Wet etching equipment and control method thereof
By setting up rotation, sway, lift and clamping components in the wet etching equipment, the problems of insufficient etching uniformity and process flexibility of existing equipment are solved, uniform etching and precise control of the wafer surface are achieved, and etching quality and equipment practicality are improved.
Patent Information
- Application Number
- CN202510307931.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2025-08-05
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing wet etching equipment has shortcomings in process flexibility and etching uniformity. Traditional wet etching equipment is difficult to achieve dynamic wobble, resulting in uneven contact, and spray etching equipment is difficult to accurately control the residence time of the etching liquid, which increases process complexity and equipment cost.
By setting up a rotating component, a swing component, a lifting component and a clamping component, the wafer rotates and swings in the etching liquid, and combined with the use of the spraying component, switching and uniform etching of different etching methods can be achieved.
It improves the etching quality and the practicality of the equipment, realizes uniform etching and precise control of the wafer surface, and reduces process complexity and equipment costs.
Smart Images
Figure CN120432402A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of etching machines, in particular to wet etching equipment and a control method thereof. Background Art
[0002] Wet etching technology is one of the key processes in semiconductor manufacturing. It is mainly used to remove specific materials from the surface of the wafer through chemical solutions to achieve the processing of microstructures. This technology is widely used in integrated circuits, optoelectronic devices and micro-electromechanical systems (MEMS) and other fields. The core of wet etching is to achieve high-precision removal of materials by controlling the composition, temperature, concentration of the etching solution and the contact method between the wafer and the etching solution. Common etching methods include immersion etching and spray etching. The former achieves uniform etching by completely immersing the wafer in the etching solution, while the latter forms a thin film on the wafer surface by spraying the etching solution for local etching.
[0003] However, existing wet etching equipment still has certain limitations in terms of process flexibility and etching uniformity. First, traditional immersion etching equipment has difficulty in achieving dynamic swinging of the wafer during the etching process, resulting in uneven contact between the etching solution and the wafer surface. Especially in the etching of complex structures, problems such as insufficient etching or excessive etching are prone to occur. Secondly, although spray etching equipment can achieve local etching, the residence time of the etching solution is difficult to accurately control, which can easily cause excessive corrosion or uneven etching of the wafer surface. In addition, existing equipment often requires complex mechanical operations during the switching process between etching and cleaning, which increases the complexity of the process and the cost of the equipment. For this reason, a wet etching device is needed to solve the existing deficiencies. Summary of the Invention
[0004] The purpose of the present invention is to make up for the shortcomings of the existing technology and provide a wet etching device and a control method thereof. Through the provided rotating component, the etching liquid is sprayed and etched conveniently, and different etching modes are switched; through the provided swinging component, the wafer can swing back and forth along the radial direction of the rotary plate during the rotation, so that the wafer surface is in full contact with the etching liquid, and it is beneficial to uniformly etch the wafer surface and improve the etching quality; through the provided lifting component, different etching modes can be effectively selected according to the wafer type, thereby improving the practicality of the etching equipment; through the provided clamping component, the wafer can swing during rotation, and uniform etching can be achieved in both etching modes. Technical Solution
[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a wet etching device, comprising a solution cylinder, a rotating assembly is fixedly connected at the center of the bottom end of the solution cylinder, and the top of the rotating assembly is fixedly connected to a bottom plate, the top of the bottom plate is movably connected to a rotating plate, the top of the rotating plate is movably connected to a supporting plate, a swing assembly is provided on the bottom plate, the bottom of the swing assembly is connected to the rotating assembly, and the top of the swing assembly is fixedly connected to the bottom end of the supporting plate, the bottom of the solution cylinder is fixedly connected to a lifting assembly, and the top of the lifting assembly is fixedly connected to the bottom of the bottom plate, a clamping assembly is provided inside the rotating plate, and the clamping assembly is connected to the lifting assembly, a spray assembly is provided on the top of the solution cylinder, the spray assembly includes a spray pipe and a cleaning pipe, and the top of the spray pipe and the top of the cleaning pipe are both fixedly connected to liquid pipes.
[0006] The present invention is further configured as follows: the rotating assembly includes a fixed cylinder, a connecting cylinder, a driving column and a control column; the fixed cylinder is fixedly connected to the center of the solution cylinder; the bottom end of the connecting cylinder is movably sleeved on the top end of the fixed cylinder, and the top end of the connecting cylinder is fixedly connected to the bottom end of the base plate; the driving column movably passes through the fixed cylinder; the bottom end of the driving column movably sleeved on the top end of the control column, and the control column movably passes through the fixed cylinder; the bottom end of the solution cylinder is fixedly connected to a servo motor 1, and the output end of the servo motor 1 is fixedly connected to the bottom end of the control column.
[0007] The present invention is further configured as follows: the rocking assembly includes cam 1, cam 2, swivel 1, swivel 2, gear 1, gear 2 and gear ring 1, the top end of the swivel 1 is fixedly connected to the bottom axis of cam 1, the swivel 1 passes through gear 1, and swivel 1 is fixedly connected to gear 1, the top end of the swivel 2 is fixedly connected to the bottom axis of cam 2, the swivel 2 passes through gear 2, and swivel 2 is fixedly connected to gear 2, the gear 1 and gear 2 are both located on the inner side of gear ring 1, and the gear ring 1 is meshed with gear 1 and gear 2.
[0008] The present invention is further configured as follows: the rocking assembly also includes a moving block and a driving plate, the driving plate is movably connected to the top of the base plate, the rotating shaft 1 passes through the driving plate, and the rotating shaft 1 is movably connected to the driving plate, the cam 1 and the gear 1 are respectively located at the top and the bottom of the driving plate, the rotating shaft 2 passes through the driving plate, and the rotating shaft 2 is movably connected to the driving plate, the cam 2 and the gear 2 are respectively located at the top and the bottom of the driving plate, and the two ends of the moving block respectively conflict with the outer side of the cam 1 and the outer side of the cam 2.
