Wafer separating mechanism

Abstract

The invention discloses a wafer separating mechanism, and the mechanism comprises a placement assembly which comprises two limiting shafts, the limiting shafts extend in a first direction, and the distance between the two limiting shafts is smaller than the diameter of a wafer; the suction assembly comprises a plurality of suction nozzles, and the suction planes of the multiple suction nozzles are flush with one another; the suction plane is provided with a suction position perpendicular to the first direction and a placement position perpendicular to the vertical direction; the first driving part is connected with the suction assembly and used for driving the suction assembly to rotate around a rotating shaft extending in the second direction, so that the suction plane is switched between a suction position and a placement position; the first air blowing port and the second air blowing port are connected with the suction assembly, and the first air blowing port and the second air blowing port are located on the two sides of the suction assembly in the second direction respectively; the first air blowing opening is circular, and the second air blowing opening is prolate; the moving assembly is connected with the suction assembly and used for driving the suction assembly to move in the first direction and the vertical direction. The wafer separating mechanism can realize rapid wafer taking.

Description

Technical Field

[0001] This specification relates to the technical field of semiconductor equipment, and particularly to a wafer slicing mechanism. Background Art

[0002] A wafer refers to a circular silicon wafer or substrate used in semiconductor processes, also known as a silicon wafer or substrate. It is the basic material for manufacturing integrated circuits. Wafers are generally made of single-crystalline silicon material and have a very flat surface. The process of manufacturing wafers is called wafer manufacturing or semiconductor manufacturing, which involves multiple process steps such as wafer growth, cutting, polishing, and cleaning. On the wafer, various components and layers of integrated circuits can be manufactured through process steps such as lithography, thin-film deposition, ion implantation, diffusion, and metal deposition. Multiple chips can be manufactured on one wafer, and each chip can be used as an independent IC product through cutting and packaging. Wafer manufacturing is a crucial step in the semiconductor industry, affecting the quality, efficiency, and cost of integrated circuits. After wafer manufacturing is completed, the wafers need to be inspected. Wafer inspection is the core link in semiconductor manufacturing to ensure chip quality and yield, involving multi-dimensional technologies such as physical defect identification, dimensional measurement, and electrical performance testing.

[0003] In the prior art, when initially inspecting wafers, since multiple wafers are stacked together, and there is a large adsorption force between the wafers and water stains between some wafers, it is somewhat obstructive to take out a single wafer for inspection. Summary of the Invention

[0004] In view of the deficiencies of the prior art, an object of this specification is to provide a wafer slicing mechanism that can achieve rapid wafer picking.

[0005] To achieve the above object, an embodiment of this specification provides a wafer slicing mechanism, including: A placement component, including two limiting shafts for placing wafers. The limiting shafts extend along a first direction, and the distance between the two limiting shafts is less than the diameter of the wafer; A suction component, including multiple suction nozzles. The suction planes of the multiple suction nozzles are flush; the suction plane has a suction position perpendicular to the first direction and a placement position perpendicular to the vertical direction; A first driving member connected to the suction component, for driving the suction component to rotate around a rotation axis extending in a second direction, so that the suction plane switches between the suction position and the placement position; the first direction, the second direction, and the vertical direction are perpendicular to each other in pairs; A first air blowing port and a second air blowing port connected to the suction component. The first air blowing port and the second air blowing port are respectively located on both sides of the suction component in the second direction; the shape of the first air blowing port is circular, and the shape of the second air blowing port is flat and elongated; A moving component connected to the suction component, configured to drive the suction component to move in the first direction and the vertical direction.

[0006] As a preferred embodiment, the second air blowing port includes a plurality of sub-air blowing ports arranged in a straight line, and the shape of the sub-air blowing port is circular; the diameter of the sub-air blowing port is smaller than the diameter of the first air blowing port.

[0007] As a preferred embodiment, the first air blowing port is fixedly connected to the suction component through a copper pipe; the second air blowing port is connected to the suction component through a flexible pipe, and the position and orientation of the second air blowing port are adjustable.

[0008] As a preferred embodiment, at the same moment, at most only one of the first air blowing port and the second air blowing port is working.

[0009] As a preferred embodiment, the moving component includes a first slide rail extending in the first direction, a second slide rail extending in the vertical direction, a first slider slidably connected to the first slide rail, a second slider slidably connected to the second slide rail, and a fixing bracket fixedly connected to the lower part of the first slider; one end of the first air blowing port and one end of the second air blowing port are fixedly connected to one end of the first slider close to the placing component in the first direction; the fixed end of the first driving member is fixedly connected to the fixing bracket, and the moving end of the first driving member is rotatably connected to the fixing bracket; the first slide rail is fixedly connected to the second slider.

