Printing ceramic substrate of infrared detector and manufacturing method

Abstract

The invention relates to the technical field of infrared detectors, in particular to a printing ceramic substrate of an infrared detector and a manufacturing method, the printing ceramic substrate comprises a substrate main body, and the lower surface of the substrate main body is connected with a cold table; a plurality of extension parts corresponding to the leads are arranged around the substrate main body; a chip lead is formed on the extension part; the chip lead is connected with the lead ring; and the substrate main body and the extension part are integrally formed through 3D printing. In order to solve the problem that the refrigeration efficiency cannot be further improved due to the fact that the size of a cold head accessory in the prior art is too large, the integrally-formed printing ceramic substrate is introduced in the scheme, the substrate and an extending part used as a lead frame are integrally formed through ceramic printing, the additional mass introduced by a traditional assembling and welding structure can be reduced, and the manufacturing cost is reduced. And meanwhile, by designing the extension part in a specific shape, the size of the base plate is reduced in a disguised manner, and the refrigeration effect can be achieved more quickly.

Description

Technical Field

[0001] The present invention relates to the technical field of infrared detectors, and in particular to a printed ceramic substrate of an infrared detector and a manufacturing method thereof. Background Art

[0002] An infrared detector is a sensor used to detect infrared radiation and is widely used in night vision, thermal imaging, industrial inspection, and other fields. Its structure includes a detector chip, a dewar, a cold head, circuitry, and packaging. Typically, to achieve a good signal-to-noise ratio, the detector chip needs to be cooled by refrigeration to reduce the device's own thermal noise, thereby facilitating the separation of tiny thermal radiation signals from background signals. To achieve this cooling process, the detector chip and related peripheral circuitry are typically placed in a dewar flask, which effectively isolates heat transfer. The cold head then contacts the detector chip's substrate to continuously cool it.

[0003] For example, Chinese patent CN202111273111.6 provides a Dewar assembly and infrared detector, wherein the Dewar assembly includes a Dewar housing, a tubular getter unit, an annular fixing unit, and a lead ring unit; the lead ring unit includes a lead ring body and a lead ring housing, the lead ring body is arranged on the lead ring housing, and the lead ring housing is fixedly connected to the Dewar housing; the annular fixing unit includes an annular body and a first protrusion arranged on the annular body, and the first protrusion is used to extend into the tubular getter unit to form an interference fit and fix the annular body to the lead ring housing. The annular fixing unit is used to form an interference fit with the tubular getter unit to fix it to the lead ring housing. The structure is simple and practical, and the assembly is convenient. At the same time, it also reduces the risk of opening holes in the Dewar housing, multiple welding, and scratching the inner wall of the housing to reduce the risk of leakage and degassing of the Dewar housing, thereby improving the vacuum reliability of the Dewar assembly.

[0004] For another example, Chinese patent CN201911081065.2 proposes a method for assembling a Dewar assembly, an infrared detector, and a Dewar assembly, including: a cold screen, a frame, and a fixture, wherein the cold screen has a first connection part, the frame has a second connection part, the first connection part is bonded to the second connection part, and the fixture has a first mating part and a second mating part, the first mating part is located on the side of the first connection part away from the second connection part, and the second mating part is located on the side of the second connection part away from the first connection part. The ability of the cold screen to resist vibration and impact loads can be enhanced, and the problem of the cold screen falling off after the current detector assembly undergoes high-level vibration and impact tests can be solved, thereby ensuring the reliability of the cold screen. Moreover, the fixture has the advantages of light weight, small size, and low thermal conductivity, and basically does not increase the mass and refrigeration load of the Dewar assembly.

