Electromechanical modeling of components for distribution box design

Abstract

A method of producing an electrical twin for a power system component of a distribution box is provided. The method includes: constructing a computer-implemented mechanical model of the power system component for one or more of a load current range or an ambient temperature range; performing a simulation of the computer-implemented mechanical model within the one or more of the load current range or the ambient temperature range; generating modeled physical data of the power system component based on the simulation of the computer-implemented mechanical model; and constructing the electrical twin of the power system component based at least on the modeled physical data.

Description

Background Art

[0001] Processing tools are used in semiconductor manufacturing to perform chemical and / or physical processes on silicon substrates. Processing tools use a distribution box containing power system components to supply and control power to various components of the processing tool. Examples of power system components include solid-state relays (SSRs), circuit breakers, contactors, and fuses. Summary of the Invention

[0002] This summary is provided to introduce a selection of concepts in a simplified form that are further described in the following specific implementations. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter. Furthermore, the claimed subject matter is not limited to implementations that address any or all of the disadvantages noted in any part of this disclosure.

[0003] One embodiment provides a method for generating an electrical twin for a power system component of a distribution box. The method includes constructing a computer-implemented mechanical model of the power system component for one or more of a load current range or an ambient temperature range. The method also includes performing a simulation of the computer-implemented mechanical model within the one or more of the load current range or the ambient temperature range. The method also includes generating modeled physical data for the power system component based on the simulation of the computer-implemented mechanical model. The method also includes constructing the electrical twin of the power system component based at least on the modeled physical data.

[0004] In some such examples, the computer-implemented mechanical model is alternatively or additionally configured to model a solid-state relay (SSR) and a heat sink.

[0005] In some such examples, performing the simulation of the computer-implemented mechanical model within the one or more of the load current range or the ambient temperature range alternatively or additionally includes: performing a thermal analysis of the computer-implemented mechanical model of the SSR and the heat sink within the one or more of the load current range or the ambient temperature range.

[0006] In some such examples, the method also alternatively or additionally includes determining a degradation model of the modeled physical data, and wherein constructing the electrical twin of the power system component based at least on the modeled physical data alternatively or additionally includes constructing the electrical twin of the SSR based at least on the degradation model.

[0007] In some such examples, the computer-implemented mechanical model alternatively or additionally includes a model of a circuit breaker including a bimetallic strip.

[0008] In some such examples, generating the modeled physical data of the power system component alternatively or additionally includes generating deformation data of the bimetallic strip within one or more of the load current range or the ambient temperature range.

[0009] In some such examples, generating deformation data for the bimetallic strip alternatively or additionally includes performing a thermo-electric-structural analysis of the computer-implemented mechanical model of the bimetallic strip within one or more of the load current range or the ambient temperature range.

[0010] In some such examples, constructing the electrical twin of the power system component based at least on the modeled physical data alternatively or additionally includes determining a deformation model based at least on the deformation data. The deformation model indicates a deformation rate within at least the load current range.

[0011] Another example provides a computing system. The computing system includes: a logic subsystem; and a storage subsystem. The storage subsystem includes instructions. The instructions are executable by the logic subsystem to: operate an electrical twin of a power system component, the electrical twin correlating a physical state of the power system component with one or more of an ambient temperature range or a load current range. The instructions are further executable to receive one or more of an ambient temperature or a load current of the power system component. The instructions are further executable to perform an electrical simulation to simulate the evolution of the power system component over time for one or more of the ambient temperature or the load current.

[0012] In some such examples, the electrical twin alternatively or additionally comprises an electrical twin of a solid-state relay (SSR) and a heat sink.

[0013] In some such examples, the instructions executable to perform the electrical simulation to simulate the evolution of the power system component over time alternatively or additionally include: instructions for simulating a component temperature of one or more of the SSR or the heat sink over time.

[0014] In some such examples, the electrical twin alternatively or additionally comprises an electrical twin of a circuit breaker including a bimetallic strip.

[0015] In some such examples, the instructions executable to perform the electrical simulation to simulate the evolution of the power system component over time alternatively or additionally include instructions to simulate deformation of the bimetallic strip over time for the ambient temperature and the load current.

[0016] In some such examples, the instructions executable to use the electrical twin in the electrical simulation to simulate the evolution over time further alternatively or additionally include: instructions for causing the electrical twin to operate as an open circuit when the deformation of the bimetallic strip reaches a trip threshold condition.

[0017] Another example provides a method for simulating a distribution box. The method includes operating an electrical twin of a power system component. The electrical twin associates a physical state of the power system component with one or more of an ambient temperature range or a load current range. The method also includes receiving one or more of an ambient temperature or a load current of the power system component. The method also includes performing an electrical simulation to simulate the evolution of the power system component over time for the one or more of the ambient temperature or the load current.

[0018] In some such examples, the electrical twin alternatively or additionally comprises an electrical twin of a solid-state relay (SSR) and a heat sink.

[0019] In some such examples, performing the electrical simulation to simulate the evolution of the power system component over time alternatively or additionally includes simulating a component temperature of one or more of the SSR or the heat sink over time.

[0020] In some such examples, the electrical twin alternatively or additionally comprises an electrical twin of a circuit breaker including a bimetallic strip.

[0021] In some such examples, performing the electrical simulation to simulate the evolution of the power system component over time alternatively or additionally includes simulating deformation of the bimetallic strip over time for the ambient temperature and the load current.

[0022] In some such examples, using the electrical twin in the electrical simulation to simulate the evolution of the power system component over time alternatively or additionally includes operating the electrical twin as an open circuit when the deformation of the bimetallic strip reaches a trip threshold condition. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A block diagram of an exemplary processing tool is shown.

[0024] Figure 2 A flow chart depicts an exemplary method of creating an electrical twin of an SSR and a heat sink.

