Wafer box conveying robot and control method

Abstract

The present invention discloses a wafer box conveying robot and a control method, which relates to the field of wafer box conveying technology, and comprises a base plate housing, a clamping claw housing fixedly mounted on one side of the base plate housing, a wafer clamping claw fixedly mounted on the clamping claw housing, a back plate fixedly mounted on the other side of the base plate housing, a joint shaft mounted on the bottom of the back plate, and two wafer box clamping claw brackets symmetrically and movably mounted on one side of the back plate. The present invention provides a wafer box conveying robot and a control method, which reduces space occupation by integrating the wafer box clamping claw bracket with the wafer clamping claw. For two separate wafer box clamping claw brackets and wafer clamping claws, the wafer box clamping claw bracket and the wafer clamping claw may collide in a limited space, requiring motion planning, etc., while the integrated design of the wafer box clamping claw bracket and the wafer clamping claw can significantly reduce the size and complexity of the equipment, enabling it to operate more flexibly in a small space.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer box conveying, and in particular to a wafer box conveying robot and a control method thereof. Background Art

[0002] In the semiconductor manufacturing process, the management and transportation of wafer cassettes are key links. During the process of transferring wafers to the furnace wafer boat, the wafers in the cassettes need to be detected and positioned.

[0003] Traditional robots can only transport wafers or wafer boxes individually, and cannot transport both at the same time. The transmission efficiency of wafer boxes and wafers in wafer storage devices will decrease, and there is a lack of real-time detection function for the number and position of wafers in the wafer box. The wafer box needs to be transported to a designated position to detect the status of the wafers in the wafer box, and then the wafer box is transported by the wafer box transfer robot, which reduces the efficiency of wafer flow between various processes.

[0004] Therefore, the present invention proposes a multifunctional wafer transfer robot and control method for improvement to solve the above-mentioned problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a wafer box transfer robot and control method to solve the problem raised in the above background technology that the traditional robot can only transfer wafers or wafer boxes separately, and cannot achieve simultaneous transfer of both, which will reduce the transfer efficiency of wafer boxes and wafers in wafer storage devices.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a wafer box conveying robot and a control method, comprising a base plate shell, a clamping claw shell is fixedly mounted on one side of the base plate shell, a wafer clamping claw is fixedly mounted on the clamping claw shell, a back plate is fixedly mounted on the other side of the base plate shell, a joint shaft is mounted on the bottom of the back plate, two wafer box clamping claw brackets are symmetrically and movably mounted on one side of the back plate, a first clamping block and a second clamping block are symmetrically fixedly mounted on the two wafer box clamping claw brackets, a first supporting block and a second supporting block are respectively mounted below the first clamping block and the second clamping block, a plurality of FU18M optical fiber sensors are provided on the surface of the back plate, a receiver is mounted on the FU18M optical fiber sensor, and a wafer baffle is fixedly mounted on the top of the back plate.

[0007] As a further solution of the present invention: a solenoid valve is fixedly installed inside the base shell, an air pipe arranged inside the wafer clamp is installed between the solenoid valve and the wafer clamp, and a speed regulating valve is installed on the solenoid valve.

[0008] As a further embodiment of the present invention, an ambient light sensor for real-time monitoring of light intensity changes in the manipulator's working environment is installed in the expansion slot inside the backplane. The ambient light sensor and the FU18M fiber optic sensor are controlled by a calibration module with a visual calibration interface, a parameter configuration panel, remote calibration, and wireless control. The calibration module is used to calibrate the brightness of the FU18M fiber optic sensor.