[0005] However, during actual implementation, the inventors discovered that the detector startup speed is directly related to the cooling rate of the cold head. To accelerate the cooling of the cold head to the liquid nitrogen temperature range, the thickness and size of the cold head components have been continuously reduced to reduce thermal mass. Currently, the substrate thickness has dropped below 0.5mm. Reducing the cold head mass and thermal mass by reducing the substrate thickness is difficult to achieve, which makes it difficult to further improve the cooling efficiency of infrared detectors. Summary of the Invention

[0006] In view of the above problems existing in the prior art, a printed ceramic substrate for an infrared detector is provided;

[0007] On the other hand, a method for manufacturing the printed ceramic substrate is also provided.

[0008] The specific technical solutions are as follows:

[0009] A printed ceramic substrate for an infrared detector, comprising a substrate body;

[0010] The lower surface of the substrate body is connected to the cold stage;

[0011] A plurality of extension portions corresponding to the leads are provided around the substrate body;

[0012] The extended portion is used to form chip leads;

[0013] The chip leads are connected to lead rings;

[0014] The substrate body and the extension portion are integrally formed by 3D printing.

[0015] On the other hand, the extension portion includes a long plate-shaped lateral extension portion of the substrate;

[0016] The lateral extension portion of the substrate extends radially and horizontally from the side surface of the substrate body to a predetermined length;

[0017] The chip leads are formed on the upper surface of the laterally extending portion of the substrate;

[0018] After the chip leads reach the upper surface of the laterally extending portion of the substrate, they are connected to the lead rings by bonding.

[0019] On the other hand, the substrate body is square, matching the size of the detector chip; or, the substrate body is circular, larger than the detector chip.

[0020] On the other hand, the extension portion includes an oblique support structure in the shape of a long plate;

[0021] The oblique support structure extends radially from the side surface of the substrate body;

[0022] The first end of the oblique support structure is connected to the base plate body;

[0023] The second end of the oblique support structure is connected to the lead ring obliquely downward and fixed;

[0024] The chip leads are formed on the upper surface of the oblique supporting structure.

[0025] On the other hand, the extension portions are provided on opposite sides of the substrate body;

[0026] Support rods are respectively formed on the other two sides of the base plate body;

[0027] The support rod is obliquely downward from the substrate body to the lead ring and is connected and fixed;

[0028] The chip leads are not provided on the support rods.

[0029] On the other hand, the extension portion is a ceramic spiral support structure;

[0030] The first end of the ceramic spiral support structure is overlapped with the edge of the substrate body;

[0031] The second end of the ceramic spiral support structure is connected to the lead ring;

[0032] The main body of the ceramic spiral support structure is spiral-shaped;

[0033] The chip leads are etched along the spiral direction on the outer edge of the ceramic spiral support structure.

[0034] On the other hand, a plurality of micro dampers are provided on the ceramic spiral support structure;

[0035] The micro damper is arranged along the long axis direction of the ceramic spiral support structure;

[0036] The two ends of the micro damper are respectively connected to two adjacent arc segments of the ceramic spiral support structure;

[0037] The micro damper includes a connecting rod and a damping dissipation member;

[0038] The link rods are respectively arranged at both ends of the micro damper and connected to the ceramic spiral support structure;

[0039] The damping and dissipating member is made of porous elastic material;

[0040] The damping and dissipating member is arranged between the link rods and absorbs vibration of the ceramic spiral support structure.

[0041] On the other hand, the chip leads enter the substrate body from the extension portion and are bonded above the substrate body;

[0042] Alternatively, bonding is performed with the internal circuit of the substrate body.

[0043] A manufacturing method for manufacturing the above-mentioned printed ceramic substrate comprises:

[0044] Step S1: 3D printing is started from a substrate body to form the substrate body;

[0045] Step S2: printing an inverted extension portion on the substrate body and stretching it;

[0046] Step S3: forming chip leads on the extended portion.

[0047] On the other hand, when the extended portion is a ceramic spiral support structure, a micro damper is further added between the ceramic spiral support structures in step S2.

