An intelligent repair method and system for industrial circuit boards based on lossless damping chips

Abstract

The present invention provides an intelligent repair method and system for industrial circuit boards based on a lossless damping chip. The method obtains multi-dimensional acoustic response data within the industrial circuit board, spatially analyzes the phase offset, and generates a three-dimensional geometric boundary coordinate set for the microcrack region. The system activates the resonant wave stabilization processing mode of the lossless damping chip to generate a mechanical resonant frequency and a dynamic constraint force field that suppresses crack propagation. Based on the stress distribution state of the dynamic constraint force field, a target filling solution is generated. A conductive filling path topology is constructed to generate a continuous conductive interface. Based on the resonant response characteristics between the continuous conductive interface and the mechanical resonant frequency, a micron-level crack repair solution is generated to perform intelligent repair of industrial circuit boards. The present invention overcomes the fuzzy positioning problem of crack spatial morphology in traditional detection technologies, ensures the precise penetration of filling materials along the crack, and implements verification and closed-loop feedback of the repair effect, significantly improving the stability and reliability of the repaired industrial circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of industrial circuit board repair, and in particular to an industrial circuit board intelligent repair method and system based on a lossless damping chip. Background Art

[0002] With the widespread use of industrial multi-layer circuit boards in complex operating conditions such as high density, high frequency, and high temperature, the generation of internal microcracks has become a key factor affecting the stability and service life of the equipment. However, because microcracks are often located within the multi-layer structure and are very small, traditional external detection methods cannot accurately locate and effectively repair them. Therefore, a technical solution is urgently needed that can achieve 3D modeling of microcrack areas and implement intelligent intervention without destroying the overall structure.

[0003] The current mainstream approach is a repair method based on a combination of laser ultrasonic imaging and local thermal stress compensation. High-precision lasers are used to generate ultrasonic waves within the material, thereby constructing a rough image of the distribution of microcracks. A micro-heating module is then used to apply controllable thermal stress to the surface of the detected cracked area to inhibit crack propagation, supplemented by the localized application of conductive adhesive to restore the electrical path. Existing approaches have several drawbacks, including the scattering and mode conversion of ultrasonic signals when propagating through multilayered media, making it difficult to accurately characterize the three-dimensional boundary features of micron-scale cracks; the lack of spatial directionality in local thermal stress control, which degrades the material properties of adjacent areas; and the reliance on manual experience to set the path for the conductive adhesive filling process, resulting in difficulties in meeting the conductivity and mechanical stability requirements of the repaired material for long-term operation. Summary of the Invention

[0004] The present invention provides an intelligent repair method and system for industrial circuit boards based on a lossless damping chip, which is used to solve problems in the prior art, including the scattering and mode conversion that occur easily when ultrasonic signals propagate in multi-layer media, making it difficult to accurately characterize the three-dimensional boundary characteristics of micron-level cracks; the lack of spatial directionality in local thermal stress control, resulting in deterioration of material properties in adjacent areas; and the reliance on manual experience to set the path during the filling process of conductive glue, resulting in the conductivity and mechanical stability after repair being difficult to meet long-term operation requirements.

[0005] In a first aspect, the present invention provides an intelligent repair method for an industrial circuit board based on a lossless damping chip, comprising:

[0006] Acquiring multi-dimensional acoustic response data from within the industrial circuit board, and spatially resolving phase offsets in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of microcrack regions within the industrial circuit board, the three-dimensional geometric boundary coordinate set including depth distribution characteristics and spatial extension vectors of the microcrack regions;

[0007] Based on the depth distribution characteristics, activating a resonant wave stabilization processing mode of the lossless damping chip to generate a mechanical resonant frequency that matches the depth of the microcrack region, and generating a dynamic constraint force field on the surface of the microcrack region to inhibit crack propagation according to the mechanical resonant frequency;

[0008] According to the stress distribution state of the dynamic constraint force field, the flow direction of the conductive filling material is adjusted to generate a target filling scheme including path planning parameters, wherein the target filling scheme limits the conductive filling material to be directional filled along the adaptive penetration path within the three-dimensional geometric boundary coordinate set;

[0009] During the directional filling process, a conductive filling path topology structure matching the spatial extension vector is constructed in the microcrack region, and a continuous conductive interface covering a three-dimensional geometric boundary coordinate set is collaboratively generated based on the conductive filling path topology structure and the lossless damping chip;

[0010] According to the resonance response characteristics between the continuous conductive interface and the mechanical resonant frequency, a micron-level crack repair scheme is generated to perform intelligent repair of industrial circuit boards.

[0011] Optionally, multi-dimensional acoustic response data inside the industrial circuit board is obtained, and the phase offset in the multi-dimensional acoustic response data is spatially resolved to generate a three-dimensional geometric boundary coordinate set of the microcrack area of ​​the industrial circuit board. The three-dimensional geometric boundary coordinate set includes the depth distribution characteristics and spatial extension vector of the microcrack area, including:

[0012] Apply multi-directional ultrasonic excitation signals to industrial circuit boards, collect sound wave reflection signals under different propagation paths, and form multi-dimensional acoustic response data including time and direction dimensions;

[0013] Decomposing the multi-dimensional acoustic response data according to propagation direction, and extracting a set of phase offsets in each propagation direction;

[0014] Based on the phase offset set and a preset ultrasonic propagation velocity mapping model, a correlation relationship between the phase offset and a change in dielectric thickness is established, wherein the change in dielectric thickness characterizes a depth distribution characteristic of a microcrack region of the industrial circuit board;

[0015] performing directional fitting on the boundary of the microcrack region according to the association relationship, and calculating an extension vector of the microcrack region in the physical structure space of the industrial circuit board;

[0016] The depth distribution feature and the extension vector are integrated to generate a three-dimensional geometric boundary coordinate set containing complete morphological parameters of the microcrack region.

[0017] Optionally, based on the depth distribution characteristics, activating a resonant wave stabilization processing mode of a lossless damping chip to generate a mechanical resonant frequency that matches the depth of the microcrack region, and generating a dynamic constraint force field on the surface of the microcrack region to inhibit crack propagation according to the mechanical resonant frequency, including:

[0018] determining a fundamental frequency value of a mechanical resonant frequency according to a maximum depth value in the depth distribution feature and a material resonance characteristic of a substrate of the industrial circuit board;

[0019] Based on the different depth levels in the depth distribution characteristics, the fundamental frequency value is frequency-expanded according to a preset depth frequency gradient rule to generate a stepped mechanical resonance frequency sequence covering the depth of the microcrack region;

[0020] Synchronously outputting the step-type mechanical resonance frequency sequence through the piezoelectric stacked structure of the lossless damping chip, so that the mechanical vibration waves corresponding to the step-type mechanical resonance frequency sequence are superimposed and interfered in the depth direction of the microcrack region, and superimposed interference process data is generated;

[0021] constructing a layered constraint force intensity gradient on the surface of the microcrack region according to the vibration energy distribution in the superimposed interference process data;

[0022] The vibration wave amplitude of each layer in the layered constraint force intensity gradient is limited and adjusted to generate a dynamic constraint force field that inhibits crack propagation.

[0023] Optionally, the piezoelectric stacked structure of the lossless damping chip synchronously outputs the stepped mechanical resonance frequency sequence, so that the mechanical vibration waves corresponding to the stepped mechanical resonance frequency sequence are superimposed and interfered in the depth direction of the microcrack area, and superimposed interference process data is generated, including:

[0024] Allocating the stepped mechanical resonance frequency sequence to each piezoelectric unit corresponding to the piezoelectric stacked structure of the lossless damping chip according to the depth level, wherein each piezoelectric unit obtains a frequency allocation parameter matching the corresponding depth level;

[0025] Applying a driving voltage matching the frequency distribution parameter to each piezoelectric unit to generate a mechanical vibration wave matching the frequency distribution parameter, and increasing the amplitude of the mechanical vibration wave by a preset ratio as the frequency of the stepped mechanical resonant frequency sequence increases, thereby generating a gradient amplitude vibration wave;

[0026] Controlling the emission phase of the gradient amplitude vibration wave so that the vibration wave phase of the surface piezoelectric unit lags behind the phase of the deep piezoelectric unit by a quarter of a cycle, thereby generating a phase-delayed vibration wave emission sequence;

[0027] Recording the superposition state of the vibration waveforms of the phase-delayed vibration wave emission sequence in the depth direction of the microcrack region to generate an interference peak distribution diagram;

[0028] Extracting the interference region coordinates where the amplitude intensity exceeds the preset substrate yield strength threshold value in the interference peak distribution diagram, and marking the interference region coordinates as the effective restraining force action area;

[0029] Superposition interference process data is generated according to the distribution density and position parameters of the effective restraining force action area.

[0030] Optionally, according to the stress distribution state of the dynamic constraint force field, the flow direction of the conductive filling material is adjusted to generate a target filling scheme including path planning parameters, wherein the target filling scheme limits the conductive filling material to be directional filled along the adaptive penetration path within the three-dimensional geometric boundary coordinate set, including:

[0031] Directionally decomposing the stress distribution state of the dynamic constraint force field to obtain a set of principal stress direction angles at each position point on the surface of the microcrack region;

[0032] Calculating a directional matching degree between the principal stress direction angle set and the spatial extension vector of the three-dimensional geometric boundary coordinate set to generate a flow direction correction parameter set for each position point, wherein the flow direction correction parameter set includes a candidate filling direction for each parameter and an angle value between each parameter and the spatial extension vector;

[0033] Screening effective filling paths according to the flow direction correction parameter set to generate an effective filling path set;

[0034] Generating a target filling scheme including path planning parameters according to the spatial distribution density and directional continuity of the effective filling path set, wherein the target filling scheme consists of a main channel priority coefficient, a branch path filling sequence parameter, and an adaptive infiltration path;

[0035] The injection pressure gradient of the conductive filling material is adjusted according to the main channel priority coefficient, and the flow rate stage change is controlled according to the branch path filling sequence parameter to perform directional filling along the adaptive infiltration path.

