dispensing arrangement

Abstract

A distribution arrangement (69a, 69b, 121a, 123a, 125a, 127a) is provided configured to be positioned between two corrugated heat transfer plates (5). The distribution arrangement (69a, 69b) includes a base (71) including a sheet (73) having opposite front and back surfaces (79, 81). The front surface (89) and the back surface (93) of the base (71) include at least a portion of the front surface (79) and the back surface (81) of the sheet (73), respectively. The base (71) is provided with a through secondary bore (85) extending through the front and back surfaces (89, 93) of the base (71) so as to form a direct secondary flow path (DS) through the base (71), a non-through first secondary cavity (97) extending through the front surface (89) of the base (71), and at least one first secondary channel (101) extending inside the sheet (73). The at least one first secondary channel (101) connects the secondary bore (85) and the first secondary cavity (97) to form a first transfer secondary flow path (TS1) through the base (71).

Description

Technical Field

[0001] The present invention relates to a dispensing arrangement configured to be positioned between two corrugated heat transfer plates. The heat transfer plates and the dispensing arrangement can be included in apparatus for heat-generating processes such as electrolysis. Background Technology

[0002] Electrolysis is a well-known process that uses electrical energy to chemically break down electrolytes. For example, electrolysis can be used to separate water in an electrolyte into hydrogen and oxygen. Heat may be generated during electrolysis, and this heat must be dissipated to maintain the efficiency of electrolysis.

[0003] EP 4012070 discloses a heat exchanger comprising stacked heat transfer plates. This heat exchanger is adapted to be connected to an electrolysis unit such that a fluid circulating within the electrolysis unit passes through the heat exchanger to regulate its temperature. Typically, the temperature of the fluid gradually increases within the electrolysis unit. Therefore, the heat exchanger receives a relatively high-temperature fluid from the electrolysis unit and delivers a relatively low-temperature fluid to the electrolysis unit, meaning a temperature difference will exist across the electrolysis unit. This can lead to an uneven and undesirable electrolysis process within the electrolysis unit. The heat exchanger in EP 4012070 is a so-called plate-and-shell heat exchanger. Several other types of heat exchangers exist, such as so-called plate heat exchangers. Plate heat exchangers typically comprise multiple corrugated heat transfer plates aligned in a stacked or arranged configuration. Seals between the heat transfer plates define parallel flow channels between the heat transfer plates, one flow channel between each pair of adjacent heat transfer plates. Two fluids with different initial temperatures can be alternately supplied through every other flow channel to transfer heat from one fluid to the other. Summary of the Invention

[0004] One object of the present invention is to provide a distribution arrangement positioned between two corrugated heat transfer plates to enable a reliable and mechanically uncomplicated device comprising the heat transfer plates as part of a stacked set of corrugated heat transfer plates forming alternating first and second plate gaps. This device can be used in heat-generating processes such as electrolysis, and can cool fluids (such as electrolytes) and their products more uniformly and efficiently, thereby maintaining high process efficiency. The basic concept of the invention is to provide a distribution arrangement that can be positioned in a first gap dedicated to cooling, such that the heat-generating process can be effectively maintained in a second gap. This distribution arrangement allows fluid to be supplied to and from the second gap using the first gap. Therefore, the basic concept of the invention is to provide a distribution arrangement that realizes a device for performing heat-generating processes such as electrolysis, while simultaneously functioning as a conventional heat exchanger for “integrated” cooling during the heat-generating process.

[0005] This arrangement can be used in hydrogen production plants.

[0006] Since the distribution arrangement according to the invention is not arranged for standalone use, but rather for use as a component of the device described above, the different features and advantages of the distribution arrangement first become apparent when the distribution arrangement is installed in the device.

[0007] As described above, this distribution arrangement can be used in devices of the type described above to supply fluid (here, the second fluid) to and from the second gap via the first gap. Unless otherwise stated, the distribution arrangement for supplying the second fluid to the second gap is described in the remainder of this "Overview". This distribution arrangement is then advantageously arranged for fluid diversion, as will be further described below. The distribution arrangement for supplying the second fluid out of the second gap is then advantageously arranged for fluid collection, which will be further discussed in "Detailed Description".

[0008] The distribution arrangement according to the invention is used for positioning between two corrugated heat transfer plates, which may be of the same or different types. The distribution arrangement includes a base comprising a plate having opposing front and rear surfaces arranged to face a corresponding heat transfer plate. A central extending plane of the plate extends between the front and rear surfaces of the plate. The front and rear surfaces of the base each comprise at least a portion of the front and rear surfaces of the plate, respectively. The base includes a through-hole secondary orifice extending through the front and rear surfaces of the base to form a direct secondary flow path through the base. The base also includes a non-through-hole primary cavity extending through the front surface of the base. Furthermore, the base includes at least one primary channel extending inside the plate. The at least one primary channel connects the secondary orifice and the primary cavity to form a first secondary flow path through the base. An annular secondary sub-surface of the front surface of the base surrounds the secondary orifice.

[0009] It should be emphasized that the "ring" and "loop" in this article are not necessarily circular, but can be any "closed" shape, such as ellipse, polygon or any combination thereof.

[0010] When the distribution is properly arranged between the heat transfer plates, the middle extension plane of the plates can extend substantially parallel to the heat transfer plates.

[0011] The intermediate extension plane of the plate may extend substantially parallel to the front and rear surfaces of the plate. This intermediate extension plane may extend in the middle between the front and rear surfaces of the plate, or it may not extend in the middle.

[0012] The at least one primary channel extending inside the plate may extend substantially parallel to the intermediate extension plane of the plate, or may not extend substantially parallel to the intermediate extension plane of the plate.

[0013] Since the first-stage cavity is not through, it will only extend partially through the base, i.e., not through the rear surface of the base.

[0014] Therefore, there exists a direct secondary flow path defined by the secondary orifice, and a first transfer secondary flow path defined by the secondary orifice, the primary channel, and the primary cavity, for allowing the second fluid to pass through the base. This enables the distribution arrangement to separate the primary sub-flow from the secondary fluid flow. Thus, if the distribution arrangement is arranged in the first gap of the device as described above, it can transport the primary sub-flow of the second fluid through the first gap to the adjacent second gap, as will be further described below.

[0015] The distribution arrangement can be made of one or more materials. For example, the base of the distribution arrangement, particularly the front and rear surfaces of the base, can be made of one or more insulating materials. This prevents short circuits from occurring within the apparatus used to perform heating processes such as electrolysis, which could lead to apparatus malfunction.

[0016] The dispensing arrangement may also include a secondary orifice gasket. The secondary orifice gasket may surround the secondary orifice and abut against a secondary sub-surface of the front surface of the base for sealing. The secondary orifice gasket can achieve a tight seal between the secondary sub-surface and another surface, which may be included in another dispensing arrangement according to the invention. Additionally / alternatively, the dispensing arrangement may include a primary cavity gasket. The primary cavity gasket may surround the primary cavity and abut against the front surface of the base for sealing. The primary cavity gasket can achieve a tight seal between the front surface of the base and another surface, which may be included in the heat transfer plate.

[0017] The distribution arrangement can be designed such that the secondary sub-surface is raised relative to the remainder of the front surface of the base. This results in an increased thickness of the base around the secondary apertures. This design allows the distribution arrangement to protrude through a heat transfer plate, preventing short circuits within devices used to perform heat-generating processes such as electrolysis.

[0018] The base may also include a through-hole primary aperture. This primary aperture may extend through the front and rear surfaces of the base to form a direct primary flow path through the base. The base may also include a non-through first primary cavity through the rear surface of the base, and at least one first primary channel extending inside the plate. The at least one first primary channel may connect the primary aperture and the first primary cavity to form a first transfer primary flow path through the base. An annular primary sub-surface of the front surface of the base may surround the primary aperture.

