Temperature control method and device

Abstract

The invention relates to a temperature control method and device, and belongs to the technical field of semiconductors. The method comprises the steps that in response to the situation that the board temperature of a circuit board where an electronic element in a controller is located is smaller than the condensation recognition temperature, a refrigeration assembly is controlled to stop refrigeration; and performing refrigeration control on the refrigeration assembly according to the junction temperature of the electronic component in response to the condition that the board temperature of the electronic component is greater than or equal to the condensation identification temperature. The working state of the refrigeration assembly can be dynamically adjusted according to the plate temperature and / or junction temperature of the electronic element, condensation of the electronic element can be prevented, damage of high temperature to the electronic element can be avoided, then the processing performance of the electronic element can be guaranteed, and the service life of the electronic element is prolonged.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor technology, and in particular to a temperature control method and device. Background Art

[0002] Electronic components within a vehicle's domain controller, such as the system on chip (SOC), will affect the SOC's processing performance in high or low temperature environments. Ensuring that the SOC is in a suitable temperature environment is a problem that needs to be addressed. Summary of the Invention

[0003] The present disclosure provides a temperature control method, device, chip, electronic device, and computer-readable storage medium to adjust the ambient temperature of electronic components, ensure that the electronic components have better processing performance, and extend the life of the electronic components. The technical solutions of the present disclosure are as follows:

[0004] According to a first aspect of an embodiment of the present disclosure, there is provided a temperature control method, comprising:

[0005] In response to the board temperature of the circuit board where the electronic components in the controller are located being lower than the condensation recognition temperature, controlling the refrigeration component to stop refrigeration;

[0006] In response to the board temperature of the electronic component being greater than or equal to the condensation recognition temperature, the refrigeration component is controlled to be cooled according to the junction temperature of the electronic component.

[0007] In the above embodiment, when the board temperature of the electronic component is lower than the condensation recognition temperature, the refrigeration component is controlled to stop refrigeration, so that the temperature of the surface of the electronic component can be relatively high, and try not to be lower than the condensation recognition temperature of the environment, so as to prevent the occurrence of condensation. When the board temperature of the electronic component is greater than or equal to the condensation recognition temperature, the refrigeration component is controlled according to the junction temperature of the electronic component, and refrigeration can be carried out in time when the junction temperature of the electronic component is high, ensuring that the junction temperature of the electronic component is within an appropriate range, avoiding damage to the electronic component or performance degradation caused by the high junction temperature of the electronic component. In the embodiment of the present application, the working state of the TEC refrigeration component can be dynamically adjusted with the board temperature and junction temperature of the SOC, so that a suitable environment can be created for the electronic component, which is not only conducive to ensuring the processing performance of the SOC, but also can extend the life of the electronic component.

[0008] In conjunction with some embodiments of the first aspect, in some embodiments, the method further includes:

[0009] Synchronously acquiring the board temperature and junction temperature of the electronic component; or,

[0010] The board temperature of the electronic component is acquired, and when the board temperature of the electronic component is greater than or equal to a condensation recognition temperature, the junction temperature of the electronic component is acquired.

[0011] In conjunction with some embodiments of the first aspect, in some embodiments, the method further includes:

[0012] In response to the board temperature of the electronic component being greater than or equal to a first set temperature and less than the condensation recognition temperature, the refrigeration assembly is controlled to enter a closed state.

[0013] In the above embodiment, if the board temperature of the electronic component is within a relatively suitable temperature range, the refrigeration component is controlled to be in a closed state, thereby saving energy consumption.

[0014] In conjunction with some embodiments of the first aspect, in some embodiments, the method further includes:

[0015] In response to the board temperature of the electronic component being less than a first set temperature, the refrigeration component is controlled to enter a heating mode, and the operating voltage of the refrigeration component is configured to be a first voltage, wherein the first voltage is less than or equal to the maximum allowable voltage of the refrigeration component and greater than or equal to a set voltage threshold.

[0016] In the above embodiment, heat is provided to the electronic components by heating, and the ambient temperature of the electronic components is provided, thereby ensuring the processing performance of the electronic components.

[0017] In conjunction with some embodiments of the first aspect, in some embodiments, after controlling the refrigeration component to enter the heating mode, the method further includes:

[0018] During the heating process of the refrigeration component, the board temperature of the electronic component is continuously monitored;

[0019] In response to the board temperature of the electronic component rising to a set temperature threshold, controlling the refrigeration assembly to end the heating mode and enter an off state;

[0020] In response to the board temperature of the electronic component not rising to the set temperature threshold, the refrigeration assembly is controlled to continue the heating mode.

[0021] In the above embodiment, under the condition of continuous low temperature, the refrigeration component can be continuously heated until a suitable set temperature threshold is reached, making the heating process intelligent.

[0022] In conjunction with some embodiments of the first aspect, in some embodiments, controlling the cooling of the cooling assembly according to the junction temperature of the electronic component includes:

[0023] In response to a junction temperature of the electronic component being greater than or equal to a second set temperature, controlling the refrigeration assembly to enter a refrigeration mode, wherein the second set temperature is greater than the condensation recognition temperature;

[0024] A target temperature range of the junction temperature is determined, and an operating voltage of the refrigeration component is configured according to the target temperature range.

[0025] In conjunction with some embodiments of the first aspect, in some embodiments, configuring the operating voltage of the refrigeration component according to the target temperature range includes:

[0026] According to the target temperature range, query the mapping relationship between the temperature range and the voltage configuration information;

[0027] Determining target voltage configuration information corresponding to the target temperature range according to the mapping relationship;

[0028] The operating voltage of the refrigeration component is configured according to the target voltage configuration information.

[0029] In conjunction with some embodiments of the first aspect, in some embodiments, configuring the operating voltage of the refrigeration component according to the target voltage configuration information includes:

[0030] In response to the target voltage configuration information including a target voltage interval, configuring the operating voltage of the refrigeration component to be within the target voltage interval; or,

[0031] In response to the target voltage configuration information including a target voltage, the operating voltage of the refrigeration component is configured to be the target voltage.

[0032] In combination with some embodiments of the first aspect, in some embodiments, the operating voltage configured for the refrigeration component is positively correlated with the target temperature range.

[0033] In the above embodiment, when the junction temperature of the electronic component is high, cooling is used to reduce the junction temperature of the electronic component, thereby preventing damage to the electronic component and extending the life of the electronic component. Furthermore, based on the actual junction temperature, an appropriate operating voltage can be configured for the cooling component, thereby achieving a balance between cooling effect and energy efficiency.

[0034] In conjunction with some embodiments of the first aspect, in some embodiments, after configuring the operating voltage of the refrigeration component according to the target temperature range, the method further includes:

[0035] In response to the operating voltage of the refrigeration component being configured as the maximum allowable voltage of the refrigeration component and the junction temperature of the electronic component being greater than or equal to a set junction temperature threshold, the operating frequency of the electronic component is reduced.

[0036] In the above embodiment, when the junction temperature of the electronic component is high, the power consumption of the electronic component is further reduced by frequency reduction, thereby quickly reducing the junction temperature of the electronic component, which is beneficial to protecting the electronic component and extending its life.

[0037] In conjunction with some embodiments of the first aspect, in some embodiments, controlling the cooling of the cooling assembly according to the junction temperature of the electronic component includes:

[0038] In response to the junction temperature of the electronic component being lower than a second set temperature, the refrigeration assembly is controlled to enter a closed state, wherein the second set temperature is higher than the condensation recognition temperature.

