A semiconductor module quick packaging structure

Abstract

The application discloses a kind of semiconductor module quick packaging structures, it is related to the field of semiconductor packaging, including two sides being provided with pin semiconductor chip, the outside of the semiconductor chip is provided with the upper shell and lower shell of adaptation, the side of the lower shell is opened with the pin slot of adaptation, the upper shell and lower shell inside are provided with silica gel filling cavity, the connecting surface of the lower shell is opened with butt joint groove of head-to-tail, the longitudinal section of the butt joint groove is set in inverted trapezoidal shape.This semiconductor module quick packaging structure, through the butt joint groove of inverted trapezoidal shape setting and the cooperation of butt joint strip, can be quickly accurately butted and positioned to upper shell and lower shell, so that the position deviation of both in packaging process is not prone to occur, simultaneously, under the cooperation of the reinforcing shaft formed by the sealing gel filled in reinforcing groove, the upper shell and lower shell can not be easily separated after packaging is completed, so that the overall stability of the packaged semiconductor module is better.

Description

TECHNICAL FIELD

[0001] The present application relates to semiconductor packaging technology, in particular to a kind of fast packaging structure of semiconductor module. BACKGROUND

[0002] Power semiconductor is the core component of electronic device power conversion and circuit control, which can support high voltage, large current, and realize power switch and power conversion function through the unidirectional conductivity of semiconductor. The main uses of power semiconductor include frequency conversion, rectification, voltage conversion, power amplification, power control, etc. During operation, a large amount of heat is often generated. Generally, in addition to ensuring the normal operation of the circuit, power semiconductor can also reduce power waste and play a role in energy saving and power saving. Among them, the power semiconductor module is a module formed by pouring and sealing a certain combination of high-power electronic power devices. These devices or integrated circuit chips can work at a very high frequency, and the circuit can be more energy-efficient and material-saving when working at high frequency, which can greatly reduce the size and weight of the equipment.

[0003] During the preparation of the power semiconductor module, the commonly used method is to directly cover the semiconductor chip in two closed shells by using encapsulating glue to achieve the packaging of the semiconductor chip. However, due to the small adhesive contact area between the two closed shells, it is inconvenient to align during packaging, and the packaging may fail under the influence of the working temperature of the semiconductor module and external mechanical stress during long-term use.

[0004] In Chinese patent CN118676064B, a packaging structure for a power semiconductor module is disclosed, which includes a metal plate for mounting power semiconductors and a closed cover covering the metal plate. The inner top wall of the closed cover is pre-coated with heat dissipation silicone, and each of the left and right sides of the closed cover has a wedge-shaped edge, and each of the front and back sides has an installation strip. Each of the left and right sides of the metal plate is provided with a wedge groove, and the installation strip is fixed to the metal plate through a sealing glue. The amount of heat dissipation silicone must be sufficient to overflow from a overflow hole on the side of the closed cover after the closed cover is fixed on the metal plate. The overflow hole is sealed on the outside port by a sealing bolt. Although the above-mentioned packaging structure of the power semiconductor module is easy to package and has excellent heat dissipation, in actual application, after the closed shell is connected to the metal plate, it is mainly connected directly through the sealing glue layer and the bent connecting plate. The connecting plate is directly connected between the metal plate and the metal plate at one end, so that in the subsequent use process, when the closed shell is subjected to external force away from the metal plate, it is easy to cause the connecting plate to continue to deform and exit from the wedge groove, thereby causing the packaging failure of the semiconductor module. SUMMARY

[0005] The application aims to provide a semiconductor module rapid packaging structure to solve the above problems in the prior art.

[0006] To achieve the above object, the application provides the following technical scheme: a semiconductor module rapid packaging structure, comprising two sides provided with pin semiconductor chips, the outside of the semiconductor chips is provided with a matched upper shell and lower shell, the side surface of the lower shell is provided with a pin slot matched with the pin, the inside of the upper shell and lower shell is provided with a silica gel filling cavity, the connecting surface of the lower shell is provided with a butt joint slot connected at the head and tail, the longitudinal section of the butt joint slot is provided in an inverted trapezoidal shape, the bottom of the butt joint slot is provided with a wave slot, the side surface of the butt joint slot is provided with a plurality of reinforcing slots equidistantly arranged along the outer contour track direction, the connecting surface of the upper shell is connected with a butt joint strip matched with the butt joint slot, the bottom of the butt joint strip is provided with an expansion surface matched with the wave slot, and the butt joint strip is provided with an auxiliary slot matched with the pin.

