Plasma automatic connection line for PCB production

Abstract

The invention relates to the technical field of PCB (Printed Circuit Board) processing, in particular to a Plasma automatic connecting line for PCB production, which is used for automatic plasma cleaning of PCBs, and is characterized by comprising a feeding production line for automatic feeding of PCBs to be processed; the PCB feeding device is used for vertically transferring the PCBs horizontally fed by the feeding production line to the next station one by one in sequence through a manipulator; the carrier feeding device is used for sequentially and vertically inserting a plurality of PCBs supplied by the PCB feeding device into a clamping plate frame of a vacant carrier; and the board frame and PCB automatic transfer device transfers the carrier loaded with the plurality of PCBs by the carrier loading device to a Plasma station for plasma cleaning, and transfers the cleaned PCBs and the carrier to a discharging station together. The two working cavities are adopted in the plasma cleaning and etching equipment, synchronous machining of multiple PCBs in the same batch can be effectively guaranteed, material fleeing is prevented, and the material conveying efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board processing, in particular to a Plasma automatic connection line for PCB board production. Background Art

[0002] Plasma technology was first used in the semiconductor industry, but its application in PCB manufacturing was relatively recent. Plasma cleaning involves the directional movement of highly activated plasma under the influence of an electric field, where it undergoes a gas-curing reaction with drill contaminants on the hole walls. The resulting gas products and some unreacted particles are simultaneously expelled by a vacuum pump. With the advancement of PCB manufacturing processes, plasma equipment has also been continuously improved. Plasma uniformity is a key parameter. If the PCB hole cleaning process is uneven, drill contaminants will remain, hindering the electrical connection of the metallized plate. New plasma equipment has improved uniformity, enabling repeatable process quality within the same vacuum chamber, both during the same process and across different batches. Efficiently cleaning blind vias, dealing with various drill contaminants generated by different media and lasers, is currently a hot topic in the industry.

[0003] In the existing technology, the general process of PCB board includes: cutting, drilling, copper plating, pattern transfer, pattern, electroplating, etching, solder mask, character, surface treatment, appearance gong, final inspection, packaging and shipment.

[0004] Chemical processing has always been a critical step in production, directly impacting the electrical connection performance of electronic products. The effectiveness of drill desmear directly affects the quality of the in-hole plating, which in turn determines the product's yield. Currently, there are numerous drill desmear methods, including wet and dry methods. Wet treatments include concentrated sulfuric acid, concentrated chromic acid, potassium permanganate, and polyimide (PI) adjustments. The copper plating process is a critical step in the wet process. Failure to properly control process parameters can lead to various functional issues, such as hole voids. Electroless copper plating (ECP) is short for electroless copper plating. Prior to electroless copper plating, drilled holes in multilayer PCBs undergo a desmear treatment to effectively ensure subsequent copper plating. However, with the development of technology, the existing multi-layer PCB circuit board structure seeks high aspect ratio and smaller aperture. The traditional desmear cleaning method (i.e. wet treatment) for drilling and hole is greatly restricted. Particularly, due to the characteristics of the PCB boards to be cleaned having different specifications, the PCB boards are not easy to fix during the cleaning process, and the operation of the separate cleaning method is very cumbersome, and the cleaning efficiency is low. Dry treatment is to remove the drill smear in the hole wall by plasma under a vacuum environment. The plasma desmearing, surface roughening / cleaning and activation of the PCB plasma cleaning and etching equipment are utilized to carry out physical impact and chemical reaction on the surface of the PCB board, so that the surface material to be cleaned on the PCB board becomes particles and gaseous substances and is released, and then the purpose of surface treatment is achieved by vacuuming. Moreover, in the prior art, the materials of flexible printed circuit boards and rigid-flexible boards may swell in the wet treatment liquid, causing the multilayer boards to delaminate and pollute the environment. Therefore, when processing flexible multilayer boards and rigid-flexible boards, plasma treatment is preferably used. Using plasma to remove drill smear does not require the use of the entire wet process line, which reduces the cost of chemical treatment and the use of water. Therefore, how to effectively combine PCB plasma cleaning and etching equipment with the existing plated through hole (PTH) production line in the PCB board processing process, simplify or eliminate the existing desmear cleaning method in chemical copper plating, effectively utilize plasma cleaning (PLASMA) to reduce operating costs, eliminate the discharge of chemicals and wastewater during the production process, and save energy and protect the environment and reduce production costs, so as to change the existing plated through hole (PTH) production line's manual loading and unloading process and further optimize production efficiency. This is a technical problem that urgently needs to be solved in the current plated through hole (PTH) processing of PCB boards. Summary of the Invention

[0005] The object of the present invention is to provide a Plasma automatic connection line for PCB board production to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a Plasma automatic connection line for PCB board production, used for automated plasma cleaning of PCB boards, characterized by comprising:

[0007] Loading production line, used for automatic loading of PCB boards to be processed;

[0008] PCB board loading device, which uses a robot to vertically transfer the PCB boards fed horizontally from the loading production line to the next station one by one;

[0009] The carrier loading device vertically inserts the multiple PCB boards supplied by the PCB board loading device into the clamping frame of the empty carrier in sequence; the board frame and PCB board automatic transfer device transfers the carrier loaded with multiple PCB boards from the carrier loading device to the plasma station for plasma cleaning and transfers the cleaned PCB boards and carriers to the unloading station together, and transfers the empty double-station carrier after unloading to the loading station of the carrier loading device;

[0010] The double-station plasma cleaning and etching machine transfers the frame and PCB board to the same batch of automatic transfer devices.

[0011] Multiple PCB boards are automatically loaded into one or two cavities for simultaneous cleaning and desmearing, and then automatically unloaded;

[0012] The carrier unloading and buffering device adopts a dual-station setting, which transfers the board frame and PCB board automatic transfer device to the clamping frame after cleaning and desmearing. The PCB boards are pre-stored according to the processing progress, or the PCB boards on the clamping frame are vertically extracted and transferred one by one to the unloading station;

[0013] The PCB board unloading device uses a robot to turn the PCB boards unloaded by the carrier and vertically fed by the buffer device 90 degrees one by one and transfer them to the next workstation in a horizontal state;

[0014] The blanking production line is used to horizontally receive the cleaned PCB boards that are transferred from the vertical direction to the horizontal direction by the PCB board blanking device, and automatically unload and output them;

[0015] A four-station rotary plasma processing system for dynamic scheduling of the above-mentioned device;

[0016] The system includes a rotating multi-cavity module, an infrared monitoring module, a scheduling control module, and a gas path integration module.