[0036] Optionally, during the directional filling process, a conductive filling path topology structure matching the spatial extension vector is constructed in the microcrack region, and a continuous conductive interface covering a three-dimensional geometric boundary coordinate set is collaboratively generated based on the conductive filling path topology structure and the lossless damping chip, including:

[0037] During the directional filling process, the flow path of the conductive filling material is aligned with the spatial extension vector to have a consistent direction angle, so as to generate an initial filling path topology defined by a main path vector in the spatial extension vector;

[0038] Applying a local electric field to a node region of the initial filling path topology and controlling a dendrite growth direction of the conductive filling material in the node region to generate a branch path extension structure that matches a branch vector in the spatial extension vector;

[0039] generating conductive filling path topology verification data based on a fusion state of the branch path extension structure and the main path vector;

[0040] Based on the piezoelectric effect of the lossless damping chip, periodic micro-vibration is performed in the interface region of the conductive filling path topology to close the microscopic pores at the interface between the conductive filling material and the substrate, and data on the degree of closure of the microscopic pores is generated;

[0041] The resistance difference parameter in the conductive filling path topology verification data and the pore closure rate parameter in the microscopic pore closure degree data are compared and analyzed. When the resistance difference parameter is less than or equal to a first preset threshold and the pore closure rate parameter is greater than or equal to a second preset threshold, a continuous conductive interface covering the three-dimensional geometric boundary coordinate set is generated.

[0042] Optionally, based on the resonance response characteristics between the continuous conductive interface and the mechanical resonant frequency, a micron-scale crack repair scheme is generated to perform intelligent repair of industrial circuit boards, including:

[0043] Applying a test vibration wave having the same frequency as the mechanical resonance frequency to the continuous conductive interface, detecting a resonance response characteristic of the continuous conductive interface, and generating interface dynamic response data including a resonance frequency offset and a resonance amplitude attenuation value;

[0044] extracting a resonance frequency offset and a resonance amplitude attenuation value related to the mechanical resonance frequency from the interface dynamic response data;

[0045] The resonance frequency offset and the resonance amplitude attenuation value are compared with a preset interface integrity criterion. When the resonance frequency offset and the resonance amplitude attenuation value simultaneously meet the preset interface integrity criterion, a micron-level crack repair solution is generated to perform intelligent repair of industrial circuit boards.

[0046] In a second aspect, the present invention provides an industrial circuit board intelligent repair system based on a lossless damping chip, comprising:

[0047] a parsing module configured to obtain multi-dimensional acoustic response data from within the industrial circuit board and spatially parse phase offsets in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of microcrack regions of the industrial circuit board, the three-dimensional geometric boundary coordinate set including depth distribution characteristics and spatial extension vectors of the microcrack regions;

[0048] an activation module, configured to activate a resonant wave stabilization processing mode of the lossless damping chip based on the depth distribution characteristics, generate a mechanical resonant frequency that matches the depth of the microcrack region, and generate a dynamic constraint force field on the surface of the microcrack region to inhibit crack propagation according to the mechanical resonant frequency;

[0049] an adjustment module, configured to adjust a flow direction of the conductive filling material according to a stress distribution state of the dynamic constraint force field, and generate a target filling scheme including path planning parameters, wherein the target filling scheme defines a directional filling of the conductive filling material along an adaptive infiltration path within the three-dimensional geometric boundary coordinate set;

[0050] A construction module is used to construct a conductive filling path topology structure matching the spatial extension vector in the microcrack region during the directional filling process, and to collaboratively generate a continuous conductive interface covering a three-dimensional geometric boundary coordinate set based on the conductive filling path topology structure and the lossless damping chip;

[0051] A generation module is configured to generate a micron-scale crack repair solution based on the resonant response characteristics between the continuous conductive interface and the mechanical resonant frequency, thereby performing intelligent repair of industrial circuit boards. In a third aspect, the present invention provides a computing device comprising a processor and a memory, wherein the memory stores a computer program, and the processor is configured to execute the computer program to perform any of the methods for intelligent repair of industrial circuit boards based on a lossless damping chip as described in the first aspect.

[0052] In a fourth aspect, the present invention provides a computer storage medium having computer program instructions stored thereon, wherein the computer program instructions, when executed by a processor, implement an intelligent repair method for an industrial circuit board based on a lossless damping chip as described in any one of the first aspects.

[0053] The present invention achieves precise repair of micro-cracks in industrial circuit boards through the coordinated control of multi-dimensional acoustic detection and dynamic constraint force fields. First, a three-dimensional geometric boundary coordinate set is generated based on the spatial analysis of the phase offset, breaking through the fuzzy positioning problem of the crack spatial morphology of traditional detection technology and solving the blind spot of crack detection inside the multi-layer circuit board; secondly, through the dynamic constraint force field driven by the mechanical resonant frequency, the crack propagation is actively suppressed during the filling process to avoid the risk of secondary damage; then, the adaptive penetration path and the conductive filling path topology are combined to ensure that the filling material penetrates accurately along the true shape of the crack; finally, a repair plan is generated based on the resonance response characteristics to achieve dynamic verification and closed-loop feedback of the repair effect, improve the electrical stability and mechanical reliability of the repaired circuit board, and meet the needs of industrial-grade high-precision repair.

[0054] Furthermore, the accuracy and reliability of three-dimensional crack morphology detection are improved through multi-directional ultrasonic excitation and propagation path decomposition technology. Specifically, by acquiring acoustic response data in both the time and direction dimensions, combined with the physical mapping relationship between phase offset and ultrasonic propagation velocity, the abstract acoustic signal is converted into a quantifiable medium thickness change parameter, breaking through the limitations of traditional single-path detection in missing inclined cracks and branching cracks. Directional fitting and extension vector calculations are used to reproduce the three-dimensional extension trajectory of the crack in the physical space of the circuit board, providing a high-precision spatial reference for subsequent repairs. This solution is applicable to laminated circuit boards and can identify differences in the depth and direction of micron-level microcracks, laying a key data foundation for the generation of dynamic constraint force fields and adaptive filling path planning, forming a closed-loop technology chain for "detection-control-repair."

[0055] These and other aspects of the present invention will become more readily apparent from the following description of the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0057] Figure 1 A flowchart of an industrial circuit board intelligent repair method based on a lossless damping chip provided by an embodiment of the present invention;

[0058] Figure 2 A schematic structural diagram of an industrial circuit board intelligent repair system based on a lossless damping chip provided by an embodiment of the present invention;

[0059] Figure 3 A schematic diagram of the structure of a computing device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0060] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0061] In some of the processes described in the specification and claims of the present invention and the above-mentioned figures, multiple operations that appear in a specific order are included, but it should be clearly understood that these operations may not be executed in the order in which they appear in this article or may be executed in parallel. The serial numbers of the operations, such as 101, 102, etc., are only used to distinguish between different operations, and the serial numbers themselves do not represent any execution order. In addition, these processes may include more or fewer operations, and these operations may be executed in sequence or in parallel. It should be noted that the descriptions of "first", "second", etc. in this article are used to distinguish different messages, devices, modules, etc., and do not represent the order of precedence, nor do they limit "first" and "second" to be different types.

[0062] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0063] Figure 1 The present invention provides a flowchart of an industrial circuit board intelligent repair method based on a lossless damping chip, such as Figure 1 As shown, the method includes:

[0064] This invention addresses the industry's pain points: the hidden nature of microcracks within industrial multilayer circuit boards, the risk of secondary damage associated with traditional repair processes, and the difficulty in achieving precise three-dimensional repair. By proposing an intelligent repair solution that collaborates across physical fields, this approach addresses three key limitations of existing technologies: First, ultrasonic detection technology is limited to single-dimensional signal analysis, resulting in a mismatch between the repair range and the actual damaged area; second, conventional filling processes employ static pressure injection, which can easily lead to material accumulation or insufficient penetration in complex crack branches; and third, verification of repair effectiveness relies on destructive sampling or surface electrical testing, making in-situ interface integrity assessment impossible. This solution establishes a three-dimensional coordinate system of crack depth extension vectors through multi-dimensional acoustic phase space analysis, breaking through the traditional two-dimensional detection blind spot; based on the crack depth feature matching the mechanical resonant frequency, a gradient dynamic constraint force field is generated to achieve mechanical suppression of crack extension at the nanometer amplitude; combining the stress distribution state with the spatial vector direction to design an adaptive penetration path, and through the electric field to regulate the dendrite growth to construct a conductive topological network that matches the crack morphology; finally, the resonance response characteristics and the original mechanical frequency are used to form a collaborative verification mechanism to form a full-process repair system. Based on this, the present invention provides an industrial circuit board intelligent repair method based on a lossless damping chip, such as Figure 1 ,include:

[0065] Step 101: Acquire multi-dimensional acoustic response data inside the industrial circuit board, and spatially analyze the phase offset in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of the microcrack area of ​​the industrial circuit board. The three-dimensional geometric boundary coordinate set includes the depth distribution characteristics and spatial extension vector of the microcrack area.

