Bonding-free sensor packaging structure and manufacturing method thereof

Abstract

The invention discloses a bonding-free sensor packaging structure and a manufacturing method thereof. The bonding-free sensor packaging structure comprises a substrate, a sensing module and a cover body, the substrate is provided with a die bonding area and a bonding area surrounding the outer side of the die bonding area. The sensing module comprises an interposer installed in the die bonding area and a sensing chip installed on the interposer in a stacked mode, so that the sensing module and the substrate jointly form a CoWoS component. The cover body comprises a light-transmitting piece and an annular molded support formed on the light-transmitting piece, and the annular molded support is provided with a joint end far away from the light-transmitting piece. And the cover body is adhered and fixed to the bonding area of the substrate through the bonding end, so that the substrate and the cover body jointly enclose to form a closed space, and the sensing module is accommodated in the closed space. Therefore, the distance between the edge of the sensing chip and the sensing area can be reduced, and the loss caused by the metal wire can be avoided.

Description

Technical Field

[0001] The present application relates to a sensor packaging structure, and more particularly to a wire-free sensor packaging structure and a manufacturing method thereof. Background Art

[0002] Conventional sensor packaging structures use wire bonding to electrically couple the substrate and sensor chip with metal wires. However, as the space between the sensing area and the outer edge of the sensor chip decreases, the metal wires must be partially embedded within the adhesive layer between the sensor chip and the glass sheet. However, this can easily cause separation or cracking between the metal wires and the adhesive layer, compromising the electrical coupling between the substrate and the sensor chip.

[0003] Therefore, the inventors believe that the above defects can be improved, and have conducted intensive research and applied scientific principles to finally propose the present application which has a reasonable design and effectively improves the above defects. Summary of the Invention

[0004] The embodiments of the present application provide a wire-free sensor packaging structure and a manufacturing method thereof, which can effectively improve the defects that may occur in the existing sensor packaging structure.

[0005] The present application discloses a method for manufacturing a wire-free sensor packaging structure, which includes: a pre-processing step: setting a mold on a substrate layer to form a forming space; wherein the substrate layer is defined as a plurality of substrates; a molding step: injecting glue into the forming space to mold a bracket layer on the substrate layer; wherein the bracket layer is defined as a plurality of annular molded brackets formed on the plurality of substrates, and each substrate and the corresponding annular molded bracket are collectively defined as a supporting seat; in each supporting seat, the substrate has a die-bonding area surrounded by the annular molded bracket, and the annular molded bracket has a joint end away from the substrate; a die-bonding step: installing a plurality of sensor modules in the die-bonding areas of the plurality of supporting seats, so that each sensor module and the corresponding substrate together form a CoWoS (chip on wafer on S) The invention relates to a method for manufacturing a plurality of light-transmitting sheets, wherein the plurality of light-transmitting sheets are bonded and fixed to the joint ends of the plurality of supporting seats, so that each supporting seat and the corresponding light-transmitting sheet together surround a closed space to accommodate the corresponding sensing module; and a cutting step, wherein the substrate layer and the support layer are cut to separate the plurality of supporting seats from each other.

[0006] Optionally, at least one sensing module includes a plurality of microbumps and a filling layer located between the sensing chip and the interposer, the sensing chip and the interposer are electrically coupled to each other through the plurality of microbumps, and the plurality of microbumps are embedded in the filling layer.

[0007] Optionally, in at least one sensing module, the plurality of bonding pads of the sensing chip and the plurality of contacts of the interposer are fixed to each other and electrically coupled in a hybrid bonding manner.

[0008] Optionally, the method for manufacturing a wire-free sensor packaging structure further includes, before the die bonding step, a docking step of mounting a wafer on an interposer; wherein the wafer defines a plurality of sensing chips arranged in a matrix, the interposer defines a plurality of interposers, and the plurality of sensing chips are stacked and mounted on the plurality of interposers respectively; and a slicing step of cutting the interposer and the wafer to form a plurality of interposers separated from each other and a plurality of sensing chips respectively fixed to the plurality of interposers; wherein each interposer and the sensing chip fixed thereon are collectively defined as a sensing module.

[0009] Optionally, in the die-bonding step, each sensor module is provided with a plurality of solder balls on the bottom surface of the interposer, and the plurality of solder balls are mounted on the die-bonding region of the corresponding support.

[0010] Optionally, in the preceding step, the mold is disposed on the substrate layer along a height direction, and the mold includes a plurality of side walls, each of the side walls forming a demoulding angle between 5 degrees and 7 degrees with the height direction.

[0011] The embodiments of the present application also disclose a wire-free sensor packaging structure, which includes: a carrier, including: a substrate having a die-bonding area and a molding area surrounding the outside of the die-bonding area; and an annular molding bracket formed in the molding area of the substrate, and the annular molding bracket has a bonding end away from the substrate; a sensing module, including an interposer stacked and mounted on the die-bonding area and a sensing chip stacked and mounted on the interposer, so that the sensing module and the substrate together form a CoWoS component; and a transparent sheet adhesively fixed to the bonding end of the carrier, so that the carrier and the transparent sheet together surround a closed space to accommodate the sensing module.