[0025] Figure 3 An exemplary computer-implemented mechanical model of an SSR and heat sink is shown schematically.

[0026] Figure 4 Shows Figure 3 Schematic diagram of an exemplary electrical twin of an SSR and heat sink.

[0027] Figure 5 A flow chart depicting an exemplary method of creating an electrical twin of a circuit breaker is depicted.

[0028] Figure 6 An exemplary computer-implemented mechanical model of a bimetallic strip of a circuit breaker is schematically shown.

[0029] Figure 7 Shows Figure 6 Schematic diagram of an exemplary electrical twin of a computer-implemented mechanical model.

[0030] Figure 8 A flow chart depicts an exemplary method for designing a distribution panel using electrical twins of power system components.

[0031] Figure 9 Shows the use of Figure 4 Schematic diagram of an exemplary electrical simulation of the electrical twin of the SSR in FIG.

[0032] Figure 10 Shows the use of Figure 7 Schematic diagram of an exemplary electrical simulation of an electrical twin of a circuit breaker.

[0033] Figure 11 Schematically shows Figure 9 Exemplary evolution of the component temperature of an SSR over time in an electrical simulation.

[0034] Figure 12 Schematically shown Figure 10 Exemplary evolution of the deformation of the bimetallic strip of a circuit breaker over time in an electrical simulation.

[0035] Figure 13 A block diagram of an exemplary computing system is depicted. DETAILED DESCRIPTION

[0036] The term "ambient temperature" generally refers to the temperature of the air surrounding the power system components.

[0037] The term "bimetallic strip" generally refers to an electrical connector in a circuit breaker that consists of two or more dissimilar metal strips joined in a face-to-face relationship. The dissimilar metals expand at different rates when heated, causing the bimetallic strip to deform. For example, the bimetallic strip is heated when the circuit breaker operates under a fault condition.

[0038] The term "circuit breaker" generally refers to an electrical device that contains a bimetallic strip. The bimetallic strip deforms when the circuit breaker operates under a fault condition. When the deformation of the bimetallic strip reaches a tripping threshold condition, the circuit breaker operates as an open circuit.

[0039] The term "component temperature" generally refers to the temperature of a power system component.

[0040] The term "computer-implemented mechanical model" generally refers to a virtual three-dimensional representation of a real-world power system component that includes the electrical, thermal, and structural characteristics of the power system component.

[0041] The term "constraints" generally refers to the outer range of desired operating points for power system components.

[0042] The term "deformation" and variations thereof generally refer to the change in shape of a bimetallic strip as a function of heating.

[0043] The term "deformation data" generally refers to information related to the change in shape of the bimetallic strip caused by different ambient temperatures and / or load currents.

[0044] The term "deformation model" generally refers to a set of one or more equations used to determine the magnitude of deformation of a bimetallic strip as a function of factors such as ambient temperature and load current.

[0045] The term "electrical simulation" generally refers to a virtual representation of an electrical circuit.

[0046] The term "electrical twin" generally refers to a virtual circuit component representation of a power system component. The electrical twin relates the physical state of the power system component to ambient temperature and / or load current for electrical simulation.

[0047] The term "evolution over time" generally refers to a change in the physical state of a power system component as a function of time from exposure to load current and / or ambient temperature.

[0048] The term "fault condition" generally refers to the operation of a circuit breaker where the load current is greater than the rated current of the circuit breaker.

[0049] The term "heat sink" generally refers to a thermally conductive mass that dissipates thermal energy from a power system component, such as a solid-state relay.

[0050] The term "load current" generally refers to the electrical energy flowing through a power system component. Load current can be either direct current or alternating current.

[0051] The term "modeled physical data" generally refers to information determined from analysis of computer-implemented mechanical models of power system components.

[0052] The term "physical state" generally refers to the physical condition of a power system component. Examples of physical state include component temperature and deformation magnitude.

[0053] The term "distribution box" generally refers to a device that supplies power to and / or controls the delivery of power to one or more components of a machine.

[0054] The term "power system component" generally refers to the electrical equipment found in a distribution panel. A power system component provides or controls the output power of the distribution panel. Examples of power system components include solid-state relays and circuit breakers.

[0055] The term "processing chamber" generally refers to an enclosure in which chemical and / or physical processes are performed on a substrate.

[0056] The term "processing tool" generally refers to a machine that includes a processing chamber and other hardware configured to enable processing to be performed in the processing chamber.

[0057] The term "rated current" generally refers to the upper limit of the load current range that a circuit breaker can continuously conduct at a specified ambient temperature. The operating conditions of a circuit breaker can derate the rated current to different values. Examples of such operating conditions include varying ambient temperatures and operating multiple circuit breakers adjacent to each other.

[0058] The term "degraded model" generally refers to a mathematical representation of modeled physical data derived from a computer-implemented mechanical model of a power system component. A degraded model can be an approximation of the modeled physical data and have a lower complexity. For example, results from a computer-implemented mechanical model (e.g., three-dimensional) can be degraded to a two-dimensional perspective.

[0059] The term "solid-state relay (SSR)" generally refers to an electronic device that controllably switches output power on or off.

[0060] The term "substrate" generally refers to any object on which chemical and / or physical processes are performed in a processing chamber.

[0061] The term "thermal analysis" generally refers to the analysis of transient heat dissipation of a power system component as determined by a computer-implemented mechanical model of the power system component.

[0062] The term "thermo-electro-structural analysis" generally refers to the analysis of the deformation of a bimetallic strip caused by an applied load current and / or ambient temperature as determined by a computer-implemented mechanical model of the bimetallic strip.

[0063] The term "trip time" generally refers to the duration of time a circuit breaker operates under a fault condition until the circuit breaker operates as an open circuit, or trips.

[0064] The term "trip threshold condition" generally refers to a situation where the bimetallic strip deforms to such an extent that the electrical connection in the circuit breaker is interrupted.

