Heat dissipation device, control system and method of semiconductor test machine

Abstract

The invention discloses a heat dissipation device, a control system and a method of a semiconductor testing machine, the heat dissipation device comprises a supporting arm, the interior of the supporting arm is designed to be of a hollow structure, a plurality of positioning holes which are linearly distributed at equal intervals are formed in the outer walls of the two sides of the supporting arm, and the interior of the supporting arm is telescopically and movably connected with a telescopic arm; spring protruding buttons are fixedly installed on the outer walls of the two sides of the bottom end of the telescopic arm, a cooling support is rotationally installed on the outer wall of one side of the top end of the telescopic arm through a damping rotating shaft, an air nozzle is fixedly installed on the outer wall of the top end of the cooling support, a temperature sensor is fixedly installed below the air nozzle, and an air injection opening is fixedly installed on the outer wall of one side of the telescopic arm. According to the scheme provided by the invention, automatic cooling of the test machine in the use process can be realized, the cooling speed and efficiency are improved, the overall test speed of the test machine can be effectively improved, and the situation of long-time crash is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation control of semiconductor machines, and in particular to a heat dissipation device, control system and method for a semiconductor test machine. Background Art

[0002] A semiconductor tester is a high-precision device used to test semiconductor devices, primarily to verify chip functionality and performance. Semiconductor testing runs through the entire process of design, manufacturing, packaging, and application, and can be divided into three categories based on the production process: verification testing, wafer testing, and packaging testing. A semiconductor tester is a high-end device that integrates a variety of high-precision, high-performance test and measurement functions. It is one of the most important tools in the semiconductor testing process. It determines or evaluates the function and performance of integrated circuits by measuring the output response of semiconductors and comparing it with the expected output. However, when the temperature of the sub-board on the test motherboard is too high, the traditional multi-site semiconductor tester is prone to test system crash. The only way to cool down the system is to shut down the system to cool naturally or manually cool it down with a handheld air pipe. However, the above-mentioned natural cooling has the problems of slow cooling speed and low efficiency, while manual cooling with a handheld air pipe increases human resource costs and wastes manpower. Therefore, the present invention proposes a semiconductor test machine heat dissipation device. Summary of the Invention

[0003] The object of the present invention is to provide a heat dissipation device, a control system and a method for a semiconductor test machine to solve the problems mentioned in the background art.

[0004] To achieve the above object, the present invention provides the following technical solutions: A heat dissipation device for a semiconductor testing machine, comprising: A base, the base being slidably connected to one side of the test machine; A support arm, one end of which is fixedly connected to the base, the interior of the support arm being designed as a hollow structure, and another end of which is provided with a telescopic arm, the telescopic arm being able to telescope up and down along the interior of the support arm; and A temperature control component, one end of which is detachably connected to the top of the telescopic arm, and the other end of which is directed toward the test motherboard on the test machine. A gas channel is provided in the temperature control component, and is connected to an external gas supply system through an electrically controlled gas valve to provide cooling gas for the buckle board on the test motherboard during the semiconductor testing process.

[0005] In one embodiment, a plurality of linearly distributed positioning holes with equal spacing are provided on both side outer walls of the support arm, and spring knobs matching the positioning holes are fixedly mounted on both side outer walls of the bottom end of the telescopic arm.

[0006] In one embodiment, the temperature control component includes: a fixed bracket, one end of which is rotatably connected to one side of the top end of the telescopic arm via a rotating shaft, and a gas passage is provided inside the fixed bracket; and An air nozzle is fixedly connected to the other end of the fixing bracket and communicates with the gas channel inside the fixing bracket.

[0007] In one embodiment, a gas injection port is provided at one end of the fixed bracket, and the gas injection port is connected to the gas nozzle through a gas channel inside the fixed bracket, and an electrically controlled gas valve is provided at the gas injection port to control the gas flow entering the gas channel.

