Server central processing unit test verification platform

Abstract

The invention discloses a server central processing unit test verification platform, and relates to the technical field of servers, and the server central processing unit test verification platform comprises an open frame, a calculation module, a management module, a heat dissipation module and an expansion module; the calculation module and the management module are arranged on the first layer of the open type frame; the expansion module is arranged on the second layer of the open type frame; the calculation module is used for executing a test verification task on the server central processing unit; the management module is used for managing and controlling the calculation module and the heat dissipation module; the heat dissipation module is used for conducting heat dissipation on the calculation module, the management module and the expansion module; the expansion module is used for connecting auxiliary test equipment; the auxiliary test equipment is provided with an interface electrically connected with the server central processing unit so as to test and verify the interface function of the server central processing unit, the technical problem of limited application scenes is solved through modular design and open architecture, and the technical effects of improving hardware model selection flexibility and being suitable for more test and verification scenes are achieved.

Description

Technical Field

[0001] This application relates to the technical field of servers, and particularly to a test and verification platform for a server central processing unit. Background Art

[0002] In the early stage of hardware development, engineering validation for testing the server central processing unit (CPU) can be used to verify whether the CPU design meets the requirements. Currently, a test and verification platform is usually built based on hardware devices such as the CPU, hard disk, and board cards of the server, with poor flexibility, limited applicable scenarios, and usually being relatively single. Summary of the Invention

[0003] This application provides a test and verification platform for a server central processing unit to at least solve the problem of limited applicable scenarios of the test and verification platform for a server central processing unit in related technologies.

[0004] This application provides a test and verification platform for a server central processing unit, including: an open framework, a computing module, a management module, a heat dissipation module, and an expansion module; The computing module and the management module are arranged on the first layer of the open framework; the expansion module is arranged on the second layer of the open framework; the computing module is electrically connected to the management module and the expansion module respectively; the heat dissipation module is electrically connected to the management module; The computing module is used to execute the test and verification task for the server central processing unit; The management module is used to manage and control the computing module and the heat dissipation module; The heat dissipation module is used to dissipate heat from the computing module, the management module, and the expansion module; The expansion module is used to connect auxiliary test equipment; the auxiliary test equipment has an interface electrically connected to the server central processing unit to implement the test and verification of the interface function of the server central processing unit.

[0005] With this application, since the server central processing unit test and verification platform includes a decoupled computing module, a management module, a heat dissipation module, an expansion module, etc., and the functional modules are connected through standardized interfaces, and the computing module, the management module, the heat dissipation module, and the expansion module are all arranged on an open framework. On the premise of being able to perform hardware function verification, performance testing, stability testing, etc. on the server central processing unit, the direct dependencies between the functional modules are isolated, allowing each functional module to be independently developed, tested, and upgraded. Thus, it can avoid a global reconstruction of the platform caused by changes in a single functional module. Only by replacing the computing module can the server central processing units of different models be tested and verified, realizing multi-purpose use of one machine, improving resource utilization, reducing the development cost of the platform and the cost of test and verification. And by using the larger and more flexible installation space provided by the open architecture based on the open framework, the free combination of the hardware layout of functional modules, etc. can be realized. When upgrading or adjusting components, it is not restricted by the size of the traditional chassis, and it can be compatible with non-standard hardware such as extra-long and / or extra-large ones, avoiding hardware conflicts and inability to test caused by insufficient installation space. Therefore, it can solve the technical problem of the limited applicable scenarios of the server central processing unit test and verification platform, achieve the technical effect of ensuring hardware compatibility and improving the flexibility of hardware selection, so as to be applicable to more test and verification scenarios. Moreover, by adopting an open structure, breaking the closed structure of the traditional chassis, the heat dissipation efficiency is significantly improved through natural air convection, and it has more excellent heat dissipation performance, enabling stable control of the temperature of the server central processing unit in high-load test scenarios. More test items can be carried out and the test ability is stronger in high-load test scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In order to more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0007] Figure 1 FIG. 1 is one of the structural schematic diagrams of a server central processing unit test and verification platform provided by an embodiment of the present application; Figure 2 FIG. 2 is another structural schematic diagram of a server central processing unit test and verification platform provided by an embodiment of the present application; Figure 3 FIG. 3 is a third structural schematic diagram of a server central processing unit test and verification platform provided by an embodiment of the present application; Figure 4 FIG. 4 is the structural schematic diagram of an adapter card module in a server central processing unit test and verification platform provided by an embodiment of the present application; Figure 5Schematic diagram of the structure of the first hard disk module in a server central processing unit test and verification platform provided by an embodiment of the present application; Figure 6 Fourth schematic diagram of the structure of a server central processing unit test and verification platform provided by an embodiment of the present application; Figure 7 Fifth schematic diagram of the structure of a server central processing unit test and verification platform provided by an embodiment of the present application; Figure 8 Schematic diagram of the structure of the computing module in a server central processing unit test and verification platform provided by an embodiment of the present application; Figure 9 Schematic diagram of the topology structure of the computing module and the management module in a server central processing unit test and verification platform provided by an embodiment of the present application; Figure 10 Schematic diagram of the connection relationship of the open core protocol connector in a server central processing unit test and verification platform provided by an embodiment of the present application; Figure 11 Schematic diagram of the structure of the computing module and the management module in a server central processing unit test and verification platform provided by an embodiment of the present application; Figure 12 Schematic diagram of the heat dissipation module in a server central processing unit test and verification platform provided by an embodiment of the present application. Detailed implementation manners

[0008] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0009] It should be noted that in the description of the present application, the terms "include", "comprise" or any other variant thereof are intended to cover a non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. The terms "first", "second", etc. in the present application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0010] It should be noted that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. The terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of either one. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0011] To enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.

[0012] An embodiment of the present application provides a server central processing unit test and verification platform, and the platform will be described in detail in combination with the structure and working principle of the server central processing unit test and verification platform.

[0013] Specifically, Figure 1 It is one of the structural schematic diagrams of a server central processing unit test and verification platform provided by an embodiment of the present application. Figure 2 It is another structural schematic diagram of a server central processing unit test and verification platform provided by an embodiment of the present application. Figure 3 It is the third structural schematic diagram of a server central processing unit test and verification platform provided by an embodiment of the present application.

[0014] Refer to Figure 1, Figure 2 and Figure 3 , a server central processing unit test and verification platform, may include: an open frame 110, a computing module 120, a management module 130, a heat dissipation module 140, and an expansion module 150.

[0015] In actual implementation, the server central processing unit test and verification platform provided by the embodiments of the present application is used to test the central processing unit (CPU) of a server to verify whether the design of the CPU meets the requirements.

[0016] The above test belongs to engineering validation for CPU testing. Engineering validation is usually used in the early stage of hardware development to verify whether the design of the developed hardware meets the requirements.

