Special ground thermal control equivalent device testing method applied to flat plate type satellite

Abstract

The invention discloses a method for testing a special ground thermal control equivalent device applied to a flat plate type satellite. The method comprises the following steps: providing an equivalent device, and a temperature measurement interface J1, a network interface J2 and a control interface J3 which are connected with the equivalent device; the whole satellite is powered on by a ground ATE power supply or a solar simulation square matrix; the equivalent device, the temperature measurement interface J1, the wire network interface J2 and the control interface J3 are used for carrying out a whole satellite temperature telemetering test and a thermal control state and thermal control instruction test; confirming the off-state of a whole-satellite heater and de-electrifying the whole satellite; after the equivalent device is accessed, the semaphore completes the uplink and downlink of a thermal control telemetering remote control instruction and the processing and forwarding of test data through the management server, the launch console and the intelligent test equipment, so that the function test of the thermal control subsystem in a desktop joint test stage is realized, and the system and the method can be applied to the analog signal access of a flat plate type satellite.

Description

Technical Field

[0001] The present invention relates to the field of satellite ground test design, and in particular to a test method for a special ground thermal control equivalent device applied to a flat-plate satellite. Background Art

[0002] The thermal control subsystem consists of temperature sensors, active heaters, heat pipes, multilayer insulation components, thermal control coatings, thermal grease, thermal insulation gaskets, and electrical connectors. Its function is to ensure that all satellite components remain within their normal operating temperature ranges before launch, during the ascent phase, during on-orbit testing, during normal on-orbit operation, in safe hold mode, and until the end of their lifespan. Furthermore, unpowered components remain within their normal on-orbit storage temperature ranges. Using a real thermal control system would require authentic flat-panel satellite structural fixtures, heat pipes, coatings, and fluid thermal grease. These components are large, complex to operate, and involve numerous testing processes. There are no matching scenarios in the ground test environment, making them difficult to test. Summary of the Invention

[0003] In view of the shortcomings of the existing technology, the present invention provides a ground thermal control equivalent device testing method applied to flat-panel satellites. The thermal control equivalent device testing method of the present invention can be applied to analog signal access of flat-panel satellites.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] A method for testing a ground-based thermal control equivalent device for a flat-panel satellite comprises the following steps:

[0006] Step S1: Provide an equivalent device, and a temperature measurement interface J1, a wire network interface J2, and a control interface J3 connected to the equivalent device; provide a set of ground thermal control equivalent devices, including a thermal control heating equivalent module, a thermistor equivalent module, and a digital sensor equivalent module, and connect the corresponding temperature measurement interface J1, the wire network interface J2, and the control interface J3, and realize the connection between the equivalent device and the satellite through the J1 temperature measurement cable, the J2 wire network, and the J3 heating cable.

[0007] Step S2: The ground ATE power supply or the solar simulation array powers on the entire satellite; the ground ATE power supply or the solar simulation array powers on the entire satellite and starts the system.

[0008] Step S3: The satellite's temperature telemetry test, as well as the thermal control status and thermal control command test, are conducted through the equivalent device, temperature measurement interface J1, wire network interface J2, and control interface J3. Based on the connected equivalent device and its corresponding interface, a comprehensive satellite temperature telemetry test is conducted, with real-time monitoring and analysis of temperature data from the equivalent device's 30 temperature measurement and telemetry channels. Simultaneously, a thermal control status and thermal control command test is conducted to verify the heating status, heater on / off command execution, and power output of the equivalent device's 27 heating channels. During this process, signals are routed through the management server, control console, and intelligent test equipment, enabling efficient transmission and interaction of thermal control telemetry and remote control commands, as well as precise processing and rapid forwarding of test data, completing the functional testing of the thermal control subsystem during the desktop joint testing phase.

[0009] Step S4: Confirm that all satellite heaters are off and power is removed from the satellite. After access via the equivalent device, signals are routed through the management server, the control console, and the intelligent test equipment to complete the uplink and downlink of thermal control telemetry and remote control commands, as well as the processing and forwarding of test data, thereby completing the functional testing of the thermal control subsystem during the desktop joint test phase. After confirming that all heaters on the satellite are off, the entire satellite is safely powered off via the ground-based ATE power supply or the solar simulation array, concluding the test process.

