Multilayer substrate and wiring substrate

Abstract

The laminated body has a structure in which a plurality of insulator layers are laminated along the Z-axis. The first radiation conductor layer receives or radiates a first high-frequency signal and receives or radiates a second high-frequency signal. The vibration direction of the electromagnetic field caused by the second high-frequency signal propagating in the air is different from the vibration direction of the electromagnetic field caused by the first high-frequency signal propagating in the air. The second radiation conductor layer is positioned nearer to the negative side of the Z axis than the first radiation conductor layer, and overlaps the first radiation conductor layer when viewed in the negative direction of the Z axis. The first signal path and the second signal path are connected to the first radiation conductor layer. The first high-frequency signal is transmitted through the first signal path. The second high-frequency signal is transmitted through a second signal path. The first connection conductor is connected to the first signal path and the second signal path, and is positioned further toward the negative side of the Z axis than the second radiation conductor layer.

Description

Technical Field

[0001] The present invention relates to a multilayer substrate including a plurality of radiating conductor layers. Background Art

[0002] As a conventional invention related to a multilayer substrate, there is known a multilayer patch antenna described in Patent Document 1. This multilayer patch antenna includes a parasitic patch radiator that radiates high-frequency signals of two orthogonal polarized waves.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application No. 2022-502909 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] However, in the multilayer patch antenna described in Patent Document 1, there is a demand for improving the isolation between high-frequency signals of two orthogonal polarized waves.

[0008] Therefore, an object of the present invention is to improve the isolation between a first high-frequency signal and a second high-frequency signal.

[0009] Technical solutions to solve problems

[0010] In the multilayer substrate according to one embodiment of the present invention,

[0011] The multilayer substrate includes a laminate, a first radiation conductor layer, a second radiation conductor layer, a first signal path, a second signal path, and a first connection conductor.

[0012] The laminate has a structure in which a plurality of insulating layers are laminated along the Z axis.

[0013] The first radiation conductor layer is provided in the laminate and receives or radiates a first high-frequency signal and receives or radiates a second high-frequency signal.

[0014] The vibration direction of the electromagnetic field caused by the second high-frequency signal propagating in the air is different from the vibration direction of the electromagnetic field caused by the first high-frequency signal propagating in the air.

[0015] The second radiating conductor layer is provided in the laminate and is located on the negative side of the Z axis relative to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative direction of the Z axis.

[0016] The first signal path and the second signal path are connected to the first radiation conductor layer.

[0017] The first high-frequency signal is transmitted in the first signal path,

[0018] The second high-frequency signal is transmitted in the second signal path.

[0019] The first connecting conductor is provided in the laminate, connected to the first signal path and the second signal path, and is located on the negative side of the Z axis with respect to the second radiation conductor layer.

[0020] A multilayer substrate according to one embodiment of the present invention includes a laminate, a first radiation conductor layer, a second radiation conductor layer, a first signal path, a second signal path, and a first connection conductor.

[0021] The laminate has a structure in which a plurality of insulating layers are laminated along the Z axis.

[0022] The first radiation conductor layer is provided in the laminated body.

[0023] The first radiation conductor layer is provided with a first feeding point and a second feeding point.

[0024] When viewed in the negative direction of the Z axis, the second feed point and the first feed point are not in a point-symmetrical relationship with respect to the center of gravity of a figure defined by the outer edge of the first radiation conductor layer.

[0025] The second radiating conductor layer is provided in the laminate and is located on the negative side of the Z axis relative to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative direction of the Z axis.

[0026] The first signal path and the second signal path are connected to the first radiation conductor layer.

[0027] The first connecting conductor is provided in the laminate, connected to the first signal path and the second signal path, and is located on the negative side of the Z axis with respect to the second radiation conductor layer.

[0028] A wiring substrate according to one embodiment of the present invention includes a first laminate, a first signal path portion, a second signal path portion, and a first connection conductor.

[0029] An antenna component is mounted on the first stacked body.

[0030] The antenna component is located on the positive side of the Z axis relative to the first stack.

[0031] The antenna component includes a second laminate, a first radiation conductor layer, and a second radiation conductor layer.

[0032] The first stack has a structure in which a plurality of insulating layers are stacked along the Z axis.

[0033] The second laminate has a structure in which a plurality of insulating layers are stacked along the Z axis.

[0034] The first radiation conductor layer is provided in the second laminate and receives or radiates a first high-frequency signal and receives or radiates a second high-frequency signal.

[0035] The vibration direction of the electromagnetic field caused by the second high-frequency signal propagating in the air is different from the vibration direction of the electromagnetic field caused by the first high-frequency signal propagating in the air.

[0036] The second radiating conductor layer is provided in the second laminate and is located on the negative side of the Z axis relative to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative direction of the Z axis.

[0037] The first signal path portion and the second signal path portion are provided in the first laminate and are electrically connected to the first radiation conductor layer.

[0038] The first high-frequency signal is transmitted in the first signal path portion.

[0039] The second high-frequency signal is transmitted in the second signal path portion.

[0040] The first connecting conductor is provided in the second laminate, is connected to the first signal path portion and the second signal path portion, and is located on the negative side of the Z axis with respect to the second radiation conductor layer.

[0041] Effects of the Invention

[0042] According to the present invention, the isolation between the first high-frequency signal and the second high-frequency signal can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is an exploded perspective view of the multi-layer substrate 10 .

[0044] Figure 2 This is a rear view of the multi-layer substrate 10 when in use.

[0045] Figure 3 It is an exploded perspective view of the multi-layer substrate 10a.

[0046] Figure 4 It is an exploded perspective view of the multi-layer substrate 10b. DETAILED DESCRIPTION

[0047] (Implementation Method)

[0048] [Structure of Multilayer Substrate 10]

[0049] Hereinafter, the structure of a multilayer substrate 10 according to an embodiment of the present invention will be described with reference to the drawings. Figure 1 It is an exploded perspective view of the multi-layer substrate 10 . Figure 2 This is a rear view of the multi-layer substrate 10 when in use.

[0050] In the following, the stacking direction of the stack 12 of the multilayer substrate 10 is defined as the up-down direction. The up-down axis coincides with the Z-axis. The up direction is the positive direction of the Z-axis. The down direction is the negative direction of the Z-axis. The two axes extending from the sides of the stack 12 when the stack 12 is viewed from below are defined as the left-right axis and the front-back axis. The left-right axis is orthogonal to the up-down axis. The front-back axis is orthogonal to the up-down axis and the left-right axis. In addition, the definitions of directions in this specification are for example only. Therefore, the directions of the multilayer substrate 10 in actual use do not need to coincide with the directions in this specification.

