Semi-automatic wafer accurate alignment mechanism

Abstract

The invention relates to the technical field of semiconductor processing, in particular to a semi-automatic wafer accurate alignment mechanism, and mainly solves the technical problems that an existing wafer alignment mechanism cannot guarantee alignment accuracy and is relatively complex in structural design. The mechanism comprises a rack, a wafer chuck, a drawer type feeding assembly, a jacking assembly and a visual assembly, the drawer type feeding assembly serves as a unique feeding structure, feeding of an upper wafer and a lower wafer is achieved through one feeding structure, and the structure is simplified; besides, on one hand, the mechanism ensures the levelness of the wafer chuck through the surface contact between the telescopic clamping block and the wafer chuck, and on the other hand, the levelness of the top plate is adjusted through the leveling structure so as to ensure the parallelism of the upper wafer and the lower wafer; the position of the lower wafer on the adsorption plate is adjusted through the jacking assembly so that the lower wafer can be aligned with the upper wafer, and the alignment precision of the upper wafer and the lower wafer can be guaranteed through cooperation of the two aspects.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and particularly relates to a semi-automatic wafer precise alignment mechanism. Background Art

[0002] In the semiconductor manufacturing process, the wafer alignment accuracy is one of the core factors determining the yield of chip manufacturing. Especially in processes such as lithography and etching, the wafer alignment accuracy directly affects the quality and yield of chips. Wafer alignment is achieved through a wafer alignment mechanism.

[0003] The existing wafer alignment mechanisms have the following problems: First, the wafer levelness cannot be adjusted, thus the parallelism between two wafers cannot be guaranteed, and further the alignment accuracy cannot be guaranteed; Second, usually two sets of feeding structures are provided, and the structural design is relatively complex. Summary of the Invention

[0004] To overcome the technical defects of the existing wafer alignment mechanisms that cannot guarantee the alignment accuracy and have a relatively complex structural design, the present invention provides a semi-automatic wafer precise alignment mechanism.

[0005] The semi-automatic wafer precise alignment mechanism provided by the present invention includes: A frame, which includes a horizontally arranged installation platform, and the installation platform is provided with an installation window; A wafer chuck, which is placed in the installation window and is clamped and fixed by two relatively arranged telescopic clamping blocks. The telescopic clamping blocks are installed on the installation platform and are attached to the side wall of the wafer chuck in a surface-contact manner. The lower surface of the wafer chuck is set as a first adsorption surface; A drawer-type feeding component, which includes a drawer frame and an adsorption plate. The drawer frame is slidably installed on the frame. The adsorption plate is placed in the drawer frame and is provided with a first vision window. The upper surface of the adsorption plate is set as a second adsorption surface. The drawer frame has a working state in which the second adsorption surface is located directly below the first adsorption surface and a feeding state in which the second adsorption surface extends outside the frame through sliding; A jacking component, which includes a four-axis platform and a top plate. The four-axis platform is installed on the frame and the top end is provided with an output part for outputting translation along the XYZ three axes and rotation around the Z axis. The top plate is installed on the output part of the four-axis platform through a leveling structure. The leveling structure is used to adjust the levelness of the top plate. The top plate is provided with a second vision window and the second vision window is vertically corresponding to the first vision window; A vision component, which includes a camera. The camera is installed on the frame and has a detection state located directly below the second vision window.

[0006] Optionally, the telescopic clamping block includes a block body and a telescopic driving member for driving the horizontal movement of the block body. The surface of the block body close to the wafer chuck is set as a cylindrical surface with a horizontal line as the straight generatrix, and a groove adapted to the cylindrical surface is provided on the side wall of the wafer chuck.

[0007] Optionally, the wafer chuck is also positioned by relatively arranged fixing blocks and pushing blocks. The fixing blocks and the pushing blocks are both installed on the mounting platform, and the clamping directions of the two are perpendicular to the clamping directions of the two telescopic clamping blocks.

[0008] Optionally, there are multiple sets of the leveling structures evenly distributed along the circumference of the top plate. The top plate is elastically supported on the output part of the four-axis platform through multiple sets of leveling structures, and the leveling structure is also provided with a locking member for locking the relative positions of the top plate and the output part of the four-axis platform when the top plate lifts the adsorption plate to fit the wafer chuck.