[0039] In some embodiments, when the junction temperature of the electronic component has not reached the second set temperature, the refrigeration component does not need to be turned on for cooling, thereby saving energy consumption.

[0040] In conjunction with some embodiments of the first aspect, in some embodiments, the method further includes:

[0041] In response to not acquiring the junction temperature of the electronic component, controlling the refrigeration component to enter a refrigeration mode, and configuring the operating voltage of the refrigeration component to be a second voltage, where the second voltage is less than a maximum allowable voltage of the refrigeration component.

[0042] In the above embodiment, the board temperature of the electronic component is lowered by cooling the refrigeration assembly, thereby avoiding the electronic component being unable to power on or wake up quickly due to the increase in board temperature, and enabling rapid power on or wake up.

[0043] In conjunction with some embodiments of the first aspect, in some embodiments, before obtaining one of the board temperature of the circuit board where the electronic component in the controller is located and the junction temperature of the electronic component, the method further includes:

[0044] Instruction information is received, where the instruction information is used to instruct the domain controller to enter a standby state.

[0045] According to a second aspect of an embodiment of the present disclosure, there is provided a temperature control device, comprising:

[0046] The control module is used to control the refrigeration component to stop refrigeration when the board temperature of the circuit board where the electronic components in the controller are located is lower than the condensation recognition temperature, and to control the refrigeration component to stop refrigeration when the board temperature of the electronic components is greater than or equal to the condensation recognition temperature according to the condensation temperature of the electronic components.

[0047] In conjunction with some embodiments of the second aspect, in some embodiments, the apparatus further includes:

[0048] A temperature monitoring module is built into the circuit board where the electronic component is located, and is used to collect the board temperature of the electronic component.

[0049] In combination with some embodiments of the second aspect, in some embodiments, the temperature monitoring module includes a thermistor temperature sensor.

[0050] In conjunction with some embodiments of the second aspect, in some embodiments, the control module is further configured to:

[0051] In response to the board temperature of the electronic component being greater than or equal to a first set temperature and less than the condensation recognition temperature, the refrigeration assembly is controlled to enter a closed state.

[0052] In conjunction with some embodiments of the second aspect, in some embodiments, the control module is further configured to:

[0053] In response to the board temperature of the electronic component being less than a first set temperature, the refrigeration component is controlled to enter a heating mode, and the operating voltage of the refrigeration component is configured to be a first voltage, wherein the first voltage is less than or equal to the maximum allowable voltage of the refrigeration component and greater than or equal to a set voltage threshold.

[0054] In conjunction with some embodiments of the second aspect, in some embodiments, the control module is further configured to:

[0055] After the refrigeration component enters the heating mode, the board temperature of the electronic component is continuously monitored during the heating process of the refrigeration component;

[0056] In response to the board temperature of the electronic component rising to a set temperature threshold, controlling the refrigeration assembly to end the heating mode and enter an off state;

[0057] In response to the board temperature of the electronic component not rising to the set temperature threshold, the refrigeration assembly is controlled to continue the heating mode.

[0058] In conjunction with some embodiments of the second aspect, in some embodiments, the control module is further configured to:

[0059] In response to a junction temperature of the electronic component being greater than or equal to a second set temperature, controlling the refrigeration assembly to enter a refrigeration mode, wherein the second set temperature is greater than the condensation recognition temperature;

[0060] determining a target temperature range within which the junction temperature of the electronic component lies;

[0061] The operating voltage of the refrigeration component is configured according to the target temperature range.

[0062] In conjunction with some embodiments of the second aspect, in some embodiments, the control module is further configured to:

[0063] According to the target temperature range, query the mapping relationship between the temperature range and the voltage configuration information;

[0064] Determining target voltage configuration information corresponding to the target temperature range according to the mapping relationship;

[0065] The operating voltage of the refrigeration component is configured according to the target voltage configuration information.

[0066] In conjunction with some embodiments of the second aspect, in some embodiments, the control module is further configured to:

[0067] In response to the target voltage configuration information including a target voltage interval, configuring the operating voltage of the refrigeration component to be within the target voltage interval; or,

[0068] In response to the target voltage configuration information including a target voltage, the operating voltage of the refrigeration component is configured to be the target voltage.

[0069] In combination with some embodiments of the second aspect, in some embodiments, the operating voltage configured for the refrigeration component is positively correlated with the target temperature range.

[0070] In conjunction with some embodiments of the second aspect, in some embodiments, the apparatus further includes:

[0071] A frequency reduction module is used to reduce the operating frequency of the electronic component after configuring the operating voltage of the refrigeration component, in response to the operating voltage of the refrigeration component being configured as the maximum allowable voltage of the refrigeration component and the junction temperature of the electronic component being greater than or equal to a set junction temperature threshold.

[0072] In conjunction with some embodiments of the second aspect, in some embodiments, the control module is further configured to:

[0073] In response to the junction temperature of the electronic component being lower than a second set temperature, the refrigeration assembly is controlled to enter a closed state, wherein the second set temperature is higher than the condensation recognition temperature.

[0074] In conjunction with some embodiments of the second aspect, in some embodiments, the control module is further configured to:

[0075] In response to not acquiring the junction temperature of the electronic component, controlling the refrigeration component to enter a refrigeration mode, and configuring the operating voltage of the refrigeration component to be a second voltage, where the second voltage is less than a maximum allowable voltage of the refrigeration component.

[0076] In conjunction with some embodiments of the second aspect, in some embodiments, the apparatus further includes:

[0077] The receiving module receives instruction information before obtaining the board temperature and the junction temperature of the electronic component, where the instruction information is used to instruct the controller to enter a standby state.

[0078] The third aspect embodiment of the present disclosure proposes an electronic device, comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the method described in the first aspect embodiment of the present disclosure.

[0079] The fourth aspect embodiment of the present disclosure proposes a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable a computer to execute the method described in the first aspect embodiment of the present disclosure.

[0080] A fifth embodiment of the present disclosure provides a computer program product, including a computer program, which executes the method described in the first embodiment of the present disclosure when executed by a processor.

[0081] The sixth aspect embodiment of the present disclosure proposes a chip, which includes one or more interface circuits and one or more processors; the interface circuit is used to receive signals from the memory of the electronic device and send signals to the processor, the signals including computer instructions stored in the memory, and when the processor executes the computer instructions, the electronic device executes the method described in the first aspect embodiment of the present disclosure.

[0082] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0083] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the description are used to explain the principles of the present disclosure, and do not constitute an improper limitation of the present disclosure.

[0084] Figure 1 A schematic diagram of an application scenario provided by an embodiment of the present disclosure;

[0085] Figure 2 A schematic flow chart of a temperature control method provided in an embodiment of the present disclosure;

[0086] Figure 3 A schematic flow chart of a temperature control method provided in an embodiment of the present disclosure;

[0087] Figure 4 A schematic flow chart of a temperature control method provided in an embodiment of the present disclosure;

[0088] Figure 5 A schematic structural diagram of a temperature control device provided in an embodiment of the present disclosure;

[0089] Figure 6 A schematic diagram of the structure of an electronic device provided in an embodiment of the present disclosure;

[0090] Figure 7 A schematic diagram of the structure of a chip provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0091] In order to enable ordinary persons in the art to better understand the technical solutions of the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings.