[0051] Hereinafter, X is a component or member of the multilayer substrate 10. In this specification, unless otherwise specified, the various parts of X are defined as follows. The front portion of X means the front half of X. The rear portion of X means the rear half of X. The left portion of X means the left half of X. The right portion of X means the right half of X. The upper portion of X means the upper half of X. The lower portion of X means the lower half of X. The front end of X means the front end of X. The rear end of X means the rear end of X. The left end of X means the left end of X. The right end of X means the right end of X. The upper end of X means the upper end of X. The lower end of X means the lower end of X. The front end of X means the front end of X and its vicinity. The rear end of X means the rear end of X and its vicinity. The left end of X means the left end of X and its vicinity. The right end of X means the right end of X and its vicinity. The upper end of X means the upper end of X and its vicinity. The lower end of X means the lower end of X and its vicinity.

[0052] The multilayer substrate 10 is used as an antenna and a transmission line. The multilayer substrate 10 is electrically connected to a circuit substrate, for example. Figure 1 As shown, the multilayer substrate 10 includes a laminate 12 , a first ground conductor layer 16 , a second ground conductor layer 18 , a first radiation conductor layer 20 , a second radiation conductor layer 21 , a first connecting conductor 22 , a first signal path R1 , and a second signal path R2 .

[0053] The laminate 12 has a plate shape. Figure 1 as well as Figure 2As shown, the laminate 12 has a strip shape extending along the horizontal axis when viewed from below. The laminate 12 has a structure in which insulating layers 14a to 14g are stacked along the vertical axis (Z axis). The insulating layers 14a to 14g are arranged in order from top to bottom.

[0054] When viewed from below, the insulating layers 14e to 14g have a strip shape extending along the left-right axis. When viewed from below, the insulating layers 14a to 14d have a rectangular shape. Therefore, the length of the insulating layers 14e to 14g along the left-right axis is longer than the length of the insulating layers 14a to 14d along the left-right axis. When viewed from below, the left ends of the insulating layers 14a to 14d overlap with the left ends of the insulating layers 14e to 14g. The material of the insulating layers 14a to 14g as described above is a thermoplastic resin such as polyimide or liquid crystal polymer. Therefore, the laminate 12 has flexibility. In addition, among the insulating layers 14a to 14g, the insulating layers adjacent to each other in the upper and lower directions are thermally bonded to each other.

[0055] The first radiation conductor layer 20 radiates the first high frequency signal and the second high frequency signal. The first radiation conductor layer 20 is provided in the laminate 12. In this embodiment, the first radiation conductor layer 20 is located on the upper main surface of the insulating layer 14a. Figure 1 As shown, when viewed from below, the first radiating conductor layer 20 has a square shape with sides extending along the front-back axis and the left-right axis. The length of one side of the first radiating conductor layer 20 is ½ the wavelength within the resonant frequency band of the first radiating conductor layer 20. The wavelength of the first high-frequency signal and the second high-frequency signal fall within the resonant frequency band of the first radiating conductor layer 20. Furthermore, the resonant mode of the first radiating conductor layer 20 is the base mode.

[0056] The second radiating conductor layer 21 radiates the third high-frequency signal and the fourth high-frequency signal. The second radiating conductor layer 21 is provided in the laminate 12. In this embodiment, the second radiating conductor layer 21 is located on the upper principal surface of the insulating layer 14b. As a result, the second radiating conductor layer 21 is located below the first radiating conductor layer 20 (on the negative side of the Z axis).

[0057] Furthermore, if Figure 3As shown, the second radiating conductor layer 21 overlaps the first radiating conductor layer 20 when viewed from below (the negative direction of the Z axis). When viewed from below, the second radiating conductor layer 21 has a square shape with sides extending along the front-back axis and the left-right axis. However, the area of the second radiating conductor layer 21 is larger than that of the first radiating conductor layer 20. Therefore, when viewed from below, the four sides of the second radiating conductor layer 21 do not overlap with the first radiating conductor layer 20. When viewed from below, the first radiating conductor layer 20 is contained within the outer edge of the second radiating conductor layer 21. Furthermore, when viewed from below, the intersection of the diagonals of the second radiating conductor layer 21 coincides with the intersection of the diagonals of the first radiating conductor layer 20. In other words, when viewed from below (the negative direction of the Z axis), the center of gravity of the shape defined by the outer edge of the second radiating conductor layer 21 coincides with the center of gravity of the shape defined by the outer edge of the first radiating conductor layer 20.

[0058] The resonant frequency band of the second radiating conductor layer 21 is lower than the resonant frequency band of the first radiating conductor layer 20. In this embodiment, the difference between the resonant frequency band of the first radiating conductor layer 20 and the resonant frequency band of the second radiating conductor layer 21 is at least 10% of the frequency of the first high-frequency signal and the frequency of the second high-frequency signal. However, the difference between the resonant frequency band of the first radiating conductor layer 20 and the resonant frequency band of the second radiating conductor layer 21 may be less than 10% of the frequency of the first high-frequency signal and the frequency of the second high-frequency signal.

[0059] The first signal path R1 is connected to the first radiating conductor layer 20. The first signal path R1 includes the first signal conductor layer 24 and an interlayer connection conductor v1. The first signal conductor layer 24 is located on the upper main surface of the insulating layer 14f. When viewed from below, the first signal conductor layer 24 has a linear shape extending along the horizontal axis. When viewed from below, the left end of the first signal conductor layer 24 overlaps with the first radiating conductor layer 20. The interlayer connection conductor v1 penetrates the insulating layers 14a to 14e along the vertical axis. The upper end of the interlayer connection conductor v1 is connected to the rear of the intersection of the diagonal lines of the first radiating conductor layer 20. The lower end of the interlayer connection conductor v1 is connected to the left end of the first signal conductor layer 24.

[0060] The first high-frequency signal propagates along the first signal path R1. Therefore, the first high-frequency signal is supplied to the first radiating conductor layer 20 via the interlayer connection conductor v1. The interlayer connection conductor v1 is connected to the rear of the intersection of the diagonal lines of the first radiating conductor layer 20. Hereinafter, the point where the interlayer connection conductor v1 connects to the first radiating conductor layer 20 is referred to as the first feed point P1. The first high-frequency signal resonates in the first radiating conductor layer 20, causing current to flow in the direction along the front-back axis.