[0010] As a preferred embodiment, the placing component further includes: Two fixing plates perpendicular to the first direction, and two ends of the limiting shaft are respectively fixed to the inner sides of the two fixing plates; A fixing seat fixedly connected to the bottom of the fixing plate; A third slide rail extending in the first direction, and the bottom of the fixing seat is slidably connected to the third slide rail.

[0011] As a preferred embodiment, the placing component further includes: A fourth slide rail extending in the first direction, the fourth slide rail is fixedly arranged on the upper surface of the fixing seat and passes through the two fixing plates; A baffle slidably connected to the fourth slide rail, the baffle is located between the two fixing plates and passes through the two limiting shafts.

[0012] As a preferred embodiment, there are a plurality of placing components, and the plurality of placing components are spaced apart in the second direction; the moving component includes a fifth slide rail extending in the second direction, and a third slider slidably connected to the fifth slide rail; the second slide rail is fixedly connected to the third slider.

[0013] As a preferred embodiment, the suction component includes three first suction nozzles spaced circumferentially and a second suction nozzle located at the center of the three first suction nozzles, and the suction area of the second suction nozzle is larger than that of the first suction nozzle.

[0014] As a preferred embodiment, the wafer slicing mechanism further includes a conveyor belt extending in a first direction, the conveyor belt is located on one side of the placing component close to the suction component in the first direction, and the suction component is located above the conveyor belt. Beneficial effects

[0015] The wafer slicing mechanism provided in this embodiment includes a placing component, a suction component, a first air blowing port, a second air blowing port, a moving component and a first driving member. The suction component sucks the wafer. The first air blowing port and the second air blowing port are respectively located on both sides of the suction component in a second direction, and the shape of the first air blowing port is circular, and the shape of the second air blowing port is oblong. When the suction component sucks the target wafer, the first air blowing port can first blow away multiple wafers adjacent to the target wafer, and then blow air into the gap between the target wafer and its adjacent wafers through the oblong second air blowing port, so that the suction component can easily take out the target wafer under the drive of the moving component, and can achieve rapid wafer picking.

[0016] In addition, the first driving member is connected to the suction component and can drive the suction component to rotate, so that the suction plane can be switched between the suction position and the placing position. When the suction plane is in the suction position, the suction component faces the placing component, and rapid wafer picking can be achieved; when the suction plane is in the placing position, the suction component is arranged downward, and the wafer can be stably placed on the horizontal plane for subsequent inspection of the wafer. When picking the wafer, the wafer is arranged vertically to reduce the resistance.

[0017] Referring to the following description and the accompanying drawings, specific embodiments of the present invention are disclosed in detail, indicating the ways in which the principles of the present invention can be adopted. It should be understood that the embodiments of the present invention are not limited in scope thereby.

[0018] Features described and / or illustrated for one embodiment can be used in the same or similar way in one or more other embodiments, combined with features in other embodiments, or replace features in other embodiments.

[0019] It should be emphasized that the term "comprising / including" when used herein refers to the presence of features, whole things, steps or components, but does not exclude the presence or addition of one or more other features, whole things, steps or components. Description of the drawings

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 Schematic three-dimensional structure diagram of a wafer slicing mechanism provided in this embodiment; Figure 2 is Figure 1 Front view of the suction component, the first air blowing port and the second air blowing port in; Figure 3 Enlarged structure diagram of a second air blowing port provided in this embodiment; Figure 4 Schematic structure diagram of a placement component provided in this embodiment.

[0022] Explanation of reference numerals: 1. Placement component; 11. Limit shaft; 12. Fixed plate; 13. Fixed seat; 14. Third slide rail; 15. Fourth slide rail; 16. Baffle; 2. Suction component; 21. First suction nozzle; 22. Second suction nozzle; 3. First air blowing port; 31. Copper pipe; 4. Second air blowing port; 41. Sub-air blowing port; 42. Flexible pipe; 5. Moving component; 51. First slide rail; 52. Second slide rail; 53. First slider; 54. Second slider; 55. Fixed frame; 56. Fifth slide rail; 57. Third slider; 6. Conveyor belt; 71. First driving member; 72. Second driving member; 73. Third driving member; 74. Fourth driving member; 75. Fifth driving member; 10. Wafer; X. First direction; Y. Second direction; Z. Vertical direction. Detailed implementation manners

[0023] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or there can be another element in the middle. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be another element in the middle at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this invention belongs. The terms used in the specification of this invention are only for the purpose of describing specific embodiments and are not intended to limit this invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0026] Please refer to Figures 1 to 4 An embodiment of this application provides a wafer 10 slicing mechanism, including: a placement component 1, a suction component 2, a first air blowing port 3, a second air blowing port 4, a moving component 5 and a first driving member 71.