[0009] The brightness calibration comprises the following steps:

[0010] Step 1: Obtain the light intensity signal L from the ambient light sensor every 0.5 seconds and calculate the change in the light intensity signal between adjacent time periods. ;

[0011] Step 2: Set the threshold value according to actual needs and calculate the change of the light intensity signal sampled in adjacent time periods. Compare with the set threshold. The comparison principle is:

[0012] when When the value is less than the set threshold, the luminous intensity of the FU18M fiber optic sensor will not be adjusted;

[0013] when When it is greater than the set threshold, the luminous intensity of the FU18M fiber optic sensor is adjusted;

[0014] The visual calibration interface is used to display a real-time signal strength waveform with a superimposed sensitivity threshold line, and is equipped with a "one-click calibration" button, which automatically completes the full calibration process after the user clicks it;

[0015] The parameter configuration panel allows users to customize the calibration mode, environmental compensation switch, and calibration cycle;

[0016] Remote calibration and wireless control include communication protocol integration: connecting the robot to the host computer or mobile terminal via Wi-Fi or Bluetooth modules; remote instruction set: supporting remote instruction sending, real-time adjustment of sensor parameters, providing API interface, and compatibility with the factory MES system to achieve seamless integration of calibration process and production scheduling.

[0017] As a further solution of the present invention: in step 2, the luminous intensity of the FU18M optical fiber sensor is adjusted by adjusting the current of the FU18M optical fiber sensor (18). The current adjustment formula of the FU18M optical fiber sensor (18) is:

[0018]

[0019] Where, is the reference current, k=0.002 is the empirical coefficient, is the baseline light intensity.

[0020] As a further solution of the present invention: a solenoid valve is fixedly installed inside the base shell, an air pipe arranged inside the wafer clamp is installed between the solenoid valve and the wafer clamp, and a speed regulating valve is installed on the solenoid valve.

[0021] As a further solution of the present invention: a cylinder is fixedly installed inside the back plate, a moving block is fixedly installed on the cylinder, main connecting rods are fixedly installed on both sides of the inner wall of the back plate, a rotating connecting rod is arranged between the moving block and the main connecting rod, the rotating connecting rod is connected to the moving block and the main connecting rod by multiple bearing screws, and the main connecting rod is also connected to the wafer box clamp bracket by bearing screws.

[0022] As a further solution of the present invention: the number of the FUM optical fiber sensors is set to twenty-five, the diameter of which is mm, and they are evenly distributed on the backplane.

[0023] As a further solution of the present invention: the second clamping block and the second supporting block are arranged on the inner side of the wafer box clamping bracket, and the first clamping block and the first supporting block are arranged on the outer side of the wafer box clamping bracket.

[0024] As a further solution of the present invention: the FU18M optical fiber sensor is fixed to the back plate by connecting with multiple bolts and threaded grooves, and the receiver is installed at the end of the FU18M optical fiber sensor and fixed by screws.

[0025] As a further solution of the present invention: a first in-position sensor is installed inside the back plate and on one side of the moving block, and a second in-position sensor is installed below the first in-position sensor.

[0026] As a further solution of the present invention: the joint shaft is mounted on the wafer transfer manipulator or the wafer handling robot by fastening screws.

[0027] As a further solution of the present invention: a control method for a wafer box transfer robot comprises the following steps;

[0028] S1. When clamping the wafer box, the cylinder is started to drive the moving block to move. When the moving block rises, it pulls the rotating connecting rod. After being pulled by the moving block, the rotating connecting rod drives the main connecting rod to pull. At this time, the main connecting rod can drive the two wafer box clamping claw brackets to move closer to each other, so as to clamp the wafer box;

[0029] S2. Since the wafer cassette is a standard part, the spacing between the wafers inside it is fixed. At this time, the 25 FU18M fiber optic sensors installed on the backplane correspond to the positions of the wafers. The FU18M fiber optic sensors emit sensor beams to the wafers in the wafer cassette. After receiving the sensor beams, the wafers at the corresponding positions in the wafer cassette will generate reflection signals to be received by the FU18M fiber optic sensors. If there are no wafers at the corresponding positions in the wafer cassette, no reflection signals will be generated for the FU18M fiber optic sensors to receive.

[0030] After receiving the signal reflected by the wafer, the S3 and FU18M fiber optic sensors will automatically calibrate and output the position of the wafer in the wafer box, and automatically calculate the number of wafers in the wafer box, so as to accurately detect the position and number of wafers in the wafer box in real time.

