Reinforced cooling S-shaped folded plate and sine curved surface target plate laminated plate cooling unit

Abstract

The invention discloses an S-shaped folded plate and sine curved surface target plate laminate cooling unit for enhanced cooling, relates to the technical field of gas turbine cooling, and solves the problems that in the prior art, an impact array is used, so that the cooling performance is remarkably reduced, and the flow resistance is increased. The device comprises an S-shaped folded plate and a gas film plate, wherein the S-shaped folded plate is arranged at the upper end of the gas film plate; a plurality of air inlets are formed in the S-shaped folded plate, and a plurality of rectangular grooves are formed in the surface, facing the air film plate, of the S-shaped folded plate; a gas guide section is arranged on the side, facing the S-shaped folded plate, of the gas film plate, the bottom face of the gas guide section is a sine curved face which is composed of a plurality of transverse sine curves and a plurality of longitudinal sine curves and is provided with a plurality of protruding structures, and a plurality of gas film holes are formed in the bottom face of the gas guide section. The sine curved surface folded plate capable of reducing the transverse flow influence is adopted to reduce the transverse flow momentum at the downstream impact jet flow position, and interference and deflection on the jet flow are reduced.

Description

Technical Field

[0001] The invention relates to the technical field of gas turbine turbine cooling, in particular to a layer plate cooling unit of an S-shaped folded plate and a sinusoidal target plate for enhanced cooling. Background Art

[0002] Crossflow is a significant factor affecting the cooling performance of impingement jet arrays. Crossflow from upstream jets invariably interferes with and deflects downstream jets in the array, resulting in reduced heat transfer. This negative effect of crossflow is a limiting factor in the length of jet impingement arrays. However, for turbine blades with high heat loads, existing technologies often use impingement arrays, which significantly reduces cooling performance and increases flow resistance. Summary of the Invention

[0003] To address the aforementioned issues of significantly reduced cooling performance and increased flow resistance in the prior art using impingement arrays, this invention proposes a cooling unit with enhanced S-shaped folds and a sinusoidal target plate. This invention employs a sinusoidal fold to reduce the impact of lateral flow, thereby reducing the momentum of the lateral flow at the downstream impingement jet and minimizing jet interference and deflection.

[0004] The present invention proposes a layer plate cooling unit for an S-shaped folding plate and a sinusoidal target plate with enhanced cooling, which specifically includes an S-shaped folding plate and an air film plate, wherein the S-shaped folding plate is arranged at the upper end of the air film plate; a plurality of air inlets are provided on the S-shaped folding plate, and a plurality of rectangular grooves are provided on the surface facing the air film plate; an air guide section is provided on the side of the air film plate facing the S-shaped folding plate, and a plurality of protruding structures and a plurality of air film holes are provided on the bottom surface of the air guide section.

[0005] Furthermore, the bottom surface of the air guide section is a sinusoidal surface with a plurality of convex structures composed of a plurality of transverse sinusoidal curves and a plurality of longitudinal sinusoidal curves.

[0006] Furthermore, the rectangular grooves and the air inlets are arranged alternately.

[0007] Furthermore, the width of the rectangular groove at the edge of the air film plate is smaller than the width of the rectangular groove in the middle.

[0008] Furthermore, the air inlet and the rectangular groove are arranged at equal distances.

[0009] Furthermore, the air inlet includes an air inlet groove and a plurality of guide holes, and the guide holes are arranged at the bottom of the air inlet groove.

[0010] Furthermore, the cross section of the air inlet slot is rectangular.

[0011] Furthermore, the number of the guide holes is greater than the air film holes.

[0012] Furthermore, the angle between the axis of the air film hole and the lower surface plane of the air film plate is 30 degrees.

[0013] Furthermore, the air film holes are arranged in a matrix.

[0014] The beneficial effects of the layer cooling unit of the S-shaped folded plate and sinusoidal target plate with enhanced cooling described in the present invention are: (1) The present invention provides a layer plate cooling unit with an S-shaped folded plate and a sinusoidal curved target plate for enhanced cooling. The unit introduces gas into the S-shaped folded plate through an air inlet and converts the gas into a jet. At the same time, a plurality of rectangular grooves provided on the S-shaped folded plate induce vortex pairs to hinder the cross flow and reduce the influence of the cross flow in the cold air cavity, thereby increasing the cooling efficiency of the layer plate cooling and reducing the flow resistance. The sinusoidal curved surface with a plurality of hill-like protrusions on the air film plate reduces the intensity of the cross flow. The flow resistance of the inner end face of the S-shaped folded plate and the air film plate using the sinusoidal curved surface decreases as the cross flow intensity decreases, especially when the impact distance is small.

