Semiconductor wafer processing equipment and processing method thereof

Abstract

The invention discloses semiconductor wafer processing equipment and a processing method thereof, and relates to the technical field of semiconductor processing equipment, clamping jaw type wafer processing equipment is provided, a clamping jaw of the clamping jaw type wafer processing equipment is of a vertically-arranged conveying belt structure positioned on a vertically-arranged rod body, a conveying belt is made of a soft material, and the outer ring of the conveying belt is provided with a circle of soft teeth; the number of the clamping jaws is larger than or equal to three, and the clamping jaws slide oppositely to clamp and loosen a wafer. During use, a wafer needing to be cleaned is plugged between the clamping jaws and then is gradually filled between the two teeth along with the rotating edge of the conveying belt so as to be positioned; in the rotating cleaning process, if the wafer needs to rotate around the axis of the wafer, clamping on the wafer can be released on the premise that the wafer is not separated from the soft teeth, and the wafer rotates relative to the clamping jaw by means of inertia after the wafer is rapidly stopped or rapidly decelerated after rotating; the technical effects that the semiconductor wafer processing equipment can clean the wafer without dead corners, the wafer processing efficiency is high, and the applicability to the wafer specification is high are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to a semiconductor wafer processing equipment and a processing method thereof. Background Art

[0002] During the manufacturing process of integrated circuits, wafers are exposed to a large number of particles during multiple processes such as thin film deposition, etching, and polishing. In order to keep the wafer surface clean and eliminate particles left on the wafer surface during the process, the wafer must be cleaned after each process. Among them, the horizontal cleaning technology is to place the wafer on a clamping device and rotate it at a certain speed, while spraying a certain flow of cleaning liquid onto the wafer to clean the wafer surface.

[0003] Chinese invention patent CN113990798B discloses a wafer clamping device and wafer post-processing equipment. This solution features a simple and reliable structure that uses claws positioned on a turntable that can be raised and lowered to position a single wafer. The device clamps the wafer for high-speed rotation after lowering and releases it after raising to interact with the robot arm.

[0004] Although the above solution can realize the clamping and positioning of the wafer more conveniently, it has the following shortcomings:

[0005] One reason is that due to its inherent structural limitations, the wafer needs to be firmly fixed by the clamping claws during positioning and cleaning, and the relative position of the wafer and the clamping claws cannot be changed. This results in a blind spot where the wafer contacts the clamping claws, seriously affecting the overall cleaning effect.

[0006] The second is that it can only process one wafer at a time, which is inefficient and not conducive to large-scale production.

[0007] The third reason is that the device has poor applicability to wafers. A set of equipment can only process wafers of one specification or multiple similar specifications, which indirectly affects production costs.

[0008] Therefore, there is a need for a semiconductor wafer processing equipment that can clean wafers without dead angles, has high wafer processing efficiency and is highly adaptable to wafer specifications. Summary of the Invention

[0009] The embodiments of the present application provide a semiconductor wafer processing device, which solves the technical problems in the prior art that the wafer processing equipment has dead corners in the cleaning process, low processing efficiency and poor applicability to wafers due to the limitations of its own structure. The technical effects of the semiconductor wafer processing equipment being able to clean wafers without dead corners, high wafer processing efficiency and strong applicability to wafer specifications are achieved.

[0010] The embodiment of the present application provides a semiconductor wafer processing device, comprising a base barrel, a rotating carrier ring assembly, and a wafer carrying assembly;

[0011] The basic barrel body is a hard round barrel with an open top, a discharge port at the bottom and a supply unit on the side wall;

[0012] The main body of the rotating carrier ring assembly is a hard ring body driven by a motor, including a carrier ring rotatably connected to the bottom of the base barrel;

[0013] The number of the wafer carrying assemblies is 3 or more, which cooperate with each other to achieve the clamping and loosening of the wafer, and include a carrier and a conveyor belt assembly;

[0014] The carrier is a vertical rod, which is slidably positioned on the carrier ring and slides along the radial direction of the carrier ring as needed to adjust the spacing between the wafer carrier components;

[0015] The conveyor belt assembly is a vertically arranged conveyor belt structure, positioned on the base carrier rod, and a circle of soft teeth is provided on the outer ring of the conveyor belt;

[0016] During the rotational cleaning process, the wafer is clamped without being separated from the soft teeth, and then the machine stops or decelerates rapidly, relying on inertia to rotate the wafer relative to the wafer supporting component to eliminate cleaning blind spots.

[0017] Furthermore, the rotating carrier ring assembly includes a carrying ring, a rotating drive assembly, and a limiting rail; the carrying ring is a hard ring body, which is rotatably connected to the inner bottom of the base barrel body; the rotating drive assembly is positioned on the inner wall of the base barrel body, and is a combination of a motor and a gear; the limiting rail is a hard straight guide rail, the number of which is 3 or more, arranged radially, and the angle between two adjacent limiting rails is less than or equal to 120 degrees. The limiting rail is positioned on the carrying ring or is integrally formed with the carrying ring; the limiting rail serves as a guide for the movement of the wafer carrying assembly, and the length direction is the same as the radial direction of the carrying ring.

