Display module and electronic equipment

Abstract

The invention relates to a display module and electronic equipment, the display module comprises a display panel and a first circuit board, the display panel comprises a display part, a bending part and a packaging part which are sequentially arranged, the display part comprises a light emitting surface and a backlight surface which are oppositely arranged in the first direction of the display module, and the packaging part is arranged on the side, provided with the backlight surface, of the display part; the first circuit board is arranged between the packaging part and the display part. The first circuit board can be arranged between the packaging part and the display part, so that the packaging part can be supported, the bending radian of the bending part is ensured to be within a proper range, and the bending part is prevented from being damaged due to excessive bending. According to the electronic equipment, the packaging part and the display part do not need to be provided with other supporting pieces, so that the occupied space of the display module in the electronic equipment in the first direction and the second direction is reduced, the compactness of the internal structure of the electronic equipment can be improved, and the requirement for high-density stacking of all parts in the electronic equipment is met.

Description

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on February 6, 2024, with application number 202410171587.6 and invention name “Display module and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of terminal technology, and in particular to a display module and electronic equipment. Background Art

[0003] With the advancement of science and technology, electronic devices are becoming increasingly ubiquitous and widely used in our daily lives. To facilitate portability, electronic devices are becoming increasingly lightweight and thin. However, this trend leads to limited internal space, necessitating a continuously increasing demand for structural compactness.

[0004] In electronic devices of related art, the display module can usually adopt a flexible screen and usually adopts the COP (Chip On Plastic, where the chip is bound to the flexible plastic substrate of the display panel) packaging process. Taking advantage of the bending characteristics of the flexible screen itself, the packaging part of the flexible screen used to bind the circuit board and driver chip is bent on the back side of the flexible screen display part to reduce the space occupied by the packaging part on the electronic device frame. However, in related art, the display module of this structure occupies a large space in the electronic device, which easily leads to limited installation space for other components in the electronic device and cannot meet the requirements of high-density stacking of various components in the electronic device. Summary of the Invention

[0005] In view of this, the present application provides a display module and an electronic device to solve the problem that the display module occupies a large space in the electronic device, which easily leads to limited installation space for other components in the electronic device.

[0006] A first aspect of an embodiment of the present application provides a display module, including a display panel and a first circuit board, wherein the display panel includes a display portion, a bending portion, and a packaging portion connected in sequence, and along a first direction of the display module, the display portion includes a light-emitting surface and a backlight surface arranged opposite to each other, the packaging portion is arranged on a side of the display portion having the backlight surface, and the first circuit board is arranged between the packaging portion and the display portion.

[0007] The first circuit board can be disposed between the packaging portion and the display portion, thereby supporting the packaging portion and ensuring that the bending curvature of the bent portion is within an appropriate range, thereby preventing damage to the bent portion due to excessive bending. In this application, no additional support members are required between the packaging portion and the display portion, thereby reducing the space occupied by the display module within the electronic device along the first and second directions. This can improve the compactness of the internal structure of the electronic device and meet the requirements for high-density stacking of various components within the electronic device.

[0008] In one possible design, the display module also includes a second circuit board, which is arranged on the side of the packaging part away from the display part. The second circuit board includes a first binding end and a second binding end, the first binding end is connected to the packaging part, and the second binding end is connected to the first circuit board.

[0009] The second circuit board is an independent circuit board. This allows the second circuit board to be directly connected to the packaging portion along the first direction via the first binding end when the first circuit board is bound to the packaging portion, and directly connected to the first circuit board via the second binding end, without causing a large curvature. This further reduces the space occupied by the display module within the electronic device along the first and second directions. Furthermore, the first and second circuit boards being independent circuit boards further reduces the manufacturing difficulty of the first and second circuit boards, saving the production cost of the display module.

[0010] In a possible design, the first binding end is connected to an end of the packaging portion away from the bending portion.

[0011] This structure can facilitate the binding connection between the second circuit board, the packaging part and the first circuit board, and can reduce the space occupied by the second circuit board in the third direction, thereby further reducing the space occupied by the display module in the electronic device along the third direction.

[0012] In a possible design, along the second direction of the display module, at least a portion of the first circuit board extends out of the packaging portion and is connected to the second binding end.

[0013] This structure can further reduce the difficulty of binding the second binding end to the first circuit board, thereby facilitating mass production of display modules.

[0014] In a possible design, the display module further includes a driving chip, and the driving chip is arranged on a side of the packaging portion away from the display portion.

[0015] The driver chip is used to drive the display panel to realize the display function. The driver chip is bound and arranged on the side of the packaging part away from the display part, thereby avoiding interference between the driver chip and the first circuit board and improving the reliability of the driver chip.

[0016] In a possible design, along the first direction of the display module, the height of the second circuit board is less than or equal to the height of the driving chip.

[0017] When the height of the second circuit board is less than or equal to the height of the driver chip, the connection reliability between the second circuit board and the packaging part and the first circuit board can be ensured while further reducing the space occupied by the display module in the first direction, thereby facilitating high-density stacking of various components inside the electronic device.

[0018] In a possible design, along the third direction of the display module, the width of the packaging portion is less than or equal to the width of the display portion.