[0010] Further preferably, the temperature measurement interface J1, the wire network interface J2, and the control interface J3 are each provided with an electrical connector interface;

[0011] Further preferably, the equivalent device is provided with three electrical connector interfaces connected to the temperature measurement interface J1, the wire network interface J2, and the control interface J3 in sequence; the three electrical connector interfaces on the equivalent device correspond to the thermal control heating equivalent module, the thermistor equivalent module, and the digital sensor equivalent module, respectively;

[0012] Further preferably, the temperature measurement interface J1 is used to simulate the temperature measurement of the MF501 thermistor; the control interface J3 is used to control the on and off of the heating circuit; and the wire network interface J2 is used for actual temperature measurement. In other words, the equivalent device integrates a thermal control heating equivalent module, a thermistor equivalent module and a digital sensor equivalent module. Three electrical connector interfaces are provided on the equivalent device, which are connected to the temperature measurement interface J1, the wire network interface J2 and the control interface J3 in sequence. Through the J1 temperature measurement cable, the J2 wire network and the J3 heating cable, these electrical connector interfaces are used to achieve a stable connection between the equivalent device and the satellite. These three electrical connector interfaces correspond to different functional modules of the equivalent device, namely the thermal control heating equivalent module, the thermistor equivalent module and the digital sensor equivalent module, and each has a specific function. Among them, the temperature measurement interface J1 is used to simulate the temperature measurement function of the MF501 thermistor, and can simulate the temperature measurement situation of this type of thermistor in actual work; the control interface J3 is used to control the on and off of the heating circuit, and can accurately open or close the heating circuit; the one-wire network interface J2 is used for actual temperature measurement and can obtain real temperature data.

[0013] Further preferably, the correctness of the on-off response of the thermal control heating control circuit is verified by the LED indicator light of the thermal control heating equivalent module, and the correctness of the power response of the thermal control heating control circuit is verified by the power resistor; the correctness of the response of the thermal control thermistor measurement circuit is verified by the fixed resistance resistor of the thermistor equivalent module, and the correctness of the response of the thermal control digital temperature sensor measurement circuit is verified by the DS18B20 temperature sensor of the digital sensor equivalent module; the specific temperature telemetry test: the temperature measurement interface J1 is used to simulate the MF501 thermistor for temperature measurement, and the actual temperature data obtained by the wire network interface J2 is combined to monitor and analyze the temperature data of the 30 temperature telemetry channels on the equivalent device in real time. At the same time, the correctness of the response of the thermal control thermistor measurement circuit is verified by the fixed resistance resistor in the thermistor equivalent module. In addition, the correctness of the response of the thermal control digital temperature sensor measurement circuit is verified by using the DS18B20 temperature sensor in the digital sensor equivalent module.

[0014] Thermal Control Status and Instruction Testing: Control interface J3 is used to control the on / off state of the heating circuit, verifying the heating status, heater on / off instruction execution, and power output of the 27 heating channels on the equivalent device. Specifically, the LED indicator on the thermal control heating equivalent module is used to verify the correct on / off response of the thermal control heating circuit. This involves observing whether the on / off state of the indicator matches the on / off state of the heating circuit. Furthermore, a power resistor is used to verify the correct power response of the thermal control heating circuit, ensuring that the power output of the heating circuit meets expectations under different states.

[0015] During the entire testing process, signals are transmitted through the management server, control console and intelligent testing equipment to achieve efficient uplink and downlink transmission and interaction of thermal control telemetry and remote control commands, as well as accurate processing and rapid forwarding of test data, completing the functional testing of the thermal control subsystem in the desktop joint test phase.

