Display panel and electronic equipment

Abstract

The invention provides a display panel and electronic equipment, the display panel comprises a display area and a non-display area, and the display panel comprises a substrate; the isolation layer is located on one side of the substrate and comprises a first isolation structure located in the non-display area and a second isolation structure located in the display area, the second isolation structure comprises a plurality of isolation openings arranged at intervals, and the first isolation structure is arranged along the edge of the display panel; the isolation layer comprises a supporting part and a shielding part which are stacked in the direction away from the substrate, and the shielding part in the first isolation structure extends out relative to the supporting part to form a first eave structure; the light-emitting devices are located in the corresponding isolation openings; and the packaging layer is located on one side, far away from the substrate, of the light-emitting device and the isolation layer, and at least part of the packaging layer wraps the first eave structure. Therefore, the bonding strength of the packaging layer at the edge of the display panel and the first isolation structure can be improved, the risk of film layer stripping of the packaging layer is reduced, and the packaging effectiveness of the edge of the display panel is ensured.

Description

Technical Field

[0001] This application relates to the field of display technologies, and more particularly, to a display panel and an electronic device. Background Art

[0002] Flat panel display devices based on technologies such as Organic Light Emitting Diode (OLED) and Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptop computers, and desktop computers due to their advantages of high image quality, power saving, thin body, and wide application range, and have become the mainstream in display devices. In the process of manufacturing traditional display panels, the light-emitting pixel patterning is usually achieved through a Fine Metal Mask (FMM). The FMM technology is mature and has rich mass production experience. However, the FMM technology also has problems such as limited precision, high development cost, and long development cycle. The fine metal maskless technology eliminates the limitations of the traditional OLED process on the display screen size, resolution, and other screen body performances, and has the advantages of high performance, full-domain size, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, CN118781966A record the relevant content of the fine metal maskless technology for reference.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] In order to overcome the above deficiencies in the prior art, an object of this application is to provide a display panel. The display panel includes a display area and at least a part of a non-display area surrounding the display area. The display panel includes: A substrate; An isolation layer on one side of the substrate. The isolation layer includes a first isolation structure in the non-display area and a second isolation structure in the display area. The second isolation structure includes a plurality of spaced apart isolation openings. The first isolation structure is arranged along the edge of the display panel; the isolation layer includes a support part and a shielding part stacked in a direction away from the substrate. In a direction parallel to the substrate, the shielding part in the first isolation structure protrudes compared to the support part to form a first eaves structure; A plurality of light-emitting devices, and the light-emitting devices are located in the corresponding isolation openings; A packaging layer located on the side of the light-emitting device and the isolation layer away from the substrate, at least a part of the packaging layer extends to the non-display area, and at least a part of the packaging layer wraps the first eaves structure.

[0005] In some possible implementation manners, the packaging layer includes a first packaging sub-layer, a second packaging sub-layer, and a third packaging sub-layer that are stacked in a direction away from the substrate. At least a part of the first packaging sub-layer wraps the first eaves structure; Preferably, the materials of the first packaging sub-layer and the third packaging sub-layer include inorganic materials, and the material of the second packaging sub-layer includes organic materials.

[0006] In some possible implementation manners, the first packaging sub-layer includes a plurality of pixel packaging units located in the display area and edge packaging units at least partially located in the non-display area; the plurality of pixel packaging units are respectively located on the side of the corresponding light-emitting device away from the substrate, and at least a part of the edge packaging units extends to the non-display area and wraps the first eaves structure; Preferably, the display panel includes light-emitting devices with at least two different light-emitting colors, and the edge packaging units and the pixel packaging units corresponding to the light-emitting devices of at least one light-emitting color are arranged on the same layer and have the same material; Preferably, in a direction parallel to the substrate, the shielding portion in the second isolation structure protrudes relative to the supporting portion to form a second eaves structure, and the pixel packaging unit wraps at least a part of the second eaves structure.

[0007] In some possible implementation manners, the display panel further includes at least one dam structure located in the non-display area, and the dam structure surrounds at least a part of the edge of the display panel; the first isolation structure is located on the side of at least one dam structure close to the display area or on the side of at least one dam structure away from the display area.

[0008] In some possible implementation manners, the first isolation structure is located on the side of the dam structure close to the display area, and the orthographic projection of the first isolation structure on the substrate is located within the orthographic projection of the second packaging sub-layer on the substrate; at least a part of the second packaging sub-layer and at least a part of the third packaging sub-layer are located on the side of the first isolation structure away from the substrate; Preferably, the second packaging sub-layer covers the surface of the first isolation structure away from the substrate and the side wall surface of the first isolation structure away from the display area.

[0009] In some possible implementation manners, the first isolation structure is located on a side of the dam structure close to the display area, a positive projection of the second encapsulation sub-layer on the substrate is located on a side of a positive projection of the first isolation structure on the substrate close to the display area, the first encapsulation sub-layer and the third encapsulation sub-layer are in contact with each other on at least a part of a side of the first isolation structure away from the substrate and on a side of the first isolation structure away from the display area, and wrap the first eaves structure on the side of the first isolation structure away from the display area; Preferably, the first encapsulation sub-layer covers a surface of the first isolation structure away from the substrate.

[0010] In some possible implementation manners, the first isolation structure is located on a side of the dam structure away from the display area, a positive projection of the second encapsulation sub-layer on the substrate is located on a side of a positive projection of the dam structure on the substrate close to the display area, the first encapsulation sub-layer and the third encapsulation sub-layer are in contact with each other on a side of the dam structure away from the display area and extend to the first isolation structure to wrap the first eaves structure; Preferably, the first encapsulation sub-layer covers a surface of the first isolation structure away from the substrate.

[0011] In some possible implementation manners, the first isolation structure is arranged in a continuous ring shape along an edge of the display panel, and at least two of the first isolation structures are arranged side by side along the edge of the display panel; Preferably, a distance between two adjacent first isolation structures is greater than or equal to 31 micrometers.

[0012] In some possible implementation manners, a distance between an edge of a positive projection of the shielding part on the substrate and an edge of a positive projection of the supporting part on the substrate is greater than or equal to 500 nanometers.

[0013] In some possible implementation manners, in a direction away from the substrate, a thickness of the supporting part is greater than or equal to 2.5 micrometers.

[0014] In some possible implementation manners, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode that are stacked in a direction away from the substrate, the second isolation structure has conductivity, and the second electrode is in contact with the second isolation structure.

[0015] In some possible implementation manners, the display panel includes a pixel defining layer located between the second isolation structure and the substrate, the pixel defining layer includes a plurality of pixel openings, and a positive projection of the pixel opening on the substrate is located within a positive projection of the isolation opening on the substrate.

[0016] In some possible implementations, the second isolation structure layer further includes a receiving portion, a positive projection of the supporting portion on the substrate is located within a positive projection of the receiving portion on the substrate, and the positive projection of the receiving portion on the substrate is located within a positive projection of the shielding portion on the substrate; Preferably, the material of the receiving portion includes molybdenum, and / or the material of the supporting portion includes aluminum, and / or the material of the shielding portion includes titanium.