[0019] When the width dimension of the packaging part is less than or equal to the width dimension of the display part, the space occupied by the display module in the third direction can be further reduced, and the first circuit board located between the packaging part and the display part can be exposed from the packaging part along the third direction, thereby making it easier to arrange some electronic devices on the first circuit board, thereby improving the compactness of the internal structure of the electronic device and meeting the requirements of high-density stacking of various components inside the electronic device.

[0020] In a possible design, the display module further includes waterproof glue, and the waterproof glue is filled in the gap between the first circuit board and the second circuit board.

[0021] The waterproof glue is filled in the gap between the first circuit board and the second circuit board, which can prevent liquid from entering the gap between the first circuit board and the second circuit board, thereby improving the waterproof performance of the display module.

[0022] In one possible design, the second circuit board is a chip-on-film or a flexible circuit board, so that the second circuit board can fit more closely with the packaging part and the first circuit board, thereby making it easier to achieve a binding connection between the second circuit board, the packaging part and the first circuit board.

[0023] In a possible design, the display module further includes a supporting layer, and the supporting layer is disposed between the first circuit board and the display portion.

[0024] The support layer can further provide good support for the packaging part to ensure that the bending radius of the bending part is within an appropriate range and avoid damage to the bending part due to excessive bending. In addition, the support layer provides support for the second circuit board to facilitate the subsequent hot pressing and bonding of the second circuit board to the first circuit board.

[0025] In a possible design, a recessed portion is provided on the first circuit board, and the supporting layer is provided in the recessed portion.

[0026] In this structure, the support layer can be arranged in the recessed portion, which can reduce the setting volume of the support layer, provide better support for the first circuit board and the packaging portion, and at the same time improve the compactness of the internal structure of the electronic device, meeting the requirements of high-density stacking of various components inside the electronic device.

[0027] In a possible design, the recessed portion is provided on a side of the first circuit board facing away from the second binding end.

[0028] The recessed portion is arranged at a position corresponding to the second binding end on the first circuit board, so that the supporting layer arranged in the recessed portion can provide good support for the binding position corresponding to the second binding end on the first circuit board, so as to facilitate the subsequent hot pressing binding connection between the second circuit board and the first circuit board.

[0029] In one possible design, the first circuit board is a flexible circuit board; or, the first circuit board is a printed circuit board; or, the first circuit board includes both a flexible circuit board and a printed circuit board. The first circuit board can serve as a wiring board connected to the mainboard, facilitating the arrangement of electronic components on the first circuit board to meet the requirements of electronic equipment, increasing the design freedom of the display module, and further reducing the space occupied by the display module in the second direction.

[0030] In one possible design, the first circuit board is a printed circuit board, the second circuit board is a flexible circuit board, and the difference between the thermal expansion coefficient of the first circuit board and the thermal expansion coefficient of the second circuit board is a first thermal expansion coefficient difference; or, the first circuit board is a flexible circuit board, the second circuit board is a flexible circuit board, and the difference between the thermal expansion coefficient of the first circuit board and the thermal expansion coefficient of the second circuit board is a second thermal expansion coefficient difference; wherein the second thermal expansion coefficient difference is smaller than the first thermal expansion coefficient difference.

[0031] When the first circuit board is a flexible circuit board, the thermal expansion coefficients of the first circuit board and the second circuit board, also a flexible circuit board, are similar. During the thermal compression bonding process, the difference in expansion volume between the first and second circuit boards is minimal, making it easier for the second binding end 32 of the second circuit board to align with the corresponding binding position on the first circuit board. This allows the second binding end to be made smaller in the second direction, further reducing the space occupied in the second direction. The space saved in the second direction can be used to increase the installation space for components such as batteries, further facilitating an increase in battery capacity.

[0032] In a possible design, the display module further includes an adhesive layer, and the adhesive layer is disposed between the display portion and the first circuit board.

[0033] The adhesive layer can fix the first circuit board on the side of the display part having the backlight surface, thereby avoiding relative offset between the first circuit board and the second circuit board, thereby improving the binding reliability between the first circuit board and the second circuit board, and can further improve the structural stability of the display module, facilitating the overall assembly of the display module.

[0034] In a possible design, the display module further includes a metal plate, and the metal plate is arranged on a side of the display portion having the backlight surface.

[0035] The metal plate is attached to the backlight surface of the display part, so that it can be used to support the display part and improve the structural strength and surface flatness of the display part.

[0036] In a possible design, the display module further includes a cover plate, which is arranged on a side of the display portion having the light emitting surface.

[0037] The cover plate is attached to the light emitting surface of the display part, thereby further improving the structural strength of the display part, protecting the light emitting surface, preventing the light emitting surface from being scratched, and improving the reliability and service life of the display module.

[0038] A second aspect of the embodiments of the present application provides an electronic device comprising a middle frame, a back cover, and a display module as described in any of the above embodiments, wherein the display module and the back cover are respectively connected to opposite sides of the middle frame. Since the display module has the above-mentioned technical effects, electronic devices including the display module should also have corresponding technical effects, which will not be further described here.

[0039] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] Figure 1 This is a simplified structural diagram of a display module in the related art;

[0042] Figure 2 It is a simplified structural diagram of another display module in the related art;

[0043] Figure 3 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0044] Figure 4 A schematic diagram of a partial structural breakdown of an electronic device provided in an embodiment of the present application;

[0045] Figure 5 A simplified structural diagram of a display module provided in an embodiment of the present application;

[0046] Figure 6 for Figure 4 The schematic diagram of part of the module structure is shown in the figure;

[0047] Figure 7 A simplified structural diagram of another display module provided in an embodiment of the present application;

[0048] Figure 8 A simplified structural diagram of another display module provided in an embodiment of the present application;

[0049] Figure 9 for Figure 4 A partial enlarged view of point A in the middle;

[0050] Figure 10 A simplified structural diagram of another display module provided in an embodiment of the present application.