[0016] Further preferably, the equivalent device is a thermal control equivalent device. This device, via temperature measurement interface J1 (J1 temperature measurement), works with the satellite integrated electronic baseboard to simulate the MF501 fixed resistor thermal sensor for measurement. It also works with the satellite integrated electronic baseboard via wired network interface J2 (J2 wired network) to measure actual temperature using a digital temperature sensor DS18B20. The thermal control equivalent device receives heating instructions JROC1-JROC30 from the satellite integrated electronic baseboard via control interface J3 (J3 heating), activating heating. The LEDs in these circuits illuminate. If the thermal control equivalent device malfunctions, power can be disconnected from the satellite integrated electronic end. The thermal control equivalent device receives heating instructions JROC1-JROC30 from the satellite integrated electronic baseboard via control interface J3. Upon receiving these instructions, the corresponding heating circuit is activated, illuminating the LEDs in these circuits. By observing the LEDs' on / off status, the correctness of the thermal control heating circuit's on / off response can be visually verified. In addition, power resistors were used to verify the correctness of the thermal control heating circuit's power response, ensuring the heating circuit's power output met expectations under different conditions. Throughout the testing process, signals passed through the management server, control console, and intelligent test equipment, enabling efficient uplink and downlink transmission and interaction of thermal control telemetry and remote control commands, as well as precise processing and rapid forwarding of test data, completing the functional testing of the thermal control subsystem during the desktop joint testing phase.

[0017] The present invention has the following beneficial effects:

[0018] The present invention proposes a dedicated ground-based thermal control equivalent device consisting of a thermal control equivalent device and three cable assemblies. Through three unique electrical connector interfaces, in conjunction with corresponding modules and cables, it achieves functional simulation of the satellite thermal control subsystem during ground testing. This device, unlike traditional satellite ground test equipment, provides a new structural solution for satellite thermal control subsystem testing. It integrates multiple functions, such as thermal control heating equivalent, thermistor equivalent, and digital sensor equivalent, into the same device, enabling simultaneous performance of multiple tests, including temperature telemetry, thermal control status, and instructions. This simplifies the testing process, improves testing efficiency, and achieves a breakthrough in functional integration in the field of satellite ground-based thermal control testing. A complete set of testing methods for flat-panel satellite-specific ground-based thermal control equivalent devices is constructed, clarifying steps such as device connection, system power-up, functional testing, and power-down. This standardizes the testing process for the thermal control subsystem during the desktop joint testing phase, providing a standardized and systematic operating guide for ground-based testing of satellite thermal control subsystems and filling the gaps in specific testing processes and methods in this field.

[0019] Precise Simulation and Comprehensive Testing: The thermal control equivalent device connects to the temperature measurement interface J1, the wire network interface J2, and the control interface J3 via three electrical connectors. Combined with various functional modules, it accurately simulates the MF501 thermistor temperature measurement, implements actual DS18B20 temperature measurement, and controls the heating circuit. It can fully test the satellite's 30 temperature measurement and telemetry channels and 27 heating channels, fully covering the thermal control subsystem's functionality and ensuring that all satellite components remain within the normal temperature range throughout their lifecycle.

[0020] Intuitive monitoring and reliable verification: The LED indicator of the thermal control heating equivalent module can intuitively display the on / off state of the heating circuit, and verify the power response in combination with the power resistor; the thermistor equivalent module and the digital sensor equivalent module respectively verify the corresponding measurement circuit response, ensuring the functional correctness and reliability of the thermal control subsystem from multiple dimensions, and ensuring that the ground test results truly reflect the performance of the satellite thermal control system.

[0021] Safe, convenient and flexible layout: The electrical connector's anti-incorrect plug-in design prevents damage to the onboard thermal control circuit due to operational errors. The thermal control equivalent device adopts a small, lightweight H-shaped rack-mounted aluminum alloy chassis, which is convenient for reasonable layout according to the position of the entire satellite, reducing desktop space. In the event of an abnormality, the power can be cut off from the satellite's integrated electronic terminal to ensure test safety.

[0022] Efficient interaction and function realization: Through the management server, the control console, and the intelligent test equipment, the uplink and downlink of thermal control telemetry and remote control commands and the test data processing and forwarding are realized. During the desktop joint test phase, the real power supply path and environment of the satellite thermal control subsystem are simulated, and the functional test of the thermal control subsystem is completed efficiently to ensure the coverage of ground tests and provide strong support for the safety, reliability and stability of the satellite's in-orbit power supply.

