Embedded element circuit board preparation method, circuit board and electronic equipment

Abstract

The invention discloses an embedded element circuit board preparation method, a circuit board and electronic equipment, a first insulating layer is formed on at least one side surface of a substrate, the first insulating layer is provided with at least one groove, the substrate is exposed, an embedded element is arranged at the bottom of the groove, and a second insulating layer is formed on one side, far away from the substrate, of the first insulating layer. The groove is filled with the insulating material of the second insulating layer, a circuit layer is formed on the side, away from the first insulating layer, of the second insulating layer, and the circuit layer is electrically connected with the embedded component. It is ensured that the distance between the surface, away from the substrate, of the embedded element and the surface, away from the substrate, of the first insulating layer in the direction perpendicular to the substrate is smaller than a preset value, segment difference caused by the fact that the grooves are too deep and insulating materials cannot be filled is avoided, the risk that the circuit board is cracked or even broken due to stress concentration is reduced, and the quality of the circuit board is improved.

Description

Technical Field

[0001] The present invention relates to circuit board processing technology, and in particular to a method for preparing an embedded component circuit board, a circuit board and electronic equipment. Background Art

[0002] Electronic devices are continuously evolving toward smaller size, greater functionality, and higher reliability. To meet these performance requirements, passive components (such as resistors, capacitors, and inductors), which occupy the largest area and are the most numerous, are also undergoing continuous improvements in integration and functionality. On printed circuit boards (PCBs), the size of components and the area occupied by the circuitry connecting them are the biggest limitations to product miniaturization. In particular, to meet the semiconductor technology development needs of artificial intelligence (AI GPUs), 5G, and high-performance computing, a growing number of product design companies are beginning to design embedded high-density components within the substrate's mid-layer to enhance product performance. Therefore, embedding passive components has become a key technology for improving the integration and performance of PCBs. PCBs with embedded passive components are called embedded component PCBs.

[0003] Figure 1 This is a process flow chart for preparing an existing embedded component circuit board, such as Figure 1 As shown, a through slot 11 is usually opened on the circuit board 10, and then a removable carrier tape 20 is placed on one side. The embedded device 30 is placed on the carrier tape 20 at the bottom of the through slot 11. Then, a semi-cured insulating material 40 is placed on the other side of the circuit board. Then, the semi-cured insulating material is pressed by hot pressing. During the hot pressing process, the semi-cured insulating material fills the through slot 11. After pressing, the carrier tape 20 is removed. Figure 1 As shown, if the thickness of the circuit board 10 is thicker than that of the embedded device 30 and the through groove 11 is deeper, it is not easy to be filled with the insulating material 40 during pressing, and a step difference is formed on the surface of the circuit board 10. Stress concentration is likely to occur at this position, causing the circuit board 10 to crack or even break, affecting the quality of the circuit board 10. Summary of the Invention

[0004] The present invention provides a method for preparing an embedded component circuit board, a circuit board, and an electronic device, which can avoid grooves being too deep, resulting in insulation material not being able to fill the grooves and causing step differences, reduce the risk of stress concentration causing the circuit board to crack or even break, and improve the quality of the circuit board.

[0005] In a first aspect, the present invention provides a method for preparing an embedded component circuit board, comprising:

[0006] providing a substrate;

[0007] forming a first insulating layer on at least one side surface of the substrate, wherein the first insulating layer is provided with at least one groove to expose the substrate;

[0008] An embedded component is provided at the bottom of the groove, wherein a distance between a surface of the embedded component away from the substrate and a surface of the first insulating layer away from the substrate in a direction perpendicular to the substrate is less than a preset value;

[0009] forming a second insulating layer on a side of the first insulating layer away from the substrate, wherein the insulating material of the second insulating layer fills the groove;

[0010] A circuit layer is formed on a side of the second insulating layer away from the first insulating layer. The circuit layer penetrates the second insulating layer and is electrically connected to the embedded device.