[0018] Furthermore, each wafer carrying assembly corresponds to a limiting track;

[0019] The conveyor belt assembly as a whole is a vertical conveyor belt structure, which is positioned on the carrier, and includes a top support pulley, a bottom support pulley and a carrier belt; the top support pulley and the bottom support pulley are both cylindrical wheel bodies, which are indirectly positioned on the carrier body through a rod body or a plate body, and at least one of them rotates under the drive of a motor; the axial direction of the top support pulley and the bottom support pulley is perpendicular to the axial direction of the base barrel body; the carrier belt is a soft annular belt body, which is sleeved on the top support pulley and the bottom support pulley and is always in a straight state; the soft teeth on the outer ring of the carrier belt are load-bearing teeth; the load-bearing teeth are rubber soft teeth, which are arranged in a ring shape on the carrier belt.

[0020] Preferably, a tape adsorbent is also positioned on the base carrier rod; the tape adsorbent is a block-shaped electromagnet, located in the space surrounded by the tape and controlled by the control unit to be powered on and off; the distance between the tape adsorbent and the top support pulley and the bottom support pulley is similar, and the distance difference does not exceed one-fifth of the distance between the top support pulley and the bottom support pulley; the tape is of a hollow structure, and the internal hollow area thereof is annular, and an inner core is filled in this area; the inner core is made of ferromagnetic material.

[0021] Further, one or more photoelectric sensors are provided at a position on the inner wall of the base barrel near the top opening; the photoelectric sensors are infrared photoelectric sensors, which are signal-connected to the control unit and are used to detect and determine whether the wafer placed in the equipment of the present application is in place.

[0022] Preferably, a support carrier is further included; the support carrier is of a frame structure and is positioned on the ground;

[0023] The side wall of the base barrel is rotatably connected to the support carrier, and the axial direction of the rotation axis is perpendicular to its own axial direction, and it rotates under the coordinated control of the control unit and the power component.

[0024] Preferably, an extrusion positioning component is further included;

[0025] The number of the extrusion positioning components is 3 or more, and they are all slidably positioned on the limit track, and each corresponds to a limit track;

[0026] The extrusion positioning component includes a support rod, a top rod, a positioning ball and a bottom rod;

[0027] The support rod is integrally in an inverted U shape, and the bottom is slidably positioned on the limit track and is closer to the inner wall of the base barrel than the positioning ball;

[0028] The top rod, the positioning ball and the bottom rod are combined and spliced into a vertically arranged rod body, and both ends of the rod body are respectively positioned at positions near the ends of the support rod;

[0029] At least one of the top rod and the bottom rod is a telescopic rod with a built-in compression spring;

[0030] Among all the extrusion positioning components, at least one positioning ball rotates under the coordinated control of the control unit and the power component;

[0031] The positioning ball includes a top plate, a bottom plate, a rubber ring and a built-in adsorbent; the top plate and the bottom plate are both horizontally arranged; the rubber ring is a vertically arranged tubular rubber material ring body, the longitudinal section of which is in the shape of "()", and the top and bottom edges are respectively fixed to the edges of the top plate and the bottom plate; the built-in adsorbent is positioned on the top plate or the bottom plate, and when powered on, the magnetic force is used to drive the top plate and the bottom plate to approach each other.

[0032] Preferably, the top rod is a telescopic rod with a built-in compression spring, and the bottom rod is a telescopic rod controlled by a control unit;

[0033] After the wafer is clamped and positioned using multiple positioning balls, multiple bottom rods are controlled to extend and retract to varying degrees without damaging the wafer, thereby enabling the wafer to be cleaned in a tilted state.

[0034] Preferably, it further includes an expansion unit;

[0035] The expansion unit includes a connector and a carrier body;

[0036] The carrier body is a hard plate that plays a bearing role. A rotating carrier ring assembly is positioned on the carrier body, and three or more wafer bearing assemblies are positioned on the rotating carrier ring assembly.

[0037] The connector is a rod or a plate, which is fixed on the carrier body and positioned on the robot arm or the workshop transport trolley to play a connecting role;

[0038] When wafers need to be transferred, the expansion unit is used to carry multiple wafers and move them to the top opening of the basic barrel, and the carried wafers are placed one by one into the basic barrel; after the wafers are cleaned, the basic barrel is controlled to rotate and its opening is facing downward, and then other expansion units are used to support the cleaned wafers from the bottom of the basic barrel.

[0039] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0040] By providing a claw-type wafer processing equipment, its claws are a vertically arranged conveyor belt structure positioned on a vertical rod body, the conveyor belt is made of soft material and has a circle of soft teeth on the outer ring; the number of claws is greater than or equal to three, and they slide towards each other to achieve clamping and loosening of the wafer; when in use, the wafer to be cleaned is stuffed between the claws and then gradually filled between the two teeth as the edge of the conveyor belt rotates and is thus positioned; during the rotational cleaning process, if the wafer is to be rotated around its own axis, the clamping of the wafer can be relaxed without the wafer leaving the soft teeth, and after rotation, it can be quickly stopped or quickly decelerated and then the wafer can be rotated relative to the claws by relying on inertia; this effectively solves the technical problems in the prior art that the wafer processing equipment has dead corners in the cleaning process due to its own structure, low processing efficiency and poor applicability to wafers, thereby achieving the technical effect that the semiconductor wafer processing equipment can clean wafers without dead corners, has high wafer processing efficiency and is highly applicable to wafer specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 This is a schematic diagram of the internal structure of the semiconductor wafer processing equipment of this application;

[0042] Figure 2This is a schematic diagram of the appearance and structure of the semiconductor wafer processing equipment of this application;

