Semiconductor aluminum plate polishing device with self-cleaning function

Abstract

The application discloses a semiconductor aluminum plate polishing device with a self-cleaning function, and relates to the polishing technical field.The device comprises a mainframe box, both sides of the mainframe box are provided with feeding lines, the inside of the mainframe box is sequentially provided with a bottom layer baffle, a middle layer baffle and an upper layer baffle from bottom to top, the inside of the mainframe box is provided with a plurality of pairs of feeding assemblies, first shifters, second shifters, first driving machines and second driving machines, the first shifters and the second shifters are of the same structure, the first driving machines and the second driving machines are of the same structure, front polishing assemblies and rear polishing assemblies are installed between the first shifters and the second shifters, the first driving machines drive the front polishing assemblies, and the second driving machines drive the rear polishing assemblies.The polishing wheels on the sleeves are driven to move up and down in the sliding process of the reciprocating wave-shaped plate, so that more directions of polishing and grinding are provided for the aluminum plate.

Description

TECHNICAL FIELD

[0001] The present application relates to the polishing technical field, and in particular to a semiconductor aluminum plate polishing device with self-cleaning function. BACKGROUND

[0002] The semiconductor aluminum plate refers to an aluminum or aluminum alloy plate used in the semiconductor manufacturing process, mainly used for manufacturing key components such as electrodes, wires, packaging substrates, and heat dissipation components. Aluminum is one of the important materials in the semiconductor process due to its excellent electrical conductivity, thermal conductivity, light weight, and processability. Semiconductor manufacturing involves multiple layers of lithography, etching, and thin film deposition processes. Any surface unevenness can cause errors in subsequent processes. Chemical polishing combines mechanical grinding and chemical corrosion to achieve nanoscale planarization of the aluminum surface, meeting the precision requirements of advanced processes. The polished aluminum surface is smoother, reduces resistance loss, and enhances electrical conductivity. In addition, polishing can optimize interface contact and improve heat conduction efficiency, ensuring the long-term stability of high-power devices. Therefore, the polishing process of the aluminum plate surface is very important. However, the existing polishing equipment cannot timely remove the dust generated, which remains on the polishing wheel or aluminum plate, still requiring additional processes for treatment, reducing the processing efficiency. SUMMARY

[0003] The present application aims to provide a semiconductor aluminum plate polishing device with self-cleaning function to solve the problems in the prior art.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a semiconductor aluminum plate polishing device with self-cleaning function, comprising a main box, the two sides of the main box are provided with a material conveying line, the inside of the main box is sequentially provided with a bottom layer partition, a middle layer partition and an upper layer partition from bottom to top, the inside of the main box is provided with a plurality of pairs of feeding assemblies, a first positioner, a second positioner, a first drive machine and a second drive machine, the first positioner and the second positioner are the same structure, the first drive machine and the second drive machine are the same structure, the first positioner and the second positioner are installed with front polishing assemblies and rear polishing assemblies, the first drive machine drives the front polishing assemblies, and the second drive machine drives the rear polishing assemblies.

[0005] Further, a plurality of feeding assemblies are arranged on the middle partition, each feeding assembly comprises a transmission column, a sliding block and a transmission roller, the sliding block is slidingly arranged in the transmission column, a push spring is arranged between the sliding block and the transmission column, the transmission roller is rotatably arranged on the sliding block, one side of the transmission roller is provided with a driving motor, a plurality of small rollers are rotatably arranged on the middle part of the middle partition, the aluminum plate to be polished is moved by the feeding line, and the aluminum plate is vertically fed into the polishing device, in the polishing device, the sliding block is pressed to the aluminum plate by the push spring, the transmission roller is tightly attached to the aluminum plate, the driving motor drives the transmission roller to slowly rotate, and the aluminum plate is transmitted to the other end, and the small rollers support the bottom of the aluminum plate.

