Positioning device for multilayer circuit board

Abstract

The invention discloses a positioning device for a multilayer circuit board, and the device comprises a bottom frame, a lifting side frame, a calibration top cover, a material stopping platform, and a calibration frame. In the use process, low-temperature cold air is continuously sprayed to the peripheral area of the surface of a substrate along the center of the substrate; the airflow jet orifices at the top of the substrate are closer to the exhaust area of the square pipe, so that the pressure of the low-temperature cold air jetted by the airflow jet orifices is relatively concentrated, and the copper foil belt is outwards attached along the central area at the top of the substrate; when a copper foil belt at the top of the substrate is subjected to low-temperature cold air blown by an airflow jet orifice in the central area of the top of the substrate, the low-temperature cold air is guided by negative-pressure airflow from an air suction hole area, and the airflow guiding state is that the copper foil belt synchronously moves from the top of the substrate to the areas on the two sides of the substrate; therefore, the central area of the copper foil belt and the edge area of the copper foil belt are sequentially attached to the surface of the substrate, and the adhesion capacity of the copper foil belt to the edge area of the surface of the substrate is improved.

Description

Technical Field

[0001] The invention relates to the technical field of positioning copper-clad boards on the surface of circuit substrates, in particular to a positioning device for multi-layer circuit boards. Background Art

[0002] When stacking multi-layer circuit boards, a high-precision positioning system is required to align the substrate layers. Temperature, pressure and other parameters must be controlled during the pre-pressing and formal pressing stages. Buffer materials are used to protect the circuit boards and prevent inter-layer shifting. The surface of the circuit substrate needs to be positioned and covered with a copper foil layer.

[0003] In the prior art, publication number "CN208113087U" discloses a drilling positioning device for the production of multi-layer circuit boards, comprising a support base device, the upper end of which is fixedly connected to a positioning device, the positioning device comprising a support sleeve, a slide bar, a square slot, a first spring, a strip bar, a positioning slot, a positioning pin, a second spring, a support base, a guide hole, a slot, a slide base, a motor, a drill bit, a positioning shaft, a torsion spring, and a bayonet pin, the support sleeve having a slide bar slidably sleeved therein, the slide bar being provided with a square slot, the support sleeve having a first spring slidably sleeved therein, the square slot having a strip bar slidably sleeved therein, the strip bar being provided with a positioning slot, the positioning slot having a positioning pin clamped therein, and the outer side of the positioning pin being sleeved therein with a second spring. This drilling positioning device for the production of multi-layer circuit boards employs a positioning device to facilitate positioning, and is quick and easy to disassemble, making it convenient for staff to perform maintenance.

[0004] However, the existing technology still has major deficiencies, such as: In the above-mentioned device and the prior art, before hot pressing the multi-layer circuit board, the required built-in copper foil layer will be coated on the surface of the substrate. After the lamination is completed, the surface of the copper foil layer will be cut. At the same time, the substrate is easily displaced during the lamination process. The displaced substrate cannot be docked and bonded with the cut copper foil layer, resulting in uneven copper coating on the surface of the substrate of the composite circuit board during the hot pressing process. Summary of the Invention

[0005] The object of the present invention is to provide a positioning device for a multi-layer circuit board to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solution: a positioning device for a multi-layer circuit board, comprising a base frame, a lifting side frame, a calibration top cover, a material stopping platform and a calibration frame, wherein the material stopping platform is mounted on the top of the base frame, the lifting side frame is mounted on the top of the material stopping platform, the calibration frame is arranged between the material stopping platform and the base frame, the calibration top cover is mounted on the top of the lifting side frame, and the surface of the calibration top cover is provided with a fitting pressing groove; The feeding and discharging conveying unit for the copper sheet layer on the circuit board surface is arranged on both sides of the chassis and is used to convey and wind up the copper foil board layer required to be laminated on the circuit board surface before multi-layer composite hot pressing of the circuit board; The copper-clad conveying and adsorbing unit for the circuit board surface is arranged in the area of the stop platform and is used to control the winding tension of the copper foil board layer after the copper foil board layer is conveyed in place, so that the copper foil board layer is calibrated and adhered to the circuit board surface to ensure the effective adhesion of the copper foil layer on the circuit board surface; The auxiliary pressure fitting and corresponding cutting unit for the copper sheet on the substrate surface is arranged in the area of the stop platform and is used to apply pressure and position the area of the copper sheet on the substrate surface, so as to ensure accurate and effective cutting of the copper foil board layer and ensure the smoothness of the cut of the copper-clad area on the substrate surface.

[0007] Preferably, the feeding and discharging conveying unit for the copper sheet layer on the circuit board surface includes a material receiving rack and a material feeding rack. The material receiving rack and the material feeding rack are symmetrically arranged at both ends of the chassis. A material receiving bin and a material feeding bin are respectively installed on the surfaces of the material receiving rack and the material feeding rack. A material receiving roller is installed inside the material receiving bin, and a material feeding roller is installed inside the material feeding bin. A copper foil board is wound and sleeved on the surface of the material feeding roller, and one end of the copper foil board passes through the stop platform and is connected to the material receiving roller.