[0031] S4. When clamping the wafer, the solenoid valve is activated and air is sucked through the air pipe connected to the wafer clamp. Negative pressure is formed in the hole on the wafer clamp to suck the wafer. There is a speed regulating valve on the solenoid valve to control the flow rate of the gas, thereby controlling the clamping of the wafer by the wafer clamp.

[0032] As a further solution of the present invention: a control method for a wafer box transfer robot, characterized in that the calibration method of the FU18M optical fiber sensor includes the following steps;

[0033] Get detection voltage and reference voltage;

[0034] The detection voltage and the reference voltage are normalized and converted into a voltage change; the normalization principle is:

[0035] in, is the reference voltage, α is the detection voltage obtained when the detection object is at any position within the detection range, and β is the threshold voltage obtained after the potentiometer is adjusted;

[0036] is the proximal detection voltage, is the remote electrical measurement voltage, is the maximum detection voltage, It is the minimum detection voltage. When the change of the detection voltage is the same as the threshold voltage, a response signal is output.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] 1. The present invention provides a wafer box transfer robot and a control method. By integrating the wafer box clamping bracket and the wafer clamping claw into an integrated design, the space occupied is reduced. For two separate wafer box clamping brackets and wafer clamping claws, the wafer box clamping bracket and the wafer clamping claw may collide in a limited space, requiring motion planning, etc. The integrated design of the wafer box clamping bracket and the wafer clamping claw can significantly reduce the size and complexity of the equipment, enabling it to operate more flexibly in a small space.

[0039] 2. The present invention arranges an integrated FU18M fiber optic sensor on the backplane. When the wafer box clamping claw bracket clamps the wafer box, if there are wafers in the wafer box, the light beam emitted by the FU18M fiber optic sensor light source forms a total reflection on the edge of the wafer, thereby forming a transmission path for the optical signal. At this time, it is determined that there is a wafer at the position of the wafer box groove corresponding to the FU18M fiber optic sensor, otherwise it does not exist, thereby judging the position and number of wafers in the wafer box clamped by the wafer box clamping claw bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present invention;

[0041] Figure 2 This is a front view of the overall structure in an embodiment of the present invention;

[0042] Figure 3 A top view of the overall structure in an embodiment of the present invention;

[0043] Figure 4 Schematic diagram of the internal structure of the backplane in an embodiment of the present invention;

[0044] Figure 5 This is a structural distribution diagram of the FU18M optical fiber sensor in an embodiment of the present invention;

[0045] Figure 6 A perspective view of the bottom plate housing structure in an embodiment of the present invention;

[0046] Figure 7 This is a calibration flow chart of the FU18M optical fiber sensor in an embodiment of the present invention;

[0047] Figure 8 This is a flow chart of the luminous intensity adjustment and determination of the FU18M optical fiber sensor in an embodiment of the present invention.

[0048] In the figure: 1. Wafer clamp; 2. Base plate housing; 3. Back plate; 4. Clamp housing; 5. Joint shaft; 6. Wafer box clamp bracket; 7. First clamping block; 8. Second clamping block; 9. First support block; 10. Second support block; 11. Moving block; 12. Solenoid valve; 13. Main connecting rod; 14. Rotating connecting rod; 15. Bearing screw; 16. Wafer baffle; 17. Cylinder; 18. FU18M optical fiber sensor; 19. First in-position sensor; 20. Second in-position sensor. DETAILED DESCRIPTION

[0049] The technical solutions in the embodiments of the present invention are described clearly and completely below with reference to the accompanying drawings.

[0050] Example 1:

