Aluminum fluoride coated article for substrate processing apparatus and method of production
By coating aluminum fluoride coating on the surface of the substrate processing equipment components, the corrosion problem in high-temperature plasma environment is solved, and the durability and wear resistance of the equipment are improved.
Patent Information
- Application Number
- CN202480005841.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-18
- Filing Date
- 2024-01-19
- Publication Date
- 2025-08-05
AI Technical Summary
In the prior art, the equipment components used to treat substrates are susceptible to corrosion during high-temperature plasma treatment, especially in the environment of chlorine and fluorine plasma, and the resistance of traditional materials such as nickel, alumina or aluminum nitride is insufficient.
The surface of the equipment components is coated with an aluminum fluoride coating, and by forming aluminum fluoride on the metal aluminum layer, it enhances its corrosion resistance, the coating thickness and material composition are specifically designed to suit high temperature and plasma environments.
It significantly improves the corrosion resistance of equipment components in high temperature and plasma environments, and extends the service life and reliability of components.
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Figure CN120435588A_ABST
Abstract
Description
Technical Field
[0001]
[0014] Embodiments of the present invention generally relate to components of apparatus for processing substrates, and more particularly, to protective coatings for components of apparatus for processing substrates. Background Art
[0002] Substrates utilized in semiconductor devices are processed in a variety of ways and under a variety of conditions. The inventors have observed that certain higher temperature plasma processes cause accelerated wear and other damage to components of the equipment used to process the substrates. In particular, plasma-based deposition of various metal silicides (e.g., titanium silicide) involves the use of relatively high temperature plasmas containing halogens (e.g., chlorine and fluorine), creating a corrosive environment that has been observed to require frequent removal, recovery, and / or replacement. Summary of the Invention
[0003] In one embodiment, a component of an apparatus for processing a substrate comprises a coating comprising aluminum fluoride disposed on at least a portion of a surface of the component.
[0004] In an embodiment, a method of coating a component of an apparatus for processing a substrate comprises disposing a coating comprising metallic aluminum on an exterior surface of the component; and contacting the metallic aluminum with a fluorinating agent under conditions sufficient to form an aluminum fluoride coating over at least a portion of the component.
[0005] In an embodiment, a method of repairing a coating on a component comprises removing at least a portion of an existing coating from the component; disposing a coating comprising metallic aluminum on an exterior surface of the component; and contacting the metallic aluminum with a fluorinating agent under conditions sufficient to form an aluminum fluoride coating over at least a portion of the component.
[0006] In an embodiment, a method of processing a substrate includes positioning a substrate within a processing volume of a processing chamber of an apparatus for processing a substrate, wherein at least a portion of the apparatus for processing a substrate includes a coating comprising aluminum fluoride disposed on at least a portion of a surface of the component such that the surface is disposed within or facing the processing volume; and processing the substrate.
[0007] Other and further embodiments of the present invention are described below. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Embodiments of the present invention, briefly summarized above and discussed in greater detail below, may be understood by reference to the exemplary embodiments of the invention depicted in the accompanying drawings. However, the drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of the scope, as the invention may admit to other equally effective embodiments.
[0009] Figure 1A simplified diagram depicting an apparatus for processing a substrate according to embodiments disclosed herein.
[0010] Figure 2 is a flow chart describing a method of coating a part according to embodiments disclosed herein.
[0011] Figure 3 is a flow chart describing a method of repairing or re-applying a coating to a component according to embodiments disclosed herein.
[0012] Figure 4 is a flow chart describing a method of processing a substrate according to embodiments disclosed herein.
[0013] Figure 5 is a block diagram depicting components having an aluminum fluoride coating according to embodiments disclosed herein.