[0051] Reference numerals:

[0052] 1'-display panel;

[0053] 11'-display unit;

[0054] 12'-bending portion;

[0055] 13'-packaging part;

[0056] 2'-first circuit board;

[0057] 21'-binding part;

[0058] 22'-avoidance groove;

[0059] 3'-support member;

[0060] 4'-driver chip;

[0061] 5'-battery;

[0062] 10-Display module;

[0063] 1-Display panel;

[0064] 11-display unit;

[0065] 111-light emitting surface;

[0066] 112- backlight surface;

[0067] 12- bending portion;

[0068] 13- packaging unit;

[0069] 2-first circuit board;

[0070] 21-depression;

[0071] 3- second circuit board;

[0072] 31-first binding end;

[0073] 32-second binding end;

[0074] 4- Driver chip;

[0075] 5-adhesive layer;

[0076] 6-Waterproof dispensing;

[0077] 7-Metal plate;

[0078] 8-cover plate;

[0079] 9-composite membrane;

[0080] 101-support layer;

[0081] 20-middle frame;

[0082] 30-back cover;

[0083] 40-battery;

[0084] 50- Mainboard;

[0085] X-second direction;

[0086] Y-third direction;

[0087] Z-first direction.

[0088] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0089] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0090] In the description of this application, unless otherwise specified or limited, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0091] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0092] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0093] As society progresses, electronic devices are becoming increasingly ubiquitous and widely used in our lives. To make them easier to carry, they are becoming increasingly lightweight and thin. However, this trend inevitably leads to limited internal space, necessitating a continuous increase in the demand for compactness within these devices.

[0094] Please refer to Figure 1 , Figure 1 This is a simplified structural diagram of a display module in the related art. Figure 1 As shown, in electronic devices of related art, the display panel 1' of the display module usually adopts a flexible screen and usually adopts a COP (Chip On Plastic, a chip is bound to a flexible plastic substrate of the display panel) packaging process. By utilizing the bending characteristics of the flexible display surface 1' itself, the packaging part 13' of the display panel 1' is bent on the side of the display part 11' away from its display surface through the bending part 12' to reduce the space occupied by the packaging part 13' on the frame of the electronic device, wherein the packaging part 13' is used to bind the first circuit board 2' and the driver chip 4'. Among them, the driver chip 4' is usually directly bound to the side of the packaging part 13' away from the display part 11', and the first circuit board 2' is bound and connected to the packaging part 13' through the binding part 21'.

[0095] like Figure 1As shown, the driving chip 4' and the first circuit board 2' can be arranged along the second direction X, so that at least a portion of the first circuit board 2' is located on the back side of the display portion 11'. However, the length of the packaging portion 13' and the first circuit board 2' in the second direction X occupies a large space, which easily reduces the installation space of components such as the battery 5', which is not conducive to increasing the battery capacity.

[0096] Please refer to Figure 2 , Figure 2 FIG. 1 is a simplified structural diagram of another display module in the related art. Figure 2 As shown, along the first direction Z, the first circuit board 2' can also be arranged on the side of the packaging portion 13' facing away from the display portion 11', and a clearance groove 22' is provided to avoid the driver chip 4', which is also bound to the packaging portion 13' on the side facing away from the display portion 11'. However, considering the actual wiring, and to avoid interference between the first circuit board 2' and the driver chip 4', the size of the clearance groove 22' should be larger than the size of the driver chip 4'. As a result, the dimensions of the first circuit board 2' in both the first direction Z and the second direction X are larger, resulting in the display module occupying more space in the first direction Z and the second direction X.

[0097] Furthermore, to prevent the bent portion 12' from being damaged by excessive bending, a support member 3' is typically provided between the packaging portion 13' and the display portion 11' to ensure that the bending arc of the bent portion 12' remains within an appropriate range. The support member 3' is typically a block-shaped support block that simply serves as a support, or a multi-layer support plate or other supporting structure, which further increases the space occupied by the display module within the electronic device.

[0098] In summary, the display module in the related art occupies a large space in the electronic device, which results in limited installation space for other components in the electronic device and cannot meet the requirement of high-density stacking of various components in the electronic device.

[0099] In view of this, the embodiments of the present application provide a display module and an electronic device to reduce the space occupied by the display module in the electronic device, improve the compactness of the internal structure of the electronic device, and meet the requirements of high-density stacking of various components inside the electronic device. Among them, the electronic device can be any device with a foldable screen function, such as a mobile phone, a tablet computer, a personal digital assistant (PDA), a laptop computer, a car computer, a foldable display device, a foldable display screen, a wearable device, etc. The embodiments of the present application do not impose any special restrictions on the specific form of the above-mentioned electronic device. For the convenience of explanation, the following description is made by taking the electronic device as an example of a mobile phone. The electronic device of the present application is introduced below with specific embodiments.