[0092] It should be noted that the terms "first," "second," and the like in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the numbers used in this manner are interchangeable where appropriate so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure as detailed in the appended claims.

[0093] The electronic components within a vehicle's domain controller generate heat during operation, causing the temperature of the circuit boards to rise continuously. When the circuit board's surface temperature falls below the ambient dew point, condensation forms, and this condensation drips onto the circuit board, potentially causing component failure. Furthermore, when electronic components are exposed to low temperatures, their processing performance decreases and their power consumption increases.

[0094] In order to solve the problems existing in the related art, the present disclosure proposes a temperature control method, device, chip, electronic device and storage medium. In response to the board temperature of the circuit board where the electronic component is located in the controller being lower than the condensation recognition temperature, the refrigeration component is controlled to stop refrigeration, so that the temperature of the surface of the electronic component can be relatively high and will not be lower than the condensation recognition temperature of the environment as much as possible, thereby preventing the occurrence of condensation. In response to the board temperature of the electronic component being greater than or equal to the condensation recognition temperature, the refrigeration component is controlled to refrigerate according to the junction temperature of the electronic component. Refrigeration can be carried out in a timely manner when the junction temperature of the electronic component is high, ensuring that the junction temperature of the electronic component is within an appropriate range, thereby avoiding damage to the electronic component or performance degradation caused by the high junction temperature of the electronic component. In the embodiment of the present application, the working state of the refrigeration component can be dynamically adjusted according to the board temperature and junction temperature of the electronic component, thereby creating a suitable environment for the electronic component, which is not only conducive to ensuring the processing performance of the SOC, but also can extend the life of the electronic component.

[0095] Before introducing the detailed solution of the present disclosure, taking the electronic component as SOC and the cooling component as a semiconductor cooling chip (Thermoelectric Cooler, TEC) as an example, the scenario in which the solution of the present disclosure is applied is first described. Figure 1 This is a schematic diagram of an application scenario provided by an embodiment of the present disclosure. Figure 1 As shown, from top to bottom are a water cooling plate 101, a coolant 102, a thermal conductive adhesive 103, a semiconductor refrigeration sheet (Thermoelectric Cooler, TEC) 104, a low power double data rate memory (Low Power Double Data Rate, LPDDR) 105 and a chip package 106, wherein the heat dissipation structure is mainly used to dissipate heat for the chip package 106.

[0096] Optionally, the chip package 106 may include a plurality of chip units 107 cut from a wafer.

[0097] Optionally, the water cooling plate 101 is used to dissipate heat from the chip package 106 via the cooling liquid 102 .

[0098] Optionally, the coolant 102 is used to flow in the water-cooled plate 101 to remove heat generated when the SOC is working.

[0099] Optionally, thermal conductive adhesive 103 is used to connect the water cooling plate 101 and the TEC 104 , and to connect the TEC 104 and the LPDDR 105 , to assist in conducting heat from the chip package 106 to the water cooling plate 101 .

[0100] Optionally, the TEC 104 includes a hot side and a cold side. The TEC 104 has an active cooling function. When the temperature is high, it can enter a cooling mode to transfer heat from the cold side to the hot side. Specifically, it absorbs heat from the cold side and releases it on the hot side, thereby lowering the temperature of the hot side and providing a lower ambient temperature for the SOC. The TEC 104 also has an active heating function. When the temperature is low, it can enter a heating mode to raise the temperature of the cold side, thereby providing a higher ambient temperature for the SOC. Through both heating and cooling functions, the TEC 104 can provide a suitable ambient temperature for the SOC, thereby improving the processing performance of the SOC. The TEC 104 has two power supply terminals, U+ and U-. Applying a voltage to the TEC 104 via the U+ or U- terminals creates a temperature differential across the cooling block. The voltage direction can optionally cause the TEC 104 to perform either cooling or heating. For example, a voltage provided by the U+ terminal causes the TEC to perform cooling, while a voltage provided by the U- terminal causes the TEC to perform heating.

[0101] Optionally, LPDDR 105 is a low-power dynamic random access memory connected to the chip package 106 .

[0102] When the ambient temperature of the SOC is high, the heat is transferred from the chip package 106 through various components to the water cooling plate 101, and then the heat is taken away by the coolant 102, achieving effective heat conduction, thereby ensuring that the temperature of the SOC is within an acceptable range during operation, preventing the SOC from overheating and causing damage to the SOC. Figure 1 As shown, the heat dissipation direction is indicated by arrows in the figure.

[0103] Optionally, the chip package 106 may include a central processing unit (CPU) and a graphics processing unit (GPU), wherein the CPU is used to schedule and manage all hardware resources and can efficiently handle multiple tasks; the GPU can support multiple 4K ultra-high-definition touch screen displays, realizing the function of one chip and multiple screens, and providing clear and smooth image and video displays for the driver and passengers; it provides powerful processing capabilities for multimedia entertainment, navigation, vehicle information display and other functions of the smart cockpit. While processing multiple high-load tasks in the cockpit, the computing unit will generate a lot of heat. At this time, if there is no heat dissipation mechanism, the performance will be greatly affected.

[0104] Figure 2 This is a flow chart of a temperature control method provided in an embodiment of the present application. Figure 2 As shown, the temperature control method may include but is not limited to the following steps:

[0105] S201, obtaining the board temperature of the circuit board where the electronic components in the controller are located.

[0106] In some embodiments, the controller can be a controller of different electronic devices. Optionally, the electronic device can be a smart phone, a tablet computer, a personal digital assistant, a wearable device, an in-vehicle device or an Internet of Vehicles device, such as a vehicle. In this disclosure, only a vehicle is used as an example, but it does not limit the scope of this disclosure.

[0107] In some embodiments, the controller may be a domain controller of the vehicle. Optionally, the domain controller of the vehicle may include, but is not limited to, a power domain controller, a chassis domain controller, a body domain controller, an intelligent cockpit domain controller, an autonomous driving domain controller, etc.

[0108] In some embodiments, a temperature sensor is disposed on the circuit board where the electronic components are located, and the board temperature of the circuit board where the electronic components are located can be collected based on the temperature sensor. Optionally, one or more temperature sensors can be disposed within a designated area of the circuit board where the electronic components are located. For example, one or more temperature sensors can be disposed in the center area of the circuit board. For another example, one or more temperature sensors can be disposed near the electronic components, for example, multiple temperature sensors can be disposed on the circuit board surrounding the electronic components.

[0109] In some embodiments, when multiple temperature sensors are provided, the temperatures collected by the multiple temperature sensors may be averaged to obtain the board temperature of the circuit board where the electronic components are located.

[0110] In some embodiments, the temperatures collected by multiple temperature sensors may be compared, and the maximum temperature may be selected as the board temperature of the circuit board where the electronic component is located.

[0111] In some embodiments, the types of temperature sensors may include, but are not limited to: thermistor temperature sensors (e.g., negative temperature coefficient (NTC) thermistor sensors), thermocouple temperature sensors, diode-based temperature sensors, integrated circuit temperature sensors, digital temperature sensors, resistance temperature detectors, etc.

[0112] S202 , in response to the board temperature of the circuit board where the electronic components in the controller are located being lower than the condensation recognition temperature, controlling the refrigeration component to stop refrigeration.

