Wafer post-processing device, bearing unit, overturning method and processing equipment

Abstract

The invention provides a wafer post-processing device, a bearing unit, an overturning method and processing equipment, the wafer post-processing device comprises a controller and a wafer bearing unit, and the wafer bearing unit comprises a bearing bracket, a detection assembly and an adjusting assembly; the bearing bracket comprises a turnover main body, a fixedly mounted upper limiting piece and a movably mounted lower limiting piece, and the lower limiting piece can be close to or far away from the center of the main body; the detection assembly is used for detecting the inclination angle of the wafer; the adjusting assembly is arranged on the main body and is used for supporting the wafer upwards so as to adjust the wafer to a horizontal state; the controller is configured to control the main body to turn over to a horizontal state, control the detection assembly to detect the inclination angle of the wafer, control the adjusting assembly to support the wafer according to the inclination angle, control the lower limiting piece to be away from the center of the main body, control the adjusting assembly to adjust the wafer to a horizontal state, and control the lower limiting piece to be close to the center of the main body. According to the invention, the overturned and inclined wafer can be leveled, and the wafer cannot be polluted and the limiting piece cannot be damaged.

Description

Technical Field

[0001] The present invention belongs to the field of chemical mechanical polishing technology and is used for processing semiconductor chips. Specifically, it relates to a wafer post-processing device, a carrying unit, a flipping method, and a processing device. Background Art

[0002] Chemical Mechanical Polishing (CMP) equipment is currently the only equipment that can achieve global flattening of the surface of semiconductor wafers and is one of the five core processes in the wafer manufacturing process.

[0003] A CMP system typically consists of an Equipment Front End Module (EFEM), a polishing unit, a cleaning unit, and a drying unit, enabling wafer loading and unloading, ensuring surface uniformity that meets process requirements. In a vertical cleaning and drying system, wafers must be flipped from a vertical position to a horizontal position before being removed from the EFEM.

[0004] The wafer carrier used for flipping includes stoppers for positioning the wafer. As the carrier moves the wafer, the wafer's edges and stoppers form multiple points of support, allowing it to slide along the support surface under inertia and gravity until it reaches a horizontal position. However, during production, wafers occasionally fail to fully flip to a horizontal position, preventing the EFEM from properly removing the wafer, causing the machine to shut down due to an alarm, or even causing the wafer to break. Summary of the Invention

[0005] In view of this, the present invention provides a wafer post-processing device, a carrying unit, a flipping method and a processing equipment, thereby solving or at least alleviating one or more of the above-mentioned problems and other problems existing in the prior art.

[0006] A first aspect of the present invention provides a wafer post-processing device, comprising: a controller, a carrying bracket, a detection component, and an adjustment component;

[0007] The carrying bracket includes a flippable main body, an upper limit member fixedly mounted on a side surface of the main body, and a movably mounted lower limit member, wherein the lower limit member can be moved closer to or farther from the center of the main body, and the upper limit member and the lower limit member are used to limit and carry the wafer during the flipping process of the main body;

[0008] The detection component is used to detect the tilt angle of the wafer;

[0009] The adjustment assembly is provided on the main body and is used to support the wafer upwards to adjust the wafer to a horizontal state;

[0010] The controller is electrically connected to the carrying bracket, the detection component and the adjustment component, and is configured to:

[0011] Control the main body to flip to a horizontal state,

[0012] Controlling the detection component to detect the tilt angle of the wafer,

[0013] controlling the adjustment component to support the wafer according to the tilt angle,

[0014] Control the lower limit member to be away from the center of the main body,

[0015] Controlling the adjustment component to adjust the wafer to a horizontal state,

[0016] Controlling the lower limit member to be close to the center of the main body;

[0017] The wafer is adjusted to a horizontal state, and the wafer and the lower limit member are not worn.

[0018] Optionally, the carrying bracket further comprises a flip drive motor, and the main body flips along the first axis, and the first axis is the center line of the motor shaft of the flip drive motor;

[0019] The upper limit member and the lower limit member are respectively located on both sides of the first shaft.

[0020] Optionally, the bearing bracket includes two upper limit members and two lower limit members, and the upper limit members and the lower limit members are respectively arranged in an axisymmetric distribution about the same symmetry axis, and the symmetry axis is perpendicular to the first axis;

[0021] The detection component is located on the symmetry axis.

[0022] Optionally, the adjustment assembly includes two upper adjustment elements and two lower adjustment elements, the two upper adjustment elements and the two lower adjustment elements are respectively arranged in an axisymmetric distribution about the symmetry axis, the upper adjustment element and the upper limit member are located on the same side of the first axis, and the lower adjustment element and the lower limit member are located on the same side of the first axis;

[0023] Each of the upper adjustment element and the lower adjustment element includes an adjustment driver, an adjustment support rod and an adjustment support element. The adjustment support rod connects the adjustment driver and the adjustment support element. The adjustment driver drives the adjustment support rod to rise or fall. The adjustment support element is used to support the wafer.

[0024] Optionally, the adjustment support element includes a support element body and a clamping portion, the body is a plate-shaped annular member, and a through-lifting hole is provided on the body. The adjustment support rod passes through the lifting hole, and one end located on one side surface of the body is connected to the adjustment support element, and the other end is connected to the adjustment driver.

[0025] Optionally, the detection assembly includes a first detection element and a second detection element, the first detection element is arranged at the midpoint of a line connecting the centers of the two lower adjustment elements, the second detection element is arranged at the midpoint of a line connecting the centers of the two upper adjustment elements, and the first detection element and the second detection element are located at the same height;

[0026] The two upper adjustment elements are located between the upper limit members, and the two lower adjustment elements are located between the lower limit members;

[0027] The controlling the detecting component to detect the tilt angle of the wafer, and controlling the adjusting component to support the wafer according to the tilt angle, comprises:

[0028] controlling the first detection element to detect a first distance from the wafer,

[0029] controlling the second detection element to detect a second distance from the wafer,

[0030] The adjustment driver controlling the two lower adjustment elements drives the adjustment support rod to rise by the first distance,

[0031] The adjustment driver controlling the two upper adjustment elements drives the adjustment support rod to rise the second distance.