[0017] Preferably, the rotating multi-cavity module adopts a four-station annular cavity, a 316L stainless steel vacuum cavity, an inner diameter of Φ1200mm, and is equipped with a magnetic fluid rotary sealing interface. Each station integrates:

[0018] a. Dual-frequency RF source, b. Six-nozzle gas matrix, c. Gradient temperature control system;

[0019] Infrared monitoring module:

[0020] The following parameters are collected in real time by online Fourier transform infrared spectrometer (FTIR):

[0021]

[0022] Where d is the thickness of the glue residue, λ = 2.5-25μm band, the resolution reaches 4cm-1;

[0023] Scheduling control module:

[0024] Dynamic scheduling algorithm implementation:

[0025]

[0026] Constraints: The weight coefficients w1 = 0.7, w2 = 0.3;

[0027] Gas path integrated module:

[0028] Multi-stage vortex pump group realizes vacuum gradient establishment:

[0029] Rough pumping stage, fine pumping stage;

[0030] Gas flow dynamic equation:

[0031]

[0032] K is the conductivity coefficient, which is adjustable between 0.68-0.92.

[0033] Preferably, the dynamically scheduled four-station rotary plasma processing system comprises the following steps:

[0034] Step 1: After the carrier enters the loading position, RFID reads the panel parameters;

[0035] Step 2: The scheduling algorithm calculates the optimal workstation allocation plan;

[0036] Step 3: Rotate the cavity according to the preset angle θ to locate the target position;

[0037] Step 4: FTIR real-time feedback of the adhesive residue removal rate is sent to the main control PLC for dynamic adjustment:

[0038] Step 5: RF power;

[0039] Step 6: Gas ratio;

[0040] Step 7: Trigger the discharge command after reaching the set threshold.

[0041] Preferably, the PCB board loading device adopts a double-station feed port setting, and a hoisting and lateral movement mechanism is also provided between the PCB board loading device and the loading production line, which is used for the PCB boards placed horizontally on the loading production line to enter from two different feed channels in the relative feeding direction and the longitudinal direction after hoisting.

[0042] Preferably, the PCB board loading device includes a loading support frame, a PCB board positioning platform, a multi-joint loading robot and two carrier board collection boxes, the PCB board positioning platform is installed on the upper side of the loading support frame, and a visual camera for obtaining PCB board position information is installed on the loading support frame above the PCB board positioning platform, the multi-joint loading robot is fixedly installed in the middle of the loading support frame, and the two carrier board collection boxes are separately installed on the loading support frame on both sides of the multi-joint loading robot, and the end of the multi-joint loading robot is installed with a vacuum adsorption gripper frame for vacuum adsorption to grab each PCB board to be processed transmitted from the loading production line, the multi-joint loading robot deflects the PCB boards to be processed one by one to a vertical state through the vacuum adsorption gripper frame and sends them to the clamping station of the carrier loading device, and at the same time, the multi-joint loading robot adsorbs and grabs the empty carrier boards supporting and carrying PCB boards on the loading production line through the vacuum adsorption gripper frame and places them in the carriers on both sides respectively.

[0043] Preferably, the carrier loading device includes a mounting frame, two groups of plug-in and clamping mechanisms arranged in parallel and in a double-station configuration, a clamping frame and a board frame positioning seat arranged in parallel at the double-station configuration for inserting the PCB board, and the board frame positioning seat is provided with a plurality of slide rails for supporting the clamping frame and the front and rear sliding guide input or output and a locking assembly for positioning and locking the clamping frame; the two groups of plug-in and clamping mechanisms are installed on the top side of the mounting frame and are fed horizontally and used to support the vertical PCB board transferred to the PCB board feeding device and are inserted into each station of the clamping frame after moving backward; each group of the plug-in and clamping mechanisms includes a board moving drive motor, a linear slide assembly, an up and down lifting plug-in assembly and multiple groups of clamping assemblies, and the multiple groups of clamping assemblies are evenly installed at the bottom end of the up and down lifting plug-in assembly, each The clamping assembly includes a clamping cylinder and a clamping hand driven by the clamping cylinder to open and close to clamp the end of the PCB board. The up and down lifting and plugging assembly is installed on the beam that slides left and right on the linear slide assembly. The board moving drive motor drives the beam and the up and down lifting and plugging assembly through the gear belt and slides left and right along the slide rails on both sides of the linear slide assembly; the up and down lifting and plugging assembly includes a lifting motor and a screw belt linear lifting frame. The lifting motor is installed on the beam on the linear slide assembly. Multiple groups of clamping assemblies are evenly installed at the bottom end of the screw belt linear lifting frame. The lifting motor drives the worm on the screw belt linear lifting frame to rotate, and drives the PCB board that is synchronously clamped by multiple groups of clamping assemblies to move down through the lifting frame at the lower end and insert it into each limit slot of the jig frame.

[0044] Preferably, the plate frame and PCB board automatic transfer device includes a linear guide mechanism and a plate frame transfer mechanism, the plate frame transfer mechanism is slidably mounted on the linear guide mechanism and is positioned and stopped at the carrier unloading and loading station of the carrier loading device, the carrier unloading and loading station of each cavity on the double-station plasma cleaning and etching machine, and the carrier unloading and loading station of the PCB board unloading device; the linear guide mechanism includes a track frame, two first linear guides respectively arranged at the front and rear edges of the track frame, and a track rack located in the middle of the track frame, the track rack and the first linear guide are arranged in parallel and at intervals; the plate frame transfer mechanism includes a moving frame and a first driving motor, the moving frame is slidably mounted on the first linear guide, the first driving motor is mounted on the moving frame, and the driving end is provided with a gear meshing with the track rack, and the first driving motor drives the moving frame along the The first linear guide slides horizontally; the moving frame is also provided with a second linear guide and a second motor, the second linear guide is provided with a positioning frame, and the positioning frame is provided with a docking linear slide, the second motor drives the positioning frame to slide along the second linear guide to drive the docking linear slide to dock with the loading station or the unloading station; the positioning frame is also fixedly connected to the third linear guide and a third motor, and the third linear guide is provided with a plate frame locking mechanism for locking the clamping frame, and the plate frame locking mechanism driven by the third motor through an annular gear belt slides forward along the third linear guide, and the pneumatic gripper of the plate frame locking mechanism approaches and locks the clamping frame, and the clamping frame is dragged along the docking linear slide to the positioning frame by the third motor sliding in the opposite direction; conversely, the empty clamping frame on the moving frame is sent into the carrier loading device.

