V-COB packaging device and method for ultra-high-definition display screen module

Abstract

The present invention relates to the field of display chip packaging technology, specifically to a V‑COB packaging device and method for ultra-high-definition display screen modules, comprising a workbench and several sealing heads installed above it, a packaging table placed on the top surface of the workbench, a board box provided at the rear of one side of the packaging table, several placement boxes placed inside the board box for neatly storing several display module circuit boards; a conveying group is provided inside the top surface of one side of the packaging table, and a core adhesive group is provided above the board box, which cooperates with the conveying group to pull the placement box forward, thereby coating the chip with glue and sticking it to several display module circuit boards. The present invention completes the automation of the entire process from circuit board feeding, chip placement, gluing to pressing through the dynamic coordination of the provided core adhesive group, conveying group and core pressing wheel, thereby improving the efficiency of a single process and the chip bonding yield, and laying an efficient foundation for subsequent wire bonding and sealing curing.

Description

Technical Field

[0001] The present invention relates to the technical field of display chip packaging, and in particular to a V-COB packaging device and method for an ultra-high-definition display screen module. Background Art

[0002] COB packaging technology adheres a bare chip to an interconnect substrate using conductive or non-conductive adhesive, followed by wire bonding to achieve electrical connections. This technology has become a mainstream choice for LED displays due to its ultra-lightweight, impact-resistant, high-viewing angle, and bendability. V-COB is an optimized version of standard COB technology. The "V" emphasizes its specialized optimizations and enhancements for visual display quality. For example, improvements to the encapsulation adhesive, materials, and manufacturing processes improve light efficiency and reduce halo and glare.

[0003] Patent application number CN202322652279.9 discloses a COB packaged display screen, comprising a mounting plate assembly; a display screen assembly, which is fixed to the mounting plate assembly and includes multiple interconnected COB display structures and a light shielding layer, with the multiple COB display structures covered by the light shielding layer on their circumferential sides; and a dust removal assembly, which is movably disposed on the light-emitting surface of the display screen assembly. This patent's technical solution effectively solves the existing problem of light mixing caused by interference between refracted light between adjacent modules when multiple COB modules are spliced ​​together.

[0004] In the COB packaging process for ultra-high-definition display screens, chip bonding efficiency directly affects overall production capacity. Traditional bonding methods suffer from low positioning accuracy and poor operational consistency. Although the aforementioned patent solves the light interference problem after the COB display screen is spliced ​​through the design of a light-shielding layer, its core technology focuses on optical optimization and dust removal after the packaging is completed, and does not involve automated improvements to the chip bonding process. Especially in large-scale production, precise alignment of chips and circuit boards, uniform glue coating, and lossless pressing remain technical bottlenecks, resulting in low efficiency in the front-end packaging process and restricting overall production capacity improvement. Summary of the Invention

[0005] In order to overcome the defects in the prior art, the purpose of the present invention is to provide a V-COB packaging device and method for an ultra-high-definition display screen module. Through the dynamic coordination of the core bonding group, the conveying group and the pressing mechanism in the early bonding process of the chip packaging, the entire process from circuit board feeding, chip placement, gluing to pressing is automated, thereby improving the efficiency of a single process to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above objectives, on the one hand, the present invention provides a V-COB packaging device for an ultra-high-definition display screen module, comprising a workbench and several sealing heads installed above it, a packaging table placed on the top surface of the workbench, a board box provided behind one side of the packaging table, and several placement boxes placed inside the board box for neatly storing several display module circuit boards;

[0007] A conveying group is provided on the top surface of one side of the packaging table, and a core sticking group is provided above the board box, which cooperates with the conveying group to pull the placement box forward, and the chips are glued and glued to a number of display module circuit boards; a shifting block is provided at the middle of the front end of the placement box, and the conveying group includes a conveyor belt and a servo motor provided flush with the top surface of the packaging table, and shifting teeth are symmetrically provided on the outer sides of both ends of the conveyor belt. A spring-loaded support plate is installed inside the board box, and the top surface of the board box is open and an inclined guide platform is provided on the top of the rear side surface thereof, which is used to guide the placement box on the top layer to move forward and displace, and then the shifting block is driven by the contact of the shifting teeth;

[0008] The core sticking group includes a pair of vertically arranged core placing tubes, a pair of vertically arranged glue liquid tubes and a core delivering group rotatably connected to the bottom of the core placing tubes. The core delivering group consists of a pair of core delivering sleeves, a pair of ventilation sleeves and a ventilation tube coaxially connected, wherein the core delivering sleeve is adapted to fit the outer side surface of the ventilation sleeve, and the outer side surface of the core delivering sleeve is symmetrically provided with core placing grooves, and an air extraction channel is provided between the ventilation tube and the core placing groove. The inner wall of the bottom of the air extraction channel is provided with a sealing rod, the rotation ratio of the conveyor belt and the core delivering sleeve is 2:1, and the bottom end of the glue liquid tube is open and is slidably connected to a rubber wheel.