[0032] Optionally, the adjustment support element includes an adjustment support surface and an adjustment limit surface, the upper limit member includes an upper bearing surface and an upper limit surface, and the lower limit member includes a lower bearing surface, a lower limit surface and a hook-shaped portion;

[0033] When the main body is in a horizontal state, the adjustment limit surface protrudes upward from the edge of the adjustment support surface, the upper limit surface protrudes upward from the edge of the upper bearing surface, the lower limit surface protrudes upward from the edge of the lower bearing surface, and the hook-shaped portion protrudes inward from the edge of the lower limit surface;

[0034] Before controlling the adjustment component to support the wafer according to the tilt angle, the adjustment limit surface is lower than the upper bearing surface and the lower bearing surface in the vertical direction;

[0035] The center of the upper adjusting element and the center of the lower adjusting element are the midpoints of the intersection lines of the corresponding adjusting limit surfaces and the adjusting support surfaces;

[0036] The center of the upper limit member is the midpoint of the intersection line between the corresponding upper bearing surface and the upper limit surface;

[0037] The center of the lower limit member is the midpoint of the intersection line between the corresponding lower bearing surface and the lower limit surface;

[0038] The center of the upper regulating element, the center of the lower regulating element, the center of the upper limit member, and the center of the lower limit member are cocircular when they are in the same plane, and the cocircular circle is consistent with the edge of the wafer;

[0039] The central angle between the center of the adjacent upper adjusting element and the center of the upper limit member is 3° to 15°, and the central angle between the center of the adjacent lower adjusting element and the center of the lower limit member is 3° to 15°.

[0040] Optionally, controlling the adjustment component to adjust the wafer to a horizontal state includes:

[0041] Controlling the adjustment driver of the upper adjustment element to drive the adjustment support rod to rise until the adjustment support surface of the upper adjustment element is at the same height as the adjustment support surface of the lower adjustment element;

[0042] The adjusting driver of the upper adjusting element and the adjusting driver of the lower adjusting element are controlled to drive the adjusting support rod to descend.

[0043] Optionally, the height of the upper limit surface is 1-2 mm, the height of the lower limit surface is 5-10 mm, and the angle between the lower bearing surface and the lower limit surface is 95°-105°;

[0044] The wafer is 12-inch wafer;

[0045] So that the disturbance to the wafer caused by the adjustment component when supporting the wafer according to the tilt angle is less than 0.1 mm.

[0046] Optionally, the wafer post-processing device further includes a wafer vertical processing unit and a transfer robot, and the processor is further configured to:

[0047] Controlling the wafer vertical processing unit to perform a wafer post-processing process;

[0048] The transfer robot is controlled to grab the vertical wafer from above the wafer vertical processing unit and place it vertically on the carrying bracket.

[0049] According to a second aspect of the present invention, there is provided a wafer carrying unit, comprising: a carrying bracket, a detection component and an adjustment component;

[0050] The carrying bracket includes a flippable main body, two upper limit members fixedly mounted on one side surface of the main body, and two lower limit members movably mounted, wherein the lower limit members can be moved closer to or farther away from the center of the main body, and the upper limit members and the lower limit members are used to limit and carry the wafer during the flipping process of the main body;

[0051] The detection assembly includes a first detection element and a second detection element, respectively used to detect a first distance and a second distance between the wafer and the detection surface;

[0052] The adjustment assembly is disposed on the main body, and includes two upper adjustment elements and two lower adjustment elements that can be raised and lowered relative to a side surface of the main body, and is used to be raised and lowered according to the first distance and the second distance to support the wafer and adjust the wafer to a horizontal state;

[0053] The two upper adjusting elements are arranged between the two upper limit members, the two lower adjusting elements are arranged between the two lower limit members, the first detection element is arranged at the midpoint of the line connecting the centers of the two lower adjusting elements, and the second detection element is arranged at the midpoint of the line connecting the centers of the two upper adjusting elements.

[0054] According to a third aspect of the present invention, a wafer flipping method is provided, using the wafer carrying unit according to the second aspect, comprising:

[0055] Controlling the main body to flip to a horizontal state;

[0056] controlling the second detecting element to detect the second distance;

[0057] controlling the first detecting element to detect the first distance;

[0058] controlling the upper adjustment element and the lower adjustment element to rise according to the second distance and the first distance respectively to support the wafer;

[0059] controlling the lower limit member to move away from the center of the main body;

[0060] controlling the upper adjustment element to rise according to the second distance and the first distance to horizontally support the wafer;

[0061] controlling the upper adjusting element and the lower adjusting element to descend according to the first distance;

[0062] The lower limit member is controlled to be close to the center of the main body.

[0063] According to the fourth aspect of the present invention, a wafer processing device is provided, comprising: a processor and a wafer carrying unit as described in the second aspect 10, the processor being electrically connected to the wafer carrying unit and being used to control the wafer carrying unit to execute the wafer flipping method as described in the third aspect.

[0064] The present invention has the following technical effects: the present invention can adjust a wafer that is stuck when flipping from a vertical state to a horizontal state to a horizontal state, thereby avoiding the situation where the EFEM cannot take the wafer normally, causing the machine to alarm and shut down, or even smashing the wafer. At the same time, the present invention, through the precise detection of the tilt angle, the stable support of the adjustment component and the active avoidance of the lower limit member, does not cause wear to the wafer and the lower limit member during the adjustment to the horizontal state, thereby avoiding damage and contamination to the edge of the wafer and extending the service life of the lower limit member. In addition, the present invention achieves compatibility with wafers in any state during the flipping process by optimizing the wafer inclination detection and judgment process, avoids redundant processes, and improves the quality and stability of wafer processing by wafer processing equipment by improving the efficiency and reliability of wafer interactive transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0066] Figure 1 It is a structural diagram of CMP equipment.

[0067] Figure 2 It is a structural schematic diagram of the carrying bracket 22 flipped to a horizontal state.

[0068] Figure 3 It is a structural schematic diagram of the carrying bracket 22 flipped to a vertical state.

[0069] Figure 4 yes Figure 2 Schematic diagram of the structure of the upper limit member 224 of the middle bearing bracket 22.

[0070] Figure 5 yes Figure 2 Schematic diagram of the structure of the lower limit member 225 of the middle bearing bracket 22.

[0071] Figure 6 yes Figure 2 Schematic diagram of the wafer position.

[0072] Figure 7 FIG. 1 is a schematic structural diagram of an embodiment of a wafer carrying unit 100 of the present invention.

[0073] Figure 8 FIG. 1 is a schematic structural diagram of another embodiment of the wafer carrying unit 100 of the present invention.

[0074] Figure 9 yes Figure 8 A schematic side view of the structure of the wafer carrying unit 100 is enlarged.

[0075] Figure 10 yes Figure 8 A schematic side view of the structure of the wafer carrying unit 100 at point B is enlarged.