[0011] Optionally, metal layers are provided on two opposite sides of the substrate, and before the first insulating layer is formed on at least one side of the substrate, the method further includes:

[0012] performing patterning on the metal layer to form at least one metal pad on at least one side of the substrate;

[0013] Correspondingly, the groove of the first insulating layer exposes the metal pad, and the embedded device is arranged on the metal pad.

[0014] Optionally, forming a first insulating layer on at least one side surface of the substrate includes:

[0015] Pressing a first insulating layer provided with through holes onto at least one side surface of the substrate; or,

[0016] forming an insulating layer precursor on at least one side of the substrate;

[0017] A portion of the insulating layer precursor is removed to form at least one groove, exposing the substrate to obtain a first insulating layer.

[0018] Optionally, after the embedded element is provided at the bottom of the groove, the method further comprises:

[0019] A portion of the first insulating layer is removed so that a distance between a surface of the embedded component away from the substrate and a surface of the first insulating layer away from the substrate in a direction perpendicular to the substrate is less than a preset value.

[0020] Optionally, a gap is reserved between the sidewall of the embedded component and the sidewall of the groove. During the process of forming the second insulating layer on the side of the first insulating layer away from the substrate, the insulating material of the second insulating layer fills the gap and covers the embedded component.

[0021] Optionally, the circuit layers are formed on both opposite sides of the substrate, and in the process of forming the circuit layer on the side of the second insulating layer away from the first insulating layer, the process further includes:

[0022] A connection hole is formed to connect the two circuit layers. The connection hole passes through the substrate, the first insulating layer and the second insulating layer. A conductive layer is formed on an inner wall of the connection hole.

[0023] Optionally, after forming a circuit layer on a side of the second insulating layer away from the first insulating layer, the method further includes:

[0024] A circuit board is pressed onto a side of the circuit layer away from the second insulating layer.

[0025] In a second aspect, the present invention further provides a circuit board, which is prepared using the method for preparing an embedded component circuit board provided in the first aspect of the present invention, comprising:

[0026] substrate;

[0027] a first insulating layer, wherein the first insulating layer is formed on at least one side surface of the substrate, and the first insulating layer is provided with at least one groove to expose the substrate;

[0028] an embedded component, the embedded component being disposed at the bottom of the groove, wherein a distance between a surface of the embedded component away from the substrate and a surface of the first insulating layer away from the substrate in a direction perpendicular to the substrate is less than a preset value;

[0029] a second insulating layer, wherein the second insulating layer is formed on a side of the first insulating layer away from the substrate, and an insulating material of the second insulating layer fills the groove;

[0030] A circuit layer is formed on a side of the second insulating layer away from the first insulating layer, and the circuit layer penetrates the second insulating layer and is electrically connected to the embedded device.

[0031] Optionally, a metal pad is further provided at the bottom of the groove, and the embedded device is provided on the metal pad.

[0032] In a third aspect, the present invention further provides an electronic device comprising the circuit board provided in the second aspect of the present invention.

[0033] The present invention provides a method for preparing a circuit board with embedded components, which forms a first insulating layer on at least one side of a substrate, wherein the first insulating layer is provided with at least one groove to expose the substrate, and an embedded component is provided at the bottom of the groove, wherein the distance between the surface of the embedded component away from the substrate and the surface of the first insulating layer away from the substrate in a direction perpendicular to the substrate is less than a preset value, and a second insulating layer is formed on the side of the first insulating layer away from the substrate, wherein the insulating material of the second insulating layer fills the groove, and a circuit layer is formed on the side of the second insulating layer away from the first insulating layer, wherein the circuit layer passes through the second insulating layer and is electrically connected to the embedded device. The present invention can determine the thickness of the first insulating layer according to the thickness of the embedded component, ensure that the distance between the surface of the embedded component away from the substrate and the surface of the first insulating layer away from the substrate in a direction perpendicular to the substrate is less than a preset value, avoid the groove being too deep, resulting in the insulation material being unable to fill and the appearance of a step difference, reduce the risk of stress concentration causing the circuit board to crack or even break, and improve the quality of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present invention will be described in further detail below with reference to the accompanying drawings and examples.

