Reaction chamber and thin film deposition equipment

Abstract

The invention discloses a reaction chamber and thin film deposition equipment, and the reaction chamber comprises a transmission channel which is provided with a gap; and the adjusting assembly comprises an adjusting plate which is matched with the notch and is movably arranged. Through movable control of the adjusting plate, the transmission channel is switched between a closed state and an open state, and the volume of the reaction chamber is adjusted, so that gaseous reactants can be effectively isolated, disordered deposition of a thin film is reduced, the operation efficiency of equipment is improved, cleaning dead corners are thoroughly cleaned, the wafer pollution risk is reduced, and the product quality is improved. Therefore, the use effect of the reaction chamber is enhanced, the product performance and the yield are remarkably improved, and the production process is optimized.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a reaction chamber and thin film deposition equipment. Background Art

[0002] In the precision process of semiconductor manufacturing, the reaction chamber of the thin film deposition equipment is a core component, and its performance is directly related to the production quality and yield of the wafer. However, the traditional reaction chamber has significant drawbacks in the design of the transmission channel 1. For example, during the deposition process, due to the lack of targeted protective measures, the transmission channel 1 cannot effectively isolate the gaseous reactants, resulting in disordered deposition of unnecessary thin films in the channel, which not only reduces the operating efficiency of the equipment, but also generates a large number of particles. In the wafer transmission and cleaning process, the transmission channel 1 has hard-to-reach cleaning dead corners, and residual particles cannot be completely removed. These particles can easily fall onto the wafer surface during the transmission process, causing wafer contamination, thereby affecting product performance and yield. Summary of the Invention

[0003] Embodiments of the present invention provide a reaction chamber and a thin film deposition device, which are intended to achieve volume adjustment of the reaction chamber, thereby enhancing the use effect of the reaction chamber.

[0004] A reaction chamber according to an embodiment of the present invention is characterized by comprising:

[0005] A transmission channel, wherein the transmission channel is provided with a gap;

[0006] An adjustment component includes an adjustment plate that fits in the notch and is movably arranged.

[0007] Furthermore, the adjustment assembly also includes a first driving unit connected to the adjustment plate, and the first driving unit is arranged below the transmission channel and is used to drive the adjustment plate to rise and fall.

[0008] Furthermore, the adjustment plate rises in the deposition state and fits into the gap of the transmission channel; the adjustment plate descends in the cleaning state and separates from the transmission channel.

[0009] Furthermore, the notch is an arc-shaped notch, the adjustment plate is an arc-shaped plate, and the arc of the arc-shaped notch is the same as that of the arc-shaped plate.

[0010] Furthermore, the adjustment plate is made of ceramic material.

[0011] Furthermore, the first driving unit includes a first driving motor and a first connecting rod provided between the first driving motor and the adjustment plate.

[0012] Furthermore, the reaction chamber further includes a heating disk and a second driving unit connected to the heating disk, and the second driving unit includes a second driving motor and a second connecting rod provided between the second driving motor and the heating disk.

[0013] Furthermore, the second drive motor and the first drive motor are the same motor, or the second drive motor and the first drive motor are different motors.

[0014] Furthermore, when the second drive motor and the first drive motor are the same motor, a telescopic rod is provided between the first drive motor and the first connecting rod.

[0015] An embodiment of the present invention further provides a thin film deposition device, comprising a reaction chamber as described in any one of the above items.

[0016] Embodiments of the present invention provide a reaction chamber and thin film deposition equipment. The reaction chamber includes: a transmission channel having a notch; and an adjustment assembly including a movable adjustment plate that fits within the notch. The embodiment of the present invention switches the transmission channel between closed and open states through the movable control of the adjustment plate, thereby adjusting the volume of the reaction chamber. This effectively isolates gaseous reactants, reduces disordered thin film deposition, improves equipment operating efficiency, ensures thorough cleaning of blind spots, reduces the risk of wafer contamination, and thus enhances the performance of the reaction chamber, significantly improving product performance and yield, and optimizing the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 A schematic structural diagram of a reaction chamber provided in an embodiment of the present invention;

