A method, system, and storage medium for measuring the height of circuit board components.

Abstract

This invention relates to the field of semiconductor technology, and particularly to a method, system, and storage medium for measuring the height of circuit board components. The method involves transmitting a normal circuit board to obtain the inherent height of components on that board. A first measuring component measures the normal component angle as it passes, and a second measuring component measures the normal substrate angle as it passes. The method then transmits to a target circuit board, where the first measuring component measures the target component angle as it passes, and the second measuring component measures the target substrate angle as it passes. Based on the inherent height, normal component angle, normal substrate angle, target component angle, and target substrate angle, the actual height of the component on the target circuit board is obtained. The method then determines whether the component height is normal based on the actual height. This invention eliminates the need for laser measurement of component height, does not affect production efficiency, offers high cost-effectiveness in height measurement, and improves the accuracy of the measurement results.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a method, system and storage medium for measuring the height of circuit board components. Background Technology

[0002] In the semiconductor industry, the height of components on a PCB board has a significant impact on the quality of the PCB. When components are too tall, it can affect the installation of the PCB, or indicate that components are not properly mounted or DIP connectors are not inserted correctly. Therefore, before using AOI equipment to inspect components on a PCB board, it is necessary to first check whether the height of certain components on the PCB board meets the requirements.

[0003] In existing technologies, line lasers or spot lasers are mostly used to detect the height of components on circuit boards. However, using line lasers or spot lasers to measure component height requires parameter calibration for specific components, and the measured data needs to be processed by AOI equipment, which increases the AOI equipment's working time and affects production efficiency on actual production lines. Furthermore, using relatively expensive line lasers or spot lasers to measure the height of a component on a PCB board is not cost-effective. In addition, since laser measurement utilizes laser reflection, the surface condition of the component must also be considered. When the component surface is relatively rough, diffuse reflection occurs, making the component easier to detect. However, when the component surface is relatively smooth, specular reflection can easily lead to false alarms in the measurement process, resulting in inaccurate measurement results. Summary of the Invention

[0004] In view of this, one objective of the present invention is to provide a method, system, and storage medium for measuring the height of circuit board components, so as to solve the technical problems in the prior art where the measurement of the height of components on circuit boards affects production efficiency, has low cost performance, and is prone to errors in measurement results.

[0005] To address the aforementioned technical problems, the embodiments of the present invention provide the following technical solutions:

[0006] In a first aspect, embodiments of the present invention provide a method for measuring the height of circuit board components, used to measure the substrate of the circuit board and the components disposed on the substrate, the method comprising:

[0007] Transmit the normal circuit board and obtain the height of the components themselves, and correct the position of the first measurement component and the second measurement component during the transmission process;

[0008] When the normal circuit board reaches the measurement position, the normal component angle generated by the passing of the component is measured by the first measurement component, and the normal substrate angle generated by the passing of the substrate is measured by the second measurement component.

[0009] The target circuit board is transferred. When the target circuit board reaches the measurement position, the target component angle generated by the passing of the component is measured by the first measurement component, and the target substrate angle generated by the passing of the substrate is measured by the second measurement component.

[0010] The actual height of the component on the target circuit board is obtained by considering its own height, the angle of a normal component, the angle of a normal substrate, the angle of the target component, and the angle of the target substrate.

[0011] Determine whether the height of the component on the target circuit board is normal based on its actual height.

[0012] In some embodiments, correcting the positions of the first measuring component and the second measuring component includes:

[0013] Establish a coordinate system based on the normal moving plane of the circuit board, and obtain the coordinates of the components in the coordinate system;

[0014] The positions of the first and second measuring components are corrected according to the coordinates of the components, so that the first and second measuring components are both located at the coordinates of the corresponding components.

[0015] In some embodiments, before the normal circuit board reaches the measurement position, the method further includes:

[0016] Determine whether a normal circuit board or the circuit board under test has reached the sensing position, which is the position before the measurement position;

[0017] When in the sensing position, it emits high-frequency pulses and collects measurement signals returned from the first and second measurement components in real time.

[0018] In some embodiments, the step of transmitting high-frequency pulses and acquiring measurement signals returned from the first measurement component and the second measurement component in real time includes:

[0019] Obtain the model numbers of components on a normal circuit board or the circuit board under test;

[0020] Set the corresponding high-frequency pulse according to different models;

[0021] It transmits high-frequency pulses of the corresponding frequency and collects measurement signals returned from the first and second measurement components in real time.

[0022] In some embodiments, obtaining the actual height of the component on the target circuit board based on its own height, normal component angle, normal substrate angle, target component angle, and target substrate angle includes:

[0023] Set up an angle and height reference table for the target circuit board based on requirements;

[0024] Based on the angle-height comparison table, obtain the normal component height corresponding to the normal component angle, the normal substrate height corresponding to the normal substrate angle, the target component height corresponding to the target component angle, and the target substrate height corresponding to the target substrate angle.

[0025] The actual height of the component on the target circuit board is obtained based on its own height, normal component height, normal substrate height, target component height, and target substrate height.

[0026] In some embodiments, determining whether the height of the component on the target circuit board is normal based on its actual height includes:

[0027] Set condition values ​​according to requirements;

[0028] Compare the actual height with the conditional value to determine whether the height of the component is normal;

[0029] When the actual height is greater than or equal to the condition value, it indicates that the height of the component is abnormal;

[0030] When the actual height is less than the condition value, it indicates that the height of the component is normal.

[0031] In some embodiments, determining whether the height of the component on the target circuit board is normal based on its actual height further includes:

[0032] Set the condition values ​​and normal ranges according to your needs;

[0033] Compare the difference between the actual height and the conditional value to see if it is within the normal range;

[0034] When the difference is within the normal range, it indicates that the height of the component is normal;

[0035] When the difference is greater than the normal range, it indicates that the height of the component is excessively high;

[0036] When the difference is less than the normal range, it indicates that the component is missing.

[0037] In some embodiments, the determination result includes excessive height, normal, and missing component. After determining whether the height of the component on the target circuit board is normal based on the actual height, the method further includes:

[0038] As the target circuit board is transferred to AOI, the judgment result is stored in the AOI output TXT and displayed in the AOI output repair station result;

[0039] Set the "excessive height" and "missing parts" results in the judgment results as abnormal errors;

[0040] If an error occurs, the error will be displayed in front of the repair station results output by the AOI, and the image of the component taken by the AOI will be displayed.