[0100] Please refer to Figure 3 , Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 3 As shown, the electronic device may include a display module 10, a middle frame 20 and a back cover 30, wherein the display module 10 and the back cover 30 are respectively connected to opposite sides of the middle frame 20, and the display module 10, the middle frame 20 and the back cover 30 can be jointly enclosed to form an installation space for setting a main board, a battery, a camera module and other electronic devices.

[0101] The display module 10 may include a liquid crystal display (LCD), an organic light emitting diode (OLED) display panel, or other display panels for displaying images. The middle frame 20 is used to support the entire device and can be made of metal, ceramic, glass, plastic, etc. The back cover 30 can also be made of metal, ceramic, glass, plastic, etc. The middle frame 20 and back cover 30 can be formed separately and fixed by welding, clamping, bonding, etc.

[0102] For ease of understanding, the thickness direction of the display module 10 is defined as a first direction Z, the length direction of the display module 10 is defined as a second direction X, and the width direction of the display module 10 is defined as a third direction Y.

[0103] Please refer to Figure 4 , Figure 4 This is a schematic diagram of the partial structural decomposition of an electronic device provided in an embodiment of the present application. Figure 4 As shown, along the first direction Z, the display module 10 can be connected to one side of the middle frame 20 by bonding or other means, and the mainboard 50 and battery 40 can be connected to the other side of the middle frame 20 by bonding or screw connection, that is, fixed between the middle frame 20 and the back cover 30. The display module 10 and battery 40 can be electrically connected to the mainboard 50 by means of a flexible circuit board, a cable, etc., and the specific configuration can be based on actual needs and is not limited here.

[0104] The display module 10 may be composed of components such as a display panel 1 , a first circuit board 2 , a second circuit board 3 , and a driving chip 4 .

[0105] Among them, the display panel 1 can be used to display images, videos, etc. In the present application, the display panel 1 can be a flexible screen. Exemplarily, the display panel 1 can be an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen. The AMOLED display screen is a self-luminous display screen and does not require a backlight module (BLM). Therefore, when the base substrate in the AMOLED display screen is made of a flexible resin material, such as polyethylene terephthalate (PET), the AMOLED display screen can have a bendable property. Exemplarily, the display panel 1 can also be an organic light-emitting diode (OLED) display screen, a mini organic light-emitting diode (MID) display screen, a micro organic light-emitting diode (MID) display screen, a micro organic light-emitting diode (MID) display screen, a quantum dot light emitting diode (QLED) display screen, etc., without limitation here.

[0106] like Figure 4 As shown, the first circuit board 2 can be bound to the display panel 1 via the second circuit board 3. The first circuit board 2 or the second circuit board 3 can be connected to the mainboard 50 as a wiring circuit board to achieve electrical connection between the display module 10 and the mainboard 50, and a variety of electronic components can be arranged on the first circuit board 2 or the second circuit board 3 to meet the various usage requirements of the electronic device.

[0107] The driver chip 4 can be bound to the display panel 1 to drive the display panel 1 to realize the display function.

[0108] It should be understood that binding, that is, bonding, also known as bonding, refers to a method of connection in the production and packaging process of microelectronic devices. For example, it can be to use anisotropic conductive film (ACF) and other methods to utilize heat pressing or ultrasonic energy to complete the connection of internal interconnections of solid-state circuits in microelectronic devices. Its processes may include pressure welding, wire welding, bonding, ball welding, flat welding, etc. The binding connection has better corrosion resistance and shock resistance, and also has higher stability, which can increase the service life of the display module 10 and is conducive to the mass production of the display module 10. Exemplarily, the driver chip 4 is bound to the display panel 1, that is, the driver chip 4 is physically fixed and electrically connected to the display panel 1 by welding or other methods.

[0109] Please refer to Figure 5 , Figure 5 This is a simplified structural diagram of a display module provided in an embodiment of the present application. Figure 5 As shown, the display panel 1 includes a display portion 11, a bent portion 12, and an encapsulation portion 13. Along a first direction Z of the display module 10, the display portion 11 includes a light-emitting surface 111 and a backlight surface 112 that are disposed opposite each other. The encapsulation portion 13 is bent by the bent portion 12 to the side of the display portion 11 having the backlight surface 112, so that the encapsulation portion 13 is disposed on the backlight surface 112 side of the display portion 11.

[0110] Among them, the light-emitting surface 111 of the display part 11 is used to display the picture, and the packaging part 13 is used to bind the driver chip 4 and the first circuit board 2. The packaging part 13 is arranged on the backlight surface 112 side of the display part 11, which can reduce the space occupied by the packaging part 13 on the frame of the electronic device, thereby further reducing the size of the frame on the light-emitting surface 111 of the electronic device, increasing the occupation ratio of the light-emitting surface 111 on the electronic device, and reducing the size of the electronic device in the second direction X and the third direction Y.

[0111] like Figure 5 As shown, the first circuit board 2 is disposed between the packaging portion 13 and the display portion 11, thereby supporting the packaging portion 13 and ensuring that the bending curvature of the bending portion 12 is within an appropriate range, thereby preventing the bending portion 12 from being damaged due to excessive bending. In this application, no additional support members are required between the packaging portion 13 and the display portion 11, thereby reducing the space occupied by the display module 10 within the electronic device along the first direction Z and the second direction X. This can improve the compactness of the internal structure of the electronic device and meet the requirements for high-density stacking of various components within the electronic device.

[0112] The space saved by the display module 10 in the second direction X can be used to install components such as the battery 40 , thereby facilitating an increase in battery capacity.