[0065] A processing tool used to process substrates may include many different powered components. The circuitry used to provide power to the powered components may be located in a distribution box. Some distribution box components may include electromechanical features. Exemplary electromechanical components include solid-state relays (SSRs) and circuit breakers. For example, the electromechanical characteristics of such components may vary with different operating conditions, such as ambient temperature and / or load current. However, during process tool development and when troubleshooting, testing the physical distribution box under different operating conditions can be time-consuming and expensive.

[0066] To avoid testing physical distribution boxes under different operating conditions, electrical simulation can be used to design distribution boxes. However, current simulation models of power system components are typically based on static operating conditions, such as static load current or static ambient temperature. Such static operating conditions may not reflect the operating conditions of distribution boxes in the real world. For example, when the load current changes, the electrical simulation of the circuit breaker may reset the determination of the trip time. In this regard, the trip time modeled by the electrical simulation may be longer than that of a circuit breaker in the real world that experiences constantly changing load currents. Discovering such problems in processing tools deployed in semiconductor manufacturing plants can be expensive and time-consuming. In addition, diagnosing and resolving such problems may involve expensive redesign of the distribution box.

[0067] Thus, an example is disclosed for generating an electrical twin of a power system component. The electrical twin is used in electrical simulations to design a distribution box within constraints. In short, the disclosed example constructs a computer-implemented mechanical model of the power system component for a range of load currents and / or ambient temperatures. The computer-implemented mechanical model includes a three-dimensional structural model of the power system component, which includes the material and electrical properties of the power system component. The computer-implemented mechanical model then performs a simulation over the range of load currents and / or ambient temperatures. Modeled physical data of the power system component is then generated based on the simulation of the computer-implemented mechanical model. The modeled physical data represents simulated physical states of the power system component under different physical conditions. An electrical twin of the power system component is then constructed based at least on the modeled physical data. Thus, the electrical twin associates the physical state of the power system component with a range of ambient temperatures and / or load currents. When used in electrical simulations, the electrical twin can provide more accurate information about the physical state of the dynamic load current and / or dynamic ambient temperature than a static model. Performing electrical simulations using the electrical twin can help reduce the cost of designing and developing switchboards. Furthermore, such electrical simulations can be used as a diagnostic tool for the operation of field switchboards.

[0068] Before discussing these examples in detail, Figure 1 An exemplary processing tool 100 is schematically shown that utilizes a power distribution box to supply power to and / or control power to components of the processing tool 100. The processing tool 100 takes the form of a deposition tool, such as a chemical vapor deposition (CVD) tool or an atomic layer deposition (ALD) tool. In other examples, a processing tool incorporating a power distribution box designed according to the present disclosure may include any other suitable type of processing tool. Examples include electrodeposition tools, dry etching tools, wet etching tools, ultraviolet (UV) exposure tools, and spin cleaning tools.

[0069] The processing tool 100 includes a processing chamber 102 and a substrate support 104 within the processing chamber 102. The substrate support 104 is configured to support a substrate 106 disposed within the processing chamber 102. The substrate support 104 includes a substrate heater 108. In other examples, the heater may alternatively or additionally be located elsewhere within the processing chamber 102.

[0070] The processing tool 100 also includes a showerhead 110, a gas inlet 112, and flow control hardware 114. In other examples, the processing tool may include a nozzle or other device for delivering gas to the processing chamber 102, as well as or in addition to the showerhead. The flow control hardware 114 is connected to one or more process gas sources. The process gas sources are shown as process gas source 1 116 and process gas source N 118, where N is an integer of 0 or greater.

[0071] Flow control hardware 114 can be controlled to cause gases from process gas source 1 116 and process gas source N to flow into process chamber 102 via gas inlet 112. Flow control hardware 114 includes one or more components that can be controlled to place one or more selected gas sources in fluid communication with gas inlet 112. Exemplary components of flow control hardware 114 include one or more mass flow controllers and / or valves. In some examples, the process chamber may include one or more additional gas inlets.

[0072] The processing tool 100 also includes an exhaust system 124. The exhaust system 124 is configured to exhaust gases from the processing chamber 102. The exhaust system 124 can include any suitable hardware, including one or more pumps.

[0073] The processing tool 100 also includes a first electrical distribution box 126. The first electrical distribution box 126 is configured to receive power from a power supply 128 and provide output power to the substrate heater 108. The first electrical distribution box 126 includes an SSR 130. The SSR 130 is configured to be selectively controlled to turn the output power off and on using pulse width modulation (PWM). Such a configuration can be used to control the temperature of the substrate heater 108. However, switching the output power may increase the component temperature of the SSR 130 during operation. In this regard, a heat sink 132 is thermally coupled to the SSR 130. The heat sink 132 helps dissipate the thermal energy generated by the SSR 130 during switching. The SSR 130 and the heat sink 132 can be selected to remain within constraints. For example, the size of the heat sink 132 can be selected so that the component temperature of the SSR 130 remains below a desired temperature.

[0074] First distribution box 126 also includes a circuit breaker (CB) 134 including a bimetallic strip. The bimetallic strip deforms when circuit breaker 134 operates under a fault condition. When the deformation of the bimetallic strip reaches a tripping threshold condition, circuit breaker 134 operates as an open circuit. The duration, or trip time, that circuit breaker 134 remains in a fault condition before reaching the tripping threshold condition can vary depending on the load current and / or ambient temperature of circuit breaker 134. Circuit breaker 134 can be selected to remain within constraints. For example, the constraints may include a desired tripping time for a desired load current and / or a desired ambient temperature.