[0061] The second signal path R2 is connected to the first radiating conductor layer 20. The second signal path R2 includes a second signal conductor layer 26 and an interlayer connection conductor v2. The second signal conductor layer 26 is located on the upper main surface of the insulating layer 14f. When viewed from below, the second signal conductor layer 26 has a linear shape extending along the horizontal axis. When viewed from below, the left end of the second signal conductor layer 26 overlaps with the first radiating conductor layer 20. The interlayer connection conductor v2 penetrates the insulating layers 14a to 14e along the vertical axis. The upper end of the interlayer connection conductor v2 is connected to the right of the intersection of the diagonal lines of the first radiating conductor layer 20. Hereinafter, the point where the interlayer connection conductor v2 connects to the first radiating conductor layer 20 is referred to as the second feed point P2. Thus, the first feed point P1 and the second feed point P2 are provided on the first radiating conductor layer 20. Furthermore, when viewed downward (in the negative direction of the Z axis), the second feed point P2 and the first feed point P1 are not point-symmetrical about the center of gravity of the figure defined by the outer edge of the first radiating conductor layer 20. In this embodiment, the second feed point P2 and the first feed point P1 are not point-symmetrical about the intersection of the diagonal line of the first radiating conductor layer 20. The lower end of the interlayer connection conductor v2 is connected to the left end of the second signal conductor layer 26.

[0062] The second high-frequency signal propagates along the second signal path R2. Therefore, the second high-frequency signal is supplied to the first radiating conductor layer 20 via the interlayer connecting conductor v2. The interlayer connecting conductor v2 is connected to the right side of the intersection of the diagonals of the first radiating conductor layer 20. The second high-frequency signal resonates in the first radiating conductor layer 20, causing a current to flow along the left-right axis. Therefore, the electromagnetic field generated by the second high-frequency signal propagating through the air vibrates in a direction different from the electromagnetic field generated by the first high-frequency signal propagating through the air. In this embodiment, the electromagnetic field generated by the second high-frequency signal propagates in an airborne direction, which is orthogonal to the electromagnetic field generated by the first high-frequency signal propagating through the air.

[0063] The third signal path R3 is connected to the second radiating conductor layer 21. The third signal path R3 includes the third signal conductor layer 28 and an interlayer connection conductor v3. The third signal conductor layer 28 is located on the upper main surface of the insulating layer 14f. When viewed from below, the third signal conductor layer 28 has a linear shape extending along the horizontal axis. When viewed from below, the left end of the third signal conductor layer 28 overlaps with the second radiating conductor layer 21. The interlayer connection conductor v3 penetrates the insulating layers 14a to 14e along the vertical axis. The upper end of the interlayer connection conductor v3 is connected to the left side of the intersection of the diagonal lines of the second radiating conductor layer 21. Hereinafter, the point where the interlayer connection conductor v3 connects to the second radiating conductor layer 21 is referred to as the third feed point P3. The lower end of the interlayer connection conductor v3 is connected to the left end of the third signal conductor layer 28.

[0064] The third high-frequency signal propagates along the third signal path R3. Therefore, the third high-frequency signal is supplied to the second radiating conductor layer 21 via the interlayer connecting conductor v3. The interlayer connecting conductor v3 is connected to the left side of the intersection of the diagonal lines of the second radiating conductor layer 21. Therefore, the third high-frequency signal resonates in the second radiating conductor layer 21, causing a current to flow in a direction along the left-right axis.

[0065] The fourth signal path R4 is connected to the second radiating conductor layer 21. The fourth signal path R4 includes the fourth signal conductor layer 30 and an interlayer connection conductor v4. The fourth signal conductor layer 30 is located on the upper main surface of the insulating layer 14f. When viewed from below, the fourth signal conductor layer 30 has a linear shape extending along the horizontal axis. When viewed from below, the left end of the fourth signal conductor layer 30 overlaps with the second radiating conductor layer 21. The interlayer connection conductor v4 penetrates the insulating layers 14a to 14e along the vertical axis. The upper end of the interlayer connection conductor v4 is connected to a point just in front of the intersection of the diagonals of the second radiating conductor layer 21. Hereinafter, the point where the interlayer connection conductor v4 connects to the second radiating conductor layer 21 is referred to as the fourth feed point P4. The fourth feed point P4 and the third feed point P3 are point-symmetrical about the intersection of the diagonals of the second radiating conductor layer 21. The lower end of the interlayer connection conductor v4 is connected to the left end of the fourth signal conductor layer 30.

[0066] The fourth high-frequency signal propagates along the fourth signal path R4. Therefore, the fourth high-frequency signal is supplied to the second radiating conductor layer 21 via the interlayer connecting conductor v4. The interlayer connecting conductor v4 is connected just before the intersection of the diagonals of the second radiating conductor layer 21. The fourth high-frequency signal resonates in the second radiating conductor layer 21, causing current to flow along the front-back axis. Therefore, the electromagnetic field generated by the fourth high-frequency signal propagating through the air vibrates in a direction different from the electromagnetic field generated by the third high-frequency signal propagating through the air. In this embodiment, the electromagnetic field generated by the fourth high-frequency signal propagates in an airborne direction, which is orthogonal to the electromagnetic field generated by the third high-frequency signal propagating through the air.

[0067] The first ground conductor layer 16 is provided in the laminate 12. In this embodiment, the first ground conductor layer 16 is located on the upper main surface of the insulating layer 14e. As a result, the first ground conductor layer 16 is located below the second radiating conductor layer 21 (on the negative side of the Z axis). The first ground conductor layer 16 is located above the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30.

[0068] The first ground conductor layer 16 covers substantially the entire upper principal surface of the insulating layer 14e. Thus, when viewed from below (the negative direction of the Z axis), the first ground conductor layer 16 overlaps with the first radiating conductor layer 20 and the second radiating conductor layer 21. Consequently, the first radiating conductor layer 20, the second radiating conductor layer 21, and the first ground conductor layer 16 function as a patch antenna. Furthermore, when viewed from below, the first ground conductor layer 16 overlaps with the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30.

[0069] The second ground conductor layer 18 is provided in the laminate 12. In this embodiment, the second ground conductor layer 18 is located on the upper main surface of the insulating layer 14g. As a result, the second ground conductor layer 18 is located below the first ground conductor layer 16 (on the negative side of the Z axis). The second ground conductor layer 18 is located below the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30.

[0070] The second ground conductor layer 18 covers substantially the entire upper main surface of the insulating layer 14g. Thus, when viewed from below (in the negative direction of the Z axis), the second ground conductor layer 18 overlaps with the first ground conductor layer 16. Furthermore, when viewed from below (in the negative direction of the Z axis), the second ground conductor layer 18 overlaps with the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30. The first and second ground conductor layers 16, 18 are connected to the ground potential. Consequently, the first, second, third, fourth, and third signal conductor layers 24, 26, 28, and 30, as well as the first and second ground conductor layers 16, 18, form a stripline structure.

[0071] The first connecting conductor 22 is provided in the laminate 12. In this embodiment, the first connecting conductor 22 is a conductive layer located on the upper main surface of the insulating layer 14d. Therefore, the first connecting conductor 22 is located below the second radiating conductor layer 21 (on the negative side of the Z axis) and above the first ground conductor layer 16 (on the positive side of the Z axis). Furthermore, the distance from the first connecting conductor 22 to the first ground conductor layer 16 along the vertical axis (the Z axis) is shorter than the distance from the first connecting conductor 22 to the second radiating conductor layer 21 along the vertical axis (the Z axis). Furthermore, when viewed from below, the first connecting conductor 22 overlaps with the second radiating conductor layer 21.

