Die bond packaging equipment

Abstract

The utility model relates to a solid crystal packaging device, which is characterized by comprising a rack, a feeding mechanism, a feeding and discharging platform, a material grabbing and moving mechanism, a carrier, a crystal ring, a loading jig and a workbench, a positioning assembly is detachably arranged on the crystal ring, and the positioning assembly is used for positioning the loading jig; the die bonding station is used for dispensing the printed circuit board conveyed by the carrier and welding a chip at a wafer ring position with the printed circuit board; the material receiving mechanism is used for receiving and storing the printed circuit board subjected to die bonding, and the die bonding work station can be used for dispensing the printed circuit board conveyed by the carrier and welding a chip at the position of a die ring with the printed circuit board, so that the automation of the whole dispensing, die bonding and transferring work can be realized; and the positioning assembly for positioning the loading jig is detachably mounted on the wafer ring, so that the production requirements of wafers with multiple specifications and dimensions can be met, only corresponding accessories need to be replaced, and the operation is simple and reliable.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding machines, in particular to crystal bonding packaging equipment. Background Art

[0002] Die bonding, also known as chip mounting, uses colloid to bond the chip to the designated area of ​​the bracket to form a thermal or electrical path, providing conditions for subsequent wire bonding. It is mainly used for lead cabinet pressure plates of various gold wire ultrasonic welding equipment and various suction nozzles, ejectors, dispensing heads, porcelain nozzles, through needles, motors, carbon brushes, encoders, transmission belts and various spare parts and instruments of automated robots for various chip mounting equipment.

[0003] Existing die bonders generally operate in a single-arm mode, with jigs placed manually. Materials need to be manually placed and picked up during the die bonding operation, which can easily touch already bonded chips, causing defects. It is also difficult to troubleshoot problems, and the equipment is inconvenient to operate. Manual intervention is frequent, and defective products are prone to occur. Existing die bonders all use 8-inch wafer rings. With the advancement of chip production technology, the wafer size has also increased from the original 8 inches to 12 inches. Existing die bonders are not compatible with 8-inch and 12-inch wafers, have limitations, and cannot meet usage requirements. Utility Model Content

[0004] The purpose of this utility model is to provide a solid crystal packaging device, aiming to solve the above-mentioned technical problems of low automation of loading and unloading during solid crystal processing, as well as the problems of incompatibility of wafer sizes, low efficiency and limitations, so as to improve the adaptability of fixed packaging equipment and improve fixed packaging efficiency.

[0005] The following technical solutions are used to solve the technical problems in this utility model:

[0006] Die bonding equipment, including:

[0007] frame;

[0008] A loading mechanism, the loading mechanism being arranged on the frame and comprising a silo for placing printed circuit boards to be bonded;

[0009] A loading and unloading platform, wherein the loading and unloading platform and the loading mechanism are spaced apart along the width direction of the frame, and the loading and unloading platform is provided with a bidirectional conveyor belt, and the conveyor belt is extended along the length direction of the frame;

[0010] A material grabbing and moving mechanism, which can move the printed circuit boards in the material bin to the loading and unloading platform;

[0011] A carrier, the carrier is used to transport the printed circuit board back and forth between the loading and unloading platform and the die bonding work station;

[0012] Crystal ring, used to implement the expansion operation of the blue film;

[0013] A loading jig, to which the blue film is adhered, and the loading jig is placed on the wafer ring;

[0014] A workbench, driving the crystal ring to move in a horizontal plane;

[0015] A positioning assembly is detachably provided on the wafer ring, and the positioning assembly is used to position the loading fixture;

[0016] A die bonding station is used for dispensing glue on the printed circuit board delivered by the carrier and welding the chip at the die ring position to the printed circuit board;

[0017] The material receiving mechanism is used to receive and store the printed circuit boards after die bonding.

[0018] The utility model also has the following technical features:

[0019] In one embodiment of the present invention, a lifting device is further provided in the wafer ring. The lifting device is arranged below the loading fixture to lift the chip on the blue film.

[0020] In one embodiment of the present invention, a flip assembly is further provided above the wafer ring, and the flip assembly is used to flip the chip on the blue film on the wafer ring.

[0021] In one embodiment of the present invention, the crystal bonding work station includes a dispensing welding head and a glue disc mechanism arranged above the carrier, and a crystal bonding welding head is also arranged between the carrier and the crystal ring. The glue disc mechanism is used to provide adhesive, and the dispensing welding head is used to place the adhesive on the glue disc mechanism on the printed circuit board on the carrier. The crystal bonding welding head is used to transfer the flipped chip on the flip assembly to the adhesive position on the printed circuit board on the carrier and fix it as a whole with the printed circuit board.

[0022] In one embodiment of the present invention, a correction lens barrel is provided above the wafer ring, and the correction lens barrel is used to locate the position of the flip assembly after flipping the chip.

[0023] In one embodiment of the present invention, a crystal retrieval lens barrel is further provided above the crystal ring, and the crystal retrieval lens barrel is used to locate the chip position of the blue film on the crystal ring.

[0024] In one embodiment of the present invention, a crystal fixing lens barrel is provided above the carrier, and the crystal fixing lens barrel is used to locate the position of the printed circuit board on the carrier.