[0051] Reference Figure 1 、 Figure 2 as well as Figure 3 As shown in the figure of the embodiment of the present invention, a wafer box transfer robot and control method are shown, which include a base plate housing 2, a clamping claw housing 4 fixedly mounted on one side of the base plate housing 2, and a wafer clamping claw 1 fixedly mounted on the clamping claw housing 4. A back plate 3 is fixedly mounted on the other side of the base plate housing 2, and a joint shaft 5 is mounted on the bottom of the back plate 3. Two wafer box clamping claw brackets 6 are symmetrically and movably mounted on one side of the back plate 3. A first clamping block 7 and a second clamping block 8 are symmetrically fixedly mounted on each of the two wafer box clamping claw brackets 6. A first support block 9 and a second support block 10 are respectively mounted below the first clamping block 7 and the second clamping block 8. A plurality of FU18M optical fiber sensors 18 are provided on the surface of the back plate 3, and a receiver is mounted on the FU18M optical fiber sensor 18. A wafer block 16 is fixedly mounted on the top of the back plate 3. By integrating the wafer box clamping claw bracket 6 with the wafer clamping claw 1, space occupation is reduced. Moreover, for two separate wafer box clamping brackets 6 and wafer clamping claws 1, the wafer box clamping bracket 6 and the wafer clamping claw 1 may collide in a limited space, which requires motion planning, etc., while the integrated design of the wafer box clamping bracket 6 and the wafer clamping claw 1 can significantly reduce the size and complexity of the equipment, so that it can be operated more flexibly in a small space. By arranging an integrated FU18M optical fiber sensor 18 on the back plate 3, when the wafer box clamping bracket 6 clamps the wafer box, if there is a wafer in the wafer box, the light beam emitted by the light source of the FU18M optical fiber sensor 18 forms a total reflection on the edge of the wafer, thereby forming a transmission path for the optical signal. At this time, it is determined that there is a wafer at the wafer box groove position corresponding to the FU18M optical fiber sensor 18, otherwise it does not exist, thereby judging the position and number of wafers in the wafer box clamped by the wafer box clamping bracket 6.

[0052] Reference Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As other embodiments of the present invention: a solenoid valve 12 is fixedly installed inside the bottom plate housing 2, an air pipe arranged inside the wafer clamp 1 is installed between the solenoid valve 12 and the wafer clamp 1, a speed regulating valve is installed on the solenoid valve 12, a cylinder 17 is fixedly installed inside the back plate 3, a moving block 11 is fixedly installed on the cylinder 17, main connecting rods 13 are fixedly installed on both sides of the inner wall of the back plate 3, a rotating connecting rod 14 is provided between the moving block 11 and the main connecting rod 13, the rotating connecting rod 14 is connected to the moving block 11 and the main connecting rod 13 by a plurality of bearing screws 15, and the main connecting rod 13 is also connected to the wafer box clamp bracket 6 by the bearing screws 15;

[0053] By providing an electromagnetic valve 12, when the wafer clamp 1 needs to clamp the wafer, the electromagnetic valve 12 starts to operate, the air pipe above starts to suck air, and a negative pressure is formed in the hole on the wafer clamp 1, thereby sucking the wafer. There is a speed regulating valve on the electromagnetic valve 12 to control the flow rate of the gas, thereby controlling the clamping of the wafer by the wafer clamp 1. The moving block 11 and one side of the rotating connecting rod 14 are connected by a bearing screw 15, and the other side of the rotating connecting rod 14 and the middle part of the main connecting rod 13 are connected by the bearing screw 15. The connection method of the bearing screw 15 is a screw connection, which can ensure the rotation of the rod. When the pressure The compressed gas enters the bearing screw 15, and the moving block 11 is moved upward by the gas pressure, causing the bearing screw 15 connected to the moving block 11 and the rotating link 14 to rotate, thereby driving the rotating link 14 to rotate inward. This then causes the bearing screw 15 to rotate, and the main connecting rod 13 to move inward as a whole, thereby driving the wafer cassette clamping claw bracket 6 to clamp the wafer cassette. When the gas pressure disappears, the moving block 11 will gradually return to its original position, thereby driving the rotating link 14 to rotate outward, causing the main connecting rod 13 to drive the wafer cassette clamping claw bracket 6 to move outward as a whole, thereby releasing the wafer cassette.

[0054] As a further embodiment of the present invention, twenty-five FU18M optical fiber sensors 18 are provided, each having a diameter of 1 mm and evenly distributed on the backing plate 3. The second clamping block 8 and the second support block 10 are provided on the inner side of the wafer cassette clamping bracket 6, and the first clamping block 7 and the first support block 9 are provided on the outer side of the wafer cassette clamping bracket 6. The FU18M optical fiber sensors 18 are fixed to the backing plate 3 via a plurality of bolts and threaded grooves. The receiver is mounted at the end of the FU18M optical fiber sensor 18 and is fixed thereto via screws.