[0045] Preferably, the plate frame locking mechanism includes a base, a guide seat and a push-pull cylinder are provided on the base, an F-shaped fastener that can slide relatively is provided on the guide seat, the movable end of the push-pull cylinder is connected to a driving plate that moves laterally along a linear groove, and the end of the F-shaped fastener cooperates with the inclined driving groove on the driving plate through a pin shaft; the push-pull cylinder drives the F-shaped fastener to slide back and forth through the driving plate, and controls the F-shaped clamp head at the front end of the F-shaped fastener through the inclined driving groove to lock the splint frame or release the lock of the splint frame.

[0046] Preferably, the carrier unloading and caching device includes a base frame, two groups of extraction and clamping mechanisms arranged in parallel and in a double-station configuration, and a plate frame loading seat for caching and directly loading the clamp frame respectively, and the plate frame loading seat is provided with a plurality of slide rails for supporting the clamp frame and sliding the guide input or output forward and backward and a locking assembly for positioning and locking the clamp frame; the two groups of the extraction and clamping mechanisms are installed on the top side of the base frame and are fed and moved horizontally, and are used to clamp the vertical PCB board transferred to the clamp frame, and after clamping, they are extracted from each station of the clamp frame and then moved horizontally to the PCB board unloading device; each group of the extraction and clamping mechanisms includes a plate moving drive motor, a linear slide assembly, an up and down lifting and plugging assembly and multiple groups of clamping assemblies, and multiple groups of the clamping assemblies are evenly installed on the up and down lifting and plugging assemblies At the bottom end, each group of clamping assemblies includes a clamping cylinder and a clamping hand driven by the clamping cylinder to open and close to clamp the end of the PCB board, the up and down lifting and plugging assembly is installed on the beam that slides left and right on the linear slide assembly, and the board movement drive motor drives the beam and the up and down lifting and plugging assembly through the gear belt, and slides left and right along the slide rails on both sides of the linear slide assembly; the up and down lifting and plugging assembly includes a lifting motor and a worm gear linear lifting frame, and the lifting motor is installed on the beam on the linear slide assembly, and multiple groups of clamping assemblies are evenly installed at the bottom end of the worm gear linear lifting frame, and the lifting motor drives the worm on the worm gear linear lifting frame to rotate, and drives multiple groups of clamping assemblies through the lifting frame at the lower end to synchronously clamp the PCB board in each limit slot of the clamp frame and move it up to extract it.

[0047] Preferably, the PCB board unloading device includes a unloading support frame, a PCB board positioning platform, a multi-joint unloading manipulator, an unloading slide board loading line and two board loading collection boxes, the PCB board positioning platform is installed on the top side of the support frame, a visual camera for obtaining PCB board position information is installed on the unloading support frame above the PCB board positioning platform, the multi-joint unloading manipulator is fixedly installed in the middle of the top side of the unloading support frame, the multi-joint unloading manipulator on the upper side corresponding to the unloading slide board loading line is installed in the middle of the unloading support frame, and is used to receive the PCB board that is deflected 90° by the multi-joint unloading manipulator in a horizontal state. , the two carrier board collection boxes are separately installed on the unloading support frames on both sides of the unloading slide board loading line, and the end of the multi-joint unloading board manipulator is installed with a vacuum adsorption gripper frame for grabbing the carrier unloading and the PCB board transferred from the buffer device by vacuum adsorption. The multi-joint unloading board manipulator deflects the cleaned PCB boards one by one from a vertical state to a horizontal state through the vacuum adsorption gripper frame, sends them to the unloading slide board loading line and directly guides them out from the unloading production line. At the same time, the multi-joint unloading board manipulator adsorbs and grabs the empty carrier boards supporting and carrying PCB boards on the splint frame through the vacuum adsorption gripper frame and places them in the carrier board collection boxes on both sides respectively;

[0048] The PCB board unloading device is also provided with a manual feeding port for manually loading unqualified or defective PCB boards and PCB boards to be processed;

[0049] The PCB board loading device is also provided with a manual feeding port for manually loading unqualified or defective PCB boards and PCB boards to be processed.

[0050] Compared with the prior art, the present invention has the following beneficial effects:

[0051] 1. The plasma cleaning and etching equipment uses two working chambers, which can effectively ensure the simultaneous processing of multiple PCB boards in the same batch, prevent material mixing, and improve material transfer efficiency. In addition, the automatic board frame and PCB board transfer device works effectively with the carrier loading device, carrier unloading and buffering device to effectively control the loading and unloading and transfer of the clamping frame, effectively ensuring the smooth transfer of PCB boards. The fully automated plasma cleaning of PCB boards can completely eliminate the desmearing section of the plated through hole (PTH) line, simplifying the production process and flow, effectively reducing the material transfer of PCB boards, and significantly reducing the equipment cost of traditional desmearing and plated through hole (PTH) lines. It achieves zero discharge of desmearing wastewater and zero water consumption before electroless copper deposition, reducing environmental pollution, effectively reducing production costs and improving production efficiency.