[0072] The first connecting conductor 22 is connected to the first signal path R1 and the second signal path R2. In this embodiment, when viewed from below, the first connecting conductor 22 has a linear shape having a first end t1 and a second end t2. The first end t1 of the first connecting conductor 22 is connected to the interlayer connecting conductor v1. The second end t2 of the first connecting conductor 22 is connected to the interlayer connecting conductor v2.

[0073] Furthermore, the multilayer substrate 10 is designed to satisfy the following conditions. The phase difference between the first high-frequency signal input to the interlayer-connector conductor v2 in the first radiating conductor layer 20 and the first high-frequency signal input to the interlayer-connector conductor v2 via the first connecting conductor 22 is an odd multiple of 180°. This condition is sufficient as long as the first high-frequency signal input to the interlayer-connector conductor v2 without passing through the first connecting conductor 22 is attenuated by the first high-frequency signal input to the interlayer-connector conductor v2 via the first connecting conductor 22 within the usable frequency band. Furthermore, the phase difference between the second high-frequency signal input to the interlayer-connector conductor v1 in the first radiating conductor layer 20 and the second high-frequency signal input to the interlayer-connector conductor v1 via the first connecting conductor 22 is an odd multiple of 180°. This condition is sufficient as long as the second high-frequency signal input to the interlayer-connector conductor v1 without passing through the first connecting conductor 22 is attenuated by the second high-frequency signal input to the interlayer-connector conductor v1 via the first connecting conductor 22 within the usable frequency band.

[0074] The first ground conductor layer 16, the second ground conductor layer 18, the first radiating conductor layer 20, the second radiating conductor layer 21, the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30 are formed, for example, by patterning a metal foil adhered to the upper main surfaces of the insulating layers 14a to 14g. The metal is, for example, copper. Furthermore, the interlayer connecting conductors v1 to v4 are, for example, via-hole conductors. These via-hole conductors are formed by forming through-holes in the insulating layers 14a to 14e, filling the through-holes with a conductive paste, and sintering the conductive paste.

[0075] Next, an example of using the multilayer substrate 10 will be described. Figure 1 As shown, the multilayer substrate 10 includes a first section A1 and a second section A2. The first section A1 includes the first radiating conductor layer 20 and the second radiating conductor layer 21. The second section A2 does not include the first radiating conductor layer 20 and the second radiating conductor layer 21. The thickness of the first section A1 is greater than that of the second section A2. Therefore, the second section A2 is more easily bent upward or downward than the first section A1.

[0076] Therefore, in the multi-layer substrate 10, as Figure 2As shown, the second section A2 is bent. In addition, a connector 100 is installed at the end of the second section A2. The connector 100 is connected to a connector provided on a circuit board (not shown). In addition, the multilayer substrate 10 can also be connected to other circuit boards without the connector 100.

[0077] [Effect]

[0078] The multilayer substrate 10 improves the isolation between the first high-frequency signal and the second high-frequency signal. Specifically, at the first feed point P1 and the second feed point P2 of the first connecting conductor 22, if the first high-frequency signal enters the interlayer connecting conductor v2 from the first feed point P1 via the second feed point P2, the first high-frequency signal becomes noise.

[0079] Therefore, the first connecting conductor 22 is connected to the first signal path R1 and the second signal path R2. A phase difference occurs between the first high-frequency signal input to the interlayer connecting conductor v2 in the first radiating conductor layer 20 and the first high-frequency signal input to the interlayer connecting conductor v2 via the first connecting conductor 22. Consequently, the first high-frequency signal input to the interlayer connecting conductor v2 in the first radiating conductor layer 20 and the first high-frequency signal input to the interlayer connecting conductor v2 via the first connecting conductor 22 cancel each other out. As a result, the first high-frequency signal is prevented from becoming noise. For the same reason, the second high-frequency signal is also prevented from becoming noise.

[0080] Here, the first connecting conductor 22 is designed to suppress the first high-frequency signal entering the interlayer-connector conductor v2 from the second feed point P2 from becoming noise. Similarly, the first connecting conductor 22 is designed to suppress the second high-frequency signal entering the interlayer-connector conductor v1 from the first feed point P1 from becoming noise. Specifically, the phase difference between the first high-frequency signal input to the interlayer-connector conductor v2 in the first radiating conductor layer 20 and the first high-frequency signal input to the interlayer-connector conductor v2 via the first connecting conductor 22 is an odd multiple of 180°. This phase state is sufficient as long as the first high-frequency signal input to the interlayer-connector conductor v2 without passing through the first connecting conductor 22 is attenuated by the first high-frequency signal input to the interlayer-connector conductor v2 via the first connecting conductor 22 within the operating frequency band. Furthermore, the phase difference between the second high-frequency signal input to the interlayer-connector conductor v1 in the first radiating conductor layer 20 and the second high-frequency signal input to the interlayer-connector conductor v1 via the first connecting conductor 22 is an odd multiple of 180°. Furthermore, the second high-frequency signal input to the interlayer connection conductor v1 not via the first connection conductor 22 may be in a phase state in which the second high-frequency signal input to the interlayer connection conductor v1 via the first connection conductor 22 is attenuated within the operating frequency band.

[0081] In the multilayer substrate 10, the first connecting conductor 22 is located below (on the negative side of the Z axis) the second radiating conductor layer 21. Consequently, the second radiating conductor layer 21 is located between the first radiating conductor layer 20 and the first connecting conductor 22. This prevents the electromagnetic field generated by the first radiating conductor layer 20 from reaching the first connecting conductor 22 and becoming noise.

[0082] In the multilayer substrate 10, the first ground conductor layer 16 is located between the first connecting conductor 22 and the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30. This prevents noise from intruding into the first connecting conductor 22 and the first signal conductor layer 24, the second signal conductor layer 26, the third signal conductor layer 28, and the fourth signal conductor layer 30.

[0083] (First Modification)

[0084] Next, a multi-layer substrate 10a according to a first modification will be described with reference to the drawings. Figure 3 It is an exploded perspective view of the multi-layer substrate 10a.

[0085] The multi-layer substrate 10 a differs from the multi-layer substrate 10 in the following respects.

[0086] The first connecting conductor 22 is located below the first ground conductor layer 16 (on the negative side of the Z axis) and above the second ground conductor layer 18 (on the positive side of the Z axis).

[0087] The multilayer substrate 10 a further includes a second connection conductor 23 .

[0088] A first branch conductor layer 40 is provided in the first signal path R1 .