[0076] Figure 11 yes Figure 8 Schematic diagram of the relationship between distance parameters detected when wafer jam occurs in the wafer carrying unit 100.

[0077] Figure 12 FIG. 1 is a schematic structural diagram of an embodiment of a wafer post-processing device 1000 of the present invention.

[0078] Figure 13 It is a structural schematic diagram of an embodiment of the wafer flipping method of the present invention.

[0079] Figure 14 FIG. 2 is a schematic structural diagram of a wafer processing device 2000 according to an embodiment of the present invention.

[0080] Reference numerals:

[0081] Fixed surface 1;

[0082] Front module 10; front robot 11; front-opening wafer transfer box 12;

[0083] Wafer processing module 20; transfer robot 21; carrying bracket 22; main body 221; arc-shaped member 2212; flip connection portion 222; flip drive motor 223; upper limit member 224; upper bearing surface 2241; upper limit surface 2242; lower limit member 225; lower bearing surface 2251; lower limit surface 2252; hook portion 2253; lower limit member driver 226; thin cylinder 2261; ejector rod 2262; compression spring 2263; spring mounting seat 2264; buffer block 2265; groove 227; drying unit 23;

[0084] Detection component 3; first detection element 31; second detection element 32;

[0085] Adjustment assembly 4; upper adjustment element 41; adjustment driver 411; adjustment support rod 412; adjustment support element 413; adjustment support surface 4131; adjustment limit surface 4132; lower adjustment element 42;

[0086] Wafer carrying unit 100; controller 200; wafer carrying unit 300; wafer vertical processing unit 400; processor 500;

[0087] Wafer post-processing device 1000; wafer processing equipment 2000. DETAILED DESCRIPTION

[0088] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments in the embodiments of the present invention should fall within the scope of protection of the embodiments of the present invention.

[0089] In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0090] In addition, in the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a mechanical connection or an electrical connection, or it can be the internal connection between two components. It can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances.

[0091] Figure 1 The diagram below is a schematic diagram of the CMP equipment structure, which includes a front module 10 and a wafer processing module 20. The front module 10 is used to store pre-polished and polished wafers. It includes a front robot 11 (i.e., an EFEM robot) and four front-opening unified pods (FOUPs) 12. The front robot 11 is located on the side of the front-opening pods 12 adjacent to the wafer processing module 20 and is used to transfer horizontally placed wafers between the wafer processing module 20 and the front-opening pods 12.

[0092] The wafer processing module 20 includes a carrier bracket 22, a polishing unit, a cleaning unit, and a drying unit 23. Unprocessed wafers are placed horizontally in a front-opening wafer transfer box 12, grabbed by the front robot 11, and transferred to the wafer processing module 20, where they undergo the polishing process of the polishing unit, the cleaning process of the cleaning unit, and the drying process of the drying unit. The drying unit 23 uses a vertical drying process such as pull drying or spin drying. The transfer robot 21 grabs the vertical wafer from above the drying unit 23 and places it vertically on the carrier bracket 22. The wafer carrier bracket 22 flips the wafer to a horizontal state with the front side facing up, and the front robot 11 can then grab the wafer and transfer it out of the wafer processing module 20, and finally place it in the front-opening wafer transfer box 12.

[0093] Figure 2-Figure 3 The structural diagram of the carrier bracket 22 is shown in the figure. As shown in the figure, the carrier bracket 22 includes a main body 221 that can be turned around the driving axis. When the main body 221 is turned under the driving Figure 2 The horizontal state shown is between Figure 3 The main body 221 is provided with position-limiting members for supporting, limiting and carrying wafers on the circumference of one side surface, including two upper position-limiting members 224 and two lower position-limiting members 225, which are located on both sides of the drive shaft.

[0094] Figure 4 and Figure 5 The upper limit member 224 and the lower limit member 225 are schematic structural diagrams. As shown in the figure, the upper limit member 224 includes an upper bearing surface 2241 and an upper limit surface 2242, and the lower limit member 225 includes a lower bearing surface 2251, a lower limit surface 2252 and a hook portion 2253. When the main body 221 is in a vertical state, as shown in FIG. Figure 3 As shown, the upper limit member 224 is at the top and the lower limit member 225 is at the bottom. The wafer is placed obliquely in the space defined by the upper limit member 224 and the lower limit member 225 of the main body 221. The edge of the wafer supports the upper bearing surface 2241, the lower limit surface 2252 and the hook portion 2253. Figure 6 The wafer is indicated by the long dashed line.

[0095] Main body 221 along Figure 3 During the process of flipping from the vertical state to the horizontal state in the direction indicated by the middle arrow, the edge of the wafer slides along the upper bearing surface 2241 and the lower limit surface 2252 under the action of inertia and its own gravity. The direction and process of sliding are shown in FIG. Figure 6 As shown by the arrow in the middle. Until the main body 221 is turned to the horizontal state, as shown in FIG. Figure 6 The wafer indicated by the midpoint dashed line is supported by the upper supporting surface 2241 and the lower supporting surface 2251 and is in a horizontal state. The front robot 11 grabs the wafer and transfers it to the EFEM.

[0096] When a CMP device processes a wafer, there is a situation where the wafer cannot be completely flipped to a horizontal position (referred to as wafer jam). For example Figure 6 The wafer represented by the solid line, although the main body 221 is flipped to a horizontal state, the wafer is still stuck between the upper supporting surface 2241 and the lower limit surface 2252, and cannot slide to the lower supporting surface 2251. After analysis, it is mainly because there are wafers with large edge roughness, which causes the friction between the wafer and the limiter to be too large, and the wafer cannot slide normally. Once the wafer is stuck, the front robot 11 will not be able to grab the wafer normally, causing the machine to alarm and shut down, so manual intervention or replacement of the limiter is necessary, resulting in additional economic losses. What is more serious is that when the front robot 11 grabs the tilted wafer, it may collide with the wafer and cause fragments. Fragments are serious machine accidents, requiring a long period of shutdown for cleaning or even replacement of the entire unit where the fragments occur, causing huge economic losses.

[0097] However, even if the stoppers are made of a material with relatively good self-lubricating properties, and the upper bearing surface 2241 and the lower limiting surface 2252 are processed into specific shapes to reduce the impact of friction, wafer jams still occur randomly and irregularly. After repeated testing and verification, one of the reasons is that the continuous wear of the supporting surface by friction is uneven. When the supporting surface texture formed by the upper bearing surface 2241 and the lower limiting surface 2252 is highly consistent with the edge texture of a certain wafer, the wafer will not slide normally, while subsequent wafers may be completely unaffected, resulting in occasional wafer jams and causing economic losses.

