Electromagnetic shielding packaging module, electromagnetic shielding packaging method and electronic product

Abstract

The invention discloses an electromagnetic shielding packaging module, an electromagnetic shielding packaging method and an electronic product, and relates to the technical field of semiconductors, the electromagnetic shielding packaging module comprises a substrate, at least two groups of electronic modules, at least two plastic packaging bodies and a sputtering shielding wall, the substrate is provided with a grounding layer, the electronic modules are arranged on the substrate, and the sputtering shielding wall is arranged on the substrate. One plastic package body wraps one electronic module, and a gap exists between two adjacent plastic package bodies; and the sputtering shielding wall covers the gap, the surface of the plastic package body and the outer side surface of the substrate, and is electrically connected with the grounding layer. According to the technical scheme provided by the invention, the weight of the electromagnetic shielding packaging module can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an electromagnetic shielding packaging module, an electromagnetic shielding packaging method and an electronic product. Background Art

[0002] With the rapid development of SIP (System-in-Package) packaging technology, electronic products are becoming increasingly complex. However, electromagnetic interference between modules (or devices) within these SIP-packaged products is becoming increasingly prominent. Electromagnetic shielding technology, which leverages the absorption and reflection of electromagnetic waves by metal shielding, can effectively reduce electromagnetic interference between electronic components within SIP-packaged products and between these components and the external environment.

[0003] Currently, to address the electromagnetic interference problem between electronic components within SIP packaged products, the following method is typically used: first, individual electronic components are mounted on a substrate. A plastic encapsulation process is then used to encapsulate all the electronic components on the substrate that require encapsulation (i.e., overall encapsulation). The encapsulated body is then slotted to expose the grounding copper layer on the substrate, forming grooves between the interfering electronic components. Conductive filler is then poured into the grooves to form a sputtering shielding wall, which is electrically connected to the grounding copper layer. Finally, a conductive material is used to create a conformal shielding layer on the surface of the encapsulated body to isolate the electronic components from interference sources in the external environment. In this method, the conductive filler is typically a high-density conductive material (such as conductive silver paste), resulting in a higher product weight. Summary of the Invention

[0004] The main purpose of the present invention is to provide an electromagnetic shielding packaging module, an electromagnetic shielding packaging method and an electronic product, aiming to reduce the weight of the electromagnetic shielding packaging module.

[0005] To achieve the above objectives, the present invention proposes an electromagnetic shielding packaging module, comprising:

[0006] a substrate having a ground layer;

[0007] At least two groups of electronic modules are arranged on the substrate;

[0008] At least two plastic packaging bodies, one plastic packaging body covering one electronic module, and a gap between two adjacent plastic packaging bodies;

[0009] The sputtering shielding wall covers the gap, the surface of the plastic package body and the outer side surface of the substrate, and the sputtering shielding wall is electrically connected to the ground layer.

[0010] In one embodiment, the thickness of the sputtering shielding wall is in the range of 2 μm to 20 μm; and / or,

[0011] The sputtering shielding wall includes a first stainless steel layer, a copper layer and a second stainless steel layer which are stacked.

[0012] In one embodiment, the electronic module includes a first electronic module, a second electronic module, and a third electronic module sequentially spaced apart from each other on the substrate;

[0013] The plastic sealing body includes two first plastic sealing bodies and one second plastic sealing body, the two first plastic sealing bodies respectively cover the first electronic module and the third electronic module, the second plastic sealing body covers the second electronic module, and there is a gap between the first plastic sealing body and the second plastic sealing body;

[0014] The sputtering shielding wall includes a first sputtering shielding wall and a second sputtering shielding wall connected to each other, wherein the first sputtering shielding wall covers the gap and the surface of the first plastic package away from the substrate, and the second sputtering shielding wall covers at least the surface of the second plastic package away from the substrate, the outer side surface of the first plastic package and the outer side surface of the substrate.

[0015] In one embodiment, the first sputtering shield wall includes a first sputtering shield segment and a second sputtering shield segment connected to each other, the first sputtering shield segment covers the gap, and the second sputtering shield segment covers the surface of the first plastic package away from the substrate;

[0016] The thickness of the first sputtering shield segment is 2 μm-7 μm, and the thickness of the second sputtering shield segment is 4 μm-20 μm.

[0017] In one embodiment, the thickness of the plastic package is defined as H1, and the thickness of the electronic module is defined as H0, and the following relationship is satisfied: 40 μm ≤ (H1 − H0) ≤ 500 μm.