[0023] In order to more clearly illustrate the structural features and effects of the present invention, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the principle of a test method for a flat-panel satellite-specific ground thermal control equivalent device mentioned in the present invention;

[0025] Figure 2 This is the principle diagram of the control interface J3 mentioned in the present invention controlling the on / off of the heating circuit;

[0026] Figure 3 This is a schematic diagram of the actual temperature measurement of the one-line network interface J2 provided by the present invention, where 1#\2#\3# represent the one-line network temperature measurement channels;

[0027] Figure 4 This is a schematic diagram of the configuration principle of the control console provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0028] The present invention will be further described below with reference to the accompanying drawings and related knowledge, and described clearly and completely. Obviously, the described applications are only part of the embodiments of the present invention, rather than all of the embodiments.

[0029] Reference Figure 1-Figure 4 As shown, a test method for a flat-panel satellite-specific ground thermal control equivalent device of the present invention includes the following steps:

[0030] Step S1: providing an equivalent device, and a temperature measurement interface J1, a wire network interface J2, and a control interface J3 connected to the equivalent device; the temperature measurement interface J1, the wire network interface J2, and the control interface J3 are each provided with an electrical connector interface, and the equivalent device is provided with three electrical connector interfaces that are sequentially connected to the temperature measurement interface J1, the wire network interface J2, and the control interface J3; the three electrical connector interfaces on the equivalent device correspond to a thermal control heating equivalent module, a thermistor equivalent module, and a digital sensor equivalent module, respectively;

[0031] Step S2: The ground ATE power supply or the solar simulation array powers on the entire satellite;

[0032] Step S3: The temperature telemetry test of the entire satellite and the thermal control status and thermal control instruction test are performed through the equivalent device, the temperature measurement interface J1, the wire network interface J2 and the control interface J3; the temperature measurement interface J1 is used to simulate the temperature measurement of the MF501 thermistor; the control interface J3 is used to control the on / off of the heating circuit; and the wire network interface J2 is used for actual temperature measurement.

[0033] Step S4: Confirm that the heater of the entire satellite is off and power off the entire satellite; after access through the equivalent device, the signal quantity completes the uplink and downlink of the thermal control telemetry remote control instructions and the processing and forwarding of the test data through the management server, the control console, and the intelligent test equipment, thereby realizing the functional test of the thermal control subsystem in the desktop joint test phase, and verifies the correctness of the on-off response of the thermal control heating control circuit through the LED indicator light of the thermal control heating equivalent module and the correctness of the power response of the thermal control heating control circuit through the power resistor; verifies the correctness of the response of the thermal control thermistor measurement circuit through the fixed resistance resistor of the thermistor equivalent module, and verifies the correctness of the response of the thermal control digital temperature sensor measurement circuit through the DS18B20 temperature sensor of the digital sensor equivalent module. A total of 30 temperature measurement and telemetry channels and 27 heating channels are arranged on the equivalent device.

[0034] Example 1, with reference to Figure 1-Figure 4 As shown, a test method for a flat-panel satellite-specific ground thermal control equivalent device of the present invention includes the following steps:

[0035] Step S1: Provide an equivalent device, and a temperature measurement interface J1, a wire network interface J2 and a control interface J3 connected to the equivalent device; Figure 1 As shown in the figure, this design can realize the functional test of the thermal control subsystem during the satellite joint test phase, evaluate the rationality of the thermal design, and ensure the process test coverage during the satellite joint test phase.

[0036] Furthermore, after the equivalent device is connected, the satellite is powered by the ground ATE power supply or the solar simulation array, and the semaphore is used to complete the uplink and downlink of thermal control telemetry and remote control commands and the processing and forwarding of test data through the management server, the control console, and the intelligent test equipment, thereby realizing the functional test of the thermal control subsystem in the desktop joint test phase. In other words, after the thermal control equivalent device is connected to the satellite system, the ground ATE power supply or the solar simulation array provides power support for the satellite. On this basis, the semaphore completes the two-way transmission of thermal control telemetry and remote control commands, as well as the processing and forwarding of test data with the help of the management server, the control console and the intelligent test equipment. Through this series of processes, the satellite's in-orbit operation status is accurately simulated, and a comprehensive functional test of the thermal control subsystem in the desktop joint test phase is realized, effectively verifying the power supply performance, command response and data interaction capabilities of the thermal control system, and ensuring the reliability and stability of the satellite thermal control subsystem in actual operation.

