Mounting device and method for controlling mounting device

Abstract

The invention provides a mounting apparatus and a control method of the mounting apparatus. The invention aims to optimize the beat difference between two mounting heads in a double-channel double-head mounting device. A control device of the mounting device extracts a distribution mode for which of a first mounting head on the upstream side and a second mounting head on the downstream side a plurality of electronic components mounted on one substrate are mounted; a combination pattern of an initial height of the first mounting head and an initial height of the second mounting head when a mounting process of one substrate is started is extracted, an absolute value of a beat difference between the first mounting head and the second mounting head in each of the combination patterns is calculated, and the first mounting head and the second mounting head are mounted on the basis of each of the calculated absolute values. A certain allocation pattern is regarded as an allocation pattern in which the beat difference is optimized, and the allocation pattern to be executed is determined.

Description

Technical Field

[0001] The technology disclosed in this specification relates to a mounting device and a control method for a mounting device. Background Art

[0002] In the technical field of mounting devices, a mounting device is known in which electronic components are mounted on substrates respectively conveyed in a plurality of lanes by one or more mounting heads. For example, Patent Document 1 discloses the following mounting device: there are a total of four mounting areas on the upstream side and the downstream side of each of two lanes, and an upstream mounting head and a downstream mounting head capable of moving across two lanes are provided.

[0003] When such a mounting head is at a high position, the distance from the substrate is farther and the vertical movement distance of the nozzle becomes longer compared to when it is at a low position, so the required time becomes longer. Therefore, the mounting head is controlled to move at the lowest position in a state where a component has not been mounted on the substrate in the lane, and to move at a high position in a manner that does not interfere with the component each time it is loaded.

[0004] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2008-251586

[0005] However, in a mounting device in which components are mounted on a single substrate by two mounting heads on the upstream side and the downstream side as in Patent Document 1, the number of components to be mounted on the upstream side and the downstream side is allocated to minimize the standby time of each mounting head. However, in the case of crossing the lane of the other party and there being a large component in the lane of the other party, there is a problem that the mounting head moves at a high position compared to the expected optimization, resulting in a delay in the operation of one mounting head, an increase in the standby time of the other mounting head, and an increase in the tact time. Summary of the Invention

[0006] An object of the technology disclosed in this specification is to optimize the tact difference between two mounting heads in a dual-lane dual-head type mounting device.

[0007] This specification discloses an installation device. The installation device includes: a plurality of substrate conveying devices arranged in parallel to convey substrates in a conveying direction; a first mounting head that mounts electronic components on each substrate conveyed by the plurality of substrate conveying devices in an upstream region in the conveying direction; a second mounting head that further mounts electronic components on the substrate after the electronic components are mounted by the first mounting head in a downstream region in the conveying direction; a head moving device that moves the first mounting head and the second mounting head horizontally across the plurality of substrate conveying devices and periodically changes the height position; and a control device that controls each part. The control device extracts a distribution pattern in which each of the plurality of electronic components mounted on one substrate is mounted by either the first mounting head or the second mounting head. For each of the distribution patterns, the control device extracts a combination pattern of the initial height of the first mounting head and the initial height of the second mounting head when starting the mounting process for one substrate. The control device calculates the absolute value of the cycle time difference between the first mounting head and the second mounting head in each of the combination patterns. Based on the calculated absolute values, the control device regards a certain distribution pattern as a distribution pattern that optimizes the cycle time difference and determines it as the distribution pattern to be executed.

[0008] This specification discloses a control method for an installation device. The installation device includes: a plurality of substrate conveying devices arranged in parallel to convey substrates in a conveying direction; a first mounting head that mounts electronic components on each substrate conveyed by the plurality of substrate conveying devices in an upstream region in the conveying direction; a second mounting head that further mounts electronic components on the substrate after the electronic components are mounted by the first mounting head in a downstream region in the conveying direction; and a head moving device that moves the first mounting head and the second mounting head horizontally across the plurality of substrate conveying devices and periodically changes the height position. The control method of the installation device is characterized by including: extracting a distribution pattern in which each of the plurality of electronic components mounted on one substrate is mounted by either the first mounting head or the second mounting head; for each of the distribution patterns, extracting a combination pattern of the initial height of the first mounting head and the initial height of the second mounting head when starting the mounting process for one substrate; calculating the absolute value of the cycle time difference between the first mounting head and the second mounting head in each of the combination patterns; and based on the calculated absolute values, regarding a certain distribution pattern as a distribution pattern that optimizes the cycle time difference and determining it as the distribution pattern to be executed.

[0009] According to the technology disclosed in this specification, it is possible to optimize the cycle time difference between two mounting heads in a dual-channel dual-head type installation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a top view schematically showing the installation device of the embodiment. Figure 2 It is a side view of the mounting head showing an embodiment. Figure 3 It is a flowchart showing the mounting process of an embodiment. Figure 4 It is a flowchart showing the head height change process of an embodiment. Figure 5 It is a flowchart showing the allocation determination process of an embodiment. Detailed Embodiment

[0011] Hereinafter, an embodiment will be described with reference to the drawings. In the embodiment, an XYZ orthogonal coordinate system is defined, and the positional relationship of each part is described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X-axis of a predetermined plane is defined as the X-axis direction. The direction parallel to the Y-axis of a predetermined plane orthogonal to the X-axis is defined as the Y-axis direction. The direction parallel to the Z-axis orthogonal to the predetermined plane is defined as the Z-axis direction. The rotation direction or tilt direction centered on the X-axis direction is defined as the θX direction. The rotation direction or tilt direction centered on the Y-axis direction is defined as the θY direction. The rotation direction or tilt direction centered on the Z-axis direction is defined as the θZ direction. In the embodiment, the predetermined plane is parallel to the horizontal plane. The Z-axis is parallel to the vertical axis, and the Z-axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. Additionally, the predetermined plane may be inclined with respect to the horizontal plane. Furthermore, in the embodiment, the predetermined plane including the X-axis and the Y-axis is appropriately referred to as the XY plane.

[0012] [Mounting Device] Figure 1 It is a top view schematically showing the mounting device 10 of an embodiment. Figure 2 It is a side view of the mounting head 40 showing an embodiment. The mounting device 10 is a device for mounting electronic components C on a substrate P.

