Radio frequency connector installation stepped hole solder resist tool

Abstract

The invention discloses a radio frequency connector mounting stepped hole resistance welding tool which comprises a positioning plate, a special cutter and a cavity. The cavity is a gold-plated module cavity to be subjected to hole resistance welding, and a plurality of radio frequency connector stepped holes to be subjected to resistance welding are formed in the cavity; the positioning plate is used for accurately positioning a plurality of radio frequency connector stepped holes to be subjected to resistance welding and vertically limiting the holes when the special cutter is used for cutting; the special cutter is used for cutting a continuous gold-plated layer of the gold-plated hole at the hole edge of the stepped hole of the radio frequency connector to be subjected to resistance welding; according to the scheme, accurate and rapid alignment of a plurality of radio frequency connector assembly mounting step holes is realized at a time; precise cutting and blocking of a hole edge gold plating layer of a radio frequency connector installation step hole are achieved, the gold plating layers of other parts of the step hole are not damaged, and therefore it is guaranteed that reliable sintering is guaranteed, and the air tightness and the voidage meet relevant standard requirements. The process optimization is realized, the overflow solder cleaning process in the sintering process is reduced, and the efficiency of the sintering process is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of microwave component microelectronics installation, in particular to a step hole soldering tool for installing a radio frequency connector. Background Art

[0002] In the microwave component microelectronics installation process, the microwave substrate, RF connector, and cavity must be sintered to ensure airtightness and void ratio. This sintering process requires gold plating of the substrate sintering surface and the RF connector mounting step holes on the cavity to ensure solderability. Since the gold plating of the substrate sintering surface and the RF connector mounting step holes creates a continuous gold-plated surface, and the substrate and RF connector cannot be sintered at the same temperature due to the complex cavity structure, two temperature gradients are often used for sintering, one in tandem. Therefore, regardless of which is sintered first, the substrate or the RF connector, the solder will flow along the intact gold-plated layer and onto the post-sintering installation location on the cavity. This requires cleaning of the post-sintering location to prevent the post-sintering installation from being impossible due to solder overflow. The overflowing solder adheres firmly to the gold-plated layer and is difficult to clean.

[0003] Currently, there is no relevant special equipment or tools to meet the requirements of precise blocking of the gold-plated layer when sintering microwave substrates, RF connectors and cavities, ensuring reliable sintering and achieving airtightness and void ratio that meet relevant standard requirements. Summary of the Invention

[0004] In response to the above technical problems, the present invention provides a solder mask tool for step holes in RF connector installation, which can quickly and accurately achieve physical blocking between the gold-plated layer of the step holes in RF connector installation and the continuous gold-plated layer on the sintered surface of the microwave substrate, thereby avoiding solder overflow during sintering and affecting subsequent installation, reducing the process of cleaning overflow solder during sintering, and greatly improving production efficiency.

[0005] The present invention is achieved by adopting the following technical solutions: A tool for installing step holes in radio frequency connectors to resist soldering comprises a positioning plate, a special tool and a cavity; the cavity is a gold-plated module cavity for holes to be resisted soldering, and is provided with a plurality of step holes for radio frequency connectors to be resisted soldering inside; the positioning plate accurately positions the plurality of step holes for radio frequency connectors to be resisted soldering, and simultaneously limits the vertical position of the special tool relative to the holes when cutting; the special tool cuts the continuous gold-plated layer of the gold-plated hole along the hole edge of the step hole for the radio frequency connector to be resisted soldering.

[0006] Specifically, a plurality of positioning plate through holes are provided on the positioning plate, and the positions of the positioning plate through holes correspond to the stepped holes of the RF connector to be resisted with solder.

[0007] Specifically, the diameter of the through hole of the positioning plate is slightly larger than the stepped hole of the RF connector to be resisted with solder.

[0008] Specifically, the positioning plate is further provided with two positioning annular holes, which are vertically arranged at the upper and lower parts of the positioning plate respectively.

[0009] Specifically, a vertical positioning plate milling groove is further provided on the back of the positioning plate, the position of the positioning plate milling groove corresponds to the two positioning annular holes, and the width of the positioning plate milling groove is greater than the two positioning annular holes.

