Sound driving circuit, sound device including the same, and vehicle device including the sound device

Abstract

The invention provides a sound driving circuit, a sound device including the sound driving circuit, and a vehicle device including the sound device. The sound driving circuit includes: an audio processor that generates an input audio signal based on a sound source; a signal conversion circuit that converts an input audio signal into a piezoelectric audio signal; and an amplifier circuit that amplifies the piezoelectric audio signal so as to generate a piezoelectric driving signal for driving the piezoelectric vibration device.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of and priority to Korean Patent Application No. 10-2024-0019611, filed on February 8, 2024, which is hereby incorporated by reference in its entirety for all purposes as if fully set forth herein. Technical Field

[0003] The present disclosure relates to a sound driving circuit, a sound device including the sound driving circuit, and a vehicular device including the sound device. Background Art

[0004] Speakers used in devices can be, for example, actuators, which include magnets and coils. However, when actuators are used in devices, they are thick. Piezoelectric elements, which can achieve thinner designs, are attracting increasing attention.

[0005] Piezoelectric devices may have a characteristic in which impedance gradually decreases toward a high-frequency region (or a high-pitched sound band). Therefore, when a piezoelectric device is configured with a speaker sound driving circuit, problems such as overcurrent, clipping, and sound quality degradation may occur. Summary of the Invention

[0006] The inventors of the present disclosure have recognized that piezoelectric devices can be driven by adding a power resistor to a conventional sound driving circuit for a speaker. However, the inventors of the present disclosure have recognized a problem: conventional sound driving circuits with the addition of a power resistor increase power consumption due to the power resistor, and the heat generated by the power resistor due to this increased power consumption can reduce reliability. Through extensive research and experiments, the inventors of the present disclosure have developed a sound driving circuit that can drive a piezoelectric device using a conventional sound driving circuit for a speaker, a sound device including the sound driving circuit, and a vehicle device including the sound device.

[0007] One aspect of the present disclosure is directed to providing a sound driving circuit that can drive a piezoelectric device, a sound device including the sound driving circuit, and a vehicle device including the sound device.

[0008] Another aspect of the present disclosure is directed to providing a sound driving circuit that can drive a speaker and a piezoelectric device, a sound device including the sound driving circuit, and a vehicle device including the sound device.

[0009] Another aspect of the present disclosure is directed to providing a vehicle device that can output a virtual engine sound through a sound device including a sound driving circuit capable of driving a piezoelectric device.

[0010] Additional features, advantages, and aspects of the present disclosure are partially set forth in the present disclosure and will become apparent from the present disclosure, or may be understood by practicing the inventive concepts provided herein. Other features, advantages, and aspects of the present disclosure may be realized and obtained through the description provided in the present disclosure or content derivable from the present disclosure, as well as the claims and the accompanying drawings.

[0011] To achieve these and other advantages and aspects of the present disclosure, as embodied and broadly described herein, in one or more aspects, a sound driving circuit includes: an audio processor that generates an input audio signal based on a sound source; a signal conversion circuit that converts the input audio signal into a piezoelectric audio signal; and an amplifier circuit that amplifies the piezoelectric audio signal to generate a piezoelectric driving signal for driving a piezoelectric vibration device.

[0012] In one or more aspects, a sound driving circuit includes: an audio processor that generates an audio signal based on a sound source; a preamplifier circuit that amplifies the audio signal to generate an input audio signal; a signal conversion circuit that converts the input audio signal into a piezoelectric audio signal; and an amplifier circuit that amplifies the piezoelectric audio signal to generate a piezoelectric driving signal for driving a piezoelectric vibration device.

[0013] In one or more aspects, a sound driving circuit includes: an audio processor that generates a first input audio signal and one or more second input audio signals based on a sound source; a signal conversion circuit that converts the first input audio signal into a piezoelectric audio signal; and an amplifier circuit that amplifies the one or more second input audio signals to generate one or more actuator driving signals for driving one or more coil-type actuators, and amplifies the piezoelectric audio signals to generate a piezoelectric driving signal for driving a piezoelectric-type vibration device.

[0014] In one or more aspects, a sound driving circuit includes: an audio processor that generates a first audio signal and one or more second audio signals based on a sound source; a preamplifier circuit that amplifies the one or more second audio signals to generate one or more second input audio signals, and amplifies the first audio signal to generate the first input audio signal; a signal conversion circuit that converts the first input audio signal into a piezoelectric audio signal; and an amplifier circuit that amplifies the one or more second input audio signals to generate one or more actuator driving signals for driving one or more coil-type actuators, and amplifies the piezoelectric audio signal to generate a piezoelectric driving signal for driving a piezoelectric vibration device.

[0015] In one or more aspects, an acoustic device includes: a vibration device including a piezoelectric material; and a drive circuit portion connected to the vibration device. The drive circuit portion includes the acoustic drive circuit as described above for applying a piezoelectric drive signal to the vibration device.

[0016] In one or more aspects, an acoustic device includes: a vibration device comprising a piezoelectric material; one or more actuators comprising a magnet and a coil; and a drive circuit portion connected to the vibration device and the one or more actuators. The drive circuit portion includes the acoustic drive circuit described above, which applies a piezoelectric drive signal to the vibration device and applies one or more actuator drive signals to the one or more actuators.

[0017] In one or more aspects, a vehicle device includes: an exterior material; an interior material covering the exterior material; and one or more sound generating devices configured to output sound in one or more of the exterior material, the interior material, and an area between the exterior material and the interior material. The one or more sound generating devices include a sound device. The sound device includes: a vibration device including a piezoelectric material; and a drive circuit portion connected to the vibration device. The drive circuit portion includes a sound drive circuit as described above that applies a piezoelectric drive signal to the vibration device.

[0018] In one or more aspects, a vehicle device includes: an exterior material; an interior material covering the exterior material; and one or more sound generating devices configured to output sound in one or more of the exterior material, the interior material, and an area between the exterior material and the interior material. The one or more sound generating devices include a sound device. The sound device includes: a vibration device including a piezoelectric material; one or more actuators including a magnet and a coil; and a drive circuit portion connected to the vibration device and the one or more actuators. The drive circuit portion includes the sound drive circuit as described above, which applies a piezoelectric drive signal to the vibration device and applies one or more actuator drive signals to the one or more actuators.

[0019] In one or more aspects, a vehicle device includes: a vehicle body bottom frame; a vehicle body bottom covering the vehicle body bottom frame; and one or more virtual engine sound devices mounted on the vehicle body bottom frame or in an area between the vehicle body bottom frame and the vehicle body bottom frame. The one or more virtual engine sound devices include a sound device. The sound device includes: a vibration device including a piezoelectric material; and a drive circuit portion connected to the vibration device. The drive circuit portion includes a sound drive circuit as described above that applies a piezoelectric drive signal to the vibration device.

[0020] Details of other exemplary embodiments are included in the detailed description section and accompanying drawings of this disclosure.

[0021] According to one or more embodiments of the present disclosure, a sound driving circuit, a sound device including the sound driving circuit, and a vehicle device including the sound device can output sound based on the vibration (or displacement) of the piezoelectric device, and can prevent overcurrent and clipping phenomena that occur in the high-pitched vocal band (or high-frequency area) when the piezoelectric device vibrates (or shifts).

[0022] A sound driving circuit, a sound device including the sound driving circuit, and a vehicle device including the sound device according to one or more embodiments of the present disclosure may drive a speaker and a piezoelectric device.

[0023] A vehicle device according to one or more embodiments of the present disclosure may output a virtual engine sound through a sound device including a sound driving circuit capable of driving a piezoelectric device.

[0024] Other systems, methods, features, and advantages will become apparent to those skilled in the art upon examination of the following figures and detailed description. It is intended that all such additional systems, methods, features, and advantages be included within this description, be within the scope of this disclosure, and be protected by the following claims. Nothing in this section should be construed as limiting these claims. Additional aspects and advantages are discussed below in conjunction with various aspects of this disclosure.

[0025] It is to be understood that both the foregoing description and the following description of the present disclosure are exemplary and explanatory and are intended to provide further explanation of the disclosure as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which are included to provide a further understanding of the disclosure, are incorporated in and constitute a part of this disclosure, illustrate aspects and embodiments of the disclosure and together with the description serve to explain the principles of the disclosure.

[0027] Figure 1 A sound device according to an embodiment of the present disclosure is shown.

[0028] Figure 2 An embodiment according to the present disclosure is shown Figure 1 The signal conversion circuit shown in .

[0029] Figure 3 A sound device according to another embodiment of the present disclosure is shown.

[0030] Figure 4 A sound device according to another embodiment of the present disclosure is shown.

[0031] Figure 5 A sound device according to another embodiment of the present disclosure is shown.

[0032] Figure 6 A sound device according to another embodiment of the present disclosure is shown.

[0033] Figure 7 According to one embodiment of the present disclosure Figure 6 A cross-sectional view taken along line II′ is shown in FIG.

[0034] Figure 8 FIG. 1 is a diagram showing another embodiment according to the present disclosure. Figure 6 Exploded perspective view of the sound device shown in .

[0035] Figure 9 is a cross-sectional view illustrating a device according to one embodiment of the present disclosure.

[0036] Figure 10 is a cross-sectional view showing a vehicle device according to one embodiment of the present disclosure.

[0037] Figure 11 is a perspective view showing a vehicle device according to another embodiment of the present disclosure.

[0038] Figure 12 According to one embodiment of the present disclosure Figure 11 A cross-sectional view taken along line II-II' is shown in FIG.

[0039] Figure 13 is a perspective view illustrating a vibration device according to one embodiment of the present disclosure.

[0040] Figure 14 According to one embodiment of the present disclosure Figure 13 A cross-sectional view taken along line III-III' is shown in FIG.

[0041] Figure 15 According to one embodiment of the present disclosure Figure 13 A cross-sectional view taken along line IV-IV′ is shown in FIG.

[0042] Figure 16 is a perspective view illustrating a vibration layer according to another embodiment of the present disclosure.

[0043] Figure 17 is a perspective view illustrating a vibration layer according to another embodiment of the present disclosure.

[0044] Figure 18 is an exploded perspective view illustrating a vibration device according to another embodiment of the present disclosure.

[0045] Figure 19 is a plan view showing a vehicle device according to another embodiment of the present disclosure.

[0046] Figure 20 According to one embodiment of the present disclosure Figure 19 A cross-sectional view taken along line VV′ shown in FIG.

[0047] Throughout the drawings and detailed description, unless otherwise described, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustration, and convenience, the size, length, and thickness of each layer, region, and element, as well as their depiction, may be exaggerated. DETAILED DESCRIPTION

[0048] The advantages and features of the present disclosure and their implementation methods will become clear through the various aspects described with reference to the accompanying drawings. However, the present disclosure can be implemented in different forms and should not be construed as limited to the exemplary aspects set forth herein. Rather, these exemplary aspects are examples and are intended to make the present disclosure thorough and complete, to help those skilled in the art understand the inventive concept, and do not limit the scope of protection of the present disclosure.

[0049] The shapes, sizes, ratios, angles, and quantities disclosed in the accompanying drawings for describing the embodiments of the present disclosure are merely examples, and therefore, the present disclosure is not limited to the details shown. The same reference numerals throughout refer to the same elements. In the following description, when it is determined that a detailed description of a related known function or configuration would unnecessarily obscure the key points of the present disclosure, such detailed description will be omitted.

[0050] In the case where “including,” “having,” and “comprising” described in this specification are used, another part may be added unless “only” is used. Terms in the singular form may include plural forms unless otherwise noted.

[0051] When interpreting ingredients, even if not explicitly described, the ingredients are interpreted as including a margin of error.

[0052] When describing a positional relationship, for example, when the positional relationship between two parts is described as "on," "above," "below," and "near," unless "exactly" or "directly" is used, one or more other parts may be set between the two parts.

[0053] When describing a time relationship, for example, when a time sequence is described as “after,” “successively after,” “followed by,” and “before,” discontinuous cases may be included unless “just” or “directly” is used.

[0054] It should be understood that although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of this disclosure.

[0055] When describing the elements of the present disclosure, the terms "first", "second", "A", "B", "(a)", "(b)", etc. may be used. These terms are intended to distinguish the corresponding elements from other elements, and these terms are not used to limit the nature, basis, order or number of the elements.

[0056] When an element is “connected,” “coupled,” or “contacting” another element, unless otherwise specified, the element may not only be directly connected, coupled, or contacting the other element, but may also be indirectly connected, coupled, or contacting the other element through one or more intermediate elements interposed between the elements.

[0057] When an element is described as “contacting” or “overlapping” another element, unless otherwise specified, the element may not only be directly in contact with, overlapping with, etc. the other element, but may also be indirectly in contact with or overlapping the other element via one or more intermediate elements disposed or interposed between the elements.

[0058] The term "at least one" should be understood to include any and all combinations of one or more of the associated listed items. For example, the meaning of "at least one of the first, second, and third items" means two or more of the first, second, and third items, as well as all combinations of items listed in the first, second, or third items.

[0059] The features of the various embodiments of the present disclosure may be partially or fully coupled or combined with each other and may interoperate and be technically driven in various ways, as will be fully understood by those skilled in the art. The embodiments of the present disclosure may be performed independently of each other, or may be performed together in a mutually dependent relationship.

[0060] Hereinafter, exemplary embodiments of the sound device according to the present disclosure will be described in detail with reference to the accompanying drawings. For ease of description, the proportion of each element shown in the drawings is different from the actual proportion and is therefore not limited to the proportion shown in the drawings.

[0061] Figure 1 A sound device according to an embodiment of the present disclosure is shown.

[0062] Reference Figure 1, a sound device according to one embodiment (or first embodiment) of the present disclosure may include a vibration device 10 and a driving circuit part 100 connected to the vibration device 10 .

[0063] The vibration device 10 may be configured to include a piezoelectric material. The vibration device 10 may vibrate (or displace) based on a piezoelectric drive signal PDS applied from the drive circuit portion 100 to output (or generate) sound (or vibration or sound waves). For example, the vibration device 10 may be a piezoelectric device, a vibration generating device, a vibration membrane, a vibration generating membrane, an active vibration generator, a membrane actuator, or a membrane exciter, but the embodiments of the present disclosure are not limited thereto.

[0064] The driving circuit portion 100 may include a sound driving circuit 101 configured to provide a piezoelectric driving signal PDS to the vibration device 10 .

[0065] The sound driving circuit 101 according to one embodiment of the present disclosure may include a signal conversion circuit 120 and an amplifier circuit 130 .

[0066] The signal conversion circuit 120 can be configured to convert the input audio signal (or input audio data) IAS into a piezoelectric audio signal PAS. For example, the signal conversion circuit 120 can be configured to convert the input audio signal IAS into a piezoelectric audio signal PAS so as to correspond to the driving characteristics of the piezoelectric vibration device 10 (or piezoelectric device or piezoelectric vibration device). For example, the vibration device 10 may have a characteristic in which the impedance gradually decreases toward the high-frequency region (or high-pitched vocal cords). Therefore, an overcurrent caused by a peak component appearing in the high-frequency region (or high-pitched vocal cords), a clipping phenomenon caused by the overcurrent, and a decrease in sound quality may occur. For example, when a signal greater than or equal to an allowable voltage is applied to the amplifier circuit 130, a clipping phenomenon may occur.

[0067] According to one embodiment of the present disclosure, the signal conversion circuit 120 can convert the input audio signal IAS into a piezoelectric audio signal PAS, thereby preventing overcurrent in the high-pitched vocal signal (or high-frequency region) of the input audio signal IAS. For example, the signal conversion circuit 120 can be configured to limit the voltage corresponding to the input audio signal IAS to less than the allowable voltage of the amplifier circuit 130. For example, the signal conversion circuit 120 can be configured to generate the piezoelectric audio signal PAS by attenuating the high-pitched vocal signal of the input audio signal IAS. For example, the signal conversion circuit 120 can be configured to generate the piezoelectric audio signal PAS by linearly attenuating the high-pitched vocal signal of the input audio signal IAS. For example, the high-pitched vocal signal can have a frequency of 1 kHz or higher, but the embodiments of the present disclosure are not limited thereto. For example, the signal conversion circuit 120 can be configured to generate the piezoelectric audio signal PAS by attenuating the attenuation frequency (or cutoff frequency) of the input audio signal IAS or higher. For example, the signal conversion circuit 120 may be configured to generate the piezoelectric audio signal PAS by attenuating a signal having an attenuation frequency or higher in the input audio signal IAS. For example, the attenuation frequency may be 1 kHz, but the present disclosure is not limited thereto.