[0008] Preferably, the copper-clad conveying and adsorbing unit for the circuit board surface includes an upward pushing and flowing part. The upward pushing and flowing part includes a top pressing plate. Vertical frames are installed on both sides of the calibration top cover. Lifting guide rails are embedded and installed on the surfaces of the vertical frames. An L-shaped arm is installed on the moving end of the lifting guide rail. A cross beam frame is installed between adjacent L-shaped arms. The top pressing plate is arranged at the bottom of the cross beam frame. Strip-shaped air inlet cavities and rectangular concave cavities are arranged on the surface of the top pressing plate. Air flow jet ports are opened at the bottom of the rectangular concave cavity. Multiple groups of air flow jet ports are arranged at intervals, and each group of air flow jet ports is aligned in parallel. A square pipe is installed inside the rectangular concave cavity. The square pipe is communicated with the strip-shaped air inlet cavity. A moving partition is slidably arranged on the surface of the square pipe. An elastic rubber strip is also installed inside the rectangular concave cavity. Both ends of the elastic rubber strip are fixed to the moving partition and the rectangular concave cavity respectively.

[0009] Preferably, the upward pushing and flowing part further includes a cold air bin. The cold air bin is installed between adjacent cross beam frames. A sealing cover is hermetically installed at the top of the rectangular concave cavity. An installation air cover is communicated and installed at the top of the strip-shaped air inlet cavity. The installation air cover and the cold air bin are communicated through an air supply pipe. A pressure nozzle is communicated and installed at the bottom of the air flow jet port.

[0010] Preferably, the copper-coated circuit board surface conveying and adsorbing unit further includes a lower adsorbing part, the lower adsorbing part includes a lateral air platform, the lateral air platform is installed on both sides of the chassis, a material stop cavity is arranged on the surface of the material stop platform, an air suction hole is arranged on one side of the material stop cavity close to the lateral air platform, an air suction pipe is connected and installed on one side of the lateral air platform, a negative pressure air chamber is installed at one end of the air suction pipe, and the air suction pipe is communicated with the air suction hole.

[0011] Preferably, the copper sheet corresponding cutting auxiliary pressure fitting unit on the substrate surface includes a cutting blade, the cutting blade is installed on the bottom surface of the calibration top cover, a flexible airbag is embedded and installed on the bottom surface of the calibration top cover outside the cutting blade, and a solenoid valve is installed outside the flexible airbag.

[0012] Preferably, a circuit board conveying and guiding unit is arranged in the material stop cavity, the circuit board conveying and guiding unit includes an inclined guide platform, the inclined guide platform is installed at both ends of the material stop platform, feeding rollers are installed on the surface of the inclined guide platform and inside the material stop cavity, a second through groove is arranged in the central area of the material stop cavity, and a first through groove is arranged in the area of the material stop cavity close to the two inclined guide platforms on both sides.

[0013] Preferably, a copper-coated circuit board surface fitting position calibration unit is arranged in the bottom area of the first through groove.

[0014] Preferably, the copper-coated circuit board surface fitting position calibration unit includes a calibration frame, a bottom cylinder is installed at the bottom of the calibration frame, the bottom cylinder is installed on the top of the chassis, a middle bottom platform is installed in the central area of the calibration frame, a central top column is installed on the top of the middle bottom platform, the top of the central top column movably passes through the second through groove, a calibration column is installed in the area of the calibration frame top close to the first through groove, the top of the calibration column movably passes through the first through groove, an anti-slip pad is embedded and installed on the top of the calibration frame, and the anti-slip pads are arranged in several groups in an array.