[0075] The processing tool 100 also includes a second distribution box 136 that supplies power to a radio frequency (RF) generator 135. The RF generator 135 is electrically connected to the substrate support 104. The RF generator 135 is configured to provide RF power to form a plasma. In this example, the showerhead 110 is configured as a grounded counter electrode. In other examples, the RF generator 135 may supply RF power to the showerhead 110 or other suitable electrode structures. The second distribution box 136 includes a matching network 138 for impedance matching of the RF power. Examples of suitable power levels include between 0 and 6500 watts. In some examples, the RF power is configured to operate at multiple different frequencies and / or powers. The second distribution box 136 also includes a circuit breaker 140 including a bimetallic strip. Similar to the circuit breaker 134, the circuit breaker 140 operates as an open circuit when the bimetallic strip reaches a trip threshold condition. In other examples, the first distribution box 126 and the second distribution box 136 may be combined into a single distribution box. In other examples, the RF generator 135 and / or the matching network 138 may be omitted.

[0076] The various components of first distribution box 126 and second distribution box 136 may be collectively referred to as power system components. As an example, the power system components include SSR 130, circuit breaker 134, and circuit breaker 140. First distribution box 126 and / or second distribution box 136 may also include other power system components.

[0077] The controller 142 is operably coupled to the substrate heater 108, the flow control hardware 114, the exhaust system 124, the first distribution box 126, and the second distribution box 136. The controller 142 is configured to control various functions of the processing tool 100 to perform a deposition process. For example, the controller 142 is configured to control the temperature of the substrate heater 108 by controlling the switching of the SSR 130 using PWM. The controller 142 can adjust the PWM based on data from the temperature sensor to maintain a desired temperature on the substrate heater 108. The controller 142 is also configured to operate the flow control hardware 114 to cause a selected gas or gas mixture to flow into the processing chamber 102 at a selected rate. The controller 142 is also configured to operate the exhaust system 124 to remove gases from the processing chamber 102. For example, the controller 142 can control the exhaust system 124 and / or the flow control hardware 114 to purge the processing chamber 102. In addition, the controller 142 is configured to operate the RF generator 135 and the second distribution box 136 to form a plasma in the processing chamber 102. The controller 142 may also be configured to control any other suitable functions of the processing tool 100. The controller 142 may include any suitable computing system, examples of which are described below with respect to Figure 13 To describe.

[0078] As previously mentioned, electrical simulation can be used to help design distribution boxes within constraints. However, available electrical simulations may not be able to model the electromechanical response of power system components under dynamic operating conditions. Available simulations can alternatively use static modeling. As mentioned above, static modeling can lead to design errors when modeling the operation of electromechanical components under dynamic operating conditions.

[0079] As discussed above, the disclosed examples utilize an electrical twin of a power system component to perform electrical simulations. The electrical twin correlates the physical state of the power system component with a range of ambient temperatures and / or load currents. The electrical simulation may include applying dynamic load currents and / or dynamic ambient temperatures to the electrical twin. The electrical twin can then determine the corresponding physical state to generate electrical simulation results using the modeled physical data. Such electrical simulations can more closely reflect the real-world operation of power system components than electrical simulations using static modeling.

[0080] Figure 2 A flow chart of an exemplary method 200 for generating an electrical twin for use with a power system component of a distribution box is depicted. At step 202, method 200 includes constructing a computer-implemented mechanical model of the power system component for one or more of a load current range or an ambient temperature range. The computer-implemented mechanical model may include structural data, electrical data, thermal data, or any combination thereof for the power system component. In the depicted example, the computer-implemented mechanical model is configured to model an SSR and a heat sink, as shown at 204. An exemplary computer-implemented mechanical model 300 is schematically shown at Figure 3 As shown, SSR 302 is thermally coupled to heat sink 304. In such a configuration, heat sink 304 helps dissipate the heat energy generated by SSR 302. SSR 302 and heat sink 304 are examples of SSR 130 and heat sink 132, respectively. Figure 3 , however, the computer-implemented mechanical model 300 contains three-dimensional information about the SSR 302 and the heat sink 304. The computer-implemented mechanical model 300 also contains information about the materials from which the SSR 302 and the heat sink 304 are made, including information on the thermal conductivity of such materials.

[0081] Return to Figure 2At step 206, method 200 includes performing a simulation of the computer-implemented mechanical model over one or more of the load current range or the ambient temperature range. As depicted at 208, performing the simulation of the computer-implemented mechanical model includes performing a thermal analysis of the computer-implemented mechanical model of the SSR and the heat sink over one or more of the load current range or the ambient temperature range. The thermal analysis can determine the thermal energy generated by SSR 302 and dissipated by heat sink 304. Thus, the modeled physical data indicates component temperatures of SSR 302 caused by one or more of the load current range or the ambient temperature range.

[0082] In step 209, method 200 includes generating modeled physical data of the power system component based on a simulation of a computer-implemented mechanical model. In step 210, method 200 also includes optionally determining a degraded model of the modeled physical data. For example, determining the degraded model may include mathematically reducing the modeled physical data. In some examples, the degraded model may include an approximation of the modeled physical data, and therefore, the degraded model may be less complex than the modeled physical data. More specifically, the modeled physical data may include three-dimensional information. The three-dimensional information may be degraded to a two-dimensional stereogram to determine the degraded model. In such an approach, the runtime of a downstream electrical simulation using an electrical twin with a degraded model may be less than the runtime of a downstream electrical simulation using an electrical twin with modeled physical data. In other examples, 210 may be omitted.

[0083] At step 212, method 200 further includes constructing an electrical twin of the power system component based on at least the modeled physical data. The electrical twin of the power system component is used in electrical simulation to design the distribution box to remain within the constraints. Figure 8 Discussing exemplary uses of electrical twins in electrical simulations, in an example including determining a degradation model at step 210 , constructing an electrical twin of a power system component based on at least the modeled physical data includes constructing an electrical twin of an SSR based on at least the degradation model, as shown at 214 .