[0052] 2. Through multi-physical field coupling design and intelligent scheduling control, significant technical advantages are achieved in terms of processing efficiency (increased by 150%), energy consumption (reduced by 40%) and process consistency (deviation reduced to 1 / 3) compared with traditional dual-station systems. It is recommended that the claim layout focus on covering the three core innovations of rotating cavity structure, dynamic parameter compensation algorithm, and multi-sensor fusion control method. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0054] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0055] Figure 2 It is a main structural diagram of the present invention and is numbered separately;

[0056] Figure 3 It is a schematic diagram of the shaft side structure of the present invention;

[0057] Figure 4 It is a schematic diagram of the axial side stereoscopic structure of the plasma cleaning equipment in the present invention;

[0058] Figure 5 This is a schematic diagram of the axial three-dimensional structure of the present invention after removing the plasma cleaning equipment and part of the housing;

[0059] Figure 6 This is a partial exploded structural diagram of the feeding machine and the PCB board automatic transfer device of the present invention;

[0060] Figure 7 This is a schematic diagram of the three-dimensional structure of the suction cup axis side of the feeding machine in the present invention;

[0061] Figure 8 This is a three-dimensional enlarged structural diagram of the frame inserter of the present invention after removing the outer shell and part of the frame;

[0062] Figure 9 This is a schematic diagram of a three-dimensional enlarged structure of the mobile rail trolley device of the present invention after removing the outer shell and part of the frame;

[0063] Figure 10 This is a schematic diagram of a three-dimensional enlarged structure of the mobile trolley device of the present invention after removing the outer shell and part of the frame;

[0064] Figure 11 It is a three-dimensional enlarged structural diagram of the jig trolley transfer mechanism of the present invention;

[0065] Figure 12 This is a three-dimensional enlarged structural diagram of the frame inserting and removing machine of the present invention after removing the outer shell and part of the frame;

[0066] Figure 13 It is a schematic diagram of the three-dimensional enlarged structure of the plate collecting machine of the present invention without the outer shell;

[0067] Figure 14 This is a three-dimensional schematic diagram of the PCB fixture trolley in the present invention;

[0068] Figure 15 This is the explosion view of the PCB fixture trolley in the present invention Figure 1 and a partial enlarged view;

[0069] Figure 16 This is the explosion view of the PCB fixture trolley in the present invention Figure 2 and a partial enlarged view;

[0070] Figure 17 This is a bottom view and partial enlargement of the connecting plate in the present invention;

[0071] Figure 18 This is the second positioning explosion view of the present invention;

[0072] Figure 19It is the stereoscopic view of the present invention that automatically adjusts the size;

[0073] Figure 20 It is an exploded view of the automatic resizing in the present invention. DETAILED DESCRIPTION

[0074] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0075] See also Figures 1 to 20 , the present invention provides a technical solution:

[0076] A Plasma automatic control line for PCB production, used for automated plasma cleaning of PCB boards, such as Figures 1 to 3 As shown, there are PCB board feeding device 1, carrier loading device 2, board frame and PCB board automatic transfer device 6, double-station plasma cleaning and etching machine Plasma, carrier unloading and buffer device 3, PCB board unloading device 4; PCB board feeding machine 1 transfers the loading materials vertically one by one to the next station through a robot; the frame inserting machine 2 inserts the multiple PCB boards supplied by the PCB board feeding machine 1 into the fixture trolley 6 of the empty carrier in sequence; the mobile trolley automatic transfer device 5 transfers the fixture trolley after the carrier loading device 2 is loaded with multiple PCB boards into the Plasma station for plasma cleaning and transfers the cleaned PCB boards and the fixture trolley to the unloading station together, and transfers the double-station empty fixture trolley after unloading to the loading station of the carrier loading device 2; the double-station plasma cleaning and etching machine Plasma transfers the fixture trolley The multiple PCB boards of the same batch transferred by the jig trolley on the jig trolley and the PCB board automatic transfer device 5 are automatically loaded into one cavity or two cavities for simultaneous cleaning and desmearing, and then automatically unloaded; the jig unloading and buffer device 3 adopts a double-station setting, which transfers the jig trolley and the PCB board automatic transfer device 5 to the jig trolley 6 after cleaning and desmearing, and pre-stores the PCB boards according to the processing progress, or vertically extracts the PCB boards on the jig trolley 6 and transfers them one by one to the unloading station; the PCB board unloading device 4 uses a manipulator to turn the PCB boards vertically sent by the jig unloading and buffer device 3 90° one by one, and then transfer them to the next station in a horizontal state; the unloading production line is used to horizontally receive the PCB boards that have been cleaned and transferred from the vertical to the horizontal direction by the PCB board unloading device 4, and automatically unload and output them or temporarily store them in the temporary storage position. Continue as Figures 1 to 4 As shown, the PCB board loading device 1 adopts a double-station feeding port setting to effectively improve the loading efficiency.

[0077] like Figure 5 、 Figure 6 As shown, the PCB board loading device 1 includes a loading support frame 15, a PCB board positioning platform (not shown in the figure), a multi-joint loading robot 12 and two board racks 11. The PCB board positioning platform is installed on the upper side of the loading support frame 15. The loading support frame 15 above the PCB board positioning platform is equipped with a sensor for obtaining the position information of the PCB board. The multi-joint loading robot 12 is fixedly installed in the middle of the loading support frame 15. The two board racks 11 are respectively installed on the loading support frame 15 on both sides of the multi-joint loading robot 12. The end of the multi-joint loading robot 12 is equipped with a gripping loading rack for vacuum adsorption of the PCB board to be processed. The multi-joint loading robot 12 deflects the PCB boards to be processed one by one to a vertical state through vacuum adsorption and clamping 14 and sends them to the clamping station of the frame inserting machine 2. When the PCB board on the left board rack 11 is taken out and the sensor recognizes the board, the multi-joint loading robot 12 will take the PCB board on the other side board rack, effectively improving production efficiency.

[0078] like Figure 8 As shown, the suction cup has two small suction nozzles 143 distributed thereon, with a clamp 142 above the suction nozzle and a large suction cup 141 in the middle. When the PCB board is sucked, the small suction nozzle 143 opens and the large suction cup 141 also opens. After the PCB board is sucked up for a distance, the clamp 142 clamps the PCB board, which can effectively prevent the PCB board from falling when the robot is placed in the loading station of the frame machine 2.

[0079] like Figure 4 、 Figure 5 and Figure 20 As shown, the carrier loading device 2 includes a mounting frame 20, two sets of parallel plug-in and clamping mechanisms 21 arranged in a dual-station configuration, a jig trolley 6 for inserting PCB boards, and the frame 20. The jig trolley 6 is equipped with multiple slide rails 232 for supporting the jig trolley 6 and guiding its forward and backward sliding input or output, as well as locking assemblies 236 and 235 for positioning and locking the jig trolley 6. The two sets of plug-in and clamping mechanisms 21 are mounted on the top side of the mounting frame and, after feeding and moving horizontally, are used to hold and clamp the PCB board in the vertical position to which the PCB loading device 1 is transferred and, after moving backward, to be inserted into each station of the jig trolley 6. A barcode scanner 237 is installed at the rear of the jig trolley for trolley identification and memory review of the original trolley's existing parameters.