[0025] In one embodiment of the present invention, the loading and unloading platform includes a loading platform and a unloading platform. The loading platform is arranged on a side of the unloading platform facing away from the silo. Both the loading platform and the unloading platform are provided with the conveyor belt.

[0026] In one embodiment of the present invention, the material grabbing and moving mechanism includes a material grabbing main seat and an adsorption component. The material grabbing main seat is arranged on the frame, and the adsorption component is movably installed on the material grabbing main seat. The adsorption component is used to transfer the printed circuit board in the material bin to the loading and unloading platform.

[0027] In one embodiment of the present invention, the material receiving mechanism is arranged on the side of the loading and unloading platform facing away from the carrier, and the material receiving mechanism includes a material receiving box, which corresponds to the conveyor belt of the loading and unloading platform to receive and store the printed circuit boards after the bonding process.

[0028] In one embodiment of the present invention, the crystal ring includes an expanding ring fixing seat, which is rotatably mounted on the workbench. The loading jig is placed at the upper end of the expanding ring fixing seat. An expanding ring pressure plate is installed around the expanding ring fixing seat. The expanding ring pressure plate presses the edge of the loading jig. The lifting unit is used to lift and lower the expanding ring pressure plate to link the unfolding of the blue film.

[0029] Compared with the existing technology, the beneficial effects of the present invention are reflected in: the frame, loading mechanism, loading and unloading platform, material grabbing and moving mechanism, carrier and receiving mechanism form a complete automated handling system, so that the entire work process of printed circuit boards from loading to unloading after crystal bonding is completed can be automatically handled, reducing manual intervention, thereby reducing the error and damage risks that may occur during the operation, and the blue film expansion operation can be implemented through the crystal ring, and the printed circuit board transported by the carrier can be glued and the chip at the crystal ring position and the printed circuit board can be welded through the crystal bonding work station, thereby realizing the automation of the entire glue dispensing, crystal bonding and transportation operations, and the positioning component for positioning the loading fixture can be detachably installed on the crystal ring, thereby being compatible with the production requirements of wafers of multiple specifications and sizes, and only the corresponding accessories need to be replaced, and the operation is simple and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a schematic diagram of the overall structure of a die-bonding packaging device in one embodiment of the present invention;

[0031] Figure 2 This is a schematic structural diagram of a die-bonding packaging device in one embodiment of the present invention after being removed from a housing;

[0032] Figure 3 This is a structural diagram of the loading and unloading platform and the loading mechanism in one embodiment of the present invention;

[0033] Figure 4 This is a structural diagram of the material grabbing and moving mechanism in one embodiment of the present utility model;

[0034] Figure 5 This is a schematic structural diagram of a carrier in one embodiment of the present invention;

[0035] Figure 6 This is a schematic structural diagram of a die-bonding workbench in one embodiment of the present invention;

[0036] Figure 7 This is a structural diagram of a material receiving mechanism in one embodiment of the present invention;

[0037] Figure 8 This is a structural diagram of a dispensing welding head in one embodiment of the present invention;

[0038] Figure 9 This is a schematic structural diagram of a rubber disc mechanism in one embodiment of the present invention;

[0039] Figure 10 This is a schematic structural diagram of a die-bonding head in one embodiment of the present invention;

[0040] Figure 11 This is a schematic structural diagram of a flip assembly in one embodiment of the present invention;

[0041] Figure 12 and Figure 13 They are schematic structural diagrams of the crystal ring and the workbench from two different perspectives in one embodiment of the present invention;

[0042] Figure 14 This is a schematic structural diagram of a correction lens barrel in one embodiment of the present invention;

[0043] Figure 15 This is a schematic structural diagram of a crystal extraction lens barrel in one embodiment of the present invention;

[0044] Figure 16 This is a schematic structural diagram of a crystal-fixing lens barrel in one embodiment of the present invention;

[0045] Figure 17 This is a schematic structural diagram of a lifting device in one embodiment of the present invention;

[0046] Description of Figure Numbers:

[0047] 10. Rack;

[0048] 20. Loading mechanism; 21. Material bin; 22. Ejecting motor; 221. Synchronous wheel; 222. Upper and lower slides; 23. Loading main seat;

[0049] 30. Loading and unloading platform; 32. Loading platform; 33. Unloading platform;

[0050] 40. Material grabbing and moving mechanism; 41. Material grabbing main seat; 42. Adsorption element; 43. Material grabbing slide rail; 44. Material grabbing slide plate; 45. Upper and lower cylinders;

[0051] 50. Carrier; 51. Carrier base; 52. Top plate; 53. Cover plate; 54. Carrier cylinder; 55. Motor;

[0052] 61. Dispensing welding head; 611. Z motor seat; 612. Upper and lower motors; 613. Rotating motor seat; 614. Rotating motor; 615. Offset axis; 617. Coupling; 618. Slide plate;

[0053] 62. Glue plate mechanism; 621. Glue plate base; 622. Glue plate motor; 623. Gear; 624. Glue plate; 625. Scraper; 626. Scraper seat;

[0054] 63. Die-bonding welding head; 631. Rotating motor; 632. Welding head main seat; 633. Z-axis motor; 634. Z-axis motor main seat; 635. Eccentric shaft; 636. Guide rail fixed seat; 637. Cross guide rail; 638. Guide rail movable seat; 639. Swing arm;

