High-precision integrated backlight source structure

Abstract

The invention relates to a high-precision integrated backlight source structure, and belongs to the technical field of backlight sources. The high-precision integrated backlight source structure comprises a front frame, a light guide assembly, a backlight source plate, a diffuse reflection film, a control panel and a heat dissipation bottom frame are sequentially arranged in the front frame from top to bottom, and a heat dissipation mechanism is installed between the diffuse reflection film and the control panel; the heat dissipation mechanism comprises a heat conduction plate arranged between the diffuse reflection film and the control panel. According to the design that a working medium is divided into a plurality of parts and limited in independent space, the integrated backlight source can still effectively absorb heat at the corresponding position of the backlight source plate or the control panel when running obliquely or vertically; according to the integrated backlight source, the probability of thermal drift caused by uneven temperature of the backlight source plate can be reduced so as to improve the stability of the optical bistable state, and meanwhile, the probability of overheating damage of the control plate caused by too high temperature can be reduced, so that the spectral precision and the operation stability of the integrated backlight source are remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of backlight sources, and in particular to a high-precision integrated backlight source structure. Background Art

[0002] An integrated backlight is a compact and stable integrated backlight assembly. It includes an integrally injection-molded frame, a light guide plate that converts point light sources into a surface light source, an optical film that evens out the light, and auxiliary components such as a reflector and backplane. These components are designed to improve assembly efficiency, reliability, and performance stability. Currently, high-power integrated backlights typically utilize a vapor chamber as their heat dissipation mechanism, which provides a more uniform heat transfer effect than heat pipes and other heat dissipation mechanisms.

[0003] When a high-power integrated backlight source is installed and used at a large angle, the liquid working fluid inside the heat spreader only partially contacts the backlight source indirectly. The part of the backlight source above the liquid working fluid needs to be cooled by the evaporation and flow of the gaseous working fluid. This will cause the temperature of the two parts to be uneven. Over time, it is easy to cause "thermal drift" of the backlight source, making it difficult to stabilize the optical performance of the backlight source, and having a great impact on the operating accuracy of the backlight source. Summary of the Invention

[0004] Based on this, it is necessary to provide a high-precision integrated backlight structure to address the problem that high-power integrated backlight sources are prone to "thermal drift" when installed and used at a large angle, which has a significant impact on the operating accuracy of the backlight source.

[0005] A high-precision integrated backlight structure includes a front frame, wherein a light guide component, a backlight source plate, a diffuse reflection film, a control board and a heat dissipation bottom frame are sequentially arranged inside the front frame from top to bottom, and a heat dissipation mechanism is installed between the diffuse reflection film and the control board.

[0006] Furthermore, the heat dissipation mechanism includes a heat conducting plate arranged between the diffuse reflection film and the control plate, the outer side of the heat conducting plate passes through the front frame, the outer side of the heat conducting plate is provided with a grid-shaped heat dissipation air cavity, the top of the heat conducting plate is provided with square holes that are evenly distributed and staggered with the grid-shaped heat dissipation air cavity, the interior of the square hole is fixedly connected to a heat conducting block, the interior of the heat conducting block is fixedly connected to a liquid wick, the interior of the liquid wick is filled with a working medium that is initially in a liquid state, the interior of the liquid wick is fixedly connected to a barrier plate, the top of the barrier plate is provided with evenly distributed liquid guide ports, the interior of the liquid guide ports is fixedly connected to a heat conducting frame fixedly connected to the liquid wick, and two adjacent heat conducting frames are staggered on both sides of the barrier plate.

[0007] Furthermore, the inner diameter of the grid-shaped heat dissipation cavity gradually increases from the center point of the heat conducting plate toward a direction away from the center point of the heat conducting plate, and the vertical cross-section of a single channel in the grid-shaped heat dissipation cavity is circular.

[0008] Furthermore, the heat conducting block, the baffle plate and the heat conducting frame are all fixedly connected to the liquid wick through a sintering process.

[0009] Furthermore, the liquid guide port and the heat conduction frame are both punched out from corresponding positions of the barrier plate through a mechanical mold punching process.