[0008] In one embodiment, the base comprises: a turntable, the turntable being disposed below the support arm and fixedly connected to one end of the support arm; and A support base is provided below the turntable and is rotatably connected to the turntable, and one side of the support base is slidably connected to one side of the testing machine.

[0009] In one embodiment, a slider is fixedly mounted on the lower surface of the bottom end of the support seat, and the slider is integrally formed with the support seat.

[0010] In one embodiment, the heat dissipation device of the semiconductor testing machine further includes: A temperature sensor is fixedly connected to the bottom of the air nozzle and is used to monitor the temperature of the pinch board on the test motherboard in real time during the semiconductor test process.

[0011] An embodiment of the present invention further provides a control system for a heat dissipation device of a semiconductor test machine, comprising: Heat dissipation device for semiconductor testing machines; a processor, the processor being communicatively connected to a temperature sensor in a heat dissipation device of the semiconductor test machine, and configured to generate a control signal based on parameter information fed back by the temperature sensor; A driver is communicatively connected to the processor and is used to control the movement position of the heat dissipation device of the semiconductor test machine on the test machine and the flow rate of cooling gas at the air nozzle according to the control signal generated by the processor.

[0012] An embodiment of the present invention further provides a method for controlling a heat dissipation device of a semiconductor test machine, comprising the following steps: Acquiring parameter information during a semiconductor test process, wherein the parameter information includes a temperature parameter; generating a control signal according to the parameter information; The moving position of the heat dissipation device of the semiconductor test machine on the test machine and the flow rate of the cooling gas at the air nozzle are controlled according to the control signal.

[0013] In one embodiment, generating a control signal according to the parameter information includes: When the temperature parameter is greater than a temperature threshold, determining, based on the temperature parameter, first position information corresponding to an area of the pinch plate where the temperature is greater than the temperature threshold; The moving distance of the heat sink and the rotation angle of the support arm are determined according to the first position information and the current second position information of the heat sink, and a motion control signal is generated according to the moving distance of the heat sink and the rotation angle of the support arm.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The above-mentioned embodiments of the present invention provide a heat dissipation device, control system, and method for a semiconductor test machine. In the heat dissipation device, the support arm and the air nozzle are used in conjunction with each other to support and blow air to the high-temperature area of the test machine's gusset plate, effectively helping to cool and dissipate heat from the high-temperature gusset plate, avoiding the semiconductor test machine system from freezing due to excessive gusset plate temperature, and ensuring the normal use of the semiconductor test machine. Compared with traditional heat dissipation methods, the present invention does not require manual hand-held processing, thereby freeing the user's hands, reducing human resource costs and improving human resource utilization efficiency. Compared with natural cooling, the present invention has a faster cooling speed and higher efficiency, which can effectively improve the overall testing speed of the test machine and avoid long-term freezing. The telescopic and rotating structures of the air nozzle of the present invention are used in conjunction with each other to dynamically adjust the air blowing angle and air blowing height of the air nozzle. At the same time, the air nozzle can be adjusted by sliding position and 360° rotation. The air blowing adjustment methods are more diverse and can be applied to different environments. The structure is more flexible to use, effectively reducing the limitations of the structure and making it more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of the front three-dimensional structure of a heat dissipation device provided by an embodiment of the present invention; Figure 2 An optional embodiment of the present invention provides Figure 1 Schematic diagram of the enlarged structure of area A; Figure 3A bottom-up schematic diagram of a heat dissipation device provided in an optional embodiment of the present invention; Figure 4 A schematic diagram of the internal three-dimensional structure of a support arm provided in an optional embodiment of the present invention; Figure 5 A schematic diagram of a telescopic arm structure assembly provided in an optional embodiment of the present invention; Figure 6 This is a flow chart of a control method for a heat dissipation device of a semiconductor test machine according to an embodiment of the present invention.