[0041] In a second aspect, embodiments of the present invention provide a height measurement system for circuit board components, comprising:

[0042] The controller and a first measuring component and a second measuring component communicatively connected to the controller, the first measuring component being used to measure the component angle generated when a component of the circuit board passes by, and the second measuring component being used to measure the substrate angle generated when the substrate of the circuit board passes by.

[0043] The controller includes:

[0044] A processor and a memory communicatively connected to the processor;

[0045] The memory stores computer program instructions executable by the processor, which, when executed by the processor, cause the controller to perform any of the height measurement methods for circuit board components proposed in the first aspect.

[0046] Thirdly, embodiments of the present invention provide a computer-readable storage medium storing processor-executable computer program instructions, which, when executed by the processor, cause the computer to perform any of the height measurement methods for circuit board components proposed in the first aspect.

[0047] The embodiments of the present invention have the following beneficial effects: Unlike the prior art, the height measurement method for circuit board components provided in the embodiments of the present invention is used to measure the substrate of a circuit board and the components disposed on the substrate. The method includes: transmitting a normal circuit board and obtaining the height of the component itself; correcting the positions of a first measuring component and a second measuring component during transmission; when the normal circuit board reaches the measurement position, measuring the normal component angle generated by the component's passage using the first measuring component, and measuring the normal substrate angle generated by the substrate's passage using the second measuring component; transmitting a target circuit board; when the target circuit board reaches the measurement position, measuring the target component angle generated by the component's passage using the first measuring component, and measuring the target substrate angle generated by the substrate's passage using the second measuring component; obtaining the actual height of the component on the target circuit board based on its own height, normal component angle, normal substrate angle, target component angle, and target substrate angle; and determining whether the height of the component on the target circuit board is normal based on the actual height.

[0048] This invention, through the transmission of a normal circuit board, obtains the height of the components on the normal circuit board, corrects the positions of the first and second measuring components, measures the normal component angle generated when the component on the normal circuit board passes through using the first measuring component, and measures the normal substrate angle generated when the substrate of the normal circuit board passes through using the second measuring component, transmits the target circuit board to the measuring position, measures the target component angle generated when the component on the target circuit board passes through using the first measuring component, and measures the target substrate angle generated when the substrate of the target circuit board passes through using the second measuring component, and obtains the actual height of the component on the target circuit board based on its own height, normal component angle, normal substrate angle, target component angle, and target substrate angle. Based on the actual height, it determines whether the height of the component on the target circuit board is normal. This eliminates the need for laser measurement of component height; the actual height of the component on the target circuit board can be calculated by measuring the angles of the component and substrate on the normal circuit board and the target circuit board, thereby determining whether the component height is normal. This does not affect production efficiency, offers high cost-effectiveness in height measurement, and improves the accuracy of measurement results. Attached Figure Description

[0049] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the prior art or embodiments will be briefly introduced below. Obviously, the drawings described below only show some embodiments of the present invention and should not be considered as limiting the scope of protection. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0050] Figure 1 This is a schematic diagram illustrating application scenarios of the height measurement method for circuit board components in some embodiments of the present invention;

[0051] Figure 2 This is a schematic diagram of the structure of a height measurement system for circuit board components provided in some embodiments of the present invention;

[0052] Figure 3 yes Figure 2 A schematic diagram of the controller in the height measurement system shown in the embodiment;

[0053] Figure 4 This is a flowchart illustrating a method for measuring the height of circuit board components according to some embodiments of the present invention;

[0054] Figure 5 This is a schematic diagram of the height measurement system measuring element and substrate in some embodiments of the present invention. Detailed Implementation

[0055] To make the objectives and advantages of the embodiments of the present invention more readily understood, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The detailed description of the embodiments of the present invention in the accompanying drawings is not intended to limit the scope of protection claimed by the present invention, but only to illustrate selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0056] It should be noted that, unless there is a conflict, the various technical features involved in the embodiments of the present invention described below can be combined with each other, and all are within the protection scope of the present invention. Furthermore, although functional modules are divided in the device or structural schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. In addition, the terms "first," "second," "third," and other similar expressions used herein do not limit the data or execution order, but are only for illustrative purposes and to distinguish identical or similar items with substantially the same function and effect, and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features.

[0057] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. It should be understood that the term "and / or" as used herein includes any and all combinations of one or more of the listed items.

[0058] Please see Figure 1 , Figure 1 The illustration shows a schematic diagram of an application scenario of the height measurement method for circuit board components provided in some embodiments of the present invention.

[0059] Specifically, such as Figure 1 As shown, this application scenario includes a height measurement system 1000 for circuit board components, a normal circuit board 10, and a target circuit board 20. The height measurement system 1000 is used to measure the substrate of the circuit board and the components disposed on the substrate. Those skilled in the art can place the height measurement system 1000 at any suitable location on the AOI (Automated Optical Inspection) equipment according to actual needs, such as at the gantry of the AOI equipment, or further, at the longitudinal lead screw guide rail of the AOI equipment. The height measurement system 1000 includes a controller (…). Figure 1(Not shown in the image) A first measuring component 100 and a second measuring component 200, wherein the controller is communicatively connected to the first measuring component 100 and the second measuring component 200 respectively. The normal circuit board 10 includes a substrate 11 and components 12 disposed on the substrate 11, and the target circuit board 20 includes a substrate 21 and components 22 disposed on the substrate 21. The target circuit board 20 is a circuit board with the actual height of the component to be measured.

[0060] In the initial state, the first measuring component 100 and the second measuring component 200 have an initial angle. The initial angle of the first measuring component 100 and the second measuring component 200 is by default perpendicular to the ground, that is, the deflection angle in the initial state is 0 degrees. The deflection angle in the initial state can also be adjusted as needed. When measuring a circuit board, the height measuring system 1000 first transports the normal circuit board 10 from the loading station along direction M to the connecting station, and obtains the height of the components 12 of the normal circuit board 10 itself (i.e., the height of the components 12). Figure 1 The height d shown, and the position of the first measuring component 100 and the second measuring component 200 are corrected during the transmission of the normal circuit board 10 so that the first measuring component 100 and the second measuring component 200 are aligned with the normal circuit board 10, that is, the first measuring component 100 and the second measuring component 200 are located in the transmission path of the component 12 of the normal circuit board 10, so that the first measuring component 100 and the second measuring component 200 can measure the substrate of the normal circuit board 10 and the target circuit board 20 and the components disposed on the substrate.