[0007] The butt joint slot is pre-filled with a quantitative sealant, and when the butt joint strip is embedded in the butt joint slot and fixed by the sealant, the sealant in the reinforcing slot is solidified to form a reinforcing shaft.

[0008] Further, the silica gel filling cavity is filled with heat dissipation silica gel to form a heat dissipation coating layer.

[0009] Further, the reinforcing slot penetrates into the inside of the lower shell in the horizontal direction from the surface of the butt joint slot.

[0010] Further, the expansion surface is provided in a wave shape, and the shape and size thereof are matched with the wave slot.

[0011] Further, the top of the butt joint slot is provided with a closed slot, and the end of the butt joint strip away from the expansion surface is provided with a closed part matched with the closed slot.

[0012] Further, when the butt joint strip moves into the butt joint slot to contact the closed part with the closed slot, the closed part cooperates with the pin to form a pressing surface, and when the closed part continues to move into the closed slot, the pressing surface moves to press the sealant in the butt joint slot.

[0013] Further, the bottom of the expansion surface is provided with a plurality of passive slots extending into the inside of the upper shell, the inside of the upper shell is provided with a transfer slot communicating all the passive slots, and the connecting surface of the upper shell is provided with a plurality of overflow slots distributed on both sides of the butt joint strip.

[0014] Further, the plurality of overflow slots are all in communication with the transfer slot, and the filling amount of the sealant in the butt joint slot must be sufficient to overflow the sealant from the overflow slots to the connecting surface of the upper shell when the butt joint strip is completely butted with the butt joint slot.

[0015] Compared with the prior art, the semiconductor module rapid packaging structure provided by the application has the following beneficial effects:

[0016] 1. The semiconductor module rapid packaging structure, by the cooperation of the butt joint groove and the butt joint strip arranged in an inverted trapezoidal shape, can quickly and accurately butt joint and position the upper shell and the lower shell, so that the two are not easy to deviate in position during packaging, and under the cooperation of the reinforcing shaft formed by the solidification of the sealing glue filled in the reinforcing groove, the upper shell and the lower shell are not easy to separate after packaging is completed, so that the overall stability of the packaged semiconductor module is good.

[0017] 2. The semiconductor module rapid packaging structure, by the cooperation between the closed groove, the closed part, the passive groove, the transfer groove and the overflow groove, the sealing glue filled in the butt joint groove can be extruded by the butt joint strip during the movement of the closed part along the inside of the closed groove, so that it can pass through the passive groove and the transfer groove and overflow from the overflow groove to the connecting surface of the upper shell, so that after the upper shell and the lower shell are connected and assembled, a layer of tight and uniform sealing glue layer can be formed between the connecting surfaces of the two, so that the packaging stability of the semiconductor module is better. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0019] Figure 1 The overall structure schematic diagram provided by the embodiment of the present application;

[0020] Figure 2 The upper shell, semiconductor chip and lower shell separation state diagram provided by the embodiment of the present application;

[0021] Figure 3 The upper shell and lower shell local section structure schematic diagram provided by the embodiment of the present application;

[0022] Figure 4 The upper shell and lower shell local section structure schematic diagram provided by the embodiment of the present application; Figure 3 The enlarged structure schematic diagram of A in the middle;

[0023] Figure 5 The lower shell local section structure schematic diagram provided by the embodiment of the present application;

[0024] Figure 6 The upper shell local section structure schematic diagram provided by the embodiment of the present application;

[0025] Figure 7A schematic view of an upper shell structure provided for an embodiment of the present application is shown in the figure.

[0026] Figure 8 A schematic view of an upper shell structure provided for an embodiment of the present application is shown in the figure. Figure 7 A schematic view of an upper shell structure provided for an embodiment of the present application is shown in the figure.

[0027] Legend of reference signs:

[0028] 1, semiconductor chip; 101, pin; 102, upper shell; 103, lower shell; 104, pin slot; 105, silica gel filling cavity; 106, heat dissipation coating layer; 2, butt joint groove; 21, wave groove; 22, reinforcing groove; 23, butt joint strip; 24, expansion surface; 25, reinforcing shaft; 26, auxiliary groove; 3, closed groove; 31, closed part; 32, passive groove; 33, transfer groove; 34, overflow groove. DETAILED DESCRIPTION

[0029] In order for those skilled in the art to better understand the technical solutions of the present application, the present application will be further described in detail below with reference to the accompanying drawings.