[0055] 70. Crystal ring; 71. Workbench; 72. Ring expansion fixing seat; 73. Ring expansion pressure plate; 74. Positioning rod; 75. Positioning bar;

[0056] 80. Loading fixture;

[0057] 90. Material receiving mechanism; 91. Material receiving box; 92. Material receiving main seat; 93. Material receiving motor; 94. Material receiving slide;

[0058] 100. Flip assembly; 101. Adjustment seat; 102. Z-phase motor; 103. Eccentric shaft; 104. Z slide; 105. Flip motor; 106. Flip motor seat; 107. Motor flip shaft; 108. Flip arm; 109. Suction nozzle;

[0059] 110. Correction lens barrel;

[0060] 120. Crystallization tube;

[0061] 130, ejector; 131, adjustment seat; 132, ejector motor seat; 133, ejector motor; 134, sensor; 135, eccentric shaft; 136, ejector cap; 137, air connector;

[0062] 140. Crystal bonding workbench;

[0063] 150. Crystal-fixing lens barrel. DETAILED DESCRIPTION

[0064] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0065] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0066] It should be noted that the die bonding process is a key step in the semiconductor packaging process. Its main purpose is to accurately place the chip in the designated area of ​​the bracket and bond it through colloid to form a thermal path or an electrical path, which provides conditions for subsequent wire bonding. This process is crucial to fields such as LED packaging, chip semiconductor packaging, and camera precision mounting. Let’s take chip semiconductor packaging as an example. After the existing wafer is produced through the previous cutting process, there will be chips arranged in an array on the blue film. The chips are glued to the blue film, and the distance between the chips is small. In order to ensure that the fixing equipment accurately positions a single chip, it is necessary to increase the distance between the chips on the blue film. For this reason, a process of expanding the blue film through a crystal ring is derived. Since the blue film has a certain deformation ability, the blue film is stretched and deformed through the die bonding process, thereby increasing the distance between the chips to facilitate scanning of the chips on the blue film through the positioning lens. Scanning is performed to facilitate the positioning of the chip to be mounted. Since the existing wafer expansion equipment can only expand the wafer of one type, the adaptability is low, and the existing die bonding equipment requires manual placement of the jig when loading and unloading. Human intervention is likely to touch the fixed wafers, resulting in defective products and affecting the efficiency of the die bonding work. Therefore, the utility model proposes a die bonding packaging equipment, including: a frame 10; a feeding mechanism 20, the feeding mechanism 20 is arranged on the frame 10, the feeding mechanism 20 includes a silo 21, the silo 21 is used to place the printed circuit board to be bonded The loading and unloading platform 30 is spaced apart from the loading mechanism 20 along the width direction of the frame 10, and the loading and unloading platform 30 is provided with a bidirectional conveyor belt, which is extended along the length direction of the frame 10; the material grabbing and moving mechanism 40 can transfer the printed circuit board in the hopper 21 to the loading and unloading platform 30; the carrier 50 is used to transport the printed circuit board back and forth between the loading and unloading platform 30 and the crystal bonding work station; the crystal ring 70 is used to implement the blue film film expansion operation; a loading jig 80, to which the blue film is adhered, and the loading jig 80 is placed on the crystal ring 70; a workbench 71, which drives the crystal ring 70 to move in a horizontal plane; a positioning component is detachably provided on the crystal ring 70, and the positioning component is used to position the loading jig 80; the crystal bonding work station is used to dispense glue on the printed circuit board delivered by the carrier 50 and to perform welding operations between the chip at the position of the crystal ring 70 and the printed circuit board; a material receiving mechanism 90, which is used to receive and store the printed circuit board after the crystal bonding is completed.

[0067] In one embodiment, see Figure 4The material grabbing and moving mechanism 40 includes a material grabbing main seat 41 and an adsorption component 42. The material grabbing main seat 41 is arranged on the frame 10, and the adsorption component 42 is movably installed on the material grabbing main seat 41. The adsorption component 42 is used to transfer the printed circuit board in the material bin 21 to the loading and unloading platform 30.

[0068] In one embodiment, see Figure 3 The hopper 21 in the loading mechanism 20 is used to store the printed circuit boards to be bonded, and the loading and unloading platform 30 is equipped with a bidirectional conveyor belt, which allows the printed circuit boards to be transported in the length direction of the frame 10. The material grabbing and moving mechanism 40 transfers the printed circuit boards from the hopper 21 to the loading and unloading platform 30 through the adsorption member 42. The carrier 50 is responsible for horizontal transportation between the loading and unloading platform 30 and the bonding work station. The receiving mechanism 90 is responsible for receiving and storing the printed circuit boards after bonding. In this way, the entire workflow of the printed circuit boards from loading to unloading after bonding is automated, reducing manual intervention, thereby reducing the errors and damage risks that may occur during the operation. By precisely controlling the actions of each mechanism, the positioning accuracy of the printed circuit boards during transportation can be ensured, which is conducive to improving the stability and accuracy of the bonding process. In addition, the compact arrangement structure of each mechanism can reduce the distance and time of the printed circuit board transportation, which is conducive to improving the efficiency of the bonding process and reducing the overall volume of the bonding equipment.

