Coil component, method for manufacturing same, and circuit module provided with coil component

Abstract

The technical problem of the present invention is to provide a coil component having a conductor pin of an improved shape. A coil component (100) is provided with an element body (10) provided with through-holes (21-24), conductor pins (31-34) inserted into the through-holes (21-24), and a protective member (60) embedded between the inner peripheral walls of the through-holes (21-24) and the outer peripheral walls of the conductor pins (31-34). The outer peripheral walls of the conductor pins (31-34) have protrusions (A) embedded in the protective member (60). The protrusions (A) are located in the vicinity of the ends of the conductor pins (31-34) located on the main surface (11) side and in the vicinity of the second ends of the conductor pins (31-34) located on the main surface (12) side. Thus, the conductor pin can be prevented from falling off.

Description

Technical Field

[0001] The present invention relates to a coil component including a conductor pin, a method for manufacturing the same, and a circuit module including such a coil component. Background Art

[0002] In Patent Document 1, a coil component is disclosed in which a metal columnar member is disposed in a hole provided in a magnetic sheet. Prior Art Documents Patent Documents

[0003] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2021-176166 Summary of the Invention Technical Problem to be Solved by the Invention

[0004] In the coil component of Patent Document 1, a cylindrical metal columnar member is used.

[0005] In the present invention, a coil component having a conductor pin with an improved shape, a method for manufacturing the same, and a circuit module including such a coil component will be described. Technical Means for Solving the Technical Problem

[0006] A coil component according to an aspect of the present invention includes: a body having a first main surface and a second main surface located on opposite sides of each other, and provided with a plurality of through holes penetrating from the first main surface to the second main surface; a plurality of conductor pins respectively inserted into the plurality of through holes; and a protection member buried between an inner peripheral wall of the through hole and an outer peripheral wall of the conductor pin, wherein the outer peripheral wall of the conductor pin has a protrusion portion buried with the protection member, and the protrusion portion is provided near a first end portion of the conductor pin located on the first main surface side and near a second end portion of the conductor pin located on the second main surface side.

[0007] A circuit module according to an aspect of the present invention includes: a substrate having a first pad pattern and a second pad pattern; and the above-described coil component mounted on the substrate, wherein a first external terminal and a second external terminal are respectively connected to the first pad pattern and the second pad pattern.

[0008] A method for manufacturing a coil component according to an aspect of the present invention includes: a step of preparing a body having a first main surface and a second main surface located on opposite sides of each other; a step of forming a plurality of through holes penetrating from the first main surface to the second main surface in the body; a step of inserting conductor pins into the plurality of through holes respectively; a step of burying a protection member between an inner peripheral wall of the through hole and an outer peripheral wall of the conductor pin; a step of grinding the first main surface and the second main surface of the body until both end portions of the conductor pin are exposed; and a step of continuously grinding until both end portions of the conductor pin are deformed. Advantageous Effects of the Invention

[0009] According to the present invention, it is possible to provide a coil component capable of realizing a conductor pin with an improved shape, a manufacturing method thereof, and a circuit module including such a coil component. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a schematic perspective view showing the appearance of a coil component 100 according to a first embodiment of the technology of the present invention. Figure 2 (a) is a schematic cross-sectional view along the Figure 1 A-A line shown in Figure 2 and (b) is a schematic cross-sectional view along the Figure 1 B-B line shown in Figure 3 is an enlarged view for explaining the structure near the end portion of the conductor pin 31 included in the coil component 100 in the Z direction. Figure 4 is an enlarged view for explaining the structure near the end portion of the conductor pin 31 according to a first modification in the Z direction. Figure 5 is an enlarged view for explaining the structure near the end portion of the conductor pin 31 according to a second modification in the Z direction. Figure 6 is a process chart for explaining the manufacturing method of the coil component 100. Figure 7 is a process chart for explaining the manufacturing method of the coil component 100. Figure 8 is a process chart for explaining the manufacturing method of the coil component 100. Figure 9 is a process chart for explaining the manufacturing method of the coil component 100. Figure 10 is a process chart for explaining the manufacturing method of the coil component 100. Figure 11 is a process chart for explaining the manufacturing method of the coil component 100. Figure 12 is a schematic exploded perspective view for explaining the structure of the circuit module 120. Figure 13 is a schematic cross-sectional view for explaining the structure of a coil component 200 according to a second embodiment of the technology of the present invention. Figure 14 is an enlarged view for explaining the structure near the end portion of the conductor pin 31 included in the coil component 200 in the Z direction. Figure 15 is a schematic cross-sectional view for explaining the structure of a coil component 300 according to a third embodiment of the technology of the present invention. Figure 16It is a schematic cross-sectional view showing the structure of the coil component 400 according to the fourth embodiment of the technology of the present invention. Figure 17 It is a schematic cross-sectional view showing the structure of the coil component 500 according to the fifth embodiment of the technology of the present invention. Figure 18 It is a schematic cross-sectional view showing the structure of the coil component 600 according to the sixth embodiment of the technology of the present invention. Figure 19 It is a schematic cross-sectional view showing the structure of the coil component 700 according to the seventh embodiment of the technology of the present invention. Detailed Embodiments

[0011] Hereinafter, embodiments of the technology according to the present invention will be described in detail with reference to the drawings.