[0018] The present invention also provides an electromagnetic shielding packaging method, comprising the following steps:

[0019] A substrate and at least two groups of electronic modules are provided, wherein the substrate is provided with a ground layer and at least two mounting areas;

[0020] Mounting electronic modules in one of two adjacent mounting areas;

[0021] Performing a first plastic packaging on the mounted electronic module to form a first plastic packaging body;

[0022] sputtering a first sputtering shielding wall on the first plastic package, so that the first sputtering shielding wall covers the surface of the first plastic package away from the substrate and the inner side of the first plastic package, and the first sputtering shielding wall is electrically connected to the ground layer;

[0023] Place the unmounted electronic module in another mounting area between two adjacent mounting areas;

[0024] Performing a second plastic sealing on the mounted electronic module to form a second plastic sealing body;

[0025] Cut into single modules, sputter-plate a second sputtering shielding wall on the second plastic package body, so that the second sputtering shielding wall at least covers the surface of the second plastic package body away from the substrate, the outer surface of the first plastic package body and the outer side surface of the substrate, and the second sputtering shielding wall is connected to the first sputtering shielding wall to form a sputtering shielding wall to obtain an electromagnetic shielding module.

[0026] In one embodiment, after performing a first plastic packaging step on the mounted electronic module to form a first plastic packaging body and before performing a first sputtering shielding wall on the first plastic packaging body, the method further includes:

[0027] Applying a layer of protective glue on the mounting area where no electronic module is mounted, and exposing the ground layer at the edge of the first plastic package body;

[0028] After the step of sputtering the first sputtering shielding wall on the first plastic package body and before the step of mounting the unmounted electronic module on the other mounting area of the two adjacent mounting areas, the method further includes:

[0029] The protective glue is removed.

[0030] In one embodiment, after the step of performing a first plastic packaging on the electronic module to form a first plastic packaging body, and before the step of coating a layer of protective glue covering the ground layer on the mounting area where no electronic module is mounted, the method further includes:

[0031] removing the plastic packaging material overflowing from the gap between two adjacent electronic modules; and / or,

[0032] After the step of removing the protective glue and before the step of mounting the unmounted electronic module on another mounting area of the two adjacent mounting areas, the method further includes:

[0033] Remove the protective glue remaining in the space between two adjacent electronic modules.

[0034] In one embodiment, the electronic module includes a first electronic module, a second electronic module, and a third electronic module that generate electromagnetic waves with each other, and the substrate is provided with a first mounting area, a second mounting area, and a third mounting area that are sequentially arranged;

[0035] The steps of mounting an electronic module in one of two adjacent mounting areas include:

[0036] Mounting the first electronic module and the third electronic module in the first mounting area and the third mounting area respectively;

[0037] The step of performing a first plastic encapsulation on the mounted electronic module to form a first plastic encapsulation body includes:

[0038] Performing a first plastic packaging on the first electronic module and the third electronic module to form two first plastic packaging bodies;

[0039] The steps of mounting an unmounted electronic module in another mounting area of two adjacent mounting areas include:

[0040] Mounting a second electronic module in the second mounting area;

[0041] The step of performing a second plastic sealing on the mounted electronic module to form a second plastic sealing body includes:

[0042] The second module is plastic-sealed for the second time to form a second plastic-sealed body.

[0043] The present invention further provides an electronic product, which includes the electromagnetic shielding module as described above, or includes the electromagnetic shielding module obtained by adopting the electromagnetic shielding packaging method as described above.

[0044] The electromagnetic shielding packaging module provided by the present invention includes a substrate, at least two groups of electronic modules, at least two plastic-encapsulated bodies and a sputtering shielding wall. The substrate is provided with a grounding layer, the electronic modules are arranged on the substrate, one plastic-encapsulated body covers one electronic module, and there is a gap between two adjacent plastic-encapsulated bodies; the sputtering shielding wall covers the gap, the surface of the plastic-encapsulated body and the outer side of the substrate, and the sputtering shielding wall is electrically connected to the grounding layer. The above technical solution of the present invention separates each group of electronic modules by the sputtering shielding wall, which can achieve the effect of cavity shielding, and compared with the existing high-density conductive filler, the weight of the sputtering shielding wall of the present invention is relatively small, so the weight of the electromagnetic shielding packaging module is relatively low. At the same time, the sputtering shielding wall used in the present invention is usually a thin film structure with a relatively small thickness, thereby reducing the lateral size of the electromagnetic shielding packaging module, and then reducing the volume of the electromagnetic shielding packaging module, which is conducive to the miniaturization of the electromagnetic shielding packaging module. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0046] Figure 1 A schematic cross-sectional view of an embodiment of an electromagnetic shielding packaging module provided by the present invention;

[0047] Figure 2 A schematic diagram of the structure involved in the electromagnetic shielding packaging method provided by the present invention;

[0048] Figure 3 A schematic flow chart of the steps of an embodiment of the electromagnetic shielding packaging method provided by the present invention;

[0049] Figure 4 A schematic flow chart of steps of another embodiment of the electromagnetic shielding packaging method provided by the present invention;

[0050] Figure 5 This is a schematic flow chart of the steps of another embodiment of the electromagnetic shielding packaging method provided by the present invention.