[0037] Reference Figure 1 As shown, the other ends of the temperature measurement interface J1, the wire network interface J2 and the control interface J3 are respectively connected to the satellite integrated electronic baseboard, and combined with the equivalent device in the present invention, the analog signal access applied to the flat-panel satellite is realized.

[0038] In the present invention, the thermal control equivalent device is a ground temperature measuring device with simple functions and easy operation, which belongs to the execution device. The thermal control equivalent device has a total of 3 electrical connector interfaces, refer to Figure 1 As mentioned above, the three electrical connector interfaces are J36A-62ZK, J36A-62ZK and J36A-9ZK, and they correspond to the thermal control heating equivalent module, thermistor equivalent module and digital sensor equivalent module respectively. The selection of the electrical connector has an anti-misconnection design to prevent operational errors from causing damage to the on-board thermal control circuit.

[0039] In the present invention, the temperature measurement interface J1, the line network interface J2, and the control interface J3 are respectively provided with an electrical connector interface. Figure 1 As shown, they are J36A-62TJ, J36A-62TJ and J36A-9TJ, and a total of 3 electrical connector interfaces are set corresponding to the thermal control equivalent device.

[0040] In the present invention, the equivalent device includes front and rear panels, an internal printed circuit board (PCBA), and a power resistor. The front panel has 6*5=30 LED lights, and the internal printed circuit board (PCBA) is mounted on the front panel. The printed circuit board has pads for inserting LED lights and power resistor pads. The LED lights are connected in series with a 1.5K resistor and then connected to the two ends of the power resistor through open wires to form a heating circuit for indicating whether the heating circuit is on or off.

[0041] In the present invention, the temperature measurement interface J1 (J36A-62ZK2B panel seat hole) is used to simulate the MF501 temperature measurement remote, refer to the MF501 thermistor graduation table shown in Table 1;

[0042] Table 1

[0043] temperature resistance temperature resistance temperature resistance -40 203764.5 -2 19159.5 36 3091.1 -39 189775.4 -1 18152.0 37 2962.8 38 176843.6 0 17203.7 38 2840.5 -37 164882.2 1 16310.8 39 2721.0 -36 153812.2 2 15469.8 40 2612.9 -35 143561.3 3 14677.4 41 2507.0 -34 134063.8 4 13930.4 42 2406.0 -33 125259.4 5 13226.0 43 2309.5 -32 117093.1 6 12561.6 44 2217.5 -31 109514.6 7 11934.5 45 2129.7 30 102477.8 8 11342.6 46 2045.8 -29 95940.7 9 10783.6 47 1965.7 -28 89864.5 10 10255.6 48 1889.1 -27 84213.8 11 9756.6 49 1816.0 -26 78956.3 12 9281.9 50 1746.1 -25 74062.1 13 8838.8 51 1679.3 -24 69503.7 14 8416.8 52 1615.3 -23 65256.2 15 8017.5 53 1554.2 -22 61296.3 16 7639.5 54 1495.7 -21 57602.8 17 7281.6 55 1439.7 -20 54156.1 18 6942.6 56 1386.1 -19 50938.3 19 6621.3 57 1334.8 -18 47932.7 20 6316.8 58 1285.7 -17 45124.0 21 6028.1 59 1238.7 -16 42498.2 22 5754.3 60 1193.6 -15 40042.2 23 5494.5 61 1150.4 -14 37744.0 24 5248.0 62 1108.9 -13 35592.5 25 5013.9 63 1069.2 -12 33577.4 26 4791.7 64 1031.2 -11 31689.1 27 1580.6 65 994.7 -10 29919.6 28 4380.0 66 959.6 -9 28259.9 29 4189.3 67 926.0 -8 26702.9 30 4008.1 68 893.7 -7 25241.4 31 3835.7 69 862.8 -6 23869.2 32 3671.7 70 833.0 -5 22580.3 33 3515.7 -4 21369.1 34 3367.2 -3 20230.4 35 3225.7

[0044] In the present invention, the control interface J3 (J36A-62ZK2B panel seat hole) is used to control the on-off of the heating circuit, refer to Figure 2 Shown is the schematic diagram of the on-off control principle of the heating circuit.