[0012] <First Embodiment> Figure 1 It is a schematic perspective view showing the appearance of the coil component 100 according to the first embodiment of the technology of the present invention. In addition, Figure 2 (a) of Figure 1 is a schematic cross-sectional view taken along the line A-A shown in Figure 2 (b) of Figure 1 is a schematic cross-sectional view taken along the line B-B shown in

[0013] As Figure 1 and Figure 2 show, the coil component 100 of the first embodiment includes: a body 10 having through holes 21 to 24; and conductor pins 31 to 34 respectively inserted into the through holes 21 to 24. The body 10 may be made of a composite magnetic material, which is formed by fixing magnetic particles made of high magnetic permeability materials such as ferrite and Permalloy with a resin binder. The body 10 has main surfaces 11 and 12 that form the XY plane and are located on opposite sides of each other, and the through holes 21 to 24 are provided so as to penetrate the body 10 from the main surface 11 to the main surface 12.

[0014] The through hole 21 and the through hole 22 are arranged in the X direction, and their positions in the Y direction are the same. The through hole 23 and the through hole 24 are arranged in the X direction, and their positions in the Y direction are the same. The positions of the through holes 21 and 22 in the Y direction are different from the positions of the through holes 23 and 24 in the Y direction. In addition, the positions of the through holes 21 to 24 in the X direction are different from each other.

[0015] The positional relationship of the conductor pins 31 to 34 is the same as that of the through holes 21 to 24. The conductor pins 31 to 34 are columnar members made of a good conductor such as Cu, and are conductive members preformed into a pin shape differently from the processing of the substrate 10. Therefore, it is different from the structure formed by electroplating or the like during the processing of the substrate 10. By using such conductor pins 31 to 34, even when the aspect ratio of the through holes 21 to 24 is high, long-time electrolytic plating is not required, and voids or the like are not generated. The diameter of the conductor pins 31 to 34 is smaller than the diameter of the through holes 21 to 24, whereby a gap can be formed between the inner peripheral wall of the through holes 21 to 24 and the outer peripheral wall of the conductor pins 31 to 34. As Figure 2 shown, a protective member 60 made of an insulating material such as resin is filled in this gap. Thereby, the detachment of the conductor pins 31 to 34 can be prevented. In addition, even when the insulation of the substrate 10 is insufficient, contact between the conductor pins 31 to 34 and the substrate 10 can be prevented, so that insulation between the two can be ensured. Here, the conductor pins 31 to 34 can be cylindrical or prismatic.

[0016] The main surface 11 of the substrate 10 is covered with an insulating film 70, and the main surface 12 of the substrate 10 is covered with an insulating film 80. The insulating films 70 and 80 are both made of resin or the like. In the insulating film 70, openings 71 to 74 are provided at positions overlapping the conductor pins 31 to 34 when viewed from the Z direction. Thereby, one end of the conductor pins 31 to 34 in the Z direction is exposed at the openings 71 to 74. In addition, in the insulating film 80, openings 81 to 84 are provided at positions overlapping the conductor pins 31 to 34 when viewed from the Z direction. Thereby, the other end of the conductor pins 31 to 34 in the Z direction is exposed at the openings 81 to 84.

[0017] On the surface of the insulating film 70, connection patterns 51 and 53 extending in the X direction are provided. One end of the connection pattern �1 overlaps with the opening 71, and the other end of the connection pattern 51 overlaps with the opening 72. Thereby, one end of the conductor pin 31 and one end of the conductor pin 32 are connected via the connection pattern 51. In addition, one end of the connection pattern 53 overlaps with the opening 73, and the other end of the connection pattern 53 overlaps with the opening 74. Thereby, one end of the conductor pin 33 and one end of the conductor pin 34 are connected via the connection pattern 53.

