Chip test system and control method thereof

Abstract

The invention provides a chip testing system and a control method thereof, and relates to the field of chip testing, and the chip testing system comprises a testing base which is provided with a plurality of testing contacts; the flexible pressure detection module is configured to detect the pressure when the flexible substrate is pressed and deformed; the driving module is connected with the flexible pressure detection module and used for driving the flexible pressure detection module to move in the direction close to or away from the test base; and the control module is in signal connection with the first electrode, the second electrode and the driving module, and the control module is configured to control the driving module according to the capacitance signal sent by the flexible pressure detection module so as to control the motion stroke of the flexible pressure detection module. The driving module is controlled through the received pressure detection signal, so that proper pressure is applied to the chip to fix the chip, the stroke of the driving module does not need to be calibrated, the complex calibration process is omitted, and the test process is simplified.

Description

Technical Field

[0001] The present invention relates to the field of chip testing, and in particular to a chip testing system and a control method thereof. Background Art

[0002] To ensure chip quality, they are typically tested before shipment. This involves attaching the chip to a simulated test board, bringing the test contacts on the board into contact with the contacts on the chip. Prior to testing, the chip is pressurized to ensure stable contact between the contacts on the chip and the test board.

[0003] However, the above test method has the problems of requiring regular calibration, complicated calibration process and poor test accuracy. Summary of the Invention

[0004] In order to overcome the problems existing in the related art, the present invention provides a chip testing system and a control method thereof.

[0005] To achieve the above-mentioned and other related objectives, the first aspect of the present invention provides the following technical solution: a chip testing system, comprising: A test base, wherein a plurality of test contacts are provided on the test base; a flexible pressure detection module disposed opposite the test base, the flexible pressure detection module comprising a flexible substrate and a first electrode and a second electrode connected to the flexible substrate, the first electrode and the second electrode being spaced apart along a direction of movement of the flexible pressure detection module, the flexible pressure detection module being configured such that when the flexible substrate is compressed and deformed, the capacitance between the first electrode and the second electrode changes, thereby generating a changing capacitance signal, the capacitance signal being used to represent the magnitude of pressure within the flexible pressure detection module; a driving module connected to the flexible pressure detection module and configured to drive the flexible pressure detection module to move in a direction approaching or away from the test base; The control module is signal-connected to the first electrode, the second electrode and the driving module respectively, and the control module is configured to control the driving module according to the capacitance signal sent by the flexible pressure detection module to control the movement stroke of the flexible pressure detection module.

[0006] In one embodiment of the present invention, the flexible substrate includes an arcuate surface protruding toward the test base and a plane connected to the edge of the arcuate surface, at least one of the first electrode and the second electrode is provided in plurality, the first electrode is provided on the plane, and the second electrode is embedded in the flexible substrate.

[0007] In one embodiment of the present invention, four first electrodes are provided, and the centers of the four first electrodes are respectively located at the four vertices of a rectangle. The second electrode has a rectangular sheet structure, and the second electrode includes a first surface facing the first electrode and a second surface facing away from the first electrode. The projections of the four first electrodes on the plane where the first surface is located are all located within the first surface.

[0008] In one embodiment of the present invention, the material of the flexible substrate includes polydimethylsiloxane material, and the surface of the polydimethylsiloxane material is coated with a conductive carbon-based material; and / or, A pore structure is provided in the flexible matrix.

[0009] In one embodiment of the present invention, the chip testing system further includes: a temperature detection module, configured to detect the temperature of the flexible pressure detection module; The control module is signal-connected to the temperature detection module, and is configured to control the driving module according to the capacitance signal sent by the flexible pressure detection module and the temperature signal sent by the temperature detection module to control the movement stroke of the flexible pressure detection module.

[0010] In one embodiment of the present invention, the temperature detection module is built into the flexible substrate, and in the movement direction of the flexible pressure detection module, the temperature detection module is located on the side of the first electrode away from the second electrode, or on the side of the second electrode away from the first electrode.

[0011] A second aspect of the present invention provides the following technical solution: a method for controlling a chip test system, the method comprising: The control driving module drives the flexible pressure detection module to move toward the test base; acquiring a capacitance signal between the first electrode and the second electrode during movement of the flexible pressure detection module; When it is determined that the capacitance signal meets a preset condition, the driving module is controlled to stop the movement of the flexible pressure detection module.

[0012] In one embodiment of the present invention, a plurality of first electrodes are provided, and the control method of the chip testing system further includes: acquiring a capacitance signal between each of the first electrodes and the second electrodes; Determining a magnitude relationship between the capacitance signals; Based on the magnitude relationship of the capacitance signals, the tilt direction or the offset direction of the chip is determined.

[0013] In one embodiment of the present invention, determining the tilt direction or offset direction of the chip based on the magnitude relationship of each of the capacitance signals includes: When a difference between at least two capacitance signals is greater than a preset difference, sorting the capacitance signals; Based on the sorted capacitance signals, the four vertices of the chip are sorted in order of height. The larger the capacitance signal, the higher the vertex of the chip at the corresponding position. The tilt direction of the chip is determined based on the high and low position sorting of the four vertices.

[0014] In one embodiment of the present invention, the control method of the chip testing system further includes: Determine the preset standard pressure-stroke correspondence; During the movement of the flexible pressure detection module, the actual pressure represented by the capacitance signal detected by the flexible pressure detection module is compared with the standard pressure of the same stroke in the standard pressure-stroke correspondence relationship; If the comparison result meets the preset pressure abnormality condition, the driving module is controlled to stop the movement of the flexible pressure detection module; otherwise, the driving module is controlled to drive the flexible pressure detection module to continue moving.

[0015] In one embodiment of the present invention, determining the preset standard pressure-stroke correspondence includes: Acquire a temperature signal detected by a temperature detection module, wherein the temperature signal represents the temperature of the flexible pressure detection module; The corresponding standard pressure-stroke correspondence is determined according to the temperature signal and preset configuration information, wherein the preset configuration information is used to characterize the correspondence between temperature and pressure-stroke curves.

[0016] In one embodiment of the present invention, determining the corresponding standard pressure-stroke correspondence according to the temperature signal and preset configuration information includes: If the preset configuration information includes the temperature represented by the temperature signal, a pressure-stroke curve corresponding to the temperature represented by the temperature signal is determined as the standard pressure-stroke correspondence relationship; Otherwise, obtain the pressure-stroke curves corresponding to two temperatures adjacent to the temperature represented by the temperature signal in the preset configuration information, fit the two pressure-stroke curves, and obtain the pressure-stroke curve corresponding to the temperature represented by the temperature signal as the standard pressure-stroke correspondence relationship.