[0013] The mounting device 10 of the embodiment is a dual lane type mounting device 10 that mounts electronic components C on different substrates P using two systems of channels. In the mounting device 10 of the embodiment, the conveyance direction of the substrate P is the direction from the -X side toward the +X side. Additionally, in the embodiment, approximately half of the area on the -X side in the mounting device 10 is referred to as the upstream area DU, and approximately half of the area on the +X side in the mounting device 10 is referred to as the downstream area DD. Furthermore, in the mounting device 10 of the embodiment, in the upstream area DU and the downstream area DD, the electronic components C can be mounted on the same substrate P in two stages.

[0014] As Figure 1As shown, the mounting device 10 includes a base member 12, a VCS (Vision Centering System) unit 14, a replacement nozzle holding mechanism 16, a component storage unit 18, a substrate transfer device 20, a component supply device 30, a mounting head 40, a head moving device 50, and a control device 90.

[0015] The base member 12 supports the VCS unit 14, the replacement nozzle holding mechanism 16, the component storage unit 18, the substrate transfer device 20, the component supply device 30, the mounting head 40, and the head moving device 50, respectively.

[0016] The substrate transfer device 20 transfers the substrate P from the upstream to the downstream of the mounting device 10. In the embodiment, the substrate transfer device 20 transfers the substrate P in the direction from the -X side to the +X side in the X-axis direction. The substrate transfer device 20 transfers the substrate P to the mounting area DM. The mounting area DM is defined by the transfer path of the substrate transfer device 20.

[0017] The substrate P before mounting the electronic component C is carried into the substrate transfer device 20 from the -X side end of the base member 12. The substrate transfer device 20 transfers the carried-in substrate P in the +X direction and stops the carried-in substrate P in their respective mounting areas DM. The substrate transfer device 20 transfers the substrate P after mounting the electronic component C in the +X direction. The substrate P after mounting the electronic component C is carried out from the +X side end of the base member 12.

[0018] In the mounting device 10 of the embodiment, the substrate P is transferred through two systems of channels. The substrate transfer device 20 includes a first substrate transfer device 22 and a second substrate transfer device 24 respectively provided in the channels of the two systems. The substrate P before mounting the electronic component C is carried into either the first substrate transfer device 22 or the second substrate transfer device 24 of the substrate transfer device 20 from the -X side end of the base member 12.

[0019] In the mounting device 10 of the embodiment, the mounting area DM includes a first upstream area Uf on the upstream area DU side and a first downstream area Df on the downstream area DD side on the transfer path of the first substrate transfer device 22, and a second upstream area Ur on the upstream area DU side and a second downstream area Dr on the downstream area DD side on the transfer path of the second substrate transfer device 24.

[0020] The first substrate transfer device 22 is provided on the -Y side near the mounting device 10 and transfers the substrate P in the direction from the -X side to the +X side in the X-axis direction. The substrate P transferred by the first substrate transfer device 22 on the -Y side near the mounting device 10 is mounted with several electronic components C in the first upstream area Uf and further mounted with electronic components C in the first downstream area Df.

[0021] The second substrate conveying device 24 is arranged relative to the first substrate conveying device 22 in a direction (Y-axis direction) orthogonal to the conveying direction (X-axis direction) of the substrate P, is provided on the +Y side near the mounting device 10, and conveys the substrate P in the direction from the -X side to the +X side in the X-axis direction. After several electronic components C are mounted on the substrate P conveyed by the second substrate conveying device 24 on the +Y side near the mounting device 10 in the second upstream region Ur, further electronic components C are mounted on the substrate P in the second downstream region Dr.

[0022] The first substrate conveying device 22 and the second substrate conveying device 24 each have, for example, a pair of guide members 26 for guiding the substrate P and a pair of conveyor belts 28 for conveying the substrate P in the X-axis direction.

[0023] The guide members 26 extend in the X-axis direction. The pair of guide members 26 are separated from each other in the Y-axis direction. One guide member 26 is arranged on the +Y side of the substrate P. The other guide member 26 is arranged on the -Y side of the substrate P.

[0024] The conveyor belt 28 is an annular closed belt. The conveyor belt 28 is a conveying mechanism that supports the substrate P and moves the substrate P along the guide member 26. One conveyor belt 28 is supported on one guide member 26 by a driving wheel and a driven wheel. The other conveyor belt 28 is supported on the other guide member 26 by a driving wheel and a driven wheel.

[0025] The conveyor belt 28 arranged on the +Y side among the pair of conveyor belts 28 supports the +Y side end of the lower surface of the substrate P. The conveyor belt 28 arranged on the -Y side supports the -Y side end of the lower surface of the substrate P. The driving wheel is rotated by a driving motor (not shown), thereby conveying the substrate P in the X-axis direction.

[0026] The component supply device 30 holds a plurality of electronic components C to be mounted on the substrate P, and can supply the electronic components C to the mounting head 40, that is, supply them to the holding position in a state that can be held (adsorbed or gripped) by the mounting head 40.

[0027] In the mounting device 10 of the embodiment, the component supply device 30 includes a component supply device 32f on the -Y side of the first substrate conveying device 22 arranged in the upstream region DU, a component supply device 32r on the +Y side of the second substrate conveying device 24 arranged in the upstream region DU, a component supply device 34f on the -Y side of the first substrate conveying device 22 arranged in the downstream region DD, and a component supply device 34r on the +Y side of the second substrate conveying device 24 arranged in the downstream region DD. In addition, the component supply device 30 may not necessarily include the component supply devices 32f and 34f arranged on the -Y side.

[0028] The component supply devices 32f, 32r, 34f, and 34r each include a plurality of tape feeders 36. The tape feeder 36 conveys a carrier tape holding a plurality of electronic components C. By conveying the carrier tape, at least one of the plurality of electronic components C is supplied to a holding position held by the mounting head 40.

[0029] The mounting head 40 holds the electronic component C supplied from the component supply device 30 by means of a nozzle 46 and mounts it on the surface of the substrate P disposed in the mounting area DM. The mounting head 40 has: an upstream head 42 having a movable area in the upstream area DU; and a downstream head 44 having a movable area in the downstream area DD. That is, the mounting device 10 of the embodiment is a double-head type mounting device 10. In the following description, without specifically distinguishing between the upstream head 42 and the downstream head 44, it is simply referred to as the mounting head 40.