[0017] Another object of the present application is to provide a display panel, the display panel includes a display area and at least a part of a non-display area surrounding the display area, and the display panel includes: A substrate; An isolation layer located on one side of the substrate, the isolation layer includes a first isolation structure located in the non-display area and a second isolation structure located in the display area, the second isolation structure includes a plurality of spaced apart isolation openings, and the first isolation structure is disposed along an edge of the display panel; a positive projection of a side of the first isolation structure close to the substrate on the substrate is located within a positive projection of a side of the first isolation structure away from the substrate on the substrate; A plurality of light-emitting devices, the light-emitting devices are located in the corresponding isolation openings; A packaging layer located on a side of the light-emitting device and the isolation layer away from the substrate, at least a part of the packaging layer extends to the non-display area, and at least a part of the packaging layer wraps the first isolation structure.

[0018] Another object of the present application is to provide an electronic device, the electronic device includes the display panel provided by the present application, or the electronic device includes a display panel manufactured by the manufacturing method of the display panel provided by the present application.

[0019] Compared with the prior art, the present application has the following beneficial effects: The present application provides a display panel and an electronic device. In a display panel having a second isolation structure in a display area, a first isolation structure disposed on the same layer as the second isolation structure is disposed at an edge of the display panel, and an eaves structure of the first isolation structure is wrapped by a packaging layer to form a nested structure. In this way, the adhesion strength between the packaging layer and the first isolation structure at the edge of the display panel can be improved, the risk of film layer peeling of the packaging layer can be reduced, and the packaging effectiveness at the edge of the display panel can be ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0021] Figure 1 One of the regional schematic diagrams of the display panel provided by the present application; Figure 2 One of the cross-sectional schematic diagrams of the display panel provided by the present application; Figure 3 Another cross-sectional schematic diagram of the display panel provided by the present application; Figure 4 Another cross-sectional schematic diagram of the display panel provided by the present application; Figure 5 Another cross-sectional schematic diagram of the display panel provided by the present application; Figure 6 The cross-sectional schematic diagram of the pixel driving circuit provided by the present application; Figure 7 The equivalent circuit schematic diagram of the pixel driving circuit provided by the present application; Figure 8 Another regional schematic diagram of the display panel provided by the present application; Figure 9 Another cross-sectional schematic diagram of the display panel provided by the present application; Figure 10 Another cross-sectional schematic diagram of the display panel provided by the present application; Figure 11 The schematic diagram of the isolation structure provided by the present application; Figure 12 The schematic diagram of the light-emitting functional layer provided by the present application; Figure 13 Another cross-sectional schematic diagram of the display panel provided by the present application; Figure 14 Another cross-sectional schematic diagram of the display panel provided by the present application; Figure 15 Another cross-sectional schematic diagram of the display panel provided by the present application; Figure 16 Another cross-sectional schematic diagram of the display panel provided by the present application; Figure 17 The step flow schematic diagram of the manufacturing method of the display panel provided by the present application; Figure 18 The schematic diagram of the electronic device provided by the present application.

[0022] Icons: 111-substrate; 112-array functional layer; 120-first electrode; 130-pixel defining layer; 610-first isolation structure; 620-second isolation structure; 601-supporting portion; 602-shielding portion; 603-receiving portion; 810-light-emitting device; 811-first light-emitting device; 812-second light-emitting device; 813-third light-emitting device; 910-isolation opening; 150-light-emitting functional layer; 160-second electrode; 500-encapsulation layer; 510-first encapsulation sublayer; 520-second encapsulation sublayer; 530-third encapsulation sublayer; 511-edge encapsulation Unit; 512-pixel packaging unit; DAM-dam structure; DAM1-first dam; DAM2-second dam; AA-display area; NA-non-display area; 112D-pixel driving circuit; PX-pixel; SPX-sub-pixel; SPX1-first sub-pixel; SPX2-second sub-pixel; SPX3-third sub-pixel; T1-driving transistor; T2-data transistor; Cst-storage capacitor; HIL-hole injection layer; HTL-hole transport layer; EBL-electron blocking layer; EML-luminescent material layer; HBL-hole blocking layer; ETL-electron transport layer. DETAILED DESCRIPTION

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0024] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0025] It should be noted that similar reference numerals and letters represent similar items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined or explained in subsequent figures. It should be noted that different features in the embodiments of the present application can be combined with each other without conflict.

[0026] For easy understanding, the X-axis, Y-axis, and Z-axis orthogonal to each other are shown in the accompanying drawings. The direction along the X-axis is called the X direction, the direction along the Y-axis is called the Y direction, and the direction along the Z-axis is called the Z direction. The Z direction is the normal direction with respect to the plane including the X direction and the Y direction. In addition, the case of observing various elements parallel to the plane including the X direction and the Y direction is called a top view. Or the plane of the X direction and the Y direction is a plane parallel to the display surface of the display panel, and the Z direction is a direction parallel to the thickness direction of the display panel.

[0027] For some elements, sometimes terms such as "above" or "upper" are used when describing the position of elements located in the Z direction, and terms such as "below" or "lower" are used when describing the position of elements located in the opposite direction. In addition, when using terms such as "above", "upper", "below", "lower", "relative", etc. to define the positional relationship between two elements, it includes not only the state where the above two elements are directly in contact, but also the state where the above two elements are separated by a gap or other elements. In addition, terms such as "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0028] In some related display panels, an encapsulation layer is provided in the display panel to prevent water vapor from invading the organic light-emitting layer. The encapsulation layer usually extends from the display area to the non-display area surrounding the display area and extends to the edge of the display panel.

[0029] Through the research of the inventor, it is found that in some such display panels, when the edge is impacted (such as a drop impact), film layer peeling (peeling) may occur between the encapsulation layer located at the edge of the display panel and other film layers it covers, and water vapor invades the organic light-emitting layer along the gap between the film layers, which may cause damage to the organic light-emitting layer and black spot defects.

[0030] In view of this, this embodiment provides a solution that can reduce the risk of film layer peeling of the encapsulation layer at the edge of the display panel. The solution provided in this embodiment will be elaborated in detail below.

[0031] Please refer to Figure 1 , Figure 1 which is a schematic structural diagram of a display panel provided in this embodiment. The display panel can be an organic light-emitting diode display panel (Organic Light Emitting Diode, abbreviated as OLED), a quantum dot light-emitting diode display panel (Quantum Dot Light Emitting Diodes, abbreviated as QLED). The display panel includes a display area AA with a display function and a non-display area NA.

[0032] The shape of the display area AA of the display panel can be rectangular, or can be other shapes such as square, circular or oval, and is not specifically limited in this embodiment.

[0033] The display area AA includes a plurality of pixels PX arranged in the X direction and the Y direction. The pixel PX includes a plurality of sub-pixels SPX that display different colors. In some embodiments, the pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel, the second sub-pixel SPX2 is a green sub-pixel SPX2, and the third sub-pixel SPX3 is a red sub-pixel SPX3. In some embodiments, in addition to the sub-pixels SPX1, SPX2, and SPX3, the pixel PX further includes a sub-pixel SPX that emits white or other color light.