[0051] Description of Figure Numbers:

[0052] 100. Electromagnetic shielding packaging module; 1. Substrate; 11. Ground layer; 2. First electronic module; 3. Second electronic module; 4. Third electronic module; 5. First plastic package; 6. Second plastic package; 7. First sputtering shielding wall; 71. First sputtering shielding section; 72. Second sputtering shielding section; 8. Second sputtering shielding wall; 9. Protective glue.

[0053] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0055] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0056] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0057] Currently, to address the electromagnetic interference problem between electronic components within SIP packaged products, the following method is typically used: first, individual electronic components are mounted on a substrate. A plastic encapsulation process is then used to encapsulate all the electronic components on the substrate that require encapsulation (i.e., overall encapsulation). The encapsulated body is then slotted to expose the grounding copper layer on the substrate, forming grooves between the interfering electronic components. Conductive filler is then poured into the grooves to form a sputtering shielding wall, which is electrically connected to the grounding copper layer. Finally, a conductive material is used to create a conformal shielding layer on the surface of the encapsulated body to isolate the electronic components from interference sources in the external environment. In this method, the conductive filler is typically a high-density conductive material (such as conductive silver paste), resulting in a higher product weight.

[0058] In order to solve the above technical problems, the present invention proposes an electromagnetic shielding module, aiming to reduce the weight of the electromagnetic shielding packaging module.

[0059] See also Figure 1 In one embodiment of the present invention, an electromagnetic shielding packaging module 100 includes a substrate 1, at least two groups of electronic modules, at least two plastic-encapsulated bodies and a sputtering shielding wall. The substrate 1 is provided with a grounding layer 11. The electronic module is arranged on the substrate 1. One plastic-encapsulated body covers one electronic module, and there is a gap between two adjacent plastic-encapsulated bodies; the sputtering shielding wall covers the gap, the surface of the plastic-encapsulated body and the outer side of the substrate 1, and the sputtering shielding wall is electrically connected to the grounding layer 11.

[0060] The substrate 1 can be optionally a printed circuit board (i.e., a PCB board), and electronic components of different functions and types (including but not limited to chips, resistors, capacitors, etc.) are mounted on the substrate 1. These electronic components are divided into multiple groups of electronic modules (at least two groups) according to their functions and whether they generate electromagnetic waves (form electromagnetic interference) with each other. Each group of electronic modules contains at least one electronic component. The number and type of electronic components in each group of electronic modules can be the same or different, and are not limited here. There is no electromagnetic interference between the electronic components in the electronic modules of the same group, but electromagnetic waves are generated between the electronic modules of different groups, thereby causing electromagnetic interference. The number of plastic encapsulation bodies is the same as the number of electronic modules, and one plastic encapsulation body corresponds to covering one electronic module. The plastic encapsulation body is mainly used to effectively protect the electronic components in the electronic module and further fix the various electronic components in the electronic module. In addition, there is a gap between two adjacent plastic encapsulation bodies, and the grounding layer 11 located at the gap on the substrate 1 is exposed. The sputtering shielding wall covers the gap, the surface of the plastic encapsulation body, and the outer side of the substrate 1, thereby achieving electrical connection between the sputtering shielding wall and the grounding layer 11 at the gap. The sputtering shielding wall can separate the groups of electronic modules that generate electromagnetic waves from each other, achieving the effect of cavity shielding. At the same time, the sputtering shielding wall can also isolate the electronic components inside the electromagnetic shielding module from the interference sources in the external environment, achieving the function of common shielding.

[0061] The above-described technical solution of the present invention achieves a cavity-specific shielding effect by separating the groups of electronic modules that generate electromagnetic waves from each other through the use of sputtering shielding walls. Compared to existing high-density conductive fillers, the sputtering shielding walls of the present invention are relatively lightweight, resulting in a relatively low weight for electromagnetic shielding packaging module 100. Furthermore, the sputtering shielding walls employed in the present invention are typically thin-film structures with a relatively low thickness, thereby reducing the lateral dimensions of electromagnetic shielding packaging module 100 and, consequently, the volume of electromagnetic shielding packaging module 100, thereby facilitating miniaturization of electromagnetic shielding packaging module 100.

[0062] In an optional embodiment of the present invention, the thickness of the sputtering shielding wall ranges from 2 μm to 20 μm (e.g., 2 μm, 5 μm, 10 μm, 15 μm, 20 μm, and any interval between the two end points). Compared to the existing method of slotting and filling with conductive filler (the slot width is typically 100 μm to 400 μm), the sputtering shielding wall used in the embodiment of the present invention is relatively thin, thereby reducing the lateral dimensions of the electromagnetic shielding package module 100 and, in turn, the volume of the electromagnetic shielding package module 100, thereby facilitating miniaturization of the electromagnetic shielding package module 100.

