Semiconductor packaging material pressure testing device

Abstract

The invention relates to the technical field of pressure testing, and provides a semiconductor packaging material pressure testing device which comprises a testing box body, probe testing equipment and wafer positioning equipment are arranged on the two sides of the interior of the testing box body respectively, a sliding platform is arranged in the testing box body, and a discharging tray is connected to the sliding platform in a sliding mode. The device further comprises an indentation instrument body and a rotary placing cylinder, the indentation instrument body is arranged at the top of the test box body in a sliding mode, the rotary placing cylinder is rotatably connected to the top of the discharging tray, a placing structure used for vertically stacking wafers is arranged in the rotary placing cylinder, and material moving plate bodies are arranged on the two sides of the rotary placing cylinder. And a position adjusting structure is arranged between the material moving plate body and the rotary placement barrel, and through the technical scheme, the problem that in the prior art, when electrical performance detection is carried out on a wafer, electrical performance detection is difficult to carry out on the wafer in a normal pressure environment is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of pressure testing, and in particular to a pressure testing device for semiconductor packaging materials. Background Art

[0002] Semiconductor packaging materials include wafers, substrate frames, lead frames and plastic shells. In the actual packaging process, the wafer is first diced, and then the wafer chip is mounted on the substrate frame. The wafer is then connected to the bonding pad using conductive resin or special metal, and the pins of the bonding pad are then inserted into the substrate frame. The bonding pad and the substrate frame are then welded, and finally the plastic shell is installed to complete the semiconductor packaging operation.

[0003] In the actual production process of various packaging materials used in semiconductor packaging operations, it is necessary to perform sampling tests on the packaging materials to determine the production quality of the packaging materials. Among them, the existing technology generally needs to test the electrical properties and pressure properties of the wafer when testing the wafer. The method for testing the electrical properties of the wafer uses a dedicated probe station with two probes installed on the probe station to test the electrical properties of the wafer, and the method for testing the pressure performance of the wafer generally uses a nanoindenter. The nanoindenter also uses a probe-like structure to directly contact the surface of the wafer to perform pressure testing on the wafer.

[0004] However, electrical performance testing or pressure testing of wafers under normal conditions will show certain differences from the pressure environment and working power of the wafers in actual operation. In the existing technology, it is difficult to simulate the electrical performance testing of wafers under normal working pressure. Summary of the Invention

[0005] The present invention provides a semiconductor packaging material pressure testing device, which is used to solve the problem in the prior art that it is difficult to perform electrical performance testing on wafers under normal pressure environment.

[0006] The technical solution of the present invention is as follows: a semiconductor packaging material pressure testing device includes a test box, a probe test device and a wafer positioning device are respectively provided on both sides of the test box, a sliding platform is provided in the test box, and a material discharge tray is slidably connected to the sliding platform, and further includes: An indenter body, the indenter body being slidably disposed on the top of the test box; A rotating placement cylinder is rotatably connected to the top of the material placement tray, and a placement structure for vertically stacking wafers is provided in the rotating placement cylinder. Material moving plates are provided on both sides of the rotating placement cylinder, and a position adjustment structure is provided between the material moving plates and the rotating placement cylinder. The two material moving plates are used to move the wafers into the wafer positioning device, the probe testing device and the placement structure in sequence.

[0007] In order to drive the indenter body to move laterally, a through slide is further provided on the top of the test box, and the top of the indenter body extends to the upper side of the test box through the through slide. An installation chamber is provided on one side of the through slide, and a screw transmission structure is provided in the installation chamber to drive the indenter body to move between the top of the probe testing equipment and the wafer positioning equipment.

[0008] In order to vertically stack multiple wafers that need to be tested, the placement structure further includes a stacking cylinder and a support plate. The stacking cylinder is located in the rotating placement cylinder. Through grooves are provided on both side walls of the stacking cylinder and the rotating placement cylinder. Multiple support plates are longitudinally fixedly connected on both sides of the interior of the stacking cylinder. The multiple support plates located on both sides correspond to each other, and the wafer is placed between the two corresponding support plates.