[0055] By setting the number of FU18M fiber optic sensors 18 to 25, and because the wafer box is a standard part, the spacing between all wafers placed in the wafer box is fixed. Therefore, the wafers in the wafer box, whether storing 6-inch wafers or 8-inch wafers, correspond to the position of the FU18M fiber optic sensors 18, which exactly corresponds to the position and number of wafers in the wafer box. The position of the FU18M fiber optic sensors 18 is fixed by bolts and thread grooves, making the FU18M fiber optic sensors 18 more stable. When adjusting the sensitivity, the sensitivity level of the receiver can be adjusted by rotating the screw. By changing the distance between the FU18M fiber optic sensor 18 and the target object, the intensity of the light signal detected by the receiver is changed, thereby achieving sensitivity adjustment;

[0056] The calibration method of the FU18M fiber optic sensor 18 includes the following steps:

[0057] Get detection voltage and reference voltage;

[0058] The detection voltage and the reference voltage are normalized and converted into a voltage change; the normalization principle is:

[0059] in, is the reference voltage, α is the detection voltage obtained when the detection object is at any position within the detection range, and β is the threshold voltage obtained after the potentiometer is adjusted;

[0060] is the proximal detection voltage, is the remote electrical measurement voltage, is the maximum detection voltage, It is the minimum detection voltage. When the change of the detection voltage is the same as the threshold voltage, a response signal is output.

[0061] Other embodiments of the present invention: a first in-position sensor 19 is installed inside the back plate 3 and on one side of the moving block 11, a second in-position sensor 20 is installed below the first in-position sensor 19, and the joint shaft 5 is installed on the wafer transfer manipulator or wafer handling robot by fastening screws;

[0062] By setting the first in-position sensor 19 and the second in-position sensor 20, it is possible to determine whether the wafer box clamping claw bracket 6 has clamped the wafer box. When the wafer box clamping claw bracket 6 is not clamped, the second in-position sensor 20 is relied on to determine whether the moving block 11 is in the starting position. When clamping, the moving block 11 moves forward. When the wafer box clamping claw bracket 6 clamps the wafer box, the position of the first in-position sensor 19 is extended by the moving block 11 to sense and determine whether the clamping is taken. If the wafer box is not clamped correctly, the extended position of the moving block 11 will exceed the first in-position sensor 19 or does not reach the position of the first in-position sensor 19, then the first in-position sensor 19 will not sense, thereby judging that the clamping has failed. The joint shaft 5 is connected to the rising part of the wafer transfer robot and the wafer handling robot by a set screw, so that the wafer transfer robot can perform horizontal rotation.

[0063] A solenoid valve 12 is fixedly installed inside the bottom plate housing 2 , an air pipe arranged inside the wafer clamp 1 is installed between the solenoid valve 12 and the wafer clamp 1 , and a speed regulating valve is installed on the solenoid valve 12 .

[0064] Example 2:

[0065] The same positions as in Example 1 are not described again, except that:

[0066] This wafer cassette transfer robot includes a backplane, ambient light sensor, FU18M fiber optic sensor, calibration module, visual calibration interface, parameter configuration panel, and components related to remote calibration and wireless control. These components work together to achieve efficient transfer and precise calibration of wafer cassettes.

[0067] Initial calibration operation: When the robot starts, the calibration module automatically performs the initial calibration process. The ambient light sensor monitors the working environment light intensity in real time. The calibration module reads the light intensity data and performs a preliminary calibration of the brightness of the FU18M fiber optic sensor based on the preset reference parameters to ensure that the sensor is in the best working condition and lay the foundation for subsequent transmission tasks.

[0068] Operation process: Ambient light monitoring and data processing: The ambient light sensor acquires a light intensity signal L every 0.5 seconds and transmits it to the calibration module. The calibration module calculates the change ΔL of the sampled light intensity signal in adjacent time periods to grasp the dynamic changes of ambient light intensity in real time. The brightness of the optical fiber sensor is dynamically adjusted, and a threshold is set according to actual production needs. The calculated ΔL is compared with the threshold.