[0045] In the present invention, reference is made to Figure 3 As shown, the one-wire network interface J2 (J36A-9ZK2B panel seat hole) is used for actual temperature measurement.

[0046] In the present invention, reference is made to Figure 1 As shown, the starting plug model, plug label, and end plug model of the temperature measurement interface J1 and the control interface J3 are shown in Table 2 below;

[0047] Table 2

[0048]

[0049]

[0050]

[0051]

[0052] The starting plug model, plug label, and end plug model of the first-line network interface J2 are shown in Table 3 below;

[0053] Table 3

[0054]

[0055] In the present invention, the functional test of the thermal control subsystem in the satellite joint test phase can be realized through design, the rationality of the thermal design can be assessed, and the process test coverage of the satellite joint test phase can be guaranteed; specifically: the correctness of the on-off response of the thermal control heating control circuit is verified by the LED indicator light of the equivalent device thermal control heating equivalent module; the correctness of the power response of the thermal control heating control circuit is verified by the power resistor of the equivalent device thermal control heating function equivalent module; the correctness of the response of the thermal control thermistor measurement circuit is verified by the fixed resistance resistor of the equivalent device thermistor equivalent module; and the correctness of the response of the thermal control digital temperature sensor measurement circuit is verified by the DS18B20 temperature sensor of the equivalent device digital sensor equivalent module.

[0056] In the present invention, the thermal control equivalent device test process is shown in Table 4;

[0057] Table 4

[0058] Serial number Testing Process 1. Ground analog array / ATE power supply to power up the entire satellite 2. Whole-satellite temperature telemetry test 3. Thermal control status and thermal control instruction test 4. Confirm that the whole star heater is off 5. Ground analog array / ATE power supply to power down the entire satellite

[0059] and reference Figure 4 The figure shows the configuration principle diagram of the control console provided by an embodiment of the present invention.

[0060] A specific application example is provided below:

[0061] Application Example 1

[0062] A test method for a flat-panel satellite-specific ground thermal control equivalent device. In this embodiment, the thermal control function test uses simulated components for both thermistors and electric heaters. Figure 1 The thermal control equivalent device is effectively connected to the satellite integrated electronic floor through cables J1, J2, and J3, so that the thermal control subsystem and the satellite form a test loop. The thermal control equivalent device test mainly includes the following contents:

[0063] Temperature telemetry test:

[0064] A total of 30 temperature measurement telemetry channels are arranged on the equivalent device. The specific telemetry channels and telemetry names are shown in Table 5. The satellite does not perform other operations. Observe the temperature telemetry data and record that the room temperature is 27 degrees in this state. The indicated temperature should be consistent with the expected telemetry value;

[0065] Table 5 Satellite thermal control temperature telemetry

[0066]

[0067]

[0068] Thermal control status and thermal control command test, a total of 27 heating channels are arranged on the equivalent device, and the specific heating code and heating name are shown in Table 6 Satellite thermal control heating status test switch;

[0069] Table 6 Satellite thermal control heating status test switch

[0070]

[0071]

[0072] The satellite thermal control command test and test results are shown in Table 7. The thermal control equivalent device test verifies that when the thermal control subsystem is in the temperature control state, the heater switch command is executed normally and the power output is normal, and the power supply voltage is stable at 42.2V±0.2V;

[0073] Table 7

[0074]

[0075]

[0076]

[0077] The present invention is applied to the test process of a flat-panel satellite-specific ground thermal control equivalent device, and fully simulates the actual power supply path and environment of the satellite thermal control subsystem during the desktop joint test phase, verifies the power supply function performance and control function of the thermal control subsystem, ensures the ground test coverage, and ensures the safety, reliability and stability of the satellite's on-orbit power supply.