[0043] Figure 3 It is a structural diagram of the rotating carrier ring assembly, the wafer supporting assembly and the wafer rotating assembly;

[0044] Figure 4 This is a schematic diagram of the appearance structure of the basic barrel;

[0045] Figure 5 This is a schematic diagram of the bottom structure of the basic barrel;

[0046] Figure 6 Schematic diagram of the structure of the carrier tape;

[0047] Figure 7 Schematic diagram of the positional relationship between the basic barrel and the supporting frame;

[0048] Figure 8 This is a schematic diagram of the positional relationship between the base barrel and the supporting frame after it is flipped over;

[0049] Figure 9 This is a schematic diagram of the positional relationship between the expansion unit and the basic barrel;

[0050] Figure 10 This is a structural diagram of the expansion unit.

[0051] In the picture:

[0052] Basic barrel body 100, electric slip ring 110, discharge port 120, blocking ring 130, photoelectric sensor 150, basic carrier ring 160, supply unit 170, carrier ring 210, limiting rail 230, sliding carrier block 240, basic carrier rod 310, top support pulley 320, bottom support pulley 330, carrier belt 340, inner core 341, load-bearing teeth 342, carrier belt adsorbent 410, support rod 420, top rod 430, positioning ball 440, top plate 441, bottom plate 442, rubber ring 443, built-in adsorbent 444, bottom rod 450, support carrier 500, connector 610, carrier plate body 620. DETAILED DESCRIPTION

[0053] To facilitate understanding of the present invention, the present application will be described more comprehensively below with reference to the relevant drawings; the drawings show preferred embodiments of the present invention, but the present invention can be implemented in many different forms and is not limited to the embodiments described herein; on the contrary, the purpose of providing these embodiments is to enable a more thorough and comprehensive understanding of the disclosed content of the present invention.

[0054] It should be noted that the terms “vertical”, “horizontal”, “up”, “down”, “left”, “right” and similar expressions used in this document are for illustrative purposes only and do not represent the only implementation method.

[0055] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains; the terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention; the term "and / or" used herein includes any and all combinations of one or more of the associated listed items.

[0056] Example 1

[0057] like Figures 1 to 4 As shown, the semiconductor wafer processing equipment of the present application includes a basic barrel 100, a rotating carrier ring assembly, a wafer supporting assembly, a power assembly and a control unit.

[0058] The basic barrel body 100 is a hard round barrel with an open top, which plays a role of bearing and supporting; an electric slip ring 110 for transmitting electric energy is positioned at the center of the bottom of the basic barrel body 100, and a drain port 120 for draining liquid is provided at the bottom; a basic carrier ring 160 is positioned at the inner bottom of the basic barrel body 100, and the basic carrier ring 160 is a hard ring body, the bottom of which is fixed on the inner bottom of the basic barrel body 100 and is coaxial with the basic barrel body 100, matching the rotating carrier ring assembly, and plays the role of bearing and supporting the rotating carrier ring assembly; the basic barrel body 100 is also provided with a supply unit 170 for spraying cleaning liquid and / or gas into the basic barrel body 100; the supply unit 170 includes a nozzle and a delivery pipe, the nozzle is positioned on the inner wall of the basic barrel body 100, and sprays toward the wafer in the basic barrel body 100 under the control of the control unit, and the delivery pipe is connected to the nozzle; the supply unit 170 is a prior art and will not be described here.

[0059] The main body of the rotating carrier ring assembly is a hard ring body driven by a motor, including a carrying ring 210, a rotating drive assembly, and a limiting rail 230; the carrying ring 210 is a hard ring body, which is rotatably connected to the basic carrier ring 160 and is coaxial with the basic carrier ring 160; the rotating drive assembly is used to drive the carrying ring 210 to rotate relative to the basic carrier ring 160, and is positioned on the inner wall of the basic barrel body 100, which is a combination of a motor and a gear; the limiting rail 230 is a hard straight guide rail, the number of which is 3 or more, arranged radially, and the angle between two adjacent limiting rails 230 is less than or equal to 120 degrees. The limiting rail 230 is positioned on the carrying ring 210 or is integrally formed with the carrying ring 210; the limiting rail 230 serves as a guide for the movement of the wafer carrying assembly, and the length direction is the same as the radial direction of the carrying ring 210.

[0060] The number of the wafer carrying assemblies is 3 or more, all of which are slidably positioned on the limiting rails 230, and each wafer carrying assembly corresponds to a limiting rail 230; all wafer carrying assemblies cooperate with each other to achieve the clamping and positioning of the wafer;

[0061] The wafer carrying assembly includes a carrying body and a conveyor belt assembly;

[0062] The carrier includes a sliding carrier block 240 and a base carrier rod 310; the sliding carrier block 240 is slidably positioned on the limiting rail 230, slides along the length direction of the limiting rail 230 and can be fixed on the limiting rail 230 as needed; the base carrier rod 310 is a hard rod body, arranged longitudinally, and its bottom is fixed to the top of the sliding carrier block 240;