[0066] In this step, multi-dimensional acoustic response data refers to the set of acoustic signals obtained through multi-directional ultrasonic excitation and propagation path decomposition; spatial resolution operation refers to the process of converting the phase offset into medium thickness change through the propagation rate model and fitting the three-dimensional morphology of the crack; the three-dimensional geometric boundary coordinate set refers to the set of spatial parameters including the three-dimensional coordinate points, depth levels and extension vectors of the crack; the depth distribution feature refers to the hierarchical depth data of the crack along the thickness direction of the circuit board, which is generated by mapping the phase offset and the sound velocity model; the spatial extension vector refers to the extension direction of the crack in three-dimensional space.

[0067] In an embodiment of the present invention, ultrasonic waves with different propagation paths are emitted to an industrial circuit board through a multi-directional ultrasonic excitation signal generator, and time series data and directional distribution data of the reflected signals are collected to form multi-dimensional acoustic response data containing time and directional dimensions. Secondly, the multi-dimensional acoustic response data is decomposed by the propagation direction, and a set of phase offsets in each direction is extracted. Then, based on an ultrasonic propagation velocity mapping model, the phase offsets are converted into dielectric thickness change values. Subsequently, a directionality fitting is performed on the crack boundary, and the extension vector of the crack in the three-dimensional physical space of the circuit board is calculated. Finally, the depth distribution characteristics and the extension vector are integrated to generate a set of three-dimensional geometric boundary coordinates.

[0068] Step 102: Based on the depth distribution characteristics, activate the resonant wave stabilization processing mode of the lossless damping chip to generate a mechanical resonant frequency that matches the depth of the microcrack area, and generate a dynamic constraint force field on the surface of the microcrack area to inhibit crack propagation according to the mechanical resonant frequency.

[0069] In this step, the resonant wave stabilization processing mode refers to a control mode that outputs a stepped mechanical resonant frequency through a piezoelectric stacked structure to generate a dynamic constraint force field; the mechanical resonant frequency refers to a vibration frequency sequence generated in an inversely proportional relationship according to the crack depth, with the deep layer corresponding to the high frequency and the surface layer corresponding to the low frequency; the dynamic constraint force field refers to a layered force field formed by superimposing vibration waves of different frequencies.

[0070] In an embodiment of the present invention, first, based on the depth distribution characteristics in the three-dimensional geometric boundary coordinate set, the maximum depth value of the crack is extracted and the resonance coefficient of the substrate is queried to calculate the basic value of the mechanical resonance frequency; secondly, the basic frequency is divided into depth levels and gradiently expanded to generate a step-type mechanical resonance frequency sequence; then, the piezoelectric stacked structure of the lossless damping chip is activated, and the stepped frequency is distributed to the piezoelectric units of the corresponding level to generate a mechanical vibration wave matching the frequency; finally, through the superposition interference effect of the vibration wave, a layered constraint force distribution pattern is formed on the crack surface, and the driving voltage of each layer of piezoelectric units is adjusted so that the deep constraint force strength is 3 to 5 times that of the surface layer, thereby generating a dynamic constraint force field that inhibits crack expansion.

[0071] Step 103: According to the stress distribution state of the dynamic constraint force field, the flow direction of the conductive filling material is adjusted to generate a target filling scheme including path planning parameters, wherein the target filling scheme limits the conductive filling material to be directionally filled along the adaptive penetration path within the three-dimensional geometric boundary coordinate set.

[0072] In this step, the stress distribution state refers to the principal stress direction and intensity distribution data on the crack surface under the action of the dynamic constraint force field; the adjustment operation refers to the action of screening the filling path and generating injection parameters according to the matching degree between the stress direction and the space vector; the path planning parameters refer to the path control rules including the main path priority, branch filling order and curvature radius limitation; the adaptive penetration path refers to the filling path that matches the crack morphology, and the curvature radius is not less than 5 times the branch width; the directional filling operation refers to the precise filling process of controlling the material injection pressure and flow rate according to the path planning parameters.

[0073] In an embodiment of the present invention, first, a set of principal stress direction angles of each position point is extracted; secondly, the direction matching degree of the principal stress direction angles and the spatial extension vectors in the three-dimensional geometric boundary coordinate set is calculated, and candidate filling directions with an angle less than 30 degrees with the extension vector are screened; then, based on the stress interference coefficient and the crack branch width of the candidate filling direction, a set of effective filling paths with a curvature radius not less than 5 times the branch width is generated; finally, based on the spatial density and directional continuity of the effective filling paths, path planning parameters including the main channel priority and branch filling order are generated, and accordingly, the injection pressure gradient and flow rate stage change rules of the conductive filling material along the adaptive infiltration path are limited to form a target filling scheme.

[0074] Step 104: During the directional filling process, a conductive filling path topology structure matching the spatial extension vector is constructed in the microcrack region, and a continuous conductive interface covering a three-dimensional geometric boundary coordinate set is collaboratively generated based on the conductive filling path topology structure and the lossless damping chip.

[0075] In this step, the conductive filling path topology structure that matches the spatial extension vector refers to a conductive network structure in which the deviation angle between the filling path and the crack main axis and branch direction is less than 15 degrees; the continuous conductive interface refers to a repaired circuit interface in which the resistance difference is less than or equal to 5% and the pore closure rate is greater than or equal to 95%.

[0076] In an embodiment of the present invention, the flow path of the conductive filling material is first calibrated to a consistent direction angle with the spatial extension vector, thereby generating an initial filling path topology defined by the main path vector; secondly, a local electric field of 50 V / mm is applied to the node area of ​​the initial path to control the dendrite growth direction of the conductive filling material at the node so that its deviation angle from the branch vector is less than 15 degrees, thereby generating a branch path extension structure; then, a four-probe resistance tester is used to detect the connection resistance difference between the main path and the branch path, requiring the difference to be no more than 5%, and verifying that the curvature radius of the connection is no less than 2 times the branch width; finally, a lossless damping chip is used to generate a periodic micro-vibration of 30 kHz, with the amplitude controlled within 5 μm, which lasts for 5 seconds so that the interface pore closure rate exceeds 95%, thereby generating a continuous conductive interface covering a set of three-dimensional geometric boundary coordinates.

[0077] Step 105: Generate a micron-level crack repair solution based on the resonance response characteristics between the continuous conductive interface and the mechanical resonant frequency to perform intelligent repair of the industrial circuit board.

[0078] In this step, the resonance response characteristics refer to the frequency offset and amplitude attenuation parameters of the repaired interface under the test vibration wave; the micron-level crack repair solution refers to a closed-loop control solution that includes repair coordinates, performance parameters and secondary repair instructions.

[0079] In an embodiment of the present invention, a 20kHz test vibration wave with the same frequency as the mechanical resonance frequency is first applied to the continuous conductive interface, and the interface vibration amplitude and phase offset are detected by a laser interferometer to generate interface dynamic response data including resonant frequency offset and amplitude attenuation; secondly, the resonant frequency offset and amplitude attenuation values ​​are extracted from the interface dynamic response data; then, the frequency offset and amplitude attenuation values ​​are input into a preset qualified repair parameter mapping table, requiring that the frequency offset does not exceed 3% and the amplitude attenuation does not exceed 15%; finally, when the parameters meet the standards at the same time, a micron-level crack repair plan including the three-dimensional coordinates of the repair area and performance indicators is generated, otherwise a local secondary repair instruction is triggered.

[0080] For example, a multi-directional ultrasonic transmitter first transmits a multi-band excitation signal to a multi-layer circuit board. Reflected signals from multiple directions are collected, generating acoustic response data encompassing both time and direction, and detecting the phase offset in the microcrack region. Second, based on the acoustic velocity model of the substrate material, the phase offset is converted into a depth distribution feature, the crack depth level is calculated, and a spatial extension vector is generated. The piezoelectric stack structure of the lossless damping chip is then activated, outputting a stepped mechanical resonant frequency sequence, forming a layered dynamic constraint force field on the crack surface. Next, a filling path matching the extension vector is selected based on the stress distribution. The injection pressure and flow rate of the conductive filler material are adjusted. After the main path is filled, parameters are adjusted to supplement the branch. A local electric field is applied to the node region to control dendrite growth along the branch vector direction, and the main branch connection resistance difference and curvature radius are measured. Finally, a test vibration wave with the same frequency as the mechanical resonant frequency is applied to measure the interface resonance frequency shift and amplitude attenuation. A qualified repair plan is generated, and the coordinates of the repair area are annotated.

[0081] To address the difficulty in accurately identifying the three-dimensional boundaries of microcracks in industrial circuit boards, this step spatially resolves the phase offsets of multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set containing depth distribution and extension vectors. The present invention provides a specific embodiment, step 101, obtaining multi-dimensional acoustic response data from within an industrial circuit board, spatially resolving the phase offsets in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set for the microcrack region of the industrial circuit board. The three-dimensional geometric boundary coordinate set includes the depth distribution characteristics and spatial extension vectors of the microcrack region, specifically comprising the following steps:

[0082] Step 111: Apply multi-directional ultrasonic excitation signals to the industrial circuit board, collect sound wave reflection signals under different propagation paths, and form multi-dimensional acoustic response data including time dimension and direction dimension.