[0068] The amplifier circuit 130 may receive the piezoelectric audio signal PAS output from the signal conversion circuit 120 and may amplify the received piezoelectric audio signal PAS to generate a piezoelectric drive signal PDS. For example, the amplifier circuit 130 may amplify the piezoelectric audio signal PAS based on a predetermined gain value to generate the piezoelectric drive signal PDS. For example, the amplifier circuit 130 may amplify the piezoelectric audio signal PAS to generate a piezoelectric drive signal PDS having positive and negative polarities, and may provide (or transmit) the piezoelectric drive signal PDS having positive and negative polarities to the vibration device 10.

[0069] According to one embodiment of the present disclosure, the amplifier circuit 130 may receive (or apply) the piezoelectric audio signal PAS from the signal conversion circuit 120 and amplify the piezoelectric audio signal PAS within a permissible voltage range to generate the piezoelectric drive signal PDS. Thus, clipping due to vibration (or displacement) of the vibration device 10 may be prevented.

[0070] The sound driving circuit 101 according to one embodiment of the present disclosure may further include an audio processor 110 .

[0071] The audio processor 110 may be configured to provide (or transmit) an input audio signal IAS to the signal conversion circuit 120. For example, the audio processor 110 may generate an audio signal based on a sound source SS input according to the control of a host system (or host controller), and may be configured to provide (or transmit) the generated audio signal as the input audio signal IAS to the signal conversion circuit 120.

[0072] The vibration device 10 can vibrate (or displace) based on the piezoelectric drive signal PDS applied from the amplifier circuit 130 of the drive circuit portion 100 (or the sound drive circuit 101 ) to output (or generate) sound (or vibration or sound waves).

[0073] According to one embodiment of the present disclosure, the vibration device 10 can vibrate (or shift) by a piezoelectric drive signal PDS based on a piezoelectric audio signal PAS, wherein overcurrent is limited in the high-pitched vocal band by the signal conversion circuit 120, thereby preventing overcurrent and clipping phenomena occurring in the high-pitched vocal band (or high-frequency region).

[0074] In the sound driving circuit 101 according to one embodiment of the present disclosure, the audio processor 110 and the amplifier circuit 130 can be regarded as a conventional sound driving circuit of a speaker. For example, the sound driving circuit 101 according to one embodiment of the present disclosure may include a signal conversion circuit 120 connected between the audio processor 110 and the amplifier circuit 130 in the conventional sound driving circuit of the speaker. Therefore, since the sound driving circuit 101 according to one embodiment of the present disclosure includes the signal conversion circuit 120 added to the conventional sound driving circuit of the speaker, the sound driving circuit 101 can drive (or vibrate or move) the piezoelectric vibration device 10 and can prevent overcurrent and clipping phenomena from occurring in the high-pitched vocal range (or high-frequency region) when driving the vibration device 10.

[0075] In the sound driving circuit 101 according to one embodiment of the present disclosure, the audio processor 110, the signal conversion circuit 120 and the amplifier circuit 130 may be mounted on a printed circuit board (PCB). For example, in the PCB, the signal line 101L between the audio processor 110 and the amplifier circuit 130 may be disconnected, or there may be no signal line between the audio processor 110 and the amplifier circuit 130. Therefore, the input audio signal IAS output from the audio processor 110 may not be provided to the amplifier circuit 130 (for example, through the disconnected signal line 101L), but may be provided only to the signal conversion circuit 120. For comparison, in a conventional sound driving circuit of a speaker, the audio processor is connected to the amplifier circuit through a signal line, so that the input audio signal is transmitted to the amplifier circuit without being converted.

[0076] Figure 2 An embodiment according to the present disclosure is shown Figure 1 The signal conversion circuit shown.

[0077] Reference Figure 1 and Figure 2 , the signal conversion circuit 120 according to one embodiment of the present disclosure may include a filter circuit 127 .

[0078] The filter circuit 127 can filter the input audio signal IAS to generate the piezoelectric audio signal PAS, thereby preventing an overcurrent from occurring in high-pitched vocal signals (e.g., frequencies of 1 kHz or higher) of the input audio signal IAS. For example, the filter circuit 127 can be configured to limit the voltage corresponding to the input audio signal IAS to a voltage less than the allowable voltage of the amplifier circuit 130, but the embodiments of the present disclosure are not limited thereto.

[0079] The filter circuit 127 may be configured to generate a piezoelectric audio signal PAS by attenuating a high-pitched vocal signal of the input audio signal IAS. The filter circuit 127 may be configured to generate a piezoelectric audio signal PAS by linearly attenuating a high-pitched vocal signal of the input audio signal IAS. For example, the filter circuit 127 may be configured to generate a piezoelectric audio signal PAS by attenuating a signal having an attenuation frequency (e.g., 1 kHz) or higher in the input audio signal IAS. For example, the filter circuit 127 may be configured to generate a piezoelectric audio signal PAS by linearly attenuating a signal having an attenuation frequency or higher in the input audio signal IAS. For example, the filter circuit 127 may be a piezoelectric equalizer, a piezoelectric filter, a low-pass filter, a high-cut filter, or a treble-cut filter, but embodiments of the present disclosure are not limited thereto.

[0080] The signal conversion circuit 120 according to one embodiment of the present disclosure may include a correction circuit 121 , a level control circuit 123 , and a clipping circuit 125 .

[0081] The correction circuit 121 can correct the input audio signal IAS so that the difference between the highest and lowest sound pressure levels in a specific tonal band (or specific frequency band) of the sound generated by the vibration device 10 based on the vibration (or displacement) is reduced. The correction circuit 121 can correct the input audio signal IAS to improve the flatness of the sound pressure level of the sound generated by the vibration (or displacement) of the vibration device 10. For example, the correction circuit 121 can correct the input audio signal IAS so that the valley component (or valley frequency) and / or peak component (or peak frequency) in the specific tonal band of the sound generated by the vibration (or displacement) of the vibration device 10 are improved. A peak can be a phenomenon in which the sound pressure level jumps at a specific frequency, while a valley can be a phenomenon in which a low sound pressure level is generated due to the prevention of the occurrence of sounds with a specific frequency. The flatness of the sound pressure level can be the deviation level between the highest and lowest sound pressure levels at a specific frequency. For example, the correction circuit 121 can be a flattening circuit, a tuned equalizer, or a peak / valley correction circuit, but the embodiments of the present disclosure are not limited to this.

[0082] The correction circuit 121 according to one embodiment of the present disclosure may increase a first tonal vocal band signal of the input audio signal IAS and / or may decrease a second tonal vocal band signal different from the first tonal vocal band signal to generate a first audio correction signal ACS1.

[0083] According to one embodiment of the present disclosure, the correction circuit 121 may correct the input audio signal IAS so that the valley phenomenon (or valley frequency) in the first pitch vocal cord signal of the sound generated based on the vibration (or displacement) of the vibration device 10 is improved. For example, the correction circuit 121 may be configured to increase the first pitch vocal cord signal of the input audio signal IAS. For example, the correction circuit 121 may be configured to increase the value (or level) of the first pitch vocal cord signal of the input audio signal IAS by a predetermined value. For example, the correction circuit 121 may increase the value (or level) of the first pitch vocal cord signal of the input audio signal IAS by up to a maximum value of 3 decibels (+3dB), but the embodiments of the present disclosure are not limited thereto. For example, the first pitch vocal cord signal may have a frequency of 250Hz to 600Hz, but the embodiments of the present disclosure are not limited thereto.

[0084] According to one embodiment of the present disclosure, the correction circuit 121 may correct the input audio signal IAS so that peaks (or peak frequencies) are reduced in the second tonal vocal band signal of the sound generated based on the vibration (or displacement) of the vibration device 10. For example, the correction circuit 121 may be configured to reduce the second tonal vocal band signal of the input audio signal IAS. For example, the correction circuit 121 may reduce the value (or level) of the second tonal vocal band signal of the input audio signal IAS by a predetermined value to generate the first audio correction signal ACS1. For example, the correction circuit 121 may reduce the value (or level) of the second tonal vocal band signal of the input audio signal IAS by up to a maximum of 3 decibels (-3 dB), although embodiments of the present disclosure are not limited thereto. For example, the second tonal vocal band signal may have a frequency of 1 kHz or higher, 4 kHz or higher, or 10 kHz or higher, although embodiments of the present disclosure are not limited thereto.

[0085] The correction circuit 121 according to one embodiment of the present disclosure may include a first correction circuit 121 a and a second correction circuit 121 b .

[0086] The first correction circuit 121a may be configured to increase the first tonal vocal band signal of the input audio signal IAS, and the second correction circuit 121b may reduce the second tonal vocal band signal in the signal obtained by increasing the first tonal vocal band signal by the first correction circuit 121a, so as to generate a first audio correction signal ACS1.

[0087] The correction circuit 121 according to another embodiment of the present disclosure may include a first correction circuit 121 a , a second correction circuit 121 b , and a mixing circuit.

[0088] The first correction circuit 121a may be configured to increase a first tonal vocal band signal of the input audio signal IAS. The second correction circuit 121b may be configured to decrease a second tonal vocal band signal of the input audio signal IAS. The mixing circuit may mix the signal obtained by increasing the first tonal vocal band signal by the first correction circuit 121a with the signal obtained by decreasing the second tonal vocal band signal by the second correction circuit 121b to generate a first audio correction signal ACS1.

[0089] According to another embodiment of the present disclosure, the first audio correction signal ACS1 outputted from the correction circuit 121 may be a signal in which valleys and peaks in the input audio signal IAS are improved. For example, the first audio correction signal ACS1 may be a signal in which valleys in a first tonal vocal band signal of the input audio signal IAS are improved, and peaks in a second tonal vocal band signal of the input audio signal IAS are improved.

[0090] The level control circuit 123 may be configured to control the volume (or volume level) of the first audio correction signal ACS1 output from the correction circuit 121. The level control circuit 123 may receive the first audio correction signal ACS1 output from the correction circuit 121 and may control the volume level of the received first audio correction signal ACS1 to generate the second audio correction signal ACS2. For example, the level control circuit 123 may control one or more of the phase and amplitude of the first audio correction signal ACS1 based on the gain value to generate the second audio correction signal ACS2.

[0091] The clipping circuit 125 can be configured to generate a third audio correction signal ACS3 by removing noise from the second audio correction signal ACS2 output from the level control circuit 123. The clipping circuit 125 can receive the second audio correction signal ACS2 output from the level control circuit 123 and can be configured to generate the third audio correction signal ACS3 by removing noise from the received second audio correction signal ACS2. For example, the clipping circuit 125 can be configured to prevent the occurrence of clipping caused by band-width increase (which is based on signal amplification by the amplifier circuit 130). According to one embodiment of the present disclosure, the clipping circuit 125 can remove signals of 0 dBFS (dB full scale) or greater from the second audio correction signal ACS2 output from the level control circuit 123 to generate the third audio correction signal ACS3. For example, the clipping circuit 125 can be a limiter, but embodiments of the present disclosure are not limited thereto.

[0092] The filter circuit 127 may be configured to generate a piezoelectric audio signal PAS by attenuating a high-pitched vocal band (or high-frequency) signal of the third audio correction signal ACS3 output from the clipping circuit 125. The filter circuit 127 may receive the third audio correction signal ACS3 output from the clipping circuit 125 and may attenuate the high-pitched vocal band (or high-frequency) signal of the received third audio correction signal ACS3 to generate the piezoelectric audio signal PAS.

[0093] According to one embodiment of the present disclosure, the vibration device 10 can vibrate (or shift) according to the piezoelectric drive signal PDS based on the piezoelectric audio signal PAS generated by the signal conversion circuit 120 including the correction circuit 121, the level control circuit 123, the clipping circuit 125 and the filter circuit 127, so as to output (or generate) sound (or vibration or sound wave), and can prevent the overcurrent phenomenon and the clipping phenomenon occurring in the high-pitched vocal band (or high-frequency area), and can improve the valley phenomenon in the first-pitched vocal band and the peak phenomenon in the second-pitched vocal band, thereby enhancing the sound characteristics and / or the sound pressure level characteristics.

[0094] Figure 3 FIG. 4 shows a sound device according to another embodiment of the present disclosure. For example, Figure 3 As shown in the above reference Figure 1 and Figure 2 The embodiment of the sound driving circuit of the sound device described in the present invention is further configured with a preamplifier circuit. Therefore, in the following description, the preamplifier circuit will be described in detail, and the other components can be the same as those described above. Figure 1 and Figure 2 The elements described are substantially the same, and thus, the same reference numerals refer to the same elements, and repeated descriptions thereof may be omitted or briefly given below.

[0095] Reference Figure 3 In the sound device according to another embodiment (or the second embodiment) of the present disclosure, the sound driving circuit 101 of the driving circuit part 100 may include a preamplifier circuit 140 , a signal conversion circuit 120 , and an amplifier circuit 130 .

[0096] The preamplifier circuit 140 may amplify the audio signal AS input to the preamplifier circuit 140 to generate the input audio signal IAS. For example, the preamplifier circuit 140 may perform primary amplification on the audio signal AS based on a predetermined gain value to generate the input audio signal IAS. The preamplifier circuit 140 may be configured to provide (or transmit) the input audio signal IAS to the signal conversion circuit 120.

[0097] The signal conversion circuit 120 may receive the input audio signal IAS output from the preamplifier circuit 140 and may be configured to convert the received input audio signal IAS into a piezoelectric audio signal PAS. In addition to the fact that the signal conversion circuit 120 receives the input audio signal IAS output from the preamplifier circuit 140, the signal conversion circuit 120 may be similar to the above-mentioned Figure 1 and Figure 2 The signal conversion circuit 120 described above is the same or substantially the same, and therefore, repeated description thereof is omitted. Figure 1 and Figure 2 The description of the signal conversion circuit 120 may be included in Figure 3 The signal conversion circuit 120 may be configured to provide (or transmit) the piezoelectric audio signal PAS to the amplifier circuit 130 .

[0098] The amplifier circuit 130 may amplify the piezoelectric audio signal PAS to generate a piezoelectric drive signal PDS, and may be configured to apply the piezoelectric drive signal PDS to the vibration device 10. For example, the amplifier circuit 130 may be the same as that described above with reference to FIG. Figure 1 and Figure 2 The amplifier circuit 130 described is the same or substantially the same, and therefore, repeated description thereof is omitted.

[0099] The sound driving circuit 101 according to another embodiment of the present disclosure may further include an audio processor 110 .

[0100] The audio processor 110 may be configured to provide (or transmit) an audio signal AS to the preamplifier circuit 140. For example, the audio processor 110 may generate an audio signal AS based on a sound source SS input according to the control of a host system (or host controller), and may be configured to provide (or transmit) the generated audio signal AS to the preamplifier circuit 140.

[0101] In the sound driving circuit 101 according to one embodiment of the present disclosure, the audio processor 110, the signal conversion circuit 120, the amplifier circuit 130, and the preamplifier circuit 140 may be mounted on a printed circuit board (PCB). For example, in the PCB, the signal line 101L between the preamplifier circuit 140 and the amplifier circuit 130 may be disconnected, or there may be no signal line between the preamplifier circuit 140 and the amplifier circuit 130. Therefore, the input audio signal IAS output from the preamplifier circuit 140 may not be provided to the amplifier circuit 130 (e.g., via the disconnected signal line 101L) but may be provided only to the signal conversion circuit 120.

[0102] The vibration device 10 can vibrate (or shift) based on the piezoelectric drive signal PDS applied from the amplifier circuit 130 of the drive circuit part 100 (or the sound drive circuit 101) so as to output (or generate) sound (or vibration or sound waves), and can prevent overcurrent and clipping phenomena occurring in the high-pitched vocal band (or high-frequency area), and can improve the valley phenomenon in the first-pitched vocal band and the peak phenomenon in the second-pitched vocal band, thereby enhancing the sound characteristics and / or sound pressure level characteristics.

[0103] Figure 4 A sound device according to another embodiment of the present disclosure is shown.

[0104] Reference Figure 4 , a sound device according to another embodiment (or the third embodiment) of the present disclosure may include a vibration device 10, one or more (or multiple) actuators (or speakers) 30-1 to 30-n including a magnet and a coil (or voice coil), and a driving circuit part 100 connected to the vibration device 10 and the one or more (or multiple) actuators 30-1 to 30-n.

[0105] The vibration device (or piezoelectric device) 10 may vibrate (or displace) based on the piezoelectric driving signal PDS applied from the driving circuit portion 100 so as to output (or generate) sound (or vibration or sound wave).

[0106] One or more (or multiple) actuators 30-1 to 30-n may be coil-type vibration devices or coil-type actuators. For example, one or more (or multiple) actuators 30-1 to 30-n may vibrate (or be driven) based on actuator drive signals (or speaker drive signals) ADS1 to ADSn applied from the drive circuit portion 100 according to Fleming's left-hand rule so as to output (or generate) sound (or vibration or sound waves).