[0012] Optionally, the sensing module includes a plurality of microbumps and a filling layer located between the sensing chip and the interposer. The sensing chip and the interposer are electrically coupled to each other through the plurality of microbumps, and the plurality of microbumps are embedded in the filling layer.

[0013] Optionally, the plurality of bonding pads of the sensing chip and the plurality of contacts of the interposer are fixed to each other and electrically coupled in a hybrid bonding manner.

[0014] Optionally, the support base defines a height direction perpendicular to the die-bonding area, and the inner side surface of the annular mold support has an inclination angle of 5 to 7 degrees with the height direction, and the outer side surface of the annular mold support is coplanar with the outer edge of the substrate.

[0015] The present application also discloses a method for manufacturing a wire-free sensor packaging structure, which includes: a pre-processing step: disposing a mold on a light-transmitting layer to form a forming space; a molding step: injecting glue into the forming space to mold a bracket layer on the light-transmitting layer; a cutting step: cutting the light-transmitting layer and the bracket layer to form a plurality of light-transmitting sheets separated from each other and a plurality of annular molded brackets respectively fixed to the plurality of light-transmitting sheets; wherein each light-transmitting sheet and the annular molded bracket fixed thereto are collectively defined as a cover body, and each annular molded bracket has a joint end away from the corresponding light-transmitting sheet; a die-bonding step: mounting a sensing module on a die-bonding area of a substrate to form a CoWoS component; wherein the sensing module includes an interposer stacked on the die-bonding area and a sensing chip stacked on the interposer; and a packaging step: bonding and fixing a joint end of a cover body to the substrate so that the substrate and the cover body together surround a closed space to accommodate the sensing module.

[0016] Optionally, the sensing module includes a plurality of microbumps and a filling layer located between the sensing chip and the interposer. The sensing chip and the interposer are electrically coupled to each other through the plurality of microbumps, and the plurality of microbumps are embedded in the filling layer.

[0017] Optionally, the plurality of bonding pads of the sensing chip and the plurality of contacts of the interposer are fixed to each other and electrically coupled in a hybrid bonding manner.

[0018] Optionally, the method for manufacturing a wire-free sensor packaging structure further includes, before the die bonding step, a docking step of mounting a wafer on an interposer; wherein the wafer defines a plurality of sensing chips arranged in a matrix, the interposer defines a plurality of interposers, and the plurality of sensing chips are stacked and mounted on the plurality of interposers respectively; and a slicing step of cutting the interposer and the wafer to form a plurality of interposers separated from each other and a plurality of sensing chips respectively fixed to the plurality of interposers; wherein each interposer and the sensing chip fixed thereon are collectively defined as a sensing module.

[0019] Optionally, in the die-bonding step, the sensing module is provided with a plurality of solder balls on the bottom surface of the interposer, and is mounted on the die-bonding region of the substrate using the plurality of solder balls.

[0020] Optionally, in the preceding step, the mold is disposed on the light-transmitting layer along a height direction, and the mold includes a plurality of side walls, each of the side walls forming a demoulding angle between 5 degrees and 7 degrees with the height direction.

[0021] The present application discloses a wire-free sensor packaging structure, comprising: a substrate having a die-bonding region and a bonding region surrounding the die-bonding region; a sensing module comprising an interposer mounted on the die-bonding region and a sensing chip stacked and mounted on the interposer, such that the sensing module and the substrate together form a CoWoS component; and a cover comprising: a light-transmitting sheet; and an annular molded bracket formed on the light-transmitting sheet, the annular molded bracket having a bonding end away from the light-transmitting sheet; wherein the cover is adhesively fixed to the bonding region of the substrate with the bonding end, such that the substrate and the cover together surround a closed space to accommodate the sensing module.

[0022] Optionally, the sensing module includes a plurality of microbumps and a filling layer located between the sensing chip and the interposer. The sensing chip and the interposer are electrically coupled to each other through the plurality of microbumps, and the plurality of microbumps are embedded in the filling layer.

[0023] Optionally, the plurality of bonding pads of the sensing chip and the plurality of contacts of the interposer are fixed to each other and electrically coupled in a hybrid bonding manner.

[0024] Optionally, the cover defines a height direction perpendicular to the light-transmitting sheet, and the inner side of the annular molded bracket has an inclination angle of 5 to 7 degrees with the height direction, and the outer side of the annular molded bracket is coplanar with the outer edge of the light-transmitting sheet.

[0025] In summary, the wireless sensor packaging structure and manufacturing method disclosed in the embodiments of the present application adopt the CoWoS component to achieve a wireless packaging architecture, thereby helping to reduce the distance between the edge of the sensing chip and the sensing area, and effectively avoiding related defects derived from metal wires.

[0026] To further understand the features and technical content of this application, please refer to the following detailed description and drawings of this application. However, such description and drawings are only used to illustrate this application and do not limit the scope of protection of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 Schematic diagram of the process of manufacturing a wire-free sensor packaging structure according to the first embodiment of the present application.

