Radio frequency feedthrough component, coaxial radio frequency feedthrough component and package for radio frequency circuit

Abstract

The invention relates to a radio frequency feed-through component, a coaxial radio frequency feed-through component and a package for a radio frequency circuit. A radio frequency (RF) feedthrough component having an impedance greater than 20 ohms is disclosed. The radio frequency feedthrough component includes a ceramic body having a flexible non-ferrous conductor adhered to an outer peripheral surface of the ceramic body and to an inner peripheral surface of a hole passing through the ceramic body. A non-ferrous conductive lead is disposed through the aperture and projects from at least one side of the aperture. A non-ferrous hermetic seal is formed between a portion of the non-ferrous conductive lead disposed in the hole and a non-ferrous conductor adhered to an inner circumferential surface of the hole. The RF feedthrough component may be assembled in the opening of the conductive housing to form an electromagnetic shielding package for the circuit.

Description

Technical Field

[0001] The present disclosure generally relates to radio frequency (RF) feedthrough components, coaxial RF feedthrough components, and packages for RF circuits, and more particularly to ceramic RF feedthrough components suitable for hermetically sealed circuit packages and combinations thereof. Background Art

[0002] Circuits enclosed within hermetically sealed packages typically include electrical leads or pins through which current and electrical signals are transmitted to and from the circuit. Hermetic sealing is necessary to prevent the penetration of fluids, particles, and other environmental contaminants. The package typically includes a conductive housing made of metal or a metal-clad insulator. The conductive housing electrically shields the circuit from external interference and prevents the circuit from causing interference outside the package.

[0003] The electrical leads or pins are typically integrated with an insulating feedthrough component fitted in an opening through the conductive housing. The feedthrough component includes a conductive ferrule disposed around an insulator that electrically insulates the electrical pin or lead from the ferrule. The insulator is typically borosilicate glass, and both the pin and the ferrule are fabricated from a metal alloy called Kovar that has the same coefficient of thermal expansion (CTE) as the glass. During manufacturing, the glass is bonded to the ferrule and the electrical pin by firing the parts positioned in a fixture, which forms a glass-metal hermetic seal upon cooling. Alternatively, the ferrule, glass, and pin can be assembled by interference fit. For corrosion resistance and solderability, an adhesion layer of nickel and an external gold plating are deposited on the exposed Kovar to complete the assembly. The conductive ferrule of the assembled feedthrough is then welded to the conductive housing to hermetically seal the circuit package.

[0004] However, the glass-metal feedthrough components described herein are laborious and costly to manufacture. In addition, glass-metal feedthroughs are poor conductors of RF energy and are a source of passive intermodulation (PIM) distortion. These side effects can be attributed to the relatively lossy and iron-containing nature of nickel and Kovar. More specifically, the unplated portion of the Kovar pin within the glass insulator attenuates the RF signal. Additionally, the skin depth at typical RF frequencies is greater than the thickness of the external gold plating, resulting in the propagation of RF energy through the lossy nickel and Kovar. Accordingly, there has been a continuing need to improve RF feedthrough components suitable for hermetically sealed circuit packages and combinations thereof. Summary of the Invention

[0005] In a first aspect, a radio frequency feedthrough component is described. The radio frequency feedthrough component includes: a ceramic body having an outer peripheral surface and a hole with an inner peripheral surface; a non-ferrous conductor adhered to the outer peripheral surface of the ceramic body and adhered to the inner peripheral surface of the hole; and a non-ferrous conductive lead disposed through the hole, a portion of the non-ferrous conductive lead being disposed in the hole of the ceramic body and another portion of the non-ferrous conductive lead extending from at least one side of the ceramic body, wherein a non-ferrous airtight seal is formed between the portion of the non-ferrous conductive lead disposed in the hole and the non-ferrous conductor adhered to the inner peripheral surface of the hole; and wherein the characteristic impedance of the radio frequency feedthrough component is greater than 20 ohms.