[0048] The above technical solution has the following advantages or beneficial effects:

[0049] In order to solve the problem in the existing technology that the cooling efficiency cannot be further improved due to the excessive size of the cold head accessories, this solution introduces an one-piece printed ceramic substrate. The substrate and the extended part used as the lead frame are one-piece ceramic printed, which can reduce the extra mass introduced by the traditional assembly and welding structure. At the same time, by designing the extension part with a specific shape, the substrate size is reduced in disguise, and the cooling effect can be achieved faster. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] The embodiments of the present invention will be described more fully with reference to the accompanying drawings, which are provided for illustration and description only and are not intended to limit the scope of the present invention.

[0051] Figure 1 This is an overall schematic diagram of Embodiment 1 of the present invention;

[0052] Figure 2 is a side view of a cold stage in an embodiment of the present invention;

[0053] Figure 3 This is an overall schematic diagram of the second embodiment of the present invention;

[0054] Figure 4 Schematic diagram of a small circular substrate in an embodiment of the present invention;

[0055] Figure 5 Schematic diagram of a square extended substrate in an embodiment of the present invention;

[0056] Figure 6This is an overall schematic diagram of Embodiment 3 of the present invention;

[0057] Figure 7 Schematic diagram of a spiral support structure in an embodiment of the present invention;

[0058] Figure 8 Schematic diagram of the spiral support structure and external leads in an embodiment of the present invention;

[0059] Figure 9 Schematic diagram of a damper in an embodiment of the present invention;

[0060] Figure 10 Schematic diagram of the preparation method in an embodiment of the present invention. DETAILED DESCRIPTION

[0061] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0062] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0063] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but they are not intended to limit the present invention.

[0064] The present invention comprises:

[0065] A printed ceramic substrate for an infrared detector, such as Figure 1-3 As shown, it includes a substrate body 1;

[0066] The lower surface of the substrate body 1 is connected to the cold stage 2;

[0067] A plurality of extension portions 3 corresponding to the leads are provided around the substrate body 1;

[0068] The extended portion 3 is used to form a chip lead 4;

[0069] Chip leads are connected to lead rings 5;

[0070] The substrate body 1 and the extension portion 3 are integrally formed by 3D printing.

[0071] Specifically, in order to address the problem in the prior art that the cooling efficiency cannot be further improved due to the excessive size of the cold head accessories, in this embodiment, the shape of the substrate is first changed. Normally, the packaging structure of the infrared detector chip is set on the substrate body 1, and is soldered to the substrate body 1 through the pins at the bottom, and output is carried out in conjunction with the relevant peripheral circuits. During the output process, each pin needs to be led out to the edge of the substrate by routing to form a pad, and then led out to the lead ring by bonding. The back of the substrate body 1 is directly soldered to the cold stage 2, and cooling is performed through the cold stage 2.

[0072] After analyzing the above structure, it is easy to find that since the pins need to be led out to the outside through the printed circuit on the substrate, a larger substrate needs to be made when making the lead-out circuit to reserve routing space, which will cause the heat capacity of the substrate to increase significantly, and the heat that the cold head needs to carry also increases accordingly.

[0073] By providing an extension portion 3 corresponding to the lead wire, the circuit corresponding to the lead wire can be turned into a sheet-shaped lead-out portion, thereby reducing the total area of the substrate in disguise and improving the cooling efficiency.

[0074] Accordingly, in order to achieve higher strength of the substrate body 1 and the extended portion 3, in this embodiment, a ceramic 3D printing metal process is also used to make the above two parts integrally formed. Based on this process, the overall strength of the structure can be increased, which makes it easier to reduce the cross-sectional area to further reduce the heat capacity of the substrate part and improve the cooling efficiency.

[0075] In the actual manufacturing process, for the horizontal part, a metal sintering process is mainly used to directly form the substrate body 1 and the extension portion 3 with a specific shape, and then the finished product is formed by stacking.