[0078] The present invention provides a thermal control equivalent device with an integrated design. The equivalent device adopts a modular architecture and internally integrates three core functional units: a thermal control heating equivalent module, a thermistor equivalent module, and a digital sensor equivalent module. At the hardware interface level of the equivalent device, three special electrical connector interfaces with an anti-misplugging design are set, which are respectively connected one-to-one with the temperature measurement interface J1, the wire network interface J2, and the control interface J3. Stable communication is achieved between each interface through customized J1 temperature measurement cables, J2 wire network, and J3 heating cables. Among them, the temperature measurement interface J1 is equipped with a high-precision analog signal conversion circuit, which is specially used to simulate the temperature measurement characteristics of the MF501 thermistor; the control interface J3 has a built-in intelligent power control chip, which can accurately control the on and off of the heating circuit; the wire network interface J2 adopts a high-speed data transmission protocol to ensure the real-time and accurate transmission of the actual temperature measurement data. Through this innovative design of corresponding interfaces and modules, the thermal control equivalent device can accurately simulate various working conditions in the satellite thermal control subsystem test.

[0079] This invention features intelligent power startup, using a ground-based ATE power supply or a solar array as the satellite's power source. This system, based on an intelligent power management system, automatically powers on the entire satellite. This system monitors key parameters such as supply voltage and current in real time. Based on a pre-set power supply strategy, it automatically triggers the power supply process upon detecting that the satellite system meets power-on conditions, ensuring the entire satellite enters a safe and stable test-ready state.

[0080] The multi-dimensional precision testing in this invention conducts satellite temperature telemetry testing, as well as thermal control status and thermal control command testing, through the coordinated operation of the thermal control equivalent device and the temperature measurement interface J1, the first-line network interface J2, and the control interface J3. Temperature measurement verification: The temperature measurement interface J1 simulates the dynamic resistance changes of the MF501 thermistor. Combined with the 30 high-precision temperature measurement telemetry channels arranged on the equivalent device, the temperature of key parts of the satellite is monitored in real time. At the same time, a DS18B20 digital temperature sensor is connected through the first-line network interface J2 to achieve synchronous measurement of actual temperature. The two temperature measurement methods are mutually verified to ensure the accuracy and reliability of the temperature data.

[0081] Heating Control Verification: Control interface J3 receives JROC1-JROC30 heating commands from the satellite integrated electronic baseboard, driving the 27 heating channels within the thermal control and heating equivalent module. The module's LED indicator array visually displays the on / off status of each heating circuit. High-precision power resistors are used to monitor and calibrate the power output of each heating circuit in real time, verifying the correct on / off response and power response accuracy of the thermal control circuit under different commands.

[0082] Circuit response verification: During the test, the standard fixed-value resistor within the thermistor equivalent module was used to simulate the resistance characteristics of the thermistor under different temperature environments to verify the response accuracy of the thermal-control thermistor measurement circuit. The DS18B20 temperature sensor within the digital sensor equivalent module was used to comprehensively test the signal processing and data transmission capabilities of the thermal-control digital temperature sensor measurement circuit.

[0083] The present invention has safe and reliable testing. After completing all test items, the working status of all heaters in the entire satellite is comprehensively checked through the satellite integrated electronic system. After confirming that all heaters are in the off state, the ground ATE power supply or the solar simulation array gradually cuts off the power supply to the entire satellite according to the predetermined power-off procedure. At the same time, the built-in abnormal protection mechanism of the thermal control equivalent device can automatically trigger the power-off operation of the satellite integrated electronic terminal when an abnormal working condition of the equipment is detected, effectively ensuring the safety of the test equipment and the satellite system. In the entire test process, the signal quantity realizes the millisecond-level uplink and downlink transmission of thermal control telemetry and remote control commands, as well as the real-time processing and efficient forwarding of test data through the high-speed data transmission network composed of the management server, the control console, and the intelligent test equipment, ensuring the complete simulation of the actual operating conditions of the satellite thermal control subsystem during the desktop joint test phase, and realizing the comprehensive testing and verification of its functions.

[0084] This invention differs from the single-function design of traditional satellite thermal control test equipment. It integrates three functions: thermal control heating equivalent, thermistor equivalent, and digital sensor equivalent. It also achieves precise simulation testing through a unique interface and module design. It proposes multi-dimensional testing methods, such as combining simulated temperature measurement with actual temperature measurement, and using LED indicators and power resistors to collaboratively verify heating control circuits. It also builds an intelligent power supply and data transmission network. This testing method breaks the single verification model of traditional satellite thermal control testing and provides a new approach and method for ground testing of satellite thermal control subsystems.