[0063] The conveyor belt assembly is a vertical conveyor belt structure as a whole, which is positioned on the base carrier rod 310, and includes a top support pulley 320, a bottom support pulley 330 and a carrier belt 340; the top support pulley 320 and the bottom support pulley 330 are both cylindrical wheel bodies, which are indirectly positioned on the base carrier rod 310 through a rod body or a plate body, and at least one of the two rotates under the drive of a motor, and the motor that drives the wheel body is electrically connected to the electric slip ring 110; the axial directions of the top support pulley 320 and the bottom support pulley 330 are perpendicular to the axial direction of the base barrel body 100 , both are closer to the axis of the basic barrel body 100 than the basic carrier rod 310; the carrier belt 340 is a soft annular belt, preferably made of rubber, which is sleeved on the top support pulley 320 and the bottom support pulley 330 and is always in a straight state; a circle of load-bearing teeth 342 is positioned on the outer ring of the carrier belt 340 (that is, the surface away from the top support pulley 320 and the bottom support pulley 330); the load-bearing teeth 342 are soft rubber teeth, arranged in a ring on the carrier belt 340, and the spacing between the teeth is uniform and less than 8 mm;

[0064] Under the control of the control unit, multiple wafer carrying components move closer to and farther from each other to achieve the clamping and loosening of the wafer (they have the function of clamping claws when used in combination).

[0065] Furthermore, the limiting track 230 is provided with a scale; the sliding carrier 240 is slidably positioned on the limiting track 230, can be slid manually, and the sliding carrier 240 is fixed as needed through a pin structure, a buckle, a pawl mechanism or a clip.

[0066] Furthermore, the sliding carrier block 240 is slidably positioned on the limiting track 230 and slides as required under the control of the control unit and driven by the electric telescopic rod, air cylinder or oil cylinder.

[0067] The power assembly is used to provide power for the operation of various components of the semiconductor wafer processing equipment of this application, and the control unit plays a role in controlling the coordinated operation of various components of the semiconductor wafer processing equipment. Both are existing technologies and will not be described in detail here.

[0068] When the semiconductor wafer processing equipment of the embodiment of the present application is used:

[0069] 1. First, the wafer carrier assembly is controlled to move according to the specifications of the wafer to be cleaned so that the wafer can be placed between the multiple wafer carrier assemblies and will not fall due to the support of the carrier teeth 342;

[0070] 2. Then, use the gripper or suction cup to move the wafer to be cleaned to the top of the base barrel 100 while keeping it horizontal, and ensure that the wafer and the base barrel 100 are coaxial;

[0071] 3. The wafer is then moved downward and the carrier belt 340 is rotated in coordination with the wafer carrier 340 so that the edge of the wafer gradually fills the gap between the two teeth and is then supported by the carrier teeth 342 (this process occurs near the top of the wafer carrier assembly).

[0072] 4. After this, the multiple carrier belts 340 are controlled to rotate synchronously to move the wafers between the wafer support assemblies downward; at the same time, other wafers that need to be cleaned are placed between the wafer support assemblies, while ensuring that the spacing between the wafers on the wafer support assemblies is greater than 3 cm;

[0073] 5. After placing multiple wafers and ensuring that they are below the top support pulley 320 and above the bottom support pulley 330, control the wafer supporting assemblies to move toward each other and clamp the wafers between the wafer supporting assemblies;

[0074] 6. Thereafter, the rotating carrier ring assembly is controlled to operate, driving the wafer on the semiconductor wafer processing apparatus of the present application to rotate while controlling the supply unit 170 to operate to clean and / or dry the wafer; during this period, the wafer supporting assemblies are controlled to move away from each other, and the rotating carrier ring assembly is controlled to stop or decelerate rapidly without the wafer being separated from the supporting teeth 342 (without being separated from the supporting teeth 342), relying on inertia to cause the wafer to rotate relative to the rotating carrier ring assembly, thereby eliminating the wafer cleaning dead angle, and then re-clamping the wafer; during the cleaning period, the wafer clamping and loosening actions are performed once or multiple times;

[0075] 7. After cleaning is completed, control the carrier 340 to rotate and cooperate with the clamps or suction cups (the clamps and suction cups here need to be clean, instead of continuing to use the clamps and suction cups to place the wafer into the equipment of this application to prevent the wafer from being contaminated again) to remove the cleaned wafer from the top of the wafer carrying assembly.

[0076] Preferably, Figure 1 and Figure 3As shown, in order to further accurately control the on-demand rotation of the wafer, a carrier adsorbent 410 is also positioned on the basic carrier rod 310; the carrier adsorbent 410 is a block-shaped electromagnet, located in the space surrounded by the carrier 340 and controlled by the control unit to be powered on and off; the distance between the carrier adsorbent 410 and the top support pulley 320 and the bottom support pulley 330 is close, and the distance difference does not exceed one-fifth of the distance between the top support pulley 320 and the bottom support pulley 330; the carrier 340 is a hollow structure, and its internal hollow area is annular, and the area is filled with an inner core 341; the inner core 341 is made of ferromagnetic material; the inner core 341 is preferably an iron bar; the inner core 341 is preferably magnetic powder and / or iron powder; in the process of cleaning the wafer, the above step 6 is changed to: thereafter, the rotating carrier ring assembly is controlled to operate, driving the wafer on the semiconductor wafer processing equipment of the present application to rotate while controlling the supply unit 170 to operate to clean and / or dry the wafer; during the control The wafers to be cleaned at dead corners are moved between the carrier adsorbents 410, and then the carrier adsorbents 410 are controlled to operate so that the carrier 340 is bent and deformed under the influence of magnetic force, thereby releasing the clamping of the wafers between the carrier adsorbents 410. Thereafter, the rotating carrier ring assembly is controlled to stop quickly or decelerate rapidly without the wafers separating from the carrier teeth 342, and the wafers between the carrier adsorbents 410 are caused to rotate differentially relative to the rotating carrier ring assembly by relying on inertia, thereby eliminating the wafer cleaning dead corners; thereafter, the carrier adsorbents 410 are controlled to be powered off and other wafers are controlled to move between the carrier adsorbents 410 in turn, and the action of "controlling the carrier adsorbents 410 to operate so that the carrier 340 is bent and deformed, thereby releasing the clamping of the wafers between the carrier adsorbents 410, and then controlling the rotating carrier ring assembly to stop quickly or decelerate rapidly without the wafers separating from the carrier teeth 34, and the wafers between the carrier adsorbents 410 are caused to rotate differentially relative to the rotating carrier ring assembly by relying on inertia." is repeated.