[0034] The sub-pixel SPX includes a pixel driving circuit 310 and a light-emitting device 810 that is driven by the pixel driving circuit to emit light of a corresponding color. The first sub-pixel SPX1 includes a first light-emitting device 811, the second sub-pixel SPX2 includes a second light-emitting device 812, and the third sub-pixel SPX3 includes a third light-emitting device 813. One pixel driving circuit 310 drives at least one light-emitting device 810 to emit light. For example, the display area AA includes a normal display area and a light-transmissive display area. The light-transmissive display area is a display area corresponding to a sensor and having light-transmissive performance, and the normal display area is a display area not corresponding to a sensor. In the normal display area, one pixel driving circuit drives one light-emitting device 810 to emit light, and in the light-transmissive display area, one pixel driving circuit drives one or more light-emitting devices 810 to emit light.

[0035] Please refer to Figures 2 to 5 , Figures 2 to 5 which is a cross-sectional schematic diagram of the display panel provided in this embodiment. The display panel provided in this embodiment may include a substrate 111, an isolation layer, a light-emitting device 810, and a packaging layer 500.

[0036] In this embodiment, the material of the substrate 111 may include a rigid material, such as glass; or, the material of the substrate 111 may include a flexible material, such as polyimide (Pi).

[0037] Optionally, an array functional layer 112 may be further provided on one side of the substrate 111. The array functional layer 112 may include a plurality of film layer structures, such as a buffer layer, an active layer, a plurality of conductive layers, a plurality of insulating layers, and a planarization layer, etc. Please refer to Figure 6, multiple film layer structures of the array functional layer 112 can form multiple thin film transistors (TFTs) and wiring structures at different positions, and the thin film transistors can cooperate with each other to form multiple pixel driving circuits 112D.

[0038] In addition, the array functional layer 112 further includes at least one of the following traces: a trace for transmitting the data signal Data, a trace for transmitting the scan number Scan, a trace for transmitting the driving voltage VDD, a trace for transmitting the common voltage VSS, etc.

[0039] Please refer to Figure 7 , the pixel driving circuit 110D includes a driving transistor T1 and a data transistor T2. The source of the data transistor T2 is connected to the data line that provides the data signal Data. The gate of the data transistor T2 is connected to the scan line that provides the scan signal Scan. The drain of the data transistor T2 is connected to the gate of the driving transistor T1. Both ends of the storage capacitor Cst are respectively connected to the gate and the source of the driving transistor T1. The drain of the driving transistor T1 is connected to the light-emitting device 810. Figure 7 is an embodiment of the pixel driving circuit 110D. The pixel driving circuit 110D of the present application is not limited to Figure 7 the 2T1C pixel driving circuit shown, and can also be other pixel driving circuits, such as 7T1C, 8T1C pixel driving circuits, etc.

[0040] The isolation layer is located on one side of the substrate 111. For example, the isolation layer is located on the side of the array functional layer 112 away from the substrate 111. The isolation layer includes a second isolation structure 620 located in the display area AA and a first isolation structure 610 located in the non-display area NA. The second isolation structure 620 includes a plurality of spaced apart isolation openings 910. The first isolation structure 610 is arranged along the edge of the display panel. That is, the plurality of isolation openings 910 are located in the display area AA.

[0041] In this embodiment, the second isolation structure 620 and the first isolation structure 610 are provided on the same layer and have the same material.

[0042] The isolation layer includes a support portion 601 and a shielding portion 602 that are stacked in a direction away from the substrate 111. In a direction parallel to the substrate 111, the shielding portion 602 in the first isolation structure 610 protrudes compared to the support portion 601 to form a first eaves structure. For example, the orthographic projection of the support portion 601 in the first isolation structure 610 on the substrate 111 is located within the orthographic projection of the shielding portion 602 on the substrate 111. That is, the support portion 601 in the first isolation structure 610 is retracted compared to the shielding portion 602 to form an undercut structure.

[0043] Multiple light-emitting devices 810 are respectively located within corresponding isolation openings 910. That is, in this embodiment, the light-emitting devices 810 are located in the display area AA and within the isolation openings 910 formed by the second isolation structure 620.

[0044] The encapsulation layer 500 is located on the side of the light-emitting devices 810 and the isolation layer away from the substrate 111. At least a part of the encapsulation layer 500 extends to the non-display area NA, and at least a part of the encapsulation layer 500 wraps the first eaves structure.

[0045] The multiple isolation openings 910 include multiple first isolation openings, multiple second isolation openings, and multiple third isolation openings.

[0046] Multiple light-emitting devices 810 are located on one side of the substrate 111, and the multiple light-emitting devices 810 include multiple first light-emitting devices 811, multiple second light-emitting devices 812, and multiple third light-emitting devices 813. The first light-emitting devices 811 are arranged corresponding to the first isolation openings, the second light-emitting devices 812 are arranged corresponding to the second isolation openings, and the third light-emitting devices 813 are arranged corresponding to the third isolation openings. The first light-emitting devices 811, the second light-emitting devices 812, and the third light-emitting devices 813 can emit light of different colors respectively.

[0047] In one embodiment, one light-emitting device 810 is arranged corresponding to one isolation opening 910. For example, the first light-emitting devices 811 are arranged in one-to-one correspondence with the first isolation openings, the second light-emitting devices 812 are arranged in one-to-one correspondence with the second isolation openings, and the third light-emitting devices 813 are arranged in one-to-one correspondence with the third isolation openings. At least a part of the first light-emitting devices 811 is disposed within the corresponding first isolation openings, at least a part of the second light-emitting devices 812 is disposed within the corresponding second isolation openings, and at least a part of the third light-emitting devices 813 is disposed within the corresponding third isolation openings.

[0048] In another embodiment, multiple light-emitting devices 810 are arranged corresponding to one isolation opening 910. For example, multiple light-emitting devices 810 with the same emission color are arranged corresponding to one isolation opening 910.

[0049] Based on the above design, in the display panel provided by the present application, a first isolation structure 610 is provided on the edge of the display panel and is arranged on the same layer as the second isolation structure 620, and the encapsulation layer 500 wraps the eaves structure of the first isolation structure 610 to form a nested structure. In this way, the adhesion strength between the encapsulation layer 500 and the first isolation structure 610 at the edge of the display panel can be improved, the risk of film peeling of the encapsulation layer 500 can be reduced, and the encapsulation effectiveness at the edge of the display panel can be ensured.

[0050] In some possible implementation manners, the encapsulation layer 500 includes a first encapsulation sub-layer 510, a second encapsulation sub-layer 520, and a third encapsulation sub-layer 530 that are stacked in a direction away from the substrate 111. At least a part of the first encapsulation sub-layer 510 wraps the first eaves structure.

[0051] Optionally, according to the setting position of the first isolation structure 610, the second encapsulation sub-layer 520 and the third encapsulation sub-layer 530 may also wrap the first eaves structure in some cases.