[0019] The at least one first primary channel extending inside the plate may extend substantially parallel to the intermediate extension plane of the plate, or may not extend substantially parallel to the intermediate extension plane of the plate.

[0020] Since the first primary cavity is non-through, it will only extend partially through the base, that is, not through the front surface of the base.

[0021] Therefore, there exists a direct primary flow path defined by the primary orifice, and a first transfer primary flow path defined by the primary orifice, the first primary channel, and the first primary cavity, for allowing the second fluid to pass through the base. This enables the distribution arrangement to separate the first primary sub-flow from the second primary fluid flow. Thus, if the distribution arrangement is arranged in the first gap of the device as described above, it can transport the first primary sub-flow of the second fluid through the first gap to the adjacent second gap, as will be further described below.

[0022] The dispensing arrangement may also include a primary orifice gasket. The primary orifice gasket may surround the primary orifice and abut against a primary sub-surface of the front surface of the base for sealing. The primary orifice gasket may achieve a tight seal between the primary sub-surface and another surface, which may be included in another dispensing arrangement according to the invention. Furthermore / alternatively, the dispensing arrangement may include a first primary cavity gasket. The first primary cavity gasket may surround a first primary cavity and abut against a rear surface of the base for sealing. The first primary cavity gasket may achieve a tight seal between the rear surface of the base and another surface, which may be included in the heat transfer plate.

[0023] The distribution arrangement can be designed such that the primary sub-surface is raised relative to the rest of the front surface of the base. This results in an increased thickness of the base around the primary aperture.

[0024] The arrangement allows the first stage cavity to be aligned with the first primary cavity. Thus, a normal axis extending perpendicular to the intermediate plane of the plate can extend through both the first stage cavity and the first primary cavity. This configuration is advantageous because it allows the at least one first stage channel and the at least one first primary channel to intersect each other.

[0025] Alternatively, the arrangement can be such that the first stage cavity is displaced relative to the first primary cavity. In this case, the normal axis perpendicular to the intermediate extension plane of the plate may not extend through both the first stage cavity and the first primary cavity. This configuration can be advantageous because it allows the at least one first stage channel and the at least one first primary channel to extend at any height between the front and rear surfaces of the plate.

[0026] The arrangement can be designed such that the at least one first primary channel extends between the front surface of the plate and the intermediate extension plane of the plate. Furthermore, the at least one first primary channel can extend between the rear surface of the plate and the intermediate extension plane of the plate. This configuration is advantageous because it allows the at least one first primary channel to intersect with each other.

[0027] The base of the distribution arrangement may include a non-through secondary cavity extending through the front surface of the base, and at least one secondary channel extending inside the plate. The at least one secondary channel may connect a secondary aperture and a secondary cavity to form a second secondary flow path through the base. Alternatively / additionally, the base may include a non-through second primary cavity extending through the rear surface of the base, and at least one second primary channel extending inside the plate. The at least one second primary channel may connect a primary aperture and a second primary cavity to form a second primary flow path through the base.

[0028] The at least one secondary channel and / or the at least one secondary primary channel extending inside the plate may extend substantially parallel to the intermediate extension plane of the plate, or may not extend substantially parallel to the intermediate extension plane of the plate.

[0029] Since the secondary cavity is non-through, it will only extend partially through the base, that is, not through the rear surface of the base.

[0030] Since the second primary cavity is non-through, it will only extend partially through the base, that is, not through the front surface of the base.

[0031] Therefore, in addition to the direct secondary flow path and the first transfer secondary flow path, a second transfer secondary flow path defined by a secondary orifice, a second secondary channel, and a second secondary cavity can exist to allow the second fluid to pass through the base. This allows the distribution arrangement to separate the second-stage sub-flow from the second-stage fluid flow. Thus, if the distribution arrangement is arranged in the first gap of the device as described above, the second-stage sub-flow of the second fluid can be transported via the first gap to the adjacent second gap. The first and second secondary sub-flows can be transported to the second gap at different locations, which can improve the distribution of the second fluid in the second gap.

[0032] In addition to the direct primary flow path and the first transfer primary flow path, a second transfer primary flow path defined by a primary orifice, a second primary channel, and a second primary cavity can exist to allow the second fluid to pass through the base. This allows the distribution arrangement to separate the second primary sub-flow from the second primary fluid flow. Therefore, if the distribution arrangement is arranged in the first gap of the device as described above, the second primary sub-flow of the second fluid can be transported via the first gap to the adjacent second gap. The first and second primary sub-flows can be transported to the second gap at different locations, which can improve the distribution of the second fluid in the second gap.

[0033] The allocation arrangement can be designed such that the first-stage cavity and the second-stage cavity are aligned with the second primary cavity and the first primary cavity, respectively. This configuration can be advantageous because it allows the at least one first-stage channel to intersect with the at least one second primary channel, and the at least one second-stage channel to intersect with the at least one first primary channel.

[0034] Alternatively, the arrangement can be designed such that the first and second stage cavities are displaced relative to the second and first primary cavities. This configuration can be advantageous because it allows the at least one first stage channel, the at least one second stage channel, the at least one first primary channel, and the at least one second primary channel to extend at any height between the front and rear surfaces of the plate.

[0035] The arrangement allows the at least one primary channel and the at least one secondary channel to extend between the front surface of the plate and the intermediate extension plane of the plate. Furthermore, the at least one primary channel and the at least one secondary channel can extend between the rear surface of the plate and the intermediate extension plane of the plate. This configuration is advantageous because it allows the at least one primary channel and the at least one secondary channel to intersect each other.

[0036] The distribution arrangement can be designed such that the plate includes an inner wall surrounding (i.e. defining) a secondary orifice. The inner wall may include a first half and a second half extending on opposite sides of a central plane dividing the secondary orifice, the central plane being perpendicular to the intermediate extension plane of the plate. The first half of the inner wall of the plate may be arranged further away from the primary stage cavity than the second half of the inner wall of the plate. The at least one primary stage channel may extend from an opening in the first half of the inner wall of the plate. This design can be advantageous when the distribution arrangement is used in a directional configuration where the first half of the inner wall is positioned above the second half of the inner wall. This design can then facilitate gas- and liquid-phase separation of the second fluid in the secondary orifice, as will be further described below. The primary orifice of the distribution arrangement may have a similar structure.

[0037] The dispensing arrangement plates may be provided with rod engagement recesses. As the name suggests, these rod engagement recesses are arranged to engage with rods in the device described above, which are arranged to support the heat transfer plates of the device. Therefore, the rod engagement recesses can be used to secure the dispensing arrangement and any heat transfer plates engaged therewith within the device. The rod engagement recesses may be formed as holes, cavities, or recesses through the plates, defined by the annular inner wall of the plates. As another example, the rod engagement recesses may extend from the outer edge of the plates, for example, from the central portion of the outer edge. The rod engagement recesses (which may be insulated) and the primary cavity may be arranged on the opposite side of the secondary hole. The recesses may have any suitable shape.

[0038] The dispensing arrangement may also include a snap-fit ​​device that protrudes from the front surface of the plate around the annular secondary sub-surface of the front surface of the base and possibly also around the annular primary sub-surface. The snap-fit ​​device may be arranged to engage with a locking device of one of the heat transfer plates to attach the dispensing arrangement to said one of the heat transfer plates. This snap-fit ​​device allows for simple and stable assembly of the device including the dispensing arrangement and the heat transfer plates.

[0039] Other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description and the accompanying drawings. Attached Figure Description

[0040] The invention will now be described in more detail with reference to the accompanying schematic diagrams, wherein...

[0041] Figure 1a and Figure 1b It is a substantially similar perspective view, schematically showing a portion of the device in a disassembled state and the different fluid paths through the device, which includes multiple dispensing arrangements according to the invention.