[0019] Figure 2 Another structural schematic diagram of a reaction chamber provided by an embodiment of the present invention;

[0020] Figure 3 A first exemplary diagram of a reaction chamber provided in an embodiment of the present invention;

[0021] Figure 4 A second exemplary diagram of a reaction chamber provided in an embodiment of the present invention;

[0022] Figure 5Another structural schematic diagram of a reaction chamber provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0024] It will be understood that when used in this specification and the appended claims, the terms “comprises” and “comprising” indicate the presence of described features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0025] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the present invention. As used in the specification and appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly indicates otherwise.

[0026] It should be further understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0027] See below Figures 1 to 4 , an embodiment of the present invention provides a reaction chamber, comprising:

[0028] A transmission channel 1, wherein the transmission channel 1 is provided with a gap 11;

[0029] The adjusting component 2 includes an adjusting plate 21 that fits in the notch 11 and is movably arranged.

[0030] In this embodiment, the transmission channel 1 is switched between closed and open states by controlling the movement of the regulating plate 21. For example, Figure 3 and Figure 4As shown, when the adjustment plate 21 fits into the notch 11 of the transmission channel 1, the transmission channel 1 is closed, and when the adjustment plate 21 is separated from the notch 11 of the transmission channel 1, the transmission channel 1 is opened, so that the volume of the reaction chamber can be adjusted. In this way, the gaseous reactants can be effectively isolated when needed, the disordered deposition of thin films can be reduced, the operating efficiency of the equipment can be improved, and the cleaning dead corners can be ensured to be thoroughly cleaned, reducing the risk of wafer contamination, thereby enhancing the use effect of the reaction chamber, and significantly improving product performance and yield, and optimizing the production process.

[0031] In one embodiment, the adjustment assembly 2 further includes a first driving unit 22 connected to the adjustment plate 21 . The first driving unit 22 is disposed below the transmission channel 1 and is configured to drive the adjustment plate 21 to move upward or downward.

[0032] In this embodiment, the adjustment plate 21 is driven up and down by the first driving unit 22, so that the adjustment plate 21 is precisely matched at the notch 11, thereby making the transmission channel 1 more sealed and effectively preventing gas leakage. Alternatively, the adjustment plate 21 is moved away from the transmission channel 1 to increase the volume of the space, thereby achieving flexible regulation of the internal space of the reaction chamber and ensuring precise control of the reaction conditions. In other embodiments, the adjustment plate 21 can also be driven to move in the horizontal direction by the first driving unit 22, which can also achieve the corresponding effect, or the first driving unit 22 can be set above the transmission channel 1 so that the adjustment plate 21 is matched with the notch 11 when it descends and separated from the transmission channel 1 when it rises. In addition, the inclination angle of the adjustment plate 21 can also be controlled by the first driving unit 22 to further optimize the gas flow path, improve the reaction uniformity, ensure the stability of the environment in the reaction chamber, and improve production efficiency and product quality.

[0033] In one embodiment, the adjustment plate 21 rises in the deposition state and fits into the notch 11 of the transmission channel 1 ; the adjustment plate 21 descends in the cleaning state and separates from the transmission channel 1 .

[0034] In this embodiment, during deposition, it is necessary to ensure that the reaction gas and plasma are concentrated in the reaction chamber and do not penetrate into the transmission channel 1, so the adjustment plate 21 is raised, as shown in FIG. Figure 3 As shown, when the regulating plate 21 is raised, it can effectively close the transmission channel 1, prevent the escape of gaseous reactants, prevent the deposition of thin films in the transmission channel 1, and ensure the purity of the deposition process; in the cleaning state, the regulating plate 21 is lowered, as shown Figure 4As shown, this fully opens the channel, reducing dead zones and facilitating thorough cleaning of the chamber interior, removing residual particles, reducing contamination, and improving equipment maintenance efficiency. Furthermore, when transferring wafers, the robot arm must reach into the reaction chamber to remove the wafers, so the adjustment plate 21 must also be lowered to ensure unobstructed transfer channel 1. This design not only extends the equipment's service life but also significantly reduces maintenance costs, ensuring the continuity and stability of the production process.