[0069] In one embodiment, see Figure 3 The feeding mechanism 20 includes a feeding motor 22, which is fixed on the feeding main seat 23. The feeding motor 22 is equipped with a synchronous wheel 221 and an upper and lower slide plate 222. The hopper 21 is fixed on the base of the loading and unloading platform 30.

[0070] In one embodiment, see Figure 2 A flip assembly 100 is further provided above the wafer ring 70 , and the flip assembly 100 is used to flip the chip on the blue film on the wafer ring 70 .

[0071] In one embodiment, the die bonding work station includes a glue dispensing welding head 61 and a glue disc mechanism 62 arranged above the carrier 50, and a die bonding welding head 63 is also arranged between the carrier 50 and the crystal ring 70. The glue disc mechanism 62 is used to provide adhesive, and the glue dispensing welding head 61 is used to place the adhesive on the glue disc mechanism 62 onto the printed circuit board on the carrier 50. The die bonding welding head 63 is used to transfer the flipped chip on the flip assembly 100 to the adhesive position on the printed circuit board on the carrier 50 and fix it to the printed circuit board as a whole.

[0072] In a specific embodiment, the fixed packaging equipment is produced based on the flip chip process. Therefore, in order to meet the requirements of the production process, the chip on the blue film on the crystal ring 70 needs to be removed and flipped. The flip component 100 includes an adjustment seat 101, on which a Z-phase motor 102 is fixed, an eccentric shaft 103 is fixed at the output end of the Z-phase motor 102, a Z slide 104 is connected to the eccentric shaft, the connecting seat 104 connects the Z slide 1044 and the flip motor seat 106, the flip motor 105 is fixed on the flip motor seat 106, the output end of the flip motor 105 is connected to the motor flip shaft 107, the front end of the motor flip shaft 107 is fixed with a flip arm 108, and a suction nozzle 109 is fixed on the flip arm 108. The flip component 100 is used for flipping the chip and is adapted to the flip chip process. Through the flip component 100 and the crystal bonding head 63, the flip chip process can be realized to take out the crystal and bond the crystal at the same time, which is different from the existing swing arm crystal taking and bonding method.

[0073] In one embodiment, see Figure 8 The glue dispensing welding head 61 is set above the carrier 50. The glue dispensing welding head 61 includes a Z motor seat 611. The upper and lower motors 612 are installed on the Z motor seat 611. A rotating motor seat 613 is installed on the top. An eccentric shaft 615 is installed on the upper and lower motors 612. A rotating motor 614 is installed on the top of the rotating motor seat 613. A coupling 617 is installed on the rotating motor 614. A slide 618 is installed at the bottom of the coupling 617. A glue dispensing arm 616 is fixed at the output end of the slide 618. The glue dispensing welding head 61 is used to dispense glue on the printed circuit board.

[0074] In one embodiment, see Figure 9 The glue disc mechanism 62 includes a glue disc base 621, on which a glue disc motor 622 and a scraper seat 626 are fixed. A scraper 625 is fixed to the front end of the scraper seat 626. A gear 623 is installed at the output end of the glue disc motor 622, and a glue disc 624 is installed at the center of the bottom of the gear 623. The glue disc is used to store glue or adhesive.

[0075] In one embodiment, see Figure 10The die bonding welding head 63 includes a welding head main seat 632, a rotating motor 631 is provided on the top of the welding head main seat 632, a Z-axis motor main seat 634 is installed on the rear bottom of the welding head main seat 632, a Z-axis motor 633 is fixed on the Z-axis motor main seat 634, an eccentric shaft 635 is fixed on the output end of the Z-axis motor 633, a guide rail fixing seat 636 is fixed on the output end of the rotating motor 631, and the guide rail movable seat 638 is connected to the guide rail fixing seat 636 through a cross guide rail 637. A swing arm 639 is fixed on the guide rail movable seat 638. The flip component 100 drives the suction nozzle 109 to suck up the chip on the blue film, and then flips it 180°. By starting the swing arm 639 to swing, the swing arm 639 rotates horizontally 180°, picks up the chip after the flip component 100 flips over, and places the picked chip on the printed circuit board in the positioned carrier 50 to complete a die bonding.

[0076] In one embodiment, see Figure 2 A correction lens barrel 110 is provided above the wafer ring 70 , and the correction lens barrel 110 is used to locate the position of the flip assembly 100 after flipping the chip.

[0077] In one embodiment, the correction lens barrel 110 includes a correction lens barrel adjustment base, a correction lens barrel, a correction CCD, and a light source.

[0078] In one embodiment, a crystal retrieval lens barrel 120 is further provided above the crystal ring 70 . The crystal retrieval lens barrel 120 is used to locate the chip position of the blue film on the crystal ring 70 .

[0079] In one embodiment, the crystal acquisition lens barrel 120 includes a crystal acquisition adjustment base, a crystal acquisition lens barrel, a crystal acquisition CCD, and a light source.

[0080] In one embodiment, a die-bonding lens barrel 150 is disposed above the carrier 50 , and the die-bonding lens barrel 150 is used to locate the position of the printed circuit board on the carrier 50 .

[0081] In one embodiment, see Figure 16 The crystal-fixing lens barrel 150 includes a crystal-fixing lens barrel adjustment seat, on which the crystal-fixing lens barrel 150 is disposed. The top and bottom ends of the crystal-fixing lens barrel are respectively equipped with a crystal-fixing CCD and a light source.