[0030] As Figure 2 shown, the mounting head 40 has a housing 40a, one or more nozzles 46, and a nozzle driving part 48 corresponding to each nozzle 46.

[0031] The housing 40a is connected to a Z-axis moving device 80 described later. In the embodiment, the housing 40a is integrally provided with a Z-axis sliding member 84 of the Z-axis moving device 80. The housing 40a supports the nozzle 46 and the nozzle driving part 48.

[0032] The nozzle 46 releasably holds the electronic component C. The nozzle 46 of the embodiment is a suction nozzle that sucks and holds the electronic component C. An opening 46a is provided at the tip of the nozzle 46. The opening 46a of the nozzle 46 is connected to a vacuum system. In a state where the tip of the nozzle 46 is in contact with the electronic component C, by performing a suction operation of sucking from the opening 46a provided at the tip of the nozzle 46, the electronic component C is sucked and held at the tip of the nozzle 46. By canceling the suction operation of sucking from the opening 46a, the electronic component C is released from the nozzle 46. In addition, the nozzle 46 may be a gripping nozzle that grips the electronic component C.

[0033] The nozzle 46 has a shaft 46b connected to the tip, and the tip is formed with an opening 46a and sucks the electronic component C. The shaft 46b is a rod-shaped member that supports the tip and is supported by the housing 40a so as to extend in a direction (Z-axis direction) orthogonal to the surface of the substrate P. An air pipe (pipe) connecting the opening 46a to the suction mechanism of the nozzle driving part 48 is disposed inside the shaft 46b.

[0034] The nozzle driving part 48 moves the nozzle 46 in a direction (Z-axis direction) orthogonal to the surface of the substrate P, and sucks the electronic component C by the opening 46a of the nozzle 46. The nozzle driving part 48 rotates the nozzle 46 in the θZ direction.

[0035] In the nozzle drive unit 48, as a mechanism for moving the nozzle 46 in the Z-axis direction, for example, a mechanism having a direct-acting linear motor with the Z-axis direction as the drive direction is exemplified. The nozzle drive unit 48 moves the axis 46b of the nozzle 46 in the Z-axis direction by the direct-acting linear motor, thereby moving the opening 46a at the tip of the nozzle 46 in the Z-axis direction. Further, in the nozzle drive unit 48, as a mechanism for rotating the nozzle 46 in the θZ direction, for example, a mechanism composed of a motor and a transmission element connected to the axis 46b is exemplified. The nozzle drive unit 48 transmits the driving force output from the motor to the axis 46b through the transmission element, rotates the axis 46b in the θZ direction, and thereby also rotates the tip of the nozzle 46 in the θZ direction.

[0036] In the nozzle drive unit 48, as a mechanism for adsorbing the electronic component C by the opening 46a of the nozzle 46, that is, an attracting mechanism, for example, a mechanism having an air pipe connected to the opening 46a of the nozzle 46, a pump connected to the air pipe, and a solenoid valve for switching the opening and closing of the pipeline of the air pipe is exemplified. The nozzle drive unit 48 sucks the air in the air pipe by the pump, and switches whether to suck the air from the opening 46a by switching the opening and closing of the solenoid valve. The nozzle drive unit 48 adsorbs (holds) the electronic component C to the opening 46a by opening the solenoid valve and sucking the air from the opening 46a, and releases the electronic component C adsorbed to the opening 46a by closing the solenoid valve without sucking the air from the opening 46a, that is, becomes a state where the electronic component C is not adsorbed by the opening 46a (a non-holding state).

[0037] As Figure 1 shown, the mounting head 40 can move between the supply area SM (holding position) for supplying the electronic component C in the component supply device 30 and the mounting area DM for arranging the substrate P. The mounting head 40 can move in the X-axis direction, Y-axis direction, and Z-axis direction within the movable range by using the head moving device 50. The mounting head 40 holds the electronic component C supplied to the component supply device 30 by the nozzle 46, and after moving to each mounting area DM, mounts the electronic component C on the substrate P arranged in the mounting area DM.

[0038] The upstream head 42 can move between the supply area SM (holding position) for supplying the electronic component C in the component supply devices 32f and 32r and the first upstream area Uf and the second upstream area Ur for arranging the substrate P. The downstream head 44 can move between the supply area SM (holding position) for supplying the electronic component C in the component supply devices 34f and 34r and the first downstream area Df and the second downstream area Dr for arranging the substrate P. Each supply area SM and each mounting area DM are defined at different positions in the XY plane.

[0039] The head moving device 50 is capable of moving the mounting head 40 in the X-axis direction, Y-axis direction, and Z-axis direction, respectively. The head moving device 50 includes a head moving device 50U disposed in the upstream region DU for moving the upstream head 42 and a head moving device 50D disposed in the downstream region DD for moving the downstream head 44. In the following description, without specifically distinguishing between the head moving device 50U and the head moving device 50D, it is simply referred to as the head moving device 50.

[0040] The head moving device 50U and the head moving device 50D each have: an X-axis moving device 60 for moving the mounting head 40 in the X-axis direction; a Y-axis moving device 70 for moving the mounting head 40 in the Y-axis direction; and a Z-axis moving device 80 for moving the mounting head 40 in the Z-axis direction.

[0041] The Z-axis moving device 80 is connected to the mounting head 40. By driving the Z-axis moving device 80, the mounting head 40 moves in the Z-axis direction. The X-axis moving device 60 is connected to the mounting head 40 via the Z-axis moving device 80. The Z-axis moving device 80 moves in the X-axis direction by driving the X-axis moving device 60, whereby the mounting head 40 moves in the X-axis direction. The Y-axis moving device 70 is connected to the mounting head 40 via the X-axis moving device 60 and the Z-axis moving device 80. The X-axis moving device 60 moves in the Y-axis direction by driving the Y-axis moving device 70, whereby the mounting head 40 moves in the Y-axis direction.