[0107] The driving circuit portion 100 may include a sound driving circuit 101 configured to drive the vibration device 10 and one or more (or multiple) actuators 30-1 to 30-n. The sound driving circuit 101 may provide a piezoelectric driving signal PDS to the vibration device 10 and may provide actuator driving signals ADS1 to ADSn to one or more (or multiple) actuators 30-1 to 30-n.

[0108] The sound driving circuit 101 according to another embodiment of the present disclosure may include a signal conversion circuit 120 and an amplifier circuit 130 , and may further include an audio processor 110 .

[0109] The audio processor 110 may be configured to generate a first input audio signal (or first input audio data) IAS1 and one or more (or more) second input audio signals (or second input audio data) IAS2-1 to IAS2-n. For example, the audio processor 110 may generate the first audio signal and one or more (or more) second audio signals based on a sound source SS input under the control of a host system (or host controller). The audio processor 110 may be configured to provide (or transmit) the first audio signal as the first input audio signal IAS1 to the signal conversion circuit 120, and may be configured to provide (or transmit) the one or more (or more) second audio signals as the one or more (or more) second input audio signals IAS2-1 to IAS2-n to the amplifier circuit 130.

[0110] The audio processor 110 according to one embodiment of the present disclosure may be configured to generate a plurality of second input audio signals IAS2-1 to IAS2-n based on the sound source SS, so as to provide (or transmit) the second input audio signals IAS2-1 to IAS2-n to the amplifier circuit 130. For example, the plurality of second input audio signals IAS2-1 to IAS2-n may be the same as or different from each other.

[0111] The signal conversion circuit 120 may receive the first input audio signal IAS1 output from the audio processor 110 and may be configured to convert the received first input audio signal IAS1 into a piezoelectric audio signal PAS. In addition to the fact that the signal conversion circuit 120 receives the first input audio signal IAS1 output from the audio processor 110, the signal conversion circuit 120 may be similar to the above-mentioned Figure 1 and Figure 2 The signal conversion circuit 120 described above is the same or substantially the same, and therefore, repeated description thereof is omitted. Figure 1 and Figure 2 The description of the signal conversion circuit 120 may be included in Figure 4 The signal conversion circuit 120 may be configured to provide (or transmit) the piezoelectric audio signal PAS to the amplifier circuit 130 .

[0112] The amplifier circuit 130 may be configured to generate one or more (or multiple) actuator drive signals ADS1 to ADSn by amplifying one or more (or multiple) second input audio signals IAS2-1 to IAS2-n, and may also be configured to generate a piezoelectric drive signal PDS by amplifying a piezoelectric audio signal PAS.

[0113] The amplifier circuit 130 may receive one or more (or multiple) second input audio signals IAS2-1 to IAS2-n output from the audio processor 110 and may amplify the received one or more (or multiple) second input audio signals IAS2-1 to IAS2-n to generate one or more (or multiple) actuator drive signals ADS1 to ADSn. For example, the amplifier circuit 130 may amplify the one or more (or multiple) second input audio signals IAS2-1 to IAS2-n based on a predetermined gain value to generate one or more (or multiple) actuator drive signals ADS1 to ADSn. For example, the amplifier circuit 130 may amplify one or more (or multiple) second input audio signals IAS2-1 to IAS2-n to generate one or more (or multiple) actuator drive signals ADS1 to ADSn having positive and negative polarities, and may provide (or transmit) the one or more (or multiple) actuator drive signals ADS1 to ADSn having positive and negative polarities to one or more (or multiple) actuators 30-1 to 30-n.

[0114] The amplifier circuit 130 may receive the piezoelectric audio signal PAS output from the signal conversion circuit 120 and amplify the received piezoelectric audio signal PAS to generate a piezoelectric drive signal PDS. For example, the amplifier circuit 130 may amplify the piezoelectric audio signal PAS based on a predetermined gain value to generate the piezoelectric drive signal PDS. For example, the amplifier circuit 130 may amplify the piezoelectric audio signal PAS to generate a piezoelectric drive signal PDS having positive and negative polarities, and may provide (or transmit) the piezoelectric drive signal PDS having positive and negative polarities to the vibration device 10.

[0115] According to one embodiment of the present disclosure, the amplifier circuit 130 may receive (or apply) the piezoelectric audio signal PAS from the signal conversion circuit 120 and amplify the piezoelectric audio signal PAS within a permissible voltage range to generate the piezoelectric drive signal PDS. This prevents clipping caused by the vibration (or displacement) of the vibration device 10.

[0116] The amplifier circuit 130 according to one embodiment of the present disclosure may include a first amplifier circuit 131 and one or more (or multiple) second amplifier circuits 132 - 1 to 132 - n .

[0117] The first amplifier circuit 131 may generate a piezoelectric drive signal PDS by amplifying the piezoelectric audio signal PAS output from the signal conversion circuit 120 based on a predetermined gain value. For example, the first amplifier circuit 131 may generate a piezoelectric drive signal PDS having positive and negative polarities by amplifying the piezoelectric audio signal PAS, and may be configured to provide (or transmit) the piezoelectric drive signal PDS having positive and negative polarities to the vibration device 10.

[0118] The first amplifier circuit 131 according to one embodiment of the present disclosure can receive (or apply) the piezoelectric audio signal PAS from the signal conversion circuit 120 and generate a piezoelectric drive signal PDS by amplifying the piezoelectric audio signal PAS within a permissible voltage range. Therefore, the vibration device 10 can vibrate (or displace) by the piezoelectric drive signal PDS based on the piezoelectric audio signal PAS, wherein the signal conversion circuit 120 limits overcurrent in the high-pitched vocal range. Therefore, overcurrent and clipping phenomena that occur in the high-pitched vocal range (or high-frequency region) can be prevented.

[0119] The one or more (or more) second amplifier circuits 132-1 to 132-n may amplify the one or more (or more) second input audio signals IAS2-1 to IAS2-n based on a predetermined gain value to generate one or more (or more) actuator drive signals ADS1 to ADSn. For example, the one or more (or more) second amplifier circuits 132-1 to 132-n may amplify the one or more (or more) second input audio signals IAS2-1 to IAS2-n to generate one or more (or more) actuator drive signals ADS1 to ADSn having positive and negative polarities, and may be configured to provide (or transmit) the one or more (or more) actuator drive signals ADS1 to ADSn having positive and negative polarities to one or more (or more) actuators 30-1 to 30-n.

[0120] In the sound driving circuit 101 according to another embodiment of the present disclosure, the audio processor 110, the signal conversion circuit 120, and the amplifier circuit 130 may be mounted on a printed circuit board (PCB). For example, in the PCB, the signal line 101L between the audio processor 110 and the first amplifier circuit 131 may be disconnected, or there may be no signal line between the audio processor 110 and the first amplifier circuit 131. Therefore, the first input audio signal IAS1 output from the audio processor 110 may not be provided to the first amplifier circuit 131 (e.g., via the disconnected signal line 101L), but may be provided only to the signal conversion circuit 120.

[0121] The vibration device 10 can vibrate (or shift) based on the piezoelectric drive signal PDS applied from the first amplifier circuit 131 in the sound drive circuit 101 (or the amplifier circuit 130 of the sound drive circuit 101) so as to output (or generate) sound (or vibration or sound waves), which can prevent overcurrent and clipping phenomena occurring in the high-pitched vocal band (or high-frequency area), and can improve the valley phenomenon in the first-pitched vocal band and the peak phenomenon in the second-pitched vocal band, thereby enhancing the sound characteristics and / or sound pressure level characteristics.

[0122] Each of the plurality of actuators 30-1 to 30-n may be configured to generate (or output) sound (or vibration) by vibrating (or driving) based on actuator drive signals ADS1 to ADSn applied from corresponding second amplifier circuits among the plurality of second amplifier circuits 132-1 to 132-n in the sound drive circuit 101 (or the amplifier circuit 130 of the sound drive circuit 101).

[0123] In the sound driving circuit 101 according to another embodiment of the present disclosure, the audio processor 110 and the amplifier circuit 130 can be considered as a conventional sound driving circuit of a speaker. For example, the sound driving circuit 101 according to another embodiment of the present disclosure may include a signal conversion circuit 120 connected between the audio processor 110 and the amplifier circuit 130 in the conventional sound driving circuit of the speaker. Therefore, since the sound driving circuit 101 according to another embodiment of the disclosure includes the signal conversion circuit 120 added to the conventional sound driving circuit of the speaker, the sound driving circuit 101 can drive (or vibrate or move) an actuator including a magnet and a coil, and can also drive the piezoelectric vibration device 10, and can prevent overcurrent and clipping phenomena that occur in high-pitched sounds (or in the high-frequency region) when the vibration device 10 is driven (or vibrated or displaced).

[0124] Figure 5 FIG. 4 shows a sound device according to another embodiment of the present disclosure. For example, Figure 5 Shown above with reference Figure 4 Therefore, in the following description, the preamplifier circuit will be described in detail, and the other components can be the same as those described above. Figure 4 The descriptions of the embodiments are substantially the same, and thus, the same reference numerals refer to the same elements, and repeated descriptions thereof may be omitted or will be briefly given below.

[0125] Reference Figure 5 In the sound device according to another embodiment (or the fourth embodiment) of the present disclosure, the sound driving circuit 101 of the driving circuit part 100 may include a preamplifier circuit 140, a signal conversion circuit 120 and an amplifier circuit 130, and may also include an audio processor 110.

[0126] The audio processor 110 may be configured to provide (or transmit) a first audio signal AS1 and one or more (or multiple) second audio signals AS2-1 to AS2-n to the preamplifier circuit 140. For example, the audio processor 110 may generate the first audio signal AS1 and one or more (or multiple) second audio signals AS2-1 to AS2-n based on a sound source SS input under the control of a host system (or host controller). The audio processor 110 may be configured to provide (or transmit) the first audio signal AS1 and one or more (or multiple) second audio signals AS2-1 to AS2-n to the preamplifier circuit 140.

[0127] The audio processor 110 according to one embodiment of the present disclosure may be configured to generate a plurality of second audio signals AS2-1 to AS2-n based on a sound source SS, so as to provide (or transmit) the plurality of second audio signals AS2-1 to AS2-n to the preamplifier circuit 140. For example, the plurality of second audio signals AS2-1 to AS2-n may be the same as or different from each other.

[0128] The preamplifier circuit 140 may amplify the first audio signal AS1 input to the preamplifier circuit 140 to generate a first input audio signal IAS1. For example, the preamplifier circuit 140 may be configured to generate the first input audio signal IAS1 by primarily amplifying the first audio signal AS1 input from the audio processor 110 based on a predetermined gain value. The preamplifier circuit 140 may be configured to provide (or transmit) the first input audio signal IAS1 to the signal conversion circuit 120.

[0129] The preamplifier circuit 140 may amplify one or more (or more) second audio signals AS2-1 to AS2-n input to the preamplifier circuit 140 to generate one or more (or more) second input audio signals IAS2-1 to IAS2-n. For example, the preamplifier circuit 140 may be configured to generate one or more (or more) second input audio signals IAS2-1 to IAS2-n by primarily amplifying the one or more (or more) second audio signals AS2-1 to AS2-n input from the audio processor 110 based on a predetermined gain value. The preamplifier circuit 140 may be configured to provide (or transmit) the one or more (or more) second input audio signals IAS2-1 to IAS2-n to the amplifier circuit 130.

[0130] The preamplifier circuit 140 according to one embodiment of the present disclosure may include a first preamplifier circuit 141 and one or more (or multiple) second preamplifier circuits 142 - 1 to 142 - n .

[0131] The first preamplifier circuit 141 may amplify the first audio signal AS1 input to the first preamplifier circuit 141 to generate a first input audio signal IAS1. For example, the first preamplifier circuit 141 may generate the first input audio signal IAS1 by primarily amplifying the first audio signal AS1 input from the audio processor 110 based on a predetermined gain value. The first preamplifier circuit 141 may be configured to provide (or transmit) the first input audio signal IAS1 to the signal conversion circuit 120.

[0132] The one or more (or more) second preamplifier circuits 142-1 to 142-n may amplify the one or more (or more) second audio signals AS2-1 to AS2-n input to the one or more (or more) second preamplifier circuits 142-1 to 142-n to generate one or more (or more) second input audio signals IAS2-1 to IAS2-n. For example, the one or more (or more) second preamplifier circuits 142-1 to 142-n may be configured to generate the one or more (or more) second input audio signals IAS2-1 to IAS2-n by primarily amplifying the one or more (or more) second audio signals AS2-1 to AS2-n input from the audio processor 110 based on a predetermined gain value. The one or more (or multiple) second preamplifier circuits 142 - 1 to 142 - n may be configured to provide (or transmit) the one or more (or multiple) second input audio signals IAS2 - 1 to IAS2 - n to the amplifier circuit 130 .

[0133] The signal conversion circuit 120 may receive the first input audio signal IAS1 output from the preamplifier circuit 140 (or the first preamplifier circuit 141), and may be configured to convert the received first input audio signal IAS1 into a piezoelectric audio signal PAS. In addition to receiving the first input audio signal IAS1 output from the preamplifier circuit 140, the signal conversion circuit 120 may be similar to the above-mentioned Figure 4 The signal conversion circuit 120 described above is the same or substantially the same, and therefore, repeated description thereof is omitted. Figure 4 The description of the signal conversion circuit 120 may be included in Figure 5 The signal conversion circuit 120 may be configured to provide (or transmit) the piezoelectric audio signal PAS to the amplifier circuit 130 .

[0134] The amplifier circuit 130 can amplify one or more (or multiple) second input audio signals IAS2-1 to IAS2-n provided from the preamplifier circuit 140 to generate one or more (or multiple) actuator drive signals ADS1 to ADSn, and amplify the piezoelectric audio signal PAS provided from the signal conversion circuit 120 to generate a piezoelectric drive signal PDS.

[0135] In addition to the amplifier circuit 130 receiving one or more (or a plurality of) second input audio signals IAS2-1 to IAS2-n output from the preamplifier circuit 140, the amplifier circuit 130 may be the same as described above with reference to FIG. Figure 4The amplifier circuit 130 described above is the same or substantially the same, and therefore, its repeated description may be omitted or briefly given below. Figure 4 The description of the amplifier circuit 130 may be included in Figure 5 . In the description of the amplifier circuit 130 shown in FIG.

[0136] The amplifier circuit 130 according to one embodiment of the present disclosure may include a first amplifier circuit 131 and one or more (or multiple) second amplifier circuits 132 - 1 to 132 - n .

[0137] The first amplifier circuit 131 may generate a piezoelectric drive signal PDS by amplifying the piezoelectric audio signal PAS output from the signal conversion circuit 120 based on a predetermined gain value. For example, the first amplifier circuit 131 may generate a piezoelectric drive signal PDS having positive and negative polarities by amplifying the piezoelectric audio signal PAS, and may be configured to provide (or transmit) the piezoelectric drive signal PDS having positive and negative polarities to the vibration device 10.

[0138] The one or more (or more) second amplifier circuits 132-1 to 132-n may amplify the one or more (or more) second input audio signals IAS2-1 to IAS2-n provided from the preamplifier circuit 140 based on a predetermined gain value to generate one or more (or more) actuator drive signals ADS1 to ADSn. For example, the one or more (or more) second amplifier circuits 132-1 to 132-n may amplify the one or more (or more) second input audio signals IAS2-1 to IAS2-n to generate one or more (or more) actuator drive signals ADS1 to ADSn having positive and negative polarities, and may be configured to provide (or transmit) the one or more (or more) actuator drive signals ADS1 to ADSn having positive and negative polarities to one or more (or more) actuators 30-1 to 30-n.

[0139] In the sound driving circuit 101 according to another embodiment of the present disclosure, the audio processor 110, the signal conversion circuit 120, the amplifier circuit 130, and the preamplifier circuit 140 may be mounted on a single printed circuit board (PCB). For example, in the PCB, the signal line 101L between the first preamplifier circuit 141 of the preamplifier circuit 140 and the first amplifier circuit 131 of the amplifier circuit 130 may be disconnected, or there may be no signal line between the first preamplifier circuit 141 and the first amplifier circuit 131. Therefore, the first input audio signal IAS1 output from the preamplifier circuit 140 may not be provided to the amplifier circuit 130 (e.g., via the disconnected signal line 101L) but may be provided only to the signal conversion circuit 120.