[0010] Furthermore, the cross-sectional shape of the heat-conducting frame is an open isosceles trapezoid, and the cross-sectional opening of the heat-conducting frame faces the liquid guide port.

[0011] Furthermore, the heat conducting block and the square hole are both in the shape of matching rectangular parallelepipeds, and the heat conducting block is fixedly connected to the inside of the square hole through a vacuum brazing process.

[0012] Furthermore, flexible thermal pads are bonded to both top and bottom ends of the heat conducting plate, the top of the upper flexible thermal pad contacts the diffuse reflection film, and the bottom of the lower flexible thermal pad contacts the control board.

[0013] Furthermore, the sizes of the upper contact parts of the flexible thermal pad and the diffuse reflection film are the same, and the sizes of the lower contact parts of the flexible thermal pad and the control board are the same. The flexible thermal pad is a silicon-based flexible thermal conductive material component.

[0014] Furthermore, the top four sides of the heat conducting plate are provided with sockets that are evenly distributed and staggered with the grid-shaped heat dissipation air cavities, and the bottom four sides of the front frame are fixedly connected with plugs that are evenly distributed and plugged into adjacent sockets.

[0015] Furthermore, the cross-sectional shapes of the sockets and the plug blocks are both matching rectangles, and the number of the sockets and the plug blocks is the same and no less than thirty.

[0016] The high-precision integrated backlight structure divides the working fluid into multiple parts and confines them to independent spaces. This allows the integrated backlight to effectively absorb heat from the corresponding positions of the backlight panel or control board when operating at an angle or vertical position. This not only reduces the probability of "thermal drift" caused by uneven temperature of the backlight panel, thereby improving the stability of the optical bistability, but also reduces the probability of overheating and damage to the control board due to excessive temperature, significantly improving the spectral accuracy and operational stability of the integrated backlight.

[0017] A grid-shaped heat dissipation air cavity with a gradually expanding air flow channel is adopted. Regardless of whether the integrated backlight source is used tilted or horizontally, the density and flow friction of the heated air inside the grid-shaped heat dissipation air cavity are significantly reduced. This enables the heated air to be accelerated and guided outward along the inner wall of the grid-shaped heat dissipation air cavity, so that the temperature of the heat conduction plate and the heat conduction block is lower, further reducing the probability of local overheating of the backlight source panel or the control panel, and further reducing the probability of "thermal drift" of the backlight source panel due to uneven temperature. At the same time, the indirect cooling design is adopted, which can also prevent the external environment from contacting the light guide component, the backlight source panel and the control panel, so as to ensure the overall protection effect of the integrated backlight source. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 It is a structural diagram of the overall structure of the present invention;

[0020] Figure 2 It is a cross-sectional schematic diagram of the overall structure of the present invention;

[0021] Figure 3 It is an exploded schematic diagram of the overall structure of the present invention;

[0022] Figure 4 This is a schematic diagram of the connection between the front frame and the heat dissipation mechanism in the present invention;

[0023] Figure 5 Schematic diagram of the explosion of the heat dissipation mechanism of the present invention;

[0024] Figure 6 is a schematic cross-sectional view of the heat conducting plate of the present invention;

[0025] Figure 7 It is a partial exploded schematic diagram of the heat dissipation mechanism in the present invention.

[0026] Reference numerals:

[0027] 100, front frame; 200, light guide assembly; 300, backlight panel; 400, diffuse reflection film; 500, control panel; 600, heat dissipation bottom frame; 700, heat dissipation mechanism; 710, heat conduction plate; 711, grid-shaped heat dissipation cavity; 712, square hole; 713, socket; 720, heat conduction block; 730, liquid wick; 740, barrier plate; 741, liquid guide port; 750, heat conduction frame; 760, flexible thermal pad; 800, plug. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0029] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of the present invention are for illustrative purposes only and do not represent the only implementation method.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0031] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are in contact indirectly through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0032] Unless otherwise defined, all technical and scientific terms used in the present description have the same meanings as those commonly understood by those skilled in the art to which this invention pertains. The terms used in this description are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used in this description includes any and all combinations of one or more of the associated listed items.