[0027] Among them, the placement component 1 includes two limiting shafts 11 for placing the wafer 10. The limiting shafts 11 extend along the first direction X, and the distance between the two limiting shafts 11 is less than the diameter of the wafer 10. The two limiting shafts 11 are spaced apart in the second direction Y. The first direction X, the second direction Y and the vertical direction Z are perpendicular to each other in pairs, and the first direction X and the second direction Y are specifically two directions perpendicular to each other in the horizontal plane.

[0028] The suction component 2 includes a plurality of suction nozzles. The suction planes of the plurality of suction nozzles are flush. The suction plane has a suction position perpendicular to the first direction X and a placement position perpendicular to the vertical direction Z. The first driving member 71 is connected to the suction component 2 and is used to drive the suction component 2 to rotate around the rotation axis extending in the second direction Y, so that the suction plane switches between the suction position and the placement position. The first air blowing port 3 and the second air blowing port 4 are both connected to the suction component 2. The first air blowing port 3 and the second air blowing port 4 are respectively located on both sides of the suction component 2 in the second direction Y. The shape of the first air blowing port 3 is circular, and the shape of the second air blowing port 4 is oblong. The moving component 5 is connected to the suction component 2 and is used to drive the suction component 2 to move in the first direction X and the vertical direction Z.

[0029] The wafer 10 slicing mechanism provided by this embodiment includes a placement component 1, a suction component 2, a first air blowing port 3, a second air blowing port 4, a moving component 5, and a first driving member 71. The wafer 10 is sucked by the suction component 2. The first air blowing port 3 and the second air blowing port 4 are respectively located on both sides of the suction component 2 in the second direction Y. The shape of the first air blowing port 3 is circular, and the shape of the second air blowing port 4 is oblong. When the suction component 2 sucks the target wafer 10, the first air blowing port 3 can first blow away multiple wafers 10 adjacent to the target wafer 10, and then blow air into the gap between the target wafer 10 and its adjacent wafer 10 through the oblong second air blowing port 4, so that the suction component 2 can easily take out the target wafer 10 under the drive of the moving component 5, and rapid wafer picking can be achieved.

[0030] In addition, the first driving member 71 is connected to the suction component 2 and can drive the suction component 2 to rotate, so as to switch the suction plane between the suction position and the placement position. When the suction plane is at the suction position, the suction component 2 faces the placement component 1, and rapid wafer picking can be achieved; when the suction plane is at the placement position, the suction component 2 is arranged downward, and the wafer 10 can be stably placed on the horizontal plane to facilitate subsequent detection of the wafer 10. When picking up the wafer 10, the wafer 10 is arranged vertically to reduce resistance.

[0031] In one embodiment, the second air blowing port 4 may include only one opening, the length of which in one direction is longer, and the length in the other direction (perpendicular to the longer direction) is extremely short, thereby forming the oblong second air blowing port 4.

[0032] In a preferred embodiment, as Figure 3 shown, the second air blowing port 4 includes a plurality of sub-air blowing ports 41 arranged in a straight line, so that the shape of the second air blowing port 4 is oblong. Specifically, the shape of the sub-air blowing port 41 is circular, and the diameter of the sub-air blowing port 41 is smaller than the diameter of the first air blowing port 3. Through the plurality of spaced sub-air blowing ports 41, the air flow blown out by the second air blowing port 4 can be made stronger, which is convenient for separating adjacent wafers 10.

[0033] Preferably, as Figure 2 shown, the first air blowing port 3 is fixedly connected to the suction component 2 through a copper pipe 31. The second air blowing port 4 is connected to the suction component 2 through a flexible pipe 42, and the position and orientation of the second air blowing port 4 are adjustable. During actual operation, the position and orientation of the second air blowing port 4 can be adjusted as needed. The arrangement direction of the plurality of sub-air blowing ports 41 intersects with the first direction X, the second direction Y, and the vertical direction Z.