[0061] In this embodiment of the invention, a measuring position is set at any suitable location between the loading station and the connecting station. When the normal circuit board 10 reaches the measuring position, the controller measures the normal component angle (i.e., the angle caused by the passage of component 12) through the first measuring component 100. Figure 1 The angle α1 shown is the angle measured when the first measuring component 100 contacts the element 12, and the normal substrate angle (i.e., the angle generated by the substrate 11 passing through) is measured by the second measuring component 200. Figure 1 The angle β1 shown is the angle at which the second measuring component 200 contacts the substrate 11.

[0062] After measuring the normal component angle and the normal substrate angle, the target circuit board 20 continues to be transported from the loading station to the docking station along direction M. When the target circuit board 20 reaches the measurement position, the controller measures the target component angle (i.e., the angle generated by the passing of component 22) through the first measurement component 100. Figure 1 The angle α2 shown is the angle measured when the first measuring component 100 contacts the element 22, and the angle of the target substrate generated by the passage of the substrate 21 is measured by the second measuring component 200. Figure 1The angle β2 shown is the angle at which the second measuring component 200 contacts the substrate 21.

[0063] After measuring the angles of the target component and the target substrate, the actual height of component 22 on the target circuit board 20 is calculated based on the obtained height of the component itself, the angle of the normal component, the angle of the normal substrate, the angle of the target component, and the angle of the target substrate. Based on the actual height, it is determined whether the height of component 22 on the target circuit board 20 is normal. By measuring the angles generated by the components and substrates of the normal circuit board and the target circuit board during the transmission process (i.e., the angle of the normal component, the angle of the normal substrate, the angle of the target component, and the angle of the target substrate), the actual height of the component on the target circuit board can be calculated, thereby determining whether the height of the component on the target circuit board is normal. Moreover, there is no need to use laser to measure the height, reducing the cost caused by laser equipment. At the same time, it reduces the measurement error caused by specular reflection in laser measurement, does not affect production efficiency, and has a high cost-performance ratio for height measurement, improving the accuracy of height measurement results.

[0064] It should be understood that Figure 1 The application scenario shown is only a simplified illustration of some components of the height measurement system 1000. It does not limit the structure, type and quantity of the height measurement system, the number, height and type of components in the normal circuit board and the target circuit board, etc., in other application scenarios or embodiments. Those skilled in the art can add, delete or change the components of the height measurement system according to actual needs. For example, in some embodiments, components such as a support platform and a transmission mechanism for automatically transferring the normal circuit board and the target circuit board are added. The embodiments of the present invention do not limit this in any way.

[0065] To facilitate understanding of the height measurement method for circuit board components provided in the embodiments of the present invention, the height measurement system for circuit board components provided in the embodiments of the present invention will first be described in detail.

[0066] Please see Figure 2 , Figure 2 The schematic diagram illustrates the structure of a height measurement system for circuit board components provided in some embodiments of the present invention.

[0067] Specifically, such as Figure 2As shown, the circuit board component height measurement system 1000 includes a controller 300 and a first measurement component 100 and a second measurement component 200 communicatively connected to the controller 300. The first measurement component 100 is used to measure the component angle generated when a component of the circuit board passes by, for example, measuring the normal component angle generated when a component of a normal circuit board passes by. The second measurement component 200 is used to measure the substrate angle generated when the substrate of the circuit board passes by, for example, measuring the normal substrate angle generated when the substrate of a normal circuit board passes by. The controller 300 is used to coordinate and control the various components and modules of the height measurement system 1000 to work together and complete various business logics.

[0068] Understandable, Figure 2 The structures shown in the embodiments are merely illustrative and do not impose any limitations on the structure of the height measurement system. The height measurement system may also include components that are more... Figure 2 The structure shown has more or fewer components, or has the same Figure 2 The diagram shows different configurations of the structure.

[0069] Please see Figure 3 , Figure 3 A schematic diagram of the controller in a height measurement system provided by some embodiments of the present invention is shown.

[0070] Specifically, such as Figure 3 As shown, the controller 300 includes at least one processor 310 and a memory 320 that are communicatively connected. Figure 3 Taking a processor connected via a bus system 330 as an example, the various components in the controller 300 are coupled together through the bus system 330, which is used to realize communication between the components. It's easy to understand that the bus system 330, in addition to the data bus, can also include a power bus, a control bus, and a status signal bus, etc. However, for clarity and brevity, in... Figure 3 The general labels all buses as Bus System 330. This is understandable. Figure 3 The structures shown in the embodiments are merely illustrative and do not limit the structure of the controller described above. For example, the controller may also include components that are more... Figure 3 The structure shown has more or fewer components, or has the same as Figure 3 The diagram shows different configurations of the structure.

[0071] Specifically, the processor 310 provides computational and control capabilities to control the controller 300 to perform corresponding tasks. For example, it controls the controller 300 to execute any of the height measurement methods for circuit board components provided in the embodiments of the present invention, or to execute the steps in any possible implementation of any of the height measurement methods for circuit board components provided in the embodiments of the present invention. Those skilled in the art will understand that the processor 310 can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.

[0072] The memory 320, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs, non-transitory computer-executable programs, instructions, and modules, such as the program, instructions, and modules corresponding to the height measurement method for circuit board components in the embodiments of the present invention. In some embodiments, the memory 320 may include a program storage area and a data storage area. The program storage area may store an operating system, an application program required for at least one function, and the data storage area may store data created according to the use of the processor 310. The processor 310 executes various functional applications and data processing of the controller 300 by running the non-transitory software programs, instructions, and modules stored in the memory 320 to implement any of the height measurement methods for circuit board components provided in the embodiments of the present invention, or to execute the steps in any possible implementation of any of the height measurement methods for circuit board components provided in the embodiments of the present invention. In some embodiments, the memory 320 may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory 320 may also include memories remotely located relative to the processor 310, which may be connected to the processor 310 via a communication network. It is understood that examples of the aforementioned communication networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0073] As can be understood from the above, the implementing entity of any of the height measurement methods for circuit board components provided in the embodiments of the present invention can be any suitable type of controller with certain calculation and control capabilities. For example, it can be implemented by the controller 300 of the height measurement system 1000 described above. In some embodiments, the height measurement method for any of the circuit board components provided in the embodiments of the present invention can be implemented by a processor executing computer program instructions stored in a memory.