[0015] Preferably, a first concave cavity is arranged at the top of the calibration column, the first concave cavity is symmetrically arranged in two groups, a second concave cavity is also arranged at the top of the calibration column, a counterweight block is installed in the first concave cavity, a side cavity is arranged on one side of the calibration column, a linear guide rail is installed in the side cavity, a linear guide rail is also installed in the second concave cavity, a moving block is installed on the moving end of the linear guide rail, an electric rotating shaft is embedded and installed inside the moving block, a calibration rotating wheel is installed on the rotating end of the electric rotating shaft, and an anti-slip rubber strip is arranged on the surface of the calibration rotating wheel.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. During use, in order to calibrate the deflection position of the substrate, first, a set of linear guides in the X-axis state can be driven to drive multiple moving blocks to lift synchronously. After the moving blocks are lifted, the calibration rollers installed inside the moving blocks will fit against and lift the substrate, and the electric rotating shaft will drive the calibration roller part to perform position calibration in the X-axis state. When the substrate completes the position calibration in the X-axis state, a set of linear guides in the Y-axis state can be driven to drive multiple moving blocks to lift synchronously. After the moving blocks are lifted, the calibration rollers installed inside the moving blocks will fit against and lift the substrate again, and the electric rotating shaft will drive the calibration roller part to perform position calibration in the Y-axis state. After the substrate is calibrated in the X-axis and Y-axis states, it is in the effective copper-clad area. At this time, the linear guide is driven to fall for reset, and then the substrate falls back onto the top of the calibration column again. The anti-slip pad on the top of the calibration column will fit against the bottom of the substrate, so as to keep the substrate continuously stable during the copper-cladding process of the substrate and ensure the effective fitting and coating of the copper foil layer on the surface of the substrate; 2. During use, in order to ensure that the copper foil tape always maintains a wrapped and adhered state during the cutting process, first, the operator can inject low-temperature cold air into the bottom of the installation air cover through the cold air chamber and the air supply pipe. The low-temperature cold air enters the strip-shaped air inlet cavity through the installation air cover and is slowly injected into the rectangular concave cavity under the guidance of the square pipe. There is a central area of the substrate at the air jet orifice first connected to the bottom of the rectangular concave cavity. This means that the low-temperature cold air blows downward from near the copper foil tape in the central area of the top of the substrate. As the injection pressure of the low-temperature cold air continuously increases, the air pressure pushes the moving partition to squeeze the elastic rubber strip to contract, and the moving partition moves to open more air jet orifices, so that the low-temperature cold air continuously jets from the center of the substrate to the surrounding area of the surface of the substrate. However, since the air jet orifices at the top of the substrate are closer to the exhaust area of the square pipe, the pressure of the low-temperature cold air jetted from this group of air jet orifices is more concentrated. This makes the copper foil tape fit along the central area of the top of the substrate and outward, so that the copper foil tape can better adhere to the surface of the substrate and ensure the adhesion effect of the copper foil tape in the central area of the surface of the substrate; 3. During use, in order to avoid the problem of poor adhesion effect of the copper foil tape in the edge area of the surface of the substrate, during the process of surface blowing and auxiliary adhesion of the copper foil tape, the negative pressure air chamber on one side of the side air table can be cooperatively opened to continuously extract the gas in the suction holes through the suction pipe. Since the suction holes are arranged in an array along both sides of the substrate, when the copper foil tape on the top of the substrate is blown by the low-temperature cold air from the air jet orifices in the central area of the top of the substrate, the low-temperature cold air will be guided by the negative pressure air flow in the suction hole area, and the low-temperature cold air will form an air flow guide. The state of this air flow guide is to move synchronously from the top of the substrate to the two side areas of the substrate, so that the central area and the edge area of the copper foil tape are sequentially adhered to the surface of the substrate, so as to improve the adhesion ability of the copper foil tape to the edge area of the surface of the substrate while reducing the wrinkles generated by the copper foil tape; 4. During use, after the cutting process is completed, in order to further ensure that the cut copper foil tape layer can effectively adhere to the surface of the substrate, at this time, the lifting guide rail on the vertical frame can be driven to drive the L-shaped arm and the cross beam frame to move downward. During the movement of the cross beam frame, the top pressing plate will pass through the fitting pressure groove and tightly press on the cut copper foil tape, so as to realize the tight fitting of the copper foil tape layer on the top of the substrate. At the same time, it is ensured that the cut copper foil tape piece is completely separated from the copper foil tape, and the uniform adhesion of the copper foil tape piece to the substrate surface is ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall device of the present invention; Figure 2 It is a schematic diagram of the suction hole part of the present invention; Figure 3 It is a schematic diagram of the second through groove part of the present invention; Figure 4 It is a schematic diagram of the stop material platform part of the present invention; Figure 5 It is a schematic diagram of the calibration frame part of the present invention; Figure 6 It is a schematic diagram of the cold air bin part of the present invention; Figure 7 It is a schematic diagram of the sealing cover part of the present invention; Figure 8 It is a schematic diagram of the rectangular cavity part of the present invention; Figure 9 It is a schematic diagram of the flexible airbag part of the present invention; Figure 10 It is a schematic diagram of the central top column part of the present invention; Figure 11 It is a schematic diagram of the calibration column part of the present invention; Figure 12 It is a schematic diagram of the calibration runner part of the present invention; Figure 13 It is a schematic diagram of the anti-slip pad part of the present invention.

[0018] In the figure: 1. Receiving rack; 11. Receiving bin; 12. Receiving roller; 2. Feeding rack; 21. Feeding bin; 22. Feeding roller; 3. Bottom rack; 31. Negative pressure air chamber; 32. Suction pipe; 33. Lateral air platform; 4. Lifting side frame; 41. Calibration top cover; 42. Fitting pressure groove; 43. Cutting blade; 44. Flexible airbag; 45. Solenoid valve; 5. Top pressing plate; 51. Strip-shaped air inlet cavity; 52. Rectangular cavity; 521. Square pipe; 522. Moving partition; 523. Elastic rubber strip; 524. Air flow injection port; 53. Sealing cover; 6. Vertical frame; 61. Lifting guide rail; 62. L-shaped arm; 63. Cross beam frame; 7. Cold air chamber; 71. Air supply pipe; 72. Installation air cover; 8. Material stop platform; 81. Material stop cavity; 82. Loading roller; 83. Suction hole; 84. First through groove; 85. Second through groove; 86. Oblique guide platform; 9. Calibration frame; 91. Bottom cylinder; 92. Central top column; 93. Calibration column; 931. First concave cavity; 932. Counterweight; 933. Side cavity; 934. Second concave cavity; 935. Linear guide rail; 936. Moving block; 937. Electric rotating shaft; 938. Calibration runner; 939. Anti-slip pad; 94. Middle bottom platform. Specific implementation mode

