Monolithic wafer cleaning machine

Abstract

The invention provides a single-chip wafer cleaning machine, and relates to the technical field of single-chip wafer cleaning machines, the single-chip wafer cleaning machine comprises a cleaning machine frame, an inner cavity and a spraying mechanism, the inner cavity is arranged in the cleaning machine frame, a central processing unit is arranged on one side of the surface of the cleaning machine frame, an auxiliary assembly is installed at the bottom end of the inner wall of the inner cavity, and the auxiliary assembly comprises a base; the bottom end of the base is fixedly connected with the bottom end of the inner wall of the inner cavity, a stepping motor is installed in the base, the output end of the stepping motor is fixedly connected with a rotating frame, seepage holes are formed in the side wall of the rotating frame, and the section size of the base is matched with the section size of the bottom end of the inner cavity. According to the wafer cleaning device, the problems that in the wafer machining process, many industrial impurities are attached to the surface of the wafer, the surface of the wafer needs to be cleaned at the moment, the angle of a cleaning head arranged in a common cleaning device cannot be adjusted, and then the surface of the wafer is inconvenient to clean comprehensively are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of single-chip wafer cleaning machines, and in particular to a single-chip wafer cleaning machine. Background Art

[0002] A single-wafer cleaning machine is a device specifically designed for cleaning wafers during semiconductor manufacturing. It is primarily used to remove contaminants, particles, residues, and other chemical contaminants from the wafer surface to ensure a clean surface, thereby improving the quality and reliability of subsequent processes such as photolithography and deposition. It is a common process in manufacturing processes.

[0003] Prior art, such as the invention with publication number CN115116905B, discloses a single-wafer cleaning machine. The patent includes a cleaning machine body, a cleaning tank, a water distribution arm, a cleaning liquid nozzle, and an ultrapure water nozzle. The cleaning machine body also includes a supporting mechanism. The supporting mechanism includes a turntable, a vertical pipe, a circular plate, a horizontal partition, and a compressed air bag. A vent is provided at the top of the turntable. A vent pipe is provided at the upper end of the compressed air bag. A centering assembly is also provided on the cleaning tank. The centering assembly includes three push mechanisms, each of which includes a radial push rod and a translational vertical rod. Three transmission blocks are fixedly connected to the outside of the circular plate. The lower end of each translational vertical rod engages the inclined surface of a corresponding transmission block. This invention utilizes external atmospheric pressure to generate pressure on the wafer by changing the air pressure within the turntable and the vertical pipe, thereby securing the wafer to the turntable. The centering assembly positions the wafer before securing it, significantly reducing the degree of deviation between the wafer axis and the turntable axis.

[0004] During the process of production and processing, it was found that during the processing of the wafer, a lot of industrial dirt will adhere to the surface of the wafer. At this time, the surface of the wafer needs to be cleaned. However, the cleaning head provided in the conventional cleaning device cannot be adjusted in angle, which makes it inconvenient to clean the wafer surface in all aspects. Summary of the Invention

[0005] The purpose of the present invention is to solve the problem in the prior art that during the processing of wafers, a large amount of industrial dirt will adhere to the surface of the wafer, and the surface of the wafer needs to be cleaned. However, the cleaning head provided in the conventional cleaning device cannot be adjusted in angle, which makes it inconvenient to clean the wafer surface in all aspects.

[0006] The cleaning mechanism is installed in the cleaning chamber, and the cleaning mechanism has a bottom end and a bottom end, and a bottom end of the cleaning mechanism is installed in the cleaning chamber. The top end of the connecting pipe is rotatably connected to thedrinking nozzle, and the bottom end of the connecting pipe is rotatably connected to the nozzle opening.

[0007] The effect achieved by the above components is: during the processing and production of wafers, stains will adhere to the surface of the wafers, and the surface of the wafers needs to be cleaned. At this time, the wafers are placed in the inner chamber of the cleaning machine frame and cleaned with the help of the spray mechanism. In this process, the spray mechanism can deflect the angle of the spray pipe and the nozzle, and at the same time, the spray pipe can be moved horizontally, which helps to use all-round cleaning operations on the wafers.

[0008] Preferably, a baffle is fixedly connected to the inner wall of the upper end of the connecting pipe, and the upper surface of the baffle is in contact with a filter cartridge. The filter cartridge is an activated carbon cartridge, and a plurality of filter holes are opened on the surface of the filter cartridge.

[0009] The effect achieved by the above components is: when the clean water in the water tank is transported to the spray pipe, and then the flushing process is carried out with the help of the nozzle arranged on the lower surface of the spray pipe, auxiliary filtration can be carried out with the help of the activated carbon filter cartridge arranged in the connecting pipe, which helps to save energy and protect the environment.