[0035] Figure 1 The present invention is a process flow chart for preparing an embedded component circuit board;

[0036] Figure 2 A flow chart of a method for preparing an embedded component circuit board provided by the present invention;

[0037] Figure 3 、 4 A process flow chart for preparing a circuit board with embedded components provided by the present invention;

[0038] Figure 5 This is a structural schematic diagram of a circuit board provided by the present invention. DETAILED DESCRIPTION

[0039] To make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the present invention more clearly understood, the technical solutions of the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It is apparent that the described embodiments are only some of the embodiments of the present invention, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0040] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0041] In the present invention, unless otherwise expressly specified and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature. In addition, the terms "first" and "second" are only used to distinguish in description and have no special meaning.

[0042] Figure 2 This is a flow chart of a method for preparing an embedded component circuit board provided by the present invention. Figure 3 、 4 The present invention provides a process flow chart for preparing an embedded component circuit board, such as Figure 2 、 3 As shown in , 4, the method for preparing the embedded component circuit board includes:

[0043] S101: Provide a substrate.

[0044] In an embodiment of the present invention, the substrate may be an insulating board. For example, the material of the insulating board may be FR-4 epoxy resin, polyimide (PI), polytetrafluoroethylene (PTFE), glass fiber cloth, etc., which is not limited in the present invention.

[0045] In some embodiments of the present invention, Figure 3 、 4 As shown, the substrate 110 includes an insulating plate 111 and metal layers 112 disposed on opposite sides of the insulating plate 111. For example, the metal layers 112 may be copper foils.

[0046] like Figure 3 、 4As shown, in an embodiment of the present invention, the metal layer 112 is patterned to form at least one metal pad 1121 on at least one side of the substrate 110. Exemplarily, the metal layer 112 can be patterned by masked wet etching to form the metal pad 1121, and the specific process is not repeated here.

[0047] S102 , forming a first insulating layer on at least one side surface of the substrate, wherein the first insulating layer is provided with at least one groove to expose the substrate.

[0048] In an embodiment of the present invention, a first insulating layer is formed on at least one side surface of the substrate, and the first insulating layer is provided with at least one groove to expose the substrate.

[0049] For example, Figure 3 、 4 As shown, a first insulating layer 120 is formed on two opposite sides of the substrate 110 . The first insulating layer 120 is provided with at least one groove 121 , and the groove 121 exposes a metal pad 1121 .

[0050] In some embodiments of the present invention, a first insulating layer 120 with through holes may be pre-formed, and then the first insulating layer 120 may be pressed onto both sides of the substrate 110. For example, the material of the first insulating layer 120 may be a prepreg material, which may be composed of a resin and a reinforcing material, wherein the reinforcing material may be of several types, such as glass fiber cloth, paper base, and composite material.

[0051] In other embodiments of the present invention, an insulating layer precursor may be first formed to cover both sides of the substrate 110, and then a portion of the insulating layer precursor may be removed to form at least one groove 121, exposing the substrate 110 to obtain the first insulating layer 120. For example, the insulating layer precursor may be a photosensitive material, and a mask, exposure, and development process may be used to remove a portion of the insulating layer precursor to form the at least one groove 121, which may then be cured to obtain the first insulating layer 120.

[0052] S103. Arrange an embedded component at the bottom of the groove.

[0053] For example, Figure 3 、 4 As shown, an embedded component 130 is disposed on a metal pad 1121 at the bottom of the groove 121. In the present invention, embedded components 130 are disposed in grooves 121 on both sides of the substrate 110, thereby increasing the integration density of embedded components 130 and facilitating miniaturization of electronic devices. In the present invention, embedded components 130 may include resistors, capacitors, inductors, and the like, although this is not a limitation.