[0017] In one embodiment of the present invention, the control method of the chip testing system further includes: If the comparison result satisfies the preset pressure abnormality condition, prompting the tilt direction or offset direction of the chip, and / or prompting the reset direction of the chip; The comparison result is periodically detected to determine whether it satisfies the preset pressure abnormality condition. When the comparison result switches from satisfying the preset pressure abnormality condition to not satisfying the preset pressure abnormality condition, the driving module is controlled to drive the flexible pressure detection module to continue moving.

[0018] The technical solutions provided by the embodiments of the present invention may have the following beneficial effects: The test base carries the chip, and the control module controls the drive module to drive the flexible pressure detection module toward the test base. During the movement, the flexible pressure detection module applies pressure to the chip. After the flexible substrate is deformed under pressure, the distance between the first electrode and the second electrode changes, resulting in a change in the capacitance between the first electrode and the second electrode. By detecting the capacitance signal between the first electrode and the second electrode, the pressure value applied to the chip by the flexible pressure detection module can be determined as a pressure detection signal. The control module receives the pressure detection signal in real time and controls the drive module according to the received pressure detection signal, thereby applying appropriate pressure to the chip to fix the chip. Since the actual pressure applied to the chip is detected, there is no need to calibrate the stroke of the drive module, eliminating the complex calibration process and simplifying the test process. A flexible substrate is used to apply pressure to the chip. During the pressure application process, the flexible substrate can adaptively deform, and while not causing damage to the chip, it can maintain a large contact area with the chip, thereby improving the uniformity and stability of the pressure applied to the chip, thereby ensuring the stability of the subsequent test process.

[0019] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0021] Figure 1 is a schematic diagram of a chip testing system according to an embodiment of the present invention; Figure 2 2 is a schematic structural diagram of a flexible pressure detection module of a chip testing system according to an embodiment of the present invention; Figure 3 Schematic diagram of the positional relationship of various structures of the flexible pressure detection module of the chip testing system according to an embodiment of the present invention; Figure 4 2 is a schematic diagram of a state of a flexible pressure detection module of a chip testing system according to an embodiment of the present invention when under pressure; Figure 53. This is a schematic diagram of the state of the flexible pressure detection module of the chip testing system according to an embodiment of the present invention when the chip is tilted; Figure 6 is a schematic structural diagram of a flexible substrate of a chip testing system according to an embodiment of the present invention; Figure 7 is a schematic diagram of the connection relationship of a chip testing system according to an embodiment of the present invention; Figure 8 This is a flow chart of a control method for a chip testing system according to an embodiment of the present invention.

[0022] In the picture: 100. Test base; 110. Test board; 120. Limit frame; 130. Test contact; 200. Flexible pressure detection module; 210. Flexible substrate; 211. Arc surface; 212. Plane; 213. Core; 214. Conductive layer; 215. Pore structure; 220. First electrode; 230. Second electrode; 231. First surface; 232. Second surface; 300. Temperature detection module; 400. Chip; 500. Drive module; 600. Control module; 700. A / D converter; 800. Two-to-one selector; 900. Amplifier. DETAILED DESCRIPTION

[0023] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. In the following description, when referring to the drawings, like numbers in different figures represent like or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present invention, as detailed in the appended claims.

[0024] In order to ensure the quality of chip 400, chip 400 is usually tested before leaving the factory, that is, chip 400 is fixed on a test board 110 for simulation test, so that the test contacts 130 on the test board 110 contact the contacts on chip 400, thereby performing a simulation test on chip 400.

[0025] In the related art, the chip 400 is usually placed on a test socket, and the test socket is mechanically pressed down to make the chip 400 fit with the test board 110. However, the chip 400 test usually needs to be performed at different temperatures. The test socket is prone to deviations in the pressing stroke from the standard value due to thermal expansion and contraction of parts. Operators are required to perform manual calibration regularly. During calibration, the parts of the test socket need to be disassembled and the calibration parts need to be replaced. The calibration process is complicated, which affects the test efficiency. In addition, due to factors such as mechanical wear, the test socket will produce stroke deviations. This deviation cannot be compensated in real time and can only be corrected through subsequent maintenance, making it difficult to ensure the accuracy of the test.

[0026] Based on this, an exemplary embodiment of the present invention provides a chip testing system, such as Figure 1 and Figure 7 As shown, the chip testing system includes a test base 100, a flexible pressure detection module 200, a driving module 500 and a control module 600. The test base 100 is provided with a plurality of test contacts 130, for example, Figure 1 As shown, the test base 100 includes a test board 110, on which a limit frame 120 is provided. The limit frame 120 is adapted to the shape of the chip to be tested 400. The chip to be tested 400 can be placed within the limit frame 120 to limit the horizontal position of the chip to be tested 400. Test contacts 130 are located within the area framed by the limit frame 120. The test contacts 130 are used to contact contacts on the chip 400 to achieve signal connection, thereby performing relevant tests on the chip 400 through the test base 100, such as performing system-level functional verification on the chip 400, that is, running programs to verify the chip 400's ability to work in conjunction with other components (CPU / GPU / storage controller).

[0027] Please refer to 1 and Figure 2 The flexible pressure detection module 200 is disposed opposite to the test base 100 and is used to detect the pressure applied to the chip 400. The flexible pressure detection module 200 includes a flexible substrate 210 and a first electrode 220 and a second electrode 230 connected to the flexible substrate 210. The shape and material of the flexible substrate 210 are not specifically limited. For example, it only needs to be able to undergo elastic deformation when subjected to pressure. For example, the shape of the flexible substrate 210 can be cylindrical, rectangular, or the like. The material of the flexible substrate 210 can be, for example, a material that can undergo deformation under pressure, such as silicone or rubber.

[0028] The first electrode 220 and the second electrode 230 are made of aluminum, tantalum, titanium, nickel or stainless steel. The first electrode 220 and the second electrode 230 can be made of the same material, for example, the first electrode 220 and the second electrode 230 are both made of aluminum. The first electrode 220 and the second electrode 230 can also be made of different materials, for example, the first electrode 220 is made of aluminum and the second electrode 230 is made of stainless steel.

[0029] Along the movement direction of the flexible pressure detection module 200, the first electrode 220 and the second electrode 230 are spaced apart. Figure 3 As shown, the flexible pressure detection module 200 moves in the up-down direction, and the first electrode 220 and the second electrode 230 are arranged at intervals in the up-down direction. The first electrode 220 and the second electrode 230 are arranged in a plane perpendicular to the movement direction (e.g. Figure 3 The projections of the first electrode 220 and the second electrode 230 on the horizontal plane overlap, thereby forming a capacitor. The first electrode 220 and the second electrode 230 are both connected to the flexible substrate 210. The first electrode 220 can be disposed on the surface of the flexible substrate 210, embedded within the flexible substrate 210, or indirectly connected to the flexible substrate 210 through other structures. Similarly, the second electrode 230 can be disposed on the surface of the flexible substrate 210, embedded within the flexible substrate 210, or indirectly connected to the flexible substrate 210 through other structures.