[0017] The development directions of server CPUs mainly include optimizations and improvements in aspects such as artificial intelligence (AI) computing power, energy efficiency, and architecture. Among them, liquid cooling technology and heterogeneous computing technology can address the high-density computing power requirements for server CPUs. In terms of the architecture of server CPUs, the x86 architecture and the ARM architecture each have their own advantages, and optimizations for the above two architectures are still ongoing.

[0018] The rapid development of technologies such as artificial intelligence has put forward higher requirements for new computing power infrastructure. A data center, as a typical computing power infrastructure, usually consists of a large number of servers. To meet the high requirements of new computing power infrastructure, the computing capabilities of each core of the server CPU play a decisive role.

[0019] The server CPU is the "brain" of the server, responsible for data processing and instruction execution, and may specifically include: performing logical operations, instruction parsing, and data processing tasks, etc. The computing speed and cache capacity of the server CPU have a direct impact on the server response speed and task execution efficiency. A high-performance server CPU can significantly improve the processing capabilities in scenarios such as database queries and scientific calculations, and reduce memory access latency. Therefore, the server CPU is not only the core component of the server, but also the key factor determining the performance, function, and efficiency of the server. A CPU with excellent performance, stable reliability, and outstanding energy efficiency can provide the server with more efficient computing power, faster response speed, and more lasting operation guarantee.

[0020] For both data centers and enterprise-level applications, one of the core aspects in their design and planning is the selection of the server CPU. Selecting the appropriate CPU in server design can not only meet current requirements but also provide a solid foundation for future expansion and optimization to achieve higher performance and better user experience.

[0021] The server central processing unit test and verification platform may include: an open framework 110 and various functional modules. The above-mentioned functional modules may include a computing module 120, a management module 130, a heat dissipation module 140, an expansion module 150, etc.

[0022] On the one hand, the server central processing unit test and verification platform provided by the embodiments of the present application adopts a decoupled modular design, and each functional module can be independently developed, tested, and upgraded.

[0023] Among them, the computing module 120 is used to execute the test and verification tasks for the server central processing unit; The management module 130 is used to manage and control the computing module 120 and the heat dissipation module 140; The heat dissipation module 140 is used to dissipate heat from the computing module 120, the management module 130, and the expansion module 150; The expansion module 150 is used to connect auxiliary test equipment; the auxiliary test equipment has an interface electrically connected to the server central processing unit to implement the test and verification of the interface function of the server central processing unit; The computing module 120 is electrically connected to the management module 130 and the expansion module 150 respectively; the heat dissipation module 140 is electrically connected to the management module 130.

[0024] In some embodiments, the task of executing the test and verification of the server central processing unit may specifically be the responsibility of the computing module 120.

[0025] In the embodiments of the present application, the test and verification content of the server central processing unit may include but is not limited to at least one of the following categories: basic function verification, firmware and system compatibility testing, performance testing, memory bandwidth testing, stability and stress testing, energy efficiency and temperature testing, etc.

[0026] Basic function verification belongs to basic function testing, and its role is to ensure the correct hardware parameters of the server CPU. In some embodiments, basic function verification may include the verification of CPU information, etc. The information to be verified may include but is not limited to at least one of the following: the number of cores included in the CPU (which can be abbreviated as "core count"), the number of threads (which can be abbreviated as "thread count"), and frequency, etc.

[0027] The functions of the firmware and system compatibility test include ensuring that the firmware version and settings are correct, and that basic functions such as system time and memory usage are normal. In some embodiments, the firmware and system compatibility test may include, but is not limited to, at least one of the following: Basic Input Output System (BIOS) test and Baseboard Management Controller (BMC) test, etc.

[0028] The performance test may include testing at least one of the computing power, multi-thread performance, and database processing ability of the CPU. In some embodiments, the performance of the server CPU can be tested by at least one of software tools such as Sysbench and Super PI.

[0029] The memory bandwidth test can be used to verify the interaction efficiency between the server CPU and the memory, especially the bandwidth performance in the case where the server CPU is multi-core (i.e., the server CPU includes multiple cores). In some embodiments, the memory bandwidth of the server CPU can be tested by software tools such as Stream.

[0030] The stability and stress test is a long-term high-load test. In some embodiments, at least one of software tools such as stressapptest (Stressful Application Test or Stressful App Test) and Sysbench can be used to make the server CPU run at full load to check the heat dissipation performance and stability of the server CPU.

[0031] The energy efficiency and temperature test may include dynamic frequency adjustment and temperature monitoring under high load, etc., to ensure the effectiveness of the heat dissipation solution of the server CPU.

[0032] In some embodiments, the management module 130 can manage and control the server central processor test and verification platform. Specifically, the management module 130 can manage and control the computing module 120 and the heat dissipation module 140 in the server central processor test and verification platform.

[0033] In some embodiments, the role and functions that the management module 130 can achieve for the server central processor test and verification platform can be equivalent to that of the BMC for the server.

[0034] In some embodiments, the function of the heat dissipation module 140 is heat dissipation. By dissipating heat from the computing module 120, the management module 130, and the expansion module 150, the purpose of cooling the computing module 120, the management module 130, and the expansion module 150 is achieved.

[0035] In some embodiments, the heat dissipation module 140 may adopt any structure with air-cooling or water-cooling functions. The specific structure of the heat dissipation module 140 is not limited in the embodiments of the present application.

[0036] In some embodiments, in addition to the foregoing test verification content, the computing module 120 may also perform test verification on the interface function of the server CPU through the cooperation of the expansion module 150.

[0037] In some embodiments, the expansion module 150 may be used to electrically connect the server CPU to the auxiliary test device. In some embodiments, the foregoing auxiliary test device may include at least one of a hard disk and a Peripheral Component Interconnect express (PCIe) device, etc.

[0038] In some embodiments, the functional modules are connected through standardized interfaces. Specifically, the management module 130 may be electrically connected to the computing module 120 and the heat dissipation module 140 through standardized interfaces such as the Intelligent Platform Management Interface (IPMI) interface. The computing module 120 and the expansion module 150 may be electrically connected through standardized interfaces such as the PCIe interface.

[0039] On the other hand, the server central processing unit test verification platform provided by the embodiments of the present application adopts an Open Chassis architecture. Each functional module included in the server central processing unit test verification platform is disposed on the open frame 110.

[0040] In some embodiments, the open frame 110 may include two layers. Among them, the computing module 120 and the management module 130 are disposed on the first layer of the open frame 110; the expansion module 150 is disposed on the second layer of the open frame 110.

[0041] In some embodiments, the first layer of the open frame 110 may be the bottom layer, and the second layer of the open frame 110 may be the upper layer above the bottom layer.

[0042] In some embodiments, the first layer of the open frame 110 may include a tray 111. The tray 111 may be used to carry the computing module 120 and the management module 130.

[0043] In some embodiments, the second layer of the open frame 110 may include a base. The base may be used to carry the expansion module 150. The area of the base may be less than or equal to the area of the tray 111.