[0010] Preferably, an angle scale is provided on the surface of the limiting plate at a position corresponding to the limiting groove, and the size of the angle scale is adapted to the cross-sectional size of the limiting plate.

[0011] The effect achieved by the above components is that the deflection angle of the entire spray pipe can be effectively observed by setting the angle scale on the surface of the limit plate.

[0012] Preferably, the spray pipe is a stainless steel pipe, and the length of the spray pipe is adapted to the cross-sectional size of the rotating frame.

[0013] The effects achieved by the above components are: Stainless steel sprinkler pipes are widely used in some humid environments or places with higher requirements due to their excellent corrosion resistance and oxidation resistance.

[0014] Preferably, an auxiliary material mechanism is provided on the arc surface of one side of the connecting pipe, and the auxiliary material mechanism includes a butt joint pipe, the bottom end of the butt joint pipe is fixedly connected to the connecting pipe, the upper end of the butt joint pipe is fixedly connected to a supporting pipe, the upper end of the supporting pipe is fixedly connected to a delivery pipe, an auxiliary material cylinder is fixedly connected to one side of the water tank, the bottom end of the auxiliary material cylinder is fixedly connected to the delivery pipe, inner grooves are provided on both sides of the inner wall of the bottom end of the supporting pipe, an outer groove is provided on the surface of the supporting pipe at a position corresponding to the inner groove, the inner wall of the inner groove is slidably connected to an inner magnetic block, and the outer groove The inner wall of the tube is slidably connected to an outer magnetic block, and the outer magnetic block is attracted to the inner magnetic block. The two side surfaces of the supporting tube are fixedly connected to electric push rods, and the output end of the electric push rod is fixedly connected to the surface of the outer magnetic block. The two inner magnetic blocks are fixedly connected to the same opening and closing column at one end close to each other, and through holes are provided on both sides of the bottom end of the opening and closing column. The upper end of the butt joint tube is fixedly connected to a closing plate at a position corresponding to the bottom end of the opening and closing column. The inner wall of the closing plate is plugged into the bottom end surface of the opening and closing column, and the cross-sectional size of the inner wall of the closing plate is adapted to the cross-sectional size of the opening and closing column.

[0015] The effect achieved by the above components is: in the process of cleaning the wafer surface, in order to effectively increase the cleaning effect, the auxiliary material mechanism set on one side of the spray mechanism can be used to operate, which helps to transport the additional cleaning additive into the connecting pipe and mix it with clean water, so as to further clean the wafer surface.

[0016] Preferably, a drainage block is fixedly connected to the bottom end of the inner wall of the opening and closing column, and the cross-section of the drainage block is in the shape of a pointed cone.

[0017] The effect achieved by the above components is that the cleaning additive liquid transported in the auxiliary material barrel can be quickly guided by the drainage block with a pointed cone-shaped cross section.

[0018] Preferably, a sealing ring is fixedly connected to the arc surface of the bottom end of the opening and closing column, and a sealing groove is opened on the inner wall of the closing plate, and the inner wall surface of the sealing groove abuts against the surface of the sealing ring.

[0019] The effect achieved by the above components is: with the help of the abutment limit between the sealing groove and the sealing ring, the sealing performance can be further improved, thereby allowing better opening and closing operations between the supporting pipe and the docking pipe.

[0020] Preferably, the bottom end of the inner wall of the connecting tube is fixedly connected to an auxiliary frame, the upper end of the auxiliary frame is rotatably connected to a rotating frame, the cross-section of the rotating frame is a pointed cone, and the surface of the rotating frame is evenly fixedly connected to a plurality of connecting plates, the cross-section of the connecting plates is inclined.

[0021] The effect achieved by the above components is: through the rotating frame set in the connecting pipe, it can rotate with the transported cleaning liquid with the help of the inclined connecting plate set on the surface, thereby facilitating the mixing of the cleaning additive and clean water, and enabling better cleaning operations.

[0022] Preferably, the inner wall of the rotating frame is provided with a clamping mechanism, and the clamping mechanism includes a positioning frame and a placement plate, the surface of the positioning frame is fixedly connected to the surface of the rotating frame, the upper inner wall of the positioning frame is fixedly connected to a support plate, a plurality of extrusion holes are evenly opened on the surface of the placement plate, and the positions of the extrusion holes on the lower surface of the placement plate are fixedly connected to a guide rail, the inner wall cross-section of the guide rail is concave, and the inner wall of the guide rail is slidably connected to a guide block, the cross-sectional size of the guide block is adapted to the cross-sectional size of the inner wall of the guide rail, the upper end of the guide block is connected to a connecting column, the arc surface of the connecting column is threadedly connected to an extrusion roller, and the extrusion roller is a sponge roller, and the lower surface of the guide block is fixedly connected to a rack, and the upper surface of the rack slides with the lower surface of the guide rail. The cam is fixedly connected to the guide rail at one side, and the cross-section of the fixed plate is "L"-shaped. The lower surface of the fixed plate is fixedly connected to the surface of the support plate, and the inner wall of the positioning frame is fixedly connected to the inlaid plate. The surface of the inlaid plate is fixedly connected to the driving motor, and the output end of the driving motor is fixedly connected to the adjusting rod. The upper end of the adjusting rod is rotatably connected to the lower surface of the placing plate, and the bottom arc surface of the adjusting rod is fixedly connected to the support frame. The upper surface of the support frame is fixedly connected to a gear ring, and the lower surface of the placing plate is rotatably connected to the position of the rack and the gear ring. The tooth surface of the gear is meshed with the tooth surface of the rack and the gear ring. The upper surface of the placing plate is fixedly connected to a support pad corresponding to the position of the adjusting rod, and the support pad is a rubber pad.