[0084] Figure 4An exemplary electrical twin 400 utilizing a computer-implemented mechanical model of an SSR and a heat sink is schematically shown. Electrical twin 400 includes a degradation model 402. For example, degradation model 402 is based on modeled physical data from a computer-implemented mechanical model of the SSR (e.g., computer-implemented mechanical model 300). In other examples, degradation model 402 may be based on any other suitable modeled physical data. Degradation model 402 is configured to determine a component temperature 404 of the SSR based on at least an ambient temperature 406 and a heat flow magnitude 408 caused by current passing through the SSR. Input P1 410 is configured to receive ambient temperature 406. Field data storage 412 is configured to receive a storage rate for data output from the electrical simulation. Heat flow magnitude 408 is based on at least a load current flowing from input P3 414 to output P4 416. Electrical twin 400 includes an analog ammeter 418 to determine a moving average current (root mean square (RMS) current) 420 of the load current. For example, the moving average current 420 may include the RMS value of the load current. In other examples, other suitable calculations of the load current may be used. The electrical twin 400 determines the heat flow magnitude 408 based at least on the power dissipated by the load current. More specifically, the electrical twin 400 determines the heat flow magnitude 408 by multiplying the moving average current 420 by the corresponding voltage drop across the SSR.

[0085] The electrical twin 400 also includes a switch 422 to simulate the SSR turning the output power on and off during operation. Input P2 424 controls the switch 422 to open and close the switch 422. Figure 8 Exemplary uses of the electrical twin 400 in electrical simulations are discussed.

[0086] In the above example, the modeled power system component includes an SSR. In other examples, the modeled power system component may include a circuit breaker. Figure 5 An exemplary method 500 for generating an electrical twin for a circuit breaker (e.g., circuit breaker 134 or circuit breaker 140) is shown. Similar to method 200, at step 502, method 500 includes constructing a computer-implemented mechanical model of a power system component. At step 503, method 500 further includes performing a simulation of the computer-implemented mechanical model. At step 504, method 500 further includes generating modeled physical data for the power system component based on the simulation of the computer-implemented mechanical model. At step 506, method 500 additionally includes constructing an electrical twin for the power system component based at least on the modeled physical data. In the depicted example, the computer-implemented mechanical model includes a model of a circuit breaker including a bimetallic strip, as shown at 508. The exemplary computer-implemented mechanical model 600 of the bimetallic strip 602 is schematically shown at Figure 6As shown, the bimetallic strip 602 includes a first metal 604, a second metal 606, and an optional third metal 608. In various examples, the first metal 604, the second metal 606, and the third metal 608 may include alloys or pure metals. The first metal 604, the second metal 606, and the third metal 608 have different thermal expansion coefficients. Although schematically depicted Figure 6 , but the computer-implemented mechanical model 600 contains three-dimensional information about the bimetallic strip 602. The computer-implemented mechanical model 600 also contains information about the material from which the bimetallic strip 602 is made. For example, the computer-implemented mechanical model 600 contains information about the thermal conductivity, electrical conductivity, and coefficient of thermal expansion of the material.

[0087] Return to Figure 5 Generating modeled physical data for the power system component includes generating deformation data for the bimetallic strip within one or more of a load current range or an ambient temperature range, as shown at 510. Generating the deformation data for the bimetallic strip may include performing a thermo-electric-structural analysis on a computer-implemented mechanical model of the bimetallic strip within one or more of the load current range or the ambient temperature range, as shown at 512. In this manner, the modeled physical data indicates a deformation rate of the bimetallic strip caused by a combination of a load current and an ambient temperature within the load current range and / or the ambient temperature range.

[0088] Next, constructing an electrical twin of the power system component based at least on the modeled physical data includes determining a deformation model based at least on the deformation data, as shown at 514. The deformation model indicates a deformation rate within the bimetallic strip at least over a range of load currents. The deformation model can then be used in the electrical twin of the circuit breaker.

[0089] Figure 7 An exemplary electrical twin 700 of a circuit breaker including a bimetallic strip (e.g., bimetallic strip 602) is shown. Electrical twin 700 is configured to simulate the electrical operation of the circuit breaker under different ambient temperatures and load currents. In electrical twin 700, a load current flows from input P3 702 to output P1 704. An analog ammeter 706 determines a moving average current, such as a root mean square current (RMS current) 708 of the load current.

[0090] The electrical twin 700 also includes a deformation model 710. The deformation model 710 is configured to determine when a circuit breaker is operating under a fault condition based on at least a moving average current (RMS current) 708. As previously described, a fault condition indicates that the load current is greater than the rated current of the circuit breaker. However, the rated current may be derated based on the operating conditions of the circuit breaker. Therefore, the electrical twin 700 includes a temperature de-rating factor 712 to determine the derated current by de-rating the rated current based on the ambient temperature 714. As a specific example, a rated current of 70A (amperes) at 30°C (degrees Celsius) may be derated to 38A at 40°C. Similarly, an adjacent de-rating factor 716 may be used to further de-rating the rated current based on the number of circuit breakers 718. As a specific example, a single circuit breaker at 40°C is rated at 100%, while two adjacent circuit breakers at 40°C are each derated to 90%. In some examples, the adjacent de-rating factor 716 may determine the de-rated current using a lookup table (LUT) 720. Ambient temperature 714 and number of adjacent circuit breakers 718 are configurable inputs to electrical twin 700. Electrical twin 700 also includes a current factor module 722 configured to determine when a circuit breaker operates under a fault condition based at least on moving average current (RMS current) 708 and derated current.

[0091] Deformation model 710 is configured to determine the magnitude of bimetallic strip deformation when the circuit breaker operates under fault conditions. Deformation slope data 724 is used to determine the rate of deformation of the bimetallic strip based on the moving average current (RMS current) during a fault condition using a lookup table (LUT) 726. In some examples, deformation slope data 724 can be used to interpolate between two or more entries in LUT 726 to determine the deformation rate. Such interpolation can help reduce the size of LUT 726.