[0044] In some embodiments, the open frame 110 may further include two parallel brackets. The shape of each bracket may include a rectangle or a trapezoid, etc. The first layer (such as the tray 111) and the second layer (such as the base) of the open frame 110 may be perpendicular to the two brackets and connect the two brackets, so that the first layer and the second layer of the open frame 110 may be parallel and at a certain distance from each other.

[0045] In some embodiments, the heat dissipation module 140 can be flexibly arranged on the open frame 110. For example, the heat dissipation module 140 can be arranged on the first layer or the second layer of the open frame 110, or the heat dissipation module 140 can be arranged on both the first layer and the second layer of the open frame 110.

[0046] In some embodiments, at least one handle 112 may be provided on the first layer of the open frame 110. The handle 112 can be grasped by a staff member and / or a manipulator, etc.

[0047] According to the server central processing unit test and verification platform provided by the embodiments of the present application, by including a computing module, a management module, a heat dissipation module, an expansion module, etc. with a decoupled design, the functional modules are connected through a standardized interface, and the computing module, the management module, the heat dissipation module, and the expansion module are all arranged on an open frame. On the premise of being able to perform hardware function verification, performance testing, stability testing, etc. on the server central processing unit, the direct dependencies between the functional modules are isolated, allowing each functional module to be independently developed, tested, and upgraded, thus avoiding a global reconstruction of the platform caused by a change in a single functional module. Only by replacing the computing module can the server central processing units of different models be tested and verified, achieving multi-purpose use of one machine, improving resource utilization rate, reducing the development cost of the platform and the cost of test and verification, and through the use of a larger and more flexible installation space provided by the open architecture based on the open frame, being able to freely match the hardware layout of functional modules, etc., and being unrestricted by the traditional chassis size when upgrading or adjusting components, being able to be compatible with non-standard hardware such as extra-long and / or extra-large ones, and avoiding hardware conflicts and inability to test caused by insufficient installation space. Therefore, the technical problem of limited applicable scenarios of the server central processing unit test and verification platform can be solved, achieving the technical effect of ensuring hardware compatibility and improving the flexibility of hardware selection, so as to be applicable to more test and verification scenarios. And, by adopting an open structure, breaking the closed structure of the traditional chassis, significantly improving the heat dissipation efficiency through natural air convection, having more excellent heat dissipation performance, being able to stably control the temperature of the server central processing unit in a high-load test scenario, and having more test items and stronger test capabilities in a high-load test scenario.

[0048] In some embodiments of the present application, the expansion module 150 includes a breakout card module 151; the auxiliary test equipment connected to the breakout card module 151 includes a high-speed peripheral component interconnect equipment.

[0049] In actual implementation, the expansion module 150 may include a breakout card module 151. A paddle card can be used to adapt the PCIe interface. Correspondingly, the auxiliary test equipment connected to the breakout card module 151 may include a PCIe device.

[0050] In some embodiments, the breakout card module 151 may also be provided with a plurality of first positioning holes. The second layer of the open frame 110 may be provided with the same number of second positioning holes as the breakout card module 151, and the positions of the second positioning holes correspond to the positions of the first positioning holes one by one. In some embodiments, the second positioning holes may be provided on the base. The breakout card module 151 can be connected to the second layer (such as the base) of the open frame 110 through the first positioning holes, the second positioning holes and fasteners, so as to fix the breakout card module 151 on the second layer (such as the base) of the open frame 110. The type of the fasteners is not limited in the embodiments of the present application. For example, the above-mentioned fasteners may be screws or pins, etc.

[0051] In some embodiments, the maximum scale supported by the breakout card module 151 may be to verify 10 double-width (DW) full-height full-length (FHFL) PCIe devices.

[0052] In some embodiments, the breakout card module 151 may include a plurality of breakout card slots, and each breakout card slot may insert a PCIe device. The PCIe device is usually in the form of a board card, that is, a PCIe card.

[0053] In some embodiments, the breakout card module 151 may further include an upper cover. The upper cover can be used to cover the breakout card slots to prevent dust and the like from falling into the breakout card slots when no test verification is performed, prevent damage to the subsequently inserted PCIe devices, and avoid inaccurate test verification results of the server CPU. In some embodiments, the upper cover may be separated from the breakout card slots, or the upper cover may be connected to the body of the breakout card module provided with the breakout card slots by means of hinging or the like, so that the upper cover does not cover the breakout card slots during test verification, and the upper cover can cover the breakout card slots when no test verification is performed.

[0054] In some embodiments, the cable used in the adapter card module 151 can be a cable with a customized type of PCIE Gen5. By customizing the signal definition of the cable, the interoperability between the server CPU and different PCIe devices can be verified. Verifying the interoperability between the server CPU and different PCIe devices can include: verifying the automatic negotiation of link width (x1 / x4 / x16) and power management coordination, and testing the bifurcation function of the PCIe interface to ensure that the x16 slot can be split into multiple x8 or x4 channels to support multi-device expansion. The above different PCIe devices can include at least one of a graphics processing unit (GPU) and a field programmable gate array (FPGA) acceleration card, etc.

[0055] Figure 4 FIG. is a schematic structural diagram of an adapter card module in a server central processing unit test and verification platform provided by an embodiment of the present application. Exemplarily, Figure 4 The shown adapter card module can include 8 adapter card slots and can support up to 8 PCIe devices at most.

[0056] According to the server central processing unit test and verification platform provided by an embodiment of the present application, by adopting a modular-designed adapter card module, the adapter card module is decoupled from other functional modules. On the premise of being able to implement the test and verification of the PCIE interface function of the server central processing unit, the direct dependency between the adapter card module and other modules is isolated, allowing the adapter card module to be independently developed, tested, and upgraded, thereby avoiding the global reconstruction of the platform caused by changes in the adapter card module, and reducing the development cost and efficiency of the platform as well as the cost and efficiency of test and verification.

[0057] In some embodiments of the present application, the expansion module 150 includes a first hard disk module 152; the auxiliary test device connected to the first hard disk module 152 includes a target hard disk in the form factor of an enterprise and data center solid state drive.

[0058] In actual execution, the expansion module 150 can include a first hard disk module 152. The first hard disk module 152 can be used to connect a hard disk. The type of the target hard disk connected to the first hard disk module 152 can include a hard disk in the form factor of an enterprise and data center solid state drive (Enterprise and Data center SSD Form Factor, EDSFF). Correspondingly, the auxiliary test device connected to the first hard disk module 152 can include an EDSFF hard disk.