[0023] The effect achieved by the above components is: in the process of cleaning the wafer, in order to avoid the position displacement of the wafer, the clamping mechanism set on the inner wall of the rotating frame will be used for auxiliary clamping and limiting. With the help of the placement plate set in the clamping mechanism, the wafer is placed using the placement plate, and then the position of the extrusion roller sliding on the surface of the placement plate is moved and adjusted, so that the four surfaces of the wafer can be quickly clamped and fixed.

[0024] Preferably, a cylinder is fixedly connected to the lower surface of the placement plate, and an extrusion block is fixedly connected to the output end of the cylinder. The cross-section of the extrusion block close to the gear ring is conical, and the surface of the extrusion block is engaged with the tooth surface of the gear ring.

[0025] The effect achieved by the above components is: after the gear ring is rotated to the specified position to clamp and fix the wafer, it can be effectively squeezed and fixed with the help of the conical toothed squeezing block fixed at the output end of the cylinder.

[0026] Compared with the prior art, the advantages and positive effects of the present invention are: 1. In the present invention, by setting up a spray mechanism, the spray pipe and the nozzle corresponding to the rotating frame on the lower surface of the mounting plate can be deflected and moved horizontally, and the limit rod fixed on the surface of the spray pipe is used to perform movable regulation along the limit groove opened on the surface of the limit plate, thereby facilitating the quick and convenient cleaning operation on the surface of the wafer.

[0027] 2. In the present invention, by setting an auxiliary material mechanism, the inner wall between the supporting tube and the butt joint tube on one side of the connecting tube can be opened and closed, so that the auxiliary cleaning additive liquid in the auxiliary material cylinder can be transported, which is convenient for mixing the cleaning additive liquid with clean water. In this process, the electric push rod drives the adsorption and movement between the outer magnetic block and the inner magnetic block, so that the inner magnetic block drives the lifting and lowering of the opening and closing column position, and the opening and closing column and the closing plate in the inner wall of the upper end of the butt joint tube are plugged and separated, which helps to facilitate the transportation, regulation and use of the cleaning additive liquid.

[0028] 3. In the present invention, by setting up a clamping mechanism, the wafer can be squeezed, clamped and fixed on the surface of the placement plate. With the help of the gear ring, gear and rack for rotation, the rack drives the squeezing roller in the guide rail on the surface of the placement plate to move, so that the squeezing roller can effectively squeeze, fix and limit the wafer, so that the wafer cannot be offset or shaken during the cleaning process. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 The present invention provides a schematic diagram of the three-dimensional structure of a single-wafer cleaning machine; Figure 2 The present invention provides a schematic diagram of the internal structure of a three-dimensional structure of a single-wafer cleaning machine; Figure 3The present invention proposes a single-chip wafer cleaning machine Figure 2 Schematic diagram of the cross-sectional structure; Figure 4 The present invention provides a structural schematic diagram of a spray mechanism of a single-wafer cleaning machine; Figure 5 The present invention provides a schematic diagram of the partial structure of a spray mechanism of a single-wafer cleaning machine; Figure 6 The present invention proposes a single-chip wafer cleaning machine Figure 5 A schematic diagram of the structure enlarged at point A; Figure 7 The present invention proposes a single-chip wafer cleaning machine Figure 4 Schematic diagram of the structure enlarged at B; Figure 8 The present invention provides a structural schematic diagram of an auxiliary material mechanism of a single-wafer cleaning machine; Figure 9 The present invention provides a schematic diagram of the partial structure of the opening and closing column of a single-wafer cleaning machine; Figure 10 The present invention provides a schematic structural diagram of a clamping mechanism for a single-wafer cleaning machine; Figure 11 The present invention provides a partial structural schematic diagram of a clamping mechanism of a single-wafer cleaning machine.