[0009] The present invention is further configured such that the top end of the driving plate is fixedly connected to the bottom end of the rotating plate, the bottom end of the driving plate is fixedly connected to the top end of the driving column, the moving block is movably connected to the top of the rotating plate, and the top end of the moving block is fixedly connected to the bottom end of the support plate.
[0010] The present invention is further configured as follows: the lifting assembly includes a fixed column, a lifting column, a driving rod and a connecting block, the fixed column is fixedly connected to the bottom of the solution cylinder, the bottom end of the lifting column is movably sleeved on the top of the fixed column, and the top of the lifting column is fixedly connected to the bottom end of the base plate, the driving rod is movably connected to the inside of the fixed column, and the connecting block is slidably connected to the inside of the fixed column, the outer side of the driving rod is provided with a thread, the driving rod passes through the connecting block, and the driving rod is threadedly connected to the connecting block, the multiple protruding ends of the connecting block are fixedly connected to the inner side of the lifting column, the bottom end of the solution cylinder is fixedly connected to servo motor 2, and the output end of servo motor 2 is fixedly connected to the bottom end of the driving rod.
[0011] The present invention is further configured as follows: the clamping assembly includes a gear ring 2, a gear 3, a rack 1 and a clamping rod, the gear ring 2 is movably connected to the inside of the rotating plate, the gear 3, rack 1 and the clamping rod are all distributed in a circular array, and the gear 3 is movably connected to the inside of the rotating plate through a rotating shaft, the gear 3 is meshed with the inner side of the gear ring 2, the rack 1 is respectively meshed with the gear 3, and the rack 1 is Z-shaped, the rack 1 is respectively fixedly connected to the clamping rod, several sliding grooves are opened on the support plate, and the top of the clamping rod is respectively slidably connected to the sliding grooves, the end of the rack 1 away from the clamping rod is fixedly connected to a compression spring, and the other end of the compression spring is fixedly connected to the inside of the rotating plate.
[0012] The present invention is further configured as follows: the clamping assembly also includes gear four, rack two, tooth block one, tooth block two, a return spring and a traction rope, the gear four is movably connected to the inside of the rotating plate through a rotating shaft, and the gear four is meshed with the gear ring two, the rack two is meshed with the gear four, and one end of the rack two is fixedly connected to the tooth block one, the tooth block two is movably connected to the outside of the base plate, and the tooth block one is meshed with the tooth block two, the end of the tooth block two away from the tooth block one is fixedly connected to the return spring, and the other end of the return spring is fixedly connected to the inside of the base plate, one end of the traction rope is fixedly connected to the end of the tooth block two, and the other end of the traction rope is fixedly connected to the top of the fixed column.
[0013] The present invention is further configured such that the spray assembly also includes a synchronization rod, a gear five, a receiving box, a collar and a servo motor three, the top end of the spray pipe and the top end of the cleaning pipe are fixedly connected to the synchronization rod, and the outer sides of the synchronization rods are fixedly connected to the gear five, the gears five are meshed, the top end of one of the synchronization rods is movably connected to the inside of the receiving box, the servo motor three is fixedly connected to the inside of the receiving box, and the output end of the servo motor three is fixedly connected to the top end of the synchronization rod, and the two synchronization rods both movably pass through the collar.
[0014] A wet etching control method comprises the following steps: S1. First, the solution cylinder is located inside the device. Etching liquid can be injected into the solution cylinder, and a drain nozzle is provided at the bottom of the solution cylinder for discharging the etching liquid. The first gear is engaged with the second gear, and the second gear is engaged with the second gear, thereby causing the six gears to rotate synchronously, and the rotation direction of the gear three is opposite to that of the gear four, controlling the rack one to move closer along the radial direction of the rotary plate until the clamping rod conflicts with the outer side of the wafer, completing the clamping of the wafer during its descent, and as the wafer continues to descend, the wafer is immersed in the etching solution; S3. As the base plate moves downward, the connecting cylinder moves downward along the fixed cylinder, and the driving column moves downward along the control column, and the servo motor 1 is started to drive the control column to rotate, so that the driving column rotates inside the connecting cylinder, thereby causing the driving plate to rotate on the inner side of the base plate, and then the rotary plate and the support plate to rotate synchronously, so that the wafer rotates inside the etching liquid. Since the rotary shaft 1 and the rotary shaft 2 are both movable and penetrate the driving plate, the gear 1 and the gear 2 are driven to rotate around the axis of the driving cylinder. Since the gear 1 and the gear 2 are both meshed with the gear ring 1, the gear 1 and the gear 2 rotate synchronously in the same direction. When the cam 1 rotates from the distal end to the proximal end, the cam 2 rotates from the proximal end to the distal end, thereby pushing the moving block to move back and forth between the cam 1 and the cam 2, driving the wafer to swing back and forth along the radial direction of the support plate during the rotation; S4. When the wafer needs to be spray-etched, the wafer is controlled to be above the liquid level of the solution cylinder, and the clamping rod is clamped on the wafer. The top of the accommodating box is connected to the control mechanism, and the spray pipe and the cleaning pipe are controlled to move above the wafer. A thin layer of etching liquid is sprayed onto the surface of the wafer through the liquid outlet of the spray pipe, and the wafer is controlled to swing during rotation; S5. Ultrapure water is sprayed through the cleaning pipe to clean the wafer surface, thereby alternating etching and cleaning. Servo motor three controls the rotation of a synchronization rod. Under the action of gear five, the other synchronization rod rotates in the opposite direction, thereby changing the angle between the spray pipe and the cleaning pipe, thereby adjusting the time the etching solution stays on the wafer surface.