[0054] For example, Figure 3 、 4As shown, the embedded component 130 can be fixed to the metal pad 1121 by adhesive. Fixing the embedded component 130 to the metal pad 1121 can improve the bonding strength between the embedded component 130 and the substrate 110, preventing large displacement caused by compression during the subsequent formation of the second insulating layer. In addition, the metal pad 1121 can improve the heat dissipation efficiency of the embedded component 130, preventing heat accumulation that may cause the embedded component 130 to burn out.

[0055] For example, Figure 3 、 4 As shown, a gap is reserved between the sidewall of the embedded component 130 and the sidewall of the groove 121 .

[0056] In some embodiments of the present invention, the thickness of the first insulating layer 120 can be determined in advance based on the thickness of the embedded component 130 to ensure that the distance between the surface of the embedded component 130 away from the substrate 110 and the surface of the first insulating layer 120 away from the substrate 110 in a direction perpendicular to the substrate 110 is less than a preset value. This prevents the groove 121 from being too deep, resulting in an inability to fill it with insulating material during the subsequent filling process. Exemplarily, the preset value can be 5μm. In a specific embodiment of the present invention, the surface of the embedded component 130 away from the substrate 110 is flush with the surface of the first insulating layer 120 away from the substrate 110.

[0057] In other embodiments of the present invention, during the preparation of the first insulating layer 120, the thickness of the first insulating layer 120 is designed based on the thickness of the embedded component 130 and can be slightly larger than the thickness of the embedded component 130. For example, the thickness of the embedded component 130 is generally between 45 μm and 55 μm, and the first insulating layer 120 can be set to 50 μm to 60 μm. Figure 3 、 4 As shown, after the embedded component 130 is disposed at the bottom of the groove 121, a portion of the first insulating layer 120 can be removed based on the height of the embedded component 130, so that the distance between the surface of the embedded component 130 away from the substrate 110 and the surface of the first insulating layer 120 away from the substrate 110, in a direction perpendicular to the substrate 110, is less than a predetermined value. For example, the predetermined value can be 5 μm. In a specific embodiment of the present invention, the surface of the embedded component 130 away from the substrate 110 is flush with the surface of the first insulating layer 120 away from the substrate 110.

[0058] S104 , forming a second insulating layer on a side of the first insulating layer away from the substrate, wherein the insulating material of the second insulating layer fills the groove.

[0059] For example, Figure 3 、 4As shown, a second insulating layer 140 is formed on both sides of the first insulating layer 120 away from the substrate 110, and the insulating material of the second insulating layer 140 fills the groove 121. For example, as Figure 3 、 4 As shown, the insulating material of the second insulating layer 140 fills the gap between the sidewall of the embedded component 130 and the sidewall of the groove 121 and covers the embedded component 130 , thereby improving the stability of the embedded component 130 .

[0060] Exemplarily, the insulating material of the second insulating layer 140 can be a semi-cured material. In an embodiment of the present invention, the semi-cured material can be pressed onto the side of the first insulating layer 120 away from the substrate 110 by hot pressing. During the hot pressing process, the semi-cured material is squeezed and filled into the groove 121.

[0061] S105 , forming a circuit layer on a side of the second insulating layer away from the first insulating layer, wherein the circuit layer penetrates the second insulating layer and is electrically connected to the embedded device.

[0062] In the embodiment of the present invention, Figure 3 、 4 As shown, a circuit layer 150 is formed on one side of the two second insulating layers 140 away from the first insulating layer 120. The circuit layer 150 may include multiple circuits. Some of the circuits in the circuit layer 150 pass through the second insulating layer 140 and are electrically connected to the embedded device 130, providing an interface for signal input / output of the embedded device 130.