[0006] Preferably, the non-ferrous conductor may be flexible.

[0007] Preferably, the non-ferrous conductor may include gap vacancies.

[0008] Preferably, the non-ferrous conductor may be a thick film.

[0009] Preferably, the radio frequency feedthrough component may further include an adhesion film deposited on the ceramic body, wherein the non-ferrous conductor includes a thin film deposited on the adhesion film.

[0010] Preferably, the radio frequency feedthrough component may be a coaxial device, and the non-ferrous conductive lead may include pins with a diameter between 0.009 inches and 0.030 inches, the diameter of the hole may be between 0.011 inches and 0.032 inches, and the outer diameter of the ceramic body may be between 0.071 inches and 0.0470 inches.

[0011] Preferably, the radio frequency feedthrough component may include an impedance of 50 ohms, wherein the ceramic body has a relative dielectric constant between 5 and 9.

[0012] Preferably, the radio frequency feedthrough component may include an impedance of 75 ohms, wherein the ceramic body has a relative dielectric constant between 5 and 9.

[0013] In a second aspect, a coaxial radio frequency feedthrough component is described. The coaxial radio frequency feedthrough component includes: a ceramic body having an outer peripheral surface and a hole with an inner peripheral surface; a non-ferrous metal mesh adhered to the outer peripheral surface of the ceramic body and adhered to the inner peripheral surface of the hole; and a non-ferrous conductive lead disposed through the hole, a portion of the non-ferrous conductive lead being disposed in the hole and another portion of the non-ferrous conductive lead extending from opposite sides of the ceramic body, wherein a non-ferrous airtight seal is formed between the portion of the non-ferrous conductive lead disposed in the hole and the non-ferrous metal mesh adhered to the inner peripheral surface of the hole; and wherein the characteristic impedance of the coaxial radio frequency feedthrough component is greater than 20 ohms.

[0014] Preferably, the coaxial radio frequency feedthrough component may include a low-pass cut-off frequency between 75 GHz and 8 GHz given by the following expression:

[0015]

[0016] where D is the outer diameter of the ceramic body, d is the diameter of the hole, and ε r is the relative dielectric constant of the ceramic body.

[0017] Preferably, the characteristic impedance may be between 50 ohms and 75 ohms, including 50 ohms and 75 ohms.

[0018] Preferably, the non-ferrous metal mesh may include gap vacancies, wherein the non-ferrous metal mesh is flexible.

[0019] In a third aspect, a package for a radio frequency circuit is described. The package includes: an electrically shielded housing including a conductive opening extending through a wall portion of the electrically shielded housing; and a coaxial radio frequency feedthrough component including: a non-ferrous conductor adhered to an outer peripheral surface of a ceramic body and adhered to an inner peripheral surface of a hole passing through the ceramic body; a non-ferrous conductive lead disposed through the hole and electrically connected to the non-ferrous conductor on the inner peripheral surface of the hole, the impedance of the coaxial radio frequency feedthrough component being greater than 20 ohms; the ceramic body being disposed in the conductive opening of the electrically shielded housing and the non-ferrous conductor on the outer peripheral surface of the ceramic body being electrically connected to the conductive opening, wherein the coaxial radio frequency feedthrough component is airtightly sealed to the electrically shielded housing.

[0020] Preferably, the non-ferrous conductor may include gap vacancies, wherein the non-ferrous conductor is flexible.

[0021] Preferably, the coaxial radio frequency feedthrough component may have an impedance of 50 ohms.

[0022] Preferably, the non-ferrous conductive lead may include pins having a diameter between 0.009 inches and 0.030 inches, the diameter of the hole may be between 0.011 inches and 0.032 inches, and the outer diameter of the ceramic body may be between 0.071 inches and 0.0390 inches, wherein the coaxial RF feedthrough component has a low-pass cutoff frequency between 75 GHz and 9 GHz.

[0023] Preferably, the coaxial RF feedthrough component may have an impedance of 75 ohms.