[0018] External terminals 41, 42 and a connection pattern 52 are provided on the surface of the insulating film 80. The external terminal 41 is disposed at one end in the X direction of the substrate 10 so as to overlap with the opening 81. The external terminal 42 is disposed at the other end in the X direction of the substrate 10 so as to overlap with the opening 84. Thus, the other end of the conductor pin 31 is connected to the external terminal 41, and the other end of the conductor pin 34 is connected to the external terminal 42. In addition, the connection pattern 52 extends in a direction inclined with respect to the X direction, one end of which overlaps with the opening 82 and the other end of which overlaps with the opening 83. Thus, the other end of the conductor pin 32 is connected to the other end of the conductor pin 33 via the connection pattern 52.

[0019] With the above structure, four conductor pins 31 to 34 are connected in series between the external terminal 41 and the external terminal 42, functioning as a two-terminal type coil. The inductance of the coil component 100 is mainly determined by the lengths of the conductor pins 31 to 34, but the inductance can also be adjusted by the lengths of the connection patterns 51 to 53.

[0020] In addition, in the present embodiment, the current flowing in the conductor pins 31 to 34 turns back in the Z direction, so that the magnetic fields are mutually strengthened inside the substrate 10. For example, since the current directions in the conductor pin 31 and the conductor pin 32 are opposite to each other, the magnetic field generated by the conductor pin 31 and the magnetic field generated by the conductor pin 32 are mutually strengthened, thereby increasing the inductance. The same applies to the relationship between the conductor pins 32 and 33 and the relationship between the conductor pins 33 and 34. Furthermore, in the present embodiment, the positions of the conductor pins 31 to 34 in the X direction are all different, and the conductor pins 31 and 34 located at both ends in the X direction are respectively connected to the external terminals 41 and 42, so there is no interference with the conductor pins 32 and 33, and the areas of the external terminals 41 and 42 can be sufficiently ensured.

[0021] Figure 3 It is an enlarged view for explaining the structure near the end of the conductor pin 31 in the Z direction.

[0022] As Figure 3 shown, the diameter φ31 of the conductor pin 31 is smaller than the diameter φ21 of the through hole 21, and a protective member 60 is filled in the gap between the two. However, the diameter of the conductor pin 31 is not constant in the Z direction, and the diameter expands near the end in the Z direction. This expansion of the diameter is caused by the protrusion A provided on the outer peripheral wall of the conductor pin 31. In Figure 3 the example shown, due to the presence of the protrusion A, the diameter φA of the end of the conductor pin 31 in the Z direction is larger than the diameter φ31. The protrusion A is embedded in the protective member 60, and as a result, the adhesion between the conductor pin 31 and the protective member 60 can be improved. With such an improved shape, it is difficult for the conductor pin 31 to fall off from the through hole 21. InFigure 3 In the example shown, the protrusion A does not contact the base body 10. However, when the base body 10 has a certain degree of insulation, the protrusion A can also contact the base body 10.

[0023] In Figure 3 one end portion of the conductor pin 31 in the Z direction is shown. However, as shown in (a) of Figure 2 , the protrusion A is provided at both end portions of the conductor pin 31. Similarly, for the other conductor pins 32 to 34, protrusions A are formed at both end portions in their Z directions.

[0024] In addition, the diameter φ71 of the opening 71 provided in the insulating film 70 is smaller than the diameter φ31 of the conductor pin 31, and the conductor pin 31 is exposed over the entire surface of the opening 71. Thus, even when there is an offset in the formation position of the opening 71, contact between the connection pattern 51 and the base body 10 can be prevented. Regarding the diameter φ71 of the opening 71, it may also be larger than the diameter φ31 of the conductor pin 31. However, even in this case, as long as the diameter φ71 of the opening 71 is made smaller than the diameter φ21 of the through hole 21, contact between the connection pattern 51 and the base body 10 can be prevented. That is, when the diameter φ71 of the opening 71 is substantially the same as the diameter φ21 of the through hole 21, if there is a slight offset in the formation position of the opening 71, the connection pattern 51 contacts the base body 10. However, this situation can be prevented in the present embodiment. Moreover, in the present embodiment, since the diameter of the conductor pin 31 expands at the end portion in the Z direction, even when there is an offset in the formation position of the opening 71, the contact area between the connection pattern 51 and the conductor pin 31 can be sufficiently ensured.

[0025] Above, the relationship between one end portion of the conductor pin 31 and the through hole 21 and the opening 71 has been described. However, the relationship between the other end portion of the conductor pin 31 and the through hole 21 and the opening 81 is the same. Also, the relationships between the conductor pin 32 and the through hole 22 and the openings 72, 82, between the conductor pin 33 and the through hole 23 and the openings 73, 83, and between the conductor pin 34 and the through hole 24 and the openings 74, 84 are the same.