[0059] EDSFF is a standard for Solid State Disks (SSDs) designed for data centers and enterprise storage systems. Solid State Disks, also known as Solid State Drives, are hard drives made of solid-state electronic storage chip arrays. EDSFF defines four main form factors: E1.S (Enterprise and Data center 1U Short SSD Form Factor), E1.L (Enterprise and Data center 1U Long SSD Form Factor), E3.S (Enterprise and Data center 3U Short SSD Form Factor), and E3.L (Enterprise and Data center 3U Long SSD Form Factor). EDSFF hard drives can include the Enterprise and Data center Short SSD Form Factor (EDSFF) and the Enterprise and Data center Long SSD Form Factor (EDLFF). The "S" in the E1.S and E3.S specifications represents short, and the EDSFF hard drives of the E1.S and E3.S specifications belong to the hard drives of the Enterprise and Data center Short SSD Form Factor; the "L" in the E1.L and E3.L specifications represents long, and the EDSFF hard drives of the E1.L and E3.L specifications belong to the hard drives of the Enterprise and Data center Long SSD Form Factor.

[0060] Solid state drives come in a variety of forms, such as solid state drives of design types like SATA (Serial Advanced Technology Attachment), PCIe, M.2 (M2 interface), U.2 (SFF-8639 interface), SAS (Serial Attached SCSI), E1.L, E1.S, and E3.S. Among them, E1.L is longer than E1.S. E3.S is a new form standard for NVMe SSDs (NVM Express or Non-Volatile Memory, non-volatile storage high-speed solid state drives) for cloud services and enterprise data centers, with advantages such as stronger scalability and better performance, heat dissipation, and power consumption, and is very suitable for large-capacity, high-density all-flash storage arrays. Solid state drives of the E3 series break away from the design limitations of the 2.5-inch form factor, are optimized for high-performance, high-efficiency servers and storage requirements, and incorporate a standardized LED status indicator.

[0061] In some embodiments, the first hard disk module 152 may also be provided with a plurality of third positioning holes. The second layer of the open frame 110 may be provided with the same number of fourth positioning holes as the first hard disk module 152, and the positions of the fourth positioning holes correspond one-to-one with the positions of the third positioning holes. In some embodiments, the fourth positioning holes may be provided on the base. The first hard disk module 152 can be connected to the second layer (such as the base) of the open frame 110 through the third positioning holes, the fourth positioning holes, and fasteners, so as to fix the first hard disk module 152 on the second layer (such as the base) of the open frame 110. The type of fastener is not limited in the embodiments of the present application. For example, the above fasteners may be screws or pins, etc.

[0062] In some embodiments, the first hard disk module 152 may support multiple EDSFF hard disks of the same or different specifications to verify this storage form, so as to achieve the purpose of verifying the interface function of the server CPU.

[0063] According to the server central processing unit test and verification platform provided by the embodiments of the present application, by adopting a modularized first hard disk module, the first hard disk module is decoupled from other functional modules. On the premise of being able to test and verify the storage function of the server central processing unit, the direct dependence between the first hard disk module and other modules is isolated, allowing the first hard disk module to be independently developed, tested, and upgraded, thus avoiding global reconstruction of the platform caused by changes in the first hard disk module, and reducing the development cost and efficiency of the platform as well as the cost and efficiency of test and verification.

[0064] In some embodiments of the present application, the expansion module 150 includes a second hard disk module 153; the auxiliary test device connected to the second hard disk module 153 includes a non-volatile storage high-speed solid-state drive.

[0065] In actual implementation, the expansion module 150 may include a second hard disk module 153. The second hard disk module 153 may be used to connect to a hard disk. The type of the hard disk connected to the second hard disk module 153 may be a non-volatile storage high-speed solid-state drive. Accordingly, the auxiliary test device connected to the second hard disk module 153 may include an NVMe SSD.

[0066] In some embodiments, the second hard disk module 153 may also be provided with a plurality of fifth positioning holes. The second layer of the open frame 110 may be provided with the same number of sixth positioning holes as the second hard disk module 153, and the positions of the sixth positioning holes correspond to the positions of the fifth positioning holes one by one. In some embodiments, the sixth positioning holes may be provided on the base. The second hard disk module 153 may be connected to the second layer (such as the base) of the open frame 110 through the fifth positioning holes, the sixth positioning holes, and fasteners, so as to fix the second hard disk module 153 on the second layer (such as the base) of the open frame 110. The type of the fasteners is not limited in the embodiments of the present application. For example, the above fasteners may be screws or pins, etc.

[0067] In some embodiments, the second hard disk module 153 may support multiple NVMe SSDs to verify this storage form, so as to achieve the purpose of verifying the interface function of the server CPU. In some embodiments, the NVMe SSDs connected to the second hard disk module 153 may adopt NVMe SSDs with interfaces such as SATA or M.2.

[0068] According to the server central processing unit test and verification platform provided by the embodiments of the present application, by adopting a modularized second hard disk module, the second hard disk module is decoupled from other functional modules. On the premise of being able to test and verify the storage function of the server central processing unit, the direct dependence between the second hard disk module and other modules is isolated, and the second hard disk module is allowed to be independently developed, tested, and upgraded, thereby avoiding the global reconstruction of the platform caused by changes in the second hard disk module, and reducing the development cost and efficiency of the platform as well as the cost and efficiency of test and verification.

[0069] Figure 5 It is a schematic structural diagram of the first hard disk module in a server central processing unit test and verification platform provided by the embodiments of the present application. Refer to Figure 5, in some embodiments of the present application, the first hard disk module includes a first housing 510; the first housing 510 is provided with a first opening and a first backplane 520; the first opening and the first backplane 520 are oppositely arranged; the first surface of the first backplane 520 is used for electrically connecting with the target hard disk; the second surface of the first backplane 520 is provided with a first interface; the first interface is used for electrically connecting with the server central processing unit.

[0070] In actual implementation, the first hard disk module 152 may include a first housing 510 having a cavity. The specific shape of the first housing 510 is not limited in the embodiments of the present application. In some embodiments, the first housing 510 may adopt a cuboid shape or the like.

[0071] The first housing 510 is provided with a first opening and a first backplane 520 that are opposite to each other. The EDSFF hard disk can be inserted from the first opening and connected to the first surface of the first backplane 520. It can be understood that the first surface of the first backplane 520 is the surface opposite to the first opening, and the second surface of the first backplane 520 is the other surface. The second surface of the first backplane 520 may be provided with a first interface, and the EDSFF hard disk can be electrically connected to the server CPU through the first interface.

[0072] In some embodiments, the portion of the first housing 510 other than the first backplane 520 and the first opening may be provided with heat dissipation holes, forming a structure similar to a cage. The shape and arrangement of the heat dissipation holes are not limited in the embodiments of the present application. Exemplarily, the heat dissipation holes may adopt a rectangular or circular shape or the like. For different surfaces of the first housing 510, heat dissipation holes of the same or different shapes may be adopted.

[0073] Exemplarily, Figure 5 The first hard disk module shown can support up to 8 E3.S specification ESDFF hard disks at most.

[0074] According to the server central processing unit test and verification platform provided by the embodiments of the present application, by adopting a first housing including a first opening and a first backplane that are oppositely arranged, the first hard disk module has better heat dissipation performance, can stably control the temperature of the server central processing unit in a high-load test scenario, and can perform more test items and have stronger test capabilities in a high-load test scenario.