[0034] As Figure 1As shown, the moving component 5 includes a first slide rail 51 extending along the first direction X, a second slide rail 52 extending along the vertical direction Z, a first slider 53 slidably connected to the first slide rail 51, a second slider 54 slidably connected to the second slide rail 52, and a fixing bracket 55 fixedly connected to the lower side of the first slider 53. One end of the first air blowing port 3 and one end of the second air blowing port 4 are fixedly connected to one end of the first slider 53 close to the placing component 1 along the first direction X. The fixed end of the first driving member 71 is fixedly connected to the fixing bracket 55, and the moving end of the first driving member 71 is rotatably connected to the fixing bracket 55. The first slide rail 51 is fixedly connected to the second slider 54.

[0035] Specifically, the first slider 53 is connected with a second driving member 72, and the second driving member 72 can drive the first slider 53 to drive the fixing bracket 55 to move along the first direction X, so as to realize the movement of the sucking component 2 along the first direction X. The second slider 54 is connected with a third driving member 73, and the third driving member 73 can drive the second slider 54 to drive the sucking component 2 to move along the vertical direction Z.

[0036] In this embodiment, as Figure 4 shown, the placing component 1 further includes: a fixed seat 13, a third slide rail 14 and two fixing plates 12. The two fixing plates 12 are perpendicular to the first direction X. Both ends of the limiting shaft 11 are respectively fixed to the inner sides of the two fixing plates 12. The fixed seat 13 is fixedly connected to the bottom of the fixing plate 12 and can connect the two fixing plates 12. The third slide rail 14 extends along the first direction X. The bottom of the fixed seat 13 is slidably connected to the third slide rail 14, so that the structure on the fixed seat 13 can move along the first direction X, facilitating the loading and unloading of the wafer 10. During manual loading, the fixed seat 13 is located at one end of the third slide rail 14 away from the sucking component 2; after manual loading is completed, the fixed seat 13 can be moved to one end of the third slide rail 14 close to the sucking component 2, facilitating the sucking component 2 to pick up the material.

[0037] Specifically, the placing component 1 further includes a fourth slide rail 15 and a baffle 16. The fourth slide rail 15 extends along the first direction X. The fourth slide rail 15 is fixedly arranged on the upper surface of the fixed seat 13 and passes through the two fixing plates 12. The baffle 16 is slidably connected to the fourth slide rail 15. The baffle 16 is located between the two fixing plates 12 and passes through the two limiting shafts 11. The vertically stacked wafers 10 can be fixed by the baffle 16, one fixing plate 12 away from the sucking component 2, and the two limiting shafts 11, so that they will not fall down. When the sucking component 2 moves to near the wafer 10 to pick up the material, the baffle 16 moves a predetermined distance in the direction close to the sucking component 2; after the sucking component 2 takes out one wafer 10, the baffle 16 moves in the direction away from the sucking component 2.

[0038] In this embodiment, there are multiple (e.g., 3 to 5) placement components 1, and the multiple placement components 1 are spaced apart in the second direction Y. Thus, when manually loading, multiple groups of wafers 10 can be placed, reducing the frequency of manual loading. Correspondingly, the moving component 5 includes a fifth slide rail 56 extending in the second direction Y and a third slider 57 slidably connected to the fifth slide rail 56. The second slide rail 52 is fixedly connected to the third slider 57. The third slider 57 is connected to a fourth driving member 74, and the fourth driving member 74 can drive the third slider 57 to drive the suction component 2 to move in the second direction Y, realizing material taking at different placement components 1.

[0039] As Figure 2 shown, the suction component 2 includes three first suction nozzles 21 spaced apart circumferentially and a second suction nozzle 22 located at the center of the three first suction nozzles 21. The suction area of the second suction nozzle 22 is larger than that of the first suction nozzles 21, so as to stably adsorb the wafer 10.

[0040] Specifically, the wafer 10 slicing mechanism further includes a conveyor belt 6 extending in the first direction X. The conveyor belt 6 is located on the side of the placement component 1 close to the suction component 2 in the first direction X, and the suction component 2 is located above the conveyor belt 6. After the suction component 2 sucks and separates a wafer 10, the first driving member 71 causes the suction component 2 to switch to the placement position, so that the suction component 2 can place the wafer 10 on the conveyor belt 6. The conveyor belt 6 is connected to a fifth driving member 75 for driving the conveyor belt 6 to move in the first direction X to convey the wafer 10 to the next station.