[0006] Further, a double-head motor is arranged on one side of the main box, a main drive shaft is arranged on the double-head motor, driving bevel gears are arranged at two ends of the main drive shaft, two double-head screws are rotatably arranged in the main box, one double-head screw is located below the upper partition, and the other double-head screw is located above the bottom partition, one end of the two double-head screws penetrates the main box, driven bevel gears are arranged on the two double-head screws, the two driven bevel gears are meshed with the two driving bevel gears respectively, and the two groups of threads in the two double-head screws are opposite in rotation direction.

[0007] Further, the first positioner comprises an upper forked cantilever and a lower forked cantilever, the upper forked cantilever and the lower forked cantilever are symmetrically arranged, the upper forked cantilever comprises a nut sliding block and two supporting arms, the nut sliding blocks of the upper forked cantilever and the lower forked cantilever are threadedly connected with the two double-head screws respectively, the two nut sliding blocks are slidingly connected with the main box, mounting holes are formed in the two supporting arms of the upper forked cantilever and the lower forked cantilever, the first positioner and the second positioner can move close to each other or move away from each other under the driving of the two double-head screws, the upper forked cantilever and the lower forked cantilever in the first positioner move simultaneously, drive the front polishing assembly and the rear polishing assembly to move close to the aluminum plate, form an adjustable aluminum plate polishing structure, and adapt to aluminum plates with different wall thicknesses, so that the universality and practicability of the polishing equipment are improved.

[0008] Further, the front polishing assembly and the rear polishing assembly are the same in structure, the front polishing assembly comprises two symmetrically arranged shifting mechanisms, each shifting mechanism comprises a spline shaft, a sleeve and a plurality of polishing wheels, a spline groove matched with the spline shaft is formed in the center of the upper part of the sleeve, the spline shaft is slidingly connected with the sleeve, the plurality of polishing wheels are uniformly arranged on the sleeve, and the bottom of the sleeve is provided with a ball bearing.

[0009] Further, the sleeve is provided with positive and negative plates on the upper and lower sides of each polishing wheel, the positive and negative plates on the upper half of the polishing wheel are arranged in opposite directions to the positive and negative plates on the lower half of the polishing wheel, in the polishing process, the positive and negative plates of each polishing wheel are electrified, the air ionized by the positive plate moves to the negative plate, the moving particles drive the surrounding air flow through collision and friction, forming an ion wind airflow, the positive and negative plates on the upper half of the polishing wheel in each shifting mechanism form a downward airflow, the positive and negative plates on the upper half of the polishing wheel in each shifting mechanism form an upward airflow, the airflows meet head-on at the center and spread to the surrounding, since the polishing wheel produces powder when polishing the aluminum plate, the powder is carried to the middle layer of the baffle under the driving of the ion wind, realizing automatic collection of polishing powder and achieving the effect of automatic cleaning of the polishing wheel.

[0010] Further, the mounting hole on the upper fork cantilever is connected with the spline shaft, the mounting hole on the lower fork cantilever is connected with the sleeve, the first drive machine includes a sub-machine box and a pair of driven conical friction wheels, the sub-machine box is installed on the upper layer of the baffle, the sub-machine box and the bottom of the upper layer of the baffle are provided with a sliding groove, the bottoms of the pair of driven conical friction wheels are connected with the two spline shafts of the front polishing assembly through shafts, and the shafts are connected with the sliding groove in a sliding mode.

[0011] Further, the first drive machine further includes a second servo motor, a driving conical friction wheel and a spring, the second servo motor is vertically and slidably installed on the sub-machine box through a support, the driving conical friction wheel is installed in the sub-machine box, the spring is located between the driving conical friction wheel and the sub-machine box, a thrust ball bearing is arranged between the spring and the driving conical friction wheel, the driving conical friction wheel is in contact with the two driven conical friction wheels, the second servo motor drives the driving conical friction wheel to rotate, and due to the pushing of the spring, the driving conical friction wheel always maintains contact with the two driven conical friction wheels, even if the positions of the first and second shifters change and the relative positions of the two driven conical friction wheels change, the driving conical friction wheel is automatically adjusted in height under the action of the spring, variable position transmission is realized, the driven conical friction wheels drive the spline shaft to rotate, the spline shaft drives the sleeve to rotate, the sleeve drives the polishing wheel to rotate, and the polishing wheel polishes the aluminum plate.