[0014] For ease of understanding, identical reference numerals have been used wherever possible to designate identical elements that are common to the figures. The figures are not drawn to scale and may be simplified for clarity. Elements and features of one embodiment may be beneficially incorporated into other embodiments without further clarification. DETAILED DESCRIPTION
[0015] The high temperatures of some deposition and other processing processes require that components of the processing chamber of the apparatus used to process the substrate be formed from nickel, nickel alloys, and / or various iron-containing alloys such as stainless steel or austenitic steel. Applicants have observed that aluminum fluoride is more resistant to attack by chlorine and fluorine at high temperatures and / or in plasma conditions than conventional materials such as nickel, aluminum oxide, or aluminum nitride. However, coating components with aluminum fluoride by chemical vapor deposition (CVD) and / or atomic layer deposition (ALD) processes has not been observed to provide improved resistance to attack by chlorine and fluorine at high temperatures, in plasma, and in other corrosive processing conditions.
[0016] Due to the low melting point of aluminum, various components of the equipment used to process substrates are fabricated from suitable high-temperature materials such as stainless steel, nickel, or nickel alloys, and then coated with a relatively thin layer of metallic aluminum. The aluminum-coated components are then subjected to a fluorination process in which a portion of the aluminum layer is converted into aluminum fluoride.
[0017] It has been observed that aluminum fluoride coatings comprising aluminum fluoride in embodiments, and in some embodiments consisting essentially of aluminum and aluminum fluoride, have a melting point significantly higher than aluminum and significantly improved corrosion resistance compared to other coatings and underlying components prior to coating. The chemical bonds forming the aluminum fluoride coating are theoretically strong, thus providing improved temperature and corrosion resistance.
[0018] In an embodiment, a component of an apparatus for processing a substrate comprises a coating comprising aluminum fluoride disposed on at least a portion of a surface of the component. In an embodiment, the coating comprises an inner portion comprising metallic aluminum in contact with the surface of the component and an outer portion comprising aluminum fluoride forming an outer surface.
[0019] In an embodiment, the inner portion has a thickness greater than or equal to about 1 μm, and the outer portion has a thickness less than or equal to about 2 μm. In an embodiment, the coating comprises aluminum trifluoride.
[0020] In an embodiment, the component comprises nickel and / or an iron-containing alloy. In an embodiment, the component is a component of an apparatus for processing a substrate, such as a semiconductor or other substrate used in the manufacture of microelectronic devices or other thin film manufacturing processes, and / or semiconductor devices.
[0021] In an embodiment, a method of coating a component of an apparatus for processing a substrate comprises disposing a coating comprising metallic aluminum on an outer surface of the component; and contacting the metallic aluminum with a fluorinating agent under conditions sufficient to form an aluminum fluoride coating over at least a portion of the component. In an embodiment, the aluminum fluoride coating comprises aluminum trifluoride. In an embodiment, depositing the coating comprising metallic aluminum on the outer surface of the component comprises electroplating the component.
[0022] In an embodiment, a method of repairing and / or recoating a component comprises removing at least a portion of a pre-existing coating (when present) now present on the component; disposing a coating comprising metallic aluminum on an exterior surface of the component; and contacting the metallic aluminum with a fluorinating agent under conditions sufficient to form an aluminum fluoride coating over at least a portion of the component.
[0023] In one embodiment, a method of processing a substrate includes positioning a substrate within a processing volume of a processing chamber of an apparatus for processing a substrate, wherein at least one component of the apparatus for processing a substrate includes a coating comprising aluminum fluoride disposed on at least a portion of a surface of the component, such that the surface is disposed within or facing the processing volume; and processing the substrate. In one embodiment, processing the substrate includes plasma deposition of titanium silicide. In one embodiment, the component including the coating comprising aluminum fluoride disposed on at least a portion of a surface of the component is a showerhead, an internal portion of the apparatus, a chamber liner, a substrate support structure, a deposition ring, a cover ring, a heater housing, a portion of a gas delivery system within the apparatus, a pumping channel, or the like.