[0042] In the embodiment, the Y-axis moving device 70 includes a pair of Y-axis moving devices 70. The Y-axis moving device 70, for example, includes: a Y-axis guiding member 72 supported by the base member 12 and extending in the Y-axis direction; a Y-axis sliding member 74 guided by the Y-axis guiding member 72 and sliding in the Y-axis direction; and a Y-axis actuator for generating a force to move the Y-axis sliding member 74 in the Y-axis direction. The Y-axis sliding member 74 supports the X-axis moving device 60.

[0043] The X-axis moving device 60 includes: an X-axis guiding member 62 supported by the Y-axis sliding member 74 of the Y-axis moving device 70 and extending in the X-axis direction; an X-axis sliding member 64 guided by the X-axis guiding member 62 and sliding in the X-axis direction; and an X-axis actuator for generating a force to move the X-axis sliding member 64 in the X-axis direction. The X-axis sliding member 64 supports the Z-axis moving device 80.

[0044] The Z-axis moving device 80 includes: a Z-axis guiding member 82, supported by the X-axis sliding member 64 of the X-axis moving device 60 and extending in the Z-axis direction; a Z-axis sliding member 84, guided by the Z-axis guiding member 82 and sliding in the Z-axis direction; and a Z-axis actuator, generating power to move the Z-axis sliding member 84 in the Z-axis direction. The Z-axis sliding member 84 supports the mounting head 40, or is integrally provided with the housing 40a of the mounting head 40 (refer to Figure 2 ).

[0045] The VCS unit 14, the nozzle replacement holding mechanism 16, and the component storage unit 18 are arranged in the XY plane at positions overlapping the movable area of the mounting head 40, and are arranged at positions lower in the vertical direction than the mounting head 40 in the Z-axis direction. In the embodiment, the VCS unit 14, the nozzle replacement holding mechanism 16, and the component storage unit 18 are arranged adjacent to each other between the second substrate conveying device 24 and the component supply device 30.

[0046] The VCS unit 14, the nozzle replacement holding mechanism 16, and the component storage unit 18 are respectively arranged in both the upstream area DU and the downstream area DD on the +Y side of the second conveying device. That is, they are respectively arranged corresponding to the upstream head 42 of the mounting head 40 on the upstream area DU side and the downstream head 44 of the mounting head 40 on the downstream area DD side.

[0047] The VCS unit 14 is an image recognition device for detecting the state of the electronic component C, and has, for example, a camera that captures the vicinity of the nozzle 46 of the mounting head 40 and an illumination unit that illuminates the captured area. The VCS unit 14 recognizes the shape of the electronic component C adsorbed by the nozzle 46 of the mounting head 40 and the holding state of the electronic component C held by the nozzle 46. More specifically, the VCS unit 14 captures the nozzle 46 of the mounting head 40 from the lower side in the vertical direction (-Z side) when the mounting head 40 moves to the facing position, and analyzes the captured image, thereby recognizing the shape of the electronic component C adsorbed by the nozzle 46 and the holding state of the electronic component C held by the nozzle 46. The VCS unit 14 outputs the acquired information to the control device 90.

[0048] The nozzle replacement holding mechanism 16 is a mechanism for holding a variety of nozzles 46. The nozzle replacement holding mechanism 16 holds a variety of nozzles 46 in a state where they can be detachably replaced by the mounting head 40. The nozzle replacement holding mechanism 16 can also hold, for example, a suction nozzle that holds the electronic component C by suction and a gripping nozzle that holds the electronic component C by gripping. The mounting head 40 changes the installed nozzle 46 by the nozzle replacement holding mechanism 16, and supplies air pressure to the installed nozzle 46 to drive it, thereby enabling the held electronic component C to be held under appropriate conditions (suction or gripping).

[0049] The component storage unit 18 is a box that stores the electronic components C held by the mounting head 40 through the nozzles 46 and not mounted on the substrate P. That is, in the mounting apparatus 10, it serves as a waste box for the electronic components C not mounted on the substrate P. When there are electronic components C held by the mounting head 40 that are not to be mounted on the substrate P, the mounting apparatus 10 moves the mounting head 40 to a position facing the component storage unit 18 and releases the held electronic components C, thereby dropping the electronic components C into the component storage unit 18.

[0050] The control device 90 controls each part of the mounting apparatus 10. The control device 90 includes a computer system having at least one processor, a main memory, a storage device, and an interface. The processor is a CPU (Central Processing Unit). The main memory includes a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory). As the storage device, a hard disk drive (HDD: Hard Disk Drive), a solid state drive (SSD: Solid State Drive), a magnetic disk, a magneto-optical disk, a CD-ROM, and a DVD-ROM are exemplified. The interface includes an input / output circuit. The functions of the processor are stored in the storage device as programs. The processor reads the programs from the storage device and expands them in the main memory, and executes processes according to the programs.

[0051] The control device 90 can be directly provided in the mounting apparatus 10 or can exist separately via a network. In the embodiment, controlling the mounting head 40 includes controlling the head moving device 50. Controlling the nozzle 46 includes controlling the nozzle driving unit 48.

[0052] In addition, the mounting apparatus 10 may appropriately include an operation device (not shown) for the operator to operate, a display device (not shown) for displaying various information, a warning device for issuing an alarm by light and / or sound, and the like.

[0053] [Optimization method for beat difference] In the mounting apparatus 10 of the embodiment, the two mounting heads 40, i.e., the upstream head 42 and the downstream head 44, can simultaneously perform mounting processes on two substrates P. In addition, after the upstream head 42 mounts several electronic components C on one substrate P, the downstream head 44 can further mount electronic components C.

[0054] For example, after several electronic components C are mounted on the first substrate P conveyed to the first upstream region Uf by the upstream head 42, the first substrate P is conveyed to the first downstream region Df, and the remaining electronic components C are mounted by the downstream head 44. After mounting the electronic components C on the first substrate P in the first upstream region Uf, the upstream head 42 mounts several electronic components C on the second substrate P conveyed to the second upstream region Ur, and then mounts several electronic components C on the third substrate P conveyed to the first upstream region Uf.

[0055] In addition, after mounting the electronic components C on the first substrate P in the first downstream region Df, the downstream head 44 mounts the remaining electronic components C on the second substrate P conveyed to the second downstream region Dr, and then mounts the remaining electronic components C on the third substrate P conveyed to the first downstream region Df. Thus, the upstream head 42 and the downstream head 44 alternately process the substrate P conveyed by the first substrate conveying device 22 and the substrate P conveyed by the second substrate conveying device 24.