[0035] In one embodiment, the notch 11 is an arc-shaped notch 11, and the adjustment plate 21 is an arc-shaped plate, with the arc-shaped notch 11 and the arc-shaped plate having the same curvature. Based on the arc-shaped notch 11, the adjustment plate 21 is also configured as an arc. This not only enhances the fit between the adjustment plate 21 and the transmission channel 1, but also optimizes airflow distribution and improves the efficiency of the reaction chamber. During operation, the arc-shaped design effectively reduces resistance and ensures smooth raising and lowering of the adjustment plate 21.

[0036] In practice, the specifications of the regulating plate 21 (such as width and length) will be adjusted to suit the design of the different chambers, ensuring a non-contact, sealed reaction chamber. Non-contact here means that there is less than 1mm of clearance between the baffle and the chamber / pumping ring, allowing for purge gas to create a gas seal.

[0037] In one embodiment, the adjustment plate 21 is made of ceramic. Using a ceramic adjustment plate 21 effectively prevents gaseous reactants from depositing on the adjustment plate 21, avoiding the formation of unnecessary thin films. Furthermore, ceramics have high hardness and wear resistance, which can reduce particle generation, improve equipment efficiency, and improve product yield. Of course, in other embodiments, adjustment plates 21 made of other materials may also be used. Furthermore, the surface of the adjustment plate 21 may be coated with an anti-stick coating to further reduce the probability of gaseous reactants adhering to the plate and ensure the cleanliness of the reaction chamber.

[0038] In one embodiment, the first driving unit 22 includes a first driving motor 221 and a first connecting rod 222 disposed between the first driving motor 221 and the adjustment plate 21 .

[0039] The first drive motor 221 precisely controls the displacement of the first connecting rod 222 to achieve precise raising and lowering of the adjustment plate 21, thereby optimizing the environmental parameters within the reaction chamber. The first connecting rod 222 can be made of high-strength material to ensure effective transmission of driving force. Furthermore, a limiter mechanism can be provided to prevent excessive raising and lowering of the adjustment plate 21, ensuring safe operation within a predetermined range. The limiter mechanism should be designed to match the precision of the fit between the adjustment plate 21 and the first connecting rod 222 to ensure the stability and reliability of the entire system. This refined structural design significantly improves the operational efficiency and safety of the reaction chamber. The first drive motor 221 can be a stepper motor, servo motor, or DC motor, depending on the specific application scenario and control accuracy requirements. Stepper motors enable precise step control and are suitable for applications with strict requirements for the raising and lowering position of the adjustment plate. Servo motors offer high control accuracy and dynamic response capabilities, making them suitable for applications requiring fast response and precise positioning. DC motors have the advantages of simple structure and low cost, making them suitable for applications with less demanding control accuracy. In practical applications, the appropriate motor type can be selected according to the specific requirements of the reaction chamber to achieve the best driving effect.

[0040] Combine Figure 5 In one embodiment, the reaction chamber further includes a heating plate 3 and a second drive unit 31 connected to the heating plate 3. The second drive unit 31 includes a second drive motor 311 and a second connecting rod 312 disposed between the second drive motor 311 and the heating plate 3. The second connecting rod 312 can be made of a high-temperature resistant material to ensure stable operation in a high-temperature environment. The second drive motor 311 can adjust the distance between the heating plate 3 and other structures in the reaction chamber (such as a spray device) by precisely controlling the displacement of the second connecting rod 312 to adapt to different reaction requirements.

[0041] Furthermore, the second drive motor 311 and the first drive motor 221 are the same motor, or the second drive motor 311 and the first drive motor 221 are different motors.