[0024] Preferably, the non-ferrous conductive lead may include pins having a diameter between 0.009 inches and 0.015 inches, the diameter of the hole may be between 0.011 inches and 0.017 inches, and the outer diameter of the ceramic body may be between 0.180 inches and 0.470 inches, wherein the coaxial RF feedthrough component has a low-pass cutoff frequency between 30 GHz and 8 GHz. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The objects, features, and advantages of the present disclosure will become more apparent by considering the following detailed description in conjunction with the accompanying drawings. The drawings depict only representative embodiments and should not be considered as limiting the scope of the invention.

[0026] Figure 1 is a cross-sectional view of a ceramic RF feedthrough component.

[0027] Figure 2 is a perspective view of a non-ferrous conductor on a ceramic body.

[0028] Figure 3 is a partial exploded view of a ceramic RF feedthrough component and a conductive housing.

[0029] Figure 4 is a cross-sectional view of a ceramic RF feedthrough component assembled with a conductive housing.

[0030] Those of ordinary skill in the art will understand that the drawings are shown for simplicity and clarity and may not be drawn to scale and may not include well-known features; the order of appearance of actions or steps may be different from the order described; unless otherwise stated, the order or appearance of these actions or steps may occur simultaneously, and the terms and expressions used herein have the meanings understood by those of ordinary skill in the art, unless a different meaning is expressly attributed to them herein. DETAILED DESCRIPTION

[0031] The present disclosure generally relates to radio frequency (RF) feedthrough components (also referred to herein as "feedthroughs"), and more particularly to ceramic RF feedthrough components suitable for hermetically sealed circuit packages and combinations thereof.

[0032] The RF feedthrough components described herein generally include a non-ferrous conductor selectively adhered to the outer peripheral surface of a ceramic body and the inner peripheral surface of a hole passing through the ceramic body. A non-ferrous conductive lead is disposed through the hole and extends from one or both sides of the hole. A portion of the non-ferrous conductive lead disposed in the hole is hermetically sealed to a thick film conductor adhered to the surface of the hole. The representative impedance of the ceramic RF feedthrough components described herein is greater than 20 ohms.

[0033] In Figure 1 , the coaxial radio frequency (RF) feedthrough component 100 includes an annular ceramic body 110 having an outer peripheral surface 112 and a hole with an inner peripheral surface 114. Representative ceramic materials include alumina and aluminum nitride and other ceramic formulations. Ceramics, particularly Class 1 C0G ceramics, have good temperature stability from as low as -55 °C to as high as 125 °C. More specific ceramic material properties are further described herein.

[0034] In Figure 2 , a non-ferrous conductor 116 is adhered to the outer peripheral surface 112 of the ceramic body and the inner peripheral surface 114 of the hole. The non-ferrous conductor may include silver, palladium, or other relatively soft metals or alloys thereof that can accommodate the thermal expansion and contraction of the ceramic body. In one implementation, the non-ferrous metal has a purity of at least 90%.

[0035] In Figure 2 , the non-ferrous conductor 116 is configured as a flexible metal mesh 118 adhered to the outer and inner peripheral surfaces of the ceramic body. The mesh structure includes voids 119 that enhance the ability of the soft metal to expand and contract with the ceramic body. In one implementation, the non-ferrous conductor is deposited on the ceramic body using thick film technology. More specifically, a thick film paste containing a soft non-ferrous metal, oxide, or alloy thereof mixed with a glass frit is applied to selected portions of the ceramic body. The thick film paste can be applied to the ceramic body in spraying, dipping, screen, and stencil printing or other deposition operations. The ceramic body selectively coated with the thick film paste is then subjected to a firing operation during which the glass powder is burned off, creating voids in the non-ferrous conductor on the ceramic body. For illustrative purposes, Figure 2 the voids 119 are shown as discrete openings. In reality, the voids are microscopic interstitial spaces between the constituent elements of the non-ferrous conductor. The voids define a metal mesh on the outer and inner peripheral surfaces of the ceramic body and increase the flexibility of the non-ferrous conductor. The non-ferrous conductor can have a thickness of approximately 0.0015 inches and can be built up in a layer sequence to increase the thickness.