[0028] Figure 2 for Figure 1 Schematic diagram of the preceding steps in .

[0029] Figure 3 for Figure 1 Schematic diagram of the molding steps in (a).

[0030] Figure 4 for Figure 1 Schematic diagram of the molding steps in (b).

[0031] Figure 5 for Figure 4 3D schematic diagram of .

[0032] Figure 6 for Figure 1 Schematic diagram of the docking steps in (a).

[0033] Figure 7 for Figure 1 Schematic diagram of the docking steps in (b).

[0034] Figure 8 for Figure 1 Schematic diagram of the slicing steps in .

[0035] Figure 9 for Figure 1 Schematic diagram of the die-bonding step in .

[0036] Figure 10 for Figure 1 Schematic diagram of the packaging steps in .

[0037] Figure 11 for Figure 1 Schematic diagram of the cutting steps in (a).

[0038] Figure 12 for Figure 1 Schematic diagram of the cutting steps in (b).

[0039] Figure 13 Schematic diagram of the process of manufacturing a wire-free sensor packaging structure according to the second embodiment of the present application.

[0040] Figure 14 for Figure 13 Schematic diagram of the preceding steps in .

[0041] Figure 15 for Figure 13 Schematic diagram of the molding steps in (a).

[0042] Figure 16 for Figure 13 Schematic diagram of the molding steps in (b).

[0043] Figure 17 for Figure 13 Schematic diagram of the cutting steps in .

[0044] Figure 18 for Figure 13 Schematic diagram of the die bonding step and packaging step in (1).

[0045] Figure 19 for Figure 13 Schematic diagram of the die bonding step and packaging step (2). DETAILED DESCRIPTION

[0046] The following is an explanation of the implementation methods of the "wireless sensor packaging structure and its manufacturing method" disclosed in this application through specific embodiments. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without deviating from the concept of this application. In addition, the drawings of this application are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.

[0047] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.

[0048] [Example 1]

[0049] See also Figures 1 to 12 , which is Example 1 of the present application. This embodiment discloses a wireless sensor package structure 100 and a manufacturing method S100 thereof. To facilitate the description of this embodiment, the manufacturing method of the wireless sensor package structure will be first introduced below, followed by a description of the various components of the wireless sensor package structure 100 and their connection relationships.

[0050] This embodiment discloses a method S100 for manufacturing a wireless sensor package structure, which sequentially includes (or implements) a pre-processing step S110, a molding step S120, a docking step S130, a slicing step S140, a die bonding step S150, a packaging step S160, and a dicing step S170. This embodiment sequentially describes the steps S110-S170 of the method S100 for manufacturing a wireless sensor package structure, thereby producing the wireless sensor package structure 100, but the present application is not limited thereto.

[0051] For example, in other embodiments not shown in the present application, the above-mentioned multiple steps S110~S170 of the wireless sensor packaging structure manufacturing method S100 can be increased or decreased or their implementation order can be adjusted according to design requirements; or, the wireless sensor packaging structure 100 can be manufactured in a manner other than the wireless sensor packaging structure manufacturing method S100.

[0052] The preceding step S110: Figures 1 to 3 As shown, a mold 200 is placed (along a height direction H) on a substrate layer 10 to form a forming space 201. The substrate layer 10 defines a plurality of substrates 1, which are interconnected and arranged in a matrix in this embodiment. The forming space 201 is composed of a plurality of interconnected subspaces 2011, but the present application is not limited to this. For example, in other embodiments not shown in this application, the plurality of substrates 1 may be arranged in a non-matrix configuration; alternatively, the plurality of subspaces 2011 may be spaced apart and not interconnected.

[0053] Furthermore, in this embodiment, the mold 200 includes a plurality of sidewalls 202 , and each sidewall 202 forms a draft angle σ202 ranging from 5 to 7 degrees with respect to the height direction H, to facilitate demolding in the subsequent molding step S120 . Specifically, the distance between two adjacent sidewalls 202 gradually decreases in a direction away from the substrate layer 10 .

[0054] The molding step S120: Figure 1 and Figures 3 to 5 As shown, glue is injected into the forming space 201 to mold a support layer 20 on the substrate layer 10. The support layer 20 is defined as a plurality of annular molded supports 2 respectively formed on the plurality of substrates 1, and the plurality of annular molded supports 2 are connected to each other in this embodiment, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the plurality of annular molded supports 2 can also be provided separately from each other. To put it another way, each of the subspaces 2011 roughly corresponds to the formation of one annular molded support 2.

[0055] It should be noted that each substrate 1 and the corresponding annular mold support 2 are collectively defined as a support base B. In each support base B, the substrate 1 has a die-bonding region 11 surrounded by the annular mold support 2 , and the annular mold support 2 has a joint end 21 away from the substrate 1 .