[0075] , in some embodiments of the present application, the second hard disk module 153 includes a second housing; the second housing is provided with a second opening and a second backplane; the second opening and the second backplane are oppositely arranged; the first surface of the second backplane is used for electrically connecting with a non-volatile storage high-speed solid-state hard disk; the second surface of the second backplane is provided with a second interface; the second interface is used for electrically connecting with the server central processing unit.

[0076] In actual implementation, the second hard disk module 153 may adopt a structure similar to that of the first hard disk module 152.

[0077] The second hard disk module 153 may include a second housing having a cavity. The specific shape of the second housing is not limited in the embodiments of the present application. In some embodiments, the second housing may adopt a shape such as a cuboid.

[0078] The second housing is provided with a second opening and a second backplane that are opposite in position. The NVMe SSD can be placed through the second opening and connected to the second surface of the second backplane. It can be understood that the second surface of the second backplane is the surface opposite to the second opening, and the second surface of the second backplane is the other surface. The second surface of the second backplane may be provided with a second interface, and the NVMe SSD can be electrically connected to the server CPU through the second interface.

[0079] In some embodiments, the portion of the second housing other than the second backplane and the second opening may be provided with heat dissipation holes, forming a structure similar to a cage. The shape and arrangement of the heat dissipation holes are not limited in the embodiments of the present application. Exemplarily, the heat dissipation holes may be rectangular or circular, etc. For different surfaces of the second housing, heat dissipation holes of the same or different shapes may be adopted.

[0080] It should be noted that generally, due to differences in interfaces and dimensions, etc., the first housing and the second housing are not interchangeable. For example, when the first hard disk module supports an E3.S specification EDSFF hard disk and the second hard disk module supports a 2.5-inch NVMe SSD, the first housing and the second housing are not interchangeable.

[0081] In some embodiments, the expansion module 150 may adopt a flexible combination form of the adapter card module 151, the first hard disk module 152, and the second hard disk module 153. For example, the expansion module 150 may adopt at least one adapter card module 151, or at least one first hard disk module 152, or at least one second hard disk module 153, or a combination of at least one adapter card module 151 and at least one first hard disk module 152, or a combination of at least one adapter card module 151 and at least one second hard disk module 153, or a combination of at least one first hard disk module 152 and at least one second hard disk module 153, or a combination of at least one adapter card module 151, at least one first hard disk module 152, and at least one second hard disk module 153.

[0082] Figure 6 This is the fourth structural schematic diagram of a server central processing unit test and verification platform provided by the embodiments of the present application. Exemplarily, Figure 6 The figure shows a case where the expansion module 150 adopts a combination of one adapter card module 151 and one first hard disk module 152.

[0083] Figure 7 This is the fifth structural schematic diagram of a server central processing unit test and verification platform provided by an embodiment of the present application. Exemplarily, Figure 7 The figure shows a case where the expansion module 150 adopts a combination of three first hard disk modules 152.

[0084] Exemplarily, Figure 3 The figure shows a case where the expansion module 150 adopts a combination of one adapter card module 151, one first hard disk module 152, and one second hard disk module 153.

[0085] It can be understood that in the case where the expansion module 150 includes the first hard disk module 152 and the second hard disk module 153, different storage forms can be verified, so as to achieve the purpose of verifying the interface function of the server CPU.

[0086] In some embodiments, according to different combination methods of the adapter card module 151, the first hard disk module 152, and the second hard disk module 153, the expansion module 150 can actually support a maximum of 4 NVMe SSDs and 4 GPU cards, or 4 NVMe SSDs and 8 ordinary PCIe devices, or 24 NVMe SSDs at most.

[0087] In some embodiments, the computing module 120 can be connected to the adapter card module 151, the first hard disk module 152, and the second hard disk module 153 through a multi-channel input / output (Mini Cool Edge IO, MCIO) cable.

[0088] In some embodiments, the expansion module 150 can be used to assist in verifying the compatibility of 8 E3.S SSDs densely installed in a 2U server, so as to ensure the stability of the connection between the tray locking mechanism and the backplane in the server.

[0089] In some embodiments, the expansion module 150 can support automatic link reconstruction after hot plugging operation, and the state jump of the Link Training and Status State Machine (LTSSM) is normal.

[0090] In some embodiments, the computing module 120 can detect whether the server CPU correctly recognizes all SSDs by using commands such as lsscsi, and check whether the PCIe topology structure meets the x8 channel allocation (single-disk bandwidth ≥ 14GB / s in Gen5 mode).

[0091] In some embodiments, the computing module 120 can confirm whether the firmware version of the SSD complies with the PCIe Gen5 / 6 specification through an NVMe CLI tool (such as nvme list).

[0092] In some embodiments, for the single-disk and multi-disk aggregation performance, the computing module 120 can perform read and write tests including sequential ones, such as simulating full-disk sequential read and write (e.g., block size 1M, QD = 256) using fio, etc., to verify whether the peak bandwidth of the single disk reaches the theoretical value.

[0093] In some embodiments, when the computing module 120 conducts a test on the number of input / output operations per second (IOPS) for random reads and writes, it can test 4K random reads and writes (e.g., 70% read + 30% write) through Iometer, etc., to verify whether the theoretical value is reached.

[0094] According to the server central processing unit test and verification platform provided by the embodiments of the present application, by adopting a second housing including a relatively arranged second opening and a second backplane, the second hard disk module has better heat dissipation performance, can stably control the temperature of the server central processing unit in a high-load test scenario, and can perform more test items and has stronger test capabilities in a high-load test scenario.

[0095] In some embodiments of the present application, the computing module 120 can be used to split the high-speed peripheral component interconnect ports of the server central processing unit to respectively correspond to high-speed peripheral component interconnect devices connected to the adapter card module.

[0096] In actual execution, the computing module 120 (specifically, it can be the first controller) splits the PCIe ports of the server CPU.

[0097] In the test and verification platform, each PCIe port of the server CPU needs to be split. In some embodiments, splitting the PCIe ports of the server CPU may include: The first controller reads the ID status of each PCIe device serving as an auxiliary test device through MCIO; The first controller transfers the ID status of the above-mentioned PCIe devices to the BIOS through CPU0_I2C; The BIOS converts the obtained ID status into different actual splitting parameters; The BIOS splits the PCIe ports according to the splitting parameters.

[0098] It should be noted that a personal identification number (PIN) of the ID of each PCIe device can be set on the MCIO of the PCIe device, so as to set different identification numbers (Personal identification, ID) for different PCIe devices. The ID of the PCIe device can be transmitted through the cable to the MCIO on the motherboard.

[0099] In some embodiments, the BIOS can directly read the original split parameters in the NVPARAM during the Post stage. The BIOS can compare two sets of parameters (including the original split parameters and the actual split parameters). When the two sets of parameters are inconsistent, the BIOS can reset the forking parameters in the NVPARAM and restart; when the two parameters are consistent, the BIOS can boot up according to the normal process, thereby realizing the splitting of the PCIe port.