[0083] In this step, the multi-directional ultrasonic excitation signal refers to a collection of ultrasonic pulses emitted from multiple azimuth angles, with typical directions including 0°, 45°, 90°, etc.; the acoustic wave reflection signal refers to the time domain waveform data formed after the ultrasonic wave propagates in different directions inside the circuit board and encounters crack reflection.

[0084] In an embodiment of the present invention, a multi-directional excitation signal is first applied to the surface of an industrial circuit board through a multi-channel ultrasonic transmitting device. Secondly, the sound wave reflection signals under different propagation paths are collected, and the time domain waveform data and arrival time difference of each path are recorded to form multi-dimensional acoustic response data. Subsequently, the ambient noise and the interference of the circuit board surface reflection are filtered out, and finally an acoustic data set containing two dimensions including the time direction is generated.

[0085] Step 112: Decompose the multi-dimensional acoustic response data according to propagation direction, and extract a set of phase offsets in each propagation direction.

[0086] In this step, the propagation direction decomposition operation refers to separating the mixed acoustic signal into independent directional components through the beamforming algorithm; the phase offset set refers to the phase delay difference data set caused by the crack in each propagation direction of the ultrasonic wave, which is generated through Hilbert transform and normalization processing.

[0087] In an embodiment of the present invention, the multidimensional acoustic response data is first decomposed according to the propagation direction, and the mixed signal is separated into sub-datasets of independent propagation directions. Secondly, the phase information in each sub-dataset is extracted through Hilbert transform, and the phase difference between the ultrasonic wave in the crack area and the intact medium area is calculated to form a set of phase offsets in each propagation direction. The phase offsets are then normalized to eliminate the influence of the propagation distance difference and generate a standardized phase offset matrix.

[0088] Step 113: Based on the phase offset set and a preset ultrasonic propagation velocity mapping model, a correlation relationship between the phase offset and a change in dielectric thickness is established, wherein the change in dielectric thickness represents a depth distribution feature of the microcrack region of the industrial circuit board.

[0089] In this step, the preset ultrasonic propagation velocity mapping model refers to a database that stores the relationship between the substrate sound velocity, temperature, and thickness, and is used to convert the phase difference into a change in medium thickness; the medium thickness change refers to the reduction in substrate thickness caused by the crack, which is calculated by multiplying the time delay and the sound velocity by 2.

[0090] In this embodiment of the present invention, a preset ultrasonic propagation velocity mapping model is first called. Next, each phase difference in the phase offset set is converted into a time delay, where the time delay is equal to the phase difference divided by the ultrasonic angular frequency. The medium thickness change is then calculated based on the product of the time delay and the speed of sound. The thickness change is equal to the time delay multiplied by the speed of sound divided by two. Finally, a linear correlation between the phase offset and the change in medium thickness is established to generate a depth distribution feature dataset for the microcrack region.

[0091] Step 114: performing directional fitting on the boundary of the microcrack region according to the association relationship, and calculating an extension vector of the microcrack region in the physical structure space of the industrial circuit board.

[0092] In this step, the directional fitting operation refers to the use of the least squares method to perform directional regression analysis on the crack boundary points to determine the extension trends of the main channel and branches; the extension vector refers to the parameters that describe the three-dimensional spatial direction of the crack, including the main channel azimuth, branch angle, and Z-axis inclination angle.

[0093] In an embodiment of the present invention, first, based on the medium thickness variation data set, the least squares method is used to perform directional fitting on the crack boundary and calculate the extension direction angle of the main crack channel; secondly, the expansion direction of the crack branch is determined by spatial gradient analysis, and the angle data between each branch and the main channel is extracted; then, the main channel direction angle and the branch angle are integrated into a three-dimensional space vector; finally, the discrete data points are supplemented by an interpolation algorithm to generate a set of extension vectors that describe the complete spatial direction of the crack.

[0094] Step 115: Integrate the depth distribution feature and the extension vector to generate a three-dimensional geometric boundary coordinate set containing complete morphological parameters of the microcrack region.

[0095] In this step, the complete morphological parameters refer to the three-dimensional digital description of the crack that integrates depth, direction and coordinates, including layer depth, space vector and topological connection relationship.

[0096] In an embodiment of the present invention, the layered depth values ​​in the depth distribution feature dataset are first spatially aligned with the direction parameters in the extension vector set; secondly, the three-dimensional coordinate points are clustered according to the depth level, and the coordinate points in the same depth layer share the same extension direction angle; then the depth values, direction angles and coordinate points are integrated into a structured data table; finally, a visual geometric boundary coordinate set is generated.

[0097] In order to improve the depth matching of the microcrack constraint force field, this step generates a stepped mechanical resonance frequency sequence based on the depth distribution characteristics, and constructs a dynamic constraint force field that inhibits crack propagation through superposition interference. The present invention provides a specific embodiment, step 102, based on the depth distribution characteristics, activates the resonant wave stabilization processing mode of the lossless damping chip, generates a mechanical resonance frequency that matches the depth of the microcrack area, and generates a dynamic constraint force field that inhibits crack propagation on the surface of the microcrack area based on the mechanical resonance frequency, specifically including the following steps:

[0098] Step 121: determining a fundamental frequency value of a mechanical resonance frequency according to a maximum depth value in the depth distribution feature and a material resonance characteristic of a substrate of the industrial circuit board.

[0099] In this step, the material resonance characteristics refer to the functional relationship between the natural frequency of the substrate and its thickness and temperature, which is stored in the database for frequency calculation; the basic frequency value refers to the reference frequency calculated based on the inverse proportion between the maximum crack depth and the substrate resonance coefficient, and the formula is basic frequency = substrate resonance coefficient / maximum depth.

[0100] In an embodiment of the present invention, a material resonance characteristic database of the substrate of the industrial circuit board is first called; secondly, the maximum depth value is converted into a fundamental frequency value of the mechanical resonance frequency through an inverse proportional relationship formula; and finally, the calculated fundamental frequency value is used as a benchmark for subsequent frequency expansion.

[0101] Step 122: Based on the different depth levels in the depth distribution characteristics, the basic frequency value is frequency-expanded according to a preset depth frequency gradient rule to generate a stepped mechanical resonance frequency sequence covering the depth of the microcrack area.

[0102] In this step, the preset depth frequency gradient rule refers to a linear or nonlinear expansion rule that increases the frequency according to the crack depth level; the frequency expansion operation refers to the algorithmic process of allocating the basic frequency to different depth levels according to the gradient rule; the stepped mechanical resonance frequency sequence refers to a frequency set divided by depth level.

[0103] In an embodiment of the present invention, the different depth levels in the depth distribution feature are first divided according to preset intervals; secondly, based on a preset depth frequency gradient rule, the basic frequency value is expanded in a hierarchical increasing ratio; then, a stepped mechanical resonance frequency sequence is generated to assign increasing frequency values ​​to different depth levels to ensure that the frequency covers the full depth area of ​​the crack.

[0104] Step 123: Synchronously outputting the stepped mechanical resonance frequency sequence through the piezoelectric stacked structure of the lossless damping chip so that the mechanical vibration waves corresponding to the stepped mechanical resonance frequency sequence are superimposed and interfered in the depth direction of the microcrack region, and superimposed interference process data is generated.

[0105] In this step, the piezoelectric stack structure refers to an actuator composed of multiple layers of piezoelectric ceramic sheets, each layer corresponding to a specific depth level; the mechanical vibration wave refers to the vibration wave generated by each piezoelectric layer at the assigned frequency; the superposition interference operation refers to the energy superposition and phase interference process of vibration waves of different frequencies in the crack depth direction; the superposition interference process data refers to the detection data set containing the energy peak, phase difference and interference pattern of each depth point.

[0106] In an embodiment of the present invention, a stepped mechanical resonance frequency sequence is first assigned to the corresponding piezoelectric unit group; secondly, all piezoelectric units are synchronously driven to generate mechanical vibration waves; then, the superposition interference process of the vibration waves is recorded in the depth direction of the microcrack area, and the vibration energy peak and phase difference at each depth point are collected to generate superposition interference process data including energy distribution and interference pattern.

[0107] Step 124: constructing a layered constraint force intensity gradient on the surface of the microcrack region according to the vibration energy distribution in the superimposed interference process data.

[0108] In this step, the vibration energy distribution refers to the intensity distribution of the vibration wave energy along the crack depth direction; the layered constraint force intensity gradient refers to the constraint force intensity parameter distributed according to the depth level.

[0109] In an embodiment of the present invention, the vibration energy distribution is first extracted from the superposition interference process data, and the energy peak position is mapped to the crack depth level; secondly, based on the linear relationship between the energy peak and the constraint force strength, the layered constraint force strength gradient is set, and the deep constraint force strength is the energy peak multiplied by the conversion coefficient; finally, the constraint force strength gradient of each layer is solidified through the voltage regulation module of the piezoelectric stacked structure.

[0110] Step 125: limiting and adjusting the vibration wave amplitude of each layer in the layered constraint force intensity gradient to generate a dynamic constraint force field that suppresses crack propagation.

[0111] In this step, the vibration wave amplitude refers to the mechanical vibration amplitude output by the piezoelectric layer, which is positively correlated with the frequency and driving voltage; the limit adjustment operation refers to the action of dynamically adjusting the amplitude according to the substrate strength threshold.