[0015] (2) The layer plate cooling unit of the S-shaped folded plate and the sinusoidal target plate with enhanced cooling described in the present invention achieves more uniform heat exchange on the target surface through the arrangement of the air film holes on the air film plate; at the same time, the overall structure of the present invention is simple and easy to process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings constituting a part of this application are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0017] In the attached figure: Figure 1 It is a schematic structural diagram of a layer plate cooling unit of an S-shaped folded plate and a sinusoidal target plate for enhanced cooling according to the present invention; Figure 2 It is a cross-sectional view of a layer cooling unit of an S-shaped folded plate and a sinusoidal target plate for enhanced cooling according to the present invention; Figure 3 It is a structural schematic diagram of an air film plate of a layer plate cooling unit of an S-shaped folded plate and a sinusoidal target plate for enhanced cooling according to the present invention; Among them: 1-S-shaped folding plate, 2-air film plate, 3-air inlet, 4-S-shaped end face, 5-air guide section, 6-inner surface of air film plate, 7-air film hole. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0021] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0022] Specific implementation method 1: See Figure 1-Figure 3 The present embodiment is described in detail. The layer plate cooling unit of the S-shaped folded plate and the sinusoidal target plate with enhanced cooling described in the present embodiment specifically comprises an S-shaped folded plate 1 and an air film plate 2, wherein the S-shaped folded plate 1 is arranged at the upper end of the air film plate 2; a plurality of air inlets 3 are arranged on the S-shaped end face 4 of the S-shaped folded plate 1, and the plurality of air inlets 3 are arranged at equal intervals; a plurality of rectangular grooves are arranged at equal intervals on the surface of the S-shaped folded plate 1 facing the air film plate 2, and the rectangular grooves and the air inlets 3 are arranged alternately; an air guide section 5 is provided on the side of the air film plate 2 facing the S-shaped folded plate 1, and the inner surface 6 of the air film plate on the bottom of the air guide section 5 is a sinusoidal surface with a plurality of continuously undulating hill-like protrusion structures composed of a plurality of transverse sinusoidal curves and a plurality of longitudinal sinusoidal curves, and a plurality of air film holes 7 are provided on the inner surface 6 of the air film plate.

[0023] The width of the rectangular groove at the edge of the air film plate 2 is smaller than the width of the rectangular groove in the middle.

[0024] The air inlet 3 includes an air inlet groove and a plurality of guide holes. The guide holes are provided at the bottom of the air inlet groove to convert the airflow into a jet. The air inlet groove has a rectangular cross section and is provided on one side of the S-shaped end face 4. The air inlet groove and the rectangular groove are alternately arranged on the upper and lower surfaces of the S-shaped folded plate 1, so that the cross section of the S-shaped folded plate 1 presents an S-shaped bending state. Figure 2 As shown; the gas is introduced from the air inlet groove, transformed into a jet through the guide hole and enters the guide section 5, and induces vortex pairs in the rectangular groove to hinder the cross flow and reduce the influence of the cross flow in the cold air cavity, thereby increasing the cooling efficiency of the layer cooling and reducing the flow resistance.

[0025] The number of the guide holes is greater than the air film holes 7; specifically, the number of the air inlets 3 is 4, and each air inlet 3 includes 8 guide holes, which are arranged in a 4×8 manner; the air film holes 7 are arranged in a 3×3 manner.

[0026] The angle between the axis of the air film hole 7 and the lower surface plane of the air film plate 2 is 30 degrees.

[0027] The specific working process of the layer cooling unit of the S-shaped folded plate and sinusoidal target plate with enhanced cooling described in the present invention is as follows: The air inlet 3 introduces cold air into the S-shaped folded plate 1. The guide hole is used to convert the air flow in the S-shaped folded plate 1 into a jet flow and introduce the jet flow cold air into the air film plate 2.