[0015] Compared with the prior art, the wet etching equipment and control method thereof have the following beneficial effects: 1. The present invention provides a rotating assembly, and since the bottom end of the driving column is movably sleeved on the top end of the control column, the bottom plate, the rotating plate and the supporting plate can be lifted as a whole, so that the wafer can be immersed in the etching liquid, or the wafer can be controlled to be directly above the etching liquid, thereby facilitating the spray etching of the etching liquid and realizing the switching of different etching modes.
[0016] 2. The present invention provides a swinging assembly. Since the moving block is located between the two cams, as cam one and cam two rotate, the moving block swings back and forth on the rotary plate, thereby realizing the back and forth swing of the support plate. When the wafer is immersed in the etching liquid, the wafer can swing back and forth along the radial direction of the rotary plate during the rotation process, so that the wafer surface is fully in contact with the etching liquid, which is beneficial to uniformly etching the wafer surface and improving the etching quality.
[0017] 3. The present invention sets up a lifting assembly. Since the connecting block is fixedly connected to the inner side of the lifting column, the lifting column can move downward along the outer side of the fixed column. Conversely, the lifting column can move upward to adjust the wafer to different heights. Through the different heights of the wafer, the switching between immersion etching and spray etching is realized, and different etching methods are effectively selected according to the wafer type, thereby improving the practicality of the etching equipment.
[0018] 4. The present invention provides a clamping assembly. Under the action of the compression spring, the rack is reset, so that the clamping rod clamps the outside of the wafer, and when the base plate continues to descend, the clamping rod always keeps clamping the wafer. If the wafer is controlled to be above the etching liquid surface, spray etching can be adopted. If the wafer is controlled to be inside the etching liquid, immersion etching can be adopted. In both methods, the wafer can be swung during rotation. In both etching modes, uniform etching can be achieved.
[0019] 5. The present invention uses a spray assembly to spray ultrapure water through a cleaning pipe to clean the wafer surface, thereby alternating etching and cleaning. Servo motor three controls the rotation of a synchronization rod, and under the action of gear five, the other synchronization rod rotates in the opposite direction, thereby changing the angle between the spray pipe and the cleaning pipe. This can adjust the time that the etching liquid stays on the wafer surface, thereby performing intermittent etching on the wafer surface, avoiding corrosion of other parts of the wafer caused by the etching liquid staying on the wafer surface for too long, and performing etching more accurately. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 Schematic diagram of the internal structure of the solution cartridge of the present invention; Figure 3 For the present invention Figure 2 Schematic diagram of explosion structure; Figure 4 This is a schematic structural diagram of the rotating assembly of the present invention; Figure 5 This is a schematic diagram of the structure of the swing assembly of the present invention; Figure 6 This is a schematic diagram of the lifting assembly structure of the present invention; Figure 7 This is a schematic diagram of the structure of the clamping assembly of the present invention; Figure 8 This is a schematic structural diagram of the spray assembly of the present invention; Figure 9 For the present invention Figure 1 Schematic diagram of the enlarged structure at A in the middle; Figure 10 For the present invention Figure 7 Schematic diagram of the enlarged structure at point B in the middle.
[0021] In the figure: 1, solution cylinder; 2, rotating assembly; 201, fixed cylinder; 202, connecting cylinder; 203, driving column; 204, control column; 3, bottom plate; 4, rotating plate; 5, supporting plate; 6, rocking assembly; 601, cam 1; 602, cam 2; 603, rotating shaft 1; 604, rotating shaft 2; 605, gear 1; 606, gear 2; 607, gear ring 1; 608, moving block; 609, driving plate; 7, lifting assembly; 701, fixed column; 702, lifting column; 703, driving rod; 704, connecting block; 8 , clamping assembly; 801, gear ring 2; 802, gear 3; 803, rack 1; 804, clamping rod; 805, gear 4; 806, rack 2; 807, gear block 1; 808, gear block 2; 809, reset spring; 810, traction rope; 9, spray assembly; 901, spray pipe; 902, cleaning pipe; 903, synchronization rod; 904, gear 5; 905, receiving box; 906, collar; 907, servo motor 3; 10, servo motor 1; 11, servo motor 2; 12, slide; 13, compression spring. DETAILED DESCRIPTION
[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.
[0023] like Figure 1-10As shown, the present invention provides a technical solution: a wet etching device, comprising a solution cylinder 1 for placing etching liquid, the top of the solution cylinder 1 is used to add etching liquid, and the bottom of the solution cylinder 1 is provided with a pipe for discharging etching liquid, a rotating assembly 2 is fixedly connected to the center of the bottom end of the solution cylinder 1, and the top of the rotating assembly 2 is fixedly connected to a bottom plate 3, the top of the bottom plate 3 is movably connected to a rotating plate 4, the top of the rotating plate 4 is movably connected to a supporting plate 5 for placing wafers, a swinging assembly 6 is provided on the bottom plate 3, and the bottom of the swinging assembly 6 is in contact with the rotating plate 4. The rotating components 2 are connected, and the top of the swing component 6 is fixedly connected to the bottom of the support plate 5. The bottom of the solution cylinder 1 is fixedly connected to the lifting component 7, and the top of the lifting component 7 is fixedly connected to the bottom of the base plate 3. A clamping component 8 is provided inside the rotating plate 4, and the clamping component 8 is connected to the lifting component 7. A spray component 9 is provided on the top of the solution cylinder 1. The spray component 9 includes a spray pipe 901 and a cleaning pipe 902, and the top of the spray pipe 901 and the top of the cleaning pipe 902 are fixedly connected with liquid pipes, which can realize alternating etching and cleaning of wafers.