[0009] The above-mentioned setting significantly improves the automation level of the chip bonding process through innovative mechanical linkage design and modular structure.

[0010] As a further improvement of the present technical solution, a box delivery port is provided on the rear side wall of the board box and at the bottom of the inclined guide platform. The placement box is adapted to be slidably plugged into the box delivery port. Limit platforms are fixed on both sides of the top port of the board box, and the limit platforms protrude from the inner side wall of the board box.

[0011] As a further improvement of the present technical solution, one end of the roller of the conveyor belt near the end of the plate box is coaxially connected to a driving pulley, one end of the ventilation pipe is provided with a driven pulley through a bearing sleeve, the driven pulley and a pair of ventilation sleeves are coaxially connected through straight pipes, the other end of the ventilation pipe is connected to an air pump, the circumference of the driving pulley is equal to the side length of the display module circuit board in the forward movement direction, the circumference of the driven pulley is twice the circumference of the driving pulley, and the driven pulley and the driving pulley are connected by a transmission belt.

[0012] As a further improvement of the present technical solution, a through hole is provided on the bottom surface of the core-setting groove, and a plurality of ventilation holes are provided on the outer side surface of the ventilation sleeve in a circular shape at equal intervals, and the ventilation holes are connected to the straight tube, and a ring is fixed above both ends of the sealing rod and the ring is tangent to the arc surface of the bottom side of the sealing rod, the sealing rod is inserted into the straight tube and contacts its bottom side wall, and a hook is fixed on the bottom surface of the outer end ring of the sealing rod, and the hook is engaged with the side walls of the bracket at both ends of the straight tube.

[0013] As a further improvement of the present technical solution, through grooves are symmetrically provided on both side walls of the core placing barrel, and the outer side of the bottom end of the core placing barrel is tightly sleeved on the card cover, and the card cover is connected to the core feeding sleeve.

[0014] As a further improvement of the present technical solution, the bottom end of the glue cylinder is provided with an oblique opening, and waist-shaped holes are provided on both side walls of the oblique opening. The two ends of the wheel axle of the rubber wheel are correspondingly plugged and slid into the two waist-shaped holes.

[0015] As a further improvement of the present technical solution, linkage rods are provided at both ends of the axle of the rubber wheel, and the bottom end of the linkage rod is adapted to slide and engage with the outer side surface of the core feeding sleeve. Slide grooves are provided on both end surfaces of the core feeding sleeve and located outside the core placing groove. The upper end of the linkage rod is in contact with a spring piece, and the two ends of the spring piece are fixed to the outer wall of the glue cylinder. The spring piece is straight in its natural state and close to the bottom of the waist-shaped hole. When the core feeding sleeve is rotated to the linkage rod with the chip, the linkage rod slides into the slide groove under the elastic force of the spring piece, driving the rubber wheel to contact the chip surface and roll relatively to apply glue.

[0016] As a further improvement of the present technical solution, a pair of core pressing wheels are supported on the top surface of the packaging table and located at the rear end of the conveyor belt. The pair of core pressing wheels are aligned front to back with a pair of core feeding sleeves. A transmission gear is provided at one end of the axle of the pair of core pressing wheels. Another transmission gear is coaxially connected to the outside of the active pulley, and the two transmission gears are engaged for transmission.

[0017] As a further improvement of the present technical solution, a door-shaped support frame is set above the middle part of the board box, a pressure rod is inserted in the middle of the top surface of the support frame, and a hemispherical pressure pad is sleeved on the bottom end of the pressure rod. The core tube and the glue tube are both sleeved in a support frame extended and fixed on the top surface of the support frame.