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] Please refer to Figures 1 - 13 , the present invention provides a technical solution: Embodiment 1: A positioning device for multi-layer circuit boards: including a bottom frame 3, a lifting side frame 4, a calibration top cover 41, a material stop platform 8 and a calibration frame 9. The material stop platform 8 is installed on the top of the bottom frame 3, the lifting side frame 4 is installed on the top of the material stop platform 8, the calibration frame 9 is arranged between the material stop platform 8 and the bottom frame 3, the calibration top cover 41 is installed on the top of the lifting side frame 4, and a fitting pressure groove 42 is arranged on the surface of the calibration top cover 41; The feeding and discharging conveying unit for the copper foil layer on the surface of the circuit board is arranged on both sides of the bottom frame 3 and is used for conveying and winding the copper foil layer required for compounding on the surface of the circuit board before multi-layer composite hot pressing of the circuit board; The feeding and discharging conveying unit for the copper foil layer on the surface of the circuit board includes a material receiving frame 1 and a material feeding frame 2. The material receiving frame 1 and the material feeding frame 2 are symmetrically arranged at both ends of the bottom frame 3. A material receiving bin 11 and a material feeding bin 21 are respectively installed on the surfaces of the material receiving frame 1 and the material feeding frame 2. A material receiving roller 12 is installed inside the material receiving bin 11, a material feeding roller 22 is installed inside the material feeding bin 21, a copper foil board is wound around the surface of the material feeding roller 22, and one end of the copper foil board passes through the material stop platform 8 and is connected to the material receiving roller 12.

[0021] Copper-clad conveying and adsorbing unit on the surface of the circuit board. The copper-clad conveying and adsorbing unit on the surface of the circuit board is arranged in the area of the material stop platform 8 and is used to control the winding tension of the copper foil laminate after the copper foil laminate is conveyed in place, so that the copper foil laminate is calibrated and attached to the surface of the circuit board to ensure the effective attachment of the copper foil layer on the surface of the circuit board; The copper-clad conveying and adsorbing unit on the surface of the circuit board includes an upward pushing part. The upward pushing part includes a top pressing plate 5. Vertical frames 6 are installed on both sides of the calibration top cover 41. A lifting guide rail 61 is embedded on the surface of the vertical frame 6. An L-shaped arm 62 is installed on the moving end of the lifting guide rail 61. A cross beam frame 63 is installed between adjacent L-shaped arms 62. The top pressing plate 5 is arranged at the bottom of the cross beam frame 63. Strip-shaped air inlet cavities 51 and rectangular concave cavities 52 are arranged on the surface of the top pressing plate 5. Air flow injection ports 524 are opened at the bottom of the rectangular concave cavity 52. Multiple groups of air flow injection ports 524 are arranged at intervals, and each group of air flow injection ports 524 is aligned in parallel. A square tube 521 is installed inside the rectangular concave cavity 52. The square tube 521 is communicated with the strip-shaped air inlet cavity 51. A moving partition 522 is slidably arranged on the surface of the square tube 521. An elastic rubber strip 523 is also installed inside the rectangular concave cavity 52. Both ends of the elastic rubber strip 523 are fixed to the moving partition 522 and the rectangular concave cavity 52 respectively.

[0022] The upward pushing part further includes a cold air bin 7. The cold air bin 7 is installed between adjacent cross beam frames 63. A sealing cover 53 is hermetically installed at the top of the rectangular concave cavity 52. An installation air cover 72 is communicated and installed at the top of the strip-shaped air inlet cavity 51. The installation air cover 72 and the cold air bin 7 are communicated through an air supply pipe 71. A pressure nozzle is communicated and installed at the bottom of the air flow injection port 524.

[0023] The copper-clad conveying and adsorbing unit on the surface of the circuit board further includes a lower adsorbing part. The lower adsorbing part includes a lateral air platform 33. The lateral air platform 33 is installed on both sides of the bottom frame 3. A material stop cavity 81 is arranged on the surface of the material stop platform 8. Suction holes 83 are opened on one side of the material stop cavity 81 close to the lateral air platform 33. An air suction pipe 32 is communicated and installed on one side of the lateral air platform 33. A negative pressure air bin 31 is installed at one end of the air suction pipe 32. The air suction pipe 32 is communicated with the suction holes 83.