[0100] According to the server central processing unit test and verification platform provided by the embodiments of the present application, the high-speed peripheral component interconnect port of the server central processing unit is split by the computing module, so that the high-speed peripheral component interconnect ports of the server central processing unit respectively correspond to the high-speed peripheral component interconnect devices connected to the adapter card module. On this basis, the test and verification of each high-speed peripheral component interconnect port of the server central processing unit can be realized, and the test and verification of the high-speed peripheral component interconnect port is more refined.

[0101] In some embodiments of the present application, the computing module 120 includes a motherboard, a first controller, an on-board non-volatile storage high-speed solid-state drive 123, and at least two test and verification channels; each test and verification channel is respectively used to connect a server central processing unit; the first controller is used to execute the test and verification task of the server central processing unit.

[0102] In actual execution, the computing module 120 may include a motherboard, a first controller, and an on-board non-volatile storage high-speed solid-state drive 123.

[0103] The motherboard (mainboard, MB) can carry the platform for CPU test and operation. The motherboard can adopt the same structure as a common server motherboard, except that multiple server CPUs can be installed in the motherboard of the embodiments of the present application, and one server CPU can be installed in each test and verification channel.

[0104] In some embodiments, the first controller can specifically execute the test and verification tasks for the server central processing unit by running programs or the like. The first controller can be a Complex Programmable Logic Device (CPLD), FPGA, Microcontroller Unit (MCU), or the like.

[0105] In some embodiments, the storage function of the computing module 120 can be implemented by the on-board non-volatile storage high-speed solid-state drive 123.

[0106] In some embodiments, signals of all interfaces related to the server CPU verification test, such as PCIe, Serial Peripheral Interface (SPI), Inter Integrated Circuit (I2C), Improved Inter Integrated Circuit (I3C), etc., can be led out as test interfaces for verifying the related functions of the server CPU. Among them, the PCIe resources can be linked to an adapter card through a cable to implement the function verification of the server CPU.

[0107] Figure 8 FIG. is a schematic structural diagram of a computing module in a server central processing unit test and verification platform provided by an embodiment of the present application; Figure 9 FIG. is a schematic topological structure diagram of a computing module and a management module in a server central processing unit test and verification platform provided by an embodiment of the present application. The structure of the computing module 120 and the topology of the components included can be referred to Figure 8 and Figure 9 . Figure 9 The CPLD located on the motherboard side in is the first controller.

[0108] According to the server central processing unit test and verification platform provided by the embodiment of the present application, by adopting at least two test and verification channels, multiple server central processing units can be tested and verified simultaneously, and the efficiency of the server central processing unit test and verification can be improved.

[0109] In some embodiments of the present application, the test and verification channel includes at least one memory channel and a multi-channel input / output connector; the multi-channel input / output connector is used to connect the high-speed peripheral component interconnect port of the server central processing unit.

[0110] In actual execution, each test and verification channel can include at least one memory channel and a multi-channel input / output (MCIO) connector. Figure 9The connectors therein are all MCIO connectors, and both CPU0 and CPU1 are server CPUs; the two CPUs above can be connected to the connectors above or below themselves through PCIe cables to draw out PCIe signals. In addition, the CCIX0 port of CPU0 can be connected to two connectors through two PCIe cables or CCIX cables, and the CCIX0 port of CPU1 can be connected to two connectors through two PCIe cables or CCIX cables. The two connectors connected to the CCIX0 port of CPU0 can be respectively connected to a connector connected to the CCIX0 port of CPU1 through PCIe cables; the CCIX1 port of CPU0 can be connected to two connectors through two PCIe cables or CCIX cables, and the CCIX1 port of CPU1 can be connected to two connectors through two PCIe cables or CCIX cables. The two connectors connected to the CCIX1 port of CPU0 can be respectively connected to a connector connected to the CCIX1 port of CPU1 through PCIe cables. Among them, the CCIX (Cache Coherent Interconnect for Accelerators) protocol is an inter-chip interconnect protocol based on cache coherence, which can optimize the data transfer efficiency and resource sharing between processors and accelerators in heterogeneous computing systems.

[0111] In some embodiments, the memory channels in each test verification channel can be divided from the memory channels included in the memory installed on the motherboard.

[0112] In some embodiments, the computing module 120 can adopt the following configuration.

[0113] Support for dual CPUs. Exemplarily, the maximum value of the Thermal Design Power (TDP) of the CPU can be 300W.

[0114] The memory uses a single 16-channel 128GB DDR (Double Data Rate) 5 memory, such as Double Data Rate Synchronous Dynamic Random Access Memory (DDR SDRAM). Exemplarily, the memory can use a Dual-Inline-Memory-Modules (DIMM) with a bandwidth of X32.

[0115] PCIe resources can be drawn out through MCIO connectors and can be 2-way 16 PCIe CEM interfaces 121.

[0116] The on-board NVMe SSD can adopt a non-volatile storage high-speed solid-state drive 123 with an M.2 interface.

[0117] The network card can adopt an RJ45 interface network card and / or an Open Core Protocol (OCP) network card.

[0118] In some embodiments, at least one ear 113 can be provided on the first layer (specifically, it can be a tray) of the open frame 110. In some embodiments, the ear 113 can be provided with a video interface such as a Video Graphic Array (VGA) interface, etc. This video interface can be connected to the server CPU through a cable. In some embodiments, the ear 113 can be provided with a Universal Serial Bus (USB) interface, such as USB3.0, etc. This USB interface can be connected to the server CPU through a cable.

[0119] According to the server central processing unit test and verification platform provided by the embodiments of the present application, by each test and verification channel including at least one memory channel and a multi-channel input / output connector, and the multi-channel input / output connector connecting to the high-speed peripheral component interconnect port of the server central processing unit, a test and verification platform that can more accurately and quickly test and verify the high-speed peripheral component interconnect interface function of the server central processing unit can be realized. By each test and verification channel including at least one memory channel and a multi-channel input / output connection, the efficiency of testing and verifying the server central processing unit can be improved.

[0120] In some embodiments of the present application, the computing module 120 further includes an Open Core Protocol connector 122 to realize the automatic allocation of the high-speed peripheral component interconnect root components of multiple server central processing units.

[0121] In actual execution, the motherboard of the computing module 120 can also be provided with an Open Core Protocol (OCP) connector.

[0122] In some embodiments, when multiple server CPUs are installed on the motherboard, the Open Core Protocol connector 122 can automatically allocate the PCIe root components (Root complex, RC) of the above multiple server CPUs.

[0123] Figure 10 It is a schematic diagram of the connection relationship of the Open Core Protocol connector in a server central processing unit test and verification platform provided by the embodiments of the present application. The following combines Figure 10 , and an exemplary description is given of the process of the Open Core Protocol connector 122 automatically allocating the PCIe RC of multiple server CPUs.

