Packaging structure of three-phase full-bridge circuit

Abstract

The invention discloses a packaging structure of a three-phase full-bridge circuit, which comprises a plastic packaging body and six power devices arranged in the plastic packaging body, three of the six power devices form an upper half bridge, the other three of the six power devices form a lower half bridge, an upper half bridge metal base and three lower half bridge metal bases are laid in the plastic packaging body, and the upper half bridge metal base and the three lower half bridge metal bases are arranged on the plastic packaging body. Pins are arranged at the two ends of the plastic package body, the three power devices in the upper half bridge are arranged on the upper half bridge metal base, and the three power devices in the lower half bridge are arranged on the three lower half bridge metal bases in a one-to-one correspondence mode. According to the packaging structure of the three-phase full-bridge circuit, the occupied area of the three-phase full-bridge circuit is greatly reduced, miniaturization and light weight of a system are facilitated, and the efficiency of the system is remarkably improved; in addition, due to the fact that external connecting wires are reduced, parasitic inductance is greatly reduced, switch overshoot and electromagnetic interference are reduced, and high-frequency operation can be supported.

Description

Technical Field

[0001] The present invention relates to a semiconductor packaging structure, and particularly to a packaging structure of a three-phase full-bridge circuit. Background Art

[0002] As is known to those skilled in the art, due to technical advantages such as high efficiency, high power density, high reliability, and control flexibility, the three-phase full-bridge circuit has been widely applied in aspects such as motor drive and energy conversion, and has become the core topology of modern power electronic systems.

[0003] At present, the existing three-phase full-bridge circuits are all board-level circuits, that is, six power switching devices are installed on a PCB board. The area of the entire three-phase full-bridge circuit is relatively large, which is not conducive to miniaturization and light weight, and reduces the efficiency, power density, and reliability of the system; at the same time, due to a large number of external connections, the parasitic inductance is large, and it will also cause switching overshoot and electromagnetic interference. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a packaging structure of a three-phase full-bridge circuit that can insert the wire head straight into the wiring hole of the wiring terminal.

[0005] To solve the above technical problem, the technical solution adopted by the present invention is: a packaging structure of a three-phase full-bridge circuit, including: a plastic package body and six power devices arranged in the plastic package body. Among these six power devices, three are built into the upper half-bridge, and the other three are built into the lower half-bridge. A metal base for the upper half-bridge and three metal bases for the lower half-bridge are laid flat in the plastic package body. The plastic package body is provided with pins at both ends. The three power devices in the upper half-bridge are arranged on the metal base for the upper half-bridge, and the three power devices in the lower half-bridge are correspondingly arranged on the three metal bases for the lower half-bridge.

[0006] As a preferred solution, in the packaging structure of a three-phase full-bridge circuit, the metal base for the upper half-bridge is located at one end in the plastic package body, and the three metal bases for the lower half-bridge are arranged side by side at the other end in the plastic package body.

[0007] As a preferred solution, in the packaging structure of a three-phase full-bridge circuit, among the three metal bases for the lower half-bridge, the middle metal base for the lower half-bridge is horizontally provided with transverse reinforcement ribs on both sides respectively, which are located between the corresponding lower half-bridge metal base and the upper half-bridge metal base.

[0008] As a preferred solution, in the packaging structure of a three-phase full-bridge circuit, among the three metal bases for the lower half-bridge, the middle metal base for the lower half-bridge is also vertically provided with longitudinal reinforcement ribs extending to the corresponding end of the plastic package body.

[0009] As a preferred solution, in the packaging structure of the three-phase full-bridge circuit, reinforcing grooves are provided on the upper half-bridge metal base, all the lower half-bridge metal bases, and all the pins, so that the encapsulant formed during encapsulation is embedded in all the reinforcing grooves.

[0010] As a preferred solution, in the packaging structure of the three-phase full-bridge circuit, at least one longitudinally arranged reinforcing groove is provided at each of the two side ends of the upper half-bridge metal base, and at least one reinforcing groove is provided at the main part of the upper half-bridge metal base.

[0011] As a preferred solution, in the packaging structure of the three-phase full-bridge circuit, at least two longitudinally arranged reinforcing grooves are provided at the main part of the upper half-bridge metal base.

[0012] As a preferred solution, in the packaging structure of the three-phase full-bridge circuit, at least one reinforcing groove is provided at the main part of each of the two lower half-bridge metal bases on both sides, at least one longitudinally arranged reinforcing groove is provided at each of the outer ends of the two lower half-bridge metal bases on both sides, at least one reinforcing groove is provided at the main part of the lower half-bridge metal base in the middle, and longitudinally arranged reinforcing grooves are provided at the ends of the transverse reinforcing ribs on both sides of the lower half-bridge metal base in the middle.