[0063] For example, a hole can be pre-opened in the second insulating layer 140 at a position corresponding to the embedded device 130, and then a metal foil (e.g., copper foil) can be formed on the side of the second insulating layer 140 away from the first insulating layer 120 by electroplating. The hole is filled with metal, and then the metal foil is patterned to form the circuit layer 150. The specific process of the patterning process can be referred to existing processes and will not be described in detail in the present invention.

[0064] In the embodiment of the present invention, Figure 3 、 4 As shown, in the process of forming the circuit layer 150, the following steps are also included:

[0065] A connection hole 151 is formed to connect the two circuit layers 150. The connection hole 151 passes through the substrate 110, the first insulating layer 120 and the second insulating layer 140. A conductive layer is formed on the inner wall of the connection hole 151 to achieve electrical connection between the two circuit layers 150. For example, a through hole passing through the substrate 110, the first insulating layer 120 and the second insulating layer 140 can be formed by mechanical or laser drilling, and then a metal layer (such as a copper layer) is deposited on the inner wall of the hole by electroplating to achieve electrical connection between the two circuit layers 150. The specific process can refer to the existing hole metallization process, and the present invention will not be repeated here. For example, in an embodiment of the present invention, the interior of the connection hole 151 is also filled with an insulating medium 152.

[0066] In some embodiments of the present invention, the circuit board prepared by the above method can be directly used as a finished circuit board.

[0067] In some embodiments of the present invention, the circuit board prepared by the above method can be used as an intermediate layer of a multi-layer circuit board, that is, after forming a circuit layer on the side of the second insulating layer away from the first insulating layer, the method further includes:

[0068] A circuit board is pressed together on one side of the two circuit layers 150 away from the second insulating layer 140. The circuit board may include at least one circuit layer 161. The circuit layer 161 of the circuit board is electrically connected to the circuit layer 150. For example, Figure 3 、 4 As shown, both circuit layers 150 have adhesive layers 162 formed on the side away from second insulating layer 140. Adhesive layers 162 may be prepregs. Exemplarily, adhesive layers 162 and metal foil are stacked sequentially on the side of circuit layer 150 away from second insulating layer 140, then heat-pressed. After lamination, the metal foil is patterned to form circuit layer 161.

[0069] The present invention provides a method for preparing a circuit board with embedded components, which forms a first insulating layer on at least one side of a substrate, wherein the first insulating layer is provided with at least one groove to expose the substrate, and an embedded component is provided at the bottom of the groove, wherein the distance between the surface of the embedded component away from the substrate and the surface of the first insulating layer away from the substrate in a direction perpendicular to the substrate is less than a preset value, and a second insulating layer is formed on the side of the first insulating layer away from the substrate, wherein the insulating material of the second insulating layer fills the groove, and a circuit layer is formed on the side of the second insulating layer away from the first insulating layer, wherein the circuit layer passes through the second insulating layer and is electrically connected to the embedded device. The present invention can determine the thickness of the first insulating layer according to the thickness of the embedded component, ensure that the distance between the surface of the embedded component away from the substrate and the surface of the first insulating layer away from the substrate in a direction perpendicular to the substrate is less than a preset value, avoid the groove being too deep, resulting in the insulation material being unable to fill and the appearance of a step difference, reduce the risk of stress concentration causing the circuit board to crack or even break, and improve the quality of the circuit board.

[0070] Figure 5 This is a schematic diagram of the structure of a circuit board provided by the present invention, which is prepared by the method for preparing an embedded component circuit board provided by any of the aforementioned embodiments of the present invention. Figure 5 As shown, the circuit board includes:

[0071] Substrate 110. Exemplarily, in the embodiment of the present invention, the substrate 110 may be an insulating board. Exemplarily, the material of the insulating board may be FR-4 epoxy resin, polyimide (PI), polytetrafluoroethylene (PTFE), glass fiber cloth, etc., which is not limited in the present invention.