[0076] At the same time, during the 3D printing process, the circuit is formed by gold plating on the internal circuit part of the substrate body 1, and then insulation treatment is performed at the predetermined position above and further printing is performed to increase the thickness to form a complete substrate body 1 and extended part 3.

[0077] Generally speaking, in order to achieve a simpler process flow, the chip leads can be set on the upper surface of the extension part 3. After the substrate main body 1 and the extension part 3 are printed, the chip leads are formed by gold plating above the extension part 3. The chip leads can be connected to circuits at other heights through vias or the like.

[0078] In one embodiment, the extension portion 3 includes a long plate-shaped substrate lateral extension portion 31;

[0079] The substrate lateral extension portion 31 extends radially horizontally from the side of the substrate body to a predetermined length;

[0080] The chip leads 4 are formed on the upper surface of the laterally extending portion 31 of the substrate;

[0081] After the chip lead 4 reaches the upper surface of the laterally extending portion 31 of the substrate, it is connected to the lead ring 5 by bonding.

[0082] Specifically, in order to address the problem in the prior art that the cooling efficiency cannot be further improved due to the excessive size of the cold head accessory, in this embodiment, the extension portion 3 is set to a structure that extends radially horizontally from the side of the substrate body, and the structure will be set on at least one side of the substrate body 1 as needed.

[0083] At the same time, in order to facilitate the subsequent bonding process, the extension part 3 located on the side near the end point will be set at a certain angle, so that a certain distance is left between the distal end points of two adjacent extension parts 3, which is convenient for the subsequent bonding process.

[0084] Since there is no substrate between the extended portions 3 , the blank area on the substrate body 1 is reduced, thereby reducing the overall heat capacity of the substrate body 1 and facilitating improved cooling efficiency.

[0085] Among them, the chip lead 4 is formed on the upper surface of the laterally extended part 31 of the substrate, which can be realized by a process such as gold plating. After being led out from the internal circuit of the detector chip or the substrate body 1, it is gold-plated along the upper surface of the laterally extended part to form a lead. When it reaches the far end point, it is welded to the bonding wire as a pad, and the other end of the bonding wire is overlapped at the corresponding position on the lead ring to realize signal transmission.

[0086] In one embodiment, Figure 4 、 5 As shown, the substrate body 1 is square, matching the size of the detector chip;

[0087] Alternatively, the substrate body 1 is circular and larger than the detector chip.

[0088] Specifically, in order to effectively reduce the thermal mass, this embodiment mainly provides two small substrate configurations.

[0089] In one embodiment, the substrate body 1 is square, matching the dimensions of the detector chip. In this embodiment, the substrate body 1 and the detector chip overlap in the projection direction. Internal circuitry leads the detector chip pins to the extension portion 3 for bonding. This design reduces both mass and thermal mass by 66.2%.

[0090] Alternatively, the substrate body 1 is circular, with a diameter slightly larger than the diagonal length of the detector chip. This circular shape provides additional space relative to the rectangular detector chip, allowing for the formation of specific peripheral circuitry that is ultimately connected to the extension portion 3 for bonding. This design reduces both mass and thermal mass by 56.6%.

[0091] In one embodiment, the extension portions 3 are provided on opposite sides of the substrate body;

[0092] Support rods 6 are formed on the other two sides of the substrate body 1;

[0093] The support rod 6 is obliquely downward from the substrate body 1 and is connected and fixed to the lead ring 5;

[0094] No chip leads are provided on the support rod 6 .

[0095] Specifically, considering the stability of substrate welding and reducing the shaking of the substrate body 1 above the cold stage 2, in this embodiment, the extension parts 3 are set on two opposite sides of the substrate body, and support rods 6 are formed on the other two sides of the substrate body 1.

[0096] The support rods 6 play a supporting role and are used to connect the substrate body 1 and the lead ring structure respectively to provide additional stability.

[0097] The support rod 6 includes a certain lateral extension portion when viewed from the side, then turns obliquely downward at a specific angle, is lowered to the height of the lead ring 5, and is laterally connected to the lead ring 5 for fixed connection.