[0140] The vibration device 10 can vibrate (or shift) based on the piezoelectric drive signal PDS applied from the first amplifier circuit 131 in the sound drive circuit 101 (or the amplifier circuit 130 of the sound drive circuit 101) so as to output (or generate) sound (or vibration or sound waves), which can prevent overcurrent and clipping phenomena occurring in the high-pitched vocal band (or high-frequency area), and can improve the valley phenomenon in the first-pitched vocal band and the peak phenomenon in the second-pitched vocal band, thereby enhancing the sound characteristics and / or sound pressure level characteristics.

[0141] Each of the plurality of actuators 30-1 to 30-n may be configured to generate (or output) sound (or vibration) by vibration (or drive) based on actuator drive signals ADS1 to ADSn applied from corresponding second amplifier circuits among the plurality of second amplifier circuits 132-1 to 132-n in the sound drive circuit 101 (or the amplifier circuit 130 of the sound drive circuit 101).

[0142] In the sound driving circuit 101 according to another embodiment of the present disclosure, the audio processor 110, the amplifier circuit 130, and the preamplifier circuit 140 can be considered as a conventional sound driving circuit for a speaker. For example, the sound driving circuit 101 according to another embodiment of the present disclosure may include a signal conversion circuit 120 connected between the preamplifier circuit 140 and the amplifier circuit 130 in the conventional sound driving circuit of the speaker. Therefore, since the sound driving circuit 101 according to another embodiment of the present disclosure includes the signal conversion circuit 120 added to the conventional sound driving circuit of the speaker, the sound driving circuit 101 can drive (or vibrate or displace) an actuator including a magnet and a coil, and can also drive a piezoelectric vibration device 10, and can prevent overcurrent and clipping phenomena from occurring in the high-pitched vocal range (or high-frequency region) when the vibration device 10 is driven (or vibrated or displaced).

[0143] Figure 6 A sound device according to another embodiment of the present disclosure is shown. Figure 7 According to one embodiment of the present disclosure Figure 6 A cross-sectional view taken along line II′ in FIG. Figure 8 FIG. 1 is a diagram showing another embodiment according to the present disclosure. Figure 6 An exploded perspective view of the sound device shown.

[0144] Reference Figures 6 to 8 , a sound device 200 according to another embodiment of the present disclosure may include a vibration member 210 , a support member 230 , a vibration device 10 , and a driving circuit part 100 .

[0145] The vibration member 210 may generate vibration or output sound (or sound wave or sound pressure level) S based on the vibration (or displacement) of the vibration device 10. For example, the vibration member 210 may be a vibration plate, a sound plate, a diaphragm, a sound output plate, or a sound vibration plate, but the embodiments of the present disclosure are not limited thereto.

[0146] The support member 230 may be disposed at a peripheral portion of the vibration member 210. The support member 230 may have an inner space 230S and may be configured to support the vibration member 210. For example, the support member 230 may be configured to accommodate the vibration member 210. For example, the support member 230 may be a housing, an outer housing, a housing member, a housing, a housing member, a cabinet, or an enclosure, but embodiments of the present disclosure are not limited thereto.

[0147] According to one embodiment of the present disclosure, the support member 230 may be configured to be transparent, translucent, or opaque. For example, the support member 230 may include one or more of a metal material and a non-metal material (or a composite non-metal material), but the embodiments of the present disclosure are not limited thereto. For example, the support member 230 may include one or more of a metal material, plastic, or wood, but the embodiments of the present disclosure are not limited thereto.

[0148] The support member 230 according to one embodiment of the present disclosure may include a bottom portion 231 and a sidewall portion 233 .

[0149] The bottom portion 231 may be disposed to be spaced apart from the vibration member 210. The bottom portion 231 may be disposed to face a rear surface of the vibration member 210.

[0150] The sidewall portion 233 may be configured or provided at the peripheral portion of the bottom portion 231. For example, the sidewall portion 233 may be vertically connected to the peripheral portion of the bottom portion 231. For example, the sidewall portion 233 may include a structure bent from the peripheral portion of the bottom portion 231, but the embodiments of the present disclosure are not limited thereto.

[0151] The sidewall portion 233 may be configured to support the vibration member 210. For example, the sidewall portion 233 may be configured to support a peripheral portion of the vibration member 210. For example, the sidewall portion 233 may be configured to support the vibration member 210 and surround a side surface of the vibration member 210.

[0152] According to one embodiment of the present disclosure, the sidewall portion 233 may be integrated with the bottom portion 231. For example, the bottom portion 231 and the sidewall portion 233 may be integrated into one body (a single body), and thus, the inner space 200S surrounded by the sidewall portion 233 may be provided above the bottom portion 231. Therefore, the support member 230 may include a box shape in which one side (or upper side) is opened by the bottom portion 231 and the sidewall portion 233.

[0153] The sidewall portion 233 according to one embodiment of the present disclosure may include a first support surface 233a. The first support surface 233a may be configured to support a peripheral portion of the vibration member 210. For example, the first support surface 233a may protrude from the inner surface of the sidewall portion 233. The vibration member 210 may be connected or coupled to the first support surface 233a using the coupling member 220. For example, the rear peripheral portion of the vibration member 210 may be connected or coupled to the first support surface 233a using the coupling member 220.

[0154] The vibration device 10 may be configured to vibrate the vibration member 210. The vibration device 10 may be a piezoelectric type vibration device including a piezoelectric material.

[0155] The vibration device 10 may be disposed or configured on any one of the first surface (or front surface or upper surface) and the second surface (or rear surface or lower surface) opposite to the first surface of the vibration member 210. For example, the vibration device 10 may be disposed or configured on the second surface of the vibration member 210, but the embodiments of the present disclosure are not limited thereto. For example, the vibration device 10 may be disposed or configured on each of the first surface and the second surface of the vibration member 210. For example, the vibration device 10 may be disposed or configured on one or more of the first surface and the second surface of the vibration member 210.

[0156] The vibration device 10 can be connected or coupled to the vibration member 210 via the connection member 215. For example, the vibration device 10 can be connected or coupled to one or more of the first surface and the second surface of the vibration member 210 using the connection member 215. Therefore, the vibration member 210 can vibrate based on the vibration (or displacement) of the vibration device 10 to generate one or more of vibration and sound. For example, the vibration device 10 can use the vibration member 210 as a vibration plate to generate one or more of vibration and sound.

[0157] The driving circuit portion 100 may be electrically connected to the vibration device 10 through the signal supply member 17. The driving circuit portion 100 may be configured to apply a piezoelectric driving signal to the vibration device 10 through the signal supply member 17. The driving circuit portion 100 may include the aforementioned Figures 1 to 5 The sound driving circuit 101 is described above, and therefore, a repeated description thereof is omitted.

[0158] The vibration device 10 can vibrate (or displace) based on the piezoelectric drive signal applied from the sound drive circuit 101 through the signal supply member 17 to vibrate the vibration member 210. Therefore, the vibration device 10 can prevent the overcurrent phenomenon and the clipping phenomenon that occur in the high-pitched vocal range (or high-frequency region), and can improve the valley phenomenon in the first-pitched vocal range and the peak phenomenon in the second-pitched vocal range, thereby enhancing the sound characteristics and / or sound pressure level characteristics.

[0159] The driving circuit portion 100 according to one embodiment of the present disclosure may further include a signal cable 103 and a connector 105 .

[0160] The signal cable 103 may be electrically connected to a printed circuit board (PCB) 102 of the driving circuit part 100 .

[0161] The connector 105 may be provided or arranged at the support member 230 and may be configured to be electrically connected to the signal cable 103. A portion of the connector 105 may pass through the side wall portion 233 of the support member 230 and may be accommodated in the internal space 230S. For example, the connector 105 may be inserted (or accommodated) into a portion of the side wall portion 233 of the support member 230. For example, the support member 230 may further include a connector insertion hole (or connector accommodation hole) 233h provided at the side wall portion 233, so that a portion (or inner portion) of the connector 105 is inserted (or accommodated) therein. For example, a waterproof member (or waterproof adhesive or waterproof tape) may be provided or interposed between the connector insertion hole and the connector 105.

[0162] The sound device 200 according to another embodiment of the present disclosure may further include a cover 250 .

[0163] The cover 250 may be configured to cover the vibration member 210. The cover 250 may be configured to protect the vibration member 210 and the vibration device 10. For example, the cover 250 may be supported by the support member 230 so as to cover the first surface of the vibration member 210. For example, the cover 250 may be supported by the support member 230 so as to be spaced apart from the first surface of the vibration member 210. For example, the cover 250 may be supported by the support member 230 with a gap space GS therebetween.

[0164] The sidewall portion 233 according to one embodiment of the present disclosure may include a second support surface 233b. The second support surface 233b may be configured to support a peripheral portion of the cover 250. For example, the second support surface 233b may be formed in a recessed manner from the inner side surface and the uppermost surface of the sidewall portion 233. The second support surface 233b may be located between the uppermost surface of the sidewall portion 233 and the first support surface 233a.

[0165] The support member 230 according to one embodiment of the present disclosure may further include a protrusion portion 233c. For example, the protrusion portion 233c may protrude from the upper outer surface of the sidewall portion 233 so as to have a predetermined width.

[0166] The cover 250 according to one embodiment of the present disclosure may be detachably coupled to the sidewall portion 233 of the support member 230 by a hook coupling scheme, but the embodiments of the present disclosure are not limited thereto. For example, the cover 250 according to another embodiment of the present disclosure may be attached to the second support surface 233b of the support member 230 by using an attachment member.

[0167] The cover 250 according to one embodiment of the present disclosure may include a sound emission portion (or sound emission port) 251. The sound emission portion 251 may be formed to vertically penetrate the cover 250 along the thickness direction Z of the cover 250. Therefore, the sound (or sound wave) S generated by the vibration (or displacement) of the vibration member 210 based on the vibration (or displacement) of the vibration device 10 can be output to the outside through the sound emission portion 251 of the cover 250.

[0168] The sound emitting portion 251 according to one embodiment of the present disclosure may include one or more holes formed to overlap (or correspond to) the center of the vibration device 10. The sound emitting portion 251 according to another embodiment of the present disclosure may include one or more holes based on a lattice structure or a radial lattice structure.

[0169] Figure 9 is a cross-sectional view illustrating a device according to one embodiment of the present disclosure.

[0170] Reference Figure 9 , the device according to one embodiment of the present disclosure may be a device for outputting sound. For example, the device according to one embodiment of the present disclosure may be a device for outputting one or more of sound and vibration. For example, the device according to one embodiment of the present disclosure may implement or realize a display device, a sound device, a sound output device, a vibration device, a vibration generating device, a sound bar, a sound system, a sound device for an electronic device, a sound device for a display, a sound device for a vehicle device, or a sound bar for a vehicle device, etc. For example, the vehicle device may include one or more seats and one or more glass windows. For example, the vehicle device may include a vehicle, a train, a ship, or an aircraft, but the embodiments of the present disclosure are not limited thereto. In addition, the device according to one embodiment of the present disclosure may implement or realize analog signage or digital signage, etc., such as advertising signs, posters, or bulletin boards, etc.

[0171] The device according to one embodiment of the present disclosure may include a passive vibration member 300 , a vibration device 10 , and a driving circuit part 100 .

[0172] The passive vibration member 300 may vibrate based on the vibration (or displacement) of the vibration device 10. For example, the passive vibration member 300 may generate one or more of vibration and sound based on the driving of the vibration device 10.

[0173] The passive vibration member 300 according to one embodiment of the present disclosure can be a display panel, which includes a display area (or screen) with multiple pixels, and the multiple pixels realize black / white or color images. Therefore, the passive vibration member 300 can generate one or more of vibration and sound based on the drive of the vibration device 10. For example, the passive vibration member 300 can vibrate based on the vibration of the vibration device 10 while the display area displays an image, and thus can generate or output a sound synchronized with the image displayed on the display area. For example, the passive vibration member 300 can be a vibrating object, a display member, a display panel, a sign panel, a vibration plate, a passive vibration plate, a front cover, a front member, a vibration panel, a sound panel, a passive vibration panel, a sound output plate, a sound vibration plate or an image screen, etc., but the embodiments of the present disclosure are not limited thereto.

[0174] According to another embodiment of the present disclosure, the passive vibration member 300 may be configured with a material having material properties suitable for being vibrated by the vibration device 10 in order to output sound. The passive vibration member 300 may include a metal material or a non-metallic material (or a composite non-metallic material), but the embodiments of the present disclosure are not limited thereto. For example, the passive vibration member 300 may include one or more materials selected from metal, plastic, paper, wood, fiber, cloth, leather, glass, carbon, and a reflector, but the embodiments of the present disclosure are not limited thereto. For example, the paper may be a cone-shaped paper for a speaker. For example, the cone-shaped paper may be pulp or foam plastic, etc., but the embodiments of the present disclosure are not limited thereto.

[0175] According to another embodiment of the present disclosure, the passive vibration component 300 may include a display panel including pixels for displaying an image, or may include a non-display panel. For example, the passive vibration component 300 may include one or more display panels (including pixels for displaying an image), a screen panel (to which an image is projected from a display device), a lighting panel, a signage panel, a vehicle interior material, a vehicle exterior material, a vehicle glass window, a vehicle seat interior material, a vehicle ceiling material, a building ceiling material, a building interior material, a building glass window, an aircraft interior material, an aircraft glass window, and a reflector, but the embodiments of the present disclosure are not limited thereto. For example, the non-display panel may be a light emitting diode lighting panel (or device), an organic light emitting lighting panel (or device), an inorganic light emitting lighting panel (or device), a mini light emitting diode panel (or device), or a micro light emitting diode panel (or device), but the embodiments of the present disclosure are not limited thereto.

[0176] The vibration device 10 may be configured to vibrate the passive vibration member 300. The vibration device 10 may be a piezoelectric vibration device including a piezoelectric material. For example, the vibration device 10 may be configured to be transparent, translucent, or opaque.

[0177] The vibration device 10 can be connected or coupled to the passive vibration member 300 via a connecting member 350. For example, the vibration device 10 can be connected to the rear surface of the passive vibration member 300 using the connecting member 350. Thus, the passive vibration member 300 can vibrate based on the vibration (or displacement) of the vibration device 10 to generate one or more of vibration and sound. For example, the vibration device 10 can use the passive vibration member 300 as a vibration plate to generate one or more of vibration and sound.

[0178] The driving circuit portion 100 may be electrically connected to the vibration device 10 through the signal supply member 17. The driving circuit portion 100 may be configured to apply a piezoelectric driving signal to the vibration device 10 through the signal supply member 17. The driving circuit portion 100 may include the above-mentioned Figures 1 to 5 The sound driving circuit 101 is described above, and therefore, a repeated description thereof is omitted.

[0179] The vibration device 10 can vibrate (or displace) based on the piezoelectric drive signal applied from the sound drive circuit 101 through the signal supply member 17 to vibrate the passive vibration member 300. Therefore, the vibration device 10 can prevent the overcurrent phenomenon and the clipping phenomenon that occur in the high-pitched vocal range (or high-frequency region), and can improve the valley phenomenon in the first-pitched vocal range and the peak phenomenon in the second-pitched vocal range, thereby enhancing the sound characteristics and / or sound pressure level characteristics.

[0180] Figure 10 is a cross-sectional view showing a vehicle device according to one embodiment of the present disclosure.

[0181] Reference Figure 10 According to one embodiment of the present disclosure, the vehicle device 400 may be a vehicle device including one or more seats and one or more windows. For example, the vehicle device 400 may include a vehicle, a train, a ship, an aircraft, etc., but the embodiments of the present disclosure are not limited thereto.

[0182] Vehicular device 400 may include a primary structure 410 , an exterior material 420 , and an interior material 430 .

[0183] The primary structure 410 may be a vehicle body, a vehicle structure, or a frame structure, but the embodiments of the present disclosure are not limited thereto. For example, the primary structure 410 may include a main frame, a sub-frame, a side frame, a door frame, a bottom frame, and a seat frame, but the embodiments of the present disclosure are not limited thereto.

[0184] The exterior material 420 may be configured to cover the primary structure 410. For example, the exterior material 420 may be configured to cover an exterior portion of the primary structure 410. In the following description, the exterior material 420 may be referred to as a vehicle exterior material 420 and may be used interchangeably. For example, the vehicle exterior material 420 may include at least one or more of a hood panel, a front fender panel, an instrument panel, a pillar panel, a trunk panel, a roof panel (or ceiling), a floor panel, a door panel, an inner door panel and an outer door panel, a front bumper, a rear bumper, a spoiler, headlights, taillights, fog lights, and a bottom portion of a vehicle body, but the embodiments of the present disclosure are not limited thereto.

[0185] The vehicle exterior material 420 according to one embodiment of the present disclosure may include at least one or more of a planar portion (or flat portion) and a curved portion (or flexed portion or uneven portion). For example, the vehicle exterior material 420 may have a structure corresponding to that of the corresponding main structure 410, or may have a structure different from that of the corresponding main structure 410.