[0036] Alternatively, thin film technology can be used to form a non-ferrous conductor on a ceramic body. The thin film process typically includes sputtering a thin adhesion layer onto a selected surface of the ceramic body before sputtering a conductive layer onto the thin adhesion layer. In one implementation, the non-ferrous conductive layer includes a copper film deposited on the adhesion layer and a gold film subsequently deposited on the copper film. One or more other non-ferrous conductive materials can be used in place of the representative copper film and gold film. In some thin film processes, the adhesion layer includes a ferrous compound. Thus, a ceramic RF feedthrough component including a thin film non-ferrous conductor deposited on a thin film ferrous adhesion layer may not perform as well as a ceramic RF feedthrough component including the non-ferrous thick film conductor described above. However, a ceramic RF feedthrough component including one or more non-ferrous thin film conductive layers deposited on a ferrous thin film adhesion layer still performs significantly better (e.g., produces less PIM distortion) than prior art RF feedthrough components including kovar alloy and glass.

[0037] In yet another alternative, the non-ferrous conductor can be directly bonded to the ceramic body. The direct bonding process typically includes high temperature oxidation of copper or other non-ferrous conductors in nitrogen or other suitable atmospheres having a controlled oxygen content. Non-ferrous conductors applied using thin film or direct bonding techniques may not be as flexible as non-ferrous conductors applied using thick film techniques.

[0038] In some implementations, a ceramic RF feedthrough component can include any combination of thick film, thin film, or directly bonded non-ferrous conductors. For example, one or more thin film non-ferrous conductors can be deposited on an adhesion layer on the inner peripheral surface 114 of a hole (through which a conductive lead is disposed), and a thick film non-ferrous conductor can be deposited on the outer peripheral surface 112 of the ceramic body.

[0039] In Figure 1 , a non-ferrous conductive lead 120 disposed through a hole in the ceramic body and fixed to the hole of the ceramic body extends from one or both of opposite sides of the ceramic body. A portion of the non-ferrous conductive lead located within the hole is hermetically sealed with a non-ferrous conductor 116 adhered to the surface of the hole. The non-ferrous conductive lead can be configured as a pin having a specific diameter or some other cross-sectional shape.

[0040] In one implementation, the hermetic seal is formed by Figure 1 the non-ferrous solder 117 shown. The solder can be a high temperature non-leaching solder. One such solder is a Sn10 formulation solder that mainly contains lead and a smaller amount of other elements such as silver. Lead solder is relatively soft and will maintain a hermetic seal when the ceramic body expands and contracts in most operating environments. In one implementation, the non-ferrous conductive lead includes pure silver or copper coated with pure silver. As used herein, "pure" means a purity of not less than 90%. Alternatively, other non-ferrous conductors can be used.

[0041] The manufacturing cost of the RF feedthrough component including non-ferrous metal deposited on the ceramic body described herein is significantly lower than that of the prior art glass-metal feedthrough. Thick film and other non-ferrous deposition processes are less labor-intensive than machining kovar ferrules and conductive pins and then assembling the prior art glass-metal feedthroughs. In addition, the ceramic RF feedthrough components described herein exhibit significantly better performance compared to the prior art glass-metal feedthroughs, partly due to the significant reduction in RF attenuation caused by the use of non-ferrous conductors, reduced PIM distortion, and the low CTE of the ceramic.

[0042] The characteristic impedance Z of the coaxial ceramic RF feedthrough component o is given by the following expression (Equation I):

[0043]

[0044] where D is the outer diameter of the ceramic body, d is the diameter of the hole, and ε r is the relative dielectric constant of the ceramic body.