[0028] The cold air jet induces vortex pairs at the rectangular groove of the S-shaped folded plate 1 to hinder the cross flow and reduce the impact of the cross flow in the cold air cavity, thereby increasing the cooling efficiency of the layer cooling and reducing the flow resistance; at the same time, the cross airflow is blocked by several hill-like protrusions on the inner surface 6 of the air film plate.

[0029] The air flow is sent out from the air film holes 7 and covers the outer surface of the air film plate 2 .

[0030] To summarize the above implementation cases, the layer plate cooling unit of the S-shaped folded plate and sinusoidal target plate with enhanced cooling described in the present invention introduces gas into the S-shaped folded plate 1 through the air inlet 3 and converts the gas into a jet. At the same time, a number of rectangular grooves provided on the S-shaped folded plate 1 induce vortex pairs to hinder cross flow and reduce the influence of cross flow in the cold air cavity, thereby increasing the cooling efficiency of the layer plate cooling and reducing the flow resistance; the sinusoidal surface with several hill-like protrusions on the air film plate 2 reduces the intensity of the cross flow; the flow resistance of the S-shaped folded plate 1 and the internal end face 6 of the air film plate using the sinusoidal surface decreases as the intensity of the cross flow decreases, especially when the impact distance is small. The layer plate cooling unit of the S-shaped folded plate and sinusoidal target plate with enhanced cooling described in the present invention achieves more uniform heat exchange on the target surface through the arrangement of the air film holes 7 on the air film plate 2; at the same time, the overall structure of the present invention is simple and easy to process.

[0031] The specific embodiments described above further illustrate the objectives, technical solutions, and beneficial effects of the present invention. It should be understood that the above description is merely a specific embodiment of the present invention and is not intended to limit the invention. Reasonable combinations of the features described in the above embodiments are also possible. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A cooling unit for a layer of an S-shaped folded plate and a sinusoidal target plate with enhanced cooling, characterized by: The invention comprises an S-shaped folding plate (1) and an air film plate (2), wherein the S-shaped folding plate (1) is arranged at the upper end of the air film plate (2); a plurality of air inlets (3) are arranged on the S-shaped folding plate (1), and a plurality of rectangular grooves are arranged on the surface facing the air film plate (2); an air guide section (5) is arranged on the side of the air film plate (2) facing the S-shaped folding plate (1), and a plurality of protruding structures and a plurality of air film holes (7) are arranged on the bottom surface of the air guide section (5).

2. The enhanced cooling S-shaped folded plate and sinusoidal target plate layer cooling unit according to claim 1 is characterized in that: The bottom surface of the air guide section (5) is a sinusoidal surface having a plurality of convex structures and formed by a plurality of transverse sinusoidal curves and a plurality of longitudinal sinusoidal curves.

3. The enhanced cooling S-shaped folded plate and sinusoidal target plate layer cooling unit according to claim 2, characterized in that: The rectangular grooves and the air inlets (3) are arranged alternately.

4. The enhanced cooling S-shaped folded plate and sinusoidal target plate layer cooling unit according to claim 3, characterized in that: The width of the rectangular groove at the edge of the air film plate (2) is smaller than the width of the rectangular groove in the middle.

5. The enhanced cooling S-shaped folded plate and sinusoidal target plate layer cooling unit according to claim 3, characterized in that: The air inlet (3) and the rectangular groove are arranged at equal distances.

6. The enhanced cooling S-shaped folded plate and sinusoidal target plate layer cooling unit according to claim 5, characterized in that: The air inlet (3) comprises an air inlet groove and a plurality of guide holes, wherein the guide holes are arranged at the bottom of the air inlet groove.

7. The enhanced cooling S-shaped folded plate and sinusoidal target plate layer cooling unit according to claim 6, characterized in that: The cross section of the air inlet groove is rectangular.

8. The enhanced cooling S-shaped folded plate and sinusoidal target plate layer cooling unit according to claim 6, characterized in that: The number of the guide holes is greater than the air film holes (7).

9. The layer cooling unit for enhanced cooling of an S-shaped folded plate and a sinusoidal target plate according to any one of claims 1 to 8, characterized in that: The angle between the axis of the air film hole (7) and the lower surface plane of the air film plate (2) is 30 degrees.

10. The enhanced cooling S-shaped folded plate and sinusoidal target plate layer cooling unit according to claim 9, characterized in that: The air film holes (7) are arranged in a matrix.

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