[0113] In some embodiments, the condensation recognition temperature can be determined based on the dew point temperature. Alternatively, the condensation recognition temperature can be the dew point temperature. Alternatively, the condensation recognition temperature can be a temperature greater than the dew point temperature, but with a difference from the dew point temperature within a set range. For example, if the dew point temperature is 33°C, the condensation recognition temperature can be determined to be 35°C based on the dew point temperature.

[0114] In some embodiments, the board temperature of the electronic component may be compared with the condensation recognition temperature to determine whether the board temperature of the electronic component is lower than the condensation recognition temperature.

[0115] In some embodiments, the board temperatures of the electronic component obtained a set number of times can be averaged to obtain an average board temperature of the electronic component. The average board temperature of the electronic component can be compared with the condensation recognition temperature to determine whether the average board temperature of the electronic component is lower than the condensation recognition temperature.

[0116] If the temperature of the circuit board where the electronic components in the controller are located is lower than the condensation recognition temperature, the refrigeration component can be controlled to stop refrigeration in order to avoid condensation.

[0117] S203 , in response to the board temperature of the electronic component being greater than or equal to the condensation recognition temperature, performing cooling control on the cooling component according to the junction temperature of the electronic component.

[0118] In some embodiments, when the board temperature of the electronic component is greater than or equal to the condensation recognition temperature, it indicates that the surrounding environment of the electronic component is high. Furthermore, the refrigeration component can enter refrigeration control based on the junction temperature of the electronic component, which can avoid the board temperature of the electronic component being too high or the junction temperature of the electronic component being too high.

[0119] In some embodiments, the junction temperature of the electronic component is the actual operating temperature of the transistor junction inside the electronic component. Optionally, the ambient temperature around the electronic component, the thermal resistance of the electronic component from the junction to the environment, and the power consumption of the electronic component when working can be determined. The junction temperature of the electronic component is determined based on the ambient temperature, the thermal resistance from the junction to the environment, and the power consumption of the electronic component.

[0120] In some embodiments, the junction temperatures of the electronic component acquired a set number of times may be averaged to obtain an average junction temperature of the electronic component. Further, the cooling component may be controlled based on at least one of the average junction temperatures.

[0121] The present disclosure proposes a temperature control method. When the board temperature of the circuit board where the electronic components are located in the controller is lower than the condensation recognition temperature, the refrigeration component is controlled to stop refrigeration, so that the temperature of the surface of the electronic components can be relatively high and will not be lower than the condensation recognition temperature of the environment as much as possible, thereby preventing the occurrence of condensation.

[0122] When the board temperature of the electronic component is greater than or equal to the condensation recognition temperature, the refrigeration component is controlled according to the junction temperature of the electronic component. Refrigeration can be promptly performed when the junction temperature of the electronic component is high, ensuring that the junction temperature of the electronic component is within an appropriate range, thereby avoiding damage to the electronic component or performance degradation caused by the high junction temperature of the electronic component.

[0123] In the embodiment of the present application, the working state of the refrigeration component can be dynamically adjusted according to the board temperature and junction temperature of the electronic components, thereby creating a suitable environment for the electronic components, which is not only conducive to ensuring the processing performance of the SOC, but also can extend the life of the electronic components.

[0124] Figure 3 This is a flow chart of a temperature control method provided in an embodiment of the present application. Figure 3 As shown, the temperature control method may include but is not limited to the following steps:

[0125] S301, obtaining the board temperature of the circuit board where the electronic components in the controller are located.

[0126] For a detailed description of step S301, please refer to the relevant contents in the above embodiment, which will not be repeated here.

[0127] S302 , in response to the board temperature of the circuit board where the electronic components in the controller are located being lower than the condensation recognition temperature, controlling the refrigeration component to stop refrigeration.

[0128] For a detailed description of step S302, please refer to the relevant contents in the above embodiment, which will not be repeated here.

[0129] S303 : In response to the board temperature of the electronic component being greater than or equal to the condensation recognition temperature, obtaining the junction temperature of the electronic component.

[0130] In some embodiments, the ambient temperature around the electronic component may be acquired based on a temperature sensor.

[0131] In some embodiments, the thermal resistance from the junction to the ambient can be determined based on design parameters of the electronic component.

[0132] In some embodiments, the power consumption of the electronic component during operation may be determined based on the supply voltage and operating current of the electronic component during operation.

[0133] In some embodiments, the junction temperature of an electronic component may be determined using the following formula:

[0134] T j =T a +(R θJA ×P)

[0135] Among them, T j Indicates the junction temperature of electronic components; T a Indicates the ambient temperature around the electronic components; R θJA It represents the thermal resistance from the junction to the environment; P represents the power consumption of the electronic component when it is working.

[0136] In some embodiments, the board temperature and the junction temperature of the electronic component may be acquired in real time.

[0137] In some embodiments, the board temperature and the junction temperature of the electronic component may be obtained at set time intervals.

[0138] S304 , performing cooling control on the cooling assembly according to the junction temperature of the electronic component.

[0139] The present disclosure proposes a temperature control method. When the board temperature of the circuit board where the electronic components are located in the controller is lower than the condensation recognition temperature, the refrigeration component is controlled to stop refrigeration, so that the temperature of the surface of the electronic components can be relatively high and will not be lower than the condensation recognition temperature of the environment as much as possible, thereby preventing the occurrence of condensation.

[0140] When the board temperature of the electronic component is greater than or equal to the condensation recognition temperature, the refrigeration component is controlled according to the junction temperature of the electronic component. Refrigeration can be promptly performed when the junction temperature of the electronic component is high, ensuring that the junction temperature of the electronic component is within an appropriate range, thereby avoiding damage to the electronic component or performance degradation caused by the high junction temperature of the electronic component.

[0141] Figure 4 A flow chart of another temperature control method provided by an embodiment of the present disclosure. Figure 4 As shown, the temperature control method may include at least one of the following steps:

[0142] S410: Receive instruction information from the controller.

[0143] In some embodiments, the indication information is used to instruct the controller to enter a standby state.

[0144] In some embodiments, the indication information may be a power-on indication of the controller.

[0145] In some embodiments, the indication information may be a sleep / wake-up indication of the controller.

[0146] In some embodiments, the indication information may be a power-on indication of the controller.

[0147] In some embodiments, indication information may be generated based on a user's operation on a setting area or button.

[0148] In some embodiments, the indication information may be generated based on the user's power-on voice or wake-up voice.

[0149] S420: Acquire the board temperature and junction temperature of the electronic components in the controller.

[0150] In some embodiments, after obtaining the board temperature of the electronic component, S430, S440, and S450 may be executed separately. It is understood that when the board temperature of the electronic component satisfies the determination criteria of one step, the subsequent steps of the corresponding branch of the step are executed. That is, when the determination criteria of S430 are met, S431 to S434 may be executed; when the determination criteria of S440 are met, S441 may be executed; and when the determination criteria of S450 are met, S451 to S456 may be executed.

[0151] S430: Determine whether the board temperature of the electronic component is lower than a first set temperature.

[0152] In response to the board temperature of the electronic component being lower than the first set temperature, S431 is executed.

[0153] S431, controlling the refrigeration component to enter a heating mode, and configuring the operating voltage of the refrigeration component to be a first voltage.

[0154] In some embodiments, in response to the electronic component's panel temperature (or average panel temperature) being less than a first set temperature, the cooling assembly is controlled to enter heating mode, where the first set temperature is less than the condensation detection temperature. For example, the first set temperature may be -20°C. This heating mode provides heat to the electronic component, maintaining an ambient temperature for the electronic component, thereby ensuring processing performance of the electronic component.