[0026] In addition, in Figure 3 the example shown, the protrusion A exists over the entire circumference of the outer peripheral wall of the conductor pin 31. However, as in the Figure 4 deformation example shown, the protrusion A may exist only on a part of the outer peripheral wall of the conductor pin 31. Also, as in the Figure 5 deformation example shown, not only at the end portion of the conductor pin 31, but also other protrusions B may exist in the intermediate section that is not the end portion of the conductor pin 31. The protrusions B are also embedded in the protection member 60, thereby further improving the close contact between the conductor pin 31 and the protection member 60.

[0027] Next, a manufacturing method of the coil component 100 of the present embodiment will be described.

[0028] Figures 6 to 11 It is a process diagram for explaining the manufacturing method of the coil component 100 of the present embodiment. Figures 6 to 11 It corresponds to the A-A cross section shown in Figure 1 Shown.

[0029] First, as Figure 6 Shown, a blank 10 made of a composite magnetic material or the like is prepared, and through holes 21 to 24 are formed by drilling or the like. Next, as Figure 7 Shown, in a state where the main surface 12 of the blank 10 is covered with the support 90, the conductor pins 31 to 34 are inserted into the through holes 21 to 24. At this time, the lengths of the conductor pins 31 to 34 may be shorter than the thickness of the blank 10. Next, as Figure 8 Shown, a protective member 60 is formed from the main surface 11 side of the blank 10, and the whole is pressurized using water pressure or the like, so that the protective member 60 is filled inside the through holes 21 to 24. Thereby, the protective member 60 can be buried between the inner peripheral wall of the through holes 21 to 24 and the outer peripheral wall of the conductor pins 31 to 34.

[0030] Next, as Figure 9 Shown, after peeling off the support 90, the main surfaces 11 and 12 of the blank 10 are polished until the end portions of the conductor pins 31 to 34 are exposed. At this time, polishing is performed under the condition that the end portions of the conductor pins 31 to 34 are easily deformed, and polishing is continued until the end portions of the conductor pins 31 to 34 are sufficiently deformed. As a result, the end portions of the conductor pins 31 to 34 are clearly deformed, and the protruding portions A in which the protective member 60 is buried can be formed.

[0031] Next, as Figure 10 Shown, after insulating films 70 and 80 are respectively formed on the main surfaces 11 and 12 of the blank 10, openings 71 to 74 are formed in the insulating film 70, and openings 81 to 84 are formed in the insulating film 80. As described above, the end portions of the conductor pins 31 to 34 are deformed by polishing, and their diameters are enlarged, so that sufficient margins can be ensured for the formation positions of the openings 71 to 74 and 81 to 84. Next, after a seed layer (not shown) is formed on the surfaces of the insulating films 70 and 80 by electroless plating, as Figure 11 Shown, resist 91 and 92 are respectively formed on the surfaces of the insulating films 70 and 80. After electrolytic plating is performed in this state, if the resists 91 and 92 are peeled off and the seed layer is etched, the external terminals 41 and 42 and the connection patterns 51 to 53 are formed, and the Figure 1 Coil component 100 of the present embodiment shown is completed.

[0032] Thus, in the present embodiment, the two end portions of the conductor pins 31 to 34 are ground under conditions where they are easily deformed, and the grinding is continued until the two end portions of the conductor pins 31 to 34 are deformed. Therefore, the protruding portions A can be formed at the two end portions of the conductor pins 31 to 34. The coil component 100 manufactured in this way can constitute the circuit module 120 by being mounted on the mounting area 100A on the substrate 110 shown in Figure 12 On the substrate 110, pad patterns 111 and 112 are provided on the surface, and the coil component 100 is mounted on the substrate 110 in such a manner that the external terminals 41 and 42 are respectively connected to the pad patterns 111 and 112.

[0033] <Second Embodiment> Figure 13 FIG. is a schematic cross-sectional view showing the structure of the coil component 200 according to the second embodiment for explaining the technology of the present invention. Here, Figure 13 (a) of corresponds to Figure 2 the cross-section shown in (a) of Figure 13 (b) of corresponds to Figure 2 the cross-section shown in (b) of

[0034] As shown in Figure 13 , the coil component 200 according to the second embodiment is different from the coil component 100 according to the first embodiment in that the outer peripheral walls of the conductor pins 31 to 34 are covered with the protective film 61. Since the other basic structures are the same as those of the coil component 100 according to the first embodiment, the same reference numerals are given to the same elements, and the repeated description is omitted.

[0035] The protective film 61 is made of an insulating material and is pre-covered on the outer peripheral walls of the conductor pins 31 to 34. By using such conductor pins 31 to 34, the insulation property with respect to the body 10 can be further improved. In addition, in the present embodiment, since the conductor pins 31 to 34 are covered with the protective film 61, a material with insufficiently high insulation can also be used as the material of the protective member 60. As an example, a resin material containing a filler made of a magnetic material such as ferrite or permalloy can be used for the protective member 60. Thereby, the inductance of the coil component 200 can be further increased.