[0013] As a preferred solution, in the packaging structure of the three-phase full-bridge circuit, at least one transversely arranged reinforcing groove is provided at the main part of each of the two lower half-bridge metal bases on both sides, and at least one transversely arranged reinforcing groove is provided at the main part of the lower half-bridge metal base in the middle.

[0014] As a preferred solution, in the packaging structure of the three-phase full-bridge circuit, at least one transversely arranged reinforcing groove is provided on each of the pins.

[0015] The beneficial effects of the present invention are as follows:

[0016] 1. By integrating the chips of six power switching devices into a single module, the present invention greatly reduces the occupied area of the three-phase full-bridge circuit, which is beneficial to the miniaturization and light weight of the system, and significantly improves the efficiency of the system. In addition, due to the reduction of external connection wires, the parasitic inductance is greatly reduced, and the occurrence of switching overshoot and electromagnetic interference is reduced, which can support high-frequency operation.

[0017] 2. By arranging one end of the upper half-bridge metal base in the encapsulant and arranging the three lower half-bridge metal bases side by side at the other end in the encapsulant, the overall arrangement is more compact, further reducing the area of the entire three-phase full-bridge circuit.

[0018] 3. The present invention strengthens the stability of the entire frame by horizontally arranging transverse reinforcing ribs on both sides of a lower half-bridge metal base located in the middle and vertically arranging longitudinal reinforcing ribs extending to the corresponding ends of the plastic package.

[0019] 4. The present invention further increases the stability of the frame by providing reinforcing grooves on the upper half-bridge metal base, all the lower half-bridge metal bases, and all the pins. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the packaging structure of the three-phase full-bridge circuit described in the present invention.

[0021] Figure 2 It is a schematic diagram of the principle structure of the three-phase full-bridge circuit described in the present invention.

[0022] Figure 1 Figure 2 The reference numerals in the figures are as follows: 1. Upper half-bridge metal base, 2. First lower half-bridge metal base, 3. Second lower half-bridge metal base, 31. First transverse reinforcing rib, 32. Second transverse reinforcing rib, 33. Longitudinal reinforcing rib, 4. Third lower half-bridge metal base, 91. Pin reinforcing groove, 92. Pin reinforcing groove, 93. End reinforcing groove, 94. Body reinforcing groove, 95. End reinforcing groove, 96. End reinforcing groove, 97. End reinforcing groove, 98. End reinforcing groove, 99. Body reinforcing groove. DETAILED DESCRIPTION OF THE INVENTION

[0023] The following will describe in detail the detailed implementation of a packaging structure of a three-phase full-bridge circuit according to the present invention with reference to the accompanying drawings.

[0024] As Figure 1 shown, a packaging structure of a three-phase full-bridge circuit according to the present invention includes: a plastic package (a conventional structure in the art, which will not be described in detail here) and six power devices Q1 to Q6 arranged in the plastic package. As Figure 2 shown, among the six power devices Q1 to Q6, the power devices Q4, Q5, and Q6 are built into an upper half-bridge, and the power devices Q1, Q2, and Q3 are built into a lower half-bridge. A upper half-bridge metal base 1 and three lower half-bridge metal bases, namely the first lower half-bridge metal base 2, the second lower half-bridge metal base 3, and the third lower half-bridge metal base 4, are laid flat in the plastic package. The upper half-bridge metal base 1 is located at one end, and the first lower half-bridge metal base 2, the second lower half-bridge metal base 3, and the third lower half-bridge metal base 4 are arranged side by side at the other end. The second lower half-bridge metal base 3 horizontally arranges a first transverse reinforcing rib 31 located between the first lower half-bridge metal base 2 and the upper half-bridge metal base 1 on one side ( Figure 1 the left side in Figure 1On the right side in) a second lateral reinforcing rib 32 is horizontally arranged between the third lower half-bridge metal base 4 and the upper half-bridge metal base 1, and the second lower half-bridge metal base 3 is also longitudinally provided with a longitudinal reinforcing rib 33 extending to the corresponding end of the plastic package body ( Figure 1 the lower end in); at one end of the plastic package body ( Figure 1 the upper end in), transverse pin reinforcing grooves 91 are provided on the pins G6, D6, G5, G4 and D4, and at the other end of the plastic package body ( Figure 1 the upper end in), transverse pin reinforcing grooves 92 are provided on the pins S1, G1, S2, G2, S3 and G3. The upper half-bridge metal base 1 is respectively provided with a longitudinally arranged end reinforcing groove 93 at both of its side ends. The upper half-bridge metal base 2 is respectively provided with a longitudinally arranged main body reinforcing groove 94 between the power devices Q6 and Q5, and between the power devices Q5 and Q4. The main bodies of the first lower half-bridge metal base 2, the second lower half-bridge metal base 3 and the third lower half-bridge metal base 4 are respectively provided with a transversely arranged main body reinforcing groove 99. The first lower half-bridge metal base 2 is provided with two longitudinally arranged end reinforcing grooves 97 at its outer side ( Figure 1 the left side in) end. The second lower half-bridge metal base 3 is provided with a longitudinally arranged end reinforcing groove 95 at the end of its left-side first lateral reinforcing rib 31 and a longitudinally arranged end reinforcing groove 96 at the end of its right-side second lateral reinforcing rib 32. The third lower half-bridge metal base 4 is provided with two longitudinally arranged end reinforcing grooves 98 at its outer side ( Figure 1 the right side in) end. The power devices Q4, Q5 and Q6 are horizontally arranged on the upper half-bridge metal base 1. The power device Q1 is arranged on the first lower half-bridge metal base 2. The power device Q2 is arranged on the second lower half-bridge metal base 3. The power device Q3 is arranged on the third lower half-bridge metal base 4.