[0098] When two support rods 6 are provided on one side, the two support rods 6 are provided at a certain angle in the top view direction to improve stability.

[0099] In one embodiment, Figure 6 As shown, the extension portion 3 includes a long plate-shaped oblique support structure 7;

[0100] The oblique support structure 7 extends radially from the side of the substrate body 1;

[0101] The first end of the oblique support structure 7 is connected to the substrate body 1;

[0102] The second end of the oblique support structure 7 is connected to the lead ring obliquely downward and fixed;

[0103] The chip leads are formed on the upper surface or inside of the oblique support structure 7 .

[0104] Specifically, in order to achieve lightweight substrate accessories, in this embodiment, the extension portion 3 is constructed into an inclined support structure 7 with a supporting function. The inclined support structure 7 is usually arranged radially, extending from the side of the substrate body 1, and then pointing to the lead ring 5 obliquely downward at a specific angle and connected and fixed.

[0105] Since the oblique support structure 7 is radially arranged around the side of the substrate body 1 and is obliquely overlapped and fixed on the lead ring 5, it can provide effective constraints on the substrate body 1 in multiple directions and improve structural stability.

[0106] At the same time, the chip leads are formed on the upper surface of the oblique support structure 7 by gold plating, and are led out along the path of substrate body 1 - oblique support structure 7 - lead ring.

[0107] During the manufacturing process, the above-mentioned oblique support structure 7 is also formed at one time through 3D printing together with the substrate main body 1. In order to achieve higher printing accuracy, the substrate can be printed upside down. The substrate and the part where the oblique support structure 7 is connected to the substrate main body 1 are printed first, and then the oblique support structure 7 is gradually stacked and stretched above the part where the oblique support structure 7 is connected to the substrate main body 1 to form a complete oblique support structure 7.

[0108] In addition, it is also necessary to form chip leads 4 on the oblique support structure 7, which mainly includes the following three forming methods.

[0109] A process for forming an external chip lead 4 is to first print a complete oblique support structure 7, then completely gold-plate the surface of the oblique support structure 7, and then remove the excess gold plating by laser etching, leaving only the part corresponding to the chip lead 4.

[0110] Another process for forming an external chip lead 4 is to first print a complete inclined support structure 7, and then print molten gold on the surface of the inclined support structure 7, so that the gold is infiltrated and fixed on the surface of the inclined support structure 7 to form a chip lead 4. This method has a faster molding speed.

[0111] A process for forming a built-in chip lead 4 is to first form a circuit structure by printing a gold wire portion, and then bury the gold wire when printing the oblique support structure 7 to form the chip lead 4.

[0112] It should be noted that the horizontal extension portion 3 is usually connected by direct bonding, while the chip leads 4 extending along the oblique support structure 7 need to be fixed to the lead ring by welding.

[0113] To achieve firm welding, the chip leads 4 can be aligned in advance, and then the substrate body 1 can be glued to the cold platform 2 with glue, and then welded by laser welding or laser brazing, including placing a gold ball or brazing solder between the ceramic lead ring and the support rod, and using a laser to melt the metal ball or solder into a liquid metal ball. After cooling, the substrate circuit can be connected to the lead ring circuit.

[0114] Alternatively, the chip leads 4 may be aligned in advance, and then the substrate body 1 may be glued to the cold stage 2, and the brazing material may be placed between the ceramic lead ring and the support rod, and vacuum high-temperature brazing may be performed in a vacuum brazing furnace.

[0115] In one embodiment, Figure 7 、 8 As shown, the extended portion 3 is a ceramic spiral support structure 8;

[0116] The first end of the ceramic spiral support structure 8 is overlapped with the edge of the substrate body 1;

[0117] The second end of the ceramic spiral support structure 8 is connected to the lead ring 5;

[0118] The main part of the ceramic spiral support structure 8 is spiral-shaped;

[0119] The outer edge of the ceramic spiral support structure 8 is etched with chip leads along the spiral direction;

[0120] Alternatively, the chip leads are formed inside the ceramic spiral support structure 8 .