[0018] In another aspect, the present invention provides a V-COB packaging method for an ultra-high-definition display screen module, using the aforementioned V-COB packaging device for an ultra-high-definition display screen module, comprising the following steps:

[0019] S1. Place several chips in a core placement barrel, fill the barrel with glue, then neatly place several display module circuit boards in a placement box, and then place several placement boxes filled with display module circuit boards into a board placement box;

[0020] Several placement boxes are ejected by the pallet, and the rear end of the placement box on the top layer is guided by the inclined guide platform to slide against the front of the top port of the board box, thereby forming a misaligned state with the placement box below;

[0021] S2, at this time, the servo motor is started to drive the conveyor belt to circulate. When a shifting tooth moves to the front end of the board box, it contacts the shifting block and drives the placement box to move to the top surface of the packaging table;

[0022] S3. When all the cassettes are moved to the top of the packaging table, the vacuum pump is started to extract air through the through-hole of the core feeding sleeve to suck a chip. The speed of the conveyor belt is reduced by the driving pulley and the driven pulley, and the core feeding sleeve is driven to put down the chip every half a circle.

[0023] S4, during step S3, the chip is transferred to the glue cylinder along with the core feeding sleeve, and is contacted by the glue wheel and rolled to apply glue;

[0024] S5, the chip is then bonded into place by the flexible rolling of the core pressing wheel;

[0025] S6. After the chips of the circuit boards in the placement box are bonded, wire bonding is performed to achieve electrical connection, and then the placement box is transferred to the bottom of the sealing head for sealing curing.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] 1. The V-COB packaging device and method for the ultra-high-definition display screen module completes the automation of the entire process from circuit board feeding, chip placement, glue coating to pressing through the dynamic coordination of the core bonding group, conveying group and core pressing wheel, thereby improving the efficiency of each single process and the chip bonding yield, laying an efficient foundation for subsequent wire bonding and sealing curing.

[0028] 2. The V-COB packaging device and method for the ultra-high-definition display screen module uses the offset guidance design of the spring support plate and the inclined guide table in the board box to complete the automatic lifting and forward displacement of the placement box. This achieves the effect that the placement box can be accurately grasped by the conveyor belt without human intervention, realizes the continuous supply of circuit boards, and reduces the interval time between processes.

[0029] 3. The V-COB packaging device and method of the ultra-high-definition display screen module, through the design of the rotary exhaust channel of the core feeding sleeve and the vent sleeve, cooperates with the sealing control of the sealing rod to the lower vent hole, completes the adsorption of the chip in the core placement groove and the directional downward release; achieves the effect of zero displacement in the chip transfer process, and the landing position is precisely matched with the circuit board pad; and through the clamping structure of the linkage rod and the core feeding sleeve slide, combined with the spring force storage to drive the rubber wheel to slide obliquely, completes the rolling quantitative glue coating on the back of the chip; achieves the effect of uniform and controllable thickness of the glue layer, and avoids bonding failure caused by incomplete coverage of the glue liquid.

[0030] 4. The V-COB packaging device and method for the ultra-high-definition display screen module completes the tangential rolling of the chip through the counter-rotation design of the gear transmission of the core pressing wheel and the conveyor belt, achieving the effect of flexible pressure bonding and preventing chip displacement or damage caused by static pressing.

[0031] 5. The V-COB packaging device and method of the ultra-high-definition display screen module achieves compatibility and adaptation with circuit boards of different sizes and chip arrangements through customized design of the core sleeve specifications and core slot layout; it achieves the effect of equipment being replaced and used immediately, and supports the rapid production conversion of multiple models of products. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The drawings described herein are for illustrative purposes only and are not intended to limit the scope of the present invention in any way. In addition, the shapes and proportional dimensions of the various components in the drawings are merely illustrative and are used to help understand the present invention, and are not intended to specifically limit the shapes and proportional dimensions of the various components of the present invention. Those skilled in the art will select various possible shapes and proportional dimensions to implement the present invention according to the specific circumstances under the guidance of the present invention.