[0098] The present invention provides a wafer carrying unit 100 for flipping a wafer from a vertical state to a horizontal state, and adjusting a stuck wafer to a horizontal state, thereby solving the above-mentioned technical problems.

[0099] like Figure 7 or Figure 8 As shown, the wafer carrying unit 100 includes: a carrying bracket 22 , a detection component 3 and an adjustment component 4 .

[0100] The carrier 22 includes a main body 221 that can be rotated along a first axis, an upper stopper 224, a lower stopper 225, and a lower stopper driver 226. The upper stopper 224 and lower stopper driver 226 are fixedly mounted on one side of the main body 221, while the lower stopper 225 is movably mounted on the same side of the main body 221. The upper and lower stopper 224, 225 are located on opposite sides of the first axis. The lower stopper driver 226 is used to drive the lower stopper 225 toward or away from the center of the main body 221. When the lower stopper 225 is near the center of the main body 221, it forms a space for wafer placement with the upper stopper 224. When the lower stopper 225 is away from the center of the main body 221, it forms a space for adjusting the wafer angle with the upper stopper 224. When the main body 221 is rotated, it switches between a horizontal and vertical state. The lower stopper 225 is positioned near the center of the main body 221. The upper and lower stopper 224, 225 limit and support the wafers during the rotation of the main body 221.

[0101] The detection component 3 is used to detect the tilt angle of the wafer along the upper limit member 224 toward the lower limit member 225 when the main body 221 is flipped to a horizontal state. If the tilt angle detected by the detection component 3 is less than or equal to the preset threshold, it means that the wafer is not stuck and the front robot 11 can grab the wafer normally. The preset threshold can be determined based on the angle deviation allowed when the front robot grabs the wafer. If the tilt angle detected by the detection component 3 is greater than the preset threshold, it means that the wafer is stuck, and the adjustment component 4 is triggered to level the wafer. Optionally, Figure 4-Figure 6 As shown, the upper limit member includes an upper bearing surface 2241 and an upper limit surface 2242, and the lower limit member 225 includes a lower bearing surface 2251, a lower limit surface 2252, and a hook-shaped portion 2253. When the main body 221 is in a horizontal state, the upper limit surface 2242 protrudes upward from the edge of the upper bearing surface 2241, the lower limit surface 2252 protrudes upward from the edge of the lower bearing surface 2251, and the hook-shaped portion 2253 protrudes inward from the edge of the lower limit surface 2252. Therefore, when the main body 221 is in a vertical state to place a wafer, the edge of the wafer abuts the upper bearing surface 2241, the lower limit surface 2252, and the hook-shaped portion 2253, so that the wafer remains in a nearly vertical state. When the main body 221 and the wafer are both in a horizontal state, the upper bearing surface 2241 and the lower bearing surface 2251 support the wafer, and the edge of the wafer abuts the upper bearing surface 2242 and the lower limit surface 2252. By limiting the number and position of the upper limit member 224 and the lower limit member 225 and the shape of the upper supporting surface 2241 and the lower limit surface 2252, the wafer can slide relative to the main body 221 along the lower limit member 225 toward the upper limit member 224 during the process of flipping to the horizontal direction, which is perpendicular to the first axis.

[0102] The adjustment component 4 can support the wafer upward at the tilt angle detected by the detection component 3, that is, it can support the wafer so that the wafer remains as still as possible or moves as little as possible, thereby ensuring that the wafer will not be affected by the friction generated by the lower limit surface 2252 during the support process due to relative displacement or displacement trend of the wafer edge. Friction can easily cause serious accidents such as wafer edge chipping and cracking. Even if no serious accidents occur, it can easily cause wear of the wafer edge and the lower limit surface 2252. Contaminants generated by wear can adhere to the surface of the wafer, causing the wafers transferred to the front-opening wafer folding box 12 to fail to meet the cleanliness requirements, thereby affecting subsequent processes and ultimately leading to a decrease in chip yield, and even cross-diffusion of contaminants affecting other wafers.

[0103] After the adjustment assembly 4 supports the wafer, the lower limit member driver 226 drives the lower limit member 225 away from the center of the main body 221, so that the edge of the wafer contacts the lower limit surface 2252. During this contact process, the wafer is supported and does not produce undesirable displacement. While maintaining the lower limit surface 2252 in contact with the wafer, the adjustment assembly 4 adjusts the wafer to a horizontal state, thereby preventing the wafer and the lower limit member 225 from being damaged by friction or collision, thus preventing contamination or damage to the wafer and extending the service life of the lower limit member.

[0104] Optionally, the support bracket 22 further includes a flip connection portion 222 and a flip drive motor 223. The flip drive motor 223 is mounted on the fixed surface 1, with the motor shaft passing through the fixed surface 1 and then connected to the flip connection portion 222. The other end of the flip connection portion 222 is fixedly connected to the main body 221. The flip drive motor 223 drives the flip connection portion 222 to rotate the main body 221 about the motor shaft. The centerline of the motor shaft of the flip drive motor 223 is the first axis.

[0105] Optionally, the main body 221 is annular in shape and further includes an arcuate member 2212 mounted on the inner side of the main body 221. The support bracket 22 includes two upper limit members 224 and two lower limit members 225. The two upper limit members 224 and the two lower limit members 225 are respectively axially symmetrically distributed about the same axis of symmetry, and the axis of symmetry is perpendicular to the first axis, so that the sliding direction of the wafer during the flipping to horizontal state is consistent with the axis of symmetry. The arcuate member 2212 is arranged axially symmetrically about the axis of symmetry, and the positions of the two ends of the arcuate member 2212 correspond to the two lower limit members 225.

[0106] Optionally, the detection component 3 includes a first detection element 31, which is a photoelectric sensor located on the symmetry axis, preferably a laser ranging sensor that detects a first distance between a detection surface of the first detection element 31 and the wafer surface. Figure 11 yes Figure 8A schematic diagram of the relationship between the distance parameters of the detection when the wafer carrier unit 100 is stuck. As shown in the figure, when the main body 221 is flipped to a horizontal state, the first detection element 31 detects the first distance h2 between the point on the lower surface of the wafer directly above the first detection element 31 and the detection surface. When h2> the predetermined tilt threshold h b When the wafer is stuck, the tilt threshold h b The first detection element 31 is disposed on the arc-shaped member 2212 .