[0012] Further, the bottom layer partition is slidably installed with a reciprocating wave plate above, and the bottom layer partition is also provided with a sliding groove, the ball is in contact with the reciprocating wave plate, the bottom of the reciprocating wave plate is provided with a pin shaft, the pin shaft penetrates the sliding groove of the bottom layer partition, the bottom of the bottom layer partition is provided with a first servo motor, the crank is installed on the first servo motor, the connecting rod is connected between the crank and the pin shaft, the connecting rod is connected with the crank and the pin shaft, the first servo motor drives the crank to rotate, the crank drives the reciprocating wave plate to slide back and forth through the connecting rod, under the action of gravity, the ball at the bottom of the sleeve is always in contact with the reciprocating wave plate, the reciprocating wave plate drives the polishing wheel on the sleeve to move up and down in the process of sliding, and more directions of polishing and grinding are provided for the aluminum plate.

[0013] Compared with the prior art, the beneficial effects of the present application are:

[0014] The first and second shifters can move close to each other or away from each other, driving the front and rear polishing assemblies to be close to the aluminum plate, forming an adjustable aluminum plate polishing structure, and adaptively changing for aluminum plates of different wall thicknesses, so as to improve the universality and practicality of the polishing equipment; the ion wind airflow formed by the ionization of the positive plate carries the powder to the middle layer partition, realizes automatic collection of the polishing powder, and achieves the effect of automatically cleaning the polishing wheel; the reciprocating wave plate drives the polishing wheel on the sleeve to move up and down in the process of sliding, and more directions of polishing and grinding are provided for the aluminum plate. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall appearance structure of the present application;

[0016] Figure 2 It is a schematic diagram of the internal structure of the present application Figure One ;

[0017] Figure 3 It is a schematic diagram of the internal structure of the present application Figure Two ;

[0018] Figure 4 It is a schematic diagram of the internal structure of the present application Figure Three ;

[0019] Figure 5 It is a schematic diagram of the internal structure of the present application Figure Four ;

[0020] Figure 6 It is a schematic diagram of the internal structure of the present application Figure Five ;

[0021] Figure 7 It is a schematic diagram of the internal structure of the present application Figure Six .

[0022] In the diagram: 1. Main chassis; 2. Bottom partition; 3. Middle partition; 4. Upper partition; 5. Small roller; 6. Conveyor column; 7. Slider; 8. Conveyor roller; 9. First servo motor; 10. Crank; 11. Connecting rod; 12. Reciprocating wave plate; 13. Dual-head motor; 14. Main drive shaft; 15. Driving bevel gear; 16. Driven bevel gear; 17. Dual-head screw; 18. First positioner; 19. Second positioner; 20. Upper fork cantilever; 21. Lower fork cantilever; 22. Splined shaft; 23. Sleeve; 24. Ball bearing; 25. Polishing wheel; 26. First drive motor; 27. Second drive motor; 28. Auxiliary chassis; 29. ​​Second servo motor; 30. Driving conical friction wheel; 31. Spring; 32. Driven conical friction wheel. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Example: Figures 1-7 As shown, the present invention provides a technical solution: a semiconductor aluminum plate polishing device with self-cleaning function, including a main unit 1. Feed lines are provided on both sides of the main unit 1. Inside the main unit 1, from bottom to top, a bottom partition 2, a middle partition 3, and an upper partition 4 are arranged sequentially. Inside the main unit 1, several pairs of feeding components, a first positioner 18, a second positioner 19, a first drive motor 26, and a second drive motor 27 are arranged. The first positioner 18 and the second positioner 19 have the same structure, and the first drive motor 26 and the second drive motor 27 have the same structure. A front polishing component and a rear polishing component are installed between the first positioner 18 and the second positioner 19. The first drive motor 26 drives the front polishing component, and the second drive motor 27 drives the rear polishing component. The drive unit for polishing includes several pairs of feeding components mounted on the middle partition 3. Each feeding component includes a conveyor column 6, a slider 7, and a conveyor roller 8. The slider 7 is slidably mounted in the conveyor column 6, and a push spring is provided between the slider 7 and the conveyor column 6. The conveyor roller 8 is rotatably mounted on the slider 7, and a drive motor is provided on one side of the conveyor roller 8. Several small rollers 5 are also rolled in the middle of the middle partition 3. The aluminum plate to be polished is moved by the feed line and fed vertically into the polishing device. In the polishing device, the slider 7 is pressed against the aluminum plate by the push spring, so that the conveyor roller 8 is in close contact with the aluminum plate. The drive motor drives the conveyor roller 8 to rotate slowly, conveying the aluminum plate to the other end. The small rollers 5 provide support at the bottom of the aluminum plate.