[0089] A second branch conductor layer 42 is provided in the second signal path R2.

[0090] A third branch conductor layer 44 is provided in the third signal path R3 .

[0091] A fourth branch conductor layer 46 is provided in the fourth signal path R4.

[0092] The first connecting conductor 22 is located below the first ground conductor layer 16 (on the negative side of the Z axis) and above the second ground conductor layer 18 (on the positive side of the Z axis). In this embodiment, the first connecting conductor 22 is a conductive layer located on the upper main surface of the insulating layer 14f. Furthermore, the first connecting conductor 22 is connected to the first signal conductor layer 24 and the second signal conductor layer 26.

[0093] The second connecting conductor 23 is provided in the laminate 12. The second connecting conductor 23 is located below the first ground conductor layer 16 (on the negative side of the Z axis) and above the second ground conductor layer 18. In this embodiment, the second connecting conductor 23 is a conductor layer located on the upper main surface of the insulating layer 14f. The second connecting conductor 23 is connected to the third signal path R3 and the fourth signal path R4. In this embodiment, the second connecting conductor 23 is connected to the third signal conductor layer 28 and the fourth signal conductor layer 30.

[0094] A first branch conductor layer 40 is provided in the first signal path R1. In this embodiment, the first branch conductor layer 40 is connected to the first signal conductor layer 24. The first branch conductor layer 40 captures the third high-frequency signal and the fourth high-frequency signal. The first branch conductor layer 40 is, for example, an open-circuited stub. Therefore, the length of the first branch conductor layer 40 is, for example, 1 / 4 of the wavelength within the resonant frequency band of the second radiating conductor layer 21.

[0095] A second branch conductor layer 42 is provided in the second signal path R2. In this embodiment, the second branch conductor layer 42 is connected to the second signal conductor layer 26. The second branch conductor layer 42 captures the third high-frequency signal and the fourth high-frequency signal. The second branch conductor layer 42 is, for example, an open-circuited stub. Therefore, the length of the second branch conductor layer 42 is, for example, 1 / 4 of the wavelength within the resonant frequency band of the second radiating conductor layer 21.

[0096] A third branch conductor layer 44 is provided in the third signal path R3. In this embodiment, the third branch conductor layer 44 is connected to the third signal conductor layer 28. The third branch conductor layer 44 captures the first high-frequency signal and the second high-frequency signal. The third branch conductor layer 44 is, for example, an open-circuited stub. Therefore, the length of the third branch conductor layer 44 is, for example, ¼ the wavelength of the resonant frequency band of the first radiating conductor layer 20.

[0097] A fourth branch conductor layer 46 is provided in the fourth signal path R4. In this embodiment, the fourth branch conductor layer 46 is connected to the fourth signal conductor layer 30. The fourth branch conductor layer 46 captures the first high-frequency signal and the second high-frequency signal. The fourth branch conductor layer 46 is, for example, an open-circuited stub. Therefore, the length of the fourth branch conductor layer 46 is, for example, ¼ of the wavelength within the resonant frequency band of the first radiating conductor layer 20. The remaining structure of the multilayer substrate 10a is the same as that of the multilayer substrate 10, and therefore its description is omitted. The multilayer substrate 10a can achieve the same effects as the multilayer substrate 10.

[0098] According to the multilayer substrate 10a, the provision of the first connecting conductor 22 improves the isolation between the third and fourth high-frequency signals for the same reason that the isolation between the first and second high-frequency signals can be improved. Furthermore, the second connecting conductor 23 is designed to suppress the third high-frequency signal from entering the interlayer connecting conductor v4 from the fourth feed point P4 from becoming noise. Similarly, the second connecting conductor 23 is designed to suppress the fourth high-frequency signal from entering the interlayer connecting conductor v3 from the third feed point P3 from becoming noise. The design method for the second connecting conductor 23 is the same as that for the first connecting conductor 22, and therefore its description will be omitted.

[0099] In the multilayer substrate 10a, the first connecting conductor 22 is located below (on the negative side of the Z axis) the first ground conductor layer 16. Consequently, the first ground conductor layer 16 is located between the first and second radiating conductor layers 20 and 21 and the first connecting conductor 22. This prevents the electromagnetic field generated by the first and second radiating conductor layers 20 and 21 from reaching the first connecting conductor 22 and becoming noise.

[0100] In the multilayer substrate 10a, the second connecting conductor 23 is located below (on the negative side of the Z axis) the first ground conductor layer 16. Consequently, the first ground conductor layer 16 is located between the first and second radiating conductor layers 20 and 21 and the second connecting conductor 23. This prevents the electromagnetic field generated by the first and second radiating conductor layers 20 and 21 from reaching the second connecting conductor 23 and becoming noise.

[0101] In the multilayer substrate 10a, a first branching conductor layer 40 is provided in the first signal path R1. The first branching conductor layer 40 captures the third and fourth high-frequency signals. Thus, even if the third and fourth high-frequency signals radiated from the second radiating conductor layer 21 intrude into the first signal path R1, they are captured by the first branching conductor layer 40. As a result, the third and fourth high-frequency signals are prevented from becoming noise in the first signal path R1.

[0102] In the multilayer substrate 10a, a second branch conductor layer 42 is provided in the second signal path R2. The second branch conductor layer 42 captures the third and fourth high-frequency signals. Thus, even if the third and fourth high-frequency signals radiated from the second radiating conductor layer 21 intrude into the second signal path R2, they are captured by the second branch conductor layer 42. As a result, the third and fourth high-frequency signals are prevented from becoming noise in the second signal path R2.

[0103] In the multilayer substrate 10a, a third branch conductor layer 44 is provided in the third signal path R3. The third branch conductor layer 44 captures the first and second high-frequency signals. Thus, even if the first and second high-frequency signals radiated from the first radiating conductor layer 20 intrude into the third signal path R3, they are captured by the third branch conductor layer 44. As a result, the first and second high-frequency signals are prevented from becoming noise in the third signal path R3.

[0104] In the multilayer substrate 10a, a fourth branch conductor layer 46 is provided in the fourth signal path R4. The fourth branch conductor layer 46 captures the first and second high-frequency signals. Thus, even if the first and second high-frequency signals radiated from the first radiating conductor layer 20 intrude into the fourth signal path R4, they are captured by the fourth branch conductor layer 46. As a result, the first and second high-frequency signals are prevented from becoming noise in the fourth signal path R4.

[0105] (Second Modification)

[0106] Next, a multi-layer substrate 10b according to a second modification will be described with reference to the drawings. Figure 4 It is an exploded perspective view of the multi-layer substrate 10b.

[0107] The multi-layer substrate 10 b differs from the multi-layer substrate 10 in the following respects.

[0108] The first ground conductor layer 16 is located on the lower main surface of the insulating layer 14 e .