[0074] The following will describe in detail the height measurement method for circuit board components provided in this invention, taking into account exemplary applications and implementations of the height measurement system for circuit board components provided in this embodiment.

[0075] Please see Figure 4 , Figure 4 The schematic diagram illustrates a flowchart of a method for measuring the height of circuit board components provided in some embodiments of the present invention.

[0076] Those skilled in the art will understand that the height measurement method for circuit board components provided in the embodiments of the present invention can be applied to the controller (e.g., controller 300) in the above-described height measurement system for circuit board components. Specifically, the execution subject of the height measurement method for circuit board components is one or at least two processors of the controller.

[0077] Specifically, such as Figure 4 As shown, the height measurement method for circuit board components provided in this embodiment of the invention includes, but is not limited to, the following steps S100-S500:

[0078] S100: Transmits a normal circuit board and obtains the height of the components themselves, and corrects the positions of the first and second measuring components during transmission.

[0079] In this step, the component's height refers to the standard value of the component's height measured in advance. The component's height data can be stored in any suitable medium. When needed, the component's height can be obtained from the medium that stores the component's height data.

[0080] In this embodiment of the invention, a conveying mechanism is provided and is communicatively connected to a height measurement system. The conveying mechanism includes a drive motor, a transmission assembly, and a conveyor belt. The conveyor belt of the conveying mechanism is provided with a loading station, a connecting station, and a measurement position. The measurement position is located at any suitable position between the loading station and the connecting station. The connecting station is used to transport the circuit board to the next process after measuring the actual height of the components on the circuit board.

[0081] Specifically, a normal circuit board is placed at the loading station of the conveyor mechanism, and the conveyor mechanism is controlled to start transporting the normal circuit board from the loading station to the receiving station. During the transport of the normal circuit board, the positions of the first and second measuring components are adjusted and corrected according to the transport path and direction of the components on the normal circuit board, so that the first and second measuring components are aligned with the normal circuit board, that is, the first and second measuring components are located on the transport path of the components on the normal circuit board, thereby enabling the measurement of the components and substrate of the normal circuit board and the subsequent target circuit board.

[0082] For example, please see Figure 5 During the transmission of the normal circuit board 30, the normal circuit board 30 is transmitted along direction N on the conveying mechanism 400. Based on the transmission path and transmission direction of the normal circuit board 30, the position, transmission path and transmission direction of the components on the normal circuit board 30 are obtained. Based on the position, transmission path and transmission direction of the components on the normal circuit board 30, the positions of the first measuring component 100 and the second measuring component 200 of the height measuring system 1000 are corrected so that the first measuring component 100 and the second measuring component 200 are both located on the transmission path of the components on the normal circuit board 30.

[0083] In some embodiments, the positions of the first measuring component and the second measuring component are corrected, specifically including but not limited to the following steps S110-S120:

[0084] S110: Establish a coordinate system based on the normal circuit board moving plane and obtain the coordinates of the components in the coordinate system.

[0085] Specifically, during the transfer of a normal circuit board, the moving plane of the normal circuit board is obtained. This moving plane is the plane on which the normal circuit board lies as it moves on the conveyor mechanism, such as the plane on the conveyor belt. Based on the moving plane of the normal circuit board, a coordinate system is established. The positions of the components on the normal circuit board are mapped to the established coordinate system, giving each component a corresponding coordinate. Then, the coordinates of the components in the coordinate system are obtained, facilitating real-time quantification of component position changes.

[0086] For example, please see Figure 5 The normal circuit board 30 moves along direction N on the conveyor mechanism 400. The moving plane of the normal circuit board 30 is the plane on which the normal circuit board 30 is located when it moves on the conveyor mechanism 400. A coordinate system XOY is established based on the moving plane of the normal circuit board 30, and the positions of the components of the normal circuit board 30 are mapped to the coordinate system XOY. This is understandable. Figure 5The coordinate system XOY is only shown schematically and does not impose any specific limitations on the location of the origin of the coordinate system XOY, the units of the coordinate axes, or anything else.

[0087] S120: Correct the positions of the first measuring component and the second measuring component according to the coordinates of the components, so that the first measuring component and the second measuring component are both at the coordinates of the corresponding components.

[0088] Specifically, the current positions of the first and second measuring components are mapped to the established coordinate system, giving them corresponding current coordinates. After obtaining the coordinates of the element in the coordinate system, the current coordinates of the first measuring component are compared with the coordinates of the element. Based on the difference between the current coordinates of the first measuring component and the coordinates of the element, the position of the first measuring component is corrected so that it is located on the transmission path of the element, i.e., at the corresponding element's coordinates (Y-axis coordinates). Similarly, the current coordinates of the second measuring component are compared with the coordinates of the element. Based on the difference between the current coordinates of the second measuring component and the coordinates of the element, the position of the second measuring component is corrected so that it is located on the transmission path of the element, i.e., at the corresponding element's coordinates (Y-axis coordinates).

[0089] For example, please see Figure 5 Normally, the circuit board 30 moves along direction N. In order to make the first measuring component 100 be in the coordinates (i.e., Y-axis coordinates) of the corresponding component, the first measuring component 100 is moved along the Y-axis direction. The position of the first measuring component 100 is adjusted so that the Y-axis coordinate of the first measuring component 100 in the coordinate system is consistent with the Y-axis coordinate of the component in the coordinate system, thus completing the correction of the position of the first measuring component 100.

[0090] Similarly, in order to make the second measuring component 200 be positioned at the coordinates (i.e., the Y-axis coordinate) of the corresponding element, the second measuring component 200 is moved along the Y-axis direction to adjust its position so that the Y-axis coordinate of the second measuring component 200 in the coordinate system is consistent with the Y-axis coordinate of the element in the coordinate system, thus completing the correction of the position of the second measuring component 200.