[0024] like Figure 1 and Figure 4 As shown, the rotating assembly 2 includes a fixed cylinder 201, a connecting cylinder 202, a driving column 203 and a control column 204. The fixed cylinder 201 is fixedly connected to the center of the solution cylinder 1, the bottom end of the connecting cylinder 202 is movably sleeved on the top of the fixed cylinder 201, and the top of the connecting cylinder 202 is fixedly connected to the bottom end of the base plate 3, the driving column 203 movably passes through the fixed cylinder 201, the bottom end of the driving column 203 is movably sleeved on the top of the control column 204, and the control column 204 movably passes through the fixed cylinder 201, the bottom end of the solution cylinder 1 is fixedly connected to a servo motor 10, and the output end of the servo motor 10 is fixedly connected to the bottom end of the control column 204.
[0025] Since the bottom end of the driving column 203 is movably mounted on the top end of the control column 204, the bottom plate 3, the rotating plate 4 and the supporting plate 5 can be lifted as a whole, so that the wafer can be immersed in the etching liquid, or the wafer can be controlled to be directly above the etching liquid, so as to facilitate the spray etching of the etching liquid and realize the switching of different etching methods.
[0026] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 5 and Figure 9As shown, the rocking assembly 6 includes a cam 1 601, a cam 2 602, a swivel 1 603, a swivel 2 604, a gear 1 605, a gear 2 606 and a gear ring 1 607. The top of the swivel 1 603 is fixedly connected to the bottom axis of the cam 1 601, the swivel 1 603 passes through the gear 1 605, and the swivel 1 603 is fixedly connected to the gear 1 605. The top of the swivel 2 604 is fixedly connected to the bottom axis of the cam 2 602, the swivel 2 604 passes through the gear 2 606, and the swivel 2 604 is fixedly connected to the gear 2 606. The gear 1 605 and the gear 2 606 are both located on the inner side of the gear ring 1 607, and the gear ring 1 607 is meshed with the gear 1 605 and the gear 2 606. The rocking assembly 6 also includes a moving block 608 and a drive plate 609. The drive plate 609 is movably connected to the bottom At the top of plate 3, swivel 1 603 passes through driving plate 609, and swivel 1 603 is movably connected to driving plate 609, cam 1 601 and gear 1 605 are respectively located at the top of driving plate 609 and the bottom of driving plate 609, swivel 2 604 passes through driving plate 609, and swivel 2 604 is movably connected to driving plate 609, cam 2 602 and gear 2 606 are respectively located at the top of driving plate 609 and the bottom of driving plate 609, the two ends of moving block 608 respectively conflict with the outer side of cam 1 601 and the outer side of cam 2 602, the top of driving plate 609 is fixedly connected to the bottom end of rotating plate 4, the bottom end of driving plate 609 is fixedly connected to the top of driving column 203, the moving block 608 is movably connected to the top of rotating plate 4, and the top of moving block 608 is fixedly connected to the bottom end of supporting plate 5.
[0027] Since the driving column 203 is fixedly connected to the driving plate 609, and the rotating shaft 1 603 and the rotating shaft 2 604 are movable through the driving plate 609, the driving plate 609 drives the rotating shaft 1 603 and the rotating shaft 2 604 to rotate around the axis of the driving column 203 during rotation, so that the gear 1 605 and the gear 2 606 are engaged and rotated with the gear ring 1 607, driving the cam 1 601 and the cam 2 602 to rotate in the same direction. Since the moving block 608 is located between the two cams, as the cam 1 601 and the cam 2 602 rotate, the moving block 608 swings back and forth on the rotating plate 4, realizing the back and forth swing of the support plate 5. When the wafer is immersed in the etching solution, the wafer can swing back and forth along the radial direction of the rotating plate 4 during rotation, so that the wafer surface is fully in contact with the etching solution, and it is beneficial to uniformly etch the wafer surface, thereby improving the etching quality.
[0028] like Figure 1 、 Figure 2 、 Figure 3 and Figure 6As shown, the lifting assembly 7 includes a fixed column 701, a lifting column 702, a driving rod 703 and a connecting block 704. The fixed column 701 is fixedly connected to the bottom of the solution cylinder 1, the bottom end of the lifting column 702 is movably sleeved on the top of the fixed column 701, and the top of the lifting column 702 is fixedly connected to the bottom end of the base plate 3, the driving rod 703 is movably connected to the inside of the fixed column 701, and the connecting block 704 is slidably connected to the inside of the fixed column 701, the outer side of the driving rod 703 is provided with a thread, the driving rod 703 passes through the connecting block 704, and the driving rod 703 is threadedly connected to the connecting block 704, and the multiple convex ends of the connecting block 704 are fixedly connected to the inner side of the lifting column 702, the bottom end of the solution cylinder 1 is fixedly connected to the servo motor 2 11, and the output end of the servo motor 2 11 is fixedly connected to the bottom end of the driving rod 703.
[0029] Start the servo motor 211 to drive the driving rod 703 to rotate. Since the driving rod 703 is threadedly connected to the connecting block 704, the fixed column 701 limits the moving direction of the connecting block 704, driving the connecting block 704 to move downward. Since the connecting block 704 is fixedly connected to the inner side of the lifting column 702, the lifting column 702 moves downward along the outer side of the fixed column 701. Conversely, the lifting column 702 can be moved upward to adjust the wafer to different heights. Through the different heights of the wafer, the switching between immersion etching and spray etching is realized, and different etching methods are effectively selected according to the wafer type, thereby improving the practicality of the etching equipment.