[0082] In one embodiment, see Figure 12 and Figure 13The crystal ring 70 includes a ring expansion fixing seat 72, which is rotatably mounted on the workbench 71. The loading fixture 80 is placed at the upper end of the ring expansion fixing seat 72. A rotation correction unit is provided on the ring expansion fixing seat 72. The rotation correction unit is used to adjust the angle of the loading fixture 80. An ring expansion pressure plate 73 is installed around the ring expansion fixing seat 72. The ring expansion pressure plate 73 presses the edge of the loading fixture 80. The lifting unit is used to lift and lower the ring expansion pressure plate 73 to link the expansion of the blue film.

[0083] In one embodiment, Figure 12 The arrow in the figure shows the translation direction of the loading jig 80. The blue film is pre-pasted on the loading jig 80. The loading jig 80 is in the shape of an elliptical sheet or other suitable shapes. There is a circular opening in the middle of the loading jig 80. After the blue film is pasted on the loading jig 80, the chip on the blue film is exposed at the circular opening, which facilitates the subsequent lifting device to lift the chip that needs to be mounted on the blue film.

[0084] In one embodiment, see Figure 12 The loading jig 80 with the blue film is stacked on the material rack. The single blue film can be horizontally transferred to the expansion ring fixing seat 72 by an automated manipulator, and the lifting unit is started to make the expansion ring pressure plate 73 descend. During the descent of the expansion ring pressure plate 73, the expansion ring fixing seat 72 is in a high position. During the process of the expansion ring pressure plate 73 pressing the loading jig 80, the expansion ring fixing seat 72 and the blue film are lifted, and then the blue film is unfolded, thereby increasing the distance between the chips, making it easier for the positioning lens to position the chip to be installed.

[0085] In one embodiment, see Figure 13 The lifting unit includes a lifting screw arranged on the lower plate surface of the ring expansion pressure plate 73. The lifting screws are arranged in multiple groups at intervals along the circumferential direction of the ring expansion pressure plate 73. The upper end of the lifting screw is rotatably matched with the lower plate surface of the ring expansion pressure plate 73, and the lower end of the lifting screw is matched with the threaded hole on the ring expansion fixing seat 72. The power unit drives the multiple groups of lifting screws to rotate synchronously, thereby making the lifting screws extend into the threaded holes on the ring expansion fixing seat 72, so that the entire ring expansion pressure plate 73 descends to implement the crystal expansion operation of the blue film.

[0086] In one embodiment, since the loading jig 80 needs to be positioned by a positioning assembly when it is introduced above the expansion ring fixing seat 72, the sizes of the wafers vary, and the loading jigs 80 used to load the wafers vary in size. The positioning assembly can be replaced to position the loading jigs 80 of different sizes, thereby significantly enhancing the adaptability of the entire die-bonding packaging equipment, improving the production efficiency of the die-bonding packaging equipment, and reducing production costs.

[0087] In one embodiment, the expansion ring holder 72 included in the crystal ring 70 is rotatably mounted on the workbench 71. Since there is a positional error in the blue film of the loading jig 80 introduced into the expansion ring holder 72, the expansion ring holder 72 can be driven to rotate by the rotation correction unit, thereby fine-tuning the position of the blue film of the loading jig 80 in the horizontal plane, facilitating the scanning and positioning of the position of the chip to be installed by the positioning lens, and ensuring the installation accuracy of the chip and the PCB board.

[0088] In one embodiment, see Figure 12 In order to move the entire crystal ring 70 in the horizontal plane to ensure that the chip to be installed is always in the receiving position of the installation robot, the workbench 71 can drive the crystal ring 70 to move in the horizontal plane, and the crystal ring 70 can move in the X-axis direction and the Y-axis direction.

[0089] In a specific embodiment, the workbench 71 is composed of two groups of cross-shaped screw rods and nut webs, and the screw rods of the two groups of screw rods and nut webs are respectively connected to their respective drive motors. The workbench 71 is installed on a group of sliders above. The position of the chip to be installed is scanned and positioned by a positioning lens, thereby controlling the start and stop of the two groups of screw rods and nut webs, so that the chip to be installed stays at the set robot receiving position.

[0090] In one embodiment, a lifting device is further provided in the wafer ring 70 . The lifting device is located below the loading fixture 80 to lift the chip on the blue film.

[0091] In one embodiment, see Figure 17 The lifting device includes a pin 130 and an adjustment seat 131. A pin motor seat 132 is installed on the top of the adjustment seat 131. A pin motor 133 is installed on the left side of the pin motor seat 132, and a sensor 134 is installed on the right side. An eccentric shaft 135 is installed on the top of the pin motor 133, and a pin cap 136 is installed on the top of the eccentric shaft 135. An air joint 137 is installed at the lower rear part of the pin cap. The pin 130 is used to separate the chip from the crystal ring blue film.

[0092] In one embodiment, in order to ensure the positioning of both sides of the loading jig 80 so that the loading jig 80 is within the area defined by the positioning assembly, the positioning assembly includes at least two groups of positioning bars 75, and the positioning bars 75 are arranged in parallel and spaced apart and are detachably connected to the upper end surface of the expansion ring fixing seat 72. The positioning bars 75 are used to implement the positioning of both sides of the loading jig 80.