[0024] In an embodiment, the aluminum layer is fluorinated by exposing the article coated with aluminum to a temperature, a pressure, and for a period of time to allow fluorine to react with the aluminum to form an outer coating or layer of aluminum fluoride.
[0025] In an embodiment, a high temperature material such as nickel, nickel alloy, stainless steel, or austenitic steel will first be coated with a high purity aluminum base layer having a purity of greater than or equal to about 95 wt% aluminum. The aluminum coating will then be converted to a passivated aluminum fluoride form.
[0026] Figure 1 A simplified diagram depicting an example apparatus 100 for processing substrates illustrates the basic structure of a chamber in which individual deposition steps and other steps may be performed. Apparatus 100 may be adapted, for example, to perform thermal, subatmospheric CVD processes, as well as other processes such as reflow, drive-in, cleaning, etching, deposition, and gettering processes. In some instances, multiple steps of the process may be performed within an individual chamber before being removed for transfer to another chamber. The primary components of the system include, among other things, a vacuum chamber 105 that receives process and other gases from a gas delivery system 110, a vacuum system 115, and a control system 116. In embodiments, the apparatus may include an internal or external source 117 of plasma 118 for use during processing of the substrate. While the figures show the structure of only a single chamber for illustrative purposes, multiple chambers with similar structures may be provided as part of a cluster tool, each tailored to perform different aspects of some overall manufacturing process.
[0027] The apparatus 100 includes a housing assembly 120 forming a vacuum chamber 105 with a processing volume 125. A gas distribution structure, such as a showerhead 130, disperses reactant gases and other gases, such as purge gases, toward one or more substrates 135 held in position by a substrate support structure 140. A heater 145 can be controllably moved between different positions to accommodate different deposition processes and for etching or cleaning processes.
[0028] Reactant gases and carrier gases are supplied from a gas delivery system 110 through supply lines to the showerhead 130. The supply lines deliver the gases separately to a gas distribution structure, as described later. The gas delivery system 110 includes various gas sources and suitable supply lines to deliver selected quantities of each source to the vacuum chamber 105. Typically, the supply line for each gas includes a shutoff valve that can be used to automatically or manually shut off the flow of gas into the associated supply line, and a mass flow controller or other type of controller that measures the flow of gas or liquid through the supply line. Depending on the process being performed by the system, some of the sources may be liquid sources rather than gas sources. When using a liquid source, the gas delivery system 110 includes a liquid injection system or other suitable mechanism (e.g., a bubbler) to vaporize the liquid. The vapor from the liquid is then often mixed with a carrier gas. During the deposition process, the gas supplied to the showerhead 130 flows toward the substrate surface (as indicated by arrow 150), where the gas can be evenly distributed in a laminar flow radially across the substrate surface.
[0029] Purge gas can be delivered into the vacuum chamber 105 from the showerhead 130 and / or from an inlet port 121 disposed through the wall 122 of the housing assembly 120. The purge gas introduced into the vacuum chamber 105 flows to the annular pumping passage 155. The vacuum system 115, including a vacuum pump, exhausts the gas through the exhaust line 165 (as indicated by arrow 160). The rate at which the exhaust gas and entrained particles are drawn from the annular pumping passage 155 through the exhaust line 165 is controlled by a throttle valve system 170.
[0030] In embodiments, one or more of these components, e.g., a portion of the housing assembly 120, the showerhead 130, the substrate support structure 140, a housing of the heater 145, a portion of the gas delivery system 110 present within the vacuum chamber 105, the annular pumping channel 155, and / or the like, may include a coating comprising aluminum fluoride disposed on at least a portion of a surface of the component.
[0031] Figure 2 2 is a flow chart of an example process 200 for coating components of an apparatus for processing a substrate. Figure 2 As shown, process 200 may include placing a coating having metallic aluminum on an exterior surface of a component of an apparatus for processing a substrate (block 202). Figure 2 As shown, process 200 may include contacting metallic aluminum with a fluorinating agent under conditions sufficient to form an aluminum fluoride coating over at least a portion of the component (block 204 ).