[0056] The docking steps S130 and S240: Figure 1 、 Figure 6 and Figure 7 As shown, a wafer 30 is mounted on an interposer layer 40. The wafer 30 defines a plurality of sensing chips 3 arranged in a matrix, and the interposer layer 40 defines a plurality of interposers 4, and the plurality of sensing chips 3 are stacked and mounted on the plurality of interposers 4.

[0057] In this embodiment, the installation method of each sensing chip 3 and the corresponding interposer 4 can be adjusted according to actual needs. Figure 6 As shown, the bonding pads 31 of the sensor chip 3 and the contacts 41 of the interposer 4 are fixed and electrically coupled to each other by a hybrid bonding method.

[0058] Furthermore, if Figure 7 As shown, a plurality of micro bumps 5 and an underfill layer 6 may be provided between each sensing chip 3 and the corresponding interposer 4 to secure them to each other. The sensing chip 3 (e.g., the plurality of bonding pads 31 ) and the interposer 4 (e.g., the plurality of contacts 41 ) are electrically coupled to each other via the plurality of micro bumps 5 , which are embedded within the underfill layer 6 .

[0059] The slicing step S140: Figure 1 、 Figure 7 and Figure 8 As shown, the interposer 40 and the wafer 30 are cut to form a plurality of interposers 4 separated from each other and a plurality of sensing chips 3 respectively fixed to the plurality of interposers 4. Each interposer 4 and the sensing chip 3 fixed thereon are collectively defined as a sensing module M.

[0060] Furthermore, although the docking step S130 and the slicing step S140 are described in this embodiment as being performed between the molding step S120 and the die-bonding step S150, the present application is not limited thereto. In other words, the docking step S130 and the slicing step S140 can be performed before the die-bonding step S150 based on actual needs.

[0061] The solidification step S150: Figure 1 and Figure 9As shown, multiple sensor modules M are mounted on the die-bonding regions 11 of multiple carriers B, such that each sensor module M and the corresponding substrate 1 together form a CoWoS (chip-on-wafer-on-substrate) structure E. In this embodiment, the bonding end 21 of the annular molded support 2 of each carrier B is preferably not lower than the top of the corresponding sensor module M (e.g., the top surface of the sensor chip 3) to facilitate the subsequent packaging steps S160 and S270.

[0062] Furthermore, each of the sensing modules M is provided with a plurality of solder balls 42 on the bottom surface of the interposer 4 , and each of the sensing modules M is mounted on the die-bonding region 11 corresponding to the carrier B using the plurality of solder balls 42 .

[0063] It should be additionally noted that the methods S100 and S200 for manufacturing a wireless sensor package structure are limited to using the CoWoS component E to achieve a wireless packaging architecture, thereby facilitating a reduction in the distance between the edge of the sensing chip 3 and the sensing area 32 (e.g., no pads are formed on the top surface of the sensing chip 3, so that the distance can be reduced to less than 200 microns). Therefore, any manufacturing method that does not use a CoWoS component is different from the method S100 for manufacturing a wireless sensor package structure disclosed in this embodiment.

[0064] The packaging step S160: Figure 1 and Figure 10 As shown, a plurality of light-transmitting sheets 7 are respectively bonded and fixed to the joint ends 21 of the plurality of support bases B, so that each support base B and the corresponding light-transmitting sheet 7 together enclose a closed space S, which accommodates the corresponding sensing module M. Each light-transmitting sheet 7 is bonded to the joint end 21 of the corresponding support base B using an adhesive layer 8. The adhesive layer 8 can be made of light-curing adhesive (e.g., UV adhesive), heat-curing adhesive, or a patch according to actual needs, and this application is not limited thereto.

[0065] Furthermore, the light-transmitting sheet 7 is parallel to the substrate 1 of the supporting base B, and in this embodiment, the light-transmitting sheet 7 can be a flat glass sheet and its outer surface is preferably formed with a broadband anti-reflection (BBAR) coating, but the present application is not limited thereto.

[0066] The cutting step S170: Figure 1 、 Figure 10 and Figure 11As shown, the substrate layer 10 and the support layer 20 are cut to separate the plurality of carriers B from each other, thereby forming a plurality of the non-bonding type sensor packaging structures 100 that are separated from each other.

[0067] As described above, this embodiment generally describes the preferred implementation process of the method S100 for manufacturing a wireless sensor package structure. The following describes the specific structure of the wireless sensor package structure 100 produced by the method S100 from a structural perspective. In other words, some technical features of the wireless sensor package structure 100 can be referenced to the description of the method S100, but this application is not limited thereto.

[0068] like Figure 11 and Figure 12 As shown, the non-bonding sensor package structure 100 includes a carrier B, a sensor module M mounted in the carrier B, and a light-transmitting sheet 7 fixed to the carrier B. The carrier B includes a substrate 1 and an annular mold support 2 formed on the substrate 1. The substrate 1 is flat and has a die-bonding region 11 and a molding region 12 surrounding the die-bonding region 11. The molding region 12 is in the shape of a square ring.