[0052] Optionally, the materials of the first encapsulation sub-layer 510 and the third encapsulation sub-layer 530 include inorganic materials. For example, the materials of the first encapsulation sub-layer 510 and the third encapsulation sub-layer 530 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON).

[0053] The material of the second encapsulation sub-layer 520 includes organic materials. For example, the material of the second encapsulation sub-layer 520 includes resin materials such as epoxy resin and acrylic resin.

[0054] The first encapsulation sub-layer 510 and the third encapsulation sub-layer 530 can be formed by chemical vapor deposition (CVD), and the second encapsulation sub-layer 520 can be formed by ink-jet printing (IJP). The second encapsulation sub-layer 520 and the third encapsulation sub-layer 530 are at least continuously provided over the entire display area AA, and a part of them is also provided in the border area NA.

[0055] Among them, the second encapsulation sub-layer 520 can have a certain fluidity during the setting process. The second encapsulation sub-layer 520 can fill the height difference formed by the pixel encapsulation unit 512, the second isolation unit 620, and the isolation opening 920, and achieve planarization to a certain extent.

[0056] In some possible implementation manners, the first encapsulation sub-layer 510 includes a plurality of pixel encapsulation units 512 located in the display area AA and edge encapsulation units 511 at least partially located in the non-display area. The plurality of pixel encapsulation units 512 are respectively located on the side of the corresponding light-emitting device 810 away from the substrate 111, and at least a part of the edge encapsulation units 511 extends to the non-display area NA and wraps the first eaves structure.

[0057] Optionally, the display panel includes at least two light-emitting devices 810 with different light-emitting colors. Among them, the pixel encapsulation units 512 corresponding to different light-emitting devices 810 can be formed in different manufacturing steps. The edge encapsulation unit 511 and the pixel encapsulation units 512 corresponding to the light-emitting devices 810 of at least one light-emitting color are arranged on the same layer and have the same material, that is, the edge encapsulation unit 511 and the pixel encapsulation units 512 corresponding to the light-emitting devices 810 of at least one light-emitting color are formed in the same manufacturing step. For example, the pixel encapsulation units 512 corresponding to the light-emitting devices 810 of at least one color can extend to the non-display area NA to form the edge encapsulation unit 511.

[0058] At least part of the pixel encapsulation unit 512 is located on the side of the light-emitting device 810 away from the substrate. For example, at least part of the pixel encapsulation unit 512 is located on the side of the second electrode 160 away from the substrate. At least another part of the pixel encapsulation unit 512 passes through the side wall of the second isolation structure 620 and extends to the side of the second isolation structure 620 away from the substrate 111. The plurality of pixel encapsulation units 512 include a plurality of first pixel encapsulation units corresponding to a plurality of first light-emitting devices 811, a plurality of second pixel encapsulation units corresponding to a plurality of second light-emitting devices 812, and a plurality of third pixel encapsulation units corresponding to a plurality of third light-emitting devices 813. The first pixel encapsulation unit is located on the side of the corresponding first light-emitting device 811 away from the substrate 111, the second pixel encapsulation unit is located on the side of the corresponding second light-emitting device 812 away from the substrate 111, and the third pixel encapsulation unit is located on the side of the corresponding third light-emitting device 813 away from the substrate 111.

[0059] Optionally, there is a gap between adjacent pixel encapsulation units 512, and the gap can be located on the side of the isolation structure between adjacent isolation openings away from the substrate.

[0060] Optionally, in the direction parallel to the substrate 111, the shielding portion 602 in the second isolation structure 620 protrudes compared with the supporting portion 601 to form a second eaves structure, and the pixel encapsulation unit 512 wraps at least part of the second eaves structure. That is, at least part of the pixel encapsulation unit 512 is located within the corresponding isolation opening 910, and at least another part extends along the side wall of the second isolation structure 620 facing the isolation opening 910 to the side of the second isolation structure 620 away from the substrate 111, so as to wrap at least part of the second eaves structure formed by the shielding portion 602 of the second isolation structure 620.

[0061] In some possible implementations, the display panel further includes at least one dam structure DAM located in the non-display area NA, and the dam structure DAM is disposed around at least a part of the edge of the display panel. Optionally, the dam structure DAM may be formed by laminating partial film layers in the array functional layer 112. For example, it may be formed by laminating a partial planarization layer and a partial conductive layer. The dam structure DAM can be used to prevent the second encapsulation sub-layer 520 with a certain fluidity during the manufacturing process from spreading and overflowing the edge of the display panel.

[0062] The first isolation structure 610 is located on one side of at least one dam structure DAM close to the display area AA or on one side of at least one dam structure DAM far from the display area AA. Among them, according to the different relative positions of the first isolation structure 610 and the dam structure DAM, the covering relationship of each sub-layer in the encapsulation layer 500 to the first isolation structure 610 may be different.

[0063] In some possible implementations, please refer to Figure 3 , the first isolation structure 610 is located on the side of the dam structure DAM close to the display area AA. For example, the dam structure DAM may include a first dam DAM1 and a second dam DAM2 located on the side of the first dam DAM1 far from the display area AA. The first dam DAM1 and the second dam DAM2 are arranged in parallel and both extend along the edge of the display panel. The first isolation structure 610 may be located on the side of the first dam DAM1 close to the display area AA.

[0064] The orthographic projection of the first isolation structure 610 on the substrate 111 is located within the orthographic projection of the second encapsulation sub-layer 520 on the substrate 111. At least a part of the second encapsulation sub-layer 520 and at least a part of the third encapsulation sub-layer 530 are located on the side of the first isolation structure 610 far from the substrate 111.

[0065] For example, when forming the relatively thin first encapsulation sub-layer 510, the first encapsulation sub-layer 510 may wrap the first isolation structure 610 along the outer contour of the first isolation structure 610, that is, wrap the first eaves structure. In this way, the first encapsulation sub-layer 510 and the first eaves structure form an interlocking structure, improving the bonding strength between the first encapsulation sub-layer 510 and the first isolation structure 610. Among them, the first encapsulation sub-layer 510 also continues to extend to cover the dam structure DAM and extend to the edge of the display panel.

[0066] Then, when setting the relatively thick second encapsulation sub-layer 520, the second encapsulation sub-layer 520 may spread over the first isolation structure 610 and extend to the dam structure DAM and be blocked by the dam structure DAM. In this way, the second encapsulation sub-layer 520 will fill the undercut structure jointly formed by the first isolation structure 610 and the first encapsulation sub-layer 510 attached to the first isolation structure 610, thereby improving the bonding strength between the second encapsulation sub-layer 520 and the first encapsulation sub-layer 510.

[0067] Then, a third encapsulation sub-layer 530 is formed on the side of the second encapsulation sub-layer 520 away from the substrate 111. The third encapsulation sub-layer 530 extends from the display area AA to cover the dam structure DAM in the non-display area NA and extends to the edge of the display panel. Among them, on at least part of the dam structure DAM and on the side of the dam structure DAM away from the display area AA, the third encapsulation sub-layer 530 formed of an inorganic material contacts and adheres to the first encapsulation sub-layer 510. That is, on the side of the dam structure DAM away from the display area AA, the first encapsulation sub-layer 510 and the third encapsulation sub-layer 530 are mutually attached, so as to block the intrusion of moisture between the first encapsulation sub-layer 510 and the third encapsulation sub-layer 530.