[0045] The ceramic RF feedthrough components described herein can have any characteristic impedance. Representative ceramic RF feedthrough components described herein have a characteristic impedance greater than 20 ohms. Characteristic impedances of 50 ohms and 75 ohms are the most common. Feedthroughs with a 50-ohm impedance are typically used in RF (including microwave) applications, etc. Feedthroughs with a 75-ohm impedance are typically used in cable and satellite TV, as well as video applications, etc. Other less common characteristic impedances of RF feedthrough components include 125 ohms used in the aerospace industry and 92 ohms specified by the Nuclear Instrument Module (NIM) standard for experimental research, etc.

[0046] For most RF feedthrough component applications, the electrical and mechanical constraints of the host device determine the characteristic impedance and size of the RF feedthrough component, as shown in Equation I. Representative non-ferrous conductive pin sizes and ceramic body sizes of the coaxial ceramic RF feedthrough components with 50-ohm and 75-ohm impedances described herein are shown in Table I below.

[0047] Table I

[0048] Ohm Pin diameter Relative dielectric constant Outer diameter Inner diameter Cutoff frequency (GHz) 50 0.009 5 0.071 0.011 74.33823738 50 0.015 5 0.110 0.017 47.98195322 50 0.018 5 0.129 0.020 40.91484383 50 0.020 5 0.142 0.022 37.16911869 50 0.030 5 0.206 0.032 25.62143133 50 0.009 9 0.134 0.011 29.35820896 50 0.015 9 0.208 0.017 18.91346154 50 0.018 9 0.240 0.020 16.39166667 50 0.020 9 0.269 0.022 14.62453532 50 0.030 9 0.390 0.032 10.08717949 75 0.009 5 0.180 0.011 29.32230474 75 0.015 5 0.279 0.017 18.91761596 75 0.009 9 0.470 0.011 8.370212766

[0049] The low-pass cutoff frequency of the coaxial ceramic RF feedthrough component is given by the following expression (Equation II):

[0050]

[0051] where D is the outer diameter of the ceramic body, d is the diameter of the hole, and ε ris the relative dielectric constant of the ceramic body. Table I above includes the cutoff frequencies of representative feedthroughs having 50 ohm and 75 ohm impedances as described herein. The 50 ohm coaxial ceramic RF feedthrough component includes a low pass cutoff frequency between 75 GHz and 10 GHz. The 75 ohm coaxial ceramic RF feedthrough component includes a low pass cutoff frequency between 30 GHz and 8 GHz. Other cutoff frequencies can be selected by appropriately choosing the dimensions and relative dielectric constant of the ceramic body.

[0052] In one representative 50 ohm implementation shown in Table I, the RF feedthrough component is a coaxial device, the non-ferrous conductive leads include pins with diameters between 0.009 inches and 0.030 inches, the ceramic body has a relative dielectric constant of 5, the inner diameter of the ceramic body is between 0.011 inches and 0.032 inches, and the outer diameter of the ceramic body is between 0.071 inches and 0.0206 inches.

[0053] In another representative 50 ohm implementation shown in Table I, the RF feedthrough component is a coaxial device, the non-ferrous conductive leads include pins with diameters between 0.009 inches and 0.030 inches, the ceramic body has a relative dielectric constant of 9, the inner diameter of the ceramic body is between 0.011 inches and 0.032 inches, and the outer diameter of the ceramic body is between 0.134 inches and 0.390 inches.

[0054] In one representative 75 ohm implementation shown in Table I, the RF feedthrough component is a coaxial device, the non-ferrous conductive leads include pins with diameters between 0.009 inches and 0.015 inches, the ceramic body has a relative dielectric constant of 5, the inner diameter of the ceramic body is between 0.011 inches and 0.017 inches, and the outer diameter of the ceramic body is between 0.180 inches and 0.279 inches.

[0055] In another representative 75 ohm implementation shown in Table I, the RF feedthrough component is a coaxial device, the non-ferrous conductive leads include pins with a diameter of 0.009 inches, the relative dielectric constant of the ceramic body is 9, the inner diameter of the ceramic body is 0.011 inches, and the outer diameter of the ceramic body is 0.470 inches.