[0009] Optionally, the leveling structure includes: A vertical plate, the bottom end of which is fixed on the output part of the four-axis platform and the top end is equipped with a guide wheel; A column, the bottom end of which is slidably inserted into the output part of the four-axis platform and the top end is equipped with a support ball; A support block, which is fixed under the top plate and supported on the support ball. A guide groove cooperating with the guide wheel is provided on the side wall of the support block, and the support block is connected to the column through a tension spring; An adjusting plate, which is suspended between the top plate and the output part of the four-axis platform through a connecting member fixed under the top plate; An elastic support member, which is installed on the output part of the four-axis platform and abuts against the lower surface of the adjusting plate; A locking member, which is installed in the output part of the four-axis platform and is used to abut against the column from the side to complete the locking.

[0010] Optionally, an annular accommodation groove is provided at the inner edge of the upper surface of the drawer frame, and a plurality of positioning blocks are distributed along the circumference of the accommodation groove. The positioning blocks are provided with wedge-shaped surfaces to guide the adsorption plate to fall into the accommodation groove from above.

[0011] Optionally, the camera assembly further includes a three-axis platform. The camera is installed on the frame through the three-axis platform, and the three-axis platform is used to drive the camera to translate in the XYZ three axes.

[0012] Optionally, there are two sets of the camera assemblies, which are respectively located on both sides of the lifting assembly. The adsorption plate is provided with two first vision windows corresponding to the two sets of camera assemblies, and the top plate is provided with two second vision windows corresponding to the two sets of camera assemblies.

[0013] Optionally, the semi-automatic wafer precise alignment mechanism further includes a spacer assembly. A plurality of sets of the spacer assemblies are provided along the circumferential direction of the wafer chuck. The spacer assembly includes: A rotating column, which is vertically arranged and rotatably installed at the edge of the wafer chuck; A connecting rod, which is horizontally arranged and one end of which is fixedly connected to the bottom end of the rotating column; A gasket, which is fixedly connected to the other end of the connecting rod, and when the rotating column rotates, the gasket has a spacer state located below the first adsorption surface and an avoidance state of disengaging from below the first adsorption surface.

[0014] Optionally, the semi-automatic wafer precise alignment mechanism further includes a locking assembly. The locking assembly includes: A pressing column, which is inserted into the edge of the wafer chuck with a clearance; A locking rod, which is horizontally arranged and fixedly connected to the bottom end of the pressing column; An elastic member, which is connected between the pressing column and the wafer chuck and is used to drive the pressing column to move upward.

[0015] The technical solution provided by the present invention has the following advantages compared with the prior art: The semi-automatic wafer precise alignment mechanism provided by the present invention is provided with a drawer-type loading component as the only loading structure. After the upper wafer enters below the first adsorption surface through the drawer-type loading component, the upper wafer is attached and adsorbed and fixed on the first adsorption surface through the lifting component. The lower wafer can be directly adsorbed and fixed on the second adsorption surface of the drawer-type loading component. In this way, the loading of the upper and lower two wafers is realized through a set of loading structures, which simplifies the structure. In addition, on the one hand, the flatness of the wafer chuck is ensured by the surface contact between the telescopic clamping block and the wafer chuck, and the flatness of the top plate is adjusted through the leveling structure, so as to realize the flatness adjustment of the adsorption plate lifted by the top plate, and further ensure the parallelism of the upper and lower two wafers. On the other hand, after the vision component has detected both the upper and lower two wafers, the position of the lower wafer on the adsorption plate is adjusted through the lifting component to align the lower wafer with the upper wafer. The two aspects cooperate to ensure the alignment accuracy of the upper and lower two wafers. Description of the Drawings

[0016] The drawings here are incorporated into the specification and form a part of this specification, showing the embodiments consistent with the present invention and used together with the specification to explain the principles of the present invention.

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.

[0018] Figure 1 It shows a schematic structural diagram of the semi-automatic wafer precise alignment mechanism in the embodiment of the present invention; Figure 2 It shows an assembly drawing of the frame and the drawer-type loading component in the loading state in the embodiment of the present invention; Figure 3 It shows a schematic structural diagram of the wafer chuck and related components in the embodiment of the present invention; Figure 4 It shows a schematic structural diagram of the locking component in the embodiment of the present invention; Figure 5 It shows an assembly schematic diagram of the drawer frame and the adsorption plate in the embodiment of the present invention; Figure 6 It shows a schematic structural diagram of the lifting component in the embodiment of the present invention; Figure 7 It shows a schematic structural diagram of the top plate and the leveling structure in the embodiment of the present invention; Figure 8 It shows Figure 7 a partial enlarged view of part A in Figure 9 It shows a schematic structural diagram of the vision component in the embodiment of the present invention.