[0109] The multilayer substrate 10 b includes external electrodes 124 , 126 , 128 , and 130 instead of the first signal conductor layer 24 , the second signal conductor layer 26 , the third signal conductor layer 28 , and the fourth signal conductor layer 30 .

[0110] An electronic component 200 is mounted on the lower main surface of the laminate 12 of the multilayer substrate 10 b .

[0111] The external electrodes 124 , 126 , 128 , and 130 are located on the lower main surface of the insulating layer 14 e . The lower ends of the interlayer connection conductors v1 to v4 are connected to the external electrodes 124 , 126 , 128 , and 130 , respectively.

[0112] Electronic component 200 is, for example, a semiconductor integrated circuit. Electronic component 200 is mounted on external electrodes 124, 126, 128, and 130 using solder. The remaining structure of multilayer substrate 10b is the same as that of multilayer substrate 10, and thus its description is omitted. Multilayer substrate 10b can achieve the same effects as multilayer substrate 10.

[0113] (Other Implementations)

[0114] The multilayer substrate according to the present invention is not limited to the multilayer substrates 10, 10a, and 10b, and can be modified within the scope of the gist thereof. The structures of the multilayer substrates 10, 10a, and 10b can also be arbitrarily combined.

[0115] Furthermore, the first radiating conductor layer 20 can also receive the first high-frequency signal and the second high-frequency signal, and the second radiating conductor layer 21 can also receive the third high-frequency signal and the fourth high-frequency signal.

[0116] In addition, in the multilayer substrate 10a, the first branch conductor layer 40, the second branch conductor layer 42, the third branch conductor layer 44, and the fourth branch conductor layer 46 are not essential components. The multilayer substrate 10a may include any one, any two, or any three of the first branch conductor layer 40, the second branch conductor layer 42, the third branch conductor layer 44, and the fourth branch conductor layer 46.

[0117] In addition, the second connection conductor 23 is not an essential component.

[0118] In addition, the first branch conductor layer 40 , the second branch conductor layer 42 , the third branch conductor layer 44 , and the fourth branch conductor layer 46 may be short-circuit branch conductor layers.

[0119] Furthermore, the first branch conductor layer 40 , the second branch conductor layer 42 , the third branch conductor layer 44 , and the fourth branch conductor layer 46 may be provided for impedance matching instead of capturing high-frequency signals.

[0120] Furthermore, the first connection conductor 22 and the second connection conductor 23 are not limited to the conductor layers. Therefore, the first connection conductor 22 and the second connection conductor 23 may also be interlayer connection conductors.

[0121] In addition, the multilayer substrate 10a includes one laminate 12. However, the multilayer substrate 10a may also include a plurality of laminates. Specifically, Figure 3 The multilayer substrate 10a may also include a first laminate and a second laminate. In this case, the first laminate includes insulating layers 14a to 14d. The material of insulating layers 14a to 14d is, for example, ceramic. The second laminate includes insulating layers 14e to 14g. The material of insulating layers 14e to 14g is a thermoplastic resin.

[0122] The antenna component includes insulator layers 14a to 14d, a first radiating conductor layer 20, and a second radiating conductor layer 21. The wiring board includes insulator layers 14e to 14g, a first ground conductor layer 16, a second ground conductor layer 18, a first signal conductor layer 24, a second signal conductor layer 26, a third signal conductor layer 28, a fourth signal conductor layer 30, and portions of interlayer connection conductors v1 to v4. The antenna component is mounted on the first laminate using solder. In this case, the antenna component is positioned above the first laminate (on the positive side of the Z axis).

[0123] A portion of the interlayer-connector conductor v1 and the first signal conductor layer 24 constitute the first signal path portion. The first signal path portion is electrically connected to the first radiating conductor layer 20. A portion of the interlayer-connector conductor v2 and the second signal conductor layer 26 constitute the second signal path portion. The second signal path portion is electrically connected to the first radiating conductor layer 20. A portion of the interlayer-connector conductor v3 and the third signal conductor layer 28 constitute the third signal path portion. The third signal path portion is electrically connected to the second radiating conductor layer 21. A portion of the interlayer-connector conductor v4 and the fourth signal conductor layer 30 constitute the fourth signal path portion. The fourth signal path portion is electrically connected to the second radiating conductor layer 21.

[0124] Furthermore, the multilayer substrate 10 includes a single laminate 12. However, the multilayer substrate 10 may also include a first laminate and a second laminate, similar to the multilayer substrate 10a. Specifically, the first radiating conductor layer 20 may be provided on the first laminate. The first connecting conductor 22 may also be provided on the second laminate. The second laminate is attached to the first laminate using solder. Therefore, if the first connecting conductor 22 is provided on the first laminate, the length of the current path from the first radiating conductor layer 20 to the first connecting conductor 22 is likely to vary. Therefore, the first connecting conductor 22 is provided on the second laminate. This reduces variations in the length of the current path from the first radiating conductor layer 20 to the first connecting conductor 22.

[0125] Furthermore, the multilayer substrate 10 may not include a portion below the insulating layer 14d. In this case, the insulating layers 14a to 14d may be made of ceramic.

[0126] The present invention has the following configuration. (1)

[0128] A multi-layer substrate, wherein

[0129] The multilayer substrate includes a laminate, a first radiation conductor layer, a second radiation conductor layer, a first signal path, a second signal path, and a first connection conductor.

[0130] The laminate has a structure in which a plurality of insulating layers are laminated along the Z axis.

[0131] The first radiation conductor layer is provided in the laminate and receives or radiates a first high-frequency signal and receives or radiates a second high-frequency signal.

[0132] The vibration direction of the electromagnetic field caused by the second high-frequency signal propagating in the air is different from the vibration direction of the electromagnetic field caused by the first high-frequency signal propagating in the air.

[0133] The second radiating conductor layer is provided in the laminate and is located on the negative side of the Z axis relative to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative direction of the Z axis.

[0134] The first signal path and the second signal path are connected to the first radiation conductor layer.

[0135] The first high-frequency signal is transmitted in the first signal path,

[0136] The second high-frequency signal is transmitted in the second signal path.

[0137] The first connecting conductor is provided in the laminate, connected to the first signal path and the second signal path, and is located on the negative side of the Z axis with respect to the second radiation conductor layer. (2)

[0139] The multilayer substrate according to (1), wherein

[0140] The multilayer substrate further comprises a first ground conductor layer.