[0056] The downstream head 44 generates a standby time when the processing of the upstream head 42 is delayed and the substrate P to be processed next is not conveyed to the downstream DD side. In addition, the upstream head 42 generates a standby time when the processing of the downstream head 44 is delayed, the conveyance of the substrate P is stalled, and the processed substrate P is not conveyed to the downstream DD side. In the mounting process, it is preferable that such a standby time is the shortest, that is, it is preferable that the cycle difference between the two mounting heads 40 is small.

[0057] Here, the height position of the mounting head 40 of the embodiment can be changed by the Z-axis moving device 80. In addition, when mounting the electronic component C held by the nozzle 46 on the substrate P, the nozzle 46 is reciprocated in the Z-axis direction by the nozzle driving unit 48. Specifically, after the suction operation for sucking from the opening 46a is stopped in a state where the nozzle 46 descends in the Z-axis direction and the electronic component C is placed on the substrate P, the mounting is completed by raising the nozzle 46 in the Z-axis direction.

[0058] At this time, the lower the mounting head 40 is located, the shorter the moving distance of the reciprocating movement of the nozzle 46 in the Z-axis direction and the shorter the required time. Therefore, it is preferable to set the order of mounting the electronic components C in the order of increasing height dimension of the electronic components C, make the initial height position of the mounting head 40 the lowest, and gradually increase the height position of the mounting head 40 in order not to interfere with the mounted electronic components C, thereby shortening the cycle time of production.

[0059] However, in the case where, as in the embodiment, the mounting head 40 mounts the substrates P respectively conveyed in a plurality of channels, it is sometimes necessary to cross the first substrate conveying device 22 and the second substrate conveying device 24 during the movement of the mounting head 40. At this time, there is a case where a large electronic component C is mounted on the substrate P conveyed to the substrate conveying device 20 side where no mounting process is performed, and interference occurs when crossing at the height of the predetermined mounting head 40.

[0060] In this case, in order to prevent interference between the electronic component C held by the nozzle 46 and the electronic component C mounted on the substrate P, the mounting head 40 is raised to avoid it. Then, it is necessary to increase the reciprocating movement distance of the nozzle 46 in the Z-axis direction by the amount of the increase in the height position of the mounting head 40, and the overall required time for the mounting process is longer than expected. As a result, there is a possibility that the processing of one mounting head 40 is delayed, the other mounting head 40 has a standby time or the standby time is extended, so that the cycle time difference changes and the entire production schedule is delayed.

[0061] For example, when the two mounting heads 40 respectively maintain the lowest height positions within the producible range where no interference occurs with the substrate P being mounted and their processing times are the same, the predetermined cycle time difference is zero and the cycle time is the shortest. However, in this case, the possibility that the height position of the mounting head 40 rises unexpectedly when crossing the other substrate conveying device 20 becomes large, and the possibility that the entire production schedule is delayed becomes high. On the other hand, if the two mounting heads 40 maintain the highest height positions, interference will not occur in any case, and it is not necessary to change the height position to a high position unexpectedly. Therefore, the possibility that the entire production schedule is delayed becomes low, but the predetermined cycle time itself increases.

[0062] Therefore, in the mounting device 10 of the embodiment, in order not to significantly extend the cycle time and to be able to suppress a significant delay in the schedule even when the height position of the mounting head 40 is changed, the cycle time difference is optimized. Therefore, when a plurality of electronic components C are mounted on a single substrate P to be mounted in a predetermined order, the allocation of the electronic components C, that is, which number of the electronic components C the upstream head 42 mounts in the upstream region DU and which number of the electronic components C the downstream head 44 mounts starting from in the downstream region DD is optimized.

[0063] Specifically, the allocation pattern of the electronic components C is extracted, that is, which number of the electronic components C the upstream head 42 mounts in the upstream region DU and which number of the electronic components C the downstream head 44 mounts starting from in the downstream region DD, and a certain allocation pattern is selected for implementation. The allocation pattern indicates the types of combinations of which number of the electronic components C the upstream head 42 mounts and which number of the electronic components C the downstream head 44 mounts starting from.

[0064] If the number of electronic components C mounted with respect to one substrate P is set to α, then at most α - 1 types of patterns are extracted. For example, the extracted assignment patterns can also be restricted based on predetermined conditions. The predetermined conditions include, for example, that the difference in the number of electronic components C mounted by the upstream head 42 and the downstream head 44 is below a predetermined quantity, or that the number of electronic components C mounted by the upstream head 42 and the downstream head 44 is above a predetermined quantity.

[0065] In a predetermined assignment pattern, a combination pattern of the initial heights of the upstream head 42 and the downstream head 44 when starting the mounting process on one substrate P is extracted. Then, the cycle difference between the processes of the upstream head 42 and the downstream head 44 and its absolute value in each combination pattern are calculated. Table 1 shows an example of the combination pattern of the initial heights, and the respective cycle differences and the absolute values of the cycle differences.

[0066] [Table 1]

[0067] The initial height is selected from the values of the height positions where the upstream head 42 and the downstream head 44 can be set. In the embodiment, it is one of 1 mm, 3 mm, 6 mm, 10 mm, 15 mm, and 25 mm from the reference height toward the +Z side. The initial height of the upstream head 42 is selected within the range from the height at which the electronic component C initially held by the nozzle 46 does not interfere with the substrate P or the like to the maximum height (25 mm in the embodiment). The initial height of the downstream head 44 is selected within the range from the height at which the electronic component C initially held by the nozzle 46 on the downstream region DD side does not interfere with the substrate P or the like to the maximum height (25 mm in the embodiment). In addition, the initial height of the downstream head 44 is at least above the initial height of the upstream head 42 and above the height when the upstream head 42 mounts the last electronic component C.