[0121] Specifically, in order to achieve lightweight substrate accessories, in this embodiment, the extension part 3 is constructed into a ceramic spiral support structure 8 with a supporting function. The ceramic spiral support structure 8 is usually arranged radially, extending from the side of the substrate body 1, and then pointing to the lead ring 5 obliquely downward at a specific angle and connected and fixed.

[0122] Among them, the main part of the ceramic spiral support structure 8 is a single-strand spiral structure formed according to a specific pitch. It has a smaller cross-sectional area than the traditional support rod, and achieves similar structural strength through the spiral structure, thereby further reducing the overall thermal mass.

[0123] Since the ceramic spiral support structure 8 is radially arranged around the side of the substrate body 1 and is obliquely overlapped and fixed on the lead ring 5, it can provide effective constraints on the substrate body 1 in multiple directions and improve structural stability.

[0124] At the same time, the outer edge of the ceramic spiral support structure 8 is gold-plated along the spiral direction to form a chip lead, which is led out along the path of substrate body 1 - ceramic spiral support structure 8 - lead ring.

[0125] During the manufacturing process, the above-mentioned ceramic spiral support structure 8 is also formed at one time through 3D printing with the substrate main body 1. In order to achieve higher printing accuracy, the substrate can be printed inverted. First, the substrate and the part where the ceramic spiral support structure 8 is connected to the substrate main body 1 are printed, and then the part where the ceramic spiral support structure 8 is connected to the substrate main body 1 is gradually stacked and stretched to form a complete ceramic spiral support structure 8.

[0126] In addition, it is also necessary to form chip leads 4 on the ceramic spiral support structure 8, which mainly includes the following three forming methods.

[0127] A process for forming an external chip lead 4 is to first print a complete ceramic spiral support structure 8, then completely gold-plate the surface of the ceramic spiral support structure 8, and then remove the excess gold plating by laser etching, leaving only the part corresponding to the chip lead 4.

[0128] Another process for forming an external chip lead 4 is to first print a complete ceramic spiral support structure 8, and then print molten gold on the surface of the ceramic spiral support structure 8, so that the gold is infiltrated and fixed on the surface of the ceramic spiral support structure 8 to form a chip lead 4. This method has a faster molding speed.

[0129] A process for forming a built-in chip lead 4 is to first form a circuit structure by printing a gold wire portion, and then bury the gold wire when printing a ceramic spiral support structure 8 to form the chip lead 4.

[0130] It should be noted that the extension portion 3 in the horizontal direction is usually connected by direct bonding, while the chip lead 4 extending along the ceramic spiral support structure 8 needs to be fixed to the lead ring by welding.

[0131] To achieve firm welding, the chip leads 4 can be aligned in advance, and then the substrate body 1 can be glued to the cold platform 2 with glue, and then welded by laser welding or laser brazing, including placing a gold ball or brazing solder between the ceramic lead ring and the support rod, and using a laser to melt the metal ball or solder into a liquid metal ball. After cooling, the substrate circuit can be connected to the lead ring circuit.

[0132] Alternatively, the chip leads 4 may be aligned in advance, and then the substrate body 1 may be glued to the cold stage 2, and the brazing material may be placed between the ceramic lead ring and the support rod, and vacuum high-temperature brazing may be performed in a vacuum brazing furnace.

[0133] It should be noted that since the above process is reinforced by welding, there is no need to additionally glue the support rods to reinforce them. This can effectively reduce the amount of glue. For example, if there are 40 original bonding silk glue joints, then 8 support rod glue joints do not need to be glued, reducing the amount of glue used inside the Dewar by nearly 1 / 3, thereby extending the vacuum life inside the Dewar.