[0033] The following combination Figure 1 - Figure 7The high-precision integrated backlight structure of the present invention is described.

[0034] In one embodiment, a high-precision integrated backlight structure includes a front frame 100. Inside the front frame 100, a light guide assembly 200, a backlight panel 300, a diffuse reflection film 400, a control board 500, and a heat dissipation bottom frame 600 are sequentially arranged from top to bottom. A heat dissipation mechanism 700 is installed between the diffuse reflection film 400 and the control board 500.

[0035] The light guide assembly 200 includes but is not limited to the following structures from bottom to top:

[0036] The high-temperature resistant plastic frame can not only separate the structure above the high-temperature resistant plastic frame from the backlight panel 300, thereby preventing the backlight panel 300 from burning and deforming the structure above the high-temperature resistant plastic frame, but also can reduce the probability of vibration between the structure above the high-temperature resistant plastic frame and the backlight panel 300;

[0037] Light guide plate, which achieves uniform light diffusion through precisely designed dot distribution;

[0038] The first diffuser is used to interfere with light and initially improve brightness uniformity;

[0039] a first prism sheet, used for focusing light to enhance display brightness;

[0040] The second prism is used to enhance the light focusing effect and further increase the display brightness;

[0041] The second diffuser is used to eliminate light interference and further improve brightness uniformity;

[0042] The light guide assembly 200 is stacked in layers: a high-temperature resistant plastic frame → a first light guide plate → a first diffusion sheet → a first prism sheet → a second prism sheet → a second diffusion sheet, and utilizes the vibration buffering properties of the plastic frame to isolate the thermal impact of the backlight panel 300.

[0043] The top of the heat dissipation base frame 600 is provided with a groove that matches the control board 500. The control board 500 is fixed inside the groove with high-temperature resistant glue. The input and output terminals of the control board 500 pass through the groove and the heat dissipation base frame 600 in sequence and extend out of the heat dissipation base frame 600. The bottom of the heat dissipation base frame 600 is provided with evenly distributed air guide grooves. The heat dissipation base frame 600 and the plug 800 are fixed together through a vacuum brazing process.

[0044] When the control board 500 and the heat dissipation base frame 600 need to be connected together, first evenly apply high-temperature resistant glue in the groove at the top of the heat dissipation base frame 600, accurately embed the control board 500 into the groove, and ensure that its input and output ends pass through the grooves reserved in the heat dissipation base frame 600 respectively. After the glue is cured, check whether the fit between the control board 500 and the groove and the protruding length of the terminals meet the tolerance requirements.

[0045] like Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 and Figure 7 As shown, the heat dissipation mechanism 700 includes a heat conducting plate 710 arranged between the diffuse reflection film 400 and the control board 500, the outer side of the heat conducting plate 710 passes through the front frame 100, the outer side of the heat conducting plate 710 is provided with a grid-shaped heat dissipation air cavity 711, the top of the heat conducting plate 710 is provided with square holes 712 that are evenly distributed and staggered with the grid-shaped heat dissipation air cavity 711, the inside of the square holes 712 is fixedly connected to a heat conducting block 720, the inside of the heat conducting block 720 is fixedly connected to a liquid wick 730, the inside of the liquid wick 730 is filled with a working medium in an initial liquid state, the inside of the liquid wick 730 is fixedly connected to a blocking plate 740, the top of the blocking plate 740 is provided with evenly distributed liquid guide ports 741, the inside of the liquid guide ports 741 is fixedly connected to a heat conducting frame 750 fixedly connected to the liquid wick 730, and two adjacent heat conducting frames 750 are staggered on both sides of the blocking plate 740;

[0046] When the integrated backlight source is operating on a moving object such as a vehicle, and the vehicle brakes or drives on a bumpy road, causing the integrated backlight source to shake, the blocking plate 740 and the heat-conducting frame 750 can prevent the liquid working medium inside the liquid wick 730 from directly impacting the liquid wick 730, effectively reducing the probability of the liquid wick 730 loosening or falling off under the action of the impact, thereby ensuring that the liquid wick 730 can be used normally. The heat-conducting frame 750 and the blocking plate 740 can guide the heat of the gasified working medium to the liquid working medium during the gas-liquid circulation of the working medium, thereby accelerating the liquefaction of the gasified working medium, which can accelerate the gas-liquid circulation rate of the working medium.