[0068] In the case of the example shown in Table 1, it shows that in this assignment pattern, even when the height of the upstream head 42 is 1 mm, the electronic component C mounted by the upstream head 42 No. 1 does not interfere with the substrate P while being held by the nozzle 46. In addition, it shows that the height of the downstream head 44 is 10 mm, and the electronic component C mounted by the downstream head 44 No. 1 does not interfere with the substrate P after the upstream head 42 has mounted a predetermined number of electronic components C while being held by the nozzle 46. Therefore, the initial height of the upstream head 42 can be selected from one of 1 mm, 3 mm, 6 mm, 10 mm, 15 mm, and 25 mm, and the initial height of the downstream head 44 can be selected from one of 10 mm, 15 mm, and 25 mm.

[0069] The required time for the processing of each of the upstream head 42 and the downstream head 44 is calculated as the time for raising the height position not beyond a predetermined value, but based on the height of the electronic component C mounted on the substrate P to be processed. Based on the required time for the processing of each of the upstream head 42 and the downstream head 44, the beat difference and its absolute value are calculated.

[0070] As shown in Table 1, in this allocation mode, the absolute values of the beat differences for all the combination modes are calculated. Further, in this allocation mode, the average value of the absolute values of the beat differences for all the combination modes is calculated. Similarly, in all the allocation modes, the average value of the absolute values of the beat differences is calculated. The allocation mode with the minimum average value of the absolute values of the beat differences among all the extracted allocation modes can be regarded as the allocation mode that optimizes the beat difference.

[0071] The combination modes can also be multiplied by weight coefficients respectively. Table 2 shows an example of the combination modes of the initial heights, and their respective beat differences, absolute values of the beat differences, and weight coefficients.

[0072] [Table 2]

[0073] The weight coefficients are set within the range of 0 or more and 1 or less. For example, it can also be that the smaller the beat difference, the larger the weight coefficient, and the larger the beat difference, the smaller the weight coefficient. In this case, emphasis is placed on shortening the beat time. In addition, for example, it can also be that the smaller the beat difference, the smaller the weight coefficient, and the larger the beat difference, the larger the weight coefficient. In this case, emphasis is placed on the production schedule not being delayed more than expected.

[0074] [Mounting Method] Figure 3 It is a flowchart showing the mounting process of the embodiment. The control device 90 of the mounting device 10 executes the Figure 3 processing of the flowchart shown. In addition, in the mounting process, the adsorption position of the electronic component C in the component supply device 30, the mounting coordinates of the electronic component C on the substrate P, etc. are Figure 3 pre-stored in the mounting device 10 through the teaching performed before the mounting process shown.

[0075] In addition, Figure 3 the processing of the flowchart shown represents a series of processes performed on the substrate P by the mounting head 40 (upstream head 42 or downstream head 44) corresponding to a single substrate P conveyed to a certain mounting area in the mounting area DM. In the following description, as an example, the mounting process in the first upstream area Uf is described.

[0076] The substrate P is conveyed to the mounting device 10. The first substrate conveying device 22 of the substrate conveying device 20 conveys the substrate P to the first upstream area Uf of the mounting area DM. The positioning process of the substrate P is performed. The control device 90 controls the head moving device 50U to move the upstream head 42 in the mounting head 40 toward the supply area SM (step SA1).

[0077] In addition, the supply area SM to which the upstream head 42 moves is one of the component supply devices 32f and 32r on the upstream area DU side. The upstream head 42 moves to a certain supply area SM that supplies the electronic component C to be mounted next based on the production program preset before the mounting process shown in Figure 3 . The control device 90 moves the upstream head 42 to a position where the electronic component C in the supply area SM faces the nozzle 46.

[0078] The control device 90 controls the nozzle driving unit 48 of the upstream head 42 to hold the electronic component C with the nozzle 46 (step SA2).

[0079] The control device 90 controls the head moving device 50U to move the upstream head 42 to a position facing the VCS unit 14 on the upstream area DU side (step SA3). Here, when the supply area SM that supplies the electronic component C in step SA1 is the component supply device 32f arranged on the -Y side of the first substrate conveying device 22, the upstream head 42 moves above the first substrate conveying device 22 and the second substrate conveying device 24 and moves to a position facing the VCS unit 14. At this time, in order not to interfere with the electronic components C already mounted on the substrate P held in the first upstream area Uf and the substrate P held in the second upstream area Ur, the height position of the upstream head 42 is controlled.

[0080] The control device 90 controls the VCS unit 14 to detect the state of the electronic component C held by the nozzle 46 of the upstream head 42 (step SA4). In addition, based on the detection result, when it is determined not to mount the electronic component C on the substrate P, the control device 90 controls the head moving device 50U to move the upstream head 42 to a position facing the component storage unit 18, controls the nozzle driving unit 48 to release the holding of the electronic component C, and discards the electronic component C into the component storage unit 18.

[0081] The control device 90 controls the head moving device 50U to move the upstream head 42 to a position where the nozzle 46 faces a predetermined mounting position of the substrate P in the first upstream area Uf of the mounting area DM (step SA5). Here, the VCS unit 14 is arranged on the +Y side of the second substrate conveying device 24. Therefore, the upstream head 42 moves across the upper part of the second substrate conveying device 24 and moves onto the substrate P held in the first upstream area Uf of the first substrate conveying device 22. At this time, in order not to interfere with the electronic components C already mounted on the substrate P held in the first upstream area Uf and the substrate P held in the second upstream area Ur, the height position of the upstream head 42 is controlled.

[0082] The control device 90 controls the nozzle driving part 48 of the upstream head 42 to mount the electronic component C adsorbed and held by the nozzle 46 (step SA6).

[0083] The control device 90 repeatedly executes Figure 3 the processing shown in the flowchart until the predetermined types and quantities of electronic components C are respectively mounted at the predetermined mounting positions on the substrate P in the first upstream area Uf. If the mounting of the electronic component C by the upstream head 42 is completed, the first substrate conveying device 22 conveys the substrate P to the first downstream area Df in the mounting area DM. The upstream head 42 starts the mounting process for the substrate P conveyed to the second upstream area Ur.

[0084] In the mounting process in the first downstream area Df, in the above series of processes, the upstream head 42 is replaced by the downstream head 44, the upstream area DU is replaced by the downstream area DD, and the component supply devices 32f, 32r are replaced by the component supply devices 34f, 34r, and the process is carried out in the same way. If the mounting of the electronic component C by the downstream head 44 is completed, the first substrate conveying device 22 carries out the substrate P from the mounting device 10 to the +X side.