[0033] Figure 1 It is a schematic diagram of the overall assembly structure of the present invention;

[0034] Figure 2 For the present invention Figure 1 A top view of

[0035] Figure 3 It is a schematic diagram of the partial assembly structure of the present invention;

[0036] Figure 4 This is a schematic diagram of the assembly structure of the packaging station, conveying group and core bonding group of the present invention;

[0037] Figure 5 For the present invention Figure 4 A partial cross-sectional view of a side view of the

[0038] Figure 6 This is a schematic diagram of the packaging platform structure of the present invention;

[0039] Figure 7 This is a disassembled diagram of the conveying group and the core feeding group of the present invention;

[0040] Figure 8 This is a schematic diagram of the assembly structure of the core placement cylinder, glue liquid cylinder and core feeding sleeve of the present invention;

[0041] Figure 9 It is a schematic structural diagram of the core feeding sleeve of the present invention;

[0042] Figure 10 This is a disassembled diagram of the glue cylinder and the rubber wheel assembly of the present invention;

[0043] Figure 11 This is a schematic diagram of the assembly structure of the pressure rod and the support frame of the present invention;

[0044] Figure 12 This is a schematic diagram of the core pressing wheel assembly structure of the present invention;

[0045] The meaning of each number in the figure is:

[0046] 100, workbench; 110, sealing head; 120, packaging table; 121, limit strip; 122, avoidance groove; 130, board box placement; 131, box delivery port; 132, inclined guide table; 133, limit table; 140, box placement; 141, shifting block;

[0047] 200, conveying group; 210, conveyor belt; 211, shifting gear; 220, servo motor; 230, driving pulley;

[0048] 300, core bonding assembly; 310, core placement barrel; 311, through slot; 312, cover; 320, core feeding assembly; 321, core feeding sleeve; 3211, core placement slot; 3212, through hole; 3213, slideway; 322, vent sleeve; 3221, vent hole; 323, vent pipe; 324, driven pulley; 325, sealing rod; 330, glue cylinder; 3301, oblique opening; 3302, waist-shaped hole; 331, rubber wheel; 332, linkage rod; 333, spring piece;

[0049] 340, core pressing wheel; 341, transmission gear; 350, pressure rod; 351, pressure pad; 360, support frame; 361, support frame. DETAILED DESCRIPTION

[0050] The details of the present invention can be more clearly understood in conjunction with the accompanying drawings and the description of the specific embodiments of the present invention. However, the specific embodiments of the present invention described herein are for illustrative purposes only and are not to be construed as limiting the present invention in any way. Under the guidance of the present invention, any possible variations of the present invention conceived by skilled artisans should be considered within the scope of the present invention. The terms "mounted" and "connected" should be understood broadly, meaning direct connection as well as indirect connection through an intermediary.

[0051] The terms "central axis," "vertical," "horizontal," "front," "back," "up," "down," "left," "right," "top," "bottom," "inside," and "outside" used herein to indicate positions or location relationships are based on the positions or location relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. Furthermore, in the description of the present invention, "several" means two or more, unless otherwise specifically defined.

[0052] See also Figure 1-Figure 7 As shown, the present invention provides a V-COB packaging device for an ultra-high-definition display screen module, including a workbench 100 and several sealing heads 110 installed above it. A glue supply tank for supplying epoxy resin glue to the several sealing heads 110 is provided at the rear of the workbench 100. This is a prior art and will not be described in detail here. A packaging table 120 is placed on the top surface of the workbench 100, and a board box 130 is provided at the rear of one side of the packaging table 120. Several placement boxes 140 are placed inside the board box 130 for neatly storing several display module circuit boards. A limiting strip 121 is embedded on the top surface of the packaging table 120 and located below the entirety of the several sealing heads 110 for limiting the placement box 140 so that the chip on the circuit board is aligned with the sealing head 110 and then packaged by glue injection.

[0053] Specifically, a conveying group 200 is provided on the top surface of one side of the packaging table 120, and a core gluing group 300 is provided above the board box 130. The conveying group 200 cooperates with the forward pulling of the placement box 140 to coat the chips with glue and stick them to several display module circuit boards; a shift block 141 is provided in the middle of the front end of the placement box 140, and the conveying group 200 includes a conveyor belt 210 and a servo motor 220 that are flush with the top surface of the packaging table 120. An avoidance groove 122 is provided on the top surface of the packaging table 120 and in front of the board box 130 for placing the conveyor belt 210, so as to contact the placement box 140 and move it to the packaging table 120.

[0054] Furthermore, shifting teeth 211 are symmetrically provided on the outer sides of both ends of the conveyor belt 210, and a spring-loaded support plate is installed inside the plate box 130. A spring-loaded elastic force is formed by symmetrically embedding a number of springs on the bottom surface of the support plate, so that the several placement boxes 140 placed in the plate box 130 are always pushed up and taken out horizontally by the conveyor belt 210; the top surface of the plate box 130 is open and an inclined guide platform 132 is provided on the top of its rear side surface, whose longitudinal section is a right triangle with the inclined surface facing forward, which is used to guide the placement boxes 140 on the top layer to move forward and dislocate, and then the shifting block 141 is contacted and driven by the shifting teeth 211; by chamfering the top edge of the rear end of the placement box 140 to slide with the inclined guide platform 132, the placement box 140 contacts the inclined guide platform 132 when it is pushed up by the support plate and is smoothly guided forward.