[0112] In an embodiment of the present invention, the vibration amplitude of each layer in the layered constraint force strength gradient is first detected; secondly, an amplitude limitation rule is set according to a preset substrate yield strength threshold, requiring that the surface amplitude does not exceed 50% of the amplitude corresponding to the substrate yield strength; then, by reducing the driving voltage of the surface piezoelectric unit, while maintaining the deep amplitude unchanged, its amplitude is adjusted to, and finally a dynamic constraint force field is generated to inhibit crack propagation.

[0113] To address the issue of insufficient superposition and interference of vibration waves in the depth direction of the microcracks, this step generates interference process data for the effective restraining force application area through phase lag control and gradient amplitude adjustment of the piezoelectric stack structure. The present invention provides a specific embodiment, step 303, in which the piezoelectric stack structure of the lossless damping chip synchronously outputs the stepped mechanical resonant frequency sequence, causing the mechanical vibration waves corresponding to the stepped mechanical resonant frequency sequence to superimpose and interfere in the depth direction of the microcrack region, and generating superposition interference process data, specifically includes the following steps:

[0114] Step 331: Allocate the stepped mechanical resonance frequency sequence to each piezoelectric unit corresponding to the piezoelectric stacked structure of the lossless damping chip according to the depth level, wherein each piezoelectric unit obtains a frequency allocation parameter matching the corresponding depth level.

[0115] In this step, the frequency allocation parameter refers to the specific frequency value assigned to each unit in the piezoelectric stack structure, which strictly corresponds to the crack depth level.

[0116] In an embodiment of the present invention, first, frequency parameters are assigned to each piezoelectric unit in the piezoelectric stack structure according to the physical position according to the depth level division of the stepped mechanical resonance frequency sequence; secondly, the frequency allocation parameters of each piezoelectric unit are written into the drive control module through the frequency encoder to ensure that the parameters are strictly matched with the level.

[0117] Step 332: Apply a driving voltage that matches the frequency allocation parameter to each piezoelectric unit to generate a mechanical vibration wave that matches the frequency allocation parameter, and increase the amplitude of the mechanical vibration wave according to a preset ratio as the frequency of the stepped mechanical resonant frequency sequence increases, so as to generate a gradient amplitude vibration wave.

[0118] In this step, the driving voltage refers to the voltage value determined according to the frequency-voltage mapping relationship; the mechanical vibration wave refers to the vibration wave output by the piezoelectric unit, whose frequency is consistent with the distribution parameters, and the amplitude increases according to the preset rules; the incremental operation refers to the control process in which the amplitude of the vibration wave increases according to the square relationship as the frequency increases; the gradient amplitude vibration wave refers to a vibration wave sequence in which the amplitude increases according to the depth level, and the amplitude in the deep layer is significantly higher than that in the surface layer.

[0119] In an embodiment of the present invention, the driving voltage value of each piezoelectric unit is first determined; secondly, a matching voltage is applied to each piezoelectric unit to generate a mechanical vibration wave corresponding to the frequency parameter, and the amplitude of the vibration wave increases according to the square of the frequency; finally, the output is adjusted through the amplitude calibration module to generate a gradient amplitude vibration wave sequence in which the amplitude increases with frequency.

[0120] Step 333: Control the emission phase of the gradient amplitude vibration wave so that the vibration wave phase of the surface piezoelectric unit lags behind that of the deep piezoelectric unit by a quarter cycle, so as to generate a phase-delayed vibration wave emission sequence.

[0121] In this step, the emission phase refers to the starting time of the vibration wave emission, and the interference control of waveforms at different levels is achieved through lag control; the phase-lag vibration wave emission sequence refers to a control strategy in which the emission time of the surface vibration wave is delayed by a quarter of a cycle compared to the deeper layer, which is used to optimize the interference effect.

[0122] In an embodiment of the present invention, the vibration period of each piezoelectric unit is first calculated; secondly, the vibration wave emission time of the surface piezoelectric unit is controlled to lag behind that of the deep unit by 10 microseconds, thereby forming a phase-delayed vibration wave emission sequence; then, the waveform phase difference is monitored to ensure that the lag error is less than 1 microsecond, thereby generating a vibration wave emission sequence with precisely controllable phase.

[0123] Step 334: Record the superposition state of the vibration waveforms of the phase-delayed vibration wave emission sequence in the depth direction of the microcrack area to generate an interference peak distribution diagram.

[0124] In this step, the superposition state of the vibration waveform refers to the synthetic waveform after the spatial superposition of vibration waves of different frequencies, which includes constructive and destructive interference areas; the interference peak distribution diagram records the two-dimensional or three-dimensional spectrum of the synthetic amplitude intensity of each spatial point, which is used to identify high-energy areas.

[0125] In an embodiment of the present invention, a laser Doppler vibrometer is first used to sample at 1-micron intervals along the depth direction of the microcrack area, recording the vibration waveform data of each point. Secondly, the vibration waveforms of different piezoelectric units are superimposed along the time axis to detect the interference positions of the peaks and troughs. Subsequently, the amplitude intensity at each depth point is extracted through Fourier transform to generate an interference peak distribution map containing the peak positions and amplitude intensities.

[0126] Step 335: extracting the interference region coordinates in the interference peak distribution graph where the amplitude intensity exceeds the preset substrate yield strength threshold, and marking the interference region coordinates as the effective restraining force action area.

[0127] In this step, the preset substrate yield strength threshold refers to the critical stress value at which the material undergoes plastic deformation; the interference area coordinates refer to the set of spatial position points where the amplitude intensity exceeds the yield strength; and the effective constraint force action area refers to the high-energy interference area that passes the threshold screening.

[0128] First, the amplitude intensity value of each coordinate point is read from the interference peak distribution map to detect the amplitude intensity of the specific depth area. Secondly, the preset substrate yield strength threshold is queried, and all coordinate points with amplitude intensity exceeding the threshold are marked as the effective constraint force action area. Finally, an effective action area dataset containing a set of coordinates and intensity values ​​is generated.

[0129] Step 336: Generate superposition interference process data based on the distribution density and position parameters of the effective restraining force action area.

[0130] In this step, the operation of generating superposition interference process data refers to the process of integrating distribution density, coordinate position and intensity parameters to form structured data; superposition interference process data refers to a data set containing the density, position and intensity of the effective action area, which is used for iterative optimization of the dynamic constraint force field.

[0131] In an embodiment of the present invention, the spatial distribution density of the effective restraining force action area is first counted, and the number of action areas per unit volume is 25 per cubic millimeter; secondly, the position parameters including the depth level and directional angle deviation in the action area coordinates are extracted; finally, the distribution density and position parameters are integrated into a structured data table to generate superimposed interference process data for restraint force field optimization.

[0132] To address the issue of insufficient adaptability of the conductive filling material's flow direction within microcracks, this step calculates the directional matching between the stress distribution and the space vector to generate a target filling solution containing an adaptive infiltration path. The present invention provides a specific embodiment, step 103, which adjusts the flow direction of the conductive filling material based on the stress distribution state of the dynamic constraint force field to generate a target filling solution containing path planning parameters. The target filling solution specifies that the conductive filling material is directional filled along the adaptive infiltration path within the three-dimensional geometric boundary coordinate set. The target filling solution specifically includes the following steps:

[0133] Step 301: Directionally decompose the stress distribution state of the dynamic constraint force field to obtain a set of principal stress direction angles at each position point on the surface of the microcrack region.

[0134] In this step, the directional decomposition operation refers to the process of decomposing the stress tensor into the direction of the maximum principal stress, which is used to extract the dominant stress direction of each point; the principal stress direction angle set refers to the direction angle data set of the maximum principal stress at each point on the surface of the microcrack area, which is used to guide the filling path planning.

[0135] In an embodiment of the present invention, the stress distribution state of the dynamic constraint force field is first directionally decomposed, and the maximum principal stress direction angle of each position point on the surface of the microcrack area is extracted to form a principal stress direction angle set; secondly, the stress direction of each point is converted into an angle value ranging from 0° to 360°; then, noise interference is eliminated to generate a standardized data set containing the principal stress direction angles of each point as input for subsequent direction matching.

[0136] Step 302: Calculate the direction matching degree of the principal stress direction angle set and the spatial extension vector of the three-dimensional geometric boundary coordinate set to generate a flow direction correction parameter set for each position point, wherein the flow direction correction parameter set includes the candidate filling direction of each parameter and the angle value between each parameter and the spatial extension vector.

[0137] In this step, the direction matching calculation operation refers to the process of calculating the angle between the principal stress direction and the spatial extension vector direction, and screening candidate directions with angles less than the threshold; the flow direction correction parameter set refers to a parameter list containing candidate filling directions and their angles with the spatial vector.

[0138] In an embodiment of the present invention, first, the difference between each angle value in the principal stress direction angle set and the spatial extension vector direction angle in the three-dimensional geometric boundary coordinate set is calculated; secondly, the direction matching threshold is set to 30 degrees, and the candidate filling directions with differences less than the threshold are screened to generate a flow direction correction parameter set; then, the candidate filling directions and the angle values ​​with the spatial vectors are recorded for each parameter to form a parameter list for path screening.

[0139] Step 303: Screening effective filling paths according to the flow direction correction parameter set to generate an effective filling path set.

[0140] In this step, the screening operation refers to a multi-condition path filtering process based on the angle, stress interference coefficient and curvature radius; the effective filling path refers to a qualified path that simultaneously meets the conditions that the angle is less than or equal to 30 degrees, the stress interference coefficient is less than or equal to 0.8, and the curvature radius is greater than or equal to 5 times the branch width.