[0069] When ΔL is less than the threshold, the luminous intensity of the FU18M fiber optic sensor remains stable; when ΔL exceeds the threshold, the calibration module uses the formula:

[0070]

[0071] Calculate the adjusted current and then change the luminous intensity of the optical fiber sensor, where the reference current is 20mA, the empirical coefficient k=0.002, and the reference light intensity is 500lx;

[0072] For example, if ΔL is 100lx, the adjusted current is:

[0073] 20×(1+0.002×100 / 500)=20.08mA, which enables precise adjustment of the brightness of the optical fiber sensor to adapt to changes in ambient light and ensure the visual recognition accuracy of wafer box transmission;

[0074] Visual calibration interface application: The interface displays the signal strength waveform in real time, with the sensitivity threshold line superimposed on the waveform, intuitively showing the sensor's working status. The operator can use the "one-click calibration" button to start the automatic calibration process, eliminating the need for complex manual operations and quickly completing the entire calibration process, reducing human intervention and improving production efficiency.

[0075] Parameter custom configuration: Enter the parameter configuration panel, and the operator can customize the calibration mode according to the differences in production tasks, such as selecting fast calibration or precise calibration; turn on or off the environmental compensation switch. When turned off, the system ignores the impact of ambient light changes on sensor brightness; set the calibration cycle. If it is set to calibrate every 2 hours, the calibration module will perform the calibration task at this time to ensure that the robot is always in good working condition;

[0076] Remote calibration and wireless control: Device connection: Through the Wi-Fi module, the robot establishes a stable connection with the factory's host computer; at the same time, it supports Bluetooth module connection to mobile terminals, making it convenient for operators to control the robot at different locations;

[0077] Remote commands and parameter adjustments: The host computer or mobile terminal can send commands remotely, such as adjusting the sensitivity of the fiber optic sensor or changing the transmission speed. The calibration module receives and executes the commands in real time, achieving remote and precise control of parameters. It provides an API interface and seamlessly connects to the factory's MES system. It transmits calibration process data and wafer box transmission status information to the MES system, and simultaneously receives production plan-related parameters issued by the MES system, so that the calibration process is closely coordinated with production scheduling and the overall production process is optimized.

[0078] Dynamic calibration cycle and abnormal trigger calibration: Time / event-driven calibration: In addition to the initial calibration and timed calibration at startup, the system automatically triggers secondary calibration based on the accumulated working time. For example, after 10 cumulative working hours, the calibration module automatically performs the calibration task to compensate for the sensor performance drift caused by long-term operation. The calibration trigger condition is set according to the number of wafer transfers. For example, after every 100 wafer boxes are transferred, the calibration module starts the calibration process to ensure that the robot maintains high-precision transfer during long-term tasks.

[0079] Abnormal trigger calibration: During operation, if the sensor detects abnormal signal fluctuations, such as a large fluctuation in signal strength beyond the normal range within a short period of time, the emergency calibration process will be immediately initiated to quickly adjust parameters such as the fiber optic sensor brightness to eliminate abnormal factors and ensure production continuity;

[0080] Through this embodiment 2, the wafer box transfer robot can effectively improve the accuracy and stability of wafer box transfer in actual production applications with its perfect calibration system and intelligent control function, adapt to changing production environments and task requirements, and promote efficient production in industries such as semiconductor manufacturing.

[0081] The working principle of the present invention is: the present invention provides a wafer box conveying robot and control method,

[0082] Step 1: When clamping the wafer box, start the cylinder 17 to drive the moving block 11 to move. When the moving block 11 rises, it pulls the rotating link 14. After being pulled by the moving block 11, the rotating link 14 drives the main link 13 to pull. At this time, the main link 13 can drive the two wafer box clamping claw brackets 6 to approach each other, so as to clamp the wafer box;

[0083] Step 2. Since the wafer box is a standard part, the spacing between the wafers inside it is fixed. At this time, the twenty-five FU18M fiber optic sensors 18 set on the back plate 3 correspond to the positions of the wafers. The FU18M fiber optic sensors 18 emit sensor beams to the wafers in the wafer box. After receiving the sensor beams, the wafers at the positions corresponding to the FU18M fiber optic sensors 18 in the wafer box will generate reflection signals for the FU18M fiber optic sensors 18 to receive. If there are no wafers at the corresponding positions in the wafer box, no reflection signals will be generated for the FU18M fiber optic sensors 18 to receive.