[0124] The two server CPUs are respectively denoted as CPU0 and CPU1. The PCIe RC of CPU0 is CPU0 RC0, and the PCIe RC of CPU1 is CPU1 RC0. The OCP connector can be an OCP3.0 connector.

[0125] CPU0 RC0_H is connected to the OCP3.0 connector. The bandwidth of CPU0 RC0_H is defaulted to X8 bandwidth and supports expansion to form X16 bandwidth with CPU0RC0_L, and supports multi-host with CPU1 RC0_L.

[0126] Use 1pin OCP0_CABLE_PRSNT and 1pin OCP0_CPU_ADDR for distinction. When the CABLE for expansion is in place, the OCP0_CABLE_PRSNT signal is low, defaulting to high; when the CABLE is connected to CPU0 RC0_L, the OCP0_CPU_ADDR signal is low, and when the CABLE is connected to CPU1 RC0_L, the OCP0_CPU_ADDR signal is high, defaulting to low. Through the above signal changes, the PCIe RCs of multiple server CPUs can be automatically allocated.

[0127] According to the server central processing unit test and verification platform provided by the embodiments of the present application, by means of the open core protocol connector, the high-speed peripheral component interconnect root components of multiple server central processing units are automatically allocated, which can help test and verify multiple server central processing units simultaneously, improve the efficiency of server central processing unit test and verification, and can be applicable to more test and verification scenarios by providing various test conditions for multiple servers.

[0128] In some embodiments of the present application, the management module 130 includes a data center security control module 131 and a power module 132.

[0129] In actual execution, referring to Figure 3 , the management module 130 may include a data center security control module 131 and a power module 132.

[0130] The data center security control module 131 is a data center security control module (Data center SecureControl Module, DC-SCM), which transfers the general server management, security, and control functions from the typical motherboard architecture to a smaller general form factor module.

[0131] The power module 132 can be a power supply unit (PSU) for supplying power to each computing module 120, management module 130, heat dissipation module 140, and expansion module 150.

[0132] According to the server central processing unit test and verification platform provided by the embodiments of the present application, by using the data center security control module through the management module, the security control of the server central processing unit test and verification platform can be realized, the security of the server central processing unit test and verification can be improved, and through the power supply module, the operation of each functional module can be guaranteed, ensuring the successful implementation of the server central processing unit test and verification, and improving the efficiency of the server central processing unit test and verification.

[0133] In some embodiments of the present application, the data center security control module 131 includes a second controller and a baseboard management controller. Figure 11 It is a schematic structural diagram of the computing module and the management module in a server central processing unit test and verification platform provided by the embodiments of the present application.

[0134] In actual execution, referring to Figure 9 and Figure 11 , the data center security control module 131 may include a second controller and a baseboard management controller.

[0135] The second controller may adopt a complex programmable logic device (Complex Programmable Logic Device, CPLD), FPGA or a microcontroller unit (Microcontroller Unit, MCU), etc. Figure 9 The CPLD located on the data center security control module side in

[0136] In some embodiments, the second controller may cooperate with the baseboard management controller, and is specifically used for managing and controlling the computing module 120 and the heat dissipation module 140.

[0137] In some embodiments, the baseboard management controller may include a trusted platform module (Trusted Platform Module, TPM) and / or a trusted cryptography module (Trusted Cryptography Module, TCM).

[0138] According to the server central processing unit test and verification platform provided by the embodiments of the present application, by cooperating the second controller with the baseboard management controller to manage and control the computing module and the heat dissipation module, the security of the server central processing unit test and verification can be improved.

[0139] Figure 12 It is a schematic diagram of the heat dissipation module in a server central processing unit test and verification platform provided by the embodiments of the present application. Referring to Figure 12, in some embodiments of the present application, the heat dissipation module 140 includes a first heat dissipation component 141 and a second heat dissipation component 142; the first heat dissipation component 141 is disposed on the first layer of the open frame 110; the second heat dissipation component 142 is disposed on the second layer of the open frame 110.

[0140] In actual implementation, the heat dissipation module 140 may include two parts. One part is the first heat dissipation component 141 disposed on the first layer of the open frame 110, and the other part is the second heat dissipation component 142 disposed on the second layer of the open frame 110.

[0141] The first heat dissipation component 141 can be used to dissipate heat from the computing module 120 and the management module 130.

[0142] The second heat dissipation component 142 can be used to dissipate heat from the expansion module 150.

[0143] In some embodiments, both the first heat dissipation component 141 and the second heat dissipation component 142 can be connected to the aforementioned BMC through cables and managed by the BMC.

[0144] According to the server central processing unit test and verification platform provided by the embodiments of the present application, by disposing the first heat dissipation component on the first layer of the open frame and the second heat dissipation component on the second layer of the open frame, the heat dissipation of the functional module disposed on the first layer of the open frame is separated from the heat dissipation of the functional module disposed on the second layer of the open frame, which helps to adopt different heat dissipation schemes and strategies for the heat dissipation of the functional module disposed on the first layer of the open frame and the functional module disposed on the second layer of the open frame, so as to improve the heat dissipation performance and avoid waste of power.

[0145] In some embodiments of the present application, the first heat dissipation component 141 includes a first fan module 143 and a rotating component 144; the first fan module 143 is disposed at the first end of the rotating component 144; the second end of the rotating component 144 is connected to the first layer of the open frame 110 to realize the angular rotation of the first fan module 143 relative to the first layer of the open frame 110.

[0146] In actual implementation, the first fan module 143 may include multiple fans. For the number and model of the fans included in the first fan module 143, the embodiments of the present application do not make specific limitations.

[0147] The first fan module 143 can be connected to the first layer of the open frame 110 through a rotating component 144. The first fan module 143 can be fixedly connected to the first end of the rotating component 144. The second end of the rotating component 144 connected to the first layer of the open frame 110 can rotate, thereby driving the first fan module 143 to rotate relative to the first layer of the open frame 110, enabling the angle of the first fan module 143 to be adjusted, thereby changing the relative position and distance between the first fan module 143 and the computing module 120 and the management module 130, and changing the heat dissipation effect.

[0148] Exemplarily, Figure 12 Several different positions of the rotating component 144 are shown, which can correspond to multiple angles of rotation of the first fan module 143 relative to the first layer of the open frame 110.

[0149] In some embodiments, the management module 130 can be used to control the rotating component 144 to control the angle of rotation of the first fan module 143 relative to the first layer of the open frame 110. Through the above control, it is possible to provide heat dissipation conditions as needed according to actual test verification requirements, and perform more flexible or complex tests on the server CPU.

[0150] In some embodiments, the management module 130 can be used to control the power of the first fan module 143, etc. Through the above control, it is possible to provide heat dissipation conditions as needed according to actual test verification requirements, and perform more flexible or complex tests on the server CPU.