[0077] Furthermore, the carrier adsorbent 410 is indirectly positioned on the base carrier rod 310 through a plate or a rod.

[0078] Preferably, in order to improve the rotation accuracy of the carrier belt 340, the inner ring of the carrier belt 340 is provided with protrusions or pits, and the side walls of the top support pulley 320 and the bottom support pulley 330 are also provided with matching pits or protrusions.

[0079] Preferably, the inner ring of the carrier belt 340 is also provided with teeth, and the top support pulley 320 and the bottom support pulley 330 are gears.

[0080] Preferably, all the top support pulleys 320 and bottom support pulleys 330 are driven by the same power source.

[0081] Preferably, Figure 6 As shown, in order to reduce the back-splash of the cleaning liquid, the carrying teeth 342 are conical and the carrying belt 340 is strip-shaped.

[0082] Furthermore, the discharge outlet 120 is provided with a closing valve controlled by a control unit. When the device of the present application needs to be cleaned after being used for a certain period of time, the discharge outlet 120 can be closed first, and then water can be poured into the basic barrel body 100 by using the supply unit 170. Finally, the liquid in the basic barrel body 100 is stirred by the rotation of the rotating carrier ring assembly, the forward and reverse rotation of the carrier belt 340 and / or the operation of the carrier belt adsorbent 410 to achieve self-cleaning of the device of the present application.

[0083] Furthermore, for environmental considerations around the device of this application, liquid splashing is reduced, such as Figure 5 As shown, a shielding ring 130 is also positioned on the basic barrel body 100; the shielding ring 130 is a tubular ring body, which is sleeved on the basic barrel body 100 and coaxial with the basic barrel body 100, and can be detachably fixed on the basic barrel body 100; the presence of the shielding ring 130 increases the barrel depth and reduces liquid splashing.

[0084] Furthermore, the shielding ring 130 has multiple fixing points on the basic barrel body 100, and the height of the shielding ring 130 can be adjusted as needed during use.

[0085] Preferably, a ring lifting assembly is also positioned on the basic barrel body 100; the ring lifting assembly is a telescopic rod that is controlled by a control unit to extend and retract, and the top is positioned on the shielding ring 130; the shielding ring 130 is slidably positioned on the basic barrel body 100; when in use, the height of the shielding ring 130 can be adjusted as needed to take into account the convenience of wafer placement and the effect of shielding splashing liquid.

[0086] Preferably, Figure 1 As shown, one or more photoelectric sensors 150 are provided on the inner wall of the basic barrel body 100 near the top opening; the photoelectric sensor 150 is an infrared photoelectric sensor, which is connected to the control unit signal and is used to detect whether the wafer placed in the device of this application is in place.

[0087] Preferably, Figure 7 and Figure 8 As shown, the equipment of the present application also includes a support carrier 500; the support carrier 500 is a frame structure, positioned on the ground; the side wall of the basic barrel body 100 is rotatably connected to the support carrier 500, and the axial direction of the rotating shaft is perpendicular to its own axial direction, and rotates under the coordinated control of the control unit and the power component; after the wafers in the equipment of the present application are cleaned, the basic barrel body 100 can be controlled to flip 180 degrees, so that the wafers can enter from the top and exit from the bottom (enter from the top of the equipment of the present application and exit from the bottom of the equipment of the present application); and then the output wafers can be transported away using equipment such as conveyor belts.

[0088] The technical solutions in the above embodiments of the present application have at least the following technical effects or advantages:

[0089] It solves the technical problems in the prior art that the wafer processing equipment has cleaning dead corners due to its limited structure, low processing efficiency and poor applicability to wafers, and realizes the technical effects that the semiconductor wafer processing equipment can clean the wafer without dead corners, has high wafer processing efficiency and strong applicability to wafer specifications.

[0090] Embodiment 2

[0091] Considering that the method of relying on the inertia of the wafer to make it rotate by itself to eliminate the cleaning dead corners has certain uncertainties, which to a certain extent affects the stability of the wafer cleaning effect; in view of the above problems, the embodiment of the present application adds an extrusion positioning component on the basis of the above embodiment, and realizes the on-demand rotation of the wafer by squeezing and fixing the wafer and then using the rotation to drive the wafer to rotate, and avoids the frequent sudden stop and rapid deceleration of the rotating carrier ring component. Specifically:

[0092] As Figure 1 and Figure 4 shown, the number of the limiting tracks 230 of the rotating carrier ring component is 6 or more, and they are arranged radially, and the included angle between adjacent two limiting tracks 230 is less than or equal to 60 degrees; the limiting track 230 also serves as a guide for the movement of the extrusion positioning component.