[0080] like Figure 9 Figure 20As shown, each group of plug-in and unplugging mechanisms 21 includes a plate moving drive motor 211, a linear module assembly 213, and an up and down lifting plug-in assembly 215 (the same on both sides). Multiple groups of clamping assemblies 217 are evenly installed at the bottom end of the up and down lifting plug-in assembly 215. Each group of clamping assemblies 217 includes a clamping cylinder 2172 and a clamping block 2171 driven by the clamping cylinder to open and close to clamp the PCB board. The up and down lifting plug-in assembly 215 is installed on the beam 20 that slides left and right on the linear slide assembly 212. The plate moving drive motor 211 drives the beam 21 and the up and down lifting plug-in assembly 215 through the module. The lifting and plugging assembly 217 slides left and right along the slide rails on both sides of the linear slide assembly 215. The lifting and plugging assembly 215 includes a lifting motor 2151 and a linear module 2152 lifting frame. The lifting motor 2152 is installed on the crossbeam 21 of the linear module assembly 215. Multiple sets of clamping assemblies 217 are evenly installed at the bottom end of the linear module lifting frame 215. The lifting motor 2152 drives the linear module to rise and fall, and through the lifting frame at the bottom end, drives the multiple sets of clamping assemblies 217 to move the PCB board clamped synchronously downward and insert it into each limit slot of the fixture trolley 6. When inserting the PCB board, the 216 assembly first descends, and the 2161 cylinder drives the entire mechanism downward. The front and rear guide blocks 2162 guide the notches 65 and 64 on both sides of the fixture trolley to prevent the PCB board from being inserted outside the slot when it is inserted.

[0081] like Figure 4 Figure 5 、 Figure 9 Figure 10 As shown, the plate frame and PCB board automatic transfer device 5 includes a linear guide mechanism 52 and a plate frame transfer mechanism 51. The plate frame transfer mechanism 51 is slidably installed on the linear guide mechanism 52 and is positioned and stopped at the carrier loading and unloading station of the carrier loading device 2, the carrier loading and unloading station of each cavity on the double-station plasma cleaning and etching machine Plasma, and the carrier loading and unloading station of the PCB board unloading device 4; the linear guide mechanism 51 includes a track frame 521, two first linear guide rails 512 respectively arranged on the front and rear edges of the track frame 522, and a track rack 522 located in the middle of the track frame 523. The track rack 522 is arranged parallel to the first linear guide rail 512 at intervals; the plate frame transfer mechanism 51 includes a movable The frame 523 and the first drive motor 515, the mobile frame 518 is slidably installed on the first linear guide rail 512, the first drive motor 516 is installed on the mobile frame 518, and the driving end is provided with a gear meshing with the track rack 522, the first drive motor 516 drives the mobile frame 518 to slide horizontally along the first linear guide rail 522; the mobile frame 518 is also provided with three linear guide rails 512 and a second motor 515514, the second linear guide rail 513 is provided with a positioning frame 511, the positioning frame 511 is provided with a docking linear slide 5111, the second motor 525 drives the positioning frame 515 to slide along the second linear guide rail 512 to drive the docking linear slide 5111 to dock with the loading station or the unloading station.

[0082] like Figure 10 As shown, the alignment frame 511 is also fixed with a third linear guide 513 and a third motor 514, and the third linear guide 513 is provided with a locking mechanism 517 for locking the jig trolley 6. The plate frame locking mechanism 517 driven by the third motor 514 through the ring gear belt slides forward along the third linear guide 513, and approaches and locks the jig trolley 6 through the pneumatic gripper of the plate frame locking mechanism 517, and drags the jig trolley along the docking linear slide 5111 to the alignment frame 511 through the reverse sliding of the third motor 514; conversely, the empty jig trolley 6 on the movable frame 518 is sent to the carrier loading device 2.

[0083] like Figure 11 As shown, the plate frame locking mechanism 517 includes a base 5175, on which a guide seat 5171 and a push-pull cylinder 5172 are provided, and the guide seat 5171 is provided with an F-shaped fastener 5173 that can slide relatively, and the movable end of the push-pull cylinder 5172 is connected to a driving plate 5174 that moves linearly along the slide groove on the guide seat 5171, and the end of the F-shaped fastener 5173 cooperates with the inclined driving slide groove 51740 on the driving plate 5174 through a pin shaft; the push-pull cylinder 5172 drives the F-shaped fastener 5173 to slide back and forth through the driving plate 5174, and controls the F-shaped clamping head at the front end of the F-shaped fastener 5173 through the inclined driving slide groove 51740 to lock the clamping plate frame 32 or release the lock of the fixture trolley 6.

[0084] like Figure 4 Figure 5 、 Figure 8 Figure 12 As shown, the carrier unloading and caching device 3 is similar in structure to the carrier loading device 2, except that one is used for unloading the fixture trolley 6 and the other is used for loading and caching the fixture trolley 6, that is, a caching station for the fixture trolley 6 is added to the carrier unloading and caching device 3; the carrier unloading and caching device 3 includes a base frame 34, two sets of parallel and double-station extraction and clamping mechanisms 31 and a plate frame loading seat 3 for caching and directly loading the fixture trolley 6 respectively. 3. The board frame loading seat 33 is provided with a plurality of slide rails 32 for supporting the jig trolley 6 and the forward and backward sliding guide input or output and a locking assembly 36 for positioning and locking the jig trolley; two sets of extraction and clamping mechanisms 31 are installed on the top side of the base frame 34 and are used to support the vertical PCB board transferred to the jig trolley 6 after feeding and moving horizontally, and then extract the PCB board from each workstation of the jig trolley 6 after clamping and moving horizontally to the PCB board unloading device 4; each set of extraction and clamping mechanisms 31 and Figure 8The structure of the plug-in and clamping mechanism 21 used in the middle loading is similar, except that it has an additional outward-pushing cylinder to prevent the PCB board from rubbing against the backplane when being pulled out. No excessive annotations are given here. Each set of extraction and clamping mechanisms 31 includes a plate moving drive motor, a linear slide assembly, an up and down lifting plug-in assembly 610 and multiple sets of clamping assemblies. The multiple sets of clamping assemblies are evenly installed at the bottom end of the up and down lifting plug-in assembly. Each set of clamping assemblies includes a clamping cylinder and a clamping hand driven by the clamping cylinder to open and close to clamp the end of the PCB board. The up and down lifting plug-in assembly is installed on the horizontal beam that slides left and right on the linear slide assembly. The plate moving drive motor drives the horizontal beam and the up and down lifting plug-in assembly through the gear belt, and slides left and right along the slide rails on both sides of the linear slide assembly.