[0016] Explanation of the accompanying figures: 1. Support arm; 2. Positioning hole; 3. Telescopic arm; 4. Spring knob; 5. Cooling bracket; 6. Rotating shaft; 7. Air nozzle; 8. Temperature sensor; 9. Air injection port; 10. Turntable; 11. Support seat; 12. Slider. DETAILED DESCRIPTION

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0018] In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc., should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0020] See Figures 1 to 5An embodiment of the present invention provides a heat dissipation device for a semiconductor test machine, which may include a base, a support arm 1, and a temperature control assembly. The base is slidably connected to one side of the test machine; one end of the support arm 1 is fixedly connected to the base, and the interior of the support arm 1 is designed as a hollow structure. A telescopic arm 3 is sleeved on one end of the support arm 1, and the telescopic arm 3 can be telescopically moved up and down along the interior of the support arm 1; one end of the temperature control assembly is detachably connected to the top of the telescopic arm 3, and the other end of the temperature control assembly faces the test motherboard on the test machine. A gas channel is provided in the temperature control assembly, and is connected to an external gas supply system through an electrically controlled gas valve to provide cooling gas for the gusset plate on the test motherboard during the semiconductor test process.

[0021] In this embodiment, the base is integrally slidably connected to one side of the test machine to drive the entire heat dissipation device to move on the test machine; and the support arm 1 is fixedly connected to the base, so that when the base is rotated and adjusted, the support arm 1 can drive the temperature control component to rotate a certain angle, thereby adapting to the high-temperature position of the gusset plate in different areas of the test motherboard to achieve targeted temperature regulation; Preferably, a plurality of equally spaced linearly distributed positioning holes 2 are provided on the outer walls on both sides of the support arm 1, and spring convex buttons 4 that match the positioning holes 2 are fixedly installed on the outer walls on both sides of the bottom end of the telescopic arm 3; the spring convex buttons 4 can be elastically inserted into the positioning holes 2, so that the telescopic arm 3 can be positioned in a convex button-like manner to meet different test height requirements, thereby achieving a protective effect on the semiconductor being tested; here, the shape of the support arm 1 and the telescopic ratio are not limited, as long as the outer diameter of the telescopic arm 3 is smaller than and matches the inner diameter of the support arm 1, so that the telescopic arm 3 can be set in the support arm 1 and move up and down; Here, the temperature control component is detachably connected to the top of the telescopic arm 3 to facilitate the installation and maintenance of related components on the temperature control component; through the setting of the support arm 1, the base and the telescopic arm 3, the temperature control component can be adjusted up and down and in rotation, thereby adjusting the position and angle of the temperature control component, so that it can be suitable for cooling work in different panel areas.

[0022] In an optional embodiment of the present invention, the temperature control assembly may include a fixed bracket 5 and an air nozzle 7. One end of the fixed bracket 5 is rotatably connected to one side of the top end of the telescopic arm 3 via a rotating shaft 6. An air passage is provided through the interior of the fixed bracket 5. The air nozzle 7 is fixedly connected to the other end of the fixed bracket 5 and communicates with the air passage within the fixed bracket 5.

[0023] In this embodiment, the air nozzle 7 is provided at the other end of the fixed bracket 5 and is connected to the gas channel provided in the fixed bracket 5 to provide cooling gas to the gusset plate. Here, the number of air nozzles 7 is not limited, and one or more air nozzles can be provided. When multiple air nozzles 7 are provided, the multiple air nozzles 7 are arranged in an array at the other end of the fixed bracket 5 through connecting pipes. Here, a spiral guide vane may be provided in the gas channel to optimize the distribution of the airflow in the channel.

[0024] In an optional embodiment of the present invention, a gas injection port 9 is provided at one end of the fixed bracket 5, and the gas injection port 9 is connected to the gas nozzle 7 through a gas channel inside the fixed bracket 5, and an electrically controlled gas valve is provided at the gas injection port 9 to control the gas flow entering the gas channel.