[0085] In this way, the upstream head 42 and the downstream head 44 alternately process the substrate P conveyed by the first substrate conveying device 22 and the substrate P conveyed by the second substrate conveying device 24. In addition, after the upstream head 42 mounts several electronic components C on one substrate P, the downstream head 44 further mounts the electronic components C.

[0086] [Head height change processing] Figure 4 is a flowchart showing the head height change processing of the embodiment. The control device 90 of the mounting device 10 executes Figure 4 the head height change processing shown. Figure 4 The head height change processing shown is executed in parallel with the processing of the flowchart shown in Figure 3

[0087] Figure 4 The processing shown is for changing the height position of the mounting head 40 according to a preset production program. In the following description, as an example, the processing for changing the height position of the downstream head 44 in the mounting process in the first downstream area Df will be described.

[0088] The control device 90 acquires the height information of the electronic component C mounted on the substrate P located in the second downstream area Dr at a predetermined cycle (step SB1).

[0089] The control device 90 determines whether there is interference between the electronic component C mounted on the substrate P located in the second downstream area Dr and the downstream head 44 (step SB2). Here, the electronic component C that is the object of determining whether there is interference can be limited to the electronic component C on the moving path of the downstream head 44, or it can be the electronic component C with the largest height dimension among the electronic components C already mounted on the substrate P located in the second downstream area Dr.

[0090] When the control device 90 determines that there is interference with the downstream head 44 (step SB2 is "Yes"), it changes the height of the downstream head 44 (step SB3). The height position of the mounting head 40 can be changed stepwise. For example, it can be changed to positions that are 1 mm, 3 mm, 6 mm, 10 mm, 15 mm, and 25 mm above the reference height in the +Z direction. In step SB3 of the embodiment, it is changed to the next higher position from the current height position. The control device 90 repeatedly executes steps SB2 and SB3 until it determines in step SB2 that there is no interference with the downstream head 44 (step SB2 is "No").

[0091] If the control device 90 determines that there is no interference with the downstream head 44, it ends Figure 4 the series of processing shown, and returns to step SB1. Additionally, in Figure 4 the head height change processing shown, it is also possible to obtain the amount in the height direction where interference occurs in step SB2, and change to a position two or more steps higher in step SB3 according to this amount.

[0092] When changing the height position of the downstream head 44 in the mounting process in the second downstream area Dr, the second downstream area Dr is replaced with the first downstream area Df in the above series of processing, and the same is implemented. When changing the height position of the upstream head 42, the downstream head 44 is replaced with the upstream head 42, the first downstream area Df is replaced with the first upstream area Uf, and the second downstream area Dr is replaced with the second upstream area Ur, and the same is implemented.

[0093] [Allocation determination processing] Figure 5This is a flowchart showing the allocation decision process of the embodiment. The control device 90 of the mounting device 10 executes the Figure 5 processing of the flowchart shown. Figure 5 The allocation decision process shown starts Figure 3 before the mounting process shown and is executed when producing the production program.

[0094] Figure 5 The allocation decision process shown is used to determine which numbered electronic component C the upstream head 42 mounts to in the upstream area DU and which numbered electronic component C the downstream head 44 mounts starting from in the downstream area DD when mounting a plurality of electronic components C on a single substrate P as the object of the mounting process. After setting information such as the type and size of the electronic components C mounted on the substrate P, the mounting coordinate positions, and the order, Figure 5 the process shown starts automatically or by receiving a predetermined operation from the operator, for example.

[0095] The control device 90 extracts the allocation pattern of the electronic components C (step SC1).

[0096] The control device 90 sets the execution count i to i = 1 and starts the loop process (step SC2). In the loop process, the processes from step SC3 to step SC7 are repeatedly executed n times while i ≤ n holds. Additionally, n is the number of allocation patterns extracted in step SC1.

[0097] The control device 90 extracts the combination pattern of the initial heights of the upstream head 42 and the downstream head 44 in the i-th allocation pattern (step SC3).

[0098] The control device 90 sets the execution count j to j = 1 and starts the loop process (step SC4). In the loop process, the process of step SC5 is repeatedly executed m times while j ≤ m holds. Additionally, m is the number of combination patterns of the initial heights extracted in step SC3.

[0099] The control device 90 calculates the time required for the upstream head 42 to mount all the electronic components C to be allocated on a single substrate P for the j-th combination pattern in the n-th allocation pattern. Additionally, in order for the upstream head 42 to prevent the held electronic components C from interfering with the substrate P, etc., the height position does not decrease during the period until all the allocated electronic components C are mounted on a single substrate P.

[0100] Similarly, the control device 90 calculates the time required until all the electronic components C to be assigned to the downstream head 44 are mounted on one substrate P after a predetermined number of electronic components C have been mounted on the substrate P by the upstream head 42 for the j-th combination pattern in the n-th assignment pattern. In addition, the downstream head 44 raises its height position so as not to interfere with the substrate P or the like, and does not lower during the period until all the assigned electronic components C are mounted on one substrate P.

[0101] The control device 90 calculates the beat difference between the upstream head 42 and the downstream head 44 based on the calculated required time for the j-th combination pattern in the n-th assignment pattern (step SC5).

[0102] The control device 90 resets the execution count j to j = j + 1 again in the loop process and returns to step SC5. If the process of step SC5 is executed m times and the beat differences between the upstream head 42 and the downstream head 44 are calculated for the m combination patterns extracted in step SC3, the loop process ends (step SC6).

[0103] In the loop process from step SC4 to step SC6, the control device 90 calculates and stores the beat difference for each of the m combination patterns. The control device 90 calculates the average value of the absolute values of the beat differences of the m combination patterns for the i-th assignment pattern (step SC8).

[0104] The control device 90 resets the execution count i to i = i + 1 again in the loop process and returns to step SC3. If the processes from step SC3 to step SC7 are executed n times and the average value of the absolute values of the beat differences is calculated for the n assignment patterns extracted in step SC1, the loop process ends (step SC8).

[0105] In the loop process from step SC2 to step SC8, the control device 90 calculates and stores the average value of the absolute values of the beat differences for each of the n assignment patterns. The control device 90 determines the assignment pattern as the assignment pattern with the smallest average value of the absolute values of the beat differences among the n assignment patterns (step SC9). The control device 90 generates a production program for mounting the electronic components C on the substrate P by the upstream head 42 and the downstream head 44 based on the assignment pattern determined in the Figure 5 processing of the shown flowchart.