[0069] Furthermore, the annular mold support 2 is preferably square-ring-shaped and formed in the molding area 12 of the substrate 1, and the annular mold support 2 has a joint end 21 away from the substrate 1. Specifically, the support base B defines a height direction H perpendicular to the die-bonding area 11, and an inner side surface 22 of the annular mold support 2 forms an inclination angle σ22 between 5 and 7 degrees with respect to the height direction H. An outer side surface 23 of the annular mold support 2 is coplanar with the outer edge of the substrate 1.

[0070] The sensing module M includes an interposer 4 and a sensing chip 3 stacked and mounted on the interposer 4. The mounting method of the sensing chip 3 and the interposer 4 can be adjusted according to actual needs. For example, Figure 11 As shown, the plurality of bonding pads 31 of the sensing chip 3 and the plurality of contacts 41 of the interposer 4 are fixed and electrically coupled to each other in a hybrid bonding manner. Figure 12 As shown, the sensing module M includes a plurality of micro-bumps 5 and a filling layer 6 located between the sensing chip 3 and the interposer 4. The sensing chip 3 and the interposer 4 are electrically coupled to each other through the plurality of micro-bumps 5, and the plurality of micro-bumps 5 are buried in the filling layer 6.

[0071] The sensing module M is stacked and mounted on the die-bonding area 11 with the interposer 4, so that the sensing module M and the substrate 1 together form a CoWoS structure E. The sensing module M is preferably spaced apart from the inner side surface 22 of the annular mold support 2, and the top of the sensing module M is lower than the bonding end 21 of the annular mold support 2 relative to the substrate 1.

[0072] The light-transmitting sheet 7 is adhesively fixed to the joint end 21 of the support base B, so that the support base B and the light-transmitting sheet 7 together form a closed space S, which accommodates the sensing module M. The wire-free sensor package structure 100 uses an adhesive layer 8 to bond the light-transmitting sheet 7 to the joint end 21 of the support base B. The adhesive layer 8 can be a light-curing adhesive (e.g., UV adhesive), a heat-curing adhesive, or a patch, depending on actual needs, and this application is not limited thereto.

[0073] [Example 2]

[0074] See also Figures 13 to 19 , which is Example 2 of the present application. This embodiment discloses a wireless sensor package structure 100 and a manufacturing method S200 thereof. To facilitate the description of this embodiment, the manufacturing method of the wireless sensor package structure will be first introduced below, followed by a description of the various components of the wireless sensor package structure 100 and their connection relationships.

[0075] This embodiment discloses a method S200 for manufacturing a wireless sensor package structure, which sequentially includes (or implements) a pre-processing step S210, a molding step S220, a cutting step S230, a docking step S240, a slicing step S250, a die bonding step S260, and a packaging step S270. This embodiment sequentially describes the steps S210-S270 of the method S200 for manufacturing a wireless sensor package structure, thereby producing the wireless sensor package structure 100, but the present application is not limited thereto.

[0076] For example, in other embodiments not shown in the present application, the above-mentioned multiple steps S210~S270 of the wireless sensor packaging structure manufacturing method S200 can be increased or decreased or their implementation order can be adjusted according to design requirements; or, the wireless sensor packaging structure 100 can be manufactured in a manner other than the wireless sensor packaging structure manufacturing method S200.

[0077] Furthermore, the specific implementation of the docking step S240 and the slicing step S250 is substantially similar to the docking step S130 and the slicing step S140 described in Example 1, and therefore will not be further described here. Furthermore, although the docking step S240 and the slicing step S250 are described in this embodiment as being between the cutting step S230 and the die-bonding step S260, this is not intended to limit the present application. In other words, the docking step S240 and the slicing step S250 can be performed before the die-bonding step S260, depending on actual needs.

[0078] The preceding step S210: Figures 13 to 15 As shown, a mold 200 is placed (along a height direction H) on a light-transmitting layer 70 to form a forming space 201. In this embodiment, the light-transmitting layer 70 can be a flat glass sheet and its outer surface is preferably coated with a broadband anti-reflection (BBAR) film, but the present application is not limited thereto.

[0079] More specifically, the light-transmitting layer 70 is defined by a plurality of light-transmitting sheets 7. In this embodiment, the light-transmitting sheets 7 are interconnected and arranged in a matrix. The forming space 201 is formed by a plurality of interconnected subspaces 2011, but the present application is not limited to this. For example, in other embodiments not shown herein, the light-transmitting sheets 7 may be arranged in a non-matrix configuration; alternatively, the subspaces 2011 may be spaced apart and not interconnected.

[0080] Furthermore, in this embodiment, the mold 200 includes a plurality of sidewalls 202 , and each sidewall 202 forms a draft angle σ202 ranging from 5 to 7 degrees with respect to the height direction H, to facilitate demolding during the molding step S220 . Specifically, the distance between two adjacent sidewalls 202 gradually decreases in a direction away from the substrate layer 10 .