[0084] Step 3: After receiving the signal reflected by the wafer, the FU18M optical fiber sensor 18 automatically calibrates and outputs the position of the wafer in the wafer box, and automatically calculates the number of wafers in the wafer box, thereby accurately detecting the position and number of wafers in the wafer box in real time.

[0085] Step 4. When clamping the wafer, start the solenoid valve 12 and start suction through the air pipe connected to the wafer clamp 1. A negative pressure is formed on the hole on the wafer clamp 1 to suck the wafer. There is a speed regulating valve on the solenoid valve 12 to control the flow rate of the gas, thereby controlling the clamping of the wafer by the wafer clamp 1.

[0086] The above is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A wafer box transfer robot, comprising a bottom plate housing (2), characterized in that: A clamping shell (4) is fixedly mounted on one side of the base plate housing (2), and a wafer clamping claw (1) is fixedly mounted on the clamping shell (4); a back plate (3) is fixedly mounted on the other side of the base plate housing (2), and a joint shaft (5) is mounted on the bottom of the back plate (3); two wafer box clamping claw brackets (6) are symmetrically and movably mounted on one side of the back plate (3), and a first clamping block (7) and a second clamping block (8) are symmetrically and fixedly mounted on the two wafer box clamping claw brackets (6); a first support block (9) and a second support block (10) are respectively mounted below the first clamping block (7) and the second clamping block (8); a plurality of FU18M optical fiber sensors (18) are provided on the surface of the back plate (3), and a receiver is mounted on the FU18M optical fiber sensor (18); a wafer baffle (16) is fixedly mounted on the top of the back plate (3); A cylinder (17) is fixedly installed inside the back plate (3), and a moving block (11) is fixedly installed on the cylinder (17). Main connecting rods (13) are fixedly installed on both sides of the inner wall of the back plate (3). A rotating connecting rod (14) is provided between the moving block (11) and the main connecting rod (13). The rotating connecting rod (14) is connected to the moving block (11) and the main connecting rod (13) by a plurality of bearing screws (15). The main connecting rod (13) is also connected to the wafer box clamping bracket (6) by a bearing screw (15). The number of the FU18M optical fiber sensors (18) is set to twenty-five, the diameter of which is 1 mm, and they are evenly distributed on the back plate (3). The second clamping block (8) and the second support block (10) are provided on the inner side of the wafer box clamping bracket (6), and the first clamping block (7) and the first support block (9) are provided on the outer side of the wafer box clamping bracket (6); The FU18M optical fiber sensor (18) is fixed to the back plate (3) by a plurality of bolts and threaded grooves, the receiver is mounted on the end of the FU18M optical fiber sensor (18) and fixed by screws, and the joint shaft (5) is mounted on the wafer transfer manipulator or the wafer handling robot by fastening screws; A first in-position sensor (19) is installed inside the back plate (3) and on one side of the moving block (11), and a second in-position sensor (20) is installed below the first in-position sensor (19).

2. A wafer box transfer robot according to claim 1, characterized in that: A solenoid valve (12) is fixedly installed inside the base plate housing (2), an air pipe arranged inside the wafer clamp (1) is installed between the solenoid valve (12) and the wafer clamp (1), and a speed regulating valve is installed on the solenoid valve (12).