[0025] In this embodiment, an external gas supply system can be connected by providing a gas injection port 9, so that cooling gas can be injected through the gas injection port 9, and the injected cooling gas can be discharged through the air nozzle 7. In actual use, the air nozzle 7 can be aimed at the area on the gusset plate where the temperature is too high, so that the cooling gas blown out can cool and dissipate the high-temperature area of the gusset plate, thereby avoiding the situation where the semiconductor tester system freezes due to excessive temperature of the gusset plate, and ensuring the normal use of the semiconductor tester; In an optional embodiment of the present invention, the base may include a turntable 10 and a support base 11. The turntable 10 is disposed below the support arm 1 and fixedly connected to one end of the support arm 1; the support base 11 is disposed below the turntable 10 and rotatably connected to the turntable 10, and one side of the support base 11 is slidably connected to one side of the test machine.

[0026] Furthermore, a slider 12 is fixedly mounted on the lower surface of the bottom end of the support base 11 , and the slider 12 and the support base 11 are integrally formed to facilitate production, manufacturing and assembly.

[0027] In this embodiment, a turntable 10, a support seat 11 and a slider 12 are sequentially provided at the bottom end of the support arm 1, and the turntable 10 and the support seat 11 can be rotatably connected by a rotating shaft; during assembly, the heat dissipation device can be slidably installed as a whole on an adapted semiconductor testing machine through the provided support seat 11 and the slider 12, so that the position of the heat dissipation device can be slid and adjusted by a sliding connection, thereby improving the use effect; through the structural design of the turntable 10, in actual use, the support arm 1 and its structural assembly thereon can be rotated 360° through the turntable 10 to achieve adjustment of the angle of the air nozzle 7; by cooperating with the use of the slider 12, the position of the air nozzle 7 can be dynamically adjusted, thereby adapting to high-temperature areas at different positions on the test motherboard, so as to improve the structural use flexibility of the air nozzle 7.

[0028] In an optional embodiment of the present invention, the heat dissipation device of the semiconductor test machine may further include a temperature sensor 8. The temperature sensor 8 is fixedly connected to the bottom of the air nozzle 7 and is used to monitor the temperature of the daughter board on the test motherboard in real time during the semiconductor test process.

[0029] Here, the temperature sensor 8 can be an infrared temperature sensor. During the semiconductor test process, the infrared temperature sensor scans the surface temperature field of the gusset plate in real time for real-time monitoring and feedback. The infrared temperature sensor uses a non-contact infrared thermal imager (such as FLIR Lepton or MLX90640) and supports high-resolution temperature matrix acquisition. Furthermore, based on the temperature matrix read from the infrared temperature sensor, the high-temperature area on the gusset plate can be analyzed and determined, so as to adjust the position of the heat dissipation load on the test machine and open the electronically controlled gas valve to cool the high-temperature area through the air nozzle 7.

[0030] An embodiment of the present invention further provides a control system for a heat sink of a semiconductor test machine, comprising the heat sink, a processor, and a driver. The processor is communicatively connected to a temperature sensor in the heat sink of the semiconductor test machine and is configured to generate a control signal based on parameter information fed back by the temperature sensor. The driver is communicatively connected to the processor and is configured to control the movement of the heat sink within the test machine, the position of the support arm 1 on the base of the heat sink, and the flow rate of cooling gas at the air nozzle 7 based on the control signal generated by the processor.

[0031] During semiconductor testing, a driver drives the heat sink's slider 12 to slide back and forth across the test platform. During this sliding motion, temperature sensor 8 scans the temperature field on the gusset plate in real time, enabling real-time monitoring of the gusset plate's temperature during semiconductor testing. Temperature sensor 8 stores the collected temperature parameters to facilitate subsequent determination of the heat sink's second position on the test platform.