[0141] The first ground conductor layer is provided in the laminate and is located on the negative side of the Z axis relative to the second radiation conductor layer, and overlaps the first radiation conductor layer and the second radiation conductor layer when viewed in the negative direction of the Z axis. (3)

[0143] The multilayer substrate according to (2), wherein

[0144] The first connecting conductor is located on the negative side of the Z axis with respect to the second radiation conductor layer, and is located on the positive side of the Z axis with respect to the first ground conductor layer. (4)

[0146] The multilayer substrate according to (3), wherein

[0147] A distance from the first coupling conductor to the first ground conductor layer on the Z axis is shorter than a distance from the first coupling conductor to the second radiation conductor layer on the Z axis. (5)

[0149] The multilayer substrate according to (2), wherein

[0150] The multilayer substrate further comprises a second ground conductor layer.

[0151] The second ground conductor layer is provided in the laminate and is located on the negative side of the Z axis relative to the first ground conductor layer, and overlaps with the first ground conductor layer when viewed in the negative direction of the Z axis.

[0152] The first connection conductor is located on the negative side of the Z axis with respect to the first ground conductor layer, and is located on the positive side of the Z axis with respect to the second ground conductor layer. (6)

[0154] The multilayer substrate according to any one of (1) to (5), wherein

[0155] The multilayer substrate further comprises a third signal path and a fourth signal path,

[0156] The second radiation conductor layer receives or radiates a third high-frequency signal and receives or radiates a fourth high-frequency signal.

[0157] The vibration direction of the electromagnetic field caused by the fourth high-frequency signal propagating in the air is different from the vibration direction of the electromagnetic field caused by the third high-frequency signal propagating in the air.

[0158] The third signal path and the fourth signal path are connected to the second radiation conductor layer.

[0159] The third high frequency signal is transmitted in the third signal path.

[0160] The fourth high-frequency signal is transmitted in the fourth signal path. (7)

[0162] The multilayer substrate according to (6), wherein

[0163] The multilayer substrate further includes a second connection conductor.

[0164] The second connection conductor is provided in the laminate and is connected to the third signal path and the fourth signal path. (8)

[0166] The multilayer substrate according to (7), wherein

[0167] The multilayer substrate further comprises a first ground conductor layer.

[0168] The first ground conductor layer is provided in the laminate and is located on the negative side of the Z axis relative to the second radiation conductor layer, and overlaps the first radiation conductor layer and the second radiation conductor layer when viewed in the negative direction of the Z axis.

[0169] The second connection conductor is located on the negative side of the Z axis relative to the first ground conductor layer. (9)

[0171] The multilayer substrate according to any one of (6) to (8), wherein

[0172] The resonant frequency of the second radiating conductor layer is lower than the resonant frequency of the first radiating conductor layer. (10)

[0174] The multilayer substrate according to (9), wherein

[0175] A difference between a resonant frequency band of the first radiating conductor layer and a resonant frequency band of the second radiating conductor layer is equal to or greater than 10% of a frequency of the first high-frequency signal and a frequency of the second high-frequency signal. (11)

[0177] The multilayer substrate according to any one of (6) to (10), wherein

[0178] A first branch conductor layer is provided in the first signal path.

[0179] A second branch conductor layer is provided in the second signal path. (12)

[0181] The multilayer substrate according to any one of (6) to (11), wherein

[0182] A third branch conductor layer is provided in the third signal path.

[0183] A fourth branch conductor layer is provided in the fourth signal path. (13)

[0185] A multi-layer substrate, wherein

[0186] The multilayer substrate includes a laminate, a first radiation conductor layer, a second radiation conductor layer, a first signal path, a second signal path, and a first connection conductor.

[0187] The laminate has a structure in which a plurality of insulating layers are laminated along the Z axis.

[0188] The first radiation conductor layer is provided in the laminated body.

[0189] The first radiation conductor layer is provided with a first feeding point and a second feeding point.

[0190] When viewed in the negative direction of the Z axis, the second feed point and the first feed point are not in a point-symmetrical relationship with respect to the center of gravity of a figure defined by the outer edge of the first radiation conductor layer.

[0191] The second radiating conductor layer is provided in the laminate and is located on the negative side of the Z axis relative to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative direction of the Z axis.

[0192] The first signal path and the second signal path are connected to the first radiation conductor layer.

[0193] The first connecting conductor is provided in the laminate, connected to the first signal path and the second signal path, and is located on the negative side of the Z axis with respect to the second radiation conductor layer. (14)

[0195] A wiring substrate, wherein:

[0196] The wiring substrate includes a first laminate, a first signal path portion, a second signal path portion, and a first connection conductor.

[0197] An antenna component is mounted on the first stacked body.

[0198] The antenna component is located on the positive side of the Z axis relative to the first stack.

[0199] The antenna component includes a second laminate, a first radiation conductor layer, and a second radiation conductor layer.

[0200] The first stack has a structure in which a plurality of insulating layers are stacked along the Z axis.

[0201] The second laminate has a structure in which a plurality of insulating layers are stacked along the Z axis.

[0202] The first radiation conductor layer is provided in the second laminate and receives or radiates a first high-frequency signal and receives or radiates a second high-frequency signal.

[0203] The vibration direction of the electromagnetic field caused by the second high-frequency signal propagating in the air is different from the vibration direction of the electromagnetic field caused by the first high-frequency signal propagating in the air.

[0204] The second radiating conductor layer is provided in the second laminate and is located on the negative side of the Z axis relative to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative direction of the Z axis.

[0205] The first signal path portion and the second signal path portion are provided in the first laminate and are electrically connected to the first radiation conductor layer.

[0206] The first high-frequency signal is transmitted in the first signal path portion.

[0207] The second high-frequency signal is transmitted in the second signal path portion.

[0208] The first connecting conductor is provided in the second laminate, is connected to the first signal path portion and the second signal path portion, and is located on the negative side of the Z axis with respect to the second radiation conductor layer.

[0209] Description of Reference Numerals

[0210] 10, 10a, 10b: multi-layer substrate;

[0211] 12: laminate;

[0212] 14a~14g: insulator layer;

[0213] 16: 1st ground conductor layer;

[0214] 18: second ground conductor layer;

[0215] 20: first radiation conductor layer;

[0216] 21: second radiation conductor layer;

[0217] 22: 1st connecting conductor;

[0218] 23: second connecting conductor;

[0219] 24: 1st signal conductor layer;

[0220] 26: second signal conductor layer;

[0221] 28: 3rd signal conductor layer;

[0222] 30: 4th signal conductor layer;

[0223] 40: first branch conductor layer;

[0224] 42: second branch conductor layer;

[0225] 44: the third branch conductor layer;

[0226] 46: 4th branch conductor layer;

[0227] 100: connector;

[0228] 124, 126, 128, 130: external electrodes;

[0229] 200: electronic components;

[0230] A1: Interval 1;

[0231] A2: Interval 2;

[0232] P1: first power supply point;

[0233] P2: Second power supply point;

[0234] P3: The third power supply point;

[0235] P4: 4th power supply point;

[0236] R1: first signal path;

[0237] R2: second signal path;

[0238] R3: 3rd signal path;

[0239] R4: 4th signal path;

[0240] t1: first end;

[0241] t2: the second end;

[0242] v1~v4: interlayer connecting conductors.