[0113] like Figure 5 As shown, in a specific embodiment, the display module 10 may further include an adhesive layer 5, which is arranged between the display part 11 and the first circuit board 2, so that the first circuit board 2 can be fixed to the side of the display part 11 having the backlight surface 112, avoiding relative offset between the first circuit board 2 and the second circuit board 3, thereby improving the binding reliability between the first circuit board 2 and the second circuit board 3, and further improving the structural stability of the display module 10, facilitating the overall assembly of the display module 10.

[0114] like Figure 5 As shown, in a specific embodiment, the second circuit board 3 can be provided as an independent circuit board on the side of the packaging portion 13 away from the display portion 11. The second circuit board 3 includes a first binding end 31 and a second binding end 32. The first binding end 31 can be connected to the packaging portion 13, and the second binding end 32 can be connected to the first circuit board 2.

[0115] In related technologies, such as Figure 1 As shown, the wiring circuit board, i.e., the first circuit board 2', includes a binding portion 21' extending along its second direction X to achieve a binding connection with the packaging portion 13' of the display panel 1'. However, if the first circuit board 2' of this structure is set between the display portion 11' and the packaging portion 13', when the binding portion 21' of the first circuit board 2' is bound to the packaging portion 13', the binding portion 21 needs to be bent toward the packaging portion 13' to achieve a binding connection with the side of the packaging portion 13' away from the display portion 11'. In order to avoid damage to the binding portion 21' due to excessive bending, the space occupied by the display module in the electronic device along the first direction Z and the second direction X will inevitably be further increased. In addition, in the related art, the first circuit board 2' is mostly a soft-rigid combination board, which has a high preparation cost and a high process difficulty.

[0116] In the embodiment of the present application, the second circuit board 3 is an independent circuit board. Therefore, when the second circuit board 3 is used to bind the first circuit board 2 to the packaging portion 13, the second circuit board 3 can be directly bound to the packaging portion 13 along the first direction Z via the first binding end 31, and directly bound to the first circuit board 2 via the second binding end 32. This prevents a large curvature of the bending, thereby further reducing the space occupied by the display module 10 within the electronic device along the first direction Z and the second direction X. Furthermore, the first circuit board 2 and the second circuit board 3 are independent circuit boards, which can further reduce the difficulty of manufacturing the first circuit board 2 and the second circuit board 3, thereby saving the production cost of the display module 10.

[0117] Please refer to Figure 6 , Figure 6 for Figure 4 A schematic diagram of a partial structure of the module is shown in FIG. In a specific implementation, Figure 5 and Figure 6 As shown, the first binding end 31 of the second circuit board 3 is connected to the end of the packaging part 13 away from the bending part 12, and the second binding end 32 is connected to the first circuit board 2, so that the first circuit board 2 can be conveniently bound and connected to the packaging part 13 through the second circuit board 3 at the end of the packaging part 13 away from the bending part 12, and the space occupied by the second circuit board 3 in the third direction Y can be reduced, thereby further reducing the space occupied by the display module 10 along the third direction Y in the electronic device.

[0118] Further, if Figure 5 As shown, along the second direction X of the display module 10, at least a portion of the first circuit board 2 extends beyond the packaging portion 13 and is connected to the second binding end 32. That is, the projections of the first circuit board 2 and the packaging portion 13 along the first direction Z at least partially do not overlap. This structure can further reduce the difficulty of binding the second binding end 32 to the first circuit board 2, thereby facilitating mass production of the display module 10.

[0119] It should be noted that the above-mentioned "end" refers to the two ends of a structure that are away from each other in a preset direction, that is, the "first binding end" and the "second binding end" are concepts of one end and the other end relative to each other, rather than referring to the end face of a structure (i.e., the side wall). Exemplarily, the first binding end 31 of the second circuit board 3 is the end at which the second circuit board 3 is connected to the packaging portion 13, and the second binding end 32 of the second circuit board 3 is the end at which the second circuit board 3 is connected to the first circuit board 2, rather than referring to the end face (i.e., the side wall) of the second reading board 3. In addition, it should be understood that the "end" refers to an area of a length located at both ends of the structure, and does not limit its distance from the end face.

[0120] like Figure 5 As shown, in a specific embodiment, the display module 10 may further include a waterproof glue 6, which fills the gap between the first circuit board 2 and the second circuit board 3, thereby preventing liquid from entering the gap between the first circuit board 2 and the second circuit board 3, thereby improving the waterproof performance of the display module 10.

[0121] In a specific embodiment, the portion of the second circuit board 3 extending from the packaging portion 13 along the second direction X can also be completely bound and connected to the first circuit board 2, thereby further simplifying the preparation process of the display module 10, improving the preparation efficiency, and enhancing the connection stability of the display module 10.

[0122] like Figure 6 As shown, in a specific embodiment, along the third direction Y of the display module 10 , the width dimension W1 of the packaging portion 13 is less than or equal to the width dimension W2 of the display portion 11 , that is, W1 ≤ W2 .

[0123] Among them, if the width dimension W1 of the packaging part 13 is greater than the width dimension W2 of the display part 11, that is, W1>W2, the space occupied by the display panel 1 in the third direction Y will be increased, and the space occupied by the borders of the electronic device on both sides along the third direction Y will be increased, thereby increasing the size of the electronic device, which is not conducive to the miniaturization design of the electronic device.