[0151] According to the server central processing unit test verification platform provided by the embodiments of the present application, the angle of the first fan module relative to the first layer of the open frame is rotated through the rotating component, and the angle can be adjusted according to actual test verification requirements to achieve a preset or optimal heat dissipation effect.

[0152] In some embodiments of the present application, the angle of rotation of the first fan module 143 relative to the first layer of the open frame 110 includes multiple preset angles.

[0153] In actual execution, multiple preset angles can be preset for the angle of rotation of the first fan module 143 relative to the first layer of the open frame 110. The angle of rotation of the first fan module 143 relative to the first layer of the open frame 110 can be adjusted to any of the above preset angles.

[0154] The present application embodiments do not limit the number and specific values of the preset angles. For example, the preset angles can include four gears such as 55°, 68°, 83°, and 120°, or three gears such as 30°, 45°, and 60°.

[0155] According to the server central processing unit test and verification platform provided by the embodiments of the present application, the first fan module can be rotated at any preset angle relative to the first layer of the open frame through the rotating component, and the angle can be adjusted according to the actual test and verification requirements to achieve the preset or optimal heat dissipation effect.

[0156] In some embodiments of the present application, a slide rail is provided on the second layer of the open frame 110; the second heat dissipation component 142 includes a second fan module 145; the second fan module 145 is slidably connected to the second layer of the open frame 110 through the slide rail.

[0157] In actual implementation, the second fan module 145 may include multiple fans. The number and model of the fans included in the second fan module 145 are not specifically limited in the embodiments of the present application.

[0158] The second fan module 145 can slide along the slide rail provided on the second layer of the open frame 110, so as to change the relative position and distance between the second fan module 145 and the expansion module 150, and change the heat dissipation effect.

[0159] In some embodiments, the management module 130 can be used for the movement of the second fan module 145 on the slide rail to control the position of the second fan module 145. Through the above control, it is possible to provide heat dissipation conditions as needed according to the actual test and verification requirements, and perform more flexible or complex tests on the server CPU.

[0160] In some embodiments, the management module 130 can be used to control the power of the second fan module 145, etc. Through the above control, it is possible to provide heat dissipation conditions as needed according to the actual test and verification requirements, and perform more flexible or complex tests on the server CPU.

[0161] According to the server central processing unit test and verification platform provided by the embodiments of the present application, the second fan module slides along the slide rail provided on the second layer of the open frame, and the angle can be adjusted according to the actual test and verification requirements to achieve the preset or optimal heat dissipation effect.

[0162] Those skilled in the art can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be implemented by electronic hardware, computer software, or a combination of the two. To clearly illustrate the interchangeability of hardware and software, the composition and steps of each example have been generally described according to functions in the above description. Whether these functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. Skilled professionals can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.

[0163] The above has introduced in detail a server central processing unit test and verification platform provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A server central processing unit test and verification platform, characterized in that Comprising: An open frame, a computing module, a management module, a heat dissipation module, and an expansion module; The computing module and the management module are disposed on the first layer of the open frame; The expansion module is disposed on the second layer of the open frame; the computing module is electrically connected to the management module and the expansion module respectively; the heat dissipation module is electrically connected to the management module; The computing module is configured to execute test and verification tasks for the server central processing unit; The management module is configured to manage and control the computing module and the heat dissipation module; The heat dissipation module is configured to dissipate heat from the computing module, the management module, and the expansion module; The expansion module is configured to connect auxiliary test equipment; the auxiliary test equipment has an interface electrically connected to the server central processing unit to implement test and verification of the interface function of the server central processing unit.

2. The server central processing unit test and verification platform according to claim 1, wherein The expansion module includes an adapter card module; The auxiliary test equipment connected to the adapter card module includes a high-speed peripheral component interconnect device.

3. The server central processing unit test and verification platform according to claim 1 or 2, characterized in that The expansion module includes a first hard disk module; The auxiliary test equipment connected to the first hard disk module includes a target hard disk in the form factor of an enterprise and data center solid state drive.

4. The server central processing unit test and verification platform according to claim 1 or 2, characterized in that The expansion module includes a second hard disk module; The auxiliary test equipment connected to the second hard disk module includes a non-volatile memory express solid state drive.

5. The server central processing unit test and verification platform according to claim 3, wherein The first hard disk module includes a first housing; the first housing is provided with a first opening and a first backplane; the first opening and the first backplane are oppositely arranged; The first surface of the first backplane is used for electrically connecting to the target hard disk; the second surface of the first backplane is provided with a first interface; the first interface is used for electrically connecting to the server central processing unit.

6. The server central processing unit test and verification platform according to claim 4, characterized in that, The second hard disk module includes a second housing; the second housing is provided with a second opening and a second backplane; the second opening and the second backplane are oppositely arranged; The first surface of the second backplane is used for electrically connecting to the non-volatile memory express solid state drive; the second surface of the second backplane is provided with a second interface; the second interface is used for electrically connecting to the server central processing unit.

7. The server central processing unit test and verification platform according to claim 1, wherein The computing module includes a motherboard, a first controller, an on-board non-volatile memory express solid state drive, and at least two test and verification channels; each test and verification channel is respectively used for connecting a server central processing unit; the first controller is configured to execute test and verification tasks for the server central processing unit.

8. The server central processing unit test and verification platform according to claim 7, characterized in that The test and verification channel includes at least one memory channel and a multi-channel input / output connector; The multi-channel input / output connector is used for connecting the high-speed peripheral component interconnect port of the server central processing unit.

9. The server central processing unit test and verification platform according to claim 7 or 8, characterized in that The computing module further includes an Open Core Protocol connector to implement automatic allocation of the high-speed peripheral component interconnect root components of multiple server central processing units.

10. The server central processing unit test and verification platform according to claim 1, characterized in that, The management module includes a data center security control module and a power module.

11. The server central processing unit test and verification platform according to claim 10, characterized in that, The data center security control module includes a second controller and a baseboard management controller.

12. The server central processing unit test and verification platform according to claim 1, characterized in that, The heat dissipation module includes a first heat dissipation component and a second heat dissipation component; The first heat dissipation component is disposed on the first layer of the open frame; the second heat dissipation component is disposed on the second layer of the open frame.

13. The server central processing unit test and verification platform according to claim 12, characterized in that, The first heat dissipation component includes a first fan module and a rotating component; The first fan module is disposed at the first end of the rotating component; the second end of the rotating component is connected to the first layer of the open frame, so as to realize the angular rotation of the first fan module relative to the first layer of the open frame.

14. The server central processing unit test and verification platform according to claim 13, characterized in that, The angles of rotation of the first fan module relative to the first layer of the open frame include a plurality of preset angles.

15. The server central processing unit test and verification platform according to any one of claims 12 to 14, characterized in that, A slide rail is provided on the second layer of the open frame; the second heat dissipation component includes a second fan module; the second fan module is slidably connected to the second layer of the open frame through the slide rail.

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