[0036] As shown in the enlarged view in (a) of Figure 14 , in the present embodiment, the protruding portion A may also break through the protective film 61. That is, the protective film 61 may be formed on the portions of the outer peripheral walls of the conductor pins 31 to 34 other than the two end portions. In this case, a part of the protruding portion A contacts the protective member 60 without the protective film 61 therebetween. Such a structure is used as Figure 9As described, it is obtained by grinding the two end portions of the conductor pins 31 to 34 under conditions where they are easily deformed and continuing the grinding until the two end portions of the conductor pins 31 to 34 are deformed. That is, without performing special processing on the conductor pins 31 to 34 before inserting them into the through holes 21 to 24, the protrusion portions A can be formed on the conductor pins 31 to 34 having the protective film 61. Or, as shown in the enlarged view of (b) of Figure 14 , the protective film 61 may also be formed on substantially the entire surface of the outer peripheral wall of the conductor pins 31 to 34 including the two end portions. In the case of the manner shown in (b) of Figure 14 , the insulation property with respect to the element body 10 can be further improved.

[0037] <Third Embodiment> Figure 15 FIG. is a schematic cross-sectional view showing the structure of a coil component 300 for explaining the third embodiment of the technology of the present invention. Here, Figure 15 (a) of Figure 2 corresponds to the cross-section shown in (a) of Figure 15 (b) of Figure 2 corresponds to the cross-section shown in (b) of

[0038] As shown in Figure 15 , the difference between the coil component 300 of the third embodiment and the coil component 100 of the first embodiment is that the diameters φ21 and φ24 of the through holes 21 and 24 are larger than the diameters φ22 and φ23 of the through holes 22 and 23, and the diameters φ31 and φ34 of the conductor pins 31 and 34 are larger than the diameters φ32 and φ33 of the conductor pins 32 and 33. Since the other basic structures are the same as those of the coil component 100 of the first embodiment, the same reference numerals are assigned to the same elements, and the repeated description is omitted.

[0039] In the present embodiment, since the diameters φ31 and φ34 of the conductor pins 31 and 34 are larger than the diameters φ32 and φ33 of the conductor pins 32 and 33, the cross-sectional areas of the conductor pins 31 and 34 are larger than the cross-sectional areas of the conductor pins 32 and 33. Therefore, the strength of the conductor pins 31 and 34 can be improved. Thus, even when an external force is applied via the external terminals 41 and 42, the conductor pins 31 and 34 are not easily detached or damaged. In addition, since the cross-sectional areas of the conductor pins 32 and 33 are smaller than the cross-sectional areas of the conductor pins 31 and 34, the volume of the element body 10 can be sufficiently ensured.

[0040] <Fourth Embodiment> Figure 16 FIG. is a schematic cross-sectional view showing the structure of a coil component 400 for explaining the fourth embodiment of the technology of the present invention. Here, Figure 16 (a) of Figure 2 corresponds to the cross-section shown in (a) of Figure 16The (b) of Figure 2 the cross-section shown in (b).

[0041] As Figure 16 shown, the coil component 400 of the fourth embodiment is different from the coil component 100 of the first embodiment in that the diameters of the through holes 21 to 24 increase from the main surface 11 of the base body 10 toward the main surface 12, and the diameters of the conductor pins 31 to 34 increase from the main surface 11 of the base body 10 toward the main surface 12. Since other basic structures are the same as those of the coil component 100 of the first embodiment, the same reference numerals are assigned to the same elements, and repeated descriptions are omitted.

[0042] In the present embodiment, since the diameters of the conductor pins 31 to 34 on the main surface 12 side where the external terminals 41 and 42 are formed increase, the external force applied via the external terminals 41 and 42 is dispersed, and it is difficult for the conductor pins 31 to 34 to fall off or break. In addition, since the shapes of the conductor pins 31 to 34 are the same, it is not necessary to use a variety of conductor pins of different types. When manufacturing the coil component 400 of the present embodiment, the insertion directions of the conductor pins 31 to 34 are Figure 7 opposite, and it is only necessary to insert from the main surface 12 side of the base body 10.

[0043] <Fifth Embodiment> Figure 17 is a schematic cross-sectional view showing the structure of the coil component 500 of the fifth embodiment for explaining the technology of the present invention. Here, Figure 17 the (a) of Figure 2 corresponds to the cross-section shown in (a) of Figure 17 the (b) of Figure 2 corresponds to the cross-section shown in (b) of

[0044] As Figure 17 shown, the coil component 500 of the fifth embodiment is different from the coil component 100 of the first embodiment in that the central axes of the through holes 21 to 24 are inclined with respect to the Z direction. Since other basic structures are the same as those of the coil component 100 of the first embodiment, the same reference numerals are assigned to the same elements, and repeated descriptions are omitted.