[0124] Therefore, when the width dimension W1 of the packaging part 13 is less than or equal to the width dimension W2 of the display part 11, that is, W1≤W2, the space occupied by the display module 10 in the third direction Y can be further reduced, and the first circuit board 2 located between the packaging part 13 and the display part 11 can be exposed to the packaging part 13 along the third direction Y, that is, the projection of the packaging part 13 on the first circuit board 2 does not completely cover the first circuit board 2 along the third direction Y, thereby making it easier to arrange some electronic components on the first circuit board 2, thereby improving the compactness of the internal structure of the electronic device and meeting the requirements of high-density stacking of various components inside the electronic device.

[0125] In a specific embodiment, Figure 5 As shown, the driver chip 4 is bound and arranged on a side of the packaging portion 13 away from the display portion 11 , thereby avoiding interference between the driver chip 4 and the first circuit board 2 and improving the reliability of the driver chip 4 .

[0126] The number of the driving chips 4 can be one or more, and can be set according to actual needs to ensure the reliability of the function of the display unit 11, and is not limited here.

[0127] In the above embodiments, the second circuit board 3 can be a flip chip film or a flexible printed circuit (FPC), so that the second circuit board 3 can be more closely fitted with the packaging part 13 and the first circuit board 2, thereby making it easier to achieve a binding connection between the second circuit board 3 and the packaging part 13 and the first circuit board 2.

[0128] In addition, in the above embodiments, the first circuit board 2 can be a single-layer or multi-layer printed circuit board (PCB), or the first circuit board 2 can be a single-layer or multi-layer flexible circuit board (FPC), or the first circuit board 2 can also be a soft-hard combination board including a printed circuit board (PCB) and a flexible circuit board (FPC), so that the first circuit board can be connected to the main board as a wiring circuit board, and it is convenient to arrange electronic devices on the first circuit board to meet the use requirements of electronic equipment, and it can improve the design freedom of the display module 10. The first circuit board 2 can be specifically set according to actual needs and is not limited here.

[0129] In a specific embodiment, Figure 5 As shown, the first circuit board 2 is a printed circuit board (PCB), which has high hardness and can better support the packaging part 13.

[0130] In a specific embodiment, please refer to Figure 7 , Figure 7 This is a simplified structural diagram of another display module provided in an embodiment of the present application. Figure 7 As shown, the first circuit board 2 may be a flexible printed circuit (FPC).

[0131] Among them, the circuit board is composed of a variety of materials and internal wiring. The differences in the materials of the circuit board and the internal wiring design will affect the thermal expansion coefficient of the circuit board, resulting in different volumes of the circuit board expanding due to heat.

[0132] When the first circuit board 2 is a printed circuit board and the second circuit board 3 is a flexible circuit board, since the materials and internal wiring designs of the printed circuit board and the flexible circuit board are different, the thermal expansion coefficients of the first circuit board 2 and the second circuit board 3 are quite different. Therefore, during the hot pressing binding process, it is easy to cause the expansion volume of the first circuit board 2 to be quite different from the expansion volume of the second circuit board 3. The second binding end 32 of the second circuit board 3 is difficult to align with the corresponding binding position on the first circuit board 2. Therefore, the size of the second binding end 32 along the second direction X needs to be made larger to ensure that the second binding end 32 is aligned and connected with the corresponding binding position on the first circuit board 2.

[0133] When the first circuit board 2 and the second circuit board 3 are both flexible circuit boards, the materials of the first circuit board 2 and the second circuit board 3 are the same, which can reduce the difference in the coefficient of thermal expansion between the first circuit board 2 and the second circuit board 3. Furthermore, by optimizing the internal wiring design, the difference in the coefficient of thermal expansion between the first circuit board 2 and the second circuit board 3 can be further reduced, making the coefficients of thermal expansion of the first circuit board 2 and the second circuit board 3 closer. In some embodiments, the coefficients of thermal expansion of the first circuit board 2 and the second circuit board 3 can be substantially the same.

[0134] Exemplarily, when the first circuit board 2 is a printed circuit board and the second circuit board 3 is a flexible circuit board, the difference between the thermal expansion coefficient of the first circuit board 2 and the thermal expansion coefficient of the second circuit board 3 is a first thermal expansion coefficient difference Δα1; when the first circuit board 2 is a flexible circuit board and the second circuit board 3 is also a flexible circuit board, the difference between the thermal expansion coefficient of the first circuit board 2 and the thermal expansion coefficient of the second circuit board 3 is a second thermal expansion coefficient difference Δα2; the second thermal expansion coefficient difference Δα2 is less than the first thermal expansion coefficient difference Δα1, that is, Δα2<Δα1.

[0135] Therefore, if Figure 7 As shown, when the first circuit board 2 is a flexible circuit board, the thermal expansion coefficients of the first circuit board 2 and the second circuit board 3, also a flexible circuit board, are similar. During the hot pressing bonding process, the difference in the expanded volumes of the first circuit board 2 and the second circuit board 3 is minimal, making it easier for the second binding end 32 of the second circuit board 3 to align with the corresponding binding position on the first circuit board 2 for connection. This allows the size of the second binding end 32 along the second direction X to be made smaller, thereby further reducing the space occupied in the second direction X. The space saved in the second direction X can be used to increase the installation space for components such as the battery 40, further facilitating an increase in battery capacity.