[0030] Embodiment 1:

[0031] Please refer to Figures 1-8 A semiconductor module rapid packaging structure, including two sides provided with pin 101 semiconductor chip 1, the outside of semiconductor chip 1 is provided with the upper shell 102 and the lower shell 103 that are adapted to each other, the side surface of lower shell 103 is provided with pin slot 104 that is adapted to pin 101, the inside of upper shell 102 and lower shell 103 is provided with silica gel filling cavity 105, and the heat dissipation silica gel is filled in silica gel filling cavity 105 to form heat dissipation coating layer 106.

[0032] It should be noted that the depth value of pin slot 104 is consistent with the thickness value of pin 101, when pin 101 is embedded in pin slot 104, the surface of pin 101 is flush with the surface of lower shell 103, so that the connection of the connecting surface between upper shell 102 and lower shell 103 is better after the assembly connection of the two.

[0033] In the embodiment, the connecting surface of lower shell 103 is provided with butt joint groove 2 that is connected in head and tail, the longitudinal section of butt joint groove 2 is provided in inverted trapezoidal shape, the bottom of butt joint groove 2 is provided with wave groove 21, and a plurality of reinforcing grooves 22 are equidistantly provided on the side surface of butt joint groove 2 along the direction of the outer contour track, the connecting surface of upper shell 102 is connected with butt joint strip 23 that is adapted to butt joint groove 2, the bottom of butt joint strip 23 is provided with expansion surface 24 that is adapted to wave groove 21, expansion surface 24 is provided in wave shape, and the shape and size thereof are adapted to wave groove 21, and auxiliary groove 26 that is adapted to pin 101 is provided on butt joint strip 23.

[0034] It needs to be explained that when the butt joint groove 2 is pre-filled with the sealing glue, and the butt joint strip 23 is embedded in the butt joint groove 2 and is fixed by the sealing glue, the sealing glue in the reinforcing groove 22 is solidified to form the reinforcing shaft 25, and the reinforcing groove 22 penetrates into the inside of the lower shell 103 from the surface of the butt joint groove 2 in the horizontal direction.

[0035] When the semiconductor chip 1 is packaged, it is first placed in the lower shell 103 in which the butt joint groove 2 is pre-filled with the sealing glue, and the pins 101 on the semiconductor chip 1 are embedded in the pin grooves 104, and then the butt joint strip 23 on the upper shell 102 is butted against the butt joint groove 2 on the lower shell 103, so that the butt joint strip 23 is embedded in the butt joint groove 2, and is fixed by the sealing glue between the butt joint strip 23 and the inner wall of the butt joint groove 2, and when the sealing glue is solidified, the reinforcing shaft 25 formed in the reinforcing groove 22 is fixedly connected with the butt joint strip 23 to form an integral whole, so that the upper shell 102 and the lower shell 103 after butt joint are not only connected by the connecting layer formed between the butt joint strip 23 and the inner wall of the butt joint groove 2, but also connected by the cooperation of the reinforcing shaft 25 and the reinforcing groove 22, so that the packaging stability between the upper shell 102 and the lower shell 103 is better, and the packaging failure is less likely to occur in the subsequent long-term use.

[0036] Embodiment 2:

[0037] Please refer to Figures 4-8 In order to further improve the packaging effect of the semiconductor module, the embodiment provides a technical scheme based on the above-mentioned embodiment: the top of the butt joint groove 2 is provided with a closed groove 3, the end of the butt joint strip 23 away from the expansion surface 24 is provided with a closed part 31 matched with the closed groove 3, the bottom of the expansion surface 24 is provided with a plurality of passive grooves 32 extending into the inside of the upper shell 102, the inside of the upper shell 102 is provided with a transfer groove 33 communicating all the passive grooves 32, and the connecting surface of the upper shell 102 is provided with a plurality of overflow grooves 34 distributed on both sides of the butt joint strip 23, and the plurality of overflow grooves 34 are in communication with the transfer groove 33, so that the passive grooves 32 and the overflow grooves 34 are in communication through the transfer groove 33.