[0092] The bimetal deformation determination module 728 is configured to determine the bimetal deformation amplitude based at least on the deformation rate. Furthermore, the bimetal deformation state machine 730 is configured to determine when the bimetal deformation amplitude reaches a trip threshold condition. The bimetal deformation state machine 730 transmits an output to the switch controller 734 indicating when the determined bimetal deformation amplitude reaches the trip threshold condition. In some examples, the trip threshold condition includes a deformation amplitude greater than a specified deformation amplitude. The depicted functionality of the deformation model 710 is illustrative, and in other examples, the model for determining when a bimetallic strip reaches a trip threshold condition may include any suitable structure.

[0093] As previously described, when the bimetallic strip reaches a trip threshold condition, the circuit breaker operates as an open circuit. Therefore, electrical twin 700 includes switch 732. Switch controller 734 is configured to open switch 732 to create an open circuit based on the output from bimetallic deformation state machine 730. When switch 732 is open, bimetallic deformation determination module 728 is configured to use bimetallic negative slope data 736 to determine the magnitude of bimetallic deformation. In some examples, bimetallic negative slope data 736 may be stored in a lookup table.

[0094] The electrical twin 700 also includes an output P4 738. The output P4 738 can indicate the state of the switch 732. In this manner, the electrical twin 700 is configured to correlate the physical state of the bimetallic strip deformation with a load current range and / or an ambient temperature range.

[0095] Figure 7 The electrical twin 700 is illustrative, and any other suitable electrical twin configuration may be used to model a circuit breaker in dynamic operation. Although the above examples are provided for SSRs and circuit breakers, in other examples, other power system components may be modeled using electrical twins.

[0096] The above examples involve creating electrical twins of power system components. Such electrical twins can be used to design distribution boxes to stay within constraints. Figure 8 A flow chart of an exemplary method 800 for simulating a distribution panel using an electrical twin of a power system component is shown. At step 802, method 800 includes operating an electrical twin of a power system component. The electrical twin associates a physical state of the power system component with one or more of an ambient temperature range or a load current range. In some examples, the electrical twin includes electrical twins of an SSR and a heat sink, as shown at 804.

[0097] In such examples, electrical simulations can utilize the electrical twins of the SSR and heat sink to help design the distribution box to stay within the constraints. Figure 9 Such an electrical simulation 900 is shown schematically. The electrical simulation 900 includes an electrical twin 902 of an SSR and a heat sink. The electrical twin 902 is an exemplary embodiment of the electrical twin 400. In the depicted example, the SSR includes an SSR rated for 65A. In other examples, the electrical twin may include any other suitable SSR and / or heat sink. The electrical twin 902 is connected to a load 904 (depicted as a resistor) and a voltage source 906. The load 904 and the voltage source 906 help drive the load current through the electrical twin 902. An ambient temperature 908 and a PWM control signal 910 are configured as controllable inputs to the electrical simulation 900. More specifically, the ambient temperature 908 and the PWM control signal 910 are applied to the electrical twin 902. Figure 9 The electrical simulation 900 is illustrative, and other electrical simulations utilizing the electrical twin 902 may be used in other examples.

[0098] Return to Figure 8 In other examples, the electrical twin includes an electrical twin of a circuit breaker including a bimetallic strip, as shown at 806 . Figure 10 An exemplary electrical simulation 1000 of an electrical twin 1002 including a circuit breaker is schematically shown. Electrical twin 1002 is an exemplary embodiment of electrical twin 700. In the depicted example, electrical twin 1002 includes a circuit breaker rated for 63A. In other examples, electrical twin 1002 may include other circuit breakers. Electrical simulation 1000 also includes a load 1004 (depicted as a resistor) and a voltage source 1006 to generate a load current. Switch 1008 is configured to utilize a PWM control signal 1010 to control the amount of load current passing through electrical twin 1002. Figure 10 The electrical simulation 100 is illustrative, and other electrical simulations utilizing the electrical twin 1002 may be used in other examples. Return to Figure 8 In other examples, the electrical twin may model other power system components besides SSRs and heat sinks or circuit breakers.

[0099] At step 808, method 800 also includes receiving one or more of an ambient temperature or a load current of a power system component. At step 810, method 800 then includes performing an electrical simulation to simulate the evolution of one or more of the ambient temperature or the load current of the power system component over time. In an example where the electrical twin includes an SSR and a heat sink, at step 812, method 800 includes simulating the change in component temperature of one or more of the SSR or the heat sink over time.

[0100] For example, Figure 11 An exemplary component temperature 1100 of an SSR is schematically shown as a function of time, such as simulated by electrical simulation 900. In some examples, the SSR and heat sink in the electrical simulation are selected to remain below a desired temperature. Such a configuration can help increase the reliability of the SSR and heat sink compared to an SSR and heat sink whose component temperatures exceed the desired temperature. Thus, by using electrical simulations utilizing the disclosed electrical twin, a distribution box can be designed to remain within constraints. Figure 11 In the example, the distribution box can be designed to remain below the desired temperature. Figure 11 is illustrative, and other component temperatures of the SSR and / or heat sink may be simulated.

[0101] Return to Figure 8In an example where the electrical twin comprises an electrical twin of a circuit breaker, at step 814, method 800 includes simulating deformation of a bimetallic strip over time under ambient temperature and load current. Furthermore, at step 816, method 800 includes operating the electrical twin as an open circuit when the deformation of the bimetallic strip reaches a trip threshold condition. Figure 12 Schematically shows exemplary deformation of a circuit breaker over time when the circuit breaker is in a fault condition. For example, Figure 12 can be Figure 10 An electrical simulation is generated. As shown, when the circuit breaker is in a fault condition, the deformation 1202 of the circuit breaker's bimetallic strip increases over time. At time 1204, deformation 1202 reaches a trip threshold condition 1206. In the depicted example, trip threshold condition 1206 includes a specified deformation amplitude. Furthermore, at time 1204, the circuit breaker is operating as an open circuit. As previously described, when the circuit breaker is operating as an open circuit, the bimetallic negative slope data is used to determine deformation 1202, as shown at 1208. Figure 12 is illustrative, and other tripping times of the circuit breaker may be simulated.