[0068] Among them, the second encapsulation sub-layer 520 covers the surface of the first isolation structure 610 away from the substrate 111 and the side wall surface of the first isolation structure 610 away from the display area AA.

[0069] In some possible implementation manners, please refer to Figure 4 , the first isolation structure 610 is located on the side of the dam structure DAM close to the display area AA, and the orthographic projection of the second encapsulation sub-layer 520 on the substrate 111 is located on the side of the orthographic projection of the first isolation structure 610 on the substrate 111 close to the display area AA.

[0070] For example, the existing dam structure DAM includes two juxtaposed dams, and in this embodiment, one of the dams can be replaced by the first isolation structure 610. The first isolation structure 610 blocks the second encapsulation sub-layer 520 from spreading to the edge of the display panel.

[0071] In this case, when forming the relatively thin first encapsulation sub-layer 510, the first encapsulation sub-layer 510 can wrap the first isolation structure 610 along the outer contour of the first isolation structure 610, that is, wrap the first eaves structure. In this way, the first encapsulation sub-layer 510 and the first eaves structure form an interlocking structure, improving the adhesion strength between the first encapsulation sub-layer 510 and the first isolation structure 610. Among them, the first encapsulation sub-layer 510 also continues to extend to cover the dam structure DAM and extends to the edge of the display panel.

[0072] After forming the third encapsulation sub-layer 530, the first encapsulation sub-layer 510 and the third encapsulation sub-layer 530 contact each other and wrap the first eaves structure on the side of the first isolation structure 610 away from the display area AA on at least part of the first isolation structure 610. In this way, the adhesion strength between the first encapsulation sub-layer 510, the third encapsulation sub-layer 530 and the first isolation structure 610 is improved, and the intrusion of moisture between the first encapsulation sub-layer 510 and the third encapsulation sub-layer 530 can be blocked.

[0073] For some possible implementations, see Figure 5 The first isolation structure 610 is located on a side of the dam structure DAM away from the display area AA. For example, the dam structure DAM may include a first dam DAM1 and a second dam DAM2 located on a side of the first dam DAM1 away from the display area AA. The first dam DAM1 and the second dam DAM2 are arranged side by side and both extend along the edge of the display panel. The first isolation structure 610 may be located on a side of the second dam DAM2 away from the display area AA and may be arranged side by side with the first dam DAM1 and the second dam DAM2.

[0074] The orthographic projection of the second encapsulation sublayer 520 on the substrate 111 is located on the side of the orthographic projection of the dam structure DAM on the substrate 111 close to the display area AA, and the first encapsulation sublayer 510 and the third encapsulation sublayer 530 contact each other on the side of the dam structure DAM away from the display area AA and extend to the first isolation structure 610 to wrap the first eaves structure.

[0075] The first encapsulation sublayer 510 may cover the surface of the first isolation structure 610 away from the substrate 111 .

[0076] For example, when forming a thinner first encapsulation sublayer 510, the first encapsulation sublayer 510 can extend from the display area AA to cover the dam structure DAM and further extend to cover the first isolation structure 610 and wrap the first eaves structure of the first isolation structure 610. The first encapsulation sublayer 510 and the first eaves structure form a mosaic structure, thereby improving the bonding strength between the first encapsulation sublayer 510 and the first isolation structure 610.

[0077] Next, when a thicker second encapsulation sublayer 520 is provided, the dam structure DAM can prevent the second encapsulation sublayer 520 from further spreading toward the edge of the display panel.

[0078] Then, a third encapsulation sublayer 530 is formed on the side of the second encapsulation sublayer 520 facing away from the substrate 111. The third encapsulation sublayer 530 extends from the display area AA to the non-display area NA, covering the dam structure DAM. It also extends over the first isolation structure 610. The third encapsulation sublayer 530, formed of an inorganic material, contacts and adheres to the first encapsulation sublayer 510 over at least a portion of the dam structure DAM and on the side of the dam structure DAM facing away from the display area AA, thereby preventing moisture from invading between the first encapsulation sublayer 510 and the third encapsulation sublayer 530.

[0079] For some possible implementations, see Figure 8, the first isolation structure 610 is arranged in a continuous ring shape along the edge of the display panel, at least two first isolation structures 610 are arranged side by side along the edge of the display panel, and the encapsulation layer 500 covers the first eaves structure of at least two first isolation structures 610. In this way, by arranging at least two first isolation structures 610, the bonding strength between the encapsulation layer 500 and the first isolation structure 610 can be further improved, and the risk of peeling between the encapsulation layer 500 and other film layers at the edge of the display panel can be reduced.

[0080] Optionally, please refer to Figure 9 , the distance W1 between two adjacent first isolation structures 610 is greater than or equal to 31 microns. In this way, when forming the first encapsulation sub-layer 510, the first encapsulation sub-layer 510 can better cover the area between the two first isolation structures 610.

[0081] In some possible implementation manners, please refer to Figure 10 , the distance W2 between the edge of the positive projection of the shielding portion 602 on the substrate 111 and the edge of the positive projection of the supporting portion 601 on the substrate 111 is greater than or equal to 500 nanometers.

[0082] In this way, when forming the light-emitting device 810 in the display area AA, the shielding portion 602 can play a better blocking effect, and disconnect the film layers located inside and outside the isolation opening 910 during the process of vapor deposition to form the light-emitting functional layer 150 and the second electrode 160.

[0083] In some possible implementation manners, please refer to Figure 10 , in the direction away from the substrate 111, the thickness H1 of the supporting portion 601 is greater than or equal to 2.5 microns.

[0084] In this way, when forming the light-emitting device 810 in the display area AA, it is ensured that the second isolation structure 620 has sufficient height to disconnect the film layers located inside and outside the isolation opening 910 during the process of vapor deposition to form the light-emitting functional layer 150 and the second electrode 160.

[0085] In some possible implementation manners, the light-emitting device 810 includes a first electrode 120, a light-emitting functional layer 150, and a second electrode 160 that are stacked in the direction away from the substrate 111. The second isolation structure 620 has conductivity, and the second electrode 160 is in contact with the second isolation structure 620.

[0086] Optionally, the first electrode 120 can be connected to the pixel driving circuit in the array functional layer 112, the second electrode 160 can be connected to the common voltage providing circuit through the second isolation structure 620, and when there is a potential difference between the first electrode 120 and the second electrode 160, the light-emitting functional layer 150 located between the first electrode 120 and the second electrode 160 is driven to emit light.

[0087] The first electrode 120 may include a multi-layer structure. For example, the first electrode 120 includes a reflective layer and a pair of conductive oxide layers covering the upper surface and the lower surface of the reflective layer respectively. The reflective layer can be formed, for example, using a metal material with excellent light reflectivity such as silver. Each conductive oxide layer can be formed, for example, by a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 160 is formed, for example, by a metal material such as an alloy of magnesium and silver (MgAg).