[0030] Legend: 1. Cleaning machine frame; 2. Inner chamber; 3. CPU; 4. Rotating frame; 5. Rotating frame; 6. Mounting plate; 7. Spraying mechanism; 701. Spraying pipe; 702. Spray head; 703. Servo motor; 704. Driving rod; 705. Limiting rod; 706. Limiting plate; 707. Limiting groove; 708. Angle scale; 709. Water tank; 710. High-pressure pump; 711. Connecting pipe; 712. Connecting pipe; 713. Fixing frame; 714. Filter cartridge; 715. Baffle; 716. Filter hole; 717. Connecting shaft; 8. Auxiliary material mechanism; 801. Auxiliary material cartridge; 802. Delivery pipe; 803. Carrying pipe; 804. Outer slide; 805. Inner slide; 806. Opening and closing column; 807. Inner magnetic block; 808. Electric push rod; 809. External magnetic block; 810, through hole; 811, docking tube; 812, drainage block; 813, sealing ring; 814, closing plate; 815, sealing groove; 816, connecting plate; 817, auxiliary frame; 818, rotating frame; 9, clamping mechanism; 901, positioning frame; 902, support plate; 903, inlay plate; 904, driving motor; 905, support frame; 906, gear ring; 907, guide rail; 908, gear; 909, rack; 910, fixing plate; 911, cylinder; 912, extrusion block; 913, extrusion hole; 914, connecting column; 915, extrusion roller; 916, guide block; 917, adjusting rod; 918, placement plate; 919, support pad; 10, auxiliary components; 101, base; 102, seepage hole; 103, stepping motor. DETAILED DESCRIPTION

[0031] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features therein can be combined with each other.

[0032] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from the description. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0033] like Figure 1-3As shown, the present invention provides a single-chip wafer cleaning machine, including a cleaning machine frame 1, an inner chamber 2 and a spray mechanism 7. The inner chamber 2 is arranged inside the cleaning machine frame 1, and a central processing unit 3 is provided on one side of the surface of the cleaning machine frame 1. An auxiliary component 10 is installed at the bottom end of the inner wall of the inner chamber 2, and the auxiliary component 10 includes a base 101. The bottom end of the base 101 is fixedly connected to the bottom end of the inner wall of the inner chamber 2, and a stepper motor 103 is installed inside the base 101. The output end of the stepper motor 103 is fixedly connected to the rotating frame 4. The side wall of the rotating frame 4 is provided with a seepage hole 102. The cross-sectional size of the base 101 is adapted to the cross-sectional size of the bottom end of the inner chamber 2, a rotating frame 5 is installed on one side surface of the base 101, and a mounting plate 6 is provided on one side of the rotating frame 5. The spray mechanism 7 is arranged at a position on the surface of the mounting plate 6 corresponding to the rotating frame 4, an auxiliary material mechanism 8 is provided on the arc surface of one side of the connecting pipe 712, and a clamping mechanism 9 is provided on the inner wall of the rotating frame 4.

[0034] The specific configuration and functions of the spray mechanism 7, auxiliary material mechanism 8 and clamping mechanism 9 will be described in detail below.

[0035] like Figure 4 、 Figure 5 and Figure 6As shown, the spray mechanism 7 includes a driving rod 704, a servo motor 703, a connecting pipe 712 and a connecting pipe 711. Both ends of the driving rod 704 are rotatably connected to the lower surface of the mounting plate 6, the servo motor 703 is fixedly connected to the lower surface of the mounting plate 6, the output end of the servo motor 703 is fixedly connected to one end of the driving rod 704, and the arc surface of the driving rod 704 is threadedly connected with a connecting shaft 717 at both ends. The bottom ends of the two connecting shafts 717 are fixedly connected to the same spray pipe 701, and the lower surface of the spray pipe 701 is fixedly connected to a plurality of nozzles 702. The surface of the connecting pipe 712 is fixedly connected to a fixing frame 713. One side of the fixing frame 713 is fixedly connected to the surface of the mounting plate 6. The side wall of the inner chamber 2 is fixedly connected to a water tank 709. A high-pressure pump 710 is installed inside the water tank 709. The output end of the high-pressure pump 710 is fixedly connected to the connecting pipe 712 by means of a connecting pipe 711. The connecting pipe 711 is a plastic hose. One side of the mounting plate 6 The limiting plate 706 is fixedly connected, and a limiting groove 707 is provided on the surface of the limiting plate 706. The cross section of the limiting groove 707 is arc-shaped. The surface of the spray pipe 701 is fixedly connected to the limiting rod 705. The cross section of one end of the limiting rod 705 is "T"-shaped. The arc surface of the limiting rod 705 is movably connected to the inner wall of the limiting groove 707. The bottom end of the connecting pipe 712 is rotatably connected to one side of the spray pipe 701 by means of the connecting pipe 711, and the inner wall of the upper end of the connecting pipe 712 is fixedly connected There is a baffle 715, and the upper surface of the baffle 715 is in contact with a filter cartridge 714. The filter cartridge 714 is an activated carbon cartridge. A plurality of filter holes 716 are provided on the surface of the filter cartridge 714. An angle scale 708 is provided on the surface of the limiting plate 706 at the position corresponding to the limiting groove 707. The size of the angle scale 708 is adapted to the cross-sectional size of the limiting plate 706. The spray pipe 701 is a stainless steel pipe, and the length of the spray pipe 701 is adapted to the cross-sectional size of the rotating frame 4.