[0091] S200: When the normal circuit board reaches the measurement position, the normal component angle generated by the passing of the component is measured by the first measurement component, and the normal substrate angle generated by the passing of the substrate is measured by the second measurement component.

[0092] Specifically, when a normal circuit board is detected to have reached the measurement position, a first measurement command is sent to the first measurement component. Upon receiving the first measurement command, the first measurement component begins operation, measuring the normal component angle generated when a component on the normal circuit board passes the measurement position. This allows the first measurement component to measure the normal component angle generated by the passing of a component on the normal circuit board. The normal component angle is the angle formed by the first measuring rod of the first measurement component and the vertical direction. For example... Figure 1 The first measuring rod 101 shown forms an angle α1 with the vertical direction. A second measuring command is sent to the second measuring component. Upon receiving the second measuring command, the second measuring component starts operating and measures the normal substrate angle generated when the substrate of a normal circuit board passes through the measuring position. This achieves the measurement of the normal substrate angle generated when the substrate passes through, which is the angle formed by the second measuring rod of the second measuring component and the vertical direction. For example... Figure 1 The angle β1 formed between the second measuring rod 201 and the vertical direction is shown.

[0093] It should be understood that the first and second measuring components can use height sensors or angle sensors (such as photoelectric encoders) to sense the angle generated by the passage of the component and the substrate. In other words, the normal component angle and the normal substrate angle can be measured by using angle sensors or other means.

[0094] In some embodiments, the height measurement method for the circuit board components before the normal circuit board reaches the measurement position further includes, but is not limited to, the following steps S201-S202:

[0095] S201: Determine whether the normal circuit board or the circuit board under test has reached the sensing position.

[0096] S202: When in the sensing position, it emits high-frequency pulses and collects measurement signals returned from the first and second measurement components in real time.

[0097] In this embodiment of the invention, the conveyor belt of the conveying mechanism is provided with a feeding station, a connecting station, a measuring position, and a sensing position. The measuring position is set at any suitable position between the feeding station and the connecting station, and the sensing position is set at any suitable position between the feeding station and the measuring position. That is, the sensing position is the position before the measuring position and after the feeding station.

[0098] Specifically, a sensor is placed at the sensing position to detect whether the normal circuit board or the circuit board under test (i.e., the target circuit board) has reached the sensing position. When the normal circuit board or the circuit board under test reaches the sensing position, i.e., when the normal circuit board or the circuit board under test is in the sensing position, a high-frequency pulse is emitted to the first measurement component and the second measurement component, and the measurement signals of the first measurement component and the second measurement component are collected. The measurement signals are the component angles and substrate angles generated when the components and substrate of the circuit board pass through. After emitting the high-frequency pulse to the first measurement component and the second measurement component, the measurement signals returned by the first measurement component and the second measurement component are collected in real time, and the measurement signals are analyzed to obtain the component angles and substrate angles generated when the components and substrate pass through.

[0099] In this way, when the normal circuit board or the circuit board under test is in the sensing position, a high-frequency pulse is emitted in advance and the measurement signals returned by the first measurement component and the second measurement component are collected. This avoids measurement errors that may occur when the measurement position is in the wrong place due to the failure to send high-frequency pulses in time to collect measurement signals or the delay in collecting measurement signals, thus improving the accuracy of the measurement results.

[0100] It should be understood that the sensor can be any suitable type of sensor, such as a limit sensor or a pressure sensor. By sensing the positional or pressure changes that occur when the normal circuit board or the circuit board under test moves to the sensing position, the sensor can determine whether the normal circuit board or the circuit board under test has reached the sensing position.

[0101] In some embodiments, a high-frequency pulse is emitted and measurement signals returned from the first measurement component and the second measurement component are acquired in real time, including but not limited to the following steps S2021-S2023:

[0102] S2021: Obtain the model number of the component on the normal circuit board or the circuit board under test.

[0103] S2022: Set the corresponding high-frequency pulse according to different models.

[0104] S2023: Transmit high-frequency pulses of the corresponding frequency and collect measurement signals returned from the first and second measurement components in real time.

[0105] In this embodiment of the invention, different components use high-frequency pulses of different frequencies to acquire measurement signals from the first measurement component and the second measurement component. The model data of components on a normal circuit board or the circuit board under test is stored in any suitable medium. When needed, the model number of the component on the circuit board can be obtained from the medium storing the component model data.

[0106] In this step, a model-frequency lookup table is pre-constructed. This table is used to characterize the correspondence between the model of a component and the frequency of a high-frequency pulse. For example, in some embodiments, the model-frequency lookup table is shown in Table 1 below:

[0107] Table 1:

[0108] Component model High frequency pulse frequency A24 300kHz B52 500kHz C66 1MHz D42 2MHz E84 5MHz F93 10MHz G10 20MHz

[0109] Specifically, the model number of the component on the target circuit board or the circuit board under test is obtained from the storage medium, and the target frequency of the high-frequency pulse corresponding to the model number of the component is found from the model-frequency lookup table. The high-frequency pulse of the corresponding frequency (i.e. the target frequency) is set, and the high-frequency pulse is emitted to the first measurement component and the second measurement component to collect the measurement signals returned by the first measurement component and the second measurement component in real time. Then, the measurement signals are analyzed to obtain the component angle and the substrate angle generated when the component and the substrate of the target circuit board or the circuit board under test pass through.

[0110] For example, as shown in Table 1 above, the model-frequency lookup table is as follows. The model of the component is E84. The target frequency of the high-frequency pulse corresponding to the model of the component E84 is found to be 5MHz from the model-frequency lookup table. The high-frequency pulse with a target frequency of 5MHz is set as the target transmission pulse. The high-frequency pulse with a target frequency of 5MHz is transmitted to the first measurement component and the second measurement component, and the measurement signals returned from the first measurement component and the second measurement component are collected in real time.

[0111] S300: Transmit the target circuit board. When the target circuit board reaches the measurement position, the first measurement component measures the target component angle generated by the passing of the component, and the second measurement component measures the target substrate angle generated by the passing of the substrate.

[0112] In this embodiment of the invention, the target circuit board (i.e. the circuit board under test) and the normal circuit board are the same type of circuit board. The same type of circuit board means that the position, quantity and structure of the components on the substrate are the same in design. Only due to the process error of manufacturing, the actual position, actual quantity and actual posture of the components may be different, which will affect the signal transmission of the components and thus affect the quality of the circuit board.