[0032] In an embodiment, disposing metallic aluminum on the outer surface of the component comprises electrolytic deposition, for example, electroplating. Other suitable methods for disposing metallic aluminum on the outer surface of the component include electroless impregnation, plasma spraying, and the like.
[0033] Although Figure 2 An example block diagram of process 200 is shown. In some embodiments, process 200 may include: Figure 2 Additionally, or alternatively, two or more blocks of process 200 may be performed concurrently.
[0034] Figure 3 is a flow chart of an example process 300 of a method for repairing and / or replacing a coating on a component of an apparatus for processing a substrate.
[0035] Figure 3 The method depicted in can be performed in individual processing chambers provided as standalone chambers or as part of a cluster tool. In an embodiment, a cluster tool is configured for performing a method for processing a substrate as described herein.
[0036] like Figure 3As shown, process 300 may include removing at least a portion of an existing coating (if present) (block 302). For example, a process chamber or cluster tool may remove at least a portion of a coating previously disposed on the exterior of a component. Figure 3 As shown, process 300 may include placing a coating having metallic aluminum on an outer surface of the component (block 304). Figure 3 As further shown, process 300 may include contacting metallic aluminum with a fluorinating agent under conditions sufficient to form an aluminum fluoride coating over at least a portion of the component (block 306 ).
[0037] Although Figure 3 An example block diagram of process 300 is shown. In some embodiments, process 300 may include comparing Figure 3 . Additionally, or alternatively, two or more blocks of process 300 can be executed concurrently.
[0038] Figure 4 is a flow chart of an example process 400 of a method of processing a substrate. Figure 4 The methods described in can be performed in individual processing chambers provided as standalone chambers or as part of a cluster tool. In an embodiment, a cluster tool is configured to perform a method for processing a substrate as described herein.
[0039] like Figure 4 As shown, process 400 may include positioning a substrate within a processing chamber of an apparatus for processing a substrate (block 402). Figure 4 As shown, process 400 may include processing the substrate (block 404). Figure 4 As further shown, process 400 includes at least one component of an apparatus for processing a substrate including a coating having aluminum fluoride disposed on at least a portion of a surface of the component (block 406). In embodiments, processing the substrate includes plasma deposition of a metal silicide, which in embodiments may be titanium silicide.
[0040] Although Figure 4 An example block diagram of process 400 is shown. In some embodiments, process 400 may include comparing Figure 4 Additional blocks, fewer blocks, different blocks, or differently arranged blocks as described in . Additionally, or alternatively, two or more blocks of process 400 can be executed concurrently.
[0041] Figure 5 A block diagram depicting components of an apparatus for processing a substrate 500 includes a component 502 having a coating 508 comprising an inner portion 504 comprising metallic aluminum in contact with a surface of the component and an outer portion 506 forming an outer surface that has been fluorinated and comprises aluminum fluoride.
[0042] In one embodiment, coating 508 has an inner portion 504 and an outer portion 506, inner portion 504 having a thickness of about 1 μm or greater, about 2 μm or greater, about 3 μm or greater, about 4 μm or greater, about 5 μm or greater, about 6 μm or greater, about 7 μm or greater, about 8 μm or greater, or about 10 μm or greater, and outer portion 506 having a thickness of about 5 μm or less, about 3 μm or less, about 2 μm or less, about 1.5 μm or less, about 1 μm or less, or about 0.5 μm or less. In one embodiment, coating 508 comprises, consists essentially of, or consists of aluminum and aluminum fluoride.
[0043] In an embodiment, coating 508 is formed from an aluminum layer, i.e., the aluminum coating of inner portion 504 comprises, consists of, or consists essentially of aluminum, with the aluminum having a purity of greater than or equal to about 95 wt %, or greater than or equal to about 98 wt %, or greater than or equal to about 99 wt %, or greater than or equal to about 99.5 wt %, or greater than or equal to about 99.995 wt %, based on the total amount of the layer present prior to fluorination.