Claims

1. A multi-layer substrate, wherein: The multilayer substrate includes a laminate, a first radiation conductor layer, a second radiation conductor layer, a first signal path, a second signal path, and a first connection conductor. The laminate has a structure in which a plurality of insulating layers are laminated along the Z axis. The first radiation conductor layer is provided in the laminate and receives or radiates a first high-frequency signal and receives or radiates a second high-frequency signal. The vibration direction of the electromagnetic field caused by the second high-frequency signal propagating in the air is different from the vibration direction of the electromagnetic field caused by the first high-frequency signal propagating in the air. The second radiating conductor layer is provided in the laminate and is located on the negative side of the Z axis relative to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative direction of the Z axis. The first signal path and the second signal path are connected to the first radiation conductor layer. The first high-frequency signal is transmitted in the first signal path, The second high-frequency signal is transmitted in the second signal path. The first connecting conductor is provided in the laminate, connected to the first signal path and the second signal path, and is located on the negative side of the Z axis with respect to the second radiation conductor layer.

2. The multi-layer substrate according to claim 1, wherein The multilayer substrate further comprises a first ground conductor layer. The first ground conductor layer is provided in the laminate and is located on the negative side of the Z axis relative to the second radiation conductor layer. The first ground conductor layer overlaps the first radiation conductor layer and the second radiation conductor layer when viewed in the negative direction of the Z axis.

3. The multi-layer substrate according to claim 2, wherein The first connecting conductor is located on the negative side of the Z axis relative to the second radiation conductor layer, and is located on the positive side of the Z axis relative to the first ground conductor layer.

4. The multi-layer substrate according to claim 3, wherein A distance from the first coupling conductor to the first ground conductor layer on the Z axis is shorter than a distance from the first coupling conductor to the second radiation conductor layer on the Z axis.

5. The multi-layer substrate according to claim 2, wherein The multilayer substrate further comprises a second ground conductor layer. The second ground conductor layer is provided in the laminate and is located on the negative side of the Z axis relative to the first ground conductor layer, and overlaps with the first ground conductor layer when viewed in the negative direction of the Z axis. The first connection conductor is located on the negative side of the Z axis relative to the first ground conductor layer, and is located on the positive side of the Z axis relative to the second ground conductor layer.

6. The multi-layer substrate according to any one of claims 1 to 5, wherein The multilayer substrate further comprises a third signal path and a fourth signal path, The second radiation conductor layer receives or radiates a third high-frequency signal and receives or radiates a fourth high-frequency signal. The vibration direction of the electromagnetic field caused by the fourth high-frequency signal propagating in the air is different from the vibration direction of the electromagnetic field caused by the third high-frequency signal propagating in the air. The third signal path and the fourth signal path are connected to the second radiation conductor layer. The third high frequency signal is transmitted in the third signal path. The fourth high-frequency signal is transmitted in the fourth signal path.

7. The multi-layer substrate according to claim 6, wherein The multilayer substrate further includes a second connection conductor. The second connection conductor is provided in the laminate and is connected to the third signal path and the fourth signal path.

8. The multi-layer substrate according to claim 1, wherein The multilayer substrate further includes a second connection conductor and a first ground conductor layer. The first ground conductor layer is provided in the laminate and is located on the negative side of the Z axis relative to the second radiation conductor layer, and overlaps the first radiation conductor layer and the second radiation conductor layer when viewed in the negative direction of the Z axis. The second connection conductor is located on the negative side of the Z axis relative to the first ground conductor layer.

9. The multi-layer substrate according to any one of claims 1 to 8, wherein The resonant frequency of the second radiating conductor layer is lower than the resonant frequency of the first radiating conductor layer.

10. The multi-layer substrate according to claim 9, wherein A difference between a resonant frequency band of the first radiating conductor layer and a resonant frequency band of the second radiating conductor layer is equal to or greater than 10% of a frequency of the first high-frequency signal and a frequency of the second high-frequency signal.

11. The multi-layer substrate according to any one of claims 6 to 10, wherein: A first branch conductor layer is provided in the first signal path. A second branch conductor layer is provided in the second signal path.

12. The multi-layer substrate according to claim 6 or claim 7, wherein: A third branch conductor layer is provided in the third signal path. A fourth branch conductor layer is provided in the fourth signal path.

13. A multi-layer substrate, wherein: The multilayer substrate includes a laminate, a first radiation conductor layer, a second radiation conductor layer, a first signal path, a second signal path, and a first connection conductor. The laminate has a structure in which a plurality of insulating layers are laminated along the Z axis. The first radiation conductor layer is provided in the laminated body. The first radiation conductor layer is provided with a first feeding point and a second feeding point. When viewed in the negative direction of the Z axis, the second feed point and the first feed point are not in a point-symmetrical relationship with respect to the center of gravity of a figure defined by the outer edge of the first radiation conductor layer. The second radiating conductor layer is provided in the laminate and is located on the negative side of the Z axis relative to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative direction of the Z axis. The first signal path and the second signal path are connected to the first radiation conductor layer. The first connecting conductor is provided in the laminate, connected to the first signal path and the second signal path, and is located on the negative side of the Z axis with respect to the second radiation conductor layer.

14. A wiring substrate, wherein: The wiring substrate includes a first laminate, a first signal path portion, a second signal path portion, and a first connection conductor. An antenna component is mounted on the first stacked body. The antenna component is located on the positive side of the Z axis relative to the first stack. The antenna component includes a second laminate, a first radiation conductor layer, and a second radiation conductor layer. The first stack has a structure in which a plurality of insulating layers are stacked along the Z axis. The second stack has a structure in which a plurality of insulating layers are stacked along the Z axis. The first radiation conductor layer is provided in the second laminate and receives or radiates a first high-frequency signal and receives or radiates a second high-frequency signal. The vibration direction of the electromagnetic field caused by the second high-frequency signal propagating in the air is different from the vibration direction of the electromagnetic field caused by the first high-frequency signal propagating in the air. The second radiating conductor layer is provided in the second laminate and is located on the negative side of the Z axis relative to the first radiating conductor layer, and overlaps with the first radiating conductor layer when viewed in the negative direction of the Z axis. The first signal path portion and the second signal path portion are provided in the first laminate and are electrically connected to the first radiation conductor layer. The first high-frequency signal is transmitted in the first signal path portion. The second high-frequency signal is transmitted in the second signal path portion. The first connecting conductor is provided in the second laminate, is connected to the first signal path portion and the second signal path portion, and is located on the negative side of the Z axis with respect to the second radiation conductor layer.

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