[0036] like Figure 7 、 Figure 8 and Figure 9As shown, the auxiliary material mechanism 8 includes a butt joint 811, the bottom end of the butt joint 811 is fixedly connected to the connecting pipe 712, the upper end of the butt joint 811 is fixedly connected to the supporting pipe 803, the upper end of the supporting pipe 803 is fixedly connected to the delivery pipe 802, one side of the water tank 709 is fixedly connected to the auxiliary material cylinder 801, the bottom end of the auxiliary material cylinder 801 is fixedly connected to the delivery pipe 802, and the inner wall of the bottom end of the supporting pipe 803 is provided with inner sliding grooves 805 on both sides, and the surface of the supporting pipe 803 corresponds to the inner sliding grooves. An outer slide groove 804 is provided at the position of the groove 805, and the inner wall of the inner slide groove 805 is slidably connected to the inner magnetic block 807, and the inner wall of the outer slide groove 804 is slidably connected to the outer magnetic block 809. The outer magnetic block 809 is attracted to the inner magnetic block 807. The two side surfaces of the supporting tube 803 are fixedly connected to the electric push rod 808. The output end of the electric push rod 808 is fixedly connected to the surface of the outer magnetic block 809. The end of the two inner magnetic blocks 807 close to each other is fixedly connected to the same opening and closing column 806. Through holes 810 are provided on both sides of the bottom end of the closing column 806, and a closing plate 814 is fixedly connected to the upper end of the butt-jointed pipe 811 at a position corresponding to the bottom end of the opening and closing column 806. The inner wall of the closing plate 814 is plugged into the bottom end surface of the opening and closing column 806, and the cross-sectional size of the inner wall of the closing plate 814 is adapted to the cross-sectional size of the opening and closing column 806. The bottom end of the inner wall of the opening and closing column 806 is fixedly connected to a drainage block 812, and the cross-section of the drainage block 812 is in the shape of a pointed cone, and the bottom end of the opening and closing column 806 is round. A sealing ring 813 is fixedly connected to the arc surface, a sealing groove 815 is opened on the inner wall of the closing plate 814, the inner wall surface of the sealing groove 815 is in contact with the surface of the sealing ring 813, an auxiliary frame 817 is fixedly connected to the bottom end of the inner wall of the connecting tube 712, and the upper end of the auxiliary frame 817 is rotatably connected to a rotating frame 818, the cross-section of the rotating frame 818 is a pointed cone, and a number of connecting plates 816 are evenly fixedly connected to the surface of the rotating frame 818, and the cross-section of the connecting plate 816 is inclined.

[0037] like Figure 10 and Figure 11As shown, the clamping mechanism 9 includes a positioning frame 901 and a placement plate 918. The surface of the positioning frame 901 is fixedly connected to the surface of the rotating frame 4. The inner wall of the upper end of the positioning frame is fixedly connected to the support plate 902. The surface of the placement plate 918 is evenly provided with a plurality of extrusion holes 913. The lower surface of the placement plate 918 is fixedly connected to the position of the extrusion holes 913. The inner wall section of the guide rail 907 is concave. The inner wall of the guide rail 907 is slidably connected to the guide block 916. The cross-sectional size of the guide block 916 is The upper end of the guide block 916 is connected to a connecting column 914, and the arc surface of the connecting column 914 is threadedly connected to an extrusion roller 915. The extrusion roller 915 is a sponge roller. The lower surface of the guide block 916 is fixedly connected to a rack 909. The upper surface of the rack 909 slides through the lower surface of the guide rail 907. A fixed plate 910 is fixedly connected to one side of the guide rail 907. The cross-section of the fixed plate 910 is "L" shaped. The lower surface of the fixed plate 910 is connected to the surface of the support plate 902. The inner wall of the positioning frame 901 is fixedly connected with an inlay plate 903, the surface of the inlay plate 903 is fixedly connected with a drive motor 904, the output end of the drive motor 904 is fixedly connected with an adjusting rod 917, the upper end of the adjusting rod 917 is rotatably connected to the lower surface of the placement plate 918, the arc surface of the bottom end of the adjusting rod 917 is fixedly connected with a support frame 905, the upper surface of the support frame 905 is fixedly connected with a gear ring 906, and the lower surface of the placement plate 918 rotates corresponding to the position of the rack 909 and the gear ring 906. It is dynamically connected with a gear 908, the tooth surface of the gear 908 is meshed with the tooth surface of the rack 909 and the gear ring 906, the upper surface of the placement plate 918 is fixedly connected with a support pad 919 corresponding to the position of the adjustment rod 917, the support pad 919 is a rubber pad, the lower surface of the placement plate 918 is fixedly connected with a cylinder 911, the output end of the cylinder 911 is fixedly connected with an extrusion block 912, the cross-section of the extrusion block 912 on the side close to the gear ring 906 is conical, and the surface of the extrusion block 912 is clamped with the tooth surface of the gear ring 906.