[0141] In an embodiment of the present invention, first, candidate directions with angles exceeding 30 degrees are excluded based on the angle values ​​in the flow direction correction parameter set; secondly, the stress interference coefficients of the remaining candidate directions are calculated, which is defined as the ratio of the stress intensity in that direction to the regional average stress, and paths with coefficients lower than 0.8 are screened; then, it is checked whether the path curvature radius meets the condition of being no less than 5 times the crack branch width, that is, if the branch width is 0.1 mm, the curvature radius must be greater than or equal to 0.5 mm, to generate a valid filling path set.

[0142] Step 304: Generate a target filling scheme including path planning parameters according to the spatial distribution density and directional continuity of the effective filling path set, wherein the target filling scheme consists of a main channel priority coefficient, a branch path filling sequence parameter, and an adaptive infiltration path.

[0143] In this step, spatial distribution density refers to the number of effective filling paths in a unit area; directional continuity refers to the continuity requirement that the directional angle deviation of adjacent filling paths is less than or equal to 15 degrees; the main channel priority coefficient refers to the filling priority weight of the main crack channel; the branch path filling order parameter refers to the filling execution order rule arranged in descending order by branch width or length.

[0144] In an embodiment of the present invention, the spatial distribution density of the effective filling path set is first counted; secondly, the directional continuity of the path is analyzed, and the directional angle deviation of adjacent paths is calculated to be less than 15 degrees, and the continuous path group is screened; then, a priority coefficient of 1 is assigned to the main channel of the crack, and priorities 2 to N are assigned to the branch paths in descending order of width; finally, the density, continuity and priority parameters are integrated to generate a target filling scheme that includes the main channel priority coefficient, branch filling order and adaptive penetration path rules.

[0145] Step 305: adjusting the injection pressure gradient of the conductive filling material according to the main channel priority coefficient, and controlling the flow rate stage change according to the branch path filling sequence parameter to perform directional filling along the adaptive infiltration path.

[0146] In this step, the injection pressure gradient refers to the difference in filling pressure corresponding to different priority paths; the adjustment operation refers to the control action of dynamically adjusting the pressure and flow rate based on real-time monitoring data; the flow rate stage change refers to the staged reduction of the flow rate according to the filling order; the directional filling operation refers to the precise execution process of controlling the material injection direction and speed according to the planned path.

[0147] In this embodiment of the present invention, injection pressure gradients are first set for different regions based on the main channel priority coefficient, ensuring that the main channel achieves a higher pressure level while the branch paths are set to pressure values ​​according to decreasing priority. Secondly, flow rates are controlled in stages according to the branch path filling sequence parameters, with the main channel adopting a higher flow rate level and the branch paths successively lower flow rates. A directional filling operation is then performed along the adaptive infiltration path, with the filler material penetration depth and path matching monitored in real time. A dynamic pressure adjustment mechanism is triggered when path deviation exceeds a preset threshold, ensuring the spatial accuracy of the filling path and the three-dimensional crack topography.

[0148] In order to improve the synergy between the conductive interface and the microcrack geometric boundary, this step constructs a continuous conductive path topology structure linked to the lossless damping chip through spatial vector calibration and dendrite growth control. The present invention provides a specific embodiment, step 104, during the directional filling process, constructs a conductive filling path topology structure that matches the spatial extension vector in the microcrack region, and based on the conductive filling path topology structure and the lossless damping chip, collaboratively generates a continuous conductive interface covering the three-dimensional geometric boundary coordinate set, specifically including the following steps:

[0149] Step 401: During the directional filling process, the flow path of the conductive filling material is calibrated to have a consistent direction angle with the spatial extension vector, so as to generate an initial filling path topology defined by a main path vector in the spatial extension vector.

[0150] In this step, the calibration operation refers to the closed-loop control process of adjusting the flow direction of the filling material to be consistent with the direction angle of the spatial extension vector through sensor feedback and path control algorithm; the direction angle consistency refers to the strict matching state in which the angular deviation between the filling path direction and the spatial vector direction is less than or equal to 2 degrees; the main path vector refers to the main channel extension direction parameter of the crack defined in the three-dimensional geometric boundary coordinate set; the initial filling path topology refers to the digital model of the filling path generated after calibration.

[0151] In an embodiment of the present invention, the flow path of the conductive filling material is first calibrated with the direction angle of the main path vector in the spatial extension vector to ensure that the deviation between the filling path and the main axis direction of the crack is less than 2 degrees; secondly, the movement trajectory of the injection nozzle is adjusted in real time to ensure that it extends strictly along the spatial coordinates of the main path vector; then, the calibrated flow path morphology is recorded to generate an initial filling path topology containing the main path coordinate points and direction parameters, which serves as the basis for subsequent branch expansion.

[0152] Step 402: Apply a local electric field to the node region of the initial filling path topology, and control the dendrite growth direction of the conductive filling material in the node region to generate a branch path extension structure that matches the branch vector in the spatial extension vector.

[0153] In this step, the local electric field refers to the electric field generated in a specific area by microelectrodes, with an intensity of 50 volts per millimeter; the dendrite growth direction refers to the tree-like extension path formed by the conductive material under the action of the electric field, and the direction deviates from the branch vector by less than 5 degrees; the branch path extension structure refers to the extension structure in which the dendrite path is consistent with the crack branch direction and the length does not exceed 3 times the branch width.

[0154] In an embodiment of the present invention, a microelectrode array is first arranged in the branch node area of ​​the initial filling path topology, and a local electric field of 50 volts per millimeter is applied; secondly, the migration direction of metal ions in the conductive filling material is controlled so that the dendrites grow along the branch vector direction in the spatial extension vector, with a deviation angle of less than 5 degrees; then, the dendrite length is monitored to be no more than 3 times the branch width, thereby generating a branch path extension structure that matches the branch vector.

[0155] Step 403: Generate conductive filling path topology verification data based on the fusion state of the branch path extension structure and the main path vector.

[0156] In this step, the fusion state refers to the physical connection state in which the resistance difference at the connection between the main path and the branch path is less than or equal to 5% and the curvature radius is greater than or equal to 2 times the branch width; the conductive filling path topology verification data refers to the quality inspection data set including the resistance difference, curvature radius and connection score.

[0157] In an embodiment of the present invention, the resistance difference at the connection between the main path and the branch path is first detected, and the difference is required to be no more than 5%; secondly, microscopic imaging technology is used to measure the curvature radius of the connection to ensure that it is no less than twice the branch width; then, the resistance difference and curvature radius data are integrated to generate conductive filling path topology verification data including a connection quality score, and a rework instruction is triggered when the score is lower than the threshold.

[0158] Step 404: Based on the piezoelectric effect of the lossless damping chip, periodic micro-vibration is performed in the interface region of the conductive filling path topology to close the microscopic pores at the interface between the conductive filling material and the substrate, and microscopic pore closure degree data is generated.

[0159] In this step, the piezoelectric effect refers to the physical mechanism of generating mechanical vibrations by utilizing the inverse effect of piezoelectric materials; the periodic micro-vibration operation refers to the process of applying vibration waves at a fixed frequency and amplitude to close the interface pores through alternating stress; the microscopic pore closure degree data refers to the quantitative parameter of the proportion of pore closure area, which is calculated through microscopic image analysis.

[0160] In an embodiment of the present invention, the piezoelectric effect module of the lossless damping chip is first activated to output periodic micro-vibrations with a frequency of 30 kHz and an amplitude of 5 μm. Secondly, the microscopic pores at the interface between the conductive filling material and the substrate are closed under the action of alternating stress through vibration transmission, and the porosity changes are monitored in real time using a scanning electron microscope. Finally, the ratio of the closed pore area to the total pore area is calculated to generate a pore closure rate parameter, which is reduced from an initial 25% to 3%, and the vibration is stopped after reaching the standard.

[0161] Step 405: Compare and analyze the resistance difference parameter in the conductive filling path topology verification data and the pore closure rate parameter in the microscopic pore closure degree data. When the resistance difference parameter is less than or equal to a first preset threshold and the pore closure rate parameter is greater than or equal to a second preset threshold, generate a continuous conductive interface covering the three-dimensional geometric boundary coordinate set.

[0162] In this step, the resistance difference parameter refers to the relative difference in resistance between the main path and the branch path; the pore closure rate parameter refers to the ratio of the closed pore area to the total pore area, which is required to be greater than or equal to 95% to meet the standard.

[0163] In an embodiment of the present invention, the main branch resistance difference parameter is first extracted from the conductive filling path topology verification data; secondly, the pore closure rate parameter is read from the microscopic pore closure degree data; then the two parameters are compared with the preset standards, and it is judged to be qualified when the resistance difference is less than or equal to 5% and the pore closure rate is greater than or equal to 95%, and a continuous conductive interface covering the three-dimensional geometric boundary coordinate set is generated and a repair report is output.

[0164] To address the difficulty in verifying the integrity of the conductive interface after repair, this step analyzes the interface dynamic data through the resonance response characteristics to generate a micron-level crack repair solution that meets the integrity criteria. The present invention provides a specific embodiment, step 105, which generates a micron-level crack repair solution based on the resonance response characteristics between the continuous conductive interface and the mechanical resonant frequency to perform intelligent repair of industrial circuit boards, specifically including the following steps:

[0165] Step 501: applying a test vibration wave having the same frequency as the mechanical resonance frequency to the continuous conductive interface, detecting the resonance response characteristics of the continuous conductive interface, and generating interface dynamic response data including a resonance frequency offset and a resonance amplitude attenuation value.