[0025] The main box 1 is provided with a double-head motor 13 on one side, the double-head motor 13 is provided with a main drive shaft 14, the two ends of the main drive shaft 14 are provided with driving bevel gears 15, two double-head screws 17 are rotatably installed in the main box 1, one double-head screw 17 is located below the upper layer partition plate 4, the other double-head screw 17 is located above the bottom layer partition plate 2, one end of the two double-head screws 17 penetrates the main box 1, the two double-head screws 17 are provided with driven bevel gears 16, the two driven bevel gears 16 are engaged with the two driving bevel gears 15, the two groups of threads in the two double-head screws 17 are opposite in rotation direction, the first displacement device 18 includes an upper fork cantilever 20 and a lower fork cantilever 21, the upper fork cantilever 20 and the lower fork cantilever 21 are symmetrically installed, the upper fork cantilever 20 is composed of a nut block and two arms, the nut blocks of the upper fork cantilever 20 and the lower fork cantilever 21 are threadedly connected with the two double-head screws 17, the two nut blocks are slidably connected with the main box 1, the two arms of the upper fork cantilever 20 and the lower fork cantilever 21 are provided with mounting holes, before polishing, the double-head motor 13 drives the main drive shaft 14 to rotate, the main drive shaft 14 drives the two double-head screws 17 to rotate, the two double-head screws 17 rotate in opposite directions, under the driving of the two double-head screws 17, the first displacement device 18 and the second displacement device 19 can move close to each other or move away from each other, the upper fork cantilever 20 and the lower fork cantilever 21 in the first displacement device 18 move at the same time, drive the front polishing assembly and the rear polishing assembly to move close to the aluminum plate, form an adjustable aluminum plate polishing structure, adapt to aluminum plates with different thicknesses, improve the universality and practicality of the polishing equipment.

[0026] The front polishing assembly and the rear polishing assembly have the same structure, the front polishing assembly is composed of two symmetrically arranged shifting mechanisms, each shifting mechanism includes a spline shaft 22, a sleeve 23 and a plurality of polishing wheels 25, the upper center of the sleeve 23 is provided with a spline groove matched with the spline shaft 22, the spline shaft 22 is slidably connected with the sleeve 23, the plurality of polishing wheels 25 are evenly installed on the sleeve 23, the bottom of the sleeve 23 is provided with a ball 24, the sleeve 23 is provided with positive and negative plates on the upper and lower sides corresponding to each polishing wheel 25, the directions of the positive and negative plates on the upper half of the polishing wheels 25 are opposite to the directions of the positive and negative plates on the lower half of the polishing wheels 25, in the process of polishing, the positive and negative plates of each polishing wheel 25 are electrified, the air ionized by the positive plate moves to the negative plate, the moving particles drive the surrounding air flow through collision and friction, forming an ion wind airflow, the positive and negative plates on the upper half of the polishing wheels 25 in each shifting mechanism form a downward airflow, the positive and negative plates on the upper half of the polishing wheels 25 in each shifting mechanism form an upward airflow, the airflows meet at the center and diffuse to the surrounding, since the polishing wheels 25 generate powder when polishing the aluminum plate, the powder is driven to the middle layer partition plate 3 under the driving of the ion wind, realizing automatic collection of polishing powder and achieving the effect of automatically cleaning the polishing wheels 25.