[0134] In one embodiment, Figure 9 As shown, a plurality of micro dampers 9 are provided on the ceramic spiral support structure 8;

[0135] The two ends of the micro damper 9 are respectively connected to two adjacent arc segments of the ceramic spiral support structure 8;

[0136] The micro damper 9 includes a link rod 91 and a damping dissipation member 92;

[0137] The link rods 91 are respectively provided at both ends of the micro damper 9 and connected to the ceramic spiral support structure 8;

[0138] The damping and dissipating member 92 is a porous elastic material;

[0139] The damping dissipation member 92 is disposed between the link rods 91 and absorbs vibration of the ceramic spiral support structure 8 .

[0140] Specifically, considering that after the support structure is set as a ceramic spiral structure, the total mass is reduced and additional oscillations are easily introduced, in this embodiment, a plurality of micro dampers 9 are also provided on the ceramic spiral support structure 8 to absorb vibrations.

[0141] The ceramic spiral support structure 8 is a single-strand spiral structure formed with a specific pitch. Its centerline direction is the major axis direction, and the pitches are distributed circumferentially. In this case, to suppress structural vibration, a micro damper 9 can be set between two adjacent arc segments. The micro damper 9 includes a connecting rod 91 and a damping dissipation member 92. The connecting rod 91 is used to fix the micro damper 9 on the ceramic spiral support structure 8. The damping dissipation member 92 is a porous elastic material. When it receives vibration, it will undergo elastic deformation, thereby converting the vibration into internal energy in the material for dissipation.

[0142] Specifically, the connecting rod 91 is usually made of rubber or other equivalent materials, and the damping dissipation member 92 is made of the same or different elastic materials.

[0143] When the connecting rod 91 and the damping dissipation member 92 are made of the same material, such as rubber, they can be integrally formed using a mold.

[0144] When the connecting rod 91 and the damping dissipation member 92 are made of different materials, such as a rubber connecting rod and an aerogel damping dissipation member, they are usually assembled by gluing.

[0145] The damping dissipation member 92 is made of elastic material, and holes can be formed on its surface by chemical corrosion. The holes are used to provide a certain collapse space for the damping dissipation member 92. The density, size and thickness of the holes should be determined according to the resonant frequency and amplitude of the equipment.

[0146] In some embodiments, materials with pores, such as aerogel, may also be used.

[0147] The damping coefficient can be controlled by changing the material, gap size, quantity and distribution of the damper itself.

[0148] In one embodiment, the chip lead 4 enters the substrate body 1 from the extension portion 3 and is bonded above the substrate body 1;

[0149] Alternatively, bonding is performed with the internal circuit of the substrate body 1 .

[0150] Specifically, in order to achieve compatibility with different types of detector chips, in this embodiment, an internal connection type circuit and an external connection type circuit are designed.

[0151] For externally connected circuits, the chip leads 4 are bonded to the substrate body 1 after entering the substrate body 1 from the extension portion 3. The chip leads 4 and the peripheral circuits on the substrate body 1 are formed in the following ways:

[0152] A process for forming an external substrate circuit and leads is to first print a complete substrate body 1, then completely gold-plate the surface of the substrate body 1, and then remove the excess gold plating by laser etching, leaving only the part corresponding to the substrate circuit and leads.

[0153] Another process for forming external substrate circuits and leads is to first print a complete substrate body 1, and then print molten gold on the surface of the substrate body 1, so that the gold is infiltrated and fixed on the surface of the substrate body 1 to form substrate circuits and leads. This method has a faster molding speed.

[0154] The process for forming the internally connected substrate circuitry and leads involves printing gold wires to form the chip's internal circuit structure, while also reserving extended gold wire sections for the extended portions. During the printing of the substrate body 1, the internal circuitry is embedded, and the extended gold wire sections are placed at the junction of the substrate body 1 and the extended portion 3. After printing the substrate body 1, the extended portion 3 is stacked and raised, and the extended gold wire sections are embedded to complete the internal circuitry.