[0093] The number of the extrusion positioning components is 3 or more, and they are all slidably positioned on the limiting track 230. Each extrusion positioning component corresponds to one limiting track 230 and does not share the limiting track 230 with the wafer carrying component; the included angle between adjacent limiting tracks 230 carrying the extrusion positioning components is less than or equal to 120 degrees;

[0094] The extrusion positioning component is integrally in a square shape or a D shape, and includes a support rod 420, a top rod 430, a positioning ball 440 and a bottom rod 450;

[0095] The support rod 420 is a vertical rigid rod body, integrally in a "匚" shape, and its bottom is slidably positioned on the limiting track 230, playing a role in carrying and supporting other components of the extrusion positioning component; the support rod 420 is closer to the inner wall of the base barrel 100 than the positioning ball 440;

[0096] The top rod 430, the positioning ball 440 and the bottom rod 450 are combined to form a vertical rod body, and the three are coaxial, with the top rod 430 on the top and the bottom rod 450 on the bottom; the top of the top rod 430 is fixed at a position near the top end of the support rod 420, and the bottom of the bottom rod 450 is fixed at a position near the bottom end of the support rod 420; at least one of the top rod 430 and the bottom rod 450 is a telescopic rod with an internal compression spring, and it expands and contracts when受压 or受拉.

[0097] In all the extrusion positioning assemblies, at least one positioning ball 440 rotates around its own axis under the coordinated control of the control unit and the power assembly;

[0098] The positioning ball 440 is approximately spherical in shape, and includes a top plate 441, a bottom plate 442, a rubber ring 443 and a built-in adsorbent 444; the top plate 441 and the bottom plate 442 are both hard plates, both arranged horizontally, the former fixed to the bottom of the top rod 430, and the latter fixed to the top of the bottom rod 450; the rubber ring 443 is a vertically arranged tubular rubber material ring, the top and bottom edges of which are respectively fixed to the edge of the top plate 441 and the edge of the bottom plate 442; the longitudinal section of the rubber ring 443 is "()" shape; a compression spring is positioned between the top plate 441 and the bottom plate 442, and the two ends of the compression spring respectively press against the top plate 441 and the bottom plate 442; the built-in adsorbent 444 is an electromagnet, positioned at the bottom of the top plate 441 or the top of the bottom plate 442, and is controlled by the control unit for operation; an iron sheet that matches the built-in adsorbent 444 is positioned at the top of the bottom plate 442 or the bottom of the top plate 441; when the built-in adsorbent 444 is energized, the top plate 441 and the bottom plate 442 approach each other and squeeze the rubber ring 443.

[0099] A carrier adsorbent 410 is positioned on the base carrier rod 310 , and the carrier adsorbent 410 is at the same height as the positioning ball 440 ; the carrier 340 has an internal core 341 .

[0100] Furthermore, the limiting track 230 is provided with a scale; the support rod 420 is slidably positioned on the limiting track 230, can be slid manually, and the support rod 420 can be fixed as needed through a pin structure, a buckle, a pawl mechanism or a clip.

[0101] Furthermore, the support rod 420 is slidably positioned on the limiting track 230 and slides as needed under the control of the control unit and driven by the electric telescopic rod, air cylinder or oil cylinder.

[0102] When the semiconductor wafer processing equipment of the embodiment of the present application is cleaning the wafer, it is also necessary to adjust the spacing between the extrusion positioning components according to the specifications of the wafer to be cleaned; and the above step 6 is changed to: thereafter, the rotating carrier ring component is controlled to operate, driving the wafers on the semiconductor wafer processing equipment of the present application to rotate while controlling the supply unit 170 to operate to clean and / or dry the wafers; during this period, the wafers to be cleaned without dead corners are controlled to move between the carrier adsorbents 410, and then the carrier adsorbents 410 are controlled to operate, so that the carrier 340 is bent and deformed under the influence of the magnetic force, thereby releasing the clamping of the wafers between the carrier adsorbents 410; thereafter, the built-in adsorbents 444 are controlled to operate. Power is turned on, and the wafers are clamped and positioned using multiple positioning balls 440, and the wafers are controlled to rotate as needed by controlling the rotation of the positioning balls 440, thereby eliminating blind spots in wafer cleaning; thereafter, the carrier adsorbent 410 is controlled to be powered off, the positioning balls 440 are controlled to be reset, and other wafers are controlled to move between the carrier adsorbents 410 in sequence, and the action of "controlling the carrier adsorbent 410 to operate so that the carrier 340 bends and deforms, thereby releasing the clamping of the wafers between the carrier adsorbents 410, and thereafter controlling the built-in adsorbent 444 to be powered on, and the wafers are clamped and positioned using multiple positioning balls 440, and the wafers are controlled to rotate as needed by controlling the rotation of the positioning balls 440" is repeated.

[0103] In order to further improve the cleaning effect of the wafer, preferably, the top rod 430 is a telescopic rod with a built-in compression spring, and the bottom rod 450 is a telescopic rod controlled by a control unit; after the wafer is clamped and positioned using multiple positioning balls 440, the multiple bottom rods 450 are controlled to extend and retract to different degrees without damaging the wafer, thereby prompting the wafer to be cleaned in a tilted state.