[0045] In this embodiment, since the central axes of the through-holes 21 to 24 are inclined with respect to the Z direction, the central axes of the conductor pins 31 to 34 inserted into the through-holes 21 to 24 are also inclined with respect to the Z direction. Thus, the lengths of the conductor pins 31 to 34 can be made larger than the height of the element body 10 in the Z direction, and the inductance can be increased. Alternatively, instead of inclining the central axes of the through-holes 21 to 24, the diameter of the through-holes 21 to 24 can be enlarged to incline the central axes of the conductor pins 31 to 34 inside the through-holes 21 to 24. In this case, the inclination direction of the conductor pins 31 to 34 can be controlled by the polishing conditions.

[0046] <Sixth Embodiment> Figure 18 FIG. is a schematic cross-sectional view showing the structure of a coil component 600 according to a sixth embodiment for explaining the technology of the present invention. Here, Figure 18 (a) corresponds to Figure 2 the cross section shown in (a) of Figure 18 and (b) corresponds to Figure 2 the cross section shown in (b) of

[0047] As Figure 18 shown, the coil component 600 according to the sixth embodiment is different from the coil component 100 according to the first embodiment in that the conductor pins 31 to 34 are bent. Since other basic structures are the same as those of the coil component 100 according to the first embodiment, the same reference numerals are assigned to the same elements, and redundant explanations are omitted.

[0048] In this embodiment, since the conductor pins 31 to 34 are bent instead of being straight, the lengths of the conductor pins 31 to 34 are larger than the height of the element body 10 in the Z direction, and the inductance can be increased. In addition, by using the pre-bent conductor pins 31 to 34, the inductance can be increased regardless of the control based on the polishing conditions or the like.

[0049] <Seventh Embodiment> Figure 19 FIG. is a schematic cross-sectional view showing the structure of a coil component 700 according to a seventh embodiment for explaining the technology of the present invention. Here, Figure 19 (a) corresponds to Figure 2 the cross section shown in (a) of Figure 19 and (b) corresponds to Figure 2 the cross section shown in (b) of

[0050] As Figure 19 shown, the coil component 700 according to the seventh embodiment is different from the coil component 100 according to the first embodiment in the formation positions of the openings 71 to 74. Since other basic structures are the same as those of the coil component 100 according to the first embodiment, the same reference numerals are assigned to the same elements, and redundant explanations are omitted.

[0051] In this embodiment, the positions of the openings 71 and 72 are shifted outward relative to the centers of the through-holes 21 and 22 so that the distance between the openings 71 and 72 in the X direction increases, and the positions of the openings 73 and 74 are shifted outward relative to the centers of the through-holes 23 and 24 so that the distance between the openings 73 and 74 in the X direction increases. As a result, the electrical length of the connection patterns 51 and 53 is lengthened, thereby making fine adjustments in the direction of increasing the inductance. Figure 19 In contrast, in the example shown, the positions of openings 71 and 72 are shifted inward relative to the centers of through-holes 21 and 22 to reduce the distance between them in the X direction, and the positions of openings 73 and 74 are shifted inward relative to the centers of through-holes 23 and 24 to reduce the distance between them in the X direction. In this case, since the electrical length of connection patterns 51 and 53 is shortened, fine adjustment is made toward reducing inductance.

[0052] Thus, according to this embodiment, the inductance can be finely adjusted during the process of forming openings 71 to 74 without changing the basic structure, such as the dimensions of element body 10 and the dimensions of conductor pins 31 to 34. Furthermore, the inductance can be finely adjusted by adjusting the distance between openings 82 and 83. Furthermore, the inductance can also be finely adjusted by adjusting the dimensions of openings 71 to 74 and 81 to 84.

[0053] While the embodiments of the technology of the present invention have been described above, the technology of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit and scope of the technology, which are naturally included in the scope of the technology of the present invention.

[0054] The technology of the present invention includes, but is not limited to, the following structural examples.

[0055] A coil component according to one aspect of the present invention comprises: a body having a first principal surface and a second principal surface located on opposite sides of each other, the body having a plurality of through-holes extending from the first principal surface to the second principal surface; a plurality of conductor pins inserted into the plurality of through-holes; and a protective member embedded between the inner peripheral walls of the through-holes and the outer peripheral walls of the conductor pins, the outer peripheral walls of the conductor pins having protrusions embedded in the protective member, the protrusions being provided near a first end of the conductor pin located on the first principal surface side and near a second end of the conductor pin located on the second principal surface side. This improved shape prevents the conductor pins from falling out.