[0093] An automated manipulator can be used to extract a single loading jig 80 from a feed box stacked with loading jigs 80 and horizontally transfer it to the ring-expanding fixture 72. Flat surfaces are provided on both sides of the loading jig 80, and two sets of positioning bars 75 are used to clamp the flat surfaces on both sides of the loading jig 80, thereby performing preliminary positioning of the loading jig 80. The position of the positioning bar 75 on the upper end surface of the ring-expanding fixture 72 can be adjusted according to the different sizes of loading jigs 80, thereby adjusting the distance between the two sets of positioning bars 75 to adapt to the preliminary positioning of loading jigs 80 of different sizes.

[0094] In one embodiment, see Figure 13 The positioning assembly further includes a positioning rod 74 , the lower end of which is detachably connected to the upper end surface of the expansion ring fixing seat 72 , and the positioning rod 74 is used to position one end of the loading fixture 80 .

[0095] The end face of the loading jig 80 is provided with a positioning plane. When the automated manipulator transfers the single-wafer loading jig 80 horizontally to the expansion ring fixing seat 72, the positioning plane of the end face of the loading jig 80 abuts against the positioning rod 74, thereby achieving further positioning of the loading jig 80 to ensure that the blue film on the entire loading jig 80 is located at a set position on the crystal ring 70. In a specific embodiment, the positioning rod 74 can be a threaded rod, and the positioning rod 74 is detachably connected to the expansion ring fixing seat 72. At least two groups of positioning rods 74 are arranged at plane intervals to ensure precise positioning of the loading jig 80.

[0096] In a specific embodiment, the lower end of the expansion ring fixing seat 72 is rotatably mounted on the workbench 71 through multiple sets of support bearings.

[0097] In one embodiment, before the automated manipulator horizontally transfers the single-wafer loading jig 80 to the expansion ring fixing seat 72, the expansion ring pressure plate 73 is in a high position, and then the automated manipulator horizontally transfers the single-wafer loading jig 80 to the gap between the expansion ring pressure plate 73 and the tube end of the expansion ring fixing seat 72, and positions the single-wafer loading jig 80 by the positioning component, so that the lower end surface of the single-wafer loading jig 80 abuts against the tube mouth position of the expansion ring fixing seat 72 for subsequent angle adjustment, and then starts the lifting unit to lower the expansion ring pressure plate 73, thereby linking the loading jig 80 to lower. Since the expansion ring fixing seat 72 remains stationary in the vertical plane, the expansion ring pressure plate 73 links the loading jig 80 to lower, which can cause the blue film on the loading jig 80 to deform and expand, thereby increasing the distance between the chips within the tube cavity range of the expansion ring fixing seat 72, facilitating the correction and position identification of the chips by the above-mentioned correction lens barrel 110 and the crystal retrieval lens barrel 120, and timely adjusting the position of the chips.

[0098] In one embodiment, see Figure 2 and Figure 3The loading and unloading platform 30 includes a loading platform 32 and a unloading platform 33. The loading platform 32 is located on the side of the unloading platform 33 facing away from the silo 21. The loading platform 32 and the unloading platform 33 are both provided with the conveyor belt, so that the loading and unloading processes of the printed circuit board can be carried out simultaneously, thereby improving the working efficiency of the equipment. At the same time, the conveyor belt design of the two platforms helps to realize the two-way transmission of the printed circuit boards, increasing the flexibility and adaptability of the equipment. This structural design allows the equipment to switch quickly in different production links, adapt to different production needs, and improve the flexibility of the production line. For example, when the carrier 50 transports the first printed circuit board to a fixed position for crystal bonding, the grabbing and moving mechanism 40 can grab the second printed circuit board to be crystal bonded and place it on the loading platform 32 for waiting. After the crystal bonding of the first printed circuit board is completed, it can be transported to the unloading platform 33 by the carrier 50, and then transported to the receiving box 91 by the unloading platform 33 for collection and storage. In this way, the loading and unloading of the printed circuit board can be carried out simultaneously without interfering with each other, thereby reducing the waiting time of the printed circuit board during loading and conveying, and improving the loading efficiency.

[0099] In one embodiment, see Figure 5 The carrier 50 includes a carrier base 51, a top plate 52, a cover plate 53, a carrier cylinder 54, and a carrier motor 55. The top plate 52 is arranged above the carrier base 51 to carry the printed circuit board. The cover plate 53 is pressed against the edge of the printed circuit board to ensure the stability of the printed circuit board. The carrier motor 55 drives the conveying wheel on the carrier 50 to rotate to realize the transportation of the printed circuit board. The output end of the carrier cylinder 54 is connected to the bottom of the top plate 52 to realize the lifting and lowering of the top plate 52, thereby adjusting the height of the printed circuit board on the carrier 50, so as to facilitate the printed circuit board to be moved between the carrier 50 and the loading and unloading platform 30. The material receiving mechanism 90 is provided on the side of the loading and unloading platform 30 facing away from the carrier 50. The material receiving mechanism 90 includes a material receiving box 91, a material receiving main base 92, a material receiving motor 93, and a material receiving slide 94. The material receiving main base 92 is mounted on the frame 10. The material receiving motor 93 and the material receiving slide 94 are mounted on both sides of the material receiving main base 92. The material receiving box 91 is connected to the material receiving slide 94. The material receiving motor 93 drives the material receiving slide 94 to move up and down to lift the material receiving box 91, so as to adjust the storage slot of the material receiving box 91 to correspond to the height of the conveyor belt of the loading and unloading platform 30, thereby realizing the storage of printed circuit boards. The accuracy and stability of the printed circuit boards from loading to receiving are guaranteed.