[0104] Example 3

[0105] In order to further improve the practicality and efficiency of the present application and reduce the number of wafer transfers, the present embodiment adds an expansion unit on the basis of the above embodiment, specifically:

[0106] like Figure 9 and Figure 10 As shown, the device of the present application further includes a support carrier 500; the support carrier 500 is a frame structure and is positioned on the ground; the side wall of the base barrel body 100 is rotatably connected to the support carrier 500, and the axial direction of the rotation shaft is perpendicular to the axial direction of the base barrel body 100, and the rotation is performed under the coordinated control of the control unit and the power assembly;

[0107] The expansion unit includes a connector 610 and a carrier body 620;

[0108] The carrier body 620 is a hard plate that serves as a load-bearing member. A rotating carrier ring assembly is positioned on the carrier body 620, and three or more wafer supporting assemblies are positioned on the rotating carrier ring assembly.

[0109] The connector 610 is a rod or a plate, which is fixed on the carrier body 620 and positioned on the robot arm or the workshop transport trolley to play a connecting role.

[0110] When wafers need to be transferred, the expansion unit can be used to carry multiple wafers and move them to the top opening of the basic barrel body 100, and the carried wafers can be placed one by one into the basic barrel body 100; after the wafers are cleaned, the basic barrel body 100 is controlled to rotate and its opening is facing downward, and then other expansion units (expansion units in a cleaning state) are used to support the cleaned multiple wafers from the bottom of the basic barrel body 100.

[0111] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Various modifications and variations are readily apparent to those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A semiconductor wafer processing device, characterized in that: It comprises a basic barrel (100), a rotating carrier ring assembly, and a wafer bearing assembly; The basic barrel body (100) is a hard round barrel with an open top, a discharge port (120) provided at the bottom, and a supply unit (170) provided on the side wall; The main body of the rotating carrier ring assembly is a hard ring body driven by a motor, and includes a carrier ring (210) rotatably connected to the inner bottom of the base barrel (100); The number of the wafer carrying assemblies is 3 or more, which cooperate with each other to achieve the clamping and loosening of the wafer, and include a carrier and a conveyor belt assembly; The carrier is a vertical rod, which is slidably positioned on the carrier ring (210) and slides along the radial direction of the carrier ring (210) as needed to adjust the spacing between the wafer carrier components; The conveyor belt assembly is a vertically arranged conveyor belt structure, positioned on a base carrier rod (310), and a circle of soft teeth is provided on the outer ring of the conveyor belt; During the rotational cleaning process, the wafer is clamped without being separated from the soft teeth, and then the machine stops or decelerates rapidly, relying on inertia to rotate the wafer relative to the wafer supporting component to eliminate cleaning blind spots.

2. The semiconductor wafer processing equipment according to claim 1, wherein: The rotating carrier ring assembly comprises a carrier ring (210), a rotating drive assembly, and a limiting rail (230); the carrier ring (210) is a hard ring body, which is rotatably connected to the inner bottom of the base barrel body (100); the rotating drive assembly is positioned on the inner wall of the base barrel body (100), and is a combination of a motor and a gear; the limiting rail (230) is a hard straight guide rail, the number of which is 3 or more, which is arranged in a radial shape, and the angle between two adjacent limiting rails (230) is less than or equal to 120 degrees. The limiting rail (230) is positioned on the carrier ring (210) or is integrally formed with the carrier ring (210); the limiting rail (230) serves as a guide for the movement of the wafer carrier assembly, and its length direction is the same as the radial direction of the carrier ring (210).

3. The semiconductor wafer processing equipment according to claim 1 or 2, wherein: Each wafer carrying assembly corresponds to a limiting track (230); The conveyor belt assembly as a whole is a vertical conveyor belt structure, which is positioned on the carrier, and includes a top support pulley (320), a bottom support pulley (330) and a carrier belt (340); the top support pulley (320) and the bottom support pulley (330) are both cylindrical wheel bodies, which are indirectly positioned on the carrier through a rod body or a plate body, and at least one of them rotates under the drive of a motor; the axial direction of the top support pulley (320) and the bottom support pulley (330) is perpendicular to the axial direction of the base barrel body (100); the carrier belt (340) is a soft annular belt body, which is sleeved on the top support pulley (320) and the bottom support pulley (330) and is always in a straight state; the soft teeth on the outer ring of the carrier belt (340) are load-bearing teeth (342); the load-bearing teeth (342) are rubber soft teeth, which are arranged in a ring shape on the carrier belt (340).

4. The semiconductor wafer processing equipment according to claim 3, wherein: A carrier tape adsorbent (410) is also positioned on the base carrier rod (310); the carrier tape adsorbent (410) is a block-shaped electromagnet, located in the space surrounded by the carrier tape (340) and controlled by the control unit to be powered on and off; the distance between the carrier tape adsorbent (410) and the top support pulley (320) and the bottom support pulley (330) is similar, and the distance difference does not exceed one-fifth of the distance between the top support pulley (320) and the bottom support pulley (330); the carrier tape (340) is of a hollow structure, and the inner hollow area thereof is annular, and an inner core (341) is filled in this area; the inner core (341) is made of ferromagnetic material.