[0024] In this embodiment, when the copper foil strip on the top of the substrate is blown by the low-temperature cold air from the air flow injection ports 524 in the central area on the top of the substrate, the low-temperature cold air will be guided by the negative pressure air flow in the area of the suction holes 83, and the low-temperature cold air will form an air flow direction. The state of this air flow direction is to move synchronously from the top of the substrate towards the two sides of the substrate, so that the central area and the edge area of the copper foil strip are sequentially attached to the surface of the substrate, thereby reducing the wrinkles generated in the copper foil strip and improving the adhesion ability of the copper foil strip to the edge area of the substrate surface.

[0025] The copper - clad sheet corresponding cutting - assisting pressure - fitting unit on the substrate surface is arranged in the area of the material - stopping platform 8 and is used for pressurizing and positioning the copper - clad sheet area on the substrate surface, so as to ensure accurate and effective cutting of the copper - foil board layer and ensure that the cut of the copper - clad area on the substrate surface is flat.

[0026] The copper - clad sheet corresponding cutting - assisting pressure - fitting unit on the substrate surface includes a cutting blade 43. The cutting blade 43 is installed on the bottom surface of the calibration top cover 41. A flexible airbag 44 is embedded and installed on the bottom surface of the calibration top cover 41 outside the cutting blade 43, and a solenoid valve 45 is installed outside the flexible airbag 44.

[0027] In this embodiment, during the movement of the calibration top cover 41, the flexible airbag 44 at the bottom of the calibration top cover 41 will first fit on the top area of the copper - foil tape. Since the flexible airbag 44 is set at the edge of the cutting blade 43, the copper - foil tape in the contact area with the flexible airbag 44 will be pressed and positioned by it. With the continuous movement of the calibration top cover 41, the gas in the flexible airbag 44 is continuously released outward through the solenoid valve 45, and the flexible airbag 44 shrinks but still presses the top - edge area of the copper - foil tape. At the same time, the cutting blade 43 installed on the bottom surface of the calibration top cover 41 presses on the surface of the copper - foil tape to complete the pressure cutting of the copper - foil tape.

[0028] A circuit - board conveying and guiding unit is arranged in the material - stopping cavity 81. The circuit - board conveying and guiding unit includes an inclined guide table 86. The inclined guide table 86 is installed at both ends of the material - stopping platform 8. Feeding rollers 82 are installed on the surface of the inclined guide table 86 and inside the material - stopping cavity 81. A second through - slot 85 is arranged in the central area of the material - stopping cavity 81, and a first through - slot 84 is arranged in the area of the material - stopping cavity 81 near the two inclined guide tables 86.

[0029] In this embodiment, the position of the calibration runner 938 is calibrated in the Y - axis state by driving the electric rotating shaft 937. After the substrate is calibrated in the X - axis and Y - axis states and is in the effective copper - clad area, the driving linear guide 935 drops to reset. Then the substrate falls back onto the calibration post 93 again. The anti - slip pad 939 on the top of the calibration post 93 will fit on the bottom of the substrate, so as to keep the substrate continuously stable during the copper - cladding process of the substrate and ensure the effective fitting and covering of the copper - foil layer on the substrate surface.

[0030] Embodiment Two: Based on the first embodiment, in this embodiment, it is considered that during the conveying process of the substrate, after the substrate reaches the designated copper-cladding position, the substrate cannot be calibrated in the X-axis and Y-axis, which easily leads to the substrate being skewed during the copper-clad cutting process of the surface copper foil. Although the copper foil tape has a large area and can meet the cutting and coating requirements of the substrate, if the cutting area of the copper foil tape surface is excessively offset, the incision distribution on the surface of the copper foil tape will be uneven, and the uncut area of the copper foil tape surface cannot be recycled. Therefore, in this embodiment, a circuit substrate surface copper-clad lamination position calibration unit is provided to avoid the above-mentioned problem. A circuit substrate surface copper lamination position calibration unit is provided in the bottom area of the through slot 1 84 .

[0031] The circuit substrate surface copper cladding bonding position calibration unit includes a calibration frame 9, a bottom cylinder 91 is installed at the bottom of the calibration frame 9, the bottom cylinder 91 is installed on the top of the base frame 3, a central base 94 is installed in the central area of the calibration frame 9, a central top column 92 is installed on the top of the central base 94, the top of the central top column 92 can move through the through slot 2 85, a calibration column 93 is installed on the top of the calibration frame 9 near the through slot 1 84, the top of the calibration column 93 can move through the through slot 1 84, and an anti-slip pad 939 is embedded in the top of the calibration frame 9, and the anti-slip pad 939 array is arranged into several groups.

[0032] A concave cavity 931 is provided on the top of the calibration column 93, and the concave cavity 931 is symmetrically arranged in two groups. A concave cavity 934 is also provided on the top of the calibration column 93, and a counterweight block 932 is installed in the concave cavity 931. A side cavity 933 is provided on one side of the calibration column 93, and a linear guide rail 935 is installed in the side cavity 933. A linear guide rail 935 is also installed in the concave cavity 934. A moving block 936 is installed on the moving end of the linear guide rail 935, and an electric rotating shaft 937 is embedded in the moving block 936. A calibration wheel 938 is installed on the rotating end of the electric rotating shaft 937, and an anti-slip rubber strip is provided on the surface of the calibration wheel 938.