[0155] It is understandable that when the board temperature (or average board temperature) of the electronic component is lower than the first set temperature, it indicates that the electronic component is in a low temperature environment. In order to ensure the processing performance of the electronic component, the ambient temperature can be raised by heating the refrigeration component.

[0156] Furthermore, to rapidly heat the environment surrounding the electronic components, the refrigeration assembly can be controlled to operate at a higher operating voltage for heating. Optionally, the operating voltage of the refrigeration assembly can be configured to be a first voltage. It should be noted that the first voltage is less than or equal to the maximum allowable voltage of the refrigeration assembly and greater than or equal to a set voltage threshold. This limitation ensures that the operating voltage of the refrigeration assembly is relatively high, thereby enabling rapid temperature rise.

[0157] In some embodiments, the first set temperature is -20°C.

[0158] In some embodiments, the first voltage is the maximum allowable voltage of the refrigeration component. For example, if the operating voltage of the refrigeration component is 0-6V, the maximum allowable voltage is 6V.

[0159] That is, when the board temperature of the electronic component is less than -20°C, the refrigeration component is controlled to enter the heating mode, and the operating voltage of the refrigeration component is configured to be 6V.

[0160] S432: During the heating process of the refrigeration component, the board temperature of the electronic component is continuously monitored.

[0161] S433, determining whether the board temperature of the electronic component rises to a set temperature threshold.

[0162] In some embodiments, while the cooling assembly is operating in heating mode, the board temperature of the electronic component may continue to be monitored. In response to the board temperature of the electronic component rising to a set temperature threshold, step S434 is executed, i.e., the cooling assembly is controlled to end the heating mode and enter the off state. For example, the set temperature threshold is 10°C.

[0163] In response to the board temperature of the electronic component not rising to the set temperature threshold, the refrigeration assembly is controlled to continue the heating mode, that is, S431 is continued to be executed.

[0164] It should be noted that the cooling component enters heating mode for low-temperature heating only once each time the controller is powered on or woken up from sleep mode. When the board temperature of the heated electronic components reaches the set temperature threshold, the cooling component's heating mode will terminate completely until the next power-on instruction or wake-up instruction from sleep mode is received from the controller.

[0165] S434, controlling the refrigeration component to end the heating mode and enter the off state.

[0166] S440: Determine whether the board temperature of the electronic component is greater than or equal to a first set temperature and less than a condensation recognition temperature.

[0167] In response to the board temperature of the electronic component being greater than or equal to the first set temperature and less than the condensation recognition temperature, step S441 is executed.

[0168] S441, controlling the refrigeration component to enter the closed state.

[0169] When the electronic component's board temperature (or average board temperature) is greater than or equal to the first set temperature and less than the condensation detection temperature, the refrigeration component is controlled to be off when the electronic component's board temperature is within a relatively suitable temperature range, thereby saving energy. It is understood that when the electronic component's board temperature (or average board temperature) is greater than or equal to the first set temperature and less than the condensation detection temperature, the temperature of the environment in which the electronic component is located is relatively suitable, will not affect the electronic component's processing performance, and therefore, no refrigeration component is required to generate heat.

[0170] In some embodiments, the condensation recognition temperature is 35°C.

[0171] That is, when the board temperature of the electronic component is -20°C or less than 35°C, the refrigeration component is controlled to enter the closed state.

[0172] S450: Determine whether the board temperature of the electronic component is greater than or equal to the condensation recognition temperature.

[0173] In response to the board temperature of the electronic component being greater than or equal to the condensation recognition temperature, S451 is executed.

[0174] S451, determining whether the junction temperature of the electronic component is a null value.

[0175] In some embodiments, in the controller power-on or sleep wake-up process, the micro control unit (MCU) in the controller is first powered on or woken up. After the MCU is powered on or woken up, the electronic components are powered on or woken up. Before the electronic components are powered on or woken up, the junction temperature of the electronic components cannot be obtained because the electronic components have not entered the standby state, that is, the junction temperature of the electronic components is a null value.

[0176] In response to the junction temperature of the electronic component being a non-null value, step 452 is executed.

[0177] In response to the junction temperature of the electronic component being a null value, step 456 is executed.

[0178] S452, determining whether the junction temperature of the electronic component is greater than or equal to a second set temperature.

[0179] In response to the junction temperature of the electronic component being lower than the second set temperature, step S453 is executed.

[0180] In response to the junction temperature of the electronic component being greater than or equal to the second set temperature, step S454 is executed.

[0181] S453, controlling the refrigeration component to enter the closed state.

[0182] In a scenario where the junction temperature of the electronic component is a non-null value and is lower than the second set temperature, the performance of the SOC will not be affected due to the low junction temperature of the electronic component, and the TEC is controlled to enter a closed state, thereby keeping the TEC closed and saving energy.

[0183] In some embodiments, the second set temperature is 60° C. That is, when the junction temperature of the electronic component is less than 60° C., the refrigeration component is controlled to enter a closed state.

[0184] S454, controlling the refrigeration component to enter the refrigeration mode.

[0185] When the junction temperature of the electronic component is a non-null value and is greater than or equal to the second set temperature, the refrigeration component can be controlled to enter cooling mode to prevent performance degradation or damage to the electronic component due to the high junction temperature. Furthermore, an adaptive operating voltage can be configured based on the actual junction temperature, so that the cooling effect of the refrigeration component is more in line with actual needs and energy conservation can be achieved.

[0186] That is to say, when the junction temperature of the electronic components is ≥60°C, the refrigeration component is controlled to enter the refrigeration state.

[0187] S455 , determining a target temperature range for the junction temperature, and configuring the operating voltage of the cooling component according to the target temperature range.

[0188] In some embodiments, multiple temperature intervals may be included, each temperature interval corresponds to a voltage configuration information. Optionally, the voltage configuration information may be a voltage interval. Optionally, the voltage configuration information may be a voltage.

[0189] In some embodiments, a mapping relationship between temperature intervals and voltage configuration information is pre-built.

[0190] According to the target temperature range, the mapping relationship between the temperature range and the voltage configuration information is queried, and the target voltage configuration information corresponding to the target temperature range is determined according to the mapping relationship. Further, the operating voltage of the refrigeration component is configured according to the target voltage configuration information.

[0191] In some embodiments, in response to the target voltage configuration information including a target voltage interval, the operating voltage of the refrigeration component is configured to be within the target voltage interval; or, in response to the target voltage configuration information including a target voltage, the operating voltage of the refrigeration component is configured to be the target voltage.

[0192] In some embodiments, the operating voltage configured for the cooling component is positively correlated with the target temperature range. That is, as the temperature range increases, the configured operating voltage will gradually increase until it reaches the maximum allowable voltage of the cooling component.

[0193] In some embodiments, the lengths of any two temperature intervals may be the same or different, which is not a condition limiting the present application.

[0194] In some embodiments, the increments of the operating voltages corresponding to adjacent temperature intervals may be the same or different.

[0195] For example, the temperature range T i-1 Corresponding voltage range or voltage V i-1 , temperature range T iCorresponding voltage range or voltage Vi, temperature range T i+1 Corresponding voltage range or voltage V i+1 .

[0196] If the target temperature range is the temperature range T i-1 , then according to the voltage range or voltage V i-1 The operating voltage of the refrigeration component is configured, for example, configured to a first target voltage.