5. The semiconductor wafer processing equipment according to claim 1, wherein: One or more photoelectric sensors (150) are provided at a position near the top opening on the inner wall of the base barrel (100); the photoelectric sensor (150) is an infrared photoelectric sensor, signal-connected to the control unit, and is used to detect and determine whether the wafer placed in the device of the present application is in place.

6. The semiconductor wafer processing equipment according to claim 1, wherein: It further includes a support carrier (500); the support carrier (500) is of a frame structure and is positioned on the ground; The side wall of the base barrel (100) is rotatably connected to the support carrier (500), the axial direction of the rotating shaft is perpendicular to its own axial direction, and it rotates under the coordinated control of the control unit and the power component.

7. The semiconductor wafer processing equipment according to claim 3, wherein: It further includes an extrusion positioning component; The number of the extrusion positioning components is 3 or more, and they are all slidably positioned on the limit track (230), and each corresponds to a limit track (230); The extrusion positioning component includes a support rod (420), a top rod (430), a positioning ball (440) and a bottom rod (450); The support rod (420) is generally in a "C" shape, and the bottom is slidably positioned on the limit track (230), and is closer to the inner wall of the base barrel (100) relative to the positioning ball (440); The top rod (430), the positioning ball (440) and the bottom rod (450) are combined and spliced together to form a vertically arranged rod body, and both ends of the rod body are positioned at positions near the ends of the support rod (420); At least one of the top rod (430) and the bottom rod (450) is a telescopic rod with an internal compression spring; Among all the extrusion positioning components, at least one positioning ball (440) rotates under the coordinated control of the control unit and the power component; The positioning ball (440) includes a top plate (441), a bottom plate (442), a rubber ring (443) and an internal adsorbent (444); the top plate (441) and the bottom plate (442) are both horizontally arranged; the rubber ring (443) is a vertically arranged tubular rubber material ring body, the longitudinal section is in a "()" shape, and the top and bottom edges are respectively fixed to the edges of the top plate (441) and the bottom plate (442); the internal adsorbent (444) is positioned on the top plate (441) or the bottom plate (442), and when powered on, the magnetic force is used to drive the top plate (441) and the bottom plate (442) to approach each other.

8. The semiconductor wafer processing equipment according to claim 7, wherein: The top rod (430) is a telescopic rod with an internal compression spring, and the bottom rod (450) is a telescopic rod controlled by the control unit; After the wafer is clamped and positioned using a plurality of positioning balls (440), the plurality of bottom rods (450) are controlled to extend and retract to different degrees without damaging the wafer, thereby enabling the wafer to be cleaned in an inclined state.

9. The semiconductor wafer processing equipment according to claim 6, wherein: Also includes expansion units; The expansion unit comprises a connecting body (610) and a carrier body (620); The carrier body (620) is a hard plate that plays a bearing role, and a rotating carrier ring component is positioned on it, and three or more wafer bearing components are positioned on the rotating carrier ring component; The connecting body (610) is a rod or a plate, fixed on the carrier body (620) and positioned on the mechanical arm or the workshop transport trolley, playing a connecting role; When wafers need to be transferred, the expansion unit is used to carry multiple wafers and move them to the top opening of the basic barrel (100), and the carried wafers are placed one by one into the basic barrel (100); After the wafers are cleaned, the basic barrel (100) is controlled to rotate and its opening is directed downward, and then other expansion units are used to support the cleaned wafers from the bottom of the basic barrel (100).

10. A wafer processing method, characterized in that: The semiconductor wafer processing equipment according to claim 3 is equipped with the following steps: Step 1: First, adjust the spacing between the wafer supporting components according to the specifications of the wafers to be cleaned, so that the wafers can be filled between the multiple wafer supporting components and will not fall due to the support of the supporting teeth (342); Step 2: Then, using a clamp or a suction cup, the wafer to be cleaned is moved to the top of the base barrel (100) while maintaining a horizontal state, and the wafer is ensured to be coaxial with the base barrel (100); Step 3: Afterwards, the wafer is controlled to move downward and the carrier belt (340) is controlled to rotate in coordination, so that the edge of the wafer gradually fills between the two teeth and is then supported by the carrier teeth (342); Step 4: After that, the plurality of carriers (340) are controlled to rotate synchronously to drive the wafers located between the wafer supporting assemblies to move downward; at the same time, other wafers that need to be cleaned are placed between the wafer supporting assemblies while ensuring that the spacing between the wafers on the wafer supporting assemblies is greater than 3 cm; Step 5: After placing multiple wafers and ensuring that the wafers are lower than the top support pulley (320) and higher than the bottom support pulley (330), the wafer supporting components are controlled to move toward each other to clamp the wafers between the wafer supporting components; Step 6: After that, the rotating carrier ring assembly is controlled to operate, driving the wafer on the semiconductor wafer processing device of the present application to rotate while controlling the supply unit (170) to operate to clean and / or dry the wafer; during this period, the wafer supporting assemblies are controlled to move away from each other, and the rotating carrier ring assembly is controlled to stop or decelerate quickly without the wafer being separated from the supporting teeth (342), relying on inertia to make the wafer rotate relative to the rotating carrier ring assembly, thereby eliminating the wafer cleaning dead angle, and then re-clamping the wafer; during the cleaning period, the wafer clamping and loosening action is performed once or multiple times; Step 7: After cleaning is completed, the carrier belt (340) is controlled to rotate and the cleaned wafer is taken out from the top of the wafer supporting assembly by using the clamping claws or suction cups.

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