[0072] The first insulating layer 120 is formed on at least one side of the substrate 110. The first insulating layer 120 is provided with at least one groove 121, exposing the substrate 110. For example, the material of the first insulating layer 120 can be a prepreg material, which can be composed of a resin and a reinforcing material. The reinforcing material can be of several types, such as glass fiber cloth, paper base, and composite materials.

[0073] The embedded component 130 is disposed at the bottom of the groove 121. The distance between the surface of the embedded component 130 away from the substrate 110 and the surface of the first insulating layer 120 away from the substrate 110 in a direction perpendicular to the substrate 110 is less than a preset value. Exemplarily, the embedded component 130 may include a resistor, a capacitor, an inductor, etc., which is not limited herein. Exemplarily, the preset value may be 5 μm. In a specific embodiment of the present invention, the surface of the embedded component 130 away from the substrate 110 is flush with the surface of the first insulating layer 120 away from the substrate 110.

[0074] The second insulating layer 140 is formed on a side of the first insulating layer 120 away from the substrate 110, and the insulating material of the second insulating layer 140 fills the groove 121. For example, the insulating material of the second insulating layer 140 may be a prepreg. In an embodiment of the present invention, the prepreg may be pressed onto the side of the first insulating layer 120 away from the substrate 110 using a hot pressing method. During the hot pressing process, the prepreg is squeezed and fills the groove 121.

[0075] The circuit layer 150 is formed on a side of the second insulating layer 140 away from the first insulating layer 120 . The circuit layer 150 penetrates the second insulating layer 140 and is electrically connected to the embedded device 130 .

[0076] In some embodiments of the present invention, Figure 5As shown, a metal pad 1121 is further disposed at the bottom of the groove 121, and the embedded device 130 is disposed on the metal pad 1121. Exemplarily, the substrate 110 includes an insulating plate 111 and at least one metal pad 1121 disposed on opposite sides of the insulating plate 111. The material of the metal pad 1121 can be copper. The groove 121 exposes the metal pad 1121.

[0077] In some embodiments of the present invention, Figure 5 As shown, a gap is reserved between the sidewalls of the embedded component 130 and the sidewalls of the groove 121. The insulating material of the second insulating layer 140 fills the gap between the sidewalls of the embedded component 130 and the sidewalls of the groove 121 and covers the embedded component 130, thereby improving the stability of the embedded component 130.

[0078] In some embodiments of the present invention, Figure 5 As shown, the circuit board further includes a connection hole 151 connecting the two circuit layers 150. The connection hole 151 passes through the substrate 110, the first insulating layer 120, and the second insulating layer 140. A conductive layer is formed on the inner wall of the connection hole 151 to achieve electrical connection between the two circuit layers 150. For example, in this embodiment of the present invention, the interior of the connection hole 151 is also filled with an insulating medium 152.

[0079] In some embodiments of the present invention, the circuit board prepared by the above method can be directly used as a finished circuit board.

[0080] In some embodiments of the present invention, the circuit board prepared by the above method can be used as the middle layer of a multi-layer circuit board, such as Figure 5 As shown, a circuit board is provided on one side of the two circuit layers 150 away from the second insulating layer 140. The circuit board may include at least one circuit layer 161. The circuit layer 161 of the circuit board is electrically connected to the circuit layer 150. For example, Figure 5 As shown, both circuit layers 150 have an adhesive layer 162 formed on the side away from the second insulating layer 140. Adhesive layer 162 may be a prepreg. Circuit layer 161 is formed on the side of adhesive layer 162 away from circuit layer 150. Exemplarily, adhesive layer 162 and metal foil are stacked sequentially on the side of circuit layer 150 away from the second insulating layer 140, then heat-pressed. After lamination, the metal foil is patterned to form circuit layer 161.

[0081] The present invention further provides an electronic device, which includes the circuit board provided by any of the aforementioned embodiments of the present invention.