[0038] The overall working principle is that during the processing of the wafer, the surface of the wafer needs to be cleaned. At this time, the wafer needs to be placed in the inner chamber 2 set in the cleaning machine frame 1, and the wafer needs to be placed in the rotating frame 4. The position is fixed with the help of the clamping mechanism 9 set in the rotating frame 4. First, a single wafer is placed on the surface of the placement plate 918, and then the driving motor 904 in the positioning frame 901 is started, and the driving motor 904 drives the adjusting rod 917 to rotate, and the support frame 905 on the surface of the adjusting rod 917 drives the gear ring 906 to rotate, so that the gear ring 906 drives The gear 908 provided on the lower surface of the placement plate 918 rotates, and at the same time drives the rack 909 to slide along the guide rail 907. At this time, the extrusion roller 915 sliding along the extrusion groove on the surface of the placement plate 918 will squeeze and fix the wafer, and then start the cylinder 911 on the lower surface of the placement plate 918, so that the cylinder 911 drives the extrusion block 912 to clamp and fix the tooth surface of the gear ring 906. At this time, the position of the entire placement plate 918 will not be able to shift. At this time, the entire placement plate 918, the positioning frame 901 and the wafer are rotated with the help of the rotating frame 4, and an all-round spraying operation can be performed.

[0039] During the process of spray cleaning the wafer, the entire spray mechanism 7 is moved to the top of the rotating frame 4 and the wafer with the help of the rotating frame 5 and the mounting plate 6, and then the high-pressure pump 710 in the water tank 709 is started, and the high-pressure pump 710 is allowed to transport the cleaning water to the spray pipe 701 through the connecting pipe 711 and the connecting pipe 712, and then the wafer is spray cleaned through the nozzle 702 on the lower surface of the spray pipe 701. During this process, the servo motor 703 on the lower surface of the mounting plate 6 is started, and the servo motor 703 drives the driving rod 704 to rotate. At this time, the arc surface of the driving rod 704 will be driven to rotate the spray pipe 701 fixed by the connecting shaft 717. At the same time, the spray pipe 701 The limiting rod 705 fixed on the surface will slide along the limiting groove 707 opened on the surface of the limiting plate 706. When the limiting rod 705 moves to the two ends of the limiting groove 707, the limiting rod 705 cannot continue to rotate and can only drive the spray pipe 701 to move horizontally. In this way, the spray pipe 701 can be deflected at an angle and the position of the spray pipe 701 can be moved horizontally during use, so that the spray pipe 701 and the nozzle 702 can effectively clean the wafer surface. When the clean water is transported with the help of the connecting pipe 712, it can be filtered and cleaned with the help of the filter cartridge 714 made of activated carbon at the upper end of the connecting pipe 712, which helps to save energy and protect the environment.

[0040] In the process of cleaning the surface of the wafer with the clean water in the water tank 709, in order to further clean it in depth, the auxiliary material mechanism 8 set on one side of the connecting pipe 712 can be used to store the cleaning additive in the auxiliary material cylinder 801. When auxiliary use is needed, it is only necessary to start the electric push rod 808 to drive the outer magnetic block 809 to slide along the outer slide groove 804. At this time, the outer magnetic block 809 in the supporting tube 803 is attracted to the inner magnetic block 807, so that the inner magnetic block 807 drives the opening and closing column 806. The closing plate 814 fixed to the inner wall of the connecting pipe 811 is plugged in and separated, so that the entire connecting pipe 711 is connected to the supporting pipe 803. At this time, the cleaning additive will be transported to the connecting pipe 712. The cleaning additive passes through the through hole 810 opened on the surface of the opening and closing column 806, and is diverted and transported with the help of the drainage block 812, allowing the clean water and the cleaning additive to merge. Then, with the help of the rotating frame 818 rotating in the connecting pipe 712 and the connecting plate 816, they are rotated and mixed, which can further improve the efficiency of the fusion.