[0033] In this embodiment, in order to ensure that the substrate is in the effective copper coating area, the operator can drive the bottom cylinder 91, and the bottom cylinder 91 will push the calibration frame 9 and the central top column 92 and the calibration column 93 to lift the substrate. After being lifted, the substrate will be separated from the loading roller 82. The central top column 92 and the calibration column 93 will provide multi-point support for the bottom of the substrate to ensure that the substrate remains stable during copper coating.

[0034] Working principle: During the use of this device, the operator feeds and conveys the copper foil board layer by driving the winding rollers 12 on the winding frame 1 and the feeding rollers 22 on the feeding frame 2. After the surface of the copper foil board layer is cut, the operator drives the winding rollers 12 and the feeding rollers 22 to operate the copper foil board layer to rotate and wind and shift. The operator places the substrate to be copper-clad on the surface of the inclined guide table 86 at one end of the stop platform 8. Subsequently, when the feeding roller 82 on the surface of the inclined guide table 86 and the stop platform 8 drives the substrate to move to the top area of the second through groove 85, the rotation of the feeding roller 82 is stopped. In order to ensure that the substrate is in the effective copper-clad area, the operator can drive the bottom-mounted cylinder 91. The bottom-mounted cylinder 91 will push the calibration frame 9 and the center top column 92 and the calibration column 93 to lift the substrate. After the substrate is lifted, it will be separated from the feeding roller 82. The center top column 92 and the calibration column 93 will provide multi-point support for the bottom of the substrate to ensure the stability of the substrate during copper cladding; To calibrate the deviation position of the substrate, first, a set of linear guide rails 935 in the X-axis state can be driven to drive multiple moving blocks 936 to lift synchronously. After the moving blocks 936 are lifted, the calibration rotating wheels 938 installed inside the moving blocks 936 will fit and lift the substrate, and the electric rotating shaft 937 will drive the calibration rotating wheels 938 to perform position calibration in the X-axis state. When the substrate completes the position calibration in the X-axis state, a set of linear guide rails 935 in the Y-axis state can be driven to drive multiple moving blocks 936 to lift synchronously. After the moving blocks 936 are lifted, the calibration rotating wheels 938 installed inside the moving blocks 936 will fit and lift the substrate again, and the electric rotating shaft 937 will drive the calibration rotating wheels 938 to perform position calibration in the Y-axis state. After the substrate is calibrated in the X-axis and Y-axis states and is in the effective copper-clad area, at this time, the linear guide rails 935 are driven to fall and reset. Subsequently, the substrate falls back onto the top of the calibration column 93 again, and the anti-slip pad 939 on the top of the calibration column 93 will fit on the bottom of the substrate, so as to maintain the continuous stability of the substrate during the copper-cladding process and ensure the effective fitting and covering of the copper foil layer on the surface of the substrate; After the substrate is placed and the position calibration is in place, the operator can adjust the tension of the copper foil tape by driving the take-up roller 12 and the feed roller 22. At this time, the operator can loosen the copper foil tape, and the loosened copper foil tape will droop and adhere to the upper surface of the substrate layer. To ensure that the copper foil tape is always covered and adhered during the cutting process, the operator can first inject low-temperature cold air into the bottom of the mounting air cap 72 through the cold air chamber 7 and the air supply pipe 71. The low-temperature cold air enters the strip-shaped air inlet chamber 51 through the mounting air cap 72 and is slowly injected into the rectangular cavity 52 under the guidance of the square pipe 521. There is a central area of the substrate at the air jet orifice 524 where the bottom of the rectangular cavity 52 is first connected. This means that the low-temperature cold air blows downward from near the copper foil tape in the central area at the top of the substrate. As the injection pressure of the low-temperature cold air continuously increases, the air pressure pushes the moving partition 522 to squeeze the elastic rubber strip 523 to contract, and the moving partition 522 moves to open more air jet orifices 524, so that the low-temperature cold air continuously jets from the center of the substrate to the surrounding area of the substrate surface. However, since the air jet orifices 524 at the top of the substrate are closer to the exhaust area of the square pipe 521, the pressure of the low-temperature cold air jetted by this group of air jet orifices 524 is more concentrated, which makes the copper foil tape adhere along the central area at the top of the substrate and outward, so that the copper foil tape adheres better to the substrate surface and ensures the adhesion effect of the copper foil tape in the central area of the substrate surface; When the top gas of the copper foil tape is assisted to blow and adhere, in order to avoid wrinkles on the copper foil tape and limit the priority of the gas injection area, the gas blowing pressure on the copper foil tape near the edge of the substrate is less than that in the central area of the substrate. In order to avoid the problem of poor adhesion of the copper foil tape in the edge area of the substrate surface, during the surface blowing and auxiliary adhesion of the copper foil tape, the negative pressure air chamber 31 on one side of the lateral air table 33 can be cooperatively opened to continuously extract the gas in the suction holes 83 through the suction pipe 32. Since the suction holes 83 are arranged in an array along both sides of the substrate, when the copper foil tape on the top of the substrate is blown by the low-temperature cold air from the air jet orifices 524 in the central area at the top of the substrate, the low-temperature cold air will be guided by the negative pressure air flow in the area of the suction holes 83, and the low-temperature cold air will form an air flow guide. The state of this air flow guide is to move synchronously from the top of the substrate to the two sides of the substrate, so that the central area and the edge area of the copper foil tape are successively adhered to the surface of the substrate, so as to improve the adhesion ability of the copper foil tape to the edge area of the substrate surface while reducing wrinkles on the copper foil tape; When the copper foil strip is stably and assistingly attached to multiple top regions, the operator can drive the lifting side frame 4 to move the calibration top cover 41 at the top of the lifting side frame 4 towards the top of the copper foil strip. During the movement of the calibration top cover 41, the flexible airbag 44 at the bottom of the calibration top cover 41 will first fit onto the top region of the copper foil strip. Since the flexible airbag 44 is arranged at the edge of the cutting blade 43, the copper foil strip in the contact region with the flexible airbag 44 will be pressed and positioned by it. As the calibration top cover 41 continues to move, the gas in the flexible airbag 44 is continuously released outwards through the solenoid valve 45, and the flexible airbag 44 shrinks but still presses the top edge region of the copper foil strip. At the same time, the cutting blade 43 installed at the bottom of the calibration top cover 41 is pressed onto the surface of the copper foil strip to complete the pressure cutting of the copper foil strip. After the cutting process is completed, in order to further ensure that the cut copper foil strip layer can effectively adhere to the surface of the substrate, at this time, the lifting guide rail 61 on the vertical frame 6 can be driven to drive the L-shaped arm 62 and the cross beam frame 63 to move downwards. During the movement of the cross beam frame 63, the top pressing plate 5 will pass through the fitting pressing groove 42 and tightly press onto the cut copper foil strip, thereby realizing the tight adhesion of the copper foil strip layer to the top of the substrate, and at the same time ensuring that the cut copper foil strip piece is completely separated from the copper foil strip, and ensuring the uniform adhesion of the copper foil strip piece to the surface of the substrate.