[0063] In an optional embodiment of the present invention, the sputtering shield wall includes a first stainless steel layer, a copper layer, and a second stainless steel layer which are stacked.

[0064] The copper layer has both good electromagnetic shielding and electrical conductivity, effectively providing shielding performance and reducing electromagnetic interference. The first and second stainless steel layers both have good adhesion, ensuring the stability of the sputtering shielding wall. They also offer good mechanical strength and corrosion resistance, thereby extending the service life of the sputtering shielding wall. It should be noted that the sputtering shielding wall of the above structure can be prepared using a sputtering process, specifically by sequentially sputtering a first stainless steel layer, a copper layer, and a second stainless steel layer, which is a relatively simple operation.

[0065] Compared to the existing high-density conductive fillers (such as conductive silver paste), the sputtering shielding wall used in the embodiment of the present invention is lighter, thereby reducing the weight of the electromagnetic shielding packaging module 100.

[0066] See also Figure 1 and Figure 2 In one embodiment of the present invention, the electronic module includes a first electronic module 2, a second electronic module 3 and a third electronic module 4 which are arranged in sequence on a substrate 1; the plastic package includes two first plastic packages 5 and one second plastic package 6, the two first plastic packages 5 respectively cover the first electronic module 2 and the third electronic module 4, the second plastic package 6 covers the second electronic module 3, and there is a gap between the first plastic package 5 and the second plastic package 6; the sputtering shielding wall includes a first sputtering shielding wall 7 and a second sputtering shielding wall 8 which are connected to each other, the first sputtering shielding wall 7 covers the gap and the surface of the first plastic package 5 away from the substrate 1, and the second sputtering shielding wall 8 covers at least the surface of the second plastic package 6 away from the substrate 1, the outer side surface of the first plastic package 5 and the outer side surface of the substrate 1.

[0067] The following description assumes that the substrate 1 is placed horizontally. The first electronic module 2, the second electronic module 3, and the third electronic module 4 are sequentially mounted on the upper surface of the substrate 1 from left to right, i.e., the second electronic module 3 is located between the first electronic module 2 and the second electronic module 3. Accordingly, the number of plastic encapsulation bodies is three, i.e., two first plastic encapsulation bodies 5 and one second plastic encapsulation body 6. The two first plastic encapsulation bodies 5 respectively cover the first electronic module 2 and the third electronic module 4, and the second plastic encapsulation body 6 covers the second electronic module 3. In other words, the second plastic encapsulation body 6 is located between the two first plastic encapsulation bodies 5, and there is a gap between the first plastic encapsulation body 5 and the second plastic encapsulation body 6. Optionally, the two first plastic encapsulation bodies 5 have the same thickness, i.e., the two first plastic encapsulation bodies 5 can be obtained by plastic encapsulation in one step. The thickness of the second plastic encapsulation body 6 can be the same as that of the first plastic encapsulation body 5, or it can be different, which is not limited here. Specifically, the thickness of the first plastic encapsulation body 5 and the second plastic encapsulation body 6 can be determined according to the height of the electronic components in the corresponding electronic module. Optionally, the first sputtering shielding wall 7 and the second sputtering shielding wall 8 are formed by sputtering twice, and since the current electromagnetic shielding packaging module 100 is manufactured by integral packaging, the first sputtering shielding wall 7 formed by the first sputtering covers the gap between the first plastic packaging body 5 and the second plastic packaging body 6, and the upper surfaces of the two first plastic packaging bodies 5; and in the overall packaging production process, it is finally necessary to cut into single pieces and then perform a second sputtering to form the second sputtering shielding wall 8, then the second sputtering shielding wall 8 covers the upper surface of the second plastic packaging body 6, the upper surface of the first sputtering shielding wall 7, the outer surface of the first plastic packaging body 5 and the outer surface of the substrate 1. In this way, the connection between the first sputtering shielding wall 7 and the second sputtering shielding wall 8 can be achieved, and the sputtering shielding wall located on the upper surface of the first plastic package 5 includes a portion of the first sputtering shielding wall 7 and a portion of the second sputtering shielding wall 8 that are stacked, while the sputtering shielding wall located on the upper surface of the second plastic package 6 only includes a portion of the second sputtering shielding wall 8. In this way, the thickness of the sputtering shielding wall located on the upper surface of the first plastic package 5 is greater than the thickness of the sputtering shielding wall located on the upper surface of the second plastic package 6. Optionally, the thickness of the sputtering shielding wall located on the upper surface of the first plastic package 5 is twice the thickness of the sputtering shielding wall located on the upper surface of the second plastic package 6.