[0186] In the following description, interior material 430 may be referred to as vehicle interior material 430 and may be used interchangeably. Vehicle interior material 430 may include all elements (or components) constituting the interior of vehicle device 400, or may include all elements disposed in interior space (or indoor space) IS of vehicle device 400. For example, vehicle interior material 430 may be an interior member or interior decoration material of vehicle device 400, but embodiments of the present disclosure are not limited thereto.

[0187] The vehicle interior material 430 according to one embodiment of the present disclosure may be configured to cover one or more of the primary structure 410 and the vehicle exterior material 420 in the interior space IS. For example, the vehicle interior material 430 may cover one or more of the primary structure 410 and the vehicle exterior material 420 in the interior space IS of the vehicle device 400 and may be configured to be exposed in the interior space IS of the vehicle device 400.

[0188] The vehicle interior material 430 according to one embodiment of the present disclosure may be configured to be exposed in an interior portion and / or interior space IS of the vehicle device 400. For example, the vehicle interior material 430 may be configured to cover one surface (or inner surface) of one or more of a main frame (or vehicle body), a side frame (or side body), a door frame (or door body), a handle frame (or steering wheel hub), and a seat frame that are exposed in the interior space IS of the vehicle device 400.

[0189] According to one embodiment of the present disclosure, the vehicle interior material 430 may include an instrument panel, pillar interior materials (or pillar decorations), floor interior materials (or carpets), top interior materials (or roof linings), door interior materials (or door decorations), handle interior materials (or steering wheel covers), seat interior materials, rear packaging interior materials (or rear seat shelves), overhead consoles (or lighting interior materials), rearview mirrors, glove boxes, sun visors, etc., but the embodiments of the present disclosure are not limited thereto.

[0190] According to one embodiment of the present disclosure, the vehicle interior material 430 may include one or more of metal, wood, rubber, plastic, glass, fiber, cloth, paper, reflector, leather, and carbon, but the embodiments of the present disclosure are not limited thereto. The vehicle interior material 430 including a plastic material may be an injection material made by an injection process using a thermoplastic resin or a thermosetting resin, but the embodiments of the present disclosure are not limited thereto. The vehicle interior material 430 including a fiber material may include at least one or more of plastic composite fiber, carbon fiber (or aramid fiber), and natural fiber, but the embodiments of the present disclosure are not limited thereto. The vehicle interior material 430 including a cloth material may include a textile sheet, a knitted sheet, or a non-woven fabric, but the embodiments of the present disclosure are not limited thereto. For example, the paper may be a cone paper for a speaker. For example, the cone paper may be pulp or foam plastic, but the embodiments of the present disclosure are not limited thereto. The vehicle interior material 430 including a leather material may include natural leather or artificial leather, but the embodiments of the present disclosure are not limited thereto.

[0191] The vehicle interior material 430 according to one embodiment of the present disclosure may include at least one or more of a planar portion (or flat portion) and a curved portion (or flexed portion or uneven portion). For example, the vehicle interior material 430 may have a structure corresponding to the structure (or inner surface structure) of the corresponding main structure 410, or may have a structure different from the structure of the corresponding main structure 410.

[0192] The vehicle device 400 according to one embodiment of the present disclosure may include one or more sound generating devices 450 .

[0193] The one or more sound generating devices 450 may be configured to output sound from an area between, one or more of, the vehicle exterior material 420 and the vehicle interior material 430 .

[0194] According to one embodiment of the present disclosure, one or more sound generating devices 450 may be disposed on a vehicle interior material 430. The one or more sound generating devices 450 may vibrate (or directly vibrate) the vehicle interior material 430 to generate sound S based on the vibration of the vehicle interior material 430. For example, the one or more sound generating devices 450 may be configured to vibrate the vehicle interior material 430 to output sound S to an interior portion and / or interior space IS of the vehicle device 400. Thus, the one or more sound generating devices 450 may use the vehicle interior material 430 as a sound vibration plate. The vehicle interior material 430 may be a vibration plate, a sound vibration plate, or a sound generating plate for outputting sound S, but embodiments of the present disclosure are not limited thereto. For example, the vehicle interior material 430 may have a size that is larger than the size of the one or more sound generating devices 450, but embodiments of the present disclosure are not limited thereto.

[0195] According to one embodiment of the present disclosure, one or more sound generating devices 450 may be disposed in at least one or more of the instrument panel, pillar interior material, floor interior material, roof interior material, door interior material, handle interior material, and seat interior material, or may be disposed in or connected to (or coupled to) at least one or more of the rear package interior material, overhead console, rearview mirror, glove box, and sun visor. For example, the one or more sound generating devices 450 may vibrate (or directly vibrate) at least one or more of the instrument panel, pillar interior material, floor interior material, roof interior material, door interior material, handle interior material, seat interior material, rear package interior material, overhead console, rearview mirror, glove box, and sun visor to output sound S toward the interior portion and / or interior space IS of the vehicle device 400.

[0196] According to one embodiment of the present disclosure, one or more sound generating devices 450 may be disposed in or connected to at least one or more regions (or portions) of the vehicle interior material 430. The one or more sound generating devices 450 may vibrate at least one or more regions (or portions) of the vehicle interior material 430 to output realistic sound S and / or stereo sound including multiple channels toward the interior space IS of the vehicle device 400.

[0197] According to one embodiment of the present disclosure, one or more sound generating devices 450 may be disposed in one or more of the areas between the vehicle interior material 430 and the main structure 410 and the areas between the vehicle interior material 430 and the vehicle exterior material 420 and may be configured to output sound S.

[0198] According to one embodiment of the present disclosure, one or more sound generating devices 450 may be disposed in one or more of an area between the vehicle interior material 430 and the main structure 410 and an area between the vehicle interior material 430 and the vehicle exterior material 420 , and may indirectly or directly vibrate one or more of the main structure 410 , the vehicle exterior material 420 , and the vehicle interior material 430 to output sound S. For example, one or more of the main structure 410 , the vehicle exterior material 420 , and the vehicle interior material 430 may output sound S based on the driving (or vibration or displacement) of the one or more sound generating devices 450 .

[0199] According to one embodiment of the present disclosure, one or more sound generating devices 450 may be disposed in one or more of the area (or first area) between the main structure 410 and the vehicle exterior material 420, the area (or second area) between the main structure 410 and the vehicle interior material 430, the vehicle exterior material 420, and the vehicle interior material 430, and may be configured to output sound. For example, one or more sound generating devices 450 may be disposed in one or more of the area (or first area) between the main structure 410 and the vehicle exterior material 420, the area (or second area) between the main structure 410 and the vehicle interior material 430, the vehicle exterior material 420, and the vehicle interior material 430, and may indirectly or directly vibrate one or more of the main structure 410, the vehicle exterior material 420, and the vehicle interior material 430.

[0200] According to one embodiment of the present disclosure, one or more of the vehicle exterior material 420 and the vehicle interior material 430 of the vehicle device 400 may be a vibration plate, a sound vibration plate, or a sound generating plate for outputting sound S. For example, each of the vehicle exterior material 420 and the vehicle interior material 430 for outputting sound S may have a size (or area) larger than the size (or area) of the one or more sound generating devices 450, and thus may function as a large-area vibration plate, a large-area sound vibration plate, or a large-area sound generating plate, thereby enhancing the sound characteristics and / or sound pressure level characteristics of the tonal vocal range, including the low-pitched vocal range, generated by the sound generating device 450. For example, the frequency of the sound of the low-pitched vocal range may be 300 Hz or lower, 400 Hz or lower, or 500 Hz or lower, but the embodiments of the present disclosure are not limited thereto.

[0201] One or more sound generating devices 450 according to an embodiment of the present disclosure may include a vibration device 10 and a driving circuit portion 100 .

[0202] The vibration device 10 may be a piezoelectric type vibration device including a piezoelectric material.

[0203] The vibration device 10 according to one embodiment of the present disclosure may be disposed in one or more of an area between the vehicle interior material 430 and the main structure 410 and an area between the vehicle interior material 430 and the vehicle exterior material 420 and may be configured to output sound.

[0204] According to another embodiment of the present disclosure, the vibration device 10 may be disposed in one or more of the areas between the vehicle interior material 430 and the main structure 410 and the areas between the vehicle interior material 430 and the vehicle exterior material 420, and may indirectly or directly vibrate one or more of the main structure 410, the vehicle exterior material 420, and the vehicle interior material 430 to output sound S.

[0205] According to another embodiment of the present disclosure, the vibration device 10 may be disposed in an area (or first area) between the main structure 410 and the vehicle exterior material 420, an area (or second area) between the main structure 410 and the vehicle interior material 430, or one or more of the vehicle exterior material 420 and the vehicle interior material 430, and may indirectly or directly vibrate one or more 430 of the main structure 410, the vehicle exterior material 420, and the vehicle interior material 430 to output sound.

[0206] The vibration device 10 according to another embodiment of the present disclosure can be connected or coupled to one or more of the main structure 410, the vehicle exterior material 420, and the vehicle interior material 430 by using a connecting member. Therefore, one or more of the main structure 410, the vehicle exterior material 420, and the vehicle interior material 430 can vibrate based on the vibration (or displacement) of the vibration device 10 to generate (or output) one or more of vibration and sound.

[0207] The driving circuit portion 100 may be electrically connected to the vibration device 10 through the signal supply member 17. The driving circuit portion 100 may be configured to apply a piezoelectric driving signal to the vibration device 10 through the signal supply member 17. The driving circuit portion 100 may include the above-mentioned Figures 1 to 5 The sound driving circuit 101 is described above, and therefore, a repeated description thereof is omitted.

[0208] The vibration device 10 can vibrate (or displace) based on the piezoelectric drive signal applied from the sound drive circuit 101 through the signal supply member 17 to vibrate one or more of the vehicle exterior material 420 and the vehicle interior material 430. Therefore, the vibration device 10 can prevent the overcurrent phenomenon and the clipping phenomenon that occur in the high-pitched sound band (or high-frequency region), and can improve the valley phenomenon in the first tone sound band and the peak phenomenon in the second tone sound band, thereby enhancing the sound characteristics and / or sound pressure level characteristics.

[0209] The vehicle device 400 according to one embodiment of the present disclosure may further include a woofer speaker provided in at least one or more of the instrument panel, the door frame, and the rear package inner material.

[0210] The woofer according to one embodiment of the present disclosure may include one or more of a woofer, a mid-woofer, and a sub-woofer, but the embodiments of the present disclosure are not limited thereto. For example, the woofer may be a speaker that outputs sounds from about 60 Hz to about 150 Hz, but the embodiments of the present disclosure are not limited thereto. Therefore, the woofer may output sounds from about 60 Hz to about 150 Hz, and thus may enhance the low-pitched vocal characteristics of the sounds output to the interior space.

[0211] The woofer can be based on the signal supply member 17 from above reference Figure 4 and Figure 5 The sound driving circuit 101 of the driving circuit section 100 in the described sound device is driven (or vibrated) by an actuator driving signal applied thereto, so as to generate (or output) sound.

[0212] According to one embodiment of the present disclosure, when the vehicle device 400 includes a vibration device 10 and one or more woofers, the sound driving circuit 101 of the driving circuit part 100 can drive (or vibrate) the vibration device 10 and one or more woofers respectively, but the embodiments of the present disclosure are not limited to this.

[0213] Figure 11 is a perspective view showing a vehicle device according to another embodiment of the present disclosure. Figure 12 According to one embodiment of the present disclosure Figure 11 A cross-sectional view taken along line II-II' is shown in FIG.

[0214] Reference Figure 11 and 12 , a vehicle device 400 according to another embodiment of the present disclosure may include a vehicle interior material 430 and one or more sound generating devices 450 .

[0215] The vehicle interior material 430 may include all elements (or parts) constituting the interior portion of the vehicle device 400, or may include all elements disposed in the interior space IS of the vehicle device 400. The vehicle interior material 430 may be the same as that described above with reference to FIG. Figure 10 The vehicle interior material 430 described is the same or substantially the same, and therefore, repeated description thereof is omitted. For example, the vehicle interior material 430 may be a roof interior material (or a roof lining), but the embodiments of the present disclosure are not limited thereto.

[0216] One or more sound generating devices 450 may be disposed or mounted on the vehicle interior material 430 .

[0217] The one or more sound generating devices 450 may include the above referenced Figures 6 to 8 The sound device 200 is described, and therefore, a repeated description thereof may be omitted or briefly given below.

[0218] The sound device 200 may be accommodated in a hole 433h provided in the vehicle interior material 430. For example, the support member 230 of the sound device 200 may be accommodated (or inserted) in the hole 433h of the vehicle interior material 430 in the interior space IS of the vehicle device 400. For example, the protrusion 233c of the support member 230 may be in contact with the inner surface 430i of the vehicle interior material 430.

[0219] The vibration device 10 of the sound device 200 can vibrate (or displace or drive) based on the piezoelectric driving signal applied from the sound driving circuit 101 of the driving circuit part 100 through the signal supply member 17 to output the sound S to the interior space IS of the vehicle device 400.

[0220] Figure 13 is a perspective view illustrating a vibration device according to one embodiment of the present disclosure. Figure 14 According to one embodiment of the present disclosure Figure 13 A cross-sectional view taken along line III-III' is shown in FIG. Figure 15 According to one embodiment of the present disclosure Figure 13 Specifically, Figures 13 to 15 Shown above reference Figures 1 to 12 Describe the vibration device.

[0221] Reference Figures 13 to 15 , the vibration device 10 according to one embodiment of the present disclosure may include a piezoelectric material having piezoelectric characteristics.

[0222] The vibration device 10 may be configured as a ceramic-based piezoelectric material for achieving relatively strong vibration, or may be configured as a piezoelectric ceramic having a perovskite-based crystal structure.

[0223] The vibration device 10 according to one embodiment of the present disclosure may include a vibration part 11 .

[0224] The vibration portion 11 may be configured to vibrate via the piezoelectric effect based on a piezoelectric drive signal. The vibration portion 11 may include at least one or more of a piezoelectric inorganic material and a piezoelectric organic material. For example, the vibration portion 11 may be a vibration device, a piezoelectric device layer, a piezoelectric structure, a piezoelectric vibration portion, or a piezoelectric vibration layer, but the embodiments of the present disclosure are not limited thereto.

[0225] The vibration part 11 according to one embodiment of the present disclosure may include a vibration layer 11 a , a first electrode layer 11 b , and a second electrode layer 11 c .

[0226] The vibration layer 11a may include a piezoelectric material or an electroactive material having a piezoelectric effect. For example, a piezoelectric material may have the following characteristics: when pressure or distortion is applied to the crystal structure by an external force, a potential difference is generated due to dielectric polarization caused by the change in the relative positions of positive (+) ions and negative (-) ions, and vibration is generated by an electric field based on a reverse voltage applied thereto. For example, the vibration layer 11a may be a piezoelectric layer, a piezoelectric material layer, an electroactive layer, a piezoelectric composite material layer, a piezoelectric composite material, or a piezoelectric ceramic composite material, but the embodiments of the present disclosure are not limited thereto.

[0227] The vibration layer 11a may be configured as a ceramic-based material for achieving relatively strong vibration, or may be configured as a piezoelectric ceramic having a perovskite-based crystal structure. The perovskite crystal structure may have a piezoelectric effect and / or an inverse piezoelectric effect and may be an oriented plate-like structure.

[0228] The piezoelectric ceramic may be configured as a single crystal ceramic having a single crystal structure, or may be configured as a ceramic material or polycrystalline ceramic having a polycrystalline structure. The piezoelectric material including single crystal ceramics may include α-AlPO4, α-SiO2, LiNbO3, Tb2(MoO4)3, Li2B4O7 or ZnO, but the embodiments of the present disclosure are not limited thereto. The piezoelectric material including polycrystalline ceramics may include a material based on lead zirconate titanate (PZT), which includes lead (Pb), zirconium (Zr) and titanium (Ti), or may include a material based on lead zirconium nickel niobate (PZNN), which includes lead (Pb), zirconium (Zr), nickel (Ni) and niobium (Nb), but the embodiments of the present disclosure are not limited thereto. For example, the vibration layer 11a may include at least one or more of calcium titanate (CaTiO3), barium titanate (BaTiO3) and strontium titanate (SrTiO3), but does not include lead (Pb), but the embodiments of the present disclosure are not limited thereto.

[0229] The first electrode layer 11b may be provided at the first surface (or upper surface or front surface) 11s1 of the vibration layer 11a. The first electrode layer 11b may have the same size as the vibration layer 11a, or may have a size smaller than the size of the vibration layer 11a. For example, the first electrode layer 11b may have the same shape as the vibration layer 11a, but embodiments of the present disclosure are not limited thereto.