[0085] like Figure 12 As shown, each group of up and down lifting plug components 31 and Figure 8 The upper and lower lifting and plugging components 215 and 217 used for loading materials are similar in structure and will not be described in detail here. The upper and lower lifting and plugging components 31 include a lifting motor and a worm linear module lifting frame. The lifting motor is installed on the crossbeam of the linear module. Multiple sets of clamping components are evenly installed at the bottom end of the linear module lifting frame. The lifting motor drives the linear module to lift and lower, and drives multiple sets of clamping components through the lifting frame at the lower end to synchronously clamp the PCB board in each limit slot of the political tool trolley 6 and move it upward to extract it.

[0086] like Figures 4 and 5 、 Figure 13 As shown, the PCB board unloading device 4 includes an unloading support frame 46, a PCB board positioning platform (not shown in the figure), a multi-joint unloading manipulator 43, an unloading slide board loading line 45 and two board loading boxes 42 and 44. The PCB board positioning platform is installed on the top side of the support frame, the multi-joint unloading manipulator 43 is fixedly installed in the middle of the top side of the unloading support frame 46, the unloading slide board loading line 45 corresponding to the multi-joint unloading manipulator 43 on the upper side is installed in the middle of the top side of the unloading support frame 46, and is used to receive the PCB board that is deflected 90° by the multi-joint unloading manipulator 43 in a horizontal state, and the two board loading boxes 42 and 44 are separately installed on the unloading slide board loading line 45. On the unloading support frame 46 on both sides of the rail loading line 45, the loading box 42 belongs to the manual loading position, and 44 belongs to the temporary storage position. If the material slide rail loading line 45 does not transfer downward, the multi-joint unloading robot 43 can put the PCB board into the loading box 44. The end of the multi-joint unloading robot 43 is equipped with a vacuum adsorption gripper frame for grabbing the carrier unloading and transferring the PCB board from the cache device 3 for vacuum adsorption. The multi-joint unloading robot 46 deflects the cleaned PCB boards one by one from the vertical state to the horizontal state through the vacuum adsorption gripper frame 41 and sends them to the unloading conveyor line 45, which can be directly exported to the next station. The vacuum adsorption gripper frame 41 and Figure 7The same is not described in detail here. At the same time, the multi-joint unloading manipulator 43 uses the vacuum adsorption gripper frame to adsorb and grab the empty carrier board supporting the PCB board on the fixture trolley and place it in the carrier board collection boxes 42 and 44 on both sides. In addition, the PCB board unloading device 4 is also provided with an artificial feeding port 42 for manually loading the PCB board to be processed.

[0087] A four-station rotary plasma processing system for dynamic scheduling of the above-mentioned device;

[0088] The system includes a rotating multi-cavity module, an infrared monitoring module, a scheduling control module, and a gas path integration module.

[0089] Specifically, the rotating multi-cavity module adopts a four-station annular cavity, a 316L stainless steel vacuum cavity with an inner diameter of Φ1200mm, and is equipped with a magnetic fluid rotating sealing interface. Each station integrates:

[0090] a. Dual-frequency RF source, 13.56MHz, 40.68MHz;

[0091] b. Six-nozzle gas matrix (Ar / O2 / CF4 mixed in a ratio of 3:1:0.2)

[0092] c. Gradient temperature control system (-30℃→80℃ linearly adjustable);

[0093] Infrared monitoring module:

[0094] The following parameters are collected in real time by online Fourier transform infrared spectrometer (FTIR):

[0095]

[0096] Where d is the thickness of the glue residue, λ = 2.5-25μm band, the resolution reaches 4cm-1;

[0097] Scheduling control module:

[0098] Dynamic scheduling algorithm implementation:

[0099]

[0100] Constraints: The weight coefficients w1 = 0.7, w2 = 0.3;

[0101] Gas path integrated module:

[0102] Multi-stage vortex pump group realizes vacuum gradient establishment:

[0103] Roughing stage: 10 3 Pa→10Pa(≤30s)

[0104] Fine pumping stage: 10Pa→0.1Pa(≤120s)

[0105] Gas flow dynamic equation:

[0106]

[0107] K is the conductivity coefficient, which is adjustable between 0.68-0.92.

[0108] Specifically, the dynamically scheduled four-station rotary plasma processing system includes the following steps:

[0109] Step 1: After the carrier enters the loading position, RFID reads the panel parameters

[0110] Step 2: Scheduling algorithm calculates the optimal workstation allocation plan

[0111] Step 3: Rotate the cavity to locate the target position according to the preset angle θ (θ = 90° × n, n = 0-3)

[0112] Step 4: FTIR real-time feedback of the adhesive residue removal rate is sent to the main control PLC for dynamic adjustment:

[0113] Step 5: RF power: 500W→1500W (±10W step)

[0114] Step 6: Gas ratio: O2 ratio is adjustable from 15% to 25%.

[0115] Step 7: After reaching the set threshold (α≤0.05μm-1), the discharge instruction is triggered.

[0116] Example 1: Four-station collaborative operation

[0117] 1. Initialization parameter settings:

[0118]

[0119] 2. Start the dynamic scheduling algorithm:

[0120] Using the Q-learning model, the reward function is:

[0121]

[0122] Where x = smear removal rate / target value;

[0123] 3. Exception handling mechanism:

[0124] When the vacuum leakage rate is greater than 5Pa / min, the third-level emergency response will be initiated.