[0113] Specifically, the target circuit board is manually placed at the loading station of the conveyor mechanism, or automatically transferred from the previous process to the loading station. Then, the conveyor mechanism is controlled to begin transporting the target circuit board from the loading station to the receiving station. When the target circuit board is detected to have reached the measurement position, a first measurement command is sent to the first measurement component. Upon receiving the first measurement command, the first measurement component starts working and measures the target component angle generated when the component of the target circuit board passes through the measurement position. This achieves the measurement of the target component angle generated by the passing of the component, where the target component angle is the angle formed by the first measuring rod of the first measurement component and the vertical direction. For example... Figure 1 The first measuring rod 101 shown forms an angle α2 with the vertical direction. A second measuring command is sent to the second measuring component. Upon receiving the second measuring command, the second measuring component starts operating and measures the target substrate angle generated when the substrate of the target circuit board passes through the measuring position. The target substrate angle is the angle formed by the second measuring rod of the second measuring component and the vertical direction, for example... Figure 1 The angle β2 formed between the second measuring rod 201 and the vertical direction is shown.

[0114] It is easy to understand that the first and second measuring components can use height sensors or angle sensors (such as photoelectric encoders) to sense the angle generated by the passage of the component and the substrate. In other words, the angle of the target component and the angle of the target substrate can be measured by using angle sensors or the like.

[0115] S400: The actual height of the component on the target circuit board is obtained based on its own height, normal component angle, normal substrate angle, target component angle, and target substrate angle.

[0116] For example, a trigonometric function formula is pre-designed, and the height of the component itself, the angle of the normal component, the angle of the normal substrate, the angle of the target component, and the angle of the target substrate are substituted into the trigonometric function formula. The actual height of the component on the target circuit board is then calculated using the trigonometric function formula. It is readily understood that embodiments of the present invention can design a trigonometric function formula based on the length of the first measuring rod of the first measuring component, the length of the second measuring rod of the second measuring component, trigonometric function relationships, etc.

[0117] For example, the formulas for trigonometric function relationships are:

[0118] H t =H0 + ΔH1 - ΔH2

[0119] ΔH1=R1*(cosθ1-cosθ2)

[0120]

[0121] Among them, H t Here, H0 represents the actual height of the component on the target circuit board, θ1 represents the angle of the target component, and θ2 represents the angle of the normal component. For the target substrate angle, For the normal substrate angle, R1 is the length of the first measuring rod, and R2 is the length of the second measuring rod. The lengths of the first measuring rod and the second measuring rod may be the same or different.

[0122] Of course, other methods or approaches can be used to calculate the actual height of the component on the target circuit board based on its own height, normal component angle, normal substrate angle, target component angle, and target substrate angle. This embodiment of the invention does not impose any limitations on this.

[0123] In some embodiments, the actual height of the component on the target circuit board is obtained based on its own height, normal component angle, normal substrate angle, target component angle, and target substrate angle, specifically including but not limited to the following steps S410-S430:

[0124] S410: Angle and height reference table for setting the target circuit board based on requirements.

[0125] In this step, an angle-to-height reference table for the target circuit board is pre-set based on requirements (e.g., the length of the first measuring rod of the first measuring component and the length of the second measuring rod of the second measuring component). This table represents the correspondence between angles and heights. Specifically, based on the lengths of the first and second measuring rods of the first and second measuring components, trigonometric functions are used to calculate the corresponding component height and substrate height based on the component angle, substrate angle, length of the first measuring rod, and length of the second measuring rod. The component height is then mapped one-to-one with the component angle, and the substrate height with the substrate angle, resulting in the angle-to-height reference table. The component height, component angle, and length of the first measuring rod satisfy the following relationship: H 11 =R 11 *cosθ 11 H 11 R is the component height. 11 Let θ be the length of the first measuring rod. 11 Let H be the component angle. Similarly, the substrate height, substrate angle, and length of the second measuring rod satisfy the following relationship: H 22 =R 22 *cosθ 22 H 22 R is the height of the substrate. 22 Let θ be the length of the second measuring rod. 22 The angle is the substrate angle.

[0126] For example, the length R of the first measuring rod 11 The length R of the second measuring rod is 20cm. 22 The angle height is 25cm, and the corresponding table is shown in Table 2 below:

[0127] Table 2:

[0128]

[0129]

[0130] S420: Based on the angle height comparison table, obtain the normal component height corresponding to the normal component angle, the normal substrate height corresponding to the normal substrate angle, the target component height corresponding to the target component angle, and the target substrate height corresponding to the target substrate angle.

[0131] S430: Based on its own height, normal component height, normal substrate height, target component height, and target substrate height, the actual height of the component on the target circuit board is obtained.

[0132] Specifically, based on the angle height comparison table, find the normal component height corresponding to the normal component angle, the normal substrate height corresponding to the normal substrate angle, the target component height corresponding to the target component angle, and the target substrate height corresponding to the target substrate angle.

[0133] Then, the component's own height, normal component height, normal substrate height, target component height, and target substrate height are substituted into the height calculation formula, and the actual height of the component on the target circuit board is calculated using the height calculation formula.

[0134] In this embodiment of the invention, the height calculation formula is as follows:

[0135] H T =H c +(H t11 -H t12 )-(H t21 -H t22 )

[0136] Among them, H T H represents the actual height of the component on the target circuit board. c H is the height of the component itself. t11 H is the height of the target component. t12 For normal component height, H t21 H represents the target substrate height. t22 This is the normal substrate height.

[0137] S500: Determines whether the height of the component on the target circuit board is normal based on the actual height.

[0138] Specifically, an allowable error range is set. This error is used to compensate for issues that do not affect the use of the component during the soldering process, and also to compensate for slight fluctuations that occur during circuit board transport. In this embodiment, the error range can be [H0-δ, H0+δ], where H0 is the component's height and δ is a preset allowable height error value. After obtaining the actual height of the component on the target circuit board, the actual height is compared with the error range to determine whether the component's height on the target circuit board is normal. When the actual height is within the error range, the component's height on the target circuit board is determined to be normal; when the actual height is not within the error range, the component's height on the target circuit board is determined to be abnormal.