[0030] like Figure 1 、 Figure 3 、 Figure 7 and Figure 10As shown, the clamping assembly 8 includes a gear ring 2 801, a gear 3 802, a rack 1 803 and a clamping rod 804, the gear ring 2 801 is movably connected to the inside of the rotating plate 4, the gear 3 802, the rack 1 803 and the clamping rod 804 are all distributed in a circular array, and the gear 3 802 is movably connected to the inside of the rotating plate 4 through a rotating shaft, the gear 3 802 is meshed with the inner side of the gear ring 2 801, the rack 1 803 is respectively meshed with the gear 3 802, and the rack 1 803 is Z-shaped, the rack 1 803 is respectively fixedly connected to the clamping rod 804, a plurality of slide grooves 12 are provided on the support plate 5, and the top of the clamping rod 804 is respectively slidably connected to the slide groove 12, the end of the rack 1 803 away from the clamping rod 804 is fixedly connected to the compression spring 13, and the other end of the compression spring 13 is fixedly connected to the inside of the rotating plate 4, the clamping assembly Component 8 also includes gear four 805, rack two 806, tooth block one 807, tooth block two 808, a return spring 809 and a traction rope 810. Gear four 805 is movably connected to the inside of the rotating plate 4 through a rotating shaft, and gear four 805 is meshed with gear ring two 801, rack two 806 is meshed with gear four 805, and one end of rack two 806 is fixedly connected to tooth block one 807, tooth block two 808 is movably connected to the outside of the base plate 3, and tooth block one 807 is meshed with tooth block two 808, one end of tooth block two 808 away from tooth block one 807 is fixedly connected to the return spring 809, and the other end of the return spring 809 is fixedly connected to the inside of the base plate 3, one end of the traction rope 810 is fixedly connected to the end of tooth block two 808, and the other end of the traction rope 810 is fixedly connected to the top of the fixed column 701.
[0031] As the lifting column 702 drives the bottom plate 3 to move upward, since the bottom end of the traction rope 810 is fixed to the top of the fixed column 701, when the bottom plate 3 moves to the highest point, the traction rope 810 is in a stretched state, causing the tooth block 2 808 to move close to the tooth block 1 807 until the tooth block 1 807 is engaged with the tooth block 2 808, and then the tooth block 1 807 is pushed to drive the rack 2 806 to move along the radial direction of the rotating plate 4, so that the gear 4 805 rotates, and the gear ring 2 801 rotates inside the rotating plate 4, driving the gear 3 802 to rotate around its axis, and driving the rack 1 803 to move, thereby controlling the clamping rod 80 4 move away from each other along the slide 12 and place the wafer on the support plate 5. Only when the base plate 3 moves downward for a certain distance, the rack 1 803 is reset under the action of the compression spring 13, so that the clamping rod 804 clamps the outer side of the wafer. When the base plate 3 continues to descend, the clamping rod 804 always keeps clamping the wafer. If the wafer is controlled to be above the etching liquid surface, spray etching can be adopted. If the wafer is controlled to be inside the etching liquid, immersion etching can be adopted. In both methods, the wafer can swing during rotation. In both etching modes, uniform etching can be achieved.
[0032] like Figure 1 and Figure 8 As shown, the spray assembly 9 also includes a synchronization rod 903, a gear five 904, a receiving box 905, a collar 906 and a servo motor three 907. The top of the spray pipe 901 and the top of the cleaning pipe 902 are fixedly connected to the synchronization rod 903, and the outer side of the synchronization rod 903 is fixedly connected to the gear five 904. The gears five 904 are engaged. The top of one of the synchronization rods 903 is movably connected to the inside of the receiving box 905. The servo motor three 907 is fixedly connected to the inside of the receiving box 905, and the output end of the servo motor three 907 is fixedly connected to the top of the synchronization rod 903. The two synchronization rods 903 are movably passed through the collar 906.
[0033] Ultrapure water is sprayed through the cleaning pipe 902 to clean the wafer surface, thereby alternating etching and cleaning. A synchronization rod 903 is controlled to rotate by the servo motor three 907. Under the action of the gear five 904, the other synchronization rod 903 rotates in the opposite direction, thereby changing the angle between the spray pipe 901 and the cleaning pipe 902. In this way, the time that the etching liquid stays on the wafer surface can be adjusted, so that the wafer surface is intermittently etched, avoiding the etching liquid staying on the wafer surface for too long, which may cause corrosion to other parts of the wafer, and etching can be performed more accurately.