[0155] A method for producing the above-mentioned printed ceramic substrate, such as Figure 10As shown, including:

[0156] Step S1: 3D printing is started from the substrate body to form the substrate body;

[0157] Step S2: printing an inverted extension portion on the substrate body and stretching it;

[0158] Step S3: forming chip leads on the extended portion.

[0159] In one embodiment, when the extended portion is a ceramic spiral support structure, a micro damper is further added between the ceramic spiral support structures in step S2.

[0160] The above are only preferred embodiments of the present invention and do not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A printed ceramic substrate for an infrared detector, characterized in that: including a substrate body; The lower surface of the substrate body is connected to the cold stage; A plurality of extension portions corresponding to the leads are provided around the substrate body; The extended portion is used to form chip leads; The chip leads are connected to lead rings; The substrate body and the extension portion are integrally formed by 3D printing.

2. The printed ceramic substrate according to claim 1, characterized in that The extension portion includes a long plate-shaped lateral extension portion of the substrate; The lateral extension portion of the substrate extends radially and horizontally from the side surface of the substrate body to a predetermined length; The chip leads are formed on the upper surface of the laterally extending portion of the substrate; After the chip leads reach the upper surface of the laterally extending portion of the substrate, they are connected to the lead rings by bonding.

3. The printed ceramic substrate according to claim 2, characterized in that: The substrate body is square and matches the size of the detector chip; Alternatively, the substrate body is circular and larger than the detector chip.

4. The printed ceramic substrate according to claim 1, characterized in that The extension portion includes a long plate-shaped oblique support structure; The oblique support structure extends radially from the side surface of the substrate body; The first end of the oblique support structure is connected to the base plate body; The second end of the oblique support structure is connected to the lead ring obliquely downward and fixed; The chip leads are formed on the upper surface or inside of the oblique supporting structure.

5. The printed ceramic substrate according to any one of claim 2, characterized in that: The extension portions are arranged on two opposite sides of the substrate body; Support rods are respectively formed on the other two sides of the base plate body; The support rod is obliquely downward from the substrate body to the lead ring and is connected and fixed; The chip leads are not provided on the support rods.

6. The printed ceramic substrate according to claim 1, characterized in that The extended portion is a ceramic spiral support structure; The first end of the ceramic spiral support structure is overlapped with the edge of the substrate body; The second end of the ceramic spiral support structure is connected to the lead ring; The main body of the ceramic spiral support structure is spiral-shaped; The chip leads are etched along a spiral direction on the outer edge of the ceramic spiral support structure, or the chip leads are formed inside the ceramic spiral support structure.

7. The printed ceramic substrate according to claim 6, characterized in that: A plurality of micro dampers are provided on the ceramic spiral support structure; The two ends of the micro damper are respectively connected to two adjacent arc segments of the ceramic spiral support structure; The micro damper includes a connecting rod and a damping dissipation member; The link rods are respectively arranged at both ends of the micro damper and connected to the ceramic spiral support structure; The damping and dissipating member is made of porous elastic material; The damping and dissipating member is arranged between the link rods and absorbs vibration of the ceramic spiral support structure.

8. The printed ceramic substrate according to claim 1, characterized in that: After the chip lead enters the substrate body from the extension portion, it is bonded above the substrate body; Alternatively, bonding is performed with the internal circuit of the substrate body.

9. A production method, characterized in that: Used to manufacture the printed ceramic substrate according to any one of claims 1 to 8, comprising: Step S1: 3D printing is started from a substrate body to form the substrate body; Step S2: printing an inverted extension portion on the substrate body and stretching it; Step S3: forming chip leads on the extended portion.

10. The manufacturing method according to claim 9, characterized in that: When the extended portion is a ceramic spiral support structure, a micro damper is further added between the ceramic spiral support structures in step S2.

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