[0009] In order to realize the movement of the wafer, further, the material moving plate body is divided into a transverse plate section and two material grabbing plate sections, the material grabbing plate section is set to be fork-shaped, and the two material grabbing plate sections are located on both sides of the transverse plate section.

[0010] In order to adjust the position of the material moving plate, the position adjustment structure further includes a lifting trough frame and an arc-shaped support arm. The lifting trough frames are fixedly connected on both sides of the rotating placement cylinder, and the arc-shaped support arms are slidably connected in the two lifting trough frames. The arc-shaped support arms are provided with a transverse movement component for driving the material moving plate to move, wherein a screw lifting structure is provided between the lifting trough frame and the arc-shaped support arm for adjusting the height of the arc-shaped support arm and the material moving plate.

[0011] In order to move the material moving plate laterally, the transverse moving assembly further includes a mounting box and a gear drive structure. Sliding groove frames are provided on both sides of the top of the mounting box. Sliding bars are fixedly connected on both sides of the bottom of the transverse moving plate section. The sliding bars are slidably arranged in the sliding groove frames. The gear drive structure for driving the material moving plate to move laterally is provided between the transverse moving plate section and the mounting box.

[0012] In order to adjust the position of the rotating placement cylinder, a rotating circular groove is further provided on the top of the material discharge tray, and the bottom of the rotating placement cylinder is rotatably connected to the rotating circular groove, and the rotating placement cylinder, the lifting groove frame, the arc-shaped support arm and the material moving plate rotate along the center point of the rotating circular groove.

[0013] In order to drive the material moving plate to move, the gear drive structure further includes a rotating shaft and a gear box. The rotating shaft is rotatably connected to the installation box. A transmission gear is provided on the rotating shaft. A transmission tooth plate is provided on the transverse plate section. The transmission tooth plate is consistent in length with the sliding bar. A gear box is provided between the rotating shaft and the installation box. A first drive motor is provided on the installation box. The output end of the first drive motor is matched with the gear box for transmission.

[0014] In order to perform a pressure test on the wafer, the wafer is further moved onto the wafer positioning device, and the indenter body is moved to the upper side of the wafer positioning device to perform a pressure test on the wafer.

[0015] In order to perform an electrical performance test on the wafer under pressure, the wafer is further moved onto the probe testing device, the indenter body is moved to the upper side of the probe testing device, and the electrical performance test is performed on the wafer during the pressure application process.

[0016] The working principle and beneficial effects of the present invention are: 1. In the present invention, the height and lateral position of the two material transfer plates are adjusted to achieve the purpose of quickly placing the wafer on the probe testing equipment and the wafer positioning equipment. Because the probe testing equipment and the wafer positioning equipment operate on the wafer at a fast speed, the use of two material transfer plates can maximize the speed of wafer replacement and resetting.

[0017] 2. In the present invention, after the wafer is moved to the upper side of the wafer positioning device, a pressure test is performed on the wafer using a probe at the bottom of the indenter body to detect the pressure resistance of the wafer when it is not working.

[0018] 3. In the present invention, the wafer is moved to the upper side of the probe test equipment, and pressure is applied to the wafer using the probe at the bottom of the indenter body, so that the wafer is subjected to electrical performance testing by the probe test equipment while maintaining the moving pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] Figure 1 It is a schematic structural diagram of the present invention as a whole; Figure 2It is a schematic structural diagram of a partial cross-section of the present invention; Figure 3 It is a partial cross-sectional structural diagram of the cooperation between the through-chute, the installation chamber and the indenter body in the present invention; Figure 4 This is a schematic diagram of the structure of the material discharging tray, the rotating placement cylinder, the arc-shaped support arm and the material moving plate in the present invention; Figure 5 It is a partial cross-sectional structural diagram of the coordination of the material discharging tray, the rotating placement cylinder, the stacking cylinder, the arc-shaped support arm and the material transfer plate in the present invention; Figure 6 It is a schematic structural diagram of a partial cross-section of the coordination of the arc-shaped support arm, the mounting box and the material shifting plate in the present invention.