[0042] The present embodiment is configured by a shared motor or an independent motor, which can flexibly respond to various process requirements and improve the adaptability of the system. When a shared motor is used, the system structure can be simplified, costs can be reduced, and centralized control can be facilitated to improve operational convenience. When an independent motor is used, the adjustment plate 21 and the heating plate 3 can be accurately controlled respectively to enhance the independence and flexibility of the operation and ensure the stability and efficiency of the reaction process. Through this design, not only the efficient operation of the equipment is achieved, but also the accurate control of the reaction process is ensured, further improving the quality and production efficiency of the product. Regardless of whether the same motor or different motors are used, it is necessary to ensure that the two work together to accurately control the temperature and airflow in the reaction chamber to meet the diverse process requirements and improve the overall reaction efficiency.

[0043] In one embodiment, when the second driving motor 311 and the first driving motor 221 are the same motor, a telescopic rod is provided between the first driving motor 221 and the first connecting rod 222 .

[0044] When the adjustment plate 21 and the heating plate 3 share a common drive motor, the drive motor simultaneously drives the adjustment plate 21 and the heating plate 3 to rise and fall. However, since the elevation distances of the adjustment plate 21 and the heating plate 3 differ, a telescopic rod is provided in this embodiment to compensate for this difference. The telescopic rod also provides a controllable height adjustment of the adjustment plate 21. That is, when driven by the same drive motor, the telescopic rod retracts and retracts according to actual needs, ensuring that the adjustment plate 21 and the heating plate 3 can each reach their designated positions. The design of the telescopic rod must consider its telescopic range, precision, and durability to ensure stable operation of the reaction chamber under various process conditions.

[0045] Furthermore, since the lifting height of the adjustment plate 21 can be controlled by the telescopic rod, in actual application, the positions of the adjustment plate 21 and the heating plate 3 can be flexibly adjusted according to different process requirements to achieve the best reaction effect.

[0046] Of course, when the adjustment plate 21 and the heating plate 3 are driven by different drive motors, after setting the lifting height, there is no need to specially set up a telescopic rod, that is, the first drive component corresponding to the adjustment plate 21 and the second drive component corresponding to the heating plate 3 operate independently without interfering with each other.

[0047] An embodiment of the present invention further provides a thin film deposition apparatus including the above-described reaction chamber. By employing the above-described reaction chamber, the thin film deposition apparatus can precisely control the height of the baffle and the heating plate 3 at different process stages, ensuring uniform thin film deposition, effectively reducing particle contamination, and improving wafer quality.

[0048] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referred to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

[0049] It should also be noted that, in this specification, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

Claims

1. A reaction chamber, characterized in that: include: A transmission channel, wherein the transmission channel is provided with a gap; An adjustment component includes an adjustment plate that fits in the notch and is movably arranged.

2. The reaction chamber according to claim 1, characterized in that The adjustment assembly further includes a first driving unit connected to the adjustment plate. The first driving unit is disposed below the transmission channel and is used to drive the adjustment plate to move up and down.

3. The reaction chamber according to claim 2, characterized in that The regulating plate rises in a deposition state and fits into the notch of the transmission channel; the regulating plate descends in a cleaning state and separates from the transmission channel.

4. The reaction chamber according to claim 1, wherein: The notch is an arc-shaped notch, the adjustment plate is an arc-shaped plate, and the arc of the arc-shaped notch is the same as that of the arc-shaped plate.

5. The reaction chamber according to claim 1, wherein: The adjustment plate is made of ceramic material.

6. The reaction chamber according to claim 2, characterized in that The first driving unit includes a first driving motor and a first connecting rod disposed between the first driving motor and the adjustment plate.

7. The reaction chamber according to claim 6, characterized in that The reaction chamber further includes a heating disk and a second driving unit connected to the heating disk, wherein the second driving unit includes a second driving motor and a second connecting rod disposed between the second driving motor and the heating disk.

8. The reaction chamber according to claim 7, characterized in that: The second drive motor and the first drive motor are the same motor, or the second drive motor and the first drive motor are different motors.

9. The reaction chamber according to claim 8, characterized in that: When the second drive motor and the first drive motor are the same motor, a telescopic rod is provided between the first drive motor and the first connecting rod.

10. A thin film deposition device, characterized in that: The method comprises the reaction chamber according to any one of claims 1 to 9.

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