[0041] The above description is merely a preferred embodiment of the present invention and does not constitute any other form of limitation to the present invention. Any person skilled in the art may utilize the technical contents disclosed above to change or modify them into equivalent embodiments with equivalent changes for application in other fields. However, any simple modification, equivalent change, and modification of the above embodiments made in accordance with the technical essence of the present invention without departing from the technical solution of the present invention shall still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A single-wafer cleaning machine, comprising a cleaning machine frame (1), an inner chamber (2) and a spray mechanism (7), characterized in that: The inner chamber (2) is arranged inside the cleaning machine frame (1), and a central processing unit (3) is arranged on one side of the surface of the cleaning machine frame (1). An auxiliary component (10) is installed at the bottom end of the inner wall of the inner chamber (2), and the auxiliary component (10) includes a base (101). The bottom end of the base (101) is fixedly connected to the bottom end of the inner wall of the inner chamber (2). A stepper motor (103) is installed inside the base (101), and the output end of the stepper motor (103) is fixedly connected to the rotating frame (4). The side wall of the rotating frame (4) is provided with a seepage hole (102). The cross-sectional size of the base (101) is the same as that of the inner chamber (2). The cross-sectional dimensions of the bottom end are adapted, a rotating frame (5) is installed on one side surface of the base (101), a mounting plate (6) is provided on one side of the rotating frame (5), the spray mechanism (7) is provided at a position on the surface of the mounting plate (6) corresponding to the rotating frame (4), the spray mechanism (7) comprises a driving rod (704), a servo motor (703), a connecting pipe (712) and a connecting pipe (711), both ends of the driving rod (704) are rotatably connected to the lower surface of the mounting plate (6), the servo motor (703) is fixedly connected to the lower surface of the mounting plate (6), and the output end of the servo motor (703) is fixedly connected to one end of the driving rod (704). The arc surface of the driving rod (704) is connected with a connecting shaft (717) at both ends thereof, and the bottom ends of the two connecting shafts (717) are fixedly connected to the same spray pipe (701). The lower surface of the spray pipe (701) is fixedly connected to a plurality of spray heads (702). The surface of the connecting pipe (712) is fixedly connected to a fixing frame (713). One side of the fixing frame (713) is fixedly connected to the surface of the mounting plate (6). The side wall of the inner chamber (2) is fixedly connected to a water tank (709). A high-pressure pump (710) is installed inside the water tank (709). The output end of the high-pressure pump (710) is connected to the water tank (709) by means of the connecting pipe (712). 11) is fixedly connected to the connecting pipe (712), the connecting pipe (711) is a plastic hose, one side of the mounting plate (6) is fixedly connected to the limiting plate (706), the surface of the limiting plate (706) is provided with a limiting groove (707), the cross section of the limiting groove (707) is in the shape of an arc, the surface of the spray pipe (701) is fixedly connected to the limiting rod (705), one end of the limiting rod (705) has a "T"-shaped cross section, the arc surface of the limiting rod (705) is movably connected to the inner wall of the limiting groove (707), and the bottom end of the connecting pipe (712) is rotatably connected to one side of the spray pipe (701) by means of the connecting pipe (711).

2. The single-wafer cleaning machine according to claim 1, characterized in that: A baffle (715) is fixedly connected to the inner wall of the upper end of the connecting tube (712), and a filter cartridge (714) is abutted against the upper surface of the baffle (715). The filter cartridge (714) is an activated carbon cartridge, and a plurality of filter holes (716) are provided on the surface of the filter cartridge (714).

3. The single-wafer cleaning machine according to claim 1, characterized in that: An angle scale (708) is provided on the surface of the limiting plate (706) at a position corresponding to the limiting groove (707), and the size of the angle scale (708) is adapted to the cross-sectional size of the limiting plate (706).

4. The single-wafer cleaning machine according to claim 1, characterized in that: The spray pipe (701) is a stainless steel pipe, and the length of the spray pipe (701) is compatible with the cross-sectional dimensions of the rotating frame (4).