[0021] In the figure: 1. Test box; 2. Probe test equipment; 3. Wafer positioning equipment; 4. Sliding platform; 5. Material discharge tray; 6. Indenter body; 7. Rotating placement cylinder; 8. Material transfer plate; 9. Through slide; 10. Installation chamber; 11. Stacking cylinder; 12. Support plate; 13. Transverse plate section; 14. Grabbing plate section; 15. Lifting slot frame; 16. Arc support arm; 17. Installation box; 18. Sliding slot frame; 19. Sliding bar; 20. Rotating circular slot; 21. Rotating shaft; 22. Transmission gear; 23. Transmission gear plate; 24. Gear box; 25. First drive motor; 26. Transmission screw; 27. Second drive motor; 28. Annular gear groove; 29. Meshing gear; 30. Third drive motor; 31. Lifting screw; 32. Fourth drive motor. DETAILED DESCRIPTION

[0022] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0023] like Figures 1 to 6As shown, this embodiment proposes a semiconductor packaging material pressure testing device, including a test box 1, a probe test device 2 and a wafer positioning device 3 are respectively provided on both sides of the interior of the test box 1, a sliding platform 4 is provided in the test box 1, and a material discharging tray 5 is slidably connected to the sliding platform 4, the probe test device 2 and the wafer positioning device 3 are both necessary working equipment on the probe table in the prior art, the wafer positioning device 3 is used to adjust the position of the placed wafer, determine the detected position of the wafer, and then move the wafer to the probe test device 2 so that the detected area of the wafer moves to the bottom of the two probes of the probe test device 2, the probe applies voltage, current or frequency signal to the wafer, and measures the response signal output by the wafer at the same time, so as to perform electrical performance test on the wafer; During actual use, the sliding platform 4 can autonomously drive the discharge tray 5 to move to the outside of the test box 1, so that the rotating placement cylinder 7 is also moved out of the test box 1, and is used to place the stacking cylinder 11 containing the wafers into the rotating placement cylinder 7. The way in which the sliding platform 4 moves the discharge tray 5 laterally is a technical device well known to those skilled in the art. By setting a driving structure such as a lead screw, the discharge tray 5 can be driven to move laterally.

[0024] It also includes an indenter body 6, which is slidably arranged on the top of the test box 1. A through slide 9 is provided on the top of the test box 1. The top of the indenter body 6 extends to the upper side of the test box 1 through the through slide 9. A mounting chamber 10 is provided on one side of the through slide 9. A screw transmission structure is provided in the mounting chamber 10 to drive the indenter body 6 to move between the probe test device 2 and the top of the wafer positioning device 3. The screw transmission structure includes a transmission screw 26, which is rotatably connected to the mounting chamber 10. A second drive motor 27 is provided on the mounting chamber 10. The output end of the second drive motor 27 is fixedly connected to the transmission screw 26. 6 is slidably connected to the through-slot 9 through a sliding seat, and the sliding seat is coordinated with the transmission screw 26 for transmission. In order to drive the indenter body 6 to move on the top of the wafer positioning device 3 and the probe testing device 2, the indenter body 6 is moved to the top upper side of the wafer positioning device 3 and the probe testing device 2 respectively. The indenter body 6 is a nanoindenter in the prior art. The indenter body 6 can apply a controllable load to the material surface and measure the indentation depth. By analyzing the mechanical response curve during loading and unloading, the material properties are obtained to complete the wafer pressure test operation. The second drive motor 27 is started to drive the transmission screw 26 to rotate to adjust the position of the sliding seat and the indenter body 6 in the through-slot 9.