[0019] In the figure: 1. Frame; 11. Installation platform; 111. Installation window; 12. Fixed frame; 13. Working platform; 14. Support frame; 15. Shock-absorbing block; 2. Wafer chuck; 21. Telescopic clamping block; 211. Block body; 212. Telescopic driving part; 22. Groove; 23. Fixed block; 24. Pushing block; 3. Drawer-type loading component; 31. Drawer frame; 311. Accommodation groove; 312. Positioning block; 32. Adsorption plate; 321. First vision window; 4. Lifting component; 41. Four-axis platform; 411. Lifting platform; 412. XY platform; 413. Rotating platform; 42. Top plate; 421. Second vision window; 43. Leveling structure; 431. Vertical plate; 4311. Guide wheel; 432. Column; 4321. Support ball; 433. Support block; 4331. Guide groove; 4332. Tensile spring; 434. Adjusting plate; 4341. Connecting part; 435. Elastic support; 4351. Cylinder; 4352. Spring part; 436. Limiting part; 5. Vision component; 51. Camera; 52. Three-axis platform; 6. Spacer component; 61. Rotating column; 62. Connecting rod; 63. Spacer; 7. Locking component; 71. Pressing column; 72. Locking rod; 73. Elastic part; 74. Fixed cylinder; 75. Pin shaft; 76. Hand-held part. Detailed implementation manners

[0020] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the solution of the present invention will be further described below. It should be noted that, without conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0021] In the description, it should be noted that the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. It should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific situations.

[0022] In the following description, many specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only part of the embodiments of the present invention, rather than all the embodiments.

[0023] The following Figures 1 to 9 Details of specific embodiments of the present invention will be described in detail.

[0024] This embodiment provides a semi-automatic wafer precise alignment mechanism, which includes a frame 1, a wafer chuck 2, a drawer-type loading component 3, a lifting component 4 and a vision component 5.

[0025] Among them, the frame 1 includes a horizontally arranged installation platform 11, and the installation platform 11 is provided with an installation window 111.

[0026] Specifically, the frame 1 includes a fixed frame 12, the top of the fixed frame 12 is provided with a working platform 13, a support frame 14 is provided on the working platform 13, and the installation platform 11 is located on the top of the support frame 14.

[0027] Furthermore, a plurality of shock-absorbing blocks 15 are also provided at the bottom of the fixed frame 12, which can improve the shock-absorbing ability of the platform and is more conducive to ensuring the smoothness of the work.

[0028] Among them, the wafer chuck 2 is placed in the installation window 111 and is clamped and fixed by two relatively arranged telescopic clamping blocks 21. The telescopic clamping blocks 21 are installed on the installation platform 11 and are attached to the side wall of the wafer chuck 2 in a surface-contact manner. The lower surface of the wafer chuck 2 is set as the first adsorption surface.

[0029] It is easy to understand that the telescopic clamping block 21 is attached to the wafer chuck 2 by surface contact, and the position accuracy of the wafer chuck 2 can be guaranteed by the installation accuracy of the telescopic clamping block 21. The two telescopic clamping blocks 21 cooperate to ensure the levelness of the wafer chuck 2.

[0030] Specifically, the telescopic clamping block 21 includes a block body 211 and a telescopic driving member 212 for driving the horizontal movement of the block body 211. The surface of the block body 211 close to the wafer chuck 2 is set as a cylindrical surface with a horizontal line as the generatrix. A groove 22 adapted to the cylindrical surface is provided on the side wall of the wafer chuck 2. The cooperation through the cylindrical surface can not only keep the wafer chuck 2 horizontal, but also limit the wafer chuck 2 vertically, thereby improving the clamping firmness.

[0031] More specifically, the cylindrical surface is a semi-cylindrical surface. Of course, the cylindrical surface can also be a semi-elliptical cylindrical surface or other curved surfaces.

[0032] More specifically, the telescopic driving member 212 is a cylinder. Of course, the telescopic driving member 212 can also be an electric push rod or other linear power elements.

[0033] It should be noted that the first adsorption surface can adopt common means in the art, such as vacuum adsorption, electrostatic adsorption, etc.