[0042] Figure 2 yes Figure 1a A schematic plan view of the heat transfer plate of the device.

[0043] Figure 3 yes Figure 1a A schematic plan view of a portion of the device.

[0044] Figure 4a yes Figure 1a A schematic front plan view of the upper part of the device.

[0045] Figure 4b yes Figure 4a A schematic rear plan view of the upper part of the layout.

[0046] Figure 4c yes Figure 4a A schematic partial perspective view of the upper part of the arrangement.

[0047] Figure 4d yes Figure 4a A schematic cross-sectional view of the upper part of the arrangement.

[0048] Figure 4e-4h Schematic illustration of passing through Figure 4a Different flow paths are arranged in the upper part of the middle.

[0049] Figure 5a yes Figure 4a A schematic perspective view of the upper part of the arrangement.

[0050] Figure 5b The diagram schematically shows parts including Figure 5a The electrolytic cells arranged in the upper part shown in the figure

[0051] Figure 6 It schematically shows the following based on Figure 5b The connection between multiple electrolytic cells,

[0052] Figure 7a This is a schematic front plan view of the upper part of the arrangement according to the alternative embodiment.

[0053] Figure 7b yes Figure 7a A schematic rear plan view of the upper part of the layout.

[0054] Figure 7c yes Figure 7a A schematic cross-sectional view of the upper part of the arrangement.

[0055] Figure 7d yes Figure 7a Another schematic cross-sectional view of the upper part of the arrangement.

[0056] Figure 8a and Figure 8bA substantially similar perspective view schematically illustrates a portion of the device in a disassembled state and the different fluid paths through the device, which includes multiple dispensing arrangements according to another embodiment of the invention.

[0057] Figure 9 yes Figure 8a A schematic plan view of the heat transfer plate of the device.

[0058] Figure 10 yes Figure 8a A schematic plan view of a portion of the device.

[0059] Figure 11a yes Figure 8a A schematic front plan view of the upper part of the device.

[0060] Figure 11b yes Figure 11a A schematic rear plan view of the upper part of the layout.

[0061] Figure 12a This is a schematic front plan view of the upper part of the arrangement according to the alternative embodiment.

[0062] Figure 12b yes Figure 12a A schematic rear plan view of the upper part of the layout.

[0063] Figure 12c yes Figure 12a A schematic cross-sectional view of the upper part of the arrangement.

[0064] Figure 13a This is a schematic front plan view of the upper parting arrangement according to another alternative embodiment, and

[0065] Figure 13b yes Figure 13a A schematic rear plan view of the upper part of the arrangement. Detailed Implementation

[0066] Figure 1a A portion of an apparatus 1 for producing hydrogen by electrolysis (here, alkaline water electrolysis) is shown. Apparatus 1 includes similar heat transfer plates 5 arranged in a stack 3 (shown only partially), each heat transfer plate 5 having a front surface 7 and an opposite rear surface 9. In the stack 3, the heat transfer plates 5 are flipped over each other, i.e., arranged with front surfaces 7 to front surfaces 7 and rear surfaces 9 to rear surfaces 9, wherein every other heat transfer plate 5 is flipped over relative to the remaining heat transfer plates 5. This means that every other heat transfer plate 5 is rotated 180 degrees about the longitudinal central axis L of the corresponding heat transfer plate, and then about the normal axis N of the corresponding heat transfer plate. Figure 2 It rotates 180 degrees relative to the other heat transfer plates 5.

[0067] One of the heat transfer plates 5 is in Figure 2 The heat transfer plate is shown separately and described in more detail below. The heat transfer plate 5 has a first end portion 11, a central portion 13, and a second end portion 15 arranged sequentially along the longitudinal central axis L of the heat transfer plate 5, which extends perpendicular to the transverse central axis T of the heat transfer plate 5. The first end portion 11 includes a first port hole 17, a third port hole 19, a fifth port hole 21, a seventh port hole 23, and a first transfer hole 25, while the second end portion 15 includes a second port hole 27, a fourth port hole 29, a sixth port hole 31, an eighth port hole 33, and a second transfer hole 35.

[0068] Similar to typical heat transfer plates, heat transfer plate 5 is embossed with a corrugated pattern of ridges and valleys relative to its corresponding central extending plane, which is parallel to the heat transfer plate 5. Figure 2 The heat transfer plate 5 has different corrugated patterns in different areas. For example, the central portion 13 is pressed with a so-called herringbone corrugated pattern. As another example, the edge portion 37 of the heat transfer plate 5 is pressed with alternating ridges and valleys extending from the outer edge 39 of the heat transfer plate 5.

[0069] Refer again Figure 1a Heat transfer plates 5, stacked 3, are arranged between two frame plates F; only one is shown in the figure. The heat transfer plates 5 within the stack 3 are arranged in pairs, with heat transfer plates 5b and 5c forming one of these pairs, and heat transfer plate 5d forming the other adjacent heat transfer plate in the pair. A first gap I1 is formed between each pair of heat transfer plates. Furthermore, a second gap I2 is formed between every two adjacent pairs of heat transfer plates 5. An outer heat transfer plate 5x, similar to the heat transfer plates 5 but lacking the first and second transfer holes 25 and 35, is arranged in the stack 3 and... Figure 1a Between the visible frame plates F, an additional first gap I1 (denoted as I1X) is formed together with the heat transfer plate 5a and the plate pair. Therefore, an additional second gap I2, denoted as I2X, is formed between the heat transfer plates 5a and 5b. This can be achieved in the stack 3 and... Figure 1a An external heat transfer plate without any holes is arranged between another frame plate that is not visible in the middle. In addition, a gasket (not shown) may be arranged on the inside of the frame plate F.

[0070] An annular field gasket component 41 of rubber is arranged within each first gap I1 to define a first flow channel C1 therein. An upper distribution arrangement 69a and a lower distribution arrangement 69b are also arranged within each first gap I1. An annular field seal component 43 is arranged within each second gap I2 to define a second flow channel C2 therein. An isolation device that encloses the field-sealed region surrounded by the field seal component 43 includes a hydroxide ion permeation membrane 45. The membrane 45 extends within the field seal component 43 and is substantially parallel to the heat transfer plate 5 to divide the corresponding second flow channel C2 into a second primary sub-channel C2P and a second secondary sub-channel C2S, which are parallel and extend on opposite sides of the membrane 45. The field seal component 43 and the isolation device including the membrane 45 are part of a rubber sealing arrangement S (other than the membrane), which also includes four annular ring seal components 47 integrally formed with the field seal component 43 and an insulating rubber sheet (not shown herein). The rubber sheet extends outside the field sealing member 43 and the ring sealing member 47 and is arranged to prevent contact between the heat transfer plates arranged on opposite sides of the rubber sheet.

[0071] refer to Figure 3 Field gasket component 41 surrounds a field gasket region A1 having a transverse central axis T1 and a longitudinal central axis L1. Field gasket component 41 includes first and second long sides ls1 and ls2 extending substantially parallel to the longitudinal central axis L1 of the field gasket region A1, and first and second short sides ss1 and ss2. The first short side ss1 connects to the long sides ls1 and ls2 at a first end E1 of the field gasket component 41, while the second short side ss2 connects to the long sides ls1 and ls2 at a second end E2 of the field gasket component 41. The first and second short sides ss1 and ss2 convex toward each other to form a first recess R1 on the outer side of the first short side ss1 and a second recess R2 on the outer side of the second short side ss2. An upper portion arrangement 69a partially extends into the recess R1 of the field gasket component 41, while a lower portion arrangement 69b partially extends into the recess R2 of the field gasket component 41.