[0166] In this step, the test vibration wave refers to a vibration wave whose frequency is strictly consistent with the original mechanical resonance frequency; the interface dynamic response data refers to a structured data set containing the measured resonance frequency offset and amplitude attenuation values.

[0167] In an embodiment of the present invention, a test vibration wave with exactly the same mechanical resonance frequency is first applied to the continuous conductive interface; secondly, the interface vibration response is detected in real time, and the vibration amplitude and phase offset data are collected; then, the amplitude attenuation ratio and frequency offset are integrated into the interface dynamic response data to provide a quantitative basis for subsequent judgment.

[0168] Step 502: extracting a resonance frequency offset and a resonance amplitude attenuation value related to the mechanical resonance frequency from the interface dynamic response data.

[0169] In this step, the resonance frequency offset refers to the relative deviation ratio between the measured resonance frequency and the original mechanical frequency; the resonance amplitude attenuation value refers to the reduction ratio of the measured amplitude relative to the initial excitation amplitude.

[0170] In an embodiment of the present invention, the resonance frequency offset is first extracted from the interface dynamic response data, and the calculation formula is the difference between the measured frequency and the mechanical resonance frequency, divided by the mechanical resonance frequency, and multiplied by 100%; secondly, the resonance amplitude attenuation value is extracted, and the calculation formula is the difference between the initial amplitude and the measured amplitude, divided by the initial amplitude, and multiplied by 100%; then, the two parameters are standardized into percentage form to generate a quantitative index directly related to the mechanical resonance frequency, which serves as an input parameter for interface integrity judgment.

[0171] Step 503: Compare the resonant frequency offset and the resonant amplitude attenuation value with a preset interface integrity criterion. When the resonant frequency offset and the resonant amplitude attenuation value both meet the preset interface integrity criterion, generate a micron-level crack repair solution to perform intelligent repair of the industrial circuit board.

[0172] In this step, the preset interface integrity criterion refers to the pre-set repair qualification standard, which requires that the frequency offset is less than or equal to 3% and the amplitude attenuation is less than or equal to 15%, ensuring that the interface mechanical stability and conductive performance meet the standards.

[0173] In an embodiment of the present invention, a preset interface integrity criterion database is first called, and the criterion requires that the resonance frequency offset does not exceed 3% and the resonance amplitude attenuation value does not exceed 15%; secondly, the extracted 1.5% frequency offset and 15% amplitude attenuation value are input into the criterion comparison module to detect whether both meet the threshold conditions at the same time; then, when the parameters meet the standards, a micron-level crack repair plan including the three-dimensional coordinates of the repair area, the frequency offset and the amplitude attenuation value is generated and marked as "qualified"; if any parameter exceeds the standard, a repair instruction including the rework coordinates and the exceeded parameters is generated to trigger a local secondary repair process.

[0174] Figure 2 The present invention provides a structural diagram of an industrial circuit board intelligent repair system based on a lossless damping chip, as shown in FIG. Figure 2As shown, the system includes:

[0175] An analysis module 21 is configured to obtain multi-dimensional acoustic response data from within the industrial circuit board and spatially analyze the phase offset in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of microcrack regions of the industrial circuit board. The three-dimensional geometric boundary coordinate set includes depth distribution characteristics and spatial extension vectors of the microcrack regions.

[0176] an activation module 22 configured to activate a resonant wave stabilization processing mode of the lossless damping chip based on the depth distribution characteristics, generate a mechanical resonant frequency that matches the depth of the microcrack region, and generate a dynamic constraint force field on the surface of the microcrack region to inhibit crack propagation according to the mechanical resonant frequency;

[0177] an adjustment module 23, configured to adjust a flow direction of the conductive filling material according to a stress distribution state of the dynamic constraint force field, and generate a target filling scheme including path planning parameters, wherein the target filling scheme defines a directional filling of the conductive filling material along an adaptive infiltration path within the three-dimensional geometric boundary coordinate set;

[0178] A construction module 24 is configured to construct, in the process of directional filling, a conductive filling path topology matching the spatial extension vector within the microcrack region, and collaboratively generate a continuous conductive interface covering a three-dimensional geometric boundary coordinate set based on the conductive filling path topology and the lossless damping chip;

[0179] The generating module 25 is used to generate a micron-level crack repair scheme based on the resonance response characteristics between the continuous conductive interface and the mechanical resonant frequency, so as to perform intelligent repair of the industrial circuit board.

[0180] Figure 2 The industrial circuit board intelligent repair system based on the lossless damping chip can perform Figure 1 The implementation principles and technical effects of the intelligent repair method for industrial circuit boards based on a lossless damping chip described in the illustrated embodiment are not further elaborated. The specific manner in which the various modules and units in the intelligent repair system for industrial circuit boards based on a lossless damping chip in the aforementioned embodiment perform their operations has been described in detail in the relevant embodiments of the method and will not be further elaborated here.

[0181] In one possible design, Figure 2 The embodiment shown is an industrial circuit board intelligent repair system based on a lossless damping chip that can be implemented as a computing device, such as Figure 3 As shown, the computing device may include a storage component 31 and a processing component 32;

[0182] The storage component 31 stores one or more computer instructions, wherein the one or more computer instructions are called and executed by the processing component 32 .

[0183] The processing component 32 is used to obtain multi-dimensional acoustic response data inside the industrial circuit board, spatially analyze the phase offset in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of the micro-crack area of ​​the industrial circuit board, and the three-dimensional geometric boundary coordinate set includes the depth distribution characteristics and spatial extension vector of the micro-crack area; based on the depth distribution characteristics, activate the resonant wave stabilization processing mode of the lossless damping chip to generate a mechanical resonance frequency that matches the depth of the micro-crack area, and generate a dynamic constraint force field on the surface of the micro-crack area to inhibit crack propagation according to the mechanical resonance frequency; according to the stress distribution state of the dynamic constraint force field, The flow direction of the conductive filling material is adjusted to generate a target filling scheme including path planning parameters, wherein the target filling scheme limits the conductive filling material to be directionally filled along the adaptive penetration path within the three-dimensional geometric boundary coordinate set; during the directional filling process, a conductive filling path topology structure matching the spatial extension vector is constructed in the micro-crack area, and a continuous conductive interface covering the three-dimensional geometric boundary coordinate set is collaboratively generated based on the conductive filling path topology structure and the lossless damping chip; based on the resonant response characteristics between the continuous conductive interface and the mechanical resonant frequency, a micron-level crack repair scheme is generated to perform intelligent repair of industrial circuit boards.

[0184] The processing component 32 may include one or more processors to execute computer instructions to perform all or part of the steps in the above method. Of course, the processing component may also be implemented as one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the above method.

[0185] The storage component 31 is configured to store various types of data to support operations at the terminal. The storage component can be implemented by any type of volatile or non-volatile memory device, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0186] Of course, a computing device may also include other components, such as input / output interfaces, display components, communication components, etc.

[0187] The input / output interface provides an interface between the processing component and the peripheral interface module, which can be an output device, an input device, etc.

[0188] The communication component is configured to facilitate, among other things, wired or wireless communications between the computing device and other devices.

[0189] Among them, the computing device can be a physical device or an elastic computing host provided by a cloud computing platform, etc. In this case, the computing device can refer to a cloud server, and the above-mentioned processing components, storage components, etc. can be basic server resources rented or purchased from the cloud computing platform.

[0190] The embodiment of the present invention further provides a computer storage medium storing a computer program, which can achieve the above-mentioned Figure 1 The illustrated embodiment provides an intelligent repair method for industrial circuit boards based on a lossless damping chip.

[0191] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0192] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, i.e., they may be located in one location or distributed across multiple network units. Some or all of the modules may be selected based on actual needs to achieve the objectives of the present embodiment. Persons of ordinary skill in the art will be able to understand and implement the present invention without inventive effort.

[0193] Through the description of the above embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus a necessary general hardware platform, or of course, by hardware. Based on this understanding, the essence of the above technical solution or the part that contributes to the existing technology can be embodied in the form of a software product. The computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a magnetic disk, an optical disk, etc., and includes a number of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or certain parts of the embodiments.

[0194] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. An intelligent repair method for industrial circuit boards based on lossless damping chips, characterized in that: include: Acquiring multi-dimensional acoustic response data from within the industrial circuit board, and spatially resolving phase offsets in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of microcrack regions within the industrial circuit board, the three-dimensional geometric boundary coordinate set including depth distribution characteristics and spatial extension vectors of the microcrack regions; Based on the depth distribution characteristics, activating a resonant wave stabilization processing mode of the lossless damping chip to generate a mechanical resonant frequency that matches the depth of the microcrack region, and generating a dynamic constraint force field on the surface of the microcrack region to inhibit crack propagation according to the mechanical resonant frequency; According to the stress distribution state of the dynamic constraint force field, the flow direction of the conductive filling material is adjusted to generate a target filling scheme including path planning parameters, wherein the target filling scheme limits the conductive filling material to be directional filled along the adaptive penetration path within the three-dimensional geometric boundary coordinate set; During the directional filling process, a conductive filling path topology structure matching the spatial extension vector is constructed in the microcrack region, and a continuous conductive interface covering a three-dimensional geometric boundary coordinate set is collaboratively generated based on the conductive filling path topology structure and the lossless damping chip; According to the resonance response characteristics between the continuous conductive interface and the mechanical resonant frequency, a micron-level crack repair scheme is generated to perform intelligent repair of industrial circuit boards.