[0056] More generally, the characteristic impedance, dimensions, and relative dielectric constant of the ceramic RF feedthrough component can be different from the examples in Table I.

[0057] In use, one or more ceramic RF feedthrough components can be assembled with a conductive housing to form an airtight and electromagnetic shielded package for an RF circuit. In Figure 3 and Figure 4In a radio frequency (RF) circuit package 200, an electrical shielding housing 210 includes a conductive opening 212 that extends through a wall portion 214 of the housing. The circuit package may also include an opening 216 through which a circuit can be installed within the housing before placing a cover (not shown) over the opening 216 and hermetically sealing it. The housing may include a metallic material or an insulator coated with a conductive material on an inner or outer surface thereof for electromagnetic shielding. The conductive opening 212 may be adjacent to other conductive portions of the housing. The ceramic RF feedthrough component 100 assembled with the housing 210 includes a non-ferrous conductor 116 that adheres to an outer peripheral surface of an annular ceramic body 110 as described herein. A non-ferrous conductive lead 120 disposed through a hole is electrically connected to the non-ferrous conductor on an inner peripheral surface of the hole as described herein. The annular ceramic body 110 of the RF feedthrough component 100 is disposed within the conductive opening 212 of the housing. The non-ferrous conductor 116 on the outer peripheral surface of the ceramic body is electrically connected to the conductive opening 212. A hermetic seal between the conductive opening 212 and the annular ceramic body 110 may be formed by a high temperature non-leaching solder as described herein. Figure 3 and Figure 4 The ceramic RF feedthrough component 100 shown in Figure 3 can be implemented according to any of the representative implementations disclosed and presented herein.

[0058] Although the present disclosure and what is presently considered to be its best mode have been described in a manner that establishes ownership and enables a person of ordinary skill in the art to make and use the present disclosure, it should be understood and appreciated that many equivalent substitutions and changes can be made to the representative embodiments described herein without departing from the scope and spirit of the present invention, and the scope and spirit of the present invention are not limited by the described embodiments but rather by the appended claims and their equivalents.

Claims

1. A radio frequency feedthrough component, characterized in that, The radio frequency feedthrough component includes: A ceramic body having an outer peripheral surface and a hole with an inner peripheral surface; A non-ferrous conductor adhered to the outer peripheral surface of the ceramic body and adhered to the inner peripheral surface of the hole; and A non-ferrous conductive lead disposed through the hole, a portion of the non-ferrous conductive lead being disposed in the hole of the ceramic body and another portion of the non-ferrous conductive lead protruding from at least one side of the ceramic body, wherein a non-ferrous airtight seal is formed between the portion of the non-ferrous conductive lead disposed in the hole and the non-ferrous conductor adhered to the inner peripheral surface of the hole; and wherein the characteristic impedance of the radio frequency feedthrough component is greater than 20 ohms.

2. The radio frequency feedthrough component according to claim 1, wherein The non-ferrous conductor is flexible.

3. The radio frequency feedthrough component according to claim 2, wherein, The non-ferrous conductor includes gap vacancies.

4. The radio frequency feedthrough component according to claim 3, characterized in that, The non-ferrous conductor is a thick film.

5. The radio frequency feedthrough component according to claim 3, characterized in that, The radio frequency feedthrough component further includes an adhesion film deposited on the ceramic body, wherein the non-ferrous conductor includes a thin film deposited on the adhesion film.

6. The radio frequency feedthrough component according to claim 3, characterized in that, The radio frequency feedthrough component is a coaxial device, and the non-ferrous conductive lead includes pins having a diameter between 0.009 inches and 0.030 inches, the hole having a diameter between 0.011 inches and 0.032 inches, and the outer diameter of the ceramic body being between 0.071 inches and 0.0470 inches.

7. The radio frequency feedthrough component according to claim 6, characterized in that, The radio frequency feedthrough component includes an impedance of 50 ohms, wherein the ceramic body has a relative dielectric constant between 5 and 9.