[0107] Optionally, the detection assembly 3 further includes a second detection element 32, which is a photoelectric sensor located on the axis of symmetry, preferably a laser ranging sensor that detects a second distance between the detection surface of the second detection element and the wafer surface. The detection surfaces of the first detection element 31 and the second detection element 32 are preferably at the same height. When the main body 221 is flipped to a horizontal state, the second detection element 32 detects a second distance h1 between a point on the lower surface of the wafer directly above the second detection element 32 and the detection surface. When h1>predetermined in-position threshold h a When the wafer is not in place, it means that the wafer is not in place, thereby reducing the detection and issuing an alarm message when the wafer is not in place. a It is preferably twice the height difference between the intersection of the upper bearing surface 2241 and the upper limit surface 2242 and the detection surface of the laser ranging sensor, that is, h a =2h b .

[0108] Optionally, the tilt angle of the wafer is determined by the distance h2 and the tilt threshold h b Indicated by, or expressed by distance h2 and distance h1.

[0109] Optionally, the adjustment assembly 4 includes two upper adjustment elements 41 and two lower adjustment elements 42, which are arranged symmetrically about the axis of symmetry. The two upper adjustment elements 41 and the two upper limit members 224 are located on the same side of the first axis, preferably between the two upper limit members 224. The two lower adjustment elements 42 and the two lower limit members 225 are located on the same side of the first axis, preferably between the two lower limit members 225.

[0110] like Figure 9As shown, each of the two upper adjustment elements 41 and the two lower adjustment elements 42 includes an adjustment driver 411, an adjustment support rod 412, and an adjustment support element 413. A lifting hole is defined in the main body 221, through which the adjustment support rod 412 passes. When the main body 221 is horizontal, the upper end of the adjustment support rod 412 is connected to the adjustment support element 413, and the lower end is connected to the adjustment driver 411. The adjustment driver 411 drives the adjustment support rod 412 to rise or fall, thereby driving the adjustment support element 413 to rise or fall, thereby supporting the wafer.

[0111] The adjustment support element 413 includes an adjustment support surface 4131 and an adjustment limit surface 4132. The adjustment support surface 4131 is used to support the wafer, and the adjustment limit surface 4132 protrudes upward from the edge of the adjustment support surface 4131 to form a limit for the wafer. Before supporting the wafer, the adjustment actuators 411 of the upper adjustment element 41 and the lower adjustment element 42 drive the adjustment support rod 412 to a lowered (retracted) state. At this time, the adjustment limit surfaces 4132 are at the same height, preferably at the same height as the detection surfaces of the first detection element 31 and the second detection element 32. At the same time, the adjustment limit surface 4132 is lower than the upper bearing surface 2241 and the lower bearing surface 2251 in a direction perpendicular to the upper surface of the support bracket 22. That is, when the main body 221 is in a horizontal state, the adjustment limit surface 4132 is lower than the upper bearing surface 2241 and the lower bearing surface 2251 in the vertical direction. Therefore, there will be no interference with the wafer or the robot during the process of the transfer robot 21 placing the wafer, the main body 221 flipping the wafer, and the front robot 11 grabbing the wafer.

[0112] When leveling the wafer, the first step is to control the adjustment driver 411 of the lower adjustment element 42 according to the distance h2 detected by the first detection element 31, and control the adjustment driver 411 of the upper adjustment element 41 according to the distance h1 detected by the second detection element 32, or according to the tilt threshold h b The adjustment driver 411 of the upper adjustment element 41 is controlled to drive the corresponding adjustment support rod 412 to rise, so that the adjustment limit surface 4132 rises to just support the wafer.

[0113] In the second step, the lower limit member driver 226 is controlled to drive the lower limit member 225 away from the center of the main body 221 so that the edge of the wafer contacts the lower limit surface 2252 .

[0114] In the third step, the adjustment driver 411 of the upper adjustment element 41 is controlled to make the adjustment support surface 4131 of the upper adjustment element 41 and the adjustment support surface 4131 of the lower adjustment element 42 have the same height, so that the wafer is horizontally supported by the adjustment support surface 4131 .

[0115] The fourth step is to control the adjustment driver 411 of the upper adjustment element 41 and the lower adjustment element 42 to synchronously drive the adjustment support rod 412 to descend (retract) to the initial state, that is, to make the adjustment limit surface 4132 lower than the upper bearing surface 2241 and the lower bearing surface 2251 in the vertical direction, so that the wafer maintains a horizontal state when descending, and is horizontally supported by the upper bearing surface 2241 and the lower bearing surface 2251 when the adjustment support surface 4131 descends to below the upper bearing surface 2241 and the lower bearing surface 2251.

[0116] In the fifth step, the lower limit member driver 226 is controlled to drive the lower limit member 225 to approach the center of the main body 221 , so that the edge of the wafer is centered under the action of the lower limit surface 2252 .

[0117] Preferably, the first detection element 31 is positioned at the midpoint of a line connecting the centers of the two lower adjustment elements 42, and the second detection element 32 is positioned at the midpoint of a line connecting the centers of the two upper adjustment elements 41. The center of either the upper adjustment element 41 or the lower adjustment element 42 is the midpoint of the intersection of its adjustment limit surface 4132 and the adjustment support surface 4131. Thus, in the first step, the adjustment support surface 4131 of the lower adjustment element 42 is raised by a first distance h2, and the adjustment support surface 4131 of the upper adjustment element 41 is raised by a second distance h1, precisely supporting the wafer and effectively reducing disturbances to the wafer during support. It is understood that in the third step, the adjustment actuator 411 of the upper adjustment element 41 drives the adjustment support rod 412 to rise by a distance h2-h1; in the fourth step, the adjustment actuators 411 of the upper and lower adjustment elements 41 and 42 simultaneously drive the adjustment support rod 412 to descend by a distance h1.