[0082] In the description of this document, it should be understood that the terms "up", "down", "left", "right", and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0083] In this specification, reference to terms such as "one embodiment" or "example" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0084] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0085] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A method for preparing an embedded component circuit board, characterized in that: include: providing a substrate; forming a first insulating layer on at least one side surface of the substrate, wherein the first insulating layer is provided with at least one groove to expose the substrate; An embedded component is provided at the bottom of the groove, wherein a distance between a surface of the embedded component away from the substrate and a surface of the first insulating layer away from the substrate in a direction perpendicular to the substrate is less than a preset value; forming a second insulating layer on a side of the first insulating layer away from the substrate, wherein the insulating material of the second insulating layer fills the groove; A circuit layer is formed on a side of the second insulating layer away from the first insulating layer. The circuit layer penetrates the second insulating layer and is electrically connected to the embedded device.

2. The method for preparing an embedded component circuit board according to claim 1, wherein: The substrate is provided with metal layers on two opposite sides thereof, and before forming the first insulating layer on at least one side of the substrate, the method further comprises: performing patterning on the metal layer to form at least one metal pad on at least one side of the substrate; Correspondingly, the groove of the first insulating layer exposes the metal pad, and the embedded device is arranged on the metal pad.

3. The method for preparing an embedded component circuit board according to claim 1, wherein: Forming a first insulating layer on at least one side of the substrate, comprising: Pressing a first insulating layer provided with through holes onto at least one side surface of the substrate; or, forming an insulating layer precursor on at least one side of the substrate; A portion of the insulating layer precursor is removed to form at least one groove, exposing the substrate to obtain a first insulating layer.

4. The method for preparing an embedded component circuit board according to claim 1, wherein: After the embedded component is arranged at the bottom of the groove, the method further comprises: A portion of the first insulating layer is removed so that a distance between a surface of the embedded component away from the substrate and a surface of the first insulating layer away from the substrate in a direction perpendicular to the substrate is less than a preset value.

5. The method for preparing an embedded component circuit board according to claim 1, wherein: A gap is reserved between the sidewall of the embedded component and the sidewall of the groove. During the process of forming the second insulating layer on the side of the first insulating layer away from the substrate, the insulating material of the second insulating layer fills the gap and covers the embedded component.

6. The method for preparing a circuit board with embedded components according to any one of claims 1 to 5, characterized in that: The circuit layers are formed on opposite sides of the substrate, and in the process of forming the circuit layer on a side of the second insulating layer away from the first insulating layer, the method further includes: A connection hole is formed to connect the two circuit layers. The connection hole passes through the substrate, the first insulating layer and the second insulating layer. A conductive layer is formed on an inner wall of the connection hole.

7. The method for preparing an embedded component circuit board according to claim 6, wherein: After forming a circuit layer on a side of the second insulating layer away from the first insulating layer, the method further includes: A circuit board is pressed onto a side of the circuit layer away from the second insulating layer.

8. A circuit board, characterized in that: The method for preparing an embedded component circuit board according to any one of claims 1 to 7 comprises: substrate; a first insulating layer, wherein the first insulating layer is formed on at least one side surface of the substrate, and the first insulating layer is provided with at least one groove to expose the substrate; an embedded component, the embedded component being disposed at the bottom of the groove, wherein a distance between a surface of the embedded component away from the substrate and a surface of the first insulating layer away from the substrate in a direction perpendicular to the substrate is less than a preset value; a second insulating layer, wherein the second insulating layer is formed on a side of the first insulating layer away from the substrate, and an insulating material of the second insulating layer fills the groove; A circuit layer is formed on a side of the second insulating layer away from the first insulating layer, and the circuit layer penetrates the second insulating layer and is electrically connected to the embedded device.

9. The circuit board according to claim 8, wherein: A metal pad is also provided at the bottom of the groove, and the embedded device is provided on the metal pad.

10. An electronic device, characterized in that: Comprising the circuit board as claimed in claim 8 or 9.

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