[0034] Furthermore, the wafer chuck 2 is also positioned by the relatively arranged fixing block 23 and the pushing block 24. The fixing block 23 and the pushing block 24 are both installed on the installation platform 11, and the clamping directions of the two are perpendicular to the clamping direction of the two telescopic clamping blocks 21. The two telescopic clamping blocks 21 can clamp and fix the wafer chuck 2 in one direction, and the cooperation of the fixing block 23 and the pushing block 24 can position the wafer chuck 2 in another vertical direction to ensure the position accuracy of the wafer chuck 2. It should be noted that Figure 3 As shown in, there are two pushing blocks 24.

[0035] Among them, the drawer-type loading component 3 includes a drawer frame 31 and an adsorption plate 32. The drawer frame 31 is slidably installed on the rack 1. The adsorption plate 32 is placed in the drawer frame 31 and is provided with a first visual window 321. The upper surface of the adsorption plate 32 is set as the second adsorption surface. The drawer frame 31 has a working state in which the second adsorption surface is located directly below the first adsorption surface and a loading state in which the second adsorption surface extends outside the rack 1 through sliding.

[0036] It is easy to understand that the so-called placement means that the adsorption plate 32 is supported on the drawer frame 31, and the adsorption plate 32 can be separated from the drawer frame 31 by moving upward.

[0037] Specifically, an annular accommodation groove 311 is provided at the inner edge of the upper surface of the drawer frame 31, and a plurality of positioning blocks 312 are distributed along the circumference of the accommodation groove 311. The positioning blocks 312 are provided with wedge-shaped surfaces to guide the adsorption plate 32 to fall into the accommodation groove 311 from above. Since the adsorption plate 32 needs to be frequently detached from the drawer frame 31 during operation, the arrangement of the accommodation groove 311 and the wedge-shaped surfaces of the positioning blocks 312 is more conducive to ensuring the position accuracy of the adsorption plate 32 every time it falls back into the drawer frame 31.

[0038] It should be noted that the second adsorption surface can adopt common means in the art, such as vacuum adsorption, electrostatic adsorption, etc.

[0039] It is easy to understand that when the drawer frame 31 is in the working state, the lifting assembly 4 lifts the adsorption plate 32 for related operations; when the drawer frame 31 is in the loading state, the manipulator transports the wafer to the second adsorption surface.

[0040] Among them, the lifting assembly 4 includes a four-axis platform 41 and a top plate 42. The four-axis platform 41 is installed on the frame 1 and its top is provided with an output part for outputting translation along the XYZ three axes and rotation around the Z axis. The top plate 42 is installed on the output part of the four-axis platform 41 through a leveling structure 43. The leveling structure 43 is used to adjust the level of the top plate 42. The top plate 42 is provided with a second vision window 421, and the second vision window 421 is vertically corresponding to the first vision window 321.

[0041] It is easy to understand that the four-axis platform 41 can drive the adjustment structure and the top plate 42 as a whole to move along the X axis, move along the Y axis, move along the Z axis and rotate around the Z axis. The main purpose is to align the mark of the lower wafer on the adsorption plate 32 with the mark of the upper wafer through four-axis movement after the vision component 5 has aligned the upper and lower wafers. The leveling structure 43 is mainly used to adjust the level of the top plate 42 before operation, so as to ensure the level of the adsorption plate 32 after the top plate 42 lifts the adsorption plate 32, so as to ensure the parallelism between the lower wafer on the second adsorption surface and the upper wafer on the first adsorption surface; at the same time, ensuring the alignment and parallelism of the marks of the upper and lower wafers can ensure the alignment accuracy of the upper and lower wafers.

[0042] Specifically, the four-axis platform 41 includes a lifting platform 411, an XY displacement platform and a rotating platform 413. The lifting platform 411 is installed on the frame 1, the XY displacement platform is rotated on the lifting platform 411, and the rotating platform 413 is installed on the XY displacement platform with the Z axis as the rotation axis. The rotating platform 413 serves as the output part of the four-axis platform 41. During operation, the lifting platform 411 drives the XY displacement platform and the rotating platform 413 to rise and fall synchronously, and the XY displacement platform drives the rotating platform 413 to move along the X axis or along the Y axis. The rotating platform 413 can output a rotational motion with the Z axis as the rotation axis, thereby realizing the four-axis motion of the top plate 42. Among them, the lifting platform 411, the XY displacement platform and the rotating platform 413 are all mature structures in this field and will not be described here.

[0043] Specifically, the bottom end of the four-axis platform 41 is installed at the bottom of the fixing frame 12 , and the four-axis platform 41 passes through the working platform 13 and is located inside the supporting frame 14 .