[0106] [Effect] As described above, according to the present embodiment, the cycle time difference is calculated for a plurality of combination patterns in which the initial heights of the upstream head 42 and the downstream head 44 are above the lowest height within a producible range that does not interfere with the substrate P during the mounting process. Further, the distribution pattern of the electronic components C is determined such that the average value of the absolute value of the cycle time difference or the value obtained by multiplying the absolute value by a predetermined weighting coefficient is minimized in each combination pattern. Thus, considering also the possibility that the other substrate conveying device 20 has large electronic components C and the mounting head 40 operates at a position higher than expected, the distribution pattern of the electronic components C is determined, and thus a significant increase in the cycle time due to changes in the cycle time difference can be suppressed.

[0107] [Other Embodiments] The embodiments of the present application have been described above, but the present invention is not limited to the contents of these embodiments. The above-described embodiments and modifications can be appropriately combined within a range where the processing contents do not conflict. In addition, the foregoing constituent elements include constituent elements that are easily conceivable by those skilled in the art, substantially identical constituent elements, and constituent elements within the so-called equivalent range. Further, the foregoing constituent elements can be appropriately combined. Furthermore, various omissions, substitutions, or changes of the constituent elements can be made without departing from the gist of the foregoing embodiments.

[0108] For example, all or part of the processes described as automatic processes in the above-described embodiments can also be performed manually, or all or part of the processes described as manual processes can also be performed automatically by a known method. In addition, except in the case of special description, the processing steps, specific names, and information including various data and / or parameters shown in the above description and drawings can be arbitrarily changed. For example, the various information shown in each figure is not limited to the information shown in the figure.

[0109] In addition, each constituent element of each device shown in the drawings is a functionally conceptual constituent element, and does not necessarily have to be physically configured as shown in the drawings. That is, the specific manner of dispersion and combination of each device is not limited to the manner shown in the drawings, and all or part of them can be functionally or physically dispersed and combined in any unit according to various loads, usage conditions, etc. In addition, the above-described control device 90 may be constituted by a plurality of computers divided into several functions, may exist separately via a network, and several functions of the computer may also be possessed by a cloud server that executes various functions in a cloud computing manner. In addition, the program can also be sent to the control device 90 via a network. Explanation of Reference Numerals

[0110] 10: Mounting device, 12: Base member, 14: VCS unit, 16: Replacement nozzle holding mechanism, 18: Component storage section, 20: Substrate conveying device, 22: First substrate conveying device, 24: Second substrate conveying device, 26: Guide member, 28: Conveyor belt, 30, 32f, 32r, 34f, 34r: Component supply device, 36: Tape feeder, 40: Mounting head, 40a: Housing, 42: Upstream head, 44: Downstream head, 46: Nozzle, 46a: Opening, 46b: Shaft, 48: Nozzle drive section, 50, 50D, 50U: Head moving device, 60: X-axis moving device, 62: X-axis guide member, 64: X-axis sliding member, 70: Y-axis moving device, 72: Y-axis guide member, 74: Y-axis sliding member, 80: Z-axis moving device, 82: Z-axis guide member, 84: Z-axis sliding member, 90: Control device, P: Substrate, C: Electronic component, DM: Mounting area, Df: First downstream area, Dr: Second downstream area, SM: Supply area, Uf: First upstream area, Ur: Second upstream area.

Claims

1. An installation device, characterized in that, Comprising: A plurality of substrate conveying devices, arranged in parallel, for conveying substrates in a conveying direction; A first mounting head, in an upstream region of the conveying direction, for mounting electronic components on each substrate conveyed by the plurality of substrate conveying devices; A second mounting head, in a downstream region of the conveying direction, for further mounting electronic components on the substrate after the electronic components are mounted by the first mounting head; A head moving device, for moving the first mounting head and the second mounting head horizontally across the plurality of substrate conveying devices and periodically changing the height position; And A control device, for controlling each part, The control device extracts a distribution pattern of which of the first mounting head and the second mounting head mounts each of the plurality of electronic components mounted on one substrate; The control device extracts, for each of the distribution patterns, a combination pattern of the initial height of the first mounting head and the initial height of the second mounting head when starting the mounting process on one substrate; The control device calculates the absolute value of the cycle time difference between the first mounting head and the second mounting head in each of the combination patterns; Based on the calculated absolute values, the control device regards a certain distribution pattern as a distribution pattern with an optimized cycle time difference and determines it as the distribution pattern to be executed.

2. The mounting device according to claim 1, characterized in that The control device regards the distribution pattern with the smallest average value obtained by averaging the calculated absolute values in all the combination patterns as the distribution pattern with an optimized cycle time difference.

3. The mounting device according to claim 1, characterized in that The control device regards the distribution pattern with the smallest average value obtained by averaging the values obtained by multiplying the calculated absolute values by a predetermined weight coefficient in all the combination patterns as the distribution pattern with an optimized cycle time difference.

4. A control method for a mounting device, the mounting device comprising: A plurality of substrate conveying devices, arranged in parallel, for conveying substrates in a conveying direction; A first mounting head, in an upstream region of the conveying direction, for mounting electronic components on each substrate conveyed by the plurality of substrate conveying devices; A second mounting head, in a downstream region of the conveying direction, for further mounting electronic components on the substrate after the electronic components are mounted by the first mounting head; And A head moving device, for moving the first mounting head and the second mounting head horizontally across the plurality of substrate conveying devices and periodically changing the height position, The control method for the mounting device is characterized by comprising: Extracting a distribution pattern of which of the first mounting head and the second mounting head mounts each of the plurality of electronic components mounted on one substrate; For each of the distribution patterns, extracting a combination pattern of the initial height of the first mounting head and the initial height of the second mounting head when starting the mounting process on one substrate; Calculating the absolute value of the cycle time difference between the first mounting head and the second mounting head in each of the combination patterns; And Based on the calculated absolute values, regarding a certain distribution pattern as a distribution pattern with an optimized cycle time difference and determining it as the distribution pattern to be executed.

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