[0047] When manufacturing the heat dissipation mechanism 700, first, a liquid guide port 741 and a heat conduction frame 750 are punched out on the barrier plate 740 by a punching mechanism with a corresponding mold, and then an uncovered heat conduction block 720 is manufactured, and then a liquid absorbent core 730 is manufactured and the punched barrier plate 740 is placed in the liquid absorbent core 730, and then the liquid absorbent core 730 is sintered in the heat conduction block 720. After the liquid absorbent core 730 is sintered, the inside of the liquid absorbent core 730 is evacuated to a vacuum state, and then a liquid working medium is injected into the liquid absorbent core 730, and the liquid absorbent core 730 is sealed to complete the sealing of the heat conduction block 720. Then, the side end of the heat conduction block 720 is turned upward, and the heat conduction block 720 is processed. A corresponding number of slots and sockets 713 are opened at the side ends of the heat conducting plate 710 until all the slots together form a complete grid-like heat dissipation cavity 711. The heat conducting plate 710 is then placed horizontally, and a corresponding number of square holes 712 are opened at the offset positions of the grid-like heat dissipation cavity 711. The heat conducting blocks 720 are then inserted into the square holes 712 and attached to the heat conducting plate 710 through a vacuum brazing process. Finally, silicone-based flexible thermal pads 760 are bonded to the top and bottom surfaces of the heat conducting plate 710. The sizes of the upper and lower pads must be strictly consistent with the contact surfaces of the diffuse reflection film 400 and the control board 500, respectively. At this point, the heat dissipation mechanism 700 is manufactured.

[0048] like Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 and Figure 7As shown, the inner diameter of the grid-shaped heat dissipation cavity 711 gradually increases from the center point of the heat conducting plate 710 toward the direction away from the center point of the heat conducting plate 710. The vertical cross-section of a single channel in the grid-shaped heat dissipation cavity 711 is circular. When the integrated backlight structure is placed horizontally, this can guide the gas inside the grid-shaped heat dissipation cavity 711 outward, thereby accelerating the discharge rate of the heated air inside the grid-shaped heat dissipation cavity 711 and reducing the retention rate of the heated air inside the grid-shaped heat dissipation cavity 711; the heat conducting block 720, the baffle plate 740 and the heat conducting frame 750 are all fixedly connected to the liquid wick 730 through a sintering process, which can improve the effective connection rate of the heat conducting block 720, the baffle plate 740 and the heat conducting frame 750 with the liquid wick 730, thereby improving the heat conductivity; The liquid guide port 741 and the heat-conducting frame 750 are both stamped out at the corresponding positions of the baffle plate 740 through a mechanical mold stamping process, which can reduce the manufacturing difficulty of the baffle plate 740, the liquid guide port 741 and the heat-conducting frame 750, thereby reducing the cost of use; the cross-sectional shape of the heat-conducting frame 750 is an open isosceles trapezoidal shape, and the cross-sectional opening of the heat-conducting frame 750 faces the liquid guide port 741, which not only increases the contact area between the heat-conducting frame 750 and the liquid-absorbing core 730 to improve the heat conduction effect, but also increases the use strength of the baffle plate 740 and the heat-conducting frame 750 to reduce the probability of deformation of the heat-conducting block 720; the shapes of the heat-conducting block 720 and the square hole 712 are both matching rectangular parallelepipeds, and the heat-conducting block 720 is fixedly connected to the inside of the square hole 712 through a vacuum brazing process.