[0056] In the coil component described above, the outer peripheral wall of the conductor pin may be covered with a protective film, and the protrusion may have a portion that contacts the protective member without interposing the protective film. This improves the insulation between the conductor pin and the element body.

[0057] In the above-described coil component, the protective member may also contain a magnetic material. Thereby, the inductance can be further increased.

[0058] The above-described coil component may also be further provided with: a first connection pattern and a third connection pattern provided on the first main surface of the substrate; and a second connection pattern provided on the second main surface of the substrate. The plurality of through holes include a first through hole, a second through hole, a third through hole, and a fourth through hole. The plurality of conductor pins include: a first conductor pin, a second conductor pin, a third conductor pin, and a fourth conductor pin respectively inserted into the first through hole, the second through hole, the third through hole, and the fourth through hole. The first end portion of the first conductor pin and the first end portion of the second conductor pin are connected via the first connection pattern. The second end portion of the second conductor pin and the second end portion of the third conductor pin are connected via the second connection pattern. The first end portion of the third conductor pin and the first end portion of the fourth conductor pin are connected via the third connection pattern. Thereby, the first conductor pin to the fourth conductor pin can be connected in series.

[0059] The above-described coil component may also be further provided with: a first insulating film covering the first main surface of the substrate. The first connection pattern is connected to the first conductor pin and the second conductor pin respectively via a first opening and a second opening provided in the first insulating film. The third connection pattern is connected to the third conductor pin and the fourth conductor pin respectively via a third opening and a fourth opening provided in the first insulating film. Thereby, insulation between the first connection pattern and the third connection pattern and the substrate can be ensured.

[0060] In the above-described coil component, it may also be that the diameters of the first opening, the second opening, the third opening, and the fourth opening are respectively smaller than the diameters of the first through hole, the second through hole, the third through hole, and the fourth through hole. Thereby, even when an offset occurs in the formation positions of the first opening to the fourth opening, insulation between the first connection pattern and the third connection pattern and the substrate can be ensured.

[0061] In the above-described coil component, it may also be that the diameters of the first opening, the second opening, the third opening, and the fourth opening are respectively smaller than the diameters of the first conductor pin, the second conductor pin, the third conductor pin, and the fourth conductor pin. Thereby, even when an offset occurs in the formation positions of the first opening to the fourth opening, the contact areas between the first connection pattern and the third connection pattern and the first conductor pin to the fourth conductor pin can be ensured.

[0062] In the above-described coil component, it may also be that the formation positions of the first opening and the second opening are offset with respect to the centers of the first through hole and the second through hole. Thereby, fine adjustment of the inductance can be performed.

[0063] The above-described coil component may also include: a first external terminal and a second external terminal provided on the second main surface of the base body, wherein the second end of the first conductor pin is connected to the first external terminal, and the second end of the fourth conductor pin is connected to the second external terminal. Thus, the first conductor pin to the fourth conductor pin can be connected in series between the first external terminal and the second external terminal.

[0064] The above-described coil component may also include: a second insulating film covering the second main surface of the base body, wherein the first external terminal is connected to the first conductor pin through a fifth opening provided in the second insulating film, and the second external terminal is connected to the fourth conductor pin through a sixth opening provided in the second insulating film. Thus, insulation between the first external terminal and the second external terminal and the base body can be ensured.

[0065] In the above-described coil component, the cross-sectional areas of the first conductor pin and the fourth conductor pin may be larger than those of the second conductor pin and the third conductor pin. Thus, even when an external force is applied via the first external terminal and the second external terminal, it is difficult for the first conductor pin and the fourth conductor pin to fall off or break.

[0066] A circuit module according to an aspect of the present invention includes: a substrate having a first pad pattern and a second pad pattern; and the above-described coil component mounted on the substrate, wherein the first external terminal and the second external terminal are respectively connected to the first pad pattern and the second pad pattern. Thus, a circuit module with a highly reliable coil component surface-mounted can be provided.

[0067] A manufacturing method of a coil component according to an aspect of the present invention includes: a step of preparing a base body having a first main surface and a second main surface located on opposite sides of each other; a step of forming a plurality of through-holes penetrating from the first main surface to the second main surface in the base body; a step of inserting conductor pins into the plurality of through-holes respectively; a step of embedding a protective member between the inner peripheral wall of the through-hole and the outer peripheral wall of the conductor pin; a step of grinding the first main surface and the second main surface of the base body until both ends of the conductor pin are exposed; and a step of continuously grinding until both ends of the conductor pin are deformed. Thus, protrusions can be easily formed on the outer peripheral wall of the conductor pin.