[0027] The mounting hole on the upper cross cantilever 20 is connected with the spline shaft 22, the mounting hole on the lower cross cantilever 21 is connected with the sleeve 23, the first driving machine 26 comprises a sub-machine box 28 and a pair of driven conical friction wheels 32, the sub-machine box 28 is installed on the upper layer partition plate 4, the sub-machine box 28 and the bottom of the upper layer partition plate 4 are provided with sliding grooves, the bottom of the pair of driven conical friction wheels 32 is connected with the two spline shafts 22 of the front polishing assembly through shafts respectively, the shafts are connected with the sliding grooves slidingly, the first driving machine 26 further comprises a second servo motor 29, a driving conical friction wheel 30 and a spring 31, the second servo motor 29 is installed on the sub-machine box 28 through a support vertically, the driving conical friction wheel 30 is installed in the sub-machine box 28, the spring 31 is located between the driving conical friction wheel 30 and the sub-machine box 28, a thrust ball bearing is arranged between the spring 31 and the driving conical friction wheel 30, the driving conical friction wheel 30 is in contact with the two driven conical friction wheels 32, the second servo motor 29 drives the driving conical friction wheel 30 to rotate, due to the pushing of the spring 31, the driving conical friction wheel 30 always keeps in contact with the two driven conical friction wheels 32, even if the positions of the first shifter 18 and the second shifter 19 change, the relative positions of the two driven conical friction wheels 32 change, the driving conical friction wheel 30 is automatically adjusted in height under the action of the spring 31, variable position transmission is realized, the driven conical friction wheel 32 drives the spline shaft 22 to rotate, the spline shaft 22 drives the sleeve 23 to rotate, the sleeve 23 drives the polishing wheel 25 to rotate, and the polishing wheel 25 polishes the aluminum plate.

[0028] A reciprocating wave plate 12 is slidingly installed above the bottom layer partition plate 2, the bottom layer partition plate 2 is also provided with a sliding groove, the ball 24 is in contact with the reciprocating wave plate 12, the bottom of the reciprocating wave plate 12 is provided with a pin shaft, the pin shaft penetrates through the sliding groove of the bottom layer partition plate 2, the bottom of the bottom layer partition plate 2 is provided with a first servo motor 9, a crank 10 is installed on the first servo motor 9, a connecting rod 11 is connected between the crank 10 and the pin shaft, the connecting rod 11 is connected with the crank 10 and the pin shaft, the first servo motor 9 drives the crank 10 to rotate, the crank 10 drives the reciprocating wave plate 12 to slide back and forth through the connecting rod 11, under the action of gravity, the ball 24 at the bottom of the sleeve 23 always keeps in contact with the reciprocating wave plate 12, the reciprocating wave plate 12 drives the polishing wheel 25 on the sleeve 23 to move up and down in the process of sliding, so that more directions of polishing and grinding are provided for the aluminum plate, the polishing wheel 25 moves up and down, the sleeve 23 slides up and down along the spline shaft 22, and the spline shaft 22 continues to drive the sleeve 23 to rotate.

[0029] The working principle of the present application is as follows: the aluminum plate to be polished is moved along the conveying line and is sent into the polishing device in a vertical state; the sliding block 7 is pressed against the aluminum plate by the push spring, so that the conveying roller 8 is tightly attached to the aluminum plate; the driving motor drives the conveying roller 8 to rotate slowly, and the aluminum plate is conveyed to the other end; the small rollers 5 support the bottom of the aluminum plate; before polishing starts, the double-head motor 13 drives the main drive shaft 14 to rotate, the main drive shaft 14 drives the two double-head screws 17 to rotate, the two double-head screws 17 rotate in opposite directions, the first positioner 18 and the second positioner 19 can move towards or away from each other under the drive of the two double-head screws 17, the upper fork cantilever 20 and the lower fork cantilever 21 in the first positioner 18 move simultaneously, and the front polishing assembly and the rear polishing assembly are moved to be close to the aluminum plate, so as to form an adjustable aluminum plate polishing structure, and the aluminum plate with different wall thicknesses can be adapted to improve the universality and practicability of the polishing equipment.