[0030] The first electrode 220 and the second electrode 230 serve as two plates of the capacitor, and the flexible substrate 210 between the first electrode 220 and the second electrode 230 serves as the dielectric layer of the capacitor. Figure 3 and Figure 4 As shown, when the flexible substrate 210 applies pressure to the chip 400, the flexible substrate 210 itself will be deformed due to the pressure, and the distance between the first electrode 220 and the second electrode 230 will change (for example, from Figure 3 D1 in becomes Figure 4 ), thereby causing the capacitance between the first electrode 220 and the second electrode 230 to change. The greater the pressure applied by the flexible substrate 210 to the chip 400, the greater the deformation of the flexible substrate 210 itself due to the pressure, the greater the change in the spacing between the first electrode 220 and the second electrode 230, and thus the greater the change in the capacitance between the first electrode 220 and the second electrode 230. Conversely, the smaller the pressure applied by the flexible substrate 210 to the chip 400, the smaller the deformation of the flexible substrate 210 itself due to the pressure, the smaller the change in the spacing between the first electrode 220 and the second electrode 230, and thus the smaller the change in the capacitance between the first electrode 220 and the second electrode 230. In this way, the capacitance signal between the first electrode 220 and the second electrode 230 can reflect the magnitude of the pressure applied by the flexible substrate 210 on the chip 400.

[0031] Please refer to Figure 7 The driving module 500 is connected to the flexible pressure detection module 200 and is used to drive the flexible pressure detection module 200 to move in a direction close to or away from the test base 100. For example, when a chip 400 test is required, after the chip 400 is placed on the test base 100, the driving module 500 drives the flexible pressure detection module 200 to move in a direction close to the test base 100, thereby pressurizing the chip 400 on the test base 100. After the chip 400 test is completed, the driving module 500 drives the flexible pressure detection module 200 to move in a direction away from the test base 100 so as to remove the tested chip 400. In one embodiment, the driving module 500 is configured as a screw mechanism driven by a servo motor, and the slider of the screw mechanism is connected to the flexible pressure detection module 200. In other embodiments, the driving module 500 can also be replaced by an electric cylinder.

[0032] The control module 600 is signal-connected to the first electrode 220, the second electrode 230, and the driving module 500, respectively. The control module 600 is configured to control the driving module 500 according to the capacitance signal sent by the flexible pressure detection module 200, so as to control the movement stroke of the flexible pressure detection module 200. For example, the control module 600 controls the driving module 500 to drive the flexible pressure detection module 200 to move in a direction close to the chip 400. When the flexible pressure detection module 200 is not in contact with the chip 400, the flexible substrate 210 does not deform, the distance between the first electrode 220 and the second electrode 230 does not change, and the capacitance between the first electrode 220 and the second electrode 230 does not change. Therefore, the capacitance signal sent by the flexible pressure detection module 200 does not change. When the flexible pressure detection module 200 moves to abut against the chip 400, as the flexible pressure detection module 200 continues to move toward the chip 400, the flexible substrate 210 will deform, the distance between the first electrode 220 and the second electrode 230 will gradually decrease, and the capacitance between the first electrode 220 and the second electrode 230 will gradually increase, so the capacitance signal sent by the flexible pressure detection module 200 changes. The control module 600 stores a preset standard pressure range. When the pressure represented by the capacitance signal falls within the preset standard pressure range, it means that the force currently applied by the flexible pressure detection module 200 to the chip 400 meets the pressure requirement. At this time, the control module 600 controls the driving module 500 to stop driving the flexible pressure detection module 200 to move, so that the pressure applied by the flexible pressure detection module 200 to the chip 400 is maintained within the preset standard pressure range. The specific manner in which the control module 600 obtains the capacitance signal sent by the flexible pressure detection module 200 is not limited in this embodiment. For example, the control module 600 may include an RC oscillator to detect the capacitance signal of the flexible pressure detection module 200. The capacitance (C) is part of the resonant circuit of the RC oscillator. Changes in the capacitance (C) cause changes in the oscillation frequency (f). By measuring the change in the oscillation frequency (f), the change in capacitance (C) can be determined. For another example, the control module 600 may include a capacitance-to-voltage converter that converts capacitance changes into voltage changes. By detecting the voltage change, the capacitance change can be determined.

[0033] In one exemplary embodiment, please refer to Figure 2 and Figure 3 The flexible substrate 210 includes an arcuate surface 211 protruding toward the test base 100 and a plane 212 connected to the edge of the arcuate surface 211. At least one of the first electrode 220 and the second electrode 230 is provided in plurality. The first electrode 220 is provided on the plane 212, and the second electrode 230 is built into the flexible substrate 210. In this way, when the force direction of the flexible substrate 210 is non-vertical, for example, Figure 5As shown, if the operator mistakenly places the chip 400 at an angle, the chip 400 will tilt under pressure. When the curved surface 211 of the flexible substrate 210 contacts the chip 400, the chip 400 will apply a squeezing force at an angle to the direction of travel of the flexible pressure detection module 200 to the flexible substrate 210. Because the surface of the flexible substrate 210 that acts on the chip 400 is the curved surface 211, it is easy to produce different deformation amounts at different locations when subjected to the squeezing force at an angle to the direction of travel, thereby causing the second electrode 230 in the flexible substrate 210 to change position, while the first electrode 220 located on the plane 212 is not easily changed. As a result, the spacing between the first electrode 220 and the second electrode 230 at different locations is also different. For example, in an embodiment where multiple first electrodes 220 are provided and only one second electrode 230 is provided, the second electrode 230 will tilt, and the spacing between different first electrodes 220 and second electrodes 230 will be different, resulting in different capacitance signals between different first electrodes 220 and second electrodes 230. For another example, in an embodiment where multiple second electrodes 230 are provided, the spacing between the second electrodes 230 and the first electrode 220 at different locations varies, resulting in different capacitance signals between different second electrodes 230 and the first electrode 220. Thus, when the difference between the multiple capacitance signals is large, it indicates that the chip 400 is tilted, prompting the operator to adjust the position of the chip 400.

[0034] Exemplarily, the flexible substrate 210 is configured to be hemispherical, and the curved surface 211 of the flexible substrate 210 is a hemispherical surface.

[0035] Exemplarily, the flexible substrate 210 is set to a spherical shape and is obtained by removing part of the structure through any cross-section, but it should be noted that the cross-section needs to be perpendicular to the movement direction of the flexible pressure detection module 200, so that when there are multiple first electrodes 220, when the chip 400 to be detected is tilted, the flexible substrate 210 is deformed, resulting in a difference in the distance between the first electrodes 220 and the second electrodes 230, which is convenient for detecting whether the chip 400 is placed flat.