[0139] It should be understood that other methods or approaches can also be used to determine whether the height of the component on the target circuit board is normal based on the actual height. Those skilled in the art can use any suitable method or approach according to actual needs, and the embodiments of the present invention do not limit this in any way.

[0140] For example, in some embodiments, determining whether the height of the component on the target circuit board is normal is based on its actual height, specifically including but not limited to the following steps S510-S540:

[0141] S510: Set condition values ​​according to requirements.

[0142] S520: Compare the actual height with the condition value to determine whether the height of the component is normal.

[0143] S530: When the actual height is greater than or equal to the condition value, it indicates that the height of the component is abnormal.

[0144] S540: When the actual height is less than the condition value, it indicates that the height of the component is normal.

[0145] In this step, due to the allowable error range of the welding and installation processes, the height of the component on the circuit board may not be the standard value, but may be within a certain range above and below the standard value without affecting the use of the component. Therefore, set the condition value for judging whether the height of the component is normal according to the actual needs.

[0146] Specifically, after obtaining the actual height of the component on the target circuit board, the actual height is compared with a conditional value to determine whether the component's height is normal. When the actual height is greater than or equal to the conditional value, it indicates that the component is too tall and protrudes excessively from the target circuit board, thus determining that the component's height is abnormal. When the actual height is less than the conditional value, it indicates that the component's height is appropriate and suitable for the target circuit board, thus determining that the component's height is normal.

[0147] For example, in some embodiments, determining whether the height of the component on the target circuit board is normal is based on its actual height, specifically including but not limited to the following steps S550-S590:

[0148] S550: Set condition values ​​and normal ranges according to requirements.

[0149] S560: Compare whether the difference between the actual height and the condition value is within the normal range.

[0150] S570: When the difference is within the normal range, it indicates that the height of the component is normal.

[0151] S580: When the difference is greater than the normal range, it indicates that the height of the component is too high.

[0152] S590: When the difference is less than the normal range, it indicates that the component is missing.

[0153] In this step, you can set the condition values ​​and normal ranges for judging whether the height of the component is normal, according to actual needs.

[0154] Specifically, after obtaining the actual height of the component on the target circuit board, the target difference between the actual height and the conditional value is calculated. This target difference is then compared with the normal range to determine whether the component's height is normal. When the target difference is within the normal range, it indicates that the component's height is appropriate and suitable on the target circuit board, thus confirming that the component's height is normal. When the target difference is greater than the normal range, it indicates that the component protrudes too much on the target circuit board, meaning its actual height is too high, thus confirming that the component's height is excessively high. When the target difference is less than the normal range, it indicates that the component is too recessed on the target circuit board, meaning its actual height is too low, thus confirming that the component is missing.

[0155] In some embodiments, after determining whether the height of the component on the target circuit board is normal based on the actual height, the height measurement method for the circuit board component further includes, but is not limited to, the following steps S501-S503:

[0156] S501: As the target circuit board is transferred to AOI, the judgment result is stored in the AOI output TXT and displayed in the AOI output repair station result.

[0157] In this step, the judgment results for whether the height of the components on the target circuit board is normal include excessive height, normal height, and missing components.

[0158] After measuring the actual height of the component on the target circuit board and determining whether the height of the component on the target circuit board is normal, the target circuit board is transported to the subsequent process, that is, the target circuit board is transferred to the AOI equipment for optical board measurement, and the judgment result is stored in the output TXT of the AOI equipment and displayed in the repair station result output by the AOI equipment.

[0159] Understandably, the output TXT is a file used by the AOI device to store the results of its judgment on whether the height of components on the target circuit board is normal. The output TXT can be any suitable file type and can be stored on any suitable medium.

[0160] S502: Set the "excessive height" and "missing parts" results in the judgment results as abnormal errors.

[0161] S503: If an error occurs, the error will be displayed in front of the AOI output of the maintenance station results, and the image of the component taken by the AOI will be displayed.

[0162] Specifically, the height measurement system is pre-set to report errors for excessive height or missing components in the judgment results. That is, if the judgment result indicates excessive height or missing components, the height measurement system will generate an error message. If the judgment result indicates excessive height or missing components, and the height measurement system generates an error message, this message will be displayed before the repair station results output by the AOI equipment. The system will also retrieve the image of the component on the target circuit board taken by the AOI equipment, thus avoiding information overwriting by the AOI equipment and preventing the error message from being ignored. Based on the image of the component, the system will determine the specific location of the component on the target circuit board, and then process the component or discard the target circuit board.

[0163] In summary, the height measurement method for circuit board components provided by this invention involves transmitting a normal circuit board, obtaining the height of the components on the normal circuit board, correcting the positions of the first and second measuring components, measuring the normal component angle generated when the component on the normal circuit board passes through using the first measuring component, and measuring the normal substrate angle generated when the substrate of the normal circuit board passes through using the second measuring component, transmitting the target circuit board to the measurement position, measuring the target component angle generated when the component on the target circuit board passes through using the first measuring component, and measuring the target substrate angle generated when the substrate of the target circuit board passes through using the second measuring component, and obtaining the actual height of the component on the target circuit board based on its own height, normal component angle, normal substrate angle, target component angle, and target substrate angle, and determining whether the height of the component on the target circuit board is normal based on the actual height. This invention eliminates the need for laser measurement of component height; the actual height of the component on the target circuit board can be calculated by measuring the angles of the components and substrate of the normal circuit board and the target circuit board, thereby determining whether the component height is normal. This method does not affect production efficiency, offers high cost-effectiveness in height measurement, and improves the accuracy of measurement results.

[0164] This invention provides a computer-readable storage medium storing processor-executable computer program instructions. When executed by a processor, the computer program instructions cause the computer to perform any of the height measurement methods for circuit board components provided in this invention, or to perform the steps in any of the implementations of the height measurement methods for circuit board components provided in this invention.

[0165] In some embodiments, the storage medium may be a flash memory, a hard disk, an optical disk, a register, a magnetic surface memory, a removable disk, a CD-ROM, a random access memory (RAM), a read-only memory (ROM), an electrically programmable ROM, and an electrically erasable programmable ROM, or any other form of storage medium known in the art, or various devices including one or any combination of the above storage media.