[0136] In a specific embodiment, please refer to Figure 8 , Figure 8 This is a simplified structural diagram of another display module provided in an embodiment of the present application. Figure 8As shown, the first circuit board 2 can be a hard-soft board composed of a flexible printed circuit (FPC) and a printed circuit board (PCB), so that the first circuit board 2 has a higher hardness, which can better support the packaging part 13, and can also reduce the difference in expansion coefficient at the binding connection between the first circuit board 2 and the second circuit board 3. Therefore, during the hot pressing binding process, the second binding end 32 of the second circuit board 3 is easier to align and connect with the corresponding binding position on the first circuit board 2, so that the size of the second binding end 32 along the second direction X can be made smaller, further reducing the occupied space in the second direction X. The space saved in the second direction X can be used to increase the installation space of components such as the battery 40, which is more conducive to increasing the battery capacity.

[0137] In addition, the first circuit board 2 can have multiple layers of routing layers, and the number of routing layers can be greater than or equal to 2 layers, for example, it can be 4 layers or 6 layers. Increasing the number of routing layers is conducive to making full use of the space in the first direction Z of the electronic device, thereby further reducing the space occupied by the display module 10 in the second direction X and the third direction Y of the electronic device.

[0138] In a specific embodiment, Figure 7 As shown, the display module 10 further includes a support layer 101 , which is disposed between the first circuit board 2 and the display portion 11 .

[0139] In this embodiment, the support layer 101 can further provide good support for the packaging portion 13, ensuring that the bending radius of the bending portion 12 is within an appropriate range, thereby preventing damage to the bending portion 12 due to excessive bending. In addition, the support layer 101 can also provide support for the first circuit board 2, so as to facilitate the subsequent hot-compression bonding of the second circuit board 3 to the first circuit board 2.

[0140] The support layer 101 may be a metal support layer to enhance the structural strength and support effect of the support layer 101. Of course, the support layer 101 may also be made of non-metallic materials such as epoxy resin and plastic to reduce the mass of the display module 10 and save manufacturing costs.

[0141] In addition, if Figure 7 As shown, the support layer 101 can be fixed to the backlight surface 112 side of the display portion 11 through the adhesive layer 5 to further improve the structural stability of the display module 10 .

[0142] For example, Figure 7As shown, when the first circuit board 2 is a thinner flexible printed circuit (FPC), the support layer 101 can be evenly layered between the first circuit board 2 and the display unit 11 to provide better support for the first circuit board 2 and the packaging unit 13, so as to facilitate the subsequent hot pressing and binding connection between the second circuit board 3 and the first circuit board 2.

[0143] For example, Figure 8 As shown, when the first circuit board 2 is a hard-soft combination board composed of a flexible printed circuit (FPC) and a printed circuit board (PCB), a recessed portion 21 may be provided on the first circuit board 2. The recessed portion 21 may be formed by the flexible printed circuit and the printed circuit board during the preparation process of the first circuit board 2.

[0144] The support layer 101 can be arranged in the recessed portion 21, which can reduce the setting volume of the support layer 101, provide better support for the first circuit board 2 and the packaging portion 13, and improve the compactness of the internal structure of the electronic device, meeting the requirements of high-density stacking of various components inside the electronic device.

[0145] Furthermore, the recessed portion 21 is provided on a side of the first circuit board 2 away from the second binding end 32 .

[0146] In this embodiment, the recessed portion 21 is arranged at a position corresponding to the second binding end 32 on the first circuit board 2, so that the supporting layer 101 arranged in the recessed portion 21 can provide good support for the binding position corresponding to the second binding end 32 on the first circuit board 2, so as to facilitate the subsequent hot pressing binding connection between the second circuit board 3 and the first circuit board 2.

[0147] Please refer to Figure 9 and Figure 10 , Figure 9 for Figure 4 A partial enlarged view of point A in the middle. Figure 10 A simplified structural diagram of another display module provided in an embodiment of the present application.

[0148] like Figure 9 and Figure 10 As shown, along the first direction Z of the display module 10 , the height H1 of the second circuit board 3 is less than or equal to the height H2 of the driving chip 4 , that is, H1 ≤ H2.

[0149] Among them, if the height H1 of the second circuit board 3 is greater than the height H2 of the driver chip 4, that is, H1>H2, the height of the second circuit board 3 in the first direction Z is too high, which will increase the overall height of the display module 10 in the first direction Z, and increase the space occupied by the display module 10 in the electronic device along the first direction Z, which is not conducive to the stacking of various components in the electronic device.

[0150] Therefore, when the height H1 of the second circuit board 3 is less than or equal to the height H2 of the driving chip 4, that is, H1≤H2, it is possible to ensure the connection reliability between the second circuit board 3 and the packaging part 13 and the first circuit board 2 while further reducing the space occupied by the display module 10 in the first direction Z, so as to facilitate high-density stacking of various components inside the electronic device.

[0151] like Figure 9 As shown, in a specific embodiment, the display module 10 may further include a metal plate 7, please refer to Figure 10 The metal plate 7 can be provided on the side of the display unit 11 having the backlight surface 112. Specifically, the metal plate 7 can be attached to the backlight surface 112 of the display unit 11, thereby being used to support the display unit 11 and improve the structural strength and surface smoothness of the display unit 11.