[0036] In this embodiment, please refer to Figure 2 The flexible substrate 210 is configured to include an arc-shaped surface 211 protruding toward the test base 100 and a plane 212 connected to the edge of the arc-shaped surface 211. The first electrode 220 is set on the plane 212, and the second electrode 230 is built into the flexible substrate 210. By comparing the multiple capacitance signals obtained by detection, it is possible to determine whether the chip 400 is tilted, thereby prompting the operator to adjust the position of the chip 400 in time to avoid damage to the chip 400 due to continued downward pressure after the chip 400 is tilted, thereby ensuring the reliability of the test process.

[0037] In one embodiment, the chip testing system further includes a position adjustment module for adjusting the position of the chip 400. For example, when the chip 400 is tilted, the position adjustment module can be used to restore the chip 400 to a horizontal position. The position adjustment module can include push rods or paddles located on the four sides of the chip 400.

[0038] In one embodiment, a plurality of first electrodes 220 are provided, and a single second electrode 230 is provided. The area of the second electrode 230 is larger than that of the first electrode 220, and the projections of the plurality of first electrodes 220 along the direction of travel of the flexible pressure detection module 200 are all located on the second electrode 230. For example, the second electrode 230 includes a surface facing the first electrode 220, and the projections of each first electrode 220 on the plane 212 on which the surface is located are all located within the first surface 231, so that the second electrode 230 corresponds to the plurality of first electrodes 220 at the same time. In this way, the capacitance signal between each first electrode 220 and the second electrode 230 can be detected separately to determine the pressure applied to the chip 400 and whether the chip 400 is tilted. Each first electrode 220 is within the coverage area of the second electrode 230, reducing the influence of the capacitance between the first electrode 220 and the second electrode 230 on the change in the facing area.

[0039] Of course, it is understandable that in other embodiments, there may be one first electrode 220 and multiple second electrodes 230. In this case, the area of the first electrode 220 is larger than the area of the second electrode 230, and the projections of the multiple second electrodes 230 along the travel direction of the flexible pressure detection module 200 are all located on the first electrode 220, so that the first electrode 220 simultaneously corresponds to the multiple second electrodes 230. Alternatively, there may be multiple first electrodes 220 and multiple second electrodes 230, and the multiple first electrodes 220 are arranged in a one-to-one correspondence with the multiple second electrodes 230, that is, the projection of each first electrode 220 along the travel direction of the flexible pressure detection module 200 falls on the corresponding second electrode 230.

[0040] In one exemplary embodiment, please refer to Figure 2 and Figure 3 Four first electrodes 220 are provided, with the centers of the four first electrodes 220 located at the four vertices of a rectangle. The second electrode 230 is, for example, a rectangular sheet-like structure. The second electrode 230 includes a first surface 231 facing the first electrode 220 and a second surface 232 facing away from the first electrode 220. The projections of the four first electrodes 220 on the plane 212 where the first surface 231 is located are all located within the first surface 231. The offset direction of the chip 400 can be determined by comparing the differences in the capacitance signals detected by the four first electrodes 220.

[0041] For example, the centers of the four first electrodes 220 are respectively located at the four vertices of a square. At this time, an xyz coordinate system can be established on the plane 212 where the four first electrodes 220 are located, and the coordinate origin is located in the middle position of the four first electrodes 220. According to the capacitance signals detected by the four first electrodes 220, the coordinate positions of the four first electrodes 220 are determined, and then the offset direction of the chip 400 can be determined.

[0042] Please refer to Figure 6 In an exemplary embodiment, the material of the flexible substrate 210 includes a core 213 made of polydimethylsiloxane material, and a conductive layer 214 formed by coating a conductive carbon-based material on the surface of the core 213 .

[0043] In this embodiment, a conductive carbon-based material is coated on the surface of a polydimethylsiloxane material (PDMS). The carbon-based material can form hydrogen bonds with the silicon-oxygen bonds of the polydimethylsiloxane material through oxygen-containing functional groups (-COOH, -OH), thereby improving the dispersion and constructing a more uniform conductive interface, avoiding ESD (electrostatic discharge) during the testing of the chip 400, and preventing static electricity from breaking through semiconductor devices (such as transistors) in the chip 400 and causing damage to the chip 400.

[0044] In an exemplary embodiment, a pore structure 215 is provided in the flexible substrate 210. The pore structure 215 can increase the movement path of charges, thereby preventing charges from accumulating on the surface of the flexible substrate 210 to generate static electricity and damage the chip 400.

[0045] In one exemplary embodiment, please refer to Figure 7 The chip testing system further includes a temperature detection module 300, which is configured to detect the temperature of the flexible pressure detection module 200. The control module 600 is signal-connected to the temperature detection module 300. The control module 600 is configured to control the driving module 500 according to the capacitance signal sent by the flexible pressure detection module 200 and the temperature signal sent by the temperature detection module 300, so as to control the movement stroke of the flexible pressure detection module 200. The movement stroke of the flexible pressure detection module 200 is controlled by combining the temperature signal and the capacitance signal. The temperature signal can be used to correct the movement stroke of the flexible pressure detection module 200, thereby avoiding detection deviation caused by thermal expansion and contraction of the flexible substrate 210 material, and avoiding damage to the chip 400 due to excessive pressure, or unreliable contact with the test contact 130 due to low pressure, which affects the test accuracy.

[0046] Exemplarily, the temperature detection module 300 feeds the detected temperature signal back to the control module 600. Based on the received temperature signal, the control module 600 selects a preset standard pressure range corresponding to the temperature to regulate pressure detection errors caused by thermal expansion and contraction of the flexible substrate 210. For example, the control module 600 stores multiple preset standard pressure ranges corresponding to multiple different temperature ranges. Based on the received temperature signal, the control module 600 determines the temperature range to which the temperature signal belongs, and further determines the preset standard pressure range corresponding to the temperature range. Exemplarily, the control module 600 stores five temperature ranges: (-∞, -15°C), [-15°C, 0°C), [0°C, 15°C), [15°C, 30°C), and [30°C, +∞). These five temperature ranges correspond to different preset standard pressure ranges F1 to F5, respectively. Based on the temperature signal detected by the temperature detection module 300, the control module 600 determines which temperature range the temperature signal belongs to, and then selects the corresponding preset standard pressure range from the preset standard pressure ranges F1 to F5. For example, when the temperature detected by the temperature detection module 300 is 25° C., it is determined that it belongs to the temperature range of [15° C., 30° C.), and the preset standard pressure range F4 is selected.