[0035] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A positioning device for a multi-layer circuit board, characterized in that: It includes a chassis (3), a lifting side frame (4), a calibration top cover (41), a blanking platform (8) and a calibration frame (9). The blanking platform (8) is installed on the top of the chassis (3), the lifting side frame (4) is installed on the top of the blanking platform (8), the calibration frame (9) is arranged between the blanking platform (8) and the chassis (3), the calibration top cover (41) is installed on the top of the lifting side frame (4), and a fitting pressure groove (42) is arranged on the surface of the calibration top cover (41). The loading and unloading conveying unit for the copper sheet layer on the circuit board surface is arranged on both sides of the chassis (3) and is used for conveying and winding the copper foil board layer required for lamination on the circuit board surface before multi-layer composite hot pressing of the circuit board. The copper-clad conveying and adsorption unit for the circuit board substrate surface is arranged in the area of the blanking platform (8) and is used for calibrating and fitting the copper foil board layer on the surface of the circuit board substrate by controlling the winding tension of the copper foil board layer after the copper foil board layer is conveyed in place to ensure effective fitting of the copper foil layer on the circuit board substrate surface. The corresponding cutting auxiliary pressure fitting unit for the copper sheet on the substrate surface is arranged in the area of the blanking platform (8) and is used for pressurizing and positioning the copper sheet area on the substrate surface, so as to ensure accurate and effective cutting of the copper foil board layer and ensure a flat cut of the copper-clad area on the substrate surface.

2. The positioning device for a multi-layer circuit board according to claim 1, characterized in that: The loading and unloading conveying unit for the copper sheet layer on the circuit board surface includes a winding frame (1) and a feeding frame (2). The winding frame (1) and the feeding frame (2) are symmetrically arranged at both ends of the chassis (3). A winding bin (11) and a feeding bin (21) are respectively installed on the surfaces of the winding frame (1) and the feeding frame (2). A winding roller (12) is installed inside the winding bin (11), a feeding roller (22) is installed inside the feeding bin (21), a copper foil board is wound and sleeved on the surface of the feeding roller (22), and one end of the copper foil board passes through the blanking platform (8) and is connected to the winding roller (12).