[0118] Furthermore, the wafer is a 12-inch wafer with a thickness of approximately 0.8 mm. The height of the upper limit surface 2242 is set to 1-2 mm, the height of the lower limit surface 2252 is set to 5-10 mm, and the angle between the lower bearing surface 2251 and the lower limit surface 2252 is set to 95°-105°. At the same time, when the adjustment driver 411 drives the adjustment support rod 412 to rise until the midpoint of the intersection line of the upper bearing surface 2241 and the upper limit surface 2242, the midpoint of the intersection line of the lower bearing surface 2251 and the lower limit surface 2252, and the midpoint of the intersection line of the adjustment limit surface 4132 and the adjustment support surface 4131 are in the same plane, all the midpoints are cocircular, and the circle is consistent with the edge of the wafer in a horizontal state. Furthermore, the central angle formed by the midpoint of the intersection of the adjustment limit surface 4132 and the adjustment support surface 4131 of the upper adjustment element 41 and the midpoint of the intersection of the upper bearing surface 2241 and the upper bearing surface 2242 of the adjacent upper limit member 224 is 3° to 15°, and the central angle formed by the midpoint of the intersection of the adjustment limit surface 4132 and the adjustment support surface 4131 of the lower adjustment element 42 and the midpoint of the intersection of the lower bearing surface 2251 and the lower limit surface 2252 of the adjacent lower limit member 225 is 3° to 15°. Thus, when the adjustment support surfaces 4131 of the upper adjustment element 41 and the lower adjustment element 42 are controlled to form contact support with the wafer based on the height values ​​h2 and h1 detected by the first detection element 31 and the second detection element 32, the disturbance to the wafer is less than 0.1 mm, thereby reducing the wear on the wafer edge and the lower limit surface 2252 to a level acceptable to the process.

[0119] Optional, such as Figure 10 As shown, the lower stopper driver 226 includes a thin cylinder 2261, a push rod 2262, a compression spring 2263, and a spring mounting seat 2264. The thin cylinder 2261 is mounted on the arc-shaped member 2212. One end of the push rod 2262 is connected to the thin cylinder 2261, and the other end is connected to the lower stopper 225. A groove 227 is provided on the upper surface of the main body 221 for mounting and radial movement of the lower stopper 225. A spring mounting seat 2264 is provided on one side of the groove 227 near the outer periphery of the main body 221. One end of the compression spring 2263 is fixed to the spring mounting seat 2264, and the other end is fixed to the lower stopper 225. The axes of the push rod 2262, the groove 227, and the compression spring 2263 coincide.

[0120] After the adjustment component 4 supports the wafer, under the drive of the thin cylinder 2261, the push rod 2262 pushes the lower limit member 225 to compress the compression spring 2263, and the lower limit member 225 moves away from the center of the main body 221, contacts the wafer and leaves avoidance space for leveling the wafer.

[0121] After the adjustment assembly 4 levels the wafer, the thin cylinder 2261 stops driving the ejector rod 2262 , and the lower limiter 225 moves toward the center of the main body 221 under the action of the compression spring 2263 .

[0122] Optionally, a buffer block 2265 is provided on one side of the groove 227 close to the inner circumference of the main body 221, which is used to absorb the impact elastic potential energy when the compression spring 2263 is reset and to limit the lower limit member 225, so that the lower limit member 225 can return the wafer to the center while greatly reducing the disturbance to the wafer.

[0123] The necessity of adjusting component 4 is explained below. Figures 2 to 3 As shown, when the transfer robot 21 vertically places the wafer downward on the main body 221, it first passes through the area of ​​the upper limit member 224. In order to prevent the wafer grasped by the transfer robot 21 from colliding with the upper limit member 224 and causing fragments, the vertical height of the upper limit surface 2242 is set very low, only equivalent to the thickness of the wafer or slightly higher than the thickness of the wafer. The vertical height of the lower limit surface 2252 is set slightly higher to ensure that the wafer is stably placed on the main body 221, while not affecting the front robot 11 to grasp the wafer and rise above the lower limit member 225, thereby transferring the wafer out of the wafer processing module 20. If only the two lower limit members 225 are moved back to contact the wafer to form a falling space for the wafer, the falling process of the wafer will be in a free falling state without position restriction. Therefore, under the combined action of gravity, air resistance, etc., the wafer will deviate in different directions during the falling process, which is particularly likely to cause the wafer to slip out from the side of the upper limit surface 2242, and the front robot 11 will still be unable to grasp the wafer normally.

[0124] The present invention also provides a wafer post-processing device 1000, comprising: a controller 200 and a wafer carrying unit 300, wherein the wafer carrying unit 300 comprises a carrying bracket 22, a detection component 3 and an adjustment component 4. The carrying bracket 22 comprises a flippable main body 221, an upper limit member 224 fixedly mounted on one side surface of the main body 221, and a movably mounted lower limit member 225, wherein the lower limit member 225 can be close to or away from the center of the main body 221, and the upper limit member 224 and the lower limit member 225 are used to limit and carry the wafer during the flipping process of the main body 221. The detection component 3 is used to detect the tilt angle of the wafer. The adjustment component 4 is arranged on the main body 221, and is used to support the wafer upward to adjust the wafer to a horizontal state. The controller 200 is electrically connected to the wafer carrying unit 300, and the controller 200 is configured as follows:

[0125] Control the main body 221 to flip to a horizontal state,

[0126] Control the detection component 3 to detect the tilt angle of the wafer,

[0127] Control and adjust the component 4 to support the wafer according to the tilt angle,

[0128] Control the lower limit member 225 away from the center of the main body 221,

[0129] Control the adjustment component 4 to adjust the wafer to a horizontal state,

[0130] Control the lower limit member 225 to be close to the center of the main body;

[0131] So that the wafer is adjusted to a horizontal state, and the wafer and the lower limit member will not be worn.

[0132] Optionally, the carrying bracket 22 , the detection component 3 and the adjustment component 4 in the wafer carrying unit 300 have the same structure and function as the corresponding components in the wafer carrying unit 100 .

[0133] Optionally, controlling the detection component 3 to detect the tilt angle of the wafer and controlling the adjustment component 4 to support the wafer according to the tilt angle includes:

[0134] controlling the first detection element 31 to detect a first distance from the wafer,

[0135] controlling the second detection element 32 to detect a second distance from the wafer,

[0136] The adjustment driver 411 controls the two lower adjustment elements 42 to drive the adjustment support rod 412 to rise a first distance h2.

[0137] The adjustment driver 411 controlling the two upper adjustment elements 41 drives the adjustment support rod 412 to rise by a second distance h1.

[0138] Optionally, controlling the adjustment component 4 to adjust the wafer to a horizontal state includes:

[0139] The adjustment drivers 411 of the two upper adjustment elements 41 drive the adjustment support rods 412 to rise until the adjustment support surfaces 4131 of the upper adjustment elements are at the same height as the adjustment support surfaces 4131 of the lower adjustment elements 42 ;

[0140] The adjustment drivers 411 controlling the two upper adjustment elements 41 and the adjustment drivers 411 controlling the two lower adjustment elements 42 drive the adjustment support rod 412 to descend until the adjustment limit surface 4132 is vertically lower than the upper bearing surface 2241 and the lower bearing surface 2251 .