[0034] A wet etching control method comprises the following steps: S1. First, the solution cylinder 1 is located inside the device. Etching liquid can be injected into the solution cylinder 1. A drain nozzle is provided at the bottom of the solution cylinder 1 for discharging the etching liquid. S2. When etching the wafer surface by immersion, the wafer is moved to the support plate 5 by controlling the grip, and then the servo motor 11 is started to drive the driving rod 703 to rotate. Since the driving rod 703 is threadedly connected to the connecting block 704, the fixed column 701 limits the moving direction of the connecting block 704, driving the connecting block 704 to move downward. Since the connecting block 704 is fixedly connected to the inner side of the lifting column 702, the lifting column 702 moves downward along the outer side of the fixed column 701, thereby driving the bottom plate 3 to move downward as a whole. Under the action of the reset spring 809, the rack 806 is moved along the diameter of the rotating plate 4. The gear block 808 moves in the opposite direction, thereby separating the gear block 2 808 from the gear block 1 807. Since the gear block 2 808 is meshed with the gear 4 805, the gear 4 805 rotates, thereby rotating the gear ring 2 801. Since the gear 3 802 is meshed with the gear ring 2 801, the six gear 3 802 rotate synchronously. The rotation direction of the gear 3 802 is opposite to that of the gear 4 805. The rack 1 803 is controlled to move closer along the radial direction of the rotary plate 4 until the clamping rod 804 contacts the outer side of the wafer, completing the clamping of the wafer during its descent. As the wafer continues to descend, the wafer is immersed in the etching solution. S3. As the bottom plate 3 moves downward, the connecting cylinder 202 moves downward along the fixed cylinder 201, and the driving column 203 moves downward along the control column 204. The servo motor 10 is started to drive the control column 204 to rotate, so that the driving column 203 rotates inside the connecting cylinder 202, thereby causing the driving plate 609 to rotate inside the bottom plate 3, and then causing the rotating plate 4 and the supporting plate 5 to rotate synchronously, so that the wafer rotates inside the etching solution. Since the rotating shaft 1 603 and the rotating shaft 2 604 are both movable and penetrate the driving plate 609 , thereby driving gear 1 605 and gear 2 606 to rotate around the axis of the driving column 203. Since gear 1 605 and gear 2 606 are both meshed with gear ring 1 607, gear 1 605 and gear 2 606 rotate synchronously in the same direction. When cam 1 601 rotates from the distal end to the proximal end, cam 2 602 rotates from the proximal end to the distal end, thereby pushing the moving block 608 to move back and forth between cam 1 601 and cam 2 602, driving the wafer to swing back and forth along the radial direction of the support plate 5 during the rotation process; S4. When the wafer needs to be spray-etched, the wafer is controlled to be above the liquid level of the solution cylinder 1, and the clamping rod 804 is in a state of clamping the wafer. The top of the accommodating box 905 is connected to the control mechanism, and the spray pipe 901 and the cleaning pipe 902 are controlled to move above the wafer. A thin layer of etching liquid is sprayed onto the surface of the wafer through the liquid outlet of the spray pipe 901, and the wafer is controlled to swing during the rotation; S5. Ultrapure water is sprayed through the cleaning pipe 902 to clean the wafer surface, thereby alternating etching and cleaning. The servo motor 3 907 controls the rotation of a synchronization rod 903. Under the action of the gear 5 904, the other synchronization rod 903 rotates in the opposite direction, thereby changing the angle between the spray pipe 901 and the cleaning pipe 902, thereby adjusting the time that the etching solution stays on the wafer surface.
[0035] Working principle: When in use, first, the solution cylinder 1 is located inside the device, and the etching liquid can be injected into the solution cylinder 1, and a drainage nozzle is provided at the bottom of the solution cylinder 1 for discharging the etching liquid; when the wafer surface is etched by immersion, the wafer is moved to the support plate 5 by controlling the grip, and then the servo motor 11 is started to drive the driving rod 703 to rotate. Since the driving rod 703 is threadedly connected to the connecting block 704, the fixed column 701 limits the moving direction of the connecting block 704, driving the connecting block 704 to move downward. Since the connecting block 704 is fixedly connected to the inner side of the lifting column 702, the lifting column 702 is fixedly connected to the inner side of the lifting column 702. The lifting column 702 moves downward along the outer side of the fixed column 701, thereby driving the bottom plate 3 to move downward as a whole. Under the action of the return spring 809, the rack 2 806 moves along the radial direction of the rotating plate 4, and then the tooth block 2 808 is separated from the tooth block 1 807. Since the tooth block 2 808 is meshed with the gear 4 805, the gear 4 805 rotates, thereby rotating the gear ring 2 801. Since the gear 3 802 is meshed with the gear ring 2 801, the six gears 3 802 rotate synchronously, and the rotation direction of the gear 3 802 is opposite to that of the gear 4 805, controlling the rack 1 803 to rotate along the The rotary plate 4 moves radially closer until the clamping rod 804 contacts the outer side of the wafer, completing the clamping of the wafer during its descent, and as the wafer continues to descend, the wafer is immersed in the etching liquid; in addition, as the base plate 3 moves downward, the connecting cylinder 202 moves downward along the fixed cylinder 201, and the driving column 203 moves downward along the control column 204, and the servo motor 10 is started to drive the control column 204 to rotate, so that the driving column 203 rotates inside the connecting cylinder 202, thereby causing the driving plate 609 to rotate on the inner side of the base plate 3, and then causing the rotary plate 4 and the supporting plate 5 to rotate synchronously, so that the wafer is in the etching liquid. The liquid rotates internally, and since the rotating shaft 1 603 and the rotating shaft 2 604 are movable and penetrate the driving plate 609, the gear 1 605 and the gear 2 606 are driven to rotate around the axis of the driving column 203. Since the gear 1 605 and the gear 2 606 are both meshed with the gear ring 1 607, the gear 1 605 and the gear 2 606 rotate synchronously in the same direction. When the cam 1 601 rotates from the distal end to the proximal end, the cam 2 602 rotates from the proximal end to the distal end, thereby pushing the moving block 608 to move back and forth between the cam 1 601 and the cam 2 602, driving the wafer to swing back and forth along the radial direction of the support plate 5 during the rotation process;Furthermore, when spray etching is required on a wafer, the wafer is positioned above the liquid level in solution cylinder 1, with clamping rod 804 clamping the wafer. The top of the container 905 is connected to a control mechanism, which controls the movement of both the spray pipe 901 and the cleaning pipe 902 above the wafer. A thin layer of etching liquid is sprayed onto the wafer surface through the liquid outlet of the spray pipe 901. Simultaneously, the wafer is controlled to oscillate during rotation. Furthermore, ultrapure water is sprayed through the cleaning pipe 902 to clean the wafer surface, thereby alternating etching and cleaning. Servo motor 3 907 controls the rotation of one synchronization rod 903. Driven by gear 5 904, the other synchronization rod 903 rotates in the opposite direction, thereby changing the angle between the spray pipe 901 and the cleaning pipe 902, thereby adjusting the time the etching liquid remains on the wafer surface.