[0081] The molding step S220: injecting glue into the forming space 201 to mold a support layer 20 in the light-transmitting layer 70. In this embodiment, the support layer 20 is defined as a plurality of the annular molded supports 2, and the plurality of the annular molded supports 2 are connected to each other, but the present application is not limited thereto. For example, in other embodiments not shown in the present application, the plurality of the annular molded supports 2 can also be provided separately from each other. To put it another way, each of the subspaces 2011 roughly corresponds to forming one annular molded support 2.

[0082] The cutting step S230: Figure 13 、 Figure 16 and Figure 17 As shown, the light-transmitting layer 70 and the support layer 20 are cut to form a plurality of light-transmitting sheets 7 separated from each other and a plurality of annular molded supports 2 respectively fixed to the plurality of light-transmitting sheets 7. Each light-transmitting sheet 7 and the annular molded supports 2 fixed thereto together define a cover C, and each annular molded support 2 has a joint end 21 away from the corresponding light-transmitting sheet 7.

[0083] The solidification step S260: Figure 13 and Figure 18 As shown, a sensor module M is mounted on the die-bonding region 11 of a substrate 1 to form a CoWoS component E. The sensor module M includes an interposer 4 stacked and mounted on the die-bonding region 11, and a sensor chip 3 stacked and mounted on the interposer 4. Furthermore, each sensor module M has a plurality of solder balls 42 disposed on the bottom surface of the interposer 4. Each sensor module M is mounted on the die-bonding region 11 of the corresponding carrier B using the plurality of solder balls 42.

[0084] It should be additionally noted that the method S200 for manufacturing a wireless sensor package structure is limited to using the CoWoS component E to achieve a wireless packaging architecture, thereby facilitating a reduction in the distance between the edge of the sensing chip 3 and the sensing area 32 (e.g., no pads are formed on the top surface of the sensing chip 3, so that the distance can be reduced to less than 200 microns). Therefore, any manufacturing method that does not use a CoWoS component is different from the method S200 for manufacturing a wireless sensor package structure disclosed in this embodiment.

[0085] The packaging step S270: Figure 13 and Figure 18 As shown, the joint end 21 of one of the cover bodies C is bonded and fixed to the substrate 1, so that the substrate 1 and the cover body C together enclose a closed space S, which accommodates the sensing module M, thereby forming the non-bonding type sensor package structure 100. Each of the cover bodies C is bonded to the corresponding bonding area 13 of the substrate 1 using an adhesive layer 8. The adhesive layer 8 can be made of a light-curing adhesive (e.g., UV adhesive), a heat-curing adhesive, or a patch, depending on actual needs, and this application is not limited thereto.

[0086] It should be noted that, in other embodiments not shown in the present application, the implementation of the die bonding step S260 may also be to install a plurality of the sensing modules M on a plurality of substrates 1 defined by a substrate layer, and then after the implementation of the packaging step S270, the substrate layer is cut to form a plurality of the substrates 1, and obtain a plurality of the non-bonding type sensor packaging structures 100 separated from each other.

[0087] As described above, this embodiment generally describes the preferred implementation process of the method S200 for manufacturing a wireless sensor package structure. The following describes the specific structure of the wireless sensor package structure 100 produced by the method S200 from a structural perspective. In other words, some technical features of the wireless sensor package structure 100 can be referenced to the description of the method S200, but this application is not limited thereto.

[0088] like Figure 18 and Figure 19 As shown, the bondless sensor package structure 100 includes a substrate 1, a sensing module M mounted on the substrate 1, and a cover C fixed to the substrate 1. The substrate 1 is flat and has a die-bonding region 11 and a bonding region 13 surrounding the die-bonding region 11, and the bonding region 13 is in a square ring shape.

[0089] The sensing module M is stacked and mounted on the die-bonding area 11 with the interposer 4, so that the sensing module M and the substrate 1 together form a CoWoS component E. The sensing module M includes an interposer 4 and a sensing chip 3 stacked and mounted on the interposer 4. The mounting method of the sensing chip 3 and the interposer 4 can be adjusted based on actual needs.

[0090] For example, if Figure 18 As shown, the plurality of bonding pads 31 of the sensing chip 3 and the plurality of contacts 41 of the interposer 4 are fixed and electrically coupled to each other in a hybrid bonding manner. Figure 19 As shown, the sensing module M includes a plurality of micro-bumps 5 and a filling layer 6 located between the sensing chip 3 and the interposer 4. The sensing chip 3 and the interposer 4 are electrically coupled to each other through the plurality of micro-bumps 5, and the plurality of micro-bumps 5 are buried in the filling layer 6.

[0091] The cover C includes a light-transmitting sheet 7 and an annular molded support 2 formed on the light-transmitting sheet 7. The annular molded support 2 has a joint end 21 distal from the light-transmitting sheet 7. The cover C defines a height direction H perpendicular to the light-transmitting sheet 7. An inner side surface 22 of the annular molded support 2 forms an inclination angle σ22 between 5 and 7 degrees with respect to the height direction H. An outer side surface 23 of the annular molded support 2 is coplanar with the outer edge of the light-transmitting sheet 7.