[0197] If the target temperature range is the temperature range T i , then according to the voltage range or voltage V i The operating voltage of the refrigeration component is configured, for example, to be a second target voltage.

[0198] If the target temperature range is the temperature range T i+1 , then according to the voltage range or voltage V i+1 The operating voltage of the refrigeration component is configured, for example, to a third target voltage.

[0199] In some embodiments, the difference between the second target voltage and the first target voltage can be obtained, which can be used as the voltage increment of the operating voltage corresponding to a group of adjacent temperature intervals, namely the second temperature interval and the first temperature interval; the difference between the third target voltage and the second target voltage can be obtained, which can be used as the voltage increment of the operating voltage corresponding to a group of adjacent temperature intervals, namely the third temperature interval and the second temperature interval.

[0200] In some embodiments, the voltage increment of the operating voltage corresponding to one group of adjacent temperature intervals may be the same as or different from the voltage increment of the operating voltage corresponding to another group of adjacent temperature intervals.

[0201] In some embodiments, when the board temperature of the electronic component is greater than or equal to the condensation recognition temperature and the junction temperature of the electronic component is greater than or equal to the second set temperature, the refrigeration component may be controlled according to the junction temperature of the electronic component.

[0202] For example, the first temperature range is [60°C, 65°C], that is, 60°C≤T j <65℃, the operating voltage of the cooling component is 0.5V.

[0203] The second temperature range is 65℃≤T j <70℃, the operating voltage of the cooling component is 1V.

[0204] The third temperature range is 70℃≤T j <75℃, the operating voltage of the cooling component is 1.5V.

[0205] The fourth temperature range is 75℃≤T j<80℃, the operating voltage of the cooling component is 2V.

[0206] The fifth temperature range is 80℃≤T j <85℃, the operating voltage of the cooling component is 3V;

[0207] The sixth temperature range is 85℃≤T j <90℃, the operating voltage of the cooling component is 4.5V;

[0208] The seventh temperature range is T j >90℃, the operating voltage of the TEC cooling component is 6V.

[0209] For example, the voltage increment of the operating voltage corresponding to the first temperature interval and the second temperature interval is 0.5, the voltage increment of the operating voltage corresponding to the second temperature interval and the third temperature interval is 0.5, and the voltage increment of the operating voltage corresponding to the third temperature interval and the fourth temperature interval is 1 V. In other words, the voltage increment of the operating voltage corresponding to one set of adjacent temperature intervals can be the same as or different from the voltage increment of the operating voltage corresponding to another set of adjacent temperature intervals.

[0210] In some embodiments, in response to the operating voltage of the cooling component being configured as the maximum allowable voltage of the cooling component and the junction temperature of the electronic component being greater than or equal to the set junction temperature threshold, that is, when the target temperature range is within the maximum temperature range and the junction temperature of the electronic component exceeds the set junction temperature threshold, the operating frequency of the electronic component is reduced. It is understandable that if the target temperature range is within the maximum temperature range (T j >90°C), and the junction temperature of the electronic component exceeds the set junction temperature threshold (for example, the set junction temperature threshold can be 95°C), it means that the junction temperature of the electronic component is in an extremely high state. In order to avoid high temperature damage to the electronic component, the operating frequency of the electronic component can be reduced while controlling the refrigeration component to cool, thereby achieving the purpose of further reducing the junction temperature of the electronic component.

[0211] S456, controlling the refrigeration component to enter the refrigeration mode, and configuring the operating voltage of the refrigeration component to be the second voltage.

[0212] In some embodiments, since the board temperature of the electronic component is greater than the condensation recognition temperature, it means that the surrounding environment of the electronic component is high, and since the electronic component needs to perform a power-on or wake-up process, it often causes the board temperature of the electronic component to rise. In order to avoid the electronic component from being unable to power on or wake up quickly due to the rise in board temperature, the refrigeration component can be controlled to enter a cooling mode to reduce the board temperature of the electronic component. This not only maintains the responsiveness of the electronic component, allowing the electronic component to be quickly powered on or woken up, but also avoids high-temperature damage.

[0213] Furthermore, the operating voltage of the refrigeration component in the refrigeration mode can be configured. Optionally, the operating voltage of the refrigeration component can be configured to a second voltage. It is understandable that since the current electronic component is in the power-on or wake-up process, it will not generate much heat. A moderate voltage can be configured to meet the refrigeration needs. Optionally, the second voltage is less than or equal to the first voltage. Optionally, the second voltage can be the default operating voltage of the refrigeration component in the refrigeration mode. Optionally, the second voltage is less than the maximum allowable voltage of the refrigeration component.

[0214] In some embodiments, the second voltage is less than the maximum allowable voltage of the refrigeration component, for example, may be 2V.

[0215] That is, when the junction temperature of the electronic component is a null value, the cooling component is controlled to enter the cooling mode, and the operating voltage of the cooling component is configured to be 2V.

[0216] In the disclosed embodiment, the board temperature of the electronic component can be combined with the junction temperature of the electronic component. When the board temperature of the electronic component is lower than the condensation recognition temperature, the refrigeration component can be controlled to stop refrigeration, so that the temperature of the surface of the electronic component can be relatively high and will not be lower than the condensation recognition temperature of the environment as much as possible, thereby reducing the occurrence of condensation. When the board temperature of the electronic component is higher than the condensation recognition temperature, the refrigeration component can be controlled according to the junction temperature of the electronic component. Refrigeration can be carried out in a timely manner when the junction temperature of the electronic component is high, ensuring that the junction temperature of the electronic component is within an appropriate range, thereby avoiding damage to the electronic component or performance degradation caused by the high junction temperature of the electronic component.

[0217] It is understandable that the temperature control method provided in the above embodiment involves electronic components such as SOC in the controller and refrigeration components such as Figure 1 The TEC shown can obtain the board temperature and junction temperature of the SOC, and based on the board temperature and junction temperature of the SOC, the TEC is controlled according to the temperature control method provided in the above embodiment.

[0218] In order to implement the above temperature control method, the embodiment of the present disclosure also provides a temperature control device. Figure 5 As shown, the temperature control device 500 includes: a control module 501.

[0219] The control module 501 is used to control the refrigeration component to stop refrigeration when the board temperature of the circuit board where the electronic component in the controller is located is lower than the condensation recognition temperature, and to control the refrigeration component to refrigerate according to the condensation temperature of the electronic component when the board temperature of the electronic component is greater than or equal to the condensation recognition temperature.

[0220] In some embodiments, the temperature control device 500 further includes: a temperature monitoring module 502 .

[0221] In some embodiments, the temperature monitoring module 502 is built into the circuit board where the electronic component is located, and is used to collect the board temperature of the electronic component.

[0222] In some embodiments, the temperature monitoring module 502 includes a thermistor temperature sensor.

[0223] In some embodiments, the control module 501 is further configured to:

[0224] In response to the board temperature of the electronic component being greater than or equal to a first set temperature and less than the condensation recognition temperature, the refrigeration assembly is controlled to enter a closed state.

[0225] In some embodiments, the control module 501 is further configured to:

[0226] In response to the board temperature of the electronic component being less than a first set temperature, the refrigeration component is controlled to enter a heating mode, and the operating voltage of the refrigeration component is configured to be a first voltage, wherein the first voltage is less than or equal to the maximum allowable voltage of the refrigeration component and greater than or equal to a set voltage threshold.