[0047] In one embodiment, the chip testing system also includes a two-to-one selector 800 and an A / D converter 700. The two-to-one selector 800 is signal-connected to the temperature detection module 300 and the flexible pressure detection module 200 through an amplifier 900, and at the same time, the two-to-one selector 800 is signal-connected to the control module 600; the temperature signal detected by the temperature detection module 300 or the pressure detection signal detected by the flexible pressure detection module 200 is amplified by the amplifier 900 into a voltage signal and sent to the two-to-one selector 800, and the A / D converter 700 is signal-connected to the two-to-one selector 800 and the control module 600, respectively. The two-to-one selector 800 selects one signal according to the command issued by the control module 600 and sends it to the A / D converter 700. The A / D converter 700 converts the input voltage signal into a digital signal and sends it to the control module 600. The control module 600 receives the digital signal in real time and controls the driving stroke of the driving module 500.

[0048] Exemplarily, the two-to-one selector 800 can be implemented using an AND gate structure. For example, the two-to-one selector 800 includes a first AND gate, a second AND gate, a NOT gate, and an OR gate. The first input of the first AND gate is connected to the control module 600, and the second input is connected to the amplifier 900 of the temperature detection module 300. The first input of the second AND gate is connected to the control module 600 via a NOT gate, and the second input of the second AND gate is connected to the amplifier 900 of the flexible pressure detection module 200. The outputs of the first and second AND gates are connected to the A / D converter 700 via an OR gate. Thus, when the control signal output by the control module 600 is 1, the first AND gate outputs the temperature signal amplified by the amplifier 900, and the second AND gate outputs 0. In this case, the temperature signal is output to the A / D converter 700 via the OR gate. When the control signal output by the control module 600 is 0, the first AND gate outputs 0, and the second AND gate outputs the pressure detection signal amplified by the amplifier 900. In this case, the pressure detection signal is output to the A / D converter 700 via the OR gate. In this way, the two-choice function can be realized through a simple AND gate structure.

[0049] Specifically, the control module 600 preferentially issues an instruction to the selector 800 to select the temperature signal sent by the temperature detection module 300. The temperature signal is amplified into a voltage signal by the amplifier 900, then converted into a digital signal by the A / D converter 700 and transmitted to the control module 600. The control module 600 then selects the standard pressure range for the corresponding temperature. The control module 600 then issues an instruction to the selector 800 to select the pressure detection signal detected by the pressure detection module. The pressure detection signal is amplified into a voltage signal by the amplifier 900, then converted into a digital signal by the A / D converter 700 and transmitted to the control module 600. The control module 600 then determines whether the pressure falls within the standard pressure range. If so, it issues a stop instruction to the driver module 500. If not, it controls the driver module 500 to continue operating.

[0050] The temperature detection module 300 may be, for example, a temperature sensor.

[0051] The control module 600 is configured to control the driving module 500 according to the capacitance signal sent by the flexible pressure detection module 200 and the temperature signal sent by the temperature detection module 300, including the following steps: S101, obtaining a temperature signal sent by a temperature detection module; S102, selecting a preset standard pressure range at a corresponding temperature from preset standard pressure ranges at different temperatures according to the temperature signal; S103, receiving the capacitance signal sent by the flexible pressure detection module in real time, and judging whether the pressure value represented by the capacitance signal falls within the standard pressure range, if so, sending a stop signal to the driving module, if not, the driving module continues to operate.

[0052] The method for obtaining the preset standard pressure range at different temperatures is as follows: detecting the relationship between the stroke of the flexible pressure detection module 200 and the detection pressure value at the standard temperature; then detecting the relationship between the detection pressure value at different temperatures under the same stroke, or detecting the relationship between the stroke and the detection pressure value at different temperatures. Combining the above two relationships, the relationship between the detection value and the actual pressure at different temperatures is obtained. It should be noted that the standard temperature can be set according to actual needs and this embodiment does not impose any restrictions on this.

[0053] In an exemplary embodiment, Figure 3 As shown, the temperature detection module 300 is built into the flexible substrate 210, and in the movement direction of the flexible pressure detection module 200, the temperature detection module 300 is located on the side of the first electrode 220 away from the second electrode 230, or on the side of the second electrode 230 away from the first electrode 220. For example, Figure 3 In the illustrated embodiment, the temperature detection module 300 is located below the second electrode 230 . The temperature detection module 300 may also be located above the first electrode 220 .

[0054] In this embodiment, the temperature detection module 300 is built into the flexible substrate 210, so that the temperature detection module 300 can more accurately detect the temperature of the flexible pressure detection module 200 and the detection accuracy is higher. The temperature detection module 300 is set outside the first electrode 220 and the second electrode 230, so that the temperature detection module 300 will not interfere with the displacement of the first electrode 220 and the second electrode 230, thereby ensuring the accuracy of the pressure signal detected by the flexible pressure detection module 200.

[0055] An exemplary embodiment of the present invention provides a control method for a chip test system, which can be applied to the chip test systems provided in the above embodiments. Figure 8 As shown, the control method of the chip testing system includes: S201, controlling the driving module to drive the flexible pressure detection module to move toward the test base; S202, acquiring a capacitance signal between the first electrode and the second electrode during movement of the flexible pressure detection module; S203 : When it is determined that the capacitance signal meets a preset condition, the driving module is controlled to stop the movement of the flexible pressure detection module.

[0056] The specific method of obtaining the capacitance signal between the first electrode 220 and the second electrode 230 has been described in the above system embodiment and will not be repeated here.

[0057] Combine Figure 1 and Figure 7 In this embodiment, after the operator places the chip 400 on the test base 100, the control module 600 controls the driving module 500 to drive the flexible pressure detection module 200 toward the chip 400. When the flexible substrate 210 is not in contact with the chip 400, the flexible substrate 210 does not deform, and the capacitance signal output by the flexible pressure detection module 200 remains unchanged. After the flexible substrate 210 contacts the chip 400, as the flexible pressure detection module 200 continues to move toward the chip 400, the flexible substrate 210 applies pressure to the chip 400. The flexible substrate 210 is deformed by the reaction force, causing the spacing between the first electrode 220 and the second electrode 230 connected to the flexible substrate 210 to gradually decrease. This, in turn, causes the capacitance signal output by the flexible pressure detection module 200 to gradually change. When the capacitance signal meets a preset condition, the control module 600 controls the driving module 500 to stop the movement of the flexible pressure detection module 200.

[0058] The preset condition is used to indicate that the pressure applied by the flexible pressure detection module 200 to the chip 400 meets the requirements, which can ensure that the chip 400 is in stable and effective contact with the test base 100, and can prevent the chip 400 from being damaged due to excessive pressure.