[0068] Of course, in some other embodiments, when performing the second sputtering operation to form the second sputtering shielding wall 8, selective sputtering can be performed to form the second sputtering shielding wall 8 covering the upper surface of the second package body, the outer side surface of the first plastic package body 5, and the outer side surface of the substrate 1. In this way, the sputtering shielding wall located on the upper surface of the first plastic package body 5 only includes a portion of the first sputtering shielding wall 7, and the sputtering shielding wall located on the upper surface of the second plastic package body 6 only includes a portion of the second sputtering shielding wall 8. Optionally, the thickness of the sputtering shielding wall located on the upper surface of the first plastic package body 5 is the same as the thickness of the sputtering shielding wall located on the upper surface of the second plastic package body 6.

[0069] Please refer again Figure 1 and Figure 2 In one embodiment of the present invention, the first sputtering shielding wall 7 includes a first sputtering shielding segment 71 and a second sputtering shielding segment 72 connected to each other, the first sputtering shielding segment 71 covers the gap, and the second sputtering shielding segment 72 covers the surface of the first plastic package 5 away from the substrate 1; the thickness of the first sputtering shielding segment 71 is 2μm-7μm, and the thickness of the second sputtering shielding segment 72 is 4-20μm.

[0070] The first sputtering shielding segment 71 covers the gap between the first plastic package 5 and the second plastic package 6, and the second sputtering shielding segment 72 covers the upper surface of the first plastic package 5. Since the thickness of the coating formed on the upper surface is greater than the thickness of the coating formed on the side during normal sputtering (such as magnetron sputtering), if it is necessary to ensure that the thickness of the coating formed on the upper surface is the same as the thickness of the coating formed on the side, it is necessary to optimize the sputtering operation parameters. In the embodiment of the present invention, the thickness of the first sputtering shielding segment 71 is less than the thickness of the second sputtering shielding segment 72, and there is no need to optimize the sputtering parameters. Normal sputtering operation is sufficient, and the operation is relatively simple. In addition, the thickness of the first sputtering shielding segment 71 covering the gap between the first plastic package 5 and the second plastic package 6 is relatively small, which is more conducive to reducing the lateral size of the electromagnetic shielding module, and further more conducive to reducing the volume of the electromagnetic shielding module and achieving its miniaturization.

[0071] Optionally, the thickness of the first sputtering shield segment 71 is 2μm-7μm (for example, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm and an interval value between any two end points), and the thickness of the second sputtering shield segment 72 is 4-20μm (for example, 4μm, 10μm, 15μm, 20μm and an interval value between any two end points).

[0072] In an optional embodiment of the present invention, the thickness of the plastic encapsulation is defined as H1, and the thickness of the electronic module is defined as H0. Then, 40μm ≤ (H1 - H0) ≤ 500μm is satisfied. In other words, the thickness of the plastic encapsulation is 40μm-500μm greater than the thickness of the corresponding electronic module (e.g., 40μm, 100μm, 200μm, 300μm, 400μm, 500μm, and any range between these two endpoints). This design provides excellent physical protection and mechanical support.

[0073] The present invention also provides an electromagnetic shielding packaging method for preparing the electromagnetic shielding packaging module 100 as described above.

[0074] See also Figure 3 In one embodiment of the present invention, the electromagnetic shielding packaging method includes the following steps:

[0075] Step S1 : providing a substrate 1 and at least two sets of electronic modules, wherein the substrate 1 is provided with a ground layer 11 and at least two mounting areas.

[0076] The substrate 1 is a printed circuit board with a ground layer 11. The substrate 1 is provided with mounting areas for electronic modules. The number of mounting areas is the same as the number of electronic modules. One mounting area is used to mount one electronic module, and the electronic modules in different mounting areas generate electromagnetic waves with each other, forming electromagnetic interference.

[0077] Step S2: mounting an electronic module in one of two adjacent mounting areas.

[0078] In two adjacent placement areas, the corresponding electronic module is placed in one area first. In other words, electronic modules are placed in every other placement area. Specifically, if there are two placement areas, the corresponding electronic module is placed in one area first; if there are three placement areas, the corresponding electronic modules are placed in the two edge placement areas first.

[0079] Step S3 , performing a first plastic packaging on the mounted electronic module to form a first plastic packaging body 5 .

[0080] The mounted electronic module is subjected to a first plastic sealing process to form a first plastic sealing body 5, which covers the mounted electronic module. If two or more electronic modules are mounted in step S2, two or more first plastic sealing bodies 5 are formed, and one first plastic sealing body 5 covers one mounted electronic module. Moreover, since the electronic modules are mounted in every mounting area in step S2, the mounting area of the two or more first plastic sealing bodies 5 formed is between two adjacent first plastic sealing bodies 5 where no electronic modules are mounted. It should be noted that the ground layer 11 is located at the edge of the mounting area where no electronic modules are mounted.