[0036] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Claims
1. A wet etching device, comprising a solution cartridge (1), characterized in that: The center of the bottom end of the solution cylinder (1) is fixedly connected to a rotating assembly (2), and the top of the rotating assembly (2) is fixedly connected to a bottom plate (3), the top of the bottom plate (3) is movably connected to a rotating plate (4), and the top of the rotating plate (4) is movably connected to a supporting plate (5), and a swing assembly (6) is provided on the bottom plate (3), the bottom of the swing assembly (6) is connected to the rotating assembly (2), and the top of the swing assembly (6) is fixedly connected to the bottom end of the supporting plate (5), and the solution cylinder (1) is fixedly connected to the bottom end of the supporting plate (5). ) is fixedly connected to the bottom of the solution cylinder (1), and the top of the lifting assembly (7) is fixedly connected to the bottom of the base plate (3); a clamping assembly (8) is provided inside the rotating plate (4), and the clamping assembly (8) is connected to the lifting assembly (7); a spraying assembly (9) is provided on the top of the solution cylinder (1), and the spraying assembly (9) includes a spraying pipe (901) and a cleaning pipe (902), and the top of the spraying pipe (901) and the top of the cleaning pipe (902) are both fixedly connected to liquid pipes.
2. A wet etching device according to claim 1, characterized in that: The rotating assembly (2) comprises a fixed cylinder (201), a connecting cylinder (202), a driving column (203) and a control column (204), wherein the fixed cylinder (201) is fixedly connected to the center of the solution cylinder (1), the bottom end of the connecting cylinder (202) is movably sleeved on the top end of the fixed cylinder (201), and the top end of the connecting cylinder (202) is fixedly connected to the bottom end of the bottom plate (3), the driving column (203) movably passes through the fixed cylinder (201), the bottom end of the driving column (203) is movably sleeved on the top end of the control column (204), and the control column (204) movably passes through the fixed cylinder (201), the bottom end of the solution cylinder (1) is fixedly connected to a servo motor (10), and the output end of the servo motor (10) is fixedly connected to the bottom end of the control column (204).
3. The wet etching device according to claim 1, wherein: The rocking assembly (6) includes cam 1 (601), cam 2 (602), swivel 1 (603), swivel 2 (604), gear 1 (605), gear 2 (606) and gear ring 1 (607). The top end of swivel 1 (603) is fixedly connected to the bottom axis of cam 1 (601), swivel 1 (603) passes through gear 1 (605), and swivel 1 (603) and gear 1 (605) are fixedly connected. The top end of the rotating shaft 2 (604) is fixedly connected to the bottom axis of the cam 2 (602), the rotating shaft 2 (604) passes through the gear 2 (606), and the rotating shaft 2 (604) is fixedly connected to the gear 2 (606), the gear 1 (605) and the gear 2 (606) are both located on the inner side of the gear ring 1 (607), and the gear ring 1 (607) is meshed with the gear 1 (605) and the gear 2 (606).
4. The wet etching device according to claim 3, wherein: The rocking assembly (6) further includes a moving block (608) and a driving plate (609), wherein the driving plate (609) is movably connected to the top of the bottom plate (3), the rotating shaft (603) passes through the driving plate (609), and the rotating shaft (603) is movably connected to the driving plate (609), the cam (601) and the gear (605) are respectively located at the top of the driving plate (609) and the bottom of the driving plate (609), the rotating shaft (604) passes through the driving plate (609), and the rotating shaft (604) is movably connected to the driving plate (609), the cam (602) and the gear (606) are respectively located at the top of the driving plate (609) and the bottom of the driving plate (609), and the two ends of the moving block (608) are respectively in conflict with the outer side of the cam (601) and the outer side of the cam (602).
5. The wet etching device according to claim 4, characterized in that: The top end of the driving plate (609) is fixedly connected to the bottom end of the rotating plate (4), the bottom end of the driving plate (609) is fixedly connected to the top end of the driving column (203), the moving block (608) is movably connected to the top of the rotating plate (4), and the top end of the moving block (608) is fixedly connected to the bottom end of the supporting plate (5).
6. The wet etching device according to claim 1, characterized in that: The lifting assembly (7) includes a fixed column (701), a lifting column (702), a driving rod (703) and a connecting block (704), wherein the fixed column (701) is fixedly connected to the bottom of the solution cylinder (1), the bottom end of the lifting column (702) is movably sleeved on the top end of the fixed column (701), and the top end of the lifting column (702) is fixedly connected to the bottom end of the bottom plate (3), the driving rod (703) is movably connected to the inside of the fixed column (701), and the connecting block (704) is slidably connected to the bottom of the fixing column (701). The driving rod (703) is connected to the inside of the fixed column (701), and a thread is provided on the outside of the driving rod (703). The driving rod (703) passes through the connecting block (704), and the driving rod (703) is threadedly connected to the connecting block (704). The multiple protruding ends of the connecting block (704) are fixedly connected to the inner side of the lifting column (702). The bottom end of the solution cylinder (1) is fixedly connected to the servo motor 2 (11), and the output end of the servo motor 2 (11) is fixedly connected to the bottom end of the driving rod (703).
7. The wet etching device according to claim 1, wherein: The clamping assembly (8) includes a second gear ring (801), a third gear (802), a rack (803) and a clamping rod (804), wherein the second gear ring (801) is movably connected to the inside of the rotating plate (4), the third gear (802), the rack (803) and the clamping rod (804) are all distributed in a circular array, and the third gear (802) is movably connected to the inside of the rotating plate (4) through a rotating shaft, and the third gear (802) is meshed with the inner side of the second gear ring (801), and the rack (803) is meshed with the inner side of the second gear ring (801). 803) are respectively engaged with gear three (802), and rack one (803) is Z-shaped, and the rack one (803) is fixedly connected to the clamping rod (804), and a plurality of sliding grooves (12) are provided on the support plate (5), and the top of the clamping rod (804) is slidably connected to the sliding grooves (12), and one end of the rack one (803) away from the clamping rod (804) is fixedly connected to a compression spring (13), and the other end of the compression spring (13) is fixedly connected to the inside of the rotary plate (4).