[0044] In other embodiments, the coating 508 is formed of an aluminum layer, i.e., the aluminum coating of the inner portion 504 comprises, consists of, or consists essentially of an aluminum alloy, the aluminum alloy being primarily formed of aluminum but further comprising copper, magnesium, manganese, silicon, tin, nickel, zinc, niobium, and the like. Suitable aluminum alloys include aluminum 1000 series alloys, aluminum 2000 series alloys, aluminum 3000 series alloys, aluminum 4000 series alloys, aluminum 5000 series alloys, aluminum 6000 series alloys, aluminum 7000 series alloys, and aluminum 8000 series alloys.
[0045] In an embodiment, the component is a component of an apparatus for processing a substrate and / or a semiconductor device such as those described above.
[0046] Embodiments according to the present specification include, but are not limited to, the following embodiments.
[0047] E1. A component of an apparatus for processing a substrate, comprising:
[0048] A coating comprising aluminum fluoride is disposed on at least a portion of a surface of the component.
[0049] E2. The component according to embodiment E1, wherein the coating comprises an inner portion contacting a surface of the component and comprising metallic aluminum, and an outer portion forming an outer surface and comprising aluminum fluoride.
[0050] E3. The component of embodiments E1-E2, wherein the inner portion has a thickness greater than or equal to about 1 μm and the outer portion has a thickness less than or equal to about 2 μm.
[0051] E4. The component of embodiments E1-E3, wherein the coating comprises aluminum trifluoride.
[0052] E5. The component of embodiments E1-E4, wherein the component comprises nickel and / or an iron-containing alloy.
[0053] E6. The component of embodiments E1-E5, wherein the component is a component of an apparatus for processing a substrate and / or a semiconductor device.
[0054] E7. A method of coating a component of an apparatus for processing a substrate according to embodiments E1 to E6, comprising:
[0055] disposing a coating comprising metallic aluminum on an outer surface of the component; and
[0056] Metallic aluminum is contacted with a fluorinating agent under conditions sufficient to form an aluminum fluoride coating over at least a portion of the component.
[0057] E8. A method of coating a component of an apparatus for processing a substrate, comprising:
[0058] disposing a coating comprising metallic aluminum on an outer surface of the component; and
[0059] Metallic aluminum is contacted with a fluorinating agent under conditions sufficient to form an aluminum fluoride coating over at least a portion of the component.
[0060] E9. A method according to embodiments E7-E8, wherein the aluminum fluoride coating comprises aluminum trifluoride.
[0061] E10. The method of embodiments E7-E9, wherein disposing a coating comprising metallic aluminum on the outer surface of the component comprises electroplating the component.
[0062] E11. A method for repairing a coating on a component, comprising:
[0063] removing from the component at least a portion of an existing coating present on an exterior surface of the component; and
[0064] The component is coated according to the method of embodiments E7-E10.
[0065] E12. A method for repairing a coating on a component, comprising:
[0066] removing from the component at least a portion of an existing coating present on an exterior surface of the component;
[0067] disposing a coating comprising metallic aluminum on an outer surface of the component; and
[0068] Metallic aluminum is contacted with a fluorinating agent under conditions sufficient to form an aluminum fluoride coating over at least a portion of the component.
[0069] E13. A method for processing a substrate, comprising:
[0070] A substrate is positioned within a processing volume of a processing chamber of an apparatus for processing a substrate, wherein at least one component of the apparatus for processing a substrate is according to embodiments E1-E6.
[0071] E14. A method for processing a substrate, comprising:
[0072] A substrate is disposed within a processing volume of a processing chamber of an apparatus for processing a substrate, wherein at least one component of the apparatus for processing a substrate comprises a coating disposed according to embodiments E7-E12.