[0025] The rotating placement cylinder 7 is rotatably connected to the top of the material discharging tray 5, and a rotating circular groove 20 is provided on the top of the material discharging tray 5. The bottom of the rotating placement cylinder 7 is rotatably connected in the rotating circular groove 20. The rotating placement cylinder 7, the lifting groove frame 15, the arc-shaped support arm 16 and the material moving plate 8 rotate along the center point of the rotating circular groove 20. An annular tooth groove 28 is provided at the bottom of the rotating placement cylinder 7. A meshing gear 29 is provided on the annular tooth groove 28 for transmission. The meshing gear 29 is rotatably set on the material discharging tray 5 through the mounting shaft. A third driving motor 30 is provided on the material discharging tray 5. The output end of the third driving motor 30 is fixedly connected to the mounting shaft. When it is necessary to drive the rotating placement cylinder 7 to rotate so that the two material moving plates 8 correspond to the positions between the wafer positioning device 3 and the probe testing device 2 in turn, the third driving motor 30 is started to drive the mounting shaft and the meshing gear 29 to rotate. The meshing gear 29 engages with the annular tooth groove 28 to drive the rotating placement cylinder 7 to rotate on the rotating circular groove 20.

[0026] A placement structure for vertically stacking wafers is provided in the rotating placement cylinder 7, and the placement structure includes a stacking cylinder 11 and a support plate 12. The stacking cylinder 11 is located in the rotating placement cylinder 7. Through grooves are provided on both side walls of the stacking cylinder 11 and the rotating placement cylinder 7. A plurality of support plates 12 are longitudinally fixedly connected on both sides of the interior of the stacking cylinder 11. The plurality of support plates 12 located on both sides correspond to each other in pairs. The wafer is placed between the two corresponding support plates 12, and the plurality of wafers are placed between the corresponding two support plates 12. A flat groove is provided on the support plate 12, and the end faces of both sides of the wafer will contact the side walls of the flat groove, so that the wafer is kept fixed in the stacking cylinder 11.

[0027] A material moving plate 8 is provided on both sides of the rotating placement cylinder 7. The material moving plate 8 is divided into a transverse moving plate section 13 and two material grabbing plate sections 14. The material grabbing plate section 14 is set to a fork shape. The two material grabbing plate sections 14 are located on both sides of the transverse moving plate section 13. When the material moving plate 8 is actually operated, the material grabbing plate section 14 is moved to the bottom of the wafer to be tested, and then the material grabbing plate section 14 is raised to make the wafer stay on the upper side of the material grabbing plate section 14. Then, by continuing to move the material grabbing plate section 14, the wafer is moved toward the wafer positioning device 3 or the probe test device 2; A position adjustment structure is provided between the material moving plate body 8 and the rotating placement cylinder 7. The two material moving plate bodies 8 are used to move the wafer into the wafer positioning device 3, the probe testing device 2 and the placement structure in sequence. The position adjustment structure includes a lifting slot frame 15 and an arc-shaped support arm 16. Both sides of the rotating placement cylinder 7 are fixedly connected with the lifting slot frame 15. The two lifting slot frames 15 are slidably connected with the arc-shaped support arms 16. The arc-shaped support arms 16 are provided with a transverse movement component for driving the material moving plate body 8 to move. A screw lifting structure is provided between the lifting slot frame 15 and the arc-shaped support arms 16 for adjusting the height of the arc-shaped support arms 16 and the material moving plate body 8. The screw The lifting structure includes a lifting screw 31 and a fourth drive motor 32. The lifting screw 31 is rotatably connected to the lifting slot frame 15. The arc-shaped support arm 16 is in transmission cooperation with the lifting screw 31. The lifting slot frame 15 is provided with a fourth drive motor 32. The output end of the fourth drive motor 32 is fixedly connected to the lifting screw 31. Starting the fourth drive motor 32 drives the lifting screw 31 to rotate, so that the arc-shaped support arm 16 drives the installation box 17 and the material moving plate 8 to move longitudinally, adjust the height of the material moving plate 8, so that the material moving plate 8 corresponds to the wafer position at different heights, and move the wafers at different positions to the wafer positioning device 3 and the probe testing device 2.