[0230] The second electrode layer 11c may be disposed on a second surface (or lower surface or rear surface) 11s2 of the vibration layer 11a that is opposite to or different from the first surface 11s1. The second electrode layer 11c may have the same size as the vibration layer 11a, or may have a size smaller than the size of the vibration layer 11a. For example, the second electrode layer 11c may have the same shape as the vibration layer 11a, but embodiments of the present disclosure are not limited thereto.

[0231] According to one embodiment of the present disclosure, one or more of the first electrode layer 11b and the second electrode layer 11c may be formed of a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the transparent conductive material or the semi-transparent conductive material may include indium tin oxide (ITO) or indium zinc oxide (IZO), but the embodiments of the present disclosure are not limited thereto. The opaque conductive material may include gold (Au), silver (Ag), platinum (Pt), palladium (Pd), molybdenum (Mo), magnesium (Mg), carbon, or silver (Ag) including glass frit, or may be formed of an alloy thereof, but the embodiments of the present disclosure are not limited thereto. In addition, in order to enhance the electrical and / or vibration characteristics of the vibration layer 11a, each of the first electrode layer 11b and the second electrode layer 11c may include silver (Ag) having low resistivity. In addition, the carbon may be carbon black, ketjen black, carbon nanotubes, and a carbon material including graphite, but the embodiments of the present disclosure are not limited thereto.

[0232] The vibration layer 11a can be polarized (or polarized) by applying a certain voltage to the first electrode layer 11b and the second electrode layer 11c in a certain temperature atmosphere, or in a temperature atmosphere that can change from high temperature to room temperature, but the embodiments of the present disclosure are not limited thereto. For example, the polarization direction (or polarization direction) formed in the vibration layer 11a can be formed or aligned (or arranged) from the first electrode layer 11b to the second electrode layer 11c, but is not limited thereto, and the polarization direction (or polarization direction) formed in the vibration layer 11a can be formed or aligned (or arranged) from the second electrode layer 11c to the first electrode layer 11b.

[0233] The vibration layer 11a can vibrate by alternately contracting and / or expanding based on the inverse piezoelectric effect in response to a piezoelectric drive signal applied externally to the first electrode layer 11b and the second electrode layer 11c. For example, the vibration layer 11a can vibrate in the vertical direction (or thickness direction) and in the planar direction by a piezoelectric drive signal applied to the first electrode layer 11b and the second electrode layer 11c. The vibration layer 11a can be displaced (or vibrated or driven) by contraction and / or expansion in the planar direction, thereby improving the sound characteristics and / or sound pressure level characteristics of the vibration device 10.

[0234] The vibration device 10 according to one embodiment of the present disclosure may further include a cover member 13 .

[0235] The cover member 13 may be configured to cover at least one or more of the first surface and the second surface of the vibration part 11. The cover member 13 may be configured to protect at least one or more of the first surface and the second surface of the vibration part 11. For example, the first surface of the vibration part 11 may be the front surface or the upper surface. For example, the second surface of the vibration part 11 may be the rear surface or the lower surface opposite to the first surface.

[0236] The covering member 13 according to one embodiment of the present disclosure may include a first covering member 13 a .

[0237] The first covering member 13a may be provided at the first surface of the vibration part 11. For example, the first covering member 13a may be configured to cover the first electrode layer 11b of the vibration part 11. For example, the first covering member 13a may be configured to have a larger size than the vibration part 11. The first covering member 13a may be configured to protect the first surface of the vibration part 11 and the first electrode layer 11b.

[0238] The first cover member 13a according to one embodiment of the present disclosure may include an adhesive layer. For example, the first cover member 13a may include a base film and an adhesive layer located in the base film and connected or coupled to the first surface of the vibration part 11. For example, the adhesive layer may include an electrically insulating material having adhesive properties and capable of compression and decompression, but the embodiments of the present disclosure are not limited thereto.

[0239] The first covering member 13a according to another embodiment of the present disclosure may be connected or coupled to the first surface of the vibration part 11 via the first adhesive layer 13b. For example, the first covering member 13a may be connected or coupled to the first surface of the vibration part 11 or the first electrode layer 11b via the first adhesive layer 13b. For example, the first covering member 13a may be connected or coupled to the first surface of the vibration part 11 or the first electrode layer 11b via the first adhesive layer 13b using a film lamination process. The first adhesive layer 13b may be configured to surround the entire first surface or a portion of a side surface of the vibration part 11.

[0240] The cover member 13 according to one embodiment of the present disclosure may include a second adhesive layer 13 c .

[0241] The second adhesive layer 13c may be provided on the second surface of the vibration part 11. For example, the second adhesive layer 13c may be configured to cover the second electrode layer 11c of the vibration part 11. The second adhesive layer 13c may be configured to protect the second surface and the second electrode layer 11c of the vibration part 11. The second adhesive layer 13c may be configured to surround the entire second surface or a portion of the side surface of the vibration part 11. For example, the second adhesive layer 13c may be a protective layer or a protective member, but embodiments of the present disclosure are not limited thereto.

[0242] The second adhesive layer 13c may be connected or coupled to the first adhesive layer 13b in the side surface of the vibration part 11 or the peripheral portion of the first covering member 13a. Therefore, the first adhesive layer 13b and the second adhesive layer 13c may be configured to surround or completely surround the vibration part 11. The first adhesive layer 13b and the second adhesive layer 13c may be configured to cover or surround all surfaces of the vibration part 11. For example, the vibration part 11 may be inserted (or accommodated) or embedded (or built-in) in the inner portion of the adhesive layer including the first adhesive layer 13b and the second adhesive layer 13c.

[0243] The cover member 13 according to one embodiment of the present disclosure may further include a second cover member 13 d , but embodiments of the present disclosure are not limited thereto.

[0244] The second cover member 13d may be provided at the second surface of the vibration part 11. For example, the second cover member 13d may be configured to cover the second electrode layer 11c of the vibration part 11. For example, the second cover member 13d may be configured to have a larger size than the vibration part 11 and may be configured to have the same size as the first cover member 13a, but embodiments of the present disclosure are not limited thereto. The second cover member 13d may be configured to protect the second surface of the vibration part 11 and the second electrode layer 11c.

[0245] According to one embodiment of the present disclosure, the first cover member 13a and the second cover member 13d may include the same material or different materials. For example, each of the first cover member 13a and the second cover member 13d may be a polyimide film, a polyethylene naphthalate film, or a polyethylene terephthalate film, but the embodiments of the present invention are not limited thereto.

[0246] The second cover member 13d may be connected or coupled to the second surface of the vibration part 11 or the second electrode layer 11c by using the second adhesive layer 13c. For example, the second cover member 13d may be connected or coupled to the second surface of the vibration part 11 or the second electrode layer 11c by using a film lamination process through the second adhesive layer 13c.

[0247] The vibration part 11 may be disposed or inserted (or accommodated) between the first cover member 13a and the second cover member 13d. For example, the vibration part 11 may be inserted (or accommodated) or embedded (or built-in) in an inner portion of the adhesive layer including the first adhesive layer 13b and the second adhesive layer 13c, but the embodiments of the present disclosure are not limited thereto.

[0248] According to one embodiment of the present disclosure, each of the first adhesive layer 13b and the second adhesive layer 13c may include an electrically insulating material having adhesive properties and capable of compression and decompression. For example, each of the first adhesive layer 13b and the second adhesive layer 13c may include epoxy resin, acrylic resin, silicone resin, polyurethane resin, pressure sensitive adhesive (PSA), optically clear adhesive (OCA), or optically clear resin (OCR), etc., but the embodiments of the present disclosure are not limited thereto.

[0249] The first and second adhesive layers 13b and 13c may be disposed between the first and second covering members 13a and 13d so as to surround the vibration portion 11. For example, one or more of the first and second adhesive layers 13b and 13c may be disposed to surround the vibration portion 11.

[0250] The vibration device 10 according to one embodiment of the present disclosure may further include a signal supply member 17 .

[0251] The signal supply member 17 may be configured to supply a piezoelectric driving signal supplied from the driving circuit portion to the vibration portion 11. The signal supply member 17 may be configured to be electrically connected to the vibration portion 11. The signal supply member 17 may be configured to be electrically connected to the first electrode layer 11b and the second electrode layer 11c of the vibration portion 11.

[0252] A portion of the signal supply member 17 may be accommodated (or inserted) between the cover member 13 and the vibration portion 11. For example, a portion of the signal supply member 17 may be accommodated (or inserted) between the first surface of the vibration portion 11 and the first cover member 13a. For example, a portion of the signal supply member 17 may be accommodated (or inserted) between the first cover member 13a and the second cover member 13d.

[0253] According to one embodiment of the present disclosure, an end portion (or distal end portion or one side) of the signal supply member 17 may be disposed or inserted (or accommodated) between one peripheral portion of the cover member 13 and the vibration portion 11. For example, an end portion of the signal supply member 17 may be disposed or inserted (or accommodated) between one peripheral portion of the first cover member 13a and the first surface of the vibration portion 11. For example, the signal supply member 17 may be configured as a signal cable, a flexible cable, a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board, a flexible multi-layer printed circuit, or a flexible multi-layer printed circuit board, but embodiments of the present disclosure are not limited thereto.

[0254] The signal supply member 17 according to one embodiment of the present disclosure may include a base member 17a and a plurality of signal lines 17b and 17c. For example, the signal supply member 17 may include a base member 17a, a first signal line 17b, and a second signal line 17c.

[0255] The base member 17 a may include a transparent or opaque plastic material, but embodiments of the present disclosure are not limited thereto.

[0256] The first signal line 17b and the second signal line 17c may be provided on the first surface of the base member 17a and may be spaced apart from each other or electrically isolated from each other. The first signal line 17b and the second signal line 17c may be provided parallel to each other on the first surface of the base member 17a. For example, the first signal line 17b and the second signal line 17c may be implemented in a line shape by patterning a metal layer (or conductive layer) formed or deposited on the first surface of the base member 17a.

[0257] Ends (or distal ends or one side) of the first signal line 17 b and the second signal line 17 c may be separated from each other and thus may be individually bent or folded.

[0258] The end of the first signal line 17b can be electrically connected to the first electrode layer 11b of the vibration part 11. For example, the end of the first signal line 17b can be electrically connected to at least a portion of the first electrode layer 11b of the vibration part 11 in a peripheral portion of the first cover member 13a. For example, the end of the first signal line 17b can be directly electrically connected to at least a portion of the first electrode layer 11b of the vibration part 11. For example, the end of the first signal line 17b can be electrically connected to or directly contact the first electrode layer 11b of the vibration part 11. For example, the end of the first signal line 17b can be electrically connected to the first electrode layer 11b via a conductive double-sided tape. Therefore, the first signal line 17b can be configured to provide the first piezoelectric drive signal component provided from the drive circuit part to the first electrode layer 11b of the vibration part 11.

[0259] The end of the second signal line 17c can be electrically connected to the second electrode layer 11c of the vibration part 11. For example, the end of the second signal line 17c can be electrically connected to at least a portion of the second electrode layer 11c of the vibration part 11 in a peripheral portion of the second cover member 13d. For example, the end of the second signal line 17c can be directly electrically connected to at least a portion of the second electrode layer 11c of the vibration part 11. For example, the end of the second signal line 17c can be electrically connected to or directly contact the second electrode layer 11c of the vibration part 11. For example, the end of the second signal line 17c can be electrically connected to the second electrode layer 11c via a conductive double-sided tape. Therefore, the second signal line 17c can be configured to provide the second piezoelectric drive signal component provided by the drive circuit portion to the second electrode layer 11c of the vibration part 11. The first piezoelectric drive signal component and the second piezoelectric drive signal component constitute the piezoelectric drive signal.

[0260] The signal supply member 17 according to one embodiment of the present disclosure may further include an insulating layer 17 d .

[0261] An insulating layer 17 d may be provided at the first surface of the base member 17 a so as to cover each of the first signal line 17 b and the second signal line 17 c (except for an end portion (or one side) of the signal supply member 17 ).

[0262] According to one embodiment of the present disclosure, an end (or one side) of the signal supply member 17 including an end (or one side) of the base member 17a and an end (or one side) of the insulating layer 17d can be inserted (or accommodated) between the covering member 13 and the vibration part 11, and can be fixed between the covering member 13 (or the first covering member 13a) and the vibration part 11 by the first adhesive layer 13b and the second adhesive layer 13c.

[0263] According to another embodiment of the present disclosure, the end (or one side) of the signal supply member 17, including the end of the base member 17a and the end of the insulating layer 17d, can be inserted (or accommodated) between the first cover member 13a and the second cover member 13d, and can be fixed between the first cover member 13a and the second cover member 13d via the first adhesive layer 13b and the second adhesive layer 13c. Therefore, the end of the first signal line 17b can remain electrically connected to the first electrode layer 11b of the vibration part 11, and the end of the second signal line 17c can remain electrically connected to the second electrode layer 11c of the vibration part 11. In addition, the end of the signal supply member 17 can be inserted (or accommodated) and fixed between the vibration part 11 and the first cover member 13a, thereby preventing contact defects between the vibration device 10 and the signal supply member 17 due to movement of the signal supply member 17. Alternatively, the end of the signal supply member 17 can be inserted (or accommodated) and fixed between the vibration part 11 and the second cover member 13d.

[0264] In the signal supply member 17 according to one embodiment of the present disclosure, each of the ends of the base member 17a and the ends of the insulating layer 17d can be arranged to be a certain distance away from the corresponding ends of the first signal line 17b and the corresponding ends of the second signal line 17c. For example, each of the ends of the first signal line 17b and the ends of the second signal line 17c can be exposed to the outside without being supported or covered by the ends of the base member 17a and the ends of the insulating layer 17d. For example, the ends of each of the first signal line 17b and the second signal line 17c can protrude (or extend) from the ends of the base member 17a or the ends of the insulating layer 17d and have a certain length. Therefore, the ends of each of the first signal line 17b and the second signal line 17c can be bent individually or independently.

[0265] An end portion of the first signal line 17b that is not supported by an end portion of the base member 17a and an end portion of the insulating layer 17d may be directly connected to or in direct contact with the first electrode layer 11b of the vibration portion 11. An end portion of the second signal line 17c that is not supported by an end portion of the base member 17a and an end portion of the insulating layer 17d may be directly connected to or in direct contact with the second electrode layer 11c of the vibration portion 11.

[0266] According to one embodiment of the present disclosure, a portion of the signal supply member 17 or a portion of the base member 17a can be disposed or inserted (or accommodated) between the cover member 13 and the vibration portion 11, thereby allowing the signal supply member 17 to be integrated with the vibration portion 11. Furthermore, a portion of the signal supply member 17 or a portion 17a of the base member 17a can be disposed or inserted (or accommodated) between the first cover member 13a and the second cover member 13d, thereby allowing the signal supply member 17 to be integrated with the vibration device 10. Therefore, the vibration device 10 and the signal supply member 17 can be configured as one part (or one element or one component), thereby achieving a uni-materialization effect.

[0267] According to one embodiment of the present disclosure, the first signal line 17b and the second signal line 17c of the signal supply member 17 can be integrated with the vibration device 10, and thus, there is no need for a welding process for electrically connecting the vibration device 10 and the signal supply member 17. Therefore, the manufacturing process and structure of the vibration device 10 can be simplified, and the risks associated with the welding process can be reduced.

[0268] Figure 16 is a perspective view showing a vibration layer according to another embodiment of the present disclosure. For example, Figure 16 Shown above reference Figures 13 to 15 Another embodiment of the vibration layer is described.

[0269] Reference Figure 14 and Figure 16 According to another embodiment of the present disclosure, the vibration layer 11a may include a plurality of first portions 11a1 and a plurality of second portions 11a2. For example, the plurality of first portions 11a1 and the plurality of second portions 11a2 may be alternately and repeatedly arranged along the first direction X (or the second direction Y).

[0270] Each of the plurality of first portions 11a1 may include an inorganic material portion having a piezoelectric effect (or piezoelectric characteristics). For example, each of the plurality of first portions 11a1 may include at least one or more of a piezoelectric inorganic material and a piezoelectric organic material. For example, each of the plurality of first portions 11a1 may be an inorganic portion, an inorganic material portion, a piezoelectric portion, a piezoelectric material portion, or an electroactive portion, but embodiments of the present disclosure are not limited thereto.

[0271] According to one embodiment of the present disclosure, each of the plurality of first portions 11a1 may have a first width W1 parallel to the first direction X (or the second direction Y) and may extend along the second direction Y (or the first direction X). Figures 13 to 15 The vibration layer 11a described is substantially the same, and therefore, repeated description thereof is omitted.