[0010] Specifically, the blade of the special tool is set to be a bevel, and the tip of the tool is ground off by a preset length; The tool diameter is Ф4, the inclination angle of the tool head is 14°, and the tool tip is ground down to a height of 0.07mm.

[0011] Specifically, the positioning plate is placed on the cavity, and is locked with the cavity through the milling groove and positioning annular hole of the positioning plate on the back, and the step hole of the RF connector to be soldered is aligned with the through hole of the positioning plate.

[0012] The beneficial effects of the present invention are as follows: the RF connector mounting step hole solder mask tool proposed in the present invention can realize the precise and rapid alignment of multiple RF connector mounting step holes at one time; it can realize the precise cutting and blocking of the gold-plated layer along the hole of the RF connector mounting step hole without damaging the gold-plated layer of other parts of the step hole, thereby ensuring reliable sintering, and the air tightness and void ratio meet the relevant standard requirements; it realizes process optimization, reduces the process of cleaning overflow solder in the sintering process, and greatly improves the efficiency of the sintering process. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0014] Figure 1 This is a schematic diagram of an assembly of a step hole solder resist tool for installing a radio frequency connector in an embodiment of the present invention; Figure 2 This is a schematic diagram of the back side of the positioning plate in an embodiment of the present invention; Among them, 1-positioning plate, 2-positioning plate through hole, 3-positioning annular hole, 4-positioning plate milling groove, 5-cavity, 6-step hole of the RF connector to be soldered. DETAILED DESCRIPTION

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0016] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0017] The following is combined with Figure 1-2 , some embodiments of the present invention are described in detail. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0018] The present invention proposes a tool for soldering step holes in RF connectors, comprising a positioning plate 1, a special tool and a cavity 5; the cavity 5 is a gold-plated module cavity for holes to be soldered, and is provided with a plurality of stepped holes 6 for RF connectors to be soldered; the positioning plate 1 accurately positions the plurality of stepped holes 6 for RF connectors to be soldered, and at the same time limits the vertical position of the special tool with respect to the hole when cutting; the special tool cuts the continuous gold-plated layer of the gold-plated hole along the hole edge of the stepped hole 6 for the RF connector to be soldered.

[0019] In this embodiment, a plurality of positioning plate through holes 2 are provided on the positioning plate 1, and the positions of the positioning plate through holes 2 correspond to the step holes 6 of the RF connector to be resisted. The diameter of the positioning plate through hole 2 is slightly larger than the step hole 6 of the RF connector to be resisted. The positioning plate 1 is also provided with two positioning annular holes 3, which are vertically arranged on the upper and lower parts of the positioning plate 1 respectively. A vertical positioning plate milling groove 4 is also provided on the back of the positioning plate 1, and the position of the positioning plate milling groove 4 corresponds to the two positioning annular holes 3, and the width of the positioning plate milling groove 4 is larger than the two positioning annular holes 3. The blade of the special tool is set to a bevel, and the tip of the tool is ground off to a preset length. The positioning plate 1 is placed on the cavity 5, and is locked with the cavity 5 through the positioning plate milling groove 4 and the positioning annular hole 3 on the back, and the step hole 6 of the RF connector to be resisted is aligned with the positioning plate through hole 2.

[0020] In a specific embodiment, Figure 1-2As shown, the tool for installing solder mask on stepped holes in RF connectors includes: a positioning plate 1, a special cutting tool, and a cavity 5. The positioning plate 1 precisely positions multiple stepped holes 6 of the RF connector that require solder masking on cavity 5, ensuring that the cutting tool is perpendicular to the holes during cutting. The special cutting tool cuts the gold plating along the edge of the stepped holes 6 of the RF connector that require solder masking in cavity 5, physically blocking the gold plating and preventing solder from overflowing from the holes and contaminating other soldering surfaces during sintering. Cavity 5 is the cavity of the gold-plated module that will receive solder masking.

[0021] In this embodiment, the positioning plate 1 is provided with a through hole 2 and an annular hole 3, and a milled groove 4 on the back. The through hole has a diameter of 4.2 mm, slightly larger than the diameter 3 of the first step hole. The annular hole 3 and the milled groove 4 on the back provide the positioning structure that matches the cavity.