[0081] In step S4 , a first sputtering shielding wall 7 is sputtered on the first plastic package 5 , so that the first sputtering shielding wall 7 covers the surface of the first plastic package 5 away from the substrate 1 and the inner side surface of the first plastic package 5 , and the first sputtering shielding wall 7 is electrically connected to the ground layer 11 .

[0082] The first sputtering is performed on the first plastic package body 5 to form a first sputtering shielding wall 7. The first sputtering shielding wall 7 covers the upper surface of the first plastic package body 5 and the inner side surface of the first plastic package body 5. Since the grounding layer 11 is located at the edge of the mounting area where the electronic module is not mounted, the formed first sputtering shielding wall 7 is electrically connected to the grounding layer 11.

[0083] In a specific embodiment, the first sputtering step is as follows: first, a first stainless steel layer is sputtered, then a copper layer is sputtered, and finally, a second stainless steel layer is sputtered. The formed first sputtering shield wall 7 includes a first stainless steel layer, a copper layer, and a second stainless steel layer stacked together. The thicknesses of the first stainless steel layer, the copper layer, and the second stainless steel layer can be determined based on actual conditions and are not limited herein.

[0084] Step S5: Mount the unmounted electronic module in another mounting area of the two adjacent mounting areas.

[0085] The remaining electronic modules are placed in the unmounted mounting areas. Since electronic modules are placed in every other mounting area in step S2, the electronic modules placed in step S5 are also placed in every other mounting area. If there are two mounting areas and two electronic modules, step S2 first places the electronic module in one of the mounting areas, and step S5 places the corresponding electronic module in the other mounting area. If there are three mounting areas, step S2 first places the corresponding electronic modules in the two edge mounting areas, and step S5 places the corresponding electronic module in the center mounting area.

[0086] Step S6 , performing a second plastic packaging on the mounted electronic module to form a second plastic packaging body 6 .

[0087] The electronic module mounted in step S5 (i.e., the second mounting) is subjected to a second plastic encapsulation to form a second plastic encapsulation body 6. The second plastic encapsulation body 6 covers the electronic module mounted in step S5 (i.e., the second mounting). The height of the second plastic encapsulation body 6 can be the same as or different from the height of the first plastic encapsulation body 5, which is not limited here.

[0088] Step S7, cutting into a single module, sputtering a second sputtering shielding wall 8 on the second plastic package 6, so that the second sputtering shielding wall 8 at least covers the surface of the second plastic package 6 away from the substrate 1, the outer surface of the first plastic package 5 and the outer side of the substrate 1, the second sputtering shielding wall 8 is connected to the first sputtering shielding wall 7 to form a sputtering shielding wall to obtain an electromagnetic shielding module.

[0089] The present invention takes into account the convenience and efficiency of preparation, and generally performs overall plastic sealing and sputtering on the electronic modules of multiple electromagnetic shielding packaging modules, that is, the operations of steps S1-S6 result in multiple modules. In step S7, it is first cut into single modules of appropriate size, and then the entire module is sputtered for a second time to form a second sputtering shielding wall 8. The second sputtering shielding wall 8 covers the upper surface of the second plastic packaging body 6, the upper surface of the first sputtering shielding wall 7, the outer surface of the first plastic packaging body 5, and the outer surface of the substrate 1. In this way, the first sputtering shielding wall 7 and the second sputtering shielding wall 8 are connected, and together form a shielding wall, that is, the electromagnetic shielding packaging module 100.

[0090] The electromagnetic shielding packaging method provided by the present invention utilizes two mounting operations, two plastic encapsulation operations, and two sputtering operations (i.e., a method combining selective mounting, selective plastic encapsulation, and selective sputtering) to produce an electromagnetic shielding packaging module 100 that achieves cavity shielding. This method is relatively simple to operate and does not require expensive laser slotting equipment, resulting in relatively low production costs. Furthermore, the sputtering shielding wall formed by the sputtering process of the present invention has a relatively small thickness, thereby reducing the lateral dimensions of the electromagnetic shielding packaging module 100 and, in turn, the volume of the electromagnetic shielding packaging module 100, thereby facilitating miniaturization of the electromagnetic shielding packaging module 100.

[0091] Please refer again Figure 3 In some embodiments of the present invention, after step S3 and before step S4, the method further includes:

[0092] In step S31 , a layer of protective glue 9 is applied to the mounting area where no electronic module is mounted, and the ground layer 11 at the edge of the first plastic package body 5 is exposed.

