Wafer detector, preparation method thereof and wafer detection circuit

By using a wafer detector with multiple pairs of electrodes and a fibrous structure arranged on the substrate in MicroLED wafer inspection, efficient parallel inspection without repeated pressing and lifting is achieved, solving the problems of long measurement time and low efficiency in existing technologies, and reducing probe and circuit costs.

CN120993162AActive Publication Date: 2025-11-21TIANJIN WANROU TECHNOLOGY CO LTD
7 Cites 3 Cited by

Patent Information

Application Number
CN202511516195.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-10-23
Publication Date
2025-11-21
Estimated Expiration
2045-10-23

AI Technical Summary

Technical Problem

Existing technologies for MicroLED wafer inspection require repeated pressing and lifting of the probe for contact, which increases measurement time and complexity. Furthermore, the point-by-point scanning method is inefficient, the probe manufacturing cost is high, and it is difficult to achieve high-throughput measurement.

Method used

A wafer detector employs multiple pairs of electrodes and a fibrous structure arranged on a substrate. The fibrous structure maintains electrical contact with the MicroLED electrodes through deformation, enabling parallel measurement. Horizontal movement completes the detection of the entire row.

Benefits of technology

It reduces the number of alignment steps, improves detection efficiency and throughput, lowers probe manufacturing costs and drive circuit complexity, and simplifies control logic.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention provides a wafer detector, a preparation method thereof and a wafer detection circuit, which can be applied to the technical field of wafer detection. The wafer detector comprises a substrate; the plurality of pairs of electrodes are arranged on the substrate along a first direction; wires respectively led out from each of the plurality of pairs of electrodes on the substrate; a cilia structure is arranged on each electrode in the plurality of pairs of electrodes, a conductive layer electrically connected with the corresponding electrode is arranged on the surface of the cilia structure, and when the cilia structure sweeps the electrode to be detected in the MicroLED wafer from the side direction of the electrode to be detected in the second direction, the conductive layer is electrically connected with the electrode to be detected. The cilia structure has rigidity, so that the cilia structure is in electric contact with the to-be-detected electrode through deformation. When the wafer detector is used for detecting the to-be-detected MicroLED wafer, the wafer detector does not need to be pressed down and lifted up repeatedly, and the to-be-detected MicroLED wafer can be measured at a high speed through horizontal movement only by aligning at an initial position once.
Need to check novelty before this filing date? Find Prior Art