[0272] Each of the plurality of second portions 11a2 may be disposed between the plurality of first portions 11a1. For example, each of the plurality of first portions 11a1 may be disposed between two adjacent second portions 11a2 among the plurality of second portions 11a2. Each of the plurality of second portions 11a2 may have a second width W2 parallel to the first direction X (or the second direction Y) and may extend along the second direction Y (or the first direction X). The first width W1 may be the same as or different from the second width W2. For example, the first width W1 may be greater than the second width W2. For example, the first portion 11a1 and the second portion 11a2 may include a line shape or a strip shape having the same size or different sizes, but the embodiments of the present disclosure are not limited thereto.

[0273] Each of the plurality of second parts 11a2 can be configured to fill a gap between two adjacent first parts in the plurality of first parts 11a1. Each of the plurality of second parts 11a2 can be configured to fill a gap between two adjacent first parts in the plurality of first parts 11a1, and thus can be connected or attached to the side surface of the first part 11a1 adjacent thereto. According to one embodiment of the present disclosure, each of the plurality of first parts 11a1 and the plurality of second parts 11a2 can be arranged (or arranged) parallel to each other on the same plane (or the same layer). Therefore, by the lateral coupling (or connection) of the first part 11a1 and the second part 11a2, the vibration layer 11a can be expanded to a desired size or length.

[0274] According to one embodiment of the present disclosure, each of the plurality of second portions 11a2 can absorb impact applied to the first portion 11a1, thereby enhancing the overall durability of the first portion 11a1 and providing flexibility to the vibration layer 11a. Each of the plurality of second portions 11a2 can include an organic material having ductile properties. For example, each of the plurality of second portions 11a2 can include one or more of an epoxy-based polymer, an acrylic-based polymer, and a silicone-based polymer, but the embodiments of the present disclosure are not limited thereto. For example, each of the plurality of second portions 11a2 can be an organic portion, an organic material portion, an adhesive portion, a stretchable portion, a flexural portion, a damping portion, or an extension portion, but the embodiments of the present disclosure are not limited thereto.

[0275] A first surface of each of the plurality of first portions 11a1 and the plurality of second portions 11a2 may be commonly connected to the first electrode layer 11b, and a second surface of each of the plurality of first portions 11a1 and the plurality of second portions 11a2 may be commonly connected to the second electrode layer 11c.

[0276] The plurality of first portions 11a1 and the plurality of second portions 11a2 may be arranged (or connected) on the same plane. Therefore, the vibration layer 11a according to another embodiment of the present disclosure may have a single film type. Therefore, according to another embodiment of the present disclosure, the vibration portion 11 including the vibration layer 11a of the vibration device 10 may vibrate via the first portions 11a1 having vibration characteristics and may be bent into a curved shape via the second portions 11a2 having flexibility.

[0277] Figure 17 is a perspective view showing a vibration layer according to another embodiment of the present disclosure. For example, Figure 17 Shown above reference Figures 13 to 15 Another embodiment of the vibration layer is described.

[0278] Reference Figure 14 and Figure 17, the vibration layer 11 a according to another embodiment of the present disclosure may include a plurality of first portions 11 a 3 and a second portion 11 a 4 disposed between the plurality of first portions 11 a 3 .

[0279] Each of the plurality of first portions 11a3 may be arranged to be spaced apart from each other along each of the first direction X and the second direction Y. For example, each of the plurality of first portions 11a3 may have a hexahedral shape of the same size and may be arranged in a lattice shape, but the embodiments of the present disclosure are not limited thereto. For example, each of the plurality of first portions 11a3 may have a circular plate, an elliptical plate, or a polygonal plate of the same size, but the embodiments of the present disclosure are not limited thereto.

[0280] Each of the plurality of first portions 11a3 may be the same as that referred to above. Figure 16 The first portion 11a1 described is substantially the same, and therefore, a repeated description thereof is omitted.

[0281] The second portion 11a4 may be disposed between the plurality of first portions 11a3 along each of the first direction X and the second direction Y. The second portion 11a4 may be configured to fill a gap between two adjacent first portions 11a3, or to be adjacent to or surround each of the plurality of first portions 11a3, and thus, the second portion 11a4 may be connected to or attached to the first portion 11a3 adjacent thereto. The second portion 11a4 may be configured to be similar to the first portion 11a3 described above. Figure 16 The second portion 11a2 described is substantially the same, and therefore, repeated description thereof is omitted.

[0282] A first surface of each of the plurality of first portions 11a3 and second portions 11a4 may be commonly connected to the first electrode layer 11b. A second surface of each of the plurality of first portions 11a3 and second portions 11a4 may be commonly connected to the second electrode layer 11c.

[0283] The plurality of first portions 11a3 and second portions 11a4 may be arranged (or connected) on the same plane. Therefore, the vibration layer 11a according to another embodiment of the present disclosure may have a single film type, but the embodiments of the present disclosure are not limited thereto. Therefore, according to another embodiment of the present disclosure, the vibration portion 11 including the vibration layer 11a of the vibration device 10 may vibrate via the first portion 11a3 having vibration characteristics and may be bent into a curved shape via the second portion 11a4 having flexibility.

[0284] Figure 18 : is an exploded perspective view showing a vibration device according to another embodiment of the present disclosure. For example, Figure 18 Shown above reference Figures 1 to 12 Describe the vibration device.

[0285] Reference Figure 18 The vibration device 10 according to another embodiment of the present disclosure may include two or more vibration generating parts 10-1 and 10-2. For example, the vibration device 10 may include a first vibration generating part 10-1 and a second vibration generating part 10-2.

[0286] The first vibration generating part 10-1 and the second vibration generating part 10-2 can overlap or stack with each other so as to shift (or drive or vibrate) in the same direction to maximize the amplitude displacement of the vibration device 10 or the amplitude displacement of the vibration component. For example, the first vibration generating part 10-1 and the second vibration generating part 10-2 may have substantially the same size, but the embodiments of the present disclosure are not limited thereto. For example, the first vibration generating part 10-1 and the second vibration generating part 10-2 may have substantially the same size within the error range of the manufacturing process, but the embodiments of the present disclosure are not limited thereto. Therefore, the first vibration generating part 10-1 and the second vibration generating part 10-2 can maximize the amplitude displacement of the vibration device 10 and / or the amplitude displacement of the vibration component.

[0287] Each of the first vibration generating part 10 - 1 and the second vibration generating part 10 - 2 may be the same as that described above with reference to Figures 13 to 17 The vibration device 10 described is the same or substantially the same, and therefore, the same reference numerals refer to the same elements and repeated descriptions thereof are omitted.

[0288] The vibration device 10 according to another embodiment of the present disclosure may further include an intermediate adhesive member 10M.

[0289] The intermediate adhesive member 10M may be disposed or connected between the first vibration generating part 10-1 and the second vibration generating part 10-2. As one embodiment of the present disclosure, the intermediate adhesive member 10M may be disposed or connected between the second adhesive layer 13c of the first vibration generating part 10-1 and the first covering member 13a of the second vibration generating part 10-2. As another embodiment of the present disclosure, the intermediate adhesive member 10M may be disposed or connected between the second covering member 13d of the first vibration generating part 10-1 and the first covering member 13a of the second vibration generating part 10-2. For example, the intermediate adhesive member 10M may be an intermediate member, an adhesive member, or a connecting member, but embodiments of the present disclosure are not limited thereto.

[0290] According to an embodiment of the present disclosure, the intermediate adhesive member 10M may be configured as a material including an adhesive layer that has good adhesion or adhesion to each of the first vibration generating part 10-1 and the second vibration generating part 10-2, but the embodiments of the present disclosure are not limited thereto. For example, the intermediate adhesive member 10M may include a foam pad, a double-sided tape, a double-sided foam tape, a double-sided foam pad, a double-sided adhesive tape or an adhesive, etc., but the embodiments of the present disclosure are not limited thereto. For example, the adhesive layer of the intermediate adhesive member 10M may include an epoxy resin, an acrylic resin, a silicone resin or a polyurethane, but the embodiments of the present disclosure are not limited thereto. For example, the adhesive layer of the intermediate adhesive member 10M may include a polyurethane-based material (or substance) having relatively ductile properties. Therefore, the vibration loss caused by the displacement interference between the first vibration generating part 10-1 and the second vibration generating part 10-2 can be reduced or minimized, or each of the first vibration generating part 10-1 and the second vibration generating part 10-2 can be freely displaced (or vibrated or driven).

[0291] According to another embodiment of the present disclosure, a vibration device 10 may include a first vibration generating portion 10-1 and a second vibration generating portion 10-2, which are stacked (or superimposed or overlapped) so as to vibrate (or shift or drive) in the same direction, thereby maximizing or increasing the displacement or amplitude displacement. Therefore, the displacement (or bending force or driving force) or amplitude displacement of the vibration member can be further maximized or increased, thereby further enhancing the sound characteristics and / or sound pressure level characteristics of the low-pitched vocal cords.

[0292] Figure 19 is a plan view showing a vehicle device according to another embodiment of the present disclosure. Figure 20 According to one embodiment of the present disclosure Figure 19 A cross-sectional view taken along line V-V' shown in FIG.

[0293] Reference Figure 19 and Figure 20 , a vehicle device 400 according to one embodiment of the present disclosure may include a vehicle body bottom 401 , a battery module 450 , and one or more virtual engine sound devices 470 .

[0294] The vehicle body bottom (or vehicle body floor) 401 may be a structure of the vehicle device 400. The vehicle body bottom 401 may be configured to support or cover the vehicle body lower frame 402. For example, the vehicle body bottom 401 may be a vehicle body panel or a vehicle body frame, but the embodiments of the present disclosure are not limited thereto.

[0295] The battery module 450 may be disposed at or mounted on the vehicle body bottom frame 402. For example, the battery module 450 may be disposed between the vehicle body bottom frame 402 and the vehicle body bottom 401. For example, the battery module 450 may be disposed so as to be covered by the vehicle body bottom 401.

[0296] The one or more virtual engine sound devices 470 may be devices (or apparatuses) for transmitting the position and / or driving information of the vehicle device 400 to pedestrians. For example, the one or more virtual engine sound devices 470 may be a virtual engine sound system or a vehicle approach information device, but the embodiments of the present disclosure are not limited thereto.

[0297] The one or more virtual engine sound devices 470 may include the above referenced Figures 6 to 8 For example, the one or more virtual engine sound devices 470 may be configured to output sounds or virtual engine sounds AVAS at 150 Hz to 20 kHz.

[0298] According to one embodiment of the present disclosure, one or more virtual engine sound devices 470 or the support member 230 of the sound device 200 may be disposed (or mounted) in an area between the battery module 450 and the vehicle body bottom 401 or in an area between the vehicle body bottom frame 402 and the vehicle body bottom 401. For example, the one or more virtual engine sound devices 470 may be configured to be covered by the vehicle body bottom 401. For example, the portion of the vehicle body bottom 401 that overlaps with the one or more virtual engine sound devices 470 may include one or more holes for outputting the sound (or virtual engine sound) outputted from the one or more virtual engine sound devices 470 in a ground direction (or surface direction) GD (AVAS).

[0299] According to another embodiment of the present disclosure, one or more virtual engine sound devices 470 may be accommodated (or received) in the vehicle body bottom 401. The vehicle body bottom 401 may include an accommodating portion 401a for accommodating (or receiving) the one or more virtual engine sound devices 470. For example, the accommodating portion 401a of the vehicle body bottom 401 may protrude from the vehicle body bottom 401 toward the battery module 450 to include an accommodating space.

[0300] According to another embodiment of the present disclosure, one or more virtual engine sound devices 470 can be accommodated (or received) in a receiving portion 401a of a vehicle body bottom 401 via a plurality of fastening members and can be fixed to (or mounted on) the vehicle body bottom 401. For example, the support member 230 of the sound device 200 configured in the one or more virtual engine sound devices 470 can be accommodated (or received) in the receiving portion 401a of the vehicle body bottom 401. For example, the protruding portion 233c of the support member 230 can contact the vehicle body bottom 401 around the perimeter of the receiving portion 401a of the vehicle body bottom 401. Thus, the one or more virtual engine sound devices 470 can be fixed to (or mounted on) the vehicle body bottom 401 and output sound (or virtual engine sound) AVAS toward the ground direction GD.

[0301] One or more virtual engine sound devices 470 may include a piezoelectric vibration device 10 and, therefore, may be lightweight and thin, and may output a sound (or virtual engine sound) AVAS having a wide directivity angle or a non-directivity angle based on the non-directional characteristics of the vibration device 10. One or more virtual engine sound devices 470 according to one embodiment of the present disclosure may output a sound (or virtual engine sound) AVAS having a wide directivity angle compared to a sound generated based on the vibration of an actuator including a magnet and a coil. For example, when one or more virtual engine sound devices 470 are arranged (or configured) to correspond to the center of the vehicle device 400 or the vehicle body bottom 401 in order to output the virtual engine sound AVAS, the one or more virtual engine sound devices 470 may output a uniform virtual engine sound AVAS in each of (toward) the forward direction, the rearward direction, the left direction, and the right direction relative to the center of the vehicle device 400 or the vehicle body bottom 401. The one or more virtual engine sound devices 470 according to one embodiment of the present disclosure may output a sound or virtual engine sound AVAS having a sound pressure level of 60 dB or more in a tone vocal band of 300 Hz or more, but the embodiments of the present disclosure are not limited thereto.

[0302] The vehicle device 400 according to one embodiment of the present disclosure may further include one or more actuators 30 .

[0303] One or more actuators 30 may be provided at one or more of the instrument panel 430A, the door frame 430B, and the rear package interior material 430C, but the embodiments of the present disclosure are not limited thereto. For example, one or more actuators 30 may be provided at one or more of the pillar interior material, the roof interior material, the door interior material, the seat interior material, the handle interior material, and the floor interior material, but the embodiments of the present disclosure are not limited thereto.

[0304] The one or more actuators 30 may include a magnet and a coil. The one or more actuators 30 may be one or more of a woofer, a mid-woofer, and a subwoofer, but the embodiments of the present disclosure are not limited thereto. For example, the one or more actuators 30 may be a speaker that outputs sounds from approximately 30 Hz to approximately 150 Hz, or approximately 300 Hz or lower, but the embodiments of the present disclosure are not limited thereto. Therefore, the one or more actuators 30 may output sounds from approximately 30 Hz to approximately 150 Hz, or approximately 300 Hz or lower, thereby enhancing the low-pitched vocal characteristics of the sounds output to the interior space.

[0305] One or more actuators 30 may be based on reference from above via the signal supply member 17 Figure 4 and Figure 5 The sound driving circuit 101 of the driving circuit section 100 in the described sound device is driven (or vibrated) by an actuator driving signal applied thereto, so as to generate (or output) sound.

[0306] According to one embodiment of the present disclosure, the sound driving circuit 101 of the driving circuit portion 100 may drive (or vibrate) one or more virtual engine sound devices 470 and one or more actuators 30 , respectively, but the embodiments of the present disclosure are not limited thereto.

[0307] A sound driving circuit, a sound device including the sound driving circuit, and a vehicle device including the sound device according to one or more embodiments of the present disclosure will be described below.

[0308] According to one or more embodiments of the present disclosure, a sound driving circuit may include: an audio processor that generates an input audio signal based on a sound source; a signal conversion circuit that converts the input audio signal into a piezoelectric audio signal; and an amplifier circuit that amplifies the piezoelectric audio signal to generate a piezoelectric driving signal for driving a piezoelectric vibration device.

[0309] According to one or more embodiments of the present disclosure, the signal conversion circuit may include a filter circuit that attenuates a high-pitched vocal cord signal of an input audio signal in order to generate a piezoelectric driving signal.

[0310] According to one or more embodiments of the present disclosure, the high-pitched vocal signal may have a frequency of 1 kHz or higher.

[0311] According to one or more embodiments of the present disclosure, the signal conversion circuit may further include: a correction circuit that increases a first pitch vocal band signal of an input audio signal and / or decreases a second pitch vocal band signal different from the first pitch vocal band signal to generate a first audio correction signal; a level control circuit that controls the volume level of the first audio correction signal to generate a second audio correction signal; and a clipping circuit that removes noise from the second audio correction signal to generate a third audio correction signal. The filter circuit may attenuate high-pitched vocal band signals of the third audio correction signal to generate the piezoelectric drive signal.

[0312] According to one or more embodiments of the present disclosure, the first pitch vocal band signal may have a frequency of 250 Hz to 600 Hz. The second pitch vocal band signal may have a frequency of 1 kHz or higher.