[0093] The protective glue 9 can be selected as ultraviolet light curing glue (i.e., UV glue). The protective glue 9 covers the pads at the mounting area where the electronic module is not mounted, and plays a role in protecting the pads, so as to effectively prevent the subsequent sputtering operation from damaging the pads and hindering the subsequent electrical connection operation between the electronic module and the pads. The thickness of the protective glue 9 is not limited, as long as it can play the role of protecting the pads. The length of the protective glue 9 should be appropriate and cannot cover the ground layer 11 at the edge of the first plastic package 5, that is, the ground layer 11 at the edge of the first plastic package 5 is exposed to facilitate the subsequent electrical connection between the first sputtering shielding wall 7 and the ground layer 11.

[0094] Please refer again Figure 3 In some embodiments of the present invention, after step S4 and before step S5, the method further includes:

[0095] Step S41 , removing the protective glue 9 .

[0096] The protective glue 9 can be removed by a physical removal method (such as a mechanical stripping method), a chemical dissolution method, a heating softening method, etc., to facilitate the subsequent mounting of electronic modules.

[0097] See also Figure 4 In some embodiments of the present invention, after step S3 and before step S31, the method further includes:

[0098] Step S30: removing the plastic packaging material overflowing from the gap between two adjacent electronic modules.

[0099] During the first molding operation, the molding compound may overflow and cover the ground layer 11 at the edge, so the overflowed molding compound must be removed. Optionally, the molding compound can be removed by scanning with a common laser device. Of course, other reasonable physical removal methods or chemical removal methods can also be used for removal.

[0100] After step S41 and before step S5, the method further includes:

[0101] Step S42 , removing the protective glue 9 remaining in the gap between two adjacent electronic modules.

[0102] When removing the protective adhesive 9, improper handling may result in incomplete removal, leaving residual protective adhesive 9 and affecting the subsequent placement of electronic modules. Therefore, it is necessary to effectively remove the residual protective adhesive 9. Alternatively, the residual protective adhesive 9 can be removed by scanning with a common laser device. Of course, other reasonable physical removal methods or chemical removal methods can also be used for removal.

[0103] In a specific embodiment of the present invention, the electronic module includes a first electronic module 2, a second electronic module 3 and a third electronic module 4 that generate electromagnetic waves with each other, and the substrate 1 is provided with a first mounting area, a second mounting area and a third mounting area arranged in sequence; see Figure 5 , electromagnetic shielding packaging methods include the following:

[0104] Step S2a, mounting the first electronic module 2 and the third electronic module 4 in the first mounting area and the third mounting area respectively;

[0105] Step S3a, performing a first plastic packaging on the first electronic module 2 and the second electronic module 3 to form two first plastic packaging bodies 5;

[0106] Step S31a, coating a layer of protective glue 9 on the second mounting area, and exposing the ground layer 11 at the edge of the first plastic package 5;

[0107] Step S4a, sputtering a first sputtering shielding wall 7 on the two first plastic packaging bodies 5, so that the first sputtering shielding wall 7 covers the surface of each first plastic packaging body 5 away from the substrate 1 and the inner side surface of each first plastic packaging body 5, and the first sputtering shielding wall 7 is electrically connected to the ground layer 11;

[0108] Step S41, removing the protective glue 9;

[0109] Step S5a, mounting the second electronic module 3 in the second mounting area;

[0110] Step S6a, performing a second plastic packaging on the second electronic module 3 to form a second plastic packaging body 6;

[0111] Step S7a, cutting into a single module, sputtering a second sputtering shielding wall 8 on the second plastic package 6, so that the second sputtering shielding wall 8 covers the surface of the second plastic package 6 away from the substrate 1, the surface of the first sputtering shielding wall 7 away from the substrate 1, the outer surface of the first plastic package 5 and the outer side surface of the substrate 1, the second sputtering shielding wall 8 is connected to the first sputtering shielding wall 7 to form a sputtering shielding wall to obtain an electromagnetic shielding module.

[0112] The present invention also proposes an electronic product, including an electromagnetic shielding packaging module 100. The specific structure of the electromagnetic shielding packaging module 100 refers to the above-mentioned embodiment. Since this electronic product adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0113] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformation made by utilizing the contents of the present invention's description and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. An electromagnetic shielding packaging module, characterized in that: include: a substrate having a ground layer; At least two groups of electronic modules are arranged on the substrate; At least two plastic packaging bodies, one plastic packaging body covering one electronic module, and a gap between two adjacent plastic packaging bodies; The sputtering shielding wall covers the gap, the surface of the plastic package body and the outer side surface of the substrate, and the sputtering shielding wall is electrically connected to the ground layer.

2. The electromagnetic shielding packaging module according to claim 1, wherein: The thickness of the sputtering shielding wall is in the range of 2 μm to 20 μm; and / or, The sputtering shielding wall includes a first stainless steel layer, a copper layer and a second stainless steel layer which are stacked.