[0022] In this embodiment, the blade of the custom-made tool features a specially designed bevel, with a certain length of the tip ground off. The tool has a diameter of Ø4, a bevel angle of 14°, and a 0.07mm reduction in the tip. This ensures that the blade only precisely cuts the first step edge of the stepped hole, without damaging the gold plating elsewhere in the hole, ensuring the integrity of the gold plating throughout the rest of the hole.

[0023] Cavity 5 is a gold-plated module cavity to be solder-resisted.

[0024] like Figure 1 As shown, the special tool of the positioning plate 1 is used in conjunction with the positioning plate 1, and the positioning plate 1 is placed on the gold-plated module cavity that needs to block the step holes for installing the RF connector, and is locked with the cavity 5 through the positioning annular hole 3 and the milling groove 4 of the positioning plate on the back, so that the multiple positioning plate through holes 2 on the positioning plate 1 and the multiple step holes 6 of the RF connector to be soldered that need to be blocked in the cavity 5 can be quickly and accurately positioned at one time.

[0025] In this embodiment, the positioning plate through hole 2 on the positioning plate 1 also constrains the special tool to move vertically downward in the hole to cut the gold-plated layer along the edge of the RF connector installation step hole that needs to be blocked in the cavity, without damaging the gold-plated layer on other parts of the step hole, thereby achieving precise blocking of the gold-plated layer and avoiding solder flow and overflow during sintering, which affects subsequent processes.

[0026] For the sake of simplicity, the aforementioned embodiments are described as a series of actions. However, those skilled in the art should be aware that this application is not limited by the order of the actions described, because according to this application, some steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in this specification are preferred embodiments, and the actions involved are not necessarily required by this application.

[0027] The above embodiments describe the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Without departing from the spirit and scope of the present invention, modifications and variations made by those skilled in the art without departing from the spirit and scope of the present invention should be within the scope of protection of the appended claims.

Claims

1. A solder mask tool for mounting a step hole in an RF connector, characterized in that: The invention comprises a positioning plate (1), a special tool and a cavity (5); the cavity (5) is a gold-plated module cavity for holes to be resisted with solder, and is provided with a plurality of step holes (6) of radio frequency connectors to be resisted with solder; the positioning plate (1) accurately positions the plurality of step holes (6) of radio frequency connectors to be resisted with solder, and simultaneously limits the vertical position of the special tool with respect to the holes when cutting; the special tool cuts the continuous gold-plated layer of the gold-plated hole along the hole edge of the step hole (6) of the radio frequency connector to be resisted with solder.

2. A RF connector installation step hole solder mask tool as claimed in claim 1, characterized in that: The positioning plate (1) is provided with a plurality of positioning plate through holes (2), and the positions of the positioning plate through holes (2) correspond to the stepped holes (6) of the radio frequency connector to be resist-welded.

3. A RF connector installation step hole solder mask tool as claimed in claim 2, characterized in that: The diameter of the positioning plate through hole (2) is slightly larger than the stepped hole (6) of the radio frequency connector to be resisted from soldering.

4. A RF connector installation step hole solder mask tool as claimed in claim 3, characterized in that: The positioning plate (1) is further provided with two positioning annular holes (3), which are respectively vertically arranged at the upper and lower parts of the positioning plate (1).

5. A RF connector installation step hole solder mask tool as claimed in claim 4, characterized in that: The back of the positioning plate (1) is also provided with a vertical positioning plate milling groove (4), the position of the positioning plate milling groove (4) corresponds to the two positioning annular holes (3), and the width of the positioning plate milling groove (4) is greater than the two positioning annular holes (3).

6. The RF connector installation step hole solder mask tool according to claim 1, characterized in that: The blade of the special tool is set to be an inclined surface, and the tip of the tool is ground off by a preset length.

7. The RF connector installation step hole solder resist tool according to claim 5, characterized in that: The positioning plate (1) is placed on the cavity (5) and locked with the cavity (5) through the positioning plate milling groove (4) and the positioning annular hole (3) on the back side, and the step hole (6) of the RF connector to be soldered is aligned with the positioning plate through hole (2).

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