[0041] In this embodiment, at the same moment, at most only one of the first air blowing port 3 and the second air blowing port 4 is working. In a specific application scenario, when using the wafer 10 slicing mechanism provided by the embodiment of the present application, the following steps are included: 1. Load the wafer 10. Specifically, make the fixed seat 13 of the placement component 1 be located at the end of the third slide rail 14 far from the suction component 2, make the baffle 16 close to the fixing plate 12 close to the suction component 2, stack multiple wafers 10 vertically between the fixing plate 12 far from the suction component 2 and the two limiting shafts 11, and then make the baffle 16 move along the fourth slide rail 15 to the surface of the wafers 10, so that the stacked wafers 10 are fixed by the baffle 16, the two limiting shafts 11 and the fixing plate 12 far from the suction component 2; then move the fixed seat 13 of the placement component 1 to the end of the third slide rail 14 close to the suction component 2.

[0042] 2. The suction component 2 picks up the wafer. Specifically, the suction component 2 is driven to move in the first direction X, the second direction Y, and the vertical direction Z so that the suction component 2 faces the wafer 10. Then, the second driving member 72 drives the suction component 2 to move in the first direction X, approaching and pressing against the wafer 10. At this time, the baffle 16 moves a predetermined distance in the direction close to the suction component 2, and the first air blowing port 3 is opened (the second air blowing port 4 is closed), blowing away multiple wafers 10 adjacent to the target wafer 10. After the suction component 2 is pressed tightly against the wafer 10, the third driving member 73 drives the suction component 2 to move in the vertical direction Z. At this time, the first air blowing port 3 is closed, the second air blowing port 4 is opened, and air is blown into the gap between the target wafer 10 and its adjacent wafers 10. The baffle 16 moves away from the suction component 2 to the position of the wafer 10. When the wafer 10 picked up by the suction component 2 is completely separated from the adjacent wafers 10, the second air blowing port 4 is closed.

[0043] 3. The suction component 2 discharges the wafer. Specifically, the suction component 2 is driven to move in the first direction X, the second direction Y, and the vertical direction Z so that the suction component 2 faces the conveyor belt 6. At the same time, the first driving member 71 can drive the suction component 2 to rotate to the placement position. Then, the third driving member 73 drives the suction component 2 to move in the vertical direction Z, approaching the conveyor belt 6, and then places the wafer 10 on the suction component 2 on the conveyor belt 6. Then, steps 2 and 3 are repeated. The wafer slicing mechanism of the present application can complete the picking and placing of one wafer 10 in about 6 s, with extremely high efficiency.

[0044] It should be noted that in the description of this specification, the terms "first", "second", etc. are only used for descriptive purposes and to distinguish similar objects, and there is no sequence between them, nor can they be understood as indicating or implying relative importance. In addition, in the description of this specification, unless otherwise stated, the meaning of "multiple" is two or more.

[0045] Any numerical value cited in this article includes all values from the lower limit value to the upper limit value increasing by one unit at a time. There is an interval of at least two units between any lower value and any higher value. For example, if the value of the number of components or process variables (such as temperature, pressure, time, etc.) is stated to be from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, the purpose is to illustrate that values such as 15 to 85, 22 to 68, 43 to 51, 30 to 32, etc. are also explicitly listed in this specification. For values less than 1, a unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1. These are only examples of what is intended to be clearly expressed, and it can be considered that all possible combinations of the numerical values listed between the lowest value and the highest value are explicitly described in this specification in a similar manner.

[0046] Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. The term "about" or "approximate" used in connection with a range is applicable to both endpoints of the range. Thus, "about 20 to 30" is intended to cover "about 20 to about 30", including at least the specified endpoints.

[0047] All articles and references disclosed, including patent applications and publications, are incorporated herein by reference for various purposes. The term "consisting essentially of" describing a combination shall include the identified elements, ingredients, components or steps as well as other elements, ingredients, components or steps that do not materially affect the basic novel features of the combination. The use of the terms "comprising" or "including" to describe the combinations of elements, ingredients, components or steps herein also contemplates embodiments consisting essentially of these elements, ingredients, components or steps. By using the term "may" herein, it is intended that any of the attributes described as "may" include be optional.