[0073] E15. A method for processing a substrate, comprising:
[0074] disposing a substrate within a processing volume of a processing chamber of an apparatus for processing a substrate, wherein at least one component of the apparatus for processing a substrate comprises a coating comprising aluminum fluoride disposed on at least a portion of a surface of the component such that the surface is disposed within or facing the processing volume; and
[0075] Processing substrate.
[0076] E16. The method of embodiments E13-E15, wherein processing the substrate comprises plasma deposition of titanium silicide.
[0077] E17. The method of embodiments E13-E16, wherein the component comprising the aluminum fluoride coating disposed on at least a portion of a surface of the component is a showerhead.
[0078] While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof.
Claims
1. A component of an apparatus for processing a substrate, the component comprising: A coating comprising aluminum fluoride is disposed on at least a portion of a surface of the component.
2. The component of claim 1, wherein the coating comprises an inner portion and an outer portion, the inner portion contacting the surface of the component and comprising metallic aluminum, the outer portion forming an outer surface comprising aluminum fluoride. 3 . The component of claim 2 , wherein the inner portion has a thickness greater than or equal to about 1 μm and the outer portion has a thickness less than or equal to about 2 μm.
4. The component of claim 2, wherein the inner portion comprises metallic aluminum having a purity greater than or equal to about 95 wt% aluminum.
5. The component of an apparatus for processing a substrate as claimed in claim 1, wherein the coating comprises aluminum trifluoride.
6. The component of claim 1, wherein the component comprises nickel and / or an iron-containing alloy.
7. The component of claim 1, wherein the component comprises stainless steel.
8. The component of claim 1, wherein the component comprises austenitic steel.
9. The component of claim 1, wherein the component is a component of an apparatus for processing a substrate and / or a semiconductor device.
10. A method of coating a component of an apparatus for processing a substrate, the method comprising: disposing a coating comprising metallic aluminum on an outer surface of the component; and The metallic aluminum is contacted with a fluorinating agent under conditions sufficient to form an aluminum fluoride coating over at least a portion of the component.
11. The method of claim 10, wherein the aluminum fluoride coating comprises aluminum trifluoride.
12. The method of claim 10, wherein disposing the coating comprising metallic aluminum on the outer surface of the component comprises electroplating the component.
13. The method of claim 10, wherein disposing the coating comprising metallic aluminum on the outer surface of the component comprises electroless dipping.
14. The method of claim 10, wherein disposing the coating comprising metallic aluminum on the outer surface of the component comprises plasma spraying.
15. The method of claims 10 to 14, further comprising: removing from the component at least a portion of an existing coating present on the outer surface of the component before disposing the coating comprising metallic aluminum on the outer surface of the component; and The metallic aluminum is contacted with a fluorinating agent under conditions sufficient to form an aluminum fluoride coating over at least a portion of the component.
16. A method of processing a substrate, the method comprising: disposing the substrate within a processing volume of a processing chamber of an apparatus for processing the substrate, wherein at least one component of the apparatus for processing the substrate comprises a coating comprising aluminum fluoride disposed on at least a portion of a surface of the component such that the surface is disposed within or facing the processing volume; and The substrate is processed.
17. The method of claim 16, wherein processing the substrate comprises plasma deposition of titanium silicide.
18. The method of claim 16, wherein the component comprising the coating is a housing assembly, a showerhead, a substrate support structure, a housing for a heater, a portion of a gas delivery system present within a vacuum chamber, or an annular pumping channel, the coating comprising aluminum fluoride disposed on at least a portion of a surface of the component.
19. The method of claim 16, wherein the component comprising a coating comprising aluminum fluoride and disposed on at least a portion of a surface of the component is a showerhead.
20. The method of claim 16, wherein the component comprising a coating comprising aluminum fluoride and disposed on at least a portion of a surface of the component is a substrate support structure.