[0072] Upper part arrangement 69a in Figures 4a-4d Shown separately. It includes a base 71 made of an insulating material (such as a polymer). The base 71 consists of a plate, plate, or disk 73 and two similar protrusions in the shape of thick-walled cylinders 75 and 77. The plate 73 has opposing front surfaces 79 and rear surfaces 81, wherein the front surface 79 is in Figure 4a and 4c As can be seen, and on the rear surface 81 Figure 4bAs can be seen, two holes h extend through plate 73 on opposite sides of the longitudinal central axis L1 of the upper portion, arranged 69a. Cylinders 75 and 77 protrude from the front surface 79 of plate 73 and surround a corresponding one of the holes h through plate 73, thereby defining a primary hole 83 and a secondary hole 85 through base 71, respectively. Figure 4b As shown, plate 73 includes two inner walls 84 surrounding a corresponding one of the primary hole 83 and the secondary hole 85. Each of these inner walls 84 includes a first half 86 and a second half 88, which extend on opposite sides of the hole center plane CP that divides the primary hole 83 and the secondary hole 85 into two halves. Figure 4a and 4c As shown, the free end face of cylinder 75 forms a raised annular primary sub-surface 87 of the front surface 89 of base 71. The free end face of cylinder 77 forms a raised annular secondary sub-surface 91 of the front surface 89 of base 71. Therefore, the front surface 89 of base 71 includes the primary sub-surface 87 and the secondary sub-surface 91, as well as the portion of the front surface 79 of plate 73 extending outside cylinders 75 and 77. The rear surface 93 of base 71 includes the rear surface 81 of plate 73.

[0073] Furthermore, the base 71 includes a non-through first primary cavity 95 extending through the rear surface 93 of the base 71, and a non-through first secondary cavity 97 extending through the front surface 89 of the base 71. (As from...) Figures 4a-4d It can be clearly seen that the first primary cavity 95 and the first secondary cavity 97 are displaced relative to each other, that is, they are arranged on opposite sides of the longitudinal central axis L1 of the upper arrangement 69a. Figure 4d The cross-section of the plate 73 at the intermediate extending plane IP through the upper distribution arrangement 69a is shown, which is consistent with... Figure 4d The graphic planes coincide and extend between the front and rear surfaces 79 and 81 of plate 73. Furthermore, the intermediate extending plane IP is perpendicular to the hole center plane CP of plate 73. Figure 4b (Extended meaning. Reference) Figure 4d The base 71 also includes a plurality of first primary channels 99 and a plurality of first secondary channels 101. Both the first primary channels 99 and the first secondary channels 101 extend in an intermediate extension plane IP. Each first primary channel 99 connects to a primary aperture 83 and a first primary cavity 95. Each first secondary channel 101 connects to a secondary aperture 85 and a first secondary cavity 97. See also... Figure 4b Each first primary channel 99 extends from a corresponding opening 100 in a first half 86 of the inner wall 84 that includes the primary hole 83. Similarly, each first primary channel 101 extends from a corresponding opening 102 in a first half 86 of the inner wall 84 that surrounds the secondary hole 85.

[0074] Still referencing Figure 4e-4hThere are multiple different flow paths through the base 71 and the upper portion arranged 69a. More specifically, the primary orifice 83 defines a direct primary flow path DP, while each first primary channel 99, together with the primary orifice 83 and the first primary cavity 95, defines a corresponding first transfer primary flow path TP1. Furthermore, the secondary orifice 85 defines a direct secondary flow path DS, while each first primary channel 101, together with the secondary orifice 85 and the first primary cavity 97, defines a corresponding first transfer secondary flow path TS1.

[0075] Refer again Figures 4a-4c The distribution arrangement 69a also includes an annular primary bore gasket 103 extending around the primary bore 83 and abutting against the primary sub-surface 87 for sealing; and an annular secondary bore gasket 105 extending around the secondary bore 85 and abutting against the secondary sub-surface 91 of the front surface 89 of the base 71 for sealing. Furthermore, the distribution arrangement 69a also includes an annular first primary cavity gasket 107 extending around the first primary cavity 95 and abutting against the rear surface 93 of the base 71 for sealing; and an annular first primary cavity gasket 109 extending around the first primary cavity 97 and abutting against the front surface 89 of the base 71 for sealing.

[0076] refer to Figure 4a and 4b A rod engagement recess 111 is provided in the plate 73 of the distribution arrangement 69a. The rod engagement recess 111 extends from the outer edge 113 of the plate 73 and is arranged to receive a rod for supporting the heat transfer plates 5x, 5 of the device 1, which is not shown herein.

[0077] like Figure 5a and 5b As shown, the upper portion arrangement 69a is further provided with snap-fit ​​devices 115, which are in the form of L-shaped protrusions projecting from the front surface 79 of the plate 73. Four snap-fit ​​devices 115 are equidistantly positioned around each of the primary holes 83 and secondary holes 85 within corresponding recesses 117 formed in the cylinders 75 and 77. (See reference) Figure 1a , 2In configuration 5b, the snap-fit ​​device 115 and cylinders 75 and 77 are arranged to protrude through two of the third, fifth, fourth, and sixth port holes 19, 21, 29, and 31 of the two adjacent heat transfer plates 5 of the device 1, so as to form a second gap I2 between them. Furthermore, the front surface 79 of the plate 73, which is arranged in an upper portion arrangement 69a, is positioned facing the inner heat transfer plate 5' of the two adjacent heat transfer plates 5, and the first-stage cavity gasket 109 is arranged to abut against the inner heat transfer plate 5' around one of its first and second transfer holes 25 and 35. The heat transfer plates 5 are provided with locking devices 119, which are equidistantly positioned around the third, fifth, fourth, and sixth port holes 19, 21, 29, and 31. The snap-fit ​​device 115 of the upper part arrangement 69a is arranged to interlock with a corresponding locking device 119 of the outer heat transfer plate 5” of the two adjacent heat transfer plates 5, so as to connect the two adjacent heat transfer plates 5', 5” and the sealing arrangement S arranged between them to form an electrolytic cell EC.

[0078] The lower arrangement 69b is similar to the upper arrangement 69b, except that it extends the first primary channel 99 and the first secondary channel 101. (See reference) Figure 4b and 4d For the lower distribution arrangement 69b, each first primary channel 99 extends from a corresponding opening (not shown) in the second half 88 of the inner wall 84 surrounding the primary hole 83. Similarly, each first primary channel 101 extends from a corresponding opening (not shown) in the second half 88 of the inner wall 84 surrounding the secondary hole 85. In an alternative embodiment, the upper and lower distribution arrangements can be made identical, resulting in a device comprising only one distribution arrangement.

[0079] refer to Figure 1a In apparatus 1, each heat transfer plate 5 engages with a field gasket component 41, an upper distribution arrangement 69a, and a lower distribution arrangement 69b on the rear surface 9, and with a sealing arrangement S on the front surface 7. The field gasket component 41 and the sealing arrangement S are at least partially arranged in grooves in the heat transfer plate 5, which are not shown or further described herein. See also... Figure 2 The four annular sealing components 47 of the sealing arrangement S surround a corresponding one of the first, second, seventh, and eighth port holes 17, 27, 23, and 33 of the heat transfer plate 5. Furthermore, reference is also made to... Figure 3 The gasket component 41 surrounds the first, second, seventh, and eighth port holes 17, 27, 23, and 33 of the heat transfer plate 5. Furthermore, refer to... Figure 4a and 4bIn the heat transfer plate 5, the rear surface 81 of each of the upper and lower portions 69a and 69b faces the heat transfer plate 5, and the primary holes 83 and secondary holes 85 of the upper and lower portions 69a and 69b are aligned with one of the corresponding third, fourth, fifth, and sixth port holes 19, 29, 21, and 31 of the heat transfer plate 5, and the first primary cavity gasket 107 abuts against the heat transfer plate 5 around one of the corresponding first and second transfer holes 25 and 35 of the heat transfer plate 5. Furthermore, consistent with the above description, the cylinders 75 and 77 of the upper and lower portions 69a and 69b protrude through two adjacent heat transfer plates 5 arranged on the front surface 79 of the plate 73 to abut against the rear surface 93 of the base 71 of the adjacent upper and lower portions 69a and 69b.