[0030] In the process of polishing, the positive and negative plates of each polishing wheel 25 are electrified, the air ionized by the positive plate moves to the negative plate, and the moving particles drive the surrounding air to flow through collision and friction, forming an ion wind airflow; the positive and negative plates on the upper half of the polishing wheel 25 in each shifting mechanism form a downward airflow; the positive and negative plates on the upper half of the polishing wheel 25 in each shifting mechanism form an upward airflow; the airflows meet head-on at the center and spread to the surrounding, and since the polishing wheel 25 generates powder when polishing the aluminum plate, the powder is carried to the middle layer partition plate 3 under the drive of the ion wind, so as to realize automatic collection of the polishing powder and achieve the effect of automatically cleaning the polishing wheel 25.

[0031] The second servo motor 29 drives the driving conical friction wheel 30 to rotate, and the driving conical friction wheel 30 is always in contact with the two driven conical friction wheels 32 due to the pushing of the spring 31; even if the positions of the first positioner 18 and the second positioner 19 change and the relative positions of the two driven conical friction wheels 32 change, the driving conical friction wheel 30 automatically adjusts the height under the action of the spring 31, so as to realize variable position transmission; the driven conical friction wheels 32 drive the spline shaft 22 to rotate, the spline shaft 22 drives the sleeve 23 to rotate, the sleeve 23 drives the polishing wheel 25 to rotate, and the polishing wheel 25 polishes the aluminum plate.

[0032] The first servo motor 9 drives the crank 10 to rotate, the crank 10 drives the reciprocating wave plate 12 to slide back and forth through the connecting rod 11, and the ball 24 at the bottom of the sleeve 23 is always in contact with the reciprocating wave plate 12 under the action of gravity; the reciprocating wave plate 12 drives the polishing wheel 25 on the sleeve 23 to move up and down during sliding, so as to provide more polishing directions for the aluminum plate; the polishing wheel 25 moves up and down, the sleeve 23 slides up and down along the spline shaft 22, and the spline shaft 22 continues to drive the sleeve 23 to rotate.

[0033] It will be apparent to those skilled in the art that the application is not limited to the details of the above-exemplified embodiments and that the present application can be implemented in other particular forms without departing from the spirit or essential characteristics of the present application. The embodiments should therefore be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the above description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. No reference signs in the claims should be considered as limiting the scope of the claims with respect to the figures of the patent document.