[0092] Furthermore, the cover C is adhesively fixed to the bonding area 13 of the substrate 1 at the bonding end 21, so that the substrate 1 and the cover C together enclose a closed space S, which accommodates the sensing module M. The sensing module M is preferably spaced apart from the inner side surface 22 of the annular molded bracket 2 and spaced apart from the light-transmitting sheet 7.

[0093] Furthermore, the non-bonded sensor packaging structure 100 uses an adhesive layer 8 to bond the joint end 21 of the cover body C and the joint area 13 of the substrate 1, and the adhesive layer 8 can be made of light-curing adhesive (such as UV adhesive), heat-curing adhesive, or patch according to actual needs, and this application does not limit this.

[0094] [Technical Effects of the Embodiments of the Present Application]

[0095] In summary, the wireless sensor packaging structure and manufacturing method disclosed in the embodiments of the present application utilize the CoWoS component to achieve a wireless packaging architecture, thereby facilitating a reduction in the distance between the edge of the sensing chip and the sensing area (e.g., the top surface of the sensing chip lacks any pads, reducing the distance to less than 200 microns) and effectively avoiding defects associated with metal wires.

[0096] The contents disclosed above are only preferred feasible embodiments of the present application and do not limit the patent scope of the present application. Therefore, any equivalent technical changes made using the description and drawings of the present application are included in the patent scope of the present application.

Claims

1. A method for manufacturing a wire-free sensor packaging structure, characterized in that: The method for manufacturing the wire-free sensor packaging structure comprises: A pre-step: placing a mold on a substrate layer to form a forming space; wherein the substrate layer defines a plurality of substrates; A molding step includes injecting glue into the forming space to mold a support layer on the substrate layer; wherein the support layer is defined by a plurality of annular molded supports respectively formed on the plurality of substrates, and each substrate and the corresponding annular molded support are collectively defined as a supporting seat; in each supporting seat, the substrate has a die-bonding area surrounded by the annular molded support, and the annular molded support has a joint end away from the substrate; A die-bonding step comprises mounting a plurality of sensor modules on the die-bonding regions of the plurality of carriers, so that each sensor module and the corresponding substrate together form a CoWoS (chip on wafer on substrate) structure; wherein each sensor module includes an interposer stacked and mounted on the die-bonding region and a sensor chip stacked and mounted on the interposer; a packaging step of bonding and fixing a plurality of light-transmitting sheets to the joint ends of a plurality of the supporting seats, so that each supporting seat and the corresponding light-transmitting sheet together surround a closed space to accommodate the corresponding sensing module; and A cutting step: cutting the substrate layer and the support layer to separate the plurality of support seats from each other.

2. The method for manufacturing a wire-free sensor packaging structure according to claim 1, wherein: At least one of the sensing modules includes a plurality of microbumps and a filling layer located between the sensing chip and the interposer. The sensing chip and the interposer are electrically coupled to each other through the plurality of microbumps, and the plurality of microbumps are embedded in the filling layer.

3. The method for manufacturing a non-bonding type sensor packaging structure according to claim 1, wherein: In at least one of the sensing modules, the bonding pads of the sensing chip and the contacts of the interposer are fixed and electrically coupled to each other in a hybrid bonding manner.

4. The method for manufacturing a non-bonding type sensor packaging structure according to claim 1, wherein: The method for manufacturing a wire-free sensor packaging structure further comprises, before the die-bonding step: a docking step: mounting a wafer on an interposer; wherein the wafer defines a plurality of the sensing chips arranged in a matrix, the interposer defines a plurality of the interposers, and the plurality of the sensing chips are stacked and mounted on the plurality of the interposers respectively; and The step of slicing is to cut the interposer and the wafer to form a plurality of interposers separated from each other and a plurality of sensing chips respectively fixed on the plurality of interposers. Each interposer and the sensing chip fixed thereon are collectively defined as a sensing module.

5. The method for manufacturing a non-bonding type sensor packaging structure according to claim 1, wherein: In the die-bonding step, each of the sensing modules is provided with a plurality of solder balls on the bottom surface of the interposer, and the plurality of solder balls are mounted on the die-bonding region corresponding to the supporting base.

6. The method for manufacturing a non-bonding type sensor packaging structure according to claim 1, wherein: In the preceding step, the mold is disposed on the substrate layer along a height direction, and the mold includes a plurality of side walls, each of the side walls forming a demoulding angle between 5 degrees and 7 degrees with the height direction.

7. A wire-free sensor packaging structure, characterized in that: The non-bonding type sensor packaging structure includes: A bearing seat, comprising: a substrate having a die-bonding region and a molding region surrounding the die-bonding region; and an annular molded support formed in the molding area of the substrate, and having a joint end away from the substrate; a sensing module comprising an interposer stacked on the die-bonding region and a sensing chip stacked on the interposer, such that the sensing module and the substrate together form a CoWoS component; and A light-transmitting sheet is adhesively fixed to the joint end of the supporting base, so that the supporting base and the light-transmitting sheet together surround a closed space to accommodate the sensing module.