[0048] A plurality of elements, ingredients, components or steps can be provided by a single integrated element, ingredient, component or step. Alternatively, a single integrated element, ingredient, component or step may be separated into discrete plural elements, ingredients, components or steps. The disclosure of the term "a" or "an" used to describe an element, ingredient, component or step is not intended to exclude other elements, ingredients, components or steps.

[0049] It should be understood that the above description is for purposes of illustration and not limitation. Many embodiments and many applications other than the examples provided will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of the present teachings should not be determined with reference to the above description, but should be determined with reference to the appended claims and the full scope of equivalents to which such claims are entitled. For the sake of completeness, all articles and references including patent applications and published disclosures are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein from the foregoing claims is not intended to abandon such subject matter, nor should it be considered that the inventors did not consider such subject matter to be part of the disclosed inventive subject matter.

Claims

1. A wafer dicing mechanism, characterized in that, Comprising: A placement component, including two limiting shafts for placing a wafer, the limiting shafts extending along a first direction, and the distance between the two limiting shafts being less than the diameter of the wafer; A suction component, including a plurality of suction nozzles, the suction planes of the plurality of suction nozzles being flush; the suction plane has a suction position perpendicular to the first direction and a placement position perpendicular to the vertical direction; A first driving member connected to the suction component, for driving the suction component to rotate around a rotation axis extending in a second direction, so that the suction plane switches between the suction position and the placement position; the first direction, the second direction and the vertical direction are perpendicular to each other in pairs; A first air blowing port and a second air blowing port connected to the suction component, the first air blowing port and the second air blowing port being located on both sides of the suction component in the second direction respectively; the shape of the first air blowing port is circular, and the shape of the second air blowing port is oblong; A moving component connected to the suction component, for driving the suction component to move in the first direction and the vertical direction.

2. The wafer dicing mechanism according to claim 1, characterized in that, The second air blowing port includes a plurality of sub-air blowing ports arranged in a straight line, and the shape of the sub-air blowing ports is circular; the diameter of the sub-air blowing ports is smaller than the diameter of the first air blowing port.

3. The wafer dicing mechanism according to claim 2, wherein The first air blowing port is fixedly connected to the suction component through a copper pipe; the second air blowing port is connected to the suction component through a flexible pipe, and the position and orientation of the second air blowing port are adjustable.

4. The wafer dicing mechanism according to claim 1, characterized in that At the same moment, at most only one of the first air blowing port and the second air blowing port is working.

5. The wafer dicing mechanism according to claim 1, wherein The moving component includes a first slide rail extending along the first direction, a second slide rail extending along the vertical direction, a first slider slidably connected to the first slide rail, a second slider slidably connected to the second slide rail, and a fixed frame fixedly connected to the lower part of the first slider; one end of the first air blowing port and one end of the second air blowing port are fixedly connected to one end of the first slider close to the placement component along the first direction; the fixed end of the first driving member is fixedly connected to the fixed frame, and the moving end of the first driving member is rotatably connected to the fixed frame; the first slide rail is fixedly connected to the second slider.

6. The wafer dicing mechanism according to claim 5, wherein The placement component further includes: Two fixing plates perpendicular to the first direction, and both ends of the limiting shaft are respectively fixed to the inner sides of the two fixing plates; A fixed seat fixedly connected to the bottom of the fixing plate; A third slide rail extending along the first direction, and the bottom of the fixed seat is slidably connected to the third slide rail.

7. The wafer dicing mechanism according to claim 6, wherein The placement component further includes: A fourth slide rail extending along the first direction, the fourth slide rail being fixedly arranged on the upper surface of the fixed seat and passing through the two fixing plates; A baffle slidably connected to the fourth slide rail, the baffle being located between the two fixing plates and passing through the two limiting shafts.

8. The wafer dicing mechanism according to claim 7, wherein There are a plurality of placement components, and the plurality of placement components are arranged at intervals in the second direction; the moving component includes a fifth slide rail extending along the second direction and a third slider slidably connected to the fifth slide rail; the second slide rail is fixedly connected to the third slider.

9. The wafer dicing mechanism according to claim 1, characterized in that, The suction component includes three first suction nozzles arranged at intervals in the circumferential direction and a second suction nozzle located at the center of the three first suction nozzles, and the suction area of the second suction nozzle is larger than that of the first suction nozzle.

10. The wafer dicing mechanism according to claim 1, wherein, The wafer slicing mechanism further includes a conveyor belt extending in the first direction, the conveyor belt is located on the side of the placing component close to the suction component in the first direction, and the suction component is located above the conveyor belt.

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