[0100] In a specific embodiment, the material grabbing and moving mechanism 40 includes a material grabbing main seat 41 and an adsorption component 42. The material grabbing main seat 41 is arranged on the frame 10, and the adsorption component 42 is movably installed on the material grabbing main seat 41. The adsorption component 42 is used to transfer the printed circuit board in the material bin 21 to the loading and unloading platform 30.

[0101] In one embodiment, see Figure 4 The material grabbing and moving mechanism 40 also includes a material grabbing rail 43, a material grabbing plate 44, and upper and lower cylinders 45. The material grabbing rail 43 is mounted on the material grabbing main seat 41 along the width direction of the frame 10. The material grabbing plate 44 is slidably mounted on the material grabbing rail 43. The upper and lower cylinders 45 are mounted on the material grabbing plate 44. The suction member 42 is connected to the output end of the upper and lower cylinders 45. The upper and lower cylinders 45 can drive the suction member 42 to move up and down in the vertical direction. The material grabbing plate 44 is driven horizontally along the extension direction of the material grabbing rail 43 by a driving member such as a motor, and the suction member 42 is driven up and down by the upper and lower cylinders 45. This makes it easier for the suction member 42 to accurately grab and place the printed circuit board. This improves the working efficiency and flexibility of the material grabbing and moving mechanism 40.

[0102] Specifically, the adsorption member 42 includes a connecting plate and a plurality of suction cups. The connecting plate is connected to the output ends of the upper and lower cylinders 45, and the plurality of suction cups are spaced apart around the periphery of the connecting plate. By providing a plurality of suction cups to increase the adsorption effect of the adsorption member 42 on the printed circuit board, the adsorption member 42 can stably grasp the printed circuit board. The distribution of the suction cups helps to evenly adsorb the printed circuit board and prevent it from slipping during the transfer process. By using a plurality of suction cups, it can be ensured that stable adsorption can be achieved on different printed circuit board surfaces. This structural design allows the adsorption member 42 to achieve stable adsorption on different printed circuit board surfaces, thereby improving the accuracy and reliability of the printed circuit board transfer process.

[0103] In one embodiment, see Figure 6 The fixed packaging equipment also includes a die bonding workbench 140, which includes a slide, a first slide rail, and a second slide rail. The carrier 50 is installed above the slide, and the slide is slidably installed above the first slide rail. The first slide rail is slidably installed above the second slide rail. The first slide rail is extended along the width direction of the frame 10, and the second slide rail is extended along the length direction of the frame 10. This multi-level sliding structure design enables the carrier 50 to move flexibly in the width and length directions of the frame 10, thereby improving the working efficiency and operating range of the equipment. Through this design, the printed circuit board can be moved quickly and accurately between the die bonding work position and the loading and unloading platform 30, further optimizing the die bonding process. Allowing the carrier 50 to quickly switch between different working positions improves the efficiency and flexibility of the production line.

[0104] When in use, the printed circuit board that needs to be solidified and packaged is loaded into the material box and placed on the loading and unloading platform 30, and the empty material box is placed on the receiving mechanism 90, and then the blue film of the patch is placed on the loading fixture 80; the crystal ring 70 is assembled on the workbench 71, and the chip on the blue film assembled on the crystal ring 70 is positioned by the crystal taking lens barrel 120, and at the same time, the material grabbing and moving mechanism 40 sucks the printed circuit board placed on the loading platform 32 and places it on the unloading platform 33, and the loading and unloading platform 30 drives the belt to send the printed circuit board into the carrier 50 through the motor, and the carrier 50 is assembled on the solid crystal workbench 140, and the printed circuit board in the carrier 50 is positioned by the solid crystal lens barrel 150; when the crystal taking lens barrel 120 has positioned the chip, the chip on the blue film is lifted by the ejector pin 130; the solid crystal lens barrel 150 positions the printed circuit board in the carrier 50 installed on the solid crystal workbench 140; the dispensing welding head 61 drives the dispensing arm to move from the glue tray mechanism The adhesive is dipped into 62 to dispense glue on the positioned printed circuit board, and then the suction nozzle 109 of the flip component 100 sucks the chip on the lifted blue film, and then flips it 180°. Secondly, the crystal bonding welding head 63 drives the swing arm 639 to pick up the chip after the flip component 100 is flipped, and the crystal bonding welding head 63 drives the swing arm 639 to rotate horizontally 180° to place the picked up material on the printed circuit board in the positioned carrier 50, completing a placement and crystal bonding. Repeat the above actions until the printed circuit board is full of materials and the placement of the printed circuit is completed; the carrier 50 moves to the vicinity of the loading and unloading platform 30 through the crystal bonding workbench 140, and the carrier 50 motor sends the mounted printed circuit board to the loading and unloading platform 30 through the belt, and the loading and unloading platform 30 sends the mounted printed circuit board to the receiving box 91 on the receiving mechanism 90 through the belt; repeat the above actions until all the printed circuit boards on the loading platform 32 or the chips on the blue film are used up.