[0080] Figure 6 The arrangement is shown in a highly simplified manner when multiple (four in this case) electrolytic cells EC are properly engaged with each other in device 1. Referring also to 4a and 4b, the primary hole gasket 103 and secondary hole gasket 105 of the upper arrangement 69a' seal against the rear surface 93 of the base 71 surrounding the hole h of another upper arrangement 69a"', and vice versa. Thus, the upper arrangement 69a, like the lower arrangement 69b, and more specifically its cylinders 75 and 77, forms two insulating tunnels or ports p through device 1. Figure 6 (Only one of them is shown in the figure), more specifically the second primary inlet port 57p, the second primary inlet port 57s, the second primary outlet port 59p, and the second primary outlet port 59s, which will be discussed further below.

[0081] When the device 1 is ready for use, the heat transfer plates 5 and 5x, along with the centrally located field gasket component 41 and the sealing arrangement S, are compressed between the frame plates F to form first and second flow channels C1 and C2, and port devices for conveying the first and second fluids through the device 1. After such compression, each pair of heat transfer plates 5 (such as heat transfer plates 5b and 5c) abuts against each other in the contact area, while contact between adjacent pairs of heat transfer plates 5 (such as heat transfer plates 5c and 5d) is prevented by the presence of the sealing arrangement S between the plate pairs. This separation or insulation between the plate pairs is necessary for the electrolysis of the device 1 to function properly, as will be discussed further below. Compression is achieved by some kind of tightening device (such as bolts and nuts), which are not shown or further described herein. Reference is made to the heat transfer plates 5 of the device 1 (only one of which is visible). Figure 3The port devices include a first inlet port device 53 and a first outlet port device 55 for a first fluid, and a second inlet port device 57 and a second outlet port device 59 for a second fluid. The first inlet port device 53 includes a first primary inlet port 53p and a first secondary inlet port 53s; the first outlet port device 55 includes a first primary outlet port 55p and a first secondary outlet port 55s; the second inlet port device 57 includes a second primary inlet port 57p and a second secondary inlet port 57s; and the second outlet port device 59 includes a second primary outlet port 59p and a second secondary outlet port 59s.

[0082] refer to Figure 1a A first fluid, such as deionized water, serving as the cooling fluid, is supplied to device 1 via a first inlet device 61 and exits device 1 via a first outlet device 63. The first inlet device 61 includes a first primary inlet 61p and a first secondary inlet 61s, while the first outlet device 63 includes a first primary outlet 63p and a first secondary outlet 63s. (Reference) Figure 1b A second fluid, which is an electrolyte, such as a mixture of water and an alkaline agent (such as potassium hydroxide), is supplied into device 1 via a second inlet device 65 and discharged from device 1 via a second outlet device 67. The second inlet device 65 includes a second primary inlet 65p and a secondary inlet 65s, while the second outlet device 67 includes a second primary outlet 67p and a secondary outlet 67s.

[0083] The first fluid path P1 for conveying the first fluid through device 1 includes a first primary fluid path P1p and a first secondary fluid path P1s. (Reference) Figure 1a and Figure 3 And the dashed lines indicate that the first primary fluid path P1p extends from the first primary inlet 61p to the first primary inlet port 53p, passes through the first flow channel C1, enters the first primary outlet port 55p, and reaches the first primary outlet 63p. The first primary fluid path P1s extends from the first primary inlet 61s to the first primary inlet port 53s, passes through the first flow channel C1, enters the first primary outlet port 55s, and reaches the first primary outlet 63s. The second fluid path P2 for conveying the second fluid through the device 1 includes: a second primary fluid path P2p, which includes a direct primary flow path DP through each of the upper and lower portions arranged 69a and 69b, and a first transfer primary flow path TP1. Figure 4e and 4f ), and a second-stage fluid path P2s, which includes a direct secondary flow path DS through each of the upper and lower portions arranged in 69a and 69b, and a first transfer secondary flow path TS1. Figure 4g and 4h ). refer to Figure 1b and3 And the dashed line indicates that the second primary fluid path P2p extends from the second primary inlet 65p, passes through the second primary inlet port 57p, that is, along the direct primary flow path DP through the lower distribution arrangement 69b, passes through the lower distribution arrangement 69b and enters the first gap I1 outside the first flow channel C1 along the first transfer primary flow path TP1, passes through the corresponding first transfer hole 25 of every other heat transfer plate (i.e., plate 5a, 5c, ...), enters the second primary sub-channel C2P, passes through the second primary sub-channel C2P, passes through the corresponding second transfer hole 35 of every other heat transfer plate (i.e., plate 5a, 5c, ...), enters the first gap I1 outside the first flow channel C1, passes through the upper distribution arrangement 69a along the first transfer primary flow path TP1, passes through the direct primary flow path DP through the upper distribution arrangement 69a, that is, through the second primary outlet port 59p, and reaches the second primary outlet 67p. The second-stage fluid path P2s extends from the second-stage inlet 65s, passes through the second-stage inlet port 57s, i.e., along the direct secondary flow path DS through the lower distribution arrangement 69b, passes through the lower distribution arrangement 69b and enters the first gap I1 outside the first flow channel C1 along the first transfer secondary flow path TS1, enters the second-stage sub-channel C2S through the corresponding second transfer hole 35 of every other heat transfer plate (i.e., plate 5b, 5d, ...), passes through the second-stage sub-channel C2S, enters the first gap I1 outside the first flow channel C1 through the corresponding first transfer hole 25 of every other heat transfer plate (i.e., plate 5b, 5d, ...), passes through the upper distribution arrangement 69a along the first transfer secondary flow path TS1, passes through the upper distribution arrangement 69a along the direct secondary flow path DS, i.e., passes through the second-stage outlet port 59s, and reaches the second-stage outlet 67s.

[0084] Refer again Figure 3 The first fluid (i.e., the cooling fluid) is conveyed through device 1 via ports 53s, 53p, 55s, and 55p, while the second fluid (i.e., the electrolyte) is conveyed through device 1 via ports 57p, 57s, 59p, and 59s. Ports 53s, 53p, 55s, and 55p are arranged at a greater distance from the longitudinal center plane P of device 1 compared to ports 57p, 57s, 59p, and 59s. This means that the cooling fluid is conveyed outside the electrolyte.

[0085] Therefore, a method for electrolysis is performed using apparatus 1. The method includes the following steps: applying current to apparatus 1 such that every other heat transfer plate (including heat transfer plates 5a and 5c) becomes an anode, and the remaining heat transfer plates (including heat transfer plates 5b and 5d) become cathodes. As mentioned above, an insulating sealing arrangement S between the heat transfer plates 5 is arranged in the second gap I2 of apparatus 1 (i.e., between heat transfer plates 5a and 5b and between heat transfer plates 5c and 5d, etc.), dividing the second flow channel C2 into a second primary sub-channel C2P and a second secondary sub-channel C2S. Electrolysis can thus be performed within the second flow channel C2 of apparatus 1. Also as explained above, the ports 57p, 57s, 59p, and 59s for the second fluid (i.e., electrolyte) are "lined" with plastic, which minimizes the risk of short circuits between the heat transfer plates 5, which could cause apparatus 1 to malfunction.