3. The electromagnetic shielding packaging module according to claim 1, wherein: The electronic module includes a first electronic module, a second electronic module and a third electronic module which are sequentially arranged on the substrate at intervals; The plastic sealing body includes two first plastic sealing bodies and one second plastic sealing body, the two first plastic sealing bodies respectively cover the first electronic module and the third electronic module, the second plastic sealing body covers the second electronic module, and there is a gap between the first plastic sealing body and the second plastic sealing body; The sputtering shielding wall includes a first sputtering shielding wall and a second sputtering shielding wall connected to each other, wherein the first sputtering shielding wall covers the gap and the surface of the first plastic package away from the substrate, and the second sputtering shielding wall covers at least the surface of the second plastic package away from the substrate, the outer side surface of the first plastic package and the outer side surface of the substrate.

4. The electromagnetic shielding packaging module according to claim 3, wherein: The first sputtering shielding wall comprises a first sputtering shielding segment and a second sputtering shielding segment connected to each other, the first sputtering shielding segment covers the gap, and the second sputtering shielding segment covers the surface of the first plastic package away from the substrate; The thickness of the first sputtering shield segment is 2 μm-7 μm, and the thickness of the second sputtering shield segment is 4 μm-20 μm.

5. The electromagnetic shielding packaging module according to any one of claims 1 to 4, characterized in that: Define the thickness of the plastic package as H1 and the thickness of the electronic module as H0, then 40 μm ≤ (H1-H0) ≤ 500 μm is satisfied.

6. An electromagnetic shielding packaging method, characterized in that: The following steps are involved: A substrate and at least two groups of electronic modules are provided, wherein the substrate is provided with a ground layer and at least two mounting areas; Mounting electronic modules in one of two adjacent mounting areas; Performing a first plastic packaging on the mounted electronic module to form a first plastic packaging body; sputtering a first sputtering shielding wall on the first plastic package, so that the first sputtering shielding wall covers the surface of the first plastic package away from the substrate and the inner side of the first plastic package, and the first sputtering shielding wall is electrically connected to the ground layer; Place the unmounted electronic module in another mounting area between two adjacent mounting areas; Performing a second plastic sealing on the mounted electronic module to form a second plastic sealing body; Cut into single modules, sputter-plate a second sputtering shielding wall on the second plastic package body, so that the second sputtering shielding wall at least covers the surface of the second plastic package body away from the substrate, the outer surface of the first plastic package body and the outer side surface of the substrate, and the second sputtering shielding wall is connected to the first sputtering shielding wall to form a sputtering shielding wall to obtain an electromagnetic shielding module.

7. The electromagnetic shielding packaging method according to claim 6, wherein: After performing a first plastic packaging step on the mounted electronic module to form a first plastic packaging body, and before performing a first sputtering shielding wall on the first plastic packaging body, the method further includes: Applying a layer of protective glue on the mounting area where no electronic module is mounted, and exposing the ground layer at the edge of the first plastic package body; After the step of sputtering the first sputtering shielding wall on the first plastic package body and before the step of mounting the unmounted electronic module on the other mounting area of the two adjacent mounting areas, the method further includes: The protective glue is removed.

8. The electromagnetic shielding packaging method according to claim 7, wherein: After the step of performing a first plastic packaging on the electronic module to form a first plastic packaging body, and before the step of coating a layer of protective glue covering the ground layer on the mounting area where no electronic module is mounted, the method further includes: removing the plastic packaging material overflowing from the gap between two adjacent electronic modules; and / or, After the step of removing the protective glue and before the step of mounting the unmounted electronic module on another mounting area of the two adjacent mounting areas, the method further includes: Remove the protective glue remaining in the space between two adjacent electronic modules.

9. The electromagnetic shielding packaging method according to any one of claims 6 to 8, characterized in that: The electronic module includes a first electronic module, a second electronic module and a third electronic module that generate electromagnetic waves with each other, and the substrate is provided with a first mounting area, a second mounting area and a third mounting area that are arranged in sequence; The steps of mounting an electronic module in one of two adjacent mounting areas include: Mounting the first electronic module and the third electronic module in the first mounting area and the third mounting area respectively; The step of performing a first plastic encapsulation on the mounted electronic module to form a first plastic encapsulation body includes: Performing a first plastic packaging on the first electronic module and the third electronic module to form two first plastic packaging bodies; The steps of mounting an unmounted electronic module in another mounting area of two adjacent mounting areas include: Mounting a second electronic module in the second mounting area; The step of performing a second plastic sealing on the mounted electronic module to form a second plastic sealing body includes: The second module is plastic-sealed for the second time to form a second plastic-sealed body.

10. An electronic product, characterized in that: The electronic product includes the electromagnetic shielding module according to any one of claims 1 to 5, or includes an electromagnetic shielding module obtained by the electromagnetic shielding packaging method according to any one of claims 6 to 9.

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