[0227] In some embodiments, the control module 501 is further configured to:

[0228] During the heating process of the refrigeration component, the board temperature of the electronic component is continuously monitored;

[0229] In response to the board temperature of the electronic component rising to a set temperature threshold, controlling the electronic component to end the heating mode and enter an off state;

[0230] In response to the board temperature of the electronic component not rising to the set temperature threshold, the electronic component is controlled to continue the heating mode.

[0231] In some embodiments, the control module 501 is further configured to:

[0232] In response to a junction temperature of the electronic component being greater than or equal to a second set temperature, controlling the refrigeration assembly to enter a refrigeration mode, wherein the second set temperature is greater than the condensation recognition temperature;

[0233] determining a target temperature range within which the junction temperature of the electronic component lies;

[0234] The operating voltage of the refrigeration component is configured according to the target temperature range.

[0235] In some embodiments, the control module 501 is further configured to:

[0236] In response to a junction temperature of the electronic component being greater than or equal to a second set temperature, controlling the refrigeration assembly to enter a refrigeration mode, wherein the second set temperature is greater than the condensation recognition temperature;

[0237] A target temperature range for the junction temperature of the electronic component is determined, and an operating voltage of the refrigeration component is configured according to the target temperature range.

[0238] In some embodiments, the control module 501 is further configured to:

[0239] According to the target temperature range, query the mapping relationship between the temperature range and the voltage configuration information;

[0240] Determining target voltage configuration information corresponding to the target temperature range according to the mapping relationship;

[0241] The operating voltage of the refrigeration component is configured according to the target voltage configuration information.

[0242] In some embodiments, the control module 501 is further configured to:

[0243] In response to the target voltage configuration information including a target voltage interval, configuring the operating voltage of the refrigeration component to be within the target voltage interval; or,

[0244] In response to the target voltage configuration information including a target voltage, the operating voltage of the refrigeration component is configured to be the target voltage.

[0245] In some embodiments, the operating voltage configured for the refrigeration component is positively correlated with the target temperature range.

[0246] In some embodiments, the control module 501 is further configured to:

[0247] In response to the operating voltage of the refrigeration component being configured as the maximum allowable voltage of the refrigeration component and the junction temperature of the electronic component still being greater than or equal to the set junction temperature threshold, the operating frequency of the electronic component is reduced.

[0248] In some embodiments, the control module 501 is further configured to:

[0249] In response to a junction temperature of the electronic component being lower than a second set temperature, the electronic component is controlled to enter a shutdown state, wherein the second set temperature is higher than the condensation recognition temperature.

[0250] In some embodiments, the control module 501 is further configured to:

[0251] In response to not acquiring the junction temperature of the electronic component, controlling the refrigeration component to enter a refrigeration mode, and configuring the operating voltage of the refrigeration component to be a second voltage, where the second voltage is less than a maximum allowable voltage of the refrigeration component.

[0252] In some embodiments, the temperature control device 500 further includes: a receiving module 503 .

[0253] The receiving module 503 is configured to receive instruction information, where the instruction information is used to instruct the domain controller to enter a standby state.

[0254] Since the device provided in the embodiment of the present disclosure corresponds to the methods provided in the above embodiments, the implementation of the method is also applicable to the device provided in this embodiment and will not be described in detail in this embodiment.

[0255] In the embodiments provided above, the methods and devices provided in the embodiments of the present application are introduced. In order to implement the various functions of the methods provided in the embodiments of the present application, the electronic device may include a hardware structure and a software module, and implement the aforementioned functions in the form of a hardware structure, a software module, or a hardware structure plus a software module. One of the aforementioned functions may be executed in the form of a hardware structure, a software module, or a hardware structure plus a software module.

[0256] Figure 6 FIG2 is a block diagram of an electronic device 600 for implementing the temperature control method according to an exemplary embodiment. For example, the electronic device 600 may be a mobile phone, a vehicle, a computer, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0257] Reference Figure 6 , the electronic device 600 may include one or more of the following components: a processing component 602 , a memory 604 , a power component 606 , a multimedia component 608 , an audio component 610 , an input / output (I / O) interface 612 , a sensor component 614 , and a communication component 616 .

[0258] The processing component 602 generally controls the overall operation of the electronic device 600, such as operations associated with display, phone calls, data communications, camera operation, and recording operations. The processing component 602 may include one or more processors 620 to execute instructions to perform all or part of the steps of the above-described method. In addition, the processing component 602 may include one or more modules to facilitate interaction between the processing component 602 and other components. For example, the processing component 602 may include a multimedia module to facilitate interaction between the multimedia component 608 and the processing component 602.

[0259] The memory 604 is configured to store various types of data to support operations on the electronic device 600. Examples of such data include instructions for any application or method operating on the electronic device 600, contact data, phone book data, messages, pictures, videos, etc. The memory 604 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0260] The power supply assembly 606 provides power to the various components of the electronic device 600. The power supply assembly 606 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device 600.

[0261] The multimedia component 608 includes a screen that provides an output interface between the electronic device 600 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, slides, and gestures on the touch panel. The touch sensor can not only sense the boundaries of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 608 includes a front camera and / or a rear camera. When the electronic device 600 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have focal length and optical zoom capabilities.

[0262] The audio component 610 is configured to output and / or input audio signals. For example, the audio component 610 includes a microphone (MIC), which is configured to receive external audio signals when the electronic device 600 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 604 or transmitted via the communication component 616. In some embodiments, the audio component 610 also includes a speaker for outputting audio signals.

[0263] I / O interface 612 provides an interface between processing component 602 and peripheral interface modules, such as a keyboard, click wheel, buttons, etc. These buttons may include but are not limited to: a home button, volume buttons, a start button, and a lock button.

[0264] The sensor assembly 614 includes one or more sensors for providing various aspects of status assessment for the electronic device 600. For example, the sensor assembly 614 can detect the open / closed state of the electronic device 600, the relative positioning of components, such as the display and keypad of the electronic device 600. The sensor assembly 614 can also detect changes in the position of the electronic device 600 or a component of the electronic device 600, the presence or absence of user contact with the electronic device 600, the orientation or acceleration / deceleration of the electronic device 600, and temperature changes of the electronic device 600. The sensor assembly 614 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 614 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 614 may also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0265] The communication component 616 is configured to facilitate wired or wireless communication between the electronic device 600 and other devices. The electronic device 600 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, 4G LTE, 5G NR (NewRadio) or a combination thereof. In an exemplary embodiment, the communication component 616 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 616 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0266] In an exemplary embodiment, the electronic device 600 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the above methods.

[0267] In some embodiments, the electronic device 600 may be a vehicle, which may be a hybrid vehicle, a non-hybrid vehicle, an electric vehicle, a fuel cell vehicle, or other types of vehicles. The vehicle may be an autonomous vehicle, a semi-autonomous vehicle, or a non-autonomous vehicle.

[0268] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 604 including instructions, which can be executed by the processor 620 of the electronic device 600 to perform the above method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0269] The embodiments of the present disclosure further provide a non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to enable a computer to execute the temperature control method described in the above embodiments of the present disclosure.

[0270] An embodiment of the present disclosure further provides a computer program product, including a computer program, which executes the temperature control method described in the above embodiment of the present disclosure when executed by a processor.

