother chips stacked on top of each other. A glue injection seam is formed between adjacent two waveguide mother chips. Both ends of the glue injection seam respectively correspond to one of the side baffle plates.

14. A potting system, characterized in that, Include: A carrying device, which includes a bottom plate and side plates arranged at both ends of the bottom plate; A laminate arranged on the bottom plate. The laminate includes a plurality of waveguide mother chips stacked on top of each other. A glue injection seam is formed between adjacent two waveguide mother chips. Both ends of the glue injection seam respectively correspond to one of the side plates; and A plurality of sealing films respectively arranged between the two waveguide mother chips at both ends of the laminate and the carrying device.

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