[0028] The transverse movement assembly includes a mounting box 17 and a gear drive structure. Sliding slots 18 are provided on both sides of the top of the mounting box 17. Sliding bars 19 are fixedly connected on both sides of the bottom of the transverse movement plate section 13. The sliding bars 19 are slidably arranged in the sliding slots 18. A gear drive structure for driving the material moving plate 8 to move transversely is provided between the transverse movement plate section 13 and the mounting box 17. When driving the material moving plate 8 to move transversely, the sliding bar 19 moves transversely in the sliding slots 18, so that the transverse movement of the material moving plate 8 remains stable. The gear drive structure includes a rotating shaft 21 and a gear box 24. The rotating shaft 21 is rotatably connected in the installation box 17. A transmission gear 22 is provided on the rotating shaft 21. A transmission tooth plate 23 is provided on the transverse plate segment 13. The transmission tooth plate 23 is consistent with the length of the sliding bar 19. A gear box 24 is provided between the rotating shaft 21 and the installation box 17. A first drive motor 25 is provided on the installation box 17. The output end of the first drive motor 25 is matched with the gear box 24 for transmission. The first drive motor 25 is started, and the rotating shaft 21 and the transmission gear 22 are driven to rotate through the transmission cooperation between the gear box 24 and the rotating shaft 21. The meshing relationship between the transmission gear 22 and the transmission tooth plate 23 drives the moving plate 8 to move laterally.

[0029] The wafer is moved onto the wafer positioning device 3 , and the indenter body 6 is moved to the upper side of the wafer positioning device 3 to perform a pressure test on the wafer.

[0030] The wafer is moved onto the probe testing device 2 , and the indenter body 6 is moved to the upper side of the probe testing device 2 , and an electrical performance test is performed on the wafer while pressure is applied.

[0031] Working principle of the semiconductor packaging material pressure testing device: Place multiple wafers to be tested between the two supporting plates 12 in the stacking cylinder 11, and then after the position of the material discharging tray 5 and the rotating placement cylinder 7 are moved out of the test box 1, place the stacking cylinder 11 into the rotating placement cylinder 7 so that the through-grooves of the stacking cylinder 11 and the rotating placement cylinder 7 correspond to each other, and then move the material discharging tray 5 into the test box 1, and then adjust the position of the material moving plate 8 to make the material grabbing plate section 14 move the wafer, and during the horizontal movement of the material moving plate 8, move the wafer to the device located on the other side of the rotating placement cylinder 7, first move the wafer to the wafer positioning device 3, and after moving the wafer to the wafer positioning device 3, locate the test position of the wafer, and then move the indenter body 6 to the upper side of the wafer positioning device 3, and use the indenter body 6 to perform pressure testing on the wafer; Then use a material transfer plate 8 to grab the remaining wafers, and then move the grab plate section 14 of another material transfer plate 8 to one side of the wafer positioning device 3. After positioning and pressure testing the wafers, use a material transfer plate 8 to remove the wafers from the wafer positioning device 3, and then drive the rotating placement cylinder 7 to rotate, and move the positioned wafers to one side of the probe testing device 2. Move the wafer to the probe testing device 2. At the same time, another material transfer plate 8 moves the wafer to the wafer positioning device 3 and continues to position the wafer. When performing electrical performance testing on some wafers, move the indenter body 6 to the probe testing device 2 to perform electrical performance testing on the wafer under pressure.

[0032] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor packaging material pressure testing device, comprising a test box (1), wherein a probe test device (2) and a wafer positioning device (3) are respectively provided on both sides of the interior of the test box (1), a sliding platform (4) is provided in the test box (1), and a material discharging tray (5) is slidably connected to the sliding platform (4), characterized in that: Also includes: An indenter body (6), the indenter body (6) being slidably arranged on the top of the test box (1); A rotating placement cylinder (7) is rotatably connected to the top of the material placement tray (5), and a placement structure for vertically stacking wafers is provided in the rotating placement cylinder (7). Both sides of the rotating placement cylinder (7) are provided with a material transfer plate (8), and a position adjustment structure is provided between the material transfer plate (8) and the rotating placement cylinder (7). The two material transfer plates (8) are used to move the wafers into the wafer positioning device (3), the probe test device (2) and the placement structure in sequence.