[0044] Specifically, the leveling structure 43 is provided with multiple sets uniformly distributed along the circumference of the top plate 42. The top plate 42 is elastically supported on the output portion of the four-axis platform 41 by the multiple sets of leveling structures 43. The leveling structure 43 is also provided with a locking member. The locking member is used to lock the relative position of the top plate 42 and the output portion of the four-axis platform 41 when the top plate 42 lifts the adsorption plate 32 to fit the wafer chuck 2. When in use, before loading the wafer, the top plate 42 is first driven to rise by the four-axis platform 41 until the adsorption plate 32 is lifted to contact the wafer chuck 2. At this time, when the adsorption plate 32 continues to rise, it will completely fit with the lower surface of the wafer chuck 2 under the coordination of the multiple sets of leveling structures 43. At this time, the position of the top plate 42 is locked by the locking member to achieve the fixed relative position of the top plate 42 and the output portion of the four-axis platform 41, and then the wafer loading can be carried out. It should be noted that a leveling operation is required every time the wafer chuck 2 is replaced. This leveling structure 43 can achieve automatic leveling through mechanical movement, which makes operation more convenient and labor-saving. Even if there is a slight deviation in the levelness of the wafer chuck 2, the leveling structure 43 can keep the top plate 42 parallel to the wafer chuck 2, which is more conducive to ensuring alignment accuracy.

[0045] More specifically, the leveling structure 43 includes a vertical plate 431, a column 432, a support block 433, an adjustment plate 434, an elastic support 435, and a locking member; the bottom end of the vertical plate 431 is fixed to the output part of the four-axis platform 41 and a guide wheel 4311 is installed at the top end; the bottom end of the column 432 is slidably inserted into the output part of the four-axis platform 41 and a support ball 4321 is installed at the top end; the support block 433 is fixed under the top plate 42 and supports on the support ball 4321, a guide groove 4331 matching with the guide wheel 4311 is formed on the side wall of the support block 433, and the support block 433 is connected with the column 432 through a tension spring 4332; the adjustment plate 434 is suspended between the top plate 42 and the output part of the four-axis platform 41 through a connecting member 4341 fixed under the top plate 42; the elastic support 435 is installed on the output part of the four-axis platform 41 and abuts against the lower surface of the adjustment plate 434; the locking member is installed inside the output part of the four-axis platform 41 and is used to abut against the column 432 from the side to complete the locking. The top plate 42 and the support block 433 support on the support ball 4321 and contact with the guide wheel 4311 of the vertical plate 431 through the guide groove 4331 to form a movable support. The movable support can not only maintain basic balance but also compensate for the position change of the top plate 42 during leveling, so that the top plate 42 can maintain balance at any position; the support block 433 contacts with the column 432 through the support ball 4321 and is connected through the tension spring 4332, so that not only synchronous lifting can be realized, but also the relative position difference can be compensated.

[0046] Specifically, the elastic support 435 includes a cylinder 4351 and a spring member 4352. The cylinder 4351 is the main part of the elastic support 435, and the spring member 4352 is the auxiliary part of the elastic support 435. The two parts cooperate to support the top plate 42 together before the top plate 42 is leveled.

[0047] It should be noted that since the locking member is installed inside the output part of the four-axis platform 41, it is not shown in the figure. The locking member can adopt conventional telescopic members such as a cylinder and an electric push rod. Its main function is to abut against the column 432 from the side through elongation after the top plate 42 is leveled, so that the column 432 remains relatively fixed, and thus the top plate 42 remains relatively fixed.

[0048] Furthermore, the leveling structure 43 further includes a limiting member 436, which is mainly used to limit the upper limit position of the adjustment plate 434 to avoid the overlong length of the elastic support 435, so as to protect precision structures such as the cylinder 4351.

[0049] Among them, the vision component 5 includes a camera 51. The camera 51 is installed on the frame 1 and has a detection state directly below the second vision window 421.

[0050] It should be noted that the camera 51 needs to perform two detections: the first time is to sequentially identify the mark of the upper wafer located on the first adsorption surface through the second vision window 421 and the first vision window 321, and the second time is to identify the mark of the lower wafer located on the second adsorption surface through the second vision window 421.