[0166] In some embodiments, computer program instructions may take the form of programs, software, software modules, scripts, or code, written in any form of programming language (including compiled or interpreted languages, or declarative or procedural languages), and may be deployed in any form, including as stand-alone programs or as modules, components, subroutines, or other units suitable for use in a computing environment.

[0167] As an example, computer program instructions may, but do not necessarily, correspond to files in a file system, and may be stored as part of a file that holds other programs or data, for example, in one or more scripts in a Hyper Text Markup Language (HTML) document, in a single file dedicated to the program in question, or in multiple collaborative files (e.g., a file that stores one or more modules, subroutines, or code sections).

[0168] As an example, computer program instructions can be deployed to execute on a single computing device (including devices such as smart terminals and servers), or on multiple computing devices located in one location, or on multiple computing devices distributed across multiple locations and interconnected via a communication network. It is readily understood that all or part of the steps of the methods described in the embodiments of the present invention above can be implemented directly using electronic hardware or processor-executable computer program instructions, or a combination of both.

[0169] Those skilled in the art will understand that the embodiments provided by this invention are merely illustrative. The order in which the steps in the methods of the embodiments are written does not imply a strict execution order and does not constitute any limitation on the implementation process. The order can be adjusted, merged, and deleted according to actual needs. Modules or sub-modules, units or sub-units in the apparatus or system of the embodiments can be merged, divided, and deleted according to actual needs. For example, the division of units is only a logical functional division, and there may be other division methods in actual implementation. For another example, multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed.

[0170] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented using software plus a general-purpose hardware platform, or of course, it can be implemented using hardware. Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This computer program can be stored in a computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods.

[0171] It should be noted that the above embodiments are for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. Those skilled in the art can understand that all or part of the processes of the above embodiments can be implemented by modifying the technical solutions described in the embodiments of the present invention, or by making equivalent substitutions for some of the technical features. It is understood that these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and should be considered as equivalent changes and modifications made based on the embodiments of the present invention, all of which should fall within the scope of the claims of the present invention.

Claims

1. A method for measuring the height of circuit board components, used to measure the substrate of the circuit board and the components disposed on the substrate, characterized in that, The method includes: Transmit the normal circuit board and obtain the height of the components themselves, and correct the position of the first measurement component and the second measurement component during the transmission process; When the normal circuit board reaches the measurement position, the normal component angle generated by the passing of the component is measured by the first measurement component, and the normal substrate angle generated by the passing of the substrate is measured by the second measurement component. The target circuit board is transferred. When the target circuit board reaches the measurement position, the target component angle generated by the passing of the component is measured by the first measurement component, and the target substrate angle generated by the passing of the substrate is measured by the second measurement component. The actual height of a component on the target circuit board is obtained based on its own height, normal component angle, normal substrate angle, target component angle, and target substrate angle. This includes: setting an angle height lookup table for the target circuit board based on requirements; obtaining the normal component height corresponding to the normal component angle, the normal substrate height corresponding to the normal substrate angle, the target component height corresponding to the target component angle, and the target substrate height corresponding to the target substrate angle based on the angle height lookup table; and obtaining the actual height of the component on the target circuit board based on its own height, normal component height, normal substrate height, target component height, and target substrate height. Determine whether the height of the component on the target circuit board is normal based on its actual height.

2. The method according to claim 1, characterized in that, The correction of the positions of the first measuring component and the second measuring component includes: Establish a coordinate system based on the normal moving plane of the circuit board, and obtain the coordinates of the components in the coordinate system; The positions of the first and second measuring components are corrected according to the coordinates of the components, so that the first and second measuring components are both located at the coordinates of the corresponding components.

3. The method according to claim 1, characterized in that, Before the normal circuit board reaches the measurement position, the method further includes: Determine whether a normal circuit board or the circuit board under test has reached the sensing position, which is the position before the measurement position; When in the sensing position, it emits high-frequency pulses and collects measurement signals returned from the first and second measurement components in real time.

4. The method according to claim 3, characterized in that, The process of transmitting high-frequency pulses and acquiring measurement signals returned from the first and second measurement components in real time includes: Obtain the model numbers of components on a normal circuit board or the circuit board under test; Set the corresponding high-frequency pulse according to different models; It transmits high-frequency pulses of the corresponding frequency and collects measurement signals returned from the first and second measurement components in real time.

5. The method according to claim 1, characterized in that, The method of determining whether the height of the component on the target circuit board is normal based on the actual height includes: Set condition values ​​according to requirements; Compare the actual height with the conditional value to determine whether the height of the component is normal; When the actual height is greater than or equal to the condition value, it indicates that the height of the component is abnormal; When the actual height is less than the condition value, it indicates that the height of the component is normal.

6. The method according to claim 1, characterized in that, The method of determining whether the height of the component on the target circuit board is normal based on the actual height also includes: Set the condition values ​​and normal ranges according to your needs; Compare the difference between the actual height and the conditional value to see if it is within the normal range; When the difference is within the normal range, it indicates that the height of the component is normal; When the difference is greater than the normal range, it indicates that the height of the component is excessively high; When the difference is less than the normal range, it indicates that the component is missing.

7. The method according to claim 1, characterized in that, The judgment results include excessive height, normal, and missing component. After determining whether the height of the component on the target circuit board is normal based on the actual height, the method further includes: As the target circuit board is transferred to AOI, the judgment result is stored in the AOI output TXT and displayed in the AOI output repair station result; Set the "excessive height" and "missing parts" results in the judgment results as abnormal errors; If an error occurs, the error will be displayed in front of the repair station results output by the AOI, and the image of the component taken by the AOI will be displayed.

8. A height measurement system for circuit board components, characterized in that, include: The controller and a first measuring component and a second measuring component communicatively connected to the controller, the first measuring component being used to measure the component angle generated when a component of the circuit board passes by, and the second measuring component being used to measure the substrate angle generated when the substrate of the circuit board passes by. The controller includes: A processor and a memory communicatively connected to the processor; The memory stores computer program instructions executable by the processor, which, when executed by the processor, cause the controller to perform the height measurement method for circuit board components as described in any one of claims 1-7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores processor-executable computer program instructions, which, when executed by the processor, cause the computer to perform the height measurement method for a circuit board element as described in any one of claims 1-7.

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