[0141] Optional, such as Figure 12As shown, the wafer post-processing device 1000 further includes a wafer vertical processing unit 400 and a transfer robot 21. The wafer vertical processing unit 400 includes but is not limited to a post-processing process chamber for cleaning or drying the wafer in a vertical state. The controller 200 is electrically connected to the wafer vertical processing unit 400 and the transfer robot 21. The controller 200 is configured as follows:

[0142] Controlling the wafer vertical processing unit 400 to perform wafer post-processing process;

[0143] The transfer robot 21 is controlled to grab the vertical wafer from above the wafer vertical processing unit 400 and place it vertically on the carrying bracket 22 .

[0144] The present invention also provides a wafer flipping method using the wafer carrying unit 100, such as Figure 13 As shown, the following steps are included:

[0145] S11. The wafer is placed on the main body 221, and the main body 221 is controlled to flip to a horizontal state;

[0146] S12. Control the second detection element 32 to detect the second distance h1, when h1≤h a When the detection result is that the wafer is in place, the two upper adjustment elements 41 are set between the two upper limit members 224, and the second detection element 32 is set at the midpoint of the line connecting the centers of the two upper adjustment elements 41. a It is preferably twice the height difference between the intersection line of the upper bearing surface 2241 and the upper limit surface 2242 and the detection surface of the laser ranging sensor;

[0147] S13. When the wafer is detected in place, the first detection element 31 is controlled to detect the first distance h2. When h2≤pre- b When the detection result is that the wafer is in a horizontal state, the two lower adjustment elements 42 are set between the two lower limit members 225, and the first detection element 31 is set at the midpoint of the line connecting the centers of the two lower adjustment elements 42. b Preferably, it is the height difference between the boundary line between the lower bearing surface 2251 and the lower limit surface 2252 and the detection surface of the laser ranging sensor.

[0148] S14. When it is detected that the wafer is not in a horizontal state, the adjustment driver 411 of the upper adjustment element 41 and the lower adjustment element 42 is controlled to make the adjustment support surface 4131 of the lower adjustment element 42 rise by a first distance h2, and make the adjustment support surface 4131 of the upper adjustment element 41 rise by a second distance h1, so that the adjustment component 4 forms support for the wafer, effectively reducing the disturbance to the wafer when supporting the wafer.

[0149] S15 . Control the lower limit member driver 226 to drive the lower limit member 225 away from the center of the main body 221 , so that the edge of the wafer contacts the lower limit surface 2252 .

[0150] S16. Control the adjustment driver 411 of the upper adjustment element 41 so that the adjustment support surface 4131 of the upper adjustment element 41 is at the same height as the adjustment support surface 4131 of the lower adjustment element 42, that is, the adjustment support surface 4131 of the upper adjustment element 41 rises by the difference h2-h1 between the second distance and the first distance, so that the wafer is horizontally supported by the adjustment support surface 4131.

[0151] S17. Control the adjustment actuators 411 of the upper and lower adjustment elements 41, 42 to synchronously descend (retract) to their initial positions, i.e., to both descend by a first distance h2. In the initial position, the adjustment limit surface 4132 is vertically lower than the upper and lower support surfaces 2241, 2251, so that the wafer remains horizontal as it descends. When the adjustment support surface 4131 descends below the upper and lower support surfaces 2241, 2251, the wafer is horizontally supported by the upper and lower support surfaces 2241, 2251.

[0152] S18 . Control the lower limit member driver 226 to drive the lower limit member 225 close to the center of the main body 221 , so that the edge of the wafer is centered under the action of the lower limit surface 2252 .

[0153] The present invention also provides a wafer processing device 2000, such as Figure 14 As shown, it includes: a processor 500 and a wafer carrying unit 100, the processor 500 is electrically connected to the wafer carrying unit 100, and the processor 500 controller is used to control the wafer carrying unit 100 to execute the wafer flipping method of the present invention.

[0154] Optionally, the wafer processing equipment 2000 is a chemical mechanical polishing (CMP) device. After being processed in the CMP process chamber and the cleaning process chamber, the wafers enter the vertical drying process chamber. The dried wafers are vertically placed on the carrier bracket 22 of the wafer carrier unit 100. The processor 500 controls the wafer carrier unit 100 to execute the wafer flipping method of the present invention to flip the wafer to a horizontal position. The front robot then grabs the wafer and transfers it to a front-opening wafer pod that holds the polished wafers.

[0155] The above implementation methods are only used to illustrate the embodiments of the present invention, and are not intended to limit the embodiments of the present invention. Ordinary technicians in the relevant technical field may make various changes and modifications without departing from the spirit and scope of the embodiments of the present invention. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of the present invention, and the scope of patent protection of the embodiments of the present invention should be defined by the claims.

Claims

1. A wafer post-processing device, characterized in that: include: A controller and a wafer carrying unit, wherein the wafer carrying unit includes a carrying bracket, a detection component and an adjustment component; The carrying bracket includes a flippable main body, an upper limit member fixedly mounted on a side surface of the main body, and a movably mounted lower limit member, wherein the lower limit member can be moved closer to or farther from the center of the main body, and the upper limit member and the lower limit member are used to limit and carry the wafer during the flipping process of the main body; The detection component is used to detect the tilt angle of the wafer; The adjustment assembly is provided on the main body and is used to support the wafer upwards to adjust the wafer to a horizontal state; The controller is electrically connected to the wafer carrying unit and is configured to: Control the main body to flip to a horizontal state, Controlling the detection component to detect the tilt angle of the wafer, controlling the adjustment component to support the wafer according to the tilt angle, Control the lower limit member to be away from the center of the main body, Controlling the adjustment component to adjust the wafer to a horizontal state, Controlling the lower limit member to be close to the center of the main body; The wafer is adjusted to a horizontal state, and the wafer and the lower limit member are not worn.

2. The wafer post-processing device according to claim 1, wherein: The bearing bracket further comprises a flip drive motor, and the main body flips along a first axis, wherein the first axis is the center line of a motor shaft of the flip drive motor; The upper limit member and the lower limit member are respectively located on both sides of the first shaft.

3. The wafer post-processing device according to claim 2, wherein: The bearing bracket includes two upper limit members and two lower limit members, wherein the upper limit members and the lower limit members are respectively arranged in an axisymmetric distribution about the same symmetry axis, and the symmetry axis is perpendicular to the first axis; The detection component is located on the symmetry axis.