[0051] Specifically, the vision component 5 further includes a three-axis platform 52. The camera 51 is installed on the frame 1 through the three-axis platform 52, and the three-axis platform 52 is used to drive the camera 51 to translate in the XYZ three axes. On the one hand, it is more convenient for the camera 51 to find the mark through three-axis movement. On the other hand, the camera 51 can be moved to the outside of the support frame 14 through three-axis movement to facilitate the disassembly and maintenance of the lifting component 4 and the like.

[0052] Specifically, there are two sets of vision components 5, which are respectively located on both sides of the lifting component 4. The adsorption plate 32 is provided with two first vision windows 321 corresponding to the two sets of vision components 5, and the top plate 42 is provided with two second vision windows 421 corresponding to the two sets of vision components 5. The two sets of vision components 5 respectively identify the two marks of each wafer, which is more conducive to improving the alignment accuracy.

[0053] More specifically, the camera 51 adopts an infrared camera 51 to be able to obtain a high-definition and low-distortion imaging target.

[0054] In addition, the semi-automatic wafer precise alignment mechanism of this embodiment further includes a spacer component 6. There are multiple sets of spacer components 6 arranged along the circumference of the wafer chuck 2. The spacer component 6 includes a rotating column 61, a connecting rod 62, and a gasket 63. The rotating column 61 is vertically arranged and rotatably installed at the edge of the wafer chuck 2. The connecting rod 62 is horizontally arranged and one end is fixedly connected to the bottom end of the rotating column 61. The gasket 63 is fixedly connected to the other end of the connecting rod 62, and when the rotating column 61 rotates, the gasket 63 has a spacer state located below the first adsorption surface and an avoidance state of disengaging from below the first adsorption surface. After the upper wafer is adsorbed on the first adsorption surface, manually rotate the rotating column 61 to make the gasket 63 switch to the spacer state, and then after alignment, the lower wafer is attached to the upper wafer. In this way, the edge parts of the upper and lower wafers can be isolated by the gasket 63 to be able to smoothly separate the two wafers in case of non-compliance with the alignment or other situations in the follow-up; before the upper wafer is lifted to the first adsorption surface, manually rotate the rotating column 61 to make the gasket 63 switch to the avoidance state so that the upper wafer can completely adhere to the first adsorption surface.

[0055] In addition, the semi-automatic wafer precision alignment mechanism also includes a locking assembly 7, which includes a pressing column 71, a locking rod 72 and an elastic member 73. The pressing column 71 is inserted into the edge of the wafer chuck 2, the locking rod 72 is arranged horizontally and fixedly connected to the bottom end of the pressing column 71, and the elastic member 73 is connected between the pressing column 71 and the wafer chuck 2 to drive the pressing column 71 to move upward. When the upper and lower wafers are attached, the pressing column 71 is manually pressed, and then the pressing column 71 is rotated so that the locking rod 72 is tightly attached to the lower surface of the lower wafer under the action of the elastic member 73, so that the two wafers are firmly pressed on the wafer chuck 2, and then moved away as a whole with the wafer chuck 2; before lifting the upper wafer to the first adsorption surface, the pressing column 71 is manually rotated so that the locking rod 72 is separated from the bottom of the first adsorption surface to avoid the upper and lower wafers from moving upward.

[0056] Specifically, the locking assembly 7 also includes a fixing cylinder 74, which is fixed to the edge of the wafer chuck 2, and the pressing column 71 is inserted into the fixing cylinder 74 with a gap. Two high and low grooves are provided on the fixing cylinder 74, and a pin shaft 75 is fixed on the side wall of the pressing column 71. When the locking rod 72 locks the wafer, the pin shaft 75 is engaged in the lower groove. When the locking rod 72 avoids the movement of the wafer, the pin shaft 75 is engaged in the higher groove. In this way, the elastic force exerted by the elastic member 73 on the locking rod 72 can be prevented from being too large, thereby preventing the locking rod 72 from crushing the wafer.

[0057] More specifically, handles 76 are provided on both sides of the fixing cylinder 74 to facilitate manual transport of the wafer chuck 2 .