[0055] Furthermore, a box delivery port 131 is provided on the rear side wall of the board box 130 and at the bottom of the inclined guide platform 132. The placement box 140 is adapted to be slidably plugged into the box delivery port 131. By pressing the placement box 140 above to expose the box delivery port 131, a new placement box 140 can be inserted; limit platforms 133 are fixedly provided on both sides of the top port of the board box 130. The limit platforms 133 protrude from the inner side wall of the board box 130 and are used to limit a number of placement boxes 140 from being pushed out of the board box 130.

[0056] like Figures 8-12 As shown, the core sticking group 300 includes a pair of vertically arranged core setting tubes 310, a pair of vertically arranged glue liquid tubes 330 and a core sending group 320 rotatably connected to the bottom of the core setting tube 310, and the core sending group 320 is composed of a pair of core sending sleeves 321, a pair of ventilation sleeves 322 and a ventilation pipe 323 coaxially connected. Among them, the core sending sleeve 321 is adapted to be matched with the outer side surface of the ventilation sleeve 322, and the outer side surface of the core sending sleeve 321 is symmetrically provided with a core setting groove 3211, and an air extraction channel is provided between the ventilation pipe 323 and the core setting groove 3211. The specifications of the core sending sleeve 321 and the specifications, positions and quantities of the core setting grooves 3211 are all the same. It is customized according to the size of the circuit board and the chip bonding position so that it can be quickly replaced and used; the two ends of the straight tube are fixedly connected to the top surface of the board box 130 by a bracket, and the core feeding sleeve 321 can be replaced by removing one end of the bracket; the inner wall of the bottom of this exhaust duct is provided with a sealing rod 325, which is used to seal the exhaust duct when the core placing groove 3211 is rotated to the bottom, so that the chip in the core placing groove 3211 loses suction and falls onto the circuit board; the rotation ratio of the conveyor belt 210 and the core feeding sleeve 321 is 2:1, and the bottom end of the glue cylinder 330 is open and is slidably connected to the glue wheel 331, which is used to contact the chip to apply glue and bond it to the circuit board.

[0057] Specifically, one end of the roller of the conveyor belt 210 near the end of the board placement box 130 is coaxially connected to a driving pulley 230. One end of the ventilation tube 323 is provided with a driven pulley 324 through a bearing sleeve. The driven pulley 324 is coaxially connected to a pair of ventilation sleeves 322 via a straight pipe. The other end of the ventilation tube 323 is connected to an air pump. The circumference of the driving pulley 230 is equal to the side length of the display module circuit board in the forward movement direction. The circumference of the driven pulley 324 is twice the circumference of the driving pulley 230. The driven pulley 324 and the driving pulley 230 are connected by a transmission belt. That is, when the conveyor belt 210 pulls the placement box 140 forward by one stroke according to the length of the circuit board, the rotation ratio of the driven pulley 324 and the driving pulley 230 is converted, and the core feeding sleeve 321 drives the chip to rotate half a circle, just enough to drop the chip downward to the predetermined position on the circuit board for bonding.

[0058] Furthermore, a through hole 3212 is provided on the bottom surface of the core groove 3211, and a plurality of vent holes 3221 are provided on the outer surface of the vent sleeve 322 in a circular shape with equal intervals, and the vent holes 3221 are connected to the straight tube. A collar is fixed above both ends of the sealing rod 325 and the collar is tangent to the arc surface of the bottom side of the sealing rod 325. The sealing rod 325 is inserted into the straight tube and contacts the bottom side wall thereof. The collar rotates relative to the inner wall of the straight tube. A silicone sheet is bonded to the bottom side wall of the sealing rod 325 to seal the vent holes 3221 below. The sealing rod 325 is fixed with a hook on the bottom of the outer end ring, and the hook is engaged with the side walls of the brackets at both ends of the straight tube, so that the sealing rod 325 is fixed and does not rotate synchronously with the vent sleeve 322 and the straight tube, and always seals the vent hole 3221 turned to the bottom, so that the chip falls out of the core groove 3211 when facing downward; the outer ring is provided with a rubber plug for sealing the straight tube, so that air can only be extracted from a number of vent holes 3221 to ensure the strength of the adsorption of the chip.