8. The wet etching equipment according to claim 7, characterized in that: The clamping assembly (8) further includes gear 4 (805), rack 2 (806), tooth block 1 (807), tooth block 2 (808), a return spring (809) and a traction rope (810), wherein the gear 4 (805) is movably connected to the interior of the rotary plate (4) via a rotating shaft, and the gear 4 (805) is meshed with the gear ring 2 (801), the rack 2 (806) is meshed with the gear 4 (805), and one end of the rack 2 (806) is fixedly connected to the tooth block 1 (807), and the gear Block 2 (808) is movably connected to the outside of the base plate (3), and tooth block 1 (807) is meshed with tooth block 2 (808), one end of tooth block 2 (808) away from tooth block 1 (807) is fixedly connected to a return spring (809), and the other end of the return spring (809) is fixedly connected to the inside of the base plate (3), one end of the traction rope (810) is fixedly connected to the end of tooth block 2 (808), and the other end of the traction rope (810) is fixedly connected to the top of the fixed column (701).
9. The wet etching device according to claim 1, wherein: The spray assembly (9) further includes a synchronization rod (903), a gear five (904), a receiving box (905), a collar (906) and a servo motor three (907). The top end of the spray pipe (901) and the top end of the cleaning pipe (902) are both fixedly connected to the synchronization rod (903), and the outer side of the synchronization rod (903) is fixedly connected to the gear five (904). The gear five (904) is meshed with each other. The top end of one of the synchronization rods (903) is movably connected to the inside of the receiving box (905). The servo motor three (907) is fixedly connected to the inside of the receiving box (905), and the output end of the servo motor three (907) is fixedly connected to the top end of the synchronization rod (903). Both of the synchronization rods (903) movably pass through the collar (906).
10. A wet etching control method according to any one of claims 1 to 9, characterized in that: The steps include: S1. First, the solution cylinder (1) is located inside the device, and the etching liquid can be injected into the solution cylinder (1). A drain nozzle is provided at the bottom of the solution cylinder (1) for discharging the etching liquid. S2. When etching the wafer surface by immersion, the wafer is moved to the support plate (5) by controlling the grip, and then the servo motor 2 (11) is started to drive the driving rod (703) to rotate. Since the driving rod (703) is threadedly connected to the connecting block (704), the fixed column (701) limits the moving direction of the connecting block (704), driving the connecting block (704) to move downward. Since the connecting block (704) is fixedly connected to the inner side of the lifting column (702), the lifting column (702) moves downward along the outer side of the fixed column (701), thereby driving the bottom plate (3) to move downward as a whole. Under the action of the reset spring (809), the rack 2 (806) moves along the rotating plate (4). The gear block 2 (808) and the gear block 1 (807) are separated by radial movement. Since the gear block 2 (808) is meshed with the gear 4 (805), the gear 4 (805) is rotated, thereby rotating the gear ring 2 (801). Since the gear 3 (802) is meshed with the gear ring 2 (801), the six gears 3 (802) are rotated synchronously, and the rotation direction of the gear 3 (802) is opposite to the rotation direction of the gear 4 (805). The rack 1 (803) is controlled to move closer along the radial direction of the rotary plate (4) until the clamping rod (804) contacts the outer side of the wafer, completing the clamping of the wafer during its descent, and as the wafer continues to descend, the wafer is immersed in the etching solution; S3. As the bottom plate (3) moves downward, the connecting cylinder (202) moves downward along the fixed cylinder (201), and the driving column (203) moves downward along the control column (204). The servo motor 1 (10) is started to drive the control column (204) to rotate, so that the driving column (203) rotates inside the connecting cylinder (202), thereby causing the driving plate (609) to rotate inside the bottom plate (3), and then causing the rotating plate (4) and the supporting plate (5) to rotate synchronously, so that the wafer rotates inside the etching liquid. Since the rotating shaft 1 (603) and the rotating shaft 2 (604) are both movable and penetrate the driving plate (609), the wafer rotates inside the etching liquid. 9), thereby driving gear 1 (605) and gear 2 (606) to rotate around the axis of the driving column (203). Since gear 1 (605) and gear 2 (606) are both engaged with gear ring 1 (607), gear 1 (605) and gear 2 (606) rotate synchronously in the same direction. When cam 1 (601) rotates from the distal end to the proximal end, cam 2 (602) rotates from the proximal end to the distal end, thereby pushing the moving block (608) to move back and forth between cam 1 (601) and cam 2 (602), driving the wafer to swing back and forth along the radial direction of the support plate (5) during the rotation process; S4. When the wafer needs to be spray-etched, the wafer is controlled to be located above the liquid level of the solution cylinder (1), and the clamping rod (804) is in a state of clamping the wafer. The top of the accommodating box (905) is connected to the control mechanism, and the spray pipe (901) and the cleaning pipe (902) are controlled to move to above the wafer. A thin etching solution is sprayed onto the surface of the wafer through the liquid outlet of the spray pipe (901), and the wafer is controlled to swing during the rotation process. S5. Ultrapure water is sprayed through the cleaning pipe (902) to clean the wafer surface, thereby alternating etching and cleaning. A synchronization rod (903) is controlled to rotate through the servo motor three (907). Under the action of the gear five (904), the other synchronization rod (903) rotates in the opposite direction, thereby changing the angle between the spray pipe (901) and the cleaning pipe (902), thereby adjusting the time that the etching solution stays on the wafer surface.