[0032] Furthermore, the temperature sensor 8 feeds back the collected parameter information (that is, the temperature matrix of the pinch plate) to the processor. When the parameter information received by the processor exceeds the set temperature threshold, it determines that the temperature at the current position of the pinch plate is too high. In order to avoid damaging the semiconductor, cooling measures need to be taken at this time; the processor analyzes the corresponding parameter information, and drives the heat dissipation device to move to the corresponding high-temperature position according to the analysis results and opens the electronically controlled gas valve to cool the high-temperature area through the air nozzle 7.

[0033] like Figure 6 As shown, an embodiment of the present invention further provides a method for controlling a heat dissipation device of a semiconductor test machine, comprising the following steps: Step 11, obtaining parameter information during the semiconductor test process, the parameter information including temperature parameters; Step 12: generating a control signal according to the parameter information; Step 13 , controlling the movement position of the heat dissipation device of the semiconductor test machine on the test machine and the flow rate of the cooling gas at the air nozzle 7 according to the control signal.

[0034] In this embodiment, during the semiconductor testing process, the driver drives the slider 12 of the heat dissipation device and drives the support arm 1 and the fixed bracket 5 to slide back and forth as a whole on the testing machine, and during the sliding process, the temperature field on the buckle plate is scanned in real time through the temperature sensor 8 to realize real-time monitoring of the buckle plate temperature during the semiconductor testing process.

[0035] In an optional embodiment of the present invention, the above step 12 may include: Step 121: When the temperature parameter is greater than the temperature threshold, determine, based on the temperature parameter, first position information corresponding to an area of the pinch plate where the temperature is greater than the temperature threshold; Step 122 , determining the moving distance of the heat sink and the rotation angle of the support arm 1 according to the first position information and the current second position information of the heat sink, and generating a motion control signal according to the moving distance of the heat sink and the rotation angle of the support arm 1 .

[0036] In this embodiment, the temperature threshold can be set according to the safety requirements of the gusset plate during actual testing. When the scanned temperature parameter is greater than the temperature threshold, it is determined that the current area on the gusset plate is a high temperature area. Here, the temperature parameters are stored in the temperature sensor in the form of a temperature matrix, for example, temp-grid[j][j] represents the temperature value in the i-th row and j-th column; Here, before determining the first position information corresponding to the area with a temperature greater than the threshold, coordinate system calibration and mapping are first performed to convert the pixel coordinates (row and column numbers in a two-dimensional matrix) collected by the infrared sensor into actual physical coordinates (such as millimeters or centimeters) on the surface of the gusset plate. The specific process is as follows: Step 1201, calibration plate preparation: Use a plate (or marking plate) of known size, set multiple reference points on its surface (such as four corner points or grid points), and accurately measure the physical coordinates of these points on the plate (such as the upper left corner is the origin (0, 0), the lower right corner is (300mm, 300mm)).

[0037] Step 1202, data acquisition: scan the calibration plate with an infrared sensor and record the sensor pixel coordinates corresponding to each reference point (e.g., the upper left corner reference point may correspond to pixel coordinates (0, 0), and the lower right corner corresponds to (31, 23)).

[0038] Step 1203: Establish a mapping relationship: Use linear transformation to fit the corresponding transformation relationship between pixel coordinates and physical coordinates. For example, the least squares method is used to calculate the transformation matrix parameters to minimize the error for all reference points. The transformation relationship can be expressed as: physical coordinate (x, y) = k (pixel row i, pixel column j), where k represents the transformation coefficient. This equation indicates that each pixel in row i corresponds to the physical coordinate's y value, and column j corresponds to the physical coordinate's x value. For example, if the sensor resolution is 32 × 24 pixels and the panel size is 320 mm × 240 mm, each pixel corresponds to a 10 mm × 10 mm area (x = 10 × j, y = 10 × i).

[0039] Furthermore, based on the temperature parameter, the first location information corresponding to the area of the panel where the temperature is greater than the threshold is determined. Specifically, the discrete over-temperature pixels are first aggregated into continuous areas, and the physical location and range of each area are determined. The specific aggregation process is as follows: Step 1211: adjacent over-temperature pixels (adjacent in the vertical, horizontal, or diagonal directions) are considered as the same area.