[0058] The working process of the semi-automatic wafer precision alignment mechanism of this embodiment is as follows: S1. The wafer chuck 2 is clamped and fixed by two telescopic clamping blocks 21, and the positioning is completed by the fixing block 23 and the pushing block 24; S2. The lifting assembly 4 drives the top plate 42 upward along the Z-axis, lifting the suction plate 32 until it is free from the drawer frame 31. The lifting assembly 4 then continues to lift the top plate 42 until the second suction surface contacts the first suction surface. The multiple leveling structures 43 coordinate and cooperate to ensure that the second suction surface and the first suction surface are completely aligned. The top plate 42 is then secured with a locking member to ensure that the top plate 42 is parallel to the wafer chuck 2. The lifting assembly 4 drives the top plate 42 downward along the Z-axis, returning the suction plate 32 to its original position. S3. Manually pull out the drawer frame 31 to the loading state, use a robot or manually place the upper wafer and adsorb it on the second adsorption surface, and then manually push the drawer frame 31 back to the working state; S4. The lifting assembly 4 drives the top plate 42 to rise along the Z-axis, jacks up the adsorption plate 32 until it disengages from the drawer frame 31, and then continues to jack it up to the first adsorption surface for upper wafer bonding. At this time, control the second adsorption surface to release the adsorption force while the first adsorption surface applies the adsorption force, and transfer the upper wafer from the second adsorption surface to the first adsorption surface. Then, the lifting assembly 4 drives the top plate 42 to descend along the Z-axis to reset the adsorption plate 32; S5. Manually rotate the rotating column 61 to switch the gasket 63 to the padding state; S6. The camera 51 sequentially identifies the mark of the upper wafer through the second vision window 421 and the first vision window 321; S7. Manually pull out the drawer frame 31 to the loading state, place and adsorb the lower wafer on the second adsorption surface using a manipulator or manually, and then manually push the drawer frame 31 back to the working state; S8. The lifting assembly 4 drives the top plate 42 to rise along the Z-axis, jacks up the adsorption plate 32 until it disengages from the drawer frame 31. At this time, the camera 51 identifies the mark of the lower wafer through the second vision window 421; S9. According to the difference between the mark of the lower wafer and the mark of the upper wafer, control the four-axis platform 41 to act so that the mark of the lower wafer is completely aligned with the mark of the upper wafer; S10. The lifting assembly 4 continues to drive the top plate 42 to rise along the Z-axis, jacks up the lower wafer until it fits the upper wafer. At this time, control the second adsorption surface to release the adsorption force, and the lifting assembly 4 drives the top plate 42 to descend along the Z-axis to reset the adsorption plate 32; S11. Manually rotate the pressing column 71 to press the locking rod 72 against the lower surface of the lower wafer; S12. Loosen the telescopic clamping block 21 and the pushing block 24, and remove the wafer chuck 2 together with the two wafers from the installation window 111 and transfer them to the next process.

[0059] The above are only specific embodiments of the present invention, enabling those skilled in the art to understand or implement the present invention. Although the foregoing embodiments have been described in detail, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the foregoing embodiments, and they should all be covered by the protection scope of the claims.

Claims

1. A semi-automatic wafer precise alignment mechanism, characterized in that, Comprising: A frame (1), which includes a horizontally arranged mounting platform (11), and the mounting platform (11) is provided with a mounting window (111); A wafer chuck (2), which is placed within the mounting window (111) and is clamped and fixed by two relatively arranged telescopic clamping blocks (21). The telescopic clamping blocks (21) are mounted on the mounting platform (11) and are in surface contact with the side wall of the wafer chuck (2). The lower surface of the wafer chuck (2) is set as a first adsorption surface; A drawer-type loading component (3), which includes a drawer frame (31) and an adsorption plate (32). The drawer frame (31) is slidably mounted on the frame (1). The adsorption plate (32) is placed in the drawer frame (31) and is provided with a first vision window (321). The upper surface of the adsorption plate (32) is set as a second adsorption surface. The drawer frame (31) has a working state in which the second adsorption surface is located directly below the first adsorption surface and a loading state in which the second adsorption surface extends out of the frame (1) through sliding; A lifting component (4), which includes a four-axis platform (41) and a top plate (42). The four-axis platform (41) is mounted on the frame (1) and its top end is provided with an output part for outputting translation along the XYZ three axes and rotation around the Z axis. The top plate (42) is mounted on the output part of the four-axis platform (41) through a leveling structure (43). The leveling structure (43) is used to adjust the levelness of the top plate (42). The top plate (42) is provided with a second vision window (421) and the second vision window (421) is vertically corresponding to the first vision window (321); A vision component (5), which includes a camera (51). The camera (51) is mounted on the frame (1) and has a detection state located directly below the second vision window (421).

2. The semi-automatic wafer precise alignment mechanism according to claim 1, characterized in that, The telescopic clamping block (21) includes a block body (211) and a telescopic driving member (212) for driving the block body (211) to move horizontally. The surface of the block body (211) close to the wafer chuck (2) is set as a cylindrical surface with a horizontal line as the directrix. The side wall of the wafer chuck (2) is provided with a groove (22) adapted to the cylindrical surface.