[0088] In some possible implementation manners, the display panel includes a pixel defining layer 130 located between the second isolation structure 620 and the substrate 111. For example, the pixel defining layer 130 is located between the isolation structure and the array functional layer 112. The pixel defining layer 130 includes pixel openings, and the orthographic projection of the pixel openings on the substrate 111 is located within the orthographic projection of the isolation opening 910 on the substrate 111, that is, the pixel openings and the isolation opening 910 communicate with each other.

[0089] For example, a first pixel opening communicating with the first isolation opening, a second pixel opening communicating with the second isolation opening, and a third pixel opening communicating with the third isolation opening are provided on the pixel defining layer. The areas of the orthographic projections of the first pixel opening, the second pixel opening, and the third pixel opening on the substrate 111 may be the same or different. The shape of the orthographic projection of the pixel opening and the corresponding isolation opening 910 on the substrate 111 may be the same or different. Generally, the area of the orthographic projection of the isolation opening 910 on the substrate 111 is larger than the area of the orthographic projection of the pixel opening communicating with the isolation opening 910 on the substrate 111. There is an overlap between the orthographic projection of the pixel opening of the light-emitting device 810 on the substrate 111 and the orthographic projection of the isolation opening 910 on the substrate 111. The material of the pixel defining layer 130 is an inorganic material. For example, the pixel defining layer 130 is formed using at least one inorganic insulating material such as silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiON).

[0090] The first electrode 120 is disposed on the side of the array functional layer 112 away from the substrate. The pixel defining layer 130 covers the end of the first electrode 120. Pixel openings are provided on the pixel defining layer 130, and the first electrode 120 is exposed through the pixel openings. The light-emitting functional layers 150 of the first light-emitting device 811, the second light-emitting device 812, and the third light-emitting device 813 cover the sidewalls of the pixel openings of the pixel defining layer 130 and the side of the pixel defining layer 130 facing away from the substrate. Each light-emitting functional layer 150 is located within the pixel opening and contacts the first electrode 1200.

[0091] In another embodiment, the second isolation structure 620 is disposed in the groove of the pixel defining layer 130. Alternatively, the pixel defining layer 130 may not be provided in the display panel, and the second isolation structure 620 is disposed on one side of the array substrate, and the second isolation structure 620 is in contact with one side of the array substrate 112.

[0092] In some possible implementation manners, please refer to Figure 11 , the second isolation structure 620 further includes a receiving portion 603, a positive projection of the supporting portion 601 on the substrate 111 is located within a positive projection of the receiving portion 603 on the substrate 111, and a positive projection of the receiving portion 603 on the substrate 111 is located within a positive projection of the shielding portion 602 on the substrate 111.

[0093] Optionally, the etching resistance of the supporting portion 601 is weaker than that of the shielding portion 602.

[0094] Optionally, the material of the supporting portion 601 includes at least one of aluminum (Al) and aluminum alloy. The aluminum alloy may include at least one of aluminum neodymium alloy (AlNd), aluminum yttrium alloy (AlY), or aluminum silicon alloy (AlSi).

[0095] The shielding portion 602 may be a single-layer structure or a multi-layer structure. When the shielding portion is a single-layer structure, the material of the shielding portion 602 may include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum tungsten alloy, or molybdenum niobium alloy. When the shielding portion 602 is a multi-layer structure, one layer of the shielding portion 602 includes at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum tungsten alloy, or molybdenum niobium alloy, and the other layer of the shielding portion 602 may include a conductive oxide or an inorganic insulating material. The conductive oxide is, for example, indium tin oxide (ITO) or indium zinc oxide (IZO).

[0096] The material of the receiving portion 603 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum tungsten alloy (MoW), or molybdenum niobium alloy (MoNb).

[0097] For example, the second electrode 160 is connected to the supporting portion 601 of the second isolation structure 610, and / or the second electrode 160 is connected to the receiving portion 603 of the second isolation structure 620.

[0098] In some possible implementation manners, the display panel provided in this embodiment may further include film layer structures such as an optical film (e.g., a polarizer), a transparent adhesive layer (e.g., an optical adhesive layer), and a cover plate on a side of the second encapsulation layer 500 away from the substrate 111.

[0099] Please refer to Figure 12 , Figure 12It is a schematic diagram of the light-emitting functional layer 150 of an embodiment of the present application. The light-emitting functional layer 150 of at least one light-emitting device 810 among the first light-emitting device 811, the second light-emitting device 812, and the third light-emitting device 813 includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL that are stacked in a direction away from the substrate 111 (i.e., the Z direction). The light-emitting functional layer 150 may include one light-emitting material layer EML, or a stacked light-emitting functional layer 150 including multiple light-emitting material layers EML.

[0100] In order for the light-emitting functional layer 150 to emit light, a pixel voltage is provided to the first electrode 120 and a common voltage is provided to the second electrode 160 respectively. A potential difference is formed between the first electrode 120 and the second electrode 160, so that the light-emitting functional layer 150 provided between the first electrode 120 and the second electrode 160 emits light. In one embodiment, if a potential difference is formed between the first electrode 120 and the second electrode 160 of the first light-emitting device 811, the light-emitting material layer EML of the light-emitting functional layer 150 emits blue light; if a potential difference is formed between the first electrode 120 and the second electrode 160 of the second light-emitting device 812, the light-emitting material layer EML of the light-emitting functional layer 150 emits green light; if a potential difference is formed between the first electrode 120 and the second electrode 160 of the third light-emitting device 813, the light-emitting material layer EML of the light-emitting functional layer 150 emits red light.

[0101] Among them, the pixel voltage of the first electrode 120 is provided by the pixel driving circuit 112D, and the common voltage of the second electrode 160 is provided by the second isolation structure 620. Specifically, the second electrode 160 is electrically connected to the second isolation structure 620. By providing a common voltage to the second isolation structure 620, the common voltage is supplied to the second electrode 160. That is, the second isolation structure 620 has the function of supplying a common voltage to the second electrode 160.

[0102] Please refer to Figures 13 to 16 , Figures 13 to 16 It is a cross-sectional schematic diagram of another display panel provided in this embodiment. The display panel provided in this embodiment may include a substrate 111, an isolation layer, a light-emitting device 810, and a packaging layer 500.

[0103] The isolation layer is located on one side of the substrate 111. For example, the isolation layer is located on the side of the array functional layer 112 away from the substrate 111. The isolation layer includes a second isolation structure 620 located in the display area AA and a first isolation structure 610 located in the non-display area NA. The second isolation structure 620 includes a plurality of spaced apart isolation openings 910, and the first isolation structure 610 is disposed along the edge of the display panel. That is, a plurality of isolation openings 910 are located in the display area AA.

[0104] In this embodiment, the second isolation structure 620 and the first isolation structure 610 are provided in the same layer and made of the same material.