[0271] The embodiment of the present disclosure also provides a chip, which can be found in Figure 7 Schematic diagram of the chip structure shown. Figure 7 The chip shown includes a processor 701 and an interface circuit 702. There may be one or more processors 701 and one or more interface circuits 702.

[0272] Optionally, the chip also includes a memory 703, which is used to store necessary computer programs and data; the interface circuit 702 is used to receive signals from the memory 703 and send signals to the processor 701, and the signals include computer instructions stored in the memory 703. When the processor 701 executes the computer instructions, the electronic device executes the temperature control method described in the above embodiment of the present disclosure.

[0273] It should be noted that the terms "first," "second," and the like in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the numbers used in this manner are interchangeable where appropriate so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure as detailed in the appended claims.

[0274] Throughout this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" indicate that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0275] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code comprising one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may be performed out of the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present invention pertain.

[0276] The logic and / or steps represented in the flowcharts or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing the logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (e.g., a computer-based system, a system including a processing module, or other system that can fetch and execute instructions from an instruction execution system, apparatus, or device). For purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of computer-readable media include the following: an electrical connection having one or more wires (control method), a portable computer disk cartridge (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and programmable read-only memory (EPROM or flash memory), fiber optic devices, and a portable compact disc read-only memory (CDROM). Furthermore, the computer-readable medium may even be paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium and then editing, interpreting or otherwise processing it in a suitable manner if necessary, and then storing it in a computer memory.

[0277] It should be understood that various parts of the embodiments of the present invention can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented using hardware, as in another embodiment, any one of the following technologies known in the art or a combination thereof can be used to implement: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application-specific integrated circuit having a suitable combination of logic gate circuits, a programmable gate array (PGA), a field programmable gate array (FPGA), etc.

[0278] Those skilled in the art will understand that all or part of the steps in the method of the above embodiment can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiment.

[0279] Furthermore, the functional units in the various embodiments of the present invention may be integrated into a single processing module, each unit may exist physically separately, or two or more units may be integrated into a single module. The aforementioned integrated modules may be implemented in either hardware or software functional modules. If the integrated modules are implemented as software functional modules and sold or used as standalone products, they may also be stored in a computer-readable storage medium. The aforementioned storage medium may be a read-only memory, a magnetic disk, or an optical disk, etc.

[0280] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A temperature control method, characterized in that: The method comprises: In response to the board temperature of the circuit board where the electronic components in the controller are located being lower than the condensation recognition temperature, controlling the refrigeration component to stop refrigeration; In response to the board temperature of the electronic component being greater than or equal to the condensation recognition temperature, the refrigeration component is controlled to be cooled according to the junction temperature of the electronic component.

2. The method according to claim 1, characterized in that The method further comprises: Synchronously acquiring the board temperature and junction temperature of the electronic component; or, The board temperature of the electronic component is acquired, and when the board temperature of the electronic component is greater than or equal to a condensation recognition temperature, the junction temperature of the electronic component is acquired.

3. The method according to claim 1, characterized in that The method further comprises: In response to the board temperature of the electronic component being greater than or equal to a first set temperature and less than the condensation recognition temperature, the refrigeration assembly is controlled to enter a closed state.

4. The method according to claim 3, characterized in that The method further comprises: In response to the board temperature of the electronic component being less than a first set temperature, the refrigeration component is controlled to enter a heating mode, and the operating voltage of the refrigeration component is configured to be a first voltage, wherein the first voltage is less than or equal to the maximum allowable voltage of the refrigeration component and greater than or equal to a set voltage threshold.

5. The method according to claim 4, characterized in that After controlling the refrigeration component to enter the heating mode, the method further includes: During the heating process of the refrigeration component, the board temperature of the electronic component is continuously monitored; In response to the board temperature of the electronic component rising to a set temperature threshold, controlling the refrigeration assembly to end the heating mode and enter an off state; In response to the board temperature of the electronic component not rising to the set temperature threshold, the refrigeration assembly is controlled to continue the heating mode.

6. The method according to any one of claims 1 to 5, characterized in that The step of controlling the refrigeration component according to the junction temperature of the electronic component includes: In response to a junction temperature of the electronic component being greater than or equal to a second set temperature, controlling the refrigeration assembly to enter a refrigeration mode, wherein the second set temperature is greater than the condensation recognition temperature; determining a target temperature range within which the junction temperature of the electronic component lies; The operating voltage of the refrigeration component is configured according to the target temperature range.

7. The method according to claim 6, characterized in that Configuring the operating voltage of the refrigeration component according to the target temperature range includes: According to the target temperature range, query the mapping relationship between the temperature range and the voltage configuration information; Determining target voltage configuration information corresponding to the target temperature range according to the mapping relationship; The operating voltage of the refrigeration component is configured according to the target voltage configuration information.

8. The method according to claim 7, characterized in that Configuring the operating voltage of the refrigeration component according to the target voltage configuration information includes: In response to the target voltage configuration information including a target voltage interval, configuring the operating voltage of the refrigeration component to be within the target voltage interval; or, In response to the target voltage configuration information including a target voltage, the operating voltage of the refrigeration component is configured to be the target voltage.

9. The method according to claim 8, characterized in that The operating voltage configured for the refrigeration component is positively correlated with the target temperature range.

10. The method according to claim 6, characterized in that After configuring the operating voltage according to the target temperature range, the method further includes: In response to the operating voltage of the refrigeration component being configured as the maximum allowable voltage of the refrigeration component and the junction temperature of the electronic component being greater than or equal to a set junction temperature threshold, the operating frequency of the electronic component is reduced.

11. The method according to any one of claims 1 to 5, characterized in that The step of controlling the refrigeration component according to the junction temperature of the electronic component includes: In response to the junction temperature of the electronic component being lower than a second set temperature, the refrigeration assembly is controlled to enter a closed state, wherein the second set temperature is higher than the condensation recognition temperature.

12. The method according to any one of claims 1 to 5, characterized in that The method further comprises: In response to not acquiring the junction temperature of the electronic component, controlling the refrigeration component to enter a refrigeration mode, and configuring the operating voltage of the refrigeration component to be a second voltage, where the second voltage is less than a maximum allowable voltage of the refrigeration component.

13. The method according to claim 1, wherein Before obtaining the board temperature and junction temperature of the electronic component, the method further includes: Instruction information is received, where the instruction information is used to instruct the controller to enter a standby state.

14. A temperature control device, characterized in that: The device comprises: The control module is used to control the refrigeration component to stop refrigeration when the board temperature of the circuit board where the electronic components in the controller are located is lower than the condensation recognition temperature, and to control the refrigeration component to stop refrigeration when the board temperature of the electronic components is greater than or equal to the condensation recognition temperature according to the condensation temperature of the electronic components.

15. The device according to claim 14, characterized in that The device further comprises: A temperature monitoring module is built into the circuit board where the electronic component is located, and is used to collect the board temperature of the electronic component.

16. The device according to claim 15, characterized in that The temperature monitoring module includes a thermistor temperature sensor.

17. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 13.

18. A computer-readable storage medium having computer program instructions stored thereon, characterized in that: When the program instructions are executed by a processor, the steps of the method according to any one of claims 1 to 13 are implemented.

19. A chip, characterized in that: The device comprises one or more interface circuits and one or more processors; the interface circuit is used to receive a signal from a memory of the electronic device and send the signal to the processor, the signal comprising a computer instruction stored in the memory, and when the processor executes the computer instruction, the electronic device executes the method described in any one of claims 1 to 13.

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