3. The semi-automatic wafer precise alignment mechanism according to claim 2, wherein, The wafer chuck (2) is also positioned by relatively arranged fixing blocks (23) and pushing blocks (24). The fixing blocks (23) and the pushing blocks (24) are both mounted on the mounting platform (11) and the clamping directions of the two are perpendicular to the clamping direction of the two telescopic clamping blocks (21).

4. The semi-automatic wafer precise alignment mechanism according to claim 1, characterized in that Multiple sets of the leveling structure (43) are circumferentially and evenly distributed along the top plate (42). The top plate (42) is elastically supported on the output part of the four-axis platform (41) through multiple sets of the leveling structure (43). The leveling structure (43) is also provided with a locking member, and the locking member is used to lock the relative position between the top plate (42) and the output part of the four-axis platform (41) when the top plate (42) lifts the adsorption plate (32) to fit the wafer chuck (2).

5. The semi-automatic wafer precise alignment mechanism according to claim 4, wherein, The leveling structure (43) includes: A vertical plate (431) whose bottom end is fixed to the output part of the four-axis platform (41) and whose top end is equipped with a guide wheel (4311); A vertical column (432) whose bottom end is slidably inserted into the output part of the four-axis platform (41) and whose top end is equipped with a support ball (4321); A support block (433) which is fixed below the top plate (42) and supported on the support ball (4321). A guide groove (4331) which cooperates with the guide wheel (4311) is formed on the side wall of the support block (433), and the support block (433) is connected to the vertical column (432) through a tension spring (4332); An adjustment plate (434) which is suspended between the top plate (42) and the output part of the four-axis platform (41) through a connecting piece (4341) fixed below the top plate (42); An elastic support member (435) which is installed on the output part of the four-axis platform (41) and abuts against the lower surface of the adjustment plate (434); A locking member which is installed inside the output part of the four-axis platform (41) and is used to abut against the vertical column (432) from the side to complete locking.

6. The semi-automatic wafer precise alignment mechanism according to claim 1, characterized in that, An annular accommodation groove (311) is provided at the inner edge of the upper surface of the drawer frame (31), and a plurality of positioning blocks (312) are distributed along the circumference of the accommodation groove (311). The positioning blocks (312) are provided with wedge-shaped surfaces to guide the adsorption plate (32) to fall into the accommodation groove (311) from above.

7. The semi-automatic wafer precise alignment mechanism according to claim 1, characterized in that, The vision assembly (5) further includes a three-axis platform (52). The camera (51) is installed on the frame (1) through the three-axis platform (52), and the three-axis platform (52) is used to drive the camera (51) to translate in the XYZ three axes.

8. The semi-automatic wafer precise alignment mechanism according to claim 7, characterized in that There are two sets of the vision assemblies (5) which are respectively located on both sides of the lifting assembly (4). The adsorption plate (32) is provided with two first vision windows (321) corresponding to the two sets of vision assemblies (5), and the top plate (42) is provided with two second vision windows (421) corresponding to the two sets of vision assemblies (5).

9. The semi-automatic wafer precise alignment mechanism according to any one of claims 1 to 8, characterized in that, It further includes a cushioning and separating assembly (6). There are multiple sets of the cushioning and separating assemblies (6) arranged along the circumference of the wafer chuck (2). The cushioning and separating assembly (6) includes: A rotating column (61) which is vertically arranged and rotatably installed at the edge of the wafer chuck (2); A connecting rod (62) which is horizontally arranged and one end of which is fixedly connected to the bottom end of the rotating column (61); A gasket (63) which is fixedly connected to the other end of the connecting rod (62), and when the rotating column (61) rotates, the gasket (63) has a cushioning and separating state located below the first adsorption surface and an avoidance state of disengaging from below the first adsorption surface.

10. The semi-automatic wafer precise alignment mechanism according to any one of claims 1 to 8, characterized in that, It further includes a locking assembly (7). The locking assembly (7) includes: A pressing column (71) which is inserted into the edge of the wafer chuck (2) with a gap; A locking rod (72) which is horizontally arranged and fixedly connected to the bottom end of the pressing column (71); An elastic member (73) which is connected between the pressing column (71) and the wafer chuck (2) and is used to drive the pressing column (71) to move upward.

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