[0105] This high-precision and high-speed die-bonding packaging equipment can realize chip flipping and die bonding at the same time, which is different from the existing swing-arm die-taking and die-bonding method. In addition, this equipment is compatible with 12-inch, 8-inch, and 6-inch die rings. It only needs to replace the corresponding positioning component accessories, which is simple and reliable to operate. The original loading method uses manual operation, which is prone to damaging the mounted printed circuit boards, and is prone to mixing, wrong materials, and waste. This high-precision and high-speed die-bonding packaging equipment uses automatic loading and automatic receiving to reduce manual intervention, and has image recognition function, which can well check the incoming materials and problems in the process and promptly report errors and reminders, reducing product defects caused by manual labor. This high-precision and high-speed flip chip process die-bonding packaging equipment fills the gap in flip chip process eutectic machines on the market, and improves the die bonding precision, improves production efficiency, and reduces costs. The welding head adopts a direct drive structure and high-precision cross guide rails to ensure its accuracy. It has the advantages of high degree of automation, high production efficiency, intelligent operation and reduced labor costs.

[0106] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0107] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. Die-bonding packaging equipment, characterized in that: include: frame; A loading mechanism, the loading mechanism being arranged on the frame and comprising a silo for placing printed circuit boards to be bonded; A loading and unloading platform, wherein the loading and unloading platform and the loading mechanism are spaced apart along the width direction of the frame, and the loading and unloading platform is provided with a bidirectional conveyor belt, and the conveyor belt is extended along the length direction of the frame; A material grabbing and moving mechanism, which can move the printed circuit boards in the material bin to the loading and unloading platform; A carrier, the carrier being used to transport the printed circuit board back and forth between the loading and unloading platform and the die bonding station; Crystal ring, used to implement the expansion operation of the blue film; A loading jig, to which the blue film is adhered, and the loading jig is placed on the wafer ring; A workbench, driving the crystal ring to move in a horizontal plane; A positioning assembly is detachably provided on the wafer ring, and the positioning assembly is used to position the loading fixture; The die bonding station is used to glue the printed circuit board delivered by the carrier and to weld the chip at the die ring position to the printed circuit board; The material receiving mechanism is used to receive and store the printed circuit boards after die bonding.

2. The die bonding packaging equipment according to claim 1, characterized in that: A lifting device is also provided in the wafer ring and is arranged below the loading fixture to lift the chip on the blue film.

3. The die bonding packaging equipment according to claim 1, wherein: A flip assembly is also provided above the wafer ring, and the flip assembly is used to flip the chip on the blue film on the wafer ring.

4. The die bonding packaging equipment according to claim 3, characterized in that: The crystal bonding work station includes a dispensing welding head and a glue disc mechanism arranged above the carrier. A crystal bonding welding head is also arranged between the carrier and the crystal ring. The glue disc mechanism is used to provide adhesive. The dispensing welding head is used to place the adhesive on the glue disc mechanism onto the printed circuit board on the carrier. The crystal bonding welding head is used to transfer the flipped chip on the flip assembly to the adhesive position on the printed circuit board on the carrier and fix it to the printed circuit board as a whole.

5. The die bonding packaging equipment according to claim 3, characterized in that: A correction lens barrel is provided above the crystal ring, and the correction lens barrel is used to locate the position of the flip assembly after flipping the chip; a crystal retrieval lens barrel is also provided above the crystal ring, and the crystal retrieval lens barrel is used to locate the chip position of the blue film on the crystal ring.

6. The die bonding packaging equipment according to claim 1, characterized in that: A crystal fixing lens barrel is provided above the carrier, and the crystal fixing lens barrel is used for positioning the position of the printed circuit board on the carrier.

7. The die bonding packaging equipment according to claim 1, wherein: The loading and unloading platform includes a loading platform and a unloading platform. The loading platform is arranged on the side of the unloading platform facing away from the silo. Both the loading platform and the unloading platform are provided with the conveyor belt.

8. The die bonding packaging equipment according to claim 1, wherein: The material grabbing and moving mechanism includes a material grabbing main seat and an adsorption component. The material grabbing main seat is arranged on the frame. The adsorption component is movably installed on the material grabbing main seat. The adsorption component is used to transfer the printed circuit board in the material bin to the loading and unloading platform.

9. The die bonding packaging equipment according to claim 1, wherein: The material receiving mechanism is arranged on a side of the loading and unloading platform facing away from the carrier. The material receiving mechanism includes a material receiving box. The material receiving box corresponds to the conveyor belt of the loading and unloading platform to receive and store the printed circuit boards after die bonding.

10. The die bonding packaging equipment according to claim 1, wherein: The crystal ring includes an expanding ring fixing seat, which is rotatably mounted on the workbench. The loading fixture is placed at the upper end of the expanding ring fixing seat. An expanding ring pressure plate is installed around the expanding ring fixing seat. The expanding ring pressure plate presses the edge of the loading fixture. The lifting unit is used to lift and lower the expanding ring pressure plate to link the expansion of the blue film.

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