[0059] In one embodiment, the preset condition includes the capacitance signal output by the flexible pressure detection module 200 no longer changing or the amount of change being less than a preset change threshold. When the preset condition is met, it indicates that the flexible substrate 210 is no longer deforming. This indicates that the flexible pressure detection module 200 is in place, the pressure applied to the chip 400 meets the pressure requirement, and the control driving module 500 stops the movement of the flexible pressure detection module 200. Exemplarily, the control module 600 periodically acquires the capacitance signal output by the pressure detection module 200, for example, once every 0.1 seconds. When the capacitance signals are the same for a predetermined number of consecutive times, or the amount of change in capacitance is less than a preset change threshold, it indicates that the flexible substrate 210 is no longer deforming, and the control driving module 500 stops the movement of the flexible pressure detection module 200. The predetermined number of times can be, for example, 3-5 times.

[0060] In another embodiment, the preset condition includes that the pressure value represented by the capacitance signal meets the preset standard pressure requirement. Meeting the preset standard pressure requirement can be, for example, that the pressure value represented by the capacitance signal reaches the preset standard pressure value, or that the pressure value represented by the capacitance signal is within the preset standard pressure value range. As described above, the flexible substrate 210 will deform in the process of pressing the chip 400. The greater the deformation, the greater the pressure applied to the chip 400. The greater the deformation, the smaller the spacing between the first electrode 220 and the second electrode 230, and the larger the corresponding output capacitance signal. In this way, the capacitance signal can be used to represent the pressure applied to the chip 400 by the flexible pressure detection module 200. When the pressure value represented by the capacitance signal meets the preset standard pressure requirement, it means that the pressure applied to the chip 400 meets the pressure requirement, and the control driving module 500 stops the movement of the flexible pressure detection module 200.

[0061] In this embodiment, when the capacitance signal between the first electrode and the second electrode meets the preset conditions, it indicates that there is sufficient clamping force between the chip 400 and the test base 100 at this time, and the control driving module 500 stops the movement of the flexible pressure detection module 200. In this way, it can not only ensure stable and effective contact between the chip 400 and the test base 100, thereby ensuring the smooth progress of the test process, but also avoid excessive pressure on the chip 400 and causing damage to the chip 400.

[0062] In an exemplary embodiment, a plurality of first electrodes are provided, and the control method of the chip testing system further includes: S301, acquiring a capacitance signal between each first electrode and second electrode; S302, determining the magnitude relationship of each capacitance signal; S303 : Determine the tilt direction or offset direction of the chip based on the magnitude relationship of each capacitance signal.

[0063] As previously shown, when the chip 400 is tilted, the Figure 5 As shown, the reaction force applied by the chip 400 to the flexible substrate 210 is no longer parallel to the movement direction of the flexible pressure detection module 200, and there is also a component force set at an angle to the movement direction of the flexible pressure detection module 200. The flexible substrate 210 not only deforms in the movement direction of the flexible pressure detection module 200, but also deforms in the direction at an angle to the movement direction of the flexible pressure detection module 200 under the action of the component force. This deformation causes the second electrode 230 embedded in the flexible substrate 210 to tilt. In this way, with reference to Figure 5As shown, the distances between the first electrodes 220 and the second electrodes 230 at different locations are different, which results in different capacitance signals corresponding to the first electrodes 220 at different locations. A larger capacitance signal indicates a smaller spacing between the corresponding first electrodes 220 and the second electrodes 230, and a smaller capacitance signal indicates a larger spacing between the corresponding first electrodes 220 and the second electrodes 230. In this embodiment, the flexible pressure detection module 200 sends the capacitance signals between each first electrode 220 and the second electrode 230 to the control module 600. After receiving the multiple capacitance signals sent by the flexible pressure detection module 200, the control module 600 determines the magnitude relationship of the multiple capacitance signals. By comparing the magnitudes of the capacitance signals corresponding to each first electrode 220, the magnitudes of the distances between different first electrodes 220 and the second electrode 230 can be determined, thereby determining the tilt direction or offset direction of the chip 400 (if a position of the chip 400 is tilted downward, it means that the position does not provide effective support for the chip 400, and the offset direction of the chip 400 is the direction of the position).

[0064] In this embodiment, by comparing the magnitude relationship of each capacitance signal, the tilt direction or offset direction of the chip 400 can be determined, thereby prompting the operator to adjust the position of the chip 400.

[0065] In an exemplary embodiment, determining the tilt direction or offset direction of the chip 400 based on the magnitude relationship of each capacitance signal includes: S401, when the difference between at least two capacitance signals is greater than a preset difference, sorting the capacitance signals; S402 , sorting the high and low positions of the four vertices of the chip based on the sorted capacitance signals. The larger the capacitance signal, the higher the vertex of the chip at the corresponding position. S403 : Determine the tilt direction of the chip based on the height order of the four vertices.

[0066] Exemplarily, the four first electrodes 220 are first electrode A1, first electrode A2, first electrode A3, and first electrode A4, which respectively correspond to vertex B1, vertex B2, vertex B3, and vertex B4 of the chip 400. The capacitance signal corresponding to the first electrode A1 is C1, the capacitance signal corresponding to the first electrode A2 is C2, the capacitance signal corresponding to the first electrode A3 is C3, and the capacitance signal corresponding to the first electrode A4 is C4. The control module 600 performs a pairwise difference calculation on the capacitance signals C1 to C4. When at least one difference is greater than a preset difference, it indicates that the chip 400 has tilted at a relatively large angle. The capacitance signals C1 to C4 are then sorted in order, for example, C1>C2>C3>C4. This indicates that the distance L1 between the first electrode A1 and the second electrode 230, the distance L2 between the first electrode A2 and the second electrode 230, the distance L3 between the first electrode A3 and the second electrode 230, and the distance L4 between the first electrode A4 and the second electrode 230 are in the order of L1<L2<L3<L4. The height of the four vertices of the chip 400 is sorted from high to low, namely, vertex B1, vertex B2, vertex B3, and vertex B4, and the tilt direction of the chip 400 is thus determined.

[0067] In one embodiment, after determining the offset direction of the chip, the control module 600 can also control the position adjustment module to adjust the position of the chip 400, so that the position adjustment module pushes the chip 400 to move in the opposite direction of the offset direction to restore the chip 400 to a horizontal state.

[0068] In an exemplary embodiment, the control method of the chip testing system further includes: S501, determining a preset standard pressure-stroke correspondence relationship; S502, during the movement of the flexible pressure detection module, comparing the actual pressure represented by the capacitance signal detected by the flexible pressure detection module with the standard pressure of the same stroke in the standard pressure-stroke correspondence relationship; S503 : If the comparison result satisfies the preset pressure abnormality condition, the control driving module stops the movement of the flexible pressure detection module and sends an alarm; otherwise, the control driving module drives the flexible pressure detection module to continue moving.