[0038] It needs to be explained that the inner space of the transfer groove 33 is small, and the inner space of the abutment groove 2 and the passive groove 32 is also small, so that in the working process, the transfer groove 33 only plays a role of connecting the passive groove 32 and the overflow groove 34, and the inner part of the passive groove 32 and the inner part of the abutment groove 2 also cannot store too much sealant, so that the sealant filled in the abutment groove 2 can be fully utilized, so that after the abutment of the abutment strip 23 and the abutment groove 2 is completed, the excess sealant can be effectively overflowed to the connecting surface of the upper shell 102, so that after the abutment of the upper shell 102 and the lower shell 103 is completed, a tight and uniform sealant layer can be formed between the connecting surfaces of the two, so that the connection sealing property and the connection stability between the upper shell 102 and the lower shell 103 can be further improved.

[0039] And, when the abutment strip 23 moves to the abutment groove 2 to contact the closure part 31 and the closure groove 3, the closure part 31 cooperates with the pin 101 to form a pressing surface, and when the closure part 31 continues to move into the closure groove 3, the pressing surface moves to press the sealant in the abutment groove 2, and the filling amount of the sealant in the abutment groove 2 must be sufficient to overflow a sufficient amount of sealant from the overflow groove 34 to the connecting surface of the upper shell 102 when the abutment of the abutment strip 23 and the abutment groove 2 is completed, so that after the abutment of the upper shell 102 and the lower shell 103 is completed, a tight and uniform sealant layer can be formed between the connecting surfaces of the two, so that the connection stability between the two and the overall packaging sealing property of the semiconductor module can be better.

[0040] The above only describes some exemplary embodiments of the application by way of illustration, and it is needless to say that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the application. Therefore, the above figures and descriptions are illustrative in nature and should not be understood as limiting the scope of protection of the claims of the application.

Claims

1. A quick packaging structure of a semiconductor module, comprising a semiconductor chip (1) provided with pins (101) on two sides, an upper shell (102) and a lower shell (103) being provided on the outside of the semiconductor chip (1) and being adapted to each other, a pin slot (104) being provided on the side of the lower shell (103) and being adapted to the pins (101), and a silica gel filling cavity (105) being provided in the inside of the upper shell (102) and the lower shell (103), characterized in that, The connecting surface of the lower shell (103) is provided with butt grooves (2) connected head to tail, the longitudinal section of the butt groove (2) is provided in an inverted trapezoidal shape, the bottom of the butt groove (2) is provided with a wave groove (21), the side surface of the butt groove (2) is provided with a plurality of reinforcing grooves (22) equidistantly along the outer contour trajectory direction, the connecting surface of the upper shell (102) is connected with a butt bar (23) matched with the butt groove (2), the bottom of the butt bar (23) is provided with an expansion surface (24) matched with the wave groove (21), the butt bar (23) is provided with an auxiliary groove (26) matched with the pin (101); The butt groove (2) is pre-filled with a quantitative sealant, and the butt bar (23) is embedded in the butt groove (2) and fixed by the sealant, and the sealant in the reinforcing groove (22) is solidified to form a reinforcing shaft (25); The top of the butt groove (2) is provided with a closed groove (3), one end of the butt bar (23) away from the expansion surface (24) is provided with a closed part (31) matched with the closed groove (3), when the butt bar (23) moves to the closed groove (3) and the closed part (31) contacts, the closed part (31) cooperates with the pin (101) to form a pressing surface, when the closed part (31) continues to move to the closed groove (3), the pressing surface moves to press the sealant in the butt groove (2); The bottom of the expansion surface (24) is provided with a plurality of passive grooves (32) extending into the inside of the upper shell (102), the inside of the upper shell (102) is provided with a transfer groove (33) communicating with all the passive grooves (32), the connecting surface of the upper shell (102) is provided with a plurality of overflow grooves (34) distributed on both sides of the butt bar (23); A plurality of overflow grooves (34) are in communication with the transfer groove (33), and the filling amount of the sealant in the butt groove (2) must be sufficient to overflow enough sealant from the overflow groove (34) to the connecting surface of the upper shell (102) when the butt bar (23) is butt-jointed with the butt groove (2).

2. The quick packaging structure of a semiconductor module according to claim 1, wherein The silica gel filling cavity (105) is filled with heat dissipation silica gel to form a heat dissipation coating layer (106).

3. The quick packaging structure of semiconductor module according to claim 1, wherein, The reinforcing groove (22) penetrates into the inside of the lower shell (103) from the surface of the butt groove (2) in a horizontal direction.

4. The quick packaging structure of semiconductor module according to claim 1, wherein, The expansion surface (24) is provided in a wave shape, and its shape and size are matched with the wave groove (21).

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