[0125] Power fluctuation > ±15% triggers resonator frequency compensation;

[0126] Example 2: Variable parameter processing mode

[0127] For microporous plates with pore diameter less than 0.2 mm:

[0128] Adopt high frequency priority strategy (40.68MHz accounts for 70% of energy)

[0129] Gas pressure increased to 1.5 Torr

[0130] For thick copper plates (≥3oz):

[0131] Start dual-frequency coupling mode, and the proportion of low frequency (13.56MHz) increases to 60%.

[0132] CF4 pulse injection (5s period, 30% duty cycle) was introduced.

[0133] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A Plasma automatic connection line for PCB board production, used for automated plasma cleaning of PCB boards, characterized in that: include: Loading production line, used for automatic loading of PCB boards to be processed; PCB board loading device, which uses a robot to vertically transfer the PCB boards fed horizontally from the loading production line to the next station one by one; A carrier loading device is used to vertically insert the multiple PCB boards supplied by the PCB board loading device into the clamping plate frame of the empty carrier in sequence; An automatic transfer device for board frames and PCBs, which transfers the carrier loaded with multiple PCBs from the carrier loading device to the plasma station for plasma cleaning and transfers the cleaned PCBs and carriers to the unloading station, and transfers the empty carriers in the double stations after unloading to the loading station of the carrier loading device; A double-station plasma cleaning and etching machine automatically loads multiple PCB boards of the same batch transferred by the plate frame and the PCB board automatic transfer device into one or two cavities for simultaneous cleaning and desmearing, and then automatically unloads the boards; The carrier unloading and buffering device adopts a dual-station setting, which transfers the board frame and PCB board automatic transfer device to the clamping frame after cleaning and desmearing. The PCB boards are pre-stored according to the processing progress, or the PCB boards on the clamping frame are vertically extracted and transferred one by one to the unloading station; The PCB board unloading device uses a robot to turn the PCB boards unloaded by the carrier and vertically fed by the buffer device 90 degrees one by one and transfer them to the next workstation in a horizontal state; The blanking production line is used to horizontally receive the cleaned PCB boards that are transferred from the vertical direction to the horizontal direction by the PCB board blanking device, and automatically unload and output them; A four-station rotary plasma processing system for dynamic scheduling of the above-mentioned device; The system includes a rotating multi-cavity module, an infrared monitoring module, a scheduling control module, and a gas path integration module.

2. The Plasma automatic connection line for PCB board production according to claim 1, characterized in that: The rotating multi-cavity module adopts a four-station annular cavity, a 316L stainless steel vacuum cavity with an inner diameter of Φ1200mm, and is equipped with a magnetic fluid rotary sealing interface. Each station integrates: a. Dual-frequency RF source, b. Six-nozzle gas matrix, c. Gradient temperature control system; Infrared monitoring module: The following parameters are collected in real time by online Fourier transform infrared spectrometer (FTIR): Where d is the thickness of the glue residue, λ = 2.5-25μm band, the resolution reaches 4cm-1; Scheduling control module: Dynamic scheduling algorithm implementation: Constraints: The weight coefficients w1 = 0.7, w2 = 0.3; Gas path integrated module: Multi-stage vortex pump group realizes vacuum gradient establishment: Rough pumping stage, fine pumping stage; Gas flow dynamic equation: K is the conductivity coefficient, which is adjustable between 0.68-0.

92.

3. The Plasma automatic connection line for PCB board production according to claim 1, characterized in that: The dynamically scheduled four-station rotary plasma processing system includes the following steps: Step 1: After the carrier enters the loading position, RFID reads the panel parameters; Step 2: The scheduling algorithm calculates the optimal workstation allocation plan; Step 3: Rotate the cavity according to the preset angle θ to locate the target position; Step 4: FTIR real-time feedback of the adhesive residue removal rate is sent to the main control PLC for dynamic adjustment: Step 5: RF power; Step 6: Gas ratio; Step 7: Trigger the discharge command after reaching the set threshold.

4. The Plasma automatic connection line for PCB board production according to claim 1, characterized in that: The PCB board loading device adopts a double-station feed port setting. A hoisting and transverse movement mechanism is also provided between the PCB board loading device and the loading production line, which is used to feed the PCB boards horizontally placed on the loading production line relative to the feeding direction and adaptively enter from two different feed channels in the longitudinal direction after hoisting.

5. The Plasma automatic connection line for PCB board production according to claim 4, characterized in that: The PCB board loading device includes a loading support frame, a PCB board positioning platform, a multi-joint loading robot and two carrier collection boxes, the PCB board positioning platform is installed on the upper side of the loading support frame, and a visual camera for obtaining PCB board position information is installed on the loading support frame above the PCB board positioning platform, the multi-joint loading robot is fixedly installed in the middle of the loading support frame, and the two carrier collection boxes are separately installed on the loading support frame on both sides of the multi-joint loading robot, and the end of the multi-joint loading robot is installed with a vacuum adsorption gripper frame for vacuum adsorption to grab each PCB board to be processed transmitted from the loading production line, the multi-joint loading robot deflects the PCB boards to be processed one by one to a vertical state through the vacuum adsorption gripper frame and sends them to the clamping station of the carrier loading device, while the multi-joint loading robot adsorbs and grabs the empty carriers supporting and carrying PCB boards on the loading production line through the vacuum adsorption gripper frame and places them in the carriers on both sides respectively.

6. The Plasma automatic connection line for PCB board production according to claim 1, characterized in that: The carrier loading device includes a mounting frame, two groups of plug-in and clamping mechanisms arranged in parallel and in a double-station configuration, a clamping frame and a board frame positioning seat arranged in parallel at the double-station configuration for inserting PCB boards, and the board frame positioning seat is provided with a plurality of slide rails for supporting the clamping frame and sliding the guide input or output forward and backward and a locking assembly for positioning and locking the clamping frame; the two groups of plug-in and clamping mechanisms are installed on the top side of the mounting frame and are fed horizontally and used to clamp the vertical PCB board transferred to the PCB board feeding device and inserted into each station of the clamping frame after moving backward; each group of the plug-in and clamping mechanisms includes a board moving drive motor, a linear slide assembly, an up and down lifting plug-in assembly and multiple groups of clamping assemblies, and multiple groups of clamping assemblies are evenly installed at the bottom end of the up and down lifting plug-in assembly, and each group of opening and closing assemblies is used to lock the clamping frame. The clamping assembly includes an opening and closing cylinder and a clamping hand driven by the opening and closing cylinder to clamp the end of the PCB board. The up and down lifting and plugging assembly is installed on the beam that slides left and right on the linear slide assembly. The board moving drive motor drives the beam and the up and down lifting and plugging assembly through the gear belt and slides left and right along the slide rails on both sides of the linear slide assembly; the up and down lifting and plugging assembly includes a lifting motor and a screw belt linear lifting frame. The lifting motor is installed on the beam on the linear slide assembly. Multiple groups of opening and clamping assemblies are evenly installed at the bottom end of the screw belt linear lifting frame. The lifting motor drives the worm on the screw belt linear lifting frame to rotate, and drives the PCB board that is synchronously clamped by multiple groups of opening and clamping assemblies to move down through the lifting frame at the lower end and be inserted into each limit slot of the jig frame.