[0085] The precise simulation capability of the present invention: through the precise simulation of the MF501 thermistor, the application of the DS18B20 digital temperature sensor and the precise control of the heating circuit, it is possible to highly restore the various working conditions of the satellite thermal control subsystem in actual operation. Compared with existing testing technologies, the test results are more accurate and reliable, and can provide more valuable data support for the design and optimization of the satellite thermal control system. Efficient testing process: The application of intelligent power supply startup and high-speed data transmission network greatly shortens the test time and improves the test efficiency. At the same time, the abnormal protection mechanism and anti-misinsertion design improve the safety and reliability of the test process and reduce the test cost and risk.

[0086] The testing method proposed in the present invention can comprehensively and accurately test the functions of the thermal control subsystem during the desktop joint test phase of satellite development, timely discover potential problems in the design and manufacturing process of the thermal control system, and effectively reduce the risks of satellite in-orbit operation. It is of great significance to improve the reliability and service life of the satellite, and provides new technical support for the development of satellite thermal control technology.

[0087] The technical principles of the present invention have been described above in conjunction with specific embodiments, which are merely preferred embodiments of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions based on the principles of the present invention fall within the scope of protection of the present invention. Those skilled in the art will be able to conceive of other specific embodiments of the present invention without inventive effort, and such methods will fall within the scope of protection of the present invention.

Claims

1. A test method for a flat-panel satellite dedicated ground thermal control equivalent device, characterized in that: The following steps are involved: Step S1: providing an equivalent device, and a temperature measurement interface J1, a wire network interface J2, and a control interface J3 connected to the equivalent device; Step S2: The ground ATE power supply or the solar simulation array powers on the entire satellite; Step S3: Conducting a temperature telemetry test of the entire satellite and a thermal control state and thermal control instruction test through the equivalent device, the temperature measurement interface J1, the wire network interface J2 and the control interface J3; Step S4: Confirm that the heater of the entire satellite is off and power off the entire satellite; after access through the equivalent device, the signal quantity completes the uplink and downlink of thermal control telemetry remote control instructions and the processing and forwarding of test data through the management server, the control console, and the intelligent test equipment, thereby realizing the functional test of the thermal control subsystem in the desktop joint test phase.

2. The method for testing a ground-based thermal control equivalent device for a flat-panel satellite according to claim 1, wherein: The temperature measurement interface J1, the wire network interface J2, and the control interface J3 are respectively provided with an electrical connector interface.

3. The method for testing a ground-based thermal control equivalent device for a flat-panel satellite according to claim 1, wherein: The equivalent device is provided with three electrical connector interfaces which are sequentially connected to the temperature measurement interface J1, the wire network interface J2 and the control interface J3.

4. The method for testing a ground-based thermal control equivalent device for a flat-panel satellite according to claim 3, wherein: The three electrical connector interfaces on the equivalent device correspond to the thermal control heating equivalent module, the thermistor equivalent module and the digital sensor equivalent module respectively.

5. The method for testing a ground-based thermal control equivalent device for a flat-panel satellite according to claim 4, wherein: The temperature measurement interface J1 is used to simulate the temperature measurement of the MF501 thermistor.

6. A method for testing a ground-based thermal control equivalent device for a flat-panel satellite as claimed in claim 5, characterized in that: The control interface J3 is used to control the on and off of the heating circuit.

7. The method for testing a ground-based thermal control equivalent device for a flat-panel satellite according to claim 6, wherein: The first-line network interface J2 is used for actual temperature measurement.

8. The method for testing a ground-based thermal control equivalent device for a flat-panel satellite according to claim 7, wherein: The LED indicator light of the thermal control heating equivalent module is used to verify the correctness of the on-off response of the thermal control heating control circuit, and the power resistor is used to verify the correctness of the power response of the thermal control heating control circuit; the fixed resistance resistor of the thermistor equivalent module is used to verify the correctness of the thermal control thermistor measurement circuit response, and the DS18B20 temperature sensor of the digital sensor equivalent module is used to verify the correctness of the thermal control digital temperature sensor measurement circuit response.

9. A method for testing a ground-based thermal control equivalent device for a flat-panel satellite as claimed in claim 8, characterized in that: A total of 30 temperature measurement and telemetry channels and 27 heating channels are arranged on the equivalent device.

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