8. The radio frequency feedthrough component according to claim 6, characterized in that, The radio frequency feedthrough component includes an impedance of 75 ohms, wherein the ceramic body has a relative dielectric constant between 5 and 9.

9. A coaxial radio frequency feedthrough component, characterized in that, The coaxial radio frequency feedthrough component includes: A ceramic body having an outer peripheral surface and a hole with an inner peripheral surface; A non-ferrous metal mesh adhered to the outer peripheral surface of the ceramic body and adhered to the inner peripheral surface of the hole; and A non-ferrous conductive lead disposed through the hole, a portion of the non-ferrous conductive lead being disposed in the hole and another portion of the non-ferrous conductive lead protruding from opposite sides of the ceramic body, wherein a non-ferrous airtight seal is formed between the portion of the non-ferrous conductive lead disposed in the hole and the non-ferrous metal mesh adhered to the inner peripheral surface of the hole; and wherein the characteristic impedance of the coaxial radio frequency feedthrough component is greater than 20 ohms.

10. The coaxial radio frequency feedthrough component according to claim 9, characterized in that, The coaxial radio frequency feedthrough component includes a low-pass cut-off frequency between 75 GHz and 8 GHz given by the following expression: Where D is the outer diameter of the ceramic body, d is the diameter of the hole, and ε r is the relative dielectric constant of the ceramic body.

11. The coaxial radio frequency feedthrough component according to claim 10, wherein The characteristic impedance is between 50 ohms and 75 ohms, including 50 ohms and 75 ohms.

12. The coaxial radio frequency feedthrough component according to any one of claims 9 to 11, characterized in that, The non-ferrous metal mesh includes gap vacancies, wherein the non-ferrous metal mesh is flexible.

13. A package for a radio frequency circuit, characterized in that, The package includes: An electrically shielded housing including a conductive opening extending through a wall portion of the electrically shielded housing; and A coaxial radio frequency feedthrough component including: A non-ferrous conductor adhered to the outer peripheral surface of a ceramic body and adhered to the inner peripheral surface of a hole passing through the ceramic body; A non-ferrous conductive lead disposed through the hole and electrically connected to the non-ferrous conductor on the inner peripheral surface of the hole, The impedance of the coaxial radio frequency feedthrough component is greater than 20 ohms; The ceramic body is disposed in the conductive opening of the electrical shielding housing, and the non-ferrous conductor on the outer peripheral surface of the ceramic body is electrically connected to the conductive opening. Wherein, the coaxial radio frequency feedthrough component is hermetically sealed to the electrical shielding housing.

14. The package for a radio frequency circuit according to claim 13, characterized in that, The non-ferrous conductor includes a gap vacancy, wherein the non-ferrous conductor is flexible.

15. The package for a radio frequency circuit according to claim 14, wherein The coaxial radio frequency feedthrough component has an impedance of 50 ohms.

16. The package for a radio frequency circuit according to claim 15, characterized in that, The non-ferrous conductive lead includes pins with diameters between 0.009 inches and 0.030 inches, the holes have diameters between 0.011 inches and 0.032 inches, and the outer diameter of the ceramic body is between 0.071 inches and 0.0390 inches, wherein the coaxial radio frequency feedthrough component has a low-pass cut-off frequency between 75 GHz and 9 GHz.

17. The package for a radio frequency circuit according to claim 14, wherein, The coaxial radio frequency feedthrough component has an impedance of 75 ohms.

18. The package for a radio frequency circuit according to claim 17, wherein, The non-ferrous conductive lead includes pins with diameters between 0.009 inches and 0.015 inches, the holes have diameters between 0.011 inches and 0.017 inches, and the outer diameter of the ceramic body is between 0.180 inches and 0.470 inches, wherein the coaxial radio frequency feedthrough component has a low-pass cut-off frequency between 30 GHz and 8 GHz.

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