[0069] The standard pressure-stroke correspondence refers to the standard pressure value that the flexible pressure detection module 200 should output for each unit of travel of the flexible pressure detection module 200. The standard pressure-stroke correspondence can be, for example, a pressure-stroke curve, a mapping relationship between different travel ranges and pressures, or a table or other form, and this embodiment does not limit this. The standard pressure-stroke correspondence is stored in the control module 600. When the control module 600 controls the driving module 500 to drive the flexible pressure detection module 200 to move, the capacitance signal output by the flexible pressure detection module 200 is periodically obtained, and the position signal output by the driving module 500 is obtained at the same time. The position signal is used to represent the stroke of the flexible pressure detection module 200 driven by the driving module 500. The control module 600 compares the actual pressure represented by the capacitance signal output by the flexible pressure detection module 200 with the standard pressure of the same stroke in the standard pressure-stroke correspondence. If the actual pressure is significantly different from the standard pressure, it indicates that there is an abnormality, for example, the chip 400 has tilted. At this time, it is judged that a fault has occurred. When a fault occurs, the movement of the flexible pressure detection module 200 is stopped, thereby avoiding the flexible pressure detection module 200 from continuing to move and causing damage to the chip 400.

[0070] Please refer to Figure 5 Before the driving module 500 drives the flexible pressure detection module 200 to move toward the test base 100 each time, the control module 600 applies a reset instruction to the driving module 500. After receiving the reset instruction, the control module 600 drives the flexible pressure detection module 200 to reach a preset initial position, that is, the position where the stroke is zero in the standard pressure-stroke correspondence relationship.

[0071] In an exemplary embodiment, determining a preset standard pressure-stroke correspondence includes: S601: Acquire a temperature signal detected by a temperature detection module, where the temperature signal represents the temperature of the flexible pressure detection module; S602: Determine a corresponding standard pressure-stroke correspondence according to the temperature signal and preset configuration information, where the preset configuration information is used to characterize the correspondence between the temperature and the pressure-stroke curve.

[0072] In this embodiment, the control module 600 stores preset configuration information that represents the correspondence between temperature and the pressure-stroke curve. Before controlling the drive module 500 to operate, the control module 600 first obtains the temperature signal detected by the temperature detection module 300, determines the corresponding standard pressure-stroke correspondence based on the temperature signal, and then performs a subsequent judgment on whether the pressure is abnormal.

[0073] The preset configuration information is obtained by detecting the pressure-stroke relationship at a standard temperature; then detecting the relationship between the detected pressure values at different temperatures under the same stroke, or detecting the relationship between the stroke and the detected pressure values at different temperatures. Combining these two relationships, the pressure-stroke relationship at different temperatures is obtained. It should be noted that the standard temperature can be set according to actual needs and is not limited in this embodiment.

[0074] In this embodiment, the standard pressure-stroke correspondence corresponding to the temperature signal is determined based on the temperature signal detected by the temperature detection module 300, thereby avoiding test errors caused by thermal expansion and contraction of the flexible substrate 210 due to temperature, thereby avoiding erroneous operation of the driving module 500 and further improving the reliability of the test process.

[0075] In an exemplary embodiment, determining a corresponding standard pressure-stroke correspondence relationship based on the temperature signal and preset configuration information includes: If the preset configuration information includes the temperature represented by the temperature signal, the pressure-stroke curve corresponding to the temperature represented by the temperature signal is determined as the standard pressure-stroke correspondence relationship; Otherwise, the pressure-stroke curve corresponding to one of the two temperatures adjacent to the temperature represented by the temperature signal in the preset configuration information can be used as the standard pressure-stroke correspondence. For example, the pressure-stroke curve that is closer to the temperature represented by the temperature signal can be used as the standard pressure-stroke correspondence.

[0076] In another embodiment, if the preset configuration information does not include the temperature represented by the temperature signal, pressure-stroke curves corresponding to two temperatures in the preset configuration information adjacent to the temperature represented by the temperature signal are obtained, and the two pressure-stroke curves are fitted to obtain a pressure-stroke curve corresponding to the temperature represented by the temperature signal and used as the standard pressure-stroke correspondence. The two pressure-stroke curves can be fitted, for example, by averaging the values of the points to obtain the standard pressure-stroke correspondence.

[0077] In this embodiment, the standard pressure-stroke correspondence is determined by fitting two adjacent pressure-stroke curves, so that the standard pressure-stroke correspondence is more closely matched with the current temperature, thereby improving the control accuracy of the driving module 500 and further improving the reliability of the testing process.

[0078] In an exemplary embodiment, the control method of the chip testing system further includes: S701: If the comparison result meets the preset pressure abnormality condition, the tilt direction or offset direction of the chip is prompted.

[0079] In this step, the chip's tilt or offset direction can be indicated through images, text, etc., so that the operator can more intuitively view the current status of the chip and facilitate chip position adjustment. Of course, the chip reset direction can also be indicated to better guide the operator in the reset operation.

[0080] For example, refer to Figure 1 The control module 600 can be arranged above the driving module 500. The control module 600 is provided with an interactive system, such as a display screen and buttons, or a touch screen. The operator can send a control signal to the control module 600 by operating the buttons or touching the touch screen. The control module 600 controls the driving module 500 according to the received control signal. For example, the buttons can include a start button and a reset button. When the operator presses the start button, the control module 600 applies a first reset instruction to the driving module 500. After receiving the first reset instruction, the driving module 500 drives the flexible pressure detection module 200 to a preset initial position. When the flexible pressure detection module 200 reaches the initial position, the control module 600 controls the driving module 500 to drive the flexible pressure detection module 200 from the initial position toward the chip 400.

[0081] In this embodiment, when the comparison result meets the preset pressure abnormality condition, the control module 600 can remind the operator of the tilt direction or offset direction of the chip through the interactive system. For example, the current position state of the chip is displayed on the display screen, so that the operator can intuitively see how the chip is tilted through the display screen. The operator can also be prompted to reset the chip in the form of an arrow on the display screen. After determining that the pressure is abnormal, the operator can press the reset button. At this time, the control module 600 applies a second reset instruction to the drive module 500. After receiving the second reset instruction, the drive module 500 drives the flexible pressure detection module 200 to move away from the chip 400. It can be moved to a preset initial position or only a predetermined distance, so that the operator can adjust the position of the chip 400.

[0082] S702 , periodically detecting whether the comparison result satisfies a preset pressure abnormality condition; when the comparison result switches from satisfying the preset pressure abnormality condition to not satisfying the preset pressure abnormality condition, controlling the driving module to drive the flexible pressure detection module to continue moving.