[0102] In this manner, method 800 performs electrical simulations to simulate the evolution of the physical state of power system components over time. Electrical simulations can be used to design distribution boxes to stay within constraints. Using electrical simulations to select the disclosed power system components can help avoid problems that arise when performing static simulations of power system components. Furthermore, the disclosed electrical simulations can also be used to help troubleshoot distribution box problems in existing processing tools. This can help identify distribution box problems more quickly and efficiently than other diagnostic methods. While examples are provided for SSRs and circuit breakers, any other electromechanical power system components can be modeled in a similar manner.

[0103] In some embodiments, the methods and processes described herein may be associated with a computing system of one or more computing devices. In particular, such methods and processes may be implemented as a computer application or service, an application programming interface (API), a library, and / or other computer program products. Figure 13An example of a computing system 1300 that can implement one or more of the above-described methods and processes is schematically shown. Computing system 1300 is shown in simplified form. Computing system 1300 can employ one or more personal computers, server computers, tablet computers, network computing devices, and / or other computing devices. Controller 142 is an example of computing system 1300. Method 200, method 500, and method 800 can be performed by computing system 1300. More specifically, computing system 1300 can use computer-implemented mechanical models 300, 600 to generate electrical twins 400, 700, respectively. Further, computing system 1300 can use electrical simulation 900 and / or 1000 to perform simulations.

[0104] The computing system 1300 includes a logic subsystem 1302 and a storage subsystem 1304. The computing system 1300 may optionally include a display subsystem 1308, an input subsystem 1310, a communication subsystem 1312, and / or other subsystems not shown. Figure 13 Other components in.

[0105] Logic subsystem 1302 comprises one or more physical devices configured to execute instructions 1306. For example, the logic subsystem may be configured to execute instructions that are part of one or more applications, services, programs, routines, databases, objects, components, data structures, or other logical structures. Such instructions may be implemented to perform a task, implement a data form, transform the state of one or more components, achieve a technical effect, or otherwise achieve a desired result. As an example, the logic subsystem may execute instructions for implementing method 200, method 500, and method 800.

[0106] The logic subsystem may include one or more processors configured to execute software instructions. Additionally or alternatively, the logic subsystem may include one or more hardware or firmware logic devices configured to execute hardware or firmware instructions. The processors of the logic subsystem may be single-core or multi-core, and the instructions executed thereon may be configured for sequential, parallel and / or distributed processing. Individual components of the logic subsystem may optionally be dispersed across two or more separate devices, which may be remotely located and / or configured for coordinated processing. Aspects of the logic subsystem may be virtualized and executed by remotely accessible network computing devices configured in a cloud computing architecture.

[0107] The storage subsystem 1304 includes one or more physical devices configured to store instructions 1306 that can be executed by the logic subsystem to implement the methods and processes described herein. For example, the storage subsystem 1304 may include instructions that can be executed to perform method 200, method 500, and / or method 800. When implementing such methods and processes, the state of the storage subsystem 1304 can be transformed—for example, to store different data.

[0108] The storage subsystem 1304 may include removable and / or embedded devices. The storage subsystem 1304 may include optical storage (e.g., CD, DVD, HD-DVD, Blu-ray Disc, etc.), semiconductor storage (e.g., RAM, EPROM, EEPROM, etc.), and / or magnetic storage (e.g., hard disk drive, floppy disk drive, tape drive, MRAM, etc.), etc. The storage subsystem 1304 may include volatile, non-volatile, dynamic, static, read / write, read-only, random access, sequential access, location addressable, file addressable, and / or content addressable devices.

[0109] It should be understood that storage subsystem 1304 comprises one or more physical devices. However, aspects of the instructions described herein may alternatively be propagated via a communication medium (eg, electromagnetic signals, optical signals, etc.) that is not retained by a physical device for a finite duration.

[0110] Aspects of the logic subsystem 1302 and the storage subsystem 1304 may be integrated together into one or more hardware logic components. For example, such hardware logic components may include field programmable gate arrays (FPGAs), program-specific and application-specific integrated circuits (PASIC / ASICs), program-specific and application-specific standard products (PSSP / ASSPs), systems on a chip (SOCs), and complex programmable logic devices (CPLDs).

[0111] When included, the display subsystem 1308 can be used to present a visual representation of the data stored by the storage subsystem 1304. This visual representation can take the form of a graphical user interface (GUI). As the methods and processes described herein change the data stored by the storage subsystem and therefore change the state of the storage subsystem, the state of the display subsystem 1308 may also shift to visually represent the changes in the underlying data. The display subsystem 1308 can include one or more display devices, which utilize virtually any type of technology. Such display devices can be combined with the logic subsystem 1302 and / or the storage subsystem 1304 in a shared enclosure, or such display devices can be peripheral display devices.

[0112] When included, the input subsystem 1310 can include one or more user input devices (e.g., keyboard, mouse, touch screen). In some implementations, the input subsystem can include or interact with selected natural user input (NUI) components. Such components can be integrated or peripheral, and the conversion and / or processing of input actions can be handled on-board or off-board.

[0113] When included, the communication subsystem 1312 can be configured to communicatively couple the computing system 1300 with one or more other computing devices. The communication subsystem 1312 can include wired and / or wireless communication devices compatible with one or more different communication protocols. As an example, the communication subsystem can be configured to communicate using a wireless telephone network, or a wired or wireless local area network or wide area network. In some embodiments, the communication subsystem can allow the computing system 1300 to send messages to and / or receive messages from other devices over a network such as the Internet.