[0059] Furthermore, through grooves 311 are symmetrically provided on both side walls of the core barrel 310, which is convenient for observing the chips placed in the core barrel 310 and adjusting several chips to be stacked horizontally from the through grooves 311; the outer side of the bottom end of the core barrel 310 is tightly sleeved on the card cover 312, and the card cover 312 is connected to the core feeding sleeve 321. The two side edges of the card cover 312 extend to the outside of the ventilation sleeve 322 to axially limit the core feeding sleeve 321. In addition, the outer wall of the ventilation sleeve 322 is provided with an axial groove, and the inner wall of the core feeding sleeve 321 is protruded with an axial rib, and the rib and the groove are arranged relative to each other and plugged in, so that the through hole 3212 is correspondingly connected with the ventilation hole 3221.

[0060] Furthermore, an oblique opening 3301 is obliquely provided at the bottom end of the glue cylinder 330. When installing the glue cylinder 330, the oblique opening 3301 is placed toward the core feeding sleeve 321. Waist-shaped holes 3302 are provided on both side walls of the oblique opening 3301. The two ends of the axle of the rubber wheel 331 are correspondingly plugged and slid into the two waist-shaped holes 3302, so that the rubber wheel 331 slides obliquely in the oblique opening 3301, while ensuring that the glue in the glue cylinder 330 does not leak.

[0061] Specifically, in order to apply glue to the back of the chip, linkage rods 332 are sleeved on both ends of the axle of the glue wheel 331. The bottom end of the linkage rod 332 is adapted to slide and engage with the outer side of the core feeding sleeve 321, thereby forming a limiting structure to prevent the linkage rod 332 from rotating with the glue wheel 331. By increasing the length of the arc surface of the linkage rod 332 contacting the core feeding sleeve 321, the limiting stability is increased.

[0062] The two end surfaces of the core feeding sleeve 321 and the outer side of the core setting groove 3211 are provided with a slide groove 3213, the linkage rod 332 is engaged and slid with the slide groove 3213, and the central angle of the slide groove 3213 is at least equal to the central angle of the core setting groove 3211. By increasing the sliding stroke of the linkage rod 332 and the slide groove 3213, the range of contact between the rubber wheel 331 and the chip is controlled, and the glue is fully applied; the upper end of the linkage rod 332 is abutted with a spring piece 333, which is made of spring steel and has a straight sheet structure. When the core sleeve 321 is transferred to the linkage rod 332 with the chip, the linkage rod 332 slides into the slide groove 3213 under the elastic force of the spring piece 333, driving the rubber wheel 331 to contact the chip surface and roll relative to the glue.

[0063] In addition, in order to ensure that the chip is firmly bonded, a pair of core pressing wheels 340 are supported on the top surface of the packaging platform 120 and located at the rear end of the conveyor belt 210. The pair of core pressing wheels 340 are aligned front and back with the pair of core feeding sleeves 321. One end of the wheel shaft of the pair of core pressing wheels 340 is sleeved with a transmission gear 341, and both ends of the wheel shaft are also sleeved with rings and fixed to the top surface of the packaging platform 120; the outside of the active pulley 230 is coaxially connected to another transmission gear 341, and the two transmission gears 341 are engaged for transmission, thereby transmitting the rotational force of the conveyor belt 210 to the core pressing wheel 340, and rotating in the opposite direction, and tangentially rolling the chip on the circuit board to prevent the chip from being touched and squeezed by the stationary core pressing wheel 340 and shifting.

[0064] Furthermore, a door-shaped support frame 360 ​​is set above the middle of the board box 130, and a pressure rod 350 is inserted in the middle of the top surface of the support frame 360. A spring is sleeved on the outer wall of the pressure rod 350 and located above the top surface of the support frame 360. By pressing the pressure rod 350 to contact the placement box 140 located above and exposing the box delivery port 131, a new placement box 140 can be inserted; when the hand is released, the pressure rod 350 is reset upward under the rebound action of the spring; the bottom end of the pressure rod 350 is sleeved with a hemispherical pressure pad 351, which is made of silicone material, so that it can flexibly contact the circuit board to avoid damage due to pressure; the core tube 310 and the glue tube 330 are both sleeved in a support frame 361 that is fixedly extended from the top surface of the support frame 360, so that the two can work stably in the air.