[0105] The orthographic projection of the side of the first isolation structure 610 close to the substrate 111 on the substrate is within the orthographic projection of the side of the first isolation structure 610 far from the substrate on the substrate 111. For example, in a cross section perpendicular to the substrate, the cross-sectional shape of the first isolation structure 610 is an inverted trapezoid with the upper base close to the substrate 111.

[0106] The plurality of light emitting devices 810 are respectively located in corresponding isolation openings 910 . That is, in this embodiment, the light emitting devices 810 are located in the display area AA and in the isolation openings 910 formed by the second isolation structure 620 .

[0107] The encapsulation layer 500 is located on a side of the light emitting device 810 and the isolation layer away from the substrate 111 . At least a portion of the encapsulation layer 500 extends to the non-display area NA. At least a portion of the encapsulation layer 500 wraps the first isolation structure 610 .

[0108] In this way, the encapsulation layer 500 and the first isolation structure 610 form a wedge-shaped interlocking structure, which improves the bonding strength between the encapsulation layer 500 and the first isolation structure 610 at the edge of the display panel, reduces the risk of film peeling of the encapsulation layer 500, and ensures the effectiveness of the encapsulation at the edge of the display panel.

[0109] Optionally, the orthographic projection of the side of the second isolation structure 620 close to the substrate 111 on the substrate is within the orthographic projection of the side of the second isolation structure 620 far from the substrate 111 on the substrate. For example, in a cross section perpendicular to the substrate, the cross-sectional shape of the second isolation structure 620 is an inverted trapezoid with the upper base close to the substrate 111. For example, the first isolation structure 610 and the second isolation structure 620 can be formed in the same step using the same etching process.

[0110] In some possible implementations, the isolation layer can be formed by etching a single film structure. For example, the isolation layer material may include an organic negative resist. The first isolation structure 610 and the second isolation structure 620 can be formed into a structure with an inverted trapezoidal cross-section by exposing and developing the organic negative resist.

[0111] In some other possible implementations, the isolation layer may also be formed by combining two or more film layers.

[0112] Optional, see Figures 14 to 16 The encapsulation layer 500 includes a first encapsulation sublayer 510 , a second encapsulation sublayer 520 and a third encapsulation sublayer 530 stacked in a direction away from the substrate 111 , and at least a portion of the first encapsulation sublayer 510 wraps the first isolation structure 610 .

[0113] Optionally, depending on the setting position of the first isolation structure 610, the second encapsulation sub-layer 520 and the third encapsulation sub-layer 530 may also wrap the first isolation structure 610 in some cases.

[0114] In some possible implementations, the display panel further includes at least one dam structure DAM located in the non-display area NA, and the dam structure DAM is disposed around at least a part of the edge of the display panel. Optionally, the dam structure DAM may be formed by laminating partial film layers in the array functional layer 112. For example, it may be formed by laminating a partial planarization layer and a partial conductive layer. The dam structure DAM can be used to prevent the second encapsulation sub-layer 520 with a certain fluidity from spreading and overflowing the edge of the display panel during the manufacturing process.

[0115] The first isolation structure 610 is located on one side of at least one dam structure DAM close to the display area AA or on one side of at least one dam structure DAM far from the display area AA. Among them, according to the different relative positions of the first isolation structure 610 and the dam structure DAM, the covering relationship of each sub-layer in the encapsulation layer 500 to the first isolation structure 610 may be different.

[0116] In some possible implementations, please refer to Figure 14 , the first isolation structure 610 is located on one side of the dam structure DAM close to the display area AA.

[0117] The orthographic projection of the first isolation structure 610 on the substrate 111 is located within the orthographic projection of the second encapsulation sub-layer 520 on the substrate 111. At least a part of the second encapsulation sub-layer 520 and at least a part of the third encapsulation sub-layer 530 are located on the side of the first isolation structure 610 far from the substrate 111. In some possible implementations, please refer to Figure 15 , the first isolation structure 610 is located on one side of the dam structure DAM close to the display area AA, and the orthographic projection of the second encapsulation sub-layer 520 on the substrate 111 is located on the side of the orthographic projection of the first isolation structure 610 on the substrate 111 close to the display area AA.

[0118] In some possible implementations, please refer to Figure 16 , the first isolation structure 610 is located on one side of the dam structure DAM far from the display area AA. For example, the dam structure DAM may include a first dam DAM1 and a second dam DAM2 located on the side of the first dam DAM1 far from the display area AA. The first dam DAM1 and the second dam DAM2 are arranged in parallel and both extend along the edge of the display panel. The first isolation structure 610 may be located on the side of the second dam DAM2 far from the display area AA and may be arranged in parallel with the first dam DAM1 and the second DAM2.

[0119] The orthographic projection of the second encapsulation sub-layer 520 on the substrate 111 is located on the side of the orthographic projection of the dam structure DAM on the substrate 111 close to the display area AA. The first encapsulation sub-layer 510 and the third encapsulation sub-layer 530 are in contact with each other on the side of the dam structure DAM away from the display area AA and extend to wrap the first isolation structure 610. Among them, the first encapsulation sub-layer 510 can cover the surface of the first isolation structure 610 away from the substrate 111.

[0120] Please refer to Figure 17 , this embodiment also provides a method for manufacturing a display panel, and the method may include the following steps.

[0121] Step S110: Provide a substrate 111.

[0122] Step S120: Fabricate a second isolation structure 620 on one side of the substrate 111. A plurality of isolation openings 910 are provided on the second isolation structure 620, and the plurality of isolation openings 910 include a plurality of first isolation openings, a plurality of second isolation openings, and a plurality of third isolation openings.

[0123] Step S130: Fabricate the film layers of the first light-emitting device 811. The film layers of the first light-emitting device 811 include the light-emitting functional layer 150 and the second electrode 160 of the first light-emitting device 811.

[0124] Step S140: Fabricate the pixel encapsulation unit 512 of the first light-emitting device 811. Since the film layers of the first light-emitting device 811 and the pixel encapsulation unit 512 are both prepared as a whole layer, therefore, the film layers of the first light-emitting device 811 and the pixel encapsulation unit 512 are located at the positions of the plurality of first isolation openings, the plurality of second isolation openings, and the plurality of third isolation openings.

[0125] Step S150: Etch and remove the film layers of the first light-emitting device 811 and the pixel encapsulation unit 512 at the positions of the plurality of second isolation openings and the plurality of third isolation openings, so as to form only the light-emitting functional layer 150 and the second electrode of the first light-emitting device 811, and the pixel encapsulation unit 512 of the first light-emitting device 811 at the positions of the plurality of first isolation openings.

[0126] Based on the above steps S130 to S150, the light-emitting functional layer 150 and the second electrode 160 of the second light-emitting device 812, and the pixel encapsulation unit 512 of the second light-emitting device 812 can be respectively arranged at the positions of the plurality of second isolation openings in a pixel manner, and the light-emitting functional layer 150 and the second electrode 160 of the third light-emitting device 813, and the pixel encapsulation unit 512 of the third light-emitting device 813 can be arranged at the positions of the plurality of third isolation openings.