[0083] In this step, after the operator completes the reset operation, the comparison result switches from satisfying the preset pressure abnormality condition to not satisfying the preset pressure abnormality condition. At this time, the control module 600 can automatically control the drive module 500 to drive the flexible pressure detection module 200 to continue to move, thereby improving the test efficiency. It can be understood that when the control drive module 500 drives the flexible pressure detection module 200 to continue to move, S501 and S502 can be continued to ensure the safety of the subsequent movement process. The present invention controls the flexible pressure detection module 200 to apply pressure to the chip 400 through the information fed back by the flexible pressure detection module 200 and the temperature detection module 300, so that the pressure applied by the flexible pressure detection module 200 to the chip 400 eliminates the interference of temperature, so that the pressure on the chip 400 can maintain a stable level under various temperatures, and at the same time, no manual adjustment by the operator is required, thereby improving the fixing efficiency.

[0084] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include at least one of such features.

[0085] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0086] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0087] Other embodiments of the present invention will readily occur to those skilled in the art after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein.

Claims

1. A chip testing system, characterized in that: include: A test base, wherein a plurality of test contacts are provided on the test base; a flexible pressure detection module disposed opposite the test base, the flexible pressure detection module comprising a flexible substrate and a first electrode and a second electrode connected to the flexible substrate, the first electrode and the second electrode being spaced apart along a direction of movement of the flexible pressure detection module, the flexible pressure detection module being configured such that when the flexible substrate is compressed and deformed, the capacitance between the first electrode and the second electrode changes, thereby generating a changing capacitance signal, the capacitance signal being used to represent the magnitude of pressure within the flexible pressure detection module; a driving module connected to the flexible pressure detection module, and configured to drive the flexible pressure detection module to move in a direction approaching or away from the test base; The control module is signal-connected to the first electrode, the second electrode and the driving module respectively, and the control module is configured to control the driving module according to the capacitance signal sent by the flexible pressure detection module to control the movement stroke of the flexible pressure detection module.

2. The chip testing system according to claim 1, characterized in that: The flexible substrate includes an arcuate surface protruding toward the test base and a plane connected to the edge of the arcuate surface. At least one of the first electrode and the second electrode is provided in plurality. The first electrode is provided on the plane, and the second electrode is built into the flexible substrate.

3. The chip testing system according to claim 2, characterized in that: There are four first electrodes, and the centers of the four first electrodes are respectively located at the four vertices of the rectangle. The second electrode includes a first surface facing the first electrode and a second surface facing away from the first electrode. The projections of the four first electrodes on the plane where the first surface is located are all located within the first surface.

4. The chip testing system according to claim 1, wherein: The material of the flexible substrate includes polydimethylsiloxane material, and the surface of the polydimethylsiloxane material is coated with a conductive carbon-based material; and / or, A pore structure is provided in the flexible matrix.

5. The chip testing system according to any one of claims 1 to 4, characterized in that: The chip testing system further includes: a temperature detection module, configured to detect the temperature of the flexible pressure detection module; The control module is signal-connected to the temperature detection module, and is configured to control the driving module according to the capacitance signal sent by the flexible pressure detection module and the temperature signal sent by the temperature detection module to control the movement stroke of the flexible pressure detection module.

6. The chip testing system according to claim 5, characterized in that: The temperature detection module is built into the flexible substrate, and in the movement direction of the flexible pressure detection module, the temperature detection module is located on the side of the first electrode away from the second electrode, or on the side of the second electrode away from the first electrode.

7. A control method for a chip testing system, characterized in that: Applied to the chip testing system according to any one of claims 1 to 6, the control method of the chip testing system includes: The control driving module drives the flexible pressure detection module to move toward the test base; acquiring a capacitance signal between the first electrode and the second electrode during movement of the flexible pressure detection module; When it is determined that the capacitance signal meets a preset condition, the driving module is controlled to stop the movement of the flexible pressure detection module.

8. The control method of the chip testing system according to claim 7, characterized in that: There are multiple first electrodes, and the control method of the chip testing system further includes: acquiring a capacitance signal between each of the first electrodes and the second electrodes; Determining a magnitude relationship between the capacitance signals; Based on the magnitude relationship of the capacitance signals, the tilt direction or the offset direction of the chip is determined.

9. The control method of the chip testing system according to claim 8, characterized in that: The determining the tilt direction or offset direction of the chip based on the magnitude relationship of each of the capacitance signals includes: When a difference between at least two capacitance signals is greater than a preset difference, sorting the capacitance signals; Based on the sorted capacitance signals, the four vertices of the chip are sorted in order of height. The larger the capacitance signal, the higher the vertex of the chip at the corresponding position. The tilt direction of the chip is determined based on the high and low position sorting of the four vertices.

10. The control method of the chip testing system according to any one of claims 7 to 9, characterized in that: The control method of the chip testing system further includes: Determine the preset standard pressure-stroke correspondence; During the movement of the flexible pressure detection module, the actual pressure represented by the capacitance signal detected by the flexible pressure detection module is compared with the standard pressure of the same stroke in the standard pressure-stroke correspondence relationship; If the comparison result meets the preset pressure abnormality condition, the driving module is controlled to stop the movement of the flexible pressure detection module; otherwise, the driving module is controlled to drive the flexible pressure detection module to continue moving.

11. The control method of the chip testing system according to claim 10, characterized in that: Determining the preset standard pressure-stroke correspondence includes: Acquire a temperature signal detected by a temperature detection module, wherein the temperature signal represents the temperature of the flexible pressure detection module; The corresponding standard pressure-stroke correspondence is determined according to the temperature signal and preset configuration information, wherein the preset configuration information is used to characterize the correspondence between temperature and pressure-stroke curves.

12. The control method of the chip testing system according to claim 11, characterized in that: Determining the corresponding standard pressure-stroke correspondence according to the temperature signal and preset configuration information includes: If the preset configuration information includes the temperature represented by the temperature signal, a pressure-stroke curve corresponding to the temperature represented by the temperature signal is determined as the standard pressure-stroke correspondence relationship; Otherwise, obtain the pressure-stroke curves corresponding to two temperatures adjacent to the temperature represented by the temperature signal in the preset configuration information, fit the two pressure-stroke curves, and obtain the pressure-stroke curve corresponding to the temperature represented by the temperature signal as the standard pressure-stroke correspondence relationship.

13. The control method of the chip testing system according to claim 10, characterized in that: The control method of the chip testing system further includes: If the comparison result satisfies the preset pressure abnormality condition, prompting the tilt direction or offset direction of the chip, and / or prompting the reset direction of the chip; The comparison result is periodically detected to determine whether it satisfies the preset pressure abnormality condition. When the comparison result switches from satisfying the preset pressure abnormality condition to not satisfying the preset pressure abnormality condition, the driving module is controlled to drive the flexible pressure detection module to continue moving.

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