[0065] The present invention also provides a V-COB packaging method for an ultra-high-definition display screen module, using the above-mentioned V-COB packaging device for an ultra-high-definition display screen module, comprising the following steps:

[0066] S1. Place several chips in the core cylinder 310, fill the glue cylinder 330 with conductive glue, then neatly place several display module circuit boards in the placement box 140, and then place the placement boxes 140 filled with display module circuit boards into the board placement box 130; air holes are opened in the top cover of the glue cylinder 330 to allow the glue to fall smoothly and contact the surface of the glue wheel 331;

[0067] Several placement boxes 140 are ejected by the pallet, and the rear end of the placement box 140 on the top layer is guided by the inclined guide platform 132 to slide against the front of the top end of the plate box 130, thereby forming a misaligned state with the placement box 140 below;

[0068] S2, the servo motor 220 is started to drive the conveyor belt 210 to circulate. When a shifting tooth 211 reaches the front end of the plate placing box 130, it contacts the shifting block 141 and drives the placing box 140 to move to the top surface of the packaging table 120.

[0069] S3. When all the placement boxes 140 are moved to the top surface of the packaging table 120, the vacuum pump is started to extract air through the through hole 3212 of the core feeding sleeve 321 to suck a chip. The speed of the conveyor belt 210 is reduced by the driving pulley 230 and the driven pulley 324, and the core feeding sleeve 321 is driven to release the chip every half a circle.

[0070] S4. During step S3, the chip is transferred to the glue cylinder 330 along with the core feeding sleeve 321. The linkage rod 332 is elastically pushed into the slide groove 3213 by the elastic force of the spring 333, driving the glue wheel 331 to contact the chip surface and roll relative to the chip to apply glue.

[0071] S5, the chip is then flexibly rolled and bonded into place by the core pressing wheel 340;

[0072] S6. After the chips of the circuit boards in the placement box 140 are bonded, wire bonding is performed to achieve electrical connection, and then the placement box 140 is transferred to the bottom of the sealing head 110 for sealing and curing.

[0073] It should be noted that the fixed connection and fixed arrangement of the present invention are achieved using conventional fixing means such as bolt connections or welding. The above embodiments are merely illustrative of the technical concepts and features of the present invention. Their purpose is to enable those familiar with the art to understand the content of the present invention and implement it accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made in accordance with the spirit and essence of the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. A V-COB packaging device for ultra-high-definition display screen modules includes a workbench and several sealing heads mounted above it, with a glue supply tank behind the workbench for supplying epoxy resin glue to the sealing heads. The device is characterized by: A packaging table is placed on the top surface of the workbench, and a board placement box is provided behind one side of the packaging table, and a plurality of placement boxes are placed inside the board placement box; A conveyor group is provided on the top surface of one side of the packaging table, and a core gluing group is provided above the board placement box, which cooperates with the conveyor group to pull the placement box forward, thereby applying glue to the chips and gluing them to a number of display module circuit boards; the conveyor group includes a conveyor belt and a servo motor provided flush with the top surface of the packaging table, and shifting teeth are symmetrically provided on the outer sides of both ends of the conveyor belt. The top surface of the board placement box is open, and an inclined guide platform is provided on the top of its rear side surface, which is used to guide the placement box on the top layer to move forward and displace, and then be driven by the contact of the shifting teeth; The core sticking group includes a pair of vertically arranged core placing cylinders, a pair of vertically arranged glue liquid cylinders, and a core feeding group rotatably connected to the bottom of the core placing cylinders, the bottom ends of the glue liquid cylinders are open and slidably connected to the glue wheels; The air filter press has a plurality of air intakes and an air intake that is adapted to move the air intake pipe relative to the air intake pipe, and a plurality of air intakes are installed at the air intake pipe to move the air intake pipe relative to the air intake pipe.

2. The V-COB packaging device for an ultra-high-definition display screen module according to claim 1, characterized in that: A box delivery opening is provided on the rear side wall of the board box and at the bottom of the inclined guide platform. A spring-loaded support plate is installed inside the board box. The placement box is adapted to be slidably plugged into the box delivery opening. Limit platforms are fixedly provided on both sides of the top port of the board box. The limit platforms protrude from the inner side wall of the board box. A shift block is provided at the middle of the front end of the placement box.