[0040] In step 1212, all connected pixels are traversed and marked to form independent regions (e.g., region A contains 5 connected pixels, and region B contains 3 pixels). If the distribution of overtemperature points is sparse and irregular, points with similar density are clustered together by setting the "neighborhood radius" and "minimum number of points" parameters. For example, if the distance between two overtemperature points is less than 5 mm and the number of points exceeds 3, they are considered to be in the same region.

[0041] In step 1213 , if the distance between multiple small areas is too close (eg, the distance between them is less than a preset value), they can be merged into one large area to avoid over-division.

[0042] Step 1214: For each clustered over-temperature area, calculate its physical location information: Step 12141, Center Point Coordinates: Calculate the average physical coordinates of all overheated pixels within the region and use this as the center of the region. For example, if there are five pixels in the region with physical coordinates (10, 20), (15, 25), (10, 30), (15, 35), and (20, 25), the center point is (14, 27).

[0043] Step 12142, Boundary Range: Determine the minimum bounding rectangle of the region: Find the minimum and maximum x, y values of all pixels to form a rectangular box (e.g., from the upper left corner (10, 20) to the lower right corner (20, 35)). This is the boundary range of each overtemperature region. Here, an edge detection algorithm can also be used to extract the actual shape of the region boundary.

[0044] Here, the current second position information of the heat dissipation device can be obtained by real-time monitoring through a position sensor arranged on the support seat 11; further, based on the second position information and the first position information, the straight-line movement distance of the heat dissipation device on the test machine (the absolute value of the difference between the two horizontal coordinates) and the rotation angle of the support arm 1 (with the point on the side of the test machine perpendicular to the first position information as the origin, the angle between the second line connecting the second position information to the origin and the first line connecting the first position information to the origin) can be calculated and obtained; at the same time, the opening of the electronically controlled gas valve can be adjusted according to the temperature gradient alarm value set to be greater than the temperature threshold, thereby controlling the cooling gas flow at the nozzle 7.

[0045] Here, the center coordinates, boundary range and maximum temperature value of the high-temperature area (such as "Area 1: Center (150mm, 80mm), Range 120-180mm×60-100mm, Maximum Temperature 92°C") can also be visualized: the outline of the high-temperature area is superimposed on the two-dimensional layout of the fastener board, and the temperature levels are marked with different colors to display the thermal map of the fastener during the semiconductor test in real time, and the high-temperature area is marked with a flashing or highlighted box when displayed.

[0046] The heat dissipation device provided by the above embodiment of the present invention cooperates with the support arm and the air nozzle to perform a supported cooling and blowing treatment on the high-temperature area of the gusset plate of the test machine, effectively helping the high-temperature gusset plate to cool and dissipate heat, avoiding the semiconductor test machine system crash caused by excessive temperature of the gusset plate, and ensuring the normal use effect of the semiconductor test machine. Compared with the traditional heat dissipation method, the present invention does not require manual hand-held processing, thereby freeing the user's hands, reducing human resource cost investment, and improving human resource utilization efficiency. Compared with natural cooling, the cooling speed of the present invention is faster and more efficient, which can effectively improve the overall test speed of the test machine and avoid long-term crashes. At the same time, the air blowing range of the air nozzle is small and will not affect the temperature in other normal ranges. By coordinating the use of the air nozzle, telescopic arm and rotating structure, the air nozzle can be dynamically adjusted in blowing angle and blowing height. At the same time, the air nozzle can be slid in position and rotated 360 degrees. By coordinating with the slider, the air nozzle can slide dynamically, making the blowing adjustment method more diverse and applicable to different environments. The structure is more flexible to use, effectively reducing the limitations of the structure and making it more convenient to use.