8. The bonding-free sensor packaging structure according to claim 7, wherein: The sensing module includes a plurality of microbumps and a filling layer located between the sensing chip and the interposer. The sensing chip and the interposer are electrically coupled to each other through the microbumps, and the microbumps are embedded in the filling layer.

9. The bonding-free sensor packaging structure according to claim 7, wherein: The plurality of bonding pads of the sensing chip and the plurality of contacts of the interposer are fixed to each other and electrically coupled in a hybrid bonding manner.

10. The bonding-free sensor packaging structure according to claim 7, wherein: The supporting base defines a height direction perpendicular to the solid crystal area, and the inner side surface of the annular mold support has an inclination angle between 5 degrees and 7 degrees with the height direction, and the outer side surface of the annular mold support is coplanar with the outer edge of the substrate.

11. A method for manufacturing a wire-free sensor packaging structure, characterized in that: The method for manufacturing the wire-free sensor packaging structure comprises: A preparatory step: placing a mold on a light-transmitting layer to form a forming space; a molding step of injecting glue into the forming space to mold the light-transmitting layer to form a support layer; a cutting step of cutting the light-transmitting layer and the support layer to form a plurality of light-transmitting sheets separated from each other and a plurality of annular molded supports respectively fixed to the plurality of light-transmitting sheets; wherein each light-transmitting sheet and the annular molded supports fixed thereto together define a cover body, and each annular molded support has a joint end away from the corresponding light-transmitting sheet; a die-bonding step: mounting a sensor module on a die-bonding region of a substrate to form a CoWoS component; wherein the sensor module includes an interposer stacked on the die-bonding region and a sensor chip stacked on the interposer; and A packaging step: bonding and fixing the joint end of one of the cover bodies to the substrate so that the substrate and the cover body together surround and form a closed space, which accommodates the sensing module.

12. The method for manufacturing a non-bonding type sensor packaging structure according to claim 11, wherein: The sensing module includes a plurality of microbumps and a filling layer located between the sensing chip and the interposer. The sensing chip and the interposer are electrically coupled to each other through the microbumps, and the microbumps are embedded in the filling layer.

13. The method for manufacturing a non-bonding type sensor packaging structure according to claim 11, wherein: The plurality of bonding pads of the sensing chip and the plurality of contacts of the interposer are fixed to each other and electrically coupled in a hybrid bonding manner.

14. The method for manufacturing a wire-free sensor packaging structure according to claim 11, wherein: The method for manufacturing a wire-free sensor packaging structure further comprises, before the die-bonding step: a docking step: mounting a wafer on an interposer; wherein the wafer defines a plurality of the sensing chips arranged in a matrix, the interposer defines a plurality of the interposers, and the plurality of the sensing chips are stacked and mounted on the plurality of the interposers respectively; and The step of slicing is to cut the interposer and the wafer to form a plurality of interposers separated from each other and a plurality of sensing chips respectively fixed on the plurality of interposers. Each interposer and the sensing chip fixed thereon are collectively defined as a sensing module.

15. The method for manufacturing a non-bonding type sensor packaging structure according to claim 11, wherein: In the die-bonding step, the sensing module is provided with a plurality of solder balls on the bottom surface of the interposer, and is mounted on the die-bonding region of the substrate using the plurality of solder balls.

16. The method for manufacturing a non-bonding type sensor packaging structure according to claim 11, wherein: In the preceding step, the mold is disposed on the light-transmitting layer along a height direction, and the mold includes a plurality of side walls, each of the side walls forming a demoulding angle between 5 degrees and 7 degrees with the height direction.

17. A wire-free sensor packaging structure, characterized in that: The non-bonding type sensor packaging structure includes: a substrate having a die-bonding region and a bonding region surrounding the die-bonding region; a sensor module comprising an interposer mounted on the die-bonding region and a sensor chip stacked and mounted on the interposer, such that the sensor module and the substrate together form a CoWoS component; and A cover body, comprising: a light-transmitting sheet; and an annular molded support formed on the light-transmitting sheet, and having a joint end away from the light-transmitting sheet; The cover is adhesively fixed to the joining area of the substrate via the joining end, so that the substrate and the cover together surround and form a closed space, which accommodates the sensing module.

18. The bonding-free sensor packaging structure according to claim 17, wherein: The sensing module includes a plurality of microbumps and a filling layer located between the sensing chip and the interposer. The sensing chip and the interposer are electrically coupled to each other through the microbumps, and the microbumps are embedded in the filling layer.

19. The bonding-free sensor packaging structure according to claim 17, wherein: The plurality of bonding pads of the sensing chip and the plurality of contacts of the interposer are fixed to each other and electrically coupled in a hybrid bonding manner.

20. The bonding-free sensor packaging structure according to claim 17, wherein: The cover defines a height direction perpendicular to the light-transmitting sheet, and the inner side surface of the annular molded bracket forms an inclination angle between 5 and 7 degrees with the height direction, and the outer side surface of the annular molded bracket is coplanar with the outer edge of the light-transmitting sheet.

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