[0086] As described above, for the second fluid (i.e., the electrolyte), there are two fluid paths through device 1. Therefore, the method includes the following steps: supplying a first portion of the second fluid into a first gap I1 outside the first flow channel C1, and entering the second primary sub-channel C2P through first transfer holes 25 of heat transfer plates 5a, 5c, etc.; and supplying a second portion of the second fluid into the first gap I1 outside the first flow channel C1, and entering the second secondary sub-channel C2S through second transfer holes 35 of heat transfer plates 5b, 5d, etc. Furthermore, the method also includes the step of supplying the first and second portions of the second fluid through the second flow channel C2, thereby causing water in the electrolyte to decompose into hydrogen and oxygen, forming a primary component in the second primary sub-channel C2P, and a secondary component in the second secondary sub-channel C2S, wherein the primary component contains more oxygen and less hydrogen than the second component. The primary component of the second fluid is supplied to the first gap I1 outside the first flow channel C1 through the second transfer holes 35 of heat transfer plates 5a, 5c, etc., while the secondary component of the second fluid is supplied to the first gap I1 outside the first flow channel C1 through the first transfer holes 25 of heat transfer plates 5b, 5d, etc. The primary and secondary components are discharged separately from the device 1 through the second primary outlet 67p and the second secondary outlet 67s, respectively. Heat is generated during electrolysis in the second flow channel C2. The method includes the following steps: supplying the first fluid (i.e., deionized water) through the first flow channel C1 (i.e., on both sides of the electrolysis channel C2) to effectively and uniformly dissipate the heat generated by electrolysis from the device 1.

[0087] The primary and secondary components will typically contain a mixture of liquid and gas. By connecting the first primary channel 99 and the first primary channel 101 from above to the primary orifice 83 and the secondary orifice 85 arranged in the upper part 69a, the gas can be separated from the liquid already inside the second primary outlet port 59p and the second secondary outlet port 59s, which can improve the final gas-liquid separation of the primary and secondary components.

[0088] It should be emphasized that even if the properties of the second fluid change as it is supplied through the device, the second fluid is still referred to as the second fluid, and even if the individual compositions of the primary and secondary components of the second fluid change and are different from each other and different from the original second fluid, both the primary and secondary components of the second fluid are still referred to as the second fluid.

[0089] It should be emphasized that all components necessary for the proper functioning of this device, such as power supplies, connections, wiring, control units, valves, pumps, gaskets, sensors, pipes, metering devices, etc., are not described herein or shown in the accompanying drawings. Furthermore, the characteristics of different components of devices unrelated to this invention are also not described or shown herein.

[0090] Figures 7a-7d An upper partition arrangement 121a according to an alternative embodiment of the invention is shown. Upper partition arrangements 69a and 121a are very similar. The main differences between them are as follows. In upper partition arrangement 121a, the first primary cavity 95 and the first secondary cavity 97 are aligned with each other, i.e., arranged directly opposite each other in the rear surface 93 and the front surface 89 of the base 71. The first primary channel 99 extends between the rear surface 81 of the plate 73 and the intermediate extension plane IP, while the first secondary channel 101 extends between the front surface 79 of the plate 73 and the intermediate extension plane IP, allowing them to intersect each other, as shown. Figure 7d As shown in the figure.

[0091] Figure 8a A portion of another apparatus 2 for producing hydrogen by electrolysis is shown. There are many similarities between apparatus 1 and apparatus 2, and the above description largely applies to apparatus 2 as well. Therefore, the following will focus on the differences between apparatus 2 and apparatus 1. Apparatus 2 includes first and second types of heat transfer plates 5 stacked 3 (only partially shown), one of which... Figure 9 Shown separately. The first end 11 of the heat transfer plate 5 includes a first port hole 17, a third port hole 19, a fifth port hole 21, and a first transfer hole 25, while the second end 15 of the heat transfer plate 5 includes a second port hole 27, a fourth port hole 29, a sixth port hole 31, and a second transfer hole 35. Every other heat transfer plate 5 in the stack 3 is Figure 9The first type is shown, while the remaining heat transfer plates 5 in the stack 3 are of the second type, which is similar to the first type except that the first transfer hole 25 and the second transfer hole 35 are arranged on opposite sides of the longitudinal central axis L.

[0092] Refer again Figure 8a As in device 1, the heat transfer plate 5 of device 2 defines a first gap I1 and a second gap I2. An annular field gasket component 41 is arranged within each first gap I1 to define a first flow channel C1 therein. Two similar upper portioning arrangements 123a and two similar lower portioning arrangements 123b are also arranged within each first gap I1. An annular field seal component 43 is arranged within each second gap I2 to define a second flow channel C2 therein. A membrane 45 within each second gap I2 divides the second flow channel C2 into a second primary sub-channel C2P and a second secondary sub-channel C2S. The field seal component 43 and the isolation device including the membrane 45 are part of a sealing arrangement S, which also includes two annular ring seal components 47 integrally formed with the field seal component 43 and an insulating rubber sheet (not shown herein). The rubber sheet extends outside the field seal component 43 and the ring seal components 47 and is arranged to prevent contact between the heat transfer plates arranged on opposite sides of the rubber sheet.

[0093] refer to Figure 10 The field gasket component 41 includes a first long side portion ls1 and a second long side portion ls2, as well as a first short side portion ss1 and a second short side portion ss2, which are connected to the first long side portion ls1 and the second long side portion ls2 at a first end E1 and a second end E2, respectively. At the first end E1, the field gasket component 41, or more specifically its first short side portion ss1, is bent to extend between two upper distribution arrangements 123a. At the second end E2, the field gasket component 41, or more specifically its second short side portion ss2, is bent to extend between lower distribution arrangements 123b.

[0094] Figure 11a and 11b One of the upper arrangement 123a is shown separately. It includes a base 71 consisting of a plate 73 and a cylinder 77. An aperture h extends through the plate 73, and the cylinder 77 protrudes from the front surface 79 of the plate 73 and surrounds the aperture h to define a secondary aperture 85 through the base 71. The free end face of the cylinder 77 forms a raised annular secondary subsurface 91 on the front surface 89 of the base 71.

[0095] Furthermore, base 71 includes a non-through primary stage cavity 97 extending through the front surface 89 of base 71. Base 71 also includes a plurality of primary stage channels 101 (one of which is schematically shown in dashed lines) extending in an intermediate plane located between the front surface 79 and the rear surface 81 of plate 73. Each primary stage channel 101 connects a secondary aperture 85 and a primary stage cavity 97. There are multiple different flow paths through the upper partition arrangement 123a; a direct secondary flow path DS defined by the secondary aperture 85, and a first pass-through secondary flow path TS1 defined by each primary stage channel and the secondary aperture 85 and the primary stage cavity 97.

[0096] The distribution arrangement 123a also includes an annular secondary hole gasket 105 that extends around the secondary hole 85 and abuts against the secondary sub-surface 91 for sealing, and an annular primary cavity gasket 109 that extends around the primary cavity 97 and abuts against the front surface 89 of the base 71 for sealing.

[0097] refer to Figure 8a , 9 In device 2, the two annular ring sealing components 47 and the field gasket component 41 of the sealing arrangement S surround the first port hole 17 and the second port hole 27 of each heat transfer plate 5 on opposite sides. Furthermore, reference is also made to... Figure 11a and 11b The upper arrangement 123a, like the lower arrangement, is arranged such that one of the plates 73 faces the heat transfer plates 5a, 5c, etc. with its rear surface 81, while the other faces the heat transfer plates 5a, 5c, etc. with its front surface 79. The secondary holes 85 of the upper and lower arrangements 123a and 123b are aligned with corresponding ones of the third, fourth, fifth, and sixth port holes 19, 21, 29, and 31. Furthermore, the primary cavity 97 of one of the upper and lower arrangements 123a and 123b is aligned with corresponding one of the first and second transfer holes 25 and 35, with the corresponding primary cavity gasket 109 surrounding that corresponding one. Furthermore, each protrusion (in the form of a cylinder 77 and a gasket 105) in the upper and lower arrangements 123a and 123b passes through the heat transfer plate 5 facing the front surface 79 of the plate 73 and the next heat transfer plate 5 to abut against the next upper and lower arrangements 123a and 123b, and forms a total of four insulating ports through the device 2, more specifically the second primary inlet port 57p, the second primary inlet port 57s, the second primary outlet port 59p, and the second primary outlet port 59s.