5. The single-wafer cleaning machine according to claim 1, characterized in that: An auxiliary material mechanism (8) is provided on the arc surface of one side of the connecting tube (712), and the auxiliary material mechanism (8) includes a butt joint tube (811), the bottom end of the butt joint tube (811) is fixedly connected to the connecting tube (712), the upper end of the butt joint tube (811) is fixedly connected to a supporting tube (803), the upper end of the supporting tube (803) is fixedly connected to a conveying tube (802), one side of the water tank (709) is fixedly connected to an auxiliary material barrel (801), the bottom end of the auxiliary material barrel (801) is fixedly connected to the conveying tube (802), inner grooves (805) are provided on both sides of the inner wall of the bottom end of the supporting tube (803), an outer groove (804) is provided on the surface of the supporting tube (803) at a position corresponding to the inner groove (805), the inner wall of the inner groove (805) is slidably connected to an inner magnetic block (807), and the outer groove (804) is provided on the inner wall of the inner groove (805). The inner wall of the groove (804) is slidably connected to an outer magnetic block (809), and the outer magnetic block (809) is attracted to the inner magnetic block (807). The two side surfaces of the supporting tube (803) are fixedly connected to electric push rods (808), and the output end of the electric push rod (808) is fixedly connected to the surface of the outer magnetic block (809). The ends of the two inner magnetic blocks (807) close to each other are fixedly connected to the same opening and closing column (806). Through holes (810) are provided on both sides of the bottom end of the opening and closing column (806). The upper end of the docking tube (811) is fixedly connected to a closing plate (814) at a position corresponding to the bottom end of the opening and closing column (806). The inner wall of the closing plate (814) is plugged into the bottom end surface of the opening and closing column (806), and the cross-sectional size of the inner wall of the closing plate (814) is adapted to the cross-sectional size of the opening and closing column (806).

6. The single-wafer cleaning machine according to claim 5, characterized in that: The bottom end of the inner wall of the opening and closing column (806) is fixedly connected to a drainage block (812), and the cross-section of the drainage block (812) is in the shape of a pointed cone.

7. The single-wafer cleaning machine according to claim 5, characterized in that: The arc surface at the bottom end of the opening and closing column (806) is fixedly connected to a sealing ring (813), and the inner wall of the closing plate (814) is provided with a sealing groove (815), and the inner wall surface of the sealing groove (815) is in contact with the surface of the sealing ring (813).

8. The single-wafer cleaning machine according to claim 5, characterized in that: The bottom end of the inner wall of the connecting tube (712) is fixedly connected to an auxiliary frame (817), and the upper end of the auxiliary frame (817) is rotatably connected to a rotating frame (818), the cross section of the rotating frame (818) is in the shape of a pointed cone, and a plurality of connecting plates (816) are evenly fixedly connected to the surface of the rotating frame (818), and the cross section of the connecting plates (816) is in an inclined shape.

9. The single-wafer cleaning machine according to claim 1, characterized in that: The inner wall of the rotating frame (4) is provided with a clamping mechanism (9), and the clamping mechanism (9) comprises a positioning frame (901) and a placement plate (918). The surface of the positioning frame (901) is fixedly connected to the surface of the rotating frame (4). The upper inner wall of the positioning frame is fixedly connected to a support plate (902). The surface of the placement plate (918) is evenly provided with a plurality of extrusion holes (913). The lower surface of the placement plate (918) is fixedly connected to a guide rail (907) at the position corresponding to the extrusion holes (913). The inner wall cross section of the guide rail (907) is concave. The inner wall of the guide rail (907) is slidably connected to a guide block (916), the cross-sectional size of the guide block (916) is adapted to the cross-sectional size of the inner wall of the guide rail (907), the upper end of the guide block (916) is connected to a connecting column (914), the arc surface of the connecting column (914) is threadedly connected to an extrusion roller (915), the extrusion roller (915) is a sponge roller, the lower surface of the guide block (916) is fixedly connected to a rack (909), the upper surface of the rack (909) and the lower surface of the guide rail (907) are slidably penetrated, and the guide rail ( A fixing plate (910) is fixedly connected to one side of the positioning frame (907), the cross section of the fixing plate (910) is "L"-shaped, the lower surface of the fixing plate (910) is fixedly connected to the surface of the support plate (902), the inner wall of the positioning frame (901) is fixedly connected to the inlay plate (903), the surface of the inlay plate (903) is fixedly connected to the driving motor (904), the output end of the driving motor (904) is fixedly connected to the adjusting rod (917), the upper end of the adjusting rod (917) is rotatably connected to the lower surface of the placement plate (918), and the adjusting rod (917) is fixedly connected to the lower surface of the placement plate (918). The arc surface at the bottom end of the section rod (917) is fixedly connected to a support frame (905), the upper surface of the support frame (905) is fixedly connected to a gear ring (906), the lower surface of the placement plate (918) is rotatably connected to a gear (908) corresponding to the position of the rack (909) and the gear ring (906), the tooth surface of the gear (908) is meshed with the tooth surfaces of the rack (909) and the gear ring (906), and the upper surface of the placement plate (918) is fixedly connected to a support pad (919) corresponding to the position of the adjustment rod (917), and the support pad (919) is a rubber pad.

10. The single-wafer cleaning machine according to claim 9, characterized in that: The lower surface of the placement plate (918) is fixedly connected to a cylinder (911), and the output end of the cylinder (911) is fixedly connected to an extrusion block (912). The cross-section of one side of the extrusion block (912) close to the gear ring (906) is in a conical tooth shape, and the surface of the extrusion block (912) is engaged with the tooth surface of the gear ring (906).

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