3. The positioning device for a multi-layer circuit board according to claim 2, characterized in that: The copper-clad conveying and adsorbing unit on the surface of the circuit board substrate includes an upward pushing part, and the upward pushing part includes a top pressing plate (5). Vertical frames (6) are installed on both sides of the calibration top cover (41). A lifting guide rail (61) is embedded on the surface of the vertical frame (6). An L-shaped arm (62) is installed on the moving end of the lifting guide rail (61). A cross beam frame (63) is installed between adjacent L-shaped arms (62). The top pressing plate (5) is arranged at the bottom of the cross beam frame (63). Strip-shaped air inlet cavities (51) and rectangular concave cavities (52) are arranged on the surface of the top pressing plate (5). Air flow injection ports (524) are opened at the bottom of the rectangular concave cavity (52). Multiple groups of the air flow injection ports (524) are arranged at intervals, and each group of the air flow injection ports (524) is parallel and aligned. A square tube (521) is installed inside the rectangular concave cavity (52). The square tube (521) is communicated with the strip-shaped air inlet cavity (51). A moving partition plate (522) is slidably arranged on the surface of the square tube (521). An elastic rubber strip (523) is also installed inside the rectangular concave cavity (52). Two ends of the elastic rubber strip (523) are respectively fixed to the moving partition plate (522) and the rectangular concave cavity (52).

4. The positioning device for a multi-layer circuit board according to claim 3, characterized in that: The upward pushing part further includes a cold air bin (7). The cold air bin (7) is installed between adjacent cross beam frames (63). A sealing cover (53) is hermetically installed at the top of the rectangular concave cavity (52). An installation air cover (72) is communicated and installed at the top of the strip-shaped air inlet cavity (51). The installation air cover (72) and the cold air bin (7) are communicated through an air supply pipe (71). A pressure nozzle is communicated and installed at the bottom of the air flow injection port (524).

5. The positioning device for a multi-layer circuit board according to claim 4, characterized in that: The copper-clad conveying and adsorbing unit on the surface of the circuit board substrate further includes a lower adsorbing part. The lower adsorbing part includes a lateral air platform (33). The lateral air platform (33) is installed on both sides of the bottom frame (3). A stop material cavity (81) is arranged on the surface of the stop material platform (8). An air suction hole (83) is opened on one side of the stop material cavity (81) close to the lateral air platform (33). An air suction pipe (32) is communicated and installed on one side of the lateral air platform (33). A negative pressure air bin (31) is installed at one end of the air suction pipe (32). The air suction pipe (32) is communicated with the air suction hole (83).

6. The positioning device for a multi-layer circuit board according to claim 1, characterized in that: The auxiliary pressure fitting unit for corresponding cutting of the copper-clad sheet on the substrate surface includes a cutting blade (43). The cutting blade (43) is installed on the bottom surface of the calibration top cover (41). A flexible air bag (44) is embedded on the bottom surface of the calibration top cover (41) outside the cutting blade (43). An electromagnetic valve (45) is installed outside the flexible air bag (44).

7. The positioning device for a multi-layer circuit board according to claim 5, characterized in that: A circuit board conveying and guiding unit is arranged in the material stopping cavity (81). The circuit board conveying and guiding unit includes an inclined guide table (86). The inclined guide table (86) is installed at both ends of the material stopping platform (8). Feeding rollers (82) are installed on the surface of the inclined guide table (86) and inside the material stopping cavity (81). A second through groove (85) is arranged in the central area of the material stopping cavity (81). First through grooves (84) are arranged in the areas of the material stopping cavity (81) close to both inclined guide tables (86).

8. The positioning device for a multi-layer circuit board according to claim 7, wherein: A circuit board surface copper-clad bonding position calibration unit is arranged in the bottom area of the first through groove (84).

9. The positioning device for a multi-layer circuit board according to claim 8, wherein: The circuit board surface copper-clad bonding position calibration unit includes a calibration frame (9). A bottom cylinder (91) is installed at the bottom of the calibration frame (9). The bottom cylinder (91) is installed on the top of the bottom frame (3). A middle bottom platform (94) is installed in the central area of the calibration frame (9). A central top column (92) is installed on the top of the middle bottom platform (94). The top of the central top column (92) movably passes through the second through groove (85). A calibration column (93) is installed in the area of the top of the calibration frame (9) close to the first through groove (84). The top of the calibration column (93) movably passes through the first through groove (84). An anti-slip pad (939) is embedded and installed on the top of the calibration frame (9). The anti-slip pads (939) are arranged in several groups in an array.

10. The positioning device for a multi-layer circuit board according to claim 9, characterized in that: A first concave cavity (931) is arranged at the top of the calibration column (93). The first concave cavity (931) is symmetrically arranged in two groups. A second concave cavity (934) is also arranged at the top of the calibration column (93). A counterweight block (932) is installed in the first concave cavity (931). A side cavity (933) is arranged on one side of the calibration column (93). A linear guide rail (935) is installed in the side cavity (933). A linear guide rail (935) is also installed in the second concave cavity (934). A moving block (936) is installed on the moving end of the linear guide rail (935). An electric rotating shaft (937) is embedded and installed inside the moving block (936). A calibration rotating wheel (938) is installed on the rotating end of the electric rotating shaft (937). An anti-slip rubber strip is arranged on the surface of the calibration rotating wheel (938).

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