[0025] In actual application, the plastic package body formed during packaging will be embedded into all the pin reinforcing grooves 91, pin reinforcing grooves 92, end reinforcing grooves 93, main body reinforcing grooves 94, end reinforcing grooves 95, end reinforcing grooves 96, end reinforcing grooves 97, end reinforcing grooves 98, main body reinforcing grooves 99.

[0026] In summary, only the preferred embodiments of the present invention are described above, and are not used to limit the scope of implementation of the present invention. All equivalent changes and modifications made according to the shape, structure, features and spirit described in the scope of the claims of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A packaging structure of a three-phase full-bridge circuit, comprising: A plastic package body, and six power devices disposed in the plastic package body. Among the six power devices, three are built into an upper half-bridge, and the other three are built into a lower half-bridge. It is characterized in that a metal base for the upper half-bridge and three metal bases for the lower half-bridge are laid flat in the plastic package body. The plastic package body is provided with pins at both ends thereof. The three power devices in the upper half-bridge are disposed on the metal base for the upper half-bridge, and the three power devices in the lower half-bridge are correspondingly disposed on the three metal bases for the lower half-bridge.

2. The encapsulation structure of the three-phase full-bridge circuit according to claim 1, wherein: The metal base for the upper half-bridge is located at one end in the plastic package body, and the three metal bases for the lower half-bridge are arranged side by side at the other end in the plastic package body.

3. The encapsulation structure of the three-phase full-bridge circuit according to claim 2, wherein: Among the three metal bases for the lower half-bridge, a middle one of the metal bases for the lower half-bridge is respectively provided with lateral reinforcing ribs extending laterally to both sides between the corresponding lower half-bridge metal base and the upper half-bridge metal base.

4. The encapsulation structure of the three-phase full-bridge circuit according to claim 3, characterized in that: Among the three metal bases for the lower half-bridge, a middle one of the metal bases for the lower half-bridge is also provided with a longitudinal reinforcing rib extending to the corresponding end of the plastic package body.

5. The encapsulation structure of the three-phase full-bridge circuit according to claim 4, characterized in that: Reinforcing grooves are provided on the metal base for the upper half-bridge, all the metal bases for the lower half-bridge, and all the pins, so that the plastic package body formed during plastic encapsulation is embedded in all the reinforcing grooves.

6. The encapsulation structure of the three-phase full-bridge circuit according to claim 5, characterized in that: The metal base for the upper half-bridge is respectively provided with at least one longitudinally arranged reinforcing groove at both of its side end portions, and the metal base for the upper half-bridge is provided with at least one reinforcing groove at its main body portion.

7. The encapsulation structure of the three-phase full-bridge circuit according to claim 6, wherein: The metal base for the upper half-bridge is provided with at least two longitudinally arranged reinforcing grooves at its main body portion.

8. The encapsulation structure of the three-phase full-bridge circuit according to claim 5, wherein: The two side metal bases for the lower half-bridge are respectively provided with at least one reinforcing groove at their main body portions, the two side metal bases for the lower half-bridge are respectively provided with at least one longitudinally arranged reinforcing groove at their respective outer end portions, the middle metal base for the lower half-bridge is provided with at least one reinforcing groove at its main body portion, and the middle metal base for the lower half-bridge is respectively provided with longitudinally arranged reinforcing grooves at the end portions of the lateral reinforcing ribs on both of its sides.

9. The encapsulation structure of the three-phase full-bridge circuit according to claim 8, wherein: The two side metal bases for the lower half-bridge are respectively provided with at least one transversely arranged reinforcing groove at their main body portions, and the middle metal base for the lower half-bridge is provided with at least one transversely arranged reinforcing groove at its main body portion.

10. The encapsulation structure of the three-phase full-bridge circuit according to claim 5, characterized in that: At least one transversely arranged reinforcing groove is respectively provided on the pins.

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