[0127] In some possible implementation manners, please refer to Figure 18, this application also provides an electronic device 01, and the electronic device 01 includes the display panel 10 provided in this embodiment. The electronic device 01 may include devices with image processing capabilities, such as mobile phones, desktop computers, laptop computers, tablet computers, vehicle-mounted displays, wearable devices, etc. Since the electronic device 01 includes the display panel 10 provided in this embodiment, the reliability of the electronic device 01 is higher.

[0128] In summary, for the display panel and the electronic device provided in this application, in the display panel having the second isolation structure in the display area, the first isolation structure is provided on the edge of the display panel and is arranged on the same layer as the second isolation structure, and the encapsulation layer wraps the eaves structure of the first isolation structure to form a nested structure. In this way, the adhesion strength between the encapsulation layer and the first isolation structure at the edge of the display panel can be improved, the risk of film layer peeling of the encapsulation layer can be reduced, and the encapsulation effectiveness at the edge of the display panel can be ensured.

[0129] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0130] The above-described embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a non-display area at least partially surrounding the display area, and the display panel includes: a substrate; an isolation layer on one side of the substrate. The isolation layer includes a first isolation structure in the non-display area and a second isolation structure in the display area. The second isolation structure includes a plurality of spaced-apart isolation openings. The first isolation structure is disposed along the edge of the display panel. The isolation layer includes a support portion and a shielding portion stacked in a direction away from the substrate. In a direction parallel to the substrate, the shielding portion in the first isolation structure protrudes relative to the support portion to form a first eaves structure; a plurality of light-emitting devices located in the corresponding isolation openings; a packaging layer on the side of the light-emitting devices and the isolation layer away from the substrate. At least a part of the packaging layer extends into the non-display area, and at least a part of the packaging layer wraps the first eaves structure.

2. The display panel according to claim 1, wherein The packaging layer includes a first packaging sub-layer, a second packaging sub-layer, and a third packaging sub-layer stacked in a direction away from the substrate. At least a part of the first packaging sub-layer wraps the first eaves structure; Preferably, the materials of the first packaging sub-layer and the third packaging sub-layer include inorganic materials, and the material of the second packaging sub-layer includes an organic material.

3. The encapsulation layer according to claim 2, wherein The first packaging sub-layer includes a plurality of pixel packaging units in the display area and an edge packaging unit at least partially in the non-display area. The plurality of pixel packaging units are respectively located on the side of the corresponding light-emitting devices away from the substrate. At least a part of the edge packaging unit extends into the non-display area and wraps the first eaves structure; Preferably, the display panel includes at least two types of light-emitting devices with different light-emitting colors. The edge packaging unit and the pixel packaging units corresponding to at least one type of light-emitting color are disposed on the same layer and have the same material; Preferably, in a direction parallel to the substrate, the shielding portion in the second isolation structure protrudes relative to the support portion to form a second eaves structure, and the pixel packaging unit wraps at least a part of the second eaves structure.

4. The display panel according to claim 2, wherein The display panel further includes at least one dam structure in the non-display area. The dam structure is disposed around at least a part of the edge of the display panel. The first isolation structure is located on the side of at least one dam structure close to the display area or on the side of at least one dam structure away from the display area.

5. The display panel according to claim 4, characterized in that, The first isolation structure is located on the side of the dam structure close to the display area. The orthographic projection of the first isolation structure on the substrate is located within the orthographic projection of the second packaging sub-layer on the substrate. At least a part of the second packaging sub-layer and at least a part of the third packaging sub-layer are located on the side of the first isolation structure away from the substrate; Preferably, the second packaging sub-layer covers the surface of the first isolation structure away from the substrate and the side wall surface of the first isolation structure away from the display area.

6. The display panel according to claim 4, wherein The first isolation structure is located on a side of the dam structure close to the display area. A positive projection of the second encapsulation sub-layer on the substrate is located on a side of a positive projection of the first isolation structure on the substrate close to the display area. The first encapsulation sub-layer and the third encapsulation sub-layer are in contact with each other on at least a part of a side of the first isolation structure away from the substrate and on a side of the first isolation structure away from the display area, and wrap the first eaves structure on the side of the first isolation structure away from the display area. Preferably, the first encapsulation sub-layer covers a surface of the first isolation structure away from the substrate.

7. The display panel according to claim 4, wherein The first isolation structure is located on a side of the dam structure away from the display area. A positive projection of the second encapsulation sub-layer on the substrate is located on a side of a positive projection of the dam structure on the substrate close to the display area. The first encapsulation sub-layer and the third encapsulation sub-layer are in contact with each other on a side of the dam structure away from the display area and extend to the first isolation structure to wrap the first eaves structure. Preferably, the first encapsulation sub-layer covers a surface of the first isolation structure away from the substrate.

8. The display panel according to claim 1, wherein The first isolation structure is arranged in a continuous ring shape along an edge of the display panel, and at least two of the first isolation structures are arranged side by side along the edge of the display panel. Preferably, a distance between two adjacent first isolation structures is greater than or equal to 31 micrometers.

9. The display panel according to claim 1, wherein A distance between an edge of a positive projection of the shielding portion on the substrate and an edge of a positive projection of the supporting portion on the substrate is greater than or equal to 500 nanometers.

10. The display panel according to claim 1, characterized in that, In a direction away from the substrate, a thickness of the supporting portion is greater than or equal to 2.5 micrometers.

11. The display panel according to claim 1, wherein The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode that are stacked in a direction away from the substrate. The second isolation structure has conductivity, and the second electrode is in contact with the second isolation structure.

12. The display panel according to claim 1, wherein The display panel includes a pixel defining layer between the second isolation structure and the substrate. The pixel defining layer includes a plurality of pixel openings, and a positive projection of the pixel openings on the substrate is located within a positive projection of the isolation opening on the substrate.

13. The display panel according to claim 1, characterized in that, The second isolation structure layer further includes a receiving portion. A positive projection of the supporting portion on the substrate is located within a positive projection of the receiving portion on the substrate, and a positive projection of the receiving portion on the substrate is located within a positive projection of the shielding portion on the substrate. Preferably, a material of the receiving portion includes molybdenum, and / or a material of the supporting portion includes aluminum, and / or a material of the shielding portion includes titanium.

14. A display panel, characterized in that, The display panel includes a display area and at least a part of a non-display area surrounding the display area. The display panel includes: a substrate; An isolation layer located on one side of the substrate, the isolation layer includes a first isolation structure located in the non-display area and a second isolation structure located in the display area, the second isolation structure includes a plurality of spaced apart isolation openings, and the first isolation structure is disposed along the edge of the display panel; a projection of a side of the first isolation structure close to the substrate on the substrate is located within a projection of a side of the first isolation structure away from the substrate on the substrate; A plurality of light-emitting devices, the light-emitting devices are located in the corresponding isolation openings; A packaging layer located on a side of the light-emitting device and the isolation layer away from the substrate, at least a part of the packaging layer extends to the non-display area, and at least a part of the packaging layer wraps the first isolation structure.

15. An electronic device, characterized in that, The electronic device includes the display panel according to any one of claims 1-14.

Images