[0098] Device 2 includes port devices for conveying first and second fluids through device 2. (Reference) Figure 10The port device includes a first inlet port device 53 and a first outlet port device 55 for a first fluid, and a second inlet port device 57 and a second outlet port device 59 for a second fluid. The first inlet port device 53 does not include a first primary inlet port and a first stage inlet port, but only a single inlet port. Similarly, the first outlet port device 55 does not include a first primary outlet port and a first stage outlet port, but only a single outlet port. However, the second inlet port device 57 includes a second primary inlet port 57p and a second stage inlet port 57s, and the second outlet port device 59 includes a second primary outlet port 59p and a second stage outlet port 59s.

[0099] refer to Figure 8a The first fluid is supplied to device 2 via the first inlet device 61 and exits device 2 via the first outlet device 63. Here, the first inlet device 61 does not include a first primary inlet and a first stage inlet, but only a single inlet. Similarly, here, the first outlet device 63 does not include a first primary outlet and a first stage outlet, but only a single outlet. (See reference...) Figure 8b The second fluid is supplied to the device 2 via the second inlet device 65 and to the device 1 via the second outlet device 67. The second inlet device 65 includes a second primary inlet 65p and a second secondary inlet 65s, while the second outlet device 67 includes a second primary outlet 67p and a second secondary outlet 67s.

[0100] There exists a single first fluid path P1 for conveying the first fluid through device 2. (Reference) Figure 8a and Figure 10 And the dashed line indicates that the first fluid path P1 extends from the first inlet 61 into the first inlet port 53, passes through the first flow channel C1, enters the first outlet port 55, and reaches the first outlet 63. The second fluid path P2 for conveying the second fluid through the device 1 includes a second primary fluid path P2p and a second secondary fluid path P2s. The second fluid path P2 for conveying the second fluid through the device 2 includes: a second primary fluid path P2p, which, when viewed from the frame plate F, includes a direct secondary flow path DS and a first transfer secondary flow path TS1 passing through each of the upper right partial arrangement 123a and the lower right partial arrangement 123b; and a second secondary fluid path P2s, which, when viewed from the frame plate F, includes a direct secondary flow path DS and a first transfer secondary flow path TS1 passing through each of the upper left partial arrangement 123a and the lower left partial arrangement 123b. (Reference) Figure 8b and 10And the dashed line indicates that the second primary fluid path P2p extends from the second primary inlet 65p, passes through the second primary inlet port 57p, that is, along the direct secondary flow path DS through the lower right portion arrangement 123b, passes through the lower right portion arrangement 123b and enters the first gap I1 outside the first flow channel C1 along the first transfer secondary flow path TS1, enters the second primary sub-channel C2P through the corresponding first transfer hole 25 of every other heat transfer plate (i.e., plate 5a, 5c, ...), passes through the second primary sub-channel C2P, enters the first gap I1 outside the first flow channel C1 through the corresponding second transfer hole 35 of every other heat transfer plate (i.e., plate 5a, 5c, ...), passes through the upper right portion arrangement 123a along the first transfer secondary flow path TS1, passes through the upper right portion arrangement 123a along the direct primary flow path DS, that is, through the second primary outlet port 59p, and reaches the second primary outlet 67p. The second-stage fluid path P2s extends from the second-stage inlet 65s, passes through the second-stage inlet port 57s, that is, along the direct secondary flow path DS through the lower left distribution arrangement 123b, passes through the lower left distribution arrangement 123b and enters the first gap I1 outside the first flow channel C1 along the first transfer secondary flow path TS1, enters the second-stage sub-channel C2S through the corresponding second transfer hole 35 of every other heat transfer plate (i.e., plate 5b, 5d, ...), passes through the second-stage sub-channel C2S, enters the first gap I1 outside the first flow channel C1 through the corresponding first transfer hole 25 of every other heat transfer plate (i.e., plate 5b, 5d, ...), passes through the upper left distribution arrangement 123a along the first transfer secondary flow path TS1, passes through the upper left distribution arrangement 123a along the direct secondary flow path DS, that is, passes through the second-stage outlet port 59s, and reaches the second-stage outlet 67s.

[0101] Refer again Figure 10 The first fluid is conveyed through device 2 via ports 53 and 55, while the second fluid is conveyed through device 2 via ports 57p, 57s, 59p, and 59s. Ports 57p, 57s, 59p, and 59s are arranged at a greater distance from the longitudinal center plane P of device 2 compared to ports 53 and 55. This means that the second fluid is conveyed outside the first fluid.

[0102] Figure 12a and 12b The upper portion arrangement 125a according to an alternative embodiment of the present invention is schematically shown from the front and rear, respectively. The upper portion arrangement 125a is compatible with... Figure 9The heat transfer plate 5 is used in conjunction with it. Like the upper arrangement 69a, the upper arrangement 125a includes a plastic base 71 having a primary hole 83, a secondary hole 85, a first primary cavity 95, a first primary cavity 97, a first primary channel 99 (one of which is schematically shown in dashed lines), and a first primary channel 101 (one of which is schematically shown in dashed lines). Furthermore, the upper arrangement 125a includes a non-through second primary cavity 96 extending through the rear surface 93 of the base 71, and a non-through second primary cavity 98 extending through the front surface 89 of the base 71. A plurality of second primary channels 104 (one of which is schematically shown in dashed lines) connect the primary hole 83 and the second primary cavity 96 to form a corresponding second primary flow path TP2 through the upper arrangement 125a. A plurality of second primary channels 106 (one of which is schematically shown in dashed lines) connect the secondary hole 85 and the second primary cavity 98 to form a corresponding second secondary flow path TS2 through the upper arrangement 125a. All the first primary channels 99, the second primary channel 104, the first stage channel 101, and the second stage channel 106 extend in an intermediate plane, which lies between the front and rear surfaces 79 and 81 of the plate 73 of the base 71. See also... Figure 12c The first primary channel 99 and the second primary channel 104 extend on one side of the partition wall W, while the first primary channel 101 and the second primary channel 106 extend on the other side of the partition wall W. (As from...) Figure 12b It is clearly visible that the first and second primary cavities 95 and 96 are arranged on opposite sides of the longitudinal central axis L1 of the upper distribution arrangement 125a, so as to enable the second fluid to be uniformly distributed in the second primary sub-channel C2P of the device similar to device 2. Similarly, as from Figure 12a It is clear that the first and second secondary cavities 97 and 98 are arranged on opposite sides of the longitudinal central axis L1 of the upper distribution arrangement 125a, so that the second fluid can be uniformly distributed in the second sub-channel C2S of the device similar to device 2.

[0103] Figure 13a and 13bThe upper partition arrangement 127a according to an alternative embodiment of the present invention is schematically shown from the front and rear, respectively. Upper partition arrangements 125a and 127a are very similar. The main differences between them are as follows: The first primary cavity 95 and the second primary cavity 98 of the upper partition arrangement 127a are aligned with each other, that is, they are arranged directly opposite each other on the rear surface 93 and the front surface 89 of the base 71. Furthermore, the second primary cavity 96 and the first primary cavity 97 of the upper partition arrangement 127a are aligned with each other. The first primary channel 99 and the second primary channel 104 extend between the rear surface 81 of the plate 73 and the intermediate extension plane, while the first primary channel 101 and the second primary channel 106 extend between the front surface 79 of the plate 73 and the intermediate extension plane.

[0104] Of course, the upper arrangement 125a and 127a also include gaskets and the like, which are necessary for their normal operation, even if not shown or discussed further herein.