7. The Plasma automatic connection line for PCB board production according to claim 1, characterized in that: The plate frame and PCB board automatic transfer device includes a linear guide mechanism and a plate frame transfer mechanism, the plate frame transfer mechanism is slidably installed on the linear guide mechanism and is respectively positioned and stopped at the carrier unloading and loading station of the carrier loading device, the carrier unloading and loading station of each cavity on the double-station plasma cleaning and etching machine, and the carrier unloading and loading station of the PCB board unloading device; the linear guide mechanism includes a track frame, two first linear guides respectively arranged at the front and rear edges of the track frame and a track rack located in the middle of the track frame, the track rack is arranged parallel to and spaced apart from the first linear guide; the plate frame transfer mechanism includes a moving frame and a first driving motor, the moving frame is slidably installed on the first linear guide, the first driving motor is installed on the moving frame, and the driving end is provided with a gear meshing with the track rack, and the first driving motor drives the moving frame along the first linear guide. A straight guide rail slides horizontally and linearly; the moving frame is also provided with a second linear guide rail and a second motor, the second linear guide rail is provided with a positioning frame, and the positioning frame is provided with a docking linear slide rail, the second motor drives the positioning frame to slide along the second linear guide rail to drive the docking linear slide rail to dock with the loading station or the unloading station; the positioning frame is also fixedly connected to the third linear guide rail and a third motor, and the third linear guide rail is provided with a plate frame locking mechanism for locking the clamping frame, and the plate frame locking mechanism driven by the third motor through an annular gear belt slides forward along the third linear guide rail, approaches and locks the clamping frame through the pneumatic gripper of the plate frame locking mechanism, and drags the clamping frame along the docking linear slide rail to the positioning frame through reverse sliding of the third motor; conversely, the empty clamping frame on the moving frame is sent into the carrier loading device.

8. The Plasma automatic connection line for PCB board production according to claim 7, characterized in that: The plate frame locking mechanism includes a base, a guide seat and a push-pull cylinder are provided on the base, an F-shaped clip that can slide relatively is provided on the guide seat, the movable end of the push-pull cylinder is connected to a driving plate that moves laterally along a linear groove, and the end of the F-shaped clip cooperates with the oblique driving groove on the driving plate through a pin shaft; the push-pull cylinder drives the F-shaped clip to slide back and forth through the driving plate, and controls the F-shaped clip head at the front end of the F-shaped clip through the oblique driving groove to lock the splint frame or release the lock of the splint frame.

9. The Plasma automatic connection line for PCB board production according to claim 1, characterized in that: The carrier unloading and caching device includes a base frame, two groups of extraction and clamping mechanisms arranged in parallel and in a double-station configuration, and a plate frame loading seat for caching and directly loading the clamp frame respectively. The plate frame loading seat is provided with a plurality of slide rails for supporting the clamp frame and sliding the guide input or output forward and backward, and a locking assembly for positioning and locking the clamp frame; the two groups of the extraction and clamping mechanisms are installed on the top side of the base frame and are fed and moved horizontally to support the vertical PCB board transferred to the clamp frame, and after clamping, they are extracted from each station of the clamp frame and moved horizontally to the PCB board unloading device; each group of the extraction and clamping mechanisms includes a plate moving drive motor, a linear slide assembly, an up and down lifting and plugging assembly, and multiple groups of clamping assemblies, and multiple groups of the clamping assemblies are evenly installed at the bottom end of the up and down lifting and plugging assembly. The lifting motor drives the worm on the worm gear linear lift to rotate, and drives the multiple groups of clamping assemblies to synchronously clamp the PCB board in each limit slot of the clamping plate frame and move it upward to extract it through the lifting frame at the lower end.

10. The Plasma automatic connection line for PCB production according to claim 1, characterized in that: The PCB board unloading device includes a unloading support frame, a PCB board positioning platform, a multi-joint unloading manipulator, an unloading slide board loading line and two loading board collection boxes. The PCB board positioning platform is installed on the top side of the support frame. A visual camera for obtaining PCB board position information is installed on the unloading support frame above the PCB board positioning platform. The multi-joint unloading manipulator is fixedly installed in the middle of the top side of the unloading support frame. The multi-joint unloading manipulator on the upper side corresponding to the unloading slide board loading line is installed in the middle of the unloading support frame and is used to receive the PCB board that is deflected 90° by the multi-joint unloading manipulator in a horizontal state. The carrier collection boxes are separately installed on the unloading support frames on both sides of the unloading slide board line, and the end of the multi-joint unloading manipulator is installed with a vacuum adsorption gripper frame for grabbing the carrier unloading and the PCB board transferred from the buffer device by vacuum adsorption. The multi-joint unloading manipulator deflects the cleaned PCB boards one by one from a vertical state to a horizontal state through the vacuum adsorption gripper frame, sends them to the unloading slide board line and directly guides them out from the unloading production line. At the same time, the multi-joint unloading manipulator adsorbs and grabs the empty carriers supporting and carrying PCB boards on the splint frame through the vacuum adsorption gripper frame and places them in the carrier collection boxes on both sides respectively; The PCB board unloading device is also provided with a manual feeding port for manually loading unqualified or defective PCB boards and PCB boards to be processed; The PCB board loading device is also provided with a manual feeding port for manually loading unqualified or defective PCB boards and PCB boards to be processed.

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