[0047] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A heat dissipation device for a semiconductor test machine, characterized in that: include: A base, the base being slidably connected to one side of the test machine; A support arm (1), one end of the support arm (1) is fixedly connected to the base, the interior of the support arm (1) is designed as a hollow structure, and another end of the support arm (1) is provided with a telescopic arm (3), and the telescopic arm (3) can be telescopically moved up and down along the hollow structure of the interior of the support arm (1); as well as A temperature control component, one end of which is detachably connected to the top of the telescopic arm (3), and the other end of which faces the test motherboard on the test machine. A gas channel is provided in the temperature control component, and is connected to an external gas supply system through an electrically controlled gas valve to provide cooling gas for the buckle board on the test motherboard during the semiconductor test process.

2. The heat dissipation device of a semiconductor test machine according to claim 1, wherein: A plurality of linearly distributed positioning holes (2) are provided on both sides of the outer wall of the support arm (1), and spring knobs (4) that match the positioning holes (2) are fixedly mounted on both sides of the outer wall of the bottom end of the telescopic arm (3).

3. The heat dissipation device of a semiconductor test machine according to claim 1, wherein: The temperature control component includes: A fixed bracket (5), one end of the fixed bracket (5) is rotatably connected to one side of the top end of the telescopic arm (3) via a rotating shaft (6), and a gas passage is provided inside the fixed bracket (5); and An air nozzle (7) is fixedly connected to the other end of the fixed bracket (5) and communicates with the gas channel inside the fixed bracket (5).

4. The heat dissipation device of a semiconductor test machine according to claim 3, wherein: A gas injection port (9) is provided at one end of the fixed bracket (5), and the gas injection port (9) is communicated with the gas nozzle (7) through a gas channel inside the fixed bracket (5), and an electrically controlled gas valve is provided at the gas injection port (9) to control the gas flow entering the gas channel.

5. The heat dissipation device of a semiconductor test machine according to claim 1, wherein: The base comprises: a turntable (10), the turntable (10) being arranged below the support arm (1) and fixedly connected to one end of the support arm (1); and A support base (11) is arranged below the turntable (10) and is rotatably connected to the turntable (10), and one side of the support base (11) is slidably connected to one side of the test machine.

6. The heat dissipation device of a semiconductor test machine according to claim 5, wherein: A slider (12) is fixedly mounted on the lower surface of the bottom end of the support seat (11), and the slider (12) and the support seat (11) are integrally formed.

7. The heat dissipation device of a semiconductor test machine according to claim 3, wherein: Also includes: A temperature sensor (8) is fixedly connected to the bottom of the air nozzle (7) and is used to monitor the temperature of the buckle board on the test motherboard in real time during the semiconductor test process.

8. A control system for a heat dissipation device of a semiconductor test machine, characterized in that: include: Heat dissipation device for semiconductor testing machines; a processor, the processor being communicatively connected to a temperature sensor in a heat dissipation device of the semiconductor test machine, and configured to generate a control signal based on parameter information fed back by the temperature sensor; A driver is communicatively connected to the processor and is used to control the moving position of the heat dissipation device of the semiconductor test machine on the test machine and the flow rate of the cooling gas at the air nozzle (7) according to the control signal generated by the processor.

9. A method for controlling a heat dissipation device of a semiconductor test machine, characterized in that: The following steps are involved: Acquiring parameter information during a semiconductor test process, wherein the parameter information includes a temperature parameter; generating a control signal according to the parameter information; The moving position of the heat dissipation device of the semiconductor test machine on the test machine and the cooling gas flow at the air nozzle (7) are controlled according to the control signal.

10. The control method of the semiconductor test machine heat dissipation device according to claim 9, wherein: Generating a control signal according to the parameter information includes: When the temperature parameter is greater than a temperature threshold, determining, based on the temperature parameter, first position information corresponding to an area of the pinch plate where the temperature is greater than the temperature threshold; According to the first position information and the current second position information of the heat sink, the moving distance of the heat sink and the rotation angle of the support arm (1) are determined, and a motion control signal is generated according to the moving distance of the heat sink and the rotation angle of the support arm (1).

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