2. A semiconductor packaging material pressure testing device according to claim 1, characterized in that: A through slot (9) is provided on the top of the test box (1), and the top of the indenter body (6) extends to the upper side of the test box (1) through the through slot (9). A mounting chamber (10) is provided on one side of the through slot (9), and a lead screw transmission structure is provided in the mounting chamber (10) for driving the indenter body (6) to move between the probe test device (2) and the top of the wafer positioning device (3).

3. The semiconductor packaging material pressure testing device according to claim 1, characterized in that: The placement structure includes: A stacking cylinder (11), the stacking cylinder (11) is located in the rotating placement cylinder (7), and through grooves are provided on both side walls of the stacking cylinder (11) and the rotating placement cylinder (7); Support plates (12), a plurality of support plates (12) are longitudinally fixedly connected to both sides of the interior of the stacking cylinder (11), the plurality of support plates (12) located on both sides correspond to each other in pairs, and the wafer is placed between two corresponding support plates (12).

4. The semiconductor packaging material pressure testing device according to claim 1, characterized in that: The material moving plate body (8) is divided into a transverse plate section (13) and two material grabbing plate sections (14). The material grabbing plate section (14) is set to be fork-shaped, and the two material grabbing plate sections (14) are located on both sides of the transverse plate section (13).

5. The semiconductor packaging material pressure testing device according to claim 4, characterized in that: The position adjustment structure includes: A lifting trough frame (15), both sides of the rotating placement cylinder (7) are fixedly connected to the lifting trough frame (15); An arc-shaped support arm (16), wherein the two lifting slot frames (15) are both slidably connected with the arc-shaped support arm (16), and the arc-shaped support arm (16) is provided with a transverse movement component for driving the material moving plate (8) to move; A screw lifting structure is provided between the lifting trough frame (15) and the arc-shaped support arm (16), for adjusting the height of the arc-shaped support arm (16) and the material shifting plate (8).

6. The semiconductor packaging material pressure testing device according to claim 5, characterized in that: The traverse assembly comprises: An installation box (17), wherein both sides of the top of the installation box (17) are provided with sliding slot frames (18), and both sides of the bottom of the transverse plate section (13) are fixedly connected with sliding bars (19), and the sliding bars (19) are slidably arranged in the sliding slot frames (18); A gear drive structure is provided between the transverse shifting plate section (13) and the mounting box (17) for driving the material shifting plate (8) to move transversely.

7. A semiconductor packaging material pressure testing device according to claim 6, characterized in that: A rotating circular groove (20) is provided on the top of the material discharging tray (5), and the bottom of the rotating placement cylinder (7) is rotatably connected to the rotating circular groove (20). The rotating placement cylinder (7), the lifting slot frame (15), the arc-shaped support arm (16) and the material moving plate (8) rotate along the center point of the rotating circular groove (20).

8. The semiconductor packaging material pressure testing device according to claim 7, characterized in that: The gear drive structure includes: A rotating shaft (21), the rotating shaft (21) is rotatably connected in the mounting box (17), a transmission gear (22) is provided on the rotating shaft (21), a transmission tooth plate (23) is provided on the transverse plate segment (13), and the transmission tooth plate (23) is consistent in length with the sliding bar (19); A gear box (24) is provided between the rotating shaft (21) and the mounting box (17), a first drive motor (25) is provided on the mounting box (17), and an output end of the first drive motor (25) is in transmission cooperation with the gear box (24).

9. The semiconductor packaging material pressure testing device according to claim 1, characterized in that: The wafer is moved onto the wafer positioning device (3), and the indenter body (6) is moved to the upper side of the wafer positioning device (3) to perform a pressure test on the wafer.

10. The semiconductor packaging material pressure testing device according to claim 1, characterized in that: The wafer is moved onto the probe test device (2), the indenter body (6) is moved to the upper side of the probe test device (2), and the electrical performance test of the wafer is performed while pressure is applied.

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