[0105] The embodiments described above in this invention should be considered as examples only. Those skilled in the art will recognize that the discussed embodiments can be modified in various ways without departing from the inventive concept.

[0106] As an example, the cylinders 75 and 77 in the upper arrangement 69a have sufficient height to protrude through the two heat transfer plates 5. The upper arrangement 69a can also be constructed such that the height of the two cylinders 75 and 77 is half that of the upper arrangement, and two additional cylinders of equal height, aligned with a corresponding cylinder of one of the cylinders 75 and 77, protrude from the rear surface 81 of the plate 73. These four cylinders can be arranged to protrude in pairs through the heat transfer plates 5 arranged on opposite sides of the upper arrangement 69a.

[0107] The secondary and / or primary holes in the distribution arrangement do not need to be circular, but can be any suitable shape, such as elliptical or polygonal. The cavities or multiple cavities in the distribution arrangement do not need to be elongated, but can be any suitable shape, such as circular.

[0108] The distribution arrangement can be included in apparatuses used for electrolysis types other than alkaline water electrolysis, such as chlor-alkali electrolysis. Furthermore, the distribution arrangement can be included in apparatuses used for applications other than electrolysis, such as fuel cell-type apparatuses. It should be emphasized that the attributes used herein, such as first, second, third, ..., primary, secondary, upper, lower, and A, B, C, ..., are only used to distinguish different types and do not indicate any order between types, nor do they assign any special characteristics to the types. Therefore, as clearly seen from the above, the distribution arrangement according to the invention can include secondary orifices and primary cavities, but not primary orifices and primary primary cavities, etc.

[0109] It should be emphasized that "receive", "supply", and "transmit" in the text respectively mean "receive directly or indirectly", "supply directly or indirectly", and "transmit directly or indirectly".

[0110] It should be emphasized that all axes and planes mentioned in this article are hypothetical.

[0111] It should be emphasized that details not directly related to the present invention have been omitted, and the drawings are schematic only and not drawn to scale. It should also be noted that some drawings are more simplified than others. Therefore, some components may be shown in one drawing but omitted in another.

Claims

1. A distribution arrangement configured to be positioned between two corrugated heat transfer plates (5), the distribution arrangement comprising a base (71) comprising a plate (73) having opposing front surfaces (79) and rear surfaces (81) arranged to face a corresponding one of the heat transfer plates (5), a central extension plane (IP) of the plate (73) extending between the front surface (79) and the rear surface (81) of the plate (73), the front surface (89) and the rear surface (93) of the base (71) respectively comprising at least a portion of the front surface (79) and the rear surface (81) of the plate (73), the base (71) being provided with a through secondary hole (85), a non-through primary cavity (97), and a through-hole. One primary channel (101) is missing. The through secondary hole (85) extends through the front surface (89) and rear surface (93) of the base (71) to form a direct secondary flow path (DS) through the base (71). The non-through primary cavity (97) extends through the front surface (89) of the base (71). The at least one primary channel (101) extends inside the plate (73). The at least one primary channel (101) connects the secondary hole (85) and the primary cavity (97) to form a first transfer secondary flow path (TS1) through the base (71). The annular secondary sub-surface (91) of the front surface (89) of the base (71) surrounds the secondary hole (85).

2. The allocation arrangement according to claim 1, wherein, The base (71) is at least partially made of at least one insulating material.

3. The distribution arrangement according to claim 1 or 2, further comprising: Secondary hole gasket (105), the secondary hole gasket (105) surrounds the secondary hole (85) and abuts against the secondary sub-surface (91) of the front surface (89) of the base (71) for sealing; and primary cavity gasket (109), the primary cavity gasket (109) surrounds the primary cavity (97) and abuts against the front surface (89) of the base (71) for sealing.

4. The distribution arrangement according to claim 1 or 2, wherein, The secondary sub-surface (91) is raised relative to the rest of the front surface (89) of the base (71).

5. The distribution arrangement according to claim 1 or 2, wherein, The base (71) is provided with a through primary hole (83), a non-through first primary cavity (95) and at least one first primary channel (99). The through primary hole (83) extends through the front surface (89) and the rear surface (93) of the base (71) to form a direct primary flow path (DP) through the base (71). The non-through first primary cavity (95) extends through the rear surface (93) of the base (71). The at least one first primary channel (99) extends inside the plate (73) and connects the primary hole (83) and the first primary cavity (95) to form a first transfer primary flow path (TP1) through the base (71). The annular primary sub-surface (87) of the front surface (89) of the base (71) surrounds the primary hole (83).

6. The allocation arrangement according to claim 5 further includes: A primary hole gasket (103) that surrounds the primary hole (83) and abuts against the primary sub-surface (87) of the front surface (89) of the base (71) for sealing; and a first primary cavity gasket (107) that surrounds the first primary cavity (95) and abuts against the rear surface (93) of the base (71) for sealing.

7. The distribution arrangement according to claim 5, wherein, The first stage cavity (97) is aligned with the first primary cavity (95).

8. The allocation arrangement according to claim 5, wherein, The first stage cavity (97) is shifted relative to the first primary cavity (95).

9. The allocation arrangement according to claim 5, wherein, The at least one primary channel (101) extends between the front surface (79) of the plate (73) and the intermediate extension plane (IP) of the plate (73), and the at least one first primary channel (99) extends between the rear surface (81) of the plate (73) and the intermediate extension plane (IP) of the plate (73).

10. The distribution arrangement according to claim 5, wherein, The base (71) is provided with a non-penetrating secondary cavity (98) extending through the front surface (89) of the base (71) and at least one secondary channel (106) extending inside the plate (73), the at least one secondary channel (106) connecting the secondary hole (85) and the secondary cavity (98) to form a second transmission secondary flow path (TS2) through the base (71), wherein, The base (71) is provided with a non-penetrating second primary cavity (96) extending through the rear surface (93) of the base (71) and at least one second primary channel (104) extending inside the plate (73), the at least one second primary channel (104) connecting the primary hole (83) and the second primary cavity (96) to form a second transfer primary flow path (TP2) through the base (71).

11. The distribution arrangement according to claim 10, wherein, The first primary cavity (97) and the second primary cavity (98) are aligned with the second primary cavity (96) and the first primary cavity (95), respectively.

12. The distribution arrangement according to claim 10 or 11, wherein, The at least one primary channel (101) and the at least one secondary channel (106) extend between the front surface (79) of the plate (73) and the intermediate extension plane (IP) of the plate (73), and the at least one first primary channel (99) and the at least one second primary channel (104) extend between the rear surface (81) of the plate (73) and the intermediate extension plane (IP) of the plate (73).

13. The distribution arrangement according to claim 1 or 2, wherein, The plate (73) includes an inner wall (84) surrounding the secondary hole (85), the inner wall (84) including a first half (86) and a second half (88), the first half (86) and the second half (88) extending on opposite sides of a hole center plane (CP) that divides the secondary hole (85) into two halves, the hole center plane (CP) extending perpendicular to the intermediate extension plane (IP) of the plate (73), the first half (86) of the inner wall (84) of the plate (73) being arranged further away from the primary cavity (97) than the second half (88) of the inner wall (84) of the plate (73), and wherein the at least one primary channel (101) extends from an opening (100) in the first half (86) of the inner wall (84) of the plate (73).

14. The distribution arrangement according to claim 1 or 2, wherein, The plate (73) includes a rod engagement recess (111).

15. The distribution arrangement according to claim 1 or 2 further includes a snap-fit ​​device (115) that protrudes from the front surface (79) of the plate (73) around the annular secondary sub-surface (91) of the front surface (89) of the base (71), the snap-fit ​​device (115) being arranged to engage with a locking device (119) of one of the heat transfer plates (5) to connect the distribution arrangement to the one of the heat transfer plates (5).

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