[0313] According to one or more embodiments of the present disclosure, the correction circuit may include: a first correction circuit for increasing the first tone vocal band signal; a second correction circuit for decreasing the second tone vocal band signal; and a mixing circuit for mixing the increased first tone vocal band signal and the decreased second tone vocal band signal to generate a first audio correction signal.

[0314] According to one or more embodiments of the present disclosure, a sound driving circuit may include: an audio processor that generates an audio signal based on a sound source; a preamplifier circuit that amplifies the audio signal to generate an input audio signal; a signal conversion circuit that converts the input audio signal into a piezoelectric audio signal; and an amplifier circuit that amplifies the piezoelectric audio signal to generate a piezoelectric driving signal for driving a piezoelectric vibration device.

[0315] According to one or more embodiments of the present disclosure, the signal conversion circuit may include a filter circuit that attenuates a high-pitched vocal cord signal of an input audio signal in order to generate a piezoelectric driving signal.

[0316] According to one or more embodiments of the present disclosure, the high-pitched vocal signal may have a frequency of 1 kHz or higher.

[0317] According to one or more embodiments of the present disclosure, the signal conversion circuit may further include: a correction circuit that increases a first pitch vocal band signal of an input audio signal and / or decreases a second pitch vocal band signal different from the first pitch vocal band signal to generate a first audio correction signal; a level control circuit that controls the volume level of the first audio correction signal to generate a second audio correction signal; and a clipping circuit that removes noise from the second audio correction signal to generate a third audio correction signal. The filter circuit may attenuate high-pitched vocal band signals of the third audio correction signal to generate the piezoelectric drive signal.

[0318] According to one or more embodiments of the present disclosure, the first pitch vocal band signal may have a frequency of 250 Hz to 600 Hz. The second pitch vocal band signal may have a frequency of 1 kHz or higher.

[0319] According to one or more embodiments of the present disclosure, the correction circuit may include: a first correction circuit for increasing the first tone vocal band signal; a second correction circuit for decreasing the second tone vocal band signal; and a mixing circuit for mixing the increased first tone vocal band signal and the decreased second tone vocal band signal to generate a first audio correction signal.

[0320] According to one or more embodiments of the present disclosure, a sound driving circuit may include: an audio processor that generates a first input audio signal and one or more second input audio signals based on a sound source; a signal conversion circuit that converts the first input audio signal into a piezoelectric audio signal; and an amplifier circuit that amplifies the one or more second input audio signals to generate one or more actuator driving signals for driving one or more coil-type actuators, and amplifies the piezoelectric audio signal to generate a piezoelectric driving signal for driving a piezoelectric-type vibration device.

[0321] According to one or more embodiments of the present disclosure, the signal conversion circuit may include a filter circuit that attenuates a high-pitched vocal cord signal of the first input audio signal in order to generate the piezoelectric driving signal.

[0322] According to one or more embodiments of the present disclosure, the high-pitched vocal signal may have a frequency of 1 kHz or higher.

[0323] According to one or more embodiments of the present disclosure, the signal conversion circuit may further include: a correction circuit that increases a first pitch vocal band signal of a first input audio signal and / or decreases a second pitch vocal band signal different from the first pitch vocal band signal to generate a first audio correction signal; a level control circuit that controls the volume level of the first audio correction signal to generate a second audio correction signal; and a clipping circuit that removes noise from the second audio correction signal to generate a third audio correction signal. The filter circuit may attenuate high-pitched vocal band signals of the third audio correction signal to generate the piezoelectric drive signal.

[0324] According to one or more embodiments of the present disclosure, the first pitch vocal band signal may have a frequency of 250 Hz to 600 Hz. The second pitch vocal band signal may have a frequency of 1 kHz or higher.

[0325] According to one or more embodiments of the present disclosure, the correction circuit may include: a first correction circuit for increasing the first tone vocal band signal; a second correction circuit for decreasing the second tone vocal band signal; and a mixing circuit for mixing the increased first tone vocal band signal and the decreased second tone vocal band signal to generate a first audio correction signal.

[0326] According to one or more embodiments of the present disclosure, a sound driving circuit may include: an audio processor that generates a first audio signal and one or more second audio signals based on a sound source; a preamplifier circuit that amplifies the one or more second audio signals to generate one or more second input audio signals, and amplifies the first audio signal to generate a first input audio signal; a signal conversion circuit that converts the first input audio signal into a piezoelectric audio signal; and an amplifier circuit that amplifies the one or more second input audio signals to generate one or more actuator driving signals for driving one or more coil-type actuators, and amplifies the piezoelectric audio signal to generate a piezoelectric driving signal for driving a piezoelectric-type vibration device.

[0327] According to one or more embodiments of the present disclosure, the signal conversion circuit may include a filter circuit that attenuates a high-pitched vocal cord signal of the first input audio signal in order to generate the piezoelectric driving signal.

[0328] According to one or more embodiments of the present disclosure, the high-pitched vocal signal may have a frequency of 1 kHz or higher.

[0329] According to one or more embodiments of the present disclosure, the signal conversion circuit may further include: a correction circuit that increases a first pitch vocal band signal of a first input audio signal and / or decreases a second pitch vocal band signal different from the first pitch vocal band signal to generate a first audio correction signal; a level control circuit that controls the volume level of the first audio correction signal to generate a second audio correction signal; and a clipping circuit that removes noise from the second audio correction signal to generate a third audio correction signal. The filter circuit may attenuate high-pitched vocal band signals of the third audio correction signal to generate the piezoelectric drive signal.

[0330] According to one or more embodiments of the present disclosure, the first pitch vocal band signal may have a frequency of 250 Hz to 600 Hz. The second pitch vocal band signal may have a frequency of 1 kHz or higher.

[0331] According to one or more embodiments of the present disclosure, the correction circuit may include: a first correction circuit for increasing the first tone vocal band signal; a second correction circuit for decreasing the second tone vocal band signal; and a mixing circuit for mixing the increased first tone vocal band signal and the decreased second tone vocal band signal to generate a first audio correction signal.

[0332] According to one or more embodiments of the present disclosure, an acoustic device may include: a vibration device including a piezoelectric material; and a drive circuit portion connected to the vibration device. The drive circuit portion includes the acoustic drive circuit described above for applying a piezoelectric drive signal to the vibration device.

[0333] According to one or more embodiments of the present disclosure, a vibration device may include: a vibration part, which includes a piezoelectric material; a covering member, which covers at least one or more of a first surface of the vibration part and a second surface of the vibration part opposite to the first surface; and a signal supply member, which is electrically connected to the vibration part and to a drive circuit part.

[0334] According to one or more embodiments of the present disclosure, the sound device may further include a passive vibration member. The vibration device may be arranged to vibrate the passive vibration member.

[0335] According to one or more embodiments of the present disclosure, the passive vibration component may include any one of the following: a display panel including pixels configured to display an image, a screen panel from which an image is projected from a display device, a lighting panel, a signage panel, a vehicle interior material, a vehicle exterior material, a vehicle glass window, a vehicle seat interior material, a vehicle ceiling material, a building ceiling material, a building interior material, a building glass window, an aircraft interior material, an aircraft glass window, and a reflector.

[0336] According to one or more embodiments of the present disclosure, the sound device may further include a vibration member and a support member having an inner space and arranged at a periphery of the vibration member. The vibration device may be located in the inner space of the support member and arranged to vibrate the vibration member.

[0337] According to one or more embodiments of the present disclosure, an acoustic device may include: a vibration device including a piezoelectric material; one or more actuators including a magnet and a coil; and a drive circuit portion connected to the vibration device and the one or more actuators. The drive circuit portion may include an acoustic drive circuit. The acoustic drive circuit may apply a piezoelectric drive signal to the vibration device and one or more actuator drive signals to the one or more actuators, as described above.

[0338] According to one or more embodiments of the present disclosure, a vibration device may include: a vibration part, which includes a piezoelectric material; a covering member, which covers at least one or more of a first surface of the vibration part and a second surface of the vibration part opposite to the first surface; and a signal supply member, which is electrically connected to the vibration part and to a drive circuit part.

[0339] According to one or more embodiments of the present disclosure, a vehicle device may include an exterior material, an interior material covering the exterior material, and one or more sound generating devices configured to output sound in one or more of the exterior material, the interior material, and an area between the exterior material and the interior material. The one or more sound generating devices may include the sound device described above.

[0340] According to one or more embodiments of the present disclosure, the vehicle device may further include a vibration member and a support member having an interior space and supporting the vibration member. The vibration device of the sound device may be located in the interior space of the support member and may be arranged to vibrate the vibration member.

[0341] According to one or more embodiments of the present disclosure, a vibration device of a sound device may include: a vibration part, which includes a piezoelectric material; a covering member, which covers at least one or more of a first surface of the vibration part and a second surface of the vibration part opposite to the first surface; and a signal supply member, which is electrically connected to the vibration part and connected to a drive circuit part.

[0342] According to one or more embodiments of the present disclosure, a portion of the signal supply member may be accommodated between the cover member and the vibration portion.

[0343] According to one or more embodiments of the present disclosure, the interior material may include at least one or more of an instrument panel, a pillar interior material, a top interior material, a door interior material, a seat interior material, a handle interior material, a floor interior material, and a rear package interior material.

[0344] According to one or more embodiments of the present disclosure, the exterior material may include at least one or more of a hood panel, a front fender panel, a door panel, a roof panel, a pillar panel, a trunk panel, a front bumper, a rear bumper, a spoiler, headlights, taillights, fog lights, and a bottom portion of a vehicle body.

[0345] According to one or more embodiments of the present disclosure, a vehicle device may include: an exterior material, an interior material covering the exterior material, and one or more sound generating devices configured to output sound in one or more of the exterior material, the interior material, and an area between the exterior material and the interior material. The one or more sound generating devices may include the sound device described above.

[0346] According to one or more embodiments of the present disclosure, a vibration device of a sound device may include: a vibration part, which includes a piezoelectric material; a covering member, which covers at least one or more of a first surface of the vibration part and a second surface of the vibration part opposite to the first surface; and a signal supply member, which is electrically connected to the vibration part and connected to a drive circuit part.

[0347] According to one or more embodiments of the present disclosure, a portion of the signal supply member may be accommodated between the cover member and the vibration portion.

[0348] According to one or more embodiments of the present disclosure, the interior material may include at least one or more of an instrument panel, a pillar interior material, a top interior material, a door interior material, a seat interior material, a handle interior material, a floor interior material, and a rear package interior material.

[0349] According to one or more embodiments of the present disclosure, the exterior material may include at least one or more of a hood panel, a front fender panel, a door panel, a roof panel, a pillar panel, a trunk panel, a front bumper, a rear bumper, a spoiler, headlights, taillights, fog lights, and a bottom portion of a vehicle body.

[0350] According to one or more embodiments of the present disclosure, one or more actuators of the sound device may be arranged at one or more of the dashboard, door frame, rear packaging interior material, pillar interior material, top interior material, door interior material, seat interior material, handle interior material and floor interior material.

[0351] According to one or more embodiments of the present disclosure, a vehicle device may include: a vehicle body bottom frame; a vehicle body bottom covering the vehicle body bottom frame; and one or more virtual engine sound devices mounted on the vehicle body bottom frame or in an area between the vehicle body bottom frame and the vehicle body bottom frame. The one or more virtual engine sound devices include the sound device described above.

[0352] According to one or more embodiments of the present disclosure, one or more virtual engine sound devices may be arranged to correspond to the center of the bottom of the vehicle body.

[0353] According to one or more embodiments of the present disclosure, a vibration device of a sound device may include: a vibration part, which includes a piezoelectric material; a covering member, which covers at least one or more of a first surface of the vibration part and a second surface of the vibration part opposite to the first surface; and a signal supply member, which is electrically connected to the vibration part and connected to a drive circuit part.

[0354] According to one or more embodiments of the present disclosure, a portion of the signal supply member may be received between the cover member and the vibration portion.

[0355] According to one or more embodiments of the present disclosure, the sound device may further include a vibration member and a support member having an inner space and supporting the vibration member. The vibration device of the sound device may be located in the inner space of the support member and arranged to vibrate the vibration member.

[0356] According to one or more embodiments of the present disclosure, a vehicle body bottom portion may include a housing configured to accommodate one or more virtual engine sound devices. A support member for the sound device may be housed in the housing portion. The sound device may output virtual engine sounds toward the ground.

[0357] According to one embodiment of the present disclosure, a sound device may be applied to or included in a sound generating device provided on a device or a display device. According to one embodiment of the present disclosure, the device or display device may be applied to or included in a mobile device, a video phone, a smart watch, a watch phone, a wearable device, a foldable device, a rollable device, a bendable device, a flexible device, a bending device, a sliding device, a variable device, an electronic notepad, an electronic book, a portable multimedia player (PMP), a personal digital assistant (PDA), an MP3 player, a mobile medical device, a desktop personal computer (PC), a laptop PC, a netbook computer, a workstation, a navigation device, a car navigation device, a car display device, a car device, a cinema device, a cinema display device, a television, a wallpaper display device, a signage device, a game console, a laptop computer, a monitor, a camera, a video camera, and a household appliance, etc. In addition, the sound device according to one or more embodiments of the present disclosure may be applied to or included in an organic light-emitting lighting device or an inorganic light-emitting lighting device. When the sound device is applied to or included in a lighting device, the lighting device may act as a lighting lamp and a speaker. Furthermore, when the sound device according to one or more embodiments of the present disclosure is applied to or included in a mobile device or the like, the sound device may be one or more of a speaker, a receiver, and a haptic device, but the embodiments of the present disclosure are not limited thereto.

[0358] The above-mentioned features, structures, and effects of the present disclosure are included in at least one embodiment of the present disclosure, but are not limited to only one embodiment. In addition, the features, structures, and effects described in at least one embodiment of the present disclosure can be achieved by those skilled in the art by combining or modifying other embodiments. Therefore, the content related to the combination and modification should be interpreted as within the scope of the present disclosure.

Claims

1. A sound driving circuit, comprising: an audio processor that generates an input audio signal based on a sound source; a signal conversion circuit, which converts the input audio signal into a piezoelectric audio signal; as well as An amplifier circuit amplifies the piezoelectric audio signal to generate a piezoelectric driving signal for driving a piezoelectric vibration device.

2. The sound driving circuit according to claim 1, wherein: The signal conversion circuit includes a filter circuit that attenuates a high-pitched vocal cord signal of the input audio signal to generate the piezoelectric drive signal.

3. The sound driving circuit according to claim 2, wherein: The high-pitched vocal signal has a frequency of 1 kHz or higher.

4. The sound driving circuit according to claim 2, in, The signal conversion circuit further includes: a correction circuit that increases a first tonal vocal band signal of the input audio signal and / or decreases a second tonal vocal band signal different from the first tonal vocal band signal to generate a first audio correction signal; a level control circuit that controls a volume level of the first audio correction signal to generate a second audio correction signal; and a clipping circuit that removes noise from the second audio correction signal to generate a third audio correction signal, and The filter circuit attenuates the high-pitched vocal cord signal of the third audio correction signal to generate the piezoelectric drive signal.

5. The sound driving circuit according to claim 4, in, The first tonal vocal signal has a frequency of 250 Hz to 600 Hz, and Wherein, the second tone vocal signal has a frequency of 1 kHz or higher.

6. The sound driving circuit according to claim 4, in, The correction circuit includes: a first correction circuit for increasing the first tone vocal band signal; a second correction circuit for decreasing the second tone vocal band signal; and a mixing circuit for mixing the increased first tone vocal band signal and the decreased second tone vocal band signal to generate the first audio correction signal.

7. A sound driving circuit comprising: an audio processor that generates an audio signal based on a sound source; a preamplifier circuit that amplifies the audio signal to generate an input audio signal; a signal conversion circuit, which converts the input audio signal into a piezoelectric audio signal; as well as An amplifier circuit amplifies the piezoelectric audio signal to generate a piezoelectric driving signal for driving a piezoelectric vibration device.

8. The sound driving circuit according to claim 7, wherein: The signal conversion circuit includes a filter circuit that attenuates a high-pitched vocal cord signal of the input audio signal to generate the piezoelectric drive signal.

9. The sound driving circuit according to claim 8, wherein: The high-pitched vocal signal has a frequency of 1 kHz or higher.

10. The sound driving circuit according to claim 8, in, The signal conversion circuit further includes: a correction circuit that increases a first tonal vocal band signal of the input audio signal and / or decreases a second tonal vocal band signal different from the first tonal vocal band signal to generate a first audio correction signal; a level control circuit that controls a volume level of the first audio correction signal to generate a second audio correction signal; and a clipping circuit that removes noise from the second audio correction signal to generate a third audio correction signal, and The filter circuit attenuates the high-pitched vocal cord signal of the third audio correction signal to generate the piezoelectric drive signal.

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