Claims

1. A semiconductor aluminum plate polishing device having a self-cleaning function, characterized by: The utility model provides a polishing machine, including host box (1), both sides of host box (1) are provided with the material line, and the inside of host box (1) is sequentially provided with bottom layer baffle (2), middle layer baffle (3) and upper layer baffle (4) from below, the inside of host box (1) is provided with a plurality of pairs of feeding assembly, first variator (18), second variator (19), first drive (26) and second drive (27), first variator (18) with second variator (19) same structure, first drive (26) with second drive (27) same structure, first variator (18) and second variator (19) between installation has before polishing assembly and after polishing assembly, first drive (26) drives before polishing assembly, second drive (27) drives after polishing assembly; One side of host box (1) is provided with double -end motor (13), double -end motor (13) is installed with main drive shaft (14), and both ends of main drive shaft (14) are provided with driving bevel gear (15), and two double -end screws (17) are rotatably installed in the inside of host box (1), one double -end screw (17) is located below upper layer baffle (4), and another double -end screw (17) is located above bottom layer baffle (2), and one end of two double -end screws (17) penetrates host box (1), and two double -end screws (17) are installed with driven bevel gear (16), and two driven bevel gears (16) are engaged with two driving bevel gears (15) respectively, and the rotation direction of two groups of threads in two double -end screws (17) is opposite; First variator (18) includes upper cross cantilever (20) and lower cross cantilever (21), and upper cross cantilever (20) and lower cross cantilever (21) are symmetrically installed upside down, and upper cross cantilever (20) is composed of a nut block and two arms, and the nut blocks of upper cross cantilever (20) and lower cross cantilever (21) are threadedly connected with two double -end screws (17) respectively, and two nut blocks are slidably connected with host box (1), and two arms of upper cross cantilever (20) and lower cross cantilever (21) are provided with mounting holes; The structure of the front polishing assembly and the rear polishing assembly is the same, the front polishing assembly is composed of two symmetrically arranged shifting mechanisms, each shifting mechanism includes a spline shaft (22), a sleeve (23), and a plurality of polishing wheels (25), the sleeve (23) has a spline groove in the center of its upper portion, the spline shaft (22) is slidably connected with the sleeve (23), and the plurality of polishing wheels (25) are evenly distributed on the sleeve (23), and the sleeve (23) has a plurality of ball bearings (24) at its bottom; The sleeve (23) is provided with positive and negative plates on both sides of each polishing wheel (25), and the directions of the positive and negative plates on the upper half of the polishing wheel (25) are opposite to those on the lower half of the polishing wheel (25). The bottom layer partition (2) is slidably installed with a reciprocating wave plate (12), and the bottom layer partition (2) is also provided with a sliding groove, the ball (24) is in contact with the reciprocating wave plate (12), the bottom of the reciprocating wave plate (12) is provided with a pin shaft, the pin shaft penetrates the sliding groove of the bottom layer partition (2), the bottom of the bottom layer partition (2) is provided with a first servo motor (9), the first servo motor (9) is installed with a crank (10), the crank (10) is connected with the pin shaft through a connecting rod (11), and the connecting rod (11) is connected with the crank (10) and the pin shaft.

2. The semiconductor aluminum plate polishing device with self-cleaning function according to claim 1, characterized in that: A plurality of pairs of feeding assemblies are arranged on the middle layer partition (3), each feeding assembly comprising a conveying column (6), a sliding block (7) and a conveying roller (8), the sliding block (7) being slidably installed in the conveying column (6), a push spring being arranged between the sliding block (7) and the conveying column (6), the conveying roller (8) being rotatably installed on the sliding block (7), one side of the conveying roller (8) being provided with a driving motor, and a plurality of small rollers (5) being rotatably installed on the middle part of the middle layer partition (3).

3. The semiconductor aluminum plate polishing device with self-cleaning function according to claim 1, characterized in that: The mounting hole on the upper fork cantilever (20) is connected with the spline shaft (22), the mounting hole on the lower fork cantilever (21) is slidably connected with the sleeve (23), the first driving machine (26) comprises a sub-machine box (28) and a pair of driven conical friction wheels (32), the sub-machine box (28) is installed on the upper layer partition (4), the sub-machine box (28) and the bottom of the upper layer partition (4) are provided with sliding grooves, and the bottoms of the pair of driven conical friction wheels (32) are coaxially connected with the two spline shafts (22) of the front polishing assembly through rotating shafts, and the rotating shafts are slidably connected with the sliding grooves.

4. The semiconductor aluminum plate polishing device with self-cleaning function according to claim 3, characterized in that: The first driving machine (26) further comprises a second servo motor (29), a driving conical friction wheel (30) and a spring (31), the second servo motor (29) is vertically slidably installed on the sub-machine box (28) through a support, the driving conical friction wheel (30) is installed in the sub-machine box (28), the spring (31) is located between the driving conical friction wheel (30) and the sub-machine box (28), a thrust ball bearing is arranged between the spring (31) and the driving conical friction wheel (30), and the driving conical friction wheel (30) is in contact with the two driven conical friction wheels (32).

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