[0049] Flexible thermal pads 760 are bonded to both the top and bottom ends of the thermal conductive plate 710. The top of the upper flexible thermal conductive pad 760 contacts the diffuse reflection film 400, and the bottom of the lower flexible thermal conductive pad 760 contacts the control board 500. The sizes of the contact parts of the upper flexible thermal conductive pad 760 and the diffuse reflection film 400 are the same, and the sizes of the contact parts of the lower flexible thermal conductive pad 760 and the control board 500 are the same. The flexible thermal conductive pad 760 is a silicon-based flexible thermal conductive material component, which can not only fill the gap between the diffuse reflection film 400 and the control board 500 and the thermal conductive plate 710 or the thermal conductive block 720 to improve the heat conductivity, but also can play the role of flexible buffering of the diffuse reflection film 400, the control board 500, the thermal conductive plate 710 and the thermal conductive block 720, so as to improve the drop resistance of the integrated backlight source.

[0050] The top four sides of the heat conducting plate 710 are provided with evenly distributed sockets 713 that are staggered with the grid-like heat dissipation air cavities 711. The bottom four sides of the front frame 100 are fixedly connected with evenly distributed plug blocks 800 that are plugged into adjacent sockets 713. The cross-sectional shapes of the sockets 713 and the plug blocks 800 are both matching rectangular shapes. The number of sockets 713 and plug blocks 800 is the same and no less than thirty.

[0051] The front frame 100 with integrated optical components is pressed downward as a whole so that the plug 800 is fully inserted into the socket 713 on the heat conducting plate 710 to form a closed-loop mechanical structure. The connection strength is enhanced by vacuum brazing. The heat dissipation mechanism 700 is activated to verify the heat exchange efficiency of the gradually expanding air flow channel of the grid-shaped heat dissipation air cavity 711 and the bottom air guide groove to ensure the normal phase change cycle of the working medium. The backlight brightness uniformity and heat dissipation performance are tested by powering on. The hot spot distribution is detected using a thermal imager, and the layout of the heat conducting frame 750 of the liquid guide port 741 is adjusted to optimize the heat dissipation path.

[0052] Working principle: When the integrated backlight source is used at an angle, multiple independently running working fluids are locked at corresponding heights by the liquid wick 730. At this time, the working fluids can still indirectly contact the backlight panel 300 or the control board 500 for gas-liquid circulation, which can effectively reduce the probability of excessive temperature differences between the two ends of the backlight panel 300 or the control board 500 that are far apart in height. It can not only reduce the probability of "thermal drift" of the backlight panel 300 due to uneven temperature, and the probability of overheating and damage of the control board 500 due to excessive temperature, but also significantly improve the spectral accuracy and operational stability of the integrated backlight source. At the same time, it can also accelerate the gas-liquid circulation rate of the working fluid inside the liquid wick 730, thereby accelerating the heat dissipation effect of the backlight panel 300 or the control board 500.

[0053] While the heat conducting plate 710 and the heat conducting block 720 are conducting heat away from the backlight source panel 300 or the control panel 500, the heat can also be transferred into the grid-shaped heat dissipation air cavity 711 through the heat conducting plate 710, which can heat the air temperature of the corresponding area in the grid-shaped heat dissipation air cavity 711, which can effectively reduce the density and flow friction of the air in the area, so that the air in the area can be discharged outward at an accelerated speed. In addition, the grid-shaped heat dissipation air cavity 711 with a gradually expanding airflow channel, regardless of whether the integrated backlight source is used tilted or horizontally, the heated air can be accelerated to be guided outward along the inner wall of the grid-shaped heat dissipation air cavity 711, which can not only accelerate the replacement rate of the air inside and outside the grid-shaped heat dissipation air cavity 711, making the temperature of the heat conducting plate 710 and the heat conducting block 720 lower, but also can further reduce the probability of local overheating of the backlight source panel 300 or the control panel 500, and further reduce the probability of "thermal drift" of the backlight source panel 300 due to uneven temperature, and the probability of overheating and damage of the control panel 500 due to excessively high temperature.

[0054] It should be noted that the high-temperature resistant rubber frame, first light guide plate, first diffuser, first prism sheet, second prism sheet, second diffuser, backlight panel 300, diffuse reflection film 400, control panel 500, liquid absorption core 730 and working fluid in the above description are all devices with relatively mature application of existing technology and will not be elaborated here.

[0055] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The above-described embodiments merely illustrate several embodiments of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, and these modifications and improvements fall within the scope of the present invention. Therefore, the scope of the present invention shall be determined by the appended claims.