[0068] This application claims the right of Japanese Patent Application No. 2022-202119 filed on December 19, 2022, the entire content of which is incorporated herein by reference. Description of Reference Numerals

[0069] 10 Base body 11, 12 Main surfaces 21 to 24 Through-holes 31 to 34 Conductor pins 41, 42 External terminals 51 to 53 Connection patterns 60 Protection member 61 Protective film 70, 80 Insulating film 71 - 74, 81 - 84 Openings 90 Support body 91, 92 Resist 100, 200, 300, 400, 500, 600, 700 Coil components 100A Mounting area 110 Substrate 111, 112 Pad patterns 120 Circuit module A, B Protrusions

Claims

1. A coil component, wherein: have: A body having a first main surface and a second main surface located on opposite sides of each other, and provided with a plurality of through holes penetrating from the first main surface to the second main surface; a plurality of conductor pins, which are respectively inserted into the plurality of through holes; and a protective member embedded between the inner peripheral wall of the through hole and the outer peripheral wall of the conductor pin, The outer peripheral wall of the conductor pin has a protrusion embedded in the protection member, The protrusion is provided near a first end portion of the conductor pin located on the first principal surface side and near a second end portion of the conductor pin located on the second principal surface side.

2. The coil component according to claim 1, wherein The outer peripheral wall of the conductor pin is covered with a protective film, The protrusion has a portion that contacts the protection member without interposing the protection film.

3. The coil component according to claim 2, wherein The protection member includes a magnetic material.

4. The coil component according to claim 1, wherein Also features: A first connection pattern and a third connection pattern provided on the first main surface of the element body; and A second connection pattern is provided on the second main surface of the element body, The plurality of through holes include a first through hole, a second through hole, a third through hole and a fourth through hole, The plurality of conductor pins include a first conductor pin, a second conductor pin, a third conductor pin, and a fourth conductor pin respectively inserted into the first through hole, the second through hole, the third through hole, and the fourth through hole. The first end portion of the first conductor pin and the first end portion of the second conductor pin are connected via the first connection pattern, The second end portion of the second conductor pin and the second end portion of the third conductor pin are connected via the second connection pattern. The first end portion of the third conductor pin and the first end portion of the fourth conductor pin are connected via the third connection pattern.

5. The coil component according to claim 4, wherein further comprising: a first insulating film covering the first main surface of the element body; The first connection pattern is connected to the first conductor pin and the second conductor pin respectively through a first opening and a second opening provided in the first insulating film. The third connection pattern is connected to the third conductor pin and the fourth conductor pin via a third opening and a fourth opening provided in the first insulating film, respectively. The coil component according to claim 5 , wherein: The diameters of the first opening, the second opening, the third opening, and the fourth opening are respectively smaller than the diameters of the first through hole, the second through hole, the third through hole, and the fourth through hole.

7. The coil component according to claim 6, wherein The diameters of the first opening, the second opening, the third opening, and the fourth opening are respectively smaller than the diameters of the first conductor pin, the second conductor pin, the third conductor pin, and the fourth conductor pin.

8. The coil component according to claim 5, wherein The formation positions of the first opening portion and the second opening portion are offset with respect to the centers of the first through hole and the second through hole.

9. The coil component according to any one of claims 4 to 8, wherein it further includes: a first external terminal and a second external terminal provided on the second main surface of the substrate body; the second end portion of the first conductor pin is connected to the first external terminal; the second end portion of the fourth conductor pin is connected to the second external terminal.

10. The coil component according to claim 9, wherein it further includes: a second insulating film covering the second main surface of the substrate body; the first external terminal is connected to the first conductor pin through a fifth opening provided in the second insulating film; the second external terminal is connected to the fourth conductor pin through a sixth opening provided in the second insulating film.

11. The coil component according to claim 9, wherein the cross-sectional areas of the first conductor pin and the fourth conductor pin are larger than the cross-sectional areas of the second conductor pin and the third conductor pin.

12. A circuit module, wherein it includes: a substrate having a first pad pattern and a second pad pattern; and the coil component according to claim 9 mounted on the substrate, the first external terminal and the second external terminal are respectively connected to the first pad pattern and the second pad pattern.

13. A method for manufacturing a coil component, wherein it includes: a step of preparing a substrate body having a first main surface and a second main surface located on opposite sides of each other; a step of forming a plurality of through holes penetrating from the first main surface to the second main surface in the substrate body; a step of inserting conductor pins into the plurality of through holes respectively; a step of embedding a protection member between the inner peripheral wall of the through hole and the outer peripheral wall of the conductor pin; a step of grinding the first main surface and the second main surface of the substrate body until both end portions of the conductor pin are exposed; and a step of continuously grinding until both end portions of the conductor pin are deformed.

Images