3. The wafer box transfer robot according to claim 1, characterized in that: An ambient light sensor for real-time monitoring of light intensity changes in the working environment of the manipulator, as well as a visual calibration interface, a parameter configuration panel, remote calibration and wireless control are installed in the internal expansion slot of the back panel (3). The ambient light sensor and the FU18M optical fiber sensor (18) are controlled by a calibration module, and the calibration module is used to calibrate the brightness of the FU18M optical fiber sensor (18); The visual calibration interface is used to display a real-time signal strength waveform with a superimposed sensitivity threshold line, and is equipped with a "one-click calibration" button that automatically completes the full calibration process after the user clicks it; The parameter configuration panel allows the user to customize the calibration mode, environmental compensation switch, and calibration cycle; The remote calibration and wireless control include communication protocol integration: connecting the robot to the host computer or mobile terminal via a Wi-Fi or Bluetooth module; remote instruction set: supporting remote instruction sending, real-time adjustment of sensor parameters, providing an API interface, and being compatible with the factory MES system to achieve seamless integration of the calibration process and production scheduling.

4. A control method for a wafer box conveying robot, applied to the wafer box conveying robot according to claim 3, characterized in that: The following steps are included: S1. When clamping the wafer box, the cylinder (17) is started to drive the moving block (11) to move. When the moving block (11) rises, it pulls the rotating connecting rod (14). After the rotating connecting rod (14) is pulled by the moving block (11), it drives the main connecting rod (13) to pull. At this time, the main connecting rod (13) can drive the two wafer box clamping claw brackets (6) to approach each other, thereby clamping the wafer box; S2. Since the wafer box is a standard part, the spacing between the wafers inside it is fixed. At this time, the twenty-five FU18M optical fiber sensors (18) arranged on the back plate (3) correspond to the positions of the wafers. The FU18M optical fiber sensors (18) emit a sensing beam to the wafers in the wafer box. After receiving the sensing beam, the wafers at the positions corresponding to the FU18M optical fiber sensors (18) in the wafer box will generate a reflection signal to be received by the FU18M optical fiber sensors (18). When there is no wafer at the corresponding position in the wafer box, no reflection signal will be generated to be received by the FU18M optical fiber sensors (18). After receiving the signal reflected by the wafer, the S3 and FU18M optical fiber sensors (18) automatically calibrate and output the position of the wafer in the wafer box, and automatically calculate the number of wafers in the wafer box, thereby accurately detecting the position and number of wafers in the wafer box in real time; S4. When clamping the wafer, the solenoid valve (12) is activated and air is sucked through the air pipe connected to the wafer clamp (1), forming a negative pressure in the hole on the wafer clamp (1) to suck the wafer. There is a speed regulating valve on the solenoid valve (12) for controlling the flow rate of the gas, thereby controlling the clamping of the wafer by the wafer clamp (1).

5. The control method of a wafer box transfer robot according to claim 4, characterized in that: The FU18M optical fiber sensor (18) emits a sensing beam to the wafers in the wafer box for brightness calibration, and the calibration steps are as follows: Step 1: Obtain the light intensity signal L from the ambient light sensor every 0.5 seconds and calculate the change in the light intensity signal between adjacent time periods. ; Step 2: Set the threshold value according to actual needs and calculate the change of the light intensity signal sampled in adjacent time periods. Compare with the set threshold. The comparison principle is: when When the value is less than the set threshold, the luminous intensity of the FU18M optical fiber sensor (18) is not adjusted; when When the value is greater than the set threshold, the luminous intensity of the FU18M optical fiber sensor (18) is adjusted; wherein, in step 2, the luminous intensity of the FU18M optical fiber sensor (18) is adjusted by adjusting the current of the FU18M optical fiber sensor (18), and the current adjustment formula of the FU18M optical fiber sensor (18) is: Where, is the reference current, k=0.002 is the empirical coefficient, is the baseline light intensity.

6. The control method of a wafer box transfer robot according to claim 5, characterized in that: The calibration method of the FU18M optical fiber sensor (18) comprises the following steps; Get detection voltage and reference voltage; The detection voltage and the reference voltage are normalized and converted into a voltage change; the normalization principle is: in, is the reference voltage, α is the detection voltage obtained when the detection object is at any position within the detection range, and β is the threshold voltage obtained after the potentiometer is adjusted; is the proximal detection voltage, is the remote electrical measurement voltage, is the maximum detection voltage, It is the minimum detection voltage. When the change of the detection voltage is the same as the threshold voltage, a response signal is output.

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