Claims

1. A high-precision integrated backlight structure, comprising a front frame (100), wherein a light guide assembly (200), a backlight source plate (300), a diffuse reflection film (400), a control board (500) and a heat dissipation bottom frame (600) are sequentially arranged inside the front frame (100) from top to bottom, characterized in that: A heat dissipation mechanism (700) is installed between the diffuse reflection film (400) and the control board (500); The heat dissipation mechanism (700) includes a heat conducting plate (710) arranged between the diffuse reflection film (400) and the control board (500), the outer side of the heat conducting plate (710) passes through the front frame (100), the outer side of the heat conducting plate (710) is provided with a grid-shaped heat dissipation air cavity (711), the top of the heat conducting plate (710) is provided with square holes (712) that are evenly distributed and staggered with the grid-shaped heat dissipation air cavity (711), the interior of the square hole (712) is fixedly connected with a heat conducting block (720), and the heat conducting block (720) is fixedly connected to the front frame (100). A liquid wick (730) is fixedly connected to the interior of the heat block (720), the interior of the liquid wick (730) is filled with a working medium in an initial liquid state, a baffle plate (740) is fixedly connected to the interior of the liquid wick (730), a top of the baffle plate (740) is provided with evenly distributed liquid guide ports (741), the interior of the liquid guide ports (741) is fixedly connected to a heat conduction frame (750) fixedly connected to the liquid wick (730), and two adjacent heat conduction frames (750) are staggeredly distributed on both sides of the baffle plate (740).

2. The high-precision integrated backlight structure according to claim 1, characterized in that: The inner diameter of the grid-shaped heat dissipation cavity (711) gradually increases from the center point of the heat conduction plate (710) toward a direction away from the center point of the heat conduction plate (710), and the vertical cross-section of a single channel in the grid-shaped heat dissipation cavity (711) is circular.

3. The high-precision integrated backlight structure according to claim 1, characterized in that: The heat conducting block (720), the baffle plate (740) and the heat conducting frame (750) are all fixedly connected to the liquid wick (730) through a sintering process.

4. The high-precision integrated backlight structure according to claim 1, characterized in that: The liquid guide port (741) and the heat conduction frame (750) are both punched out from corresponding positions of the baffle plate (740) through a mechanical mold punching process.

5. The high-precision integrated backlight structure according to claim 1, characterized in that: The cross-sectional shape of the heat-conducting frame (750) is an open isosceles trapezoidal shape, and the cross-sectional opening of the heat-conducting frame (750) faces the liquid guide port (741).

6. The high-precision integrated backlight structure according to claim 1, characterized in that: The heat conducting block (720) and the square hole (712) are both in the shape of matching rectangular parallelepipeds, and the heat conducting block (720) is fixedly connected to the inside of the square hole (712) through a vacuum brazing process.

7. The high-precision integrated backlight structure according to claim 1, characterized in that: Flexible thermal pads (760) are bonded to both the top and bottom ends of the thermal conductive plate (710), the top of the upper flexible thermal pad (760) contacts the diffuse reflection film (400), and the bottom of the lower flexible thermal pad (760) contacts the control board (500).

8. The high-precision integrated backlight structure according to claim 7, characterized in that: The sizes of the contact parts of the upper flexible thermal pad (760) and the diffuse reflection film (400) are the same, and the sizes of the contact parts of the lower flexible thermal pad (760) and the control board (500) are the same. The flexible thermal pad (760) is a silicon-based flexible thermal conductive material component.

9. The high-precision integrated backlight structure according to claim 1, characterized in that: The four sides of the top of the heat conducting plate (710) are all provided with sockets (713) that are evenly distributed and staggered with the grid-shaped heat dissipation air cavity (711), and the four sides of the bottom of the front frame (100) are all fixedly connected with plug blocks (800) that are evenly distributed and plugged into adjacent sockets (713).

10. The high-precision integrated backlight structure according to claim 9, characterized in that: The cross-sectional shapes of the socket (713) and the plug block (800) are both matching rectangles, and the number of the socket (713) and the plug block (800) is the same and no less than thirty.

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