2. The method according to claim 1, characterized in that Acquire multi-dimensional acoustic response data from within the industrial circuit board, and spatially resolve the phase offset in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of the microcrack region of the industrial circuit board. The three-dimensional geometric boundary coordinate set includes the depth distribution characteristics and spatial extension vector of the microcrack region, including: Apply multi-directional ultrasonic excitation signals to industrial circuit boards, collect sound wave reflection signals under different propagation paths, and form multi-dimensional acoustic response data including time and direction dimensions; Decomposing the multi-dimensional acoustic response data according to propagation direction, and extracting a set of phase offsets in each propagation direction; Based on the phase offset set and a preset ultrasonic propagation velocity mapping model, a correlation relationship between the phase offset and a change in dielectric thickness is established, wherein the change in dielectric thickness characterizes a depth distribution characteristic of a microcrack region of the industrial circuit board; performing directional fitting on the boundary of the microcrack region according to the association relationship, and calculating an extension vector of the microcrack region in the physical structure space of the industrial circuit board; The depth distribution feature and the extension vector are integrated to generate a three-dimensional geometric boundary coordinate set containing complete morphological parameters of the microcrack region.

3. The method according to claim 1, characterized in that Based on the depth distribution characteristics, activating the resonant wave stabilization processing mode of the lossless damping chip to generate a mechanical resonant frequency that matches the depth of the microcrack region, and generating a dynamic constraint force field on the surface of the microcrack region to inhibit crack propagation according to the mechanical resonant frequency, including: determining a fundamental frequency value of a mechanical resonant frequency according to a maximum depth value in the depth distribution feature and a material resonance characteristic of a substrate of the industrial circuit board; Based on the different depth levels in the depth distribution characteristics, the fundamental frequency value is frequency-expanded according to a preset depth frequency gradient rule to generate a stepped mechanical resonance frequency sequence covering the depth of the microcrack region; Synchronously outputting the step-type mechanical resonance frequency sequence through the piezoelectric stacked structure of the lossless damping chip, so that the mechanical vibration waves corresponding to the step-type mechanical resonance frequency sequence are superimposed and interfered in the depth direction of the microcrack region, and superimposed interference process data is generated; constructing a layered constraint force intensity gradient on the surface of the microcrack region according to the vibration energy distribution in the superimposed interference process data; The vibration wave amplitude of each layer in the layered constraint force intensity gradient is limited and adjusted to generate a dynamic constraint force field that inhibits crack propagation.

4. The method according to claim 3, characterized in that The piezoelectric stacked structure of the lossless damping chip synchronously outputs the step-type mechanical resonant frequency sequence, so that the mechanical vibration waves corresponding to the step-type mechanical resonant frequency sequence are superimposed and interfered in the depth direction of the microcrack area, and superimposed interference process data is generated, including: Allocating the stepped mechanical resonance frequency sequence to each piezoelectric unit corresponding to the piezoelectric stacked structure of the lossless damping chip according to the depth level, wherein each piezoelectric unit obtains a frequency allocation parameter matching the corresponding depth level; Applying a driving voltage matching the frequency distribution parameter to each piezoelectric unit to generate a mechanical vibration wave matching the frequency distribution parameter, and increasing the amplitude of the mechanical vibration wave by a preset ratio as the frequency of the stepped mechanical resonant frequency sequence increases, thereby generating a gradient amplitude vibration wave; Controlling the emission phase of the gradient amplitude vibration wave so that the vibration wave phase of the surface piezoelectric unit lags behind the phase of the deep piezoelectric unit by a quarter of a cycle, thereby generating a phase-delayed vibration wave emission sequence; Recording the superposition state of the vibration waveforms of the phase-delayed vibration wave emission sequence in the depth direction of the microcrack region to generate an interference peak distribution diagram; Extracting the interference region coordinates where the amplitude intensity exceeds the preset substrate yield strength threshold value in the interference peak distribution diagram, and marking the interference region coordinates as the effective restraining force action area; Superposition interference process data is generated according to the distribution density and position parameters of the effective restraining force action area.

5. The method according to claim 1, wherein According to the stress distribution state of the dynamic constraint force field, the flow direction of the conductive filling material is adjusted to generate a target filling scheme including path planning parameters, wherein the target filling scheme limits the conductive filling material to be directional filled along the adaptive penetration path within the three-dimensional geometric boundary coordinate set, including: Directionally decomposing the stress distribution state of the dynamic constraint force field to obtain a set of principal stress direction angles at each position point on the surface of the microcrack region; Calculating a directional matching degree between the principal stress direction angle set and the spatial extension vector of the three-dimensional geometric boundary coordinate set to generate a flow direction correction parameter set for each position point, wherein the flow direction correction parameter set includes a candidate filling direction for each parameter and an angle value between each parameter and the spatial extension vector; Screening effective filling paths according to the flow direction correction parameter set to generate an effective filling path set; Generating a target filling scheme including path planning parameters according to the spatial distribution density and directional continuity of the effective filling path set, wherein the target filling scheme consists of a main channel priority coefficient, a branch path filling sequence parameter, and an adaptive infiltration path; The injection pressure gradient of the conductive filling material is adjusted according to the main channel priority coefficient, and the flow rate stage change is controlled according to the branch path filling sequence parameter to perform directional filling along the adaptive infiltration path.

6. The method according to claim 1, characterized in that During the directional filling process, a conductive filling path topology structure matching the spatial extension vector is constructed in the microcrack region, and a continuous conductive interface covering a three-dimensional geometric boundary coordinate set is collaboratively generated based on the conductive filling path topology structure and the lossless damping chip, including: During the directional filling process, the flow path of the conductive filling material is aligned with the spatial extension vector to have a consistent direction angle, so as to generate an initial filling path topology defined by a main path vector in the spatial extension vector; Applying a local electric field to a node region of the initial filling path topology and controlling a dendrite growth direction of the conductive filling material in the node region to generate a branch path extension structure that matches a branch vector in the spatial extension vector; generating conductive filling path topology verification data based on a fusion state of the branch path extension structure and the main path vector; Based on the piezoelectric effect of the lossless damping chip, periodic micro-vibration is performed in the interface region of the conductive filling path topology to close the microscopic pores at the interface between the conductive filling material and the substrate, and data on the degree of closure of the microscopic pores is generated; The resistance difference parameter in the conductive filling path topology verification data and the pore closure rate parameter in the microscopic pore closure degree data are compared and analyzed. When the resistance difference parameter is less than or equal to a first preset threshold and the pore closure rate parameter is greater than or equal to a second preset threshold, a continuous conductive interface covering the three-dimensional geometric boundary coordinate set is generated.

7. The method according to claim 1, characterized in that Based on the resonant response characteristics between the continuous conductive interface and the mechanical resonant frequency, a micron-level crack repair scheme is generated to perform intelligent repair of industrial circuit boards, including: Applying a test vibration wave having the same frequency as the mechanical resonance frequency to the continuous conductive interface, detecting a resonance response characteristic of the continuous conductive interface, and generating interface dynamic response data including a resonance frequency offset and a resonance amplitude attenuation value; extracting a resonance frequency offset and a resonance amplitude attenuation value related to the mechanical resonance frequency from the interface dynamic response data; The resonance frequency offset and the resonance amplitude attenuation value are compared with a preset interface integrity criterion. When the resonance frequency offset and the resonance amplitude attenuation value simultaneously meet the preset interface integrity criterion, a micron-level crack repair solution is generated to perform intelligent repair of industrial circuit boards.

8. An industrial circuit board intelligent repair system based on a lossless damping chip, characterized in that: include: a parsing module configured to obtain multi-dimensional acoustic response data from within the industrial circuit board and spatially parse phase offsets in the multi-dimensional acoustic response data to generate a three-dimensional geometric boundary coordinate set of microcrack regions of the industrial circuit board, the three-dimensional geometric boundary coordinate set including depth distribution characteristics and spatial extension vectors of the microcrack regions; an activation module, configured to activate a resonant wave stabilization processing mode of the lossless damping chip based on the depth distribution characteristics, generate a mechanical resonant frequency that matches the depth of the microcrack region, and generate a dynamic constraint force field on the surface of the microcrack region to inhibit crack propagation according to the mechanical resonant frequency; an adjustment module, configured to adjust a flow direction of the conductive filling material according to a stress distribution state of the dynamic constraint force field, and generate a target filling scheme including path planning parameters, wherein the target filling scheme defines a directional filling of the conductive filling material along an adaptive infiltration path within the three-dimensional geometric boundary coordinate set; A construction module is used to construct a conductive filling path topology structure matching the spatial extension vector in the microcrack region during the directional filling process, and to collaboratively generate a continuous conductive interface covering a three-dimensional geometric boundary coordinate set based on the conductive filling path topology structure and the lossless damping chip; A generation module is used to generate a micron-level crack repair solution based on the resonance response characteristics between the continuous conductive interface and the mechanical resonant frequency, so as to perform intelligent repair of industrial circuit boards.

9. A computing device, characterized in that It comprises a processing component and a storage component; the storage component stores one or more computer instructions; the one or more computer instructions are used to be called and executed by the processing component to implement an industrial circuit board intelligent repair method based on a lossless damping chip as described in any one of claims 1 to 7.

10. A computer storage medium, characterized in that A computer program is stored, and when the computer program is executed by a computer, an intelligent repair method for an industrial circuit board based on a lossless damping chip as claimed in any one of claims 1 to 7 is implemented.

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