3. The V-COB packaging device for an ultra-high-definition display screen module according to claim 2, characterized in that: A through hole is provided on the bottom surface of the core-setting groove, and a plurality of ventilation holes are provided on the outer side surface of the ventilation sleeve in a circular shape and at equal intervals, and the ventilation holes are connected to the straight tube. Rings are fixed above both ends of the sealing rod and the rings are tangent to the arc surface of the bottom side of the sealing rod. The sealing rod is inserted into the straight tube and contacts its bottom side wall. A hook is fixed on the bottom surface of the outer end ring of the sealing rod, and the hook is engaged with the side walls of the bracket at both ends of the straight tube.

4. The V-COB packaging device for an ultra-high-definition display screen module according to claim 3, wherein: Through grooves are symmetrically provided on both side walls of the core-setting cylinder. The outer side of the bottom end of the core-setting cylinder is tightly sleeved on the card cover, and the card cover is connected to the core-feeding sleeve.

5. The V-COB packaging device for an ultra-high-definition display screen module according to claim 4, characterized in that: The bottom end of the glue cylinder is obliquely provided with an oblique opening, and waist-shaped holes are opened on both side walls of the oblique opening. The two ends of the wheel shaft of the rubber wheel are correspondingly plugged and slid into the two waist-shaped holes.

6. The V-COB packaging device for an ultra-high-definition display screen module according to claim 5, characterized in that: Linkage rods are also provided at both ends of the wheel axle of the rubber wheel, and the bottom end of the linkage rod is adapted to slide and engage with the outer side surface of the core feeding sleeve. Slide grooves are provided on both end surfaces of the core feeding sleeve and located outside the core placement groove. The upper end of the linkage rod is in contact with a spring piece, and the two ends of the spring piece are fixed to the outer wall of the glue cylinder. The spring piece is straight in its natural state and close to the bottom of the waist-shaped hole. When the core feeding sleeve is rotated to the linkage rod with the chip, the linkage rod slides into the slide groove under the elastic force of the spring piece, driving the rubber wheel to contact the chip surface and roll relative to apply glue.

7. The V-COB packaging device for an ultra-high-definition display screen module according to claim 6, characterized in that: A pair of core pressing wheels are supported on the top surface of the packaging table and located at the rear end of the conveyor belt. The pair of core pressing wheels are aligned front and back with a pair of core feeding sleeves. A transmission gear is sleeved on one end of the wheel axle of the pair of core pressing wheels. Another transmission gear is coaxially connected to the outside of the active pulley, and the two transmission gears are engaged for transmission.

8. The V-COB packaging device for an ultra-high-definition display screen module according to claim 7, characterized in that: A door-shaped support frame is set above the middle of the board box, a pressure rod is inserted in the middle of the top surface of the support frame, and a hemispherical pressure pad is sleeved on the bottom end of the pressure rod. The core tube and the glue tube are both sleeved in a supporting frame extended and fixed on the top surface of the support frame.

9. A V-COB packaging method for an ultra-high-definition display screen module, using the V-COB packaging device for an ultra-high-definition display screen module according to claim 8, characterized in that: The following steps are involved: S1. Place several chips in a core placement barrel, fill the barrel with glue, then neatly place several display module circuit boards in a placement box, and then place several placement boxes filled with display module circuit boards into a board placement box; Several placement boxes are ejected by the pallet, and the rear end of the placement box on the top layer is guided by the inclined guide platform to slide against the front of the top port of the board box, thereby forming a misaligned state with the placement box below; S2, at this time, the servo motor is started to drive the conveyor belt to circulate. When a shifting tooth moves to the front end of the board box, it contacts the shifting block and drives the placement box to move to the top surface of the packaging table; S3. When all the cassettes are moved to the top of the packaging table, the vacuum pump is started to extract air through the through-hole of the core feeding sleeve to suck a chip. The speed of the conveyor belt is reduced by the driving pulley and the driven pulley, and the core feeding sleeve is driven to put down the chip every half a circle. S4, during step S3, the chip is transferred to the glue cylinder along with the core feeding sleeve, and is contacted by the glue wheel and rolled to apply glue; S5, the chip is then bonded into place by the flexible rolling of the core pressing wheel; S6. After the chips of the circuit boards in the placement box are bonded, wire bonding is performed to achieve electrical connection, and then the placement box is transferred to the bottom of the sealing head for sealing curing.

Images