4. The wafer post-processing device according to claim 3, wherein: The adjustment assembly includes two upper adjustment elements and two lower adjustment elements, the two upper adjustment elements and the two lower adjustment elements are respectively arranged in an axisymmetric distribution about the symmetry axis, the upper adjustment elements and the upper limit member are located on the same side of the first axis, and the lower adjustment elements and the lower limit member are located on the same side of the first axis; Each of the upper adjustment element and the lower adjustment element includes an adjustment driver, an adjustment support rod and an adjustment support element. The adjustment support rod connects the adjustment driver and the adjustment support element. The adjustment driver drives the adjustment support rod to rise or fall. The adjustment support element is used to support the wafer.

5. The wafer post-processing device according to claim 4, wherein: The main body is a plate-shaped annular member, and a through-lifting hole is provided on the main body. The adjustment support rod passes through the lifting hole. One end located on one side surface of the main body is connected to the adjustment support element, and the other end is connected to the adjustment driver.

6. The wafer post-processing device according to claim 4, wherein: The detection assembly includes a first detection element and a second detection element, the first detection element is arranged at the midpoint of a line connecting the centers of the two lower adjustment elements, and the second detection element is arranged at the midpoint of a line connecting the centers of the two upper adjustment elements, and the first detection element and the second detection element are located at the same height; The two upper adjustment elements are located between the upper limit members, and the two lower adjustment elements are located between the lower limit members; The controlling the detecting component to detect the tilt angle of the wafer, and controlling the adjusting component to support the wafer according to the tilt angle, comprises: controlling the first detection element to detect a first distance from the wafer, controlling the second detection element to detect a second distance from the wafer, The adjustment driver controlling the two lower adjustment elements drives the adjustment support rod to rise by the first distance, The adjustment driver controlling the two upper adjustment elements drives the adjustment support rod to rise the second distance.

7. The wafer post-processing device according to claim 6, wherein: The adjusting support element includes an adjusting support surface and an adjusting limit surface, the upper limit member includes an upper bearing surface and an upper limit surface, and the lower limit member includes a lower bearing surface, a lower limit surface and a hook portion; When the main body is in a horizontal state, the adjustment limit surface protrudes upward from the edge of the adjustment support surface, the upper limit surface protrudes upward from the edge of the upper bearing surface, the lower limit surface protrudes upward from the edge of the lower bearing surface, and the hook-shaped portion protrudes inward from the edge of the lower limit surface; Before controlling the adjustment component to support the wafer according to the tilt angle, the adjustment limit surface is lower than the upper bearing surface and the lower bearing surface in the vertical direction; The center of the upper adjusting element and the center of the lower adjusting element are the midpoints of the intersection lines of the corresponding adjusting limit surfaces and the adjusting support surfaces; The center of the upper limit member is the midpoint of the intersection line between the corresponding upper bearing surface and the upper limit surface; The center of the lower limit member is the midpoint of the intersection line between the corresponding lower bearing surface and the lower limit surface; The center of the upper regulating element, the center of the lower regulating element, the center of the upper limit member, and the center of the lower limit member are cocircular when they are in the same plane, and the cocircular circle is consistent with the edge of the wafer; The central angle between the center of the adjacent upper adjusting element and the center of the upper limit member is 3° to 15°, and the central angle between the center of the adjacent lower adjusting element and the center of the lower limit member is 3° to 15°.

8. The wafer post-processing device according to claim 7, wherein: The controlling the adjusting component to adjust the wafer to a horizontal state includes: Controlling the adjustment driver of the upper adjustment element to drive the adjustment support rod to rise until the adjustment support surface of the upper adjustment element is at the same height as the adjustment support surface of the lower adjustment element; The adjusting driver of the upper adjusting element and the adjusting driver of the lower adjusting element are controlled to drive the adjusting support rod to descend.

9. The wafer post-processing device according to claim 7, wherein: The height of the upper limit surface is 1-2 mm, the height of the lower limit surface is 5-10 mm, and the angle between the lower bearing surface and the lower limit surface is 95°-105°; The wafer is 12-inch wafer; So that the disturbance to the wafer caused by the adjustment component when supporting the wafer according to the tilt angle is less than 0.1 mm.

10. The wafer post-processing device according to any one of claims 1 to 9, characterized in that: It also includes a wafer vertical processing unit and a transfer robot, and the controller is further configured to: Controlling the wafer vertical processing unit to perform a wafer post-processing process; The transfer robot is controlled to grab the vertical wafer from above the wafer vertical processing unit and place it vertically on the carrying bracket.

11. A wafer carrying unit, characterized in that: include: Carrying bracket, detection assembly and adjustment assembly; The carrying bracket includes a flippable main body, two upper limit members fixedly mounted on one side surface of the main body, and two lower limit members movably mounted, wherein the lower limit members can be moved closer to or farther away from the center of the main body, and the upper limit members and the lower limit members are used to limit and carry the wafer during the flipping process of the main body; The detection assembly includes a first detection element and a second detection element, respectively used to detect a first distance and a second distance between the wafer and the detection surface; The adjustment assembly is disposed on the main body, and includes two upper adjustment elements and two lower adjustment elements that can be raised and lowered relative to a side surface of the main body, and is used to be raised and lowered according to the first distance and the second distance to support the wafer and adjust the wafer to a horizontal state; The two upper adjusting elements are arranged between the two upper limit members, the two lower adjusting elements are arranged between the two lower limit members, the first detection element is arranged at the midpoint of the line connecting the centers of the two lower adjusting elements, and the second detection element is arranged at the midpoint of the line connecting the centers of the two upper adjusting elements.

12. A wafer flipping method, characterized in that: The wafer carrying unit according to claim 11 comprises: Controlling the main body to flip to a horizontal state; controlling the second detecting element to detect the second distance; controlling the first detecting element to detect the first distance; controlling the upper adjustment element and the lower adjustment element to rise according to the second distance and the first distance respectively to support the wafer; controlling the lower limit member to move away from the center of the main body; controlling the upper adjustment element to rise according to the second distance and the first distance to horizontally support the wafer; controlling the upper adjusting element and the lower adjusting element to descend according to the first distance; The lower limit member is controlled to be close to the center of the main body.

13. A wafer processing device, characterized in that: include: A processor and the wafer carrying unit as claimed in claim 10, wherein the processor is electrically connected to the wafer carrying unit and is used to control the wafer carrying unit to execute the wafer flipping method as claimed in claim 11.

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