[0152] Among them, such as Figure 10 As shown, the metal plate 7 can serve as the grounding terminal of the display module 10 , and the first circuit board 2 can be fixed to the side of the metal plate 7 away from the display portion 11 through the adhesive layer 5 , thereby facilitating the grounding of the display module 10 .

[0153] like Figure 9 As shown, in a specific embodiment, the display module 10 may further include a cover plate 8, please refer to Figure 10 The cover plate 8 can be disposed on the side of the display unit 11 having the light emitting surface 111. Specifically, the cover plate 8 can be attached to the light emitting surface 111 of the display unit 11, thereby further improving the structural strength of the display unit 11 and protecting the light emitting surface 111 from being scratched, thereby improving the reliability and service life of the display module 10.

[0154] The cover plate 8 may be made of a material with high light transmittance, such as glass or plastic, and is not limited here.

[0155] Further, if Figure 9 and Figure 10 As shown, the display module 10 may further include a composite film 9 , which may be attached to the side of the cover plate 8 facing away from the light emitting surface 111 , thereby improving the light emitting performance of the display portion 11 and enhancing the viewing experience of the user.

[0156] The composite film 9 may be one or more of a polarizer, a protective film, and a spectroscopic film, or a film layer with other functions. The specific configuration may be based on actual needs and is not limited here.

[0157] In this specification, reference can be made to the same or similar parts between the various embodiments. In particular, for the device embodiment and the terminal embodiment, since they are basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiment.

[0158] The above description is merely a specific implementation of the embodiments of the present application, but the scope of protection of the embodiments of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of the present application shall be included in the scope of protection of the embodiments of the present application. Therefore, the scope of protection of the embodiments of the present application shall be based on the scope of protection of the claims.

Claims

1. A display module, characterized in that: include: A display panel, the display panel comprising a display portion, a bending portion, and an encapsulation portion arranged in sequence; along a first direction of the display module, the display portion comprises a light-emitting surface and a backlight surface arranged opposite to each other, and the encapsulation portion is arranged on a side of the display portion having the backlight surface; wherein the first direction is a thickness direction of the display module; A first circuit board is disposed between the packaging portion and the display portion.

2. The display module according to claim 1, wherein: The display module further includes a second circuit board, which is arranged on a side of the packaging portion away from the display portion; The second circuit board includes a first binding end and a second binding end, the first binding end is connected to the packaging portion, and the second binding end is connected to the first circuit board.

3. The display module according to claim 2, wherein: The first binding end is connected to the packaging portion, including: the first binding end is connected to an end of the packaging portion away from the bending portion.

4. The display module according to claim 2, wherein: The second binding end is connected to the first circuit board, including: along a second direction of the display module, at least a portion of the first circuit board extends out of the packaging portion and is connected to the second binding end; wherein the second direction is perpendicular to the first direction.

5. The display module according to claim 2, wherein: The display module further includes a driving chip, and the driving chip is arranged on a side of the packaging portion away from the display portion.

6. The display module according to claim 5, wherein: Along the first direction of the display module, the height of the second circuit board is less than or equal to the height of the driving chip.

7. The display module according to any one of claims 1 to 6, wherein: Along a third direction of the display module, a width dimension of the encapsulation portion is smaller than or equal to a width dimension of the display portion; wherein the third direction is perpendicular to the first direction and the second direction.

8. The display module according to any one of claims 2 to 6, wherein: The display module further includes a waterproof glue filling the gap between the first circuit board and the second circuit board.

9. The display module according to any one of claims 2 to 6, wherein: The second circuit board is a chip on film or a flexible circuit board.

10. The display module according to any one of claims 2 to 6, characterized in that: The display module further includes a supporting layer, and the supporting layer is arranged between the first circuit board and the display portion.

11. The display module according to claim 10, wherein: A recessed portion is provided on the first circuit board, and the supporting layer is provided in the recessed portion.

12. The display module according to claim 11, wherein: The recessed portion is arranged on a side of the first circuit board away from the second binding end.

13. The display module according to any one of claims 1 to 12, characterized in that: The first circuit board is a flexible circuit board; Alternatively, the first circuit board is a printed circuit board; Alternatively, the first circuit board includes a flexible circuit board and a printed circuit board.

14. The display module according to any one of claims 2 to 6, characterized in that: The first circuit board is a printed circuit board, the second circuit board is a flexible circuit board, and the difference between the thermal expansion coefficient of the first circuit board and the thermal expansion coefficient of the second circuit board is a first thermal expansion coefficient difference; Alternatively, the first circuit board is a flexible circuit board, the second circuit board is a flexible circuit board, and the difference between the thermal expansion coefficient of the first circuit board and the thermal expansion coefficient of the second circuit board is a second thermal expansion coefficient difference; The second thermal expansion coefficient difference is smaller than the first thermal expansion coefficient difference.

15. The display module according to any one of claims 1 to 14, characterized in that: The display module further includes an adhesive layer disposed between the display portion and the first circuit board.

16. The display module according to any one of claims 1 to 15, characterized in that: The display module further includes a metal plate, and the metal plate is arranged on a side of the display portion having the backlight surface.

17. The display module according to any one of claims 1 to 16, wherein: The display module further includes a cover plate, which is arranged on a side of the display portion having the light emitting surface.

18. An electronic device, characterized in that: The electronic device includes a middle frame, a back cover, and a display module according to any one of claims 1 to 17, wherein the display module and the back cover are respectively connected to opposite sides of the middle frame.

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