[0114] It should be understood that the configurations and / or methods described herein are exemplary in nature, and that these specific embodiments or examples are not to be considered limiting, as many variations are possible. The specific subroutines or methods described herein may represent one or more of any number of processing strategies. In this regard, the various actions shown and / or described may be performed in the order shown and / or described, in another order, in parallel, or may be omitted. Likewise, the order of the above-described processes may be changed.

[0115] As used herein, "and / or" is defined to include OR, as enumerated by the truth table below:

[0116] As used herein, the term "one or more of A or B" includes A, B, or a combination of A and B. The term "one or more of A, B, or C" is equivalent to A, B, and / or C. Therefore, as used herein, "one or more of A, B, or C" includes A alone, B alone, C alone, a combination of A and B, a combination of A and C, a combination of B and C, or a combination of A, B, and C.

[0117] It should be understood that the configurations and / or methods described herein are exemplary in nature, and these specific embodiments or examples should not be considered restrictive, as many variations are possible. The specific routines or methods described herein may represent one or more of any number of strategies. Thus, the various actions shown and / or described may be performed in the order shown and / or described, in other orders, in parallel, or omitted. Similarly, the order of the above-described processes may be changed.

[0118] The subject matter of the present disclosure includes all novel and nonobvious combinations and subcombinations of the various processes, systems and configurations, and other features, functions, acts and / or properties disclosed herein, as well as any and all equivalents thereof.

Claims

1. A method for generating an electrical twin for a power system component of a distribution box, the method comprising: constructing a computer-implemented mechanical model of the power system component for one or more of a load current range or an ambient temperature range; performing a simulation of the computer-implemented mechanical model within the one or more of the load current range or the ambient temperature range; generating modeled physical data for the power system component based on the simulation of the computer-implemented mechanical model; as well as The electrical twin of the power system component is constructed based at least on the modeled physical data. 2 . The method of claim 1 , wherein the computer-implemented mechanical model is configured to model a solid-state relay (SSR) and a heat sink.

3. The method of claim 2 , wherein performing the simulation of the computer-implemented mechanical model within the one or more of the load current range or the ambient temperature range comprises performing a thermal analysis of the computer-implemented mechanical model of the SSR and the heat sink within the one or more of the load current range or the ambient temperature range.

4. The method of claim 2 , further comprising determining a degradation model for the modeled physical data, and wherein constructing the electrical twin of the power system component based at least on the modeled physical data comprises constructing the electrical twin of the SSR based at least on the degradation model.

5. The method of claim 1, wherein the computer-implemented mechanical model comprises a model of a circuit breaker including a bimetallic strip. 6 . The method of claim 5 , wherein generating the modeled physical data for the power system component comprises generating deformation data for the bimetallic strip within one or more of the load current range or the ambient temperature range.

7. The method of claim 6, wherein generating deformation data for the bimetallic strip comprises performing a thermo-electric-structural analysis of the computer-implemented mechanical model of the bimetallic strip within one or more of the load current range or the ambient temperature range.

8. The method of claim 6, wherein constructing the electrical twin of the power system component based at least on the modeled physical data comprises determining a deformation model based at least on the deformation data, the deformation model indicating a deformation rate within at least the load current range.

9. A computing system comprising: Logic subsystem; and a storage subsystem comprising instructions executable by the logic subsystem to: operating an electrical twin of a power system component, the electrical twin correlating a physical state of the power system component to one or more of an ambient temperature range or a load current range; receiving one or more of an ambient temperature or a load current of the power system component; as well as An electrical simulation is performed to simulate an evolution of the power system component over time for the one or more of the ambient temperature or the load current.

10. The computing system of claim 9, wherein the electrical twin comprises an electrical twin of a solid state relay (SSR) and a heat sink.

11. The computing system of claim 10, wherein the instructions executable to perform the electrical simulation to simulate the evolution of the power system component over time include instructions for simulating a component temperature of one or more of the SSR or the heat sink over time.

12. The computing system of claim 9, wherein the electrical twin comprises an electrical twin of a circuit breaker including a bimetallic strip.

13. The computing system of claim 12, wherein the instructions executable to perform the electrical simulation to simulate the evolution of the power system component over time include instructions to simulate deformation of the bimetallic strip over time for the ambient temperature and the load current.

14. The computing system of claim 13, wherein the instructions executable to use the electrical twin in the electrical simulation to simulate the evolution over time further comprise instructions for operating the electrical twin as an open circuit when the deformation of the bimetallic strip reaches a trip threshold condition.

15. A method for simulating a distribution box, the method comprising: operating an electrical twin of a power system component, the electrical twin correlating a physical state of the power system component to one or more of an ambient temperature range or a load current range; receiving one or more of an ambient temperature or a load current of the power system component; as well as An electrical simulation is performed to simulate an evolution of the power system component over time for the one or more of the ambient temperature or the load current.

16. The method of claim 15, wherein the electrical twin comprises an electrical twin of a solid state relay (SSR) and a heat sink. 17 . The method of claim 16 , wherein performing the electrical simulation to simulate the evolution of the power system component over time comprises simulating a component temperature of one or more of the SSR or the heat sink over time.

18. The method of claim 15, wherein the electrical twin comprises an electrical twin of a circuit breaker including a bimetallic strip.

19. The method of claim 18, wherein performing the electrical simulation to simulate the evolution of the power system component over time comprises simulating deformation of the bimetallic strip over time for the ambient temperature and the load current.

20. The method of claim 19, wherein using the electrical twin in the electrical simulation to simulate the evolution of the power system component over time comprises operating the electrical twin as an open circuit when the deformation of the bimetallic strip reaches a trip threshold condition.

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